TW201536125A - Printed circuit board - Google Patents
Printed circuit board Download PDFInfo
- Publication number
- TW201536125A TW201536125A TW103102651A TW103102651A TW201536125A TW 201536125 A TW201536125 A TW 201536125A TW 103102651 A TW103102651 A TW 103102651A TW 103102651 A TW103102651 A TW 103102651A TW 201536125 A TW201536125 A TW 201536125A
- Authority
- TW
- Taiwan
- Prior art keywords
- signal
- circuit board
- printed circuit
- receiving unit
- matching capacitor
- Prior art date
Links
- 239000003990 capacitor Substances 0.000 claims abstract description 28
- 230000003071 parasitic effect Effects 0.000 claims abstract description 20
- 230000005540 biological transmission Effects 0.000 claims description 17
- 230000008054 signal transmission Effects 0.000 abstract description 4
- 230000000694 effects Effects 0.000 description 2
- 238000010586 diagram Methods 0.000 description 1
- 239000012535 impurity Substances 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/0213—Electrical arrangements not otherwise provided for
- H05K1/0216—Reduction of cross-talk, noise or electromagnetic interference
- H05K1/023—Reduction of cross-talk, noise or electromagnetic interference using auxiliary mounted passive components or auxiliary substances
- H05K1/0231—Capacitors or dielectric substances
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/0213—Electrical arrangements not otherwise provided for
- H05K1/0216—Reduction of cross-talk, noise or electromagnetic interference
- H05K1/023—Reduction of cross-talk, noise or electromagnetic interference using auxiliary mounted passive components or auxiliary substances
- H05K1/0233—Filters, inductors or a magnetic substance
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
- H05K2201/10007—Types of components
- H05K2201/10015—Non-printed capacitor
Landscapes
- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Physics & Mathematics (AREA)
- Electromagnetism (AREA)
- Production Of Multi-Layered Print Wiring Board (AREA)
- Structure Of Printed Boards (AREA)
Abstract
Description
本發明涉及一種印刷電路板，尤其涉及一種抑制過孔干擾的印刷電路板。 The present invention relates to a printed circuit board, and more particularly to a printed circuit board that suppresses interference from via holes.
隨著數位通訊速度的提高，大多數電子裝置，如電腦、行動電話、個人數位產品等都在以較高的資料傳輸速率運行，而訊號的完整性對於資料的傳輸至關重要。誤差向量幅度(Error Vector Magnitude，EVM)用於衡量訊號完整性的好壞，是指在一個給定時刻理想無誤差基準訊號與實際發射訊號的向量差。 As digital communication speeds increase, most electronic devices, such as computers, mobile phones, and personal digital products, operate at higher data rates, and the integrity of the signals is critical to the transmission of data. Error Vector Magnitude (EVM) is used to measure the integrity of a signal. It refers to the vector difference between the ideal error-free reference signal and the actual transmitted signal at a given time.
隨著電路複雜程度的提高，電子裝置的印刷電路板(Printed Circuit Board，PCB)設置有多層，為了連通各層之間的印製導線，在各層設置有過孔。但是高頻訊號線在走過孔時，過孔會產生寄生電感，從而對訊號完整性帶來負面效應。 As the complexity of the circuit increases, the printed circuit board (PCB) of the electronic device is provided with a plurality of layers, and in order to connect the printed wiring between the layers, via holes are provided in each layer. However, when the high-frequency signal line passes through the hole, the via hole generates parasitic inductance, which has a negative effect on signal integrity.
鑒於以上內容，有必要提供一種抑制過孔干擾的印刷電路板。 In view of the above, it is necessary to provide a printed circuit board that suppresses via interference.
一種印刷電路板，其包括若干層、連通層與層之間的過孔、訊號發送單元、訊號接收單元及匹配電容，所述訊號發送單元與訊號接收單元設置在不同的層，該訊號發送單元經由過孔傳輸訊號到訊號接收單元，該匹配電容一端接地，另一端電性連接至該過孔，該匹配電容與該過孔固有的接地寄生電感並聯從而構成一帶通濾波電路。 A printed circuit board comprising a plurality of layers, a via between the communication layer and the layer, a signal transmitting unit, a signal receiving unit and a matching capacitor, wherein the signal transmitting unit and the signal receiving unit are disposed at different layers, and the signal sending unit The matching capacitor transmits a signal to the signal receiving unit, and the matching capacitor is grounded at one end, and the other end is electrically connected to the via hole. The matching capacitor is connected in parallel with the grounding parasitic inductance inherent to the via hole to form a band pass filter circuit.
上述的印刷電路板藉由新增一與過孔的寄生電感並聯的匹配電容，使得該匹配電容與寄生電感組成帶通濾波電路，起到抑制干擾的作 用，從而消除了過孔寄生電感對訊號傳輸的影響。 The above printed circuit board is formed by adding a matching capacitor in parallel with the parasitic inductance of the via hole, so that the matching capacitor and the parasitic inductance form a band-pass filter circuit to suppress interference. Used to eliminate the influence of via parasitic inductance on signal transmission.
100‧‧‧印刷電路板 100‧‧‧Printed circuit board
10‧‧‧過孔 10‧‧‧through hole
20‧‧‧傳輸線 20‧‧‧ transmission line
30‧‧‧訊號發送單元 30‧‧‧Signal sending unit
40‧‧‧訊號接收單元 40‧‧‧Signal receiving unit
C1‧‧‧濾波電容 C1‧‧‧Filter Capacitor
C2‧‧‧匹配電容 C2‧‧‧matching capacitor
L‧‧‧寄生電感 L‧‧‧Parasitic inductance
F1‧‧‧第一層 F1‧‧‧ first floor
F2‧‧‧第二層 F2‧‧‧ second floor
F3‧‧‧第三層 F3‧‧‧ third floor
圖1是本發明較佳實施例的印刷電路板的示意圖。 BRIEF DESCRIPTION OF THE DRAWINGS Figure 1 is a schematic illustration of a printed circuit board in accordance with a preferred embodiment of the present invention.
圖2為圖1所述印刷電路板的等效電路圖。 2 is an equivalent circuit diagram of the printed circuit board of FIG. 1.
請參閱圖1及圖2，本發明的較佳實施例提供一種印刷電路板100，在本實施方式中，該印刷電路板100為三層。該印刷電路板100包括第一層F1、第二層F2、第三層F3、過孔10及傳輸線20。所述第一層F1、第二層F2及第三層F3上設置有傳輸線20，各層之間的傳輸線20藉由過孔10連通。可以理解，印刷電路板100的層數並不局限於三層。 Referring to FIG. 1 and FIG. 2, a preferred embodiment of the present invention provides a printed circuit board 100. In the present embodiment, the printed circuit board 100 has three layers. The printed circuit board 100 includes a first layer F1, a second layer F2, a third layer F3, a via 10, and a transmission line 20. Transmission lines 20 are disposed on the first layer F1, the second layer F2, and the third layer F3, and the transmission lines 20 between the layers are connected by the vias 10. It can be understood that the number of layers of the printed circuit board 100 is not limited to three layers.
請參閱圖2，該印刷電路板100的層與層之間傳輸訊號時，由一層(例如第一層F1)的訊號發送單元30輸出的訊號經由傳輸線20連接至過孔10，再經由過孔10傳輸至另一層(例如第三層F3)的傳輸線20，最後經傳輸線20及一濾波電容C1到達訊號接收單元40。 Referring to FIG. 2, when the signal is transmitted between the layers of the printed circuit board 100, the signal outputted by the signal transmitting unit 30 of one layer (for example, the first layer F1) is connected to the via 10 via the transmission line 20, and then via the via hole. 10 is transmitted to the transmission line 20 of another layer (for example, the third layer F3), and finally reaches the signal receiving unit 40 via the transmission line 20 and a filter capacitor C1.
該過孔10存在一個對地的寄生電感L，使得訊號在傳輸過程中受到干擾，影響訊號的品質。本發明藉由新增一匹配電容C2，該匹配電容C2與寄生電感L並聯，使得寄生電感L和匹配電容C2組成帶通濾波電路，起到抑制干擾的作用。該匹配電容C2一端接地，另一端電性連接至該過孔10。 The via 10 has a parasitic inductance L to the ground, so that the signal is interfered during transmission, which affects the quality of the signal. The invention adds a matching capacitor C2, and the matching capacitor C2 is connected in parallel with the parasitic inductance L, so that the parasitic inductance L and the matching capacitor C2 form a band-pass filter circuit, which acts to suppress interference. The matching capacitor C2 is grounded at one end and electrically connected to the via 10 at the other end.
在本實施方式中，該傳輸線20上的訊號為WIFI的發射訊號，該寄生電感L的電感值為0.1nH，該濾波電容C1的電容值為33pF，該匹配電容C2的電容值為1pF，該傳輸線20的阻抗為50Ω。 In this embodiment, the signal on the transmission line 20 is a WIFI transmission signal, the inductance of the parasitic inductance L is 0.1 nH, the capacitance of the filter capacitor C1 is 33 pF, and the capacitance of the matching capacitor C2 is 1 pF. The impedance of the transmission line 20 is 50 Ω.
下面進一步說明該印刷電路板100的工作原理。 The operation of the printed circuit board 100 is further explained below.
印刷電路板100的一層中的訊號發送單元30輸出的訊號藉由傳輸線20，再經由過孔10傳輸至另一層的傳輸線20，最後經傳輸線20及一濾波電容C1到達訊號接收單元40。由於匹配電容C2與過孔10的寄生電感L並聯，使得該匹配電容C2與寄生電感L組成帶通濾波電路，起到抑制干擾的作用，從而消除了過孔10由於寄生電感L帶來的雜訊訊號對訊號傳輸的影響。 The signal output from the signal transmitting unit 30 in one layer of the printed circuit board 100 is transmitted to the transmission line 20 of the other layer via the transmission line 20, and finally reaches the signal receiving unit 40 via the transmission line 20 and a filter capacitor C1. Since the matching capacitor C2 is connected in parallel with the parasitic inductance L of the via 10, the matching capacitor C2 and the parasitic inductance L form a band-pass filter circuit to suppress interference, thereby eliminating the impurity of the via 10 due to the parasitic inductance L. The impact of the signal number on signal transmission.
本發明的印刷電路板100藉由新增一與過孔10的寄生電感L並聯的匹配電容C2，使得該匹配電容C2與寄生電感L組成帶通濾波電路，起到抑制干擾的作用，從而消除了過孔10寄生電感L對訊號傳輸的影響。 The printed circuit board 100 of the present invention adds a matching capacitor C2 in parallel with the parasitic inductance L of the via 10, so that the matching capacitor C2 and the parasitic inductance L form a band-pass filter circuit, thereby suppressing interference, thereby eliminating The effect of the parasitic inductance L of the via 10 on the signal transmission.
綜上所述，本發明符合發明專利要件，爰依法提出專利申請。惟，以上所述者僅為本發明之較佳實施例，本發明之範圍並不以上述實施例為限，舉凡熟悉本案技藝之人士援依本發明之精神所作之等效修飾或變化，皆應涵蓋於以下申請專利範圍內。 In summary, the present invention complies with the requirements of the invention patent and submits a patent application according to law. The above is only the preferred embodiment of the present invention, and the scope of the present invention is not limited to the above-described embodiments, and equivalent modifications or variations made by those skilled in the art in light of the spirit of the present invention are It should be covered by the following patent application.
100‧‧‧印刷電路板 100‧‧‧Printed circuit board
20‧‧‧傳輸線 20‧‧‧ transmission line
30‧‧‧訊號發送單元 30‧‧‧Signal sending unit
40‧‧‧訊號接收單元 40‧‧‧Signal receiving unit
C1‧‧‧濾波電容 C1‧‧‧Filter Capacitor
C2‧‧‧匹配電容 C2‧‧‧matching capacitor
L‧‧‧寄生電感 L‧‧‧Parasitic inductance
Claims (3)
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201310694061.8A CN104735908A (en) | 2013-12-18 | 2013-12-18 | Printed circuit board |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| TW201536125A true TW201536125A (en) | 2015-09-16 |
Family
ID=53370223
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| TW103102651A TW201536125A (en) | 2013-12-18 | 2014-01-24 | Printed circuit board |
Country Status (3)
| Country | Link |
|---|---|
| US (1) | US20150173174A1 (en) |
| CN (1) | CN104735908A (en) |
| TW (1) | TW201536125A (en) |
Families Citing this family (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN110268627B (en) * | 2017-02-10 | 2023-06-30 | 松下知识产权经营株式会社 | Multilayer substrate filter |
| US11564339B2 (en) * | 2017-04-11 | 2023-01-24 | Enraf-Nonius B.V. | Electrical device comprising filter and feedthrough capacitor |
| CN108601201B (en) * | 2018-04-11 | 2019-09-27 | Oppo广东移动通信有限公司 | Flexible circuit board and electronic device |
| CN111465182B (en) * | 2020-03-26 | 2023-03-24 | 重庆思睿创瓷电科技有限公司 | Filter assembling method |
| CN111224317B (en) * | 2020-04-20 | 2021-03-19 | 深圳市汇顶科技股份有限公司 | Laser emitting device |
| CN112636578B (en) * | 2020-12-03 | 2022-06-21 | 佛山市顺德区美的电子科技有限公司 | PFC circuit and noise reduction circuit |
Family Cites Families (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2002368553A (en) * | 2001-06-08 | 2002-12-20 | Mitsubishi Electric Corp | High frequency amplifier and radio transmitter using the same |
| US7076216B2 (en) * | 2002-09-17 | 2006-07-11 | Hitachi Metals, Ltd. | High-frequency device, high-frequency module and communications device comprising them |
| TWI287958B (en) * | 2005-07-15 | 2007-10-01 | Hon Hai Prec Ind Co Ltd | Printed circuit board having improved vias |
| US7757196B2 (en) * | 2007-04-04 | 2010-07-13 | Cisco Technology, Inc. | Optimizing application specific integrated circuit pinouts for high density interconnect printed circuit boards |
| CN101640519B (en) * | 2009-09-02 | 2012-04-25 | 南京理工大学 | High stop-band inhibiting multi-zero 2.4 GHz mini filter |
| JP5804076B2 (en) * | 2011-11-08 | 2015-11-04 | 株式会社村田製作所 | LC filter circuit and high frequency module |
-
2013
- 2013-12-18 CN CN201310694061.8A patent/CN104735908A/en active Pending
-
2014
- 2014-01-24 TW TW103102651A patent/TW201536125A/en unknown
- 2014-12-15 US US14/569,986 patent/US20150173174A1/en not_active Abandoned
Also Published As
| Publication number | Publication date |
|---|---|
| US20150173174A1 (en) | 2015-06-18 |
| CN104735908A (en) | 2015-06-24 |
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