TW201529707A - Curable epoxy resin composition and cured product thereof - Google Patents

Abstract

The present invention relates to a curable epoxy resin composition and a cured product, and more specifically, can provide: a curable epoxy resin capable of satisfying the electrical properties required for a copper clad laminate used in a printed circuit board, a sealing material used in electronic parts, a molding material, a template material, an adhesive, a material for an electric insulation paint, or the like; and a cured product thereof.

Description

Curable epoxy resin composition and cured product thereof

The present invention relates to a curable epoxy resin composition and a cured product thereof, and more particularly to a sealing material, a molding material, a mold material, a binder, and electricity which can be used in a copper clad laminate or an electronic component. A curable resin composition such as a material for an insulating coating material and a cured product thereof.

At present, electronic components mounted on precision equipment such as electronic equipment and communication equipment have become faster, smaller, lighter, and denser, and the requirements for reliability have become higher and higher.

With the increase in density, precision, and miniaturization of these electronic components, the circuit board tends to be multi-layered, and an electronic component such as a multilayer circuit board requires an interlayer insulating film or a planarization film. The resin material used for these interlayer insulating films or planarizing films is required to have high heat resistance in addition to excellent electrical insulation between conductors in order to accommodate high heat generation, high temperature soldering, and the like.

In the conventional circuit board, a resin varnish is impregnated on a reinforcing substrate such as glass, and then a copper foil is bonded and then heat-cured. Among these resin materials for circuit boards, a curable resin such as polyimide, phenol resin or epoxy resin is mainly used.

However, these resins generally have a dielectric constant of 3.5 or more, resulting in insufficient electrical characteristics. Therefore, electronic components prepared by using these materials have difficulty in speeding up the calculation process. Further, even if excellent electrical characteristics can be exhibited, there is a problem that heat resistance is lowered. On the other hand, although the initial physical properties of these resins are sufficient, they are tested in thermal shock and insulated. In reliability experiments such as durability tests, physical characteristics such as an increase in the modulus of elasticity occur, which causes cracking or disconnection. Therefore, there is an urgent need to develop a resin material which can achieve a balance of these characteristics.

A method for preparing a crosslinked acrylonitrile rubber using a small particle diameter is known as an insulating material capable of satisfying crack prevention, heat (impact) resistance, heat resistance, electrical insulation, and the like (Japanese Patent Publication) (Ping) No. 8-139457). Further, there is a method of producing a crosslinked acrylonitrile rubber having an average secondary particle diameter of 0.5 to 2 μm (Japanese Laid-Open Patent Publication No. 2003-113205).

However, these techniques generally use an elastomer containing 20% or more of acrylonitrile, and although excellent in compatibility with an epoxy resin or the like, electrical properties such as dielectric constant or dielectric loss of the insulating resin, or insulation reliability It has a tendency to decrease, so it is not an excellent choice. Further, these diene rubbers are often cracked by heat, and various chemical changes occur in reliability experiments such as thermal shock resistance, and physical properties such as a decrease in rubber elasticity are exhibited. As a result, the electronic component using the above-mentioned insulating resin layer has a problem that the life is shortened and the like.

Therefore, in order to increase the speed and density of the incoming call circuit, it is necessary to develop a cured product having excellent electrical properties and a resin composition capable of obtaining such a cured product.

A main object of the present invention is to provide a copper foil-clad laminate for use in a printed circuit board or a sealing material, a molding material, a mold material, a binder, an electrical insulating coating material, and the like for use in an electronic component. A hardening epoxy resin having electrical properties and a cured product thereof.

In order to achieve the above object, a specific embodiment of the present invention provides a curable epoxy resin composition comprising: an epoxy resin and a crosslinking agent, wherein the crosslinking agent contains a selected from the group consisting of vinyl toluene and maleic anhydride. One or more of the group consisting of a copolymer, a copolymer of α-methylstyrene and maleic anhydride.

In a preferred embodiment of the present invention, the curable epoxy resin composition may further comprise an auxiliary crosslinking agent selected from the group consisting of tetrabromobisphenol A and tetrabromobis. A group consisting of phenol A diglycidyl ether and a mixture of the former two.

In a preferred embodiment of the present invention, the curable epoxy resin composition may contain 100 to 400 parts by weight of a crosslinking agent and 20 to 80 parts by weight of the auxiliary agent with respect to 100 parts by weight of the epoxy resin. Crosslinker.

In a preferred embodiment of the present invention, the crosslinking agent has a weight average molecular weight of 1,400 to 50,000 g/mol, and the crosslinking agent further contains 15% by weight or more of an acid anhydride.

In a preferred embodiment of the invention, the molar ratio of vinyl toluene to maleic anhydride in the copolymer of vinyl toluene and maleic anhydride is from 1:1 to 8:1.

In a preferred embodiment of the present invention, the molar ratio of α-methylstyrene to maleic anhydride in the copolymer of α-methylstyrene and maleic anhydride is 1:1 to 8:1. .

In another embodiment of the present invention, there is further provided a cured product of the above-described curable epoxy resin composition.

In another embodiment of the present invention, the cured product has a dielectric constant of 3 or less, a dielectric loss of 0.0145 or less, and a glass transition temperature of 180 ° C or more.

According to the present invention, it is possible to provide a copper-clad laminate for use in a printed circuit board or a sealing material for a electronic component, a molding material, a mold material, a binder, a material for an electrical insulating coating, and the like. Hardening epoxy resin and hardened material thereof.

All technical and scientific terms used in the present specification have the same meaning as commonly understood by those skilled in the art, unless otherwise defined. The nomenclature used in this specification is a commonly used naming method generally known in the art.

In the entire specification of the present invention, when a certain part is used, "contains" a certain component. In the case of the description, the description is not specifically indicated, and the other components are not excluded, but the other components may be further included.

In the specification of the present application, "hardened material" means all substances formed by hardening of the composition.

One aspect of the present invention relates to a curable epoxy resin composition comprising: an epoxy resin and a crosslinking agent, wherein the crosslinking agent contains a copolymer selected from the group consisting of vinyl toluene and maleic anhydride, α- One or more of the group consisting of a copolymer of methyl styrene and maleic anhydride.

According to the curable epoxy resin composition of the present invention, an appropriate amount of a crosslinking agent is selected from the epoxy resin, and the crosslinking agent is selected from the group consisting of tetrabromobisphenol A, tetrabromobisphenol A diglycidyl ether, and the first two. Among the groups composed of the mixture, these cross-linking agents can improve the electrical properties while maintaining excellent physical properties of the epoxy resin due to the bulky characteristics and a large number of voids between the deposits.

In the present invention, the epoxy resin is not particularly limited as long as it has one or more epoxy groups in the molecule, and may be a saturated or unsaturated aliphatic or alicyclic ring having one or more epoxy groups. Classes, aromatic heterocyclic compounds. Specific examples may include: diglycidyl ether epoxy resin of phenol type bisphenol A, polyglycidyl ether epoxy resin of phenol formaldehyde novolac or cresol-formaldehyde novolac, and tris(p-hydroxyphenol) methane a triglycidyl ether epoxy resin or a tetraphenylethane tetraglycidyl ether epoxy resin; etc.; an amine type tetraglycidyl methylene diphenylamine epoxy resin or p-aminoethylene glycol A triglycidyl ether epoxy resin or the like; and a cycloaliphatic 3,4-epoxycyclohexylmethyl-3,4-epoxycyclohexylcarboxylate epoxy resin.

In the present invention, the crosslinking agent is a substance which provides crosslinking bonding between the epoxy residues of the epoxy resin, and in the case where the weight average molecular weight is less than 1,400 g/mol, since the molecular weight is not large, the electricity for the cured product is The effects of characteristics, thermal characteristics, and the like are negligible, and in the case where the weight average molecular weight exceeds 50,000 g/mol, it is difficult to prepare a prepreg due to high viscosity, and workability is also poor, so the weight average molecular weight of the crosslinking agent is preferably 1,400 to 50,000 g/mol.

Further, in the above crosslinking agent, 15% by weight based on the total weight of the crosslinking agent In the case of an acid anhydride having an acid anhydride content of less than 15% by weight, the hardening will be slow or impossible, and thus it is difficult to use it as a crosslinking agent for curing an epoxy resin.

The above crosslinking agent may be a copolymer of vinyltoluene and maleic anhydride or/and a copolymer of α-methylstyrene and maleic anhydride. The above crosslinking agent, in the copolymer of vinyl toluene and maleic anhydride, the molar ratio of vinyl toluene to maleic anhydride is 1:1 to 8:1, and the weight average molecular weight of the copolymer is 1,400 to 50,000 g/ Mol, if the molar ratio of vinyl toluene to maleic anhydride is less than 1:1, the weight average molecular weight will exceed 50,000 g/mol, so gelation will occur, making the copolymer a high molecular weight and high viscosity copolymer. There is a problem with the operational aspects. If it exceeds 8:1, the effect on electrical properties, thermal properties, and the like is negligible due to the small molecular weight.

Further, in the above crosslinking agent, in the copolymer of α-methyl styrene and maleic anhydride, the molar ratio of α-methyl styrene to maleic anhydride is 1:1 to 8:1, and the weight average molecular weight of the copolymer If it is 1,400 to 50,000 g/mol, if the molar ratio of α-methylstyrene to maleic anhydride is less than 1:1, the weight average molecular weight will exceed 50,000 g/mol, so gelation will occur and the copolymer will become a high molecular weight. And a highly viscous copolymer causes problems in handling. If it exceeds 8:1, the effect on electrical properties, thermal properties, and the like is negligible due to the small molecular weight.

The crosslinking agent as described above may be contained in an amount of 100 to 400 parts by weight with respect to 100 parts by weight of the epoxy resin. If the content of the crosslinking agent is less than 100 parts by weight based on 100 parts by weight of the epoxy resin, the hardening reaction will not proceed smoothly, and if the content exceeds 400 parts by weight, the volume will excessively increase, resulting in deterioration of workability and difficulty in production. Used in the preparation of prepreg materials.

For the copolymers of these cross-linking agents, vinyltoluene and α-methylstyrene are respectively reacted with maleic anhydride by a known method in accordance with the methods described in U.S. Patent Nos. 2,606,891 and 4,450,261. The preparation is carried out, or a commercially available product can also be purchased.

In the present invention, the curable epoxy resin composition may further contain an auxiliary crosslinking agent. The auxiliary crosslinking agent is contained in the composition in order to improve the heat resistance (Tg) of the cured product and to increase the thermal stability thereof. As the above auxiliary crosslinking agent, it may be tetrabromobisphenol A or tetrabromide. Bisphenol A diglycidyl ether and a mixture of the former two are preferably a mixture of tetrabromobisphenol A and tetrabromobisphenol A diglycidyl ether.

At this time, it may contain 20 to 80 weights with respect to 100 parts by weight of the epoxy resin. Parts of the above auxiliary crosslinking agent. If the content of the auxiliary crosslinking agent is less than 20 parts by weight relative to 100 parts by weight of the epoxy resin, the effect is negligible, but if it exceeds 80 parts by weight, the crosslinking agent is generated due to an excess of the auxiliary crosslinking agent. The problem of not being able to perform its characteristics.

The curable epoxy resin composition according to the present invention may further contain an accelerator in order to enable crosslinking to be preferably carried out. As accelerators, it may be an imidazole, especially an alkyl-substituted imidazole such as 2-methylimidazole and 2-ethyl-4-methylimidazole, or an ethyl tertiary amine such as benzyldimethylamine.

The amount of the accelerator to be used may be appropriately adjusted depending on the type of the epoxy resin, the type of the crosslinking agent, and the type of the accelerator, and preferably, the total weight of the epoxy resin, the crosslinking agent, and the auxiliary crosslinking agent. The accelerator may be from 0.01 to 5% by weight. If the accelerator is used excessively, a cured product having desired physical properties cannot be provided due to high reactivity.

Further, in order to further improve the miscibility, the curable epoxy resin composition according to the present invention may further contain an organic solvent. The content of the organic solvent can be appropriately adjusted depending on the type of the epoxy resin, the type of the crosslinking agent, and the type of the accelerator. In general, the organic solvent may be from 10 to 50% by weight based on the total weight of the epoxy resin, the crosslinking agent and the auxiliary crosslinking agent.

The organic solvent should have the following conditions: it is soluble in one or more of the epoxy resin, the crosslinking agent, and the auxiliary crosslinking agent, and has sufficient volatility to sufficiently evaporate before or during hardening. The organic solvent may be dimethyl decylamine, ethylene glycol monoethyl ether or propylene glycol monoethyl ether and esters thereof, and examples thereof include glycol ethers such as ethylene glycol monoethyl ether acetate; methyl isobutyl ketone, methyl ethyl ketone, acetone, and the like. Ketones such as methyl isopropanone; and aromatic hydrocarbons such as toluene and xylene. In addition, solvent mixtures can also be used selectively. Preferred organic solvents may be ketones, especially acetone and methyl ethyl ketone; or may be ethers, especially mixtures with propylene glycol monoethyl ether.

Further, the curable epoxy resin composition according to the present invention may further contain a filler, a dye, a pigment, a modifier, a surfactant, a fluidity regulator, a stabilizer, a processing auxiliary diluent, a adhesion promoter, A useful additive such as a flexibility agent, a toughening agent, and a heat resistant agent.

The curable epoxy resin composition of the present invention may be prepared by mixing all the components of the composition in an arbitrary order, or by preparing a first composition containing an epoxy resin component. The preparation is carried out with a second composition containing a component of the hardener composition. All other ingredients which contribute to the preparation of the epoxy resin composition may be present in the same composition at the same time, or a part may be present in the first composition and another part may be present in the second composition. Then, the first composition and the second composition are mixed to form a curable epoxy resin composition. Then, the epoxy resin composition is hardened to further obtain a cured product. Preferably, the composition component in the curable epoxy resin composition is in the form of a solution dissolved in a solvent. Such solutions or varnishes can be used to prepare coated articles.

The curable epoxy resin composition according to the present invention has excellent low dielectric properties, and therefore, can provide a cured product which can achieve low dielectric properties in a balanced manner, and is suitable for a copper clad laminate for a printed circuit board. Or a sealing material for an electronic component, a molding material, a mold material, a binder, a material for an electrical insulating coating, or the like.

Another aspect of the present invention relates to a cured product of the curable epoxy resin composition, which has a dielectric constant of 3 or less, a dielectric loss of 0.0145 or less, and a glass transition temperature of 180 ° C. the above.

The curable epoxy resin composition of the present invention can be used on any product which requires a coated coating (cured product). For example, the product may be coated with the composition of the present invention by a powder coating method or a spray coating method by placing the product in a bath containing the composition and by a method known in the art such as contact. As described above, by coating the article with an epoxy resin composition, the coating can be partially cured or completely cured. In the case where the coating portion is hardened, the product may be further processed in order to finally harden the partially cured resin. The coated article can be any substrate, such as a metal, cement or reinforcement. The article may also be a composite, a prepreg or a fiber reinforcement for the laminate.

The curable epoxy resin composition according to the present invention is especially useful for preparing composite materials required in the electronics, construction, aerospace, and automotive industries. Encapsulation by melting the reinforcing material or impregnating with a dissolved resin, or resin transfer molding, filament winding, pultrusion or reactive extrusion (RIM) and other molding methods The curable epoxy resin composition of the present invention can be applied to the preparation of a composite material, or a technique well known in the art such as coating technology. Further, the curable epoxy resin composition according to the present invention is further It can be used for a glue, a coating, a molding resin, an encapsulating resin, a sheet molding compound, or a bulk molding compound, like a usual epoxy resin.

The epoxy resin composition of the present invention can be used in a technique known in the art, for example, particularly in the preparation of prepregs and laminates for printed circuit boards. The present invention is preferably directed to a laminate for use in the electronics industry, the laminate comprising the epoxy resin composition of the present invention.

Generally, laminates for the electronics industry, especially laminates for printed circuit boards, are immersed in the epoxy resin composition of the present invention by a material for support or reinforcement by completely or Partial hardening is carried out for preparation. The reinforcing material impregnated with the partially hardened resin is generally referred to as a prepreg material. In order to prepare a printed circuit board using a prepreg, one or more prepreg layers may be laminated with one or more metal material (for example, copper) layers.

Reinforcing materials that can be impregnated with the epoxy resin composition of the present invention may include composite materials, prepreg materials, and any materials commonly used by those skilled in the art for laminate preparation. The form of such a reinforcing material may be, for example, a fabric, a cloth, a mesh, a mesh or a fiber; or a cross-ply laminate comprising balanced filaments formulated in a single direction. Generally, these reinforcing materials may be plastic fibers such as glass fiber, paper, aromatic polyamide, graphite, glass, quartz, carbon, boron fibers, and organic fibers including polyamide fibers, polytetrafluoroethylene, and meta-polystyrene. Various materials are produced, and more specifically, can be produced by various materials for preparing a laminate for a printed circuit board. In a preferred embodiment, the reinforcing material may comprise a glass or glass fiber in the form of a cloth or a mesh. As an example of the application, for example, the curable epoxy resin composition according to the present invention is very suitable for use in impregnating a glass fabric.

A person skilled in the art can easily devise a simple modification or modification of the present invention, and such variations or modifications are considered to be included in the scope of the present invention.

Hereinafter, the present invention will be described in more detail by way of examples, but the scope of the invention is not limited to the examples below.

[Example 1]

The flask with the thermometer, cooling tube and stirrer is purged with nitrogen and added After 542.33 g (4.59 mol) of α-methylstyrene, 150 g (1.53 mol) of maleic anhydride, 41.54 g of benzamidine peroxide, and 733.87 g of methyl ethyl ketone, the temperature was raised to 90 °C. The reaction was carried out at 90 ° C for 2 hours, atmospheric degassing was carried out to 190 ° C, and then 350 g of methyl ethyl ketone was added to obtain 750 g of a copolymer of α-methylstyrene and maleic anhydride.

Further, the copolymer obtained above had an acid value of 276.53 mgKOH/gm and a weight average molecular weight of 4,410 g/mol.

[Embodiment 2]

The flask equipped with a thermometer, a cooling tube, and a stirrer was purged with nitrogen, and 50 g (0.51 mol) of maleic anhydride, 2.9106 g of benzamidine peroxide, and 294 g of methyl isobutyl ketone were added, and the temperature was raised to 95 °C. 247.06 g (2.04 mol) of vinyltoluene was added dropwise at 95 ° C for 30 minutes, then reacted for 2 hours, degassed to 150 ° C under normal pressure, and then 150 g of methyl ethyl ketone was added to obtain 300 g of vinyl toluene and Malay. a copolymer of an acid anhydride.

Further, the copolymer obtained above had an acid value of 167.9 mgKOH/gm and a weight average molecular weight of 10,263 g/mol.

[Example 3]

Prepared in the same manner as in Example 1 except that 626.69 g (5.31 mol) of α-methylstyrene and 65 g (0.66 mol) of maleic anhydride were used to prepare 520 g of α-methylstyrene and maleic anhydride. Copolymer.

Further, the copolymer obtained above had an acid value of 279.65 mgKOH/gm and a weight average molecular weight of 1,266 g/mol.

[Example 4]

Prepared in the same manner as in Example 1 except that 365.80 g (3.10 mol) of α-methylstyrene and 314 g (3.20 mol) of maleic anhydride were used to prepare 720 g of α-methylstyrene and maleic anhydride. Copolymer.

Further, the copolymer obtained above had an acid value of 343.25 mgKOH/gm and a weight average molecular weight of 21,647 g/mol.

[Example 5]

The preparation was carried out in the same manner as in Example 2 except that 626.69 g (5.31 mol) of vinyltoluene and 65 g (0.66 mol) of maleic anhydride were used, and a copolymer of 543 g of vinyltoluene and maleic anhydride was prepared.

Further, the curable copolymer obtained above had an acid value of 259.79 mgKOH/gm and a weight average molecular weight of 1,149 g/mol.

[Embodiment 6]

In the same manner as in Example 2 except that 365.80 g (3.10 mol) of vinyltoluene and 314 g (3.20 mol) of maleic anhydride were used, a copolymer of 745 g of vinyltoluene and maleic anhydride was prepared.

Further, the copolymer obtained above had an acid value of 338.95 mgKOH/gm and a weight average molecular weight of 20,482 g/mol.

[Comparative Example 1]

A commercially available styrene maleic anhydride copolymer (EF-40 of Cray velly) was used.

<Characteristic evaluation method>

(1) Determination of molecular weight (g/mol)

The polystyrene-equivalent weight average molecular weight (Mw) and number average molecular weight (Mn) were determined by gel permeation chromatography (GPC) (Waters: Waters 707). The polymer was dissolved in tetrahydrofuran until the concentration of the polymer measured was 4,000 ppm, and then 100 μl was injected into the GPC. The mobile phase of GPC was flowed in at a flow rate of 1.0 ml/min using tetrahydrofuran, and analysis was carried out at 35 °C. Four columns of Waters HR-05, 1, 2, and 4E were connected in series. The detector was measured at 35 ° C using an RI and PDA Detecter.

(2) Determination of acid value (mgKOH/gm)

The MEK solution was added in excess to 0.1 g of the curable epoxy resin in the examples and the comparative examples, and after sufficiently dissolved, the mixture was back-titrated with potassium hydroxide to measure the equivalent.

(3) Preparation of copper clad laminate

Using a bisphenol A epoxy resin, a commercially available 50 g of KE-8128 (manufactured by Kolon Industries Co., Ltd.), 190 g of an acid anhydride curing agent (copolymer of each of the examples and the comparative examples), and 0.179 g of a promoter (containing 10% 2E4MZ of methyl ethyl ketone, 2-Ethyl-4-methylimidazole, BASF, Korea, was mixed to obtain a varnish. The glass fiber was immersed in the varnish obtained above, dried naturally at normal temperature, and dried in an oven at 155 ° C for 5 minutes to prepare a prepreg. Eight layers of the above prepreg were laminated with copper foil at the front and the back, and pressed at 195 ° C under a pressure of 40 kgf / cm ² for 120 minutes to obtain a copper clad laminate.

(4) Glass transition temperature (°C) determination

The copper-clad laminate obtained in (3) was measured using a differential scanning calorimeter (DSC, Q2000 manufactured by TA Instrument Co., Ltd.) (measurement site: central portion, 10 mg, measurement conditions: under nitrogen, at 20 ° C / The heating rate of min is raised to 300 ° C).

(5) Determination of dielectric constant

The dielectric constant (Dk) and dielectric loss (Df) of the cured product were measured under the following conditions using an Agilent impedance analyzer (Agilent E4991A 1 MHz - 3 GHz).

Measurement frequency: 1 GHz

Measuring temperature: 25-27 ° C

Measuring humidity: 45-55%

Measurement sample: thickness 0.8mm (0.6-1.2mm)

As shown in Table 1, it was confirmed that the raw materials having excellent heat resistance were used in the structures of Examples 1 to 6. Therefore, the glass transition temperature was remarkably improved as compared with Comparative Example 1, and the heat resistance was excellent and appeared. Low dielectric constant characteristics.

Further, as can be seen from the examples, in Examples 1 and 2, compared with Examples 3 to 6, the heat resistance and electrical properties were excellent. Therefore, it was confirmed that the vinyltoluene as a crosslinking agent was adjusted. The copolymer of maleic anhydride and the molar ratio of the copolymer of α-methylstyrene and maleic anhydride are important causes of high heat resistance and low dielectric constant.

A person skilled in the art can easily devise a simple modification or modification of the present invention, and such variations or modifications are considered to be included in the scope of the present invention.

Claims (8)

A curable epoxy resin composition comprising: an epoxy resin and a crosslinking agent, wherein the crosslinking agent comprises a copolymer selected from the group consisting of vinyl toluene and maleic anhydride, α-methylstyrene and maleic anhydride. One or more of the groups consisting of copolymers. The curable epoxy resin composition according to claim 1, wherein the curable epoxy resin composition further contains an auxiliary crosslinking agent selected from tetrabromobisphenol A, A group consisting of tetrabromobisphenol A diglycidyl ether and a mixture of the former two. The curable epoxy resin composition according to claim 1, wherein the curable epoxy resin composition contains 100 to 400 parts by weight of a crosslinking agent with respect to 100 parts by weight of the epoxy resin, and 20 to 80 parts by weight of the auxiliary crosslinking agent. The curable epoxy resin composition according to claim 1, wherein the crosslinking agent has a weight average molecular weight of 1,400 to 50,000 g/mol, and the crosslinking agent further contains 15% by weight or more of an acid anhydride. The curable epoxy resin composition according to claim 1, wherein the copolymer of vinyltoluene and maleic anhydride has a molar ratio of vinyl toluene to maleic anhydride of 1:1 to 8 :1. The hardenable epoxy resin composition according to claim 1, wherein the copolymer of α-methylstyrene and maleic anhydride has a molar ratio of α-methylstyrene to maleic anhydride. It is 1:1 to 8:1. A cured product of the curable epoxy resin composition according to any one of claims 1 to 6. The cured product according to claim 7, wherein the cured product has a dielectric constant of 3 or less, a dielectric loss of 0.0145 or less, and a glass transition temperature of 180 ° C or more.