TW201542766A - Wavelength conversion member and light emitting device using same - Google Patents
Wavelength conversion member and light emitting device using same Download PDFInfo
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- TW201542766A TW201542766A TW104110762A TW104110762A TW201542766A TW 201542766 A TW201542766 A TW 201542766A TW 104110762 A TW104110762 A TW 104110762A TW 104110762 A TW104110762 A TW 104110762A TW 201542766 A TW201542766 A TW 201542766A
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- 238000006243 chemical reaction Methods 0.000 title claims abstract description 65
- OAICVXFJPJFONN-UHFFFAOYSA-N Phosphorus Chemical compound [P] OAICVXFJPJFONN-UHFFFAOYSA-N 0.000 claims abstract description 80
- 239000011521 glass Substances 0.000 claims abstract description 65
- 239000011159 matrix material Substances 0.000 claims abstract description 19
- 150000004767 nitrides Chemical class 0.000 claims abstract description 7
- 150000004645 aluminates Chemical class 0.000 claims abstract description 4
- RCJVRSBWZCNNQT-UHFFFAOYSA-N dichloridooxygen Chemical compound ClOCl RCJVRSBWZCNNQT-UHFFFAOYSA-N 0.000 claims abstract description 4
- 150000004820 halides Chemical class 0.000 claims abstract description 4
- 230000005284 excitation Effects 0.000 claims description 27
- 239000000843 powder Substances 0.000 claims description 23
- 239000000758 substrate Substances 0.000 claims description 20
- 229910004298 SiO 2 Inorganic materials 0.000 claims description 19
- 229910018068 Li 2 O Inorganic materials 0.000 claims description 16
- 229910052760 oxygen Inorganic materials 0.000 claims description 15
- 229910018072 Al 2 O 3 Inorganic materials 0.000 claims description 10
- 229910052708 sodium Inorganic materials 0.000 claims description 9
- DGWFDTKFTGTOAF-UHFFFAOYSA-N P.Cl.Cl.Cl Chemical compound P.Cl.Cl.Cl DGWFDTKFTGTOAF-UHFFFAOYSA-N 0.000 claims description 3
- PNEYBMLMFCGWSK-UHFFFAOYSA-N aluminium oxide Inorganic materials [O-2].[O-2].[O-2].[Al+3].[Al+3] PNEYBMLMFCGWSK-UHFFFAOYSA-N 0.000 abstract description 2
- VEXZGXHMUGYJMC-UHFFFAOYSA-M Chloride anion Chemical compound [Cl-] VEXZGXHMUGYJMC-UHFFFAOYSA-M 0.000 abstract 2
- FUJCRWPEOMXPAD-UHFFFAOYSA-N Li2O Inorganic materials [Li+].[Li+].[O-2] FUJCRWPEOMXPAD-UHFFFAOYSA-N 0.000 abstract 2
- KKCBUQHMOMHUOY-UHFFFAOYSA-N Na2O Inorganic materials [O-2].[Na+].[Na+] KKCBUQHMOMHUOY-UHFFFAOYSA-N 0.000 abstract 2
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N Silicium dioxide Chemical compound O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 abstract 2
- XUCJHNOBJLKZNU-UHFFFAOYSA-M dilithium;hydroxide Chemical compound [Li+].[Li+].[OH-] XUCJHNOBJLKZNU-UHFFFAOYSA-M 0.000 abstract 2
- 229910052681 coesite Inorganic materials 0.000 abstract 1
- 229910052593 corundum Inorganic materials 0.000 abstract 1
- 229910052906 cristobalite Inorganic materials 0.000 abstract 1
- 239000000377 silicon dioxide Substances 0.000 abstract 1
- 235000012239 silicon dioxide Nutrition 0.000 abstract 1
- 229910052682 stishovite Inorganic materials 0.000 abstract 1
- 229910052905 tridymite Inorganic materials 0.000 abstract 1
- 229910001845 yogo sapphire Inorganic materials 0.000 abstract 1
- CPLXHLVBOLITMK-UHFFFAOYSA-N Magnesium oxide Chemical compound [Mg]=O CPLXHLVBOLITMK-UHFFFAOYSA-N 0.000 description 20
- 230000004907 flux Effects 0.000 description 10
- 239000000395 magnesium oxide Substances 0.000 description 10
- 230000000694 effects Effects 0.000 description 9
- 238000001354 calcination Methods 0.000 description 8
- 150000002500 ions Chemical class 0.000 description 8
- 239000003513 alkali Substances 0.000 description 7
- 238000004020 luminiscence type Methods 0.000 description 7
- 239000000203 mixture Substances 0.000 description 7
- 239000002245 particle Substances 0.000 description 7
- 239000001301 oxygen Substances 0.000 description 6
- 229910052783 alkali metal Inorganic materials 0.000 description 4
- 150000001340 alkali metals Chemical class 0.000 description 4
- QVGXLLKOCUKJST-UHFFFAOYSA-N atomic oxygen Chemical compound [O] QVGXLLKOCUKJST-UHFFFAOYSA-N 0.000 description 4
- 230000015572 biosynthetic process Effects 0.000 description 4
- 230000000052 comparative effect Effects 0.000 description 4
- 230000006866 deterioration Effects 0.000 description 4
- 238000004519 manufacturing process Methods 0.000 description 4
- 238000002844 melting Methods 0.000 description 4
- 230000008018 melting Effects 0.000 description 4
- 239000011812 mixed powder Substances 0.000 description 4
- 239000011347 resin Substances 0.000 description 4
- 229920005989 resin Polymers 0.000 description 4
- 229910017639 MgSi Inorganic materials 0.000 description 3
- 229910003564 SiAlON Inorganic materials 0.000 description 3
- 229910002808 Si–O–Si Inorganic materials 0.000 description 3
- 229910052782 aluminium Inorganic materials 0.000 description 3
- JNDMLEXHDPKVFC-UHFFFAOYSA-N aluminum;oxygen(2-);yttrium(3+) Chemical compound [O-2].[O-2].[O-2].[Al+3].[Y+3] JNDMLEXHDPKVFC-UHFFFAOYSA-N 0.000 description 3
- 239000000463 material Substances 0.000 description 3
- 238000001228 spectrum Methods 0.000 description 3
- 229910019901 yttrium aluminum garnet Inorganic materials 0.000 description 3
- 229910004283 SiO 4 Inorganic materials 0.000 description 2
- 229910003668 SrAl Inorganic materials 0.000 description 2
- UCKMPCXJQFINFW-UHFFFAOYSA-N Sulphide Chemical compound [S-2] UCKMPCXJQFINFW-UHFFFAOYSA-N 0.000 description 2
- 229910000272 alkali metal oxide Inorganic materials 0.000 description 2
- 229910000287 alkaline earth metal oxide Inorganic materials 0.000 description 2
- 230000008859 change Effects 0.000 description 2
- 238000002845 discoloration Methods 0.000 description 2
- 238000009826 distribution Methods 0.000 description 2
- 238000010304 firing Methods 0.000 description 2
- 238000005286 illumination Methods 0.000 description 2
- 238000001748 luminescence spectrum Methods 0.000 description 2
- 238000000034 method Methods 0.000 description 2
- 238000002156 mixing Methods 0.000 description 2
- -1 oxygen ions Chemical class 0.000 description 2
- BASFCYQUMIYNBI-UHFFFAOYSA-N platinum Chemical compound [Pt] BASFCYQUMIYNBI-UHFFFAOYSA-N 0.000 description 2
- 239000002994 raw material Substances 0.000 description 2
- 238000005245 sintering Methods 0.000 description 2
- 229910015999 BaAl Inorganic materials 0.000 description 1
- 229910015902 Bi 2 O 3 Inorganic materials 0.000 description 1
- 229910021193 La 2 O 3 Inorganic materials 0.000 description 1
- 229910020068 MgAl Inorganic materials 0.000 description 1
- 229910006404 SnO 2 Inorganic materials 0.000 description 1
- GEIAQOFPUVMAGM-UHFFFAOYSA-N ZrO Inorganic materials [Zr]=O GEIAQOFPUVMAGM-UHFFFAOYSA-N 0.000 description 1
- 238000010521 absorption reaction Methods 0.000 description 1
- 230000004913 activation Effects 0.000 description 1
- 229910001413 alkali metal ion Inorganic materials 0.000 description 1
- 150000001450 anions Chemical class 0.000 description 1
- 239000002585 base Substances 0.000 description 1
- 239000000919 ceramic Substances 0.000 description 1
- CETPSERCERDGAM-UHFFFAOYSA-N ceric oxide Chemical compound O=[Ce]=O CETPSERCERDGAM-UHFFFAOYSA-N 0.000 description 1
- 229910000422 cerium(IV) oxide Inorganic materials 0.000 description 1
- 239000003795 chemical substances by application Substances 0.000 description 1
- 238000003776 cleavage reaction Methods 0.000 description 1
- 239000011248 coating agent Substances 0.000 description 1
- 238000000576 coating method Methods 0.000 description 1
- 238000004040 coloring Methods 0.000 description 1
- 239000000470 constituent Substances 0.000 description 1
- 238000001816 cooling Methods 0.000 description 1
- 239000000835 fiber Substances 0.000 description 1
- 239000002223 garnet Substances 0.000 description 1
- 230000006872 improvement Effects 0.000 description 1
- 229910003480 inorganic solid Inorganic materials 0.000 description 1
- 230000001678 irradiating effect Effects 0.000 description 1
- 238000007561 laser diffraction method Methods 0.000 description 1
- 230000007246 mechanism Effects 0.000 description 1
- 239000006060 molten glass Substances 0.000 description 1
- 238000000465 moulding Methods 0.000 description 1
- 230000003287 optical effect Effects 0.000 description 1
- 229910052697 platinum Inorganic materials 0.000 description 1
- 229910052700 potassium Inorganic materials 0.000 description 1
- 238000009877 rendering Methods 0.000 description 1
- 230000007017 scission Effects 0.000 description 1
- 230000035945 sensitivity Effects 0.000 description 1
- 239000000126 substance Substances 0.000 description 1
- 230000002123 temporal effect Effects 0.000 description 1
- 230000000007 visual effect Effects 0.000 description 1
Classifications
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- C—CHEMISTRY; METALLURGY
- C03—GLASS; MINERAL OR SLAG WOOL
- C03C—CHEMICAL COMPOSITION OF GLASSES, GLAZES OR VITREOUS ENAMELS; SURFACE TREATMENT OF GLASS; SURFACE TREATMENT OF FIBRES OR FILAMENTS MADE FROM GLASS, MINERALS OR SLAGS; JOINING GLASS TO GLASS OR OTHER MATERIALS
- C03C3/00—Glass compositions
- C03C3/04—Glass compositions containing silica
- C03C3/076—Glass compositions containing silica with 40% to 90% silica, by weight
- C03C3/089—Glass compositions containing silica with 40% to 90% silica, by weight containing boron
- C03C3/091—Glass compositions containing silica with 40% to 90% silica, by weight containing boron containing aluminium
-
- C—CHEMISTRY; METALLURGY
- C03—GLASS; MINERAL OR SLAG WOOL
- C03C—CHEMICAL COMPOSITION OF GLASSES, GLAZES OR VITREOUS ENAMELS; SURFACE TREATMENT OF GLASS; SURFACE TREATMENT OF FIBRES OR FILAMENTS MADE FROM GLASS, MINERALS OR SLAGS; JOINING GLASS TO GLASS OR OTHER MATERIALS
- C03C14/00—Glass compositions containing a non-glass component, e.g. compositions containing fibres, filaments, whiskers, platelets, or the like, dispersed in a glass matrix
- C03C14/006—Glass compositions containing a non-glass component, e.g. compositions containing fibres, filaments, whiskers, platelets, or the like, dispersed in a glass matrix the non-glass component being in the form of microcrystallites, e.g. of optically or electrically active material
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- C—CHEMISTRY; METALLURGY
- C03—GLASS; MINERAL OR SLAG WOOL
- C03C—CHEMICAL COMPOSITION OF GLASSES, GLAZES OR VITREOUS ENAMELS; SURFACE TREATMENT OF GLASS; SURFACE TREATMENT OF FIBRES OR FILAMENTS MADE FROM GLASS, MINERALS OR SLAGS; JOINING GLASS TO GLASS OR OTHER MATERIALS
- C03C3/00—Glass compositions
- C03C3/04—Glass compositions containing silica
- C03C3/076—Glass compositions containing silica with 40% to 90% silica, by weight
- C03C3/089—Glass compositions containing silica with 40% to 90% silica, by weight containing boron
- C03C3/091—Glass compositions containing silica with 40% to 90% silica, by weight containing boron containing aluminium
- C03C3/093—Glass compositions containing silica with 40% to 90% silica, by weight containing boron containing aluminium containing zinc or zirconium
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- C—CHEMISTRY; METALLURGY
- C03—GLASS; MINERAL OR SLAG WOOL
- C03C—CHEMICAL COMPOSITION OF GLASSES, GLAZES OR VITREOUS ENAMELS; SURFACE TREATMENT OF GLASS; SURFACE TREATMENT OF FIBRES OR FILAMENTS MADE FROM GLASS, MINERALS OR SLAGS; JOINING GLASS TO GLASS OR OTHER MATERIALS
- C03C3/00—Glass compositions
- C03C3/04—Glass compositions containing silica
- C03C3/076—Glass compositions containing silica with 40% to 90% silica, by weight
- C03C3/097—Glass compositions containing silica with 40% to 90% silica, by weight containing phosphorus, niobium or tantalum
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- C—CHEMISTRY; METALLURGY
- C03—GLASS; MINERAL OR SLAG WOOL
- C03C—CHEMICAL COMPOSITION OF GLASSES, GLAZES OR VITREOUS ENAMELS; SURFACE TREATMENT OF GLASS; SURFACE TREATMENT OF FIBRES OR FILAMENTS MADE FROM GLASS, MINERALS OR SLAGS; JOINING GLASS TO GLASS OR OTHER MATERIALS
- C03C4/00—Compositions for glass with special properties
- C03C4/12—Compositions for glass with special properties for luminescent glass; for fluorescent glass
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- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09K—MATERIALS FOR MISCELLANEOUS APPLICATIONS, NOT PROVIDED FOR ELSEWHERE
- C09K11/00—Luminescent, e.g. electroluminescent, chemiluminescent materials
- C09K11/02—Use of particular materials as binders, particle coatings or suspension media therefor
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- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09K—MATERIALS FOR MISCELLANEOUS APPLICATIONS, NOT PROVIDED FOR ELSEWHERE
- C09K11/00—Luminescent, e.g. electroluminescent, chemiluminescent materials
- C09K11/08—Luminescent, e.g. electroluminescent, chemiluminescent materials containing inorganic luminescent materials
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- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F21—LIGHTING
- F21V—FUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMS THEREOF; STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHER ARTICLES, NOT OTHERWISE PROVIDED FOR
- F21V9/00—Elements for modifying spectral properties, polarisation or intensity of the light emitted, e.g. filters
- F21V9/30—Elements containing photoluminescent material distinct from or spaced from the light source
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- C—CHEMISTRY; METALLURGY
- C03—GLASS; MINERAL OR SLAG WOOL
- C03C—CHEMICAL COMPOSITION OF GLASSES, GLAZES OR VITREOUS ENAMELS; SURFACE TREATMENT OF GLASS; SURFACE TREATMENT OF FIBRES OR FILAMENTS MADE FROM GLASS, MINERALS OR SLAGS; JOINING GLASS TO GLASS OR OTHER MATERIALS
- C03C2214/00—Nature of the non-vitreous component
- C03C2214/16—Microcrystallites, e.g. of optically or electrically active material
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L33/00—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L33/48—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
- H01L33/50—Wavelength conversion elements
- H01L33/501—Wavelength conversion elements characterised by the materials, e.g. binder
- H01L33/502—Wavelength conversion materials
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- Glass Compositions (AREA)
- Led Device Packages (AREA)
- Luminescent Compositions (AREA)
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Abstract
Description
本發明係關於一種用以將發光二極體(LED:Light Emitting Diode)或雷射二極體(LD:Laser Diode)等發光元件所發出之光之波長變換成其他波長的波長變換構件。 The present invention relates to a wavelength conversion member for converting a wavelength of light emitted from a light-emitting element such as a light emitting diode (LED) or a laser diode (LD: Laser Diode) to another wavelength.
近年來,作為代替螢光燈或白熾燈之下一代光源,就低耗電、小型輕量、容易調節光量之觀點而言,對使用LED或LD之光源之關注不斷提高。作為此種下一代光源之一例,例如專利文獻1中揭示有於出射藍色光之LED上配置有將來自LED之光之一部分吸收並變換成黃色光之波長變換構件的光源。該光源係發出作為自LED出射之藍色光與自波長變換構件出射之黃色光之合成光的白色光。 In recent years, as a next-generation light source that replaces a fluorescent lamp or an incandescent lamp, attention has been paid to the use of a light source using LEDs or LDs from the viewpoint of low power consumption, small size and light weight, and easy adjustment of the amount of light. As an example of such a next-generation light source, for example, Patent Document 1 discloses a light source in which a wavelength conversion member that absorbs and converts a part of light from an LED into yellow light is disposed on an LED that emits blue light. The light source emits white light which is a combined light of blue light emitted from the LED and yellow light emitted from the wavelength converting member.
作為波長變換構件,先前係使用於樹脂基質中分散有無機螢光體者。然而,於使用該波長變換構件之情形時,存在因來自LED之光而導致樹脂劣化,光源之亮度容易變低之問題。尤其存在因LED所發出之熱或高能量之短波長(藍色~紫外)光而導致樹脂基質劣化,引起變色或變形之問題。 As the wavelength converting member, those used in the case where an inorganic phosphor is dispersed in a resin matrix have been used. However, when the wavelength conversion member is used, there is a problem that the resin is deteriorated due to light from the LED, and the luminance of the light source is liable to become low. In particular, there is a problem that the resin matrix is deteriorated due to heat generated by the LED or short-wavelength (blue-ultraviolet) light of high energy, causing discoloration or deformation.
因此,業界提出有包含代替樹脂於玻璃基質中分散固定有無機螢光體之完全無機固體之波長變換構件(例如參照專利文獻2及3)。該波長變換構件具有如下特徵:成為母材之玻璃不易因TED晶片之熱或照射光而劣化,不易產生變色或變形等問題。 Therefore, a wavelength conversion member including a completely inorganic solid in which an inorganic phosphor is dispersed and fixed in a glass matrix in place of a resin has been proposed (for example, refer to Patent Documents 2 and 3). This wavelength conversion member is characterized in that the glass to be a base material is less likely to be deteriorated by heat of the TED wafer or irradiation light, and it is less likely to cause discoloration or deformation.
然而,專利文獻2及3中記載之波長變換構件存在因製造時之焙 燒而導致無機螢光體劣化,容易亮度劣化之問題。尤其是於一般照明、特殊照明等用途中,由於要求較高之演色性,故而必須使用紅色或綠色等耐熱性相對較低之無機螢光體,而有無機螢光體之劣化變得顯著之傾向。因此,業界提出有藉由使玻璃組成中含有鹼金屬氧化物而降低玻璃粉末之軟化點之波長變換構件(例如參照專利文獻4)。該波長變換構件由於可藉由相對低溫下之焙燒而製造,故而可抑制焙燒時之無機螢光體之劣化。 However, the wavelength conversion members described in Patent Documents 2 and 3 have baking at the time of manufacture. The problem of deterioration of the inorganic phosphor is caused by burning, and the brightness is easily deteriorated. In particular, in general lighting, special lighting, and the like, since high color rendering properties are required, it is necessary to use an inorganic phosphor having a relatively low heat resistance such as red or green, and the deterioration of the inorganic phosphor becomes remarkable. tendency. Therefore, the wavelength conversion member which reduces the softening point of the glass powder by containing an alkali metal oxide in the glass composition is proposed (for example, refer patent document 4). Since the wavelength conversion member can be produced by firing at a relatively low temperature, deterioration of the inorganic phosphor at the time of baking can be suppressed.
[專利文獻1]日本專利特開2000-208815號公報 [Patent Document 1] Japanese Patent Laid-Open Publication No. 2000-208815
[專利文獻2]日本專利特開2003-258308號公報 [Patent Document 2] Japanese Patent Laid-Open Publication No. 2003-258308
[專利文獻3]日本專利第4895541號公報 [Patent Document 3] Japanese Patent No. 4895541
[專利文獻4]日本專利特開2007-302858號公報 [Patent Document 4] Japanese Patent Laid-Open Publication No. 2007-302858
專利文獻4中記載之波長變換構件存在發光強度容易經時降低之問題。隨著近年來之LED或LD等光源之輸出進一步增大,發光強度之經時之降低越發顯著。 The wavelength conversion member described in Patent Document 4 has a problem that the luminous intensity tends to decrease over time. As the output of light sources such as LEDs or LDs has further increased in recent years, the decrease in luminous intensity over time has become more pronounced.
因此,本發明之目的在於提供一種於照射LED或LD之光之情形時經時之發光強度之降低較少之波長變換構件及使用其而成之發光裝置。 Accordingly, an object of the present invention is to provide a wavelength conversion member having a small decrease in luminous intensity over time when an LED or an LD is irradiated, and a light-emitting device using the same.
本發明之波長變換構件之特徵在於:其係於玻璃基質中分散無機螢光體而成,且玻璃基質以莫耳%計含有SiO2 40~60%、B2O3 0.1~35%、Al2O3 0.1~10%、Li2O 0~10%、Na2O 0~10%、K2O 0~10%、Li2O+Na2O+K2O 0.1~10%、MgO 0~45%、CaO 0~45%、 SrO 0~45%、BaO 0~45%、MgO+CaO+SrO+BaO 0.1~45%、及ZnO 0~15%,並且無機螢光體係選自由氧化物螢光體、氮化物螢光體、氮氧化物螢光體、氯化物螢光體、氧氯化物螢光體、鹵化物螢光體、鋁酸鹽螢光體及鹵磷酸鹽螢光體所組成之群中之至少1種。 The wavelength conversion member of the present invention is characterized in that it is obtained by dispersing an inorganic phosphor in a glass matrix, and the glass substrate contains SiO 2 40 to 60%, B 2 O 3 0.1 to 35%, and Al in terms of mol%. 2 O 3 0.1~10%, Li 2 O 0~10%, Na 2 O 0~10%, K 2 O 0~10%, Li 2 O+Na 2 O+K 2 O 0.1~10%, MgO 0 ~45%, CaO 0~45%, SrO 0~45%, BaO 0~45%, MgO+CaO+SrO+BaO 0.1~45%, and ZnO 0~15%, and the inorganic fluorescent system is selected from oxides Phosphor, nitride phosphor, oxynitride phosphor, chloride phosphor, oxychloride phosphor, halide phosphor, aluminate phosphor, and halophosphate phosphor At least one of the group consisting of.
本發明者等查明:波長變換構件之發光強度之經時之降低尤其是受到玻璃組成中所含有之鹼金屬成分或SiO2成分之影響。推測其機制如下所述。 The inventors have found that the decrease in the luminous intensity of the wavelength converting member over time is particularly affected by the alkali metal component or the SiO 2 component contained in the glass composition. It is speculated that the mechanism is as follows.
若對組成中含有鹼金屬元素之玻璃基質照射激發光,則於玻璃基質中之氧離子之最外殼所存在之電子藉由激發光之能量被激發而自氧離子脫離。其一部分與玻璃基質中之鹼離子結合而形成著色中心(此處,鹼離子逃逸後形成空位)。另一方面,因電子逃逸而產生之電洞於玻璃基質中移動,一部分被捕捉至鹼離子逃逸後所形成之空位而形成著色中心。認為於玻璃基質中所形成之該等著色中心成為激發光或螢光之吸收源,而波長變換構件之發光強度降低。進而,有因由無機螢光體所產生之熱(因波長變換損耗所產生之熱),玻璃基質中之電子、電洞、鹼離子之移動變得活躍之傾向。藉此,加速著色中心之形成,而發光強度容易降低。因此,於本發明中,藉由含有鹼金屬元素作為必需成分,並且如上所述般將其含量限制為較少,而抑制軟化點之上升,並且抑制著色中心之產生。 When the excitation light is irradiated to the glass substrate containing the alkali metal element in the composition, the electrons present in the outermost shell of the oxygen ions in the glass matrix are excited by the energy of the excitation light to be detached from the oxygen ions. A part of it combines with the alkali ions in the glass matrix to form a color center (here, alkali ions escape to form vacancies). On the other hand, the holes generated by the escape of electrons move in the glass matrix, and a part of the holes are trapped to the vacancies formed after the escape of the alkali ions to form a color center. It is considered that the coloring centers formed in the glass matrix become absorption sources of excitation light or fluorescence, and the light-emitting intensity of the wavelength conversion member is lowered. Further, there is a tendency that electrons, holes, and alkali ions in the glass matrix become active due to heat generated by the inorganic phosphor (heat generated by wavelength conversion loss). Thereby, the formation of the coloring center is accelerated, and the luminous intensity is easily lowered. Therefore, in the present invention, by containing an alkali metal element as an essential component and limiting the content thereof to less as described above, the increase in the softening point is suppressed, and the generation of the coloring center is suppressed.
又,於組成中SiO2含量較多之情形時,於玻璃基質中作為網絡成形劑之Si-O-Si鍵之比率變多,而玻璃基質結構穩定化。因此,穩定地保持藉由Si-O-Si鍵中之Si與O之間之鍵被切斷而形成之非橋接氧,該非橋接氧成為著色中心而成為發光強度降低之原因。另一方面,於組成中SiO2含量較少之情形時,因其他成分之含量相對變多,除Si-O-Si鍵以外之鍵增加(例如於Si與O之間進入Ba或Na等其他元素),故而玻璃基質結構之穩定性降低。於在該狀態下形成非橋接氧之情形時,由 於Si元素周圍之鍵結狀態之穩定性降低,故而不易穩定地保持非橋接氧。其結果為,著色中心之形成得到抑制。 Further, in the case where the SiO 2 content is large in the composition, the ratio of Si-O-Si bonds as a network forming agent in the glass matrix increases, and the glass matrix structure is stabilized. Therefore, the non-bridged oxygen formed by the cleavage of the bond between Si and O in the Si-O-Si bond is stably maintained, and the non-bridged oxygen becomes a coloring center, which causes a decrease in luminescence intensity. On the other hand, when the content of SiO 2 is small in the composition, the content of other components is relatively increased, and the bond other than the Si—O—Si bond is increased (for example, Ba or Na is entered between Si and O, etc.). Element), so the stability of the glass matrix structure is reduced. In the case where non-bridged oxygen is formed in this state, since the stability of the bonding state around the Si element is lowered, it is not easy to stably maintain the non-bridged oxygen. As a result, the formation of the coloring center is suppressed.
再者,本發明之波長變換構件之玻璃基質含有鹼土氧化物(包括MgO)作為必需成分。鹼土氧化物會阻礙玻璃基質中之鹼金屬離子或其他離子之移動。其結果為,不易形成著色中心,可抑制發光強度之經時之降低。 Further, the glass substrate of the wavelength converting member of the present invention contains an alkaline earth oxide (including MgO) as an essential component. Alkaline earth oxides can hinder the movement of alkali metal ions or other ions in the glass matrix. As a result, it is difficult to form a coloring center, and it is possible to suppress a decrease in the luminous intensity over time.
於本發明之波長變換構件中,較佳為玻璃基質分別含有0.1%以上之Li2O、Na2O及K2O。 In the wavelength conversion member of the present invention, it is preferred that the glass substrate contains 0.1% or more of Li 2 O, Na 2 O, and K 2 O, respectively.
於本發明之波長變換構件中,較佳為玻璃基質之軟化點為400~800℃。 In the wavelength converting member of the present invention, it is preferred that the glass substrate has a softening point of 400 to 800 °C.
本發明之波長變換構件較佳為含有0.01~30質量%之無機螢光體。 The wavelength converting member of the present invention preferably contains 0.01 to 30% by mass of an inorganic phosphor.
本發明之波長變換構件較佳為包含粉末燒結體。 The wavelength converting member of the present invention preferably contains a powder sintered body.
本發明之發光裝置之特徵在於:其係具備上述波長變換構件、及對波長變換構件照射激發光之光源而成。 A light-emitting device according to the present invention is characterized in that it includes the wavelength conversion member and a light source that emits excitation light to the wavelength conversion member.
根據本發明,可提供一種於照射LED或LD之光之情形時經時之發光強度之降低較少之波長變換構件及使用其而成之發光裝置。 According to the present invention, it is possible to provide a wavelength conversion member having a small decrease in luminous intensity over time when irradiating light of an LED or an LD, and a light-emitting device using the same.
1‧‧‧發光裝置 1‧‧‧Lighting device
2‧‧‧波長變換構件 2‧‧‧wavelength conversion component
3‧‧‧光源 3‧‧‧Light source
L1‧‧‧激發光 L1‧‧‧Excited light
L2‧‧‧螢光 L2‧‧‧Fluorescent
圖1係本發明之一實施形態之發光裝置的模式性側視圖。 BRIEF DESCRIPTION OF THE DRAWINGS Fig. 1 is a schematic side view of a light-emitting device according to an embodiment of the present invention.
本發明之波長變換構件係於玻璃基質中分散無機螢光體而成者。玻璃基質以莫耳%計含有SiO2 40~60%、B2O3 0.1~35%、Al2O3 0.1~10%、Li2O 0~10%、Na2O 0~10%、K2O 0~10%、Li2O+Na2O+K2O 0.1~10%、MgO 0~45%、CaO 0~45%、SrO 0~45%、BaO 0~45%、MgO+CaO+SrO+BaO 0.1~45%、及ZnO 0~15%。以下對如 此限定玻璃組成範圍之原因進行說明。 The wavelength conversion member of the present invention is obtained by dispersing an inorganic phosphor in a glass matrix. The glass matrix contains 40 to 60% of SiO 2 , 0.1 to 35% of B 2 O 3 , 0.1 to 10% of Al 2 O 3 , 0.1 to 10% of Li 2 O, 0 to 10% of Na 2 O, and K in terms of mole %. 2 O 0~10%, Li 2 O+Na 2 O+K 2 O 0.1~10%, MgO 0~45%, CaO 0~45%, SrO 0~45%, BaO 0~45%, MgO+CaO +SrO+BaO 0.1~45%, and ZnO 0~15%. The reason why the glass composition range is thus limited will be described below.
SiO2係形成玻璃網絡之成分。SiO2之含量為40~60%,較佳為45~55%。若SiO2之含量過少,則有耐候性或機械強度降低之傾向。另一方面,若SiO2之含量過多,則發光強度容易經時降低。又,於製造波長變換構件時燒結溫度成為高溫,而無機螢光體容易劣化。 SiO 2 forms a component of the glass network. The content of SiO 2 is 40 to 60%, preferably 45 to 55%. When the content of SiO 2 is too small, there is a tendency that weather resistance or mechanical strength is lowered. On the other hand, when the content of SiO 2 is too large, the luminescence intensity tends to decrease with time. Further, when the wavelength conversion member is manufactured, the sintering temperature becomes high, and the inorganic phosphor is easily deteriorated.
B2O3係使熔融溫度降低而顯著改善熔融性之成分。B2O3之含量為0.1~35%,較佳為1~30%。若B2O3之含量過少,則不易獲得上述效果。又,於製造波長變換構件時燒結溫度成為高溫,而無機螢光體容易劣化。另一方面,若B2O3之含量過多,則發光強度容易經時降低。又,耐候性容易降低。 B 2 O 3 is a component which lowers the melting temperature and remarkably improves the meltability. The content of B 2 O 3 is from 0.1 to 35%, preferably from 1 to 30%. If the content of B 2 O 3 is too small, the above effects are not easily obtained. Further, when the wavelength conversion member is manufactured, the sintering temperature becomes high, and the inorganic phosphor is easily deteriorated. On the other hand, when the content of B 2 O 3 is too large, the luminous intensity tends to decrease with time. Moreover, weather resistance is liable to lower.
再者,SiO2與B2O3之比率SiO2/B2O3(莫耳比)之值較佳為1~7、1~6.5、1.1~6、1.15~5、1.2~4、1.5~3.5,尤佳為1.7~2.5。若SiO2/B2O3之值過大,則有SiO2之比率變大,容易形成因O元素脫離所引起之著色中心,而發光強度經時降低之傾向。另一方面,若SiO2/B2O3之值過小,則B2O3之比率變大,而耐候性容易降低。 Further, the ratio of SiO 2 to B 2 O 3 of SiO 2 /B 2 O 3 (mole ratio) is preferably 1 to 7, 1 to 6.5, 1.1 to 6, 1.15 to 5, 1.2 to 4, and 1.5. ~3.5, especially good is 1.7~2.5. When the value of SiO 2 /B 2 O 3 is too large, the ratio of SiO 2 becomes large, and it is easy to form a coloring center due to the detachment of the O element, and the luminous intensity tends to decrease with time. On the other hand, when the value of SiO 2 /B 2 O 3 is too small, the ratio of B 2 O 3 becomes large, and weather resistance is liable to lower.
Al2O3係提高耐候性或機械強度之成分。Al2O3之含量為0.1~10%,較佳為2~8%。若Al2O3之含量過少,則不易獲得上述效果。另一方面,若Al2O3之含量過多,則有熔融性降低之傾向。 Al 2 O 3 is a component that improves weather resistance or mechanical strength. The content of Al 2 O 3 is 0.1 to 10%, preferably 2 to 8%. If the content of Al 2 O 3 is too small, the above effects are not easily obtained. On the other hand, when the content of Al 2 O 3 is too large, the meltability tends to decrease.
再者,為了達成較高之耐候性,較佳為將SiO2+B2O3+Al2O3之含量設為55%以上,更佳為設為60%以上,進而較佳為設為65%以上,尤佳為設為67%以上,最佳為設為70%以上。SiO2+B2O3+Al2O3之含量之上限並無特別限定,若過多,則熔融性容易降低,因此較佳為設為85%以下,更佳為設為84%以下,進而較佳為設為83%以下。 Further, in order to achieve high weather resistance, the content of SiO 2 + B 2 O 3 + Al 2 O 3 is preferably 55% or more, more preferably 60% or more, and further preferably set to 65% or more, and particularly preferably 67% or more, and most preferably 70% or more. The upper limit of the content of SiO 2 + B 2 O 3 + Al 2 O 3 is not particularly limited, and if it is too large, the meltability is liable to lower. Therefore, it is preferably 85% or less, more preferably 84% or less. It is preferably set to 83% or less.
Li2O、Na2O及K2O係使熔融溫度降低而改善熔融性且使軟化點降低之成分。該等成分之含量分別為0~10%,較佳為0~5%,更佳為0.1~2%。若該等成分之含量過多,則有耐候性降低之傾向。 Li 2 O, Na 2 O, and K 2 O are components which lower the melting temperature and improve the meltability and lower the softening point. The content of the components is 0 to 10%, preferably 0 to 5%, more preferably 0.1 to 2%. If the content of these components is too large, the weather resistance tends to decrease.
再者,Li2O+Na2O+K2O之含量為0.1~10%,較佳為1~7%,更佳為2~5%。若Li2O+Na2O+K2O之含量過少,則軟化點不易降低。另一方面,若Li2O+Na2O+K2O含量過多,則耐候性容易降低,且容易因LED或LD之光照射而導致發光強度經時降低。Li2O、Na2O及K2O較佳為將2種以上、尤其是3種混合而使用。具體而言,較佳為分別含有0.1%以上之Li2O、Na2O及K2O。若如此,則可藉由混合鹼效應而高效率地降低軟化點。又,若使各鹼性氧化物之含量同等,則容易獲得混合鹼效應。 Further, the content of Li 2 O+Na 2 O+K 2 O is 0.1 to 10%, preferably 1 to 7%, more preferably 2 to 5%. If the content of Li 2 O+Na 2 O+K 2 O is too small, the softening point is not easily lowered. On the other hand, when the content of Li 2 O+Na 2 O+K 2 O is too large, the weather resistance is liable to lower, and the light emission intensity is likely to decrease with time due to light irradiation of LED or LD. Li 2 O, Na 2 O, and K 2 O are preferably used in combination of two or more kinds, particularly three types. Specifically, it is preferable to contain 0.1% or more of Li 2 O, Na 2 O, and K 2 O, respectively. If so, the softening point can be efficiently reduced by mixing the alkali effect. Moreover, when the content of each basic oxide is made equal, the mixed alkali effect is easily obtained.
為了達成較高之耐候性,較佳為適當調整作為有助於提高耐候性之成分之SiO2、B2O3及Al2O3之總量與成為耐候性降低之原因之鹼金屬氧化物(Li2O、Na2O及K2O)之含量之比率。具體而言,(Li2O+Na2O+K2O)/(SiO2+B2O3+Al2O3)(莫耳比)較佳為0.2以下,更佳為0.18以下,進而較佳為0.15以下。 In order to achieve high weather resistance, it is preferred to appropriately adjust the total amount of SiO 2 , B 2 O 3 and Al 2 O 3 which are components which contribute to improvement of weather resistance, and the alkali metal oxide which is a cause of deterioration in weather resistance. The ratio of the content of (Li 2 O, Na 2 O and K 2 O). Specifically, (Li 2 O+Na 2 O+K 2 O)/(SiO 2 +B 2 O 3 +Al 2 O 3 ) (mole ratio) is preferably 0.2 or less, more preferably 0.18 or less, and further It is preferably 0.15 or less.
MgO、CaO、SrO及BaO係使熔融溫度降低而改善熔融性且使軟化點降低之成分。又,由於阻礙成為因LED或LD之光照射導致形成著色中心之原因之離子之移動,故而亦具有抑制發光強度之經時之降低之效果。該等成分之含量分別為0~45%,較佳為10~45%,尤佳為15~35%。若該等成分之含量過多,則有耐候性降低之傾向。再者,質量數較大之BaO之阻礙成為形成著色中心之原因之離子之移動之效果較大,可有效地抑制發光強度之經時之降低。 MgO, CaO, SrO, and BaO are components which lower the melting temperature and improve the meltability and lower the softening point. Further, since the movement of ions which cause the formation of the coloring center due to the irradiation of the light of the LED or the LD is inhibited, the effect of suppressing the decrease in the luminous intensity over time is also obtained. The content of the components is 0 to 45%, preferably 10 to 45%, and particularly preferably 15 to 35%. If the content of these components is too large, the weather resistance tends to decrease. Further, the hindrance of BaO having a large mass number is a large effect of the movement of ions which is a cause of forming a coloring center, and the temporal decrease of the luminous intensity can be effectively suppressed.
再者,MgO+CaO+SrO+BaO之含量為0.1~45%,較佳為0.1~40%,更佳為0.1~35%,進而較佳為1~30%,尤佳為5~25%。若MgO+CaO+SrO+BaO之含量過少,則軟化點不易降低,且不易獲得抑制發光強度之經時之降低之效果。另一方面,若MgO+CaO+SrO+BaO之含量過多,則耐候性容易降低。 Further, the content of MgO+CaO+SrO+BaO is 0.1 to 45%, preferably 0.1 to 40%, more preferably 0.1 to 35%, further preferably 1 to 30%, and particularly preferably 5 to 25%. . When the content of MgO+CaO+SrO+BaO is too small, the softening point is not easily lowered, and the effect of suppressing the decrease in luminous intensity over time is not easily obtained. On the other hand, when the content of MgO+CaO+SrO+BaO is too large, the weather resistance is liable to lower.
ZnO係使熔融溫度降低而改善熔融性之成分。ZnO之含量為0~ 15%,較佳為0~12%,更佳為0~10%,進而較佳為1~7%。若ZnO之含量過多,則有耐候性降低之傾向。 ZnO is a component which lowers the melting temperature and improves the meltability. The content of ZnO is 0~ 15%, preferably 0 to 12%, more preferably 0 to 10%, and still more preferably 1 to 7%. When the content of ZnO is too large, the weather resistance tends to decrease.
又,除上述成分以外,亦可於無損本發明之效果之範圍內含有各種成分。例如可於15%以下、進而10%以下、尤其是5%以下且以總量計為30%以下之範圍內分別含有P2O5、La2O3、Ta2O5、TeO2、TiO2、Nb2O5、Gd2O3、Y2O3、CeO2、Sb2O3、SnO2、Bi2O3及ZrO2等。又,亦可含有F。F由於具有降低軟化點之效果,故而藉由含有其代替作為形成著色中心之原因之一之鹼金屬成分,可於維持軟化點之狀態下抑制發光強度之經時之降低。F之含量以陰離子%計較佳為0~20%、0~10%,尤佳為0.1~5%。 Further, in addition to the above components, various components may be contained within the range which does not impair the effects of the present invention. For example, P 2 O 5 , La 2 O 3 , Ta 2 O 5 , TeO 2 , TiO may be contained in a range of 15% or less, further 10% or less, particularly 5% or less, and 30% or less in total. 2 , Nb 2 O 5 , Gd 2 O 3 , Y 2 O 3 , CeO 2 , Sb 2 O 3 , SnO 2 , Bi 2 O 3 and ZrO 2 , and the like. Also, it may contain F. Since F has an effect of lowering the softening point, it is possible to suppress the decrease in the luminous intensity over time while maintaining the softening point by containing the alkali metal component which is one of the causes of forming the coloring center. The content of F is preferably 0 to 20%, 0 to 10%, and particularly preferably 0.1 to 5% in terms of anion %.
玻璃基質之軟化點較佳為400~800℃,更佳為450~750℃,進而較佳為500~700℃。若軟化點過低,則機械強度及耐候性容易降低。另一方面,若軟化點過高,則容易因製造時之焙燒而導致無機螢光體劣化。 The softening point of the glass substrate is preferably from 400 to 800 ° C, more preferably from 450 to 750 ° C, and still more preferably from 500 to 700 ° C. If the softening point is too low, mechanical strength and weather resistance are liable to lower. On the other hand, if the softening point is too high, the inorganic phosphor is likely to be deteriorated by baking at the time of production.
再者,一般多數情況下無機螢光體之折射率高於玻璃。於波長變換構件中,若無機螢光體與玻璃基質之折射率差較大,則激發光容易於無機螢光體與玻璃基質之界面散射。其結果為,激發光對無機螢光體之照射效率變高,而容易提高發光效率。但是,若無機螢光體與玻璃基質之折射率差過大,則有激發光之散射過度,成為散射損失而發光效率反而降低之傾向。鑒於以上情況,無機螢光體與玻璃基質之折射率差較佳為0.001~0.5左右。又,玻璃基質之折射率(nd)較佳為1.45~1.8,更佳為1.47~1.75,進而較佳為1.48~1.6。 Furthermore, in most cases, the refractive index of the inorganic phosphor is higher than that of the glass. In the wavelength conversion member, when the refractive index difference between the inorganic phosphor and the glass substrate is large, the excitation light is easily scattered at the interface between the inorganic phosphor and the glass substrate. As a result, the irradiation efficiency of the excitation light to the inorganic phosphor becomes high, and the luminous efficiency is easily improved. However, if the difference in refractive index between the inorganic phosphor and the glass substrate is too large, excessive scattering of the excitation light tends to cause scattering loss, and the luminous efficiency tends to decrease. In view of the above, the difference in refractive index between the inorganic phosphor and the glass substrate is preferably about 0.001 to 0.5. Further, the refractive index (nd) of the glass substrate is preferably from 1.45 to 1.8, more preferably from 1.47 to 1.75, still more preferably from 1.48 to 1.6.
本發明中之無機螢光體係選自由氧化物螢光體(包括YAG(Yttrium Aluminum Garnet,釔-鋁-石榴石)螢光體等石榴石系螢光體)、氮化物螢光體、氮氧化物螢光體、氯化物螢光體、氧氯化物螢光體、鹵化物螢光體、鋁酸鹽螢光體及鹵磷酸鹽螢光體所組成之群中之至少1種。 於該等無機螢光體中,氧化物螢光體、氮化物螢光體及氮氧化物螢光體之耐熱性較高,於焙燒時相對不易劣化,故而較佳。再者,氮化物螢光體及氮氧化物螢光體具有如下特徵:將近紫外~藍之激發光變換成綠~紅之廣泛波長區域,而且發光強度亦相對較高。因此,氮化物螢光體及氮氧化物螢光體尤其作為用於白色LED元件用波長變換構件之無機螢光體有效。為了抑制由無機螢光體所產生之熱傳導至玻璃基質,可使用經被覆處理之無機螢光體。藉此,可抑制玻璃基質中之電子、電洞、鹼離子之移動之活躍化,結果抑制著色中心之形成。作為被覆材料較佳為氧化物。再者,作為除上述以外之螢光體,可列舉硫化物螢光體,但硫化物螢光體由於會經時劣化或與玻璃基質反應而發光強度容易降低,故而於本發明中不使用。 The inorganic fluorescent system in the present invention is selected from the group consisting of oxide phosphors (including garnet phosphors such as YAG (Yttrium Aluminum Garnet) phosphors), nitride phosphors, and oxynitride. At least one of a group consisting of a substance phosphor, a chloride phosphor, an oxychloride phosphor, a halide phosphor, an aluminate phosphor, and a halophosphate phosphor. Among these inorganic phosphors, the oxide phosphor, the nitride phosphor, and the oxynitride phosphor have high heat resistance and are relatively less likely to be deteriorated during firing, which is preferable. Further, the nitride phosphor and the oxynitride phosphor have the characteristics of converting the near-ultraviolet-blue excitation light into a wide wavelength region of green to red, and the luminescence intensity is relatively high. Therefore, the nitride phosphor and the oxynitride phosphor are particularly effective as an inorganic phosphor for a wavelength conversion member for a white LED element. In order to suppress heat conduction from the inorganic phosphor to the glass substrate, a coated inorganic phosphor may be used. Thereby, activation of movement of electrons, holes, and alkali ions in the glass matrix can be suppressed, and as a result, formation of a coloring center can be suppressed. The coating material is preferably an oxide. In addition, as the phosphor other than the above, a sulfide phosphor is exemplified, but the sulfide phosphor is not deteriorated in the present invention because it deteriorates over time or reacts with the glass substrate to easily reduce the light-emitting intensity.
作為上述無機螢光體,可列舉於波長300~500nm具有激發能帶且於波長380~780nm具有發光波峰者,尤其是發出藍色(波長440~480nm)、綠色(波長500~540nm)、黃色(波長540~595nm)、紅色(波長600~700nm)之光者。 Examples of the inorganic phosphor include an excitation band at a wavelength of 300 to 500 nm and an emission peak at a wavelength of 380 to 780 nm, and particularly blue (wavelength: 440 to 480 nm), green (wavelength: 500 to 540 nm), and yellow. (wavelength 540~595nm), red (wavelength 600~700nm) light.
作為若照射波長300~440nm之紫外~近紫外之激發光則發出藍色之發光之無機螢光體,可列舉:(Sr,Ba)MgAl10O17:Eu2+、(Sr,Ba)3MgSi2O8:Eu2+等。 An inorganic phosphor that emits blue light when irradiated with ultraviolet to near-ultraviolet excitation light having a wavelength of 300 to 440 nm, (Sr, Ba) MgAl 10 O 17 : Eu 2+ , (Sr, Ba) 3 MgSi 2 O 8 : Eu 2+ and the like.
作為若照射波長300~440nm之紫外~近紫外之激發光則發出綠色之螢光之無機螢光體,可列舉:SrAl2O4:Eu2+、SrBaSiO4:Eu2+、Y3(Al,Gd)5O12:Ce3+、SrSiON:Eu2+、BaMgAl10O17:Eu2+,Mn2+、Ba2MgSi2O7:Eu2+、Ba2SiO4:Eu2+、Ba2Li2Si2O7:Eu2+、BaAl2O4:Eu2+等。 The inorganic phosphor that emits green fluorescence when irradiated with ultraviolet to near-ultraviolet excitation light having a wavelength of 300 to 440 nm includes SrAl 2 O 4 :Eu 2+ , SrBaSiO 4 :Eu 2+ , and Y 3 (Al, Gd) 5 O 12 :Ce 3+ , SrSiON:Eu 2+ , BaMgAl 10 O 17 :Eu 2+ ,Mn 2+ , Ba 2 MgSi 2 O 7 :Eu 2+ , Ba 2 SiO 4 :Eu 2+ ,Ba 2 Li 2 Si 2 O 7 :Eu 2+ , BaAl 2 O 4 :Eu 2+ , and the like.
作為若照射波長440~480nm之藍色之激發光則發出綠色之螢光之無機螢光體,可列舉:SrAl2O4:Eu2+、SrBaSiO4:Eu2+、Y3(Al,Gd)5O12:Ce3+、SrSiON:Eu2+、β-SiAlON:Eu2+等。 Examples of the inorganic phosphor that emits green fluorescence when irradiated with blue excitation light having a wavelength of 440 to 480 nm include SrAl 2 O 4 :Eu 2+ , SrBaSiO 4 :Eu 2+ , and Y 3 (Al,Gd). 5 O 12 :Ce 3+ , SrSiON:Eu 2+ , β-SiAlON:Eu 2+ , and the like.
作為若照射波長300~440nm之紫外~近紫外之激發光則發出黃色之螢光之無機螢光體,可列舉La3Si6N11:Ce3+等。 The inorganic phosphor which emits yellow fluorescence when irradiated with ultraviolet to near-ultraviolet excitation light having a wavelength of 300 to 440 nm is exemplified by La 3 Si 6 N 11 :Ce 3+ or the like.
作為若照射波長440~480nm之藍色之激發光則發出黃色之螢光之無機螢光體,可列舉:Y3(Al,Gd)5O12:Ce3+、Sr2SiO4:Eu2+。 The inorganic phosphor which emits yellow fluorescence when irradiated with blue excitation light having a wavelength of 440 to 480 nm is exemplified by Y 3 (Al, Gd) 5 O 12 : Ce 3+ , Sr 2 SiO 4 : Eu 2+ . .
作為若照射波長300~440nm之紫外~近紫外之激發光則發出紅色之螢光之無機螢光體,可列舉:MgSr3Si2O8:Eu2+,Mn2+、Ca2MgSi2O7:Eu2+,Mn2+等。 The inorganic phosphor which emits red fluorescent light when irradiated with ultraviolet to near-ultraviolet excitation light having a wavelength of 300 to 440 nm can be exemplified by MgSr 3 Si 2 O 8 :Eu 2+ , Mn 2+ , Ca 2 MgSi 2 O 7 . :Eu 2+ , Mn 2+, etc.
作為若照射波長440~480nm之藍色之激發光則發出紅色之螢光之無機螢光體,可列舉:CaAlSiN3:Eu2+、CaSiN3:Eu2+、(Ca,Sr)2Si5N8:Eu2+、α-SiAlON:Eu2+等。 Examples of the inorganic phosphor that emits red fluorescence when irradiated with blue excitation light having a wavelength of 440 to 480 nm include CaAlSiN 3 :Eu 2+ , CaSiN 3 :Eu 2+ , and (Ca,Sr) 2 Si 5 N. 8 : Eu 2+ , α-SiAlON: Eu 2+, and the like.
再者,亦可配合激發光或發光之波長區域,將複數種無機螢光體混合而使用。例如於照射紫外線區域之激發光而獲得白色光之情形時,只要將發出藍色、綠色、黃色、紅色之螢光之無機螢光體混合而使用即可。 Further, a plurality of kinds of inorganic phosphors may be mixed and used in combination with the wavelength region of the excitation light or the light emission. For example, when the excitation light is irradiated in the ultraviolet region to obtain white light, the inorganic phosphor emitting blue, green, yellow, or red fluorescent light may be used by mixing.
波長變換構件之發光效率(lm/W)係根據無機螢光體之種類或含量、以及波長變換構件之厚度等不同而變化。無機螢光體之含量與波長變換構件之厚度只要以發光效率成為最佳之方式適當調整即可。若無機螢光體之含量過多,則有產生不易燒結、或氣孔率變大而不易將激發光高效率地照射至無機螢光體、或波長變換構件之機械強度降低等問題之虞。另一方面,若無機螢光體之含量過少,則難以獲得所需之發光強度。就此種觀點而言,本發明之波長變換構件中之無機螢光體之含量較佳為0.01~30質量%,更佳為0.05~25質量%,進而較佳為0.08~20質量%。 The luminous efficiency (lm/W) of the wavelength conversion member varies depending on the type or content of the inorganic phosphor, the thickness of the wavelength conversion member, and the like. The content of the inorganic phosphor and the thickness of the wavelength converting member may be appropriately adjusted so that the luminous efficiency is optimal. When the content of the inorganic phosphor is too large, there is a problem that it is difficult to sinter or the porosity is increased, and the excitation light is efficiently irradiated to the inorganic phosphor or the mechanical strength of the wavelength conversion member is lowered. On the other hand, if the content of the inorganic phosphor is too small, it is difficult to obtain a desired luminescent intensity. In this regard, the content of the inorganic phosphor in the wavelength converting member of the present invention is preferably from 0.01 to 30% by mass, more preferably from 0.05 to 25% by mass, still more preferably from 0.08 to 20% by mass.
再者,對於目的在於使波長變換構件中所產生之螢光反射至激發光入射側且主要僅將螢光提取至外部之波長變換構件,可不在上述範圍內,而以發光強度成為最大之方式增加無機螢光體之含量(例如 為30~80質量%,進而為40~75質量%)。 Further, the wavelength conversion member which aims to reflect the fluorescent light generated in the wavelength conversion member to the excitation light incident side and mainly extract only the fluorescence to the outside may be out of the above range, and the emission intensity may be maximized. Increase the content of inorganic phosphors (for example It is 30 to 80% by mass, and further 40 to 75% by mass).
於本發明之波長變換構件中,除無機螢光體以外,亦可含有以總量計為30質量%以下之氧化鋁、二氧化矽、氧化鎂等光擴散材料。 In addition to the inorganic phosphor, the wavelength conversion member of the present invention may contain a light-diffusing material such as alumina, ceria or magnesia in an amount of 30% by mass or less based on the total amount.
本發明之波長變換構件較佳為包含粉末燒結體。具體而言,較佳為包含含有玻璃粉末及無機螢光體粉末之混合粉末之燒結體。若如此,則可容易地製作於玻璃基質中均勻地分散有無機螢光體之波長變換構件。 The wavelength converting member of the present invention preferably contains a powder sintered body. Specifically, it is preferably a sintered body containing a mixed powder of a glass powder and an inorganic phosphor powder. In this case, the wavelength conversion member in which the inorganic phosphor is uniformly dispersed in the glass substrate can be easily produced.
玻璃粉末之最大粒徑Dmax較佳為200μm以下,更佳為150μm以下,進而較佳為105μm以下。玻璃粉末之平均粒徑D50較佳為0.1μm以上,更佳為1μm以上,進而較佳為2μm以上。若玻璃粉末之最大粒徑Dmax過大,則於所獲得之波長變換構件中,激發光不易散射而發光效率易於降低。又,若玻璃粉末之平均粒徑D50過小,則於所獲得之波長變換構件中,激發光過度散射而發光效率容易降低。 The maximum particle diameter D max of the glass powder is preferably 200 μm or less, more preferably 150 μm or less, still more preferably 105 μm or less. The average particle diameter D 50 of the glass powder is preferably 0.1 μm or more, more preferably 1 μm or more, still more preferably 2 μm or more. When the maximum particle diameter D max of the glass powder is too large, the excitation light is less likely to be scattered in the obtained wavelength conversion member, and the luminous efficiency is liable to lower. Further, when the average particle diameter D 50 of the glass powder is too small, the excitation light is excessively scattered in the obtained wavelength conversion member, and the luminous efficiency is liable to lower.
再者,於本發明中,最大粒徑Dmax及平均粒徑D50係指藉由雷射繞射法所測得之值。 Further, in the present invention, the maximum particle diameter D max and the average particle diameter D 50 refer to values measured by a laser diffraction method.
含有玻璃粉末及無機螢光體之混合粉末之焙燒溫度較佳為玻璃粉末之軟化點±150℃以內,更佳為玻璃粉末之軟化點±100℃以內。若焙燒溫度過低,則玻璃粉末不流動,而不易獲得緻密之燒結體。另一方面,若焙燒溫度過高,則有無機螢光體成分溶出至玻璃中而發光強度降低,或無機螢光體成分擴散至玻璃中將玻璃著色而導致發光強度降低之虞。 The calcination temperature of the mixed powder containing the glass powder and the inorganic phosphor is preferably within ±150 ° C of the softening point of the glass powder, more preferably within ±100 ° C of the softening point of the glass powder. If the baking temperature is too low, the glass powder does not flow, and a dense sintered body is not easily obtained. On the other hand, when the baking temperature is too high, the inorganic phosphor component is eluted into the glass to lower the luminescence intensity, or the inorganic phosphor component is diffused into the glass to color the glass, resulting in a decrease in luminescence intensity.
又,焙燒較佳為於減壓環境中進行。具體而言,焙燒中之環境較佳為未達1.013×105Pa,更佳為1000Pa以下,進而較佳為400Pa以下。藉此,可減少殘留於波長變換構件中之氣泡量。其結果為,可降低波長變換構件內之散射因子,可提高發光效率。再者,可將焙燒步驟整體於減壓環境中進行,亦可例如僅將焙燒步驟於減壓環境中進 行,將其前後之升溫步驟或降溫步驟於並非減壓環境之環境中(例如大氣壓下)進行。 Further, the baking is preferably carried out in a reduced pressure environment. Specifically, the environment in the calcination is preferably less than 1.013 × 10 5 Pa, more preferably 1,000 Pa or less, still more preferably 400 Pa or less. Thereby, the amount of bubbles remaining in the wavelength converting member can be reduced. As a result, the scattering factor in the wavelength conversion member can be reduced, and the luminous efficiency can be improved. Furthermore, the calcination step may be carried out as a whole in a reduced pressure environment, or, for example, only the calcination step may be carried out in a reduced pressure environment, and the temperature rise step or the temperature decrease step before and after the step may be performed in an environment other than a reduced pressure environment (for example, at atmospheric pressure). )get on.
本發明之波長變換構件之形狀並無特別限制,例如不僅包括板狀、柱狀、半球狀、半球圓頂狀等其本身具有特定形狀之構件,亦包括形成於玻璃基板或陶瓷基板等基材表面之覆膜狀之燒結體等。 The shape of the wavelength conversion member of the present invention is not particularly limited, and includes, for example, a member having a specific shape such as a plate shape, a column shape, a hemispherical shape, or a hemispherical dome shape, and a substrate formed on a glass substrate or a ceramic substrate. A sintered body such as a film on the surface.
圖1中表示本發明之發光裝置之實施形態。如圖1所示,發光裝置1係具備波長變換構件2及光源3而成。光源3係對波長變換構件2照射激發光L1。入射至波長變換構件2之激發光L1被變換成其他波長之螢光L2,並自與光源3相反之側出射。此時,亦可使未經波長變換而透過之激發光L1與螢光L2之合成光出射。 Fig. 1 shows an embodiment of a light-emitting device of the present invention. As shown in FIG. 1, the light-emitting device 1 is provided with a wavelength conversion member 2 and a light source 3. The light source 3 irradiates the wavelength conversion member 2 with the excitation light L1. The excitation light L1 incident on the wavelength conversion member 2 is converted into the fluorescence L2 of the other wavelength, and is emitted from the side opposite to the light source 3. At this time, the combined light of the excitation light L1 and the fluorescent light L2 that have not been converted by the wavelength conversion can be emitted.
以下,基於實施例詳細地說明本發明,但本發明並不限定於該等實施例。 Hereinafter, the present invention will be described in detail based on examples, but the present invention is not limited to the examples.
(1)玻璃粉末之製作 (1) Production of glass powder
表1及2表示實施例中所使用之玻璃粉末(試樣A~M)及比較例中所使用之玻璃粉末(試樣N~P)。 Tables 1 and 2 show the glass powders (samples A to M) used in the examples and the glass powders (samples N to P) used in the comparative examples.
首先,以成為表1及2所示之玻璃組成之方式製備原料。使用鉑坩堝使原料於800~1500℃之溫度下熔融1~2小時而玻璃化,並使熔融玻璃於一對冷卻輥間流出,藉此成形為膜狀。利用球磨機將膜狀玻璃成形體粉碎後,進行分級而獲得平均粒徑D50為2.5μm之玻璃粉末。對於所獲得之玻璃粉末,藉由下述方法測定軟化點及耐候性。 First, raw materials were prepared in such a manner as to have the composition of the glasses shown in Tables 1 and 2. The raw material is melted at a temperature of 800 to 1500 ° C for 1 to 2 hours using a platinum crucible to vitrify, and the molten glass is allowed to flow out between a pair of cooling rolls to form a film. The film-shaped glass molded body was pulverized by a ball mill, and classified to obtain a glass powder having an average particle diameter D 50 of 2.5 μm. The softening point and weather resistance of the obtained glass powder were measured by the following methods.
軟化點係使用纖維伸長法,並採用黏度成為107.6dPa‧s之溫度。 The softening point is a fiber elongation method and a viscosity of 10 7.6 dPa ‧ is used.
耐候性係以如下方式進行評價。利用模具對玻璃粉末進行加壓成型而製作直徑1cm之圓柱狀預成型體,並於表1及2中所記載之焙燒 溫度下進行焙燒,藉此獲得圓柱狀之燒結體試樣。使用平山製作所製造之HAST試驗機PC-242HSR2將試樣於121℃、95%RH、2個大氣壓之條件下保持300小時,並觀察試樣表面,藉此評價耐候性。具體而言,光學顯微鏡觀察(×500)時,將試驗前後於試樣表面無變化者評價為「○」,將於試樣表面析出玻璃成分或失去光澤者評價為「×」。 Weather resistance was evaluated in the following manner. The glass powder was pressure-molded by a mold to prepare a cylindrical preform having a diameter of 1 cm, and the calcination described in Tables 1 and 2 was carried out. The calcination was carried out at a temperature, whereby a cylindrical sintered body sample was obtained. The sample was held at 121 ° C, 95% RH, and 2 atm for 300 hours using a HAST tester PC-242HSR2 manufactured by Hirayama Seisakusho Co., Ltd., and the surface of the sample was observed to evaluate the weather resistance. Specifically, when observed by an optical microscope (×500), the change in the surface of the sample before and after the test was evaluated as “○”, and the glass component or the tarnish was precipitated on the surface of the sample as “×”.
(2)波長變換構件之製作 (2) Production of wavelength conversion member
表3~6表示本發明之實施例(試樣1~13、17~29)及比較例(14~16、30~32)。 Tables 3 to 6 show examples (samples 1 to 13, 17 to 29) and comparative examples (14 to 16, 30 to 32) of the present invention.
將表3~6中所示之無機螢光體粉末以特定之質量比混合至表1及2中所記載之各玻璃粉末試樣中而獲得混合粉末。利用模具對混合粉末進行加壓成型而製作直徑1cm之圓柱狀預成型體。對預成型體進行焙燒後,對所獲得之燒結體實施加工,藉此獲得直徑8mm、厚度0.2mm之圓盤狀之波長變換構件。再者,焙燒溫度係根據所使用之玻璃粉末而採用表1及2中所記載之焙燒溫度。對所獲得之波長變換構件測定發光光譜,並算出發光效率。將結果示於表3~6。 The inorganic phosphor powders shown in Tables 3 to 6 were mixed in a specific mass ratio to each of the glass powder samples described in Tables 1 and 2 to obtain a mixed powder. The mixed powder was subjected to pressure molding using a mold to prepare a cylindrical preform having a diameter of 1 cm. After the preform was fired, the obtained sintered body was processed to obtain a disk-shaped wavelength conversion member having a diameter of 8 mm and a thickness of 0.2 mm. Further, the calcination temperature is the calcination temperature described in Tables 1 and 2 depending on the glass powder to be used. The luminescence spectrum was measured for the obtained wavelength conversion member, and the luminescence efficiency was calculated. The results are shown in Tables 3 to 6.
發光效率係以如下方式求出。首先,於激發波長460nm之光源上設置波長變換構件,於積分球內測定自波長變換構件之上表面發出之光之能量分佈光譜。其次,將所獲得之光譜乘以標準比視感度而計算總光通量,將總光通量除以光源之電力而算出發光效率。 The luminous efficiency was obtained in the following manner. First, a wavelength conversion member is provided on a light source having an excitation wavelength of 460 nm, and an energy distribution spectrum of light emitted from a surface of the wavelength conversion member is measured in an integrating sphere. Next, the obtained spectrum is multiplied by the standard specific visual sensitivity to calculate the total luminous flux, and the total luminous flux is divided by the electric power of the light source to calculate the luminous efficiency.
其次,將上述波長變換構件加工成1.2mm見方,而獲得小片之波長變換構件。將小片之波長變換構件載置於以650mA通電之發光波長445nm之LED晶片上,並進行100小時連續光照射。對於光照射前及光照射100小時後之波長變換構件,使用通用之發光光譜測定裝置於積分球內測定自波長變換構件之上表面發出之光之能量分佈光譜。藉由將所獲得之發光光譜乘以標準比視感度而算出總光通量值。總光通量值之變化率係以光照射100小時後之總光通量值除以光照射前之總光通量值並乘以100所得之值(%)表示,示於表3~6中。 Next, the wavelength conversion member was processed into a 1.2 mm square to obtain a small-wavelength conversion member. The small-wavelength conversion member was placed on an LED wafer having an emission wavelength of 445 nm energized at 650 mA, and subjected to continuous light irradiation for 100 hours. For the wavelength conversion member before the light irradiation and after 100 hours of the light irradiation, the energy distribution spectrum of the light emitted from the upper surface of the wavelength conversion member was measured in the integrating sphere using a general-purpose luminescence spectrometer. The total luminous flux value is calculated by multiplying the obtained luminescence spectrum by a standard specific luminosity. The rate of change of the total luminous flux value is expressed by the value (%) obtained by dividing the total luminous flux value after 100 hours of light irradiation by the total luminous flux value before light irradiation and multiplying by 100, and is shown in Tables 3 to 6.
由表3及4明確,於使用α-SiAlON作為無機螢光體之情形時,關於作為實施例之1~13之波長變換構件,光照射100小時後之總光通量值維持光照射前之98%以上,相對於此,關於作為比較例之14~16之波長變換構件,光照射100小時後之總光通量值大大降低為光照射前之96.5%以下。 As is clear from Tables 3 and 4, in the case where α-SiAlON is used as the inorganic phosphor, the total luminous flux value after 100 hours of light irradiation as the wavelength conversion member of Examples 1 to 13 is maintained at 98% before the light irradiation. On the other hand, in the wavelength conversion members of 14 to 16 which are comparative examples, the total luminous flux value after light irradiation for 100 hours is greatly reduced to 96.5% or less before the light irradiation.
由表5及6明確,於使用YAG作為無機螢光體之情形時,關於作為實施例之17~29之波長變換構件,即便於光照射100小時後亦未確認到總光通量值之降低,相對於此,關於作為比較例之30~32之波長變換構件,光照射100小時後之總光通量值大大降低為光照射前之98.5%以下。 As is clear from Tables 5 and 6, when YAG was used as the inorganic phosphor, the wavelength conversion members of Examples 17 to 29 did not confirm the decrease in the total luminous flux value even after 100 hours of light irradiation. In the wavelength conversion member of 30 to 32 which is a comparative example, the total luminous flux value after light irradiation for 100 hours is greatly reduced to 98.5% or less before light irradiation.
本發明之波長變換構件適合作為白色LED等一般照明、特殊照明(例如投影器光源、汽車之頭燈光源)等之構成構件。 The wavelength conversion member of the present invention is suitable as a constituent member of general illumination such as a white LED or special illumination (for example, a projector light source or a headlight source of an automobile).
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