TW201546221A - Temporary adhesive, adhesive film, adhesive support, laminate, and kit - Google Patents

Abstract

Provided are: a temporary adhesive which is capable of stabilising and temporarily adhering to a substrate and can form an adhesive layer with which temporary adhesion to a substrate can easily be released; an adhesive film; an adhesive support; and a laminate. This temporary adhesive is a liquid at 25 DEG C and contains: a compound containing a lipophilic group and a fluorine atom; and an elastomer.

Description

Temporary fixing of adhesive, adhesive film, adhesive support, laminate and set

The present invention relates to a temporarily fixed adhesive, an adhesive film, an adhesive support, a laminate, and a kit. More specifically, the present invention relates to a temporarily fixed adhesive, an adhesive film, an adhesive support, a laminate, and a sleeve which can be preferably used in the manufacture of a semiconductor device or the like.

In a manufacturing process of a semiconductor device such as an integrated circuit (IC) or a large scale integrated circuit (LSI), a plurality of IC chips are formed on a device wafer, and It is singulated by dicing. With the further miniaturization and high performance of electronic devices, there is a need for further miniaturization and high integration of IC chips mounted on electronic devices, but the product in the surface direction of the device wafer. The high integration of the body circuit is approaching the limit.

As a method of electrically connecting an integrated circuit in an IC chip to an external terminal of an IC chip, a wire bonding method has been widely known. However, in order to achieve miniaturization of an IC chip, the following method has been known: A through hole is provided in the wafer, and a metal plug as an external terminal is connected to the integrated circuit so as to penetrate the through hole (a method of forming a through silicon via (TSV)). However, the method of forming only the tantalum through electrode cannot sufficiently cope with the demand for further high integration of the IC wafer in recent years.

In view of the above, a technique is known in which an integrated circuit in an IC wafer is multilayered, thereby increasing the degree of integration per unit area of the element wafer. However, the multilayering of the integrated circuit increases the thickness of the IC wafer, so that it is necessary to reduce the thickness of the members constituting the IC wafer. With regard to the thinning of such a member, for example, the thinning of the element wafer has been studied. This method not only contributes to miniaturization of the IC wafer, but also saves the through-hole manufacturing steps of the element wafer in the manufacture of the through-electrode. Therefore, it is considered to have a future. In addition, in semiconductor devices such as power devices and image sensors, thinning has been attempted from the viewpoint of improving the degree of integration or improving the degree of freedom of device structure.

As a component wafer, it has been widely known to have a thickness of about 700 μm to 900 μm. In recent years, attempts have been made to reduce the thickness of an element wafer to 200 μm or less for the purpose of miniaturization of an IC wafer. However, the element wafer having a thickness of 200 μm or less is very thin, and the member for manufacturing a semiconductor element as the substrate is also very thin. Therefore, when further processing is performed on such a member, or when such a member is simply moved, It is difficult to support the member stably and without damage.

In order to solve the above problems, there is known a technique in which a wafer of a pre-thinned wafer having a component on a surface thereof is temporarily bonded to a support by a fluorenone adhesive, and the back surface of the wafer is ground and thin. After that, the element wafer is perforated to provide a through electrode, and then the support is separated from the element wafer (see Patent Document 1). According to this technique, it is possible to simultaneously achieve the heat resistance during the back grinding of the component wafer, the heat resistance in the anisotropic dry etching step, the chemical resistance during plating or etching, and finally the support with the support. Smooth peeling and low adhesion to contaminated bodies.

In addition, as a method of supporting the wafer, a technique of supporting the wafer by the support layer system is also known, and is configured by polymerizing the plasma obtained by the plasma deposition method. The plasma polymer layer is inserted as a separation layer between the wafer and the support layer system, so that the subsequent bonding between the support layer system and the separation layer is greater than the subsequent bonding between the wafer and the separation layer, so that the wafer is self-supporting When the layer system is detached, the wafer is easily detached from the separation layer (see Patent Document 2).

In addition, the following technique is known in which a polyether oxime and a viscosity-imparting agent are temporarily used, and the temporary release is performed by heating (see Patent Document 3). Further, a technique is also known in which a mixture of a carboxylic acid and an amine is temporarily followed by heating to release the temporary connection (see Patent Document 4). Further, a technique is known in which a bonding layer including a cellulose polymer or the like is heated, and the element wafer is pressure-bonded to the support, thereby being heated, and slid in the lateral direction by heating (slide), the element wafer is detached from the support (refer to Patent Document 5).

In addition, there is known a film comprising a syndiotactic 1,2-polybutadiene and a photopolymerization initiator, and the force is changed depending on the irradiation of the radiation (see Patent Document 6). Further, there is known a technique in which a support wafer and a device wafer are temporarily surrounded by a polycarbonate-containing adhesive, and after processing the element wafer, the irradiation line is irradiated and then heated, whereby the processed element is processed. The wafer is detached from the support (refer to Patent Document 7).

In addition, the following technique is known in which a support wafer and a component wafer are temporarily bonded by two layers having different softening points, and the component wafer is processed, heated, and slid in the lateral direction, thereby supporting the support and the component wafer. Detach (refer to Patent Document 8).

Further, Patent Document 9 discloses that a support and a substrate are temporarily fixed via a temporary fixing material containing a cycloolefin polymer having an anthracene structure, a fluorinated alkyl structure, and a fluorinated alkenyl structure, and a base material. And at least one structure of an alkyl structure having a carbon number of 8 or more, and at least one structure of a polyoxyalkylene structure, a phosphate group-containing structure, and a sulfo group-containing structure. Further, Patent Document 10 discloses that a substrate is bonded to a support using an adhesive composition containing an elastomer and a wax, and the elastomer contains a styrene unit as a constituent unit of the main chain. [Prior Art Document] [Patent Literature]

[Patent Document 1] Japanese Patent Laid-Open Publication No. 2011-119427 [Patent Document 2] Japanese Patent Laid-Open Publication No. 2009-528688 (Patent Document 3) Japanese Patent Laid-Open No. 2011-225814 (Patent Document 4) [Patent Document 5] Japanese Patent Publication No. 2010-506406 [Patent Document 6] Japanese Patent Laid-Open Publication No. 2007-045939 (Patent Document 7) US Patent Publication No. 2011/0318938 [Patent Document 9] Japanese Patent Laid-Open Publication No. 2013-346568 (Patent Document 10) Japanese Patent Laid-Open Publication No. 2014-34632

[Problems to be solved by the invention]

In the case where the surface (i.e., the element surface) of the element wafer on which the element is provided is temporarily connected to the support (carrier substrate) via the layer including the adhesive known in Patent Document 1 or the like, in order to stably The support component wafer requires a certain strength of adhesion to the adhesive layer. Therefore, when the entire surface of the element surface of the element wafer and the support are temporarily connected via the adhesive layer, if the temporary end of the element wafer and the support is too strong, when the element wafer is detached from the support, It is easy to cause damage to the component or the component is detached from the component wafer.

Further, as in Patent Document 2, a method of forming a plasma polymer layer as a separation layer by a plasma deposition method between a wafer and a support layer system in order to suppress the subsequent adhesion of the wafer and the support layer system to become too strong There are the following problems: (1) equipment that is usually used to implement the plasma deposition method is expensive; (2) for layer formation by the plasma deposition method, it takes time to vacuum or stack the monomers in the plasma apparatus; And (3) even if a separation layer containing a plasma polymer layer is provided, it is not easy to control the following bonding: in the case of supporting the wafer to be processed, the subsequent bonding of the wafer to the separation layer is sufficient, and On the other hand, when the support of the wafer is released, the wafer is easily detached from the separation layer or the like.

In addition, in the method of releasing the temporary contact by heating as described in Patent Document 3, Patent Document 4, and Patent Document 5, it is likely to cause a problem that the element wafer is broken when the element wafer is detached from the support.

Further, in the method of irradiating the irradiation line and releasing the temporary connection as in Patent Document 6 and Patent Document 7, it is necessary to use a support that transmits the irradiation line.

In the case where the softening point of the bonding layer on the element wafer side is 20° C. or more higher than the softening point of the bonding layer on the substrate side as in Patent Document 8, the following problem occurs: the bonding layer on the substrate side after transfer is transferred to On the bonding layer on the wafer side of the device, the cleaning property of the device wafer is lowered.

In the case where the support and the element wafer are temporarily fixed by the method disclosed in Patent Document 9 and Patent Document 10, the peeling property is insufficient. Therefore, when the support is detached from the element wafer, the element may be broken or the element may be peeled off. Further, in Patent Document 10, in order to easily separate the element wafer from the support, a support having a plurality of holes penetrating in the thickness direction or a layer having a property of being deteriorated by absorbing light is used. The (reactive layer) is inserted between the support and the component wafer, but this method must use a special support.

The present invention has been made in view of the above circumstances, and an object thereof is to provide a temporarily fixed adhesive, an adhesive film, an adhesive support, a laminate, and a sleeve, which can be formed on a wafer such as a component wafer. When the material is subjected to mechanical treatment, chemical treatment, or the like, the substrate can be stably held temporarily, and the subsequent adhesive layer to the substrate can be easily released. [Means for solving the problem]

The present inventors have conducted intensive studies to solve the above problems, and as a result, it has been found that when the adhesive is temporarily fixed as follows, the element wafer and the support can be temporarily terminated by a high adhesion force, and can be easily released. The present invention has been completed by temporarily suspending an element wafer containing a compound which is liquid at 25 ° C and contains an oleophilic group and a fluorine atom, and an elastomer. The present invention provides the following. <1> A temporarily fixed adhesive comprising: a compound which is liquid at 25 ° C and contains a lipophilic group and a fluorine atom, and an elastomer. <2> The temporarily fixed adhesive according to <1>, wherein the compound having an oleophilic group and a fluorine atom has a 10% thermal mass reduction temperature of 250 ° C or higher at 25 ° C / min from 25 ° C. <3> The temporarily fixed adhesive according to <1> or <2>, wherein the 5% thermal mass reduction temperature at which the elastomer is heated at 20 ° C/min from 25 ° C is 250 ° C or higher. The temporarily fixed adhesive according to any one of <1> to <3> wherein the elastomer is an elastomer containing a repeating unit derived from styrene. The temporarily fixed adhesive according to any one of <1> to <4> wherein the elastomer is a hydride. The temporarily fixed adhesive according to any one of <1> to <5> wherein the elastomer is a block copolymer. The temporarily fixed adhesive according to any one of <1> to <6> wherein the elastomer is a block copolymer having a single terminal or styrene at both ends. The temporarily fixed adhesive according to any one of <1> to <7> wherein the elastomer contains the elastomer A and the elastomer B, and the elastomer A is 10% by mass or more in all the repeating units. Further, the repeating unit derived from styrene containing a repeating unit derived from styrene in a ratio of more than 50% by mass and 95% by mass or less in all the repeating units is contained in a proportion of 50% by mass or less. <9> The temporarily fixed adhesive according to <8>, wherein the mass ratio of the elastomer A to the elastomer B is from 5:95 to 95:5. <10> The temporarily fixed adhesive according to any one of <1> to <9> further comprising a radical polymerizable compound. <11> The temporarily fixed adhesive according to <10>, wherein the radically polymerizable compound is a compound having two or more radical polymerizable groups. <12> The temporary adhesive agent according to <10>, wherein the radically polymerizable compound has at least one of the partial structures represented by the following (P-1) to (P-4); * in the formula is a link key, [Chemical 1] . The temporarily fixed adhesive according to any one of <10>, wherein the radical polymerizable compound is selected from the group consisting of trimethylolpropane tri(meth)acrylate and isocyanurate ring. Oxyethane modified di(meth)acrylate, isocyanuric acid ethylene oxide modified tri(meth)acrylate, triallyl isocyanurate, pentaerythritol tri(meth)acrylate, pentaerythritol Tetra (meth) acrylate, dimethylolpropane tetra (meth) acrylate, dipentaerythritol penta (meth) acrylate, dipentaerythritol hexa (meth) acrylate, and tetramethylol methane tetra (methyl) At least one of acrylates. The temporarily fixed adhesive according to any one of <1> to <13> wherein the temporarily fixed adhesive is a temporarily fixed adhesive for producing a semiconductor device. <15> An adhesive film comprising an adhesive layer comprising: a compound which is liquid at 25 ° C and contains an oleophilic group and a fluorine atom, and an elastomer. <16> The adhesive film according to <15>, wherein the concentration of the compound containing a lipophilic group and a fluorine atom in the adhesive layer is in a range of 5% in the thickness direction of the adhesive layer from any surface of the adhesive layer. The area is different from the area in the range of more than 5% and 50% in the thickness direction. <17> An adhesive support comprising an adhesive layer and a support, wherein the adhesive layer contains a compound which is liquid at 25 ° C and contains an oleophilic group and a fluorine atom, and an elastomer. <18> The adhesive support according to <17>, wherein the concentration of the compound containing the oleophilic group and the fluorine atom in the adhesive layer is from the surface on the opposite side of the support from the thickness direction of the adhesive layer. The area of the range of % is higher than the area of the opposite side of the self-supporting body from the range of more than 5% and 50% in the thickness direction of the subsequent layer. <19> A laminate having at least one or more adhesive layer A between a substrate and a support, and the subsequent layer A comprising an adhesive layer A1 containing: liquid at 25 ° C and containing a pro A compound based on an oil base and a fluorine atom, and an elastomer. <20> The laminated body according to <19>, which has an adhesive layer A1 between the substrate and the support, and the adhesive layer A1 contains a compound which is liquid at 25 ° C and has an oleophilic group and a fluorine atom, And an elastomer, and the layer A1 is in contact with the substrate and the support. <21> The laminated body according to <19>, wherein the adhesive layer A contains two or more adhesive layers A1. <22> The laminated body according to <19>, wherein the adhesive layer A further comprises an adhesive layer A2 other than the adhesive layer A1. <23> The laminated body according to <21>, wherein the adhesive layer A1 is in contact with at least one of the support and the substrate. <24> The laminate according to <22> has a support, an adhesive layer A1, an adhesive layer A2, and a substrate in this order. The laminate according to any one of <22>, wherein the adhesive layer A contains the adhesive layer A2, and the adhesive layer A2 contains the elastomer. The layered body according to any one of <19>, wherein at least one layer of the adhesive layer A contains an elastomer containing a repeating unit derived from styrene. <27> The laminate according to <26>, wherein the elastomer is a hydride. <28> The laminate according to <26> or <27> wherein the elastomer is a block copolymer. The laminated body according to any one of <26>, wherein the elastomer contains the elastomer A and the elastomer B, and the elastomer A is 10% by mass or more and 50% in all the repeating units. The repeating unit derived from styrene containing a repeating unit derived from styrene in a ratio of more than 50% by mass and 95% by mass or less in all repeating units is contained in a ratio of not more than % by mass. The laminated body according to any one of <19>, wherein the substrate is an element wafer. <31> The laminated body according to <19>, wherein the peel strength A of the support and the adhesive layer A and the peel strength B of the adhesive layer A and the substrate satisfy the following formulas (1) and (2); <B···· (1) B≦4 N/cm·(2) where the peeling strength A indicates that the substrate is fixed and the end of the support is 50 mm/min in the 90° direction. The force applied when pulling up at a speed, the peeling strength B represents the force applied when the substrate is fixed and the layer is subsequently pulled up at a speed of 50 mm/min in the 90° direction. <32> The laminated body according to <19>, wherein when the support is peeled off from the substrate, the adhesive layer A is peeled off from the interface between the substrate and the adhesive layer A, and the release surface of the substrate from the adhesive layer A A residue of a compound containing a lipophilic group and a fluorine atom is adhered in a range of 50% or more of the area; or the adhesive layer A is peeled off from the interface between the support and the adhesion layer A, and is peeled off from the adhesion layer A of the support. A residue of a compound containing a lipophilic group and a fluorine atom adheres to a range of 50% or more of the area of the surface. The layered body according to any one of <19> to <32> wherein the area of the film surface of the adhesive layer A is smaller than the area of the substrate surface of the support. The laminate according to any one of the above aspects, wherein the diameter of the substrate surface of the support is C μm, and the diameter of the substrate surface of the substrate is D μm. When the diameter of the film surface of the layer A is set to T μm, (C-200) ≧T ≧ D is satisfied. The laminate according to any one of the above aspects, wherein the diameter of the substrate surface of the support is C μm, and the diameter of the substrate surface of the substrate is D μm. Then, when the diameter of the film surface of the layer A on the side in contact with the support is T _C μm and the diameter of the film surface of the layer A on the side in contact with the substrate is T _D μm, it satisfies (C-200)≧ T _C >T _D ≧D. <36> A kit comprising a temporarily fixed adhesive A and a temporarily fixed adhesive B, the temporarily fixed adhesive A containing a compound which is liquid at 25 ° C and containing a lipophilic group and a fluorine atom, and an elastomer, The temporarily fixed adhesive B contains a thermoplastic resin. [Effects of the Invention]

According to the present invention, it is possible to provide a temporarily fixed adhesive, an adhesive film, an adhesive support, a laminate, and a kit, which can form a substrate which can be stably and temporarily attached, and can be easily released from the substrate. The temporary next layer.

Hereinafter, embodiments of the present invention will be described in detail. In the expression of the group (atomic group) in the present specification, the unsubstituted and unsubstituted expression is not described as including not only a group having no substituent but also a group having a substituent. For example, the "alkyl group" includes not only an alkyl group having no substituent (unsubstituted alkyl group) but also an alkyl group having a substituent (substituted alkyl group). The "actinic ray" or "radiation" in the present specification means, for example, visible light, ultraviolet light, far ultraviolet light, electron beam, X-ray, or the like. In the present specification, "light" means actinic rays or radiation. In the present specification, the term "exposure" refers not only to the exposure of far ultraviolet rays, X-rays, extreme ultraviolet (EUV) light, etc. represented by mercury lamps, ultraviolet rays, or excimer lasers, but also to "exposure". Refers to the use of particle beams such as electron beams and ion beams. In the present specification, "(meth)acrylate" means acrylate and methacrylate, "(meth)acrylic group" means an acryl group and a methacryl group, and "(meth)acryloyl group" means "propylene".醯基" and "methacryl oxime". In the present specification, the weight average molecular weight and the number average molecular weight are defined as polystyrene equivalent values obtained by gel permeation Chromatography (GPC). In the present specification, the weight average molecular weight (Mw) and the number average molecular weight (Mn) can be obtained, for example, by using HLC-8220 (manufactured by Tosoh Co., Ltd.) using TSKgel Super AWM-H (East) Made by Tosoh Co., Ltd., 6.0 mm (inside diameter) × 15.0 cm) as a column, and using 10 mmol/L lithium bromide N-methyl pyrrolidinone (NMP) solution as the dissolving solution . In the present specification, the term "lipophilic group" means a functional group which does not contain a hydrophilic group. In addition, the "hydrophilic group" means a functional group which exhibits affinity with water. In the embodiments described below, the members or the like described in the drawings will be simplified or omitted by the same reference numerals or corresponding symbols in the drawings.

<Temporary Fixing Adhesive> The temporarily fixed adhesive of the present invention contains a compound which is liquid at 25 ° C and contains a lipophilic group and a fluorine atom (hereinafter referred to as a fluorine-based liquid compound), and an elastomer. According to the temporary fixing adhesive of the present invention, the following layer can be formed: when the substrate of the element wafer or the like is subjected to mechanical treatment or chemical treatment, etc., the substrate can be stably temporarily attached, and the substrate can be easily released. Go on for the time being. Since the temporary fixing adhesive of the present invention contains the fluorine-based liquid compound described above, the fluorine-based liquid compound tends to be biased to the surface layer of the adhesive layer, and the concentration of the fluorine-based liquid compound in the surface layer of the adhesive layer can be increased. Therefore, an adhesive layer excellent in peelability to a substrate or a support can be formed. Further, since the elastic body is contained, the fine unevenness of the support or the substrate is also followed, and an adhesive layer having excellent adhesion can be formed by an appropriate anchor effect. Therefore, it is possible to have both adhesiveness and peelability. The temporarily fixed adhesive of the present invention can be preferably used as a temporary fixing adhesive for the manufacture of a semiconductor device. Hereinafter, the temporarily fixed adhesive of the present invention will be specifically described.

<<Fluorine-like liquid compound>> The temporary fixing adhesive of the present invention contains a fluorine-based liquid compound. In the present invention, the term "liquid" refers to a compound having fluidity at 25 ° C, and is, for example, a compound having a viscosity at 25 ° C of from 1 mPa·s to 100,000 mPa·s. The viscosity at 25 ° C of the fluorine-based liquid compound is, for example, more preferably 10 mPa·s to 20,000 mPa·s, and still more preferably 100 mPa·s to 15,000 mPa·s. When the viscosity of the fluorine-based liquid compound is in the above range, the fluorine-based liquid compound tends to be biased toward the surface layer of the adhesive layer.

In the present invention, the fluorine-based liquid compound can be preferably used as a compound of any form of an oligomer or a polymer. Alternatively, it may be a mixture of an oligomer and a polymer. The mixture may also contain more monomers. Further, the fluorine-based liquid compound may be a monomer. From the viewpoint of heat resistance and the like, the fluorine-based liquid compound is preferably an oligomer, a polymer, and a mixture thereof. Examples of the oligomer and the polymer include a radical polymer, a cationic polymer, an anionic polymer, and the like, and any of them can be preferably used. It is especially preferred to be a vinyl polymer. The weight average molecular weight of the fluorine-based liquid compound is preferably from 500 to 100,000, more preferably from 1,000 to 50,000, still more preferably from 2,000 to 20,000.

In the present invention, the fluorine-based liquid compound is preferably a compound which is not modified when it is supplied to a substrate which is temporarily placed. For example, a compound which can exist in a liquid form even after the substrate is treated by heating at 250 ° C or higher or various chemical liquids is preferable. As a specific example, it is preferable that the viscosity at 25 ° C after heating to 250 ° C under the temperature rising condition of 10 ° C / min from the state of 25 ° C is 1 mPa·s to 100,000 mPa·s. More preferably, it is 10 mPa·s to 20,000 mPa·s, and further preferably 100 mPa·s to 15,000 mPa·s. The fluorine-based liquid compound having such characteristics is preferably a non-thermosetting compound having no reactive group. The term "reactive group" as used herein refers to all groups which react by heating at 250 ° C, and examples thereof include a polymerizable group and a hydrolyzable group. Specific examples thereof include a (meth)acryl group, an epoxy group, and an isocyanate group. Further, the fluorine-based liquid compound is preferably a 10% thermal mass reduction temperature which is raised at 20 ° C/min from 25 ° C to be 250 ° C or higher, more preferably 280 ° C or higher. Further, the upper limit is not particularly limited, and is, for example, preferably 1000 ° C or lower, more preferably 800 ° C or lower. According to this aspect, it is easy to form an adhesive layer excellent in heat resistance. In addition, the mass reduction temperature means a value measured by a thermogravimetric analyzer (Thermo Gravimetric Analyzer (TGA)) under a nitrogen gas flow under the temperature rising condition.

The fluorine-based liquid compound used in the present invention contains an oleophilic group. The lipophilic group may, for example, be a linear or branched alkyl group, a cycloalkyl group, an aromatic group or the like.

The carbon number of the alkyl group is preferably from 2 to 30, more preferably from 4 to 30, still more preferably from 6 to 30, still more preferably from 12 to 20. Specific examples of the alkyl group include methyl group, ethyl group, propyl group, butyl group, pentyl group, hexyl group, heptyl group, octyl group, decyl group, decyl group, dodecyl group, tetradecyl group, and octadecyl group. Alkyl, isopropyl, isobutyl, t-butyl, tert-butyl, 1-ethylpentyl, 2-ethylhexyl. The alkyl group may also have a substituent. Examples of the substituent include a halogen atom, an alkoxy group, and an aromatic group. The halogen atom may, for example, be a chlorine atom, a fluorine atom, a bromine atom or an iodine atom, and is preferably a fluorine atom. The carbon number of the alkoxy group is preferably from 1 to 30, more preferably from 1 to 20, still more preferably from 1 to 10. The alkoxy group is preferably a straight chain or a branch. The aromatic group may be a single ring or a polycyclic ring. The carbon number of the aromatic group is preferably from 6 to 20, more preferably from 6 to 14, most preferably from 6 to 10.

The cycloalkyl group may be a single ring or a polycyclic ring. The carbon number of the cycloalkyl group is preferably from 3 to 30, more preferably from 4 to 30, still more preferably from 6 to 30, most preferably from 12 to 20. Examples of the monocyclic cycloalkyl group include a cyclopropyl group, a cyclobutyl group, a cyclopentyl group, a cyclohexyl group, a cycloheptyl group, and a cyclooctyl group. Examples of the polycyclic cycloalkyl group include adamantyl group, norbornyl group, borneol group, campphenyl group, decahydronaphthyl group, tricyclododecyl group, tetracyclododecyl group, and anthracene Camphoroyl, dicyclohexyl and pinenyl. The cycloalkyl group may also have a substituent as described above.

The aromatic group may be a single ring or a polycyclic ring. The carbon number of the aromatic group is preferably from 6 to 20, more preferably from 6 to 14, most preferably from 6 to 10. The aromatic group preferably has no hetero atom (for example, a nitrogen atom, an oxygen atom, a sulfur atom or the like) in the element constituting the ring. Specific examples of the aromatic group include a benzene ring, a naphthalene ring, a pentalene ring, an indene ring, an anthracene ring, a heptalene ring, and an indenene ring. Ring, anthracene ring, pentacene ring, anthracene ring, phenanthrene ring, anthracene ring, naphthacene ring, 1,2-benzophene ring, triphenylene ring , anthracene ring, biphenyl ring, pyrrole ring, furan ring, thiophene ring, imidazole ring, oxazole ring, thiazole ring, pyridine ring, pyrazine ring, pyrimidine ring, pyridazine ring, pyridazine ring, anthracene ring, Benzofuran ring, benzothiophene ring, isobenzofuran ring, quinazoline ring, quinoline ring, pyridazine ring, naphthyridine ring, quinoxaline ring, quinazoline ring, isoquinoline ring, indazole ring , phenanthridine ring, acridine ring, phenanthroline ring, thianthrene ring, chromene ring, xanthene ring, phenoxathiin ring , phenothiazine ring and phenazine ring. The aromatic group may also have a substituent as described above.

The fluorine-based liquid compound may be a compound containing only one lipophilic group, or may contain two or more kinds of lipophilic groups. Further, the lipophilic group may also contain a fluorine atom. That is, the fluorine-based liquid compound of the present invention may be a compound containing only a fluorine atom in a lipophilic group. Further, it may be a compound containing a fluorine-containing element (also referred to as a fluorine group) in addition to the lipophilic group. Preferred are compounds containing an oleophilic group and a fluorine group. When the fluorine-based liquid compound is a compound containing a lipophilic group or a fluorine group, the lipophilic group may contain a fluorine atom or may not contain a fluorine atom, and the lipophilic group preferably has no fluorine atom. The fluorine-based liquid compound contains one or more lipophilic groups in one molecule, preferably contains 2 to 100 oleophilic groups, and more preferably contains 6 to 80 oleophilic groups.

As the fluorine group, a known fluorine group can be used. For example, a fluorine-containing alkyl group, a fluorine-containing alkylene group, etc. Further, among the fluorine groups, a group which functions as a lipophilic group is considered to be included in the lipophilic group. The fluorine-containing alkyl group preferably has 1 to 30 carbon atoms, more preferably 1 to 20 carbon atoms, still more preferably 1 to 15 carbon atoms. The fluorine-containing alkyl group may be any of a straight chain, a branched chain, and a cyclic chain. In addition, an ether bond may also be contained. Further, the fluorine-containing alkyl group may be a perfluoroalkyl group in which all hydrogen atoms are substituted with a fluorine atom. The fluorine-containing alkylene group preferably has 2 to 30 carbon atoms, more preferably 2 to 20 carbon atoms, still more preferably 2 to 15 carbon atoms. The fluorine-containing alkylene group may be any of a straight chain, a branched chain, and a cyclic chain. In addition, an ether bond may also be contained. Further, the fluorine-containing alkylene group may be a perfluoroalkylene group in which all hydrogen atoms are substituted with a fluorine atom.

The fluorine-based liquid compound preferably has a fluorine atom content of 1% by mass to 90% by mass, more preferably 2% by mass to 80% by mass, even more preferably 5% by mass to 70% by mass. When the fluorine content is in the above range, the peeling property is excellent. The content of the fluorine atom is defined by "{(the number of fluorine atoms in one molecule x the mass of the fluorine atom) / the mass of all atoms in one molecule} x 100".

Commercially available products can also be used as the fluorine-based liquid compound. For example, F-251, F-281, F-477, F-553, F-554, F-555, F-556, and F-557 of the Megafac series manufactured by DiCai (DIC) Co., Ltd. , F-558, F-559, F-560, F-561, F-563, F-565, F-567, F-568, F-571, R-40, R-41, R-43, R -94, or 610F, 710FM, 710FS, 730FL, 730LM of the Ftergent series manufactured by Neos.

The content of the fluorine-based liquid compound in the temporarily fixed adhesive of the present invention is preferably 0.01% by mass to 10% by mass, and more preferably 0.02% by mass to 5% by mass based on the mass of the temporarily fixed adhesive other than the solvent. . The lower limit is preferably 0.03 mass% or more. The upper limit is preferably 1% by mass or less, more preferably less than 0.5% by mass. When the content of the fluorine-based liquid compound is in the above range, the adhesion and the releasability are excellent. The fluorine-based liquid compound may be used alone or in combination of two or more. When two or more cases are used in combination, it is preferred that the total content is in the above range.

<<Elastomer>> The temporarily fixed adhesive of the present invention contains an elastomer. By using an elastomer, the fine concavities and convexities of the support or the substrate are also followed, and an adhesive layer having excellent adhesion can be formed by an appropriate fixing effect. Further, when the support is peeled off from the substrate, the support can be peeled off from the substrate without applying stress to the substrate or the like, and damage or peeling of the element or the like on the substrate can be prevented. In the present specification, the term "elastomer" means a polymer compound which exhibits elastic deformation. In other words, it is defined as a polymer compound having the following properties: when an external force is applied, it is instantaneously deformed according to the external force, and when the external force is released, the original shape is restored in a short time.

The weight average molecular weight of the elastomer is preferably from 2,000 to 200,000, more preferably from 10,000 to 200,000, still more preferably from 50,000 to 100,000. Within this range, the solubility of the temporarily fixed adhesive in the solvent is excellent, and the coatability is improved. Further, there is an advantage in that when the substrate is removed from the support and the remaining adhesive layer is removed, the solubility in the solvent is also excellent, so that no residue remains on the substrate or the support.

In the present invention, the elastomer is not particularly limited, and examples thereof include a block copolymer, a random copolymer, and a graft copolymer, and a block copolymer is preferred. In the case of a block copolymer, an effect of suppressing the flow of the temporarily fixed adhesive during the heating process can be suppressed, and the subsequent maintenance can be maintained during the heating process, and the peeling property is not changed after the heating process. As the type of the elastomer, an elastomer (polystyrene elastomer) containing a repeating unit derived from styrene, a polyester elastomer, a polyolefin elastomer, a polyurethane elastomer, and a poly A amide-based elastomer, a polyacryl-based elastomer, an anthrone-based elastomer, a polyimide-based elastomer, or the like. In particular, a polystyrene-based elastomer, a polyester-based elastomer, and a polyamide-based elastomer are preferable, and from the viewpoint of heat resistance and peelability, a polystyrene-based elastomer is preferable.

In the present invention, the elastomer is preferably a hydride. Particularly preferred is a hydride of a polystyrene elastomer. If the elastomer is a hydride, thermal stability or storage stability is improved. Further, the peeling property and the cleaning property of the adhesive layer after peeling are improved. Further, the term "hydride" means a polymer having a structure in which an elastomer is hydrogenated. The elastomer preferably has a 5% thermal mass reduction temperature of from 20 ° C / min from 25 ° C to 250 ° C or more, more preferably 300 ° C or more, further preferably 350 ° C or more, and most preferably 400 ° C or more. Further, the upper limit is not particularly limited, and is, for example, preferably 1000 ° C or lower, more preferably 800 ° C or lower. According to this aspect, it is easy to form an adhesive layer excellent in heat resistance. The elastomer of the present invention preferably has the property that when the original size is set to 100%, it can be deformed to 200% by a small external force at room temperature (20 ° C), and when the external force is released, Return to below 130% in a short time.

<<<Polystyrene-based elastomer>>> The polystyrene-based elastomer is not particularly limited and may be appropriately selected depending on the purpose. For example, styrene-butadiene-styrene block copolymer (SBS), styrene-isoprene-styrene block copolymer (SIS), styrene-ethylene-butylene-styrene embedded Segment copolymer (SEBS), styrene-butadiene-butene-styrene copolymer (SBBS) and hydrides of the copolymers, styrene-ethylene-butylene styrene block copolymer (SEBS), Styrene-ethylene-propylene-styrene block copolymer (SEPS), styrene-ethylene-ethylene-propylene-styrene block copolymer, and the like.

The content of the styrene-derived repeating unit in the polystyrene-based elastomer is preferably 10% by mass to 90% by mass. From the viewpoint of the peelability, the lower limit is preferably 25% by mass or more, and more preferably 51% by mass or more.

In the present invention, the polystyrene elastomer is preferably an elastomer A containing a repeating unit derived from styrene in a ratio of 10% by mass or more and 50% by mass or less in all the repeating units, and repeating all In the unit, the elastomer B containing a repeating unit derived from styrene in a ratio of more than 50% by mass and 95% by mass or less is used in combination. By using the elastomer A and the elastomer B in combination, it has excellent releasability, and the flatness of the polished surface of the substrate (hereinafter also referred to as flat polishing property) is good, and warpage of the substrate after polishing can be effectively suppressed. It is speculated that the mechanism by which such an effect can be obtained is as follows. That is, since the elastomer A is a relatively soft material, it is easy to form an elastic adhesive layer. Therefore, when the laminate of the substrate and the support is produced by using the temporarily fixed adhesive of the present invention, and the substrate is polished and thinned, even if the pressure at the time of polishing is locally applied, the subsequent layer may be elastically deformed. Easily return to the original shape. As a result, excellent flat abrasiveness can be obtained. Further, even if the laminated body after polishing is subjected to heat treatment and thereafter cooled, the internal stress generated during cooling can be alleviated by the adhesion layer, and the occurrence of warpage can be effectively suppressed. Further, since the elastic body B is a relatively hard material, by including the elastic body B, an adhesive layer excellent in peelability can be produced.

The elastomer A preferably contains 13% by mass to 45% by mass of repeating units derived from styrene in all repeating units, more preferably 15% by mass to 40% by mass. According to this aspect, more excellent flat abrasiveness can be obtained. Further, warpage of the substrate after polishing can be effectively suppressed. The hardness of the elastomer A is preferably from 20 to 82, more preferably from 60 to 79. Further, the hardness is a value measured by a type A durometer according to the method of Japanese Industrial Standards (JIS) K6253.

The elastomer B preferably contains 55 to 90% by mass of a repeating unit derived from styrene in all repeating units, more preferably 60% by mass to 80% by mass. According to this aspect, the peeling property can be more effectively improved. The hardness of the elastomer B is preferably from 83 to 100, more preferably from 90 to 99.

The quality of the elastomer A and the elastomer B is preferably elastomer A: elastomer B = 5: 95 to 95: 5, more preferably 10: 90 to 80: 20, most preferably 15: 85 - 60:40. If it is the range, the effects described above can be obtained more effectively.

The polystyrene elastomer is preferably a block copolymer of styrene and other resins, more preferably a block copolymer having a single terminal or a terminal styrene, and particularly preferably a block copolymer having styrene at both ends. . When both ends of the polystyrene elastomer are set as a block copolymer of styrene (a repeating unit derived from styrene), thermal stability tends to be further improved. The reason for this is that a repeating unit derived from styrene having high heat resistance exists at the terminal. In particular, a block portion derived from a repeating unit derived from styrene is a reactive polystyrene-based hard block, and is preferably more excellent in heat resistance and chemical resistance. Further, it is considered that when the elastomer is a block copolymer, phase separation between a hard block and a soft block is performed at 200 ° C or higher. It is considered that the shape of the phase separation contributes to suppression of unevenness on the surface of the substrate of the element wafer. Further, such a resin is also more preferable from the viewpoints of solubility in a solvent and resistance to a resist solvent. Further, when the polystyrene elastomer is a hydride, the stability to heat is improved, and deterioration such as decomposition or polymerization is less likely to occur. Further, it is also preferable from the viewpoints of solubility in a solvent and resistance to a resist solvent. The amount of the unsaturated double bond of the polystyrene-based elastomer is preferably less than 15 mmol, more preferably less than 5, per 1 g of the polystyrene-based elastomer from the viewpoint of the releasability after the heating step. Mmmol, preferably less than 0.5 mmol. Further, the amount of the unsaturated double bond herein does not include the unsaturated double bond in the benzene ring derived from styrene. The amount of unsaturated double bonds can be calculated by nuclear magnetic resonance (NMR) measurement.

In the present specification, the term "repeating unit derived from styrene" means a structural unit derived from styrene contained in a polymer when styrene or a styrene derivative is polymerized, and may have a substituent. Examples of the styrene derivative include α-methylstyrene, 3-methylstyrene, 4-propylstyrene, and 4-cyclohexylstyrene. Examples of the substituent include an alkyl group having 1 to 5 carbon atoms, an alkoxy group having 1 to 5 carbon atoms, an alkoxyalkyl group having 1 to 5 carbon atoms, an ethoxy group, and a carboxyl group.

Commercial products of the polystyrene elastomer include, for example, Tufprene A, Tufprene 125, Tufprene 126S, Solprene T, and Asapram ( Asaprene) T-411, Asaprene T-432, Asaprene T-437, Asaprene T-438, Asaprene T-439, Tacitac ( Tuftec) H1272, Tuftec P1500, Tuftec H1052, Tuftec H1062, Tuftec M1943, Tuftec M1911, Tuftec H1041, Tuftec MP10, Tuftec M1913, Tuftec H1051, Tuftec H1053, Tuftec P2000, Tuftec H1043 ( The above is manufactured by Asahi Kasei Co., Ltd., elastomer AR-850C, elastomer AR815C, elastomer AR-840C, elastomer AR-830C, elastomer AR860C, elastomer AR-875C, elastomer AR-885C, elastomer AR -SC-15, elastomer AR-SC-0, elastomer AR-SC-5, elastic AR-710, elastomer AR-SC-65, elastomer AR-SC-30, elastomer AR-SC-75, elastomer AR-SC-45, elastomer AR-720, elastomer AR-741, elastomer AR-731, elastomer AR-750, elastomer AR-760, elastomer AR-770, elastomer AR-781, elastomer AR-791, elastomer AR-FL-75N, elastomer AR-FL-85N, Elastomer AR-FL-60N, elastomer AR-1050, elastomer AR-1060, elastomer AR-1040 (manufactured by Aron Kasei), Kraton D1111, Kraton D1113, Kraton D1114, Kraton D1117, Kraton D1119, Kraton D1124, Kraton D1126, Kraton D1161, Kraton D1162 Kraton D1163, Kraton D1164, Kraton D1165, Kraton D1183, Kraton D1193, Kraton DX406, Kraton D4141, Kraton (Kraton) D4150, Kraton D4153, Kraton D4158, Kraton D4270, Kraton D 4271, Kraton D 4433, Kraton D 1170, Branch (Kraton) D 1171, Kraton D 1173, Cariflex IR0307, Cariflex IR 0310, Cariflex IR 0401, Kraton ) D0242, Kraton D1101, Kraton D1102, Kraton D1116, Kraton D1118, Kraton D1133, Kraton D1152, Kraton D1153, Kraton D1155, Kraton D1184, Kraton D1186, Kraton D1189, Kraton D1191, Kraton D1192, Kraton DX405 Kraton DX408, Kraton DX410, Kraton DX414, Kraton DX415, Kraton A1535, Kraton A1536, Kraton FG1901 Kraton FG1924, Kraton G1640, Kraton G1641, Kraton G1642, Kraton G1643, Kraton G1645, Kraton G1633, Branch Kraton G1650, Kraton G1651, Kraton G1652, Kraton G1654, Kraton G1657, Kraton G1660, Kraton G1726, Kraton G1701, Kraton G1702, Kraton G1730 Kraton G1750, Kraton G1765, Kraton G4609, Kraton G4610 (made by Kraton), TR2000, TR2001, TR2003, TR2250, TR2500, TR2601, TR2630 , TR2787, TR2827, TR1086, TR1600, SIS5002, SIS5200, SIS5250, SIS5405, SIS5505, Dynaron 6100P, Dynaron 4600P, Dynaron 6200P, Dynaron 4630P , Dynaron 8601P, Dynaron 8630P, Dynaron 8600P, Dynaron 8903P, Dynaron 6201B, Dynaron 1321P, Generation Dynaron 1320P, Dynaron 2324P, Dynaron 9901P (made by JSR), Electrochemical STR (Denka STR) series (Electrical Chemical Industry) ), Quintac 3 520, Quintac 3433N, Quintac 3421, Quintac 3620, Quintac 3450, Quintac 3460 (Japan Ryan) (Zeon) manufacturing, TPE-SB series (manufactured by Sumitomo Chemical Co., Ltd.), Rabalon series (manufactured by Mitsubishi Chemical Corporation), Septon 1001, Septon 8004, Septon 4033, Septon 2104, Septon 8007, Septon 2007, Septon 2004, Septon 2063, Saip Septon HG252, Septon 8076, Septon 2002, Septon 1020, Septon 8104, Septon 2005, Saipton ( Septon) 2006, Septon 4055, Septon 4044, Septon 4077, Septon 4099, Septon 8006, Septon V9461, Septon V9475, Septon V9827, Hybrar 7311, Haibra Hybrar) 7125, Hybrar 5127, Hybrar 5125 (above made by Kuraray), Sumiflex (Sumitomo Bakelite) ), Leostomer, Actimer (above the Riken vinyl industry).

<<<Polyester-based elastomer>>> The polyester-based elastomer is not particularly limited and may be appropriately selected depending on the purpose. For example, a polyester-based elastomer obtained by polycondensing a dicarboxylic acid or a derivative thereof with a diol compound or a derivative thereof can be mentioned. Examples of the dicarboxylic acid include an aromatic dicarboxylic acid such as terephthalic acid, isophthalic acid or naphthalene dicarboxylic acid, and a hydrogen atom of an aromatic nucleus of the dicarboxylic acid is replaced by a methyl group, an ethyl group or a phenyl group. An aromatic dicarboxylic acid, an aliphatic dicarboxylic acid having 2 to 20 carbon atoms such as adipic acid, sebacic acid or dodecane dicarboxylic acid, and an alicyclic dicarboxylic acid such as cyclohexane dicarboxylic acid Wait. These dicarboxylic acids may be used alone or in combination of two or more. Examples of the diol compound include ethylene glycol, 1,3-propanediol, 1,4-butanediol, 1,6-hexanediol, 1,10-nonanediol, and 1,4-cyclohexanediol. An aliphatic diol or an alicyclic diol, a dihydric phenol represented by the following structural formula, or the like.

[Chemical 2]

In the formula, Y ^DO represents any alkyl group having 1 to 10 carbon atoms, a cycloalkyl group having 4 to 8 carbon atoms, -O-, -S- and -SO ₂ -, or benzene Direct bonding of the rings to each other (single bond). R ^DO1 and R ^DO2 each independently represent a halogen atom or an alkyl group having 1 to 12 carbon atoms. p ^do1 and p ^do2 each independently represent an integer of 0 to 4, and n ^do1 represents 0 or 1.

Specific examples of the polyester elastomer include bisphenol A, bis-(4-hydroxyphenyl)methane, bis-(4-hydroxy-3-methylphenyl)propane, and resorcin. These polyester elastomers may be used alone or in combination of two or more. In addition, it is also possible to use an aromatic polyester (for example, polybutylene terephthalate) portion as a hard segment component and an aliphatic polyester (for example, polytetramethylene glycol) portion as a soft segment. A multi-block copolymer of a (soft segment) component is used as a polyester elastomer. In the multi-block copolymer, various grades can be listed depending on the type, ratio, and molecular weight of the hard segment and the soft segment. Specific examples include: Hytrel (made by DuPont-Toray), Pelprene (made by Toyobo Co., Ltd.), Primalloy (Mitsubishi) Chemical manufacturing), Nouvelan (manufactured by Teijin Chemical Co., Ltd.), Espel 1612, Espel 1620 (manufactured by Hitachi Chemical Co., Ltd.), etc.

<<<Polyolefin-based elastomer>>> The polyolefin-based elastomer is not particularly limited and may be appropriately selected depending on the purpose. For example, a copolymer of an α-olefin having 2 to 20 carbon atoms such as ethylene, propylene, 1-butene, 1-hexene or 4-methyl-pentene can be mentioned. For example, an ethylene-propylene copolymer (EPR), an ethylene-propylene-diene copolymer (EPDM), etc. are mentioned. Further, examples thereof include carbon number of dicyclopentadiene, 1,4-hexadiene, cyclooctadiene, methylene norbornene, ethylidene norbornene, butadiene, and isoprene. a copolymer of 20 non-conjugated diene and an α-olefin, and the like. Further, a carboxyl-modified nitrile rubber obtained by copolymerizing methacrylic acid on a butadiene-acrylonitrile copolymer can be mentioned. Specific examples thereof include ethylene·α-olefin copolymer rubber, ethylene·α-olefin·non-conjugated diene copolymer rubber, propylene·α-olefin copolymer rubber, and butene·α-olefin copolymer rubber. Commercially available products include: Milastomer (manufactured by Mitsui Chemicals Co., Ltd.), Thermorun (Mitsubishi Chemical), and EXACT (Exxon Chemicals) Manufacturing), ENGAGE (made by The Dow Chemical), Espolex (made by Sumitomo Chemical), Sarlink (made by Toyobo), Newcon (Newcon) Made in Japan by Polypro), EXCELINK (made by JSR), etc.

<<<Polyurethane-based elastomer>>> The polyurethane-based elastomer is not particularly limited and may be appropriately selected depending on the purpose. For example, an elastomer including a hard segment containing a low molecular weight diol and a diisocyanate, and a structural unit containing a soft segment of a polymer (long-chain) diol and a diisocyanate may be mentioned. Examples of the polymer (long-chain) diol include polypropylene glycol, polytetramethylene oxide, poly(1,4-butylene adipate), and poly(extended ethyl 1,4-butylene). Adipate), polycaprolactone, poly(1,6-extended hexyl carbonate), poly(1,6-extension hexyl neopentyl adipate), and the like. The number average molecular weight of the polymer (long-chain) diol is preferably from 500 to 10,000. As the low molecular weight diol, a short chain diol such as ethylene glycol, propylene glycol, 1,4-butanediol or bisphenol A can be used. The number average molecular weight of the short-chain diol is preferably from 48 to 500. Commercial products of the polyurethane elastomers include PANDEX T-2185, PANDEX T-2983N (made by DiCai (DIC)), and Miractran (Miractran). ) (made by Miractran, Japan), Elastollan (made by BASF), Resamine (made by Daiichi Seiki Co., Ltd.), Pellethane (Dow) Chemical (made by The Dow Chemical), Ironrubber (manufactured by NOK), Mobilon (manufactured by Nisshinbo Chemical), and the like.

<<<Polyurethane-based elastomer>>> The polyamine-based elastomer is not particularly limited and may be appropriately selected depending on the purpose. For example, polyamines such as polyamide-6, polyamido-11, and polyamido-12 are used for the hard segment, and polyethers such as polyoxyethylene, polyoxypropylene, and polytetramethylene glycol are used. And/or polyester for elastomers of soft segments, and the like. The elastomer is roughly classified into two types: a polyether block guanamine type and a polyether ester block guanamine type. Commercially available products include: Ube Polyurethane Elastomer, UbeSTA XPA (made by Ube Industries, Ltd.), with Daiamide (Daicel-Daicel- Evonic), PEBAX (made by Arkema), Grilon ELX (made by EMS-Group Japan), Novamy Novamid (manufactured by Mitsubishi Chemical Co., Ltd.), Grelax (manufactured by Toyobo Co., Ltd.), polyether ester decylamine PA-200, polyether ester decylamine PA-201, polyether ester guanamine TPAE- 12. Polyether ester decylamine TPAE-32, polyester decylamine TPAE-617, polyester decylamine TPAE-617C (manufactured by T&K TOKA).

<<<Polyacrylic Elastomer>>> The polyacrylic elastomer is not particularly limited and may be appropriately selected depending on the purpose. For example, a polyacrylic-based elastomer containing acrylate such as ethyl acrylate, butyl acrylate, methoxyethyl acrylate or ethoxyethyl acrylate as a main component, or acrylate and glycidyl methacrylate, Allyl glycidyl ether and the like. Further, a polyacrylic elastomer obtained by copolymerizing a crosslinking point monomer such as acrylonitrile or ethylene may be mentioned. Specific examples thereof include an acrylonitrile-butyl acrylate copolymer, an acrylonitrile-butyl acrylate-ethyl acrylate copolymer, an acrylonitrile-butyl acrylate-glycidyl methacrylate copolymer, and the like.

<<<Anthrone-based elastomer>>> The anthrone-based elastomer is not particularly limited and may be appropriately selected depending on the purpose. For example, an anthrone-based elastomer containing a polyorganosiloxane as a main component, which is a polydimethylsiloxane, a polymethylphenyloxane, a polydiphenylsiloxane or the like, may be mentioned. . Specific examples of the commercially available product include KE series (manufactured by Shin-Etsu Chemical Co., Ltd.), SE series, CY series, and SH series (the above is manufactured by Toray-Dow corning silicone). .

<<<Other Elastomers>>> In the present invention, a rubber-modified epoxy resin (epoxy elastomer) can be used as the elastomer. The epoxy-based elastomer is obtained, for example, by using a bisphenol F-type epoxy resin or a double-end carboxylic acid-modified butadiene-acrylonitrile rubber, a terminal amine-based modified fluorenone rubber, or the like. Some or all of the epoxy groups of the phenol A type epoxy resin, the salicylaldehyde type epoxy resin, the phenol novolak type epoxy resin, or the cresol novolak type epoxy resin are modified.

The content of the elastomer in the temporarily fixed adhesive of the present invention is preferably from 50.00% by mass to 99.99% by mass, more preferably from 70.00% by mass to 99.99% by mass, based on the mass of the temporarily fixed adhesive other than the solvent. It is 88.00% by mass to 99.99% by mass. When the content of the elastomer is in the above range, the adhesion and the releasability are excellent. Further, the elastomer in the temporarily fixed adhesive of the present invention may be in various combinations. Further, in the temporarily fixed adhesive of the present invention, the fluorine-based liquid compound and the elastomer are preferably a fluorine-based liquid compound by mass ratio: elastomer = 0.001:99.999 to 10:90.00, more preferably 0.001:99.999. ~5:95.00, and then the best is 0.010:99.99~5:95.00.

<Radical Polymerizable Compound> The temporarily fixed adhesive of the present invention preferably further contains a radical polymerizable compound. By using a temporarily fixed adhesive containing a radical polymerizable compound, flow deformation of the adhesive layer during heating can be easily suppressed. Therefore, for example, when the laminated body after polishing the substrate is subjected to heat treatment or the like, flow deformation of the adhesive layer during heating can be suppressed, and occurrence of warpage can be effectively suppressed. Further, since an adhesive layer having hardness can be formed, even if a pressure is locally applied during polishing of the substrate, the subsequent layer is less likely to be deformed, and the flatness is excellent.

In the present invention, the radically polymerizable compound is a compound having a radical polymerizable group, and a known radically polymerizable compound which can be polymerized by a radical can be used. Such a compound is widely known in the industrial field, and these compounds can be used without particular limitation in the present invention. These compounds may be, for example, any of a monomer, a prepolymer, an oligomer, or a mixture thereof, and a chemical form such as the above.

In the present invention, the monomeric radical polymerizable compound (hereinafter also referred to as a polymerizable monomer) is a compound different from the polymer compound. The polymerizable monomer is typically a low molecular compound, preferably a low molecular weight compound having a molecular weight of 2,000 or less, more preferably a low molecular weight compound having a molecular weight of 1,500 or less, and further preferably a low molecular weight compound having a molecular weight of 900 or less. Further, the molecular weight of the polymerizable monomer is usually 100 or more. Further, the oligomer-type radically polymerizable compound (hereinafter also referred to as a polymerizable oligomer) is typically a polymer having a relatively low molecular weight, preferably 10 to 100 polymerizable monomers are bonded thereto. The resulting polymer. The molecular weight, the polystyrene-equivalent weight average molecular weight obtained by the gel permeation chromatography (GPC) method is preferably from 2,000 to 20,000, more preferably from 2,000 to 15,000, most preferably from 2,000 to 10,000.

The number of functional groups of the radically polymerizable compound in the present invention means the number of radical polymerizable groups in one molecule. The radical polymerizable group means a group which can be polymerized by the action of actinic rays, radiation or radicals. Examples of the radical polymerizable group include a group having an ethylenically unsaturated bond. The group having an ethylenically unsaturated bond is preferably a styryl group, a (meth)acryl fluorenyl group or a (meth)allyl group, more preferably a (meth) acrylonitrile group. That is, the radically polymerizable compound used in the present invention is preferably a (meth) acrylate compound, more preferably an acrylate compound.

From the viewpoint of suppressing warpage, the radically polymerizable compound preferably contains at least one of a difunctional or higher radical polymerizable compound containing two or more radical polymerizable groups, and more preferably contains at least one trifunctional or higher functional group. A radically polymerizable compound. The upper limit of the radical polymerizable group which the radically polymerizable compound has is not particularly limited, and may be, for example, 15 or less, or may be 6 or less. In addition, the radically polymerizable compound of the present invention preferably contains at least one trifunctional or higher radical polymerizable compound from the viewpoint of forming a three-dimensional crosslinked structure and improving heat resistance. Further, it may be a mixture of a difunctional or less radical polymerizable compound and a trifunctional or higher radical polymerizable compound.

Specific examples of the radically polymerizable compound include unsaturated carboxylic acids (for example, acrylic acid, methacrylic acid, itaconic acid, crotonic acid, methacrylic acid, maleic acid, etc.) or esters thereof, guanamines, and the like. The polymer is preferably an ester of an unsaturated carboxylic acid and a polyol compound, and an amide of an unsaturated carboxylic acid and a polyamine compound, and the like. Further, an addition reaction product of an unsaturated carboxylic acid ester or a guanamine having a nucleophilic substituent such as a hydroxyl group, an amine group or a fluorenyl group with a monofunctional or polyfunctional isocyanate or epoxy group can also be preferably used. Or a dehydration condensation reaction with a monofunctional or polyfunctional carboxylic acid or the like. Further, the following reactants are also preferred: an unsaturated carboxylic acid ester or a guanamine having an electrophilic substituent such as an isocyanate group or an epoxy group, and a monofunctional or polyfunctional alcohol, an amine or a thiol. The reactants further include a substituted carboxylic acid ester of a detachable substituent such as a halogen group or a tosyloxy group, or a substituted reactant of a monofunctional or polyfunctional alcohol, an amine or a thiol. Further, as another example, a group of compounds substituted with a vinylbenzene derivative such as unsaturated phosphonic acid or styrene, vinyl ether or allyl ether may be used instead of the unsaturated carboxylic acid.

For the specific compound, the compound described in Paragraph No. 0029 to Paragraph No. 0037 of JP-A-2014-189696 is preferably used in the present invention.

In addition, a urethane-based addition polymerizable monomer produced by an addition reaction of an isocyanate and a hydroxyl group is also preferable, and a specific example thereof is described in Japanese Patent Publication No. Sho 48-41708. In the polyisocyanate compound having two or more isocyanate groups in one molecule, a hydroxyl group-containing vinyl monomer represented by the following formula (A) is added to contain two or more polymerizable groups in one molecule. A vinyl vinyl urethane compound or the like. CH ₂ =C(R ⁴ )COOCH ₂ CH(R ⁵ )OH···(A) (wherein R ⁴ and R ⁵ represent H or CH ₃ ) Further, Japanese Patent Laid-Open No. 51-37193, Japan Japanese Patent Publication No. Sho-62-49860, Japanese Patent Publication No. Sho-58-49860, Japanese Patent Publication No. Sho 56-49860, and Japanese Patent Publication No. Sho 56-17654 A urethane compound having an ethylene oxide skeleton described in Japanese Patent Publication No. Sho 62-39417, and JP-A-62-39418 is also preferred.

In addition, as for the radically polymerizable compound, the compound described in Paragraph No. 0095 to Paragraph No. 0108 of JP-A-2009-288705 is preferably used in the present invention.

Further, the radically polymerizable compound is also preferably a compound having at least one vinyl group capable of undergoing addition polymerization and having a boiling point of 100 ° C or higher at normal pressure. For the example, the compound described in Paragraph No. 0040 of JP-A-2014-189696 is preferably used in the present invention.

Further, a compound having a boiling point of 100 ° C or higher and having at least one ethylenically unsaturated group capable of undergoing addition polymerization under normal pressure is also preferably a paragraph number 0254 to a paragraph number of JP-A-2008-292970. The compound described in 0257.

In addition to the above, a radical polymerizable compound represented by the following formula (MO-1) to formula (MO-5) can be preferably used. Further, in the case where T is an oxygen-extended alkyl group, the terminal on the carbon atom side is bonded to R.

[Chemical 3]

[Chemical 4]

In the formula, n is an integer of 0 to 14, and m is an integer of 1 to 8. A plurality of R and T in one molecule may be the same or different. In each of the radical polymerizable compounds represented by the above formula (MO-1) to formula (MO-5), at least one of a plurality of R represents -OC(=O)CH=CH ₂ or -OC ( =O) C(CH ₃ )= group represented by CH ₂ . Specific examples of the radically polymerizable compound represented by the above formula (MO-1) to (MO-5) may be given in paragraph number 0248 to paragraph number 0251 of JP-A-2007-269779. The compounds described therein are preferably used in the present invention.

Further, in the case of the general formula (1) and the general formula (2), the polyfunctional alcohol described above is added to the polyfunctional alcohol, and then ethylene oxide or propylene oxide is added as described in Japanese Laid-Open Patent Publication No. Hei 10-62986 ( A methylated acrylated compound can also be used as a radically polymerizable compound.

The radically polymerizable compound is preferably dipentaerythritol triacrylate (commercially available as KAYARAD D-330; manufactured by Nippon Kayaku Co., Ltd.) and dipentaerythritol tetraacrylate (commercially available as Kaya) KAYARAD D-320; manufactured by Nippon Kayaku Co., Ltd.), dipentaerythritol penta (meth) acrylate (commercial product is KAYARAD D-310; manufactured by Nippon Kayaku Co., Ltd.) ), dipentaerythritol hexa(meth) acrylate (commercially available as KAYARAD DPHA; manufactured by Nippon Kayaku Co., Ltd.), and these (meth) acryloyl ruthenium-separated ethylene glycol The structure of the residue and the propylene glycol residue. These types of oligomers can also be used.

The radically polymerizable compound may be a polyfunctional monomer having an acid group such as a carboxyl group, a sulfonic acid group or a phosphoric acid group. The polyfunctional monomer having an acid group may, for example, be an ester of an aliphatic polyhydroxy compound and an unsaturated carboxylic acid, and preferably has a non-aromatic carboxylic anhydride reacting with an unreacted hydroxyl group of the aliphatic polyhydroxy compound to have an acid group. The functional monomer, particularly preferably the aliphatic polyhydroxy compound in the ester, is pentaerythritol and/or dipentaerythritol. Commercially available products include polybasic acid-modified acrylic oligomers M-510 and M-520 manufactured by Toagosei Co., Ltd., for example.

The polyfunctional monomer having an acid group may be used singly or in combination of two or more. The preferred acid value of the polyfunctional monomer having an acid group is from 0.1 mgKOH/g to 40 mgKOH/g, particularly preferably from 5 mgKOH/g to 30 mgKOH/g. When the acid value of the polyfunctional monomer is in the above range, it is excellent in production or handleability.

Further, as the radical polymerizable compound, a polyfunctional monomer having a caprolactone structure can also be used. The polyfunctional monomer having a caprolactone structure is not particularly limited as long as it has a caprolactone structure in its molecule, and examples thereof include ε-caprolactone-modified polyfunctional (meth)acrylate, which is ε- The lactone-modified polyfunctional (meth) acrylate is obtained by using trimethylolethane, di-trimethylolethane, trimethylolpropane, di-trimethylolpropane, pentaerythritol, dipentaerythritol A polyhydric alcohol such as tripentaerythritol, glycerin, diglycerin or trimethylol melamine is obtained by esterification with (meth)acrylic acid and ε-caprolactone. Among them, a polyfunctional monomer having a caprolactone structure represented by the following formula (B) is preferred.

General formula (B) [Chemical 5]

(In the formula, all of the six R groups are groups represented by the following formula (C), or one to five of the six R groups are groups represented by the following formula (C), and the rest are a group represented by the following formula (D))

General formula (C) [Chemical 6]

(wherein R ¹ represents a hydrogen atom or a methyl group, m represents a number of 1 or 2, and "*" represents a bond)

General formula (D) [Chem. 7]

(wherein R ¹ represents a hydrogen atom or a methyl group, and "*" represents a bond)

The polyfunctional monomer having such a caprolactone structure is commercially available, for example, as a KAYARAD DPCA series from Nippon Kayaku Co., Ltd., and may be exemplified by DPCA-20 (the above formula (B)~ In the general formula (D), m = 1, the number of groups represented by the formula (C) = 2, and all of R ¹ are a hydrogen atom), and DPCA-30 (the formula (B) to the formula (D) wherein m = 1, the number of groups represented by the formula (C) = 3, and all of R ¹ are a hydrogen atom), DPCA-60 (the formula (B) to the formula (D) Wherein m = 1, the number of groups represented by the formula (C) = 6, a compound in which all R ¹ are a hydrogen atom), and DPCA-120 (in the formula (B) to (D) m = 2, the number of groups represented by the formula (C) = 6, a compound in which all of R ¹ is a hydrogen atom), and the like. In the present invention, the polyfunctional monomer having a caprolactone structure may be used singly or in combination of two or more.

Further, the radically polymerizable compound is preferably at least one selected from the group consisting of compounds represented by the following formula (i) or formula (ii).

[化8]

In the general formula (i) and the general formula (ii), E independently represents -((CH ₂ ) _y CH ₂ O)- or -((CH ₂ ) _y CH(CH ₃ )O)-, y are each independently The ground represents an integer of 0 to 10, and X each independently represents a (meth)acrylylene group, a hydrogen atom or a carboxyl group. In the general formula (i), the total number of (meth)acrylonitrile groups is three or four, and m each independently represents an integer of from 0 to 10, and the total value of each of m is an integer of from 0 to 40. In the general formula (ii), the total of (meth)acrylonitrile groups is 5 or 6, and n each independently represents an integer of 0 to 10, and the total value of each n is an integer of 0 to 60.

In the formula (i), m is preferably an integer of 0 to 6, more preferably an integer of 0 to 4. Further, the total value of each m is preferably an integer of 2 to 40, more preferably an integer of 2 to 16, and particularly preferably an integer of 4 to 8. In the formula (ii), n is preferably an integer of 0 to 6, more preferably an integer of 0 to 4. Further, the total value of each n is preferably an integer of from 3 to 60, more preferably an integer of from 3 to 24, still more preferably an integer of from 6 to 12.

Further, -((CH ₂ ) _y CH ₂ O)- or -((CH ₂ ) _y CH(CH ₃ )O)- in the formula (i) or the formula (ii) is preferably on the oxygen atom side The end is bonded to the form of X.

In particular, it is preferred that all of the six X in the formula (ii) are in the form of an acrylonitrile group.

The compound represented by the formula (i) or (ii) can be synthesized by the following steps as a conventionally known step: subjecting ethylene oxide or propylene oxide to a ring-opening skeleton bond by performing a ring-opening addition reaction a step of binding to pentaerythritol or dipentaerythritol; and a step of introducing, for example, (meth)acrylofluorene chloride with a terminal hydroxyl group of the ring-opening skeleton to introduce a (meth)acrylonitrile group. Each step is a well-known step, and a compound represented by the formula (i) or the formula (ii) can be easily synthesized by those skilled in the art.

Among the compounds represented by the general formula (i) and the general formula (ii), a pentaerythritol derivative and/or a dipentaerythritol derivative are more preferable. Specific examples thereof include the compounds represented by the following formulas (a) to (f) (hereinafter also referred to as "exemplary compounds (a) to exemplified compounds (f)"), and preferred examples thereof are (a) and exemplified. Compound (b), exemplified compound (e), and exemplified compound (f).

[Chemistry 9]

[化10]

Commercial products of the radically polymerizable compound represented by the formula (i) and the formula (ii) include, for example, a tetrafunctional acrylate SR having four ethylene oxide chains manufactured by Sartomer Co., Ltd. -494, a hexafunctional acrylate DPCA-60 having six pentyloxy chains, three trifunctional acrylates TPA-330 having an extended isobutoxy chain, and the like, manufactured by Nippon Kayaku Co., Ltd.

In addition, the radically polymerizable compound is also preferably a Japanese Patent Publication No. Sho 48-41708, Japanese Patent Laid-Open No. Sho 51-37193, Japanese Patent Laid-Open No. 2-32293, and Japanese Patent Publication No. Hei 2-16765. The urethane amides as described in the above, or the Japanese Patent Publication No. Sho 58-49860, the Japanese Patent Publication No. Sho 56-17654, the Japanese Patent Publication No. Sho 62-39417, and the Japanese Patent Publication No. Sho 62-39418 A urethane compound having an ethylene oxide skeleton described in the publication. Further, an amine group structure or a thioether structure in the molecule described in Japanese Laid-Open Patent Publication No. Hei. No. Hei. No. Hei. No. Hei. No. Hei. The addition polymerizable monomer is a radical polymerizable compound. Commercial products of the radically polymerizable compound include urethane oligomer UAS-10, urethane oligomer UAB-140 (manufactured by Shanyang Guoce Pulp Co., Ltd.), and NK ester (NK Ester) M. -40G, NK Ester 4G, NK Ester A-9300, NK Ester M-9300, NK Ester A-TMMT, NK Ester A-DPH NK Ester A-BPE-4, UA-7200 (manufactured by Shin-Nakamura Chemical Co., Ltd.), DPHA-40H (manufactured by Nippon Kayaku Co., Ltd.), UA-306H, UA-306T, UA-306I, AH-600 , T-600, AI-600 (manufactured by Kyoeisha), Blemmer PME400 (manufactured by Nippon Oil Co., Ltd.), etc.

In the present invention, the radically polymerizable compound preferably has at least one of the partial structures represented by the following (P-1) to (P-4), and more preferably has the following ( Part of the structure represented by P-3). The * in the formula is a link key.

[11]

Specific examples of the radically polymerizable compound having the partial structure include trimethylolpropane tri(meth)acrylate, isocyanuric acid ethylene oxide modified di(meth)acrylate, and the like. Cyanuric acid ethylene oxide modified tris(meth)acrylate, triallyl isocyanurate, pentaerythritol tri(meth)acrylate, pentaerythritol tetra(meth)acrylate, dimethylolpropane IV (meth) acrylate, dipentaerythritol penta (meth) acrylate, dipentaerythritol hexa (meth) acrylate, tetramethylol methane tetra (meth) acrylate, etc., which can be preferably used in the present invention. Some radical polymerizable compounds.

The content of the case where the radically polymerizable compound is added to the temporarily-adhered adhesive of the present invention is temporarily fixed with respect to the solvent in terms of good adhesion, flatness, peeling property, and warpage. The content of the agent is preferably from 1% by mass to 50% by mass, more preferably from 1% by mass to 30% by mass, even more preferably from 5% by mass to 30% by mass. The radically polymerizable compound may be used alone or in combination of two or more. Further, the mass ratio of the elastomer to the radically polymerizable compound is preferably an elastomer: a radical polymerizable compound = 98:2 to 10:90, more preferably 95:5 to 30:70, most preferably 90:10. ~50:50. When the mass ratio of the elastomer and the radically polymerizable compound is in the above range, an adhesive layer excellent in adhesion, flatness, releasability, and warpage resistance can be formed.

<<<Antioxidant>>> The temporary fixing adhesive of the present invention may contain an antioxidant from the viewpoint of preventing degradation of the elastomer or gelation by oxidation during heating. As the antioxidant, a phenol-based antioxidant, a sulfur-based antioxidant, a phosphorus-based antioxidant, a lanthanoid antioxidant, an amine-based antioxidant, or the like can be used. Examples of the phenolic antioxidant include p-methoxyphenol and 2,6-di-t-butyl-4-methylphenol, and "Irganox 1010" manufactured by BASF. , "Irganox 1330", "Irganox 3114", "Irganox 1035", "Sumilizer MDP" by Sumitomo Chemical Co., Ltd. -S", "Sumilizer GA-80", etc. Examples of the sulfur-based antioxidant include 3,3'-thiodipropionate distearyl ester, "Sumilizer TPM" and "Sumilizer" manufactured by Sumitomo Chemical Co., Ltd. TPS", "Sumilizer TP-D" and so on. Examples of the phosphorus-based antioxidant include tris(2,4-di-t-butylphenyl)phosphite, bis(2,4-di-t-butylphenyl)pentaerythritol diphosphite, and poly( Dipropylene glycol) phenyl phosphite, diphenylisodecyl phosphite, 2-ethylhexyl diphenyl phosphite, triphenyl phosphite, BASF (BASF) Buddha (Irgafos) 168", "Irgafos 38" and so on. Examples of the lanthanoid antioxidant include p-benzoquinone, 2-tert-butyl-1,4-benzoquinone, and the like. Examples of the amine-based antioxidant include dimethylaniline or phenothiazine. The antioxidant is preferably IRGANOX 1010, Irganox 1330, 3,3'-thiodipropionate distearyl ester, Sumilizer TP-D, More preferably, it is Irganox 1010, Irganox 1330, and especially Irganox 1010. Further, among the antioxidants, a phenolic antioxidant is preferably used in combination with a sulfur-based antioxidant or a phosphorus-based antioxidant, and it is preferable to use a phenol-based antioxidant together with a sulfur-based antioxidant. In particular, when a polystyrene elastomer is used as the elastomer, it is preferred to use a phenolic antioxidant together with a sulfur-based antioxidant. By setting such a combination, the effect of suppressing the deterioration of the elastomer by the oxidation reaction can be expected to be efficiently performed. When a phenolic antioxidant and a sulfur-based antioxidant are used in combination, the quality of the phenolic antioxidant and the sulfur-based antioxidant is preferably a phenolic antioxidant: a sulfur-based antioxidant = 95:5 to 5:95, more preferably 25:75 ~ 75:25. The combination of antioxidants is preferably Irganox 1010 and Sumilizer TP-D, Irganox 1330 and Sumilizer TP-D, and Sumi Sumilizer GA-80 and Sumilizer TP-D, more preferably Irganox 1010 and Sumilizer TP-D, Irganox 1330 and Sumilizer TP-D, especially for Irganox 1010 and Sumilizer TP-D.

The molecular weight of the antioxidant is preferably 400 or more, more preferably 600 or more, and still more preferably 750 or more from the viewpoint of preventing sublimation during heating.

When the temporary adhesive agent contains an antioxidant, the content of the antioxidant is preferably 0.001% by mass to 20.0% by mass, and more preferably 0.005% by mass to 10.0% by mass based on the total solid content of the temporarily fixed adhesive. The antioxidant may be used alone or in combination of two or more. When the antioxidant is two or more, it is preferred that the total is in the above range.

[Other components] <<Polymer compound>> The temporary fixing agent of the present invention may contain a fluorine-based liquid compound as described above and a polymer compound other than the elastomer, in order to adjust the coating property. In addition, the coating property here means the uniformity of the film thickness after coating, or the film formation property after coating. In the present invention, any of the polymer compounds can be used. The polymer compound is a compound containing no polymerizable group. The weight average molecular weight of the polymer compound is preferably from 10,000 to 1,000,000, more preferably from 50,000 to 500,000, still more preferably from 100,000 to 300,000. Specific examples of the polymer compound include a hydrocarbon resin, a novolac resin, a phenol resin, an epoxy resin, a melamine resin, a urea resin, an unsaturated polyester resin, an alkyd resin, a polyimide resin, and a polyvinyl chloride resin. , polyvinyl acetate resin, Teflon (registered trademark), polyamide resin, polyacetal resin, polycarbonate resin, polyphenylene ether resin, polybutylene terephthalate resin, poly pair Ethylene phthalate resin, polyphenylene sulfide resin, polyfluorene resin, polyether oxime resin, polyarylate resin, polyetheretherketone resin, polyamidoximine resin, and the like. Among them, a hydrocarbon resin, a novolak resin, and a polyimine resin are preferable, and a hydrocarbon resin is more preferable. The polymer compound may be used in combination of two or more kinds as needed.

Any hydrocarbon resin can be used. The hydrocarbon resin means a resin containing substantially only carbon atoms and hydrogen atoms, but other atoms may be contained in the form of a side chain as long as the basic skeleton is a hydrocarbon resin. That is, in addition to a hydrocarbon resin containing only carbon atoms and hydrogen atoms, functional groups other than a hydrocarbon group such as an acrylic resin, a polyvinyl alcohol resin, a polyvinyl acetal resin, or a polyvinylpyrrolidone resin are directly bonded to the main group. The case of the chain is also included in the hydrocarbon resin of the present invention, and in this case, the content of the repeating unit in which the hydrocarbon group is directly bonded to the main chain with respect to all the repeating units of the resin is preferably 30 mol%. Ear percentage). Examples of the hydrocarbon resin satisfying the above conditions include terpene resin, terpene phenol resin, modified terpene resin, hydrogenated terpene resin, hydrogenated terpene phenol resin, rosin, rosin ester, hydrogenated rosin, hydrogenated rosin ester, and polymerization. Rosin, polymerized rosin ester, modified rosin, rosin modified phenol resin, alkyl phenol resin, aliphatic petroleum resin, aromatic petroleum resin, hydrogenated petroleum resin, modified petroleum resin, alicyclic petroleum resin, benzofuran Coumarone) petroleum resin, enamel petroleum resin, and the like. Among them, the hydrocarbon resin is preferably a terpene resin, a rosin, a petroleum resin, a hydrogenated rosin, a polymerized rosin, more preferably a terpene resin, a rosin, and more preferably a terpene resin or a rosin.

In the case where the temporary fixing agent of the present invention contains a polymer compound, the content of the polymer compound is preferably 5% by mass or more, more preferably 10% by mass or more, more preferably the total solid content of the temporarily fixed adhesive. It is 20% by mass or more. In addition, the upper limit of the content of the polymer compound is preferably 70% by mass or less, more preferably 60% by mass or less, further preferably 50% by mass or less, and particularly preferably 40% by mass based on the total solid content of the temporarily fixed adhesive. the following. Further, the temporarily fixed adhesive of the present invention may be configured to substantially exclude a polymer compound other than the fluorine-based liquid compound and the elastomer. The content of the polymer compound is preferably 1% by mass or less, more preferably 0.1% by mass or less, and further preferably not high, based on the total solid content of the temporarily fixed adhesive. Molecular compound.

<<Solvent>> The temporary fixing adhesive of the present invention preferably contains a solvent. In the case where the temporarily fixed adhesive of the present invention is formed into an adhesive layer by coating, it is preferred to formulate a solvent. As the solvent, a known solvent can be used without limitation, and an organic solvent is preferable. The organic solvent may preferably be exemplified by ethyl acetate, n-butyl acetate, isobutyl acetate, amyl formate, isoamyl acetate, isobutyl acetate, butyl propionate, isopropyl butyrate, butyrate B. Ester, butyl butyrate, methyl lactate, ethyl lactate, alkyl oxyacetate (eg methyl oxyacetate, ethyl oxyacetate, butyl oxyacetate (eg methyl methoxyacetate, A) Ethyl oxyacetate, butyl methoxyacetate, methyl ethoxyacetate, ethyl ethoxyacetate, etc.), alkyl 3-oxopropionate (eg methyl 3-oxypropionate) , 3-oxypropionic acid ethyl ester, etc. (for example, methyl 3-methoxypropionate, ethyl 3-methoxypropionate, methyl 3-ethoxypropionate, 3-ethoxypropionic acid Ester, etc.)), alkyl 2-oxopropionates (such as methyl 2-oxypropionate, ethyl 2-oxypropionate, propyl 2-oxypropionate, etc. (eg 2-methoxy) Methyl propyl propionate, ethyl 2-methoxypropionate, propyl 2-methoxypropionate, methyl 2-ethoxypropionate, ethyl 2-ethoxypropionate), 2- Methyl oxy-2-methylpropanoate and ethyl 2-oxy-2-methylpropanoate (eg 2-methoxy-2-methyl) Methyl ester, ethyl 2-ethoxy-2-methylpropionate, etc.), methyl pyruvate, ethyl pyruvate, propyl pyruvate, methyl acetate, ethyl acetate, 2- Esters such as methyl oxobutanoate, ethyl 2-oxobutanoate, 1-methoxy-2-propyl acetate; diethylene glycol dimethyl ether, tetrahydrofuran, ethylene glycol monomethyl ether, Ethylene glycol monoethyl ether, methyl cellosolve acetate, ethyl cellosolve acetate, diethylene glycol monomethyl ether, diethylene glycol monoethyl ether, diethylene glycol monobutyl ether, propylene glycol monomethyl Ethers such as ether, propylene glycol monomethyl ether acetate, propylene glycol monoethyl ether acetate, propylene glycol monopropyl ether acetate; methyl ethyl ketone, cyclohexanone, 2-heptanone, 3-heptanone, N- Ketones such as methyl-2-pyrrolidone and γ-butyrolactone; toluene, xylene, anisole, mesitylene, ethylbenzene, propylbenzene, cumene, n-butylbenzene, second Benzobenzene, isobutylbenzene, tert-butylbenzene, pentylbenzene, isoamylbenzene, (2,2-dimethylpropyl)benzene, 1-phenylhexane, 1-phenylheptane, 1-phenyloctane, 1-phenyldecane, 1-phenyldecane, cyclopropylbenzene, cyclohexylbenzene, 2-ethyltoluene 1,2-diethylbenzene, ortho-cymene, indoline, 1,2,3,4-tetrahydronaphthalene, 3-ethyltoluene, m-isopropyltoluene, 1, 3-diisopropylbenzene, 4-ethyltoluene, 1,4-diethylbenzene, p-isopropyltoluene, 1,4-diisopropylbenzene, 4-tert-butyltoluene, 1,4 -di-t-butylbenzene, 1,3-diethylbenzene, 1,2,3-trimethylbenzene, 1,2,4-trimethylbenzene, 4-tert-butyl-o-xylene 1,2,4-triethylbenzene, 1,3,5-triethylbenzene, 1,3,5-triisopropylbenzene, 5-tert-butyl-m-xylene, 3,5- Aromatic hydrocarbons such as di-t-butyltoluene, 1,2,3,5-tetramethylbenzene, 1,2,4,5-tetramethylbenzene, pentamethylbenzene; limonene, p-menthane, Hydrocarbons such as decane, decane, dodecane, and decahydronaphthalene.

From the viewpoint of improving the surface state of the coated surface, etc., it is preferable that these solvents are mixed in two or more forms. In this case, it is particularly preferred to be selected from the group consisting of mesitylene, tert-butylbenzene, 1,2,4-trimethylbenzene, p-menthane, γ-butyrolactone, anisole, 3-ethoxy Methyl propyl propionate, ethyl 3-ethoxypropionate, ethyl cellosolve acetate, ethyl lactate, diethylene glycol dimethyl ether, butyl acetate, methyl 3-methoxypropionate A mixed solution of two or more of 2-heptanone, cyclohexanone, ethyl carbitol acetate, butyl carbitol acetate, propylene glycol methyl ether, and propylene glycol methyl ether acetate.

When the solvent is temporarily fixed to the adhesive, the content of the solvent for temporarily fixing the adhesive is preferably from 5% by mass to 80% by mass based on the total solid content of the temporarily fixed adhesive. More preferably, the total solid content concentration is 5% by mass to 70% by mass, and particularly preferably the total solid content concentration is 10% by mass to 60% by mass. The solvent may be used alone or in combination of two or more. When the solvent is two or more, it is preferred that the total is in the above range.

<<Interfacial Active Agent>> The temporary fixing adhesive of the present invention preferably contains a surfactant. As the surfactant, any of an anionic, cationic, nonionic or amphoteric surfactant may be used, and a preferred surfactant is a nonionic surfactant. Preferable examples of the nonionic surfactant include polyoxyethylene higher alkyl ethers, polyoxyalkylene higher alkyl phenyl ethers, higher fatty acid diesters of polyoxyethylene glycol, and hydrazine. Ketone surfactant.

From the viewpoint of coatability, the temporarily fixed adhesive preferably contains an anthrone-based surfactant as a surfactant. In general, when a high-viscosity temporary fixing adhesive is used, it is difficult to apply a uniform thickness, but it is easy to apply a uniform thickness by containing an anthrone-based surfactant, and thus it can be used more preferably. Examples of the anthrone-based surfactants include, for example, JP-A-62-36663, JP-A-61-226746, JP-A-61-226745, and JP-A-62-170950. Japanese Patent Laid-Open No. Sho 63-34540, Japanese Patent Laid-Open No. Hei 7-230165, Japanese Patent Laid-Open No. Hei 8-62834, Japanese Patent Laid-Open No. Hei 9-54432, Japanese Patent Laid-Open No. Hei 9-5988, Japanese Patent Laid-Open Commercially available surfactants can also be used as the surfactant described in each of the publications of JP-A-2001-330953. Commercially available anthrone-based surfactants can be used, for example, KP-301, KP-306, KP-109, KP-310, KP-310B, KP-323, KP-326, KP-341, KP-104, KP. -110, KP-112, KP-360A, KP-361, KP-354, KP-355, KP-356, KP-357, KP-358, KP-359, KP-362, KP-365, KP-366 , KP-368, KP-369, KP-330, KP-650, KP-651, KP-390, KP-391, KP-392 (manufactured by Shin-Etsu Chemical Co., Ltd.).

When the temporary adhesive agent contains a surfactant, the content of the surfactant for temporarily fixing the adhesive is preferably 0.001% by mass based on the total solid content of the temporarily fixed adhesive. 5 mass%, more preferably 0.005 mass% to 1 mass%, still more preferably 0.01 mass% to 0.5 mass%. The surfactant may be used alone or in combination of two or more. When the amount of the surfactant is two or more, it is preferable that the total amount is the above range.

<<Other Additives>> The temporary fixing adhesive of the present invention may be formulated with various additives such as a hardener, a hardening catalyst, a decane coupling agent, a filler, or the like as long as the effects of the present invention are not impaired. Adhesion promoter, UV absorber, anti-agglomerating agent, etc. In the case of disposing these additives, the total amount of the additives is preferably 3% by mass or less based on the total solid content of the temporarily fixed adhesive.

The temporarily fixed adhesive of the present invention preferably contains no impurities such as metal. The content of the impurities contained in the materials is preferably 1 ppm or less, more preferably 100 ppt or less, further preferably 10 ppt or less, and particularly preferably substantially no impurities (below the detection limit of the measuring device). A method of removing impurities such as metals from the temporarily fixed adhesive can be exemplified by filtration using a filter. The filter pore size is preferably a pore size of 10 nm or less, more preferably 5 nm or less, and further preferably 3 nm or less. The material of the filter is preferably a filter made of polytetrafluoroethylene, polyethylene or nylon. The filter can also use a filter that has been previously cleaned with an organic solvent. In the filter filtration step, a plurality of filters may be connected in series or in parallel. When using a variety of filters, it is also possible to combine filters with different apertures and/or materials. In addition, various materials may be filtered multiple times, and the step of filtering a plurality of times may also be a circulation filtration step. In addition, a method of reducing impurities such as a metal contained in the adhesive for temporary fixation may be as follows: a raw material having a small metal content is selected as a raw material constituting a temporarily fixed adhesive; a raw material constituting a temporarily fixed adhesive is subjected to filter filtration; and polytetrafluoroethylene is used. A method in which ethylene or the like is lining in a device to perform distillation under conditions where contamination is suppressed as much as possible. The preferred conditions for filter filtration of the raw materials constituting the temporarily fixed adhesive are the same as those described above. In addition to filter filtration, impurity removal using adsorbent materials can also be performed, and filter filtration can also be used in combination with adsorbent materials. As the adsorbent, a known adsorbent can be used. For example, an inorganic adsorbent such as silica gel or zeolite or an organic adsorbent such as activated carbon can be used.

<Application of Temporary Fixing Adhesive> The temporarily fixed adhesive of the present invention can form an adhesive layer excellent in adhesiveness and releasability. Therefore, for example, when mechanical processing or chemical processing is performed on the component wafer, the component wafer and the support can be stably followed, and the temporary bonding of the component wafer can be easily released, which can be preferably used as a semiconductor device. Temporary fixed adhesive for manufacturing.

<Following Film> Next, the adhesive film of the present invention will be described. The adhesive film of the present invention has an adhesive layer containing the fluorine-based liquid compound and the elastomer described above. The subsequent layer preferably contains the elastomer A and the elastomer B described above as an elastomer. Further, the adhesive layer preferably contains the radical polymerizable compound described above. The adhesive layer can be formed using the temporarily fixed adhesive of the present invention as described above. In the adhesive film of the present invention, the fluorine-based liquid compound is biased to the surface layer of the adhesive layer. Therefore, the peeling property is excellent. Further, since the adhesive layer contains an elastomer, it also follows the fine unevenness of the support or the substrate, and excellent adhesion can be obtained by an appropriate fixing effect. Therefore, it is possible to have both adhesiveness and peelability. In the adhesive film of the present invention, the adhesive layer preferably has a concentration of the fluorine-based liquid compound from a surface of the adhesive layer in a range of 5% of the thickness of the adhesive layer, and more than 5% and 50 in the thickness direction. The range of % ranges is different. The concentration of the fluorine-based liquid compound in the layer can be measured by, for example, X-ray photoelectron spectroscopy (Electron Spectroscopy for Chemical Analysis (ESCA)) while performing etching, or A method of combining tilt cutting with Time of Flight-Secondary Ion Mass Spectrometry (TOF-SIMS) measurement.

In the adhesive film of the present invention, the solvent content is preferably 1% by mass or less, more preferably 0.1% by mass or less, and particularly preferably no solvent. Further, the solvent content of the film can be measured by gas chromatography.

In the adhesive film of the present invention, the average thickness of the adhesive layer is not particularly limited, and is, for example, preferably 0.1 μm to 500 μm, more preferably 0.1 μm to 200 μm, still more preferably 10 μm to 200 μm, still more preferably 50 μm. ~200 μm. When the average thickness of the adhesive layer is in the above range, it is easy to form an adhesive film having excellent flatness. In the present invention, the average thickness of the subsequent layer is defined as the average value of the points measured by the ellipsometer at 5 points.

The adhesive film of the present invention may be formed with a release layer on one or both sides of the adhesive layer. The average thickness of the release layer is preferably from 0.001 μm to 1 μm, more preferably from 0.01 μm to 0.5 μm. If it is the said range, a film has a moderate adhesive force, and adhesiveness with a base material or a support body is favorable, and an adhesive film can be peeled easily from a base material or a support body easily. Further, in the present invention, the average thickness of the release layer is defined as the average value of the points measured by the ellipsometer at five points.

The release layer preferably contains a compound containing at least one selected from the group consisting of a fluorine atom and a ruthenium atom, and more preferably contains a fluorine-based decane coupling agent. The fluorine content of the release layer is preferably from 30% by mass to 80% by mass, more preferably from 40% by mass to 76% by mass, even more preferably from 60% by mass to 75% by mass. The fluorine content rate is defined by "{(the number of fluorine atoms in one molecule x the mass of the fluorine atom) / the mass of all atoms in one molecule} x 100". Further, the release layer preferably contains 10% by mass to 100% by mass of a compound containing at least one selected from the group consisting of a fluorine atom and a ruthenium atom, more preferably 50% by mass to 100%, based on the total solid content of the release layer. quality%. From the viewpoint of heat resistance, the release layer is preferably a three-dimensional crosslinked product containing a fluorine atom. Among them, a three-dimensional crosslinked product of a fluorine-containing polyfunctional monomer/oligomer or a three-dimensional crosslinked product of a fluorine-containing decane coupling agent is preferred, and a three-dimensional crosslinked product of a fluorine-containing decane coupling agent is particularly preferred. The fluorine-containing decane coupling agent is preferably a non-halogen decane coupling agent which is dangerous to the human body and has low metal corrosion, and is preferably a fluorine-containing alkoxy decane. Commercially available products include Optools DAC-HP and Optools DSX manufactured by Daikin Industries, Inc. Further, examples of the halogen-based decane coupling agent include a chlorochloromethane compound.

In the present invention, the release layer may contain a polymer compound having a fluorine-containing atom and a non-three-dimensional crosslinked structure. The non-three-dimensional crosslinked structure means that the ratio of the crosslinked structure which does not contain a crosslinked structure or forms a three-dimensional crosslinked structure to all crosslinked structures in the compound is 5% or less, preferably 1% or less. . It is preferred to substantially contain a three-dimensional crosslinked structure. As the polymer compound having a non-three-dimensional crosslinked structure of a fluorine atom, a polymer containing one or two or more kinds of fluorine-containing monofunctional monomers can be preferably used. More specifically, at least one fluorine-containing resin or the like selected from the group consisting of tetrafluoroethylene, hexafluoropropylene, tetrafluoroethylene oxide, hexafluoropropylene oxide, perfluoroalkyl vinyl ether, and chlorotrifluoroethylene may be mentioned. a homopolymer of one or two or more fluorine-containing monofunctional monomers of vinylidene fluoride, a perfluoroalkyl group-containing (meth) acrylate or a copolymer of the monomers, a fluorine-containing monofunctional single A copolymer of one or two or more kinds of a copolymer with ethylene, one or two or more kinds of fluorine-containing monofunctional monomers and chlorotrifluoroethylene.

The polymer compound having a non-three-dimensional crosslinked structure of a fluorine atom is preferably a perfluoroalkyl group-containing (meth)acrylic resin synthesized from a perfluoroalkyl group-containing (meth) acrylate. Specifically, the perfluoroalkyl group-containing (meth) acrylate is preferably a compound represented by the following formula (101).

Formula (101) [Chem. 12]

In the formula (101), R ¹⁰¹ , R ¹⁰² and R ¹⁰³ each independently represent a hydrogen atom, an alkyl group or a halogen atom. Y ¹⁰¹ represents a single bond or a divalent linking group selected from the group consisting of -CO-, -O-, -NH-, a divalent aliphatic group, a divalent aromatic group, and a combination of these groups. Rf is a fluorine atom or a monovalent organic group containing at least one fluorine atom.

In the formula (101), examples of the alkyl group represented by R ¹⁰¹ , R ¹⁰² and R ¹⁰³ are preferably an alkyl group having 1 to 8 carbon atoms, and examples thereof include a methyl group, an ethyl group, a propyl group and an octyl group. Isopropyl, tert-butyl, isopentyl, 2-ethylhexyl, 2-methylhexyl, cyclopentyl and the like. The aryl group is preferably an aryl group having 6 to 12 carbon atoms, and examples thereof include a phenyl group, a 1-naphthyl group, and a 2-naphthyl group. Among them, R ¹⁰¹ to R ^{103 are} preferably a hydrogen atom or a methyl group.

Y ¹⁰¹ represents a single bond or a divalent linking group selected from the group consisting of -CO-, -O-, -NH-, a divalent aliphatic group, a divalent aromatic group, and a combination of such groups, For a divalent aliphatic group, the chain structure is superior to the ring structure, and thus the linear structure is superior to the chain structure having branches. The number of carbon atoms of the divalent aliphatic group is preferably from 1 to 20, more preferably from 1 to 15, still more preferably from 1 to 12, still more preferably from 1 to 10, still more preferably from 1 to 8, more preferably 1 ~4. Examples of the divalent aromatic group include a phenylene group, a substituted phenylene group, a naphthyl group, and a substituted naphthyl group, and a phenyl group is preferred. Y ^{101 is} preferably a divalent linear aliphatic structure.

The monovalent organic group of the fluorine atom represented by Rf is not particularly limited, but is preferably a fluorine-containing alkyl group having 1 to 30 carbon atoms, more preferably 1 to 20 carbon atoms, still more preferably a carbon number of 1 to 15 carbon atoms. Fluoroalkyl. The fluorine-containing alkyl group may be a linear chain such as -CF ₂ CF ₃ , -CH ₂ (CF ₂ ) ₄ H, -CH ₂ (CF ₂ ) ₈ CF ₃ , -CH ₂ CH ₂ (CF ₂ ) ₄ H, or the like. }, may also have a branched structure {eg, -CH(CF ₃ ) ₂ , -CH ₂ CF(CF ₃ ) ₂ , -CH(CH ₃ )CF ₂ CF ₃ , -CH(CH ₃ )(CF ₂ ) ₅ CF ₂ H et al., additionally having an alicyclic structure (preferably a 5-membered ring or a 6-membered ring, such as a perfluorocyclohexyl group, a perfluorocyclopentyl group or an alkyl group substituted with the groups), May have an ether linkage (eg, -CH ₂ OCH ₂ CF ₂ CF ₃ , -CH ₂ CH ₂ OCH ₂ C ₄ F ₈ H, -CH ₂ CH ₂ OCH ₂ CH ₂ C ₈ F ₁₇ , -CH ₂ CF ₂ OCF ₂ CF ₂ OCF ₂ CF ₂ H, etc.). Alternatively, it may be a perfluoroalkyl group.

Specifically, the perfluoroalkyl group-containing (meth)acrylic resin contains a repeating unit represented by the following formula (102). Formula (102) [Chem. 13]

In the formula (102), R ¹⁰¹ , R ¹⁰² , R ¹⁰³ , Y ¹⁰¹ and Rf have the same meanings as in the formula (101), respectively, and preferred embodiments have the same meanings.

From the viewpoint of the releasability, the perfluoroalkyl group-containing (meth)acrylic resin can be arbitrarily selected in addition to the perfluoroalkyl group-containing (meth) acrylate. Examples of the radically polymerizable compound which can form a copolymerization component include, for example, acrylates, methacrylates, N,N-disubstituted acrylamides, and N,N-disubstituted methacrylamides. A radically polymerizable compound in styrene, acrylonitrile, methacrylonitrile or the like.

More specifically, for example, acrylates such as alkyl acrylate (the alkyl group preferably has 1 to 20 carbon atoms) (for example, methyl acrylate, ethyl acrylate, propyl acrylate, butyl acrylate, acrylic acid) Amyl ester, ethylhexyl acrylate, octyl acrylate, trioctyl acrylate, chloroethyl acrylate, 2,2-dimethylhydroxypropyl acrylate, 5-hydroxypentyl acrylate, trimethylolpropane Monoacrylate, pentaerythritol monoacrylate, glycidyl acrylate, benzyl acrylate, methoxybenzyl acrylate, decyl acrylate, tetrahydrofurfuryl acrylate, etc.), aryl acrylate (eg phenyl acrylate, etc.), A A methacrylate such as an alkyl acrylate (the alkyl group preferably has 1 to 20 carbon atoms) (for example, methyl methacrylate, ethyl methacrylate, propyl methacrylate, isopropyl methacrylate) Ester, amyl methacrylate, hexyl methacrylate, cyclohexyl methacrylate, benzyl methacrylate, benzyl chloride methacrylate, octyl methacrylate, 4-hydroxybutyl methacrylate, Methacrylic acid-5 -hydroxypentyl ester, 2,2-dimethyl-3-hydroxypropyl methacrylate, trimethylolpropane monomethacrylate, pentaerythritol monomethacrylate, glycidyl methacrylate, methyl Ethyl acrylate, tetrahydrofurfuryl methacrylate, etc., aryl methacrylate (such as phenyl methacrylate, toluene methacrylate, naphthyl methacrylate, etc.), styrene, alkyl styrene, etc. Styrene (eg methyl styrene, dimethyl styrene, trimethyl styrene, ethyl styrene, diethyl styrene, isopropyl styrene, butyl styrene, hexyl styrene, cyclohexyl benzene Ethylene, mercaptostyrene, benzylstyrene, chloromethylstyrene, trifluoromethylstyrene, ethoxymethylstyrene, ethoxymethylmethylstyrene, etc., alkoxystyrene For example, methoxystyrene, 4-methoxy-3-methylstyrene, dimethoxystyrene, etc.), halogen styrene (such as chlorostyrene, dichlorostyrene, trichlorostyrene, tetrachloro Styrene, pentachlorostyrene, bromostyrene, dibromostyrene, iodine styrene, fluorostyrene Free radical polymerization of trifluorostyrene, 2-bromo-4-trifluoromethylstyrene, 4-fluoro-3-trifluoromethylstyrene, etc., acrylonitrile, methacrylonitrile, acrylic acid, carboxylic acid Compound (acrylic acid, methacrylic acid, itaconic acid, crotonic acid, methacrylic acid, maleic acid, p-carboxystyrene, metal salts of these acid groups, ammonium salt compounds, etc.), from the viewpoint of peelability Particularly preferred is a (meth) acrylate having a hydrocarbon group having 1 to 24 carbon atoms, and examples thereof include methyl ester, butyl ester, 2-ethylhexyl ester, lauryl ester, and stearyl ester of (meth)acrylic acid. A glycidyl ester or the like is preferably a (meth) acrylate, particularly an acrylate, of a higher alcohol such as 2-ethylhexyl ester, lauryl ester or stearyl ester.

A commercially available product can also be used as the polymer compound having a non-three-dimensional crosslinked structure of a fluorine atom. For example, Teflon (registered trademark) (Dupont), Tefzel (Dupont), Fluon (Asahi Glass), and Hara ( Halar) (Solvay Solexis), Hylar (Solvay Solexis), Lumiflon (Asahi Glass), Afra Aflas (Asahi Glass), Cytop (Asahi Glass), Cefral Soft (Central Glass), Cefral Coat ) (Central Glass) and other fluororesins, Viton (Dupont), Kalrez (Dupont), SIFEL (Shin-Etsu Chemical) Industrial companies and other trade names of fluororubbers, such as Krytox (Dupont), Fomblin (Daitokutech), and Demnum ( Big metal work (Daikin Industries), etc. All kinds of fluorocarbon oils represented by perfluoropolyether oils, or Daifree FB series (Daikin Industries) and Megafac series (Di Aisheng ( DIC) company), etc., a fluorine-containing release agent such as a brand name.

The polystyrene-equivalent weight average molecular weight obtained by the gel permeation chromatography (GPC) method of the polymer compound having a non-three-dimensional crosslinked structure of a fluorine atom is preferably from 100,000 to 2,000, more preferably from 50,000 to 2,000, most preferably It is 10,000 to 2,000.

From the viewpoint of good releasability, the content of the polymer compound having a non-three-dimensional crosslinked structure of fluorine atom in the release layer is preferably from 1% by mass to 99% by mass based on the total solid content of the release layer. More preferably, it is 3% by mass to 95% by mass, and further preferably 5% by mass to 90% by mass. The ratio (mass ratio) of the three-dimensional crosslinked product of the fluorine-containing atom in the release layer to the polymer compound having a non-three-dimensional crosslinked structure of a fluorine atom is preferably from 5:95 to 50:50, more preferably 10:90. ~40:60, and then 15:85~30:70. The polymer compound having a non-three-dimensional crosslinked structure of a fluorine atom may be used alone or in combination of two or more. In the case of two or more kinds, it is preferable to add up to the above range.

The release layer can be formed using a composition containing a mold release component (a composition for forming a release layer). The mold release component is preferably a material containing at least one selected from the group consisting of a fluorine atom and a ruthenium atom. The material containing at least one selected from the group consisting of a fluorine atom and a ruthenium atom may, for example, be a polymerizable monomer having a fluorine atom or a ruthenium atom. More preferably, it is a fluorine-based decane coupling agent. The content of the mold release component is preferably from 5% by mass to 100% by mass, and more preferably from 50% by mass to 100% by mass based on the total solid content of the composition for forming a release layer, from the viewpoint of good detachability. Further preferably, it is 90% by mass to 100% by mass.

<<<Polymerizable monomer having a fluorine atom or a ruthenium atom>>> The polymerizable monomer having a fluorine atom or a ruthenium atom is preferably a radical polymerizable single containing one or more fluorine atoms or ruthenium atoms in one molecule. The polymer or oligomer is preferably a polymerizable monomer having a group generally called a perfluoro group having two or more fluorine atoms in one molecule.

The radically polymerizable monomer or oligomer having a fluorine atom or a ruthenium atom has a radical polymerizable functional group, and the radical polymerizable functional group is not particularly limited, and is preferably an unsaturated group (ethylenically unsaturated bond group, etc.) ).

The radical polymerizable monomer or oligomer having a fluorine atom or a ruthenium atom preferably has two or more radical polymerizable functional groups, whereby the process at a high temperature can be further improved in the manufacturing process of the device. Post-detachability from the component wafer.

<<<<Polymerizable monomer having a fluorine atom>>>> The polymerizable monomer having a fluorine atom can be selected from known monomers, preferably a monomer having a polymerizable group, more preferably a fluorine-based decane. Coupling agent. Examples of the polymerizable group include a decyl group having a hydroxyl group or a hydrolyzable group (for example, an alkoxyalkyl group, a decyloxyalkyl group, etc.), a group having a reactive unsaturated double bond ((meth) propylene). a mercapto group, an allyl group, a vinyloxy group, etc.), a ring-opening polymerization reactive group (epoxy group, oxetanyl group, oxazolyl group, etc.), a group having an active hydrogen atom (for example, a hydroxyl group, a carboxyl group, an amine group) A group such as an amino group, an aminomethyl group, a fluorenyl group, a β-ketoester group, a hydroalkylene group or a decyl alcohol group, an acid anhydride group or a group which may be substituted by a nucleophilic agent (active halogen atom, sulfonate or the like).

The radically polymerizable monomer having a fluorine atom is preferably a compound represented by the following formula (I). General formula (I): Rf{-LY} _n (wherein Rf represents a chain or cyclic n-valent group containing at least a carbon atom and a fluorine atom, and may contain either an oxygen atom or a hydrogen atom; n represents an integer of 2 or more. L represents a single bond or a divalent linking group. Y represents a polymerizable group)

In the above formula (I), Y is a polymerizable group, and for example, a decyl group having a hydroxyl group or a hydrolyzable group (e.g., an alkoxyalkyl group, a decyloxyalkyl group, etc.) is preferred, and the reactivity is not a group having a saturated double bond ((meth)acryloyl group, allyl group, vinyloxy group, etc.), a ring-opening polymerization reactive group (epoxy group, oxetanyl group, oxazolyl group, etc.), active a group of a hydrogen atom (e.g., a hydroxyl group, a carboxyl group, an amine group, an amine carbaryl group, a fluorenyl group, a β-ketoester group, a hydrodecyl group, a decyl alcohol group, etc.), an acid anhydride group, a group which may be substituted by a nucleophilic agent (activity A halogen atom, a sulfonate, etc.).

More preferably, Y represents a radical polymerizable group, and further preferably a group having a reactive unsaturated double bond. Specifically, Y is preferably a radical polymerizable functional group represented by the following formula (9).

[Chemistry 14] (In the formula (9), R ⁹⁰¹ to R ⁹⁰³ each independently represent a hydrogen atom, an alkyl group or an aryl group. The dotted line indicates a bond to a group bonded to L)

The alkyl group is preferably an alkyl group having 1 to 8 carbon atoms, and examples thereof include a methyl group, an ethyl group, a propyl group, an octyl group, an isopropyl group, a tert-butyl group, an isopentyl group, and a 2-ethylhexyl group. 2-methylhexyl, cyclopentyl and the like. The aryl group is preferably an aryl group having 6 to 12 carbon atoms, and examples thereof include a phenyl group, a 1-naphthyl group, and a 2-naphthyl group. Among them, R ⁹⁰¹ to R ^{903 are} preferably a hydrogen atom or a methyl group. L represents a single bond or a divalent linking group. The divalent linking group represents a divalent aliphatic group, a divalent aromatic group, -O-, -S-, -CO-, -N(R)-, and a divalent combination of two or more of these groups. Linkage base. Wherein R represents a hydrogen atom or an alkyl group having 1 to 5 carbon atoms. In the case where L has an alkyl group or an aryl group, the alkyl group and the aryl group are preferably substituted by a halogen atom, more preferably by a fluorine atom. Rf represents a chain or cyclic n-valent group containing at least a carbon atom and a fluorine atom, and may contain either an oxygen atom or a hydrogen atom. Rf may also be a linear or branched polymer structure containing a repeating unit having a fluorine atom.

Such a monomer having a fluorine atom can also preferably be used in the specification of the present application, which is described in Paragraph No. 0019 to Paragraph No. 0033 of JP-A-2011-48358.

Further, the radically polymerizable monomer having a fluorine atom is preferably selected from the following structural formula (1), structural formula (2), structural formula (3), structural formula (4), and structural formula (5). At least one of the compounds represented.

CH ₂ =CR ¹ COOR ² R ^f ··· Structural Formula (1) (In the structural formula (1), R ¹ represents a hydrogen atom or a methyl group. R ² represents -C _p H _2p -, -C(C _p H _{2p + 1} )H-, -CH ₂ C(C _p H _{2p + 1} )H- or -CH ₂ CH ₂ O-. R ^f represents -C _n F _{2n + 1} , -(CF ₂ ) _n H, - C _n F _{2n + 1} -CF ₃ , -(CF ₂ ) _p OC _n H _2n C _i F _{2i + 1} , -(CF ₂ ) _p OC _m H _2m C _i F _2i H, -N(C _p H _{2p + 1} ) COC _n F _{2n + 1} or -N(C _p H _{2p + 1} )SO ₂ C _n F _{2n + 1} wherein p represents an integer of 1 to 10, n represents an integer of 1 to 16, and m represents 0. An integer of ～10, i represents an integer from 0 to 16)

CF ₂ =CFOR ^g ··· Structural formula (2) (In the structural formula (2), R ^g represents a fluoroalkyl group having 1 to 20 carbon atoms)

CH ₂ =CHR ^g ··· Structural formula (3) (In the structural formula (3), R ^g represents a fluoroalkyl group having 1 to 20 carbon atoms)

CH ₂ =CR ³ COOR ⁵ R ^j R ⁶ OCOCR ⁴ =CH ₂ ···· Structural Formula (4) (In the structural formula (4), R ³ and R ⁴ represent a hydrogen atom or a methyl group. R ⁵ and R ⁶ represent -C _q H _2q -, -C(C _q H _{2q + 1} )H-, -CH ₂ C(C _q H _{2q + 1} )H- or -CH ₂ CH ₂ O-, R ^j represents -C _t F _2t. q is an integer from 1 to 10, and t is an integer from 1 to 16)

CH ₂ =CHR ⁷ COOCH ₂ (CH ₂ R ^k )CHOCOCR ⁸ =CH ₂ ···· Structural Formula (5) (In Structural Formula (5), R ⁷ and R ⁸ represent a hydrogen atom or a methyl group. R ^k is - CyF _{2y + 1} .y is an integer from 1 to 16)

Examples of the monomer represented by the formula (1) include CF ₃ (CF ₂ ) ₅ CH ₂ CH ₂ OCOCH=CH ₂ , CF ₃ CH ₂ OCOCH=CH ₂ , and CF ₃ (CF ₂ ) ₄ CH ₂ CH _{2 .} OCOC(CH ₃ )=CH ₂ , C ₇ F ₁₅ CON(C ₂ H ₅ )CH ₂ OCOC(CH ₃ )=CH ₂ , CF ₃ (CF ₂ ) ₇ SO ₂ N(CH ₂ )CH ₂ CH ₂ OCOCH =CH ₂ , CF ₂ (CF ₂ ) ₇ SO ₂ N(C ₃ H ₇ )CH ₂ CH ₂ OCOCH=CH ₂ , C ₂ F ₅ SO ₂ N(C ₃ H ₇ )CH ₂ CH ₂ OCOC(CH ₃ )=CH ₂ , (CF ₃ ) ₂ CF(CF ₂ ) ₆ (CH ₂ ) ₃ OCOCH=CH ₂ , (CF ₃ ) ₂ CF(CF ₂ ) ₁₀ (CH ₂ ) ₃ OCOC(CH ₃ )=CH ₂ , CF ₃ (CF ₂ ) ₄ CH(CH ₃ )OCOC(CH ₃ )=CH ₂ , CF ₃ CH ₂ OCH ₂ CH ₂ OCOCH=CH ₂ , C ₂ F ₅ (CH ₂ CH ₂ O) ₂ CH ₂ OCOCH =CH ₂ , (CF ₃ ) ₂ CFO(CH ₂ ) ₅ OCOCH=CH ₂ , CF ₃ (CF ₂ ) ₄ OCH ₂ CH ₂ OCOC(CH ₃ )=CH ₂ , C ₂ F ₅ CON(C ₂ H ₅ CH ₂ OCOCH=CH ₂ , CF ₃ (CF ₂ ) ₂ CON(CH ₃ )CH(CH ₃ )CH ₂ OCOCH=CH ₂ , H(CF ₂ ) ₆ C(C ₂ H ₅ )OCOC(CH ₃ ) =CH ₂ , H(CF ₂ ) ₈ CH ₂ OCOCH=CH ₂ , H(CF ₂ ) ₄ CH ₂ OCOCH=CH ₂ , H(CF ₂ )CH ₂ OCOC(CH ₃ )=CH ₂ , CF ₃ (CF ₂ ) ₇ SO ₂ N(CH ₃ )CH ₂ CH ₂ OCOC(CH ₃ )=CH ₂ , CF ₃ (CF ₂ ) ₇ SO ₂ N(CH ₃ )(CH ₂ ) ₁₀ OCO CH=CH ₂ , C ₂ F ₅ SO ₂ N(C ₂ H ₅ )CH ₂ CH ₂ OCOC(CH ₃ )=CH ₂ , CF ₃ (CF ₂ ) ₇ SO ₂ N(CH ₃ )(CH ₂ ) ₄ OCOCH=CH ₂ , C ₂ F ₅ SO ₂ N(C ₂ H ₅ )C(C ₂ H ₅ )HCH ₂ OCOCH=CH ₂ and the like. These monomers may be used alone or in combination of two or more.

Examples of the fluoroalkylated olefin represented by the structural formula (2) or the structural formula (3) include C ₃ F ₇ CH=CH ₂ , C ₄ F ₉ CH=CH ₂ , C ₁₀ F ₂₁ CH=CH ₂ , C ₃ F ₇ OCF=CF ₂ , C ₇ F ₁₅ OCF=CF ₂ , C ₈ F ₁₇ OCF=CF ₂ and the like.

The monomer represented by the structural formula (4) or the structural formula (5) may, for example, be CH ₂ =CHCOOCH ₂ (CF ₂ ) ₃ CH ₂ OCOCH=CH ₂ , CH ₂ =CHCOOCH ₂ (CF ₂ ) ₆ CH ₂ OCOCH =CH ₂ , CH ₂ =CHCOOCH ₂ CH(CH ₂ C ₈ F ₁₇ )OCOCH=CH ₂ and the like.

Further, as the radical polymerizable monomer or oligomer having a fluorine atom, an oligomer containing a repeating unit having a fluorine atom and a repeating unit having a radical polymerizable functional group can also be preferably used.

The repeating unit having a fluorine atom is preferably selected from at least one of the repeating units represented by the following formula (6), formula (7), and formula (10). [化15]

In the formula (6), R ¹ , R ² , R ³ and R ⁴ each independently represent a hydrogen atom, a halogen atom, a hydroxyl group or a monovalent organic group, and at least one of R ¹ , R ² , R ³ and R ⁴ is A fluorine atom or a monovalent organic group having a fluorine atom. In the formula (7), R ⁵ , R ⁶ and R ⁷ each independently represent a hydrogen atom, a halogen atom, a hydroxyl group or a monovalent organic group, and Y1 represents a single bond or is selected from -CO-, -O-, -NH-, A divalent linking group in a group consisting of a divalent aliphatic group, a divalent aromatic group, and a combination of these groups. Rf represents a fluorine atom or a monovalent organic group having a fluorine atom. In the formula (10), R ⁸ , R ⁹ , R ¹⁰ , R ¹¹ , R ¹² and R ¹³ each independently represent a hydrogen atom, a halogen atom, a hydroxyl group or a monovalent organic group, and Y ² and Y ³ represent a single bond or a selected one. A divalent linking group in a group consisting of free-CO-, -O-, -NH-, a divalent aliphatic group, a divalent aromatic group, and a combination of such groups. Rf represents a divalent organic group having a fluorine atom.

The monovalent organic group having a fluorine atom in the formulae (6) and (7) is not particularly limited, and is preferably a fluorine-containing alkyl group having 1 to 30 carbon atoms, more preferably 1 to 20 carbon atoms, particularly preferably A fluorine-containing alkyl group having 1 to 15 carbon atoms. The fluorine-containing alkyl group may be linear (for example, -CF ₂ CF ₃ , -CH ₂ (CF ₂ ) ₄ H, -CH ₂ (CF ₂ ) ₈ CF ₃ , -CH ₂ CH ₂ (CF ₂ ) ₄ H, or the like. ), may also have a branched structure (for example, -CH(CF ₃ ) ₂ , -CH ₂ CF(CF ₃ ) ₂ , -CH(CH ₃ )CF ₂ CF ₃ , -CH(CH ₃ )(CF ₂ ) ₅ CF ₂ H or the like), which may additionally have an alicyclic structure (preferably a 5-membered ring or a 6-membered ring, such as a perfluorocyclohexyl group, a perfluorocyclopentyl group or an alkyl group substituted with the groups), May contain an ether linkage (eg, -CH ₂ OCH ₂ CF ₂ CF ₃ , -CH ₂ CH ₂ OCH ₂ C ₄ F ₈ H, -CH ₂ CH ₂ OCH ₂ CH ₂ C ₈ F ₁₇ , -CH ₂ CF ₂ OCF ₂ CF ₂ OCF ₂ CF ₂ H, etc.). Alternatively, it may be a perfluoroalkyl group.

The divalent organic group having a fluorine atom in the formula (10) is not particularly limited, and is preferably a fluorine-containing alkylene group having 1 to 30 carbon atoms, more preferably 1 to 20 carbon atoms, still more preferably 1 to 20 carbon atoms. 15 fluorine-containing alkylene group. The fluorine-containing alkyl group may be linear (for example, -CF ₂ CF ₂ -, -CH ₂ (CF ₂ ) ₄ -, -CH ₂ (CF ₂ ) ₈ CF ₂ -, -CH ₂ CH ₂ (CF ₂ ) ₄ -etc.), may also have a branched structure (for example -CH(CF ₃ )CF ₂ -, -CH ₂ CF(CF ₃ )CF ₂ -, -CH(CH ₃ )CF ₂ CF ₂ -, -CH(CH ₃ ) (CF ₂ ) ₅ CF ₂ -etc.), or may have an alicyclic structure (preferably a 5-membered ring or a 6-membered ring, such as perfluorocyclohexyl, perfluorocyclopentyl or via these groups) The linking group of the group-substituted alkyl group or the like may also contain an ether bond (for example, -CH ₂ OCH ₂ CF ₂ CF ₂ -, -CH ₂ CH ₂ OCH ₂ C ₄ F ₈ -, -CH ₂ CH ₂ OCH ₂ CH ₂ C ₈ F ₁₆ -, -CH ₂ CF ₂ OCF ₂ CF ₂ OCF ₂ CF ₂ -, -CH ₂ CF ₂ OCF ₂ CF ₂ OCF ₂ CF ₂ -, polyperfluoroalkylene ether chain, etc.). Further, it may be a perfluoroalkylene group.

The monovalent organic group in the formula (6), the formula (7), and the formula (10) is preferably an organic group composed of a trivalent to ten-valent non-metal atom, and examples thereof include those selected from one to 60. An organic group composed of at least one of a carbon atom, 0 to 10 nitrogen atoms, 0 to 50 oxygen atoms, 1 to 100 hydrogen atoms, and 0 to 20 sulfur atoms. More specific examples include organic groups having the following structures alone or in combination of a plurality of them. The monovalent organic group may further have a substituent, and examples of the substituent which may be introduced include a halogen atom, a hydroxyl group, a carboxyl group, a sulfonato group, a nitro group, a cyano group, a decylamino group, an amine group, an alkyl group, and the like. Alkenyl, alkynyl, aryl, substituted oxy, substituted sulfonyl, substituted carbonyl, substituted sulfinyl, sulfo, phosphonium, phosphonato, decane Base, heterocyclic group, and the like. Further, the organic group may also contain an ether bond, an ester bond, or a urea bond.

The monovalent organic group is preferably an alkyl group, an alkenyl group, an alkynyl group or an aryl group. The alkyl group is preferably an alkyl group having 1 to 8 carbon atoms, and examples thereof include a methyl group, an ethyl group, a propyl group, an octyl group, an isopropyl group, a tert-butyl group, an isopentyl group, a 2-ethylhexyl group, and a 2- Methylhexyl, cyclopentyl and the like. The alkenyl group is preferably an alkenyl group having 2 to 20 carbon atoms, and examples thereof include a vinyl group, an allyl group, a prenyl group, a geranyl group, and an oil group. The alkynyl group is preferably an alkynyl group having 3 to 10 carbon atoms, and examples thereof include an ethynyl group, a propargyl group, and a trimethyldecyl ethynyl group. The aryl group is preferably an aryl group having 6 to 12 carbon atoms, and examples thereof include a phenyl group, a 1-naphthyl group, and a 2-naphthyl group. Further, the heterocyclic group is preferably a heterocyclic group having 2 to 10 carbon atoms, and examples thereof include a furyl group, a thienyl group, and a pyridyl group.

R ¹ , R ² , R ³ and R ⁴ in the formula (6), R ⁵ , R ⁶ and R ⁷ in the formula (7), and R ⁸ , R ⁹ , R ¹⁰ and R ¹¹ in the formula (10) The monovalent organic group represented by R ¹² and R ¹³ is preferably an alkyl group or an aryl group. The alkyl group is preferably an alkyl group having 1 to 8 carbon atoms, and examples thereof include a methyl group, an ethyl group, a propyl group, an octyl group, an isopropyl group, a tert-butyl group, an isopentyl group, and a 2-ethylhexyl group. , 2-methylhexyl, cyclopentyl and the like. The aryl group is preferably an aryl group having 6 to 12 carbon atoms, and examples thereof include a phenyl group, a 1-naphthyl group, and a 2-naphthyl group. Among them, R ⁹⁰¹ to R ^{903 are} preferably a hydrogen atom or a methyl group.

The following is represented by Y ¹ in the formula (7) and Y ² and Y ³ in the formula (10), which are selected from -CO-, -O-, -NH-, a divalent aliphatic group, and a divalent aromatic group. And a specific example of the divalent linking group in the group consisting of the combination of these groups. Further, in the following examples, the left side is bonded to the main chain, and the right side is bonded to Rf.

L1: -CO-NH-divalent aliphatic group-O-CO-NH-divalent aliphatic group-O-CO- L2: -CO-NH-divalent aliphatic group-O-CO- L3:-CO -divalent aliphatic group-O-CO- L4:-CO-O-divalent aliphatic group-O-CO- L5:-divalent aliphatic group-O-CO- L6:-CO-NH-divalent Aromatic group-O-CO- L7:-CO-divalent aromatic group-O-CO- L8:-divalent aromatic group-O-CO- L9:-CO-O-divalent aliphatic group-CO -O-divalent aliphatic group-O-CO- L10:-CO-O-divalent aliphatic group-O-CO-divalent aliphatic group-O-CO- L11:-CO-O-divalent aromatic Group-CO-O-divalent aliphatic group-O-CO- L12:-CO-O-divalent aromatic group-O-CO-divalent aliphatic group-O-CO- L13:-CO-O -divalent aliphatic group-CO-O-divalent aromatic group-O-CO- L14:-CO-O-divalent aliphatic group-O-CO-divalent aromatic group-O-CO- L15: -CO-O-divalent aromatic group-CO-O-divalent aromatic group-O-CO- L16:-CO-O-divalent aromatic group-O-CO-divalent aromatic group-O- CO- L17:-CO-O-divalent aromatic group-O-CO-NH-divalent aliphatic group-O-CO- L18:-CO-O-divalent aliphatic group-O-CO-NH- Divalent aliphatic group-O-CO- L19:-divalent aromatic group-divalent aliphatic group L20:-divalent aromatic group-divalent fat Group-O-divalent aliphatic group - L21:-divalent aromatic group-divalent aliphatic group-O-divalent aliphatic group-O-L22:-CO-O-divalent aliphatic group-L23 :-CO-O-divalent aliphatic group-O-

The term "divalent aliphatic group" as used herein means an alkylene group, a substituted alkylene group, an alkenyl group, a substituted alkenyl group, an alkynyl group, a substituted alkynyl group or a polyalkylene group. Among them, an alkyl group, a substituted alkyl group, an alkenyl group and a substituted alkenyl group are preferred, and an alkyl group and a substituted alkyl group are more preferred. For a divalent aliphatic group, the chain structure is superior to the ring structure, and thus the linear structure is superior to the chain structure having branches. The number of carbon atoms of the divalent aliphatic group is preferably from 1 to 20, more preferably from 1 to 15, still more preferably from 1 to 12, still more preferably from 1 to 10, still more preferably from 1 to 8, more preferably 1 ~4. Examples of the substituent of the divalent aliphatic group include a halogen atom (F, Cl, Br, I), a hydroxyl group, a carboxyl group, an amine group, a cyano group, an aryl group, an alkoxy group, an aryloxy group, a decyl group, and an alkane group. An oxycarbonyl group, an aryloxycarbonyl group, a decyloxy group, a monoalkylamino group, a dialkylamino group, an arylamino group, a diarylamino group or the like.

Examples of the divalent aromatic group include a phenylene group, a substituted phenylene group, a naphthyl group, and a substituted naphthyl group, and a phenyl group is preferred. Examples of the substituent of the divalent aromatic group include an alkyl group in addition to the examples of the substituent of the divalent aliphatic group.

The content of the repeating unit having a fluorine atom is preferably from 2 mol% to 98 mol%, more preferably from 10 mol% to 90 mol%, based on all the repeating units of the radical polymerizable oligomer having a fluorine atom.

The repeating unit having a radical polymerizable functional group is preferably a repeating unit represented by the following formula (8).

[Chemistry 16] (In the formula (8), R ⁸⁰¹ to R ⁸⁰³ each independently represent a hydrogen atom, an alkyl group or a halogen atom. Y ⁸ represents a single bond or is selected from -CO-, -O-, -NH-, a divalent aliphatic group a divalent linking group in a group consisting of a divalent aromatic group and a combination of such groups. T represents a structure having a radical polymerizable functional group)

The alkyl group as R ⁸⁰¹ to R ⁸⁰³ is preferably an alkyl group having 1 to 6 carbon atoms. T preferably represents a radical polymerizable functional group represented by the formula (9).

[化17] (In the formula (9), R ⁹⁰¹ to R ⁹⁰³ each independently represent a hydrogen atom, an alkyl group or an aryl group. The dotted line indicates a bond to a group bonded to Y ⁸ )

The alkyl group is preferably an alkyl group having 1 to 8 carbon atoms, and examples thereof include a methyl group, an ethyl group, a propyl group, an octyl group, an isopropyl group, a tert-butyl group, an isopentyl group, and a 2-ethylhexyl group. 2-methylhexyl, cyclopentyl and the like. The aryl group is preferably an aryl group having 6 to 12 carbon atoms, and examples thereof include a phenyl group, a 1-naphthyl group, and a 2-naphthyl group. Among them, R ⁹⁰¹ to R ^{903 are} preferably a hydrogen atom or a methyl group.

Y ⁸ represents a single bond or a divalent linking group selected from the group consisting of -CO-, -O-, -NH-, a divalent aliphatic group, a divalent aromatic group, and a combination of these groups. Specific examples of the combination of Y ⁸ are listed below. Further, in the following examples, the left side is bonded to the main chain, and the right side is bonded to the formula (9).

L1: -CO-NH-divalent aliphatic group-O-CO-NH-divalent aliphatic group-O-CO- L2: -CO-NH-divalent aliphatic group-O-CO- L3:-CO -divalent aliphatic group-O-CO- L4:-CO-O-divalent aliphatic group-O-CO- L5:-divalent aliphatic group-O-CO- L6:-CO-NH-divalent Aromatic group-O-CO- L7:-CO-divalent aromatic group-O-CO- L8:-divalent aromatic group-O-CO- L9:-CO-O-divalent aliphatic group-CO -O-divalent aliphatic group-O-CO- L10:-CO-O-divalent aliphatic group-O-CO-divalent aliphatic group-O-CO- L11:-CO-O-divalent aromatic Group-CO-O-divalent aliphatic group-O-CO- L12:-CO-O-divalent aromatic group-O-CO-divalent aliphatic group-O-CO- L13:-CO-O -divalent aliphatic group-CO-O-divalent aromatic group-O-CO- L14:-CO-O-divalent aliphatic group-O-CO-divalent aromatic group-O-CO- L15: -CO-O-divalent aromatic group-CO-O-divalent aromatic group-O-CO- L16:-CO-O-divalent aromatic group-O-CO-divalent aromatic group-O- CO- L17:-CO-O-divalent aromatic group-O-CO-NH-divalent aliphatic group-O-CO- L18:-CO-O-divalent aliphatic group-O-CO-NH- Divalent aliphatic group-O-CO-

The term "divalent aliphatic group" as used herein means an alkylene group, a substituted alkylene group, an alkenyl group, a substituted alkenyl group, an alkynyl group, a substituted alkynyl group or a polyalkylene group. Among them, an alkyl group, a substituted alkyl group, an alkenyl group and a substituted alkenyl group are preferred, and an alkyl group and a substituted alkyl group are more preferred. For a divalent aliphatic group, the chain structure is superior to the ring structure, and thus the linear structure is superior to the chain structure having branches. The number of carbon atoms of the divalent aliphatic group is preferably from 1 to 20, more preferably from 1 to 15, still more preferably from 1 to 12, still more preferably from 1 to 10, still more preferably from 1 to 8, more preferably 1 ~4. Examples of the substituent of the divalent aliphatic group include a halogen atom (F, Cl, Br, I), a hydroxyl group, a carboxyl group, an amine group, a cyano group, an aryl group, an alkoxy group, an aryloxy group, a decyl group, and an alkane group. An oxycarbonyl group, an aryloxycarbonyl group, a decyloxy group, a monoalkylamino group, a dialkylamino group, an arylamino group, a diarylamino group or the like.

Examples of the divalent aromatic group include a phenylene group, a substituted phenylene group, a naphthyl group, and a substituted naphthyl group, and a phenyl group is preferred. Examples of the substituent of the divalent aromatic group include an alkyl group in addition to the examples of the substituent of the divalent aliphatic group.

The content of the repeating unit having a radical polymerizable functional group is preferably from 2 mol% to 98 mol%, more preferably from 10 mol% to 90 mol, based on all the repeating units of the radical polymerizable oligomer having a fluorine atom. %.

The polystyrene-equivalent weight average molecular weight obtained by the gel permeation chromatography (GPC) method of the radically polymerizable oligomer having a fluorine atom is preferably from 2,000 to 20,000, more preferably from 2,000 to 15,000, most preferably from 2,000. ~10000.

When the composition for forming a release layer contains a radical polymerizable monomer or oligomer having a fluorine atom, the content of the radical polymerizable monomer or oligomer having a fluorine atom is not particularly limited, and it is preferably. It is preferably 0.01% by mass to 15% by mass based on the total solid content of the composition for forming a release layer. When it is 0.01% by mass or more, sufficient peeling property can be obtained, and if it is 15% by mass or less, a sufficient adhesive force can be obtained. The radically polymerizable monomer or oligomer having a fluorine atom may be used alone or in combination of two or more. When the number of the polymerizable monomers is two or more, it is preferred that the total amount is in the above range.

<<<Free radical polymerizable monomer or oligomer having a ruthenium atom>>> The radical polymerizable monomer or oligomer having a ruthenium atom is preferably an fluorenone monomer or an fluorenone oligomer, for example The compound having at least a single terminal of a polydimethylsiloxane link to be an ethylenically unsaturated group such as a (meth) acrylonitrile group or a styryl group is preferable, and a compound having a (meth) acryl fluorenyl group is preferable.

The polystyrene-equivalent number average molecular weight obtained by gel permeation chromatography of the radically polymerizable oligomer having a ruthenium atom is preferably from 1,000 to 10,000. When the polystyrene-equivalent number average molecular weight obtained by the gel permeation chromatography of the radically polymerizable oligomer having a ruthenium atom is less than 1,000 or 10,000 or more, it is difficult to exhibit the releasability by the ruthenium atom. Other nature.

The radical polymerizable monomer having a ruthenium atom is preferably a compound represented by the formula (11) or the formula (12).

[化18] (In the general formula (11) and the general formula (12), R ¹¹ to R ¹⁹ each independently represent a hydrogen atom, an alkyl group, an alkoxy group, an alkoxycarbonyl group or an aryl group. Z ¹¹ , Z ¹² and Z ¹³ respectively The radical polymerizable group is independently represented. L ¹¹ , L ¹² and L ¹³ each independently represent a single bond or a divalent linking group. n and m each independently represent an integer of 0 or more)

In the general formulae (11) and (12), R ¹¹ to R ¹⁹ each independently represent a hydrogen atom, an alkyl group, an alkoxy group, an alkoxycarbonyl group or an aryl group.

The alkyl group may be linear or branched, and is preferably an alkyl group having 1 to 5 carbon atoms, and specific examples thereof include a methyl group, an ethyl group, a n-propyl group, and an isopropyl group. The alkoxy group means -OR ²⁰ and R ²⁰ represents an alkyl group (preferably an alkyl group having 1 to 5 carbon atoms), and specific examples thereof include a methoxy group, an ethoxy group, a propoxy group, an isopropoxy group, and a butoxy group. Base. The alkoxycarbonyl group means -C(=O)R ²¹ , and R ²¹ represents an alkoxy group (preferably an alkoxy group having 1 to 5 carbon atoms), and specific examples thereof include a methoxycarbonyl group, an ethoxycarbonyl group, and a C. Oxycarbonyl group and the like. Examples of the aryl group include a phenyl group, a tolyl group, and a naphthyl group. These groups may have a substituent, and examples thereof include a phenylmethyl group (benzyl group), a phenylethyl group, a phenylpropyl group, and a phenylbutyl group. Naphthylmethyl and the like.

L ¹¹ , L ¹² and L ¹³ each independently represent a single bond or a divalent linking group. The divalent linking group means a divalent linking group selected from the group consisting of -CO-, -O-, -NH-, a divalent aliphatic group, a divalent aromatic group, and a combination of these groups.

n and m each independently represent an integer of 0 or more, preferably an integer of 0 to 100, and more preferably an integer of 0 to 50.

Z ¹¹ , Z ¹² and Z ¹³ each independently represent a radical polymerizable group, and particularly preferably a functional group represented by any one of the following formulae (i) to (iii).

[Chemistry 19] (In the formula (i), R ¹⁰¹ to R ¹⁰³ each independently represent a hydrogen atom or a monovalent organic group. X ¹⁰¹ represents an oxygen atom, a sulfur atom or -N(R ¹⁰⁴ )-, and R ¹⁰⁴ represents a hydrogen atom or a monovalent group. Organic base)

In the formula (i), R ¹⁰¹ to R ¹⁰³ each independently represent a hydrogen atom or a monovalent organic group. R ^{101 is} preferably a hydrogen atom or an alkyl group which may have a substituent. Among them, a hydrogen atom and a methyl group are preferred because of their high radical reactivity. Further, R ¹⁰² and R ¹⁰³ each independently preferably represent a hydrogen atom, a halogen atom, an amine group, a carboxyl group, an alkoxycarbonyl group, a sulfo group, a nitro group, a cyano group, an alkyl group which may have a substituent, and may have a substitution. An aryl group, an alkoxy group which may have a substituent, an aryloxy group which may have a substituent, an alkylamino group which may have a substituent, an arylamine group which may have a substituent, an alkyl group which may have a substituent a sulfonyl group or an arylsulfonyl group which may have a substituent, wherein a hydrogen atom, a carboxyl group, an alkoxycarbonyl group, an alkyl group which may have a substituent, and an aromatic group which may have a substituent are highly reactive and preferably .

X ¹⁰¹ represents an oxygen atom, a sulfur atom or -N(R ¹⁰⁴ )-, and R ¹⁰⁴ represents a hydrogen atom or a monovalent organic group. The monovalent organic group may, for example, be an alkyl group which may have a substituent. When R ¹⁰⁴ is a hydrogen atom, a methyl group, an ethyl group or an isopropyl group, it is preferred because of high radical reactivity.

The substituent which may be introduced may, for example, be an alkyl group, an alkenyl group, an alkynyl group, an aryl group, an alkoxy group, an aryloxy group, a halogen atom, an amine group, an alkylamino group, an arylamino group, a carboxyl group or an alkoxycarbonyl group. Sulfo, nitro, cyano, decylamino, alkylsulfonyl, arylsulfonyl and the like.

[Chemistry 20] (In the formula (ii), R ²⁰¹ to R ²⁰⁵ each independently represent a hydrogen atom or a monovalent organic group. Y ²⁰¹ represents an oxygen atom, a sulfur atom or -N(R ²⁰⁶ )-. R ²⁰⁶ represents a hydrogen atom or a monovalent group. Organic base)

In the formula (ii), R ²⁰¹ to R ²⁰⁵ each independently represent a hydrogen atom or a monovalent organic group. R ²⁰¹ to R ²⁰⁵ are each independently preferably a hydrogen atom, a halogen atom, an amine group, a carboxyl group, an alkoxycarbonyl group, a sulfo group, a nitro group, a cyano group, an alkyl group which may have a substituent, and an aromatic group which may have a substituent. Alkoxy group which may have a substituent, an aryloxy group which may have a substituent, an alkylamine group which may have a substituent, an arylamine group which may have a substituent, an alkylsulfonyl group which may have a substituent Or an arylsulfonyl group which may have a substituent, more preferably a hydrogen atom, a carboxyl group, an alkoxycarbonyl group, an alkyl group which may have a substituent or an aryl group which may have a substituent.

The substituent which can be introduced is the same as the substituent of the formula (i). Y ²⁰¹ represents an oxygen atom, a sulfur atom or -N(R ²⁰⁶ )-. R ²⁰⁶ has the same meaning as R ¹⁰⁴ of the formula (i), and preferred examples are also the same.

[Chem. 21] (In the formula (iii), R ³⁰¹ to R ³⁰³ each independently represent a hydrogen atom or a monovalent organic group. Z ³⁰¹ represents an oxygen atom, a sulfur atom, -N(R ³⁰⁴ )- or a phenyl group which may have a substituent R ³⁰⁴ has the same meaning as R ¹⁰⁴ of the general formula (i)

In the formula (iii), R ³⁰¹ to R ³⁰³ each independently represent a hydrogen atom or a monovalent organic group. R ^{301 is} preferably a hydrogen atom or an alkyl group which may have a substituent, and a hydrogen atom or a methyl group is more preferable because of high radical reactivity. R ³⁰² and R ³⁰³ are each independently preferably a hydrogen atom, a halogen atom, an amine group, a carboxyl group, an alkoxycarbonyl group, a sulfo group, a nitro group, a cyano group, an alkyl group which may have a substituent, and an aromatic group which may have a substituent. Alkoxy group which may have a substituent, an aryloxy group which may have a substituent, an alkylamine group which may have a substituent, an arylamine group which may have a substituent, an alkylsulfonyl group which may have a substituent The arylsulfonyl group which may have a substituent, a hydrogen atom, a carboxyl group, an alkoxycarbonyl group, an alkyl group which may have a substituent or an aromatic group which may have a substituent may have a high reactivity and are more preferable.

The substituent which can be introduced is the same as the substituent of the formula (i). Z ³⁰¹ represents an oxygen atom, a sulfur atom, -N(R ³⁰⁴ )- or a stretched phenyl group which may have a substituent. R ³⁰⁴ has the same meaning as R ¹⁰⁴ of the formula (i), and the monovalent organic group may, for example, be an alkyl group which may have a substituent, and the methyl group, the ethyl group and the isopropyl group are preferably highly reactive.

When the composition for forming a release layer contains a radically polymerizable monomer or oligomer having a ruthenium atom, the radically polymerizable single substance having a ruthenium atom with respect to the total solid content of the composition for forming a release layer The content of the body or oligomer is preferably from 0.01% by mass to 15% by mass. When it is 0.01% by mass or more, sufficient peelability can be obtained. When it is 15 mass% or less, a sufficient adhesive force can be obtained. The radically polymerizable monomer or oligomer having a ruthenium atom may be used alone or in combination of two or more. When two or more types of radical polymerizable monomers or oligomers having a ruthenium atom are used, the total amount is preferably in the above range.

The radically polymerizable monomer having a fluorine atom or a ruthenium atom can also be exemplified by RS-75, RS-72-K, RS-76-E, and RS-72-K manufactured by Di Ai Sheng (DIC) Co., Ltd. Optools DAC-HP (Fluorated Decane Coupler) manufactured by Daikin Industries Co., Ltd., X-22-164, X-22-164AS, X manufactured by Shin-Etsu Chemical Co., Ltd. -22-164A, X-22-164B, X-22-164C, X-22-164E, EBECRYL 350, EBECRYL 1360, manufactured by Daicel Cytec Co., Ltd. Tegorgad 2700, manufactured by Degussa, UV-3500B (manufactured by BYK).

In addition to the above, a material having a fluorine atom or a halogen atom may be exemplified by (heptadecafluoro-1,1,2,2-tetrahydroindenyl)trichlorodecane, (fluoro)alkyl phosphate, and fluorinated polypair. a copolymer of parylene fluoride, an oxime acrylate copolymer, tetrafluoroethylene and 2,2-bis-trifluoromethyl-4,5-difluoro-1,3-dioxole, A polymer having a pendant perfluoroalkoxy group, a fluoroethylene-propylene copolymer or the like.

The composition for forming a release layer preferably contains a solvent. As long as the solvent can form a release layer, a known solvent can be used without limitation, and the same solvent as the solvent in the temporarily fixed adhesive described above can be used. In addition to the above-mentioned components, the composition for forming a release layer may further contain various compounds depending on the purpose, within the range not impairing the effects of the present invention. For example, a thermal polymerization initiator, a sensitizing dye, or a chain transfer agent can be preferably used. These additives can be used as described in the temporary use compositions described above. The solid content concentration at 25 ° C of the composition for forming a release layer is preferably from 3% by mass to 40% by mass, more preferably from 5% by mass to 40% by mass.

The release layer can be formed by using a previously known spin coat method, a spray method, a roller coat method, a flow coat method, or a doctor coat. The composition for forming a release layer described above is applied onto a support, followed by drying. Among them, a spin coating method, a spray method, and a screen printing method are preferred, and a spin coating method or a spray method is more preferred, and a spin coating method is preferred.

In the adhesive film of the present invention, a release film may be bonded to one surface or both surfaces of the adhesive layer to form a "adhesive film with a release film". According to this aspect, the long adhesive film is wound up. In the case of a roll shape, it is possible to prevent damage to the surface of the adhesive layer or to attach it during storage. The release film can be peeled off and removed during use. For example, when a release film is bonded to both surfaces, the release film of one side may be peeled off, and the remaining release film may be peeled off after laminating the back surface on a substrate or a support. Thereby, the surface of the sheet can be kept as clean as possible.

<Method of Producing Film Next> The film of the present invention can be produced by a previously known method. For example, it can be manufactured by a melt film formation method, a solution film formation method, or the like. The melt film forming method is a method in which a raw material composition is heated and melted, whereby fluidity is obtained, and the melt is formed into a sheet shape by an extrusion molding apparatus or an injection molding apparatus, and cooled, thereby obtaining a film (sheet). . In the extrusion molding method, a roll-shaped long film can be obtained. Although it is difficult to obtain a long film in the injection molding method, high film thickness precision can be obtained. Other additives may also be added by mixing and stirring. The release film may be bonded to one side or both sides of the film to form a "adhesion film with a release film". The solution film forming method is a method in which a raw material composition is dissolved in a solvent to obtain fluidity, and the solution is applied onto a film or a support such as a drum or a belt to form a sheet. And drying, thereby obtaining a film (sheet). At the time of coating, a method of extruding a solution from a slit-like opening by pressure and applying it; a method of transferring a solution by a gravure or anilox roll and applying it; and a spray from one side are used. Or a method of scanning and coating a solution in a dispenser; accumulating the solution in a tank to pass a film or a drum or a belt therein, thereby performing a dip coating method; The method of coating is performed by scraping the solution while pushing the solution. Other additives may also be added by using a solution in which the other additives are dissolved and mixed and stirred. After the solution is applied onto a support and dried to form a solidified sheet, the sheet is mechanically peeled off from the support to obtain a film (sheet) of the monomer. In order to facilitate the peeling, the release layer coating, the immersion treatment, the gas treatment, the electromagnetic wave irradiation treatment, the plasma irradiation treatment, or the like may be performed as a treatment for imparting mold release property to the support. Alternatively, the film may be directly left without being peeled off from the support, and the film may be placed on the film support to form a "adhesive film with a release film". By performing these processes continuously, a roll-shaped long film can be obtained. Further, a release film may be bonded to both surfaces of the film to form a "sheet having a release film on both sides".

<Adhesive Support> Next, the adhesive support of the present invention will be described. The adhesive support of the present invention has a support and an adhesive layer containing the fluorine-based liquid compound and the elastomer described above. The subsequent layer preferably contains the elastomer A and the elastomer B described above as an elastomer. Further, the adhesive layer preferably contains the radical polymerizable compound described above. The adhesive layer can be formed using the temporarily fixed adhesive of the present invention as described above. The average thickness of the layer next varies depending on the use, and is, for example, preferably 0.1 μm to 500 μm. The layer may be formed by applying a temporary fixing adhesive of the present invention to the surface of the support by spin coating, spraying, roll coating, flow coating, blade coating, dipping, or the like, and Dry (bake). Drying can be carried out, for example, at 60 ° C to 150 ° C for 10 seconds to 2 minutes. The average thickness of the adhesive layer in this case is not particularly limited, and is, for example, preferably 1 μm to 100 μm, and more preferably 1 μm to 10 μm. Further, the adhesive layer may be formed by laminating the above-described adhesive film of the present invention on a support. By forming the adhesive layer by using the adhesive film, even if a material such as an elastomer having poor solubility in a solvent can be used to form an adhesive layer, it is easy to form an adhesive layer excellent in heat resistance and chemical resistance. Further, an adhesive layer having a thickness of 10 μm or more can be produced flat without unevenness in thickness. The average thickness of the adhesive layer in this case is not particularly limited, and is, for example, preferably 0.1 μm to 200 μm, more preferably 10 μm to 200 μm, still more preferably 50 μm to 200 μm. When forming the adhesive layer on the support using the adhesive film, for example, the adhesive film is placed in a vacuum laminator, and the adhesive film is placed on the support by the device, and the adhesive film is brought into contact with the support under vacuum. A method of fixing (layering) the adhesive film to the support by pressure bonding using a roller or the like. Further, the adhesive film (adjacent layer) fixed to the support may be cut into a desired shape such as a circular shape.

In the adhesive support of the present invention, the concentration of the fluorine-based liquid compound in the adhesive layer is preferably such that the surface from the opposite side of the support is in the range of 5% in the thickness direction of the adhesive layer is higher than the self-supporting The surface on the opposite side of the body originates from a region exceeding the range of 5% and 50% in the thickness direction of the subsequent layer. According to this aspect, when the adhesive support is temporarily attached to the substrate of the element wafer or the like, the peeling property is improved when the element wafer is peeled off. Further, the adhesion layer can be easily removed from the surface of the substrate, the element wafer, or the like by a method such as mechanical peeling. The concentration of the fluorine-based liquid compound is preferably such that the surface from the surface on the opposite side of the support from the surface in the thickness direction of the adhesive layer is more than 5% in the thickness direction of the adhesive layer from the surface on the opposite side of the support. The area of the range of 5% and 50% is more than 10% by mass, more preferably 30% by mass or more.

In the adhesive support of the present invention, the support (also referred to as a carrier support) is not particularly limited, and examples thereof include a ruthenium substrate, a glass substrate, a metal substrate, and a compound semiconductor substrate. Among them, a tantalum substrate is preferable in view of the fact that the tantalum substrate which is typically used as a substrate of a semiconductor device is not easily contaminated, or the electrostatic chuck which is widely used in the manufacturing process of a semiconductor device can be used. The thickness of the support is not particularly limited, and is, for example, preferably 300 μm to 100 mm, and more preferably 300 μm to 10 mm. A release layer may also be provided on the surface of the support. That is, the support may be a support with a release layer having a release layer on the surface of a substrate such as a tantalum substrate. The release layer is preferably a low surface energy layer containing fluorine atoms and/or germanium atoms, and preferably has a fluorine atom and/or germanium atom. The fluorine content of the release layer is preferably from 30% by mass to 80% by mass, more preferably from 40% by mass to 76% by mass, even more preferably from 60% by mass to 75% by mass. The material of the release layer may be the same material as that which can be formed on the surface layer of the adhesive film described above.

<Laminated body> Next, the laminated body of the present invention will be described. The laminate of the present invention has at least one or more adhesive layer A between the substrate and the support, and the subsequent layer A includes an adhesive layer A1 containing: liquid at 25 ° C and containing a lipophilic group and a compound of a fluorine atom, and an elastomer.

The laminate of the present invention preferably has a fluorine-based liquid compound and an elastomer described above between the substrate and the support in terms of improving the yield of the laminate. Layer A1 is then followed by layer A1 in contact with the substrate and support. That is, in the laminated body, it is preferable that the release layer described above is not contained between the substrate and the support, and only the adhesive layer is used.

In the present invention, the adhesive layer A1 preferably contains the elastomer A and the elastomer B described above as an elastomer. Further, the subsequent layer A1 preferably further contains the radically polymerizable compound described above. Layer A1 can then be formed using the temporarily fixed adhesive of the present invention as described above.

The laminate of the present invention can be as shown in Fig. 1, and the layer A is composed of only one layer. Alternatively, as shown in FIG. 2, it may be composed of two or more layers. By setting the adhesive layer to two or more layers, it is easy to bond the support and the substrate with good embedding properties. Further, in the case where the adhesive layer A is set to only one layer, the yield can be improved, which is preferable in this respect. In addition, in FIG. 1, FIG. 2, the code|symbol 1 is a base material, the code|symbol 2 is a support body, and the code|symbol 3, and the symbol 3A and the symbol 3B are the adhesive layer A.

In the case where the adhesive layer A contains two or more adhesive layers, it is sufficient that at least the adhesive layer A1 described above is contained. It is also possible to contain two or more layers of the above-mentioned adhesive layer A1. Further, it may be configured to include one or more of the above-described adhesive layer A1 and one or more of the other adhesive layers A1 other than the above-described adhesive layer A1. Further, the adhesive layer A1 described above is preferably in contact with at least one of the substrate and the support.

In the present invention, the adhesive layer A2 preferably contains a thermoplastic resin. In the present invention, the term "thermoplastic resin" means a resin which softens at 150 ° C to 350 ° C, and the storage elastic modulus at 25 ° C is preferably from 10 ⁴ Pa to 10 ¹² Pa, more preferably 10 ⁵ Pa. ～10 ¹¹ Pa, preferably 10 ⁶ Pa to 10 ¹⁰ Pa. The storage elastic modulus at 150 ° C to 300 ° C is preferably from 10 ² Pa to 10 ⁷ Pa, more preferably from 10 ¹ Pa to 10 ⁶ Pa, most preferably from 10 ⁰ Pa to 10 ⁵ Pa. Further, the storage elastic modulus is a value measured by a dynamic viscoelasticity measuring device (DMA). In addition, the term "softening" means a state in which the storage elastic modulus at 150 ° C to 300 ° C is 100 times or more the storage elastic modulus at 25 ° C.

In the present invention, the thermoplastic resin may, for example, be a block copolymer, a random copolymer or a graft copolymer, and is preferably a block copolymer. The type of the thermoplastic resin is not particularly limited, and a polystyrene copolymer, a polyester copolymer, a polyolefin copolymer, a polyurethane copolymer, a polyamide copolymer, or a polyacrylic acid can be used. A copolymer, an anthrone-based copolymer, a polyimide-based copolymer, or the like. In particular, a polystyrene copolymer, a polyester copolymer, and a polyamine copolymer are preferable, and a polystyrene copolymer is more preferable from the viewpoint of heat resistance and peelability. Among them, the thermoplastic resin is preferably a block copolymer of styrene and other monomers, and particularly preferably a styrene block copolymer having a single terminal or a styrene block at both ends. Further, the thermoplastic resin is preferably an elastomer. By using an elastomer as the thermoplastic resin and following the fine unevenness of the substrate or the support, an adhesive film having excellent adhesion can be obtained by an appropriate fixing effect. The elastomer may be used alone or in combination of two or more. Further, the elastomer is preferably a hydride. If the elastomer is a hydride, thermal stability or storage stability is improved. Further, the elastomer is also preferably an elastomer A containing styrene-derived repeating units in a ratio of 10% by mass or more and 50% by mass or less in all the repeating units, and more than 50 masses in all the repeating units. The elastomer B containing a repeating unit derived from styrene in a ratio of % and 95% by mass or less is used in combination. By using the elastomer A and the elastomer B in combination, it has excellent releasability, and the flatness of the polished surface of the substrate is good, and warpage of the substrate after polishing can be effectively suppressed. The details of the elastomer include the elastomers described in the above-mentioned temporary fixing adhesive of the present invention, and the preferred ranges are also the same.

Next, the layer A2 can be formed using a temporarily fixed adhesive B containing a thermoplastic resin. The content of the thermoplastic resin is preferably from 50.00% by mass to 99.99% by mass, more preferably from 70.00% by mass to 99.9% by mass, even more preferably from 88.00% by mass to 99.99% by mass, based on the mass of the temporarily fixed adhesive B other than the solvent. . When the content of the thermoplastic resin is in the above range, the adhesion and the releasability are excellent.

The temporarily fixed adhesive B may contain a component described in the temporarily fixed adhesive of the present invention described above as a component other than the thermoplastic resin. For example, a radically polymerizable compound, an antioxidant, a polymer compound, a solvent, and a surfactant are mentioned. As for the details of these components, the same components as the temporarily fixed adhesive of the present invention can be used, and the preferred ranges are also the same. The content is also the same. Among them, the surfactant is preferably an anthrone-based surfactant. By using a surfactant, coatability is improved, and it is easy to form an adhesive layer by coating. Further, the adhesive B can be temporarily fixed with a curing agent, a curing catalyst, a decane coupling agent, a filler, a adhesion promoter, an ultraviolet absorber, an anti-agglomerating agent, and the like. In the case of disposing these additives, the total amount of the additives is preferably 3% by mass or less based on the total solid content of the adhesive B. In addition, the temporarily fixed adhesive B may contain the fluorine-based liquid compound described in the temporary fixing adhesive of the present invention, or may be a composition which is substantially free of the fluorine-containing liquid compound. In addition, the fluorine-free liquid compound is preferably 0.005% by mass or less, and more preferably 0.001% by mass or less based on the mass of the temporarily fixed adhesive B other than the solvent. Further, it is preferably a fluorine-free liquid compound.

In the case where the adhesive layer A includes the above-described adhesive layer A1 and the above-described adhesive layer A2, the ratio of the total film thickness of the subsequent layer A1 to the total film thickness of the adhesive layer A2 is preferably the adhesive layer A1: Next, the layer A2 = 99:1 to 1:99, more preferably 90:10 to 10:90, and further preferably 80:20 to 20:80.

The laminate of the present invention preferably has at least one layer of the adhesive layer A containing an elastomer containing a repeating unit derived from styrene. That is, in the case where the adhesive layer A contains only one layer of the adhesive layer A1 described above, it is preferred that the adhesive layer A1 contains an elastomer containing a repeating unit derived from styrene. Further, in the case where the adhesive layer A is formed by laminating two or more layers of the above-mentioned adhesive layer A1, it is preferred that at least one layer of the adhesive layer A1 contains an elastomer containing a repeating unit derived from styrene. Further, in the case where the adhesive layer A contains the adhesive layer A1 described above and the adhesive layer A2 described above, it is preferred that at least one of the adhesive layer A1 and the adhesive layer A2 contain a repeat derived from styrene. The elastomer of the unit. Further, the elastomer is preferably a hydride. Further, the elastomer is preferably a block copolymer. Further, the elastomer preferably contains an elastomer A containing a repeating unit derived from styrene in a ratio of 10% by mass or more and 50% by mass or less in all the repeating units, and exceeds all repeating units. The elastomer B derived from a repeating unit derived from styrene in a ratio of 50% by mass and 95% by mass or less.

In the case where the adhesive layer A includes the above-described adhesive layer A1 and the above-described adhesive layer A2, the layer constitution of the laminated body of the present invention is not particularly limited. For example, the support body, the subsequent layer A1, the adhesive layer A2, and the substrate are sequentially provided, and the support, the subsequent layer A2, the adhesive layer A1, and the substrate are sequentially provided, and the support is preferably sequentially provided. The structure of the layer A1, the layer A2, and the substrate. Further, it may be configured to have a support, an adhesive layer A1, an adhesive layer A2, an adhesive layer A1, and a substrate in this order, and sequentially have a support, an adhesive layer A2, an adhesive layer A1, an adhesive layer A2, and a substrate. Composition.

The substrate wafer can be preferably used for the substrate. As the element wafer, a known element wafer can be used without limitation, and examples thereof include a tantalum substrate, a compound semiconductor substrate, and the like. Specific examples of the compound semiconductor substrate include a SiC substrate, a SiGe substrate, a ZnS substrate, a ZnSe substrate, a GaAs substrate, an InP substrate, and a GaN substrate. A mechanical structure or circuit may also be formed on the surface of the component wafer. For example, a micro-electromechanical system (MEMS), a power component, an image sensor, a micro sensor, and a light emitting diode (LED) can be cited. , optical components, interposers, embedded components, micro-components, and the like. The component wafer preferably has a structure such as a metal bump. According to the present invention, the component wafer having the structure on the surface can be stably and temporarily terminated, and the temporary bonding of the component wafer can be easily released. The height of the structure is not particularly limited, and is, for example, preferably 1 μm to 150 μm, and more preferably 5 μm to 100 μm. The film thickness of the element wafer before the mechanical treatment or the chemical treatment is preferably 500 μm or more, more preferably 600 μm or more, and still more preferably 700 μm or more. The upper limit is, for example, preferably 2000 μm or less, more preferably 1500 μm or less. The film thickness of the element wafer which has been subjected to mechanical treatment or chemical treatment to be thinned is, for example, preferably less than 500 μm, more preferably 400 μm or less, and still more preferably 300 μm or less. The lower limit is, for example, preferably 1 μm or more, and more preferably 5 μm or more.

In the laminate of the present invention, the support (carrier support) has the same meaning as the support described in the above-mentioned adhesive support, and the preferred range is also the same.

In the case where the laminate of the present invention has the laminate A1 between the substrate and the support, and the laminate A1 is in contact with the substrate and the support, the support and the laminate are preferred. The peeling strength A of A and the peeling strength B of the adhesive layer A and the base material satisfy the following formula (1) and formula (2). A<B···· (1) B≦4 N/cm·(2) By the relationship between the peeling strength A and the peeling strength B satisfying the above formula (1), the support body can be self-contained. When the substrate is peeled off, the self-supporting body and the adhesive layer A are peeled off at the interface. Further, by the relationship that the peeling strength B satisfies the above formula (2), the adhesive layer A can be kept in a film shape and easily peeled off from the surface of the substrate. That is, the adhesive layer A can be simply peeled off by mechanical peeling. The peel strength B is preferably 3 N/cm or less, more preferably 2 N/cm or less. Further, the peel strength of the present invention is a value measured for the strength applied when pulled up in the 90° direction. Peel strength A represents the force applied when the substrate is fixed and the end of the support is pulled up at a speed of 50 mm/min in the 90° direction. The peel strength B indicates the force applied when the substrate was fixed and the film-like adhesive layer was pulled up at a speed of 50 mm/min in the 90° direction.

In the laminate of the present invention, when the support is peeled off from the substrate, the adhesive layer A is peeled off from the interface between the substrate and the adhesive layer, and the area of the release surface of the substrate and the adhesive layer A is 50% or more. In the range of the above, the residue of the fluorine-based liquid compound is adhered, or the adhesive layer A is peeled off from the interface between the support and the adhesive layer, and is 50% or more of the area of the peeling surface of the adhesive layer A of the support. Within the range, the residue of the fluorine-based liquid compound adheres. Moreover, it is preferable that the residue derived from the elastomer does not adhere to the range of 50% or more of the area of the peeling surface, and more preferably does not adhere to the range of 99% or more. The residue of the fluorine-based liquid compound and the residue derived from the elastomer can be observed by visual observation, optical microscopy, scanning electron microscope, X-ray photoelectron spectroscopy, etc., and in the present invention, the surface is separated by X-ray photoelectron spectroscopy. The measurement was carried out. In the present specification, the "residue of the fluorine-based liquid compound" is a fluorine-based liquid component of the adhesive layer, and the "residue derived from the elastomer" means an elastomer component of the adhesive layer.

The laminate of the present invention can be produced by heating and pressure-bonding the surface of the adhesive support of the present invention described above on the side of the adhesive layer to the substrate. The pressurization subsequent conditions are, for example, preferably at a temperature of from 100 ° C to 200 ° C, a pressure of from 0.01 MPa to 1 MPa, and a period of from 1 minute to 15 minutes. Further, the temporary fixing adhesive of the present invention may be applied onto the surface of the substrate, and heated (baked) to form an adhesive layer, and then a support is placed on the surface of the adhesive layer and heated and pressure bonded. Further, the above-described sheet of the present invention described above may be disposed between the support and the substrate, and may be produced by heating and pressure bonding.

Further, the adhesive layer A1 may be formed on one of the support and the substrate by using the temporarily fixed adhesive of the present invention, and the temporary fixed adhesive B of the present invention or the temporarily fixed adhesive B described above may be used for the support. On the other of the body and the substrate, the adhesive layer A1 or the adhesive layer A2 is formed, and the surface of the support and the substrate on which the adhesive layer is formed is heated and pressure-bonded to each other to produce the laminate of the present invention. According to this method, since the adhesive layers are bonded to each other, the support can be bonded to the substrate with good embedding property.

Further, the temporary fixing adhesive of the present invention and the temporary fixing adhesive B described above may be used to form an adhesive layer each comprising one or more adhesive layers A1 and B on one of the support and the substrate. The other of the support and the substrate was placed on the adhesive layer, and the support and the substrate were heated and pressure bonded to produce a laminate of the present invention.

<Manufacturing Method of Semiconductor Device> <<First Embodiment>> Hereinafter, an embodiment of a method of manufacturing a semiconductor device that has been subjected to the step of manufacturing a laminated body will be described with reference to FIGS. 3(A) to 3(E). Explain. Furthermore, the present invention is not limited to the following embodiments. 3(A) to 3(E) are schematic cross-sectional views (Fig. 3(A), Fig. 3(B)) for explaining the temporary connection of the support and the element wafer, respectively, and showing that the support is temporarily attached to the support. The state in which the upper device wafer is thinned (Fig. 3(C)), the state in which the support is peeled off from the device wafer (Fig. 3(D)), and the state after removing the subsequent layer from the component wafer (Fig. 3 (Fig. 3 E)) A schematic cross-sectional view.

In this embodiment, as shown in FIG. 3(A), first, an adhesive support 100 in which the adhesive layer 11 is provided on the support 12 is prepared. Layer 11 is then preferably substantially free of solvent. The element wafer 60 (substrate) is formed by providing a plurality of element wafers 62 on the surface 61a of the ruthenium substrate 61. The thickness of the ruthenium substrate 61 is preferably, for example, 200 μm to 1200 μm. The element wafer 62 is preferably, for example, a metal structure, and has a height of preferably 10 μm to 100 μm. In the process of forming the adhesive layer 11, a step of cleaning the back surface of the support 12 or the element wafer 60 by a solvent or the like may be provided. Specifically, by removing the residue adhering to the support layer 12 or the adhesive layer on the end faces and the back surface of the element wafer 60 by using a solvent that dissolves the adhesive layer, contamination of the device can be prevented, and the total thickness of the thinned component wafer can be reduced. The thickness variation (TTV) is reduced. The solvent used in the step of washing the back surface of the support 12 or the element wafer 60 with a solvent or the like can be used as the solvent contained in the temporarily fixed adhesive described above.

Then, as shown in FIG. 3(B), the adhesive support 100 is pressed against the element wafer 60, and the support 12 and the element wafer 60 are temporarily stopped. Next, it is preferable that the layer 11 is completely covered with the element wafer 62. When the height of the element wafer is X μm and the thickness of the adhesive layer is Y μm, it is preferable to satisfy the relationship of "X+100≧Y>X". . Next, in the case where the layer 11 completely covers the element wafer 62, in the case of further reducing the total thickness variation (TTV) of the thin element wafer (that is, the case where the flatness of the thin element wafer is to be further improved) effective. That is, when the element wafer is thinned, the plurality of element wafers 62 are protected by the adhesion layer 11, and the uneven shape can be substantially eliminated on the contact surface with the support 12. Therefore, even if the thickness is reduced in such a supported state, the transfer of the shape derived from the plurality of element wafers 62 to the back surface 61b1 of the thin-type element wafer is reduced, and as a result, the finally obtained thin-type element can be further reduced. Wafer TTV.

Then, as shown in FIG. 3(C), the back surface 61b of the ruthenium substrate 61 is subjected to mechanical treatment or chemical treatment (not particularly limited, for example, thinning such as grinding or chemical-mechanical polishing (CMP). Treatment under high temperature and vacuum such as chemical vapor deposition (CVD) or physical vapor deposition (PVD), treatment with chemicals such as organic solvents, acidic treatments or alkaline treatment solutions , plating treatment, irradiation with actinic rays, heating and cooling treatment, etc., as shown in FIG. 3(C), the thickness of the ruthenium substrate 61 is made thin (for example, the average thickness is preferably less than 500 μm, more preferably 1). From μm to 200 μm), the thin component wafer 60a is obtained. It is also possible to provide a step of further extending the outer surface of the substrate surface of the component wafer by a solvent in a stage before the thinning of the component wafer and before the processing under high temperature and vacuum. Wash it. Specifically, after thinning the element wafer, the extended adhesive layer is removed by using a solvent that dissolves the adhesive layer, thereby preventing the subsequent layer from being directly subjected to the treatment under high temperature and vacuum to the adhesive layer. Deformation and deterioration. The solvent used in the step of washing the step of further extending to the outer layer of the substrate surface of the element wafer by the solvent may use the solvent contained in the temporarily fixed adhesive. That is, in the present invention, the area of the film surface of the adhesive layer is preferably smaller than the area of the substrate surface of the support. Further, in the present invention, it is more preferable that the diameter of the substrate surface of the support is C μm, the diameter of the substrate surface of the element wafer is D μm, and the diameter of the film surface of the subsequent layer is T μm. , satisfy (C-200) ≧T≧D. Further, it is preferable that the diameter of the substrate surface of the support is C μm, the diameter of the substrate surface of the element wafer is D μm, and the diameter of the film surface on the side of the subsequent layer in contact with the support is preferably set. When T _C μm and the diameter of the film surface on the side in contact with the element wafer of the subsequent layer are T _D μm, (C-200) ≧ T _C &gt; T _D ≧ D is satisfied. By setting such a configuration, it is possible to further suppress deformation and deterioration of the adhesive layer by directly performing the treatment under high temperature and vacuum on the adhesive layer. In addition, the area of the film surface of the adhesion layer means the area when the support body is viewed from the vertical direction, and the unevenness of the film surface is not considered. The same is true for the substrate surface of the component wafer. In other words, the substrate surface of the element wafer herein corresponds to, for example, the surface 61a of FIGS. 3(A) to 3(E). The same is considered for the diameter of the film surface of the adhesive layer or the like. In addition, the diameter T of the film surface of the adhesive layer is set to be T _C μm in the diameter of the film surface on the side in contact with the support of the adhesive layer, and the diameter of the film surface on the side in contact with the element wafer of the subsequent layer. When it is T _D μm, it means T=(T _C +T _D )/2. The diameter of the substrate surface of the support and the diameter of the substrate surface of the element wafer refer to the diameter of the surface on the side in contact with the adhesive layer. In addition, although the support body and the like are defined as "diameter", the support body or the like need not be a circular shape (a perfect circle) in a mathematical sense, and may be a substantially circular shape. In the case of not being a perfect circle, the diameter when converting into a perfect circle of the same area is taken as the diameter. Further, the following treatment may be performed as a mechanical treatment or a chemical treatment: after the thinning treatment, a through hole (not shown) penetrating the back surface 61b1 of the thin element wafer 60a through the ruthenium substrate is formed, and a through hole is formed in the through hole. Electrode (not shown). After the support 12 and the element wafer 60 are temporarily stopped, the heat treatment may be performed during the period until the peeling. An example of the heat treatment may be a heat treatment in a mechanical treatment or a chemical treatment. The maximum reaching temperature in the heat treatment is preferably from 80 ° C to 400 ° C, more preferably from 130 ° C to 400 ° C, still more preferably from 180 ° C to 350 ° C. The highest reaching temperature in the heat treatment is preferably set to a temperature lower than the decomposition temperature of the subsequent layer. The heat treatment is preferably carried out at a maximum temperature of 30 seconds to 30 minutes, more preferably at a maximum temperature of 1 minute to 10 minutes.

Then, as shown in FIG. 3(D), the support 12 is detached from the thin element wafer 60a. The method of the detachment is not particularly limited, and it is preferable that the end portion of the thin element wafer 60a is pulled up in the vertical direction with respect to the thin element wafer 60a without being subjected to any treatment, and is peeled off. At this time, it is preferable that the peeling interface is peeled off at the interface between the support 12 and the adhesive layer 11. In this case, the peeling strength A of the interface between the support 12 and the adhesive layer 11 and the peeling strength B of the element wafer surface 61a and the adhesive layer 11 preferably satisfy the following expression. A<B····(1)

Further, the peeling liquid described later may be brought into contact with the adhesive layer 11, and thereafter, the thin component wafer 60a may be slid with respect to the support 12, and the end portion of the thin component wafer 60a may be perpendicular to the component wafer. Pull up and peel off.

<Peeling Liquid> Hereinafter, the peeling liquid will be described in detail. Water and a solvent (organic solvent) can be used for the stripping liquid. Further, the stripping liquid is preferably an organic solvent in which the subsequent layer 11 is dissolved. The organic solvent may, for example, be an aliphatic hydrocarbon (hexane, heptane, Isopar E, Isopar H, Isopar G (Esso Chemical) )), limonene, p-menthane, decane, decane, dodecane, decahydronaphthalene, etc., aromatic hydrocarbons (toluene, xylene, anisole, mesitylene, ethylbenzene, propyl) Benzene, cumene, n-butylbenzene, t-butylbenzene, isobutylbenzene, tert-butylbenzene, pentylbenzene, isopentylbenzene, (2,2-dimethylpropyl)benzene, 1 -phenylhexane, 1-phenylheptane, 1-phenyloctane, 1-phenyldecane, 1-phenyldecane, cyclopropylbenzene, cyclohexylbenzene, 2-ethyltoluene, 1 ,2-diethylbenzene, o-isopropyltoluene, indoline, 1,2,3,4-tetrahydronaphthalene, 3-ethyltoluene, m-isopropyltoluene, 1,3-diisopropyl Benzene, 4-ethyltoluene, 1,4-diethylbenzene, p-isopropyltoluene, 1,4-diisopropylbenzene, 4-tert-butyltoluene, 1,4-di-third Benzobenzene, 1,3-diethylbenzene, 1,2,3-trimethylbenzene, 1,2,4-trimethylbenzene, 4-tert-butyl-o-xylene, 1,2,4 -Triethylbenzene, 1,3,5-three Ethylbenzene, 1,3,5-triisopropylbenzene, 5-tert-butyl-m-xylene, 3,5-di-t-butyltoluene, 1,2,3,5-tetramethyl Benzene, 1,2,4,5-tetramethylbenzene, pentamethylbenzene, etc.), halogenated hydrocarbons (dichloromethane, dichloroethylene, trichloroethylene, monochlorobenzene, etc.), polar solvents. The polar solvent may, for example, be an alcohol (methanol, ethanol, propanol, isopropanol, 1-butanol, 1-pentanol, 1-hexanol, 1-heptanol, 1-octanol, 2-octanol, 2 -ethyl-1-hexanol, 1-nonanol, 1-nonanol, benzyl alcohol, ethylene glycol monomethyl ether, 2-ethoxyethanol, diethylene glycol monoethyl ether, diethylene glycol monohexyl ether , triethylene glycol monomethyl ether, propylene glycol monoethyl ether, propylene glycol monomethyl ether, polyethylene glycol monomethyl ether, polypropylene glycol, tetraethylene glycol, ethylene glycol monobutyl ether, ethylene glycol monobenzyl ether, ethylene Alcohol monophenyl ether, propylene glycol monophenyl ether, methylphenyl orthool, n-pentanol, methylpentanol, etc.), ketones (acetone, methyl ethyl ketone, ethyl butyl ketone, methyl isobutyl) Ketones, cyclohexanone, etc.), esters (ethyl acetate, propyl acetate, butyl acetate, amyl acetate, benzyl acetate, methyl lactate, butyl lactate, ethylene glycol monobutyl acetate, propylene glycol Monomethyl ether acetate, diethylene glycol acetate, diethyl phthalate, butyl acetonate, etc.), others (triethyl phosphate, tricresyl phosphate, N-phenylethanolamine, N-phenyldiethanolamine, N-methyldiethanolamine, N-B Diethanolamine, 4-(2-hydroxyethyl)morpholine, N,N-dimethylacetamide, N-methylpyrrolidone, etc.).

Further, from the viewpoint of peelability, the peeling liquid may contain a base, an acid, and a surfactant. When the components are blended, the blending amount is preferably from 0.1% by mass to 5.0% by mass based on the stripping solution. Further, from the viewpoint of the releasability, a form in which two or more organic solvents and water, two or more kinds of bases, an acid, and a surfactant are mixed is also preferable.

The base can be used, for example, trisodium phosphate, tripotassium phosphate, triammonium phosphate, disodium hydrogen phosphate, dipotassium hydrogen phosphate, diammonium hydrogen phosphate, sodium carbonate, potassium carbonate, ammonium carbonate, sodium hydrogencarbonate, potassium hydrogencarbonate, carbonic acid. An inorganic alkaline agent such as ammonium hydrogen hydride, sodium borate, potassium borate, ammonium borate, sodium hydroxide, ammonium hydroxide, potassium hydroxide or lithium hydroxide, or monomethylamine, dimethylamine, trimethylamine, monoethylamine or diethyl Amine, triethylamine, monoisopropylamine, diisopropylamine, triisopropylamine, n-butylamine, monoethanolamine, diethanolamine, triethanolamine, monoisopropanolamine, diisopropanolamine, ethylideneamine, B An organic alkali agent such as diamine, pyridine or tetramethylammonium hydroxide. These alkaline agents may be used alone or in combination of two or more.

The acid can be used: inorganic acids such as hydrogen halide, sulfuric acid, nitric acid, phosphoric acid, boric acid, or methanesulfonic acid, ethanesulfonic acid, benzenesulfonic acid, p-toluenesulfonic acid, trifluoromethanesulfonic acid, acetic acid, citric acid, formic acid, glucose. Organic acids such as acid, lactic acid, oxalic acid, and tartaric acid.

As the surfactant, an anionic, cationic, nonionic or zwitterionic surfactant can be used. In this case, the content of the surfactant is preferably from 1% by mass to 20% by mass, and more preferably from 1% by mass to 10% by mass based on the total amount of the aqueous alkaline solution. When the content of the surfactant is set within the above range, the peeling property of the adhesive layer 11 and the thin component wafer 60a tends to be further improved.

The anionic surfactant is not particularly limited, and examples thereof include fatty acid salts, rosinates, hydroxyalkanesulfonates, alkanesulfonates, dialkylsulfosuccinates, and linear alkylbenzenes. Sulfonates, branched alkylbenzenesulfonates, alkylnaphthalenesulfonates, alkyldiphenylethers (di)sulfonates, alkylphenoxypolyoxyethylidenesulfonates An acid salt, a polyoxyalkylene ethyl sulfophenyl ether salt, an N-alkyl-N-oleyl taurine sodium salt, an N-alkyl sulfosuccinic acid monodecylamine disodium salt, Petroleum sulfonates, sulfated castor oil, sulfated tallow oil, sulfate esters of fatty acid alkyl esters, alkyl sulfate salts, polyoxyethylene ethyl ether sulfates, fatty acid monoglycerides Sulfate salts, polyoxyethylene ethyl phenyl ether sulfates, polyoxyethylidene phenyl ether sulfates, alkyl phosphates, polyoxyethylene alkyl Ether phosphate salts, polyoxyethylene ethyl phenyl ether phosphate salts, partial saponifications of styrene-maleic anhydride copolymers, partial soaps of olefin-maleic anhydride copolymers Species, naphthalene sulfonate formalin condensates and the like. Among them, alkylbenzenesulfonates, alkylnaphthalenesulfonates, and alkyldiphenylether (di)sulfonates are preferably used.

The cationic surfactant is not particularly limited, and a conventionally known cationic surfactant can be used. For example, alkylamine salts, quaternary ammonium salts, alkylimidazolium salts, polyoxyalkyleneamine salts, and polyethylene polyamine derivatives can be mentioned.

The nonionic surfactant is not particularly limited, and examples thereof include a polyethylene glycol type higher alcohol ethylene oxide adduct, an alkylphenol ethylene oxide adduct, and an alkyl naphthol ethylene oxide addition. Product, phenol ethylene oxide adduct, naphthol ethylene oxide adduct, fatty acid ethylene oxide adduct, polyol fatty acid ester ethylene oxide adduct, higher alkyl amine epoxy Ethane adduct, fatty acid decylamine ethylene oxide adduct, ethylene oxide adduct of fats and oils, polypropylene glycol ethylene oxide adduct, dimethyl oxa oxide-ethylene oxide block Copolymer, dimethyloxane-(propylene oxide-ethylene oxide) block copolymer, fatty acid ester of glycerol of polyol type, fatty acid ester of pentaerythritol, fatty acid of sorbitol and sorbitan A fatty acid ester of an ester or sucrose, an alkyl ether of a polyhydric alcohol, a fatty acid decylamine of an alkanolamine, or the like. Among them, it preferably has an aromatic ring and an ethylene oxide chain, more preferably an alkyl-substituted or unsubstituted phenol ethylene oxide adduct or an alkyl-substituted or unsubstituted naphthol epoxy B. Alkane adduct.

The zwitterionic surfactant is not particularly limited, and examples thereof include an amine oxide system such as an alkylamine oxide, an alkoxylate such as an alkylbetaine, and an amino acid such as an alkylamino fatty acid sodium. In particular, an alkyl dimethyl amine oxide which may have a substituent, an alkylcarboxybetaine which may have a substituent, and an alkyl sulfobetaine which may have a substituent may be preferably used. Specifically, the compound represented by the formula (2) of the paragraph number [0256] of JP-A-2008-203359, the formula (I) of the paragraph number [0028] of JP-A-2008-276166, The compound represented by the formula (II) and the formula (VI), and the compound represented by paragraph number [0022] to paragraph number [0029] of JP-A-2009-47927.

Further, an additive such as an antifoaming agent and a hard water softening agent may be contained as needed.

Then, as shown in FIG. 3(E), the adhesive layer 11 is removed from the thin-type device wafer 60a, whereby a thin-type component wafer can be obtained. The method of removing the layer 11 is, for example, a method in which the adhesive layer is held in a film shape and peeled off (mechanical peeling), a method in which the adhesive layer is swollen by a peeling liquid, and then peeled off, and a method in which the peeling liquid is sprayed on the adhesive layer to remove the peeling liquid. A method in which an adhesive layer is dissolved in a peeling liquid to be dissolved and removed, and a method in which the adhesive layer is decomposed by vaporization, radiation, or heat to remove the vaporized layer, and the like. A method in which the adhesive layer is held in a film shape and peeled off, and a method in which the adhesive layer is dissolved in an aqueous solution or an organic solvent to be dissolved and removed can be preferably used. As the organic solvent, the organic solvent described in the above-mentioned peeling liquid can be used. From the viewpoint of reducing the amount of the solvent used, it is preferably removed in a film form. Further, from the viewpoint of reducing damage on the surface of the element wafer, it is preferably dissolved and removed. In order to remove the film shape, it is preferable that the peel strength B of the element wafer surface 61a and the adhesive layer 11 satisfy the following formula (2). B≦4 N/cm····(2)

When the peeling strength of the interface between the support 12 and the adhesive layer 11 is A, and the peeling strength of the element wafer surface 61a and the adhesive layer 11 is B, the above formula (1) is satisfied. The formula (2) can be peeled off from the end of the thin element wafer 60a in the vertical direction with respect to the element wafer without peeling off when the support 12 is peeled off from the thin element wafer 60a, and can be peeled off, and The adhesive layer 11 on the element wafer surface 61a is removed in a film shape. After the support 12 is detached from the thin element wafer 60a, various known processes are performed on the thin element wafer 60a as needed to manufacture a semiconductor device having the thin element wafer 60a.

Further, when the adhesion layer is attached to the support, the support can be regenerated by removing the adhesive layer. In the method of removing the adhesive layer, if the film shape is maintained, a method of physically removing by spraying with a brush, an ultrasonic wave, an ice particle, or an aerosol may be mentioned; and the solution may be dissolved in an aqueous solution or an organic solvent to be dissolved. A method of removing a chemical removal method such as a method of decomposing or vaporizing by irradiation with actinic rays, radiation, or heat, and a previously known cleaning method can be used depending on the support. For example, in the case of using a tantalum substrate as a support, a cleaning method of a previously known tantalum wafer can be used, for example, an aqueous solution or an organic solvent which can be used in the case of chemical removal can be exemplified by a strong acid, a strong base, a strong oxidizing agent or the like. Specific examples of the mixture of the substances include acids such as sulfuric acid, hydrochloric acid, hydrofluoric acid, nitric acid, and organic acids, alkalis such as tetramethylammonium, ammonia, and organic bases, oxidizing agents such as hydrogen peroxide, or a mixture of ammonia and hydrogen peroxide. And a mixture of hydrochloric acid and hydrogen peroxide water, a mixture of sulfuric acid and hydrogen peroxide water, a mixture of hydrofluoric acid and hydrogen peroxide water, a mixture of hydrofluoric acid and ammonium fluoride, and the like.

From the viewpoint of the adhesion of the case where the regenerated support is used, it is preferred to use a support cleaning liquid. The support cleaning liquid preferably contains an acid (strong acid) having a pKa of less than 0 and hydrogen peroxide. The acid having a pKa of less than 0 is selected from inorganic acids such as hydrogen iodide, perchloric acid, hydrogen bromide, hydrogen chloride, nitric acid, sulfuric acid, or the like, or an organic acid such as an alkylsulfonic acid or an arylsulfonic acid. From the viewpoint of the cleaning property of the adhesive layer on the support, a mineral acid is preferred, and sulfuric acid is preferred.

Hydrogen peroxide can preferably use 30% by mass of hydrogen peroxide water, and the mixing ratio of the strong acid to 30% by mass of hydrogen peroxide water is preferably 0.1:1 to 100:1 by mass ratio, more preferably 1 : 1 to 10:1, preferably 3:1 to 5:1.

<<Second Embodiment>> A second embodiment of a method of manufacturing a semiconductor via a step of manufacturing a laminated body will be described with reference to FIGS. 4(A) to 4(E). The same portions as those of the first embodiment described above are denoted by the same reference numerals, and their description will be omitted. 4(A) to 4(E) are schematic cross-sectional views (FIG. 4(A), FIG. 4(B)) for explaining the temporary connection of the support and the element wafer, respectively, and showing that the support is temporarily attached to the support. The state in which the upper device wafer is thinned (Fig. 4(C)), the state in which the support is peeled off from the device wafer (Fig. 4(D)), and the state after removing the subsequent layer from the component wafer (Fig. 4 (Fig. 4 E)) A schematic cross-sectional view. In this embodiment, as shown in FIG. 4(A), the formation of the adhesive layer on the surface 61a of the element wafer is different from that of the first embodiment. When the adhesion layer 11a is provided on the surface 61a of the element wafer 60, the adhesive can be temporarily fixed by applying (preferably coating) on the surface of the surface 61a of the element wafer 60, followed by drying (drying) Bake) to form the adhesive layer 11a. Drying can be carried out, for example, at 60 ° C to 150 ° C for 10 seconds to 2 minutes. Then, as shown in FIG. 4(B), the support 12 is pressed against the element wafer 60, and the support 12 and the element wafer 60 are temporarily stopped. Then, as shown in FIG. 4(C), the back surface 61b of the ruthenium substrate 61 is subjected to mechanical treatment or chemical treatment, and as shown in FIG. 4(C), the thickness of the ruthenium substrate 61 is made thin, and the thin element wafer 60a is obtained. Then, as shown in FIG. 4(D), the support 12 is detached from the thin element wafer 60a. Then, as shown in FIG. 4(E), the adhesive layer 11a is removed from the thin component wafer 60a.

<<Third Embodiment>> A third embodiment of a method of manufacturing a semiconductor via a step of manufacturing a laminated body will be described with reference to FIGS. 5(A) to 5(E). The same portions as those of the first embodiment described above are denoted by the same reference numerals, and their description will be omitted. 5(A) to 5(E) are schematic cross-sectional views (Fig. 5(A), Fig. 5(B)) for explaining the temporary connection of the support and the element wafer, respectively, and showing the temporary support to the support. The state in which the upper device wafer is thinned (Fig. 5(C)), the state in which the support is separated from the device wafer (Fig. 5(D)), and the state in which the subsequent layer is removed from the device wafer (Fig. 5) (E)) A schematic cross-sectional view. In this embodiment, the following aspects are different from the first embodiment in that, as shown in FIGS. 5(A) and 5(B), an adhesion layer 11b is formed on the support body 12 and the surface 61a of the element wafer, respectively. Next, the layer 11c presses the surfaces of the support and the element wafer on the side on which the adhesive layer is formed, thereby producing a laminate (the support 12 and the element wafer 60 are temporarily stopped). At least one of the layer 11b and the subsequent layer 11c can be formed using the temporarily fixed adhesive of the present invention. The adhesive layer of the present invention may also be used to form both the adhesive layer 11b and the adhesive layer 11c, and the temporary fixing adhesive of the present invention may be used to form only one adhesive layer, and the temporary fixing adhesive described above may be used. B to form another layer. It is preferable to form the adhesive layer 11b using the temporarily fixed adhesive B described above, and to form the adhesive layer 11c using the temporarily fixed adhesive of the present invention of the present invention. Further, the adhesive layer 11b and the adhesive layer 11c may be composed of only one layer, or may be a laminate in which two or more layers are laminated. In other words, each of the adhesive layers may be formed by laminating two or more types of temporarily fixed adhesives. After the support 12 and the element wafer 60 are temporarily stopped, as shown in FIG. 5(C), the back surface 61b of the ruthenium substrate 61 is subjected to mechanical treatment or chemical treatment, and the ruthenium substrate 61 is formed as shown in FIG. 5(C). The thickness is thinned, and the thin component wafer 60a is obtained. Then, as shown in FIG. 5(D), the support 12 is detached from the thin element wafer 60a. Then, as shown in FIG. 5(E), the adhesive layer 11d is removed from the thin component wafer 60a.

<<Previous Embodiment>> Next, the previous embodiment will be described. Fig. 6 is a schematic cross-sectional view for explaining the release of the temporary adhesion state of the previous adhesive support and the element wafer. In the prior embodiment, as shown in Fig. 6, an adhesive support 100a having a bonding layer 11b formed of a conventional temporary fixing adhesive is provided as a support member, except for the support member 12. In addition, similarly to the procedure described with reference to FIGS. 3(A) to 3(E), the adhesive support 100a and the element wafer are temporarily placed, and the thin film of the element wafer is thinned, and then The thin element wafer 60a is peeled off from the adhesive support 100a in the same manner as described above.

However, according to the conventional temporary fixing adhesive, it is difficult to temporarily support the element wafer by a high adhesion force, and the temporary support of the element wafer can be easily released without causing damage to the element wafer. For example, in order to make the temporary bonding of the element wafer and the support sufficiently sufficient for the previous temporary fixing adhesive, the temporary adhesion of the element wafer and the support tends to be too strong. Therefore, in order to release the excessively strong temporary adhesion, for example, as shown in FIG. 6, an adhesive tape (for example, a dicing tape) 70 is attached to the back surface of the thin component wafer 60a, and the thin component wafer 60a is peeled off from the adhesive support 100a. In the case of the structure 63, the element wafer 62 from which the structure 63 is provided is detached, and the element wafer 62 is likely to be damaged. On the other hand, if the adhesiveness of the previous temporary fixing adhesive is low, the temporary support of the component wafer can be easily released. However, the temporary sealing of the component wafer and the support is too weak, which is likely to occur. It is not possible to reliably support a defect such as a component wafer by the support.

On the other hand, the laminated body of the present invention exhibits sufficient adhesion, and the temporary attachment of the element wafer 60 and the support 11 can be easily released. That is, according to the laminated body of the present invention, the element wafer 60 can be temporarily terminated by a high adhesion force, and the temporary replacement of the thin element wafer 60a can be easily released without causing damage to the thin element wafer 60a. .

The method of manufacturing the semiconductor device of the present invention is not limited to the above-described embodiments, and appropriate modifications, improvements, and the like can be made. Further, in the embodiment described above, the adhesive layer has a single layer structure, but the adhesive layer may have a multilayer structure. Further, in the above-described embodiment, the tantalum substrate is used as the element wafer. However, the present invention is not limited thereto, and may be any member to be processed which can be subjected to mechanical treatment or chemical treatment in the method of manufacturing a semiconductor device. For example, a compound semiconductor substrate may be mentioned, and specific examples of the compound semiconductor substrate include a SiC substrate, a SiGe substrate, a ZnS substrate, a ZnSe substrate, a GaAs substrate, an InP substrate, and a GaN substrate. Further, in the above-described embodiments, the thin film formation process of the element wafer and the formation process of the tantalum through electrode are referred to as mechanical processing or chemical treatment of the element wafer (tantalum substrate), but are not limited to the processes. Any processing necessary for the method of manufacturing the semiconductor device can also be cited. Further, the shape, size, number, arrangement position, and the like of the element wafer of the element wafer exemplified in the above-described embodiment are not limited.

<Set> Next, the kit of the present invention will be described. The kit of the present invention comprises: a temporarily fixed adhesive A, a compound containing a lipophilic group and a fluorine atom at 25 ° C and an elastomer; and a temporarily fixed adhesive B containing a thermoplastic resin. The temporarily fixed adhesive A has the same meaning as the temporarily fixed adhesive of the present invention, and the preferred range is also the same. The temporarily fixed adhesive B has the same meaning as the temporarily fixed adhesive B described in the laminate of the present invention, and the preferred range is also the same. The kit of the present invention preferably further comprises a substrate and a support. Examples of the substrate and the support include the substrate and the support described in the laminate described above, and the substrate and the support can be used. By further including a substrate and a support, a laminate having a subsequent layer including the above-described adhesive layer A1 and the above-described adhesive layer A2 between the substrate and the support can be produced. [Examples]

Hereinafter, the present invention will be more specifically described by the examples, but the present invention is not limited to the following examples as long as the scope of the invention is not exceeded. In addition, "parts" and "%" are quality standards unless otherwise specified. Further, propylene glycol-1-methyl ether acetate was referred to as "PGMEA".

[Test Example 1 (Example of using a temporarily fixed adhesive on a support having a release layer)] <Formation of an adhesive support 1> A RS-72-K containing 2 g was used by a spin coater (Di Aisheng) (DIC) (manufactured by DIC) (30 mass% PGMEA solution) and 30 g of PGMEA coating liquid for forming a release layer were applied onto a 100 mm diameter Si wafer (support) and baked at 120 ° C. After 30 seconds, the mixture was further heated at 190 ° C for 3 minutes to prepare a support 1 with a release layer. Then, the coating liquid 1 for forming an adhesive layer was applied onto the support 1 with a release layer by a spin coater, baked at 110 ° C for 1 minute, and further baked at 190 ° C for 4 minutes. This produces an adhesive support 1 having an adhesive layer.

<Composition of the coating liquid 1 for layer formation> A component: The component A shown in Table 1 is the mass part and B component shown in Table 1: The component B shown in Table 1 is shown in Table 1. Ingredients: Irganox 1010 (manufactured by BASF): 0.9 parts by mass · Sumilizer TP-D (manufactured by Sumitomo Chemical Co., Ltd.): 0.9 parts by mass·solvent : The solvent described in Table 1 was made into parts by mass shown in Table 1.

The compounds described in Table 1 are as follows. [Component A] (a-1): Megafac F-553 (fluorine-based, hydrophilic, oleophilic oligomer, liquid compound (viscosity at 25 ° C from 1 mPa·s to 100,000) Range of mPa·s), 10% thermal mass reduction temperature = 247 ° C, Mw = 0.2 million or more and less than 20,000, manufactured by Di Ai Sheng (DIC) (a-2): Megafac F-554 ( Fluorinated group, lipophilic group oligomer, liquid compound (viscosity in the range of 1 mPa·s to 100,000 mPa·s at 25 ° C), 10% thermal mass reduction temperature = 267 ° C, Mw = 0.2 million or more And less than 20,000, manufactured by Di Aisheng (DIC)) (a-3): Megafac F-556 (fluorinated, hydrophilic, lipophilic oligomer, liquid compound (at 25 ° C Viscosity is in the range of 1 mPa·s to 100,000 mPa·s), 10% thermal mass reduction temperature = 277 ° C, Mw = 0.2 million or more and less than 20,000, manufactured by Di Ai Sheng (DIC) (a-4): Megafac F-557 (fluorine-based, hydrophilic, lipophilic oligomer, liquid compound (viscosity at 25 ° C in the range of 1 mPa·s to 100,000 mPa·s), 10% heat Quality minus Less temperature = 299 ° C, Mw = 0.2 million or more and less than 20,000, manufactured by Di Ai Sheng (DIC) (a-5): Megafac F-559 (fluorinated, hydrophilic, lipophilic Oligomer, liquid compound (viscosity in the range of 1 mPa·s to 100,000 mPa·s at 25 ° C), 10% thermal mass reduction temperature = 286 ° C, Mw = 20,000 or more and less than 50,000, Di Ai Sheng ( Manufactured by DIC) (a-6): Ftergent 710FL (fluorine-based, hydrophilic, lipophilic oligomer, liquid compound (viscosity at 25 ° C from 1 mPa·s to 100,000 mPa) · range of s), manufactured by Neos (a-7): Megafac F-477 (fluorine-based, hydrophilic, lipophilic oligomer, liquid compound (25) The viscosity at °C is in the range of 1 mPa·s to 100,000 mPa·s), 10% thermal mass reduction temperature = 254 ° C, Mw = 0.2 million or more and less than 20,000, manufactured by Di Ai Sheng (DIC) Co., Ltd. (a-8 ): Megafac R-40 (fluorine-based, hydrophilic, lipophilic oligomer, liquid compound (viscosity at 25 ° C from 1 mPa·s to 100,000 mPa·s) ), 10% thermal mass reduction temperature = 256 ° C, Mw = 0.2 million or more and less than 20,000, manufactured by Di Ai Sheng (DIC) (a-9): Megafac R-41 (fluorine-based, pro Oil-based oligomer, liquid compound (viscosity at 25 ° C in the range of 1 mPa·s to 100,000 mPa·s), 10% thermal mass reduction temperature = 235 ° C, Mw = 0.2 million or more and less than 20,000 (A-10): Megafac R-43 (fluorine-based, lipophilic oligomer, liquid compound (viscosity at 25 ° C is 1 mPa·s ~ 100,000 mPa·s range), 10% thermal mass reduction temperature = 249 ° C, Mw = 0.2 million or more and less than 20,000, manufactured by Di Ai Sheng (DIC) (Ra-1): Daifree FB962 ( Fluorine-containing solid, Mw = 0.2 million or more and less than 20,000, manufactured by Daikin) (Ra-2): Megafac F552 (fluorine-based, oleophilic oligomer, waxy, Mw = 0.20 or more and less than 20,000, manufactured by Di Aisheng (DIC) (Ra-3): Megafac F562 (fluorine-based, hydrophilic, lipophilic oligomer, solid, Mw=2.0 Above and less than 50,000, manufactured by Diane Health (DIC)) (Ra-4): Megafac F430 (fluorine-based, hydrophilic-based oligomer, liquid compound, Mw = 0.050 to less than 2 million , manufactured by Di Ai Sheng (DIC) (Ra-5): Megafac F444 (perfluoroalkyl oxirane adduct, liquid compound without lipophilic group, Mw = 0.0500 ~ less than 0.2 million, manufactured by Diane (DIC)) (Ra-6): Demnum S-200 (liquid compound containing fluorine-containing atoms and containing no lipophilic group, manufactured by Daikin) [B component] ( B-1): Septon 2002 (hydrogenated polystyrene elastomer, styrene content = 30% by mass, unsaturated double bond amount = less than 0.5 mmol/g, 5% thermal mass reduction temperature = 350 Above °C and less than 400 °C, Mw = 50,000 or more and less than 100,000, hardness (type A durometer) = 80, manufactured by Kuraray (stock)) (b-2): Septon 2104 (Hydrogenated polystyrene elastomer, styrene content = 65 mass%, unsaturated double bond amount = less than 0.5 mmol / g, 5% thermal mass reduction temperature = 400 ° C or more Less than 450 ° C, Mw = 50,000 or more and less than 100,000, hardness (type A durometer) = 98, manufactured by Kuraray Co., Ltd.) (b-3): Septon 2063 (hydrogenated poly Styrene elastomer, styrene content = 13% by mass, unsaturated double bond amount = less than 0.5 mmol / g, 5% thermal mass reduction temperature = 400 ° C or more and less than 450 ° C, Mw = 100,000 or more and less than 20 Million, hardness (type A durometer) = 36, manufactured by Kuraray (share)) (b-4): Septon 2004 (hydrogenated polystyrene elastomer, styrene content = 18 Mass %, unsaturated double bond amount = less than 0.5 mmol/g, 5% thermal mass reduction temperature = 350 ° C or more and less than 400 ° C, Mw = 50,000 or more and less than 100,000, hardness (type A durometer) = 67, (Manufactured by Kuraray Co., Ltd.) (b-5): Septon 2007 (hydrogenated polystyrene elastomer, styrene content = 30% by mass, unsaturated double bond amount = less than 0.5 mmol) /g, 5% thermal mass reduction temperature = 400 ° C or more and less than 450 ° C, Mw = 50,000 or more and less than 100,000, hardness (type A durometer) = 80, Kuraray (shares) (manufacturing) (b-6): Tuftec P2000 (hydrogenated polystyrene elastomer, styrene content = 67% by mass, unsaturated double bond amount = 0.5 mmol/g or more and less than 5 mmol / g, 5% thermal mass reduction temperature = 400 ° C or more and less than 450 ° C, Mw = 50,000 or more and less than 100,000, hardness (type A durometer) = 90 or more, manufactured by Asahi Kasei (stock) (b-7): RB810 (polybutadiene-based elastomer, the amount of unsaturated double bonds is 15 mmol/g or more, 5% thermal mass reduction temperature = 100 ° C or more and less than 250 ° C, Mw = 200,000 or more and less than 300,000, Czech Republic (JSR) (manufactured by the company) (b-8): SIS5200P (non-hydrogenated polystyrene elastomer, styrene content = 15% by mass, unsaturated double bond amount = 5 mmol / g or more and less than 15 mmol / g, 5% thermal mass reduction temperature = 250 ° C or more and less than 350 ° C, Mw = 100,000 or more and less than 200,000, JSR (manufactured by JSR) (Rb-1): ZEONEX 480R (cycloolefin polymer manufactured by Zeon, Japan) (Rb-2): Durimide (registered trademark) 284 (polyimide manufactured by Fujifilm) (Rb-3) ): PCZ300 (polycarbonate manufactured by Mitsubishi Gas Chemical Co., Ltd.) The amount of unsaturated double bonds is a value calculated by NMR measurement. The mass reduction temperature is a value measured under a nitrogen flow by a thermogravimetric measuring device (TGA) at a temperature of 20 ° C/min from 25 ° C.

<Preparation of test piece> The surface of the adhesive support 1 on the side where the layer was formed and the surface of the Si wafer (component wafer) having a diameter of 100 mm were subjected to a pressure of 0.11 MPa at 190 ° C under vacuum. Press the crimp for 3 minutes to make a test piece.

<Adhesion> A tensile force tester (digital force gauge manufactured by Imada Co., Ltd., type: ZP-50N) was used at a surface of the following layer at a condition of 250 mm/min. The film was stretched in the direction, and the shearing force of the test piece was measured, and evaluated according to the following criteria. A: Adhesion force of 50 N or more B: Adhesion force of 10 N or more and less than 50 N C: Adhesion force of less than 10 N

<Peelability> The test piece was placed in the center of a dicing tape mounter together with a dicing frame so that the dicing tape was positioned above. The test piece and the dicing tape were fixed by a roller (and a vacuum), the dicing tape was cut on the cutting frame, and the test piece was mounted on the dicing tape. The test piece was stretched in the vertical direction (90° direction) of the subsequent layer under conditions of 50 mm/min, and the peeling property was evaluated on the following basis. Further, the prepared test piece was heated at 250 ° C for 30 minutes, and then stretched in the vertical direction of the adhesive layer under the condition of 50 mm/min in the same manner, and the peeling property after the hot working process was confirmed, and the evaluation was performed based on the following criteria. Furthermore, it was visually confirmed whether or not the Si wafer was damaged. A: It can be peeled off with a maximum peeling force of less than 1 N/cm. B: It can be peeled off with a maximum peeling force of 1 N/cm or more and less than 2 N/cm. C: It can be peeled off with a maximum peeling force of 2 N/cm or more and less than 4 N/cm. D: The maximum peeling force is 4 N/cm or more or the Si wafer is broken.

<Removability (Dissolution Removal)> The Si wafer (element wafer) with the subsequent layer after the end of the peeling test was placed in the spin coater with the subsequent layer facing upward, using the same as described in Table 1 below. Next, the same solvent as the solvent for the coating liquid for layer formation was used as a washing solvent, and it sprayed for 5 minutes. Further, in Comparative Example 8, Comparative Example 9, and Comparative Example 10 in which no mesitylene was used for the 5-minute spray, isopropyl alcohol (IPA) was sprayed while the Si wafer was rotated to perform rinsing. Further, spin drying is performed. Then, the appearance was observed, and the presence or absence of the remaining layer on the element surface of the Si wafer (element wafer) was visually observed and evaluated according to the following criteria. A: The remaining layer was not confirmed. B: Confirmation of the remaining layer.

<Removability (film removal)> The Si wafer (component wafer) with an adhesive layer after the peelability test was fixed, and a peeling tape was attached to the adhesive layer on the Si wafer with the adhesive layer (Lintko) (manufactured by Lintec Co., Ltd.), the release tape is stretched in the vertical direction with respect to the adhesive layer, and the adhesive layer is pulled up at a speed of 50 mm/min in the 90° direction from the Si wafer (component wafer) Film peeling of the adhesive layer was performed on the element surface. Then, the appearance was observed, and the presence or absence of peeling residue of the adhesive layer remaining on the Si wafer was visually observed and evaluated according to the following criteria. A: The film removal of the adhesive layer was performed without peeling at a peeling strength of 4 N/cm or less, and the peeling residue of the adhesive layer was not confirmed. B: The film removal of the adhesive layer was performed without peeling at a peeling strength of more than 4 N/cm, and the peeling residue of the adhesive layer was not confirmed. C: does not conform to any of the above A and B (middle breakage of film peeling)

According to the results, the adhesion and peelability of the examples were good. Further, the removability of the subsequent layer is good. On the other hand, the comparative example had poor peelability.

[Test Example 2 (Example of using a temporarily fixed adhesive on a support having no release layer)] <Formation of an adhesive support 2> The coating liquid 2 for forming an adhesive layer was applied to a diameter by a spin coater. After baking on a 100 mm Si wafer, it was baked at 110 ° C for 1 minute and further baked at 190 ° C for 4 minutes, thereby producing an adhesive support 2 having an adhesive layer. <Composition of the coating liquid 2 for layer formation> A component: The component A shown in Table 2 is the mass part and B component shown in Table 2: The component B shown in Table 2 is shown in Table 2. Ingredients: Irganox 1010 (manufactured by BASF): 0.9 parts by mass · Sumilizer TP-D (manufactured by Sumitomo Chemical Co., Ltd.): 0.9 parts by mass·solvent : The solvent described in Table 2 was made into parts by mass shown in Table 2

The compounds described in Table 2 are as follows. [A component] (a-1) to (a-10), (Ra-1) to (Ra-6): (a-1) to (a-10) and (Ra-1) of Table 1 (Ra-6) is the same [B component] (b-1) to (b-8), (Rb-1) to (Rb-3): and (b-1) to (b-8) of Table 1, (Rb-1) to (Rb-3) are the same

<Preparation of the test piece> The surface of the adhesive support 2 on the side where the adhesive layer was formed and the Si wafer having a diameter of 100 mm were pressure-bonded at 190 ° C for 3 minutes under a pressure of 0.11 MPa to prepare a test piece. .

<Adhesion> The adhesion was evaluated by the same method and criteria as those of the adhesion evaluation in Test Example 1. <Peelability> The peeling property was evaluated by the same method and criteria as the peelability evaluation in the test example 1. <Removability (Dissolution Removal)> The removability (dissolution removal) was evaluated by the same method and criteria as those in the test example 1 for the removal (dissolution removal). <Removability (film removal)> The removability (film removal) was evaluated by the same method and standard as the removal property (film removal) in the test example 1.

According to the results, the adhesion and peelability of the examples were good. Further, the removability of the subsequent layer is good. On the other hand, the comparative example had poor peelability.

[Test Example 3 (Example of using a film on a support having a release layer)] <Formation of an adhesive support 3> A RS-72-K containing 2 g was used by a spin coater (Di Aisheng (DIC) (manufactured by the company) (30% by mass of PGMEA solution) and 30 g of PGMEA coating liquid for forming a release layer were applied onto a Si wafer having a diameter of 100 mm, and baked at 120 ° C for 30 seconds, and then at 190 The mixture was heated at ° C for 3 minutes to prepare a support 3 with a release layer. Then, the adhesive film produced by the following method was placed in a vacuum laminator. Then, using the apparatus, the adhesive film is placed on the release layer of the support body 3 with the release layer, and the support body 3 with the release layer is brought into contact with the adhesive film under vacuum, and the adhesive film and the release layer are separated by a roller. The support 3 is fixed, and an adhesive support 3 having an adhesive layer (sheet-like adhesive layer) is produced.

<Method for Producing Film Next> The composition for forming a film for forming films of Examples 41 to 54 and 57 to 60 and Comparative Example 21 to Comparative Example 28 was applied by a wire bar at a speed of 1 m/min. The film was dried on a release-molded polyethylene terephthalate (PET) film having a thickness of 75 μm at 140 ° C for 10 minutes to prepare a film having a film thickness of 100 μm. The composition for forming an adhesive film of Example 55 and Example 56 was melt-stirred at 300 ° C for 5 minutes, and extruded from a slit having a width of 100 μm to prepare a film (extruded sheet).

(Composition of the composition for film formation) A component: The component A shown in Table 3 is the mass part and B component shown in Table 3: The component B shown in Table 3 is the mass part shown in Table 3. · Irganox 1010 (manufactured by BASF): 0.9 parts by mass (3.0 parts by Example 55 and Example 56 only) · Sumilizer TP-D (Sumitomo (manufactured by Chemicals Co., Ltd.): 0.9 parts by mass (3.0 parts by mass of Example 55 and Example 56 only) - Solvent: The solvent described in Table 3 was made into parts by mass shown in Table 3.

The compounds described in Table 3 are as follows. [A component] (a-1) to (a-10), (Ra-1) to (Ra-6): (a-1) to (a-10) and (Ra-1) of Table 1 (Ra-6) identical (Ra-7): polyethylene glycol (average Mw = 1000) (liquid compound without fluorine atom) [B component] (b-1), (b-2), (b -6): same as (b-1), (b-2), and (b-6) of Table 1 (b-9): Hytrel 7247 (polyester elastomer, 5% thermal mass reduction) Temperature = 383 ° C, hardness (type A durometer) = 90 or more, manufactured by Toray DuPont) (b-10): Primalloy CP300 (polyester elastomer, 5% thermal mass reduction temperature = 399 ° C, hardness (type A hardness tester) = 90 or more, manufactured by Mitsubishi Chemical Corporation)

<Preparation of test piece> The surface of the adhesive support 3 on the side where the adhesive layer was formed and the Si wafer having a diameter of 100 mm were pressure-bonded at 190 ° C for 3 minutes under a pressure of 0.11 MPa to prepare a test piece. .

<Adhesion> The adhesion was evaluated by the same method and criteria as those of the adhesion evaluation in Test Example 1. <Peelability> The peeling property was evaluated by the same method and criteria as the peelability evaluation in the test example 1. <Removability (dissolution removal)> The Si wafer with an adhesive layer after the end of the peelability test was placed in a spin coater with the subsequent layer facing upward, and the solvent described in Table 3 below was used as a cleaning solvent, and sprayed. 5 minutes. Further, spin drying is performed. Thereafter, the appearance was observed, and the presence or absence of the remaining layer was visually confirmed and evaluated according to the following criteria. A: Remaining of the adhesive layer was not confirmed. B: Remaining of the adhesive layer was confirmed. <Removability (film removal)> The removability (film removal) was evaluated by the same method and standard as the removal (film removal) in the test example 1. .

According to the results, the adhesion and peelability of the examples were good. Further, the removability of the subsequent layer is good. On the other hand, the comparative example had poor peelability.

[Test Example 4] <Formation of Adhesive Support 4> The coating liquid 4 for forming an adhesive layer was applied onto a Si wafer having a diameter of 100 mm and a thickness of 525 μm by a spin coater, and baked at 110 ° C. After 1 minute, it was baked at 190 ° C for 4 minutes, thereby producing an adhesive support 4 having an adhesive layer. <Composition of the coating liquid for layer formation> A component: The component A shown in Table 4 is the mass part and B component shown in Table 4: The component B shown in Table 4 is the mass shown in Table 4. Irganox 1010 (manufactured by BASF): 0.9 parts by mass · Sumilizer TP-D (manufactured by Sumitomo Chemical Co., Ltd.): 0.9 parts by mass Toluene: 30 parts by mass

The compounds described in Table 4 are as follows. [A component] (a-1), (a-5): same as (a-1) and (a-5) of Table 1 [B component] (b-1) to (b-6): and table 1 (b-1) to (b-6) are the same (b-11): Septon 4033 (hydrogenated polystyrene elastomer, styrene content = 30% by mass, unsaturated double bond amount) = less than 0.5 mmol / g, 5% thermal mass reduction temperature = 400 ° C and above and less than 400 ° C, hardness (type A durometer) = 76, manufactured by Kuraray (stock)) (b-12): Saip Septon 4044 (hydrogenated polystyrene elastomer, styrene content = 30% by mass, unsaturated double bond amount = less than 0.5 mmol / g, 5% thermal mass reduction temperature = 400 ° C and above and less than 450 ° C, Kuraray (manufactured by Kuraray) (b-13): Kraton G1650 (hydrogenated polystyrene elastomer, styrene content = 30% by mass, unsaturated double bond amount = less than 0.5 mmol / g, 5% thermal mass reduction temperature = 400 ° C or more and less than 450 ° C, hardness (type A durometer) = 70, manufactured by Kraton (b-14): Septon 8104 (hydrogenation) Polystyrene elastomer, styrene containing Rate = 60% by mass, amount of unsaturated double bonds = less than 0.5 mmol/g, 5% thermal mass reduction temperature = 350 ° C or more and less than 400 ° C, hardness (type A durometer) = 98, Kuraray (shares) ))) (b-15): Kraton A1535 (hydrogenated polystyrene elastomer, styrene content = 58% by mass, unsaturated double bond amount = less than 0.5 mmol / g, 5% thermal mass reduction) Temperature = 400 ° C or more and less than 450 ° C, hardness (type A durometer) = 83, manufactured by Kraton

<Production of test piece> The surface of the adhesive support 4 on the side of the adhesive layer and the surface of a 100 mm Si wafer (component wafer) having a diameter of 100 mm and a thickness of 525 μm were placed under vacuum at 190 ° C. The test piece was prepared by crimping at a pressure of 0.11 MPa for 3 minutes.

<Adhesion> The adhesion was evaluated by the same method and criteria as those of the adhesion evaluation in Test Example 1. <Peelability> The peeling property was evaluated by the same method and criteria as the peelability evaluation in the test example 1. <Removability (Dissolution Removal)> The removability (dissolution removal) was evaluated by the same method and criteria as those in the test example 1 for the removal (dissolution removal). <Removability (film removal)> The removability (film removal) was evaluated by the same method and standard as the removal property (film removal) in the test example 1. <Flat Polishing Property> The element wafer of the produced test piece was polished to a thickness of 35 μm. The polished surface of the device wafer was visually confirmed to confirm the presence or absence of a depression having a diameter of 1 mm or more. A: There is no depression at all. B: A small amount of depression is generated, but it is tolerable. C: A large number of depressions are generated and cannot be tolerated. <Wafer Warpage> After polishing the component wafer of the prepared test piece to a thickness of 35 μm, the temperature rise rate and the cooling rate were set to 10 ° C using FLX-2320 manufactured by KLA-Tencor. Min, heated from room temperature to 200 ° C, and then cooled to room temperature, and the Bow (bending) value was measured. A: Bow value is 40 μm or less B: Bow value is more than 40 μm and less than 80 μm C: Bow value is 80 μm or more

According to the results, the adhesion and peelability of the examples were good. Further, the adhesion of the subsequent layer and the flatness of the polishing property are good, and the warpage of the wafer is suppressed. Further, in the examples in which the above-described elastomer A and elastomer B were used as the elastomer, the flatness of the flatness was particularly good.

[Test Example 5] <Formation of Adhesive Support 5> The coating liquid 5 for forming an adhesive layer was applied onto a Si wafer having a diameter of 100 mm and a thickness of 525 μm by a spin coater, and then baked at 110 ° C. The mixture was baked for 1 minute and further baked at 190 ° C for 4 minutes to prepare an adhesive support 5 having an adhesive layer. <Composition of the coating liquid for layer formation> A component: The component A shown in Table 5 is the mass part and B component shown in Table 5: The component B shown in Table 5 is the mass shown in Table 5. Part C: The C component shown in Table 5 is the mass part shown in Table 5, Irganox 1010 (manufactured by BASF): 0.9 parts by mass · Sumi Leze ( Sumilizer) TP-D (manufactured by Sumitomo Chemical Co., Ltd.): 0.9 parts by mass · Mesitylene: 30 parts by mass

The compounds described in Table 5 are as follows. [A component] (a-4): same as (a-4) of Table 1 [B component] (b-2): same as (b-2) of Table 1 (b-16) Septon (Septon) ) V9827 (hydrogenated polystyrene elastomer, styrene content = 30% by mass, 5% thermal mass reduction temperature = 400 ° C or more and less than 450 ° C, manufactured by Kuraray Co., Ltd.) [C component] ( C-1) NK Ester M-40G (manufactured by Shin-Nakamura Chemical Industry Co., Ltd., monofunctional methacrylate, the following structure) [Chem. 22] (c-2) NK Ester 4G (manufactured by Shin-Nakamura Chemical Industry Co., Ltd., difunctional methacrylate, the following structure) [Chem. 23] (c-3) NK Ester A-9300 (manufactured by Shin-Nakamura Chemical Industry Co., Ltd., trifunctional acrylate, the following structure) [Chem. 24] (c-4) Triallyl isocyanurate (manufactured by Tokyo Chemical Industry Co., Ltd., trifunctional allylic compound) [Chem. 25] (c-5) NK Ester A-TMMT (manufactured by Shin-Nakamura Chemical Industry Co., Ltd., tetrafunctional acrylate) [Chem. 26] (c-6) NK Ester A-DPH (manufactured by Shin-Nakamura Chemical Industry Co., Ltd., hexafunctional acrylate) [Chem. 27] (c-7) NK Ester A-BPE-4 (manufactured by Shin-Nakamura Chemical Industry Co., Ltd., difunctional acrylate) [Chem. 28]

<Preparation of test piece> The surface of the adhesive support 5 on the side of the adhesive layer and the surface of a 100 mm Si wafer (component wafer) having a diameter of 100 mm and a thickness of 525 μm were vacuumed at 190 ° C. The test piece was prepared by crimping at a pressure of 0.11 MPa for 3 minutes.

<Adhesion> The adhesion was evaluated by the same method and criteria as those of the adhesion evaluation in Test Example 1. <Peelability> The peeling property was evaluated by the same method and criteria as the peelability evaluation in the test example 1. <Removability (Dissolution Removal)> The removability (dissolution removal) was evaluated by the same method and criteria as those in the test example 1 for the removal (dissolution removal). <Removability (film removal)> The removability (film removal) was evaluated by the same method and standard as the removal property (film removal) in the test example 1. <Flat Polishability> The flatness of the polishing property was evaluated by the same method and criteria as those of the flat polishing property in Test Example 4. <Wafer Warpage> The wafer warpage was evaluated by the same method and reference as the wafer warpage in Test Example 4.

According to the results, the adhesion and peelability of the examples were good. Further, the adhesion of the subsequent layer and the flatness of the polishing property are good, and the warpage of the wafer is suppressed.

[Test Example 6] <Production of test piece> A 12-inch diameter wafer (1吋 is 2.54 cm) which was subjected to edge trimming treatment with a plurality of bumps and a width of 500 μm and a depth of 100 μm. On the surface, a wafer bonding apparatus (manufactured by Tokyo Electron, Synapse V) was used to rotate the tantalum wafer at 50 rpm while adding 15 mL to the wafer for 30 seconds. The coating liquid for forming an adhesive layer used in Examples 61 to 86. The rotation speed was increased to 600 rpm for 30 seconds, and then the crucible wafer was rotated to face the outer circumference of the wafer and the back side of the crucible wafer was supplied with mesitylene for 40 seconds, and attached to the outer periphery of the crucible wafer and The coating for forming an adhesive layer on the back surface of the wafer is cleaned. The laminate was heated on the surface of the tantalum wafer by heating at 110 ° C for 3 minutes using a hot plate and further heating at 190 ° C for 3 minutes. Then, the surface on the side on which the adhesive layer was formed was bonded to the other film under vacuum at 190 ° C at a pressure of 0.11 MPa by a wafer bonding apparatus (manufactured by Tokyo Electron, Snapse V). A 12-inch tantalum wafer (carrier substrate) was pressure-bonded for 3 minutes to obtain a laminate. Furthermore, the thickness of the adhesive layer at this time was 40 μm. Then, the side of the first used tantalum wafer of the laminate was polished to a thickness of 35 μm using a back grinder DFG8540 (manufactured by Disco) to obtain a thinned laminate. The thinned germanium wafer of the laminate has a diameter of 299 mm.

<End-face treatment after thinning> The laminated body having a reduced thickness is laminated on the lower surface of the carrier substrate by a wafer bonding apparatus (manufactured by Tokyo Electron, Synapse V) The body was rotated at 300 rpm, and 15 mL of mesitylene was added dropwise over a period of 10 seconds from the end of the wafer at a distance of 20 mm. Then, the rotation speed was increased to 1000 rpm, and 45 mL of mesitylene was added dropwise over a period of 30 seconds. Thereafter, the surface of the crucible wafer was dried by rotating the rotation speed at 1000 rpm for 20 seconds. The obtained laminate was observed in a direction perpendicular to the 12 直径 diameter wafer provided with a plurality of bumps by an optical microscope. As a result, it was confirmed that the diameter of the substrate surface of the subsequent layer was larger than that of the carrier substrate. The diameter of the surface is less than 250 μm. Further, the diameter of the film surface on the side of the subsequent layer in contact with the carrier substrate is larger than the diameter of the film surface on the side in contact with the element wafer.

[Test Example 7] The coating liquid 6 for forming an underlayer was applied onto a Si wafer having a diameter of 100 mm and a thickness of 525 μm by a spin coater, and then baked at 110 ° C for 1 minute and further at 190 ° C. Bake for 4 minutes, thereby producing an adhesive support 6 having an adhesive layer. Further, the coating liquid 7 for forming an underlayer is applied onto a Si wafer (element wafer) having a diameter of 100 mm, a thickness of 525 μm, and a Cu bump having a height of 10 μm by a spin coater, and then Bake at 110 ° C for 1 minute and then at 190 ° C for 4 minutes to prepare an adhesive substrate having an adhesive layer.

<Composition of the coating liquid for forming the layer 6 and the coating liquid 7 for forming the subsequent layer> A component: The component A described in Table 6 is the mass part and the B component shown in Table 6: The component B is the mass part and the D component (the surfactant) shown in Table 6 and the following components are the mass parts (d-1) KP-112 (manufactured by Shin-Etsu Chemical Co., Ltd.) shown in Table 6 (d-2) ) KP-323 (manufactured by Shin-Etsu Chemical Co., Ltd.) (d-3) KP-326 (manufactured by Shin-Etsu Chemical Co., Ltd.) (d-4) KP-341 (manufactured by Shin-Etsu Chemical Co., Ltd.) · Irganox 1010 (BASF ( BASF) (manufactured by BASF): 0.9 parts by mass · Sumilizer TP-D (manufactured by Sumitomo Chemical Co., Ltd.): 0.9 parts by mass · Mesitylene: 30 parts by mass

<Preparation of test piece> The surface of the adhesive support 6 on the side where the adhesive layer was formed and the surface of the adhesive substrate on which the adhesive layer was formed were vacuum-bonded at 190 ° C for 3 minutes at a pressure of 0.11 MPa. , making test strips.

<Adhesion> The adhesion was evaluated by the same method and criteria as those of the adhesion evaluation in Test Example 1. <Embedding property> Using a C-SAM (ultrasonic microscope) for the test piece, it was confirmed that the adhesive layer after bonding (including the interface between the adhesive layers, the joint surface of the adhesive layer and the substrate, and the bonding surface of the adhesive layer and the substrate) There are no pores in the). A: No pores were produced. B: One or more and five or less small pores having a diameter of 10 μm or less were confirmed, but they were practically harmless. C: It is confirmed that more than 5 and less than 10 small pores having a diameter of 10 μm or less are practically harmless. D: Producing more than 10 pores with a diameter exceeding 10 μm is actually harmful. <Peelability> The peeling property was evaluated by the same method and criteria as the peelability evaluation in the test example 1. <Removability (Dissolution Removal)> The removability (dissolution removal) was evaluated by the same method and criteria as those in the test example 1 for the removal (dissolution removal). <Removability (film removal)> The removability (film removal) was evaluated by the same method and standard as the removal property (film removal) in the test example 1. <Flat Polishability> The flatness of the polishing property was evaluated by the same method and criteria as those of the flat polishing property in Test Example 4.

As shown in the table, the adhesion and peelability of the examples were good. Further, the adhesion of the adhesive layer and the flatness of the polishing property are good. Further, in Example 87 to Example 94 in which the second layer was two layers, and Example 96 to Example 98, the embedding property was better than that in Example 95 in which the subsequent layer was one layer.

[Test Example 8] The coating liquid 8 for forming an adhesive layer was applied onto a Si wafer having a diameter of 100 mm and a thickness of 525 μm by a spin coater, and then baked at 110 ° C for 1 minute and further at 190 ° C. Bake for 4 minutes to form a first subsequent layer. Then, the coating liquid 9 for forming an adhesive layer was spin-coated on the surface of the first adhesive layer, baked at 110 ° C for 1 minute, and further baked at 190 ° C for 4 minutes to form a second adhesive layer. An adhesive support 9 is produced.

<Composition of the coating liquid for layer formation> A component: The component A shown in Table 7 is the mass part and B component shown in Table 7: The component B shown in Table 7 is the mass shown in Table 7. Part D: The D component shown in Table 7 is the mass part shown in Table 7 · Irganox 1010 (manufactured by BASF): 0.9 parts by mass · Sumi Leze ( Sumilizer) TP-D (manufactured by Sumitomo Chemical Co., Ltd.): 0.9 parts by mass · Mesitylene: 30 parts by mass

<Preparation of test piece> The surface of the adhesive support 9 was formed with a surface of the adhesive layer and a Si wafer (element wafer) having a diameter of 100 mm, a thickness of 525 μm, and a Cu bump having a height of 10 μm. The surface of the device was vacuum-bonded at 190 ° C for 3 minutes at a pressure of 0.11 MPa to prepare a test piece.

<Adhesion> The adhesion was evaluated by the same method and criteria as those of the adhesion evaluation in Test Example 1. <Embeddedness> The embedding property was evaluated by the same method and criteria as in the evaluation of embedding in Test Example 7. <Peelability> The peeling property was evaluated by the same method and criteria as the peelability evaluation in the test example 1. <Removability (Dissolution Removal)> The removability (dissolution removal) was evaluated by the same method and criteria as those in the test example 1 for the removal (dissolution removal). <Removability (film removal)> The removability (film removal) was evaluated by the same method and standard as the removal property (film removal) in the test example 1. <Flat Polishability> The flatness of the polishing property was evaluated by the same method and criteria as those of the flat polishing property in Test Example 4.

As shown in the table, the adhesion and peelability of the examples were good. Further, the adhesion of the adhesive layer and the flatness of the polishing property are good. In addition, the embedding property is good.

1‧‧‧Substrate
2‧‧‧Support
3, 3A, 3B, 11, 11a ~ 11d‧‧‧ Next layer
12‧‧‧Support
60‧‧‧Component Wafer
60a‧‧‧ Thin component wafer
61‧‧‧矽 substrate
61a‧‧‧ surface
61b, 61b1‧‧‧ back
62‧‧‧Component wafer
63‧‧‧ Structure
70‧‧‧ Tape
100, 100a‧‧‧adhesive support

Fig. 1 is a schematic view showing an embodiment of a laminated body of the present invention. Fig. 2 is a schematic view showing another embodiment of the laminated body of the present invention. 3(A) to 3(E) are schematic views showing a first embodiment of a method of manufacturing a semiconductor device. 4(A) to 4(E) are schematic views showing a second embodiment of a method of manufacturing a semiconductor device. 5(A) to 5(E) are schematic views showing a third embodiment of a method of manufacturing a semiconductor device. FIG. 6 is a schematic cross-sectional view for explaining the release of the temporary adhesion state of the conventional adhesive support and the element wafer.

1‧‧‧Substrate

2‧‧‧Support

3‧‧‧Next layer

Claims (36)

A temporarily fixed adhesive comprising: a compound which is liquid at 25 ° C and contains a lipophilic group and a fluorine atom, and an elastomer. The temporarily fixed adhesive according to claim 1, wherein the compound containing an oleophilic group and a fluorine atom has a 10% thermal mass reduction temperature of 250 ° C or higher at 25 ° C / min from 25 ° C. The temporarily fixed adhesive according to claim 1 or 2, wherein the elastomer has a 5% thermal mass reduction temperature of 250 ° C or higher at 25 ° C / min from 25 ° C. The temporarily fixed adhesive according to claim 1 or 2, wherein the elastomer is an elastomer containing a repeating unit derived from styrene. The temporarily fixed adhesive according to claim 1 or 2, wherein the elastomer is a hydride. The temporarily fixed adhesive according to claim 1 or 2, wherein the elastomer is a block copolymer. The temporarily fixed adhesive according to claim 1 or 2, wherein the elastomer is a block copolymer having a single terminal or styrene at both ends. The temporary fixing adhesive according to the above-mentioned item, wherein the elastomer contains the elastomer A and the elastomer B, and the elastomer A is 10% by mass or more and 50% in all the repeating units. The repeating unit derived from styrene containing a repeating unit derived from styrene in a ratio of more than 50% by mass and 95% by mass or less in all repeating units is contained in a ratio of not more than % by mass. The temporarily fixed adhesive according to claim 8, wherein the mass ratio of the elastomer A to the elastomer B is from 5:95 to 95:5. The temporarily fixed adhesive according to claim 1 or 2, which further contains a radical polymerizable compound. The temporarily fixed adhesive according to claim 10, wherein the radically polymerizable compound is a compound having two or more radical polymerizable groups. The temporary adhesive agent according to claim 10, wherein the radically polymerizable compound has at least one of the partial structures represented by the following (P-1) to (P-4); wherein, * is the link key; [Chemical 1] . The temporarily fixed adhesive according to claim 10, wherein the radical polymerizable compound is selected from the group consisting of trimethylolpropane tri(meth)acrylate and isocyanuric acid ethylene oxide. (Meth) acrylate, isocyanuric acid ethylene oxide modified tri(meth) acrylate, triallyl isocyanurate, pentaerythritol tri (meth) acrylate, pentaerythritol tetra (meth) acrylate At least one of ester, dimethylolpropane tetra(meth)acrylate, dipentaerythritol penta (meth) acrylate, dipentaerythritol hexa(meth) acrylate, and tetramethylol methane tetra(meth) acrylate One. The temporarily fixed adhesive according to claim 1 or 2, wherein the temporarily fixed adhesive is a temporarily fixed adhesive for manufacturing a semiconductor device. An adhesive film comprising an adhesive layer comprising: a compound which is liquid at 25 ° C and contains an oleophilic group and a fluorine atom, and an elastomer. The adhesive film according to claim 15, wherein the concentration of the oleophilic group and the fluorine atom-containing compound in the adhesive layer is from the surface of the adhesive layer from the surface of the adhesive layer The region in the range of 5% in the thickness direction is different from the region in the range of more than 5% and 50% in the thickness direction. An adhesive support comprising an adhesive layer and a support, the adhesive layer comprising a compound which is liquid at 25 ° C and contains a lipophilic group and a fluorine atom, and an elastomer. The adhesive support according to claim 17, wherein the concentration of the compound containing an oleophilic group and a fluorine atom in the adhesive layer starts from a surface on the opposite side of the support The region of the range of 5% in the thickness direction of the adhesive layer is higher than the region from the opposite side of the support in a range of more than 5% and 50% in the thickness direction of the adhesive layer. A laminate having at least one or more adhesive layer A between a substrate and a support, and the adhesive layer A comprising an adhesive layer A1 containing: liquid at 25 ° C and containing lipophilic a compound having a fluorine atom and an elastomer. The laminate according to claim 19, wherein the adhesive layer A1 is provided between the substrate and the support, and the adhesive layer A1 is liquid at 25 ° C and contains lipophilic oil. a compound having a fluorine atom and an elastomer, and the adhesion layer A1 is in contact with the substrate and the support. The laminate according to claim 19, wherein the adhesive layer A contains two or more of the adhesive layers A1. The laminate according to claim 19, wherein the adhesive layer A further comprises an adhesive layer A2 other than the adhesive layer A1. The laminate according to claim 21, wherein the adhesive layer A1 is in contact with at least one of the support and the substrate. The laminate according to claim 22, which has the support, the adhesive layer A1, the adhesive layer A2, and the substrate in this order. The laminate according to claim 22, wherein the adhesive layer A contains the adhesive layer A2, and the adhesive layer A2 contains an elastomer. The laminate according to any one of claims 19 to 22, wherein at least one layer of the adhesive layer A contains an elastomer containing a repeating unit derived from styrene. The laminate according to claim 26, wherein the elastomer is a hydride. The laminate according to claim 26, wherein the elastomer is a block copolymer. The laminate according to claim 26, wherein the elastomer contains an elastomer A and an elastomer B, and the elastomer A is in a ratio of 10% by mass or more and 50% by mass or less in all the repeating units. The repeating unit derived from styrene containing a repeating unit derived from styrene in a ratio of more than 50% by mass and not more than 95% by mass in all the repeating units is contained. The laminate according to any one of claims 19 to 22, wherein the substrate is a component wafer. The laminate according to claim 19, wherein the peel strength A of the support and the adhesive layer A, and the peel strength B of the adhesive layer A and the substrate satisfy the following formula (1) And (2); A<B···· (1) B≦4 N/cm (2) where the peel strength A indicates that the substrate is fixed and The force applied when the end of the support is pulled up at a speed of 50 mm/min in the direction of 90°, which indicates that the substrate is fixed and the adhesive layer is 50 mm in the 90° direction. The force applied when the speed of min is pulled up. The laminate according to claim 19, wherein when the support is peeled from the substrate, the adhesive layer A is peeled off from the interface between the substrate and the adhesive layer A. a residue of the compound containing an oleophilic group and a fluorine atom attached to the substrate in a range of 50% or more of the area of the peeling surface of the adhesive layer A, or the adhesive layer A The support is peeled off from the interface of the adhesive layer A, and the compound containing an oleophilic group and a fluorine atom is attached to a range of 50% or more of the area of the peeling surface of the adhesive layer A of the support. Residue. The laminate according to any one of claims 19 to 22, 24, 27, 28, 29, 31, and 32, wherein the adhesive layer The area of the film surface of A is smaller than the area of the substrate surface of the support. The laminate according to any one of claims 19 to 22, 24, 27, 28, 29, 31, and 32, wherein When the diameter of the substrate surface of the support is C μm, the diameter of the substrate surface of the substrate is D μm, and the diameter of the film surface of the adhesive layer A is T μm, the C-200≧T is satisfied. ≧D. The laminate according to any one of claims 19 to 22, 24, 27, 28, 29, 31, and 32, wherein The diameter of the substrate surface of the support is C μm, the diameter of the substrate surface of the substrate is D μm, and the diameter of the film surface of the adhesive layer A on the side in contact with the support is T. _{When C} μm and the diameter of the film surface of the adhesive layer A on the side in contact with the substrate are T _D μm, C-200 ≧ T _C &gt; T _D ≧ D is satisfied. A kit comprising: a temporarily fixed adhesive A comprising a compound which is liquid at 25 ° C and containing a lipophilic group and a fluorine atom, and an elastomer; and a temporarily fixed adhesive B containing a thermoplastic resin.