TW201544285A - Method for producing polyimide film and electronic device, and method for peeling off coating film - Google Patents

Abstract

Provided is an electronic-device production method in which a base film satisfactorily adheres to a substrate before a peeling treatment, and can be easily peeled from the substrate after the peeling treatment. In an electronic-device production method according to the present invention, a device (83) is formed on a base film, and at least a polyimide film is provided as the base film. The electronic-device production method includes: a step (a) in which a polyimide varnish including a soluble polyimide resin, a thermosetting crosslinking material, and a solvent, is applied to a substrate (81), and dried at a temperature greater than the glass transition point of the polyimide resin, but less than the crosslinking initiation temperature of the crosslinking material, to form a coating film; a step (c) in which the device (83) is formed on the polyimide film (82) obtained as a result of step (a); and a step (b) in which, after the crosslinking reaction of the crosslinking material has been promoted, the polyimide film (82) obtained as a result of undergoing step (c) is peeled from the substrate (81).

Description

Method for producing polyimide film, method for producing electronic device, and method for peeling coating film

The present invention relates to a method for producing a polyimide film and a method for peeling a coating film. Moreover, the present invention relates to a method for producing an electronic device formed by using the method for producing the polyimide film and the method for peeling off a coating film.

In recent years, the thickness of flat panel displays such as liquid crystal displays and organic electroluminescence (EL) displays has been advanced, and flexible displays such as flexible flat panel displays that can be freely bent are being developed. In the current mainstream flat panel display, since glass is used as the substrate, the weight is heavy and easily broken. However, since the flexible display uses the base film, it has an advantage of being extremely thin, light in weight, and not easily broken. Moreover, since flexibility can be imparted, display display under a curved surface can also be realized. As a flexible display, the development of electronic paper is also being promoted.

A flexible display generally forms a resin film as a base film on a glass substrate as a support, and mounts (forms) the element on the base film. Further, it is finally produced by the step of peeling off the base film from the glass substrate. Patent Document 1 proposes a method of sequentially laminating a first material layer, a second material layer, and a peeled layer on a substrate to form a laminate, and performing adhesion between the first material layer and the second material layer during peeling. The locally reduced treatment (laser light, pressure, etc.) is then separated by physical means to separate in the layer or interface of the second material layer. Prior art literature

Patent Document 1: Japanese Patent Laid-Open Publication No. 2003-163338

[Problems to be solved by the invention]

According to the method of mounting an element on a base film, it is excellent in the point which can manufacture an electronic device, such as a flexible display easily. However, when the component is mounted, it is necessary to have adhesion between the glass substrate of the support and the base film resin so as not to be peeled off. Therefore, in order to peel off the base film from the glass substrate after mounting, technical research is required. The peeling method includes a method of burning the surface of the base film by laser light and a method of strongly peeling off, but the element may be damaged or the base film may be damaged due to the energy of the laser light, and there is a problem in the yield of the product. .

In the manufacture of an electronic device such as a flexible display, there is a strong demand in the market for a technique in which the glass substrate and the base film are strongly adhered to each other until the element is formed, and the base film can be easily peeled off from the glass substrate after the element is formed. Further, although the problem in the flexible substrate has been described, the same problem is also caused in various electronic devices in which components are to be formed on the underlying film.

The present invention has been made in view of the above circumstances, and an object thereof is to provide an electronic device in which a support body and a base film are favorably adhered to each other after a peeling treatment, and a support body and a base film are easily peeled off after a peeling treatment, and a yield is high. A manufacturing method and a peeling method of a coating film, and a method of producing a polyimide film used in at least one layer of the base film. [Means for solving the problem]

As a result of repeated efforts by the inventors of the present invention, it has been found that the subject of the present invention can be solved in the following aspects, and the present invention has been completed. [1] A method for producing a polyimide film, comprising: step (a), applying a polyimide pigment varnish containing a soluble polyimide resin, a thermosetting crosslinked material, and a solvent to a support And drying to form a coating film under conditions of a crosslinking transition temperature of the crosslinked material exceeding the glass transition point of the soluble polyamidene resin and not being thermosetting; In the step (b), the polyimine film obtained through the step (a) is peeled off from the support after the crosslinking reaction of the crosslinked material is promoted. [2] The method for producing a polyimide film according to [1], wherein in the step (b), the polyimide film is irradiated with a flash from the support side. [3] A method of manufacturing an electronic device, comprising: forming a component on a base film, and having at least a polyimide film as the base film, the method of manufacturing the electronic device comprising: the step (a), containing a solubility A polyimide varnish of a polyimide resin, a thermosetting crosslinked material, and a solvent is applied to a support and exceeds a glass transition temperature of the soluble polyimide resin and is less than thermosetting. Drying to form a coating film under the condition of crosslinking initiation temperature of the crosslinked material; step (c), forming the element on the polyimide film obtained by the step (a); and b), the polyimine film obtained by the step (c) is peeled off from the support after promoting the crosslinking reaction of the crosslinked material. [4] The method of manufacturing an electronic device according to [3], wherein the step (c) comprises a film forming process using a vapor phase growth method. [5] The method of manufacturing an electronic device according to [3], wherein the step (b) irradiates the polyimide film with a flash from the support side. [6] The method of manufacturing an electronic device according to [5], wherein the flash is concentratedly irradiated onto an edge portion of the polyimide film formed on the support. [7] The method of manufacturing an electronic device according to [5], wherein, in a plan view, the absorption is provided on the support body opposed to an edge portion of the polyimide film. Flash light absorbing layer. [8] The method of manufacturing an electronic device according to any one of [5] to [7], which selectively irradiates an area of the light emitted from the flash that has a high light absorptivity of the polyimide film . [9] The method of manufacturing an electronic device according to [8], wherein a region in which the light absorption rate of the polyimide film of the flash light is cut off by the filter is low. [10] The method for producing an electronic device according to [8], wherein the region in which the light absorption rate of the polyimide film is high is an ultraviolet region. [11] The method of manufacturing an electronic device according to [9], wherein the filter cuts off a wavelength of 400 nm or more. [12] The method of manufacturing an electronic device according to any one of [5] to [11] further comprising, before the step (c), the periphery of the support body on which the polyimide film is formed In the step (d) of depressurizing the environment, when the flash is irradiated, the bubbles existing at the interface between the polyimide film and the support are expanded. [13] The method of manufacturing an electronic device according to any one of [3] to [12] wherein the element is selected from the group consisting of a flexible display, a flexible element, a semiconductor element, a solar cell, and a fuel cell. At least one of the group consisting of. [14] A method for peeling off a coating film, comprising: step (a), applying a polyimide varnish containing a soluble polyimide resin, a thermosetting crosslinked material, and a solvent to a support, and Drying to form a polyimine film under conditions of a glass transition temperature of the soluble polyimide resin and a crosslinking initiation temperature of the crosslinked material not being thermosetting; and step (b), The polyimine film obtained through the step (a) is peeled off from the support after promoting the crosslinking reaction of the crosslinked material. [15] The method for peeling off a coating film according to [14], wherein in the step (b), the polyimide film is irradiated with a flash from the support side. [Effects of the Invention]

According to the present invention, it is possible to provide an electronic device manufacturing method and a coating film which are excellent in adhesion to the support before the peeling treatment, can be easily peeled off from the support after the peeling treatment, and have a high yield. A peeling method, and a method of producing a polyimide film for use in at least one layer of the base film.

[Method for Producing Polyimine Film] The method for producing a polyimide film of the present invention has at least the following steps (a) to (b). Step (a) is a method in which a polyimide pigment varnish containing a soluble polyimide resin, a thermosetting crosslinked material, and a solvent is applied onto a support at a glass transition temperature exceeding the soluble polyimide resin. The step of drying to form a coating film under the condition of the crosslinking initiation temperature of the thermosetting crosslinked material. The step (b) is a step of peeling the polyimine film obtained by the step (a) from the support after promoting the crosslinking reaction of the crosslinked material.

The polyimide varnish used in the step (a) contains at least a soluble polyimide resin, a thermosetting crosslinked material, and a solvent.

The soluble polyimine resin is usually obtained by polycondensing tetracarboxylic dianhydride with a diamine monomer and performing hydrazine imidization. The type of the polyimine resin is not particularly limited as long as it is solvent-soluble, and a thermoplastic polyimide resin is preferred from the viewpoint of good adhesion to the support.

In consideration of mechanical properties after film formation, it is preferred that the tetracarboxylic dianhydride and the diamine used have an aromatic group. Examples of the aromatic tetracarboxylic dianhydride include pyromellitic anhydride (1,2,4,5-benzenetetracarboxylic dianhydride) and 3,3',4,4'-diphenylketonetetracarboxylic acid II. Anhydride, 3,3',4,4'-biphenyltetracarboxylic dianhydride and 3,3',4,4'-diphenyl ether tetracarboxylic dianhydride. Further, examples of the aromatic diamine include 4,4'-oxydiaminobenzene (4,4'-diaminodiphenyl ether) and 1,3-bis-(3-aminophenoxyl). Benzene, 4,4'-bis-(3-aminophenoxy)biphenyl, 1,4-diaminobenzene, and 1,3-diaminobenzene.

By using a soluble polyimine resin, a heating step for carrying out the ruthenium is not required. That is, a polyimide pigment varnish containing a soluble polyimine in a solvent is applied onto a support and dried to form a polyimide film. Therefore, it is not necessary to use a high temperature to imidize the coating film, and the temperature is increased to the process of the crosslinking initiation temperature of the crosslinked material before the peeling treatment of the step (b) described later. It is easy to increase the choice of applicable cross-linking materials. Further, in the method for producing a polyimide film of the present invention, a polyamic acid varnish which is a polyimide precursor may be used instead of the polyimide pigment varnish, or may be incorporated in a polyimide pigment varnish. The lysine is agglomerated, but in order to imidize the poly phthalic acid coating film, it is usually necessary to carry out heating at 300 ° C to 350 ° C, so that it is almost always at a crosslinking initiation temperature of a general crosslinked material. Further, in order to carry out the ruthenium imidization at a low temperature, a catalyst may be added, but the curing of the crosslinked material may be promoted or the catalyst may deteriorate the physical properties of the polyimide film. Therefore, in the production method of the present invention, it is desirable to use a polyimide varnish dissolved in a solvent.

As the crosslinked material, a thermosetting crosslinked material which starts a crosslinking reaction at a predetermined temperature is used. Regarding the crosslinking initiation temperature of the crosslinked material, the temperature is higher than the glass transition temperature of the polyimide film to be used and lower than the heat resistance temperature of the support to be used.

The cross-linking material may be one in which the support and the polyimide film can be peeled off by the crosslinking reaction, and the compound or the amount of addition is not limited. The amount of the crosslinking agent to be added is, for example, 5% by mass to 25% by mass, and the crosslinking crosslinking starting temperature of the crosslinked material is preferably from 150 ° C to 400 ° C, more preferably from 200 ° C to 350 ° C. By setting it to 200 ° C or more, the process stability can be improved, and the manufacturing yield can be improved. Further, by setting it to 350 ° C or lower, it is possible to prevent the polyimide film or other member formed on the polyimide film from being deteriorated by heating.

The type of the cross-linked material is not limited as long as it is in accordance with the gist of the present invention, and examples thereof include a bismaleimide compound, a double nadic quinone compound, a terminal diacetylene compound, and the like.

The solvent is not particularly limited as long as it is a solvent in which the soluble polyimide resin is soluble when the varnish is formed. For example, even if it is a solvent which does not dissolve the polyimine resin when it is used alone, it can also be used if it can be dissolved when it is used together with another solvent. The solvent may be used singly or in combination.

The support is not limited as long as it does not deviate from the gist of the present invention, and a glass substrate (such as a quartz substrate), a sapphire substrate, a tantalum substrate, a tantalum carbide substrate, or the like can be exemplified as a preferred example. A polyimide film is formed directly above the support.

The step of applying the polyimide varnish may, for example, be a solution film forming method such as spray coating, brush coating, dip coating, die coating, curtain coating, flow coating, spin coating, or screen printing. After coating, a polyimide film was obtained by drying. The film thickness can be appropriately designed according to the use, and is, for example, about 5 μm to 100 μm. The drying temperature after coating is set to exceed the glass transition temperature of the soluble polyimide resin and is less than the crosslinking initiation temperature of the crosslinked material. From the viewpoint of self-manufacturing stability, the drying temperature after coating is preferably 20 ° C or more lower than the crosslinking initiation temperature.

The polyimide film may be a single layer or may be formed of a plurality of layers. Further, it may be a laminate including a layer of another resin, a metal layer, a metal oxide layer, or the like in the upper layer of the polyimide film layer.

Step (b) weakens the adhesion of the support to the polyimide film by promoting the crosslinking reaction of the crosslinked material. The crosslinking reaction of the crosslinked material can be achieved by setting the crosslinking initiation temperature of the crosslinked material or more. Then, the polyimide film and the support which are weakened by force can be easily peeled off by a known method. The means of the step (b) is not limited as long as it does not deviate from the gist of the present invention. As a method of promoting the crosslinking reaction of the crosslinking agent, it is preferred that the polyimide film is irradiated with a flash from the side of the support. method. The method of irradiating the flash is not particularly limited, and for example, it can be formed using a flash lamp. In addition, it is also effective to perform heating when irradiated with a flash. The detailed process for step (b) will be described later.

[Manufacturing Method of Electronic Apparatus] Next, an example of an embodiment of a method of manufacturing an electronic apparatus using the method for producing a polyimide film of the present invention will be described. The method for producing an electronic device of the present invention comprises the step of forming an element on a polyimide film as a base film, and further has at least step (c) in addition to the steps (a) and (b). Step (c) is carried out before step (b) and is a step of forming an element on the polyimide film. The type of the element is not particularly limited, and examples thereof include a flexible display, a flexible element, a semiconductor element, a solar cell, and a fuel cell.

The polyimide film functions as a base film for forming an element. As the polyimide film, a layer containing only the polyimide film formed by the step (a) or a layer comprising another layer laminated on the polyimide film formed by the step (a) may be used. The layer of the film. The polyimide film must be resistant to heat resistance at the process temperature at which the element is formed. In general, when the element is mounted on the base film, the process temperature is usually 300 ° C or more. Therefore, the polyimide resin to be used is preferably excellent in heat resistance. From the above viewpoint, it is preferred to use a polyimide resin derived from an aromatic diamine and an aromatic tetracarboxylic dianhydride.

The step (c) is a step of attaching a component to a polyimide film formed on a support by a known method. For example, a film forming process may be included, in which a semiconductor layer, a metal layer, an insulating layer, or the like is laminated on a base film in a desired order using a vapor phase growth method or a solution coating method or the like to form an element. Moreover, it is also possible to directly mount the components that have been created.

The step (b) may be various methods as described above, and a method of irradiating the polyimide film with a flash from the glass substrate side will be described (irradiation step). When the flash is irradiated, the degree of temperature rise or the elongation due to heating may differ due to the difference in light absorptivity or linear expansion coefficient between the glass substrate and the polyimide film, and on the glass substrate and the polyimide film. The interface produces shear stress in a direction parallel to the interface. Further, in the polyimide film, the unreacted crosslinked material is contained, and by the irradiation of the flash, the crosslinked materials are rapidly heated to a temperature higher than the crosslinking initiation temperature, and the crosslinking reaction is rapidly performed. By these shear stresses, the bonding force (bonding force) of the interface is lowered. As a result, the polyimide film can be easily peeled off from the glass substrate after the irradiation of the flash.

After the irradiation step, the polyimide film having a reduced adhesion to the glass substrate is peeled off from the glass substrate (peeling step). As a method of peeling a polyimide film from a glass substrate, various well-known techniques can be employ|adopted. Hereinafter, an example of a more specific embodiment of the step (b) will be described.

[First Embodiment] (Configuration of Flash Lamp Annealing Apparatus) Fig. 1 is a view showing a schematic configuration of a flash lamp annealing apparatus used in the first embodiment. The flash lamp annealing apparatus 1 is a device for assisting the peeling of the polyimide film by irradiating a target object 8 having a polyimide film formed on a glass substrate with a flash. As a main element, the flash lamp annealing apparatus 1 includes a chamber 10 that houses the object to be processed 8, a holding plate 20 that holds the object to be processed 8, and a flash light source 70 that illuminates the object to be processed 8. Further, the flash lamp annealing apparatus 1 includes a control unit 3 that controls various operation mechanisms provided in the apparatus to perform processing. Furthermore, in each of FIG. 1 and subsequent figures, in order to facilitate understanding, it is necessary to exaggerate or simplify the size or number of each part to draw.

The chamber 10 is disposed below the flash light source 70 and includes a chamber sidewall 11 and a chamber bottom portion 12. The chamber bottom 12 covers the lower portion of the chamber sidewall 11. A space surrounded by the chamber side wall 11 and the chamber bottom portion 12 is defined as a processing space 15. Further, a chamber window 18 is provided in the upper opening of the chamber 10 to block it.

The chamber window 18 constituting the top of the chamber 10 is a plate-like member including quartz, and functions as a quartz window that transmits light irradiated from the flash light source 70 to the processing space 15. The chamber side wall 11 and the chamber bottom portion 12 constituting the body of the chamber 10 contain a metal material excellent in strength and heat resistance such as stainless steel.

In order to maintain the airtightness of the processing space 15, the chamber window 18 and the chamber side wall 11 are sealed by an O-ring (not shown). That is, an O-ring is interposed between the peripheral edge portion of the lower surface of the chamber window 18 and the chamber side wall 11 to prevent gas from flowing out and flowing from the gaps.

A holding plate 20 is provided inside the chamber 10. The holding plate 20 is a flat plate-shaped member made of metal (for example, made of aluminum). A plurality of support pins 22 are provided on the upper surface of the holding plate 20. The holding plate 20 supports the object to be processed 8 in the chamber 10 by a plurality of support pins 22, and holds the object to be processed 8 in a substantially horizontal posture. The support pin 22 can also be lifted and lowered by a lifting drive mechanism (for example, an air cylinder or the like) (not shown).

Further, the heater 21 is built in the holding plate 20. The heater 21 includes a resistance heating wire such as a nichrome wire, generates heat by power supply from a power supply external to the drawing, and heats the holding plate 20. Further, in the holding plate 20, in addition to the heater 21, a cooling mechanism such as a water-cooled tube may be provided.

A temperature sensor configured using a thermocouple and not shown is provided in the holding plate 20. The temperature sensor measures the temperature in the vicinity of the upper surface of the holding plate 20, and transmits the measurement result to the control unit 3. The control unit 3 controls the output of the heater 21 based on the measurement result of the temperature sensor so that the holding plate 20 has a predetermined temperature. The object to be processed 8 held by the holding plate 20 is heated to a predetermined temperature by the heater 21 of the holding plate 20.

Further, the flash lamp annealing apparatus 1 includes an air supply mechanism 40 that supplies a processing gas to the processing space 15 in the chamber 10, and an exhaust mechanism 50 that discharges the ambient gas from the processing space 15. The air supply mechanism 40 includes a processing gas supply source 41, a supply pipe 42, and a supply valve 43. The front end side of the supply pipe 42 is connected to the processing space 15 in the chamber 10 to be connected, and the base end side is connected to the processing gas supply source 41. The supply valve 43 is provided in the middle of the path of the supply pipe 42. The processing gas is supplied from the processing gas supply source 41 to the processing space 15 by opening the supply valve 43. The processing gas supply source 41 can supply a suitable processing gas corresponding to the type of the object to be processed 8 or the processing purpose, and in the first embodiment, nitrogen gas (N ₂ ) is supplied.

The exhaust mechanism 50 includes an exhaust device 51, an exhaust pipe 52, and an exhaust valve 53. The front end side of the exhaust pipe 52 is connected to the processing space 15 in the chamber 10, and the base end side is connected to the exhaust device 51. An exhaust valve 53 is provided in the middle of the path of the exhaust pipe 52. The exhaust device 51 includes, for example, a dry pump and a throttle valve. By operating the exhaust device 51 while opening the exhaust valve 53, the environment of the processing space 15 can be discharged to the outside of the device. The environment of the processing space 15 can be adjusted by the air supply mechanism 40 and the exhaust mechanism 50. Further, since the processing space 15 is a sealed space, if the supply of the processing gas is not performed from the air supply mechanism 40 and the environment is discharged by the exhaust mechanism 50, the environment in the processing space 15 can be depressurized to less than atmospheric pressure.

The flash light source 70 is disposed above the chamber 10. The flash light source 70 is provided in plurality (one in FIG. 1 for convenience of illustration, but is not limited thereto), and a flasher FL and a reflector 72 provided to cover the entire upper portion of the flasher FL. The flash light source 70 illuminates the object to be processed 8 held by the holding plate 20 in the chamber 10 from the flash lamp FL via the chamber window 18 of the quartz.

Each of the plurality of flash lamps FL is a rod-shaped lamp having a long cylindrical shape, and is arranged in a planar shape so that each longitudinal direction thereof is parallel to each other in the horizontal direction. In the first embodiment, a xenon flash lamp is used as the flash lamp FL. The xenon flash lamp FL includes a rod-shaped glass tube (discharge tube) and a trigger electrode, and the rod-shaped glass tube (discharge tube) is sealed with helium gas at its inner portion, and an anode and a cathode connected to the capacitor are disposed at both ends thereof. The trigger electrode is attached to an outer peripheral surface of the glass tube. Since helium gas is an electrical insulator, even if electric charge is accumulated in a capacitor, electricity does not flow into a glass tube in a normal state. However, when a high voltage is applied to the trigger electrode to break the insulation, the electricity stored in the capacitor instantaneously flows into the glass tube by the discharge between the electrodes at both ends, thereby exciting the atom or molecule of the germanium. And let out the light. In such a xenon flash lamp FL, the electrostatic energy stored in the capacitor in advance is converted into an extremely short light pulse of, for example, 0.05 millisecond to 100 milliseconds, and thus has a light that can be irradiated with extremely strong light as compared with a lamp that is continuously lit. feature.

Further, the reflector 72 is provided to cover the entirety of the plurality of flashers FL. The basic function of the reflector 72 is to reflect the flash light emitted from the plurality of flash lamps FL to the processing space 15 side.

The control unit 3 controls the various operating mechanisms provided in the flash lamp annealing apparatus 1. The hardware of the control unit 3 has the same configuration as a general computer. In other words, the control unit 3 includes a central processing unit (CPU) that performs various kinds of arithmetic processing, and reads only memory (ROM) as a read-only memory for storing the basic program, as a memory for storing various kinds of information. A random access memory (RAM) that reads and writes freely, and a disk that stores software or data for control. The processing of the flash lamp annealing apparatus 1 is performed by the CPU of the control unit 3 executing a predetermined processing program.

In addition to the above configuration, various components are also appropriately provided in the flash lamp annealing apparatus 1. For example, in the chamber side wall 11, a conveying opening portion for carrying in and carrying out the workpiece 8 is provided in a corresponding shape. Further, in order to prevent an excessive temperature rise caused by light irradiation from the flash lamp FL, a water-cooling tube may be provided in the chamber side wall 11. Further, a pressure gauge for measuring the air pressure in the chamber 10 is provided in the flash lamp annealing apparatus 1.

(Processing Method of Polyimine Film Using Flash Annealing Apparatus) Next, the processing procedure of the flash lamp annealing apparatus 1 having the above configuration will be described. FIG. 2 is a flow chart showing the processing procedure of the flash lamp annealing apparatus 1. The respective processing steps of the flash annealing apparatus 1 described below are performed by the control unit 3 controlling the respective operating mechanisms of the flash annealing apparatus 1.

First, a loading step (stage S1) of carrying the workpiece 8 into the chamber 10 is performed. The loading of the object to be processed 8 can be performed by a transfer robot outside the flash lamp annealing apparatus 1, or can be performed manually. FIG. 3 is a cross-sectional view showing the structure of the object to be processed 8. The object to be processed 8 of the first embodiment is configured by attaching a polyimide film 82 to the upper surface of the glass substrate 81. As a material of the glass substrate 81, quartz glass is used, for example. The glass substrate 81 as quartz glass transmits the flash light emitted from the flash lamp FL over substantially the entire wavelength region. For the object to be processed 8, an appropriate support can be selected in accordance with the wavelength region to be irradiated. The polyimide film 82 is formed into a coating film shape by a method of forming a polyimide film which functions as a base resin film as described above. Further, an element 83 is attached to the upper surface of the polyimide film 82 by a known method.

The coating formation of the polyimide film 82 and the mounting of the element 83 are performed by using a device different from the flash lamp annealing apparatus 1. The polyimide film 82 is attached to the glass substrate 81 as a rigid substrate (also referred to as a carrier substrate or a dummy substrate), and the component 83 is mounted thereon, so that most of the existing equipment can be used. Component installation. Then, after the component 83 is mounted, the object to be processed 8 as shown in FIG. 3 is carried into the chamber 10.

Next, a holding step (stage S2) in which the object to be processed 8 carried into the chamber 10 is placed on the holding plate 20 via the support pin 22 and held is carried out. Here, the object to be processed 8 faces the lower side of the surface on which the element 83 is formed, that is, the glass substrate 81 is held by the holding plate 20 toward the upper side. Further, the object to be processed 8 is supported by the plurality of support pins 22 in point contact, and is held by the holding plate 20. The plurality of support pins 22 preferably support end edges of the unmounted member 83 of the glass substrate 81.

The holding plate 20 is heated to a predetermined temperature by the built-in heater 21. The temperature of the holding plate 20 is controlled by the control unit 3. The object to be processed 8 is closely supported by the holding plate 20 by a plurality of support pins 22, whereby the object to be processed 8 including the polyimide film 82 to which the element 83 is attached is heated as a whole. The temperature at which the object to be processed 8 is heated can be appropriately set within a range that does not cause thermal damage to the element 83, that is, a range exceeding the glass transition temperature of the soluble polyimide resin and the crosslinking temperature of the crosslinked material. In order to improve the heating efficiency at this time, it is preferable that the height of the object to be processed 8 supported by the plurality of support pins 22 is close to the upper surface of the holding plate 20.

Then, after the object to be processed 8 is carried into the chamber 10 and the processing space 15 is used as a sealed space, a pressure reduction step (step S3) for decompressing the inside of the chamber 10 is performed. That is, the exhaust gas is exhausted by the exhaust mechanism 50 without supplying air from the air supply mechanism 40, and the environment of the processing space 15 in the chamber 10 is depressurized to less than atmospheric pressure. At this time, if it is necessary to further reduce the partial pressure of oxygen in the chamber 10, nitrogen gas may be supplied from the gas supply mechanism 40 to replace the treatment space 15 with a nitrogen atmosphere, and then the inside of the chamber 10 may be decompressed.

After the object 8 to be held held by the holding plate 20 is heated to a predetermined temperature and the inside of the chamber 10 is decompressed to a temperature less than atmospheric pressure, the plurality of flash lamps FL of the flash light source 70 are controlled by the control unit 3. At the same time, the illumination step of lighting (stage S4). The flash emitted from the flash lamp FL (including the flash reflected by the reflector 72) passes through the chamber window 18 and holds the processed body 8 held by the panel 20 toward the processing space 15. The flash emitted from the flash lamp FL is preferably a very short strong flash (the irradiation energy is 10 J) in which the irradiation time (pulse width) of the pre-stored electrostatic energy is converted into an extremely short light pulse of 0.05 msec or more and 100 msec or less. /cm ² or more and 20 J/cm ² or less). However, the implementation of the present invention is not limited thereto, and is not limited to the above range as long as the bonding force of the interface is sufficiently reduced at the interface between the glass substrate and the polyimide film. Moreover, the number of times the flash is irradiated may be only one time or multiple times.

The reason why the lower limit of the irradiation light energy is preferable is that the temperature at the interface with the glass substrate in the polyimide film cannot be sufficiently increased. Therefore, as long as the adhesion of the interface is sufficiently reduced at the interface between the glass substrate and the polyimide film, irradiation conditions in which the irradiation light energy is less than 10 J/cm ² can be used.

The reason why the upper limit of the irradiation light energy is preferable is as follows. When the energy of the upper limit is applied, the adhesion at the interface between the glass substrate and the polyimide film is sufficiently reduced, so that it is not necessary to impart the The energy above the upper limit is increased, and the increase in power consumption of the flash lamp is suppressed by not giving extra energy; and damage to the element mounted on the polyimide film is suppressed by not giving unnecessary energy. Therefore, depending on various conditions such as the film thickness or composition of the polyimide film and the characteristics of the glass substrate on which the substrate is formed, when the irradiation light energy satisfying the above aspect is higher than 20 J/cm ² , 20 J/cm may be used. ² or more irradiation light energy is a preferable condition.

As an advantage of the multiple irradiation, the damage caused by the element which is attached to the polyimide film, or the superheat of the polyimide film itself is mentioned. If the flash is irradiated for a long time, the heat will reach the deep part, and there is a possibility that the inside of the element or the film is overheated. In the present invention, in order to allow the energy of the flash to reach only the interface between the polyimide film and the glass substrate, it is preferred to shorten the pulse width. However, when the pulse width is shortened in a state where the energy is constant, the energy to be applied is reduced, and there is a possibility that the adhesion force of the interface cannot be sufficiently lowered. Therefore, by shortening the pulse width and irradiating the flash light a plurality of times, the energy to be applied can be sufficiently maintained, the adhesion force of the interface can be sufficiently lowered, and the heat can be prevented from reaching the element or the like, thereby preventing damage of the element or the like.

FIG. 4 is a view showing a state in which the object to be processed 8 is irradiated with a flash. In the chamber 10, the object to be processed 8 holds the glass substrate 81 toward the upper side and is held by the holding plate 20. The flash emitted from the flasher FL provided above the chamber 10 is irradiated from the upper side of the object to be processed 8, that is, the side of the glass substrate 81. The glass substrate 81 passes through the flash light emitted from the flash lamp FL. As a result, the flash light is transmitted through the upper glass substrate 81 and is irradiated to the interface between the glass substrate 81 and the polyimide film 82. Further, in the first embodiment, the entire surface of the object to be processed 8 is integrally irradiated with a flash.

The interface between the glass substrate 81 and the polyimide film 82 absorbs the flash and rapidly rises, and then rapidly cools down. At this time, the region in the vicinity of the interface between the glass substrate 81 and the polyimide film 82 is heated. When the irradiation time is extremely short flash irradiation of about 0.05 msec or more and 100 msec or less, only the vicinity of the interface between the glass substrate 81 and the polyimide film 82 can be selectively heated. Therefore, by the flash irradiation, it is possible to prevent the element 83 formed on the polyimide film 82 from being heated more than necessary to cause thermal damage.

When the vicinity of the interface between the glass substrate 81 and the polyimide film 82 is rapidly heated by the flash irradiation, the vicinity of the interface between the glass substrate 81 and the polyimide film 82 is heated to thermally expand. At this time, since the linear expansion coefficients of the glass substrate 81 and the polyimide film 82 are different, the degree of expansion differs even when the temperature is raised to the same temperature. Although depending on the type of the glass substrate 81 and the polyimide film 82, the linear expansion coefficient of the polyimide film 82 is remarkably larger than the linear expansion coefficient of the glass substrate 81 (several times or more).

Further, the polyimide film 82 in the vicinity of the interface (the glass substrate 81 is transmitted through the flash) is directly heated by the flash irradiation, and the glass substrate 81 is heated by the heat conduction from the temperature-receiving polyimide film 82. Therefore, as for the end temperature itself at the time of flash irradiation, the polyimide film 82 is usually higher than the glass substrate 81. Therefore, when the region near the interface between the glass substrate 81 and the polyimide film 82 is heated by the flash irradiation, the polyimide film 82 is thermally expanded more greatly than the glass substrate 81. As a result, as shown by an arrow AR4 in FIG. 4, at the interface between the glass substrate 81 and the polyimide film 82, the polyimide film 82 is elongated more than the glass substrate 81 in a direction parallel to the interface. The shear stress plays a role. By such a shear stress along the interface between the glass substrate 81 and the polyimide film 82, the adhesion between the glass substrate 81 and the polyimide film 82 at the interface is lowered.

Further, in the present invention, a crosslinked material is added to the polyimide film 82. Most of the crosslinked material contained in the polyimide film 82 is in a state in which the crosslinking reaction is not reacted until the irradiation of the flash in the irradiation step (stage S4).

In the irradiation step (stage S4), the polyimine film 82 containing the unreacted crosslinked material is irradiated with a flash to rapidly raise the temperature to a temperature higher than the crosslinking initiation temperature of the crosslinked material. The crosslinked material contained in the film 82 rapidly produces a crosslinking reaction. Thereby, in addition to the thermal expansion of the polyimine film 82 itself as described above, the polyimide film 82 is intended to be transferred by the rapid crosslinking reaction of the crosslinked material contained in the polyimide film 82. Shear stress elongated in a direction parallel to the interface direction acts. Therefore, the shear stress along the interface between the glass substrate 81 and the polyimide film 82 acts more strongly, and the adhesion of the glass substrate 81 and the polyimide film 82 is surely lowered.

The adhesion of the polyimide film 82 in the peeling step of the step S7 described later becomes extremely easy by the decrease in the adhesion caused by the irradiation of the flash as described above. That is, the treatment of the flash lamp annealing apparatus 1 of the present invention is a process of assisting the peeling of the polyimide film 82 formed on the glass substrate 81.

After the flash irradiation of the object to be processed 8 is completed, the exhaust of the exhaust mechanism 50 is stopped, and nitrogen gas is supplied from the gas supply mechanism 40 to the processing space 15 to perform a gas pressure recovery step of returning the inside of the chamber 10 to atmospheric pressure (stage S5). Thereafter, the step of carrying out the object to be processed 8 after the processing from the chamber 10 is carried out (stage S6). Thereby, a series of peeling assist processing of the flash lamp annealing apparatus 1 is completed.

Next, in the object to be processed 8 carried out from the chamber 10, a peeling step (step S7) of peeling off the glass substrate 81 and the polyimide film 82 is performed. FIG. 5 is a view showing an example of a case where the polyimide film 82 as a layer to be peeled off is peeled off from the glass substrate 81. The end portion of the polyimide film 82 is peeled off and mechanically held by a grip member (not shown), and the grip member is moved as indicated by an arrow in FIG. The amine film 82 is peeled off from the glass substrate 81.

By the irradiation of the flash in the irradiation step (stage S4), the shear stress acts on the interface between the glass substrate 81 and the polyimide film 82, and therefore, the adhesion of the interface is lowered, and the glass substrate 81 and the polyimide The adhesion of the film 82 becomes weak. Therefore, when the polyimide film 82 is peeled off from the glass substrate 81 in the peeling step (stage S7), the polyimide film 82 can be easily peeled off from the glass substrate 81 with a small stress.

Further, instead of the grip member, the end portion of the polyimide film 82 may be wound around the drum, and the polyimide film 82 may be peeled off from the glass substrate 81 by rotating the drum. Alternatively, it may be peeled off from the glass substrate 81 while attracting the polyimide film 82 by a known suction member such as a Bernoulli chuck.

In the first embodiment, the interface between the glass substrate 81 and the polyimide film 82 having different linear expansion coefficients is heated by irradiation with a flash, and the degree of linear expansion is different in the direction parallel to the interface. Shear stress. Further, the polyimide film 82 contains a crosslinked material, and a rapid crosslinking reaction of the crosslinked material is caused by the irradiation of the flash, whereby the polyimine film 82 is oriented in a direction parallel to the interface. Shear stress becomes a stronger force.

By the action of the shear stress, the adhesion of the interface between the glass substrate 81 and the polyimide film 82 is lowered, and the adhesion therebetween is weak. Therefore, in the peeling step (stage S7), the polyimide film 82 as the peeled layer can be easily peeled off from the glass substrate 81 with a small stress. Therefore, the physical damage to the polyimide film 82 and the element 83 attached to the polyimide film 82 can be minimized, and the polyimide film 82 can be peeled off.

Further, in the first embodiment, the entire surface of the interface between the glass substrate 81 and the polyimide film 82 is integrally irradiated with the glitter. Therefore, the adhesion of the entire surface of the interface can be uniformly lowered to reduce the adhesion. When the irradiation of the integrated irradiation time is about 0.05 milliseconds or more and 100 milliseconds or less, the processing time can be remarkably shortened as compared with the case of the conventional scanning irradiation of the laser light.

Further, in the first embodiment, the difference in thermal expansion between the glass substrate 81 and the polyimide film 82 caused by the flash irradiation or the crosslinking reaction of the crosslinked material contained in the polyimide film 82 is used. The expansion and contraction (change in elasticity) of the amine film 82 reduces the adhesion of the interface. Therefore, the generation of dust can be suppressed less than that of the conventional ablation by laser irradiation. In other words, by irradiating the interface between the glass substrate 81 and the polyimide film 82 to which the crosslinked material is added, the damage to the polyimide film 82 as the peeled layer can be suppressed, and the uniform and clean auxiliary can be assisted. Peeling of the peeled layer. Further, by adding the crosslinked material, the shear stress generated at the interface between the glass substrate 81 and the polyimide film 82 is enhanced as compared with the case where the crosslinked material is not added, so that the interface can be more reliably made. Then the force is reduced.

Further, in the first embodiment, the peeling assist by the flash irradiation is performed in an environment that is less than atmospheric pressure. When the interface between the glass substrate 81 and the polyimide film 82 is irradiated with a flash and heated, a trace amount of gas is generated from the interface. When the environment around the glass substrate 81 to which the polyimide film 82 of the peeled layer is attached is decompressed, a slight amount of gas is generated by irradiating the interface with a flash, and the periphery is in a decompressed state. Therefore, the gas bubbles of the gas expand. As a result, the adhesion between the glass substrate 81 and the polyimide film 82 is further weakened, and the polyimide film 82 as the peeled layer can be more easily peeled off from the glass substrate 81.

Further, in the first embodiment, before the flash irradiation, the holding plate 20 is heated by the built-in heater 21 so as not to thermally damage the element 83, and the polyimine film 82 is contained in the polyimide film 82. The temperature at which the joint does not cause a cross-linking reaction. Thereby, the interface between the glass substrate 81 and the polyimide film 82 is assisted by thermal energy at the time of flash irradiation, and the difference in thermal expansion of the interface before and after the flash irradiation or the cross-linking reaction by flash irradiation is used. The expansion and contraction of the amine film 82 is more rapid, and a larger shear stress is generated, whereby the adhesion of the interface is further lowered, whereby the adhesion between the glass substrate 81 and the polyimide film 82 can be further weakened.

According to the method of manufacturing an electronic device according to the first embodiment, it is possible to easily peel off the element from the glass substrate as compared with the conventional manufacturing method in which the surface of the base film is burned by laser light or is strongly peeled off. The components do not damage the base film. Therefore, the method of manufacturing an electronic device according to the first embodiment can be produced at a higher yield.

[Second Embodiment] Next, an example of a method of manufacturing an electronic device different from the first embodiment will be described. The manufacturing method of the electronic device of the second embodiment is the same as that of the first embodiment except for the following points. In other words, the method of manufacturing the electronic device according to the second embodiment differs from the first embodiment in the configuration of the flash lamp annealing device and the irradiation method.

As the irradiation of a part of the region, for example, a method of irradiating the edge portion in the interface between the glass substrate and the polyimide film can be exemplified. The adhesion force between the glass substrate and the polyimide film tends to increase at the edge portion. The method of concentrating the flash on the edge portion is effective in the case where the edge portion cannot be easily peeled off without the irradiation of the flash, and the region other than the edge portion can be irradiated without flashing. Peeled by a mechanical peeling method. According to this method, the adhesion of the edge portion can be reduced and the edge portion can be easily peeled off, whereby the polyimide film can be easily peeled off from the glass substrate. In such a manner, it is possible to suppress the damage of the element by the irradiation of the flash by setting a configuration in which a part of the area such as a region where the adhesion force is locally high is concentrated. Further, since the irradiation area of the flash is narrower than in the case of the entire surface irradiation, there is an effect that the power consumption of the flash lamp can be reduced.

Fig. 6 is a view showing a configuration of a main part of a flash lamp annealing apparatus 1a according to a second embodiment. In the following figures, the same elements as those in the first embodiment are denoted by the same reference numerals.

The flash lamp annealing apparatus 1a of the second embodiment includes a light shielding plate 60 in the chamber 10. Fig. 7 is a plan view showing the light shielding plate 60 viewed from above. The light shielding plate 60 is a rectangular plate-shaped member in plan view, and is fixedly disposed in the chamber 10 by a support member (not shown). The light shielding plate 60 is formed of a material that does not transmit the flash of the flash lamp FL (for example, a metal material such as aluminum which is excellent in resistance to flash). The light shielding plate 60 is provided above the holding plate 20 in the chamber 10 so as to cover most of the object to be processed 8 held by the holding plate 20.

In the second embodiment, as shown in FIG. 7, the light shielding plate 60 is provided so that only one of the edge portions of the rectangular object to be processed 8 held by the holding plate 20 is exposed to the upper flash light source 70. Here, the end edge portion of the object to be processed 8 means a region outside the region where the element 83 is formed. That is, the element 83 is not attached over the entire surface of the polyimide film 82 formed on the glass substrate 81, and the element 83 is not mounted in a region having a predetermined width from the end portion of the polyimide film 82 to the inside. In this manner, the region where the element 83 is not attached to the edge of the polyimide film 82 and is relatively unnecessary is the "edge portion of the polyimide film 82", and in the second embodiment, the width is, for example, 5 mm. A range of ~10 mm. In addition, the region of the glass substrate 81 corresponding to the edge portion of the polyimide film 82 to which the element 83 is not mounted is referred to as "the edge portion of the glass substrate 81", and the polyimide film 82 and the glass are contained. The region of the substrate 8 to be processed 8 is referred to as "the edge portion of the object 8 to be processed".

Further, in the second embodiment, as shown in Fig. 6, the flash light source 70 is provided with one flasher FL. A reflector 72 is disposed above the flash lamp FL. The flasher FL of the second embodiment is disposed directly above the edge portion of the object 8 that is not covered by the light shielding plate 60. That is, the flasher FL is disposed only at a position opposed to the end edge portion of the object to be processed 8 exposed from the light shielding plate 60. Therefore, the edge portion of the object to be processed 8 that is not covered by the light shielding plate 60 is concentratedly irradiated with the flash light emitted from the flash lamp FL.

The remaining configuration of the flash lamp annealing apparatus 1a other than the light shielding plate 60 and the flash light source 70 is the same as that of the flash lamp annealing apparatus 1 of the first embodiment. The processing procedure of the flash lamp annealing apparatus 1a of the second embodiment is also substantially the same as that of the first embodiment (see FIG. 2).

In the second embodiment, at the time of the flash irradiation in the irradiation step (stage S4), a part of the flash emitted from the flash lamp FL is blocked by the light shielding plate 60, and the light-receiving plate is not provided in the object 8 to be held by the holding plate 20. The edge portion of the 60 cover selectively illuminates the flash. Therefore, the edge portion of the interface between the glass substrate 81 and the polyimide film 82 is selectively irradiated with a flash, and the edge portion is gradually heated. Since the element 83 is not attached to the edge portion, in the second embodiment, the surface of the edge portion of the polyimide film 82 may be heated to a sufficiently high temperature (for example, heated to a temperature higher than that of the first embodiment). The degree of illumination is strong.

Since the linear expansion coefficient of the glass substrate 81 and the polyimide film 82 is different, when the edge of the interface between the glass substrate 81 and the polyimide film 82 is heated by the flash, the heat is expanded due to the difference in thermal expansion. Shear stress acts on the interface.

Further, in the present invention, a crosslinked material is added to the polyimide film 82. Here, the step before the irradiation of the flash is the same step as in the first embodiment, and therefore, the treatment is always performed at a temperature lower than the crosslinking initiation temperature of the crosslinked material, so that the irradiation step (stage S4) is to be performed. Before the medium-illumination flash, the crosslinked material contained in the polyimide film 82 is in a state in which the crosslinking reaction is not reacted.

In the irradiation step (stage S4), the edge portion of the polyimide film 82 containing the unreacted crosslinked material is irradiated with a flash, and the crosslinked material contained in the edge portion of the polyimide film 82 is rapidly formed. The temperature is raised to a temperature higher than the crosslinking initiation temperature of the crosslinked material, and a crosslinking reaction is rapidly generated. Thereby, in addition to the thermal expansion of the polyimine film 82 itself as described above, the polyimide film 82 is intended to be transferred by the rapid crosslinking reaction of the crosslinked material contained in the polyimide film 82. Shear stress elongated in a direction parallel to the interface direction acts. Therefore, at the edge portion of the object to be processed 8, the shear stress along the interface between the glass substrate 81 and the polyimide film 82 acts more strongly, and the adhesion between the glass substrate 81 and the polyimide film 82 is exerted. Really lower. Therefore, the edge portion of the polyimide film 82 is easily peeled off from the glass substrate 81.

Further, in the second embodiment, since the flash irradiation is performed in a reduced pressure atmosphere that is less than atmospheric pressure, the interface between the glass substrate 81 and the polyimide film 82 in the edge portion of the target body 8 is minute. The air bubbles of the gas expand by heating, whereby the adhesion between the glass substrate 81 and the polyimide film 82 is further weakened, and the edge portion of the polyimide film 82 is more reliably peeled off.

Here, when a stronger flash is applied, the peeling of the polyimide film 82 can be performed more reliably, and the subsequent peeling step (stage S7) is also easy. When a stronger flash is irradiated, a stronger shear stress acts on the interface with the glass substrate 81 in the edge portion of the polyimide film 82. Thereby, after the flash irradiation, a part of the edge portion of the polyimide film 82 is peeled off, and the mechanical grip of the polyimide film 82 in the subsequent peeling step (stage S7) is changed. It's easy. In the second embodiment, the end edge portion of the polyimide film 82 is peeled off by irradiation with a stronger flash.

Thereafter, in the peeling step (stage S7), the end edge portion of the polyimide film 82 which is peeled off by the flash irradiation in the irradiation step (stage S4) is mechanically gripped by the grip member, and In the embodiment, the entire polyimide film 82 is peeled off from the glass substrate 81 in the same manner.

In the second embodiment, a part of the flash is blocked by the light shielding plate 60, whereby only the edge portion of the object to be processed 8 is irradiated with a flash, and only the edge portion of the interface between the glass substrate 81 and the polyimide film 82 is irradiated. heating. The adhesion between the polyimide film 82 formed by the general coating method and the glass substrate 81 tends to be stronger at the edge portion than in the vicinity of the center portion. Therefore, as in the second embodiment, only the edge portion of the interface between the glass substrate 81 and the polyimide film 82 is heated by the flash irradiation, and the bonding force is lowered to bring the end of the polyimide film 82. When the edge portion is peeled off from the glass substrate 81, the polyimide film 82 as the peeled layer can be easily peeled off from the glass substrate 81 in the peeling step of the peeling step (stage S7).

Further, in the same manner as in the first embodiment, the difference in thermal expansion between the glass substrate 81 and the polyimide film 82 caused by the flash irradiation reduces the bonding strength of the interface, and therefore, it is similar to the conventional ablation using laser light irradiation. In comparison, the generation of dust can be suppressed less. Therefore, as in the second embodiment, damage to the polyimide film 82 as the peeled layer can be suppressed, and peeling of the peeled layer can be cleanly assisted.

In particular, in the second embodiment, only the unnecessary portion of the unmounted member 83, that is, the edge portion of the object to be processed 8, is irradiated with a flash to be heated, so that thermal damage to the element 83 can be surely prevented. Further, since it is not necessary to consider thermal damage to the element 83, the luminous intensity of the flash lamp FL can be made sufficiently strong, and the edge portion of the polyimide film 82 can be surely peeled off from the glass substrate 81 by flash irradiation.

[Third Embodiment] The method for manufacturing an electronic device according to the third embodiment is the same as the method for manufacturing an electronic device according to the first embodiment except for the following points. In other words, the third embodiment is different from the first embodiment in which the light absorbing layer is formed on the glass substrate and the light absorbing layer is not used.

The configuration of the flash lamp annealing device is completely the same as that of the flash lamp annealing device 1 of the first embodiment. Further, the processing procedure in the third embodiment is also substantially the same as that in the first embodiment (see Fig. 2). Therefore, the description of the same processing procedure as in the first embodiment will be omitted.

In the third embodiment, a black light absorbing layer 85 is formed on the edge portion of the glass substrate 81 before the object to be processed 8 is carried into the chamber 10. FIG. 8 is a plan view of the object 8 on which the light absorbing layer 85 is formed as viewed from the side of the glass substrate 81. A black light absorbing layer 85 is formed on the surface of the glass substrate 81 at the end edge portion of the rectangular processed object 8. Specifically, for example, a black paint may be applied to the surface edge portion of the glass substrate 81 to form the light absorbing layer 85. In addition, the end edge portion of the object to be processed 8 is a region outside the region where the element 83 is attached, as in the second embodiment. In the third embodiment, the light absorbing layer 85 is formed on the edge portions of all four sides of the rectangular object to be processed 8.

The object to be processed 8 in which the light absorbing layer 85 is formed at the edge portion is carried into the chamber 10 (stage S1), and held in the holding plate 20 (stage S2). The object to be processed 8 holds the glass substrate 81 toward the upper side and is held by the holding plate 20. Therefore, the light absorbing layer 85 formed on the edge portion of the object to be processed 8 also faces the upper side.

In the third embodiment, in the case of the flash irradiation in the irradiation step (stage S4), the entire surface of the object to be processed 8 is irradiated with a flash as in the first embodiment. FIG. 9 is a view showing a state in which the object to be processed 8 in the third embodiment is irradiated with a flash. The flash emitted from the flasher FL provided above the chamber 10 is irradiated from the upper side of the object to be processed 8, that is, the side of the glass substrate 81. Since the light absorbing layer 85 is black, the received flash is absorbed throughout the entire wavelength region. Therefore, at the edge portion of the object to be processed 8, the light absorbing layer 85 is heated significantly by the flash irradiation, and the end of the interface between the glass substrate 81 and the polyimide film 82 is performed by heat conduction from the light absorbing layer 85. The rim is heated centrally. In the region on the inner side of the edge portion of the object to be processed 8, the interface between the glass substrate 81 and the polyimide film 82 is heated by the flash of the glass substrate 81 as in the first embodiment, but compared to the inner side. In the region, the edge portion of the interface of the black light absorbing layer 85 is more heated.

Since the glass substrate 81 and the polyimide film 82 have different linear expansion coefficients, when the interface between the glass substrate 81 and the polyimide film 82 is irradiated with a flash and heated, shear stress acts on the difference in thermal expansion. The interface. In the third embodiment, in particular, the edge portion of the interface between the glass substrate 81 and the polyimide film 82 is concentratedly heated. Therefore, a strong cutting stress acts on the edge portion of the interface. By the action of the strong cutting stress, the bonding strength between the glass substrate 81 and the edge portion of the interface of the polyimide film 82 is lowered, and the edge portion of the polyimide film 82 is peeled off from the glass substrate 81.

Further, in the present invention, a crosslinked material is added to the polyimide film 82. Here, in the step before the irradiation of the flash, the treatment is always performed at a temperature lower than the crosslinking initiation temperature of the crosslinked material, so that the polyimine is to be irradiated immediately before the irradiation in the irradiation step (stage S4). The crosslinked material contained in the film 82 is in a state in which the crosslinking reaction is not reacted.

In the irradiation step (stage S4), by irradiating the polyimine film 82 containing the unreacted crosslinked material with a flash, the crosslinked material contained in the polyimide film 82 is rapidly heated to a level higher than that of the crosslinked material. The temperature of the initial temperature is reached, and a crosslinking reaction is rapidly generated. Thereby, in addition to the thermal expansion of the polyimine film 82 itself as described above, the polyimide film 82 is intended to be transferred by the rapid crosslinking reaction of the crosslinked material contained in the polyimide film 82. Shear stress elongated in a direction parallel to the interface direction acts. Therefore, the shear stress along the interface between the glass substrate 81 and the polyimide film 82 acts more strongly, and the adhesion of the glass substrate 81 and the polyimide film 82 is surely lowered.

Further, in the third embodiment, the inside of the chamber 10 is also depressurized by the pressure reduction step (stage S3), and in the irradiation step (stage S4), the flash irradiation is performed under a reduced pressure atmosphere which is less than atmospheric pressure. Therefore, by the heating, the bubbles of a small amount of gas generated at the edge of the interface are expanded, and the adhesion between the glass substrate 81 and the polyimide film 82 is further weakened, and the edge portion of the polyimide film 82 is more surely Peel off.

Then, in the peeling step (stage S7), the edge portion of the polyimide film 82 which is peeled off by the flash irradiation is mechanically held by the grip member, and the polypigment is similar to that of the first embodiment. The entire imine film 82 is peeled off from the glass substrate 81.

In the third embodiment, a black light absorbing layer 85 is formed on the edge portion of the glass substrate 81 of the object 8 to be processed, and the object to be processed 8 is irradiated with a flash from the flash lamp FL. The black light absorbing layer 85 having a high light absorptivity is heated significantly by flash irradiation, and the edge portion of the interface between the glass substrate 81 and the polyimide film 82 is concentrated by heat conduction from the light absorbing layer 85. Ground heating. As described above, the adhesion between the polyimide film 82 formed by the coating method and the glass substrate 81 tends to be stronger at the edge portion than in the vicinity of the center portion. Therefore, as in the third embodiment, only the edge portion of the interface between the glass substrate 81 and the polyimide film 82 is heated by the flash irradiation, and the bonding force is lowered to reduce the binding force. When the edge portion of 82 is peeled off from the glass substrate 81, the polyimide film 82 as the peeled layer can be easily peeled off from the glass substrate 81 in the peeling step of the step S7.

Further, in the same manner as in the first embodiment, the difference in thermal expansion between the glass substrate 81 and the polyimide film 82 caused by the flash irradiation reduces the bonding strength of the interface, and therefore, it is similar to the conventional ablation using laser light irradiation. In comparison, the generation of dust can be suppressed less. Therefore, as in the third embodiment, damage to the polyimide film 82 as the peeled layer can be suppressed, and peeling of the peeled layer can be cleanly assisted.

[Fourth embodiment] Next, a fourth embodiment of the present invention will be described. The manufacturing method of the electronic device of the fourth embodiment is the same as the manufacturing method of the electronic device of the first embodiment except for the following points. That is, the fourth embodiment differs from the first embodiment in which the optical filter is not used in the case of using the optical filter.

The polyimide film generally has an optical property of easily absorbing short-wavelength light (400 nm to 500 nm or less) and easily transmitting light having a long wavelength (400 nm to 500 nm or more). Therefore, when the flash from the flash lamp contains light in a long wavelength region, there is a possibility that the flash passes through the polyimide film and the element is overheated. Since light of a wavelength band in which the polyimide film is efficiently heated is used, an optical filter that cuts off light in a long wavelength region is used. In this way, by adding a simple configuration in which an optical filter is provided, it is possible to suppress damage to components and the like. The optical filter that cuts off a specific wavelength band may be disposed between the glass substrate and the flash lamp according to the light absorption spectrum of the polyimide film, or may be configured such that the glass substrate itself is the optical filter. . Fig. 10 is a view showing a configuration of a main part of a flash annealing apparatus 1b according to a fourth embodiment. In FIG. 10, the same elements as those in the first embodiment are denoted by the same reference numerals.

In the flash annealing apparatus 1b of FIG. 10, an optical filter 74 is disposed between the chamber window 18 of the chamber 10 and the flash light source 70. The optical filter of the fourth embodiment is a plate-shaped optical member formed by melting a metal such as barium (Ba), arsenic (As), antimony (Sb), or cadmium (Cd) in quartz glass. More specifically, it is melted in quartz glass and contains at least one metal selected from the group consisting of ruthenium, arsenic, antimony, and cadmium. Since the quartz glass contains a metal component, light in a predetermined wavelength region of the light transmitted through the optical filter 74 can be reflected or absorbed and turned off (light-shielded). The wavelength region to be cut depends on the type of metal melted in the quartz glass. The optical filter 74 of the present embodiment cuts off a component having a long wavelength side of a wavelength of 400 nm or more and transmits ultraviolet light having a shorter wavelength of 400 nm.

Further, in order to prevent heating of the optical filter 74 due to absorption of the flash, a known blowing mechanism that blows cooling air to the optical filter 74 may be provided.

By providing the optical filter 74 between the chamber 10 and the flash light source 70, when the flash emitted from the flash lamp FL passes through the optical filter 74, the component having a wavelength of 400 nm or more is turned off. Further, the flash having the remaining components of the ultraviolet region having a wavelength of 400 nm or less is transmitted through the optical filter 74 to be irradiated to the object 8 to be processed held by the holding plate 20.

Fig. 11 is a view showing the radiation spectral distribution of the flash lamp FL of the cymbal. As shown in the figure, the emission spectrum of the flash lamp FL of the crucible reaches the near-infrared region from the ultraviolet region, and includes ultraviolet light having a shorter wavelength side than a wavelength of 400 nm and visible light and infrared light having a longer wavelength side. In the present embodiment, the component having a wavelength of 400 nm or more is turned off by the optical filter 74, whereby the object 8 is irradiated with a flash of an ultraviolet region having a shorter wavelength of 400 nm.

In the fourth embodiment, the glass substrate 81 is made of quartz glass and transmits a flash of light in an ultraviolet region shorter than a wavelength of 400 nm. As a result, the flash of the ultraviolet region is transmitted through the glass substrate 81 to the interface between the glass substrate 81 and the polyimide film 82. Further, in the fourth embodiment, the entire surface of the object to be processed 8 is integrally irradiated with the flash of the ultraviolet region.

A general polyimide film has a high light absorption rate of light in the ultraviolet region, and has a low light absorption rate for light in the visible light region and the infrared region on the long wavelength side in the ultraviolet region. Therefore, if the object to be processed 8 is directly irradiated from the glass substrate 81 side with a flash having a wavelength as shown in FIG. 11, the flash of the ultraviolet region is absorbed by the polyimide film 82, and the ultraviolet region is the visible region of the long wavelength side. A part of the flash of the infrared region is completely absorbed by the polyimide film 82 and transmitted, and reaches the element 83 attached to the polyimide film 82. Thereby, if the element 83 is overheated, there is a risk that the element 83 is damaged.

Therefore, in the fourth embodiment, the optical filter 74 is further provided, whereby the flash of the wavelength region in which the light absorptivity is low in the polyimide film 82 is cut off by the optical filter 74, and the object to be processed 8 is processed. The flash of the wavelength region which is easily absorbed by the polyimide film 82 is selectively irradiated. The glitter irradiated to the ultraviolet region of the polyimide film 82 is efficiently absorbed by the polyimide film 82, and is hardly irradiated to the element 83 attached to the polyimide film 82. Therefore, it is possible to suppress the element 83 from being overheated by the flash and causing damage to the element 83.

<Modifications> The embodiments of the present invention have been described above, but the invention can be variously modified without departing from the spirit and scope of the invention. For example, in the above-described embodiments, the component 83 is attached to the polyimide film 82 attached to the glass substrate 81. The object to be processed 8 is not limited thereto. Make various changes.

In the first embodiment, quartz glass is used as the material of the glass substrate 81. However, the implementation of the present invention is not limited thereto, and the glass substrate 81 may be formed using another known glass material, and the quartz glass may be used. Glass of various known additives is added.

In the first embodiment, the flash lamp annealing apparatus 1 holds the glass substrate 81 in the target object 8 toward the upper side. However, the implementation of the present invention is not limited thereto, and the object to be processed 8 may be used. The glass substrate 81 is held toward the lower side. At this time, the flash light source 70 is also disposed on the lower side of the object to be processed 8, and is configured to emit a flash from the glass substrate 81 side as in the first embodiment.

In the second embodiment, only one of the edge portions of the rectangular object to be processed 8 is exposed to the upper flash light source 70. However, the light shielding plate 60 may be provided such that both sides of the edge portion are exposed to the flash light source 70. In this manner, only the edge portion of the interface between the glass substrate 81 and the polyimide film 82 is heated by the flash irradiation, and the bonding force is lowered, whereby the polyimide film 82 as the peeled layer can be easily used. The glass substrate 81 is peeled off.

Further, in the second embodiment, a filter (neutral density (ND) filter, etc., which reduces the amount of flash without completely blocking the flash, may be used instead of the light-shielding plate 60 to be used. ). By setting the light shielding plate 60 as an ND filter, the edge portion of the object to be processed 8 can be heated centrally, and the region other than the edge portion can be heated by the flash to be in the peeling step (stage S7). ) can achieve easier peeling.

When the light shielding plate 60 is provided so that both sides of the edge portion of the object to be processed 8 are exposed, the flash lamp FL may be disposed in accordance with the shape of the exposed end edge portion. For example, when the light shielding plate 60 is provided so that the end edges of all four sides of the rectangular object to be processed 8 are exposed, the four flash lamps FL are arranged in a quadrangular shape on the flash light source 70. In other words, the flasher FL is disposed at a position opposed to the edge portion of the object 8 to be processed exposed from the light shielding plate 60.

Further, in the second embodiment, the light shielding plate 60 may be provided so that the end edge portion of the processing body 8 is exposed, and the flash light source 70 in which the plurality of flash lamps FL are arranged in parallel as in the first embodiment may be provided. . Alternatively, the light shielding plate 60 may be omitted and only the flasher FL may be disposed at a position opposed to the end edge portion of the object 8 to be processed.

In the third embodiment, the light absorbing layer 85 is formed on the edge portions of all four sides of the rectangular object to be processed 8. However, the implementation of the present invention is not limited thereto, and light is formed on one side or more of the edge portion. The absorption layer 85 is sufficient. In this manner, the light absorbing layer 85 is heated significantly by the flash irradiation, and the edge portion of the interface between the glass substrate 81 and the polyimide film 82 is concentratedly heated by heat conduction from the light absorbing layer 85. The force is lowered, and the polyimide film 82 as the peeled layer can be easily peeled off from the glass substrate 81.

Further, in the third embodiment, the light absorbing layer 85 is formed on the edge portion of the glass substrate 81. Instead of this, a black light absorbing layer 85 may be formed on the edge portion of the polyimide film 82. Alternatively, a black light absorbing layer 85 may be formed on the edge portions of both the glass substrate 81 and the polyimide film 82.

In the third embodiment, the light absorbing layer 85 is not limited to black, and may be colored in a color having a light absorption rate equal to or greater than a predetermined value.

Further, by setting the arrangement area of the plurality of flash lamps FL provided in the flash light source 70 to be sufficiently larger than the object to be processed 8, the illuminance of the flash of the edge portion of the target object 8 can be made larger than the edge portion. Area (the area on the inner side of the end edge). In other words, when the arrangement area of the plurality of flash lamps FL is sufficiently larger than the object to be processed 8, the number of the flash lamps FL that affect the edge portion of the object 8 is increased, and the illuminance of the flash of the edge portion is relatively increased. In the same manner as in the third embodiment, the edge portion of the interface between the glass substrate 81 and the polyimide film 82 is heated by the flash irradiation, and the bonding strength of the interface is lowered. The polyimide film 82 as a peeled layer is easily peeled off from the glass substrate 81. In order to obtain the illuminance increasing effect of the edge portion of the object to be processed 8, it is necessary to set the arrangement area of the plurality of flash lamps FL to 1.2 times or more the area of the object 8 to be processed.

Further, the second embodiment can be combined with the third embodiment. In other words, the black light absorbing layer 85 of the third embodiment can be formed at the edge portion of the object 8 to be exposed which is exposed from the light shielding plate 60 of the second embodiment.

Further, in the above-described embodiment, the object to be processed 8 is heated by the heater 21 incorporated in the holding plate 20 before the flash irradiation, but the object to be processed 8 may be heated by the halogen lamp instead of the heater 21. A heating mechanism using a halogen lamp may be provided in addition to the heater 21. When the distance between the object to be processed 8 supported by the plurality of support pins 22 and the upper surface of the holding plate 20 is large, it is preferably heated by a halogen lamp, and when the resin layer is transparent, it is preferably heated by the heater 21. Further, when the bonding force of the interface can be sufficiently lowered by only the flash irradiation, it is not necessary to perform heating by the heater 21 or the halogen lamp before the flash irradiation.

Further, in the above-described embodiment, the flash light source 70 is provided with a flash lamp FL, but a light source such as a flash lamp or the like which uses other rare gas may be used instead of a known light source.

EXAMPLES Hereinafter, the present invention will be specifically described with reference to examples, but the present invention is not limited to the examples.

(First Example) [Formation of Polyimine Film] Polyimine varnish A and polyimine varnish B shown in Table 1 below were prepared.

Polyimine varnish B was prepared by the method described below. That is, 150.0 g of polyimine varnish MP20A (manufactured by Mitsui Chemicals, Inc.) was added to a 300 mL separable flask, and a crosslinked material having a crosslinking initiation temperature of 200 ° C was added thereto at room temperature. The heating and cooling were carried out, and the stirring blade connected to the three-one motor was rotated at 180 rpm for 12 hours to dissolve the crosslinked material, thereby obtaining the varnish B. Further, Tg is a value obtained by measuring a polyimide film obtained from a coating film using a dynamic viscoelasticity measuring device.

[Evaluation of adhesion between glass substrate and polyimide film] Each polyimide varnish was applied to a 12.5 mm square by an applicator having a width of 11.0 mm so that the thickness after drying became 20 μm. The glass substrate was dried by heating at a temperature exceeding the glass transition temperature of the polyimide resin and the crosslinking initiation temperature of the thermosetting hardenable crosslinked material for a predetermined period of time to obtain a test piece. A part of the test piece was irradiated with a flash using a flash lamp annealing (FLA) device. The adhesion strength of each test piece under irradiation and non-irradiation was measured and evaluated. The irradiation energy is set to 5 J/cm ² to 15 J/cm ² . The results are shown in Table 2 below.

Example 1, Example 2, and Comparative Example 1 are examples in which a crosslinked material was added. By adding a crosslinked material to the varnish A, as shown in Table 1, the Tg was lowered from 200 ° C to 156 ° C due to the plasticizing effect. In Example 1 and Example 2, which were dried at a temperature exceeding the glass transition temperature and at a crosslinking initiation temperature less than the crosslinking agent, the adhesion strength before the flash was 0.7 kN. /m, 0.6 kN/m, sufficient end strength is obtained. Further, the adhesion force can be sufficiently lowered by the flash irradiation, and the polyimide film can be favorably peeled off from the glass substrate. On the other hand, in Comparative Example 1 in which the glass transition temperature was higher than the crosslinking initiation temperature of the crosslinking agent, the adhesion strength before the flashing was 0.3 kN/m, which is Example 1. The strength of less than half of Example 2. By subjecting the sample to flash irradiation, the force was reduced by 1/3. However, compared with the first and second embodiments, the reduction in the force is small, and the effect of reducing the force is low.

Comparative Examples 2 to 4 are examples in which no crosslinked material was added. In Comparative Example 2 and Comparative Example 3, drying was performed at a temperature below the glass transition temperature, and therefore, the adhesion strength was not obtained at the stage before the irradiation of the flash, and was not continued. On the other hand, in Comparative Example 4 which was dried at a temperature higher than the glass transition temperature, the adhesive strength before the irradiation of the flash was 0.9 kN/m, and sufficient adhesion strength was obtained. However, before and after the irradiation of the flash, the strength did not change, and the polyimide film could not be peeled off from the support. [Industrial availability]

The method for producing a polyimide film of the present invention and the method for producing an electronic device can be applied to various objects to be processed obtained by attaching a layer to be peeled off to a substrate. In particular, since the element can be attached to the base film and the flexibility is easily provided, it can be preferably used for a flexible display, a flexible element, an electronic device used in a flat panel display (FPD) or an electronic paper. In electronic devices such as solar cells, fuel cells, and semiconductor components.

1, 1a, 1b‧‧‧ flashing annealing device
3‧‧‧Control Department
8‧‧‧Processed body
10‧‧‧ chamber
11‧‧‧Cell wall
12‧‧‧Bottom of the chamber
15‧‧‧Processing space
18‧‧‧Case window
20‧‧‧ Keep board
21‧‧‧ heater
22‧‧‧Support pins
40‧‧‧ gas supply mechanism
41‧‧‧Processing gas supply
42‧‧‧Supply piping
43‧‧‧Supply valve
50‧‧‧Exhaust mechanism
51‧‧‧Exhaust device
52‧‧‧Exhaust piping
53‧‧‧Exhaust valve
60‧‧ ‧ visor
70‧‧‧Flash light source
72‧‧‧ reflector
74‧‧‧Optical filter
81‧‧‧ glass substrate
82‧‧‧ Polyimine film
83‧‧‧ components
85‧‧‧Light absorbing layer
AR4‧‧‧ arrow
FL‧‧‧Flash

Fig. 1 is a view showing the configuration of a main part of a flash lamp annealing apparatus according to a first embodiment. Fig. 2 is a flow chart showing the processing procedure of the flash lamp annealing apparatus. Fig. 3 is a cross-sectional view showing the structure of a target object. Fig. 4 is a view showing a state in which a subject is irradiated with a flash. FIG. 5 is a view showing an example of a case where a polyimide film which is a layer to be peeled off is peeled off from a glass substrate. Fig. 6 is a view showing the configuration of a main part of a flash lamp annealing apparatus according to a second embodiment; Fig. 7 is a plan view showing the visor viewed from above. Fig. 8 is a plan view of a to-be-processed body in which a light absorbing layer is formed. FIG. 9 is a view showing a state in which the object to be processed of the third embodiment is irradiated with a flash. Fig. 10 is a view showing the configuration of a main part of a flash lamp annealing apparatus according to a fourth embodiment. Fig. 11 is a view showing the radiation splitting distribution of the xenon flash lamp.

81‧‧‧Glass substrate (support)

82‧‧‧ Polyimine film

Claims (15)

A method for producing a polyimide film, comprising: step (a), applying a polyimide pigment varnish containing a soluble polyimide resin, a thermosetting crosslinked material, and a solvent to a support, and Drying to form a coating film under conditions of a glass transition temperature of the soluble polyamidene resin and a crosslinking initiation temperature of the crosslinked material not having thermosetting property; and step (b), passing through the step The polyimine film obtained in (a) is peeled off from the support after promoting the crosslinking reaction of the crosslinked material. The method for producing a polyimide film according to claim 1, wherein in the step (b), the polyimide film is irradiated with a flash from the support side. A method of manufacturing an electronic device, comprising: forming a component on a base film, and having at least a polyimide film as the base film, the method of manufacturing the electronic device comprising: the step (a), comprising a soluble polyazide A polyimide resin, a thermosetting crosslinked material, and a solvent-polymerized polyimide varnish are coated on the support and are at a temperature exceeding the glass transition temperature of the soluble polyimide resin and less than the thermosetting property. Forming a coating film under drying conditions of the crosslinking temperature of the joint; step (c), forming the element on the polyimide film obtained by the step (a); and step (b) The polyimine film obtained through the step (c) is peeled off from the support after promoting the crosslinking reaction of the crosslinked material. The method of manufacturing an electronic device according to claim 3, wherein the step (c) comprises a film forming process using a vapor phase growth method. The method of manufacturing an electronic device according to claim 3, wherein the step (b) irradiates the polyimide film with a flash from the support side. The method of manufacturing an electronic device according to claim 5, wherein the flash is concentratedly irradiated onto an edge portion of the polyimide film formed on the support. The method of manufacturing an electronic device according to claim 5, wherein, in a plan view, light absorption for absorbing the flash is provided on the support body opposed to an edge portion of the polyimide film Floor. The method for producing an electronic device according to claim 5, which selectively irradiates a region of the emitted light of the flash that has a high light absorptivity of the polyimide film. The method of manufacturing an electronic device according to claim 8, wherein the filter is used to cut off a region of the polyimide light having a low light absorptivity in the emitted light of the flash. The method for producing an electronic device according to claim 8, wherein the region in which the light absorption rate of the polyimide film is high is an ultraviolet region. The method of manufacturing an electronic device according to claim 9, wherein the filter cuts off a wavelength of 400 nm or more. The method for producing an electronic device according to claim 5, further comprising the step of depressurizing the environment around the support body on which the polyimide film is formed before the step (c) (d) When the flash is irradiated, the bubbles existing at the interface between the polyimide film and the support are expanded. The method of manufacturing an electronic device according to any one of claims 3 to 12, wherein the element is selected from the group consisting of a flexible display, a flexible element, a semiconductor element, a solar cell, and a fuel cell. At least one of the group consisting of. A method for peeling off a coating film, comprising: step (a), applying a polyimide varnish containing a soluble polyimide resin, a thermosetting crosslinked material, and a solvent to a support, and exceeding Drying to form a coating film under conditions of a glass transition temperature of the soluble polyimide resin and a crosslinking initiation temperature of the crosslinked material not having thermosetting property; and step (b), via step (a) The obtained polyimide film is peeled off from the support after promoting the crosslinking reaction of the crosslinked material. The method for peeling off a coating film according to claim 14, wherein in the step (b), the polyimide film is irradiated with a flash from the side of the support.