TW201611932A - Laser processing method and laser processing object - Google Patents
Laser processing method and laser processing objectInfo
- Publication number
- TW201611932A TW201611932A TW103133942A TW103133942A TW201611932A TW 201611932 A TW201611932 A TW 201611932A TW 103133942 A TW103133942 A TW 103133942A TW 103133942 A TW103133942 A TW 103133942A TW 201611932 A TW201611932 A TW 201611932A
- Authority
- TW
- Taiwan
- Prior art keywords
- laser processing
- processing method
- laser beam
- substrate
- processing object
- Prior art date
Links
Landscapes
- Laser Beam Processing (AREA)
Abstract
A laser processing method including the following steps is provided: providing a substrate, wherein the substrate has a first surface and a second surface opposite to the first surface; radiating the first surface by a first laser beam, and radiating the second surface by a second laser beam, wherein the components perpendicular to the substrate of the propagating directions of the first laser beam and the second laser beam are opposite. A laser processing object is also provided.
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
TW103133942A TWI566870B (en) | 2014-09-30 | 2014-09-30 | Laser processing method and laser processing object |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
TW103133942A TWI566870B (en) | 2014-09-30 | 2014-09-30 | Laser processing method and laser processing object |
Publications (2)
Publication Number | Publication Date |
---|---|
TW201611932A true TW201611932A (en) | 2016-04-01 |
TWI566870B TWI566870B (en) | 2017-01-21 |
Family
ID=56360694
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
TW103133942A TWI566870B (en) | 2014-09-30 | 2014-09-30 | Laser processing method and laser processing object |
Country Status (1)
Country | Link |
---|---|
TW (1) | TWI566870B (en) |
Family Cites Families (15)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP4397571B2 (en) * | 2001-09-25 | 2010-01-13 | 株式会社半導体エネルギー研究所 | Laser irradiation method, laser irradiation apparatus, and manufacturing method of semiconductor device |
JP4628129B2 (en) * | 2005-02-14 | 2011-02-09 | 株式会社アマダ | Laser processing method and apparatus |
KR20070097189A (en) * | 2006-03-28 | 2007-10-04 | 삼성전자주식회사 | Method for dividing substrate and substrate dividing apparatus for using it |
US7897487B2 (en) * | 2006-07-03 | 2011-03-01 | Hamamatsu Photonics K.K. | Laser processing method and chip |
GB2457720A (en) * | 2008-02-23 | 2009-08-26 | Philip Thomas Rumsby | Method for laser processing on the opposite sides of thin transparent substrates |
CN101474723A (en) * | 2009-01-21 | 2009-07-08 | 西安天瑞达光电技术发展有限公司 | Optical isolation laser shock processing double-side simultaneous shock device |
CN101658979A (en) * | 2009-10-09 | 2010-03-03 | 廊坊昊博金刚石有限公司 | Laser double-faced synchronous machining system and machining method thereof |
TW201114535A (en) * | 2009-10-20 | 2011-05-01 | Foxsemicon Integrated Tech Inc | Apparatus and method for laser cutting |
CN103008887A (en) * | 2012-06-29 | 2013-04-03 | 苏州德龙激光有限公司 | Method and device for cutting machined target from two surfaces by using ultra-short pulse laser |
CN102785031B (en) * | 2012-08-15 | 2015-04-01 | 武汉隽龙科技有限公司 | Method and device for cutting transparent material by using ultra-short pulse laser |
JP6127526B2 (en) * | 2012-10-29 | 2017-05-17 | 三星ダイヤモンド工業株式会社 | Laser processing apparatus and processing condition setting method for patterned substrate |
JP6036173B2 (en) * | 2012-10-31 | 2016-11-30 | 三星ダイヤモンド工業株式会社 | Laser processing equipment |
CN104014936B (en) * | 2013-02-28 | 2016-12-28 | 大族激光科技产业集团股份有限公司 | The laser processing of macromolecular material workpiece and laser cutting system |
CN203171147U (en) * | 2013-03-14 | 2013-09-04 | 镭射谷科技(深圳)有限公司 | Double-laser cutting machine |
CN103962720B (en) * | 2014-04-24 | 2016-07-13 | 中国航空工业集团公司北京航空制造工程研究所 | The synchronisation control means of dual-beam laser welding and device |
-
2014
- 2014-09-30 TW TW103133942A patent/TWI566870B/en active
Also Published As
Publication number | Publication date |
---|---|
TWI566870B (en) | 2017-01-21 |
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