TW201541700A - 天線成型之製作方法 - Google Patents

天線成型之製作方法 Download PDF

Info

Publication number
TW201541700A
TW201541700A TW103113783A TW103113783A TW201541700A TW 201541700 A TW201541700 A TW 201541700A TW 103113783 A TW103113783 A TW 103113783A TW 103113783 A TW103113783 A TW 103113783A TW 201541700 A TW201541700 A TW 201541700A
Authority
TW
Taiwan
Prior art keywords
substrate
antenna
fabricating
antenna according
plating
Prior art date
Application number
TW103113783A
Other languages
English (en)
Inventor
Chi-Haw Chiang
Pen-Shan Chao
Ren-Ruey Fang
Kuo-Yu Lee
Meng-Bin Lin
Original Assignee
Nat Inst Chung Shan Science & Technology
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Nat Inst Chung Shan Science & Technology filed Critical Nat Inst Chung Shan Science & Technology
Priority to TW103113783A priority Critical patent/TW201541700A/zh
Priority to US14/551,129 priority patent/US20150303553A1/en
Publication of TW201541700A publication Critical patent/TW201541700A/zh

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01Q—ANTENNAS, i.e. RADIO AERIALS
    • H01Q1/00—Details of, or arrangements associated with, antennas
    • H01Q1/36—Structural form of radiating elements, e.g. cone, spiral, umbrella; Particular materials used therewith
    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C18/00—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating
    • C23C18/16—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating by reduction or substitution, e.g. electroless plating
    • C23C18/1601—Process or apparatus
    • C23C18/1633—Process of electroless plating
    • C23C18/1646—Characteristics of the product obtained
    • C23C18/165—Multilayered product
    • C23C18/1653—Two or more layers with at least one layer obtained by electroless plating and one layer obtained by electroplating
    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C18/00—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating
    • C23C18/16—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating by reduction or substitution, e.g. electroless plating
    • C23C18/18—Pretreatment of the material to be coated
    • C23C18/1851—Pretreatment of the material to be coated of surfaces of non-metallic or semiconducting in organic material
    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C18/00—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating
    • C23C18/16—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating by reduction or substitution, e.g. electroless plating
    • C23C18/18—Pretreatment of the material to be coated
    • C23C18/1851—Pretreatment of the material to be coated of surfaces of non-metallic or semiconducting in organic material
    • C23C18/1872—Pretreatment of the material to be coated of surfaces of non-metallic or semiconducting in organic material by chemical pretreatment
    • C23C18/1886—Multistep pretreatment
    • C23C18/1893—Multistep pretreatment with use of organic or inorganic compounds other than metals, first
    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C18/00—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating
    • C23C18/16—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating by reduction or substitution, e.g. electroless plating
    • C23C18/18—Pretreatment of the material to be coated
    • C23C18/20—Pretreatment of the material to be coated of organic surfaces, e.g. resins
    • C23C18/2006—Pretreatment of the material to be coated of organic surfaces, e.g. resins by other methods than those of C23C18/22 - C23C18/30
    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C18/00—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating
    • C23C18/16—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating by reduction or substitution, e.g. electroless plating
    • C23C18/18—Pretreatment of the material to be coated
    • C23C18/20—Pretreatment of the material to be coated of organic surfaces, e.g. resins
    • C23C18/2006—Pretreatment of the material to be coated of organic surfaces, e.g. resins by other methods than those of C23C18/22 - C23C18/30
    • C23C18/2046—Pretreatment of the material to be coated of organic surfaces, e.g. resins by other methods than those of C23C18/22 - C23C18/30 by chemical pretreatment
    • C23C18/2073—Multistep pretreatment
    • C23C18/2086—Multistep pretreatment with use of organic or inorganic compounds other than metals, first
    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C18/00—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating
    • C23C18/16—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating by reduction or substitution, e.g. electroless plating
    • C23C18/18—Pretreatment of the material to be coated
    • C23C18/20—Pretreatment of the material to be coated of organic surfaces, e.g. resins
    • C23C18/28—Sensitising or activating
    • C23C18/285—Sensitising or activating with tin based compound or composition
    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C18/00—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating
    • C23C18/16—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating by reduction or substitution, e.g. electroless plating
    • C23C18/18—Pretreatment of the material to be coated
    • C23C18/20—Pretreatment of the material to be coated of organic surfaces, e.g. resins
    • C23C18/28—Sensitising or activating
    • C23C18/30—Activating or accelerating or sensitising with palladium or other noble metal
    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C18/00—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating
    • C23C18/16—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating by reduction or substitution, e.g. electroless plating
    • C23C18/31—Coating with metals
    • C23C18/38—Coating with copper
    • C23C18/40—Coating with copper using reducing agents
    • C23C18/405—Formaldehyde
    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D3/00—Electroplating: Baths therefor
    • C25D3/02—Electroplating: Baths therefor from solutions
    • C25D3/38—Electroplating: Baths therefor from solutions of copper

Landscapes

  • Chemical & Material Sciences (AREA)
  • Engineering & Computer Science (AREA)
  • Materials Engineering (AREA)
  • Mechanical Engineering (AREA)
  • Metallurgy (AREA)
  • Organic Chemistry (AREA)
  • General Chemical & Material Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Inorganic Chemistry (AREA)
  • Chemically Coating (AREA)
  • Details Of Aerials (AREA)

Abstract

本發明係涉及一種天線成型之製作方法，包含提供一非平面之絕緣基板之表面粗化並以電漿法，使基板表面成為親水性質，形成改質基板，於該改質基板上進行化學鍍銅再以電鍍銅層至需求厚度，以多軸機械加工定義天線線路線寬與線距，最後以銅蝕刻鍍液進行天線金屬線路的成型。藉由多軸加工機之機械刀具進行金屬線路成型加工，過程完全不需要使用任何光罩，並以控制基板表面粗化均勻度、改質基板表面親水度及精密電鍍方式提升銅線覆蓋的品質，是一種低成本與快速的加工方式。

Description

天線成型之製作方法
本發明係關於一種天線成型之製作方法，特別是關於立體天線線路加工方法，以控制基板表面粗化均勻度、改質基板表面親水度及精密電鍍方式提升銅線覆蓋的品質，一種利用精密多軸機械加工之立體天線成型方法。
習知，在無線通訊系統中，天線為收發機與傳播環境的中介點，具有轉換電壓電流與電磁場訊號，以及改變電磁波在空間中分佈的功能。因此隨著各式新穎的無線通訊規格及設備開發，天線元件的功能益發顯得重要。在移動通訊設備方面也需要愈來愈多的天線，各式天線的出現均是為了便於接收不同頻率的信號，有時需要多達六種或以上的天線才能滿足各種信號的要求。
按，立體天線之製作美國專利US7,944,404B2揭露一種圓錐式螺旋立體天線的製造方法，係利用在四分之一扇型的介電板上用刀具繞著圓周以一定的間距，輕微雕刻個凹槽。導電的弧型線是利用轉印導電材料的方法成型，最後而用焊接的方法使扇型介電板成為一中空圓錐狀天線。US7,038,636B2揭露一種圓錐式螺旋立體天線的製造方法，該專利之螺旋天線具有一螺旋的支撐物可撓式支撐物，是由三片抗靜電板的基材用機械式方法固定住，螺旋導電繞線是利用黏著劑將之固定在可撓式抗靜電板的圓周上，螺旋的導電繞線彼此之間均有設置一個貫穿孔將螺旋繞線阻隔開，以防止螺旋繞線接觸短路。US6,917,346B2則是 將導電材料加工成一扇形皺摺繞線之立體天線。US6,788,271B1是利用滾輪機構將導電材料糊滾印在圓柱表面上，且圓柱在滾動的同時會以一軸向的速度移動，使圓柱表面的螺旋導電線具有一定間隙，形成一種螺旋立體天線。US5,349,365係採折彎的導電金屬線電路板，並利用普通的焊接方式組合成一類螺旋天線。
復按，US4,945,363、US4,675,690均揭露一種利用在可撓式的基 板上製作出螺旋狀線路的天線，並將基板兩邊接縫相接捲起來並再用貼布或栓將其固定，其導電線路製作方法是利用光阻遮擋及化學蝕刻製程。而US4,163,981、US3,564,553則利用導電線在一圓棒狀、圓錐物表面上以等間距或不等間距纏繞螺旋導電線來製作天線。US6,288,686B1、US5,479,180及US4,697,192均揭露一種在玻璃纖維基材或介電材料上以螺旋方式纏繞二條或多條導電金屬條。另參考中華民國專利M308809，該專利申請範圍主要為在一個陶瓷材料柱狀體上製作螺旋導線線路，導線線路以電鍍之方法披覆在柱狀體上，材料為銅或金，螺旋數為一或二條，與本發明案採用之加工方法不同。
相較於一般平面天線而言，非平面立體天線的加工程序較為 複雜也較難達成。尤其，要在立體的基材上定義天線金屬線路線寬與線距實屬不易。上述之金屬線路線寬與線距影響天線頻寬應用範圍甚鉅，如何精準定義線寬線距以及在立體的基材上製造出螺旋狀之立體線路，是目前工業界所面臨之一大難題。
綜上所陳，目前非平面立體天線的專利主要是針對在一非平 面介電材料上製作或是結合非平面天線線路而達成製作寬頻的非平面天線之目的，而提出非平面天線線路製作的方法和與介電材料接合方法，在無線通訊系統中，天線為收發機與傳播環境的中介點，具有轉換電壓電流與電磁場訊 號，以及改變電磁波在空間中分佈的功能。因此隨著各式新穎的無線通訊規格及設備開發，天線元件的功能益發顯得重要。國內無線通訊產業中，具有大量的消費行動無線通訊產品開發需求，其裝置與天線需要整合多種無線系統的趨勢。由於裝置有便於攜帶、美觀及小體積的需求，天線因此必須在有限空間內實現多頻、超寬頻或是多天線架構的設計，並且需更進一步整合其他電路，以達到高效能或多功能的規格。當天線尺寸微小化時，如何維持其它天線特性，如頻寬、指向性與輻射效率，取得各種效能間的平衡，乃是一個重要的課題。
以上之概述與接下來的詳細說明，是為了能進一步說明本發 明達到預定目的所採取的方式、手段及功效。而有關本發明的其它目的及優點，將在後續的說明中加以闡述。
鑒於上述習知技術之缺點，本發明之主要目的為提供一種天線成型之製作方法，提供一非平面之立體基板；於該基板表面進行粗化與改質，形成改質基板，藉由該基板之表面處理，提升後端金屬鍍層之均勻性；於該改質基板上形成金屬銅層，並以精密鍍槽鍍銅於該改質基板表面覆蓋銅層；利用機械加工成型天線金屬線路，藉此不需要使用任何光罩，即可定義天線線距及線寬。藉由本發明之多軸機械加工方式，可先利用繪圖軟體定義天線金屬線路之線寬與線距，再利用掛載在多軸加工機之機械刀具進行金屬線路成型加工，過程完全不需要使用任何光罩，是一種低成本與快速的加工方式。
為達到本發明之目的基板需先進行前處理係包含基板表面之粗化控制與改質。首先，於表面以化學(蝕刻)或機械方式，進行精密的表 面粗化控制，使整體基板表面均勻地達到適當的表面粗度。其次，利用化學/機械方法進行基板的雜質(膠渣、殘屑)去除。此外部份材料因表面特性的因素，表面水滴接觸角大於90度，為疏水性質，將施予化學或物理(電漿法)等方法，進行表面改質工作，使表面水滴接觸角小於90度，成為親水性質。
於已進行表面粗化控制及改質之基板利用化學鍍銅鍍覆一層厚度約1um的化學鍍銅。其步驟先用丙酮於基材表面進行表面潔淨，接著將基材置入SnCl2以及PdCl2進行敏化與活化處理，最後，將基材置入化學鍍銅鍍液中進行化學鍍銅程序。利用電鍍方式於化學鍍銅之基材表面，進行電鍍銅層沉積至需求厚度。再以機械加工定義天線線路線寬與線距，之後再利用一般銅蝕刻鍍液進行天線金屬線路的成型。
S110~S140‧‧‧步驟
S210~S270‧‧‧步驟
第一圖係為本發明之步驟流程圖
第二圖係為本發明實施例之步驟流程圖
以下係藉由特定具體實例說明本發明之實施方式，熟悉此技藝之人士可由本說明書所揭示內容輕易地瞭解本發明之其它優點與功效。請參閱本發明圖式第一圖步驟流程圖，本發明係揭露一種天線成型之製作方法，該方法步驟係提供一非平面之立體基板S110；於該基板表面進行粗化與改質，形成改質基板S120；於該改質基板上形成金屬銅層S130；利用機械加工成型天線金屬線路S140。藉此，本發明之立體天線頻寬應用範圍 為2~18GHz，使用本發明之製作方法使基材表面粗度控制均勻，採用精密鍍槽提高電鍍銅之品質。
實施例一
請參閱圖式第二圖本發明實施例之步驟流程圖，提供一非平面之絕緣基板S210；於該基板以化學蝕刻進行表面粗化S220；於粗化後之基板以電漿法，使基板表面成為親水性質，形成改質基板S230；於該改質基板上進行化學鍍銅S240；化學鍍銅後之基板進行電鍍銅層之需求厚度S250；以多軸機械加工定義天線線路線寬與線距S260；最後以銅蝕刻鍍液進行天線金屬線路的成型S270。
其中進行化學鍍銅前，須先用丙酮於基材表面進行表面潔 淨，接著將基材置入SnCl2以及PdCl2進行敏化與活化處理，化學配方與操作條件，如表一與表二所示。最後，將基材置入化學鍍銅鍍液中進行化學鍍銅程序，鍍浴成分與操作條件，如表三所示，最後進行電鍍銅層沉積至需求厚度，鍍浴成分與操作條件，如表四所示。
表二、活化處理的配方與操作條件
最後，定義天線線路線寬與線距使用五軸車床加工機搭配直 徑適合之車刀，並將電腦輔助繪圖軟體繪製完成的線路圖形檔案程式輸入機台的控制電腦，即可進行本發明實施例一之天線線路切削加工成形，將已完成鍍銅金屬化的錐型，其鍍銅層厚度約為34μm，夾持於車床加工機，待完成工件定位後即可進行線路加工製作。線路完成品經過電性量測，每一條線路為獨立導通，且線路在頂部與側壁的連接是連續平滑。最後進行線路表面鍍鎳金製程(SF製程，Ni：5μm；Au：0.1μm)。
上述之實施例僅為例示性說明本發明之特點及其功效，而非 用於限制本發明之實質技術內容的範圍。任何熟悉此技藝之人士均可在不違背本發明之精神及範疇下，對上述實施例進行修飾與變化。因此，本發 明之權利保護範圍，應如後述之申請專利範圍所列。
S210~S270‧‧‧步驟

Claims (10)

  1. 一種天線成型之製作方法，該方法係包含以下步驟：(1)提供一非平面之立體基板；(2)於該基板表面進行粗化與改質，形成改質基板，藉由該基板之表面處理，提升後端金屬鍍層之均勻性；(3)於該改質基板上形成金屬銅層，並以精密鍍槽鍍銅於該改質基板表面覆蓋銅層；(4)利用機械加工成型天線金屬線路，藉此不需要使用任何光罩，即可定義天線線距及線寬。
  2. 如申請專利範圍第1項所述之一種天線成型之製作方法，其中該基板係以化學蝕刻或機械方式進行表面粗化。
  3. 如申請專利範圍第1項所述之一種天線成型之製作方法，其中該基板係為非導體基材。
  4. 如申請專利範圍第1項所述之一種天線成型之製作方法，其中該基板係為工程塑膠或陶瓷之材質。
  5. 如申請專利範圍第1項所述之一種天線成型之製作方法，其中該基板係以化學或機械方式除去基板雜質，並利用化學或物理等方法進行該基板表面改質工作，使表面水滴接觸角小於90度，該基板成為親水性質。
  6. 如申請專利範圍第5項所述之一種天線成型之製作方法，其中該改質基板係以電漿法，使表面水滴接觸角小於90度，該基板成為親水性質。
  7. 如申請專利範圍第1項所述之一種天線成型之製作方法，其中該改質基板形成金屬銅層之步驟係包含化學鍍銅與電鍍銅兩程序。
  8. 如申請專利範圍第7項所述之一種天線成型之製作方法，其中該化學鍍銅係包含以二氯化錫敏化該基板及氯化鈀活化該基板之處理程序。
  9. 如申請專利範圍第1項所述之一種天線成型之製作方法，其中該機械加工成型天線金屬線路係以多軸機械加工之方法定義天線線路線寬與線距。
  10. 如申請專利範圍第1項所述之一種天線成型之製作方法，其中該機械加工成型天線金屬線路係包含以銅蝕刻鍍液進行天線金屬線路之成型。
TW103113783A 2014-04-16 2014-04-16 天線成型之製作方法 TW201541700A (zh)

Priority Applications (2)

Application Number Priority Date Filing Date Title
TW103113783A TW201541700A (zh) 2014-04-16 2014-04-16 天線成型之製作方法
US14/551,129 US20150303553A1 (en) 2014-04-16 2014-11-24 Manufacturing method of antenna shaping

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
TW103113783A TW201541700A (zh) 2014-04-16 2014-04-16 天線成型之製作方法

Publications (1)

Publication Number Publication Date
TW201541700A true TW201541700A (zh) 2015-11-01

Family

ID=54322756

Family Applications (1)

Application Number Title Priority Date Filing Date
TW103113783A TW201541700A (zh) 2014-04-16 2014-04-16 天線成型之製作方法

Country Status (2)

Country Link
US (1) US20150303553A1 (zh)
TW (1) TW201541700A (zh)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN107234393A (zh) * 2017-07-21 2017-10-10 天津航天机电设备研究所 四臂螺旋天线的加工工装

Families Citing this family (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN110819973B (zh) * 2019-11-08 2021-11-16 上海安费诺永亿通讯电子有限公司 一种外置lds天线的外表面喷涂工艺及其化学抛光液
CN111926340B (zh) * 2020-08-13 2022-08-23 大博医疗科技股份有限公司 一种3d打印钛及钛合金的清洗方法

Family Cites Families (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4585519A (en) * 1983-02-10 1986-04-29 Grumman Aerospace Corporation Automated chemical milling process
TWI445474B (zh) * 2011-11-18 2014-07-11 Chuan Ling Hu Manufacturing method of plastic metallized three - dimensional line
US9655261B2 (en) * 2013-03-21 2017-05-16 Htc Corporation Casing of electronic device and method of manufacturing the same

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN107234393A (zh) * 2017-07-21 2017-10-10 天津航天机电设备研究所 四臂螺旋天线的加工工装
CN107234393B (zh) * 2017-07-21 2023-03-10 天津航天机电设备研究所 四臂螺旋天线的加工工装

Also Published As

Publication number Publication date
US20150303553A1 (en) 2015-10-22

Similar Documents

Publication Publication Date Title
US9520643B2 (en) Electronic device with foam antenna carrier
CN103619125A (zh) 一种用于提高电镀均匀性的pcb电镀方法
TW201541700A (zh) 天線成型之製作方法
CN103687309B (zh) 一种高频电路板的生产工艺
TW201321542A (zh) 製造ic屏蔽鍍膜之設備及ic之金屬屏蔽膜層
WO2008101413A1 (fr) Procédé de fabrication d'une antenne et d'une structure d'antenne
CN101489356B (zh) 电路板及其制作方法
US10669209B2 (en) Ceramic device and manufacturing method thereof
TWI417013B (zh) 立體電路元件及其製作方法
TW201541701A (zh) 非平面立體天線成型之製作方法
TWI423751B (zh) Method of manufacturing three - dimensional circuit
US20210265716A1 (en) Methods of Plating onto Sacrificial Material and Components Made Therefrom
WO2021143381A1 (zh) 三维电路的制作方法和电子元件
US11942744B2 (en) Method for producing a high-frequency connector and associated apparatus
CN102074449A (zh) 电极矩阵及其制作方法
US20100221412A1 (en) Method for manufacturing a substrate
CN107846783B (zh) 一种分布在绝缘体不同方位表面的金属线路制造方法
KR102005548B1 (ko) 모바일 통신 장치용 안테나 모듈과 그 제조방법
JP2018067694A (ja) プリント配線板アレイ及びプリント配線板の製造方法
TW201507275A (zh) 以陶瓷為基底的天線結構及其製作方法
JP2011119598A (ja) 配線回路基板
KR101713205B1 (ko) 그라운드 가스켓의 제조방법
TWM421670U (en) 3D circuit structure
CN203734114U (zh) 电子线排线治具
KR20190024067A (ko) 레이저 식각을 이용한 rf 필터 제조방법