TW201603247A - Pixel array substrate and panel - Google Patents

Abstract

A pixel array substrate includes a substrate, a plurality of pixel units and an inorganic isolation layer. The substrate has an active region and a peripheral region located around the active region. The active region includes a plurality of pixel unit regions and a folding region located at least one side of the pixel unit regions. Each of the pixel units includes an active device and a pixel electrode electrically connected to the active device. The pixel electrodes are disposed corresponding in the pixel unit regions. The inorganic isolation layer includes a first inorganic pattern and a second inorganic pattern respectively disposed in the pixel unit regions and the folding region. A thickness of the first inorganic pattern is greater than a thickness of the second inorganic pattern.

Description

Pixel array substrate and panel

The present invention relates to a pixel array substrate and a panel, and more particularly to a pixel array substrate and panel having flexible properties.

In view of the development of the technology of organic light-emitting diode (OLED), the corresponding development of the display does not need to use a backlight module, not only can make the display light and thin, but also the "flexible" characteristics for the future The focus of display development. Inorganic materials, that is, niobium oxynitrides such as tantalum nitride (SiNx), yttrium oxide (SiOx), and yttrium oxynitride (SiON), which are excellent in diffusion resistance, heat insulation, and insulation properties, are widely used. In the process of fabricating a thin film transistor array structure. However, the inorganic material has a poor ability to resist tensile strain, so when the curvature of the flexural flexible panel is too small, the inorganic material is broken or brittle, thereby limiting the display area of the organic light-emitting diode panel. It is the degree of flexibility of the metal trace area.

The invention provides a pixel array substrate with better flexibility Sex.

The invention further provides a panel, wherein the driving circuit area is bent to the back surface of the active area through the peripheral bendable area, and in addition to the effect of the borderless display, the driving circuit of the periphery can be prevented from being broken when the bending is performed. Or the problem of fracture can have better structural reliability.

The pixel array substrate of the present invention comprises a substrate, a plurality of pixel units, and an inorganic insulating layer. The substrate has an active area and a peripheral area around the active area, wherein the active area includes a plurality of pixel unit areas and a bendable area on at least one side of the pixel unit area. Each pixel unit includes an active component and a pixel electrode electrically connected to the active component, wherein the pixel electrodes are correspondingly disposed in the pixel unit region. The inorganic insulating layer includes a first inorganic insulating pattern and a second inorganic insulating pattern respectively disposed in the pixel unit region and the bendable region. The thickness of the first inorganic insulating pattern is greater than the thickness of the second inorganic insulating pattern.

In an embodiment of the invention, the pixel array substrate further includes a plurality of first signal lines and a plurality of second signal lines disposed on the substrate. Each pixel unit is electrically connected to one of the first signal lines and one of the second signal lines, wherein the bendable area is located between one of the pixel electrodes and the next first signal line, or the bendable area is located Between one of the pixel electrodes and the next second signal line, or the bendable region is between one of the pixel electrodes and the next first signal line and between the pixel electrode and the next second signal line .

In an embodiment of the invention, the first signal line and the second signal line are respectively two of a scan line, a data line and a shared line.

In an embodiment of the invention, the pixel array substrate further includes a buffer layer disposed between the substrate and the inorganic insulating layer, and the buffer layer covers the pixel unit region and the bendable region, wherein the thickness of the buffer layer Between 500 angstroms and 1000 angstroms.

In an embodiment of the invention, the first inorganic insulating pattern has a thickness of 4000 Å to 8000 Å, and the second inorganic insulating pattern has a thickness of 0 Å to 1000 Å.

In an embodiment of the invention, the peripheral region of the substrate includes a driving circuit region and a peripheral bendable region between the driving circuit region and the active region. The first inorganic insulating pattern is further disposed in the driving circuit region, and the second inorganic insulating pattern is disposed in the peripheral bendable region.

In an embodiment of the invention, the pixel array substrate further includes an organic flat layer covering the inorganic insulating layer such that the organic flat layer in the pixel unit region and the organic flat layer in the bendable region flat.

The panel of the present invention comprises a substrate, a plurality of pixel units, a driving circuit and an inorganic insulating layer. The substrate has an active area and a peripheral area located around the active area. The active area includes a plurality of pixel unit areas, and the peripheral area includes a driving circuit area and a peripheral bendable area between the driving circuit area and the active area. The drive circuit area is bent to the back of the active area through the peripheral bendable area. Each pixel unit includes an active component and a pixel electrode electrically connected to the active component, wherein the pixel electrodes are correspondingly disposed in the pixel unit region. The drive circuit is located in the drive circuit area and is located on the back of the pixel unit. The inorganic insulating layer includes a first inorganic insulating pattern and a second inorganic insulating pattern. The first inorganic insulation pattern is disposed in the pixel unit area, The second inorganic insulating pattern is located in the peripheral bendable region, wherein the thickness of the first inorganic insulating pattern is greater than the thickness of the second inorganic insulating pattern.

In an embodiment of the invention, the first inorganic insulating pattern has a thickness of 4000 Å to 8000 Å, and the second inorganic insulating pattern has a thickness of 0 Å to 1000 Å.

In an embodiment of the invention, the thickness of the second inorganic insulating layer is zero.

In an embodiment of the invention, the active region further includes a bendable region on at least one side of the pixel unit region, and the second inorganic insulating pattern is located in the bendable region and the peripheral bendable region.

In an embodiment of the invention, the panel further includes a plurality of first signal lines and a plurality of second signal lines disposed on the substrate. Each pixel unit is electrically connected to one of the first signal lines and one of the second signal lines, wherein the bendable area is located between one of the pixel electrodes and the next first signal line, or the bendable area is located Between one of the pixel electrodes and the next second signal line, or the bendable region is between one of the pixel electrodes and the next first signal line and between the pixel electrode and the next second signal line .

In an embodiment of the invention, the first signal line and the second signal line are respectively two of a scan line, a data line and a shared line.

In an embodiment of the invention, the panel further includes a buffer layer disposed between the substrate and the inorganic insulating layer, and the buffer layer is located in the active region and the peripheral region, wherein the buffer layer has a thickness of 500 angstroms to 1000 angstroms. .

In an embodiment of the invention, the first inorganic insulating layer further includes a driving circuit region disposed on the substrate.

In an embodiment of the invention, the panel further includes an organic flat layer covering the inorganic insulating layer, wherein the organic flat layer has a flat top surface.

Based on the above, since the pixel array substrate of the present invention has inorganic insulating patterns of different thicknesses, the thickness of the inorganic insulating pattern located in the pixel unit region is larger than the thickness of the inorganic insulating pattern located in the bendable region. That is, the inorganic insulating pattern is thinner in the bendable region. Therefore, when the pixel array substrate is bent through the bendable region, the problem that the inorganic insulating layer of the inorganic material is broken or broken can be avoided, so that the pixel array substrate of the present invention can have a better structure. Reliability. On the other hand, in the panel of the present invention, the driving circuit area can be bent to the back surface of the active area through the peripheral bendable area, thereby achieving the effect of no border display. Furthermore, since the thickness of the inorganic insulating pattern in the pixel unit region is larger than the thickness of the peripheral bendable region, the problem of chipping or cracking of the driving circuit during bending can be avoided, and the structural reliability can be improved.

The above described features and advantages of the invention will be apparent from the following description.

100a, 100b‧‧‧ pixel array substrate

110a, 110b, 210‧‧‧ substrates

112, 212‧‧‧ active area

112a, 212a‧‧‧ pixel unit area

112b, 212b‧‧‧ bendable area

114, 114’, 214‧‧‧ surrounding area

114a, 214a‧‧‧ drive circuit area

114b, 214b‧‧‧ perimeter bendable area

120, 220‧‧‧ pixel unit

122, 222‧‧‧ active components

124, 224‧‧‧ pixel electrodes

130, 130', 230‧‧‧Inorganic insulation

132, 232‧‧‧ first inorganic insulation pattern

134, 234‧‧‧Second inorganic insulation pattern

140, 240‧‧‧ first signal line

150, 250‧‧‧second signal line

160, 260‧‧‧ buffer layer

170, 270‧‧ organic flat layer

180, 280‧‧‧ drive circuit

200, 200’‧‧‧ panels

272‧‧‧ top surface

C‧‧‧Shared wiring

T, T1, T2, T3, T1', T2', T3'‧‧‧ thickness

W, W’‧‧‧ horizontal width

FIG. 1A is a schematic top plan view of a pixel array substrate according to an embodiment of the invention.

FIG. 1B is a schematic top plan view of a pixel array substrate according to another embodiment of the present invention.

FIG. 1C is a schematic top plan view of a pixel array substrate according to another embodiment of the invention.

FIG. 1D is a schematic top plan view of a pixel array substrate according to another embodiment of the present invention.

2 is a cross-sectional view taken along line I-I of FIG. 1A.

3 is a schematic plan view of a pixel array substrate according to another embodiment of the present invention.

4 is a cross-sectional view taken along line II-II of FIG. 3.

FIG. 5A is a schematic diagram of a panel according to an embodiment of the invention.

FIG. 5B is a schematic view showing the panel of FIG. 5A being bent.

6 is a partial cross-sectional view of the panel of FIG. 5A.

FIG. 7 is a partial cross-sectional view of a panel according to an embodiment of the invention.

FIG. 1A is a schematic top plan view of a pixel array substrate according to an embodiment of the invention. 2 is a cross-sectional view taken along line I-I of FIG. 1A. It should be noted that, for convenience of explanation, FIG. 1A omits part of the components. Referring to FIG. 1A and FIG. 2 simultaneously, in the embodiment, the pixel array substrate 100a includes a substrate 110a, a plurality of pixel units 120, and an inorganic insulating layer 130. The substrate 110a has An active region 112 and a peripheral region 114 located around the active region 112, wherein the active region 112 includes a plurality of pixel unit regions 112a and a bendable region 112b located on at least one side of the pixel unit region 112a. Each pixel unit 120 includes an active component 122 and a pixel electrode 124 electrically connected to the active component 122. The pixel electrode 124 is disposed in the pixel unit area 112a. The inorganic insulating layer 130 includes a first inorganic insulating pattern 132 and a second inorganic insulating pattern 134 disposed in the pixel unit region 112a and the bendable region 112b, respectively. In particular, the thickness T1 of the first inorganic insulating pattern 132 is greater than the thickness T2 of the second inorganic insulating pattern 134.

In detail, the substrate 110a of the present embodiment is, for example, a flexible substrate, and the material of the flexible substrate is, for example, polycarbonate (Polycarbonate, PC), polyethylene terephthalate (PET), Polyimide (PI), polyethersulfone (PES), Cyclic Olefin Copolymer (COC), Cyclo Olefin Polymer (COP), or a combination thereof, but not This is limited to this. Furthermore, the material of the inorganic insulating layer 130 of the present embodiment is, for example, one selected from the group consisting of tantalum nitride, cerium oxide, cerium oxynitride, and a combination thereof. That is, the inorganic insulating layer 130 of the present embodiment may be a single material structural layer or a plurality of structural layers of different materials, and is not limited thereto. Here, the thickness T1 of the first inorganic insulating pattern 132 is preferably between 4,000 angstroms and 8,000 angstroms, and the thickness T2 of the second inorganic insulating pattern 134 is preferably from 0 angstroms to 1000 angstroms.

In addition, as shown in FIG. 1A, the pixel array substrate 100a of the embodiment further includes a plurality of first signal lines 140 and a plurality of second signal lines 150, wherein the first signal The line 140 and the second signal line 150 are disposed on the substrate 110a, and the first signal line 140 and the second signal line 150 are disposed perpendicular to each other. More specifically. The pixel units 120 are arranged in an array, and each of the pixel units 120 is electrically connected to one of the first signal lines 140 and one of the second signal lines 150. Referring to FIG. 1A, the bendable region 112b may be located between one of the pixel electrodes 124 and the next second signal line 150; or, referring to FIG. 1B, the bendable region 112b may be located at one of the pixel electrodes 124. Between the next first signal line 140; or, referring to FIG. 1C, the bendable region 112b can be located between one of the pixel electrodes 124 and the next first signal line 140 and the pixel electrode 124 and There is no limitation between the next second signal line 150. Here, the first signal line 140 and the second signal line 150 are respectively two of the scan line, the data line and the shared line. In other words, the bendable region 112b of the present embodiment can be located between two adjacent scan lines (such as the first signal line 140) (as shown in FIG. 1B) and two adjacent data lines (such as the second signal line 150). Between (as shown in FIG. 1A), between two adjacent common lines C and a scan line (such as the first signal line 140) (as shown in FIG. 1D) or two adjacent shared lines C and data lines ( As between the second signal line 150). Preferably, the bendable region 112b has a radius of curvature of less than 5 mm, and the bendable region 112b has a horizontal width W of between 0.3 mm and 15.7 mm.

In addition, as shown in FIG. 2, in order to effectively protect the substrate 110a, the pixel array substrate 100a of the present embodiment further includes a buffer layer 160, wherein the buffer layer 160 is disposed between the substrate 110a and the inorganic insulating layer 130, and the buffer layer 160 The pixel unit area 112a and the bendable area 112b are covered. Here, the thickness T3 of the buffer layer 160 is preferably between 500 angstroms and 1000 angstroms, and the material of the buffer layer 160 is selected from tantalum nitride and oxygen. One of phlegm, bismuth oxynitride and combinations thereof. That is to say, the buffer layer 160 may be a structural layer of a single material or a structural layer of a plurality of layers of different materials, which is not limited herein. Furthermore, the pixel array substrate 100a of the present embodiment may further include an organic flat layer 170, wherein the organic flat layer 170 covers the inorganic insulating layer 130 such that the organic flat layer 170 located in the pixel unit region 112a is located at a bendable The organic planar layer 170 within region 112b is coplanar. Here, the material of the organic flat layer 170 is, for example, a photoresist such as a phenol-formaldehyde resin, an epoxy resin, or a polyisoprene rubber, but This is limited.

Since the pixel array substrate 100a of the present embodiment has the first inorganic insulating pattern 132 and the second inorganic insulating pattern 134 of different thicknesses, the thickness T1 of the first inorganic insulating pattern 132 located in the pixel unit region 112a is larger than the bendable The thickness T2 of the second inorganic insulating pattern 134 in the folded region 112b. That is, the second inorganic insulating pattern 134 of the inorganic insulating layer 130 is thinner in the bendable region 112b. As a result, when the pixel array substrate 100a is bent through the bendable region 112b, the problem that the inorganic insulating layer 130 of the inorganic material is broken or broken can be avoided, so that the pixel array substrate 100a of the present embodiment can have Better structural reliability. On the other hand, since the organic flat layer 170 located in the pixel unit region 112a and the organic flat layer 170 located in the bendable region 112b are coplanar, the thickness of the organic flat layer 170 on the first inorganic insulating pattern 132 is less than The thickness of the organic flat layer 170 on the second inorganic insulating pattern 134. That is, the organic flat layer 170 located in the pixel unit region 112a where the pixel electrode 124 is located is thinner and the first inorganic insulating pattern 132 is thinner. Therefore, the first inorganic insulating pattern 132 of the thick inorganic insulating layer 130 can effectively prevent moisture and oxygen from entering the pixel unit 120, thereby effectively improving the service life of the component.

It is to be noted that the following embodiments use the same reference numerals and parts of the above-mentioned embodiments, and the same reference numerals are used to refer to the same or similar elements, and the description of the same technical content is omitted. For the description of the omitted portions, reference may be made to the foregoing embodiments, and the following embodiments are not repeated.

3 is a schematic plan view of a pixel array substrate according to another embodiment of the present invention. 4 is a cross-sectional view taken along line II-II of FIG. 3. It should be noted that, for convenience of explanation, FIG. 3 omits part of the components. Referring to FIG. 1A and FIG. 3 simultaneously, the pixel array substrate 100b of the present embodiment is similar to the pixel array substrate 100a of FIG. 1A, but the main difference is that the peripheral region 114' of the substrate 110b of the present embodiment A driver circuit region 114a and a peripheral bendable region 114b between the driver circuit region 114a and the active region 112 are included. In particular, the first inorganic insulating pattern 132 of the present embodiment is further disposed in the driving circuit region 114a, and the second inorganic insulating pattern 134 is disposed in the peripheral bendable region 114b. Here, as shown in FIG. 4, the thickness T of the second inorganic insulating pattern 134 located in the peripheral bendable region 114b is significantly smaller than the thickness T4 of the first inorganic insulating pattern 132 in the driving circuit region 114a. Furthermore, the thickness T of the second inorganic insulating pattern 134 located in the peripheral bendable region 114b may be greater than 0 and between 0 angstroms and 1000 angstroms. Of course, in other embodiments not shown, the thickness T of the second inorganic insulating pattern 134 located in the peripheral bendable region 114b may also be zero. On the other hand, located in the drive circuit area 114a The thickness T4 of the first inorganic insulating pattern 132 may be the same as or different from the thickness T1 of the first inorganic insulating pattern 132 located in the pixel unit region 112a, which is not limited thereto, and preferably, is between 4000 angstroms. To 8000 angstroms.

Since the pixel array substrate 100b of the present embodiment has the first inorganic insulating pattern 132 and the second inorganic insulating pattern 134 of different thicknesses, the thickness T4 of the first inorganic insulating pattern 132 located in the driving circuit region 114a is greater than that of the periphery. The thickness T of the second inorganic insulating pattern 134 in the folded region 114b. That is, the second inorganic insulating pattern 134 of the inorganic insulating layer 130' is thinner in the peripheral bendable region 114b. In this way, when the pixel array substrate 100b is bent through the peripheral bendable region 114b, the problem of chipping or breaking of the inorganic insulating layer 130' of the inorganic material can be avoided, and the pixel array substrate 100b of the present embodiment is further prevented. It can have better structural reliability. On the other hand, the first inorganic insulating pattern 132 of the inorganic insulating layer 130' is thicker in the pixel unit region 112a and the driving circuit region 114a, so that moisture and oxygen can be effectively prevented from entering the pixel unit 120 and the driving circuit (not In the drawing, it can effectively improve the service life of components.

FIG. 5A is a schematic diagram of a panel according to an embodiment of the invention. FIG. 5B is a schematic view showing the panel of FIG. 5A being bent. 6 is a partial cross-sectional view of the panel of FIG. 5A. It should be noted that, for convenience of explanation, FIG. 5B omits part of the components. Referring to FIG. 5A , FIG. 5B and FIG. 6 , in the embodiment, the panel 200 includes a substrate 210 , a plurality of pixel units 220 , a driving circuit 280 , and an inorganic insulating layer 230 . The substrate 210 has an active region 212 and a peripheral region 214 located around the active region 212. The active area 212 includes a plurality of pixel unit areas 212a. The peripheral zone 214 includes a drive circuit region 214a and a peripheral bendable region 214b between the drive circuit region 214a and the active region 212. The drive circuit region 214a is bent to the back surface of the active region 212 through the peripheral bendable region 214b. Each pixel unit 220 includes an active component 222 and a pixel electrode 224 electrically connected to the active component 222. The pixel electrode 224 is disposed in the pixel unit region 212a. The drive circuit 280 is located in the drive circuit region 214a and is located on the back side of the pixel unit 220 by bending. The inorganic insulating layer 230 includes a first inorganic insulating pattern 232 and a second inorganic insulating pattern 234. The first inorganic insulating pattern 232 is disposed in the pixel unit region 212a, and the second inorganic insulating pattern 234 is located in the peripheral bendable region 214b, wherein the thickness T1' of the first inorganic insulating pattern 232 is greater than the thickness of the second inorganic insulating pattern 234 T2'. Preferably, the first inorganic insulating pattern 232 has a thickness T1' of between 4,000 angstroms and 8,000 angstroms, and the second inorganic insulating pattern 234 has a thickness T2' of between 0 angstroms and 1000 angstroms.

More specifically, in the embodiment, the active region 212 further includes a bendable region 212b located on at least one side of the pixel unit region 212a, and the second inorganic insulating pattern 234 is located at the bendable region 212b and the periphery. In the bend zone 214b. Furthermore, the panel 200 of the present embodiment further includes a plurality of first signal lines 240 and a plurality of second signal lines 250. The first signal lines 240 and the second signal lines 250 are disposed on the substrate 210, and the first signal lines are disposed. 240 is interleaved with the second signal line 250, and the first signal line 240 extends through the peripheral bendable region 214b, and the driving circuit 280 is located in the driving circuit region 214a. Each pixel unit 220 is electrically connected to one of the first signal lines 240 and one of the second signal lines 250, wherein the bendable area 212b is located at one of them. Between the pixel electrode 224 and the next first signal line 240; or, the bendable region 212b is located between one of the pixel electrodes 224 and the next second signal line 250; or the bendable region 212b is located therein Between one pixel electrode 224 and the next first signal line 240 and between the pixel electrode 224 and the next second signal line 250. Here, the first signal line 240 and the second signal line 250 are respectively two of the scan line, the data line and the shared line. In other words, the bendable region 212b of the present embodiment can be located between two adjacent scan lines, between two adjacent data lines, between two adjacent common and scan lines, or between two adjacent common lines and Between data lines. Preferably, the bendable region 212b has a radius of curvature of less than 5 mm, and the bendable region 212b has a horizontal width W' of between 0.3 mm and 15.7 mm.

It should be noted that although the active region 212 of the substrate 210 includes a bendable region 212b therein, that is, the active region 212 of the substrate 210 has a flexible characteristic bendable in addition to the pixel unit region 212a. Zone 212b. However, in other embodiments not shown, the active region of the substrate may not have a bendable region, that is, the active region of the substrate has only a pixel unit region and has no flexible property, which is still The scope of the invention to be protected. Moreover, as shown in FIG. 6, the thickness T2' of the second inorganic insulating layer 234 in the bendable region 212b and the peripheral bendable region 214b is more than 0 angstroms. However, in other embodiments, please refer to the panel 200 ′ illustrated in FIG. 7 , wherein the thickness of the second inorganic insulating pattern 234 located in the peripheral bendable region 214 b is embodied as zero, which is still to be protected by the present invention. The scope. In addition, the first inorganic insulating layer 232 of the present embodiment further includes a driving circuit region 214a disposed on the substrate 210, and the thickness T1' of the first inorganic insulating pattern 232 located in the driving circuit region 214a is located The thickness T1' of the first inorganic insulating pattern 232 of the pixel unit area 212a may be the same (as shown in the embodiment of FIG. 6) or may be different, and is not limited thereto.

In addition, referring to FIG. 6 , in order to effectively protect the substrate 210 , the panel 200 of the embodiment further includes a buffer layer 260 , wherein the buffer layer 260 is disposed between the substrate 210 and the inorganic insulating layer 230 , and the buffer layer 260 covers the active region. 212 and the surrounding area 214. Here, the thickness T3' of the buffer layer 160 is preferably between 500 angstroms and 1000 angstroms, and the material of the buffer layer 260 is selected from one of tantalum nitride, lanthanum oxide, lanthanum oxynitride, and combinations thereof. That is to say, the buffer layer 260 may be a structural layer of a single material or a structural layer of a plurality of layers of different materials, which is not limited herein. Furthermore, the panel 200 of the present embodiment may further include an organic flat layer 270, wherein the organic flat layer 270 covers the inorganic insulating layer 230 and has a flat top surface 272. Here, the material of the organic flat layer 270 is, for example, a photoresist such as a phenol-formaldehyde resin, an epoxy resin, or a polyisoprene rubber, but This is limited.

Since the panel 200 of the embodiment has the driving circuit region 214a bent through the peripheral bendable region 214b to the back surface of the active region 212, the effect of the borderless display can be achieved. Moreover, since the thickness T1' of the first inorganic insulating pattern 232 of the panel 200 in the pixel unit region 212a is larger than the thickness T2' of the peripheral bendable region 214b, it is possible to avoid the chipping or breaking of the driving circuit 280 at the time of bending. The problem can have better structural reliability.

In summary, since the pixel array substrate of the present invention has inorganic insulating patterns of different thicknesses, the thickness of the inorganic insulating pattern located in the pixel unit region is large. The thickness of the inorganic insulating pattern located in the bendable region. That is, the inorganic insulating pattern is thinner in the bendable region. Therefore, when the pixel array substrate is bent through the bendable region, the problem that the inorganic insulating layer of the inorganic material is broken or broken can be avoided, so that the pixel array substrate of the present invention can have a better structure. Reliability.

In addition, in the panel of the present invention, the driving circuit area can be bent to the back surface of the active area through the peripheral bendable area, thereby achieving the effect of no border display. Furthermore, since the thickness of the inorganic insulating pattern in the pixel unit region is larger than the thickness of the peripheral bendable region, the problem of chipping or cracking of the driving circuit during bending can be avoided, and the structural reliability can be improved.

Although the present invention has been disclosed in the above embodiments, it is not intended to limit the present invention, and any one of ordinary skill in the art can make some changes and refinements without departing from the spirit and scope of the present invention. The scope of the invention is defined by the scope of the appended claims.

100a‧‧‧ pixel array substrate

110a‧‧‧Substrate

112‧‧‧active area

112a‧‧‧ pixel unit

112b‧‧‧ bendable area

130‧‧‧Inorganic insulation

132‧‧‧First inorganic insulation pattern

134‧‧‧Second inorganic insulation pattern

140‧‧‧First signal line

160‧‧‧buffer layer

170‧‧‧Organic flat layer

T1, T2, T3‧‧‧ thickness

W‧‧‧ horizontal width

Claims (16)

A pixel array substrate includes: a substrate having an active region and a peripheral region around the active region, wherein the active region includes a plurality of pixel unit regions and one of at least one side of the pixel unit regions a plurality of pixel units, each of the pixel units includes an active component and a pixel electrode electrically connected to the active component, wherein the pixel electrodes are correspondingly disposed in the pixel unit And an inorganic insulating layer, including a first inorganic insulating pattern and a second inorganic insulating pattern, respectively disposed in the pixel unit regions and the bendable region, wherein the first inorganic insulating pattern has a thickness greater than the The thickness of the second inorganic insulating pattern. The pixel array substrate of claim 1, further comprising: a plurality of first signal lines and a plurality of second signal lines disposed on the substrate, wherein each pixel unit and one of the first signals The wire and one of the second signal wires are electrically connected, wherein the bendable region is located between one of the pixel electrodes and the next first signal line, and the bendable region is located at one of the pixel electrodes and the next second Between the signal lines, or the bendable area is between one of the pixel electrodes and the next first signal line and between the pixel electrode and the next second signal line. The pixel array substrate of claim 2, wherein the The one signal line and the second signal lines are respectively two of the scan line, the data line and the shared line. The pixel array substrate of claim 1, further comprising: a buffer layer disposed between the substrate and the inorganic insulating layer, wherein the buffer layer covers the pixel unit regions and the bendable layer a region wherein the buffer layer has a thickness of between 500 angstroms and 1000 angstroms. The pixel array substrate of claim 1, wherein the first inorganic insulating pattern has a thickness of 4000 Å to 8000 Å, and the second inorganic insulating pattern has a thickness of 0 Å to 1000 Å. The pixel array substrate of claim 1, wherein the peripheral region of the substrate comprises a driving circuit region and a peripheral bendable region between the driving circuit region and the active region, the first The inorganic insulating pattern is further disposed in the driving circuit region, and the second inorganic insulating pattern is further disposed in the peripheral bendable region. The pixel array substrate of claim 1, further comprising: an organic flat layer covering the inorganic insulating layer such that the organic flat layer located in the pixel unit regions and the bendable region The organic planar layer is coplanar. A panel includes: a substrate having an active region and a peripheral region around the active region, wherein the active region includes a plurality of pixel unit regions, and the peripheral region includes a driving circuit region and is located in the driving circuit region a peripheral bendable region between the active regions, and the driving circuit region is bent to the back surface of the active region through the peripheral bendable region; a plurality of pixel units, each of the pixel units includes an active component and a pixel electrode electrically connected to the active component, wherein the pixel electrodes are disposed correspondingly in the pixel unit regions; a driving circuit The first inorganic insulating pattern is disposed on the pixels And a second inorganic insulating pattern is located in the peripheral bendable region, wherein a thickness of the first inorganic insulating pattern is greater than a thickness of the second inorganic insulating pattern. The panel of claim 8, wherein the first inorganic insulating pattern has a thickness of from 4000 angstroms to 8,000 angstroms, and the second inorganic insulating pattern has a thickness of from 0 angstroms to 1000 angstroms. The panel of claim 9, wherein the second inorganic insulating layer has a thickness of zero. The panel of claim 8, wherein the active region further comprises a bendable region on at least one side of the pixel unit regions, and the second inorganic insulating pattern is located in the bendable region and The perimeter can be in the bend zone. The panel of claim 11, further comprising: a plurality of first signal lines and a plurality of second signal lines disposed on the substrate, wherein each pixel unit and one of the first signal lines and the middle thereof a second signal line is electrically connected, wherein the bendable area is located at one of the pixel electrodes and the next first signal line The bendable region is located between one of the pixel electrodes and the next second signal line, or the bendable region is between one of the pixel electrodes and the next first signal line and the pixel electrode Between the next second signal line. The panel of claim 12, wherein the first signal lines and the second signal lines are respectively two of a scan line, a data line and a shared line. The panel of claim 8, further comprising: a buffer layer disposed between the substrate and the inorganic insulating layer, wherein the buffer layer is located in the active region and the peripheral region, wherein a thickness of the buffer layer Between 500 angstroms and 1000 angstroms. The panel of claim 8, wherein the first inorganic insulating layer further comprises the driving circuit region disposed on the substrate. The panel of claim 8, further comprising: an organic flat layer covering the inorganic insulating layer, wherein the organic flat layer has a flat top surface.