TW201602851A - Touch panel and touch display device and method of fabricating the same - Google Patents

Abstract

A touch panel and a touch display device and method of fabricating the same are provided. The touch panel includes a first substrate, a patterned shield layer and a patterned conductive layer. The first substrate has a first surface and a second surface opposite thereto. The patterned shield layer disposed on the first surface. The patterned shield layer includes a periphery region of patterned part. The periphery region of the patterned part has at least one hollow opening to be at least one first mark pattern. The patterned conductive layer is disposed on the second surface.

Description

Touch panel and touch display device and manufacturing method thereof

The present invention relates to a panel and a display device and a method for fabricating the same, and more particularly to a touch panel and a touch display device and a method of fabricating the same.

With the increasing popularity of mobile devices such as smart phones and tablets, touch panel technology has become more mature and developed in many directions. In the touch panel of the existing on-cell structure, the method is as follows: a patterned conductive layer is formed on the substrate, and a shielding layer, a color filter layer, and the like are sequentially formed. In general, since the patterned conductive layer is a transparent conductive layer, the alignment mark formed at the same time when the patterned conductive layer is formed is permeable, which may cause difficulty in alignment of subsequent processes, thereby affecting touch. The process yield of the panel.

The invention provides a touch panel, which can effectively improve the alignment difficulty.

The invention provides a method for manufacturing a touch panel, which can produce a touch panel with good alignment.

The invention provides a touch display device with good alignment.

The invention provides a method for manufacturing a touch display device, which can produce a touch display device with good alignment.

The touch panel of the present invention includes a first substrate, a patterned shielding layer, and a patterned conductive layer. The first substrate has a first surface and a second surface opposite the first surface. The patterned shielding layer is disposed on the first surface. The patterned masking layer includes a peripheral zone pattern portion. And the peripheral area pattern portion has at least one hollow opening as at least one first marking pattern. The patterned conductive layer is disposed on the second surface.

In an embodiment of the invention, the patterned shielding layer further includes a display area pattern portion. A peripheral area is defined at the location of the peripheral area pattern portion. The display area pattern portion is located in a central area beside the peripheral area, and the display area pattern portion has a plurality of pixel openings.

In an embodiment of the invention, the method further includes at least one second marking pattern disposed on the second surface, and the contour of the second marking pattern is at least partially aligned with the contour of the first marking pattern.

In an embodiment of the invention, a substrate is further attached to the second surface, wherein the patterned conductive layer and the second marking pattern are disposed on the substrate, and the substrate is located on the patterned conductive layer and the second surface. Between, and between the second marking pattern and the second surface.

In an embodiment of the invention, the second marking pattern and the patterned conductive layer are the same film layer.

In an embodiment of the invention, the second marking pattern and the patterning are performed The conductive layers are different film layers.

In an embodiment of the invention, the patterned conductive layer further includes a plurality of touch conductive portions. A peripheral area is defined at the location of the peripheral area pattern portion. The touch conductive portion is located in a central region beside the peripheral region, and the touch conductive portion and the second mark pattern are separated from each other.

In an embodiment of the invention, the contour of the at least one first marking pattern and the contour of the second marking pattern coincide with each other.

In an embodiment of the invention, the contour of the first marking pattern and the contour of the second marking pattern fill a geometric area.

In an embodiment of the invention, the contours of the at least one first marking pattern and the contours of the at least one second marking pattern are alternately distributed in the geometric area without completely overlapping.

In an embodiment of the invention, the material of the shielding layer is a photosensitive resin or a chromium film.

In an embodiment of the invention, the first substrate has a thickness of no more than 0.25 cm.

In an embodiment of the invention, the material of the patterned conductive layer comprises a metal material, a transparent conductive material or a combination thereof.

The touch display device of the present invention includes any one of the above touch panel, pixel array substrate, sealant layer and display medium. The pixel array substrate faces the first surface of the first substrate, and includes a second substrate and a pixel array. The pixel array is disposed on the second substrate and between the second substrate and the first substrate. The sealant layer is disposed on Between the first substrate and the pixel array substrate. The display medium is disposed between the pixel array substrate and the touch panel.

In an embodiment of the invention, the touch display device further includes at least one circuit board. The circuit board is bonded to a bonding region of the first substrate to be electrically connected to the patterned conductive layer, wherein the projection of the sealant layer on the first substrate defines an adhesive region, and at least a portion of the bonding region is located in the bonding region Outside.

In an embodiment of the invention, the bonding region and the bonding region do not overlap each other.

In an embodiment of the invention, the second substrate has a thickness of no more than 0.25 cm.

In an embodiment of the invention, the thickness of the second substrate is different from the thickness of the first substrate, and the thickness of the thinner is not more than 0.25 cm.

In an embodiment of the invention, the touch display device further includes a plurality of thermally conductive particles distributed in the sealant layer.

The method for fabricating a touch panel of the present invention includes forming a patterned shielding layer on a first surface of a first substrate, forming a conductive layer on a second surface of the first substrate, and using a mask pattern The conductive layer is formed to form a patterned conductive layer. The patterned shielding layer includes a peripheral region pattern portion, and the peripheral region pattern portion has at least one hollow opening as at least one first marking pattern. The first surface and the second surface are opposite each other. The reticle pair is located in the first marking pattern.

In an embodiment of the invention, the method further includes forming at least one second marking pattern. The contour of the second marking pattern is at least partially aligned with the contour of the first marking pattern.

In an embodiment of the invention, the method further includes forming the patterned conductive layer and the second marking pattern on a substrate, and attaching the substrate to the second surface.

In an embodiment of the invention, the patterned conductive layer and the second marking pattern are made of the same film layer.

In an embodiment of the invention, the patterned conductive layer and the second marking pattern are made of different film layers.

A method for fabricating a touch display device according to the present invention includes forming a patterned shielding layer on a first surface of a first substrate, forming a conductive layer on a second surface of the first substrate, and using a mask pattern The conductive layer is formed to form a patterned conductive layer, a sealant layer is used to bond the first substrate to the pixel array substrate, and a display medium is disposed between the pixel array substrate and the first substrate. The patterned shielding layer includes a peripheral region pattern portion, and the peripheral region pattern portion has at least one hollow opening as at least one first marking pattern. The first surface and the second surface are opposite each other. The reticle pair is located in the first marking pattern. The pixel array substrate faces the first surface of the first substrate, and the sealant layer forms an adhesion region on the first substrate and the pixel array substrate.

In an embodiment of the invention, the method further includes forming at least one second marking pattern. The contour of the second marking pattern is at least partially aligned with the contour of the first marking pattern.

In an embodiment of the invention, the method further includes forming the second marking pattern and the patterned conductive layer on the substrate, and attaching the substrate to the second surface.

In an embodiment of the invention, the method further includes disposing a plurality of thermally conductive particles in the sealant layer before using the sealant layer to bond the first substrate to the pixel array substrate.

In an embodiment of the present invention, the pixel array substrate includes a second substrate and a pixel array disposed on the second substrate, and the manufacturing method further includes using a sealant layer to draw the first substrate and the After the matrix substrate is bonded, the second substrate is thinned. The thickness of the second substrate is no more than 0.25 cm.

In an embodiment of the invention, after the patterning the shielding layer is formed on the first surface of the first substrate, the following steps are sequentially performed: the display medium is disposed between the pixel array substrate and the touch panel, A sealant layer is used to bond the first substrate to the pixel array substrate, form a conductive layer on the second surface of the first substrate, and pattern the conductive layer using the reticle to form a patterned conductive layer. The pixel array substrate faces the first surface of the first substrate, and the sealant layer forms an adhesion region on the first substrate and the pixel array substrate. The first surface and the second surface are opposite each other. The reticle pair is located in at least one first marking pattern.

In an embodiment of the present invention, the pixel array substrate includes a second substrate and a pixel array disposed on the second substrate, and the manufacturing method further includes using a sealant layer to draw the first substrate and the After the matrix substrate is bonded, and before the conductive layer is formed on the second surface of the first substrate, at least one of the second substrate and the first substrate. The thickness of at least one of the second substrate and the first substrate is not more than 0.25 cm.

Based on the above, the touch panel of the present invention and the manufacturing method thereof can effectively improve the alignment difficulty, and produce a touch panel with good alignment, thereby producing a good alignment touch display device to improve the process yield. The purpose.

The above described features and advantages of the invention will be apparent from the following description.

10, 20, 30, 40, 50‧‧‧ touch panels

60, 70, 80‧‧‧ touch display devices

100‧‧‧First substrate

102‧‧‧ first surface

104‧‧‧ second surface

106‧‧‧Substrate

110‧‧‧ patterned masking layer

110a‧‧‧The surrounding area pattern department

110b‧‧‧Display Area Pattern Department

112‧‧‧First marking pattern

114‧‧‧ pixel opening

120‧‧‧ patterned conductive layer

120a‧‧‧Touch Conductor

122‧‧‧Second mark pattern

200‧‧‧ pixel array substrate

202‧‧‧second substrate

204‧‧‧ pixel array

300‧‧‧Block layer

302‧‧‧thermal particles

400‧‧‧Display media

500‧‧‧ circuit board

502‧‧‧ Conductive bonding layer

A‧‧‧ area

C‧‧‧Central District

CF‧‧‧ color filter pattern

H‧‧‧ hollow opening

I-I’, II-II’‧‧‧

L‧‧‧ Bonding area

N‧‧‧ junction area

P‧‧‧ surrounding area

S100, S102, S104, S106, S107, S108, S109‧‧‧ steps

1A is a schematic plan view of a touch panel according to a first embodiment of the present invention.

FIG. 1B is a cross-sectional view of the touch panel of FIG. 1A.

FIG. 1C is a diagram of a method of fabricating a touch panel according to a first embodiment of the present invention.

2A is a top plan view of a touch panel according to a second embodiment of the present invention.

2B is a schematic cross-sectional view of the touch panel of FIG. 2A.

2C is a partial plan view of the touch panel of the second embodiment of the present invention.

2D to 2F are other possible partial plan views of the touch panel of the second embodiment of the present invention.

3A is a top plan view of a touch panel according to a third embodiment of the present invention.

FIG. 3B is a schematic cross-sectional view of the touch panel of FIG. 3A.

3C is a partial plan view of a touch panel of a third embodiment of the present invention.

3D to 3F are other possible partial plan views of the touch panel of the third embodiment of the present invention.

4 is a cross-sectional view showing a touch panel of a fourth embodiment of the present invention.

Fig. 5 is a cross-sectional view showing a touch panel of a fifth embodiment of the present invention.

FIG. 6A is a schematic top view of a touch display device according to an embodiment of the invention.

6B is a schematic cross-sectional view of the touch display device of FIG. 6A.

FIG. 6C is a diagram of a method of fabricating the touch display device of FIG. 6A.

FIG. 6D is another manufacturing method of the touch display device of FIG. 6A.

FIG. 7A is a schematic top plan view of a touch display device according to another embodiment of the present invention.

7B is a schematic cross-sectional view of the touch display device of FIG. 7A.

FIG. 7C is a diagram of a method of fabricating the touch display device of FIG. 7A.

FIG. 7D is another manufacturing method of the touch display device of FIG. 7A.

FIG. 8A is a schematic top view of a touch display device according to still another embodiment of the present invention.

8B is a schematic cross-sectional view of the touch display device of FIG. 8A.

FIG. 8C is a diagram of a method of fabricating the touch display device of FIG. 8A.

FIG. 8D is another manufacturing method of the touch display device of FIG. 8A.

1A is a schematic plan view of a touch panel according to a first embodiment of the present invention. FIG. 1B is a cross-sectional view of the touch panel of FIG. 1A. Please refer to FIG. 1A and FIG. 1B . FIG. 1B is a cross-sectional view taken along line II′ of FIG. 1A . In the embodiment, the touch panel 10 includes a first substrate 100 , a patterned shielding layer 110 , and a patterned conductive layer . Layer 120. The first substrate 100 has a first surface 102 and a second surface 104 opposite the first surface 102. The patterned shielding layer 110 is disposed on the first surface 102. The patterned masking layer 110 includes a peripheral region pattern portion 110a. A peripheral area P is defined where the peripheral area pattern portion 110a is located, and the peripheral area pattern portion 110a has at least one hollow opening H as at least one first mark pattern 112. The patterned conductive layer 120 is disposed on the second surface 104.

In addition, the patterned mask layer 110 further includes a display area pattern portion 110b. The display area pattern portion 110b is located in a central area C beside the peripheral area P, and The display region pattern portion 110b has a plurality of pixel openings 114, wherein the display region pattern portion 110b may have a portion continuous with the peripheral region pattern portion 110a, but is not limited thereto, and the display region pattern portion 110b refers to a continuous pattern in which a loop is formed. Shape to define the portion of the pixel opening 114. The display region pattern portion 110b has, for example, a grid-like matrix pattern such that the array of pixel openings 114 is distributed in the central region C. The patterned conductive layer 120 includes a plurality of touch conductive portions 120a at least in the central region C. The touch conductive portions 120a may be a single layer solution (OLS) structure or a multilayer electrode structure. The following description is for a description of the structure in which the touch conductive portion 120a is a single-layer electrode type.

It should be noted that the size and number of the first mark pattern 112 and the touch conductive portion 120a, the ratio of the area of the peripheral area P and the area occupied by the display area C, as shown in FIG. 1A, are for illustrative purposes only and are not intended to be limiting. this invention. For convenience of description, only one first marking pattern 112 will be used, and the size and number of the touch conductive portions 120a, the peripheral area P, and the proportion of the panel occupied by the display area C are exemplified in a clearly identifiable manner.

FIG. 1C is a diagram of a method of fabricating a touch panel according to a first embodiment of the present invention. Referring to FIG. 1B and FIG. 1C , in detail, first, as shown in step S100 , a patterned shielding layer 110 is formed on the first surface 102 of the first substrate 100 , wherein the patterned shielding layer 110 may be included as shown in FIG. 1A . The peripheral area pattern portion 110a and the display area pattern portion 110b. At the same time, a hollow opening H is formed in the peripheral portion pattern portion 110a, wherein the hollow opening H is used as the first marking pattern 112. In this embodiment, the material of the patterned shielding layer 110 may be an opaque material such as a photosensitive resin or a chrome film.

Then, in step S102, a conductive layer (not shown) is formed on the second surface 104 of the first substrate 100. In other words, the conductive layer and the patterned shielding layer 110 are respectively formed on opposite sides of the first substrate 100. . Then, in step S104, the conductive layer is patterned, for example, using a mask (not shown) to form a patterned conductive layer 120. In particular, the mask used in this step is located in the first mark pattern 112. . Moreover, the material of the patterned conductive layer 120 may be, for example, a metal material such as aluminum (Al), molybdenum (Mo), silver (Ag), palladium (Pd), or, for example, indium tin oxide (ITO), nano. A transparent conductive material such as silver wire, carbon nanotube, graphene or decene, or any combination thereof.

It should be noted that when a photosensitive resin is used as the material of the shielding layer, since the withstand temperature of the photosensitive resin is about 200 degrees or less, after the patterned shielding layer 110 is formed, the subsequent production of the conductive layer is often matched. The low-temperature process conditions are, for example, an indium tin oxide (ITO) process at room temperature (about 25 degrees) or a nanosilver process. On the other hand, when a chrome film is used as the material of the shielding layer, since the chrome film has high temperature resistance characteristics, after the patterned shielding layer 110 is formed, the subsequent conductive layer can be produced without special matching with low temperature. Process conditions. In other words, when a chromium film is used as the material of the shielding layer, the subsequent conductive layer fabrication can be not limited to the low temperature process, and the process is simple.

In this embodiment, the touch panel 10 is formed by patterning the shielding layer 110, and then forming the patterned conductive layer 120. The reticle pair used to form the patterned conductive layer 120 is located in the first marking pattern 112. Because the first alignment mark 112 is formed by the hollow opening H in the opaque patterned shielding layer 110, the first alignment mark 112 itself is a fairly distinct pattern which allows the reticle to be easily positioned against the first alignment mark 112 to help improve process efficiency. In this way, the arrangement position of the patterned shielding layer 110 and the arrangement position of the patterned conductive layer 120 can be aligned with each other according to a predetermined design. In other words, the design of the first alignment mark 112 can effectively improve the alignment difficulty of the subsequent process, and the touch panel 10 with good alignment accuracy is produced, thereby improving the process yield of the touch panel 10.

In addition to the above, since the patterned shielding layer 110 and the patterned conductive layer 120 are respectively disposed on opposite sides of the first substrate 100, when the patterned conductive layer 120 is formed, in order to make the photomask (not shown) refer to the first The mark pattern 112 is aligned, and the alignment device (for example, the image capture device) must pass through the first substrate 100 to capture the image of the first mark pattern 112. Therefore, the thinner the thickness of the first substrate 100, the more effectively the sharpness of the alignment can be improved and the error can be reduced, and the touch panel 10 with good alignment can be fabricated to improve the process yield of the touch panel 10. . Specifically, the touch panel 10 in this embodiment can make the thickness of the first substrate 100 not more than 0.25 cm. The method of making the thickness of the first substrate 100 not more than 0.25 cm includes directly selecting a thin substrate having a thickness of not more than 0.25 cm as the first substrate 100, or thinning the first substrate 100 into a required shape after the patterned shielding layer 110 is formed. The patterned conductive layer 120 is formed by the thickness.

2A is a top plan view of a touch panel according to a second embodiment of the present invention. 2B is a schematic cross-sectional view of the touch panel of FIG. 2A. 2A and 2B, FIG. 2B is a cross-sectional view taken along line II' of FIG. 2A. In this embodiment, the touch panel 20 is similar to the touch panel 10, and similar components are given the same reference numerals. Said that And have similar functions, and the description is omitted. The main difference between the touch panel 20 and the touch panel 10 is that the touch panel 20 further includes at least one second marking pattern 122. The second marking pattern 122 is disposed on the second surface 104. Partially aligned to the contour of the first marking pattern 112. In detail, the touch conductive portion 120a is located in a central portion C beside the peripheral region P, and the touch conductive portion 120a and the second mark pattern 122 are separated from each other. And, the outline of the first mark pattern 112 and the outline of the second mark pattern 122 coincide with each other.

It should be noted that the second marking pattern 122 and the patterned conductive layer 120 may be the same film layer, or the second marking pattern 122 and the patterned conductive layer 120 may be different film layers, which will be described below for convenience of description. The marking pattern 122 is depicted as the same pattern as the patterned conductive layer 120.

For example, FIG. 2C is a partial plan view of a touch panel of a second embodiment of the present invention. Referring to FIG. 2A and FIG. 2C, FIG. 2C is a plan view along the area A of FIG. 2A. In a region A, the outline of the first mark pattern 112 is approximately the same as the outline of the second mark pattern 122. Specifically, the manufacturing method of the touch panel 20 is substantially the same as the manufacturing method of the touch panel 10 . However, when the foregoing step S104 is performed, in addition to forming the touch conductive portion 120a, a second mark pattern 122 is formed, and the outline of the second mark pattern 122 is at least partially aligned with the outline of the first mark pattern 112. In particular, the reticle used in the fabrication step is aligned with reference to the first marking pattern 112. For example, in this embodiment, the reticle pattern forming the second marking pattern 122 is aligned with the first marking pattern 112. The patterning conductive layer 120 is formed, in other words, the patterned conductive layer 120 and the second marking pattern 122 can be fabricated from the same film layer. However, the present invention is not limited to this. The patterned conductive layer 120 and the second mark pattern 122 may be made of different film layers, that is, the patterned conductive layer 120 and the second mark pattern 122 may be made of different materials. For convenience of explanation, the patterned conductive layer 120 and the second marking pattern 122 are exemplified by the same film layer.

It should be noted that the shapes of the first mark pattern 112 and the second mark pattern 122 illustrated in FIG. 2C are for illustrative purposes only and are not intended to limit the present invention. For example, FIG. 2D to FIG. 2F are other possible partial top views of the touch panel of the second embodiment of the present invention. As shown in FIG. 2D to FIG. 2F, as long as the contour of the first marking pattern 112 and the contour of the second marking pattern 122 are approximately the same in a geometric area (for example, the area A), it is a possible embodiment of the present invention. For example, FIG. 2D shows that both the first mark pattern 112 and the second mark pattern 122 are T-shaped patterns, and FIG. 2E shows that the first mark pattern 112 and the second mark pattern 122 are both X-shaped patterns, and FIG. 2F shows The first mark pattern 112 and the second mark pattern 122 are both square frame patterns.

In this embodiment, since the touch panel 20 is formed in advance to form the patterned mask layer 110, a conductive layer is formed, and then the mask pattern forming the second mark pattern 122 is aligned with the first mask by using a photomask (not shown). The patterned conductive layer 120 is formed by marking the pattern 112. Since the material of the shielding layer is made of an opaque material, the first marking pattern 112 formed by the hollow opening H of the patterned shielding layer 110 is quite obvious and clearly visible. In this way, the alignment difficulty of the subsequent processes can be effectively improved, thereby improving the process yield and efficiency of the touch panel 20.

In addition to the above, in other embodiments not shown, the patterned conductive layer 120 may be, for example, a multilayer electrode type structure. For example, the patterned conductive layer 120 can be composed of A plurality of electrodes are electrically connected to each other and are alternately arranged, wherein each of the electrodes may be formed by connecting rectangular, diamond, circular, triangular or other shapes of conductive patterns. The bridge wire as a series of two adjacent conductive patterns can be fabricated using the same material as or different from the conductive pattern. In the case where either the conductive pattern and the bridge wire are made of metal, when the patterned conductive layer 120 is formed in the above step S104, the second mark pattern 122 can be formed using the metal material. Therefore, the second marking pattern 122 having a clear outline can also be formed, which enables the reticle used in the subsequent process to be easily located in the second marking pattern 122 to contribute to the improvement of the process efficiency.

On the other hand, FIG. 3A is a schematic plan view of a touch panel according to a third embodiment of the present invention. FIG. 3B is a schematic cross-sectional view of the touch panel of FIG. 3A. Referring to FIG. 3A and FIG. 3B, FIG. 3B is a cross-sectional view taken along line II' of FIG. 3A. In this embodiment, the touch panel 30 is similar to the touch panel 20, and similar components are given the same reference numerals. Represents, and has similar functions, and the description is omitted. The main difference between the touch panel 30 and the touch panel 20 is that the contour of the first marking pattern 112 and the contour of the second marking pattern 122 fill a geometric area. Specifically, FIG. 3C is a partial plan view of the touch panel of the third embodiment of the present invention. Please refer to FIG. 3A and FIG. 3C. FIG. 3C is a top view along the area A of FIG. 3A. In the embodiment, the contours of the first marking pattern 112 and the contour of the second marking pattern 122 are alternately distributed in the geometric area. overlapping. Further, the contour of the first marking pattern 112 and the contour of the second marking pattern 122 assume a mutually complementary relationship in a geometric area. At this time, the outline of the first mark pattern 112 is a cross type, and the outline of the second mark pattern 122 is a square of four quadrants of the first mark pattern 112. As such, the first marking pattern 112 The outline of the second mark pattern 122 and the outline of the second mark pattern 122 generally form a one-sided geometric area, but the embodiment is not limited thereto.

The manufacturing method of the touch panel 30 is substantially the same as the manufacturing method of the touch panel 10 . However, when the foregoing step S104 is performed, in addition to forming the touch conductive portion 120a, a second mark pattern 122 may be formed, and the outline of the second mark pattern 122 is at least partially aligned with the outline of the first mark pattern 112. In particular, the reticle used in the fabrication step is aligned with reference to the first marking pattern 112. For example, in the present embodiment, the patterned conductive layer 120 is formed in such a manner that the mask pattern forming the second marking pattern 122 corresponds to the first marking pattern 112.

It should be noted that the shapes of the first mark pattern 112 and the second mark pattern 122 illustrated in FIG. 3C are for illustrative purposes only and are not intended to limit the present invention. For example, FIG. 3D to FIG. 3F are other possible partial top views of the touch panel of the third embodiment of the present invention. As shown in FIG. 3D to FIG. 3F, as long as the outline of the first mark pattern 112 and the outline of the second mark pattern 122 are filled together with a geometric area, for example, the area A, it is a possible embodiment of the present invention. In FIG. 3D, the first mark pattern 112 is, for example, a T-shape and the second mark pattern 122 is, for example, two rectangular patterns; in FIG. 3E, the first mark pattern 112 is, for example, an X-shape and the second mark pattern 122 is, for example, In FIG. 3F, the first mark pattern 112 is, for example, a square frame pattern and the second mark pattern 122 is, for example, a square pattern inside the square frame pattern.

In this embodiment, since the touch panel 30 is formed in advance to form the patterned mask layer 110, a conductive layer is formed, and then the mask pattern forming the second mark pattern 122 is corresponding to the first mark by using a mask (not shown). Pattern 112 to form a pattern Conductive layer 120. As described above, the outline of the first mark pattern 112 is fairly clearly visible, so that the alignment difficulty of the subsequent process can be effectively improved.

4 is a cross-sectional view showing a touch panel of a fourth embodiment of the present invention. The top view is similar to FIG. 2A . Please refer to FIG. 2A and FIG. 4 . FIG. 4 is a cross-sectional view taken along line II′ of FIG. 2A . In the embodiment, the touch panel 40 is similar to the touch panel 20 . Like components are denoted by the same reference numerals and have similar functions, and the description is omitted. The main difference between the touch panel 40 and the touch panel 20 is that the touch panel 40 can further include a substrate 106. The material selected for the substrate 106 can be, for example, a polyimide film or, for example, polarized light. The substrate 106 may be attached to the second surface 104 by a glue (not shown), wherein the patterned conductive layer 120 and the second marking pattern 122 are disposed on the substrate 106, The substrate 106 is positioned between the patterned conductive layer 120 and the second surface 104 and between the second mark pattern 122 and the second surface 104.

In detail, the manufacturing method of the touch panel 40 is substantially the same as the manufacturing method of the touch panel 20 . However, when the foregoing step S102 is performed, the conductive layer is formed on the substrate 106 on the second surface 104 of the first substrate 100. Next, in step S104, the patterned conductive layer 120 and the second mark pattern 122 are formed on the substrate 106, for example, using a photomask (not shown). Then, the substrate 106 is attached to the second surface 104 of the first substrate 100.

In addition, the first marking pattern 112 and the second marking pattern 122 of the touch panel 40 may be implemented in the same manner as the touch panel 20, and when they are approximately the same in a geometric area (for example, the area A), Possible implementation manners will not be described here.

In this embodiment, since the touch panel 40 is formed in advance to form the patterned shielding layer 110, a conductive layer is formed, and then the photomask (not shown) is used to align the mask pattern forming the second marking pattern 122 with the first layer. The patterned conductive layer 120 is formed by marking the pattern 112. As described above, the outline of the first mark pattern 112 is fairly clearly visible, so that the alignment difficulty of the subsequent process can be effectively improved.

Fig. 5 is a cross-sectional view showing a touch panel of a fifth embodiment of the present invention. The top view is similar to FIG. 3A. Please refer to FIG. 3A and FIG. 5. FIG. 5 is a cross-sectional view taken along line II-I of FIG. 3A. In the embodiment, the touch panel 50 is similar to the touch panel 30. Like components are denoted by the same reference numerals and have similar functions, and the description is omitted. The main difference between the touch panel 50 and the touch panel 30 is that the touch panel 50 can further include a substrate 106. The material selected for the substrate 106 can be, for example, a polyimide film or, for example, polarized light. The substrate 106 may be attached to the second surface 104 by a glue (not shown), wherein the patterned conductive layer 120 and the second marking pattern 122 are disposed on the substrate 106, The substrate 106 is positioned between the patterned conductive layer 120 and the second surface 104 and between the second mark pattern 122 and the second surface 104.

In detail, the manufacturing method of the touch panel 50 is substantially the same as the manufacturing method of the touch panel 30. However, when the foregoing step S102 is performed, the conductive layer is formed on the substrate 106 on the second surface 104 of the first substrate 100. Next, in step S104, the patterned conductive layer 120 and the second mark pattern 122 are formed on the substrate 106, for example, using a photomask (not shown). Then, the substrate 106 is attached to the second surface 104 of the first substrate 100.

In addition, the first marking pattern 112 and the second marking pattern 122 of the touch panel 50 may be implemented in the same manner as the touch panel 30, when the contour of the first marking pattern 112 and the contour of the second marking pattern 122 are filled together. A geometrical area, such as area A, is a possible implementation of the present invention and will not be described herein.

In this embodiment, since the touch panel 50 is formed in advance to form the patterned shielding layer 110, a conductive layer is formed, and then the mask pattern forming the second marking pattern 122 is aligned with the first using a photomask (not shown). The patterned conductive layer 120 is formed by marking the pattern 112. As described above, the outline of the first mark pattern 112 is fairly clearly visible, so that the alignment difficulty of the subsequent process can be effectively improved.

Further, FIG. 6A is a schematic top view of a touch display device according to an embodiment of the invention. 6B is a schematic cross-sectional view of the touch display device of FIG. 6A. Referring to FIG. 6A and FIG. 6B, FIG. 6B is a cross-sectional view taken along line II-II' of FIG. 6A. In the embodiment, the touch display device 60 includes the touch panel of one of the above embodiments ( The following description is based on the touch panel 10, the pixel array substrate 200, the sealant layer 300, and the display medium 400.

Specifically, the pixel array substrate 200 faces the first surface 102 of the first substrate 100 and includes a second substrate 202 and a pixel array 204. The pixel array 204 is disposed on the second substrate 202 and is located at the The second substrate 202 is between the first substrate 100 and the first substrate 100. The sealant layer 300 is disposed between the first substrate 100 and the pixel array substrate 200. The projection of the sealant layer 300 on the first substrate 100 defines an adhesive region L. The display medium 400 is disposed between the pixel array substrate 200 and the touch panel 10 . In this embodiment, the patterned shielding layer 110 includes a periphery disposed on the first substrate 100, and It extends substantially to the boundary of the first substrate 100. Therefore, the sealant layer 300 completely overlaps the patterned mask layer 110. However, the present invention is not limited thereto, and the sealant layer 300 may partially overlap or not overlap the patterned mask layer 110 at all. In addition, the touch panel 10 can optionally further include a plurality of color filter patterns CF, each of which is disposed in the pixel opening 114 to provide a color display effect as a color filter substrate. However, in other embodiments, the color filter pattern CF may be integrated into the pixel array 204 or provide a color display effect by the display medium 400.

In addition to the above, the touch display device 60 further includes at least one circuit board 500. The circuit board 500 is bonded to a bonding region N of the first substrate 100 by a conductive bonding layer 502 to be electrically connected to the patterned conductive layer 120. Since the conductive bonding layer 502 needs to utilize high temperature and pressure to achieve the bonding effect, the embodiment further proposes that at least a portion of the bonding region N is located outside the bonding region L; in particular, the bonding region L and the bonding region N overlap each other. The width is less than 1/2 of the width of the bonding region L; even, as shown in FIG. 6B, the bonding region L does not overlap with the bonding region N at all. In this way, the direct influence of the high temperature and pressure required for the bonding process of the circuit board 500 on the characteristics of the sealant layer 300 can be reduced, thereby improving the process yield of the touch display device 60.

FIG. 6C is a diagram of a method of fabricating the touch display device of FIG. 6A. Referring to FIG. 6B and FIG. 6C , in detail, steps S100 , S102 , and S104 are similar to the manufacturing method of the touch panel 10 described above. In this embodiment, the step S104 may refer to the touch panel 20, 30, 40 or 50, and at least one second marking pattern 122 may be formed in addition to the touch conductive portion. The outline of the second marking pattern 122 has at least Partially aligned with the outline of the first marking pattern 112, wherein the patterned conductive layer 120 is The two marking patterns 122 may be made of the same film layer, or the patterned conductive layer 120 and the second marking pattern 122 may be made of different film layers, and details are not described herein again. Next, in step S106, the display medium 400 is disposed between the pixel array substrate 200 and the first substrate 100. Then, in step S108, the sealant layer 300 is used to bond the first substrate 100 and the pixel array substrate 200. Thereby, the region where the sealant layer 300 is located forms an adhesive region L.

On the other hand, FIG. 6D is another manufacturing method of the touch display device of FIG. 6A. Referring to FIG. 6B and FIG. 6D , in detail, the steps S100 , S102 , and S104 can refer to the manufacturing method of the touch panel 10 , 20 , 30 , 40 , or 50 , and details are not described herein again. However, in this embodiment, the order in which steps 100, 102, and 104 are made is not limited to being performed immediately. Specifically, after step S100 and before step S102, in this embodiment, for example, steps S106 and S108 are sequentially performed, and then steps S102 and S104 are performed, so that the touch display device 60 can be created. .

In this embodiment, since the touch panel of the touch display device 60 is any one of the touch panels 10, 20, 30, 40, 50 as described above, based on the touch panel having a good alignment, In turn, the touch display device 60 with good alignment can be fabricated, so as to achieve the purpose of improving the process yield. On the other hand, in this embodiment, at least a portion of the bonding region N is located outside the bonding region L, so that the high temperature and pressure required for the bonding process of the circuit board 500 and the influence of the pressure on the characteristics of the bonding layer 300 can be reduced. Further, the process yield of the touch display device 50 is improved.

7A is a top plan view of a touch display device according to another embodiment of the present invention; Figure. 7B is a schematic cross-sectional view of the touch display device of FIG. 7A. Please refer to FIG. 7A and FIG. 7B. FIG. 7B is a cross-sectional view taken along line II-II' of FIG. 7A. In the embodiment, the touch display device 70 is similar to the touch display device 60, and the similar components are the same. The reference numerals are indicated and have similar functions, and the description is omitted. The main difference between the touch display device 70 and the touch display device 60 is that the touch display device 70 further includes a plurality of heat conductive particles 302 distributed in the sealant layer 300.

FIG. 7C is a diagram of a method of fabricating the touch display device of FIG. 7A. Referring to FIG. 7B and FIG. 7C , in detail, the steps S100 , S102 , S104 , S106 , and S108 are similar to the manufacturing method of the touch display device 60 described above, and are not described herein again. The method of manufacturing the touch display device 70 further includes, as in step S107, before the bonding of the first substrate 100 and the pixel array substrate 200 by using the sealant layer 300, further comprising disposing a plurality of thermally conductive particles 302 in the sealant layer 300.

On the other hand, FIG. 7D is another manufacturing method of the touch display device of FIG. 7A. Referring to FIG. 7B and FIG. 7D , in detail, the steps S100 , S106 , S108 , S102 , and S104 are similar to the other methods of manufacturing the touch display device 60 , and are not described herein again. However, after step S106 and before step S108, the present embodiment can perform step S107 as described above, so that the touch display device 70 fabricated in the same manner as the method of FIG. 7C can be produced.

Specifically, the material selected for the thermally conductive particles 302 has a thermal conductivity superior to that of the sealant layer 300; in particular, the material of the thermally conductive particles 302 may include graphene or a metallic material. Accordingly, when the circuit board 500 performs a high temperature and pressure bonding process to electrically connect with the patterned conductive layer 120, the plurality of thermally conductive particles disposed in the sealant layer 300 302 can conduct the high-temperature dispersion locally received by the sealant layer 300 to other portions of the sealant layer 300 or even to the pixel array substrate 200. In this way, the influence of the high temperature required for the bonding process of the circuit board 500 on the characteristics of the sealant layer 300 can be reduced, thereby improving the process yield of the touch display device.

It should be noted that, because the material of the heat conductive particles 302 can be made of a material including conductive materials such as graphene or a metal material, the sealant layer 300 is formed in the adhesive region L formed on the pixel array substrate 200, and the sealant layer is formed. An insulating layer (not shown) may be disposed between any of the conductive layers disposed on the pixel array substrate 200 to prevent any conductive layers on the pixel array substrate 200 from being short-circuited through the heat conductive particles 302. Or avoiding the thermal conductive particles 302 from forming a short circuit with any conductive layer disposed on the first substrate 100.

In this embodiment, since the touch panel of the touch display device 70 is any one of the touch panels 10, 20, 30, 40, 50 as described above, based on the touch panel having a good alignment, Furthermore, the touch display device 70 having a good alignment can be produced, so that the process yield can be improved. On the other hand, in addition to the bonding region N having at least a portion located outside the bonding region L to reduce the high temperature required for the bonding process of the circuit board 500 and the influence of pressure on the characteristics of the sealant layer 300, A plurality of thermally conductive particles 302 are doped in 300. At this time, by transmitting the high-temperature dispersion partially received by the sealant layer 300 to other portions of the sealant layer 300 or the pixel array substrate 200, the process yield of the touch display device 70 can be improved.

FIG. 8A is a schematic top view of a touch display device according to still another embodiment of the present invention. 8B is a schematic cross-sectional view of the touch display device of FIG. 8A. Please refer to Figure 8A 8B, FIG. 8B is a cross-sectional view taken along line II-II' of FIG. 8A. In the present embodiment, the touch display device 80 is similar to the touch display device 60, and similar components are denoted by the same reference numerals. And have similar functions, and the description is omitted. The main difference between the touch display device 80 and the touch display device 60 is that the thickness of the second substrate 202 of the touch display device 80 is no more than 0.25 cm.

FIG. 8C is a diagram of a method of fabricating the touch display device of FIG. 8A. Referring to FIG. 8B and FIG. 8C , in detail, steps S100 , S102 , S104 , S106 , and S108 are similar to the foregoing method of FIG. 6C , and details are not described herein again. The manufacturing method of the touch display device 80 further includes a step S109. After the first adhesive layer 300 is bonded to the pixel array substrate 200 by using the sealant layer 300, a substrate thinning step is further performed to thin the pixel array substrate 200. The second substrate 202. Here, the method of thinning the substrate includes, for example, but not limited to, a grinding method, and the thickness of the second substrate 202 after thinning is, for example, not more than 0.25 cm. In this way, the overall thickness of the touch display device 80 can be reduced to achieve the effect of the thinness of the touch display device.

On the other hand, FIG. 8D is another manufacturing method of the touch display device of FIG. 8A. Referring to FIG. 8B and FIG. 8D , in detail, steps S100 , S106 , S108 , S102 , and S104 are similar to the foregoing method of FIG. 6D , and details are not described herein again. However, after step S108 and before step S102, step S109 as described above is performed, so that the touch display device 80 can also be fabricated.

As apparent from the above description, in the step S104 of patterning the conductive layer, the thinner the thickness of the first substrate 100 is, the more advantageous the alignment is. Therefore, in this embodiment, step S109 can be performed on the first substrate 100 such that the first substrate 100 The thickness is reduced to no more than 0.25 cm. Next, steps S102 and S104 are performed. In this way, when the step 104 is performed, the first marking pattern 112 located on the first substrate 100 can be more easily improved to improve the manufacturing efficiency. That is, under such fabrication steps, the thickness of the first substrate 100 may be less than the thickness of the second substrate 202. However, step S109 can also selectively thin the second substrate 202 to obtain a more lightweight device. In an embodiment, step S109 may only thin the second substrate 202 such that the thickness of the first substrate 100 is greater than the thickness of the second substrate 202. It can be seen that the thickness of the thinned second substrate 202 can be the same as the thickness of the first substrate 100, or the thickness of the second substrate 202 can be different from the thickness of the first substrate 100, and the thickness of the thinner is not more than 0.25. cm.

In this embodiment, since the touch panel of the touch display device 80 is any one of the touch panels 10, 20, 30, 40, 50 as described above, based on the touch panel having a good alignment, Furthermore, the touch display device 80 having a good alignment can be produced, so that the process yield can be improved. On the other hand, the embodiment further provides a step of thinning the substrate, so that the overall thickness of the touch display device 80 can be reduced to achieve the effect of the thinness of the touch display device.

In summary, the touch panel of the embodiment of the present invention first forms a patterned shielding layer, and then uses the first marking pattern defined by the patterned shielding layer to pattern the subsequently formed film layer. The material of the shielding layer is made of an opaque material. Therefore, when the shielding layer is patterned and a part of the shielding layer is removed, the hollow opening inside the patterned shielding layer can be used as the first marking pattern. Since the first marking pattern is quite clear, the alignment difficulty of the subsequent processes can be effectively improved, and the production is made. The touch panel with good alignment improves the production efficiency and process yield of the touch panel. Furthermore, in the process of manufacturing the touch display device, the patterned conductive layer for touch can be selected after the first substrate is thinned, so that the sharpness in the alignment can be effectively improved and the error can be reduced, thereby making A touch panel with good alignment improves the process yield of the touch panel.

In addition, since the touch display device of the present invention is based on a touch panel having a good alignment, a touch display device having a good alignment can be produced, thereby achieving the purpose of improving the process yield. Moreover, it is further proposed that at least a portion of the bonding region is located outside the bonding region, thereby reducing the influence of the high temperature and pressure required for the bonding process of the circuit board on the characteristics of the bonding layer, thereby improving the process of the touch display device. rate. Moreover, it is proposed to dope the plurality of thermally conductive particles in the sealant layer, and to transfer the high temperature dispersion locally received by the sealant layer to other portions of the sealant layer, thereby improving the process yield of the touch display device. Furthermore, the substrate of the thinned pixel array substrate is further proposed, so that the overall thickness of the touch display device can be reduced to achieve the effect of the thinness of the touch display device.

Although the present invention has been disclosed in the above embodiments, it is not intended to limit the present invention, and any one of ordinary skill in the art can make some changes and refinements without departing from the spirit and scope of the present invention. The scope of the invention is defined by the scope of the appended claims.

10‧‧‧Touch panel

100‧‧‧First substrate

102‧‧‧ first surface

104‧‧‧ second surface

110‧‧‧ patterned masking layer

110a‧‧‧The surrounding area pattern department

110b‧‧‧Display Area Pattern Department

112‧‧‧First marking pattern

114‧‧‧ pixel opening

120‧‧‧ patterned conductive layer

120a‧‧‧Touch Conductor

C‧‧‧Central District

H‧‧‧ hollow opening

I-I’‧‧‧ cut line

P‧‧‧ surrounding area

Claims (31)

A touch panel includes: a first substrate having a first surface and a second surface opposite to the first surface; a patterned shielding layer disposed on the first surface, the patterned shielding layer comprising a peripheral region pattern portion having at least one cutout opening as at least one first marking pattern; and a patterned conductive layer disposed on the second surface. The touch panel of claim 1, wherein the patterned shielding layer further comprises a display area pattern portion, wherein the peripheral area pattern portion defines a peripheral area, and the display area pattern portion is located beside the peripheral area In a central area, the display area pattern portion has a plurality of pixel openings. The touch panel of claim 1, further comprising at least one second marking pattern disposed on the second surface, and the contour of the second marking pattern is at least partially aligned with the The outline of the first marking pattern. The touch panel of claim 3, further comprising a substrate attached to the second surface, wherein the patterned conductive layer and the second marking pattern are disposed on the substrate, the substrate Positioned between the patterned conductive layer and the second surface, and between the second mark pattern and the second surface. The touch panel of claim 3, wherein the second marking pattern and the patterned conductive layer are the same film layer. The touch panel of claim 3, wherein the second mark The pattern and the patterned conductive layer are different film layers. The touch panel of claim 3, wherein the patterned conductive layer further comprises a plurality of touch conductive portions, wherein a peripheral region is defined at the peripheral portion of the pattern portion, and the touch conductive portions are located at the periphery In a central area beside the area, the touch conductive portions and the second mark pattern are separated from each other. The touch panel of claim 3, wherein the contour of the at least one first marking pattern and the contour of the second marking pattern coincide with each other. The touch panel of claim 3, wherein the contour of the first marking pattern and the contour of the second marking pattern fill a geometric area. The touch panel of claim 9, wherein the contour of the first marking pattern and the contour of the second marking pattern are alternately distributed in the geometric area without completely overlapping. The touch panel of claim 1, wherein the material of the shielding layer is a photosensitive resin or a chromium film. The touch panel of claim 1, wherein the first substrate has a thickness of no more than 0.25 cm. The touch panel of claim 1, wherein the material of the patterned conductive layer comprises a metal material, a transparent conductive material or a combination thereof. A touch display device, comprising: a touch panel according to any one of claims 1 to 13; a pixel array substrate facing the first surface of the first substrate, and include a second substrate and a pixel array, the pixel array is disposed on the second substrate and located between the second substrate and the first substrate; a sealant layer disposed on the first substrate and the pixel Between the array substrates; and a display medium disposed between the pixel array substrate and the touch panel. The touch display device of claim 14, further comprising at least one circuit board bonded to a bonding region of the first substrate to be electrically connected to the patterned conductive layer, wherein the sealant layer is The projection on the first substrate defines an adhesive region, and at least a portion of the bonding region is located outside the adhesive region. The touch display device of claim 15, wherein the bonding region and the bonding region do not overlap each other. The touch display device of claim 14, wherein the second substrate has a thickness of no more than 0.25 cm. The touch display device of claim 14, wherein the thickness of the second substrate is different from the thickness of the first substrate, and the thickness of the thinner is not more than 0.25 cm. The touch display device of claim 14, further comprising a plurality of thermally conductive particles distributed in the sealant layer. A method for fabricating a touch panel, comprising: forming a patterned shielding layer on a first surface of a first substrate, the patterned shielding layer comprising a peripheral region pattern portion, and the peripheral region pattern portion has at least one hollow opening And forming a conductive layer on a second surface of the first substrate, the first surface and The second surfaces are opposite each other; and the conductive layer is patterned using a reticle to form a patterned conductive layer, and the reticle pair is located in the first marking pattern. The method for fabricating a touch panel according to claim 20, further comprising forming at least one second marking pattern, the contour of the second marking pattern being at least partially aligned with the contour of the first marking pattern. The method for fabricating a touch panel according to claim 21, further comprising forming the patterned conductive layer and the second marking pattern on a substrate, and attaching the substrate to the second On the surface. The method for fabricating a touch panel according to claim 21, wherein the patterned conductive layer and the second mark pattern are made of the same film layer. The method for fabricating a touch panel according to claim 21, wherein the patterned conductive layer and the second marking pattern are made of different film layers. A method for fabricating a touch display device includes: forming a patterned shielding layer on a first surface of a first substrate, the patterned shielding layer comprising a peripheral region pattern portion, and the peripheral region pattern portion has at least one hollowed out Opening a plurality of first marking patterns; forming a conductive layer on a second surface of the first substrate, the first surface and the second surface facing each other; patterning the conductive layer using a photomask to form a Patterning a conductive layer, and the reticle pair is located in the first mark pattern; using a sealant layer to bond the first substrate to a pixel array substrate, wherein The pixel array substrate faces the first surface of the first substrate, and the sealant layer forms an adhesive region on the first substrate and the pixel array substrate; and a display medium is disposed on the pixel array substrate. Between the first substrate and the first substrate. The method of manufacturing the touch display device of claim 25, further comprising forming at least one second marking pattern, the contour of the second marking pattern being at least partially aligned with the contour of the first marking pattern. The method for fabricating a touch display device according to claim 26, further comprising forming the second marking pattern and the patterned conductive layer on the substrate, and attaching the substrate to the first On the surface. The method for fabricating a touch display device according to claim 25, further comprising: arranging a plurality of heat conductive particles in the frame before using the sealant layer to bond the first substrate to the pixel array substrate In the glue layer. The method of manufacturing the touch display device of claim 25, wherein the pixel array substrate comprises a second substrate and a pixel array disposed on the second substrate, and the manufacturing method further comprises After the sealant layer is used to bond the first substrate to the pixel array substrate, the second substrate is thinned, and the thickness of the second substrate is no more than 0.25 cm. The method of manufacturing the touch display device according to claim 25, wherein after the patterned shielding layer is formed on the first surface of the first substrate, the following steps are sequentially performed: configuring the display The medium is between the pixel array substrate and the touch panel; the sealant layer is used to bond the first substrate to a pixel array substrate, wherein The pixel array substrate faces the first surface of the first substrate, and the sealant layer forms an adhesive region on the first substrate and the pixel array substrate; the conductive layer is formed on the first substrate On the second surface, the first surface and the second surface are opposite each other; and the conductive layer is patterned using the reticle to form the patterned conductive layer, and the reticle pair is located in the at least one first mark pattern. The method of manufacturing the touch display device of claim 30, wherein the pixel array substrate comprises a second substrate and a pixel array disposed on the second substrate, and the manufacturing method further comprises Thinning the second substrate and the first substrate after using the sealant layer to bond the first substrate to the pixel array substrate, and before forming the conductive layer on the second surface of the first substrate At least one of the second substrate and the at least one of the first substrate has a thickness of no more than 0.25 cm.