TW201533438A - Focusing method for automated photo test equipment - Google Patents

Focusing method for automated photo test equipment Download PDF

Info

Publication number
TW201533438A
TW201533438A TW103105916A TW103105916A TW201533438A TW 201533438 A TW201533438 A TW 201533438A TW 103105916 A TW103105916 A TW 103105916A TW 103105916 A TW103105916 A TW 103105916A TW 201533438 A TW201533438 A TW 201533438A
Authority
TW
Taiwan
Prior art keywords
tested
image
focus
focusing
candidate
Prior art date
Application number
TW103105916A
Other languages
Chinese (zh)
Inventor
Ming-Kai Hsueh
Wen-Chi Lo
Hsin-Yang Tsai
Chun-Hao Kao
Original Assignee
Chroma Ate Inc
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Chroma Ate Inc filed Critical Chroma Ate Inc
Priority to TW103105916A priority Critical patent/TW201533438A/en
Publication of TW201533438A publication Critical patent/TW201533438A/en

Links

Abstract

A focusing method is disclosed. The disclosed method comprise determines a plurality of candidate focusing length according to a focus length corresponding to a first device under test (DUT) among a plurality of DUTs, capturing a plurality of candidate focusing images corresponding to a second DUT next to the first DUT with the plurality of candidate focusing length, and selecting a candidate focusing image with the highest clarity value among the plurality of candidate focusing images as a base image of the second DUT to perform an examination process in advance.

Description

自動光學檢測裝置的對焦方法 Focusing method of automatic optical detecting device

本揭露係關於一種自動光學檢測裝置的對焦方法,特別關於一種自動光學檢測裝置可快速對多個待測物對焦的方法。 The present disclosure relates to a focusing method for an automatic optical detecting device, and more particularly to a method for an automatic optical detecting device to quickly focus on a plurality of objects to be tested.

在積體電路相關的領域中,自動測試是一個重要的環節。自動測試是用來判斷一個積體電路晶片的功能是否正常的流程。而對於具有光學鏡頭的積體電路更必須要判斷其光學鏡頭是否有瑕疵。 In the field related to integrated circuits, automatic testing is an important part. The automatic test is a process for judging whether or not the function of an integrated circuit chip is normal. For an integrated circuit with an optical lens, it is necessary to judge whether or not the optical lens is flawed.

在決定一個積體電路晶片的光學鏡頭是否有瑕疵,可以擷取此光學鏡頭的影像,以這個影像來判斷鏡頭內是否有刮痕或汙點等瑕疵。而要用影像來判斷鏡頭內是否有瑕疵,必須要取得足夠清晰的影像。因此,如何快速對大量待測物進行對焦,是光學自動測試中待解決的問題。 In determining whether an optical lens of an integrated circuit chip is flawed, an image of the optical lens can be captured, and the image is used to determine whether there is a scratch or a stain in the lens. To use images to determine if there are flaws in the lens, you must obtain a sufficiently clear image. Therefore, how to quickly focus on a large number of objects to be tested is a problem to be solved in optical automatic testing.

有鑑於以上的問題,本揭露提出一種自動光學檢測裝置的對焦方法,此對焦方法在對一個托盤上的一個待測物對焦時,依據托盤上相鄰於此待測物的另外一個或多個待測物的對焦 距離,來決定此待測物的對焦距離。由於托盤上相鄰的待測物的對焦距離差異不大,因此利用此方法可以快速地對多個待測物對焦,從而減少檢測所需花費的時間。 In view of the above problems, the present disclosure proposes a focusing method of an automatic optical detecting device, which focuses on one object or more adjacent to the object to be tested on the tray when focusing on one object to be tested on one tray Focus of the object to be tested Distance, to determine the focus distance of this object to be tested. Since the difference in focusing distance of adjacent objects to be tested on the tray is not large, this method can quickly focus on a plurality of objects to be tested, thereby reducing the time required for detection.

依據本發明一個或多個實施例所實現的一種自動光學檢測裝置的對焦方法,適於對一個托盤上的多個待測物(device under test,DUT)對焦,此對焦方法包含依據前述多個待測物中第一待測物所對應的對焦距離決定多個待選距離,第一待測物相鄰於第二待測物。以前述多個待選距離對第二待測物擷取對應的多個待選影像,並從這些待選影像中,選擇清晰度最高的作為第二待測物的檢測影像,以進行進一步的檢測程序。 A focusing method of an automatic optical detecting device according to one or more embodiments of the present invention is adapted to focus on a plurality of device under test (DUT) on a tray, the focusing method comprising The focusing distance corresponding to the first object to be tested determines a plurality of candidate distances, and the first object to be tested is adjacent to the second object to be tested. Extracting a plurality of to-be-selected images corresponding to the second object to be tested by using the plurality of to-be-selected distances, and selecting, from the candidate images, the detection image of the second object to be tested with the highest definition for further imaging Test procedure.

依據本發明一個或多個實施例所實現的另一種自動光學檢測裝置的對焦方法,適於對一個托盤上的多個待測物(device under test,DUT)對焦,此對焦方法包含依據前述多個待測物中第一待測物所對應的對焦距離決定第二待測物的第一待選距離與第二待選距離,其中第一待測物相鄰於第二待測物。以第一待選距離對第二待測物擷取第一待選影像。以第二待選距離對第二待測物擷取第二待選影像。比較第一待選影像的清晰度與第二待選影像的清晰度,以決定第三待選距離相對於第一待選距離或第二待選距離的關係。以第三待選距離對第二待測物擷取第三待選影像,並至少依據第一待選影像、第二待選影像與第三待選影像,決定第二待測物的檢測影像,以對第二待測物執行檢測程序。 Another focusing method of an automatic optical detecting device implemented according to one or more embodiments of the present invention is adapted to focus on a plurality of device under test (DUT) on a tray, the focusing method comprising according to the foregoing The focusing distance corresponding to the first object to be tested determines a first candidate distance and a second candidate distance of the second object to be tested, wherein the first object to be tested is adjacent to the second object to be tested. The first candidate image is captured on the second object to be tested by the first candidate distance. Taking a second candidate image for the second object to be tested by the second candidate distance. Comparing the sharpness of the first candidate image with the sharpness of the second candidate image to determine a relationship of the third candidate distance with respect to the first candidate distance or the second candidate distance. Determining a third candidate image for the second object to be tested by using the third candidate distance, and determining the detection image of the second object to be tested according to at least the first candidate image, the second candidate image, and the third candidate image To perform a detection procedure on the second object to be tested.

依據本發明的自動光學檢測裝置的對焦方法,依據 相鄰且已經完成對焦的待測物的對焦資訊,來決定當前的待測物可能的對焦距離,並且可以更進一步依據多個待測物來判斷對焦距離的變化趨勢,並且可以更進一步依據對同一個待測物的連續兩張待選影像來決定進一步的對焦方向,整體而言可以大幅度減少對焦所需花費的時間,因此可以提高光學自動測試的效率。 The focusing method of the automatic optical detecting device according to the present invention is based on The focus information of the object to be tested that is adjacent to the focus is determined to determine the possible focus distance of the current object to be tested, and the change trend of the focus distance may be further determined according to the plurality of objects to be tested, and may further be based on Two consecutive images of the same object to be tested determine the further focus direction, and the overall time required for focusing can be greatly reduced, thereby improving the efficiency of optical automatic testing.

以上之關於本揭露內容之說明及以下之實施方式之說明係用以示範與解釋本發明之精神與原理,並且提供本發明之專利申請範圍更進一步之解釋。 The above description of the disclosure and the following description of the embodiments of the present invention are intended to illustrate and explain the spirit and principles of the invention, and to provide further explanation of the scope of the invention.

1‧‧‧檢測裝置 1‧‧‧Detection device

11‧‧‧儲存模組 11‧‧‧ Storage Module

13‧‧‧影像擷取模組 13‧‧‧Image capture module

15‧‧‧處理模組 15‧‧‧Processing module

17‧‧‧檢測模組 17‧‧‧Test module

19‧‧‧托盤 19‧‧‧Tray

20、30、40‧‧‧待測物 20, 30, 40‧‧‧ Test objects

21、31、41‧‧‧對焦參考面 21, 31, 41‧‧ ‧ focus reference surface

23、33、43‧‧‧待測部位 23, 33, 43‧‧‧ parts to be tested

402‧‧‧預設圖樣 402‧‧‧Preset pattern

406‧‧‧瑕疵影像 406‧‧‧瑕疵 image

f1~f13‧‧‧待選對焦平面 f 1 ~f 13 ‧‧‧Selected focus plane

C20、C30‧‧‧清晰度分佈曲線 C 20 , C 30 ‧‧‧ sharpness distribution curve

d1‧‧‧位移參數 d 1 ‧‧‧displacement parameters

第1圖係依據本發明一實施例中的方法所實現的檢測裝置功能方塊圖。 1 is a functional block diagram of a detecting device implemented in accordance with a method in an embodiment of the present invention.

第2圖係依據本發明一實施例中的方法所實現的檢測裝置操作示意圖。 Figure 2 is a schematic diagram of the operation of the detecting device implemented in accordance with the method in an embodiment of the present invention.

第3圖係依據本發明一實施例的清晰度分佈圖。 Figure 3 is a sharpness profile in accordance with an embodiment of the present invention.

第4A圖係依據本發明一實施例中待測物的待測部位無瑕疵的影像。 Fig. 4A is an image showing the flawless portion of the object to be tested according to an embodiment of the present invention.

第4B圖係依據本發明一實施例中待測物的待測部位有瑕疵的影像。 FIG. 4B is an image of a to-be-measured portion of the object to be tested according to an embodiment of the present invention.

第5圖係依據本發明一實施例中的方法所實現的檢測裝置操作示意圖。 Figure 5 is a schematic diagram of the operation of the detecting device implemented in accordance with the method of an embodiment of the present invention.

第6圖係依據本發明一實施例的對焦方法流程圖。 Figure 6 is a flow chart of a focusing method in accordance with an embodiment of the present invention.

第7A圖係本發明一實施例中的對焦方法的部份流程圖。 Figure 7A is a partial flow chart of the focusing method in an embodiment of the present invention.

第7B圖係本發明一實施例中的對焦方法中接續於第7A圖的部份流程圖。 FIG. 7B is a partial flow chart of the focusing method in accordance with an embodiment of the present invention, which is continued from FIG. 7A.

第7C圖係本發明一實施例中的對焦方法中接續於第7A圖的部份流程圖。 FIG. 7C is a partial flow chart of the focusing method in accordance with an embodiment of the present invention, which is continued from FIG. 7A.

以下在實施方式中詳細敘述本發明之詳細特徵以及優點,其內容足以使任何熟習相關技藝者了解本發明之技術內容並據以實施,且依據本說明書所揭露之內容、申請專利範圍及圖式,任何熟習相關技藝者可輕易地理解本發明相關之目的及優點。以下之實施例係進一步詳細說明本發明之觀點,但非以任何觀點限制本發明之範疇。 The detailed features and advantages of the present invention are set forth in the Detailed Description of the Detailed Description of the invention. The objects and advantages associated with the present invention can be readily understood by those skilled in the art. The following examples are intended to describe the present invention in further detail, but are not intended to limit the scope of the invention.

依據本發明一實施例中的方法所實現的一種檢測裝置,請參照第1圖與第2圖,第1圖係依據本發明一實施例中的方法所實現的檢測裝置功能方塊圖,第2圖係依據本發明一實施例中的方法所實現的檢測裝置操作示意圖。如第1圖所示,檢測裝置1包含儲存模組11、影像擷取模組13、處理模組15與檢測模組17。其中,處理模組15電性連接至儲存模組11與影像擷取模組13。而檢測模組17電性連接至處理模組15。檢測裝置1可用以對一個托盤上的多個待測物進行檢測。 Referring to FIG. 1 and FIG. 2, FIG. 1 is a functional block diagram of a detecting device implemented by a method according to an embodiment of the present invention, and FIG. 2 is a second embodiment of the present invention. The figure is a schematic diagram of the operation of the detecting device implemented according to the method in an embodiment of the present invention. As shown in FIG. 1 , the detecting device 1 includes a storage module 11 , an image capturing module 13 , a processing module 15 , and a detecting module 17 . The processing module 15 is electrically connected to the storage module 11 and the image capturing module 13 . The detection module 17 is electrically connected to the processing module 15 . The detecting device 1 can be used to detect a plurality of objects to be tested on one tray.

儲存模組11用以儲存前述多個待測物中至少一個已經完成對焦及/或檢測的待測物,例如第2圖中的待測物20,所 對應的對焦距離,其中待測物20位於正準備進行對焦及/或檢測的待測物30的一側(例如為左側),且如第2圖所示,待測物20可以相鄰於待測物30。舉例來說,當檢測裝置1對於一個托盤上一列的多個待測物,由左至右進行檢測時,當完成待測物20的檢測,則待測物20的對焦資料,例如對焦距離或是對焦平面,可以被儲存在儲存模組11中,以作為要對待測物30對焦的依據。依據本發明的精神,儲存模組11可以是揮發性儲存媒介或是非揮發性儲存媒介,本發明不加以限制。 The storage module 11 is configured to store a test object that has been in focus and/or detected by at least one of the plurality of test objects, for example, the object to be tested 20 in FIG. Corresponding focus distance, wherein the object to be tested 20 is located on one side (for example, the left side) of the object 30 to be in focus and/or detected, and as shown in FIG. 2, the object to be tested 20 may be adjacent to Measuring object 30. For example, when the detecting device 1 detects a plurality of objects to be tested in a row on a tray from left to right, when the detection of the object to be tested 20 is completed, the focus data of the object 20 to be tested, such as a focusing distance or It is a focus plane that can be stored in the storage module 11 as a basis for focusing on the object to be tested 30. In accordance with the spirit of the present invention, the storage module 11 can be a volatile storage medium or a non-volatile storage medium, which is not limited in the present invention.

要對托盤19上的一個或多個待測物對焦以進行檢測時,一般而言處理模組15可以控制影像擷取模組13,以多個預設距離來對待測物擷取多個待選影像。以第2圖為例,首先對待測物20進行對焦及檢測時,處理模組15(未繪示於第2圖)控制影像擷取模組13,以十三個預設距離,依序對焦到待選對焦平面f1至待選對焦平面f13。由此可以得到十三張待選影像。其中,影像擷取模組13的景深,可以選擇等於或者稍大於相鄰的兩個待選對焦平面(例如待選對焦平面f5與待選對焦平面f6)的距離。而後處理模組15分析這十三張待選影像中,每張影像對應到待測物20的對焦參考面21的部份影像,藉由分析每張待選影像的這個部份影像,來決定一張待選影像有「正確地」對焦到待測物20的對焦參考面21。 In order to focus on one or more objects to be tested on the tray 19, the processing module 15 can generally control the image capturing module 13 to take multiple objects to be measured at a plurality of preset distances. Select an image. Taking FIG. 2 as an example, when the object 20 is first focused and detected, the processing module 15 (not shown in FIG. 2) controls the image capturing module 13 to focus at 13 preset distances. Go to the selected focus plane f 1 to the selected focus plane f 13 . Thus, thirteen images to be selected can be obtained. The depth of field of the image capturing module 13 can be selected to be equal to or slightly larger than the distance between two adjacent to-be-selected focusing planes (for example, the to-be-selected focusing plane f 5 and the to-be-selected focusing plane f 6 ). The post-processing module 15 analyzes the thirteen candidate images, each of which corresponds to a part of the image of the focus reference surface 21 of the object to be tested 20, and analyzes the partial image of each image to be selected to determine an image to be selected. "correctly" focuses on the focus reference surface 21 of the object to be tested 20.

請進一步參考第3圖,其係依據本發明一實施例的清晰度分佈圖。處理模組15可以把這十三張待選影像中對應於對 焦參考面21的影像區塊的清晰度都記錄來,形成如第3圖中的清晰度分佈曲線C20。由第2圖可知,對焦參考面21正好對準待選對焦平面f7,因此可以由清晰度分佈曲線C20中可以發現對應到待選對焦平面f7的待選影像,在對焦參考面21的影像區塊具有最高的清晰度,由此,處理模組15會選擇對應於待選對焦平面f7的待選影像作為待測物20的檢測影像,並以這個檢測影像的對焦距離,也就是對焦到待選對焦平面f7的預設距離作為一個參考距離。而後檢測模組17可以據此(檢測影像以及這個參考距離)來對待測物20執行一個檢測程序。 Please refer further to FIG. 3, which is a sharpness profile in accordance with an embodiment of the present invention. Processing module 15 may be selected from these thirteen image block corresponding to the image focus of the reference surface 21 are recorded to the resolution, such as the sharpness of the distribution curve C in FIG. 3, 20 is formed. Seen from FIG. 2, the reference surface 21 precisely aligned with the focus to be on the focal plane f 7 is selected, it is possible by the distribution curve definition may be found in the corresponding C 20 to be selected from the focal plane of the image f to be selected from the group 7, the in-focus reference surface 21 The image block has the highest resolution. Therefore, the processing module 15 selects the image to be selected corresponding to the to-be-selected focus plane f 7 as the detected image of the object to be tested 20, and also uses the focus distance of the detected image. It is the preset distance that is focused on the to-be-selected focus plane f 7 as a reference distance. The detection module 17 can then perform a detection procedure on the object to be tested 20 based on this (detection image and this reference distance).

簡單來說,處理模組15會對這十三張待選影像,都分析對應於對焦參考面21的影像區塊,以決定這十三張待選影像中,對應到對焦參考面21的影像區塊的清晰度最高的一張待選影像選為檢測影像,並將對應的對焦距離設定為參考距離,以便於檢測模組17對待測物20執行檢測程序。 Briefly, the processing module 15 analyzes the image blocks corresponding to the focus reference surface 21 for the thirteen candidate images to determine the clarity of the image blocks corresponding to the focus reference surface 21 among the thirteen candidate images. The image of the candidate image with the highest degree is selected as the detection image, and the corresponding focus distance is set as the reference distance, so that the detection module 17 performs the detection process on the object to be tested 20.

檢測模組17要對待測物20的待測部位23執行的檢測程序中,檢測模組17會控制影像擷取模組13依據前述的對焦距離(也就是對焦到對焦參考面21/待選對焦平面f7的對焦距離),並依據一個位移參數d1來重新設定對焦距離,以對焦至待測部位23的頂端。以第2圖的例子來說,就是控制影像擷取模組13對焦到待選對焦平面f5,並可以依序對焦到待選對焦平面f6、待選對焦平面f7、待選對焦平面f8,同時對待測物20的待測部位23進行一次或多次的影像擷取,以得到一張或多張檢測影像。得 到檢測影像後,檢測模組17以光學辨識的方法分析檢測影像,以確認待測部位23是否有瑕疵。 The detecting module 17 controls the image capturing module 13 to control the image capturing module 13 according to the aforementioned focusing distance (that is, focusing on the focusing reference surface 21 / to be selected for focusing in the detection program to be performed on the portion 23 to be tested of the object 20 to be tested. The focus distance of the plane f 7 ), and the focus distance is reset according to a displacement parameter d 1 to focus on the top end of the portion 23 to be tested. In the example of FIG. 2, the image capture module 13 is controlled to focus on the focal plane to be selected from the f 5, and can be sequentially selected to focus on the focal plane f 6, to be selected from the focal plane f 7, to be selected focal plane f 8 , at the same time, the image to be tested 23 of the object 20 is subjected to one or more image captures to obtain one or more detection images. After the detected image is obtained, the detecting module 17 analyzes the detected image by optical identification to confirm whether the portion 23 to be tested has flaws.

所述光學辨識的方法,舉例來說,請參照第4A圖與第4B圖,第4A圖係依據本發明一實施例中待測物的待測部位無瑕疵的影像,第4B圖係依據本發明一實施例中待測物的待測部位有瑕疵的影像。一般而言如果待測部位23沒有瑕疵,則對待測物所擷取到的檢測影像會如第4A圖所示,在影像中對應於待測部位23的影像區塊中僅有預設圖樣402。反之,如果待測部位23有瑕疵(刮傷、雜質),則如第4B圖所示,在影像中對應於待測部位23的影像區塊中除了有預設圖樣402以外,還有瑕疵影像406。據此,當檢測模組17判斷檢測影像中對應於待測部位的影像區塊中存在非預期的圖樣,則可以判斷受檢測的待測物在待測部位有瑕疵。 For the method of optical identification, for example, please refer to FIG. 4A and FIG. 4B , and FIG. 4A is an image of the to-be-tested part of the object to be tested according to an embodiment of the present invention, and FIG. 4B is based on the present invention. In an embodiment of the invention, the portion to be tested of the object to be tested has a flawed image. Generally, if there is no flaw in the portion 23 to be tested, the detected image captured by the object to be tested will be as shown in FIG. 4A, and only the preset pattern 402 is included in the image block corresponding to the portion 23 to be tested in the image. . On the other hand, if there is flaws (scratches, impurities) in the portion 23 to be tested, as shown in FIG. 4B, in the image block corresponding to the portion 23 to be tested in the image, in addition to the preset pattern 402, there is an image of the image. 406. According to this, when the detecting module 17 determines that there is an unintended pattern in the image block corresponding to the portion to be tested in the detected image, it can be determined that the detected object to be tested has defects in the portion to be tested.

通常處理模組15要對待測物30進行對焦以便於檢測模組17對待測物30進行檢測程序時,處理模組15會控制影像擷取模組13對待測物30重複前述對於待測物20所執行的一系列動作。然而當待測物的數量龐大時,這樣的對焦檢測流程非常的耗時。 When the processing module 15 is to focus on the object to be tested 30, and the detection module 15 performs a detection process on the object to be tested 30, the processing module 15 controls the image capturing module 13 to repeat the foregoing object 20 for the object to be tested 30. A series of actions performed. However, when the number of objects to be tested is large, such a focus detection process is very time consuming.

於本發明一實施例中,請回到第2圖,當處理模組15對待測物20執行完前述的對焦流程後,會在儲存模組11中,記錄待測物20的對焦參考面21所對應的對焦距離會對焦到待選對焦平面f7。而當處理模組15要接著控制影像擷取模組13對待 測物30進行對焦時,因為待測物30的對焦參考面31與待測物20的對焦參考面21對應到的待選對焦平面即使不同,也不會差很多(相鄰兩個待測物的鉛直位置或者說Z軸位置大致上相同),所以可以選擇以待選對焦平面f7為中心的N個待選對焦平面,作為對應於待測物30的對焦參考面31的「可能對焦平面」,其中N為正整數。 In an embodiment of the present invention, returning to FIG. 2, after the processing module 15 performs the foregoing focusing process on the object to be tested 20, the focus reference surface 21 of the object to be tested 20 is recorded in the storage module 11. The corresponding focus distance will focus on the selected focus plane f 7 . When the processing module 15 is to control the image capturing module 13 to focus on the object to be measured 30, the focus reference surface 31 of the object to be tested 30 and the focus reference surface 21 of the object to be tested 20 correspond to the to-be-selected focusing plane. Even if it is different, it will not be much worse (the vertical position of the two adjacent objects to be tested or the Z-axis position is substantially the same), so you can select N candidate focus planes centered on the to-be-selected focus plane f 7 as Corresponding to the "possible focus plane" of the focus reference surface 31 of the object 30 to be tested, where N is a positive integer.

例如N為5,那就是選擇待選對焦平面f5到待選對焦平面f9共五個待選對焦平面。因此,處理模組15可以控制影像擷取模組13以對應到前述五個被選擇出來的待選對焦平面的五個待選距離,來分別對待測物30的對焦參考面31擷取待選影像。藉此,影像擷取模組13擷取到待測物30的五張待選影像,而處理模組15可以對這五張待選影像分別進行清晰度的分析,得到如第3圖中的清晰度分佈曲線C30。最終,處理模組15可以從這五張待選影像中,選出對應到對焦參考面31的影像區塊的清晰度最高的一張待選影像。依據第3圖,處理模組15一樣會選擇對焦到待選對焦平面f7的待選影像,並將之作為待測物30的檢測影像,以進行如同前述對待測物20進行過的一系列檢測程序。 For example, N is 5, that is, a plurality of candidate focus planes are selected from the selected focus plane f 5 to the selected focus plane f 9 . Therefore, the processing module 15 can control the image capturing module 13 to correspond to the five selected distances of the five selected focus planes to be selected, respectively, to select the focus reference surface 31 of the object 30 to be selected. image. Thereby, the image capturing module 13 captures five images to be selected of the object to be tested 30, and the processing module 15 can separately analyze the sharpness of the five images to be selected, and obtain a sharpness distribution curve as shown in FIG. C 30 . Finally, the processing module 15 can select one of the five candidate images corresponding to the image block corresponding to the focus reference surface 31 with the highest resolution. According to FIG. 3, the processing module 15 will be selected as the candidate to be selected to focus the image on the focal plane f 7, and the detecting device 30 as an image to be measured as in the previous treatment was carried out in a series of 20 Test procedure.

同時請參照第3圖,需要注意的是,即使待測物20與待測物30的位置關係(在Z軸上)如第2圖所示位在同一個水平面上,但是對待測物20取得的待選影像的清晰度分佈,仍然會與對待測物30取得的待選影像的清晰度分佈不同。即使同樣是待選對焦平面(例如待選對焦平面f7)對應的待選影像,其清晰度都不 相同。蓋因清晰度係對於每個待測物的對焦參考面上的花紋,如第4A圖或第4B圖上的「CAP」字樣,來進行分析,但是每個待測物之間的花紋本身的清晰度就不會相同,因此,並不能單獨的設定一個預設清晰度門檻值來簡化此一流程,否則可能會有某些待測物對應的所有待選影像的清晰度都不超過預設清晰度門檻值,而導致無法對焦。 Please refer to FIG. 3 at the same time. It should be noted that even if the positional relationship between the object to be tested 20 and the object to be tested 30 (on the Z axis) is on the same horizontal plane as shown in FIG. 2, the object to be tested 20 is obtained. The sharpness distribution of the candidate image is still different from the sharpness distribution of the candidate image obtained by the object to be tested 30. Even if the image to be selected corresponding to the candidate focus plane (for example, the focus plane f 7 to be selected) is the same, the sharpness is different. The cover factor is analyzed for the pattern on the focus reference surface of each object to be tested, such as the word "CAP" on Fig. 4A or Fig. 4B, but the pattern itself between each object to be tested The resolution will not be the same. Therefore, it is not possible to set a preset threshold value to simplify the process. Otherwise, the resolution of all the selected images corresponding to some objects to be tested may not exceed the preset. The threshold of sharpness is illegible, resulting in inability to focus.

前述方法係直接以前一個待測物的對焦資訊,例如對焦距離或對焦平面,來作為中心以決定要被選擇用來對當前一個待測物擷取影像的多個對焦距離或對焦平面。例如前述的例子中以正確對焦到對焦參考面20的待選對焦平面f7為中心,選擇了待選對焦平面f5到待選對焦平面f9作為要對待測物30擷取待選影像的多個待選對焦平面。然而,可以更進一步以之前多個待測物的對焦資訊,來推測一個對焦距離的變化趨勢,並依照這個變化趨勢適當的選擇多個可能的待選對焦平面或待選距離,以對當前的待測物擷取多個待選影像。以下茲舉例敘述其中一種實作方式。 The foregoing method directly focuses on the focus information of a previous object to be tested, such as a focus distance or a focus plane, to determine a plurality of focus distances or focus planes to be selected for capturing an image of the current object to be tested. For example, in the foregoing example, the focus plane f 5 to be selected is correctly focused on the to-be-selected focus plane f 7 of the focus reference surface 20, and the to-be-selected focus plane f 9 is selected as the image to be tested 30 for capturing the image to be selected. Multiple to-be-selected focus planes. However, it is possible to further speculate on the change trend of the focus distance by using the focus information of the plurality of test objects before, and appropriately select a plurality of possible focus planes or candidate distances according to the change trend, to the current The object to be tested captures a plurality of images to be selected. One of the implementations is exemplified below.

請參照第5圖,其係依據本發明一實施例中的方法所實現的檢測裝置操作示意圖。如第5圖所示,當處理模組15要對待測物20、待測物30、待測物40與待測物50進行對焦的時候,首先,處理模組15先控制影像擷取模組13對準待測物20,以多個預設距離分別對焦到待選對焦平面f1到待選對焦平面f13,以對待測物20擷取共十三張待選影像,而後由於如第5圖 所示,對焦參考面21最接近待選對焦平面f6,因此依據前述的方法對待測物20的對焦距離會對焦到待選對焦平面f6,據此以前述的檢測程序,檢測模組17控制影像擷取模組13對焦到待選對焦平面f4之後,向負Z軸方向以不同的對焦距離多次對待測物20擷取檢測影像,以便辨識待測物20的待測部位23有無瑕疵。 Please refer to FIG. 5, which is a schematic diagram of the operation of the detecting device implemented according to the method in an embodiment of the present invention. As shown in FIG. 5, when the processing module 15 is to focus on the object to be tested 20, the object to be tested 30, the object to be tested 40, and the object to be tested 50, first, the processing module 15 first controls the image capturing module. 13 aligning the object to be tested 20, respectively, focusing on the to-be-selected focus plane f 1 to the to-be-selected focus plane f 13 at a plurality of preset distances, and taking a total of thirteen images to be selected from the object to be tested 20, and then as shown in FIG. 5 As shown, the focus reference surface 21 is closest to the focus plane f 6 to be selected, so that the focus distance of the object 20 to be inspected according to the foregoing method will be focused on the to-be-selected focus plane f 6 , according to which the detection module 17 is detected by the aforementioned detection procedure. After the image capturing module 13 is focused on the to-be-selected focus plane f 4 , the detected image is captured by the object 20 in a plurality of different focusing distances in the negative Z-axis direction to identify the detected portion 23 of the object 20 to be tested. defect.

接著,處理模組15控制影像擷取模組13對準待測物30,此時可以依據待測物20的對焦資訊,也就是待測物20的對焦距離、最接近對焦參考面21的待選對焦平面f6,來選擇待選對焦平面f4至待選對焦平面f8。處理模組15控制影像擷取模組13分別對焦到這五個待選對焦平面來對待測物30擷取待選影像。依據前述方法流程,由於如第5圖所示,待測物30的對焦參考面31最接近待選對焦平面f5,所以處理模組15可以認定待選對焦平面f5所對應的待選影像是待測物30的檢測影像,以讓檢測模組17據以依據前述檢測程序對待測物30的待測部位33進行檢測,並且認定對焦到待選對焦平面f5的一個預設距離是待測物30的對焦距離。 Then, the processing module 15 controls the image capturing module 13 to be aligned with the object to be tested 30. At this time, according to the focus information of the object to be tested 20, that is, the focusing distance of the object to be tested 20 and the closest to the focusing reference surface 21 Select the focus plane f 6 to select the focus plane f 4 to be selected to the focus plane f 8 to be selected. The processing module 15 controls the image capturing module 13 to focus on the five to-be-selected focusing planes to extract the image to be selected. According to the foregoing method flow, since the focus reference surface 31 of the object to be tested 30 is closest to the to-be-selected focus plane f 5 as shown in FIG. 5 , the processing module 15 can determine the candidate image corresponding to the to-be-selected focus plane f 5 . It is a detection image of the object to be tested 30, so that the detection module 17 detects the portion 33 to be tested of the object 30 according to the foregoing detection procedure, and determines that a preset distance to focus on the to-be-selected focus plane f 5 is to be The focusing distance of the object 30.

接著當處理模組15控制影像擷取模組13對準待測物40準備對待測物40進行對焦時。由於前述待測物20與待測物30的對焦資訊(對焦距離或對焦平面)已經被紀錄於儲存模組11,因此依據待測物20的對焦參考面21大致位於待選對焦平面f6,而待測物30的對焦參考面31大致位於待選對焦平面f5這樣的資訊,處理模組15可以預測待測物40的對焦參考面41可能大致位 於待選對焦平面f4。因此處理模組15可以控制影像擷取模組13分別對焦到待選對焦平面f2至待選對焦平面f6來擷取五張待測物40的待選影像。由第5圖可以知道,實際上待測物40的對焦參考面41最接近待選對焦平面f5,因此處理模組15仍然計算出待選對焦平面f5所對應的待選影像中,對焦參考面41的影像區塊的清晰度高於其他幾張待選影像中同樣的影像區塊的清晰度。從而處理模組15會選擇待選對焦平面f5所對應的待選影像作為待測物40的檢測影像,而檢測模組17則以前述檢測程序對待測物40的待測部位43進行檢測。 Then, when the processing module 15 controls the image capturing module 13 to align the object to be tested 40 to prepare the object 40 to be in focus. Since the focus information (focus distance or focus plane) of the object to be tested 20 and the object to be tested 30 have been recorded in the storage module 11, the focus reference surface 21 according to the object to be tested 20 is located substantially at the focus plane f 6 to be selected. The focus reference surface 31 of the object to be tested 30 is substantially located on the information of the focus plane f 5 to be selected, and the processing module 15 can predict that the focus reference surface 41 of the object to be tested 40 may be located substantially at the focus plane f 4 to be selected. Therefore, the processing module 15 can control the image capturing module 13 to focus on the to-be-selected focusing plane f 2 to the to-be-selected focusing plane f 6 to capture the five images to be selected of the object 40 to be tested. It can be known from FIG. 5 that the focus reference surface 41 of the object 40 is closest to the focus plane f 5 to be selected, so that the processing module 15 still calculates the image to be selected corresponding to the to-be-selected focus plane f 5 , and focuses on The resolution of the image block of the reference surface 41 is higher than the definition of the same image block of the other several images to be selected. Therefore, the processing module 15 selects the image to be selected corresponding to the to-be-selected focus plane f 5 as the detection image of the object 40 to be tested, and the detection module 17 detects the portion 43 to be tested of the object 40 by the aforementioned detection procedure.

由前述例子可以看出,於本發明一個實施例中,處理模組15並不是單純的以待測物30的對焦資訊來決定待測物40的多個待選對焦平面或者多個待選距離。處理模組15可以更進一步依據待測物20的對焦資訊搭配待測物30的對焦資訊,來預測並選擇待測物40的多個待選對焦平面及/或待選距離。 It can be seen from the foregoing examples that, in an embodiment of the present invention, the processing module 15 does not simply determine the plurality of to-be-selected focus planes or multiple candidate distances of the object 40 to be tested by using the focus information of the object to be tested 30. . The processing module 15 can further predict and select a plurality of to-be-selected focus planes and/or to-be-selected distances of the object to be tested 40 according to the focus information of the object to be tested 20 and the focus information of the object to be tested 30.

因此,關於本發明一實施例的對焦方法,可以參照第6圖,其係依據本發明一實施例的對焦方法流程圖。如步驟S610所示:以N個預設距離分別對第一待測物擷取待選影像,N為正整數。如步驟S620所示:依據N個第一待測物的待選影像來決定第一待測物的對焦距離。如步驟S630所示:依據第一待測物的對焦距離,從N個預設距離中選擇M個相鄰的待選距離,以對相鄰於第一待測物的第二待測物擷取M個待選影像,其中M小於N。如步驟S640所示:依據M個第二待測物的影像來決定第 二待測物的對焦距離。 Therefore, regarding the focusing method according to an embodiment of the present invention, reference may be made to FIG. 6, which is a flowchart of a focusing method according to an embodiment of the present invention. As shown in step S610, the image to be selected is respectively extracted from the first object to be tested by N preset distances, where N is a positive integer. As shown in step S620, the focus distance of the first object to be tested is determined according to the to-be-selected images of the N first objects to be tested. As shown in step S630, according to the focus distance of the first object to be tested, M adjacent candidate distances are selected from the N preset distances to align the second object to be tested adjacent to the first object to be tested. Take M candidate images, where M is less than N. As shown in step S640, the first image is determined according to the images of the M second objects to be tested. The focus distance of the two objects to be tested.

於本發明另一個實施例中,請繼續參照第5圖,當處理模組15已經控制影像擷取模組13對待測物20完成對焦流程後,處理模組15將待測物20相關的對焦資訊紀錄在儲存模組11中,於是處理模組15要控制影像擷取模組13對待測物30對焦時,處理模組15可以先控制影像擷取模組13對準待測物30,並且對焦於待選對焦平面f6,擷取待測物30的第一待選影像。處理模組15並分析第一待選影像中,對應於待測物30的對焦參考面31的部份的影像區塊的清晰度。 In another embodiment of the present invention, please continue to refer to FIG. 5, after the processing module 15 has controlled the image capturing module 13 to complete the focusing process of the object to be tested 20, the processing module 15 will focus on the object 20 to be tested. The information is recorded in the storage module 11, so that the processing module 15 controls the image capturing module 13 to focus on the object to be tested 30, and the processing module 15 can first control the image capturing module 13 to align the object to be tested 30, and Focusing on the to-be-selected focus plane f 6 , the first candidate image of the object to be tested 30 is captured. The processing module 15 analyzes the sharpness of the image block corresponding to the portion of the focus reference surface 31 of the object 30 to be tested in the first candidate image.

接著,處理模組15可以控制影像擷取模組13對焦於相鄰於待選對焦平面f6的其中一個待選對焦平面(例如待選對焦平面f5),並擷取待測物30的第二待選影像。處理模組15同樣分析第二待選影像中,對應於待測物30的對焦參考面31的部份的影像區塊的清晰度,而後處理模組15會發現同樣對應至對焦參考面31的部份的影像區塊,對焦在待選對焦平面f5的第二張待選影像具有更高的清晰度。據此,處理模組15可以預期如果控制影像擷取模組13對焦到待選對焦平面f4來對待測物30擷取第三待選影像,則第三待選影像中對應於對焦參考面31的部份的影像區塊可能會具有更好的清晰度。 Then, the processing module 15 can control the image capturing module 13 to focus on one of the to-be-selected focusing planes adjacent to the to-be-selected focusing plane f 6 (for example, the in-focus plane f 5 to be selected), and capture the object 30 to be tested. The second candidate image. The processing module 15 also analyzes the sharpness of the image block corresponding to the portion of the second reference image corresponding to the focus reference surface 31 of the object 30 to be tested, and the post-processing module 15 finds that it also corresponds to the focus reference surface 31. For some of the image blocks, the second image to be selected that focuses on the selected focus plane f 5 has a higher definition. Accordingly, the processing module 15 can expect that if the image capturing module 13 is controlled to focus on the to-be-selected focusing plane f 4 to capture the third candidate image, the third candidate image corresponds to the focusing reference surface. Part of the image block of 31 may have better definition.

當處理模組15實際控制影像擷取模組13對焦到待選對焦平面f4來對待測物30擷取第三待選影像,並且處理模組15實際分析第三待選影像時,處理模組15會發現,在前述三張 待選影像中,第二待選影像中對應於待測物30的對焦參考面31的部份的影像區塊的清晰度最高,因此處理模組15就可以選擇第二待選影像作為待測物30的檢測影像。檢測模組17接著依據這個檢測影像以及所對應的對焦資訊:對焦於待選對焦平面f5,以前述的檢測程序對待測物30的待測部位33進行檢測。 When the processing module 15 actually controls the image capturing module 13 to focus on the to-be-selected focusing plane f 4 to capture the third candidate image, and the processing module 15 actually analyzes the third candidate image, the processing module The group 15 finds that among the three candidate images, the image block corresponding to the portion of the focus reference surface 31 of the object 30 to be tested has the highest sharpness, so the processing module 15 can select the first The two candidate images are used as detection images of the object 30 to be tested. The detection module 17 then detects the image to be tested 33 of the object to be tested 30 by the aforementioned detection procedure according to the detection image and the corresponding focus information: focusing on the to-be-selected focus plane f 5 .

因此,於本發明另一實施例中的對焦方法,可以包含如第7A圖至第7C圖的流程,其中第7A圖至第7C圖分別為本發明一實施例中的對焦方法的部份流程圖。如步驟S710所示:以第一對焦距離來對待測物擷取第一待選影像。如步驟S720所示:以大於第一對焦距離的第二對焦距離來對待測物擷取第二待選影像。如步驟S730所示:判斷第一待選影像的清晰度是否大於第二待選影像的清晰度。 Therefore, the focusing method in another embodiment of the present invention may include the processes of FIG. 7A to FIG. 7C, wherein FIG. 7A to FIG. 7C are respectively a part of the flow of the focusing method according to an embodiment of the present invention. Figure. As shown in step S710, the first candidate image is captured by the object to be measured at the first focus distance. As shown in step S720, the second candidate image is captured by the object to be measured at a second focus distance greater than the first focus distance. As shown in step S730, it is determined whether the resolution of the first candidate image is greater than the resolution of the second candidate image.

如果第一待選影像的清晰度大於第二待選影像的清晰度,則如步驟S740所示:以小於第一對焦距離的第三對焦距離來對待測物擷取第三待選影像。並如步驟S742所示:判斷第三待選影像的清晰度是否小於第一待選影像的清晰度。如果第三待選影像的清晰度小於第一待選影像的清晰度,則如步驟S744所示:以第一待選影像作為待測物的檢測影像。否則如步驟S746所示:以第一對焦距離做為新的第二對焦距離,以第三對焦距離做為新的第一對焦距離而後回到步驟S740。 If the resolution of the first candidate image is greater than the resolution of the second candidate image, as shown in step S740, the third candidate image is captured by the object to be measured at a third focus distance smaller than the first focus distance. And as shown in step S742, it is determined whether the resolution of the third candidate image is smaller than the resolution of the first candidate image. If the resolution of the third candidate image is smaller than the resolution of the first candidate image, as shown in step S744, the first candidate image is used as the detection image of the object to be tested. Otherwise, as shown in step S746, the first focus distance is used as the new second focus distance, the third focus distance is used as the new first focus distance, and then the process returns to step S740.

如果第一待選影像的清晰度小於第二待選影像的清晰度,則如步驟S750所示:以大於第二對焦距離的第三對焦距 離來對待測物擷取第三待選影像。並如步驟S752所示:判斷第三待選影像的清晰度是否小於第二待選影像的清晰度。如果第三待選影像的清晰度小於第二待選影像的清晰度,則如步驟S754所示:以第二待選影像作為待測物的檢測影像。否則如步驟S756所示:以第二對焦距離做為新的第一對焦距離,以第三對焦距離做為新的第二對焦距離而後回到步驟S750。 If the resolution of the first candidate image is smaller than the resolution of the second candidate image, as shown in step S750: the third focus distance is greater than the second focus distance The third object to be selected is taken from the object to be measured. And as shown in step S752: determining whether the resolution of the third candidate image is smaller than the resolution of the second candidate image. If the resolution of the third candidate image is smaller than the resolution of the second candidate image, as shown in step S754, the second candidate image is used as the detection image of the object to be tested. Otherwise, as shown in step S756, the second focus distance is used as the new first focus distance, the third focus distance is used as the new second focus distance, and then the process returns to step S750.

在另一實施例中,若步驟S720是以小於第一對焦距離的第二對焦距離來對待測物擷取第二待選影像,則在步驟S730中,當第一待選影像的清晰度大於第二待選影像的清晰度時,設定第三對焦距離大於第一對焦距離;當第一待選影像的清晰度小於第二待選影像的清晰度時,設定第三對焦距離小於第二對焦距離,其餘的流程類似,不再贅述。如此,搭配本發明的其他部份的精神,甚至可以只對一個待測物對焦三次至四次,就完成對於待測物正確的對焦,而能對待測物執行進一步的檢測程序。 In another embodiment, if the step S720 captures the second candidate image by using the second focus distance smaller than the first focus distance, then in step S730, when the resolution of the first candidate image is greater than Setting the third focus distance to be greater than the first focus distance when the brightness of the second candidate image is clear; setting the third focus distance to be smaller than the second focus when the resolution of the first candidate image is smaller than the resolution of the second candidate image Distance, the rest of the process is similar, no longer repeat them. Thus, with the spirit of the other parts of the present invention, even if only one object to be tested is focused three to four times, the correct focus for the object to be tested is completed, and a further detection procedure can be performed on the object to be tested.

依據本發明的精神,影像擷取模組13可以應用感光耦合元件(charge-coupled detector,CCD)、互補金屬氧化物半導體接面電晶體光感測裝置(complementary metal-oxide semiconductor photo detector,CMOS PD)或其他適於感應並擷取影像的裝置,並且影像擷取模組13所擷取的影像可以是灰階(grayscale)或全彩的影像,本發明不加以限制。 According to the spirit of the present invention, the image capturing module 13 can apply a charge-coupled detector (CCD) or a complementary metal-oxide semiconductor photo detector (CMOS PD). Or any other device suitable for sensing and capturing images, and the image captured by the image capturing module 13 may be grayscale or full color image, which is not limited in the present invention.

同樣地,依據本發明的精神,處理模組15與檢測模組17可以由特殊應用積體電路(application-specific integrated circuit,ASIC)、進階精簡指令集機器(advanced RISC machine,ARM)、中央處理單元(central processing unit,CPU)、單晶片控制器或其他適於執行運算及控制指令的設備來實現,本發明不以此為限。 Similarly, in accordance with the spirit of the present invention, the processing module 15 and the detection module 17 can be applied by a specific application integrated circuit (application-specific integrated Circuit, ASIC), advanced RISC machine (ARM), central processing unit (CPU), single-chip controller or other device suitable for executing arithmetic and control instructions, the present invention Not limited to this.

綜上所述,依據本發明一個或多個實施例所實現的對焦方法及應用此方法的檢測裝置,在要對一個待測物進行對焦時,可以依據相鄰的待測物的對焦距離來決定此待測物可能的對焦距離,從而大幅地減少對每一個待測物對焦的時間,加快了自動測試的流程。 In summary, the focusing method and the detecting device using the method according to one or more embodiments of the present invention can be based on the focusing distance of adjacent objects to be tested when focusing on an object to be tested. Determining the possible focusing distance of the object to be tested, thereby greatly reducing the time for focusing on each object to be tested, and speeding up the process of automatic testing.

雖然本發明以前述之實施例揭露如上,然其並非用以限定本發明。在不脫離本發明之精神和範圍內,所為之更動與潤飾,均屬本發明之專利保護範圍。關於本發明所界定之保護範圍請參考所附之申請專利範圍。 Although the present invention has been disclosed above in the foregoing embodiments, it is not intended to limit the invention. It is within the scope of the invention to be modified and modified without departing from the spirit and scope of the invention. Please refer to the attached patent application for the scope of protection defined by the present invention.

13‧‧‧影像擷取模組 13‧‧‧Image capture module

19‧‧‧托盤 19‧‧‧Tray

20、30、40‧‧‧待測物 20, 30, 40‧‧‧ Test objects

21、31、41‧‧‧對焦參考面 21, 31, 41‧‧ ‧ focus reference surface

23、33、43‧‧‧待測部位 23, 33, 43‧‧‧ parts to be tested

f1~f13‧‧‧待選對焦平面 f 1 ~f 13 ‧‧‧Selected focus plane

Claims (10)

一種自動光學檢測裝置的對焦方法,用以對一托盤上的多個待測物(device under test,DUT)進行對焦,該對焦方法包含:(a)依據該些待測物中一第一待測物的對焦距離決定M個待選距離,該M個待選距離彼此不同,M為大於一的整數;(b)以該M個待選距離對一第二待測物擷取M個第二待測物的待選影像,該第二待測物相鄰於該第一待測物,該M個第二待測物的待選影像分別對應於該M個待選距離;以及(c)選擇該M個第二待測物的待選影像中清晰度最高的影像作為該第二待測物的一檢測影像。 A focusing method for an automatic optical detecting device for focusing a plurality of device under test (DUT) on a tray, the focusing method comprising: (a) a first waiting according to the objects to be tested The focusing distance of the measuring object determines M candidate distances, the M candidate distances are different from each other, and M is an integer greater than one; (b) extracting M pieces from the second candidate object by the M candidate distances a candidate image to be selected, the second object to be tested is adjacent to the first object to be tested, and the candidate images of the M second objects to be tested respectively correspond to the M candidate distances; and (c The image with the highest resolution among the candidate images of the M second analytes is selected as a detection image of the second object to be tested. 如請求項1所述的自動光學檢測裝置的對焦方法,其中在步驟(a)中,係以該第一待測物的對焦距離作為中心以決定該M個待選距離。 The focusing method of the automatic optical detecting device according to claim 1, wherein in the step (a), the focusing distance of the first object to be tested is taken as a center to determine the M candidate distances. 如請求項1所述的自動光學檢測裝置的對焦方法,更包含:(d)以N個預設距離對該第一待測物擷取N個第一待測物的待選影像,該N個第一待測物的待選影像分別對應於該N個預設距離,N為大於M的整數;以及(e)依據該N個第一待測物的待選影像中清晰度最高的影像,決定該第一待測物的對焦距離。 The focusing method of the automatic optical detecting device of claim 1, further comprising: (d) extracting, to the first object to be tested, N candidate images of the first object to be tested by N preset distances, the N The to-be-selected images of the first object to be tested respectively correspond to the N preset distances, N is an integer greater than M; and (e) the image with the highest resolution among the to-be-selected images of the N first objects to be tested , determining the focusing distance of the first object to be tested. 一種自動光學檢測裝置的對焦方法,用以對一托盤上的多個待測物(device under test,DUT)進行對焦,該對焦方法包含:(a)依據該些待測物中一第一待測物的對焦距離決定一 第一對焦距離與一第二對焦距離;(b)以該第一對焦距離對一第二待測物擷取一第一待選影像,該第二待測物相鄰於該第一待測物;(c)以該第二對焦距離對該第二待測物擷取一第二待選影像;(d)依據該第一待選影像的清晰度與該第二待選影像的清晰度,決定一第三對焦距離;(e)以該第三對焦距離對該第二待測物擷取一第三待選影像;以及(f)當該第三待選影像的清晰度小於該第一待選影像或該第二待選影像時,依據該第一待選影像的清晰度與該第二待選影像的清晰度較大者,決定該第二待測物的一檢測影像。 A focusing method for an automatic optical detecting device for focusing a plurality of device under test (DUT) on a tray, the focusing method comprising: (a) a first waiting according to the objects to be tested The focus distance of the object is determined by one a first focus distance and a second focus distance; (b) capturing a first candidate image for the second object to be tested by the first focus distance, the second object to be tested being adjacent to the first object to be tested (c) capturing a second candidate image for the second object to be tested by the second focus distance; (d) determining a resolution of the first image to be selected and a brightness of the second image to be selected Determining a third focus distance; (e) drawing a third candidate image for the second object to be measured by the third focus distance; and (f) when the third candidate image has a lower definition than the first When a candidate image or the second candidate image is selected, a detected image of the second object to be tested is determined according to the sharpness of the first candidate image and the sharpness of the second candidate image. 如請求項4所述的自動光學檢測裝置的對焦方法,更包含:(g)當該第三待選影像的清晰度大於該第一待選影像與該第二待選影像時,依據該第三對焦距離決定新的該第一對焦距離與該第二對焦距離,並重覆步驟(b)至步驟(e)。 The focusing method of the automatic optical detecting device of claim 4, further comprising: (g) when the resolution of the third candidate image is greater than the first candidate image and the second candidate image, according to the first The three focus distance determines the new first focus distance and the second focus distance, and repeats steps (b) through (e). 如請求項4所述的自動光學檢測裝置的對焦方法,其中在步驟(a)中,係以該第一待測物的對焦距離作為該第一對焦距離,且該第二對焦距離大於該第一對焦距離。 The focusing method of the automatic optical detecting device of claim 4, wherein in step (a), the focusing distance of the first object to be tested is used as the first focusing distance, and the second focusing distance is greater than the first A focus distance. 如請求項6所述的自動光學檢測裝置的對焦方法,其中在步驟(d)中,包含:(d1)當該第一待選影像的清晰度大於該第二待選影像的 清晰度時,設定該第三對焦距離小於該第一對焦距離;以及(d2)當該第一待選影像的清晰度小於該第二待選影像的清晰度時,設定該第三對焦距離大於該第二對焦距離。 The focusing method of the automatic optical detecting device of claim 6, wherein in the step (d), the method includes: (d1) when the resolution of the first candidate image is greater than the second candidate image In the case of sharpness, the third focusing distance is set to be smaller than the first focusing distance; and (d2) when the resolution of the first candidate image is smaller than the resolution of the second candidate image, setting the third focusing distance to be greater than The second focus distance. 如請求項4所述的自動光學檢測裝置的對焦方法,其中在步驟(a)中,係以該第一待測物的對焦距離作為該第一對焦距離,且該第二對焦距離小於該第一對焦距離。 The focusing method of the automatic optical detecting device according to claim 4, wherein in step (a), the focusing distance of the first object to be tested is used as the first focusing distance, and the second focusing distance is smaller than the first A focus distance. 如請求項8所述的自動光學檢測裝置的對焦方法,其中在步驟(d)中,包含:(d1)當該第一待選影像的清晰度大於該第二待選影像的清晰度時,設定該第三對焦距離大於該第一對焦距離;以及(d2)當該第一待選影像的清晰度小於該第二待選影像的清晰度時,設定該第三對焦距離小於該第二對焦距離。 The focusing method of the automatic optical detecting device of claim 8, wherein in the step (d), the method includes: (d1) when the sharpness of the first candidate image is greater than the sharpness of the second candidate image, Setting the third focus distance to be greater than the first focus distance; and (d2) setting the third focus distance to be smaller than the second focus when the resolution of the first candidate image is smaller than the resolution of the second candidate image distance. 如請求項4所述的自動光學檢測裝置的對焦方法,更包含:(h)以複數個預設距離對該第一待測物擷取複數個第一待測物的待選影像,該複數個第一待測物的待選影像分別對應於該複數個預設距離;以及(i)依據該複數個第一待測物的待選影像中清晰度最高的影像,決定該第一待測物的對焦距離。 The focusing method of the automatic optical detecting device of claim 4, further comprising: (h) extracting, from the plurality of predetermined objects, a plurality of to-be-selected images of the first object to be tested, the plurality The plurality of to-be-selected images of the first object to be tested respectively correspond to the plurality of preset distances; and (i) determining the first to-be-tested according to the image with the highest resolution among the plurality of to-be-selected images of the plurality of first objects to be tested The focus distance of the object.
TW103105916A 2014-02-21 2014-02-21 Focusing method for automated photo test equipment TW201533438A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
TW103105916A TW201533438A (en) 2014-02-21 2014-02-21 Focusing method for automated photo test equipment

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
TW103105916A TW201533438A (en) 2014-02-21 2014-02-21 Focusing method for automated photo test equipment

Publications (1)

Publication Number Publication Date
TW201533438A true TW201533438A (en) 2015-09-01

Family

ID=54694745

Family Applications (1)

Application Number Title Priority Date Filing Date
TW103105916A TW201533438A (en) 2014-02-21 2014-02-21 Focusing method for automated photo test equipment

Country Status (1)

Country Link
TW (1) TW201533438A (en)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN106483622A (en) * 2016-11-25 2017-03-08 苏州均华精密机械有限公司 There is provided and check and the automatic focusing mechanism measuring and its method

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN106483622A (en) * 2016-11-25 2017-03-08 苏州均华精密机械有限公司 There is provided and check and the automatic focusing mechanism measuring and its method

Similar Documents

Publication Publication Date Title
TWI588475B (en) Detecting defects on a wafer using template image matching
TWI606423B (en) System for detecting defects on a wafer
TWI600897B (en) Computer-implemented method, non-transitory computer-readable medium, and system for detecting defects on a wafer
JP5225297B2 (en) Method for recognizing array region in die formed on wafer, and setting method for such method
WO2017020829A1 (en) Resolution testing method and resolution testing device
US20120013727A1 (en) Cell characterization using multiple focus planes
KR20170005379A (en) Using high resolution full die image data for inspection
JP2017515097A (en) Automatic in-line inspection and measurement using projected images
TWI729186B (en) Optical measurement of opening dimensions in a wafer
JP2005156475A (en) Pattern defect inspection device and method
KR100598381B1 (en) in-line typed apparatus for auto wafer-defect classification and control method thereof
WO2019107173A1 (en) Method for adjusting needle tip position of probe needle, and inspection device
JP2010522441A (en) Semiconductor wafer foreign matter inspection and repair system and method
KR20120052087A (en) Method of inspecting board
TW201921093A (en) Inspection method and inspection apparatus
CN103808733A (en) Focusing method of automatic optical detection device
TWI733877B (en) Optical measurement of step size and plated metal thickness
TW201533438A (en) Focusing method for automated photo test equipment
TWI493177B (en) Method of detecting defect on optical film with periodic structure and device thereof
US20180045947A1 (en) Optical measurement of bump hieght
JP2006242681A (en) Visual inspection apparatus
KR20120129302A (en) Wafer defect high speed inspection apparatus
JP2006284308A (en) Visual examination method of semiconductor device
CN111504608A (en) Brightness uniformity detection system and brightness uniformity detection method
TW201715627A (en) Defect recognition system