TW201532321A - A heat sink and use the heat sink package - Google Patents
A heat sink and use the heat sink package Download PDFInfo
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- TW201532321A TW201532321A TW103104290A TW103104290A TW201532321A TW 201532321 A TW201532321 A TW 201532321A TW 103104290 A TW103104290 A TW 103104290A TW 103104290 A TW103104290 A TW 103104290A TW 201532321 A TW201532321 A TW 201532321A
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Description
本發明是有關一種散熱片及使用該散熱片的封裝結構,特別是指一種應用於晶片封裝時所使用的散熱片與封裝結構。 The present invention relates to a heat sink and a package structure using the same, and more particularly to a heat sink and package structure used in wafer packaging.
隨著科技的進步、產業的發展,現今電子產品日新月異,在滿足人類追求科技的需求下,電子產品早已朝向精緻化,薄型化的製作技術方向發展。 With the advancement of technology and the development of industry, today's electronic products are changing with each passing day. Under the demand of human beings to pursue science and technology, electronic products have already developed towards refined and thin-form production technology.
惟,不論精緻化或薄型化之電子產品,其內部電子晶片在運作時,均會產生大量的熱量,因此,隨著IC晶片內部線路積集度(integration)不斷攀升,如何將熱有效且迅速的排出已成為IC晶片封裝製程時所面臨的重要課題,因此具有高熱傳導係數特性的金屬散熱片就常被應用在封裝製程中。 However, regardless of the refined or thinned electronic products, the internal electronic chip generates a large amount of heat during operation. Therefore, as the internal circuit integration of the IC chip continues to rise, how to heat efficiently and quickly The discharge has become an important issue in the IC chip packaging process, so metal heat sinks with high thermal conductivity characteristics are often used in the packaging process.
再者,近年來智慧型手機及平板電腦蓬勃發展,手機與平板的功能愈來愈強,但是機身設計卻愈來愈輕薄,IC設計公司在手機或平板電腦晶片設計初期即必須考慮簡化晶片的配置空間,但是即便晶片於設計上已經減少高度、節省了配置空間,若無適當的散熱片相配合,實際上還是無法達到精簡空間的目的。 In addition, in recent years, smart phones and tablets have flourished, and the functions of mobile phones and tablets have become stronger and stronger, but the design of the body has become thinner and lighter. IC design companies must consider simplifying the chip in the early stage of mobile phone or tablet chip design. The configuration space, but even if the chip has been designed to reduce the height and save the configuration space, without the proper heat sink to match, it is actually unable to achieve the purpose of streamlining the space.
緣是,本發明人有感於前述電子產品之晶片所應用散熱元件之缺失,於是便深入構思且積極研究而開發設計出一種符合實際狀況所需的散熱片。 The reason is that the present inventors have felt that the heat-dissipating components of the wafers of the aforementioned electronic products are missing, and then intensively and actively researched and developed a heat sink which is required to meet the actual conditions.
有鑑於此,本發明之一目的,是提供一種 散熱片,以因應輕薄化的電子產品之晶片需求。 In view of the above, it is an object of the present invention to provide a Heat sinks to meet the needs of wafers for thin and light electronic products.
本發明之散熱片,包含一中心部、多數個支撐底部,及多數個連接部,其中,該中心部具有一第一基準面與一相反於該第一基準面的第二基準面,該第一基準面與該第二基準面之間界定出一厚度D,該多數個支撐底部是位於該中心部的邊緣且相對於該第一基準面呈凹陷狀,每一個支撐底部具有一支撐底面,該支撐底面與該第一基準面之間界定出一高度H,該高度H大於該厚度D,該多數個連接部則分別連接該中心部與互相對應的所述支撐底部。 The heat sink of the present invention comprises a central portion, a plurality of support bottoms, and a plurality of connecting portions, wherein the central portion has a first reference surface and a second reference surface opposite to the first reference surface, the first A thickness D is defined between a reference surface and the second reference surface, the plurality of support bottoms are located at an edge of the central portion and are concave with respect to the first reference surface, and each support bottom has a support bottom surface. A height H is defined between the bottom surface of the support and the first reference surface. The height H is greater than the thickness D. The plurality of connecting portions respectively connect the central portion and the supporting bottom portion corresponding to each other.
本發明之另一目的,是提供一種封裝結構,該封裝結構包含一基板、一覆晶晶片、一散熱片,及一封裝膠體,其中,該覆晶晶片設置於該基板上,該散熱片包括一中心部、多數個支撐底部,及多數個連接部,其中,該中心部具有一第一基準面與一相反於該第一基準面的第二基準面,該第一基準面與該第二基準面之間界定出一厚度D,該多數個支撐底部是位於該中心部的邊緣且相對於該第一基準面呈凹陷狀,每一個支撐底部具有一支撐底面,該支撐底面與該第一基準面之間界定出一高度H,該高度H大於該厚度D,該多數個連接部則分別連接該中心部與互相對應的所述支撐底部,該封裝膠體黏著該覆晶晶片以及至少部分該基板與至少部分該散熱片。 Another object of the present invention is to provide a package structure including a substrate, a flip chip, a heat sink, and an encapsulant, wherein the flip chip is disposed on the substrate, and the heat sink includes a central portion, a plurality of support bottoms, and a plurality of connecting portions, wherein the central portion has a first reference surface and a second reference surface opposite to the first reference surface, the first reference surface and the second portion A thickness D is defined between the reference surfaces, the plurality of support bottoms are located at an edge of the central portion and are concave with respect to the first reference surface, and each support bottom has a support bottom surface, the support bottom surface and the first A height H is defined between the reference planes, and the height H is greater than the thickness D. The plurality of connecting portions are respectively connected to the central portion and the supporting bottom portion corresponding to each other, and the encapsulant adheres to the flip chip and at least a portion thereof a substrate and at least a portion of the heat sink.
本發明的又一技術手段,是在於該多數個支撐底部的數量是四個,以對稱方式位於該中心部的四個邊或四個角。 Yet another technical means of the present invention is that the number of the plurality of support bottoms is four, and is located symmetrically on four sides or four corners of the central portion.
本發明的再一技術手段,是在於該散熱片更包含多數個末端部,每一末端部是由相對應的支撐底部朝向該第一基準面的方向翹起。 According to still another aspect of the present invention, the heat sink further includes a plurality of end portions, each end portion being lifted by a corresponding support bottom toward the first reference surface.
本發明的另一技術手段,是在於該中心部具有至少一開口。 Another technical means of the present invention is that the central portion has at least one opening.
本發明的又一技術手段,是在於該中心部的第二基準面與該多數個支撐底部的支撐底面皆是粗糙面。 According to still another aspect of the present invention, the second reference surface of the central portion and the support bottom surface of the plurality of support bottoms are both rough surfaces.
本發明之有益功效在於,利用該中心部的邊緣凹陷形成有多數個支撐底部,讓所述支撐底部相對於該散熱片的所佔比例極小化,該中心部可以產生最大範圍的散熱利用面積,以有效地對應輕薄化的晶片需求,達到精簡空間的目的。 The beneficial effect of the invention is that a plurality of support bottoms are formed by the edge of the central portion, so that the proportion of the bottom of the support relative to the heat sink is minimized, and the central portion can generate a maximum range of heat dissipation utilization area. In order to effectively meet the needs of thin and light wafers, the goal of streamlining space is achieved.
10‧‧‧散熱片 10‧‧‧ Heat sink
12‧‧‧中心部 12‧‧‧ Central Department
14‧‧‧支撐底部 14‧‧‧Support bottom
16‧‧‧連接部 16‧‧‧Connecting Department
18‧‧‧末端部 18‧‧‧End
20‧‧‧第一基準面 20‧‧‧ first datum
22‧‧‧第二基準面 22‧‧‧second datum
24‧‧‧支撐底面 24‧‧‧Support bottom
26‧‧‧開口 26‧‧‧ openings
28‧‧‧基板 28‧‧‧Substrate
30‧‧‧覆晶晶片 30‧‧‧Flip chip
34‧‧‧封裝膠體 34‧‧‧Package colloid
圖1是一俯視示意圖,說明本發明散熱片的較佳實施例;圖2是一立體示意圖,說明該較佳實施例的立體態樣;圖3是一側視剖視圖,輔助說明圖1所示之本發明散熱片的較佳實施例;圖4是一局部側視剖視圖,說明多數個散熱片堆疊的狀況;以及圖5是一側視剖視圖,說明本發明封裝結構的較佳實施例。 1 is a top plan view showing a preferred embodiment of the heat sink of the present invention; FIG. 2 is a perspective view showing a three-dimensional view of the preferred embodiment; FIG. 3 is a side cross-sectional view, and FIG. DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS Figure 4 is a partial side elevational cross-sectional view showing the state of a plurality of heat sink stacks; and Figure 5 is a side cross-sectional view showing a preferred embodiment of the package structure of the present invention.
有關本發明之相關申請專利特色與技術內容,在以下配合參考圖式之較佳實施例的詳細說明中,將可清楚的呈現。 The detailed description of the preferred embodiments of the present invention will be apparent from the detailed description of the preferred embodiments.
參閱圖1、2、3,本發明散熱片10之較佳實施例包含一中心部12、多數個支撐底部14,及多數個連接部16,其中,該中心部12具有一第一基準面20與一相反於該第一基準面20的第二基準面22,該第一基準面20與該第二基準面22之間界定出一厚度D,該多數個支撐底部14是位於該中心部12的邊緣且相對於該第一基準面20 呈凹陷狀,每一個支撐底部14具有一支撐底面24,該支撐底面24與該第一基準面20之間界定出一高度H,該高度H大於該厚度D,該多數個連接部16則分別連接該中心部12與互相對應的所述支撐底部14,其中,該中心部12具有至少一開口26,並且該中心部12的第二基準面22與該多數個支撐底部14的支撐底面24皆是粗糙面,該中心部12的第一基準面20則是光滑面。 Referring to Figures 1, 2 and 3, a preferred embodiment of the heat sink 10 of the present invention comprises a central portion 12, a plurality of support bottoms 14, and a plurality of connecting portions 16, wherein the central portion 12 has a first reference surface 20 A thickness D is defined between the first reference surface 20 and the second reference surface 22 opposite to the second reference surface 22 of the first reference surface 20, and the plurality of support bottoms 14 are located at the central portion 12. Edge and relative to the first reference surface 20 Each of the support bottoms 14 has a support bottom surface 24, and a height H is defined between the support bottom surface 24 and the first reference surface 20, the height H is greater than the thickness D, and the plurality of connection portions 16 are respectively Connecting the central portion 12 to the supporting bottom portion 14 corresponding to each other, wherein the central portion 12 has at least one opening 26, and the second reference surface 22 of the central portion 12 and the supporting bottom surface 24 of the plurality of supporting bottom portions 14 are It is a rough surface, and the first reference surface 20 of the center portion 12 is a smooth surface.
在本實施例之中,該散熱片10是採用四方形的形態,而該多數個支撐底部14的數量是四個,以對稱方式位於該中心部12的四個邊或四個角。當然除了設置在四個邊或四個角的位置之外,也可以設置在四方形的兩個對邊或兩個對角,藉此方式,同樣也能讓該中心部12相較於該多數個支撐底部14形成架高的狀態,以使晶片30或電子元件藏置於該中心部12下方的架高空間之中,而且由於該多數個支撐底部14是採用兩兩互相對稱的設計,所以該散熱片10便可以得到穩定的支撐效果。 In the present embodiment, the heat sink 10 adopts a square shape, and the number of the plurality of support bottoms 14 is four, and is located symmetrically on four sides or four corners of the center portion 12. Of course, in addition to being disposed at four or four corners, it may be disposed on two opposite sides or two opposite sides of the square. In this way, the central portion 12 can also be compared with the majority. The support bottoms 14 form an elevated state such that the wafer 30 or electronic components are hidden in the elevated space below the central portion 12, and since the plurality of support bottoms 14 are symmetrical with each other, The heat sink 10 can obtain a stable supporting effect.
除此之外,該散熱片10更包含多數個末端部,每一末端部是由相對應的支撐底部14朝向該第一基準面20的方向翹起,因此,如圖4所示,當多數個散熱片10被製造出來且互相疊放以儲存或運送時,由於每一末端部呈翹起態樣,所以每一個散熱片10會跟相鄰的散熱片10,於末端部形成縫隙,如此一來,當線上作業人員或自動化手臂在拿取散熱片10時,可以從縫隙處插入,而單獨拿取上方的散熱片10,不會容易地一次拿到多數個疊在一起的散熱片10,可有效節省作業工時。 In addition, the heat sink 10 further includes a plurality of end portions, each of which is lifted by the corresponding support bottom portion 14 toward the first reference surface 20, and thus, as shown in FIG. When the heat sinks 10 are manufactured and stacked on each other for storage or transportation, each of the heat sinks 10 will form a gap with the adjacent heat sink 10 at the end portion because each end portion is in a lifted state. First, when the line operator or the automated arm picks up the heat sink 10, it can be inserted from the slit, and the upper heat sink 10 can be taken separately, and it is not easy to get a plurality of stacked heat sinks 10 at a time. , can effectively save work hours.
參閱圖5,本發明另外又提供一種使用上述散熱片10的封裝結構,該封裝結構包含一基板28、一覆晶晶片30,及一封裝膠體34,其中,該覆晶晶片30設置於該基板28上,該封裝膠體34黏著該覆晶晶片30以及至少部分該基板28與至少部分該散熱片10。 Referring to FIG. 5, the present invention further provides a package structure using the heat sink 10, the package structure includes a substrate 28, a flip chip 30, and an encapsulant 34. The flip chip 30 is disposed on the substrate. At 28, the encapsulant 34 adheres the flip chip 30 and at least a portion of the substrate 28 to at least a portion of the heat sink 10.
其中,該散熱片10包含一中心部12、多數個支撐底部14,及多數個連接部16,其設計即如前述圖1-3所示,在此便不再贅述各個部分的細部設計。 The heat sink 10 includes a central portion 12, a plurality of support bottom portions 14, and a plurality of connecting portions 16, which are designed as shown in the foregoing FIGS. 1-3, and the detailed design of each portion will not be described herein.
該封裝結構的組裝流程係如下所述:首先,將該覆晶晶片30的各個連接點形成凸塊(bump),之後,將該覆晶晶片30翻轉過來使凸塊與該基板28直接連結,然後,再將該散熱片10貼覆至基板28上並容置該覆晶晶片30,然後進行封膠組裝,組裝完成之態樣即如圖5所示,該封裝膠體34黏著該覆晶晶片30以及至少部分該基板28與至少部分該散熱片10。 The assembly process of the package structure is as follows: First, each connection point of the flip chip 30 is formed into a bump, and then the flip chip 30 is turned over to directly connect the bump to the substrate 28. Then, the heat sink 10 is attached to the substrate 28 and the flip chip 30 is accommodated, and then the package is assembled. The assembled state is as shown in FIG. 5, and the package adhesive 34 is adhered to the flip chip. 30 and at least a portion of the substrate 28 and at least a portion of the heat sink 10.
在本實施例之中,該中心部12具有至少一開口26,此開口26之目的主要是供方位識別以及為了讓該封裝膠體34於黏著該散熱片10與覆晶晶片30之間時,如有膠量太多的狀況,可以從此開口26溢出,而不是從該覆晶晶片30周圍產生溢膠情況,藉以控制溢膠位置與溢膠量。 In the present embodiment, the central portion 12 has at least one opening 26. The purpose of the opening 26 is mainly for the orientation recognition and when the encapsulant 34 is adhered between the heat sink 10 and the flip chip 30, such as In the case where there is too much glue, it can overflow from the opening 26, instead of generating an overflow from the periphery of the flip chip 30, thereby controlling the overflow position and the amount of overflow.
除此之外,由於該散熱片10是呈四方形而沒有明確的方向性,因此,利用該中心部12所開設的開口26是呈偏心而非位於中心,產生明確的方向性,因此,於組裝該散熱片10時可以有明確的對位,有利於組裝準確性。 In addition, since the heat sink 10 has a square shape and has no clear directivity, the opening 26 opened by the center portion 12 is eccentric rather than centered, and a clear directivity is generated. When the heat sink 10 is assembled, it can have a clear alignment, which is advantageous for assembly accuracy.
再者,該中心部12的第二基準面22與該多數個支撐底部14的支撐底面24皆是粗糙面,也就是說,包覆並接觸該封裝膠體34的表面都是粗糙面,以使該封裝膠體34可以進一步地溶入粗糙面的細微縫隙之中,提高該封裝膠體34的黏著強度。 Moreover, the second reference surface 22 of the central portion 12 and the supporting bottom surface 24 of the plurality of supporting bottom portions 14 are rough surfaces, that is, the surface covering and contacting the encapsulant 34 is rough surface, so that The encapsulant 34 can be further dissolved into the fine gap of the rough surface to improve the adhesion strength of the encapsulant 34.
更重要的是,由於該散熱片10從整體面積上來說,該多數個支撐底部14只有佔用該散熱片10的四個角落而已,其他部分的面積都留給該中心部12,因此,該中心部12除了基本的四方形中間區域以外,又增加了四 個凸出邊條的區域,藉此可隨晶片體積對應安裝,該多數個支撐底部14也可以容納晶片,可作最大限度縮小體積,因此不會與其他零件干涉,所以該散熱片10既可以適用形狀更大的晶片,又能利用達到精簡空間的目的。 More importantly, since the heat sink 10 has a total area, the plurality of support bottoms 14 only occupy the four corners of the heat sink 10, and the other portions are reserved for the center portion 12, and therefore, the center portion 12 in addition to the basic square middle area, added four more The area of the protruding side strips can be installed correspondingly to the volume of the wafer, and the plurality of supporting bottoms 14 can also accommodate the wafer, which can minimize the volume and thus does not interfere with other parts, so the heat sink 10 can be The use of larger wafers can also be used to achieve a streamlined space.
綜上所述,本發明利用該中心部12的邊緣凹陷形成有多數個支撐底部14,讓所述支撐底部14相對於該散熱片10的所佔比例極小化,該中心部12可以產生最大範圍的散熱利用面積,以有效地對應輕薄化的晶片需求,達到精簡空間的目的。 In summary, the present invention utilizes the edge of the central portion 12 to be recessed to form a plurality of support bottom portions 14, such that the proportion of the support bottom portion 14 relative to the heat sink 10 is minimized, and the center portion 12 can produce the maximum range. The heat dissipation area is used to effectively meet the demand for thin and light wafers, thereby achieving the goal of streamlining space.
惟以上所述者,僅為本發明之較佳實施例而已,當不能以此限定本發明實施之範圍,即大凡依本發明申請專利範圍及發明說明內容所作之簡單的等效變化與修飾,皆仍屬本發明專利涵蓋之範圍內。 The above is only the preferred embodiment of the present invention, and the scope of the invention is not limited thereto, that is, the simple equivalent changes and modifications made by the scope of the invention and the description of the invention are All remain within the scope of the invention patent.
12‧‧‧中心部 12‧‧‧ Central Department
14‧‧‧支撐底部 14‧‧‧Support bottom
16‧‧‧連接部 16‧‧‧Connecting Department
18‧‧‧末端部 18‧‧‧End
20‧‧‧第一基準面 20‧‧‧ first datum
26‧‧‧開口 26‧‧‧ openings
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US7190066B2 (en) * | 2005-03-08 | 2007-03-13 | Taiwan Semiconductor Manufacturing Co., Ltd. | Heat spreader and package structure utilizing the same |
JP2007042719A (en) * | 2005-08-01 | 2007-02-15 | Nec Electronics Corp | Semiconductor device |
TWI311361B (en) * | 2006-03-21 | 2009-06-21 | Advanced Semiconductor Eng | Semiconductor chip package and heat slug |
TWI369766B (en) * | 2007-12-04 | 2012-08-01 | Advanced Semiconductor Eng | Heat slug and semiconductor chip package |
-
2014
- 2014-02-10 TW TW103104290A patent/TWI587550B/en active
Cited By (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN116912249A (en) * | 2023-09-13 | 2023-10-20 | 常州星宇车灯股份有限公司 | Sealant sealing quality detection method, device, equipment and medium thereof |
CN116912249B (en) * | 2023-09-13 | 2023-12-01 | 常州星宇车灯股份有限公司 | Sealant sealing quality detection method, device, equipment and medium thereof |
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