TW201603933A - 金屬膠及其用於連接組件之用途 - Google Patents

金屬膠及其用於連接組件之用途 Download PDF

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Publication number
TW201603933A
TW201603933A TW104117827A TW104117827A TW201603933A TW 201603933 A TW201603933 A TW 201603933A TW 104117827 A TW104117827 A TW 104117827A TW 104117827 A TW104117827 A TW 104117827A TW 201603933 A TW201603933 A TW 201603933A
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Taiwan
Prior art keywords
metal
weight
components
glue
component
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TW104117827A
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English (en)
Inventor
麥克 沙佛
渥夫岡 史密特
亞伯特 希爾曼
偵斯 納崔那
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賀利氏德國有限責任兩合公司
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Publication of TW201603933A publication Critical patent/TW201603933A/zh

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    • BPERFORMING OPERATIONS; TRANSPORTING
    • B23MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23KSOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K35/00Rods, electrodes, materials, or media, for use in soldering, welding, or cutting
    • B23K35/22Rods, electrodes, materials, or media, for use in soldering, welding, or cutting characterised by the composition or nature of the material
    • B23K35/34Rods, electrodes, materials, or media, for use in soldering, welding, or cutting characterised by the composition or nature of the material comprising compounds which yield metals when heated
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B22CASTING; POWDER METALLURGY
    • B22FWORKING METALLIC POWDER; MANUFACTURE OF ARTICLES FROM METALLIC POWDER; MAKING METALLIC POWDER; APPARATUS OR DEVICES SPECIALLY ADAPTED FOR METALLIC POWDER
    • B22F1/00Metallic powder; Treatment of metallic powder, e.g. to facilitate working or to improve properties
    • B22F1/10Metallic powder containing lubricating or binding agents; Metallic powder containing organic material
    • B22F1/102Metallic powder coated with organic material
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B22CASTING; POWDER METALLURGY
    • B22FWORKING METALLIC POWDER; MANUFACTURE OF ARTICLES FROM METALLIC POWDER; MAKING METALLIC POWDER; APPARATUS OR DEVICES SPECIALLY ADAPTED FOR METALLIC POWDER
    • B22F1/00Metallic powder; Treatment of metallic powder, e.g. to facilitate working or to improve properties
    • B22F1/10Metallic powder containing lubricating or binding agents; Metallic powder containing organic material
    • B22F1/103Metallic powder containing lubricating or binding agents; Metallic powder containing organic material containing an organic binding agent comprising a mixture of, or obtained by reaction of, two or more components other than a solvent or a lubricating agent
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B22CASTING; POWDER METALLURGY
    • B22FWORKING METALLIC POWDER; MANUFACTURE OF ARTICLES FROM METALLIC POWDER; MAKING METALLIC POWDER; APPARATUS OR DEVICES SPECIALLY ADAPTED FOR METALLIC POWDER
    • B22F7/00Manufacture of composite layers, workpieces, or articles, comprising metallic powder, by sintering the powder, with or without compacting wherein at least one part is obtained by sintering or compression
    • B22F7/06Manufacture of composite layers, workpieces, or articles, comprising metallic powder, by sintering the powder, with or without compacting wherein at least one part is obtained by sintering or compression of composite workpieces or articles from parts, e.g. to form tipped tools
    • B22F7/062Manufacture of composite layers, workpieces, or articles, comprising metallic powder, by sintering the powder, with or without compacting wherein at least one part is obtained by sintering or compression of composite workpieces or articles from parts, e.g. to form tipped tools involving the connection or repairing of preformed parts
    • B22F7/064Manufacture of composite layers, workpieces, or articles, comprising metallic powder, by sintering the powder, with or without compacting wherein at least one part is obtained by sintering or compression of composite workpieces or articles from parts, e.g. to form tipped tools involving the connection or repairing of preformed parts using an intermediate powder layer
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B23MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23KSOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K35/00Rods, electrodes, materials, or media, for use in soldering, welding, or cutting
    • B23K35/02Rods, electrodes, materials, or media, for use in soldering, welding, or cutting characterised by mechanical features, e.g. shape
    • B23K35/0222Rods, electrodes, materials, or media, for use in soldering, welding, or cutting characterised by mechanical features, e.g. shape for use in soldering, brazing
    • B23K35/0244Powders, particles or spheres; Preforms made therefrom
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    • BPERFORMING OPERATIONS; TRANSPORTING
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    • B23K35/22Rods, electrodes, materials, or media, for use in soldering, welding, or cutting characterised by the composition or nature of the material
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    • B23K35/3602Carbonates, basic oxides or hydroxides
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B23MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23KSOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
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    • B23K35/3618Carboxylic acids or salts
    • BPERFORMING OPERATIONS; TRANSPORTING
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    • B23KSOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
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    • B23K35/365Selection of non-metallic compositions of coating materials either alone or conjoint with selection of soldering or welding materials
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Abstract

本發明係關於一種金屬膠,其包含(A)75至90重量%之至少一種呈包含含有至少一種有機化合物之塗層之顆粒形式存在之金屬、及(B)6至20重量%之有機溶劑,其中該金屬膠進一步包含(C)2至10重量%之至少一種由式(NHR1R2R3)+(BF4)-表示之四氟硼酸銨,藉此,殘基R1、R2、及R3係相同或不同的選自H及各具有□12個C原子之烴基之殘基。

Description

金屬膠及其用於連接組件之用途
本發明係關於一種金屬燒結膠,及一種連接組件之方法,該方法中使用該金屬膠。
在電力及消費電子裝置中,具有高度壓力及溫度敏感性之組件諸如LED或極薄矽晶片之連接特別具有挑戰性。
為此,該等具有壓力及溫度敏感性之組件通常係藉助於膠合彼此連接。然而,黏著技術與其在介於組件之間產生僅包含低導熱性及/或導電性之接觸部位之缺點相關。
為解決此問題,使待連接的組件通常進行燒結。燒結技術係一種以穩定方式連接組件之極簡單的方法。
習知燒結程序的困難處為具有例如由銅或鋁製成之非貴重金屬接觸表面之組件通常無法以足夠可靠的方式穩定連接。推測來說,非貴重金屬接觸表面上之氧化物部分會干擾可靠燒結連接之形成。
已知在電力電子裝置中在燒結製程中使用金屬膠以連接組件。例如,WO2011/026623 A1揭示一種金屬膠,其含有75至90重量%(重量百分比)之至少一種呈包含含有至少一種有機化合物之塗層之顆粒形式存在之金屬、0至12重量%之至少一種金屬前驅物、6至20重量%之至少一種溶劑、及0.1至15重量%之至少一種燒結助劑,及以該金屬調配物藉助燒結方法於連接組件之用途。
本發明之目標係提供一種以穩定方式連接組件之燒結方法。該方法意欲用於在待連接之組件之間產生具有低孔隙度及高導電性及導熱性之接觸部位。具體而言,該燒結程序適用於穩定連接具有例如由銅或鋁製成之非貴重金屬接觸表面之組件。本發明之另一目標係提供一種特別適於實施該燒結方法之金屬膠。
本發明係關於一種連接組件之方法,該方法包括提供(a)包含至少(a1)一個組件1、(a2)一個組件2、及(a3)位於組件1與組件2之間之金屬膠之夾層配置、及(b)使該夾層配置燒結,藉此,該金屬膠包含(A)75至90重量%之至少一種呈包含含有至少一種有機化合物之塗層之顆粒形式存在之金屬、及(B)6至20重量%之有機溶劑,其中該金屬膠進一步包含(C)2至10重量%之至少一種由式(NHR1R2R3)+(BF4)-表示之四氟硼酸銨,藉此,殘基R1、R2、及R3係相同或不同的選自H(氫)及各具有12個C原子之烴基之殘基。
本發明進一步關於一種金屬膠,其包含(A)75至90重量%之至少一種呈包含含有至少一種有機化合物之塗層之顆粒形式存在之金屬、及(B)6至20重量%之有機溶劑,其中該金屬膠進一步包含(C)2至10重量%之至少一種由式(NHR1R2R3)+(BF4)-表示之四氟硼酸銨,藉此,殘基R1、R2、及R3係相同或不同的選自H及各具有12個C原子之烴基之殘基。
本發明之金屬膠含有75至90重量%,較佳77至89重量%,更佳78至87重量%,及甚至更佳78至86重量%之至少一種呈包含含有至少一種有機化合物之塗層之顆粒形式存在之金屬。當前給定的重量包括位於該等顆粒上之塗層化合物之重量。
術語金屬應包含純金屬及金屬合金。
在本發明之範疇中,術語「金屬」係指元素週期系統中位於與硼相同週期但在硼左側,位於與矽相同週期但在矽左側,位於與鍺相 同週期但在鍺左側,及位於與銻相同週期但在銻左側之元素、及具有大於55之原子序數之所有元素。
在本發明之範疇中,純金屬應理解為係含有至少95重量%,較佳至少98重量%,更佳至少99重量%,及甚至更佳至少99.9重量%純度金屬之金屬。
根據一較佳實施例,該金屬係銅、銀、金、鎳、鈀、鉑或鋁,尤其係銀。
金屬合金應理解為係至少一者係金屬之至少兩種組分之金屬混合物。
根據一較佳實施例,使用含有銅、鋁、鎳及/或貴重金屬之合金作為金屬合金。該金屬合金較佳包含至少一種選自由銅、銀、金、鎳、鈀、鉑、及鋁組成之群之金屬。尤佳之金屬合金含有至少兩種選自由銅、銀、金、鎳、鈀、鉑及鋁組成之群之金屬。除此之外,選自由銅、銀、金、鎳、鈀、鉑、及鋁組成之群之金屬分率可較佳佔該金屬合金之至少90重量%,較佳至少95重量%,更佳至少99重量%,及甚至更佳100重量%。該合金可例如係含有銅及銀、銅、銀及金、銅及金、銀及金、銀及鈀、鉑及鈀或鎳及鈀之合金。
本發明之金屬膠可含有作為金屬之純金屬、多種類型之純金屬、一種類型之金屬合金、多種類型之金屬合金或其混合物。
該金屬係呈顆粒形式存於該金屬膠中。
該等金屬顆粒之形狀可不同。該等金屬顆粒可例如呈薄片形式或係球形(似球)存在。根據一尤佳實施例,該等金屬顆粒係薄片形狀。然而,此不排除使用小部分不同形狀之顆粒。然而,較佳至少70重量%,更佳至少80重量%,甚至更佳至少90重量%或100重量%之顆粒係呈薄片形式存在。
塗覆該等金屬顆粒。
術語顆粒之塗層應理解為係指顆粒之表面上之堅固黏著層。
該等金屬顆粒之塗層包含至少一種類型之塗層化合物。
該等塗層化合物係有機化合物。
充作塗層化合物之有機化合物係防止該等金屬顆粒聚結之含碳化合物。
根據一較佳實施例,該等塗層化合物具有至少一個官能基。假設官能基尤其包含羧酸基、羧酸酯基、酯基、酮基、醛基、胺基、醯胺基、偶氮基、醯亞胺基或氰基。羧酸基及羧酸酯基係較佳的官能基。羧酸基可係去質子化。
該等具有至少一個官能基之塗層化合物較佳係飽和、單不飽和或多不飽和有機化合物。
除此之外,該等具有至少一個官能基之塗層化合物可係分支鏈或非分支鏈。
該等具有至少一個官能基之塗層化合物較佳包含1至50個,更佳2至24個,甚至更佳6至24個,及又更佳8至20個碳原子。
該等塗層化合物可係離子性或非離子性。
較佳使用游離脂肪酸、脂肪酸鹽或脂肪酸酯作為塗層化合物。
該等游離脂肪酸、脂肪酸鹽、及脂肪酸酯較佳係非分支鏈。
除此之外,該等游離脂肪酸、脂肪酸鹽、及脂肪酸酯較佳係飽和。
較佳之脂肪酸鹽包括銨、單烷基銨、二烷基銨、三烷基銨、鋁、銅、鋰、鈉、及鉀鹽。
烷酯特定言之甲酯、乙酯、丙酯、及丁酯係較佳酯。
根據一較佳實施例,該等游離脂肪酸、脂肪酸鹽或脂肪酸酯係具有8至24個,更佳8至18個碳原子之化合物。
較佳之塗層化合物包括辛酸(caprylic acid)(辛酸(octanoic acid))、 癸酸(capric acid)(癸酸(decanoic acid))、月桂酸(十二烷酸)、肉豆蔻酸(十四烷酸)、棕櫚酸(十六烷酸)、珠光脂酸(十七烷酸)、硬脂酸(十八烷酸)、花生酸(二十酸/二十烷酸)、蘿酸(二十二烷酸)、木蠟酸(二十四烷酸)及對應之酯及鹽。
尤佳之塗層化合物包括十二烷酸、十八烷酸、硬脂酸鋁、硬脂酸銅、硬脂酸鈉、硬脂酸鉀、棕櫚酸鈉、及棕櫚酸鉀。
該等塗層化合物可藉由自先前技術已知的習知方法施覆至金屬顆粒之表面。
可例如在溶劑中漿化該等塗層化合物,特定言之上文提及之硬脂酸鹽或棕櫚酸鹽,及在球磨機中一起研磨該等漿化的塗層化合物及金屬顆粒。在研磨之後,乾燥經該等塗層化合物塗覆之金屬顆粒且接著移除粉塵。
較佳地,整個塗層中有機化合物之分率,特定言之選自由游離脂肪酸、脂肪酸鹽及脂肪酸酯組成之群之化合物之分率,係至少60重量%,更佳至少70重量%,甚至更佳至少80重量%,又更佳至少90重量%,尤其至少95重量%,至少99重量%或100重量%。
通常,該等塗層化合物之分率,較佳選自由游離脂肪酸、脂肪酸鹽及脂肪酸酯組成之群之塗層化合物之分率係佔經塗覆之金屬顆粒之重量0.01至2重量%,較佳0.3至1.5重量%。
定義為塗層化合物之質量與金屬顆粒之表面積之比率之塗覆程度較佳係每平方米(m2)金屬顆粒表面積0.00005至0.03g,更佳0.0001至0.02g塗層化合物。
本發明之金屬膠包含6至20重量%,較佳7至18重量%,更佳8至17重量%,及又更佳10至15重量%有機溶劑(B)(即,一種有機溶劑或至少兩種有機溶劑之混合物)。
該一或多種有機溶劑係常用於金屬膠之有機溶劑。實例包括萜 品醇、N-甲基-2-吡咯啶酮、乙二醇、二甲基乙醯胺、1-十三醇、2-十三醇、3-十三醇、4-十三醇、5-十三醇、6-十三醇、異十三醇(除了倒數第二C原子上之甲基取代以外)、未經取代之1-羥基-C16-C20-烷烴(諸如16-甲基十七烷-1-醇)、二元酯(較佳係戊二酸、己二酸或琥珀酸之二甲酯或其混合物)、甘油、二乙二醇、三乙二醇、及具有5至32個C原子,更佳10至25個C原子,及甚至更佳16至20個C原子之脂族烴(尤其係飽和脂族烴)。該等脂族烴係例如由Exxon Mobil以商標名ExxsolTM D140或商標名Isopar MTM出售。
對本發明而言必須的是,該金屬膠包含2至10重量%,較佳3至8重量%之至少一種由式(NHR1R2R3)+(BF4)-表示之四氟硼酸銨(C),藉此,殘基R1、R2、及R3係相同或不同的選自H及各具有12個,較佳1至8個,尤佳1至4個C原子之烴基之殘基。特定言之,該等烴基係脂族烴基,尤其係烷基。因此,以四氟硼酸單-、二-或三烷基銨較佳。以純無機四氟硼酸銨NH4BF4特別佳。
尤佳使用NH4BF4作為唯一的四氟硼酸銨,其定量分率尤其在相對現成可施覆本發明金屬膠計2至8重量%,具體言之3至7重量%範圍內。
本發明之金屬膠可包含0至12重量%,較佳0.1至12重量%,更佳1至10重量%,及甚至更佳2至8重量%之至少一種金屬前驅物(D)。
在本發明之範疇中,金屬前驅物應理解為意指含有至少一種金屬之化合物。較佳地,該化合物低於200℃之溫度下分解同時釋放金屬。因此,在燒結製程中使用金屬前驅物較佳造成在原位產生金屬。容易確定化合物是否係金屬前驅物。例如,可在具有銀表面之基板上沉積含有待測試之化合物之膠,接著加熱至200℃,且維持該溫度20分鐘。接著,測試待測試的化合物是否在此等條件下分解。針對此目的,例如,可在測試之前對含金屬膠組分之內容物稱重以計算金屬之 理論質量。於該測試後,藉由重量分析方法來測定沉積於基板上之材料之質量。若沉積於基板上之材料之質量等於金屬之理論質量,考慮到常見測量誤差,則所測試化合物係金屬前驅物。
根據一較佳實施例,該金屬前驅物係可吸熱分解之金屬前驅物。一可吸熱分解之金屬前驅物應理解為係其較佳在保護性氣體氛圍中之熱分解係吸熱過程之金屬前驅物。該熱分解造成金屬自該金屬前驅物釋放。
根據另一較佳實施例,該金屬前驅物包含亦呈金屬顆粒(A)存在之金屬。
該金屬前驅物較佳包含用作金屬之至少一種選自由銅、銀、金、鎳、鈀、及鉑組成之群之元素。
可較佳使用以上指定金屬之可吸熱分解碳酸鹽、乳酸鹽、甲酸鹽、檸檬酸鹽、氧化物或脂肪酸鹽(較佳係具有6至24個碳原子之脂肪酸鹽)作為金屬前驅物。
在特定實施例中,使用碳酸銀、乳酸銀(I)、甲酸銀(II)、檸檬酸銀、氧化銀(例如AgO或Ag2O)、乳酸銅(II)、硬脂酸銅、氧化銅(例如Cu2O或CuO)或氧化金(例如Au2O或AuO)作為金屬前驅物。
根據一尤佳實施例,使用碳酸銀、氧化銀(I)或氧化銀(II)作為金屬前驅物。
該金屬前驅物(若存在於金屬膠中)較佳呈顆粒形式存在。
該等金屬前驅物顆粒可係薄片或球形(似球)形狀。較佳地,該等金屬前驅物顆粒係呈薄片存在。
除此之外,該金屬膠可包含0至10重量%,較佳0至8重量%之至少一種燒結助劑(E)。燒結助劑之實例包括有機過氧化物、無機過氧化物、及無機酸,諸如例如WO2011/026623 A1中所述。
除以上所示組分(A)至(E)外,本發明之金屬膠亦可含有0至15重 量%,較佳0至12重量%,更佳0.1至10重量%之一或多種其他組分(F)。該等其他組分可較佳係常用於金屬膠中之組分。該金屬膠可含有例如分散劑、表面活性劑、消泡劑、結合劑、聚合物(諸如纖維素衍生物,例如甲基纖維素、乙基纖維素、乙基甲基纖維素、羧基纖維素、羥丙基纖維素、羥乙基纖維素、羥甲基纖維素)及/或黏度控制(流變)劑作為其他組分。
針對組分(A)至(F)指定的重量%分率總和累加(例如)達相對本發明之金屬膠(即,其施覆之前)計100重量%。因此,本發明之金屬膠可藉由混合組分(A)至(F)來製得。在該情況中可使用熟習此項技藝者已知的裝置,諸如攪拌器及三輥研磨機。
本發明之金屬膠可用作燒結膠(即,用於燒結製程中)。燒結應理解為意指藉由加熱使兩個或更多個組件連接而金屬顆粒(A)不到達液相。
通過使用本發明之金屬膠實施之燒結方法可在施加壓力或不施加壓力來實施。可在無壓力下實施該燒結方法意指不論先前施加壓力達成組件間之足夠堅固連接。可在無壓力下實施該燒結製程容許在該燒結方法中使用壓力敏感性例如易碎性組件或具有機械敏感性微結構之組件。具有機械敏感性微結構之電子組件在暴曝露於無法接受的壓力時遭遇到電故障問題。
使至少兩個組件連接應理解為意指使第一組件附著在第二組件上。在此情況中,「在...上」簡單意指該第一組件之表面係連接至該第二組件之表面,而與該等兩個組件或含有該至少兩個組件之配置之相對定位無關。
在本發明之範疇中,術語組件較佳包含單一部件。較佳地,該等單一部件無法進一步拆卸。
根據特定實施例,術語組件係指用於電子裝置中之部件。
因此,組件可例如係二極體、LED(發光二極體(lichtemittierende Dioden))、DCB(直接銅結合)基板、引線框架、晶粒、IGBT(絕緣閘極雙極性電晶體(Bipolartransistoren mit isolierter Gate-Elektrode))、IC(積體電路(integrierte Schaltungen))、感測器、散熱元件(較佳係鋁散熱元件或銅散熱元件)或其他被動組件(諸如電阻器、電容器或線圈)。
待連接之組件可係相同或不同組件。
本發明之實施例係關於連接LED至引線框架,連接LED至陶瓷基板,連接晶粒、二極體、IGBT或IC至引線框架、陶瓷基板或DCB基板,連接感測器至引線框架或陶瓷基板。本發明不僅促進連接貴重金屬接觸表面,而且尤其促進在室溫及高溫下可靠的方式連接一個非貴重金屬接觸表面至一個貴重金屬接觸表面或甚至連接兩個非貴重金屬接觸表面。該連接可關於電子裝置組件之鋁、銅或銀接觸表面連接至基板之鋁、銅或銀接觸表面之間,即,可形成例如鋁-銅、鋁-銀、鋁-鋁、銅-銀、銅-銅或銀-銀連接。
該等組件例如組件1及2中之至少一者可只要其等總之非由金屬組成則包括至少一個例如呈金屬化層形式之金屬接觸表面,特定言之係由非貴重金屬諸如銅或鋁製成之金屬接觸表面,藉此在本發明之方法之範疇中實現前述夾層配置。該金屬化層較佳係該組件之一部分。較佳地,該金屬化層係位於該組件之至少一個表面。
較佳地,藉助於本發明之金屬膠連接該等組件係藉由該一或多個金屬化層來實現。
該金屬化層可包含純金屬。因此,該金屬化層可較佳包含至少50重量%,更佳至少70重量%,甚至更佳至少90重量%或100重量%之純金屬。該純金屬係(例如)選自由鋁、銅、銀、金、鈀、及鉑組成之群。
本發明之一特定優點為該純金屬可係非貴重金屬(諸如鋁或銅)。
另一方面,該金屬化層可不妨包含合金。該金屬化層之合金較佳含有至少一種選自由鋁、銀、銅、金、鎳、鈀、及鉑組成之群之金屬。
該金屬化層可不妨具有多層結構。因此,待連接之組件之至少一個表面可較佳包含由多個包含上文指定的純金屬及/或合金之層製成之金屬化層。
在本發明之方法中,至少兩個組件係藉由燒結彼此連接。
針對此目的,首先使該等兩個組件彼此接觸。在此情況中,藉助於本發明之金屬膠來實現該接觸。針對此目的,提供一種配置,其中本發明之金屬膠係位於每兩個該至少兩個組件之間。
因此,若意欲使兩個組件(即,組件1及組件2)彼此連接,則在燒結製程之前使本發明之金屬膠位於組件1與組件2之間。另一方面,假設使多於兩個組件彼此連接。例如三個組件(即,組件1、組件2、及組件3)可以適宜方式彼此連接使得組件2位於組件1與組件3之間。在此情況中,本發明之金屬膠位於組件1與組件2之間而且位於組件2與組件3之間。
該等個別組分係呈夾層配置存在及彼此連接。夾層配置應理解為意指其中兩個組件中之一者位於另一者之上且該等兩個組件基本上相對於彼此平行配置之配置。
可根據先前技術中已知的任何方法產生至少兩個組件及本發明之金屬膠之配置,其中該金屬膠係位於該配置之兩個組件之間。
較佳地,首先,對組件1之至少一個表面提供本發明之金屬膠。接著,另一組件2以其一個表面置於已施覆至組件1之表面的金屬膠上。
施覆本發明之中間膠至組件之表面上可藉助習知製程例如藉助 印刷製程諸如網版印刷或模版印刷來進行。另一方面,本發明之金屬膠可不妨藉由施配技術藉助針板轉移或藉由浸漬來施覆。
在施覆本發明之金屬膠後,較佳藉助於該金屬膠使該組件之已提供有該金屬膠之表面與該組件之待連接至其之表面接觸。因此,本發明之金屬膠之層位於待連接之組件之間。
較佳地,介於待連接之組件間之濕層之厚度係在20至100μm範圍內。在此情況中,該濕層之厚度應理解為意指在乾燥前(若存在的話)及在燒結前待連接之組件之相對表面之間的距離。該濕層之較佳厚度取決於選用以施覆金屬膠方法。
若例如藉助於網版印刷法來施覆該金屬膠,則該濕層之厚度可較佳為20至50μm。若藉助於模版印刷來施覆該金屬膠,則該濕層之較佳厚度可在20至100μm範圍內。在施配技術中該濕層之較佳厚度可在20至100μm範圍內。
作為一選項,在燒結之前引入乾燥步驟,即,自該施覆之金屬膠移除有機溶劑。根據一較佳實施例,乾燥後金屬膠中之有機溶劑之分率為相對本發明之金屬膠中(即,準備用於施覆之金屬膠中)之有機溶劑之分率計例如0至5重量%。換言之,根據該較佳實施例,於乾燥期間移除例如95至100重量%之在本發明之金屬膠中原始存在之有機溶劑。
若在無壓力之燒結製程中進行乾燥,則該乾燥可在產生該配置之後,即,在使待連接之組件接觸之後進行。若在涉及施加壓力之燒結製程中進行乾燥,則該乾燥可不妨在施覆該金屬膠至該組件之至少一個表面上之後但與待連接之組件接觸之前進行。
較佳地,該乾燥溫度係在100至150℃範圍內。
明顯地,該乾燥時間取決於本發明之金屬膠之組成及待燒結之配置之連接表面之大小。常用乾燥時間係在5至45分鐘範圍內。
使由至少兩個該等組件及位於該等組件之間之金屬膠組成之配置最終經歷燒結製程。
該等實際燒結製程進行係在施加或未施加壓力之製程中在例如200至280℃之溫度下。
壓力燒結中之製程壓力較佳係小於30MPa且更佳小於5MPa。例如,該製程壓力係在1至30MPa範圍內且更佳係在1至5MPa範圍內。
該燒結時間係(例如)在壓力燒結中在2至60分鐘範圍內,例如在2至5分鐘範圍內及例如在無壓力燒結中在30至60分鐘範圍內。
該燒結製程可在不受任何特定限制之氛圍中進行。因此,一方面,該燒結可在含氧氛圍中進行。另一方面,該燒結可不妨在無氧氛圍中進行。在本發明之範疇中,無氧氛圍應理解為意指氧含量不大於10ppm,較佳不大於1ppm,及甚至更佳不大於0.1ppm之氛圍。
該燒結係在習知的用於燒結之適宜裝置中進行,在該等裝置中可設定上述製程參數。
藉由下文實例來說明本發明,然而,此等實例可不解釋為(諸如)以任何方式或形式限制本發明。
實例:
1.製造金屬膠:
首先,藉由混合根據下表之個別組分來製造本發明之金屬膠1至4及參照膠5至7。給定的所有量係以重量%單位計。
1)具有4.50μm之平均粒徑(d50)及0.7重量%辛酸/硬脂酸(重量比1:1)之塗層之銀薄片
2.該等金屬膠之施覆及無壓力燒結:
藉由施配至DBA基板(直接結合鋁基板)之鋁表面上來施覆各金屬膠達50μm的配重層(weight layer)厚度。接著,使該施覆的金屬膠在未事先乾燥下接觸至具有銀接觸表面(4.6mm2)之矽晶片。在隨後之無壓力燒結中使用以下加熱曲線:以60分鐘時間穩定加熱接觸部位至200℃且接著維持在200℃達30分鐘。
隨後,以15分鐘時間穩定增加溫度至280℃且接著維持在該水平60分鐘。然後,以50分鐘時間使其穩定地冷卻至30℃。
在燒結之後,藉由測試剪切強度來確定結合。在此情況中,用剪切鑿子在260℃以0.3mm/s之速率剪段組件。藉助於荷重計(DAGE 2000裝置,由德國DAGE製造)測定剪切力。表2顯示用金屬膠1至7獲得的結果。

Claims (12)

  1. 一種金屬膠,其包含(A)75至90重量%之至少一種呈包含含有至少一種有機化合物之塗層之顆粒形式存在之金屬、及(B)6至20重量%之有機溶劑,其特徵為該金屬膠進一步包含(C)2至10重量%之至少一種由式(NHR1R2R3)+(BF4)-表示之四氟硼酸銨,藉此,殘基R1、R2、及R3係相同或不同的選自H及各具有12個C原子之烴基之殘基。
  2. 如請求項1之金屬膠,其中該至少一種金屬係選自由銅、銀、金、鎳、鈀、鉑、及鋁組成之群。
  3. 如請求項1或2之金屬膠,其中該等金屬顆粒係薄片形狀。
  4. 如請求項1之金屬膠,其中該至少一種有機化合物係選自由游離脂肪酸、脂肪酸鹽、及脂肪酸酯組成之群。
  5. 如請求項1之金屬膠,其中該一或多個烴基之殘基係烷基。
  6. 如請求項1之金屬膠,其中該至少一種四氟硼酸銨(C)包括NH4BF4
  7. 如請求項6之金屬膠,其包含NH4BF4作為唯一的四氟硼酸銨(C)。
  8. 如請求項1之金屬膠,其除組分(A)及(C)之外亦包有0至12重量%之至少一種金屬前驅物(D)、0至10重量%之至少一種燒結助劑(E)、及0至15重量%之一或多種其他的選自分散劑、表面活性劑、消泡劑、結合 劑、聚合物及/或黏度控制(流變)劑之組分(F)。
  9. 一種用於連接組件之方法,該方法由以下組成:(a)提供夾層配置,其包括至少(a1)一個組件1、(a2)一個組件2、及(a3)一種位於組件1與組件2之間之如前述請求項中任一項之金屬膠,及(b)燒結該夾層配置。
  10. 如請求項9之方法,其中組件1及2中之至少一者包含鋁接觸表面或銅接觸表面,藉助於該鋁接觸表面或銅接觸表面來實施該夾層配置。
  11. 如請求項9之方法,其中該燒結在施加壓力或不施加壓力的同時進行。
  12. 如請求項9之方法,其中該等組件係用於電子裝置中之部件。
TW104117827A 2014-06-18 2015-06-02 金屬膠及其用於連接組件之用途 TW201603933A (zh)

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