CN204482163U - A kind of mould exoelectron pad pasting - Google Patents
A kind of mould exoelectron pad pasting Download PDFInfo
- Publication number
- CN204482163U CN204482163U CN201420772183.4U CN201420772183U CN204482163U CN 204482163 U CN204482163 U CN 204482163U CN 201420772183 U CN201420772183 U CN 201420772183U CN 204482163 U CN204482163 U CN 204482163U
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- CN
- China
- Prior art keywords
- electronic circuit
- circuit layer
- pad pasting
- mould
- plastic parts
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- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Withdrawn - After Issue
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- Injection Moulding Of Plastics Or The Like (AREA)
Abstract
The utility model belongs to electronics pad pasting field, be specifically related to a kind of mould exoelectron pad pasting, comprise decorative adhesive film, printing ink layer and electronic circuit layer that order is arranged, it is characterized in that: described electronic circuit layer connects electronic component, plastic parts is fixed on bottom electronic circuit layer, and plastic parts arranges the groove that can hold electronic component.In high-pressure forming machine, heat and make decorative adhesive film, electronic circuit layer and printing ink layer softening, apply pressure and coordinate navigation system, make that decorative adhesive film, electronic circuit layer and printing ink layer are bending, overhead kick shape or there is acute angle, and being pasted on plastic rubber member surface, electronic component then enters the groove of plastic parts.The utility model beneficial effect is: the decorative adhesive film becoming to have electric function at die topography, and it is coated that multiple electronic component can put up film one simultaneously, the plastic parts bending, have acute angle or overhead kick especially all can realize the function of decorating electronics, be widely used.
Description
Technical field
The utility model belongs to electronics pad pasting field, is specifically related to a kind of mould exoelectron pad pasting.
Background technology
The electronics adhesive cover products of current minority in-molded (in-mold electronic), can only be applied to the electronic product of more smooth, little radian, cannot be applied to bending, possess acute angle even the plastic parts product of overhead kick.Electronics pad pasting, refers to melting welding electronic device in Film for decoration, makes it to possess electric function.
Utility model content
The purpose of this utility model is to provide a kind of mould exoelectron pad pasting being applicable to the plastic parts product surface of bending, acute angle or overhead kick, and this pad pasting possesses electric function.
To achieve these goals, technical solution adopted in the utility model is: a kind of mould exoelectron pad pasting, comprise decorative adhesive film, printing ink layer and electronic circuit layer that order is arranged, it is characterized in that: described electronic circuit layer connects electronic component, plastic parts is fixed on bottom electronic circuit layer, and plastic parts arranges the groove that can hold electronic component.
Aforesaid a kind of mould exoelectron pad pasting, described electronic component is one or more, and electronic component is fixed on electronic circuit layer by scolding tin melting welding, conducting resinl or other viscose.
Aforesaid a kind of mould exoelectron pad pasting, described plastic parts, decorative adhesive film, electronic circuit layer and printing ink layer are bending, overhead kick shape or have acute angle.
Aforesaid a kind of mould exoelectron pad pasting, described decorative adhesive film is the other materials such as PC, PP, PET or PVC.
Aforesaid a kind of mould exoelectron pad pasting, described plastic parts can be provided with steam vent according to need.
Aforesaid a kind of mould exoelectron pad pasting, the material of described electronic circuit layer is electrically conductive ink.
A manufacture method for mould exoelectron pad pasting, comprises the steps:
(1) by for the pattern of printing with the inner surface of ink printing at decorative adhesive film, formation printing ink layer;
(2) on printing ink layer, required electronic circuit layer is printed as with electrically conductive ink;
(3) electronic component is fixed on electronic circuit layer by scolding tin melting welding, conducting resinl or other viscose;
(4) turn-over by electronic component down, and plastic parts is put into high-pressure forming machine;
(5) in high-pressure forming machine, heat and make decorative adhesive film, electronic circuit layer and printing ink layer softening, apply pressure and coordinate navigation system, make that decorative adhesive film, electronic circuit layer and printing ink layer are bending, overhead kick shape or there is acute angle, and being pasted on plastic rubber member surface, electronic component then enters the groove of plastic parts.
The manufacture method of aforesaid a kind of mould exoelectron pad pasting, described plastic parts is bending, overhead kick shape or have acute angle.
The manufacture method of aforesaid a kind of mould exoelectron pad pasting, in step (5), the Wen Du Approximately heated is 120-160 ° of C, Ya Li Approximately is more than 60kg/cm2.
The manufacture method of aforesaid a kind of mould exoelectron pad pasting, described navigation system fixes the two ends of plastic parts, also fixes the integrally-built two ends that decorative adhesive film, electronic circuit layer and printing ink layer are formed.
The utility model beneficial effect is: the decorative adhesive film becoming to have electric function at die topography, and it is coated that multiple electronic component can put up film one simultaneously, the plastic parts bending, have acute angle or overhead kick especially all can realize the function of decorating electronics, be widely used.
Accompanying drawing explanation
Fig. 1 is of the present utility model not containing the structure chart of the mould exoelectron pad pasting of plastic parts;
Fig. 2 is the schematic diagram in mould exoelectron sticking film forming process of the present utility model;
Fig. 3 is the structure chart of the shaping mould exoelectron pad pasting of the utility model.
Embodiment
Below in conjunction with accompanying drawing, the utility model is further described.Following examples only for clearly the technical solution of the utility model being described, and can not limit protection range of the present utility model with this.
A manufacture method for mould exoelectron pad pasting, first takes out decorative adhesive film 1 material, the pattern of institute's wish printing is printed to the inner surface of decorative adhesive film with silk screening ink or alternate manner, forms printing ink layer 2; Again with electrically conductive ink (as tin, copper, silver, gold ... etc.) be printed as required electronic circuit layer 3 on printing ink layer; Stamp electronic component 4 again, formed shown in Fig. 1 not containing the structure chart of the mould exoelectron pad pasting OMEF of plastic parts, the meaning outside mould refer to this pad pasting not with plastic parts product integrated injection molding in mould, plastic parts is other injection mo(u)lding.
And then turn-over by electronic component 4 down, first the plastic parts of injection mo(u)lding put into high-pressure forming machine; In high-pressure forming machine, heat and allow decorative adhesive film, printing ink layer and electronic circuit layer soften Wen Du Approximately 120-160 ° of C, be beneficial to shaping, then high-pressure gas Ya Li Approximately is 60kg/cm2, coordinate navigation system, make that decorative adhesive film, electronic circuit layer and printing ink layer be bending, overhead kick shape or there is acute angle, it is surperficial that the overall structure allowing decorative adhesive film, printing ink layer and electronic circuit layer be formed is pasted on plastic parts 6, electronic component then enters the groove of plastic parts, see Fig. 2.Navigation system fixes the two ends of plastic parts, also fixes the integrally-built two ends that decorative adhesive film, electronic circuit layer and printing ink layer are formed.
Finally, complete mould exoelectron pad pasting is defined, see Fig. 3.
A kind of mould exoelectron pad pasting, comprise decorative adhesive film 1, printing ink layer 2 and electronic circuit layer 3 that order is arranged, it is characterized in that: described electronic circuit layer 3 connects electronic component 4, plastic parts 6 is fixed on bottom electronic circuit layer 3, and plastic parts 6 arranges the groove that can hold electronic component 4.Described electronic component 4 is one or more, and electronic component 4 is fixed on electronic circuit layer 3 by scolding tin melting welding, conducting resinl or other viscose.Plastic parts, decorative adhesive film, electronic circuit layer and printing ink layer are bending, overhead kick shape or have acute angle.Described decorative adhesive film is the other materials such as PC, PP, PET or PVC.Described plastic parts 6 can be provided with steam vent 5 according to need, when in mould prepared by electronics pad pasting, discharges the gas between plastic parts and decorative adhesive film.The material of described electronic circuit layer is electrically conductive ink.
More than show and describe general principle of the present utility model, principal character and advantage.The technical staff of the industry should understand; the utility model is not restricted to the described embodiments; what describe in above-described embodiment and specification just illustrates principle of the present utility model; under the prerequisite not departing from the utility model spirit and scope; the utility model also has various changes and modifications, and these changes and improvements all fall within the scope of claimed the utility model.The claimed scope of the utility model is defined by appending claims and equivalent thereof.
Claims (6)
1. a mould exoelectron pad pasting, comprise decorative adhesive film, printing ink layer and electronic circuit layer that order is arranged, it is characterized in that: described electronic circuit layer connects electronic component, and plastic parts is fixed on bottom electronic circuit layer, and plastic parts arranges the groove that can hold electronic component.
2. a kind of mould exoelectron pad pasting according to claim 1, is characterized in that: described electronic component is one or more, and electronic component is fixed on electronic circuit layer by scolding tin melting welding, conducting resinl.
3. a kind of mould exoelectron pad pasting according to claim 1 and 2, is characterized in that: described plastic parts, decorative adhesive film, electronic circuit layer and printing ink layer are bending, overhead kick shape or have acute angle.
4. a kind of mould exoelectron pad pasting according to claim 1 and 2, it is characterized in that, described decorative adhesive film is PC, PP, PET, PVC.
5. a kind of mould exoelectron pad pasting according to claim 3, it is characterized in that, described plastic parts is provided with steam vent.
6. a kind of mould exoelectron pad pasting according to claim 4, is characterized in that, the material of described electronic circuit layer is electrically conductive ink.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201420772183.4U CN204482163U (en) | 2014-12-10 | 2014-12-10 | A kind of mould exoelectron pad pasting |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201420772183.4U CN204482163U (en) | 2014-12-10 | 2014-12-10 | A kind of mould exoelectron pad pasting |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN204482163U true CN204482163U (en) | 2015-07-15 |
Family
ID=53637932
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201420772183.4U Withdrawn - After Issue CN204482163U (en) | 2014-12-10 | 2014-12-10 | A kind of mould exoelectron pad pasting |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN204482163U (en) |
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN104486906A (en) * | 2014-12-10 | 2015-04-01 | 昆山金利表面材料应用科技股份有限公司 | Out-of-mold electronic film and manufacturing method thereof |
| TWI626158B (en) * | 2017-03-21 | 2018-06-11 | 宏碁股份有限公司 | Housing structure of electronic device and manufacturing method thereof |
| CN112918015A (en) * | 2021-03-17 | 2021-06-08 | 淮安赫德兹彩色印刷包装有限公司 | Processing technology of packaging paper bag with decorative label |
-
2014
- 2014-12-10 CN CN201420772183.4U patent/CN204482163U/en not_active Withdrawn - After Issue
Cited By (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN104486906A (en) * | 2014-12-10 | 2015-04-01 | 昆山金利表面材料应用科技股份有限公司 | Out-of-mold electronic film and manufacturing method thereof |
| CN104486906B (en) * | 2014-12-10 | 2018-01-12 | 昆山峰实电子科技有限公司 | A kind of mould exoelectron pad pasting and preparation method thereof |
| TWI626158B (en) * | 2017-03-21 | 2018-06-11 | 宏碁股份有限公司 | Housing structure of electronic device and manufacturing method thereof |
| CN112918015A (en) * | 2021-03-17 | 2021-06-08 | 淮安赫德兹彩色印刷包装有限公司 | Processing technology of packaging paper bag with decorative label |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| C14 | Grant of patent or utility model | ||
| GR01 | Patent grant | ||
| C41 | Transfer of patent application or patent right or utility model | ||
| TR01 | Transfer of patent right |
Effective date of registration: 20160112 Address after: Suzhou City, Jiangsu province 215300 city of Kunshan economic and Technological Development Zone Road No. 1098 Patentee after: KEE EVER BRIGHT DECORATIVE TECHNOLOGY CO., LTD. Address before: Suzhou City, Jiangsu province 215300 city of Kunshan economic and Technological Development Zone Road No. 1098 Patentee before: Kunshan Jinli Surface Materials Application Technology Co., Ltd. |
|
| AV01 | Patent right actively abandoned |
Granted publication date: 20150715 Effective date of abandoning: 20180112 |
|
| AV01 | Patent right actively abandoned |