TW201540169A - Heat-dissipating apparatus - Google Patents

Abstract

A heat-dissipating apparatus is for cooling two electronic components. The heat-dissipating apparatus includes a heat-dissipating member. The heat-dissipating member includes a connecting piece and two heat-dissipating pieces extending perpendicularly from opposite sides of the connecting piece. The electronic components are mounted to the heat-dissipating pieces respectively.

Description

Heat sink

The invention relates to a heat sink.

The electronic components in the electronic device generate heat when they work, and the existing electronic devices often use the system fan to dissipate heat for the electronic components, and the heat dissipation effect is poor.

In view of the above, it is necessary to provide a heat sink that can improve the heat dissipation effect of electronic components.

A heat dissipating device is used for dissipating heat of two electronic components. The heat dissipating device includes a heat dissipating component, and the heat dissipating component comprises a connecting piece and two heat dissipating fins extending perpendicularly from opposite sides of the connecting piece. Set on the two heat sinks.

Compared with the prior art, the heat dissipating component has two parallel fins, and each fin is provided with an electronic component. The heat sink of the heat dissipating component can conduct heat generated by the two electronic components, thereby improving the heat dissipation efficiency of the electronic component.

1 is a perspective exploded view of a preferred embodiment of the heat sink of the present invention and electronic components.

2 is a perspective view of a preferred embodiment of a heat dissipating component of the heat sink of the present invention.

3 is a perspective assembled view of FIG. 1.

Referring to FIG. 1, a preferred embodiment of the heat sink of the present invention is used for heat dissipation of two electronic components 100. The heat dissipating device comprises a heat dissipating component 10, two thermal conductive sheets 20, a temperature sensor 30 and two fixing frames 40. The bottom end of the electronic component 100 is provided with a plurality of pins 101 through which the electronic component 100 can be connected to the circuit board. The heat dissipating member 10 and the heat conductive sheet 20 are made of a heat conductive material.

Referring to FIG. 2 , the heat dissipating component 10 is substantially U-shaped and includes a connecting piece 11 and two fins 13 extending perpendicularly from opposite sides of the connecting piece 11 . Each of the fins 13 is provided with a through hole 130 at each end thereof. A positioning piece 17 is disposed at each of both ends of the bottom side of each of the fins 13. Each positioning piece 17 extends downwardly from a positioning leg 170. The heat dissipating component 10 can be coupled to the circuit board through the positioning pin 170 such that the heat dissipating component 10 is positioned on the circuit board.

Referring again to FIG. 1, each of the holders 40 includes a substrate 41, two extending sheets 43 extending perpendicularly from opposite ends of the substrate 41, and a side extending away from the substrate 41 from the two extending sheets 43. Two fixing pieces 45 extending outward. Each fixing piece 45 is provided with a fixing hole 450.

Referring to FIG. 3 together, the temperature sensor 30 is fixed to the outside of the connecting piece 11 of the heat dissipating member 10 during assembly. The two heat conducting sheets 20 are respectively adhered to the outer sides of the two heat sinks 13 of the heat dissipating component 10, and the two through holes 130 of the heat sink 13 are located on both sides of the heat conducting sheet 20. The two electronic components 100 are respectively attached to the two thermal conductive sheets 20 on the heat dissipating component 10. The fixing pieces 45 of the two fixing frames 40 abut against the two fins 13 of the heat dissipating member 10. The fixing hole 450 of the fixing frame 40 faces the through hole 130 of the heat sink 13. The electronic component 100 is interposed between the substrate 41 of the holder 40, the two extension pieces 43 and the heat transfer sheet 20. The fastener 60 is inserted into the fixing hole 450 of the fixing frame 40 and locked into the through hole 130 of the heat sink 13 to fix the electronic component 100 to the heat dissipating component 10.

The heat dissipating component 10 has two parallel fins 13 , and each fin 13 is provided with an electronic component 100 . The heat dissipating component 10 and the heat conductive sheet 20 can conduct heat generated by the two electronic components 100, thereby improving the heat dissipation efficiency of the electronic component 100. When the temperature sensor 30 senses that the two electronic components 100 are overheated, the controller can send a signal to the circuit board to perform corresponding protection measures, such as speeding up the speed of the fan that dissipates heat for the electronic component 100.

In summary, the present invention has indeed met the requirements of the invention patent, and has filed a patent application according to law. However, the above description is only a preferred embodiment of the present invention, and it is not possible to limit the scope of the patent application of the present invention. Equivalent modifications or variations made by persons skilled in the art in light of the spirit of the invention are intended to be included within the scope of the following claims.

100‧‧‧Electronic components

101‧‧‧ stitches

10‧‧‧Heat components

11‧‧‧Connecting piece

13‧‧‧ Heat sink

130‧‧‧Perforation

17‧‧‧ Positioning film

170‧‧‧ positioning feet

20‧‧‧thermal sheet

30‧‧‧temperature sensor

40‧‧‧ Fixing frame

41‧‧‧Substrate

43‧‧‧Extension

45‧‧‧Fixed tablets

450‧‧‧Fixed holes

60‧‧‧Locker

no

100‧‧‧Electronic components

101‧‧‧ stitches

10‧‧‧Heat components

11‧‧‧Connecting piece

13‧‧‧ Heat sink

17‧‧‧ Positioning film

170‧‧‧ positioning feet

20‧‧‧thermal sheet

30‧‧‧temperature sensor

40‧‧‧ Fixing frame

60‧‧‧Locker

Claims (6)

A heat dissipating device is used for dissipating heat of two electronic components. The heat dissipating device includes a heat dissipating component, and the heat dissipating component comprises a connecting piece and two heat dissipating fins extending perpendicularly from opposite sides of the connecting piece. Set on the two heat sinks. The heat dissipating device of claim 1, wherein a heat conducting sheet is disposed between each of the heat sinks and the corresponding electronic component. The heat dissipating device of claim 1, further comprising two fixing frames fixed to the outer sides of the two fins, wherein each electronic component is sandwiched between the heat sink and the fixing frame. The heat dissipating device of claim 3, wherein each of the fixing frames comprises a substrate, two extending pieces extending perpendicularly from opposite ends of the substrate, and an end of the two extending pieces away from the substrate Two fixing pieces extending outward, the fixing piece being fixed to the heat sink. The heat dissipating device of claim 1, wherein the connecting piece of the heat dissipating component is provided with a temperature sensor. The heat dissipating device of claim 1, wherein each of the fins is provided with a positioning piece at the bottom, and each positioning piece extends downwardly with a positioning leg.