TW201611258A - Package structure of electronic device - Google Patents

Abstract

A package structure of electronic device including a first substrate, a second substrate, a moisture absorption color-changeable layer, a pixel unit, and an encapsulant is provided. The second substrate is disposed opposite to the first substrate. The pixel unit is disposed on the first substrate and located between the first substrate and the second substrate. The moisture absorption color-changeable layer is disposed between the first substrate and the second substrate and has a first surface facing the first substrate and a second surface facing the second substrate. The moisture absorption color-changeable layer is located on at least one side of the pixel unit. The encapsulant is disposed between the first substrate and the second substrate. The encapsulant is connected to the first substrate and the second substrate and surrounds the pixel unit and the moisture absorption color-changeable layer.

Description

Electronic component package structure

The present invention relates to a package structure, and more particularly to an electronic component package structure.

The organic light emitting diode display device is an emissive display device, and the organic light emitting diode display device has a light and thin, wide viewing angle, low power consumption, high conversion efficiency, high brightness, high luminous efficiency, high contrast, The advantages of large operating temperature range and high color rendering index make the organic light-emitting diode display device have great potential for development and are expected to become the mainstream of next-generation displays.

However, the internal components of the organic light-emitting diode display device are quite sensitive to moisture and oxygen, so when external moisture and oxygen invade the organic light-emitting diode display device, moisture and oxygen may cause internal components to age prematurely or even Damage, resulting in reduced reliability of internal components. In view of this, how to immediately detect the intrusion of moisture and oxygen into the organic light-emitting diode display device and improve the process technology to prevent the intrusion of moisture and oxygen is one of the problems to be solved.

The invention provides an electronic component packaging structure, which can immediately detect whether moisture is intruded into the package structure, and improve the problem that the pixel unit is affected by moisture and oxygen, resulting in shortened life to improve product reliability.

The electronic component package structure of the present invention includes a first substrate, a second substrate, a hygroscopic color changing layer, a pixel unit, and an encapsulant. The second substrate is disposed opposite to the first substrate. The pixel unit is disposed on the first substrate and located between the first substrate and the second substrate. The hygroscopic color changing layer is disposed between the first substrate and the second substrate, and has a first surface facing the first substrate and a second surface facing the second substrate, and is located on at least one side of the pixel unit. The encapsulant is disposed between the first substrate and the second substrate, and connects the first substrate and the second substrate, and surrounds the pixel unit and the hygroscopic color changing layer.

In an embodiment of the invention, the hygroscopic color changing layer surrounds the periphery of the pixel unit.

In an embodiment of the invention, the hygroscopic color changing layer has a continuous pattern or a discontinuous pattern.

In an embodiment of the invention, the first surface of the hygroscopic color changing layer is bonded to the first substrate or the second surface is joined to the second substrate.

In an embodiment of the invention, the first surface and the second surface of the moisture-absorbing color-changing layer are respectively joined to the corresponding first substrate and the second substrate.

In an embodiment of the invention, the material of the hygroscopic color changing layer comprises cobalt chloride, copper chloride or copper sulfate.

In an embodiment of the invention, the pixel unit includes an active array structure and an organic light emitting diode. The active array structure is disposed on the first substrate. The organic light emitting diode is electrically connected to the active array structure and located between the active array structure and the second substrate.

In an embodiment of the invention, the organic light emitting diode comprises an active organic light emitting diode or a passive organic light emitting diode.

In an embodiment of the invention, the encapsulating material comprises a frit, a dam, an acrylic resin or an epoxy.

In an embodiment of the invention, the hygroscopic color changing layer comprises a first reaction layer and a second reaction layer disposed on the first reaction layer.

In an embodiment of the invention, the first reaction layer is disposed on the first substrate and located between the first substrate and the second reaction layer.

In an embodiment of the invention, the first reaction layer comprises an acid-base indicator.

In an embodiment of the invention, the second reaction layer comprises an alkaline earth metal.

Based on the above, since the moisture-absorbing color-changing layer is disposed between the opposite substrates of the electronic component package structure of the present invention, wherein the moisture-absorbing color-changing layer is disposed on at least one side of the pixel unit and is covered by the package adhesive material that bonds the two opposite substrates The coating, so when the moisture intrudes into the package structure, the moisture-absorbing color layer can be used to absorb moisture to prevent water vapor from penetrating into the organic light-emitting diode. In addition, the hygroscopic color-changing layer that absorbs moisture will produce a color change, so as to immediately detect the intrusion of moisture into the package structure.

The above described features and advantages of the invention will be apparent from the following description.

100, 100A~100F‧‧‧ electronic component package structure

110‧‧‧First substrate

120‧‧‧second substrate

130‧‧‧ pixel unit

131‧‧‧Active array structure

132‧‧‧Organic Luminescent Diodes

140, 140a~140f‧‧‧moisture color layer

141‧‧‧ first surface

141f‧‧‧First reaction layer

142f‧‧‧Second reaction layer

142‧‧‧ second surface

150‧‧‧Package

1A is a schematic cross-sectional view showing an electronic component package structure according to an embodiment of the present invention.

FIG. 1B is a top plan view of the electronic component package structure of FIG. 1A.

2 is a top plan view showing an electronic component package structure according to another embodiment of the present invention.

3 is a cross-sectional view showing an electronic component package structure according to another embodiment of the present invention.

4 is a cross-sectional view showing an electronic component package structure according to another embodiment of the present invention.

FIG. 5 is a cross-sectional view showing an electronic component package structure according to another embodiment of the present invention.

6 is a top plan view showing an electronic component package structure according to another embodiment of the present invention.

7A is a top plan view of an electronic component package structure according to another embodiment of the present invention.

7B is a schematic cross-sectional view of the electronic component package structure of FIG. 7A.

1A is a schematic cross-sectional view showing an electronic component package structure according to an embodiment of the present invention. Referring to FIG. 1A , in the embodiment, the electronic component package structure 100 includes a first substrate 110 , a second substrate 120 , a pixel unit 130 , a moisture-absorbing color changing layer 140 , and an encapsulant 150 . The second substrate 120 is located above the first substrate 110. The pixel unit 130 is disposed on the first substrate 110 and located between the first substrate 110 and the second substrate 120. It is worth mentioning that the pixel unit 130 is formed on the first substrate 110 and then covered with the second substrate 120, and the second substrate 120 is a package cover. The package cover can be a glass, a plastic substrate or a film. Material, but not limited to this. Because the second substrate 120 is a package cover, there may be a gap between the pixel unit 130 and the pixel unit 130. The gap may include a moisture absorbing material or a glue filling. The other figures of the present invention are as shown in FIG. 3, FIG. 4 and FIG. FIG. 7B is the same as the embodiment in which the second substrate 120 is a package cover and may have a gap with the pixel unit 130. This is a conventional technique and is not described here.

The first substrate 110 and the second substrate 120 may be a glass substrate, a plastic substrate, a plastic film, or the like. The material of the plastic substrate/film is, for example, polyethylene terephthalate (PET), polyethylene isophthalate (PEN), polyether stone (PES), polymethyl methacrylate (PMMA), A substrate such as polycarbonate (PC), polyamine (PI) or metal foil, or the above composite substrate/film, but not limited thereto. On the other hand, the first substrate 110 and the second substrate 120 may also be substrates with touch functions, such as surface capacitive touch, digital matrix touch (eg, projected capacitive touch) or analog matrix touch. Substrate, etc.

The pixel unit 130 may include an active array structure 131 and an organic light emitting diode 132. The active array structure 131 is disposed on the first substrate 110 and includes an electronic opening Off components (such as thin film transistors), electrode layers, data lines, and signal lines. The organic light emitting diode 132 is electrically connected to the active array structure 131 and located between the active array structure 131 and the second substrate, wherein the organic light emitting diode 132 is, for example, an active matrix organic light emitting diode (AMOLED) or a passive matrix. Organic light-emitting diode (PMOLED). Generally, the active array structure 131 and the organic light emitting diode 132 are sequentially formed on the first substrate 110 through a patterning process, wherein the organic light emitting diode 132 is located on the active array structure 131.

Here, although an environmentally sensitive electronic component in which an organic light emitting diode is disposed is exemplified, in other possible embodiments, the environmentally sensitive electronic component may also be an Active Matrix Electro Phoretic Display (AM-). EPD), commonly known as electronic paper, or Active Matrix Liquid Crystal Display (AM-LCD), or Super Twisted Nematic Liquid Crystal Display (STN-LCD), this The invention does not limit this.

1B is a top plan view of the electronic component package structure of FIG. 1A. Referring to FIG. 1A and FIG. 1B, the moisture-absorbing color-changing layer 140 is disposed between the first substrate 110 and the second substrate 120, and is located at least one of the pixel units 130. side. In particular, the hygroscopic color changing layer 140 can surround the periphery of the pixel unit 130 and is, for example, a closed continuous pattern. The encapsulating material 150 is disposed between the first substrate 110 and the second substrate 120 and covers the pixel unit 130 and the moisture-absorbing color changing layer 140. The encapsulating material 150 may be glass glue, sealant, acrylic resin or An epoxy resin to firmly bond the first substrate 110 and the second substrate 120 together, and the pixel unit 130 and the hygroscopic color changing layer 140 It is located between the first substrate 110 and the second substrate 120.

In the present embodiment, the hygroscopic color changing layer 140 has a first surface 141 facing the first substrate 110 and a second surface 142 facing the second substrate 120. Generally, the external moisture is more likely to intrude into the pixel unit package structure 100 from the joint between the package material 150 and the first substrate 110 and the second substrate 120. Here, the moisture absorbing layer 140 is first. The surface 141 can be bonded to the first substrate 110, and the second surface 142 of the moisture-absorbing color changing layer 140 can be joined to the second substrate 120. Thus, the moisture-absorbing color changing layer 140 can serve as a possible intrusion path for moisture. The barrier structure is used to enhance the ability of the electronic component package structure 100 to block moisture.

Specifically, the moisture-absorbing color-changing layer 140 has the ability to absorb moisture intruding into the electronic component package structure 100, wherein the moisture-absorbing color-changing layer 140 can be formed on the first substrate 110 or the second substrate 120 by vapor deposition. Here, the material of the hygroscopic color changing layer 140 may be copper chloride (CuCl ₂ ). Generally, the copper chloride is yellowish brown before it is applied to the water gas, but when the copper chloride absorbs moisture, It will act to form aqueous copper chloride (CuCl ₂ (H ₂ O) ₂ ) and be blue-green. By observing the degree of color change of the hygroscopic color changing layer 140, it is immediately found whether the moisture invades into the electronic component package structure 100. And further confirm whether there is a lack of packaging process so that the water vapor can not be effectively blocked. In this way, it is also possible to avoid the supply of defective products on the front-end process to the back-end process for continued use, thereby improving product yield and reliability.

However, the present invention does not limit the material of the moisture-absorbing color changing layer 140 to copper chloride. In other possible embodiments, the moisture-absorbing color changing layer 140 may be made of cobalt chloride (CoCl ₂ ) or copper sulfate (CuSO _{4 ).} ). Generally, cobalt chloride appears blue before it has reacted with water gas, but when cobalt chloride absorbs water vapor, it acts to form aqueous cobalt chloride (CoCl ₂ with six crystal water). .6H ₂ O) is reddish purple, or aqueous cobalt chloride (CoCl ₂ .H ₂ O) with a crystal water and is pink. While copper sulphate has not appeared white before the action of water vapor, when copper sulphate absorbs water vapor, it acts to form aqueous copper sulphate (CuSO ₄ .5H ₂ O) with five crystal water and is blue.

The package of environmentally sensitive electronic components will be described below in several different embodiments. It is to be noted that the following embodiments use the same reference numerals and parts of the above-mentioned embodiments, and the same reference numerals are used to refer to the same or similar elements, and the description of the same technical content is omitted. For the description of the omitted portions, reference may be made to the foregoing embodiments, and the following embodiments are not repeated.

2 is a top plan view showing an electronic component package structure according to another embodiment of the present invention. Referring to FIG. 2, the electronic package structure 100A is substantially similar to the electronic component package structure 100, except that the main difference is that the moisture-absorbing color change layer 140a of the electronic package structure 100A may be a discontinuous pattern, wherein the moisture-absorbing color-changing layer 140a is, for example, It is composed of a plurality of strip patterns surrounding the periphery of the pixel unit 130, but the present invention is not limited thereto. In other possible embodiments, the hygroscopic color changing layer 140a may also be composed of a plurality of undulating, island-like patterns, zigzag patterns, or other suitable geometric patterns surrounding the pixel unit 130. In this way, the problem that the organic light-emitting diode 132 is affected by the moisture and the life is shortened can be improved to improve the reliability of the product, and the color change of the moisture-absorbing color-changing layer 140a can be observed to confirm whether the moisture invades the electron. Inside the component package structure 100A.

3 is a cross-sectional view showing an electronic component package structure according to another embodiment of the present invention; intention. Referring to FIG. 3, the electronic component package structure 100B is substantially similar to the electronic component package structure 100, but the main difference is that the second surface 142 of the moisture-absorbing color-changing layer 140b of the electronic component package structure 100B is opposite to the second substrate 120. Engaged while the first surface 141 is not bonded to the first substrate 110. Here, the hygroscopic color-changing layer 140b may be a continuous pattern or a non-continuous pattern around the pixel unit 130. The specific implementation may be adjusted with reference to FIG. 1B and FIG. 1C, and details are not described herein.

4 is a cross-sectional view showing an electronic component package structure according to another embodiment of the present invention. Referring to FIG. 4, the electronic component package structure 100C is substantially similar to the electronic component package structure 100, but the main difference is that the first surface 141 of the moisture-absorbing color-changing layer 140c of the electronic component package structure 100C is opposite to the first substrate 110. Engaged while the second surface 142 is not engaged with the second substrate 120. Here, the hygroscopic color changing layer 140c may be a continuous pattern or a non-continuous pattern around the pixel unit 130. The specific implementation may be adjusted with reference to FIG. 1B and FIG. 1C, and details are not described herein.

FIG. 5 is a cross-sectional view showing an electronic component package structure according to another embodiment of the present invention. Referring to FIG. 5, the electronic component package structure 100D is substantially similar to the electronic component package structure 100, but the main difference is that the moisture-absorbing color layer 140d of the electronic component package structure 100D is floated in the package adhesive 150, that is, It is said that the first surface 141 of the moisture-absorbing color-changing layer 140d is not bonded to the first substrate 110, and the second surface 142 is not bonded to the second substrate 120. Here, the hygroscopic color-changing layer 140d may be a continuous pattern or a non-continuous pattern around the pixel unit 130. The specific embodiment may be adjusted with reference to FIG. 1B and FIG. 1C, and details are not described herein.

In the above embodiment, the hygroscopic color layer is mainly treated by the encapsulating material. The pixel units are separated so that the hygroscopic color layer is not in direct contact with the pixel unit. 6 is a top plan view showing an electronic component package structure according to another embodiment of the present invention. Referring to FIG. 6, the electronic component package structure 100E is similar to the electronic component package structure 100, except that the main difference is that the moisture-absorbing color layer 140e of the electronic component package structure 100E is connected (directly in contact with) the pixel unit 130. Here, the hygroscopic color changing layer 140e is, for example, a continuous pattern around the pixel unit 130, but the present invention is not limited thereto. In other possible embodiments, the hygroscopic color changing layer 140e may also be a discontinuous pattern, and the specific implementation manner thereof may be adjusted with reference to FIG. 2, and details are not described herein.

For example, the two opposite surfaces of the moisture-absorbing color-changing layer 140e can be simultaneously joined to the corresponding first substrate 110 and the second substrate 120. The specific embodiment can be adjusted with reference to FIG. 1A, and details are not described herein. Alternatively, any of the two opposite surfaces of the moisture-absorbing color-changing layer 140e can be bonded to the corresponding first substrate 110 or the second substrate 120. The specific embodiment can be adjusted with reference to FIG. 3 and FIG. Narration. The two opposite surfaces of the moisture-absorbing color-changing layer 140e may not be bonded to the corresponding first substrate 110 and the second substrate 120. The specific embodiment may be adjusted with reference to FIG. 5, and details are not described herein.

7A is a top plan view of an electronic component package structure according to another embodiment of the present invention. 7B is a schematic cross-sectional view of the electronic component package structure of FIG. 7A. Referring to FIG. 7A and FIG. 7B, the electronic component package structure 100F is substantially similar to the electronic component package structure 100E, but the main difference is that the moisture-absorbing color layer 140f of the electronic component package structure 100F may include the first reaction layer 141f and The second reaction layer 142f is disposed on the first reaction layer 141f. Here, the first reaction layer 141f is disposed on The first substrate 110 is located between the first substrate 110 and the second reaction layer 142f.

The first reaction layer 141f may include an acid-base indicator (for example, a litmus indicator), and the second reaction layer 142f may include an alkaline earth metal (i.e., barium, magnesium, calcium, strontium, barium, radium). For example, the first reaction layer 141f and the second reaction layer 142f are prepared by first coating the acid-base indicator surrounding the pixel unit 130 on the first substrate 110, and forming the first after the acid-base indicator is heated. Reaction layer 141f. Next, the alkaline earth metal is evaporated to the coating range of the acid-base indicator (that is, on the first reaction layer 141f) to form the second reaction layer 142f. When the alkaline earth metal is calcium, the calcium vapor-deposited on the first reaction layer 141f is oxidized to form calcium oxide.

In view of the above, when the second reaction layer 142f is wetted, the calcium oxide absorbs water to form calcium hydroxide. Since the calcium hydroxide is weakly alkaline, after the calcium hydroxide contacts or infiltrates into the first reaction layer 141f, the first reaction layer 141f can be converted from red to blue, and the principle of action is similar to that of the red litmus paper, but the present invention does not. Limited to this. In other possible embodiments, the first reaction layer 141f may be prepared by using a wide-purpose indicator, so that after the calcium hydroxide contacts or infiltrates the first reaction layer 141f prepared by using the wide-purpose indicator, the indication is widely used. The first reaction layer 141f prepared by the agent can be changed from green to blue, ochre or purple depending on the degree of alkalinity. For example, the weak base can convert the first reaction layer 141f prepared by the wide-purpose indicator from green to blue, and the strong base can change the first reaction layer 141f prepared by the wide-purpose indicator from green to green. It is purple, and the degree of alkalitity between the weak base and the strong base can change the first reaction layer 141f prepared by the widely used indicator from green to ochre, and the principle of action and the widely used test paper similar.

In this way, it is also possible to confirm whether or not moisture is intruded into the electronic component package structure 100F by observing the color change of the moisture-absorbing color-changing layer 140f. On the other hand, the structural arrangement of the hygroscopic color changing layer 140f can be adjusted as disclosed in FIG. 1A, FIG. 1B and FIG. 2 to FIG. 5, which is not limited by the present invention.

On the other hand, for the second reaction layer 142f which forms an acidic substance after being wetted, the first reaction layer 141f can function similarly to the blue litmus paper to change from blue when contacted or absorbed into an acidic substance. It is red. Alternatively, the first reaction layer 141f may function similarly to a wide-purpose test paper to change from green to yellow, orange or red upon contact or absorption into an acidic substance, depending on the degree of acidity. For example, the weak acid can change the first reaction layer 141f prepared by the wide-purpose indicator from green to yellow, and the strong acid can change the first reaction layer 141f prepared by the wide-purpose indicator from green to red. When the acidity is between the weak acid and the strong acid, the first reaction layer 141f prepared by the widely used indicator can be changed from green to orange.

In summary, since the moisture-removing color-changing layer is disposed between the opposite substrates of the electronic component package structure of the present invention, the moisture-absorbing color-changing layer surrounds the periphery of the pixel unit and is covered by the sealing adhesive material that bonds the two opposing substrates. Therefore, when water vapor intrudes into the package structure, the moisture-absorbing color layer can be used to absorb moisture to prevent moisture from penetrating into the organic light-emitting diode. In addition, when the hygroscopic color-changing layer interacts with moisture, a color change occurs. Therefore, by observing the degree of color change of the hygroscopic color-changing layer, it is possible to immediately find out whether moisture is intruded into the electronic component package structure, and further confirm the packaging process. Whether it is missing or not, it is impossible to effectively prevent water vapor from being blocked. In this way, it can also avoid the former The supply of defective products on the end process continues to be used in the back-end process to improve product yield and reliability.

Although the present invention has been disclosed in the above embodiments, it is not intended to limit the present invention, and any one of ordinary skill in the art can make some changes and refinements without departing from the spirit and scope of the present invention. The scope of the invention is defined by the scope of the appended claims.

100‧‧‧Electronic component packaging structure

110‧‧‧First substrate

120‧‧‧second substrate

130‧‧‧ pixel unit

131‧‧‧Active array structure

132‧‧‧Organic Luminescent Diodes

140‧‧‧moisture color layer

141‧‧‧ first surface

142‧‧‧ second surface

150‧‧‧Package

Claims (13)

An electronic component package structure includes: a first substrate; a second substrate disposed opposite to the first substrate; a pixel unit disposed on the first substrate and located on the first substrate and the second substrate a moisture absorbing color layer disposed between the first substrate and the second substrate, and having a first surface facing the first substrate and a second surface facing the second substrate At least one side of the pixel unit; and a package material disposed between the first substrate and the second substrate, and connecting the first substrate and the second substrate, and surrounding the pixel unit and the moisture absorption Color changing layer. The electronic component package structure of claim 1, wherein the moisture-absorbing color-changing layer surrounds the periphery of the pixel unit. The electronic component package structure of claim 2, wherein the moisture-absorbing color-changing layer has a continuous pattern or a discontinuous pattern. The electronic component package structure of claim 1, wherein the first surface of the moisture-absorbing color-changing layer is bonded to the first substrate or the second surface is bonded to the second substrate. The electronic component package structure of claim 1, wherein the first surface and the second surface of the moisture-absorbing color-changing layer are respectively joined to the corresponding first substrate and the second substrate. The electronic component package structure according to claim 1, wherein the The material of the hygroscopic color changing layer includes cobalt chloride, copper chloride or copper sulfate. The electronic component package structure of claim 1, wherein the pixel unit comprises: an active array structure disposed on the first substrate; and an organic light emitting diode connected to the active array structure, and Located between the active array structure and the second substrate. The electronic component package structure of claim 7, wherein the organic light emitting diode comprises an active organic light emitting diode or a passive organic light emitting diode. The electronic component package structure of claim 1, wherein the package adhesive comprises glass glue, frame glue, acrylic resin or epoxy resin. The electronic component encapsulation structure of claim 1, wherein the hygroscopic color changing layer comprises a first reaction layer and a second reaction layer disposed on the first reaction layer. The electronic component package structure of claim 10, wherein the first reaction layer is disposed on the first substrate and located between the first substrate and the second reaction layer. The electronic component package structure of claim 10, wherein the first reaction layer comprises an acid-base indicator. The electronic component package structure of claim 10, wherein the second reaction layer comprises an alkaline earth metal.