TW201539551A - Monitoring method and apparatus for control of excimer laser annealing - Google Patents

Monitoring method and apparatus for control of excimer laser annealing Download PDF

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TW201539551A
TW201539551A TW104106291A TW104106291A TW201539551A TW 201539551 A TW201539551 A TW 201539551A TW 104106291 A TW104106291 A TW 104106291A TW 104106291 A TW104106291 A TW 104106291A TW 201539551 A TW201539551 A TW 201539551A
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image
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periodic
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microscope
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TWI660410B (en
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Der Wilt Paul Van
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Coherent Lasersystems Gmbh & Co Kg
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    • H01L21/02686Pulsed laser beam

Abstract

A method is disclosed evaluating a silicon layer crystallized by irradiation with pulses form an excimer-laser. The crystallization produces periodic features on the crystalized layer dependent on the number of and energy density ED in the pulses to which the layer has been exposed. An area of the layer is illuminated with light. A microscope image of the illuminated area is made from light diffracted from the illuminated are by the periodic features. The microscope image includes corresponding periodic features. The ED is determined from a measure of the contrast of the periodic features in the microscope image.

Description

用於準分子雷射退火之控制之監控方法及裝置 Monitoring method and device for control of excimer laser annealing 相關申請案 Related application

本案要請求2014年3月3日申請之No.14/195,656美國專利申請案的優先權益,其內容併此附送。 The priority of the US Patent Application No. 14/195,656, filed on March 3, 2014, is hereby incorporated by reference.

本發明之技術領域 Technical field of the invention

本發明概有關於藉脈衝雷射照射之薄矽(Si)層的熔化及再結晶。該方法特別有關於評估該等再結晶層的方法。 The present invention relates generally to the melting and recrystallization of a thin tantalum (Si) layer by pulsed laser irradiation. This method is particularly relevant to the evaluation of such recrystallized layers.

背景技術之說明 Description of the background art

矽再結晶化係為一種步驟,其乃時常被使用於薄膜電晶體(TFT)主動矩陣LCDs,及有機發光二極體(AMOLED)顯示器的製造中。該結晶矽會形成一半導體基底,其中該顯示器的電子迴路會被以傳統的微影製法來形成。通常,再結晶化係使用一脈衝雷射來進行,其會被成形呈一長線而沿該長度方向(長軸)具有一均一的強度廓形,且在該寬度方向(短軸)亦具有一均一或”頂帽”強度廓形。於此製程中,在一玻璃基材上之薄層的非結晶矽會被雷射輻射的脈衝重複地熔化,而該基材(及其上的矽層)會被 相對於該等雷射輻射脈衝之一發送源平移。藉由在某一最佳的能量密度(OED)之重複脈衝,熔化再固化(再結晶)會發生,直到一所需的晶體微結構於該薄膜中被獲得。 Rhodium recrystallization is a step that is often used in the manufacture of thin film transistor (TFT) active matrix LCDs, and organic light emitting diode (AMOLED) displays. The crystallization enthalpy forms a semiconductor substrate in which the electronic circuitry of the display is formed by conventional lithography. In general, recrystallization is performed using a pulsed laser which is formed into a long line and has a uniform intensity profile along the length direction (long axis) and also has a profile in the width direction (short axis). Uniform or "top hat" strength profile. In this process, a thin layer of amorphous germanium on a glass substrate is repeatedly melted by the pulse of the laser radiation, and the substrate (and the layer of germanium thereon) is The source translation is transmitted relative to one of the laser radiation pulses. By repetitive pulses at a certain optimum energy density (OED), melting re-solidification (recrystallization) occurs until a desired crystal microstructure is obtained in the film.

光學元件會被用來將該等雷射脈衝形成為一輻射直線,且再結晶會發生於一具有該輻射直線之寬度的條帶中。每一企圖皆會被用來使該等輻射脈衝的強度沿著該直線保持高度地一致。此乃必須保持沿該條帶之晶體微結構的一致。該等光脈衝之一較佳來源係為一準分子雷射,其會發送具有一在電磁波頻譜之紫外光區中的波長之脈衝。上述使用準分子雷射脈衝的再結晶製法,通常係被稱為準分子雷射退火(ELA)。該製法是一種很精敏者,且該OED的誤差容限會是一很少百分比,或甚至小到±0.5%。 Optical elements are used to form the laser pulses into a line of radiation, and recrystallization occurs in a strip having the width of the line of radiation. Each attempt will be used to maintain the intensity of the radiation pulses consistently along the line. This is necessary to maintain the uniformity of the crystal microstructure along the strip. One of the preferred sources of light pulses is a quasi-molecular laser that transmits a pulse having a wavelength in the ultraviolet region of the electromagnetic spectrum. The above recrystallization method using excimer laser pulses is generally called excimer laser annealing (ELA). This method is very sensitive, and the error tolerance of the OED will be a small percentage, or even as small as ±0.5%.

有兩種ELA的模式。在一模式中,一面板相對於該雷射束的平移速度係充分地慢,而使該射束寬度的”頂帽部分”由一個脈衝至下個脈衝會重疊高達95%,故任何極小的區域會接受總共大約20個脈衝。在另一稱為前進式ELA或AELA的模式中,該平移速度係更快許多,而在一次通過一面板上時該等照射的”直線”具有最少的重疊,且可能甚至在其間留下未結晶化的空間。多次通過係被作成為會使該整個面板被照射一脈衝總數,其可比在一ELA製法中更少,而來製成同等的材料。 There are two modes of ELA. In one mode, the translational speed of a panel relative to the laser beam is sufficiently slow, such that the "top hat portion" of the beam width overlaps by up to 95% from one pulse to the next, so any minimum The area will accept a total of approximately 20 pulses. In another mode called progressive ELA or AELA, the translational speed is much faster, and the "straight lines" of the illuminations have the least overlap when passing through one panel at a time, and may even leave no Crystallized space. Multiple passes are made to cause the entire panel to be illuminated by a total number of pulses, which can be made in an equivalent material in an ELA process.

不論那個ELA模式被使用,在一生產線中之面板上的結晶化模之評估係會被以目視檢查來立即地離線進行。此檢查是完全主觀的,且倚賴經高度訓練的有經驗檢 查者,他們藉由其經驗係能夠將所觀察到的面板之特徴與該結晶化射束中的能量密度之非常小的變化,例如小於1%,來互相關連。在一生產環境中,若製程能量密度有一變化,該視覺分析和確立的過程由該結晶化被進行之時起典型需要大約一到一個半小時之間,而對可接受的面板之生產線產能會有一對應的負面影響。 Regardless of which ELA mode is used, the evaluation of the crystallization mold on the panel in a production line is immediately performed offline by visual inspection. This check is completely subjective and relies on highly trained and experienced Investigators, by their experience, are able to correlate the observed panel characteristics with very small changes in energy density in the crystallized beam, for example less than 1%. In a production environment, if there is a change in the process energy density, the visual analysis and establishment process typically takes about one to one and a half hours from the time the crystallization is performed, and the production capacity of the acceptable panel is There is a corresponding negative impact.

故有需要一種評估該ELA製程的客觀方法。較好是,該方法應至少能夠在一生產線上被實行。更好是,該方法應能夠在一反饋回路中被用以類實時評估,而回應於該評估所提供的資料來自動地調整製程能量密度。 Therefore, there is a need for an objective method of evaluating the ELA process. Preferably, the method should be practiced on at least one production line. More preferably, the method should be capable of being used for real-time evaluation in a feedback loop and automatically adjusting the process energy density in response to the information provided by the evaluation.

本發明之概要 Summary of the invention

本發明係有關一種用以評估一至少部份結晶化的半導體層之方法和裝置,該半導體層係被曝露於多數個雷射輻射脈衝其在該層上具有一能量密度,該結晶化會在該層上於一第一方向造成一第一組群的週期性表面特徴,及在一垂直於該第一方向的第二方向造成一第二組群的週期性表面特徵,該第一和第二組群的週期性特徴之形式取決於該半導體層所被曝露的雷射輻射脈衝之能量密度。 The present invention relates to a method and apparatus for evaluating an at least partially crystallized semiconductor layer that is exposed to a plurality of laser radiation pulses having an energy density on the layer, the crystallization being Forming, on a layer, a periodic surface feature of a first group in a first direction and a periodic surface feature of a second group in a second direction perpendicular to the first direction, the first and the The form of the periodic characteristics of the two groups depends on the energy density of the laser radiation pulse to which the semiconductor layer is exposed.

在本發明之一態樣中,一種用以評估該半導體的方法包含:照明該結晶化的半導體層之一區域,及在來自該照明區域被該第一和第二組群的週期性特徴繞射之光中記錄該照明區域之一顯微鏡影像。該記錄影像含有分別對應於該層的照明區域中之該第一和第二組群的週期性特徴 之水平和垂直的週期性影像特徴組群。該能量密度係由該等水平和垂直的週期性影像特徴組群之至少一者的對比之一測量值來決定。 In one aspect of the invention, a method for evaluating a semiconductor includes: illuminating a region of the crystallized semiconductor layer, and periodically entanglement of the first and second groups from the illumination region A microscope image of one of the illumination regions is recorded in the shot light. The recorded image contains periodic features corresponding to the first and second groups of illumination regions of the layer, respectively Horizontal and vertical periodic image feature groups. The energy density is determined by one of the comparisons of at least one of the horizontal and vertical periodic image feature groups.

20‧‧‧評估裝置 20‧‧‧Evaluation device

21‧‧‧繞射測量裝置 21‧‧‧Diffraction measuring device

22‧‧‧結晶化矽層 22‧‧‧ Crystallized layer

24‧‧‧玻璃面板 24‧‧‧glass panel

26‧‧‧顯微鏡 26‧‧‧Microscope

28,80‧‧‧光源 28,80‧‧‧Light source

29,65,82‧‧‧射束 29,65,82‧‧·beam

30‧‧‧聚縮隔板 30‧‧‧Poly partition

32‧‧‧光學元件 32‧‧‧Optical components

34‧‧‧反射光束部份 34‧‧‧Reflected beam part

36R,84‧‧‧繞射光 36R, 84‧‧‧Diffraction

36T‧‧‧繞射光束部份 36T‧‧‧Diffraction beam part

38‧‧‧擋止物 38‧‧‧stops

39,40‧‧‧濾光元件 39,40‧‧‧ Filter elements

50‧‧‧檢測單元 50‧‧‧Detection unit

52‧‧‧光檢測元件 52‧‧‧Light detection components

54‧‧‧電子處理器 54‧‧‧Electronic processor

60,60A‧‧‧退火裝置 60,60A‧‧‧ Annealing device

62‧‧‧平移台 62‧‧‧ translation stage

64‧‧‧準分子雷射 64‧‧‧Excimer laser

66‧‧‧可變衰減器 66‧‧‧Variable attenuator

68‧‧‧射束成形光件 68‧‧·beamforming light parts

69‧‧‧成形射束 69‧‧‧Forming beam

70‧‧‧旋轉鏡 70‧‧‧Rotating mirror

72‧‧‧投射光件 72‧‧‧Projected light pieces

82R‧‧‧反射光束 82R‧‧·reflected beam

所附圖式係被併入且構成本說明書的一部份,乃示意地示出本發明之一較佳實施例,並與前述的概括說明和後述之該較佳實施例的詳細說明一起用來說明本發明的原理。 BRIEF DESCRIPTION OF THE DRAWINGS The accompanying drawings, which are incorporated in FIG The principles of the invention are illustrated.

圖1為一圖表乃示意地示出針對ELA結晶化矽層之掃描雷射顯微鏡影像的快速傅里葉變換(FFTs),在滾動和橫向方向所測出的最高振幅為脈衝能量密度之一函數。 Figure 1 is a diagram schematically showing fast Fourier transforms (FFTs) of scanning laser microscope images for ELA crystallized germanium layers. The highest amplitude measured in the rolling and transverse directions is a function of pulse energy density. .

圖2為一圖表乃示意地示出針對A-ELA結晶化矽層之掃描雷射顯微鏡影像的FFTs,在滾動和橫向方向所測出的最高振幅為脈衝能量密度之一函數。 2 is a graph schematically showing FFTs of a scanning laser microscope image for an A-ELA crystallized layer, the highest amplitude measured in the rolling and transverse directions being a function of pulse energy density.

圖3為一圖表乃示意地示出針對A-ELA結晶化矽層之掃描雷射顯微鏡影像的快速傅里葉變換(FFTs),在滾動和橫向方向所測出的最高振幅為脈衝數目之一函數。 3 is a graph schematically showing fast Fourier transforms (FFTs) of scanning laser microscope images for A-ELA crystallized germanium layers, the highest amplitude measured in the rolling and lateral directions being one of the number of pulses function.

圖4為一ELA結晶化矽層之一區域的偏振光顯微鏡影像,乃示出當結晶化時橫交於及平行於該層的滾動方向(RD)所形成的凸脊。 Fig. 4 is a polarized light microscope image of a region of an ELA crystallized ruthenium layer showing ridges formed transversely to and parallel to the rolling direction (RD) of the layer when crystallized.

圖5為一類似於圖4之一結晶化層之一區域的錐光顯微鏡影像,乃示出分別來自橫向和滾動方向凸脊之繞射光所形成的水平和垂直光帶。 Figure 5 is a conoscopic microscopy image of a region similar to one of the crystallization layers of Figure 4 showing the horizontal and vertical bands of light from the diffracted light from the transverse and rolling ridges, respectively.

圖6為一圖表乃示意地示出針對來自ELA結晶化 層之橫向及滾動方向凸脊的繞射光所測得的振幅為脈衝能量密度之一函數。 Figure 6 is a diagram schematically showing crystallization from ELA The amplitude measured by the diffracted light of the transverse and rolling ridges of the layer is a function of the pulse energy density.

圖7為一圖表乃示意地示出針對來自A-ELA結晶化層之橫向及滾動方向凸脊的繞射光就410、415和420mJ/cm2之ED值所測得的振幅為脈衝數目之一函數。 Figure 7 is a graph schematically showing one of the number of pulses measured for the ED values of 410, 415 and 420 mJ/cm 2 of diffracted light from the transverse and rolling ridges of the A-ELA crystallized layer. function.

圖8和8A示意地示出依據本發明之一用以分開地測量來自ELA結晶化層之橫向及滾動方向凸脊的繞射光之振幅的裝置之一較佳實施例。 Figures 8 and 8A schematically illustrate a preferred embodiment of a device for separately measuring the amplitude of diffracted light from the lateral and rolling ridges of an ELA crystallized layer in accordance with one aspect of the present invention.

圖9示意地示出依據本發明的ELA裝置之一較佳實施例,包含圖8的裝置併有一可變的衰減器用以回應於來自該ELA結晶化層之橫向及滾動方向凸脊的繞射光所測得的振幅調整一矽層上的脈衝能量密度。 Figure 9 is a schematic illustration of a preferred embodiment of an ELA device in accordance with the present invention, comprising the apparatus of Figure 8 and having a variable attenuator for responding to diffracted light from lateral and rolling ridges of the ELA crystallization layer The measured amplitude adjusts the pulse energy density on a layer.

圖10示意地示出依據本發明之一ELA裝置的另一較佳實施例,類似於圖9的裝置,但其中圖8的裝置係被一依據本發明之用以分開地測量來自該ELA結晶化層之橫向及滾動方向凸脊的繞射光之振幅的裝置之另一較佳實施例所取代。 Figure 10 is a schematic illustration of another preferred embodiment of an ELA device in accordance with the present invention, similar to the device of Figure 9, but wherein the device of Figure 8 is used in accordance with the present invention to separately measure crystals from the ELA. Another preferred embodiment of the device for laterally and laterally swaying the amplitude of the diffracted light of the ridges is replaced.

圖11A為一記錄於來自一在低於一最佳能量密度(OED)結晶化的矽層之一區域的繞射光中之透射顯微鏡影像的重現,該影像包含水平和垂直的週期性特徴對應於該層中的滾動方向和橫向特徴。 Figure 11A is a reproduction of a transmission microscope image recorded in a diffracted light from a region of a germanium layer crystallized below an optimum energy density (OED), the image containing horizontal and vertical periodic characteristics corresponding to The scrolling direction and the lateral characteristics in this layer.

圖11B為一類似於圖11A的影像之一透射顯微鏡影像的重現,但係為一在一高於該最佳能量密度結晶化的矽層者。 Figure 11B is a reproduction of a transmission microscope image similar to the image of Figure 11A, but as a layer of crystallization that is crystallized above the optimum energy density.

圖12為一類似於圖11B的影像之一透射顯微鏡影像的重現,及光振幅為水平和垂直距離之一函數的圖表,該等水平和垂直特徴的對比可由之被測出。 Figure 12 is a graph showing the reproduction of a transmission microscope image similar to that of Figure 11B, and the optical amplitude as a function of horizontal and vertical distance from which the contrast of horizontal and vertical characteristics can be measured.

圖13為一圖表乃示意地示出在一類似於圖12之影像的顯微鏡影像之水平特徴中所測得的對比,如同圖2的圖表所記錄之由該二組群的層特徴繞射之光的振幅為能量密度之一函數,且所測得的振幅之一的計算斜率為能量密度之一函數。 Figure 13 is a diagram schematically showing the contrast measured in a horizontal feature of a microscope image similar to the image of Figure 12, as recorded by the graph of Figure 2, by the layer characteristics of the two groups. The amplitude of the light is a function of the energy density and the calculated slope of one of the measured amplitudes is a function of the energy density.

圖14為一類似的圖13之圖表的圖表,但其中該顯微鏡影像係來自一被以包含一微平滑化技術之雷射結晶化製法來結晶化的矽層。 Figure 14 is a diagram similar to the graph of Figure 13, but wherein the microscope image is from a layer of ruthenium crystallized by a laser crystallization process comprising a micro-smoothing technique.

本發明之詳細說明 Detailed description of the invention

薄矽膜的ELA處理會導致表面粗糙突出物的形成,它們係由於矽在固化時的膨脹所形成者。該等突出物係特別會在側向生長時於三或更多個固化正面碰撞之間形成。該等突出物通常並非隨機地定位。而是,它們會由於波紋形成的過程而排列對準,在文獻中統稱為雷射致生的週期性表面結構物(LIPSS)。故該等波紋係由良好排列的突出物之系列所組成。該波紋形成係僅會在一能量密度窗(範圍)內被看到,其中該薄膜係達到部份熔化。典型地該波紋週期性係等同該入射光的波長,例如,以XeCl準分子雷射為大約290~340nm。因為此等小尺寸,故波紋不能,或極難能被使用傳統的光學顯微技術來解析。 ELA treatment of the tanning film results in the formation of surface roughness protrusions which are formed by the expansion of the crucible upon curing. These protrusions are particularly formed between three or more cured frontal collisions when grown laterally. These protrusions are usually not randomly located. Rather, they are aligned due to the process of corrugation, collectively referred to in the literature as laser-induced periodic surface structures (LIPSS). Therefore, the corrugations are composed of a series of well-arranged protrusions. The corrugation formation is only seen in an energy density window (range) where the film is partially melted. Typically, the ripple periodicity is equivalent to the wavelength of the incident light, for example, with a XeCl excimer laser of about 290-340 nm. Because of these small dimensions, the ripples are not, or extremely difficult to resolve, using conventional optical microscopy techniques.

典型在光亮場顯微術中所看到的是該ELA處理的薄膜之表面係由散佈著較亮區域之伸長的較暗彩色區域所組成。該等較暗區域的靠近檢查顯示它們係由具有較高突出物之更強烈波動的(規則的)區域所組成,而在其間係為具有較不規則及/或較低突出物的區域。該等較規則的區域於此係稱為凸脊,而在其間的區域係稱為凹谷。有一發明性的發現,即該等凸脊的形成顯得會與波紋的形成相關連,且該等凸脊的典型定向係在一垂直於該波紋方向的方向。本發明的方法和裝置係倚賴測量來自一藉由該ELA製法所形成之薄矽膜(層)中的凸脊之光繞射。該方法提供一種該波動程度之一間接測量值,其能被用來以類實時監測或控制該ELA製程。此外,一種方法係更直接針對該等波紋本身來被描述,雖然使用某些顯微技術其相較於用以測量來自凸脊之繞射的較傳統光學顯微技術係較緩慢。 Typically seen in bright field microscopy, the surface of the ELA treated film consists of an elongated darker colored area interspersed with brighter areas. The close inspection of the darker regions shows that they are composed of (regular) regions with more intense fluctuations of higher protrusions, with regions that are more irregular and/or lower protrusions therebetween. These more regular regions are referred to herein as ridges, and the regions in between are referred to as valleys. It has been found that the formation of the ridges appears to be associated with the formation of corrugations, and the typical orientation of the ridges is in a direction perpendicular to the direction of the corrugations. The method and apparatus of the present invention relies on measuring light diffraction from a ridge in a thin film (layer) formed by the ELA process. The method provides an indirect measurement of the degree of fluctuation that can be used to monitor or control the ELA process in real time. Moreover, one method is described more directly with respect to the corrugations themselves, although some microscopic techniques are used to be slower than the more conventional optical microscopy techniques used to measure diffraction from ridges.

波紋通常並非只在一方向形成。該等波紋主要係形成在一平行於掃描方向的方向,及亦在一垂直於該掃描方向的方向(該直線方向)。該等波紋係為週期性的,且於此係被以它們的週期性之方向來描述,使用一般在冶金學中共用的術語,其中該滾動方向(RD)會與該掃描方向相符,且該橫向(TD)會與該直線方向相符。緣是,由於定向於該掃描方向的波紋在該橫向係為週期性的,故它們係被稱為TD波紋。同樣地,定向於該直線方向的波紋在該滾動方向係為週期性的,故被稱為RD波紋。 Corrugations are usually not formed in only one direction. The corrugations are mainly formed in a direction parallel to the scanning direction, and also in a direction perpendicular to the scanning direction (the linear direction). The corrugations are periodic and are described herein in the direction of their periodicity, using terms commonly used in metallurgy, where the rolling direction (RD) will coincide with the scanning direction, and The landscape (TD) will match the direction of the line. The edge is that since the corrugations oriented in the scanning direction are periodic in the transverse direction, they are referred to as TD corrugations. Similarly, the corrugations oriented in the direction of the line are periodic in the rolling direction and are therefore referred to as RD corrugations.

依據LIPSS理論,TD波紋具有一間隔粗略等於該 光的波長,而RD波紋係相隔大約λ/(1±sin θ),且典型主要為該λ/(1-sin θ)間隙,其中θ是該層上之雷射輻射的入射角度,其在ELA中典型是大約5度或更大。波紋形成對獲得均一的聚矽膜是有幫助的,因為該晶粒結構會傾向於依循該表面週期性。當波紋出現時,理想地,一主要由尺寸約為λ×λ/(1-sin θ)之矩形晶粒組成之非常規則的薄膜會被形成。以較低的能量密度(ED)晶粒會較小,而以較高ED,晶粒會較大。當比該波紋領域尺寸更大的晶粒被生長時,於此稱為超側向生長(SLG),表面重流將會造成該突出物高度的減少及該薄膜中之次序的逐漸喪失。 According to the LIPSS theory, the TD ripple has a spacing roughly equal to the The wavelength of light, while the RD corrugations are separated by approximately λ/(1±sin θ), and typically predominantly the λ/(1-sin θ) gap, where θ is the angle of incidence of the laser radiation on the layer, Typically in ELA is about 5 degrees or more. Corrugation formation is helpful in obtaining a uniform polysilicon film because the grain structure tends to follow the surface periodicity. When corrugations occur, ideally, a very regular film consisting mainly of rectangular grains having a size of about λ x λ / (1 - sin θ) will be formed. At lower energy densities (ED), the grains will be smaller, while at higher ED, the grains will be larger. When grains larger than the size of the corrugated field are grown, referred to herein as super lateral growth (SLG), surface reflow will result in a reduction in the height of the protrusion and a gradual loss of order in the film.

在一用來判定由該等波紋造成的表面週期性與雷射脈衝的ED間之一數值關係的第一試驗中,結晶化膜的雷射掃描顯微鏡(LSM)影像會被以該RD和TD方向中造成的變換藉快速傅里葉變換(FFT)來分析。該FFT中之一波峰表示有某一表面週期性的存在,且該波峰的位置對應於該表面週期性的方向。以大約1/λ來提供尖銳波峰的TD變換表示強烈的TD週期性。RD變換會以大約(1-sin θ)/λ來顯示較不尖銳的波峰,並具有比該等TD變換更低的振幅,即,較不顯著的RD波紋具有大約(1-sin θ)/λ的間隔。 In a first experiment to determine the numerical relationship between the surface periodicity caused by the corrugations and the ED of the laser pulse, a laser scanning film laser scanning microscope (LSM) image is used for the RD and TD. The transformations made in the direction are analyzed by Fast Fourier Transform (FFT). One of the peaks in the FFT indicates the presence of a periodic surface, and the position of the peak corresponds to the periodic direction of the surface. A TD transform that provides sharp peaks at approximately 1/λ represents a strong TD periodicity. The RD transform will show less sharp peaks at approximately (1-sin θ) / λ and have a lower amplitude than the TD transforms, ie, the less significant RD ripple has approximately (1-sin θ) / The interval of λ.

圖1為一圖表乃示意地示出在一ELA製程中有總共25個重疊的脈衝,對應的RD和TD變換波峰之振幅為各脈衝中以每平方厘米毫焦耳(mJ/cm2)計的能量密度(ED)之一函數。其可被看出該RD週期性顯示在一比最大的TD週期性稍微更高的ED處係為最大。於此一大約420mJ/cm2的OED 係被示出該等RD和TD方向中的週期性隨著較高的ED急促地逐減(相對地)。應請瞭解於此所定義的ED係使用一常見於工業中的方法來決定,包括測量該射束中的能量並將之除以該射束的頂帽寬度,而不管該頂帽兩側的梯度。 Figure 1 is a diagram schematically showing a total of 25 overlapping pulses in an ELA process, the amplitudes of the corresponding RD and TD transform peaks being measured in millijoules per square centimeter (mJ/cm 2 ) in each pulse. A function of energy density (ED). It can be seen that the RD periodically shows that it is maximal at an ED that is slightly higher than the maximum TD periodicity. Here, an OED of about 420 mJ/cm 2 is shown to periodically decrease (relatively) with the higher ED in the RD and TD directions. It should be understood that the ED system defined herein is determined using a common method in the industry, including measuring the energy in the beam and dividing it by the top cap width of the beam, regardless of the sides of the top cap. gradient.

圖2為一類似於圖1的圖表,但係以一25個脈衝的A-ELA製程來結晶化者。其中,該等RD波紋顯示比ELA者更強的週期性,且其波峰週期性係比在該ELA製程之例更佳地界定。 Figure 2 is a graph similar to Figure 1, but crystallized by a 25 pulse A-ELA process. Among them, the RD ripples show a stronger periodicity than the ELA, and their peak periodicity is better defined than in the case of the ELA process.

圖3為一圖表乃示意地示出RD和TD波峰振幅為在一420mJ/cm2的ED的脈衝數目之一函數,該ED係稍微小於該依經驗決定的OED。其可被看出在該TD方向週期性會穩定地增加至一大約22的脈衝數目。在該RD方向,僅有非常少的週期性成長,直到大約15個脈衝已被發送之後。 Figure 3 is a graph schematically showing one of the RD and TD peak amplitudes as a function of the number of pulses of ED at 420 mJ/cm 2 which is slightly smaller than the empirically determined OED. It can be seen that the periodicity in the TD direction is steadily increased to a number of pulses of approximately 22. In this RD direction, there is very little periodic growth until approximately 15 pulses have been transmitted.

圖4為一反射光中的偏振顯微鏡影像。定向於該橫向的凸脊(其係相關連於該RD方向中的波紋,或換言之,按照該根據週期性的定義,即該等”TD波紋”)能被清楚地看出。定向於該滾動方向(且相關連於”RD波紋”)的凸脊係較不明顯但仍然可見,如將可被由上述的FFT分析預期。 Figure 4 is a polarized microscope image of a reflected light. The ridges oriented in the transverse direction (which are associated with the corrugations associated with the RD direction, or in other words, according to the definition of periodicity, i.e., the "TD ripples") can be clearly seen. The ridges oriented in the direction of the scroll (and associated with the "RD ripple") are less noticeable but still visible, as would be expected from the FFT analysis described above.

不同於波紋,該等凸脊並非嚴格地週期地。但是,該等凸脊具有一特徵間隔,其範圍典型可在大約1.5μm和約3.0μm之間,或約為一大於該等波紋的間隔之量值等級。依據波紋的專用術語,該等凸脊係被以該週期性的方向來稱謂,即,RD凸脊係定向於該橫向,而TD凸脊係定向於該滾動方向。 Unlike corrugations, the ridges are not strictly periodic. However, the ridges have a feature spacing which may typically range between about 1.5 [mu]m and about 3.0 [mu]m, or about a magnitude greater than the spacing of the corrugations. According to the specific terminology of the corrugations, the ridges are referred to in the periodic direction, i.e., the RD ridges are oriented in the transverse direction, and the TD ridges are oriented in the rolling direction.

該FFT分析,於其本身,清楚地提供評估一結晶化層之一手段。但是,用來產生上述資訊所須的步驟通常係較慢,故並不鼓勵使用該等分析於一以ELA或A-ELA結晶化之層的近實時線上監測或評估。因此,乃決定研究分析與RD和TD波紋有關連之垂直定向的凸脊組群相關連之繞射現象的可能性,而不企圖去直接測量該等波紋本身。 The FFT analysis, in and of itself, clearly provides a means of evaluating a crystallization layer. However, the steps required to generate the above information are generally slow, and the use of such analysis in near real-time online monitoring or evaluation of a layer crystallized with ELA or A-ELA is discouraged. Therefore, it was decided to study the possibility of analyzing the diffraction phenomenon associated with the vertically oriented ridge groups associated with the RD and TD ripples, without attempting to directly measure the corrugations themselves.

圖5為一譬如圖4中所示之一層的錐光顯微鏡影像。此係使用一商業上可得的顯微鏡來攝取,而該目鏡被移除以容許該物鏡的後焦點平面之一影像能被記錄。於此例中,該影像係被以一簡單的行動電話相機來記錄。該顯微鏡係被以一透射光構態來使用。一第一偏振器係被設在該樣品前方的照明光徑中,且一第二偏振器(分析器)係被設在該樣品之後,而其偏振方向係對該第一偏振器者呈90度。 Figure 5 is a conoscopic microscope image of a layer as shown in Figure 4. This is taken using a commercially available microscope that is removed to allow an image of the back focus plane of the objective to be recorded. In this example, the image is recorded as a simple mobile phone camera. The microscope is used in a transmitted light configuration. A first polarizer is disposed in the illumination path in front of the sample, and a second polarizer (analyzer) is disposed after the sample, and a polarization direction is 90 for the first polarizer. degree.

該錐光影像的中心對應於該顯微鏡系統的光軸,且離該光軸(中心點)的距離對應於該光行經的角度。因此,該錐光影像會提供在該顯微鏡中的光之方向上的資訊。 The center of the cone image corresponds to the optical axis of the microscope system, and the distance from the optical axis (center point) corresponds to the angle at which the light travels. Thus, the cone image provides information in the direction of the light in the microscope.

一聚縮隔片係被設成接近於一最小孔徑來限制該樣品上之入射光的角度分佈,並因而將該孔徑的影像限制於該錐光影像的中心。該影像的其餘部份係由被該結晶化形成的TD和RD凸脊組群繞射的光所形成。該偏振器和分析器會一起作用來最小化該中心點相對於該影像之其餘部份的亮度。以90度相對旋轉該二偏振器會在該錐光影像中形成一對交叉的消光帶,稱為消光影。藉著相對於該樣品一起旋轉偏振器和分析器,該等消光影能被由該等繞射帶 旋轉離開而來最小化該等帶的消光。 A polycondensation spacer is positioned close to a minimum aperture to limit the angular distribution of incident light on the sample and thereby confining the image of the aperture to the center of the cone image. The remainder of the image is formed by light diffracted by the crystallization of the TD and RD ridge groups. The polarizer and analyzer act together to minimize the brightness of the center point relative to the rest of the image. Rotating the two polarizers at 90 degrees will form a pair of intersecting matting strips in the cone image, referred to as matte shadows. By rotating the polarizer and the analyzer relative to the sample, the extinction shadows are Rotate away to minimize the extinction of the bands.

以灰色標度呈現於圖5中的實際影像係為一彩色影像。該水平帶是一淺藍色,而該垂直帶是一淺綠色。該等帶的色彩可為相當均勻,故相信係表示在該等波長有一高繞射效率,且在其它波長有較低的繞射效率。該等帶之色彩的均一性咸信係為該等凸脊的可變間隔之一結果。其中可能有某些光譜在該等水平和垂直帶的光譜之間重疊。 The actual image presented in Figure 5 on a gray scale is a color image. The horizontal band is a light blue color and the vertical band is a light green color. The colors of the bands can be fairly uniform, so it is believed to have a high diffraction efficiency at the wavelengths and a lower diffraction efficiency at other wavelengths. The uniformity of the color of the bands is the result of one of the variable spacing of the ridges. There may be some spectra that overlap between the spectra of the horizontal and vertical bands.

該顯微鏡物鏡為一20x物鏡。該中心點之一強度梯度較高的片段邊緣會給予該影像畫素尺寸之一指示。在該等黑暗象限中的較大方塊係為JPEG影像壓縮之一加工物。 The microscope objective is a 20x objective. The edge of the segment with a higher intensity gradient at one of the center points will give an indication of one of the image pixel sizes. The larger blocks in these dark quadrants are one of JPEG image compression.

在該圖之一水平方向有一強烈的光帶係由RD凸脊(有關於TD波紋)繞射所造成。在該圖的垂直方向,有一較弱的光帶由TD凸脊(有關於RD波紋)繞射所造成。透射的光會在該影像的中心形成一亮點。 In the horizontal direction of one of the figures, a strong band of light is caused by diffraction of the RD ridges (with respect to TD ripples). In the vertical direction of the figure, a weaker band of light is caused by diffraction of the TD ridges (with respect to RD ripple). The transmitted light creates a bright spot in the center of the image.

如由圖1和圖2的圖表可以預期,若該脈衝ED掉至該OED以下,則該TD凸脊繞射帶相對於該RD凸脊繞射帶之亮度的相對亮度會隨逐減的ED陡峭地減少。當該脈衝ED升至該OED以上,則該TD凸脊繞射帶相比於該RD凸脊繞射之亮度的相對亮度會保持大約相同,但兩者皆會隨逐增的ED陡峭地減降。故測量該等繞射帶的亮度會提供一種有力的方法可判定ED是否高於或低於OED並且有多少。 As can be expected from the graphs of Figures 1 and 2, if the pulse ED falls below the OED, the relative brightness of the brightness of the TD ridge diffraction strip relative to the RD ridge diffraction strip will decrease with the decremented ED. Sharply reduced. When the pulse ED rises above the OED, the relative brightness of the TD ridge diffraction band will remain approximately the same as the brightness of the RD ridge diffraction, but both will be steeply reduced with increasing ED. drop. Therefore, measuring the brightness of the diffractive tapes provides a powerful way to determine if the ED is above or below the OED and how much.

圖6為一圖表乃示意地示出在一ELA製程中被25個重疊脈衝結晶化的矽層區域之RD凸脊繞射強度(實線)和 TD凸脊繞射強度(虛線)為脈衝ED之一函數。該等凸脊的強度未被直接地測量。而是,繞射帶強度之一測量值係依據該等帶具有不同色彩及色彩資訊係仍存在於該規則的顯微鏡影像中之觀察來被想出。 Figure 6 is a graph schematically showing the RD ridge diffraction intensity (solid line) of the 矽 layer region crystallized by 25 overlapping pulses in an ELA process. The TD ridge diffraction intensity (dashed line) is a function of the pulse ED. The strength of the ridges is not directly measured. Rather, one of the measurements of the intensity of the diffractive tape is derived from the observation that the bands have different color and color information that are still present in the regular microscope image.

一商業上可得的掃描場圖表編輯器會被用來決定該等偏振光影像之藍色和綠色波道的平均亮度,分別作為RD凸脊和TD凸脊的繞射之一測量值。此方法之一缺點係該影像色彩波道並未提供最佳化的過濾來看出該帶亮度,因此在該二種訊號之間會有一相當大的串擾。且該非繞射的中心點之訊號會疊加於此等色彩波道上,而使它們具有一較高的雜訊標度。即便如此,該差異清楚地示出一趨勢,即當該綠色波道亮度對該藍色波道亮度之比達到一最大值時,則該OED會被發現,如在圖6中的點狀曲線所示。 A commercially available field chart editor is used to determine the average brightness of the blue and green channels of the polarized image as one of the diffraction measurements of the RD ridge and the TD ridge, respectively. One disadvantage of this method is that the image color channel does not provide an optimized filter to see the band brightness, so there is a considerable crosstalk between the two signals. And the signal of the non-diffractive center point is superimposed on the color channels, so that they have a higher noise scale. Even so, the difference clearly shows a trend that when the ratio of the luminance of the green channel to the luminance of the blue channel reaches a maximum value, the OED is found, as in the dotted curve in FIG. Shown.

或者一以一CMOS陣列或CCD陣列記錄的錐光影像,類似於圖5的影像,可被使用適當的軟體電子式地處理,而來僅由該等繞射帶採集測量數據。此具有一優點即該測量值將會不敏感於該影像中的實際顏色和該等繞射光帶的繞射效率,因該空間資訊實質上係與此無干。該實際的繞射效率可為薄膜厚度和沈積參數之一函數。 Alternatively, a cone image recorded in a CMOS array or CCD array, similar to the image of Figure 5, can be processed electronically using appropriate software to collect measurement data from only the diffraction bands. This has the advantage that the measured value will not be sensitive to the actual color in the image and the diffraction efficiency of the diffracted strips, since the spatial information is essentially dry. This actual diffraction efficiency can be a function of film thickness and deposition parameters.

圖7為一圖表乃示意地示出RD凸脊繞射強度(實曲線)和TD凸脊繞射強度(虛曲線)為連續地輸送至一被結晶化層之相同區域的脈衝數目和脈衝ED之一函數。其中的趨勢係類似於圖3之圖表者。在各例中的三個ED值係為410mJ/cm2,415mJ/cm2及420mJ/cm2,即選擇以稍多於該ED 之1%的間隔。其可被看出在15個脈衝被沈積之後,該1%的ED變化會使訊號振幅提升至一約20%的變化。在大約22個脈衝時,該繞射訊號變化係仍在該ED變化的5%左右或較好為2%。此清楚地示出本發明方法的敏感性。 Figure 7 is a graph schematically showing the RD ridge diffraction intensity (solid curve) and the TD ridge diffraction intensity (dashed curve) as the number of pulses and the pulse ED continuously delivered to the same region of a crystallized layer. One of the functions. The trend among them is similar to the chart of Figure 3. The three ED values in each case were 410 mJ/cm 2 , 415 mJ/cm 2 and 420 mJ/cm 2 , i.e., an interval slightly larger than 1% of the ED was selected. It can be seen that after 15 pulses have been deposited, this 1% change in ED will increase the signal amplitude to a change of about 20%. At about 22 pulses, the diffracted signal change is still about 5% or preferably 2% of the ED change. This clearly shows the sensitivity of the method of the invention.

圖8示意地示出依據本發明之用以評估一結晶化矽層的裝置之一較佳實施例20。於此一被評估的結晶化矽層22係被支撐在一玻璃面板24上。一被設立來供科勒(kohler)照明的顯微鏡26包含一燈或光源28會發送一白光的射束29。一聚縮隔板30會提供用於該射束29之光錐的數值孔徑之控制。 Figure 8 is a schematic illustration of a preferred embodiment 20 of an apparatus for evaluating a layer of crystallization according to the present invention. The evaluated crystallization layer 22 is supported on a glass panel 24. A microscope 26 that is set up for Kohler illumination includes a light or source 28 that transmits a beam 29 of white light. A polycondensation barrier 30 provides control of the numerical aperture of the cone of light for the beam 29.

一部份反射且部份透射的光學元件32(一射束分裂器)會將射束29導至該層22上使其垂直入射於該層,如圖8中所示。該光束的一部份34會由該層32反射,且部份36T被繞射。該字尾T,若被用於此,意指該光係被該層結晶化時所形成的上述橫向(TD)凸脊繞射。圖8A示出裝置20在一垂直於圖8之平面的平面中,並示出光36R被該層結晶化時所形成的上述滾動方向(RD)凸脊繞射。 A partially reflective and partially transmissive optical element 32 (a beam splitter) directs the beam 29 onto the layer 22 such that it is incident perpendicularly to the layer, as shown in FIG. A portion 34 of the beam is reflected by the layer 32 and the portion 36T is diffracted. The suffix T, if used herein, means that the light system is diffracted by the lateral (TD) ridge formed by the crystallization of the layer. Figure 8A shows device 20 in a plane perpendicular to the plane of Figure 8 and showing the above-described rolling direction (RD) ridge diffraction formed when light 36R is crystallized by the layer.

該反射和繞射光會透射穿過元件32。該反射光會被一擋止物38阻擋。該繞射光會旁通繞過擋止物38,並入射在一檢測單元50中之一光檢測元件52上。一電子處理器54係被提供於檢測單元50中,且被安排成能決定被該檢測器接收的繞射光之振幅。 The reflected and diffracted light is transmitted through element 32. This reflected light is blocked by a stop 38. The diffracted light bypasses the stopper 38 and is incident on one of the photodetecting elements 52 in the detecting unit 50. An electronic processor 54 is provided in the detection unit 50 and is arranged to determine the amplitude of the diffracted light received by the detector.

檢測元件52可為一畫素運作的檢測器,譬如一CCD陣列或一CMOS陣列如前所述,而會記錄該繞射光之一 錐光影像(見圖7),由之該繞射光強度能被處理器54以空間分析來決定。或者,該檢測元件可為一或多個光電二極體元件而能記錄聚合的繞射光。就本例而言,選擇性的濾光元件39和40會被提供其具有通帶被選成對應於如前所述之該TD和RD繞射光的特定顏色。它們能被移入或移出該繞射光的路徑,如圖8中以箭號A所示。 The detecting component 52 can be a pixel operated detector, such as a CCD array or a CMOS array as described above, and one of the diffracted lights is recorded. The cone image (see Figure 7), by which the intensity of the diffracted light can be determined by the processor 54 in spatial analysis. Alternatively, the detection element can be one or more photodiode elements capable of recording the polymerized diffracted light. For the purposes of this example, the selective filter elements 39 and 40 will be provided with a passband selected to correspond to the particular color of the TD and RD diffracted light as previously described. They can be moved into or out of the path of the diffracted light, as indicated by arrow A in FIG.

在任一例中,另一光譜過濾器(未示出)可被提供用以將來自光源28之光的帶寬限制於該等被繞射的顏色。此將會減少由層22散射之光(未示出)所生的雜訊,該散射光係能夠旁通繞過擋止物38並與該繞射光混合。 In either case, another spectral filter (not shown) can be provided to limit the bandwidth of light from source 28 to the diffracted colors. This will reduce the noise generated by the light (not shown) scattered by the layer 22, which can bypass the bypass 38 and mix with the diffracted light.

在圖8和8A中顯微鏡26的光件包含用於光源28的收集透鏡光件,(無限校準的)物鏡光件,及管狀透鏡光件等未被示出,可供照明的方便。此外該顯微鏡可設有一伯特蘭(Bertrand)透鏡來直接觀看該錐光影像及”目鏡”(或接目鏡)。在一顯微鏡中之此等光件的形式和功能係公知於熟悉該光學技術者,且其之詳細描述對瞭解本發明的原理並不需要。 In Figures 8 and 8A, the light member of microscope 26 includes a collection lens light member for light source 28, an (infinitely calibrated) objective light member, and a tubular lens light member, etc., which are not shown for ease of illumination. In addition, the microscope can be equipped with a Bertrand lens to directly view the cone image and the "eyepiece" (or eyepiece). The form and function of such optical components in a microscope are well known to those skilled in the art, and a detailed description thereof is not required to understand the principles of the present invention.

可擇代於一反射光顯微鏡,一透射光顯微鏡亦可被使用。此一顯微鏡設計並沒有一射束分裂器,但在該樣品前方需要一分開的聚縮透鏡。為得最佳成果該射束擋止物38可被置於該物鏡的後焦點平面中,或其在該樣品之後的任何共軛平面中。就反射光顯微術而言,該射束檔止物最好係置於該物鏡的後焦點平面之一共軛平面中。其係位在該射束分裂器之後,俾免亦會阻擋該入射光。 It can be selected as a reflected light microscope, and a transmitted light microscope can also be used. This microscope design does not have a beam splitter, but a separate condenser lens is required in front of the sample. For best results, the beam stop 38 can be placed in the back focus plane of the objective, or in any conjugate plane after the sample. In the case of reflected light microscopy, the beam stop is preferably placed in a conjugate plane of the back focus plane of the objective. After being tied to the beam splitter, the forcing will also block the incident light.

應請瞭解來自凸脊的繞射亦可在沒有偏振器及/或一射束擋止物時被觀察。繞射光帶仍亦可以在該物鏡及/或該聚縮透鏡移除之後被觀察。故該等透鏡應可被視為一種工具,其能最佳化有關正被探測之該薄膜內的該區域之亮度和選擇性的測量值。它們並非於此所述之裝置的關鍵元件。 It should be noted that the diffraction from the ridges can also be observed without a polarizer and/or a beam stop. The diffractive light strip can still be observed after the objective lens and/or the polycondensation lens are removed. Such lenses should therefore be considered a tool that optimizes the measurement of the brightness and selectivity of the region within the film being detected. They are not a critical component of the device described herein.

圖9示意地示出依據本發明之一準分子雷射退火裝置之一較佳實施例60。裝置60包含一準分子雷射64會發送一雷射射束65。射束65會透射穿過一可變衰減器66至射束成形光件68,其會發送一成形射束69經由一旋轉鏡70至投射光件72。該投射光件會以非垂直入射角將該射束投射在該層22上,如前所述。包含該層22的玻璃面板24係被支撐在一平移台62上,其會相對於該投射的雷射束以一方向RD來移動該層和面板。 Figure 9 is a schematic illustration of a preferred embodiment 60 of an excimer laser annealing apparatus in accordance with the present invention. Device 60 includes a quasi-molecular laser 64 that transmits a laser beam 65. The beam 65 is transmitted through a variable attenuator 66 to the beam shaping optics 68, which sends a shaped beam 69 through a rotating mirror 70 to the projection optics 72. The projection light will project the beam onto the layer 22 at a non-normal incidence angle, as previously described. The glass panel 24 containing the layer 22 is supported on a translation stage 62 that moves the layer and panel in a direction RD relative to the projected laser beam.

上述的裝置20係置設在該層22上方。處理單元54會由被檢測元件52觀察到之該等TD凸脊繞射和RD凸脊繞射光分量的振幅,及一由實驗曲線譬如圖6和圖7之曲線造成的電子檢查表,來判定該層是否已被以高於或低於該OED的脈衝結晶化。 The device 20 described above is placed above the layer 22. The processing unit 54 determines the amplitudes of the TD ridge diffraction and the RD ridge diffracted light component observed by the detected component 52, and an electronic checklist caused by the experimental curve 譬 as shown in the curves of FIGS. 6 and 7. Whether the layer has been crystallized with a pulse above or below the OED.

典型地,該投射雷射束中的能量密度(脈衝能量或製程ED)最初係被控制在該標定的OED。但是,被發送的能量密度可能隨著時間移變,其通常係被記錄為該OED之一明顯移變。若該OED呈現已移變至一比標定者更低之值,則該ED將會低於該OED;在前述之該二方向將會有一 較低的凸脊密度;且因此,該兩種繞射訊號的振幅將會減小。嗣一訊號會被由處理單元54發送至衰減器66來減少輸送至該層的脈衝能量。若該OED呈現已移變至一比標定者更高之值,則該ED將會低於該瞬間的OED;相對於上述的TD凸脊將會有一較低的RD凸脊密度;且因此,該RD凸脊繞射振幅將會減小,而該TD繞射振幅會保持相同。嗣一訊號會被由處理單元54發送至衰減器66來適當地增加輸送至該層的脈衝能量。 Typically, the energy density (pulse energy or process ED) in the projected laser beam is initially controlled at the calibrated OED. However, the transmitted energy density may shift over time, which is typically recorded as one of the OED's significant shifts. If the OED has been shifted to a lower value than the calibrator, the ED will be lower than the OED; there will be one in the two directions mentioned above. The lower ridge density; and therefore, the amplitude of the two diffracted signals will decrease. The first signal will be sent by processing unit 54 to attenuator 66 to reduce the pulse energy delivered to the layer. If the OED appears to have shifted to a higher value than the calibrator, the ED will be lower than the OED of the instant; there will be a lower RD ridge density relative to the TD ridge described above; and, therefore, The RD ridge diffraction amplitude will decrease and the TD diffraction amplitude will remain the same. The first signal will be sent by the processing unit 54 to the attenuator 66 to appropriately increase the pulse energy delivered to the layer.

當然,上述的校正程序並不必定要使用圖9的反饋設置來自動地完成。擇代地,處理單元54可發送有關該OED明顯移變的資訊來對一操作者顯示在一監視器上,且該操作者能人工地調整輸送至該層22的脈衝能量。 Of course, the above calibration procedure does not have to be done automatically using the feedback settings of Figure 9. Alternatively, processing unit 54 may send information regarding significant shifting of the OED to display on an operator on a monitor, and the operator can manually adjust the pulse energy delivered to the layer 22.

圖10示意地示出依據本發明的準分子雷射退火裝置之另一較佳實施例60A。裝置60A係類似於圖9的裝置60,唯除該繞射測量裝置20係被一另擇的繞射測量裝置21所取代,其包含一方向性光源80譬如一雷射束82。來自該雷射的光係以非垂直入射角入射在層22上,如圖10中所示,而造成一反射光束82R和繞射光84。其將會是來自TD凸脊和RD凸脊的繞射光束,如前參照圖8和圖9之裝置20所述者。該反射光束82R會被擋止物38選擇地阻擋,且繞射光會被檢測元件52檢測,並能被處理單元54如前所述地處理,乃視檢測元件52的形式而定。 Figure 10 is a schematic illustration of another preferred embodiment 60A of an excimer laser annealing apparatus in accordance with the present invention. Device 60A is similar to device 60 of FIG. 9, except that the diffraction measuring device 20 is replaced by an alternative diffractive measuring device 21 that includes a directional light source 80, such as a laser beam 82. Light from the laser is incident on layer 22 at a non-normal incidence angle, as shown in FIG. 10, resulting in a reflected beam 82R and diffracted light 84. It will be a diffracted beam from the TD ridges and RD ridges as previously described with reference to apparatus 20 of Figures 8 and 9. The reflected beam 82R is selectively blocked by the stop 38 and the diffracted light is detected by the detecting element 52 and can be processed by the processing unit 54 as previously described, depending on the form of the detecting element 52.

故本發明的方法和裝置可被用來由一面板找出OED,包含多次掃描各在一不同的ED,例如具有分別為 10、5或甚至只2mJ/cm2的ED。一依據本發明的顯微鏡可被裝在雷射退火裝置之一退火腔室內。該顯微鏡可包含一變焦透鏡總成用以改變其放大率。該面板能在該顯微鏡底下被掃描,以容許該面板可在一或多個位置於同情況下被測量。該顯微鏡可被附加地設有一平枱能在橫向造成移動。一自動聚焦裝置可被附加,但對一錐光影像則不需要,因其具有一比該ELA製程更大的焦點深度。完全結晶化的面板亦能在一或多個位置被測量(在線上或離線),而來檢測該製程的品質,俾使其它面板的結晶化若是需要可被中止。若足夠的測量被完成,則一瑕疵(mura,即亮度不均之痕影)的地圖可被獲得。 Thus, the method and apparatus of the present invention can be used to find an OED from a panel comprising multiple scans each at a different ED, for example having an ED of 10, 5 or even 2 mJ/cm 2 respectively. A microscope in accordance with the present invention can be mounted in an annealing chamber of a laser annealing apparatus. The microscope can include a zoom lens assembly to vary its magnification. The panel can be scanned under the microscope to allow the panel to be measured in one or more locations under the same conditions. The microscope can additionally be provided with a platform that can cause movement in the lateral direction. An autofocus device can be attached, but not for a cone image because it has a greater depth of focus than the ELA process. Fully crystallized panels can also be measured at one or more locations (online or off-line) to detect the quality of the process so that crystallization of other panels can be aborted if desired. If sufficient measurements are completed, a map of mura (mura, the shadow of uneven brightness) can be obtained.

在本發明的上述實施例中,OED係由來自一樣品在二互相垂直方向之一或二者被繞射的光之所測出振幅來決定,例如於圖6中所示者。此方法之一潛在問題係所測得的振幅之變化會由於某些因ED變化以外的理由而發生。舉例而言,檢測部件的劣化會改變所測得的振幅。又,在一樣品上可能有些結晶化的空間變異,其可能會在用以標定同一結晶化ED之被測得的繞射振幅中造成空間變異。以下所述,參照圖11A和圖11B開始,係為一另擇的資料獲得和處理方法之一說明,其能減少,假使未全部消除,上述的潛在問題。 In the above embodiment of the invention, the OED is determined by the measured amplitude of light from a sample diffracted in one or both of the mutually perpendicular directions, such as shown in FIG. One of the potential problems with this approach is that the measured amplitude changes will occur for reasons other than ED changes. For example, degradation of the sensing component changes the measured amplitude. Also, there may be some spatial variation in crystallization on a sample that may cause spatial variability in the measured diffraction amplitude used to calibrate the same crystallized ED. The following description, with reference to Figures 11A and 11B, is an illustration of an alternative method of data acquisition and processing that can reduce, if not all, the aforementioned potential problems.

圖11A和11B係為以一透射的偏振化顯微鏡作成之結晶樣品的顯微圖。圖11A係由一以一低於OED的ED處理(照射)之矽層所作成。圖11B係由一以如同圖11的雷射束 片段,但在一高於OED的ED來處理之矽層所成。該顯微鏡物鏡是一1.25x物鏡。因為如此,該圖11A和11B的影像示出一比圖4中所示者更大的區域,其影像係以一10x物鏡所攝得,並比用以造成圖6和7的影像更大許多,它們係以一20x物鏡所攝得。 Figures 11A and 11B are micrographs of crystalline samples made with a transmissive polarization microscope. Figure 11A is made of a layer of germanium treated (irradiated) with an ED below the OED. Figure 11B is a laser beam as in Figure 11 The fragment is formed by a layer of ED that is processed above the OED. The microscope objective is a 1.25x objective. Because of this, the images of Figures 11A and 11B show a larger area than that shown in Figure 4, the images of which are taken with a 10x objective and are much larger than the images used to create Figures 6 and 7. They are taken with a 20x objective.

圖11A和11B之影像的水平尺寸係大約9mm。以此一大的場域,顯著的漸暈可以發生,且亮度會朝該影像的邊緣逐漸減降。軟體式的平場校正會被施用來校正它。該等影像會被使用一商業上可得的掃描場圖表過濾來獲得該綠色波道,但藍色的過濾影像或甚至未過濾的影像亦會具有類似外觀。或者,影像可被由一設有濾色器能例如僅濾出綠光或藍光的顯微鏡來獲得。沒有聚縮隔板被用於該顯微鏡照明。該等影像具有高亮度,且相機快門時間係小於100毫秒(ms)。 The horizontal dimensions of the images of Figures 11A and 11B are approximately 9 mm. With this large field, significant vignetting can occur and the brightness gradually decreases toward the edge of the image. A soft flat field correction is applied to correct it. The images will be filtered using a commercially available field map to obtain the green channel, but the blue filtered image or even the unfiltered image will have a similar appearance. Alternatively, the image can be obtained by a microscope provided with a color filter that can, for example, only filter out green or blue light. No polycondensation spacers were used for the microscope illumination. These images have high brightness and the camera shutter time is less than 100 milliseconds (ms).

該等影像係在被呈一90度相對旋轉之一偏振器和分析器阻擋之具有零級透射光的繞射光中作成。該偏振器和分析器相對於該樣品的旋轉係會使該等消光影由該繞射帶旋轉離開,如前所述。此會造成一顯微影像,其在該層中具有一高密度的凸脊來繞射該光之區域,與該層中具有一低密度的凸脊亦會繞射該光的區域之間具有非常高的對比。 The images are created in diffracted light with zero order transmitted light blocked by a polarizer and a analyzer that are rotated 90 degrees. The rotation of the polarizer and analyzer relative to the sample causes the extinction shadows to be rotated away from the diffraction belt, as previously described. This results in a microscopic image having a high density of ridges in the layer to circulate the region of light, with regions of the layer having a low density of ridges that also diffract the light. Very high contrast.

如前所述,凸脊密度之一差異會對應於波紋密度之一差異,且將會對應於晶粒結構中之一差異。因此,該等影像中的對比係表示該層中有一不均一性。此不均一性 一般稱為亮度不均痕影(mura)。於該等影像中的水平條紋係在該掃描(滾動)方向,且被稱為掃描痕影。掃描痕影通常會由於沿該雷射束的長軸之輕微ED變異而出現。此等ED變異會致生該製程窗之一局部偏移。緣是,低於和高於OED的掃描痕影對比會互相倒反。該等掃描痕影條紋的對比係被發現經長時間非常穩定,且通常只會由於一ELA系統中之射束輸送系統中的光件之重對準、污染或清楚的結果而改變。於該等影像中的垂直線係在該直線方向(該雷射束的長軸),且被稱為拍攝痕影。低於OED時,拍攝痕影大部份係由寬濶條紋組成,而高於OED時,附加地,顯明的條紋典型會被觀察到。 As previously mentioned, one difference in ridge density will correspond to one of the ripple densities and will correspond to one of the grain structures. Therefore, the contrast in the images indicates a heterogeneity in the layer. This heterogeneity Generally referred to as brightness unevenness (mura). The horizontal stripes in the images are in the scanning (scrolling) direction and are referred to as scanning marks. Scanning marks often occur due to slight ED variations along the long axis of the laser beam. These ED variations can cause a local offset of one of the process windows. The reason is that the scan marks below and above the OED will reverse each other. The contrast of these scan marks is found to be very stable over time and is typically only altered by realignment, contamination or clear results of the light components in the beam delivery system in an ELA system. The vertical lines in the images are in the direction of the line (the long axis of the laser beam) and are referred to as shot marks. Below OED, most of the shots are made up of wide-striped stripes, and above OED, additional, prominent stripes are typically observed.

該等水平和垂直線為本說明和所附申請專利範圍之目的可被描述為週期性的,但此不一定意指該週期性是規則的。且,該等水平和垂直等詞語係僅用來供方便描述互相垂直的線,而非表示實施時該等線之一實際的定向。 The horizontal and vertical lines may be described as periodic for the purposes of the description and the appended claims, but this does not necessarily mean that the periodicity is regular. Moreover, the terms such as horizontal and vertical are used merely for convenience of describing lines that are perpendicular to each other, and not to indicate the actual orientation of one of the lines when implemented.

圖12示意地示出影像畫素之直列和橫排的平均亮度如何能被採用作為一影像中之分別的拍攝痕影和掃描痕影之一測量值。此影像係在一類似於圖11B之影像的ED範圍內所攝。圖12中的圖表G2和G1乃示意地示出分別為該影像中之全部的畫素直列和全部的畫素橫排之測量振幅。其各別之一對比值能被決定,例如,藉由各別的最高測量值減去最低測量值,或藉採取一平均振幅附近的振幅變異之標準偏差。如前所述,在本例中的影像係使用一軟體式的綠色濾光器來作成。此會加強該掃描痕影的對比。 Figure 12 is a schematic illustration of how the average brightness of the inline and horizontal rows of image pixels can be used as one of the respective measured and scanned traces in an image. This image was taken in an ED range similar to the image of Figure 11B. The graphs G2 and G1 in Fig. 12 schematically show the measurement amplitudes of all the pixel in-line and all pixel cross-sections in the image, respectively. One of the individual contrast values can be determined, for example, by subtracting the lowest measured value from the respective highest measured value, or by taking the standard deviation of the amplitude variation near the average amplitude. As mentioned earlier, the image in this example was created using a soft green filter. This will enhance the contrast of the scan marks.

圖13為一圖表乃示意地示出得自例如圖12之影像的掃描痕影之測量對比(曲線A)為ED之一函數。此圖表係由被濾光來僅示出綠色波道的影像所獲得。亦被示意地示出來供比較的是,針對該偏振光顯微鏡影像之綠色波道亮度(曲線B)和藍色波道亮度(曲線C),類似於圖6的曲線,所測得的繞射光量值為ED之一函數;及曲線B之一計算斜率(曲線D)的絕對值。其可被看出該測量對比(曲線A)在一大約15mJ/cm2的ED(該OED)處呈現一非常明顯地界定的最小值。其亦可被看出該掃描痕影對比(曲線A)大致依循該計算斜率(曲線D)的形式,其亦在如同曲線A之最小值的ED處呈現一明顯界定的最小值。 Figure 13 is a graph schematically showing the measurement contrast (curve A) of the scan marks obtained from, for example, the image of Figure 12 as a function of ED. This chart is obtained from an image that is filtered to show only the green channel. Also shown schematically for comparison, the green channel luminance (curve B) and the blue channel luminance (curve C) for the polarized light microscope image are similar to the curve of FIG. The magnitude is a function of ED; and one of the curves B calculates the absolute value of the slope (curve D). It can be seen that this measurement contrast (curve A) presents a very clearly defined minimum at an ED of about 15 mJ/cm 2 (the OED). It can also be seen that the scan mark contrast (curve A) generally follows the form of the calculated slope (curve D), which also exhibits a clearly defined minimum at the ED as the minimum of curve A.

此係與該觀察相符,即該掃描痕影對比係大部份由該直線射束中的長軸能量密度變異所造成。依據該亮度曲線B所示的關係,此一能量密度變異係被預期會造成一亮度變化。故,掃描痕影對比之一測量值會產生有關於該ED曲線的斜率之資訊,且透過此關係,該實際的處理ED會相關於所需的ED或該OED。 This is consistent with this observation, that is, the scanning trace contrast is mostly caused by the long-axis energy density variation in the linear beam. According to the relationship shown by the brightness curve B, this energy density variation is expected to cause a change in brightness. Therefore, scanning one of the measured values of the scan will produce information about the slope of the ED curve, and by this relationship, the actual processing ED will be related to the desired ED or the OED.

圖14為一類似於圖13之圖表的圖表,乃示出相同於參照圖13於前所述的測量和計算量值等,但係針對使用微平滑化來結晶化之層。微平滑化是一種被用來減少該掃描痕影條紋之對比的技術。該技術的詳細說明對瞭解本發明的原理並非必要的,因此,乃不在此呈現。該平滑化技術係被詳細描述於No.7723169美國專利中,其被讓渡給本發明的受讓人,且其完整揭露內容併此附送。 Fig. 14 is a graph similar to the graph of Fig. 13 showing the measurement and calculation magnitudes and the like as described above with reference to Fig. 13, but for the layer crystallized using micro smoothing. Micro smoothing is a technique used to reduce the contrast of the scan marks. The detailed description of the technology is not essential to the understanding of the principles of the invention and, therefore, is not presented herein. The smoothing technique is described in detail in the U.S. Patent No. 7,723, 169 issued to the assignee of the present application, the entire disclosure of which is hereby incorporated.

比較圖13和圖14的曲線A可以看出,該測得的對比係比在未使用微平滑化的情況時更低,且該對比的最小值較不佳地界定。雖然如此,一掃描痕影對比可被測出,其會忠實地隨該亮度曲線的斜率增減,如可藉比較圖14的曲線A和D來看出。緣是,透過此關係,掃描痕影對比可被採用作為該實際處理ED相對於所需ED或該OED之一測量值,以供用於上述之該結晶化製程的監測和控制。 Comparing the curves A of Figures 13 and 14, it can be seen that the measured contrast is lower than in the case where micro smoothing is not used, and the minimum value of the contrast is less well defined. Nonetheless, a scan trace contrast can be measured, which faithfully increases or decreases with the slope of the luminance curve, as can be seen by comparing curves A and D of FIG. The edge is that, by this relationship, a scan mark contrast can be used as a measure of the actual processed ED relative to the desired ED or the OED for monitoring and control of the crystallization process described above.

於此應請瞭解,上述之用於對比測量的偏振化顯微影像即使當一面板上之一層正被ELA處理時亦可被採用。當ELA時,該面板會在該掃描方向移動,即是,與該等掃描痕影條紋完全相同的方向。因此,即使雖然該拍攝痕影對比可能會在一相機曝光期間受制於面板移動,但該掃描痕影對比將不會被影響。 It should be understood here that the polarized microscopic images described above for comparative measurements can be used even when one of the layers on one side of the board is being processed by ELA. When ELA, the panel moves in the scanning direction, that is, in exactly the same direction as the scanning traces. Therefore, even though the shot contrast may be subject to panel movement during a camera exposure, the scan trace contrast will not be affected.

掃描痕影對比係十分穩定但是會十分微弱。掃描痕影對比可藉將一光學缺陷例如一細金屬線審慎地引入該射束輸送系統中而被加強。此一光學缺陷將會在被處理的薄膜中造成一陰影及或繞射條紋。只要來自該光學缺陷的對比係不強烈,則其仍可為該亮度曲線的斜率之一測量值,並因而能被用來補償ED移變。被以該雷射束之此片段掃描的區域將會具有較低的一致性,且可能較好係將它定位於該面板上之一未被用於該顯示器主動矩陣的位置中。例如,其可被設在該面板的邊緣,或在顯示器面板嗣後會被刻劃並分開之一位置處。或者,掃描痕影對比會被藉該微平滑化的暫時停止來加強。又,其可能較好係將該受影 響的區域定位在被用於製造顯示器的區域之外。 Scanning trace contrast is very stable but very weak. Scanning trace contrast can be enhanced by introducing an optical defect, such as a thin metal wire, into the beam delivery system with care. This optical defect will cause a shadow and or a diffraction fringe in the film being processed. As long as the contrast from the optical defect is not strong, it can still be a measure of the slope of the brightness curve and can thus be used to compensate for the ED shift. The area scanned by this segment of the laser beam will have a lower consistency and may be better positioned to locate one of the panels that is not used for the active matrix of the display. For example, it can be placed at the edge of the panel or at a location that is scored and separated behind the display panel. Alternatively, the scan trace contrast will be enhanced by the temporary stop of the micro smoothing. Also, it may be better to take the picture The area of the ring is positioned outside of the area that is used to make the display.

於此應請瞭解雖本發明係參照評估ELA和A-ELA結晶化的矽層來被描述,但本發明亦可應用於評估其它半導體材料的結晶化層。舉例而言,鍺(Ge)或一鍺和矽的合金之層亦可被評估。 It should be understood that although the present invention has been described with reference to the evaluation of the crystallization layer of ELA and A-ELA crystallization, the present invention is also applicable to the evaluation of the crystallization layer of other semiconductor materials. For example, a layer of germanium (Ge) or an alloy of tantalum and niobium can also be evaluated.

概括而言,本發明係參照其較佳實施例被描述於上。但本發明並不限制於所描述及示出的實施例。而本發明係僅由後附的申請專利範圍來限制。 In general terms, the invention has been described above with reference to its preferred embodiments. However, the invention is not limited to the embodiments described and illustrated. The present invention is limited only by the scope of the appended claims.

20‧‧‧評估裝置 20‧‧‧Evaluation device

22‧‧‧結晶化矽層 22‧‧‧ Crystallized layer

24‧‧‧玻璃面板 24‧‧‧glass panel

26‧‧‧顯微鏡 26‧‧‧Microscope

28‧‧‧光源 28‧‧‧Light source

29‧‧‧射束 29‧‧‧beam

30‧‧‧聚縮隔板 30‧‧‧Poly partition

32‧‧‧光學元件 32‧‧‧Optical components

34‧‧‧反射光束部份 34‧‧‧Reflected beam part

36T‧‧‧繞射光束部份 36T‧‧‧Diffraction beam part

38‧‧‧擋止物 38‧‧‧stops

39,40‧‧‧濾光元件 39,40‧‧‧ Filter elements

50‧‧‧檢測單元 50‧‧‧Detection unit

52‧‧‧光檢測元件 52‧‧‧Light detection components

54‧‧‧電子處理器 54‧‧‧Electronic processor

Claims (7)

一種用以評估一藉曝露於多數個在該層上具有一能量密度的雷射輻射脈衝而至少部份結晶化的半導體層之方法,該結晶化會在該層上於一第一方向造成一第一組群的週期性表面特徴,及一第二組群的週期性特徴在一垂直於該第一方向的第二方向,該第一和第二組群的週期特徴之形式取決於該半導體層所被曝露的該等雷射輻射脈衝之能量密度,該方法包含:照明該結晶化半導體層之一區域;記錄來自該照明區域被該等第一和第二組群的週期性特徴繞射之光中的該照明區域之一顯微鏡影像,該紀錄的影像包含水平和垂直組群的週期性影像特徴對應於該層之該照明區域中之該第一和第二組群的週期性特徴;及由該等水平和垂直組群的週期性影像特徴之至少一者的對比之一測量值來決定該能量密度。 A method for evaluating a semiconductor layer that is at least partially crystallized by exposure to a plurality of laser radiation pulses having an energy density on the layer, the crystallization occurring on the layer in a first direction a periodic surface characteristic of the first group and a periodic characteristic of a second group in a second direction perpendicular to the first direction, the form of the periodic characteristics of the first and second groups being dependent on the semiconductor The energy density of the laser radiation pulses exposed by the layer, the method comprising: illuminating a region of the crystallized semiconductor layer; recording periodic characteristic diffraction from the illumination region by the first and second groups a microscope image of the illumination region in the light, the recorded image comprising periodic image features of the horizontal and vertical groups corresponding to periodic characteristics of the first and second groups of the illumination region of the layer; And determining the energy density from a comparison of at least one of the periodic image features of the horizontal and vertical groups. 如請求項1之方法,其中該顯微鏡影像係為一透射顯微鏡影像。 The method of claim 1, wherein the microscope image is a transmission microscope image. 如請求項1之方法,其中該顯微鏡影像係由多橫排和多直列的畫素所形成,且該對比係藉測量該影像中之畫素的全部橫排和全部直列之一者的振幅,並採用取自一平均振幅的標準偏差作為該等週期性影像特徴的對比之一測量值而來決定。 The method of claim 1, wherein the microscope image is formed by a plurality of horizontal rows and a plurality of in-line pixels, and the comparison is performed by measuring amplitudes of all of the horizontal and all inline of the pixels in the image. It is determined by taking the standard deviation from an average amplitude as one of the comparisons of the periodic image features. 如請求項1之方法,其中該顯微鏡影像為一透射顯微鏡影像,係由多橫排和多直列的畫素形成,且該對比係藉測量該影像中之畫素的全部橫排和全部直列之一者的振幅,並採用所測得的最高和最低振幅之差作為該等週期性影像特徴的對比之一測量值而來決定。 The method of claim 1, wherein the microscope image is a transmission microscope image formed by a plurality of horizontal rows and a plurality of in-line pixels, and the comparison is performed by measuring all horizontal and all in-line pixels of the pixels in the image. The amplitude of one is determined using the difference between the measured highest and lowest amplitudes as a measure of the contrast of the periodic image features. 如請求項1之方法,其中該影像為綠色濾光影像。 The method of claim 1, wherein the image is a green filtered image. 如請求項1之方法,其中該影像為一藍色濾光影像。 The method of claim 1, wherein the image is a blue filtered image. 如請求項1之方法,其中該測得對比之一最小值表示用於該結晶化之一最佳能量密度。 The method of claim 1, wherein the one of the measured contrasts represents an optimum energy density for the crystallization.
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Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TWI672493B (en) * 2018-03-07 2019-09-21 由田新技股份有限公司 An automatic optical inspection system and method to obtain mura defect from the panel

Families Citing this family (15)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US9425121B2 (en) 2013-09-11 2016-08-23 Taiwan Semiconductor Manufacturing Company, Ltd. Integrated fan-out structure with guiding trenches in buffer layer
US9455211B2 (en) 2013-09-11 2016-09-27 Taiwan Semiconductor Manufacturing Company, Ltd. Integrated fan-out structure with openings in buffer layer
CN106198568B (en) * 2015-05-24 2019-03-12 上海微电子装备(集团)股份有限公司 A kind of measuring device and measuring method of the film with transparent substrates
US9976969B1 (en) 2016-10-28 2018-05-22 Coherent Lasersystems Gmbh & Co. Kg Monitoring method and apparatus for excimer-laser annealing process
US10069273B1 (en) 2017-03-02 2018-09-04 Coherent Lasersystems Gmbh & Co. Kg Lasing-gas mixture for excimer laser
CN107421638B (en) * 2017-08-25 2019-09-06 西京学院 A kind of optical diffraction analogy method and its device
JP2019047058A (en) * 2017-09-06 2019-03-22 株式会社ブイ・テクノロジー Crystallization monitoring method, laser annealing apparatus, and laser annealing method
CN107677686B (en) * 2017-09-28 2021-01-26 京东方科技集团股份有限公司 Light transmission window integrated device and equipment adopting same
GB2571997B (en) 2018-03-16 2021-10-27 X Fab Texas Inc Use of wafer brightness to monitor laser anneal process and laser anneal tool
GB2587691B (en) * 2018-03-16 2022-02-09 X Fab Texas Inc Use of wafer brightness to monitor laser anneal process and laser anneal tool
US10832635B2 (en) * 2019-03-12 2020-11-10 Himax Display, Inc. Display apparatus having display panel and humidity detection method thereof and gamma curve calibration method thereof
CN110993491B (en) * 2019-12-19 2023-09-26 信利(仁寿)高端显示科技有限公司 Automatic correction method for OED (optical element design) in excimer laser annealing process
JP2022020938A (en) * 2020-07-21 2022-02-02 株式会社日本製鋼所 Laser annealer, laser annealing method, and manufacturing method of semiconductor device
KR20220022016A (en) * 2020-08-14 2022-02-23 삼성디스플레이 주식회사 Apparatus and method for manufacturing a display device
US20220359197A1 (en) 2021-05-06 2022-11-10 Coherent Lasersystems Gmbh & Co. Kg Method and apparatus for laser annealing

Family Cites Families (37)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS60263642A (en) * 1984-06-12 1985-12-27 Nippon Seiko Kk Automatic original pattern reader
US4806018A (en) 1987-07-06 1989-02-21 The Boeing Company Angular reflectance sensor
US4810047A (en) 1988-02-16 1989-03-07 Grumman Aerospace Corporation In-line holographic lens arrangement
US5432607A (en) 1993-02-22 1995-07-11 International Business Machines Corporation Method and apparatus for inspecting patterned thin films using diffracted beam ellipsometry
US5473426A (en) 1993-03-05 1995-12-05 Nikon Corporation Defect inspection apparatus
JP3342387B2 (en) 1997-02-28 2002-11-05 三洋電機株式会社 Semiconductor film evaluation method, evaluation apparatus and formation method
JP2001110861A (en) 1999-10-06 2001-04-20 Seiko Epson Corp Check method and device of semiconductor film, and manufacturing method of thin film transistor
WO2001061734A1 (en) 2000-02-15 2001-08-23 Matsushita Electric Industrial Co., Ltd. Non-single crystal film, substrate with non-single crystal film, method and apparatus for producing the same, method and apparatus for inspecting the same, thin film transistor, thin film transistor array and image display using it
US6429943B1 (en) 2000-03-29 2002-08-06 Therma-Wave, Inc. Critical dimension analysis with simultaneous multiple angle of incidence measurements
US6864971B2 (en) 2001-03-27 2005-03-08 Isoa, Inc. System and method for performing optical inspection utilizing diffracted light
US6639201B2 (en) * 2001-11-07 2003-10-28 Applied Materials, Inc. Spot grid array imaging system
JP3794482B2 (en) 2002-04-19 2006-07-05 株式会社日本製鋼所 Method and apparatus for evaluating crystallized Si film
US7359045B2 (en) 2002-05-06 2008-04-15 Applied Materials, Israel, Ltd. High speed laser scanning inspection system
WO2004017382A2 (en) 2002-08-19 2004-02-26 The Trustees Of Columbia University In The City Of New York Process and system for laser crystallization processing of film regions on a substrate to provide substantial uniformity within areas in such regions and edge areas thereof, and a structure of such film regions
JP4024657B2 (en) 2002-11-21 2007-12-19 株式会社日本製鋼所 Method and apparatus for forming periodic structure of crystal
US7006224B2 (en) * 2002-12-30 2006-02-28 Applied Materials, Israel, Ltd. Method and system for optical inspection of an object
JP4463600B2 (en) * 2003-03-26 2010-05-19 株式会社半導体エネルギー研究所 Evaluation methods
TWI254792B (en) 2003-07-01 2006-05-11 Au Optronics Corp Detecting method and device of laser crystalline silicon
US7061623B2 (en) 2003-08-25 2006-06-13 Spectel Research Corporation Interferometric back focal plane scatterometry with Koehler illumination
JP2005191173A (en) 2003-12-25 2005-07-14 Hitachi Ltd Display and its manufacturing method
WO2005086211A1 (en) 2004-03-04 2005-09-15 Sharp Kabushiki Kaisha Method for fabricating a semiconductor device and apparatus for inspecting a semiconductor
JP4537131B2 (en) * 2004-06-30 2010-09-01 友達光電股▲ふん▼有限公司 Laser crystal silicon inspection method and apparatus
US7247813B2 (en) 2004-10-13 2007-07-24 Advanced Lcd Technologies Development Center Co., Ltd. Crystallization apparatus using pulsed laser beam
US7515253B2 (en) 2005-01-12 2009-04-07 Kla-Tencor Technologies Corporation System for measuring a sample with a layer containing a periodic diffracting structure
US7723169B2 (en) 2006-02-22 2010-05-25 Coherent, Inc. Laser beam micro-smoothing
JP4946093B2 (en) * 2006-03-01 2012-06-06 ソニー株式会社 Laser beam energy determination method for laser annealing apparatus, laser beam energy determination apparatus for laser annealing apparatus, laser annealing apparatus, and thin film transistor manufacturing method
JP4876019B2 (en) 2007-04-25 2012-02-15 株式会社日立ハイテクノロジーズ Defect inspection apparatus and method
US7659989B2 (en) 2007-06-29 2010-02-09 Coherent, Inc. Focus determination for laser-mask imaging systems
JP2009065146A (en) * 2007-08-15 2009-03-26 Sony Corp Method of forming semiconductor thin film, and inspection device for the semiconductor thin film
FR2921012A1 (en) 2007-09-13 2009-03-20 Advanced Track And Trace Sa Surface marking method for e.g. document, involves determining image representing information, and marking surface with polarized laser beam to form oriented nanostructures representing image on surface
JP4618360B2 (en) 2008-10-10 2011-01-26 ソニー株式会社 Laser annealing method and laser annealing apparatus
JP5430488B2 (en) * 2010-05-11 2014-02-26 株式会社日本製鋼所 Laser annealing processing apparatus, laser annealing processing body manufacturing method, and laser annealing processing program
JP2012015445A (en) * 2010-07-05 2012-01-19 Japan Steel Works Ltd:The Laser anneal processing unit and laser anneal processing method
KR101490830B1 (en) * 2011-02-23 2015-02-06 가부시끼가이샤 니혼 세이꼬쇼 Thin film obverse face inspection method and inspection device
JP2013258181A (en) 2012-06-11 2013-12-26 Hitachi High-Technologies Corp Polycrystalline silicon film inspecting method and device therefor
US20130341310A1 (en) 2012-06-22 2013-12-26 Coherent Lasersystems Gmbh & Co. Kg Monitoring method and apparatus for excimer laser annealing process
JP6096228B2 (en) * 2015-01-09 2017-03-15 株式会社日本製鋼所 Semiconductor film surface unevenness detection apparatus, laser annealing apparatus, and semiconductor film surface unevenness detection method

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TWI672493B (en) * 2018-03-07 2019-09-21 由田新技股份有限公司 An automatic optical inspection system and method to obtain mura defect from the panel

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