TW201601619A - Electronic substrate with heat dissipation structure - Google Patents

Abstract

An electronic substrate with heat dissipation structure includes a substrate plate and at least one heat pipe. The substrate plate includes a wiring layer, a grounding layer and an insulation layer from top to bottom. The wiring layer has at least one heat-producing element mounted thereon, and is formed with a receiving hole for the heat pipe to tightly fit therein. Heat produced by the heat-producing element and distributed over a high-temperature zone of the substrate plate surrounding the heat-producing element is absorbed by the heat pipe and then transferred to a low-temperature zone of the substrate plate distant from the heat-producing element, from where the heat is dissipated into ambient air to achieve cooling effect at upgraded heat dissipation efficiency.

Description

Electronic substrate heat dissipation structure

The present invention relates to an electronic substrate, and more particularly to an electronic substrate heat dissipation structure that achieves improved heat dissipation efficiency and space saving.

As current handheld mobile devices (such as mobile phones, tablets, and PDAs) advance with technology, internal components of handheld mobile devices, such as the central government, are required to be thinner and more computationally intensive and more efficient. Processors, integrated circuits and other components, because of the extremely limited space in the device or mechanism (due to thin and light requirements) and the speed of execution or operation are too high, so the heat of the components must be dissipated first. In order to maintain the operational efficiency and service life of the components.
The hand-held mobile device having a heat dissipating structure comprises a heat conducting plate formed by a casing, a heating element and a metal material, and the casing is internally provided with a cavity, such as a central processing unit or an integrated body. a circuit or other electronic component is disposed in the cavity, and the heat conducting plate is directly attached to one side of the heat generating component, so that the heat conducting plate is attached to the heat generating component to heat the heat generated by the heat generating component. To the heat conducting plate, it is used to achieve heat dissipation. Although the conventional hand-held mobile device has a heat-dissipating component attached to the heat-dissipating plate to achieve the heat-dissipating effect, the heat-dissipating effect is obviously not good, because the conventional heat-conducting plate is attached to the heat-generating component, so that heat is easily accumulated in the heat-emitting plate adjacent to the heat-generating component. The local position (ie, the high temperature region), that is, the heat is easily accumulated in the periphery of the heating element, and thus cannot be effectively radiated through the entire heat conducting plate, so that the heat dissipation effect is not good.
Therefore, how to solve the above problems and lack of use, and to meet the requirements of light and thin without increasing the thickness, that is, the inventor of the case and the relevant manufacturers engaged in this industry are eager to study the direction of improvement.

Therefore, in order to effectively solve the above problems, the main object of the present invention is to provide a method of embedding (or embedded) in a substrate through a heat pipe, and heat is absorbed to the substrate by the heat pipe on the substrate. The heat dissipation in the low temperature region is such that it can be removed before the structural thickness (height) is increased to effectively achieve the heat dissipation structure of the electronic substrate.
Another object of the present invention is to provide a heat dissipation structure for an electronic substrate that achieves space saving.
Another object of the present invention is to provide an electronic substrate heat dissipation structure which is effective in preventing heat accumulation (or accumulation) at the periphery of the heat generating component to effectively improve the operational efficiency and service life of the heat generating component.
In order to achieve the above object, the present invention provides an electronic substrate heat dissipation structure, comprising a substrate and at least one heat pipe, the substrate comprising a wiring layer, a ground layer and an insulating layer, the wiring layer having a first end surface and a a second end surface of the first end surface and a receiving hole, wherein the first end surface is provided with at least one heat generating component, and the receiving hole is away from the wiring layer adjacent to the heat generating component and away from the heat generating component a direction extending recessed portion, and extending through the first and second end faces, and a side of the ground layer is attached to the second end surface, and the other side is attached to a side opposite to the insulating layer, The heat pipe is embedded in the receiving hole, and one side of the heat pipe is attached to a side corresponding to the grounding layer, and the heat pipe has a heat absorption section and a heat transfer section extending outward from the heat absorption section. The heat absorbing section is embedded in a receiving hole corresponding to the heat generating component, and the heat transfer section is embedded in the receiving hole away from the heat generating component; and the heat dissipation structure of the electronic substrate of the present invention is effectively designed Avoid heat accumulation (or hoarding) in fever At the perimeter, to achieve the average temperature, the heat dissipation efficiency and improve the space saving effect.
The present invention further provides an electronic substrate heat dissipation structure, comprising a substrate and at least one heat pipe, the substrate comprising a wiring layer, a ground layer and an insulating layer, the wiring layer having a first end surface and an opposite first end surface a second end surface, the first end surface is provided with at least one heat generating component, one side of the ground layer is attached to the second end surface, and the other side is attached to a side opposite to the insulating layer, And the insulating layer has a receiving hole, and the receiving hole is formed by extending from the insulating layer corresponding to the heating element toward the heating element, and penetrates the insulating layer, and the heat pipe is embedded (provided) in the receiving hole, and one side of which is attached on the other side corresponding to the grounding layer, and the heat pipe has a heat absorbing section and a heat transfer section extending outward from the heat absorbing section, the heat absorbing portion The segment is embedded (or embedded) in a receiving hole corresponding to the heat generating component, and the heat transfer segment is embedded (or embedded) in the receiving hole away from the heat generating component; The structure is designed to effectively prevent heat accumulation (or accumulation) At the periphery of the heat generating element to reach the average temperature to improve heat dissipation efficiency and space-saving effect.

1‧‧‧Electronic substrate heat dissipation structure
10‧‧‧Substrate
101‧‧‧ wiring layer
1011‧‧‧ first end face
1012‧‧‧second end face
1014, 1031‧‧ ‧ hole
102‧‧‧ Grounding layer
103‧‧‧Insulation
105‧‧‧High temperature zone
106‧‧‧low temperature zone
107‧‧‧ openings
12‧‧‧ Heat pipe
121‧‧‧heat absorption section
122‧‧‧heat transfer section
123‧‧‧Capillary structure
124‧‧‧Working fluid
125‧‧‧ chamber
13‧‧‧heating components
131‧‧‧ pins
2‧‧‧Handheld electronic devices
21‧‧‧ housing
211‧‧‧ front cover
212‧‧‧Window
213‧‧‧ Back cover
214‧‧‧ Space
23‧‧‧ battery parts
24‧‧‧ display touch screen

BRIEF DESCRIPTION OF THE DRAWINGS Figure 1 is an exploded perspective view of a first preferred embodiment of the present invention.
Figure 2 is a perspective view showing the combination of the first preferred embodiment of the present invention.
Figure 3 is a schematic cross-sectional view showing the first preferred embodiment of the present invention.
Figure 4 is an exploded perspective view of a second preferred embodiment of the present invention.
Figure 5 is a perspective view showing the combination of the second preferred embodiment of the present invention.
Figure 6 is a schematic cross-sectional view showing a combination of a second preferred embodiment of the present invention.
Figure 7 is an exploded perspective view of a third preferred embodiment of the present invention.
Figure 8 is an exploded perspective view of a third preferred embodiment of the present invention.
Figure 9 is a perspective view showing the combination of the third preferred embodiment of the present invention.

The above object of the present invention, as well as its structural and functional features, will be described in accordance with the preferred embodiments of the drawings.
The present invention provides an electronic substrate heat dissipation structure. Please refer to FIGS. 1, 2, and 3 for a schematic, exploded, and cross-sectional view of the first preferred embodiment of the present invention. The electronic substrate heat dissipation structure 1 includes a The substrate 10 and the at least one heat pipe 12 are described in the preferred embodiment by a printed circuit board (PCB), but are not limited thereto; and the substrate 10 includes a wiring layer 101 and a The grounding layer 102 and an insulating layer 103 have a first end surface 1011 and a second end surface 1012 opposite to the first end surface 1011 and a receiving hole 1014. The second end surface 1012 is attached (or attached) The first end surface 1011 is provided with at least one heat generating component 13 on the side opposite to the ground layer 102. The heat generating component 13 is described by the processor in the preferred embodiment, but is not limited thereto. In the specific implementation, it may also be selected as an integrated circuit, such as a metal oxide semiconductor field effect transistor (MOSFET).
The heating element 13 has a semiconductor body having a plurality of pins 131, and the pins 131 are disposed on the circumferential side of the heat generating component 13, that is, the pins 131 extend from the peripheral side of the heat generating component 13. And passing through (or not penetrating) the first and second end faces 1011, 1012 of the wiring layer 101 to connect to the side opposite to the ground layer 102. At least one high temperature region 105 is formed on the wiring layer 101 in a peripheral region of the heat generating component 13. The peripheral region of the wiring layer 101 away from the heat generating component 13 is formed with a low temperature region 106, which is away from the at least one high temperature region 105. The other area is the low temperature zone 106.
The receiving hole 1014 is formed by extending from the adjacent wiring layer 101 corresponding to the heat generating component 13 in a direction away from the heat generating component 13, that is, the first figure, the receiving hole 1014 is corresponding to the adjacent hole. The side of the wiring layer 101 of the heat generating component 13 is formed to extend along a side adjacent to the side of the wiring layer 101 away from the heat generating component 13 , and the receiving hole 1014 penetrates (or penetrates) the wiring layer 101 . The first and second end faces 1011, 1012 are for receiving the opposite heat pipes 12.
Referring to FIGS. 1 and 3, the ground layer 102 is made of a metal material, such as a copper material, and the other side of the ground layer 102 is attached to or affixed to a side of the insulating layer 103. And the heat pipe 12 is embedded in the corresponding receiving hole 1014, and one side of the heat pipe 12 is attached to the side corresponding to the grounding layer 102, that is, the heat pipe 12 accommodated in the receiving hole 1014. One of the sides is flush with the second end face 1012 of the wiring layer 101 and is commonly attached to the opposite ground layer 102 side.
The heat pipe 12 is preferably a thin plate type in the present invention. The heat pipe 12 is provided with a chamber 125 and has a heat absorption section 121, a heat transfer section 122 extending outward from the heat absorption section 121, and a capillary structure 123 disposed on the inner wall of the chamber 125. In the preferred embodiment, the capillary structure 123 is illustrated by a sintered powder body, but is not limited thereto; it may also be a woven structure, a porous structure, or a groove. Or other capillary structure, and the chamber 125 of the heat pipe 12 is filled with a working fluid 124. The heat absorption section 121 of the heat pipe is embedded in the adjacent hole (or adjacent) of the receiving hole 1014 corresponding to the heat generating component 13, that is, the heat absorbing section 121 is embedded (or embedded) in the adjacent corresponding heat generating component 13 The heat transfer section 122 is embedded (or embedded) in the receiving hole 1014 away from the heating element 13 in one of the receiving holes 1014 at the side; and the heat absorbing section 121 is located in the high temperature area 105. In the hole 1014, the heat transfer portion 122 is located in the receiving hole 1014 of the low temperature region 106, and the heat pipe 12 is embedded in the receiving hole 1014 of the wiring layer 101 of the substrate 10 to be combined with the substrate 10. One. The heat pipe 12 is described in the preferred embodiment by a heat pipe 12, but is not limited thereto. In the specific implementation, the number of the receiving holes 1014 and the heat pipe 12 matches the corresponding heat generating component 13 Quantity.
Therefore, the heat pipe 12 embedded in the wiring layer 101 of the substrate 10 is designed to extend from the high temperature region 105 corresponding to the heat generating component 13 toward the relatively low temperature region 106, so that the space or the thickness of the structure can be increased. The effect of thinning the overall heat dissipation structure is achieved.
The side of the heat absorption section 121 and the heat transfer section 122 are disposed on the side opposite to the ground layer 102, and the other side of the heat absorption section 121 and the heat transfer section 122 are flush or lower than the wiring. The first end face 1011 of the layer 101, so when the heat generating component 13 generates heat, most of the heat is conducted to the ground layer 102 via the plurality of pins 131 of the heat generating component 13, so that the heat pipe of the heat pipe 12 located in the high temperature region 105 is heated. The heat received on the ground layer 102 is rapidly conducted to the heat transfer section 122 located in the low temperature region 106, and the heat absorption section 121 also circumscribes the wiring layer 101 around the heat generating component 13 A small amount of heat is transferred to the heat transfer section 122, and the heat received is quickly transmitted to the low temperature region 106 of the substrate 10 through the heat transfer portion 122 to dissipate heat, so that the heat of the heat generating component 13 can be uniformly conducted to the entire substrate 10. In contrast, a large heat dissipation area is obtained to dissipate heat to prevent heat from accumulating on the heating element 13, so that the operation efficiency and the service life of the heating element 13 can be improved.
Therefore, the heat pipe 12 of the present invention is embedded in the substrate 10 and integrated into the design, thereby effectively achieving the effect of improving heat dissipation efficiency and saving space thinning.
4, 5, and 6 are schematic views showing an exploded, combined, and cross-sectional view of a second preferred embodiment of the present invention; the structure and connection relationship of the preferred embodiment and its efficacy are substantially compared with the first The preferred embodiment is the same, so the preferred embodiment is mainly to design the receiving hole 1014 on the wiring layer 101 of the first preferred embodiment on the insulating layer 103. And the heat pipe 12 is disposed corresponding to the heat generating component 13 via the ground layer 102, that is, the insulating layer 103 has a receiving hole 1031 which is directed from the insulating layer 103 corresponding to the heat generating component 13 A direction away from the heating element 13 is extended and recessed, and penetrates through the insulating layer 103, in other words, a fourth figure, the receiving hole 1031 is from the insulating layer 103 directly under the heating element 13. And extending along a side adjacent to the insulating layer 103 away from the side of the corresponding heating element 13 , and the receiving hole 1031 is perpendicularly passed through the insulating layer 103 from the side of the ground layer 102 through the insulating layer 103 The side is for receiving the opposite heat pipe 12.
One side of the heat pipe 12 is attached (or fitted) to the other side corresponding to the ground layer 102, and the heat absorption section 121 of the heat pipe 12 is embedded (or embedded) in the capacity corresponding to the heating element 13. In the hole 1031, the heat transfer portion 122 is embedded (or embedded) in the receiving hole 1031 away from the heating element 13, that is, the heat absorption portion 121 is embedded in the heat relative to the heat through the ground layer 102. The heat transfer section 122 is embedded in the receiving hole 1031 of the insulating layer 103 away from the heat generating component 13 via the grounding layer 102, and is disposed in the receiving hole 1031 directly below or adjacent to the component 13; The heat absorption section 121 of the heat pipe 12 is located in the high temperature zone 105, and the heat transfer section 122 is located in the low temperature zone 106, that is, the heat absorption section 121 is located in the receiving hole 1031 corresponding to the high temperature zone 105, and the heat transfer section 122 is located. Corresponding to the inside of the receiving hole 1031 of the low temperature region 106, the heat absorbing section 121 and one side of the heat transfer section 122 are commonly attached to the other side of the ground layer 102, and the heat absorbing section 121 and the heat transfer section 122 are further One side is flush or lower than the other side of the insulating layer 103, so that the heat pipe 12 is embedded in the receiving hole 1031 of the insulating layer 103 of the substrate 10, It is integrated with the substrate 10 to be integrated.
Therefore, the heat pipe 12 embedded in the insulating layer 103 of the substrate 10 is designed to extend from the high temperature region 105 corresponding to the heat generating component 13 toward the relatively low temperature region 106, so that space saving and overall heat dissipation structure can be achieved. The effect of thinning.
The structure and connection relationship of the heat generating component 13 of the preferred embodiment and its function are substantially the same as those of the heat generating component 13 of the first preferred embodiment, and the plurality of pins 131 of the heat generating component 13 are disposed on the heat generating component. The first and second end faces 1011, 1012 of the wiring layer 101 are penetrated or not penetrated on the circumferential side of the 13 to be connected to the side opposite to the ground layer 102. One side of the ground layer 102 is attached (or bonded) to the second end surface 1012 of the wiring layer 101, and the other side of the ground layer 102 is attached to the side opposite to the insulating layer 103.
Therefore, when the heat generating component 13 generates heat, the heat of the heat generating component 13 and its peripheral region (i.e., the heat in the high temperature region) is conducted to the opposite ground layer 102 and passes through the heat absorbing section 121 of the heat pipe 12 located in the corresponding high temperature region 105. The heat received on the other side of the ground plane 102 will be conducted to the heat transfer section 122 at the distal end of the corresponding low temperature zone 106, and then the heat transfer section 122 on the insulating layer 103 will receive the heat. The heat is quickly transferred to the low temperature region 106 of the substrate 10, so that the heat of the heat generating component 13 can be uniformly conducted to the entire substrate 10, and a relatively large heat dissipation area is obtained to dissipate heat to prevent heat from accumulating on the heat generating component 13. Therefore, the effect of improving the operating efficiency and the service life of the heating element 13 can be achieved.
Therefore, the heat absorbing section 121 of the heat pipe 12 of the present invention is embedded in the insulating layer 103 of the substrate 10, and the grounding layer 102 is located directly below or adjacent to the heat generating component 13 for transmission by the heat pipe 12. The heat segment 122 uniformly conducts heat to the heat dissipation structure of the entire substrate 10, so as to effectively achieve the effect of improving heat dissipation efficiency and space saving, and thereby effectively achieving the effect of improving the operating efficiency and service life of the heat generating component 13.
Please refer to the seventh, eighth, and ninth drawings for the decomposition and combination of the third preferred embodiment of the present invention. The preferred embodiment of the present invention mainly dissipates the electronic substrate of the first and second preferred embodiments. The structure 1 is applied to the handheld electronic device 2 (such as a mobile phone, a tablet computer, a PDA, an IPAD), and the preferred embodiment uses the handheld electronic device 2 as a mobile phone. However, the present invention is not limited thereto. In actual implementation, the electronic substrate heat dissipation structure 1 of the present invention can also be applied to an electronic device (such as a desktop computer or a notebook computer) or a combination of Chen Ming.
The handheld electronic device 2 includes a housing 21, a battery member 23, a display touch screen 24, and the electronic substrate heat dissipation structure 1. The housing 21 is composed of a front cover 211 and a back cover 213. The front cover A space 214 for receiving the substrate 10 is defined between the 211 and the back cover 213. The front cover 211 defines a window 212 for mounting the display touch screen 24. The substrate 10 has an opening 107 for receiving the battery member 23. The opening 107 is formed on the substrate 10 and is located between the heat pipe 12 and the edge of the opposite substrate 10.
Therefore, the electronic substrate heat dissipation structure 1 of the present invention is applied to the handheld electronic device 2, in addition to rapidly and evenly transferring the heat of the heat generating component 13 in the handheld electronic device 2 to the entire substrate 10, so that the substrate 10 has a large heat dissipation. The area is radiated to the housing 21 for rapid heat dissipation, thereby effectively preventing heat from accumulating on the heating element 13, thereby achieving the effect of improving heat dissipation efficiency and space saving, and improving the operating efficiency and service life of the heating element 13. .
As described above, the present invention has the following advantages over the conventional ones:
1. It can avoid the accumulation of heat on the heating element to effectively improve the heat dissipation efficiency.
2. Space saving has thinning effect.
3. It has the effect of improving the operating efficiency and service life of the heating element.
It is to be understood that the above-described methods, shapes, configurations, and devices of the present invention are intended to be included within the scope of the present invention.

1‧‧‧Electronic substrate heat dissipation structure

10‧‧‧Substrate

101‧‧‧ wiring layer

102‧‧‧ Grounding layer

103‧‧‧Insulation

105‧‧‧High temperature zone

106‧‧‧low temperature zone

12‧‧‧ Heat pipe

121‧‧‧heat absorption section

122‧‧‧heat transfer section

13‧‧‧heating components

131‧‧‧ pins

Claims (7)

An electronic substrate heat dissipation structure includes:
a substrate comprising a wiring layer, a ground layer and an insulating layer, the wiring layer having a first end surface, a second end surface opposite to the first end surface, and a receiving hole, wherein the first end surface is provided with at least a heat generating component, the receiving hole is formed by extending from a adjacent wiring layer corresponding to the heat generating component toward a direction away from the heat generating component, and penetrates the first end surface and the second end surface, and the ground layer One side is attached to the second end surface, and the other side is attached to a side opposite to the insulating layer; and at least one heat pipe is embedded in the receiving hole, and one side is attached On the side corresponding to the grounding layer, the heat pipe has a heat absorbing section and a heat transfer section extending outward from the heat absorbing section, and the heat absorbing section is embedded in the receiving hole of the adjacent heat generating component. The heat transfer section is embedded in a receiving hole away from the heat generating component. The electronic substrate heat dissipation structure according to claim 1, wherein a peripheral region of the wiring layer adjacent to the heat generating component forms at least one high temperature region, and a peripheral region of the wiring layer away from the heat generating component forms a low temperature region. And the heat absorption section of the heat pipe is located in the high temperature zone, and the heat transfer section is located in the low temperature zone. The electronic substrate heat dissipation structure according to claim 2, wherein the heat absorption section is embedded in a receiving hole adjacent to a side of one of the heating elements, and the heat absorption section and the heat transfer section are One side is commonly attached to one side of the ground layer. An electronic substrate heat dissipation structure includes:
a substrate comprising a wiring layer, a ground layer and an insulating layer, the wiring layer having a first end surface and a second end surface opposite to the first end surface, wherein the first end surface is provided with at least one heat generating component, One side of the ground layer is attached to the second end surface, and the other side of the ground layer is attached to a side opposite to the insulating layer, and the insulating layer has a receiving hole, and the receiving hole is correspondingly The insulating layer of the heating element is configured to extend away from the heating element and extend through the insulating layer; and at least one heat pipe is embedded in the receiving hole, and one side of the heating element is attached to the corresponding one. On the other side of the formation, the heat pipe has a heat absorption section and a heat transfer section extending outward from the heat absorption section, and the heat absorption section is embedded in a receiving hole corresponding to the heat generating component, and the heat transfer section is Embedded in a receiving hole away from the heating element. The electronic substrate heat dissipation structure of claim 4, wherein a peripheral portion of the wiring layer adjacent to the heat generating component forms at least one high temperature region, and a peripheral region of the wiring layer away from the heat generating component forms a low temperature region. And the heat absorption section of the heat pipe is located in the high temperature zone, and the heat transfer section is located in the low temperature zone. The electronic substrate heat dissipation structure according to claim 5, wherein the heat absorption section is embedded in the receiving hole opposite to the heating element via the ground layer, and the heat absorption section and the heat transfer section One side is commonly attached to the other side of the ground layer. The electronic substrate heat dissipation structure according to claim 6, wherein the heating element has a plurality of pins, the pins are disposed on a circumferential side of the heating element, and penetrate the first and second layers of the wiring layer The end faces are connected to one side opposite to the ground layer.