TW201541019A - Attaching method for self-adhesive substrate - Google Patents

Abstract

The present invention relates to an attaching method for self-adhesive substrate. By using the attaching method, a self-adhesive substrate welded with a plurality of electronic components can be rapidly attached onto a disposing portion of one electronic device through the making of a self-adhesive substrate linking board and the using of an attaching fixture, without using any screws and screw tools. Moreover, because the electronic device having the self-adhesive substrate has no any bottom substrates, the heat produced by the electronic components welded on the self-adhesive substrate can effectively dissipated through the thermal conduction between the bottom insulating and heat conductive attaching layer of the self-adhesive substrate and the disposing portion of the electronic device, therefore the heat can be further dissipated to the air.

Description

Self-adhesive substrate mounting method

The present invention relates to the technical field of electronic devices, and more particularly to a self-adhesive substrate mounting method for replacing a conventional process.

In recent years, Light-Emitting Diode (LED) has been widely used in lighting devices for everyday life. Please refer to the first figure, which is an exploded view of a conventional LED luminaire. As shown in the first figure, the LED lamp 1' includes: a body 11', a socket 12', a drive control module 13', a circuit board 14', and a lamp cover 15', wherein the circuit board 14' is soldered with a plurality of LED elements 16'; and, with the aid of the screw 141' and the screw holes (111', 142'), the circuit substrate 14' is locked to one of the bases 11' In addition, the wire 143' of the circuit board 14' passes through the wire hole 113' of one of the setting surfaces 112' and the driving control module disposed in the power receiving seat 12'. 13' is electrically connected such that the plurality of LED elements 16' can be driven by the power of the drive control module 13' to emit light.

The above-mentioned LED lamp 1' is relatively simple in composition, and thus gradually becomes the target The LED bulb lamp structure commonly used before; however, after long-term research, the inventor of the present invention found that the existing composition of the LED lamp 1' shows several practical defects:

1. The manufacturing process cannot be simplistic. The LED lamp 1' usually has to manually lock the circuit substrate 14' to the setting surface 112' of the seat body 11'. The process cannot be completed by the auxiliary tool, and the manufacturing process of the LED lamp 1' cannot be single. The manufacturing costs cannot be effectively reduced.

2. The heat dissipation effect is not good. The LED lamp 1 ′ uses the circuit substrate 14 ′ to carry the plurality of LED elements 16 ′, so that the LED elements 16 ′ can be reached through the circuit substrate 14 ′ and the driving control module 13 ′ in the charging base 12 ′. Electrical connection; however, the circuit substrate 14' is usually a fiberglass, and the heat conduction and heat dissipation effects are not good, so that the heat generated when the LED elements 16' are operated cannot be prevented by the circuit substrate 14'. Conducted to the body 11' (the seat 11' is usually the best heat sink).

Therefore, the inventors of the present invention have invented the invention in view of the fact that the existing LED lamps still have many shortcomings and disadvantages, and finally developed a self-adhesive substrate mounting method of the present invention.

The main purpose of the present invention is to provide a mounting method for an electronic device having a self-adhesive substrate, wherein the mounting method of the present invention is assisted by the fabrication of a self-adhesive substrate and a mounting tool. Reach The method of quickly mounting a self-adhesive substrate on which a plurality of electronic components are soldered to the mounting portion of an electronic circuit carrier of any electronic device does not require any screw-locking tool, thereby achieving a single manufacturing process. The purpose of chemical production and rapid mass production. In addition, since the electronic device having the self-adhesive substrate produced by the mounting method of the present invention does not have any bottom-bearing substrate, the heat generated when the plurality of electronic components mounted thereon can be operated by The insulating and thermally conductive adhesive layer on the bottom of the adhesive substrate is effectively conducted to the electronic circuit carrier, and finally the heat is dissipated into the air via the electronic circuit carrier to achieve effective heat dissipation.

Therefore, in order to achieve the above object of the present invention, the inventors of the present invention have proposed a mounting method for an electronic device having a self-adhesive substrate, which comprises the following main steps: (1) providing at least one self-adhesive substrate board, and Forming a self-adhesive substrate on the adhesive substrate board; wherein the self-adhesive substrate comprises at least a copper circuit layer and an insulating and thermally conductive adhesive layer, and the insulating and thermally conductive adhesive layer is connected with a release layer; (2) according to an electronic device a shape of a mounting portion of the electronic circuit carrier, wherein the self-adhesive substrate is formed into a plurality of electronic component substrates on the self-adhesive substrate board; (3) soldering the plurality of electronic components to the plurality of electronic components The copper circuit layer on the component substrate; (4) sequentially removing each of the electronic components soldered with the plurality of electronic components Substrate substrate; (5) removing the release layer attached to the electronic component substrate, and attaching the electronic component substrate to the mounting portion of the electronic circuit carrier by the insulating and thermally conductive adhesive layer.

<present invention>

1‧‧‧Electronic device

11‧‧‧Electronic line carrier

12‧‧‧Electrical stand

13‧‧‧ Self-adhesive substrate

14‧‧‧Electronic components

15‧‧‧shade

130‧‧‧ release layer

131‧‧‧Insulation and thermal adhesion layer

132‧‧‧ copper circuit layer

133‧‧‧Upper insulation

134‧‧‧Printing layer

111‧‧‧Setting Department

16‧‧‧Control drive module

S01~S05‧‧‧ method steps

2‧‧‧Self-adhesive substrate board

1331‧‧‧Electronic component soldering holes

132a‧‧‧ copper layer

135‧‧‧Bending area

10‧‧‧Frame

17‧‧‧Base

18‧‧‧Support frame

19‧‧‧Lighting module

1A‧‧‧Light guide plate

1B‧‧‧Diffuser

3‧‧‧Placement Tools

31‧‧‧ grassroots

32‧‧‧Electronic component insertion hole

31a‧‧‧Central Manufacturing Division

32a‧‧‧Bending Department

33a‧‧‧Electronic component insertion hole

133a‧‧‧lower insulation

133b‧‧‧Central District

<知知>

1'‧‧‧LED lamps

11’‧‧‧

12'‧‧‧Electrical stand

13'‧‧‧Drive Control Module

14'‧‧‧ circuit board

15’‧‧‧shade

16'‧‧‧LED components

111’‧‧‧ screw hole

112’‧‧‧Set the surface

113’‧‧‧Wire hole

141’‧‧‧ screws

142’‧‧‧ screw hole

143’‧‧‧Wire

The first figure is an exploded view of a conventional LED lamp; the second figure is an exploded view of an electronic device having a self-adhesive substrate; the third figure is a structural view of a self-adhesive substrate of the electronic device; A flowchart of a mounting method of a self-adhesive substrate; a fifth view is a top view of a self-adhesive substrate plate; a sixth A-64th to a sixth F-line is a schematic view of a process of a self-adhesive substrate plate; The seventh F is a schematic diagram of the process of the self-adhesive substrate plate; the eighth figure is an exploded view of the electronic device; the ninth is a top view of the self-adhesive substrate; the tenth A is an exploded view of the electronic device; An explosion diagram of an electronic device; an eleventh diagram is an explosion diagram of the electronic device; a twelfth diagram is an explosion diagram of the electronic device; a thirteenth diagram is an explosion diagram of the electronic device; and a fourteenth diagram is an explosion of the electronic device Figure Figure 14B is an exploded view of the electronic device; the fifteenth diagram is a perspective view of a mounting tool; the sixteenth is a side sectional view of the mounting tool and the self-adhesive substrate; and the seventeenth A and tenth Figure 7B is a schematic diagram of the mounting process; the eighteenth A, eighteenth and eightyth Cth are schematic views of the mounting process; the nineteenth is a structural drawing of the self-adhesive substrate; The 20th D is a schematic diagram of the process of the self-adhesive substrate plate; the 21st is a structure diagram of the self-adhesive substrate; and the 22nd to the 22nd D is a process diagram of the self-adhesive substrate plate The twenty-third figure is an exploded view of the electronic device; and the twenty-fourth is an exploded view of the electronic device.

In order to more clearly describe a method of attaching a self-adhesive substrate according to the present invention, a preferred embodiment of the present invention will be described in detail below with reference to the drawings.

Before describing a mounting method of a self-adhesive substrate of the present invention, an LED flash bulb is taken as an example to describe a related structure of an electronic device having a self-adhesive substrate. Please refer to the second figure, which is an exploded view of an electronic device having a self-adhesive substrate. As shown in the second figure, the electronic device 1 is an LED bulb, and is composed of an electronic circuit carrier 11, a battery holder 12, and a self-adhesive substrate. 13. It is composed of a lampshade 15.

Please refer to the third figure at the same time, which is a structural diagram of the self-adhesive substrate 13. As shown in the second and third figures, the surface of the self-adhesive substrate 13 is a copper circuit layer 132 soldered with a plurality of electronic components 14, and the bottom surface thereof is an insulating and thermally conductive adhesive layer 131, and the insulating and thermally conductive adhesive layer 131 A release layer 130 is attached. The self-adhesive substrate 13 is disposed on the one portion 111 of the electronic circuit carrier 11 through the insulating and thermally conductive adhesive layer 131, and the copper circuit layer 132 is connected to a control driving module 16 in the power receiving base 12. Electrical connection. Generally, in order to protect the copper wiring layer 132, an upper insulating layer 133 is further disposed on the copper wiring layer 132 as a wiring covering layer; further, a printing layer 134 is printed on the upper insulating layer 133, for example, for example. The white lacquer having a reflective effect is printed or sprayed such that the printed layer 134 becomes a light reflecting layer. Alternatively, when the mounting method of the self-adhesive substrate of the present invention is applied to other electronic devices, the specific color of the printed layer may be green, yellow, or other beautiful colors.

Next, a method of attaching a self-adhesive substrate of the present invention can be started. Please refer to the fourth figure, which is a flow chart of the mounting method of the self-adhesive substrate of the present invention; and also refers to the fifth figure, which is a top view of a self-adhesive substrate board. As shown in the fourth and fifth figures, the mounting method first performs the step (S01), provides at least one self-adhesive substrate board 2, and forms a self-adhesive substrate 13 on the self-adhesive substrate board 2. As shown in the third figure, the self-adhesive substrate 13 includes at least a copper circuit layer 132 and a The edge is thermally conductively attached to the layer 131, and the insulating and thermally conductive adhesive layer 131 is connected to the release layer 130. Moreover, as shown in the third and fifth figures, the copper circuit layer 132 is covered with an upper insulating layer 133, and the upper insulating layer 133 has a plurality of electronic component soldering holes 1331 for exposing the copper wiring layer 132. Multiple solder joints. Furthermore, the upper insulating layer 133 is further covered with a printed layer 134.

Continuing to refer to the process schematic diagram of the self-adhesive substrate board 2 illustrated in FIGS. 6A to 6F, and the process diagrams illustrated in FIGS. 7A to 7F. 6A to 6F are schematic views of the process are depicted in a side cross-sectional view, and the process diagrams are drawn in the manner of the above-mentioned seventh to seventh F drawings. As shown in FIG. 6A and FIG. 7A, the self-adhesive substrate board 2 according to the step (S01) is formed by first providing an upper insulating layer 133 and processing the upper insulating layer 133 so that the The upper insulating layer 133 has a plurality of electronic component soldering holes 1331; wherein, in the case of the LED bulb, the electronic component soldering holes 1331 refer to the LED component soldering holes. Next, as shown in FIGS. 6B and 7B, the upper insulating layer 133 is bonded to a copper layer 132a, and then the copper layer 132a is processed into the copper wiring layer 132 as shown in FIG. Continuing as shown in FIG. 6D, a printed layer 134 is printed over the upper insulating layer 133. Finally, as shown in FIG. 6E and FIG. 7C, the copper wiring layer 132 is bonded to the insulating and thermally conductive adhesive layer 131 to obtain the self-adhesive substrate bonding plate 2.

After the manufacture of the self-adhesive substrate board 2, as shown in the fourth and seventh As shown in FIG. D, the mounting method of the present invention is followed by the step (S02). According to the appearance of a setting portion 111 of the electronic circuit carrier 11 of the electronic device 1, the self-adhesive substrate board 2 will be The self-adhesive substrate 13 is formed into a plurality of electronic component substrates having appropriate shapes. For example, the electronic device 1 shown in the second figure is an LED bulb, and the setting portion 111 of the electronic circuit carrier 11 is circular; therefore, the appropriate shape of the electronic component substrate is circular.

As shown in the exploded view of the electronic device depicted in FIG. 8 , the electronic device 1 is a full-circumference LED lamp, and the setting portion 111 of the electronic circuit carrier 11 is a 360° cylinder (circular or Polygon); at this time, as shown in the ninth drawing, the self-adhesive substrate 13 is cut into an electronic component substrate having a central portion 133b and a plurality of bending regions 135; The central portion 133b is correspondingly disposed on the top surface of the column-shaped installation portion 111, and the plurality of bending regions 135 are attached to the side surface of the cylindrical portion 111 after being folded down (eg, Figure 8).

Alternatively, as shown in the exploded view of the electronic device depicted in FIG. 10A, the electronic device 1 is an LED fluorescent lamp, and the setting portion 111 of the electronic circuit carrier 11 is an elongated setting surface; The self-adhesive substrate 13 (including the insulating and thermally conductive adhesive layer 131, the copper wiring layer 132 and the upper insulating layer 133) is also cut into a long shape on the elongated mounting surface, and is correspondingly disposed in the setting portion 111 of the electronic circuit carrier 11 Above.

In addition, as shown in the perspective view of the electronic device depicted in FIG. The electronic device 1 is an LED grid lamp, and the LED table lamp comprises a frame 10, a plurality of electronic circuit carriers 11 and a diffusion plate 1B; wherein the electronic circuit carrier 11 is a lighting unit The bottom surface is a one-side shape setting portion 111; at this time, the self-adhesive substrate 13 (including the insulating and thermally conductive adhesive layer 131, the copper wiring layer 132, and the upper insulating layer 133) is also cut corresponding to the square-shaped mounting portion 111. The square shape is further provided correspondingly on the setting portion 111.

In addition, as shown in the perspective view of the electronic device, the electronic device 1 is an LED table lamp, and the LED table lamp includes a base 17, a support frame 18 and a lighting module 19; The setting portion 111 of the electronic circuit carrier 11 of the lighting module 19 is a square setting surface; at this time, the self-adhesive substrate 13 (including the insulating and thermally conductive adhesive layer 131, the copper wiring layer 132 and the upper insulating layer) corresponding to the square setting surface The layer 133 is also cut into square shapes and is correspondingly disposed above the setting portion 111.

As shown in the perspective view of the electronic device depicted in FIG. 12, the electronic device 1 is a vehicle LED lamp, and the vehicle LED lamp includes a (heat dissipation) electronic circuit carrier 11; wherein the electronic circuit carrier The one portion 111 of the body 11 is an outer convex cylinder; at this time, the self-adhesive substrate 13 (including the insulating and thermally conductive adhesive layer 131, the copper wiring layer 132 and the upper insulating layer 133 is also cut corresponding to the outer convex pillar). The appropriate shape is further provided correspondingly on the setting portion 111.

Furthermore, as shown in the exploded view of the electronic device depicted in FIG. The electronic device 1 is an LED ring lamp, and the LED ring lamp includes an electronic circuit carrier 11 , a light guide plate 1A and a diffuser plate 1B. The one portion 111 of the electronic circuit carrier 11 is a ring. At this time, corresponding to the annular setting surface, the self-adhesive substrate 13 (including the insulating and thermally conductive adhesive layer 131, the copper wiring layer 132 and the upper insulating layer 133 is also cut into a strip shape and further wound into a ring shape, thereby being Correspondingly, it is disposed above the setting portion 111.

In addition, as shown in the exploded view of the electronic device depicted in FIG. 14A, the electronic device 1 is an LED backlight module, and the electronic circuit carrier 11 of the LED backlight module is directly used as a tablet computer. Back plate (aluminum cover). Wherein, the one portion 111 of the electronic circuit carrier 11 is a flat surface; at this time, the self-adhesive substrate 13 (including the insulating and thermally conductive adhesive layer 131, the copper wiring layer 132 and the upper insulating layer 133 is also cut corresponding to the plane). The plurality of strips are formed in an array, and are correspondingly disposed on the setting portion 111. Here, further, the strip-shaped self-adhesive substrate 13 depicted in FIG. The combination of the electronic components 14 may also be referred to as an LED light bar. Moreover, in addition to the exemplary application examples of the above LED lamps, the mounting method of the self-adhesive substrate of the present invention can also be applied to other various LED lighting devices, for example: LED street lights, LED downlights, LED ceiling lights, LED candle lights, LED bulbs, LED tubes, LED energy-saving lamps, LED art lights, or LED accessory lights.

As shown in the exploded view of the electronic device depicted in FIG. 14B, The electronic device 1 is an LED backlight module, and the electronic circuit carrier 11 of the LED backlight module is a dome-shaped cover. Wherein, the one portion 111 of the electronic circuit carrier 11 is a flat surface; at this time, the self-adhesive substrate 13 (including the insulating and thermally conductive adhesive layer 131, the copper wiring layer 132 and the upper insulating layer 133 is also cut corresponding to the plane). The strip is formed in a strip shape and is correspondingly disposed on the setting portion 111 in the form of a light bar.

Next, as shown in FIG. 4, FIG. 6F and FIG. EE, in step (S03), a plurality of electronic components 14 are soldered to the copper wiring layer 132 on the plurality of electronic component substrates, respectively. After the fabrication of the electronic component substrate having the plurality of electronic components 14 is completed, the entire self-adhesive substrate bonding board 2 can be sent to a test area to perform electrical testing on each of the electronic component substrates. If the LED lamp is taken as an example, the aforementioned electronic component 14 refers to the LED component, and the electrical test refers to the lighting test.

Continuing, as shown in the fourth and seventh F, Step (S04), sequentially removing each of the electronic component substrates to which the plurality of electronic components 14 are soldered; wherein the electronic component substrate comprises the self-adhesive substrate 13 and the plurality of electronic components 14, and the bottom of the self-adhesive substrate 13 A release layer 130 is also attached. Thus, in the step (S05), the self-adhesive substrate 13 can be attached to the electronic device of any electronic device 1 by the insulating and thermally conductive adhesive layer 131 as long as the release layer 130 attached to the bottom of the self-adhesive substrate 13 is removed. The setting portion 111 of the line carrier 11 is above (the application example of the electronic device 1 can be referred to the eighth to fourteenth drawings).

Regarding the foregoing step (S05), the self-adhesive substrate 13 may be attached to the setting portion 111 of the electronic circuit carrier 11 of any electronic device 1 after the release layer 130 is manually removed by an engineer. Moreover, in order to facilitate mass production, the mounting method of the present invention simultaneously provides the step of completing the step (S05) with the aid of a mounting tool. A perspective view of the mounting tool 3 as depicted in FIG. 15 and a side cross-sectional view of the mounting tool 3 and the self-adhesive substrate 13 depicted in the sixteenth embodiment, with the aid of the mounting tool 3 to complete the steps (S05) First, a mounting tool 3 is provided, wherein the mounting tool 3 includes a base layer 31, and a plurality of electronic component insertion holes 32 are dug in the base layer 31. Next, the removed electronic component substrate (including the self-adhesive substrate 13 and the plurality of electronic components 14 is placed on the base layer 31 such that the plurality of electronic components 14 on the self-adhesive substrate 13 are respectively embedded in the plurality of electronic components 14 The electronic component is placed in the hole 32. Then, as shown in FIG. 17A, the release layer 130 attached to the bottom of the self-adhesive substrate 13 is removed, and the electronic circuit of the electronic device 1 is removed. The carrier 11 is placed on the bottom of the self-adhesive substrate 13 such that the insulating and thermally conductive adhesive layer 131 is attached to the mounting portion 111 of the electronic circuit carrier 11. Finally, as depicted in FIG. The mounting process diagram removes the mounting tool 3, and the electronic component substrate (including the self-adhesive substrate 13 and the plurality of electronic components 14) is disposed in the setting portion of the electronic circuit carrier 11 of the electronic device 1. Above the 111. (The electronic circuit carrier 11 shown in FIG. 17B is a heat sink of the LED bulb).

In addition, the mounting method of the present invention provides another use of mounting The auxiliary method of the tool is used to complete the step (S05). As shown in FIG. 18A, the mounting process diagram is completed by using the aid of the mounting tool 3 (S05). First, a mounting tool 3 is provided, wherein the mounting tool comprises a central tooling. a portion 31a and a plurality of bending device portions 32a, and the plurality of bending device portions 32a are pivotally connected to the central tool portion 31a; and the central tool portion 31a and the plurality of bending device portions A plurality of LED insertion holes 33a are provided on the upper portion of 32a. Next, as shown in FIG. 18A, the electronic component substrate (including the self-adhesive substrate 13 and the plurality of electronic components 14) is turned over and placed on the central tool portion 31a. The plurality of electronic component boards 14 are embedded in the plurality of electronic component mounting holes 33a. Then, as shown in FIG. 18B, the release layer 130 attached to the electronic component substrate is removed, and the electronic circuit carrier 11 is turned over on the electronic component substrate. The insulating and thermally conductive adhesive layer 131 at the bottom of the self-adhesive substrate 13 is attached to the mounting portion 111 of the electronic circuit carrier 11 . Finally, the mounting device 3 is removed, and the electronic component substrate (including the self-adhesive substrate 13 and the plurality of electronic components 14) is disposed on the setting portion 111 of the electronic circuit carrier 11 of the electronic device 1. . (The electronic circuit carrier 11 shown in FIG. 18C is a lamp holder of a full-period LED bulb lamp).

Thus, the above description has clearly and completely explained the mounting method of an electronic device having a self-adhesive substrate provided by the present invention. However, it must It should be added that the structure of the self-adhesive substrate 13 is not limited to the structure depicted in the third figure (including at least the insulating and thermally conductive adhesive layer 131, the copper wiring layer 132 and the upper insulating layer 133); in different applications. A structural view of another embodiment of the self-adhesive substrate 13 is shown in the nineteenth diagram. The self-adhesive substrate 13 includes at least a printed layer 134, a copper wiring layer 132, a lower insulating layer 133a, and an insulating and thermally conductive adhesive layer 131. Therefore, in order to respond to the different self-adhesive substrate 13 structure, the detailed steps of the foregoing step (S01) must also be adjusted as follows: As shown in the twentieth embodiment, the first detailed step provides an insulating layer 133a and a The copper layer 132a is bonded to the copper layer 132a. Then, the copper layer 132a is processed into the copper wiring layer 132 as shown in FIG. Then, as shown in the process diagram of FIG. 10C, the copper layer 132a is processed into a copper wiring layer 132, and a printed layer 134 is printed on the copper wiring layer 132. Continuing, the lower insulating layer 133a is bonded to the insulating and thermally conductive adhesive layer 131 as shown in the twentieth diagram.

In addition, it must be added that the structure of the self-adhesive substrate 13 is not limited to the structures depicted in the third and nineteenth embodiments; in another application, the structure of another embodiment of the self-adhesive substrate 13 The figure is shown in the twenty-first figure. The self-adhesive substrate 13 includes at least a printed layer 134, an upper insulating layer 133, a copper wiring layer 132, a lower insulating layer 133a, and an insulating and thermally conductive adhesive layer 131. Therefore, in order to respond to the different self-adhesive substrate 13 structure, the detailed steps of the foregoing step (S01) can also be adjusted as follows: As shown in the process diagram of FIG. 22A, the first detailed step provides an insulating layer 133a and a copper layer 132a, and the lower insulating layer 133a is bonded to the copper layer 132a; then, as in the second 12B, the copper layer 132a is processed into the copper circuit layer 132; then, as shown in the circuit diagram of FIG. 22C, an upper insulating layer 133 is provided and The upper insulating layer 133 is processed, and the upper insulating layer 133 is bonded to a copper layer 132a. Finally, as shown in the process diagram of FIG. 22D, a printed layer 134 is printed on the upper insulating layer 133, and the lower insulating layer 133a is bonded to the insulating and thermally conductive adhesive layer 131.

Here, it must be particularly noted that the above various application examples of the present invention are mainly LED light-emitting devices, however, the mounting method of the present invention can also be applied to other electronic devices. Please refer to the twenty-third figure, which is an exploded view of an electronic device having a self-adhesive substrate. The electronic device 1 shown in the twenty-third figure is a smart phone, and various electronic components 14 are soldered to the self-adhesive substrate. 13. As shown in the figure, the self-adhesive substrate 13 includes at least an insulating and thermally conductive adhesive layer 131, a copper wiring layer 132 and an upper insulating layer 133, and the insulating and thermally conductive adhesive layer 131, the copper wiring layer 132 and the upper insulating layer 133 are attached to the electron. Above the inner surface of the back shell of the device (smartphone); that is, the back shell serves here as the electronic circuit carrier 11 and the inner surface thereof serves as the arrangement 111 here.

Referring to FIG. 24, an exploded view of an electronic device having a self-adhesive substrate, wherein the electronic device 1 shown in FIG. The computer has various electronic components 14 soldered to the self-adhesive substrate 13. As shown in the figure, the self-adhesive substrate 13 includes at least an insulating and thermally conductive adhesive layer 131, a copper wiring layer 132 and an upper insulating layer 133, and the insulating and thermally conductive adhesive layer 131, the copper wiring layer 132 and the upper insulating layer 133 are attached to the electron. Above the inner surface of the back shell of the device 1 (tablet); that is, the back shell serves here as the electronic circuit carrier 11 and the inner surface thereof serves here as the arrangement 111.

Therefore, it should be particularly noted that the most important function of the mounting method of the present invention is the smart phone of the twenty-third figure and the tablet computer of the twenty-fourth figure. The various electronic components 14 are disposed on the self-adhesive substrate 13 and the self-adhesive substrate 13 is directly adhered to the back shell of the electronic device 1 so that the heat generated by the electronic components 14 can directly pass through the self-adhesive. The substrate 13 is conducted to the back shell, and then the heat is directly dissipated into the atmosphere by the back shell.

Thus, the above-described system has completely and clearly explained the mounting method of the self-adhesive substrate of the present invention, and, through the above, we can know that the present invention has the following advantages:

1. Compared with the conventional manufacturing method of the LED lamp, the present invention can quickly weld a plurality of electronic components 14 by the manufacture of a self-adhesive substrate board 2 and the auxiliary use of a mounting tool 3. The self-adhesive substrate 13 is mounted on the mounting portion 111 of the electronic circuit carrier 11 of any of the electronic devices 1. The manufacturing process does not require any screw-locking tool, so that the manufacturing process can be simplified and mass-produced. The purpose.

2. According to the first point described above, the electronic device 1 having the self-adhesive substrate produced by the mounting method of the present invention does not have any circuit substrate, so that the plurality of electronic components 14 mounted thereon are operated. The generated heat can be effectively conducted to the installation portion 111 of the electronic circuit carrier 11 by the insulating and thermally conductive adhesive layer 131 at the bottom of the self-adhesive substrate, and finally the heat is dissipated into the air via the electronic circuit carrier 11 to be effective. The purpose of heat dissipation.

It is to be understood that the foregoing detailed description of the embodiments of the present invention is not intended to Both should be included in the scope of the patent in this case.

S01~S05‧‧‧ method steps

Claims (12)

The self-adhesive substrate mounting method comprises the following steps: (1) providing at least one self-adhesive substrate joint plate, and forming a self-adhesive substrate on the self-adhesive substrate joint plate; wherein the self-adhesive substrate comprises at least a copper circuit layer and an insulating and thermally conductive adhesive layer, and the insulating and thermally conductive adhesive layer is connected with a release layer; (2) according to the appearance of a setting portion of the electronic circuit carrier of an electronic device, the self-adhesive substrate is connected Forming the self-adhesive substrate into a plurality of electronic component substrates; (3) soldering the plurality of electronic components to the copper circuit layer on the plurality of electronic component substrates; (4) sequentially removing each of the soldered wires An electronic component substrate of the plurality of electronic components; and (5) removing the release layer attached to the electronic component substrate, and attaching the electronic component substrate to the electronic circuit carrier by the insulating and thermally conductive adhesive layer Above the settings. The method for attaching a self-adhesive substrate according to claim 1, wherein the step (1) comprises the following detailed steps: (11) providing an upper insulating layer and processing the upper insulating layer; Laying the upper insulating layer to a copper layer; (13) processing the copper layer into the copper wiring layer; (14) printing a printed layer on the upper insulating layer; and (15) bonding the copper wiring layer to the insulating thermally conductive adhesive layer to obtain The self-adhesive substrate. The method for attaching a self-adhesive substrate according to claim 1, wherein the step (1) comprises the following detailed steps: (11a) providing an insulating layer and a copper layer; (12a) insulating the lower portion a layer is bonded to the copper layer; (13a) processing the copper layer into the copper wiring layer; (14a) printing a printed layer on the copper wiring layer; and (15a) insulating the lower insulating layer The thermal adhesive layer is applied. The method for attaching a self-adhesive substrate according to claim 1, wherein the step (1) comprises the following detailed steps: (11b) providing an insulating layer and a copper layer; (12b) insulating the lower portion a layer is bonded to the copper layer; (13b) processing the copper layer into the copper circuit layer; (14b) providing an upper insulating layer and processing the upper insulating layer; (15b) the upper insulating layer and a copper layer Layer bonding; (16b) printing a printed layer on the upper insulating layer; and (15b) bonding the lower insulating layer to the insulating thermally conductive adhesive layer. The method for attaching a self-adhesive substrate according to claim 1, wherein the step (5) is further performed by the following detailed steps: (51) providing a mounting tool, wherein the mounting tool comprises a base layer, and a plurality of electronic component insertion holes are dug in the base layer; (52) the removed electronic component substrate is placed on the base layer, so that the plurality of electronic components of the electronic component substrate are respectively embedded The plurality of electronic components are placed in the holes; (53) removing the release layer attached to the electronic component substrate, and flipping the electronic circuit carrier onto the electronic component substrate, so that the self-adhesive substrate The insulating thermally conductive adhesive layer on the bottom is attached to the mounting portion of the electronic circuit carrier; and (54) the mounting tool is removed. The mounting method of the self-adhesive substrate according to the first aspect of the invention, wherein the electronic device can be any one of the following: an LED light bar, an LED lamp, a full-circumference LED lamp, an LED table lamp, an LED backlight module, LED searchlight, LED projection lamp, LED car headlight, tablet computer, mobile phone, LED display, LED street light, LED downlight, LED ceiling light, LED candle light, LED bulb, LED tube, LED energy saving lamp, LED Art lights, or LED accessory lights. The method for attaching a self-adhesive substrate according to claim 6, wherein the electronic component can be any of the following: an LED chip, an integrated circuit chip, a capacitor, a resistor, an inductor, a transformer, an oscillator, a sensor, An electronic component produced by a semiconductor process, and a combination of any two or more of the above. The method of attaching a self-adhesive substrate according to the second, third or fourth aspect of the invention, wherein the upper insulating layer is a line covering layer. The method of attaching a self-adhesive substrate according to the second, third or fourth aspect of the invention, wherein the printed layer has a specific color. The method of attaching a self-adhesive substrate according to claim 9, wherein the specific color is white, green or yellow, and the white color is such that the printed layer has the effect of light reflection. The method for attaching a self-adhesive substrate according to claim 1, wherein in the step (3), after the plurality of electronic components are soldered onto the copper circuit layer, the plurality of electronic components can be directly connected The entire self-adhesive substrate is sent to a test area for electrical testing of each electronic component. The method for attaching a self-adhesive substrate according to claim 1, wherein the step (5) is further performed by the following detailed steps: (51a) providing a mounting tool, wherein the mounting tool comprises a central tooling portion and a plurality of bending device portions, and the plurality of bending device portions are pivotally connected to the central tooling portion; And the plurality of LED insertion holes are formed on the central molding part and the plurality of bending tool parts; (52a) the removed electronic component substrate is placed on the central tool part and The plurality of electronic components of the electronic component substrate are respectively embedded in the plurality of electronic component insertion holes; (53a) removing the release type attached to the electronic component substrate Laying the electronic circuit carrier onto the electronic component substrate such that the insulating and thermally conductive adhesive layer on the bottom of the self-adhesive substrate is attached to the disposed portion of the electronic circuit carrier; and (54a) shifting In addition to the placement tool.