在本揭露中，一「素玻璃」意指在切割成一單位玻璃產品前具有一大面積的一玻璃，一「強化玻璃」意指在切割該素玻璃後的該切割單位玻璃產品，以及一「強化玻璃產品」意指已經受過根據本發明之去角化程序的該強化玻璃。 對於本發明製造一強化玻璃產品之方法可能應用的該強化玻璃並沒有特別地被限制，只要是在先前技術中已知的，但在本發明之一方面中，可包括具有強化層深度在一實施例中為10至200 mm、在另一實施例中為40至200 mm、以及在又一實施例中為120至200 mm的強化玻璃。 在本發明的另一個方面中，對於本發明之製造一強化玻璃產品之方法可能應用的該素強化玻璃可具有之維氏硬度為600至700 kgf/mm2
，以及較佳地，為650至690 kgf/mm2
。 在本發明的又一個方面中，對於本發明之製造一強化玻璃產品之方法可能應用的該強化玻璃可具有之楊氏模數為60至90 GPa，以及較佳地，為65至85 GPa。 本發明之製造一強化玻璃產品的該方法包括：當在100至800 bar的一噴射壓力與具有120至600篩孔的尺寸的顆粒下噴射水（H2
O）到該素強化玻璃時，以1至1,500 mm/min的一切割速度切割一素強化玻璃，來製備一強化玻璃產品，如此具有高生產率且不具有缺陷之該素強化玻璃可被快速地被切割。 如第1圖中所描繪之行動電話之觸控螢幕面板所使用之該強化玻璃，舉例來說，可被分為用於在其前表面上顯示影像的一部分，並當有必要時接收一觸控輸入之顯示部分，以及環繞於該顯示部分的一非顯示部分。 該素強化玻璃之每一單位產品區域的該非顯示部分包括：一非顯示部分屏蔽圖形，其係形成於其上且作用以隱藏一不透明導電線圖形，以及各種的電路；以及如有必要時以一顏料組成物填充的一雕刻的槽或一透明薄膜。於此，舉例來說，一影像、圖像、標記、IR圖形或諸如此類係形成於該雕刻的槽上。 該非顯示部分屏蔽圖形可藉由在一相應的區域上印刷用以形成一非顯示部分屏蔽圖形的一組成物、並對其硬化/乾燥，而形成。一印刷方法可包括，舉例來說，噴墨印刷、噴霧印刷、網板印刷、擠壓式塗佈、反轉套版印刷、散佈、移印方法、或諸如此類，且該移印方法以重複性而言在一小面積中具有一高準確性而被較佳地使用。 該素強化玻璃之切割可在從該素強化玻璃上所形成之非顯示部分屏蔽圖形離開一預定距離之一位置上被實施。 如有必要時，該觸控感應電極圖形可被形成於該素強化玻璃上。若是該觸控感應電極圖形或諸如此類係事先被形成於在切割前之該素強化玻璃上，則一程序時間可被大量地降低，且從而該生產率可進一步地被改善。關於該形成順序，該觸控感應電極圖形可在形成該非顯示部分屏蔽圖形之前或之後而形成，以及較佳地，其係在形成該非顯示部分屏蔽圖形之前而形成。 該觸控感應電極圖形可包括兩類型感應圖形，其彼此被配置在不同的方向以提供一觸控點之X及Y座標上的訊息。形成該觸控感應電極圖形的方法可使用物理或化學沈積、光刻法、油墨印刷方法或諸如此類。該油墨印刷方法是藉由印刷能夠形成圖形形狀之該感應圖形的導電油墨以形成該觸控感應電極圖形的方法，且具體地，在相關技術中所習知的任何傳統方法可被使用而沒有特別地限制。舉例來說，網板印刷、套版印刷、噴墨印刷、或諸如此類可被使用，但不限於此。 此外，在相關技術中所使用之任何傳統材料可被使用以形成該感應圖形的該材料而不限於此。為了預防在該顯示部分上所顯示之影像的可見度退化，透明材料可被使用，或較佳地被形成為微圖形。具體地，用以形成該感應圖形所使用之導電材料可包括，舉例來說，像是銦錫氧化物（ITO）、氧化銦鋅（IZO）、氧化鋅（ZnO）、氧化銦鋅錫（IZTO）、氧化鎘錫（CTO）等等的金屬氧化物。這些可單獨地或結合其兩種或更多種的組合被所使用，以及該銦錫氧化物（ITO）可被使用。這些可以單獨地被使用或結合其兩種或更多種的組合使用，且該銦錫氧化物（ITO）係較佳地被使用。 然後，在形成該非顯示部分屏蔽圖形之後，該素強化玻璃之一切割程序係被實施。根據本發明之該切割程序可以是在一特定條件下所實施之水刀方法的切割程序。 水刀方法係為已被廣泛地被使用以切割常規玻璃而非強化玻璃的方法，並為已知之經濟地及準確地切割玻璃的方法。 然而，沒有將該水刀方法應用到難以切割的強化玻璃的實施例。在這種情況的考量下，本案發明人已發現能夠用以切割該強化玻璃的該水刀方法的一特定條件，並已完成本發明之該方法，其可以經濟地及準確地切割強化玻璃。 本發明之切割強化玻璃產品的方法包括在100至800 bar的一噴射壓力下噴射水（H2
O）到該素強化玻璃，以及較佳地在200至700 bar，其中該切割速度係為1至1,500 mm/min，以及較佳地為400至1,000 mm/min。當水的噴射壓力係在上述範圍內時，該素強化玻璃可被有效地切割同時預防損害。在目前的揭露中，該切割速度意指當切割該強化玻璃時移動一噴射水流的速度。 當該切割速度係在上述範圍內時，該素強化玻璃可被有效地被切割，以及像是預防該素強化玻璃之被破裂的及被削除的部分之尺寸之增加的切割安全性。在該生產率及該切割安全性的考量下，該素強化玻璃係以400至1,000 mm/min之一切割速度被切割係為較佳的。 此外，根據本發明之一切割強化玻璃的方法，該切割顆粒係伴隨水（H2
O）一起被噴射。 該切割顆粒伴隨水作用以切割該強化玻璃。在本發明中所使用之該切割顆粒可包括具有120至600篩孔之尺寸的切割顆粒。當該切割顆粒的該尺寸係在上述範圍內時，預防被削除的部分之尺寸的增加以及該素強化玻璃被損害、以及預防該切割平面之一錐角的增加與由於在後續的程序期間誤差之累積的最終產品中缺陷之發生是可能的。 該切割顆粒可使用在相關技術中所使用之任何傳統材料且並不限於此。舉例來說，可包括氧化鋁、石榴石、碳化鎢、或諸如此類。這些可以單獨或兩種組合或更多被使用。 與水一起噴射之該顆粒的方法可包括，舉例來說，在水與該切割顆粒係分別地被儲存於分離的空間的方法中，用於該切割顆粒之出口係被配置在水的噴射路徑中，其中，當水在一高噴射壓力下噴射時，該切割顆粒藉由在其中所產生之負壓而經過用於該切割顆粒之出口被釋出以與水一起被噴射。在水與該切割顆粒事先地被混合的方法中，該混合物被噴射到該強化玻璃或諸如此類。就該切割顆粒之抑制散射、切割能量密度之增加、該削除的部分的減少以及該切割平面之該錐角減少而言，具有上述優點之後者方法係更較佳地被使用。 如有必要時，在該素強化玻璃之該切割程序前，於該素強化玻璃之至少一表面上形成一保護性樹脂薄膜的程序可被進一步地實施。由於在後續的程序（指紋保護層、該切割程序、強化程序或諸如此類）中所使用之該各種的化合物、或於切割程序中所產生的破片及諸如此類，藉由形成該保護性樹脂薄膜，預防在該切割程序期間中所產生的在該玻璃表面或該上述圖形上之損害或碎片等等是可能的。 該保護性樹脂薄膜可使用在相關技術中保護電極所使用，而不限於此，之任何傳統的樹脂薄膜。舉例來說，一添加劑可被應用到一高分子薄膜的一表面，及然後被黏著於該強化玻璃，或一可硬化的樹脂組成物可被應用於該強化玻璃的一表面，且然後被硬化。 如有必要時，形成該保護性樹脂薄膜以及其去除可於該切割程序後而被實施。舉例來說，形成該保護性樹脂薄膜以及去除其可於一熱去角化程序後而被實施。 根據本發明，製造一強化玻璃產品的方法包括去角化該強化玻璃的一切割平面，該去角化係藉由與具有一退火點或更高但低於該強化玻璃之蒸發點之一溫度的熱源以0.001至2.5 mm2
面積接觸至該切割平面，以及然後以5至300 mm/sec之一速度移動該熱源，這樣在該切割平面上所產生的微細裂痕的部分可被去除，且高強度可被提供。 因為受過該切割程序之該強化玻璃具有一顯著下降的強度，以及微細裂痕與尖銳地切割邊緣係存在於該切割平面上，去角化程序係必要的。 本發明之該去角化方法係藉由將該熱源接觸至該強化玻璃之該切割平面而被實施。 根據本發明之該熱源的形狀並非特別地被限制，只要其在一範圍內且不偏離本發明之目的，以及具體地，一錐體、一圓柱、該圓柱係被耦合於該錐體的一形狀或諸如此類可被使用，但不限於此。 根據該切割程序之一特定條件，該強化玻璃與在該切割平面之狀態或與該強化玻璃之性質可具有顯著的差異。在這種情況的考量下，本發明人已發現，在上述特定條件下，藉由該熱源接觸至該強化玻璃之去角化該切割平面的一種方法，以便於恢復被該切割程序所降低的該強化玻璃的強度、移除微細裂痕、並有效地去角化該切割平面，且已完成本發明之製造一強化玻璃產品的該方法。 根據本發明，該去角化步驟可包括：將該熱源以0.001至1 mm2
面積接觸至該切割平面的一上邊緣，以及然後以5至300 mm/sec的速度剝離該上邊緣；將該熱源以0.001至1 mm2
面積接觸至該切割平面的下邊緣，以及然後以5至300 mm/sec的速度剝離該下邊緣；將該熱源以0.01至2.5 mm2
面積接觸至該切割平面的未剝離的部分，以及然後以5至300 mm/sec的速度剝離該未剝離的部分。較佳地，該熱源可具有該圓柱被耦合於該錐體之底面的形狀，以及，該錐體藉由其側邊可與該切割平面之該上邊緣與該下邊緣接觸然而該圓柱經由其一側邊可接觸該切割玻璃之該未剝離的部分。在這個案例中，去除在該切割平面上之該裂痕以及改善該強度之效果可被最大化。 該熱源具有一退火點或更高但低於該強化玻璃之蒸發點的溫度。 如第6圖所示，若是該強化玻璃被加熱到該退火點之溫度或是更高，該結構的相係被改變成液體或液相。通常，由於該強化玻璃之低熱導電性，在加熱的期間外側與內側之間的一溫度差異係顯著地產生。所以，若是該強化玻璃在被加熱到或高於該退火點後被冷卻，由於該溫度差異，一體積差異被產生，使得一內部應力被產生，以及具有該退火點或更高之溫度的區域係以一條狀被剝離至一預定深度。同時，當該熱源具有蒸發點或更高時，本身進行該去角化程序是不可能的。 該退火點以及該蒸發點係依據該強化玻璃而變化，以及它們可被控制以符合強化玻璃之該物理性質而不具有特別的限制。具體地，該熱源可具有700至1,700o
C之溫度，但其不限於此。 較佳地，該熱源具有軟化點或更高但低於蒸發點的溫度。當被加熱至該軟化點更或高的該強化玻璃被冷卻時，在具有該軟化點或更高溫度的區域與該冷卻之部分間的一體積差異係顯著地大。從而，內部應力係大幅地被產生，以及具有該軟化點或更高之溫度的該區域係容易地以條狀被剝離至一預定深度。該軟化點以及該蒸發點係依據該強化玻璃而變化，以及它們可被控制以符合強化玻璃之該物理性質而不具有特別的限制。具體地，該熱源可具有850至1,700o
C之一溫度，但其不限於此。 在所加熱之部分從該切割平面以條狀被剝離後，以及變成具有如第3圖以及第4圖所示之均勻的剖面形狀，實務上，該切割平面將具有如第7圖之一照片所示的剖面。然而，當一小體積變異發生時，因為所產生之內部應力並未超出耦合於材料之間的能量，形狀變形可能發生而不會有裂痕之發生，以及根據該黏度之增加該形狀變硬化。 若是將具有根據本發明該溫度範圍之溫度的該熱源接觸到該強化玻璃之該切割平面，由於具有低熱傳遞係數之該強化玻璃的特性，熱應力係被產生於切割平面部分中，以及該切割平面之一部分係從與該熱源接觸之該部分而被剝離到一預定深度。根據本發明之該去角化方法，經由該切割程序所顯著地降低的該強化玻璃之延伸率可被大幅地增加至0.4%或更多。此外，較在先前專利中該之機械的去角化或該之雷射方法獲得均勻的剖面是可能的，以及顯著地減少去角化時間。 該熱源以0.001至2.5 mm2
面積接觸至該強化玻璃之該切割平面。若是該接觸面積少於0.001 mm2
，該去角化平面可能是粗糙的，如此該去角化形狀可能是不均勻的，以及若是該接觸面積超出2.5 mm2
，由於該強化玻璃之過度的熔化的形態變異可能會發生。 當該熱源接觸至該切割平面之該邊緣時，其可與0.001至1 mm2
的面積接觸，以及當該熱源除了接觸至該切割平面之該邊緣外的一部分（舉例來說，在剝離該上及下邊緣後之一殘留的切割平面之部分）時，其可與0.01至2.5 mm2
的面積接觸。當該熱源於上述範圍內接觸至該切割平面時，預防該過度的熔化以及抑制該形態變異是較佳的。 根據本發明之一實施例，該熱源可與該強化玻璃之該切割平面點接觸或線接觸。 在目前之揭露中，該點接觸或線接觸意指藉由接觸兩物體來形成一預定之接觸面積的案例，而非形成一接觸線（即，接觸部分並不具有預定之接觸面積）之一接觸點的案例。舉例來說，可以看出，當將錐體形狀的熱源接觸至該強化玻璃之該切割平面的該邊緣時，幾何學地，該熱源以及該邊緣接觸在一點上，而當接觸一平面形熱源至該顯示平面的該邊緣時，幾何學地，該熱源以及該邊緣接觸在一線上。然而，在該去角化的案例中，實際上，該熱源以一預定之面積中與該切割平面接觸，且因此，該點接觸或線接觸意指這個案例。 當該熱源與該強化玻璃之該切割平面點接觸或線接觸時，該接觸面積可以是0.001至1 mm2
。若是該接觸面積在上述範圍內時，預防該去角化表面變為粗糙、或預防該去角化形狀變為不均勻是可能的，且由於該過度的熔化的該形態變異可被預防。 此外，該熱源可與該強化玻璃之該切割平面面接觸。在目前之揭露中，當按幾何學原理地分析時，該面接觸意指使得兩物體彼此間平面接觸的案例。 除了該切割平面外，舉例來說，當以平行於如第5圖中③所示之該切割平面之一方向中實施該去角化時，該熱源可與該強化玻璃之該切割平面的面接觸。 當該熱源與該強化玻璃之該切割平面的面接觸時，該接觸面積可以是0.01至2.5 mm2
的範圍。若是該接觸面積係在上述範圍內時，預防該去角化表面變為粗糙、或預防該去角化形狀變為不均勻是可能的，且由於該過度的熔化的該形態變異可被預防。 根據本發明，較佳地，該強化玻璃在接觸該熱源後被淬火。 參照第6圖，當該強化玻璃在該退火點或更高之一溫度下被退火時，該體積變異係大於淬火之案例。然而，當退火該強化玻璃時，因為該耦合能量係足夠地被應用於該強化玻璃之該構件之間，該熱應力可不超出該耦合能量。另一方面地，當淬火該強化玻璃時，該體積變異是小的，但因為該耦合能量係不足夠地被應用於該強化玻璃之該構件之間，由於藉由該淬火所產生該熱應力期間的該體積變異，該加熱之部分可輕易地以條狀被剝離。 淬火可藉由在一室溫（舉例來說，15至30o
C）下實行該去角化步驟而被實施。當將該熱源接觸至該強化玻璃之該切割平面之該邊緣部分時，相應部分被加熱。然而，若是當移動該熱源時該熱源係在該相應部分以外，該加熱部分可被曝露在室溫下以便於被淬火。 接觸該切割平面之該熱源可以5至300 mm/sec之一移動速度沿著可被去角化之一部分而移動。若是該移動速度低於5 mm/sec，該保護層可能被損害以及該切割量可能會增加，使得該形態變異由於該過度的熔化而可能會發生，以及當該移動速度超出於300 mm/sec時，該去角化平面可能是粗糙的，以及該去角化形狀可能是不均勻的。 在本發明之該去角化方法中，可以被使用作該熱源的材料並非特別地被限定的，只要是其可以在上述溫度範圍內轉移熱而不使該強化玻璃變形。舉例來說，陶瓷材料等等可以被使用，但不限於此。 此外，本發明之該去角化方法可進一步地包括控制該熱源之壓力或該強化玻璃之一部分或該熱源的位置之附加方式以實現穩定之去角化品質。 根據本發明之該去角化方法係為斜向地去角化該切割平面之該上邊緣與下邊緣的方法。第2圖圖示地說明根據本發明之該切割平面去角化，其中（a）係為一剖面圖以及（b）係為一正視圖。 在斜向地去角化如第2圖所示之該切割平面之該上邊緣及下邊緣的方法中，接觸該熱源之一特定的順序或數量，或其傾斜角度並未特別地被限定，只要該上邊緣及下邊緣之最終形狀係斜向地形成。 更具體地，舉例來說，在本發明之一實施例中，該切割平面之該去角化可藉由將該熱源接觸至該切割平面之該上邊緣與下邊緣而被實施。在如第4圖圖示地說明中，一傾斜平面可藉由將該熱源接觸至該切割平面之一上邊緣①以及一下邊緣②而被形成。 在本發明之另一實施例中，該去角化可藉由將與該切割平面之該上邊緣與下邊緣所接觸之該熱源沿著該上邊緣與下邊緣移動而被實施，以及然後將與該切割平面接觸之該熱源以對於其平行的方向移動。當藉由該去角化方法而被去除的該強化玻璃之一比例是大的時，本實施例可有效地被使用。第5圖圖示地說明根據本發明之該去角化方法。參照第5圖，首先該熱源接觸該切割平面之該上邊緣以斜向地形成一傾斜平面到一預定之部分①。然後，該熱源與該切割平面之該下邊緣接觸以斜向地形成一傾斜角度到一預定之部分②。然後，該熱源以與該切割平面平行的一方向接觸該切割平面中以去除該強化玻璃至一所需之部分③，從而一最終剖面形狀可被獲得。 此外，在本發明之本實施例中，該去角化之該順序可被改變，也就是說，該去角化可藉由不同於在第5圖所示之順序中的一順序而被實施。舉例來說，該去角化可在②、①及③的一順序或③、②及①的一順序中來被實施，但其不限於此。 若是該切割平面藉由該熱源的該去角化係如上所述地被完成，如有必要，該切割平面之表面的強化程序可進一步地被實施。 該強化程序可包括藉由一拋光輪，或藉由包含一氫氟酸（HF）之蝕刻劑組成物蝕刻該切割平面以研磨該切割平面。 首先，藉由該拋光輪研磨該切割平面之該方法係以這樣的型態中被實施，即在藉由該熱源完成該傾斜平面的形成後，轉動的一拋光輪接觸該切割平面以更均勻地研磨該切割平面。從而，在該切割平面之該表面上存在的微細裂痕等係被研磨而對其強化。 該拋光輪可使用由像是二氧化鈰之磨料顆粒所組成的輪。充分地展現該剖面之強化效果而言，該磨料顆粒具有5 mm或更小的尺寸係為佳的。因為該磨料顆粒之尺寸的降低導致研磨拋光準確性的增加，越小越好。因此，雖然該尺寸之較低的限制並未被限制，具有約0.01 mm之尺寸的磨料顆粒可在考量程序時間中而被使用。 該拋光輪之轉動速度並未特別地被限制，可合適地被選擇以充分地研磨該切割平面以便於獲得強度所需水準，以及舉例來說，可以是在1,000至10,000 rpm的範圍中。 然後，使用包含氫氟酸之蝕刻劑來蝕刻該切割平面的該方法係以這樣的型態被實施，即包含氫氟酸之該蝕刻劑被應用到該切割平面以蝕刻該切割平面之該表面部分。若是該切割平面係藉由包含氫氟酸之該蝕刻劑組成物而被蝕刻，一壓紋圖形係藉由該蝕刻而形成於該切割平面之該表面上使其強化。 包含氫氟酸之該蝕刻劑係為一氫氟酸溶液，以及進一步地還包含，舉例來說，除了氫氟酸外的所需酸成分，舉例來說，像是氫氯酸、硝酸、或硫酸等，其為在先前技術中所知作為玻璃蝕刻組成物。 藉由包含有氫氟酸之該蝕刻劑來蝕刻該切割平面的時間並未特別地被限定，但該蝕刻舉例來說，以增加該強化玻璃之該強度而不在該切割平面上過度蝕刻而言，在30秒到10分鐘的一範圍內可被實施。 在蝕刻期間包含氫氟酸之該蝕刻劑之溫度並未特別地被限定，但該蝕刻舉例來說，在20至50o
C的一範圍內被較佳地實施。若是包含氫氟酸之該蝕刻劑之溫度在上述範圍內，蝕刻係均勻地且充分地被進行。 包含氫氟酸之該蝕刻劑可藉由在先前技術中任何習知的方法被應用到該切割平面，像是噴射該蝕刻劑到該切割平面、將該切割平面浸泡在該蝕刻劑中、或諸如此類。 根據本發明之一實施例，如有必要時，製造一強化玻璃產品的一方法可被提供，其中一指紋保護層係形成於該強化玻璃或該強化玻璃產品上。較佳地，當在切割該素板前形成該指紋保護層時，該單位強化玻璃產品之製造程序時間可被進一步地減少以增加生產率。 根據本發明之該指紋保護層可使用在先前技術中任何習知的傳統方法來被形成而不具有特別的限制。形成該指紋保護層的方法可包括一乾式或一濕式方法。在此，該乾式方法可包括濺射沉積、電子束沉積方法或諸如此類，以及該濕式方法可包括一噴射方法。該濕式噴射方法是包含將形成該指紋保護層之一組成物應用到該素強化玻璃之一表面的方法，以及然後在一預定之條件下使其乾燥。該濕式噴射方法是較佳地使用就生產率而言。 進一步地，當進一步地包括於該素強化玻璃之至少一表面上形成一保護性樹脂薄膜的步驟時，該保護性樹脂薄膜可被形成於該素強化玻璃之該至少一表面上。在形成該指紋保護層之前藉著形成該保護性樹脂薄膜於該素強化玻璃之至少一表面上，在後續的程序期間保護該指紋保護層是可能的。 此後，較佳的實施例係被提出以更具體地描述本發明。然而，下列的實施例係僅被給予用以描繪本發明，且本領域技術者顯然地將會明白在本發明的範圍和精神內各種變化和修改是可能的。這些變化和修改都確實地包括於所附之申請專利範圍中。實施例 製備實施例 1 ：非顯示部分屏蔽圖形之製備
用於形成黑矩陣之樹脂組成物係藉著網板印刷而被應用到一部分以成為該素強化玻璃之一非顯示部分。 接著，在該非顯示部分之每個預定之面積中雕刻一槽部分之後，用於形成一圖像之墨水（85 wt.% 的二氧化鈦、5 wt.%的六亞甲基二異氰酸酯和10 wt.%的有機溶劑）、用於形成一標記之墨水（85 wt.% 的鋁粉、5 wt.%的六亞甲基二異氰酸酯和10 wt.%的有機溶劑）、以及用於形成一IR圖形之墨水（85 wt.% 的多元醇聚合物、5 wt.%的六亞甲基二異氰酸酯和10 wt.%的有機溶劑）係藉由網板印刷而被應用於該每個雕刻的槽部分。在網板印刷期間，一印刷壓力為10 kgf，以及一印刷速度為100 mm/sec。製備實施例 2 ：非顯示部分屏蔽圖形之製備
用於形成一黑矩陣之一樹脂組成物係藉著移印而被應用到一部分以成為該素強化玻璃之一非顯示部分。 接著，在該非顯示部分之每個預定之面積中雕刻一槽部分之後，用於形成一圖像之墨水（85 wt.% 的二氧化鈦、5 wt.%的六亞甲基二異氰酸酯和10 wt.%的有機溶劑）、用於形成一標記之墨水（85 wt.% 的鋁粉、5 wt.%的六亞甲基二異氰酸酯和10 wt.%的有機溶劑）、以及用於形成一IR圖形之墨水（85 wt.% 的鉻化合物、5 wt.%的六亞甲基二異氰酸酯和10 wt.%的有機溶劑）係藉由移印而被應用於該每個雕刻的槽部分。製備實施例 3 ：指紋保護層之製備
用於形成一指紋保護層之墨水（1 wt.%的聚氧化甲烯、99 wt.%的乙基九氟丁基醚）被噴射（藉由濕式噴射）到該素強化玻璃之一表面，在其上製備實施例2之該非顯示部分屏蔽圖形係經由一噴嘴而被形成，以及在150o
C乾燥以形成一指紋保護層。製備實施例 4 ：指紋保護層之製備
二氧化矽係被配置於該素強化玻璃之該一表面上，在其上實施例2之該非顯示部分屏蔽圖形係藉由使用一電子束而被形成，以及然後全氟乙烯基醚矽烷被配置於塗佈有二氧化矽之該表面上以形成一指紋保護層。電子束沉積時間為80秒，以及其溫度為80o
C。製備實施例 5 ：指紋保護層之製備
二氧化矽係被配置於該素強化玻璃之該一表面上，在其上實施例2之該非顯示部分屏蔽圖形係藉由使用一電子束而被形成，以及然後全氟乙烯基醚矽烷被配置於塗佈有二氧化矽之該表面上以形成一指紋保護層。一電子束沉積時間為400秒，以及其溫度為80o
C。實施例 1 至 10 以及比較實施例 1-7
一保護性樹脂薄膜係於製備實施例3之該素強化玻璃之表面上形成（強化層深度：20至25 mm、維氏硬度：649 kgf/mm2
、楊氏模數：71.5 GPa、退火點：613oC
、軟化點：852oC
、蒸發點：高於1700o
C），以及然後該素強化玻璃藉由噴射一水刀以下列表1所示之一條件下被切割。接著，該素強化玻璃是否被切割都被觀察，以及其結果係表示在下列表1中。
參照上述表1，可以見到在所有具有在本發明之該噴射壓力與切割速度之範圍內的實施例中，該強化玻璃之切割是可行的，但在具有本發明之該噴射壓力與切割速度之範圍外的多數比較實施例中，該強化玻璃之切割是不可行的，或該強化玻璃在切割期間被損害。實施例 11 至 16 以及比較實施例 8 至 16
一保護性樹脂薄膜係於製備實施例3之該素強化玻璃之一表面上形成（強化層深度：20至25 mm、維氏硬度：649 kgf/mm2
、楊氏模數：71.5 GPa、退火點：613oC
、軟化點：852oC
、蒸發點：高於1700o
C），以及然後一水刀被噴射到該素強化玻璃以便於將其切割。接著，一切割平面藉由在下列表2所示之一條件下將一錐體形狀的熱源以平行於該切割平面之一方向之該強化玻璃之該切割平面接觸至該邊緣部分被去角化。去角化是否可行以及延伸率被測量，且其結果係顯示於表2中。該延伸率係藉由50個強化玻璃或更多個之一平均值來確定。 該延伸率是能夠評估該強化玻璃之強度的一指數，且以這樣的型態被測量，即兩分離的支撐跨距被配置在該強化玻璃視窗基板中心的相反側邊之下，以及當一負載藉由置於該基板中心上部分上之一上跨距被應用於一視窗基板之上部分時。介於該上跨距接觸該視窗基板的一點與該視窗基板破裂的一點（十字頭位移）間的一距離被測量，以便於根據下列方程式1計算該延伸率。 [方程式1] 延伸率(%)=(6Tδ)/s2
（其中T表示該視窗基板之厚度（mm）、δ表示一十字頭位移（mm）、以及s表示該支撐跨距之間的一距離（mm））。
參照上述表2，可以見到根據本發明之該去角化方法之該條件內所實施之實施例11至15的所有該強化玻璃展現0.4%或更高的延伸率。 參照第7圖，其描繪了實施例11之該切割平面，可以見到該去角化係於該切割平面上均勻地被實施。 在實施例16之案例中，因為該去角化係藉由具有一退火點或更高但低於軟化點之溫度的該熱源而被實施，該切割平面的一部分係以條狀被剝離，且其一部分以非為條狀的形狀被剝離，以及使得一切割平面係如第9圖所說明者所形成。 然而，在本發明之該條件外之比較實施例12至16中傾斜平面並未於該強化玻璃上形成，且其延伸率係低於0.4%。實施例 17 至 21
一保護性樹脂薄膜係於製備實施例3之該素強化玻璃之表面上形成（強化層深度：20至25 mm、維氏硬度：649 kgf/mm2
、楊氏模數：71.5 GPa、退火點：613oC
、軟化點：852oC
、蒸發點：高於1700o
C），以及然後一水刀被噴射到該素強化玻璃以便於將其切割。接著，一傾斜平面係藉由將一錐體形狀之熱源接觸到該強化玻璃之該切割平面之該邊緣部分以下列表3所示之一條件被形成。該切割平面係藉由拋光輪來研磨以使其強化，以及然後延伸率被測量。在研磨後該強化玻璃之被測量之延伸率係顯示於下列表3。於此，該延伸率係藉由50個強化玻璃或更多之一平均值來確定。
參照表3，可以見到若是該切割平面使用由具有5 µm或更小尺寸之磨料顆粒所形成之一拋光輪來研磨，在實施例中之該延伸率係更增加。然而，在實施例20與21中之該延伸率之增加並不大，其相較於其他實例係在本發明之較佳範圍之外。實施例 22 至 31
一保護性樹脂薄膜係於製備實施例3之該素強化玻璃之表面上形成（強化層深度：20至25 mm、維氏硬度：649 kgf/mm2
、楊氏模數：71.5 GPa、退火點：613oC
、軟化點：852oC
、蒸發點：高於1700o
C），以及然後該素強化玻璃藉由噴射一水刀以下列表4所示之一條件被切割。接著，一傾斜平面係藉由將一錐體形狀之熱源接觸到該強化玻璃之該切割平面之該邊緣部分以下列表4所示之一條件下被形成，且該切割平面係使用氫氟酸（HF）溶液來蝕刻使其強化。 在蝕刻後該強化玻璃之所測量之延伸率係顯示於下列表4。於此，該延伸率係藉由50個強化玻璃或更多之一平均值來確定。
參照表4，可以見到當該切割平面藉由使用包含氫氟酸之該蝕刻劑蝕刻來強化時，在實施例中之該延伸率更為增加。然而，在實施例28與33中之該延伸率之增加並不大，其所述蝕刻劑之蝕刻時間與溫度相較於其他實施例係在本發明之較佳範圍之外。 作為參照，當該蝕刻時間是10分鐘或更久時，可以見到過度蝕刻被進行。In the present disclosure, a "prime glass" means a glass having a large area before being cut into a unit of glass product, and a "tempered glass" means the cutting unit glass product after cutting the plain glass, and a "" "Reinforced glass product" means the strengthened glass that has been subjected to the dehorning procedure according to the present invention. The tempered glass which may be applied to the method of the present invention for producing a tempered glass product is not particularly limited as long as it is known in the prior art, but in one aspect of the invention, it may include a depth of the reinforcing layer in one In the examples are tempered glass of 10 to 200 mm, in another embodiment 40 to 200 mm, and in yet another embodiment 120 to 200 mm. In another aspect of the invention, the tempered glass which may be applied to the method of the invention for producing a tempered glass product may have a Vickers hardness of 600 to 700 kgf/mm.2
And preferably, 650 to 690 kgf/mm2
. In still another aspect of the present invention, the tempered glass which may be applied to the method of the present invention for producing a tempered glass product may have a Young's modulus of 60 to 90 GPa, and preferably 65 to 85 GPa. The method of the present invention for producing a tempered glass product comprises: spraying water at a spray pressure of from 100 to 800 bar and particles having a size of from 120 to 600 mesh (H)2
O) When the tempered glass is cut, a tempered glass is cut at a cutting speed of 1 to 1,500 mm/min to prepare a tempered glass product, so that the tempered glass having high productivity and no defects can be quickly Being cut. The tempered glass used in the touch screen panel of the mobile phone as depicted in FIG. 1 can be, for example, divided into a part for displaying an image on the front surface thereof, and receives a touch when necessary. The display portion of the control input, and a non-display portion surrounding the display portion. The non-display portion of each unit product region of the tempered glass includes: a non-display portion shield pattern formed thereon and configured to hide an opaque conductive line pattern, and various circuits; and if necessary An engraved groove or a transparent film filled with a pigment composition. Here, for example, an image, an image, a mark, an IR pattern, or the like is formed on the groove of the engraving. The non-display portion shield pattern can be formed by printing a composition for forming a non-display portion shield pattern on a corresponding region and hardening/drying it. A printing method may include, for example, inkjet printing, spray printing, screen printing, extrusion coating, reverse offset printing, spreading, pad printing methods, or the like, and the printing method is reproducible It is preferably used with a high accuracy in a small area. The cutting of the tempered glass can be carried out at a position away from the non-display portion shielding pattern formed on the tempered glass by a predetermined distance. The touch sensing electrode pattern can be formed on the tempered glass if necessary. If the touch sensing electrode pattern or the like is previously formed on the tempered glass before cutting, a program time can be largely reduced, and thus the productivity can be further improved. Regarding the formation order, the touch sensing electrode pattern may be formed before or after the non-display portion shielding pattern is formed, and preferably, it is formed before the non-display portion shielding pattern is formed. The touch sensing electrode pattern can include two types of sensing patterns that are arranged in different directions from each other to provide a message on the X and Y coordinates of a touch point. The method of forming the touch sensing electrode pattern may use physical or chemical deposition, photolithography, ink printing methods, or the like. The ink printing method is a method of forming the touch sensing electrode pattern by printing a conductive ink capable of forming the pattern shape of the sensing pattern, and in particular, any conventional method known in the related art can be used without Special restrictions. For example, screen printing, pattern printing, inkjet printing, or the like can be used, but is not limited thereto. Further, any conventional material used in the related art may be used to form the material of the sensing pattern without being limited thereto. In order to prevent visibility degradation of the image displayed on the display portion, the transparent material may be used, or preferably formed as a micro pattern. Specifically, the conductive material used to form the sensing pattern may include, for example, indium tin oxide (ITO), indium zinc oxide (IZO), zinc oxide (ZnO), indium zinc tin oxide (IZTO). ), a metal oxide such as cadmium tin oxide (CTO). These may be used singly or in combination of two or more kinds thereof, and the indium tin oxide (ITO) may be used. These may be used singly or in combination of two or more kinds thereof, and the indium tin oxide (ITO) is preferably used. Then, after forming the non-display portion shielding pattern, one of the tempered glass cutting processes is implemented. The cutting program according to the present invention may be a cutting program of a water jet method implemented under a specific condition. The waterjet method is a method that has been widely used to cut conventional glass instead of tempered glass, and is a known method of economically and accurately cutting glass. However, there is no embodiment in which the waterjet method is applied to a tempered glass that is difficult to cut. Under the circumstances, the inventors of the present invention have found a specific condition of the water jet method capable of cutting the tempered glass, and have completed the method of the present invention, which can cut the tempered glass economically and accurately. The method of cutting a tempered glass product of the present invention comprises spraying water at a jet pressure of 100 to 800 bar (H)2
O) to the tempered glass, and preferably at 200 to 700 bar, wherein the cutting speed is from 1 to 1,500 mm/min, and preferably from 400 to 1,000 mm/min. When the injection pressure of water is within the above range, the tempered glass can be effectively cut while preventing damage. In the current disclosure, the cutting speed means the speed at which a jet of water is moved when the tempered glass is cut. When the cutting speed is within the above range, the tempered glass can be effectively cut, and the cutting safety such as prevention of the size of the ruptured and cut portion of the tempered glass is prevented. The tempered glass is preferably cut at a cutting speed of 400 to 1,000 mm/min in consideration of the productivity and the safety of the cutting. Further, according to one of the methods of the present invention, the method of cutting tempered glass is accompanied by water (H)2
O) are sprayed together. The cutting particles act with water to cut the strengthened glass. The cut particles used in the present invention may include cut particles having a size of 120 to 600 mesh openings. When the size of the cutting particles is within the above range, the increase in the size of the portion to be removed and the damage of the tempered glass are prevented, and the increase in the taper angle of the cutting plane is prevented and the error is due to the subsequent procedure. The occurrence of defects in the accumulated final product is possible. The cutting particles can use any of the conventional materials used in the related art and are not limited thereto. For example, alumina, garnet, tungsten carbide, or the like can be included. These can be used alone or in combination of two or more. The method of spraying the particles together with water may include, for example, in a method in which water and the cutting particle system are separately stored in separate spaces, and an outlet for the cutting particles is disposed in a water injection path Where, when the water is sprayed under a high spray pressure, the cut particles are released by the outlet for the cut particles by the negative pressure generated therein to be sprayed together with the water. In the method in which water and the cutting particles are previously mixed, the mixture is sprayed to the tempered glass or the like. With regard to the suppression of scattering of the cutting particles, the increase in the cutting energy density, the reduction of the portion to be removed, and the reduction of the taper angle of the cutting plane, the latter method is more preferably used. If necessary, a procedure for forming a protective resin film on at least one surface of the tempered glass before the cutting process of the tempered glass can be further carried out. Prevention of the various compounds used in subsequent procedures (fingerprint protection layer, the cutting program, the intensification program, or the like), or the fragments produced in the cutting process, and the like, by forming the protective resin film Damage or debris or the like on the surface of the glass or the above-described pattern generated during the cutting process is possible. The protective resin film can be used by protecting the electrode in the related art, and is not limited thereto, and any conventional resin film. For example, an additive may be applied to a surface of a polymer film and then adhered to the tempered glass, or a hardenable resin composition may be applied to a surface of the tempered glass and then hardened. . If necessary, the formation of the protective resin film and its removal can be carried out after the cutting process. For example, forming the protective resin film and removing it can be carried out after a thermal dehorning procedure. According to the present invention, a method of making a tempered glass product includes dekerating a cutting plane of the tempered glass by having a temperature having an annealing point or higher but lower than an evaporation point of the tempered glass Heat source from 0.001 to 2.5 mm2
The area contacts the cutting plane, and then the heat source is moved at a speed of 5 to 300 mm/sec such that a portion of the fine crack generated on the cutting plane can be removed, and high strength can be provided. Since the tempered glass subjected to the cutting procedure has a significantly reduced strength, and fine cracks and sharply cut edges are present on the cutting plane, an exfoliation procedure is necessary. The method of de-angulation of the present invention is carried out by contacting the heat source to the cutting plane of the tempered glass. The shape of the heat source according to the present invention is not particularly limited as long as it is within a range and does not deviate from the object of the present invention, and specifically, a cone, a cylinder, and a cylinder coupled to one of the cones A shape or the like can be used, but is not limited thereto. Depending on the specific conditions of the cutting procedure, the tempered glass may be significantly different from the state of the dicing plane or the properties of the tempered glass. Under the circumstances of this case, the inventors have found a method of dekeratizing the cutting plane by contact of the heat source with the heat source under the above specific conditions, in order to recover the reduction by the cutting program. The strength of the tempered glass, the removal of fine cracks, and the effective keratinization of the cutting plane, and the method of manufacturing a tempered glass product of the present invention have been completed. According to the invention, the step of de-kerching may comprise: 0.001 to 1 mm of the heat source2
The area contacts an upper edge of the cutting plane, and then peels the upper edge at a speed of 5 to 300 mm/sec; the heat source is 0.001 to 1 mm2
The area contacts the lower edge of the cutting plane, and then peels the lower edge at a speed of 5 to 300 mm/sec; the heat source is 0.01 to 2.5 mm2
The area contacts the unpeeled portion of the cutting plane, and then the unpeeled portion is peeled off at a speed of 5 to 300 mm/sec. Preferably, the heat source may have a shape in which the cylinder is coupled to the bottom surface of the cone, and the cone may be in contact with the lower edge of the cutting plane by its side but the cylinder passes through One side can contact the unpeeled portion of the cut glass. In this case, the effect of removing the crack on the cutting plane and improving the strength can be maximized. The heat source has an annealing point or higher but a temperature below the evaporation point of the strengthened glass. As shown in Fig. 6, if the tempered glass is heated to the temperature of the annealing point or higher, the phase of the structure is changed to a liquid or a liquid phase. Generally, due to the low thermal conductivity of the tempered glass, a temperature difference between the outer side and the inner side during heating is remarkably generated. Therefore, if the tempered glass is cooled after being heated to or above the annealing point, a difference in volume is generated due to the temperature difference, so that an internal stress is generated, and an area having the annealing point or higher temperature It is peeled off to a predetermined depth in a strip shape. At the same time, when the heat source has an evaporation point or higher, it is impossible to perform the dehorning process by itself. The annealing point and the evaporation point vary depending on the tempered glass, and they can be controlled to conform to the physical property of the tempered glass without particular limitation. Specifically, the heat source may have 700 to 1,700o
The temperature of C, but it is not limited to this. Preferably, the heat source has a softening point or higher but a temperature below the evaporation point. When the tempered glass heated to the softening point is higher or higher is cooled, a volume difference between the region having the softening point or higher and the cooled portion is remarkably large. Thereby, the internal stress is largely generated, and the region having the softening point or higher is easily peeled off to a predetermined depth in a strip shape. The softening point and the evaporation point vary depending on the tempered glass, and they can be controlled to conform to the physical properties of the tempered glass without particular limitation. Specifically, the heat source may have 850 to 1,700o
One temperature of C, but it is not limited to this. After the heated portion is stripped from the cutting plane in a strip shape, and becomes a uniform cross-sectional shape as shown in FIGS. 3 and 4, the cutting plane will have a photo as shown in FIG. 7 The profile shown. However, when a small volume of variation occurs, since the internal stress generated does not exceed the energy coupled between the materials, shape deformation may occur without cracking, and the shape becomes hardened according to the increase in viscosity. If the heat source having the temperature in accordance with the temperature range of the present invention is brought into contact with the cutting plane of the tempered glass, thermal stress is generated in the cutting plane portion due to the characteristics of the tempered glass having a low heat transfer coefficient, and the cutting One of the planes is stripped to a predetermined depth from the portion in contact with the heat source. According to the dehorning method of the present invention, the elongation of the tempered glass which is remarkably lowered by the cutting procedure can be greatly increased to 0.4% or more. Furthermore, it is possible to obtain a uniform profile than the mechanical dehorning of the prior art or the laser method as described in the prior patent, and to significantly reduce the dehorning time. The heat source is 0.001 to 2.5 mm2
The area contacts the cutting plane of the tempered glass. If the contact area is less than 0.001 mm2
The dehorning plane may be rough, such that the dekerated shape may be non-uniform, and if the contact area exceeds 2.5 mm2
Morphological variations due to excessive melting of the strengthened glass may occur. When the heat source contacts the edge of the cutting plane, it can be 0.001 to 1 mm2
Area contact, and when the heat source is in contact with a portion other than the edge of the cutting plane (for example, a portion of the cutting plane remaining after peeling off the upper and lower edges), it may be from 0.01 to 2.5 Mm2
Area contact. When the heat source contacts the cutting plane within the above range, it is preferable to prevent the excessive melting and to suppress the morphological variation. According to an embodiment of the invention, the heat source may be in point or line contact with the cutting plane of the tempered glass. In the present disclosure, the point contact or line contact means a case in which a predetermined contact area is formed by contacting two objects, instead of forming a contact line (ie, the contact portion does not have a predetermined contact area). Case of contact points. For example, it can be seen that when a cone-shaped heat source is contacted to the edge of the cutting plane of the tempered glass, geometrically, the heat source and the edge are in contact at a point while contacting a planar heat source To the edge of the display plane, geometrically, the heat source and the edge are in contact on a line. However, in the case of the dehorning, in practice, the heat source is in contact with the cutting plane in a predetermined area, and therefore, the point contact or line contact means this case. When the heat source is in point or line contact with the cutting plane of the tempered glass, the contact area may be 0.001 to 1 mm.2
. If the contact area is within the above range, it is possible to prevent the dehorned surface from becoming rough, or to prevent the dehorned shape from becoming uneven, and the morphological variation due to the excessive melting can be prevented. Additionally, the heat source can be in surface contact with the cutting plane of the tempered glass. In the present disclosure, when geometrically analyzed, the surface contact means a case in which two objects are in planar contact with each other. In addition to the cutting plane, for example, when the chamfering is performed in a direction parallel to one of the cutting planes as shown by 3 in Fig. 5, the heat source may face the cutting plane of the tempered glass contact. When the heat source is in contact with the face of the cutting plane of the tempered glass, the contact area may be 0.01 to 2.5 mm.2
The scope. If the contact area is within the above range, it is possible to prevent the dehorned surface from becoming rough, or to prevent the dehorned shape from becoming uneven, and the morphological variation due to the excessive melting can be prevented. According to the invention, preferably, the tempered glass is quenched after contacting the heat source. Referring to Fig. 6, when the tempered glass is annealed at the annealing point or higher, the volume variation is larger than the case of quenching. However, when the tempered glass is annealed, since the coupling energy is sufficiently applied between the members of the tempered glass, the thermal stress may not exceed the coupling energy. On the other hand, when the tempered glass is quenched, the volume variation is small, but since the coupling energy is not sufficiently applied between the members of the tempered glass, the thermal stress is generated by the quenching. During this volume variation during the period, the heated portion can be easily peeled off in strips. Quenching can be done at room temperature (for example, 15 to 30o
C) is carried out by performing the de-angleing step. When the heat source is brought into contact with the edge portion of the cutting plane of the tempered glass, the corresponding portion is heated. However, if the heat source is outside the corresponding portion when the heat source is moved, the heated portion can be exposed to room temperature to be quenched. The heat source contacting the cutting plane can be moved along a portion that can be dehorned at a moving speed of 5 to 300 mm/sec. If the moving speed is lower than 5 mm/sec, the protective layer may be damaged and the amount of cutting may increase, so that the morphological variation may occur due to the excessive melting, and when the moving speed exceeds 300 mm/sec. The dehorning plane may be rough and the dehorned shape may be uneven. In the dehorning method of the present invention, the material which can be used as the heat source is not particularly limited as long as it can transfer heat within the above temperature range without deforming the tempered glass. For example, a ceramic material or the like can be used, but is not limited thereto. Furthermore, the method of de-angulation of the present invention may further comprise an additional means of controlling the pressure of the heat source or a portion of the strengthened glass or the location of the heat source to achieve a stable de-angled quality. The method of dehorning according to the present invention is a method of diagonally de-orienting the upper and lower edges of the cutting plane. Figure 2 graphically illustrates the cutting plane de-angle according to the present invention, wherein (a) is a cross-sectional view and (b) is a front view. In the method of diagonally dehorning the upper and lower edges of the cutting plane as shown in FIG. 2, a specific order or number of contact with the heat source, or an inclination angle thereof, is not particularly limited, As long as the final shape of the upper and lower edges is formed obliquely. More specifically, for example, in one embodiment of the invention, the de-kerching of the cutting plane can be performed by contacting the heat source to the upper and lower edges of the cutting plane. In the illustration as illustrated in Fig. 4, an inclined plane can be formed by contacting the heat source to one of the upper edge 1 and the lower edge 2 of the cutting plane. In another embodiment of the present invention, the dehorning can be performed by moving the heat source in contact with the upper and lower edges of the cutting plane along the upper and lower edges, and then The heat source in contact with the cutting plane moves in a direction parallel to it. This embodiment can be effectively used when the proportion of one of the tempered glass removed by the dehorning method is large. Figure 5 graphically illustrates the method of de-anglement in accordance with the present invention. Referring to Figure 5, first the heat source contacts the upper edge of the cutting plane to form an oblique plane obliquely to a predetermined portion 1. The heat source then contacts the lower edge of the cutting plane to form an oblique angle to a predetermined portion 2 obliquely. Then, the heat source contacts the cutting plane in a direction parallel to the cutting plane to remove the tempered glass to a desired portion 3, so that a final sectional shape can be obtained. Furthermore, in the present embodiment of the invention, the order of the de-keratinization can be changed, that is, the de-angulation can be implemented by a sequence different from the order shown in FIG. . For example, the de-keratinization may be implemented in a sequence of 2, 1, and 3 or a sequence of 3, 2, and 1, but is not limited thereto. If the cutting plane is completed as described above by the heat source, the strengthening procedure of the surface of the cutting plane can be further carried out if necessary. The strengthening process can include etching the cutting plane by a polishing wheel or by etching an etchant composition comprising a hydrofluoric acid (HF) to grind the cutting plane. First, the method of grinding the cutting plane by the polishing wheel is carried out in such a manner that after the formation of the inclined plane is completed by the heat source, a rotating polishing wheel contacts the cutting plane to be more uniform. Ground the cutting plane. Thereby, fine cracks or the like existing on the surface of the cutting plane are ground and reinforced. The polishing wheel can use a wheel composed of abrasive particles such as cerium oxide. It is preferable that the abrasive grains have a size of 5 mm or less in terms of sufficiently exhibiting the reinforcing effect of the cross section. Since the reduction in the size of the abrasive particles leads to an increase in the accuracy of the polishing and polishing, the smaller the better. Thus, although the lower limit of this size is not limited, abrasive particles having a size of about 0.01 mm can be used during the consideration of the program time. The rotational speed of the polishing wheel is not particularly limited, and may be suitably selected to sufficiently grind the cutting plane in order to obtain a desired level of strength, and may be, for example, in the range of 1,000 to 10,000 rpm. Then, the method of etching the cutting plane using an etchant comprising hydrofluoric acid is carried out in such a manner that the etchant containing hydrofluoric acid is applied to the cutting plane to etch the surface of the cutting plane section. If the cutting plane is etched by the etchant composition comprising hydrofluoric acid, an embossed pattern is formed on the surface of the cutting plane by the etching to strengthen it. The etchant comprising hydrofluoric acid is a hydrofluoric acid solution, and further comprising, for example, a desired acid component other than hydrofluoric acid, such as, for example, hydrochloric acid, nitric acid, or Sulfuric acid or the like, which is known in the art as a glass etching composition. The time for etching the dicing plane by the etchant containing hydrofluoric acid is not particularly limited, but the etching is, for example, to increase the strength of the tempered glass without excessive etching on the dicing plane. It can be implemented in a range of 30 seconds to 10 minutes. The temperature of the etchant containing hydrofluoric acid during etching is not particularly limited, but the etching is, for example, 20 to 50o
A range of C is preferably implemented. If the temperature of the etchant containing hydrofluoric acid is within the above range, the etching is performed uniformly and sufficiently. The etchant comprising hydrofluoric acid can be applied to the cutting plane by any conventional method in the prior art, such as spraying the etchant to the cutting plane, soaking the cutting plane in the etchant, or And so on. In accordance with an embodiment of the present invention, a method of making a tempered glass product can be provided, if necessary, in which a fingerprint protective layer is formed on the tempered glass or the tempered glass product. Preferably, when the fingerprint protective layer is formed before cutting the plain plate, the manufacturing process time of the unit tempered glass product can be further reduced to increase productivity. The fingerprint protective layer according to the present invention can be formed using any conventional method known in the prior art without particular limitation. The method of forming the fingerprint protective layer can include a dry or a wet process. Here, the dry method may include sputter deposition, electron beam deposition methods, or the like, and the wet method may include an ejection method. The wet jet method comprises a method of applying a composition forming the fingerprint protective layer to one surface of the tempered glass, and then drying it under a predetermined condition. This wet spraying method is preferably used in terms of productivity. Further, when further comprising a step of forming a protective resin film on at least one surface of the tempered glass, the protective resin film may be formed on the at least one surface of the tempered glass. It is possible to protect the fingerprint protective layer during a subsequent process by forming the protective resin film on at least one surface of the tempered glass before forming the fingerprint protective layer. Hereinafter, preferred embodiments are presented to more specifically describe the present invention. However, the following embodiments are only given to illustrate the invention, and it is obvious to those skilled in the art that various changes and modifications are possible within the scope and spirit of the invention. These variations and modifications are indeed included in the scope of the appended claims.Example Preparation example 1 : Preparation of non-display partial shield pattern
The resin composition for forming the black matrix is applied to a part by screen printing to become a non-display portion of the tempered glass. Next, an ink for forming an image (85 wt.% of titanium dioxide, 5 wt.% of hexamethylene diisocyanate, and 10 wt.) after engraving a groove portion in each predetermined area of the non-display portion. % organic solvent), used to form a labeled ink (85 wt.% aluminum powder, 5 wt.% hexamethylene diisocyanate and 10 wt.% organic solvent), and used to form an IR pattern The ink (85 wt.% of the polyol polymer, 5 wt.% of hexamethylene diisocyanate and 10 wt.% of the organic solvent) was applied to the groove portion of each engraving by screen printing. . During stencil printing, a printing pressure of 10 kgf and a printing speed of 100 mm/sec.Preparation example 2 : Preparation of non-display partial shield pattern
A resin composition for forming a black matrix is applied to a portion by pad printing to become a non-display portion of the tempered glass. Next, an ink for forming an image (85 wt.% of titanium dioxide, 5 wt.% of hexamethylene diisocyanate, and 10 wt.) after engraving a groove portion in each predetermined area of the non-display portion. % organic solvent), used to form a labeled ink (85 wt.% aluminum powder, 5 wt.% hexamethylene diisocyanate and 10 wt.% organic solvent), and used to form an IR pattern The ink (85 wt.% of chromium compound, 5 wt.% of hexamethylene diisocyanate and 10 wt.% of organic solvent) was applied to the groove portion of each engraving by pad printing.Preparation example 3 : Preparation of fingerprint protective layer
The ink used to form a fingerprint protective layer (1 wt.% of polyoxymethylene, 99 wt.% of ethyl nonafluorobutyl ether) was sprayed (by wet spraying) onto one surface of the tempered glass The non-display portion shield pattern on which the second embodiment is prepared is formed via a nozzle, and at 150o
C is dried to form a fingerprint protective layer.Preparation example 4 : Preparation of fingerprint protective layer
The cerium oxide is disposed on the surface of the tempered glass, and the non-display portion shielding pattern of Embodiment 2 is formed by using an electron beam, and then the perfluorovinyl ether decane is configured. The surface coated with cerium oxide forms a fingerprint protective layer. The electron beam deposition time is 80 seconds and its temperature is 80o
C.Preparation example 5 : Preparation of fingerprint protective layer
The cerium oxide is disposed on the surface of the tempered glass, and the non-display portion shielding pattern of Embodiment 2 is formed by using an electron beam, and then the perfluorovinyl ether decane is configured. The surface coated with cerium oxide forms a fingerprint protective layer. An electron beam deposition time of 400 seconds and a temperature of 80o
C.Example 1 to 10 And comparative examples 1-7
A protective resin film was formed on the surface of the tempered glass of Preparation Example 3 (strength layer depth: 20 to 25 mm, Vickers hardness: 649 kgf/mm)2
, Young's modulus: 71.5 GPa, annealing point: 613oC
Softening point: 852oC
Evaporation point: higher than 1700o
C), and then the tempered glass is cut by spraying a water knife under one of the conditions shown in Table 1. Next, whether or not the tempered glass was cut was observed, and the results are shown in Table 1 below.
Referring to Table 1 above, it can be seen that in all of the embodiments having the range of the injection pressure and the cutting speed of the present invention, the tempered glass is cut, but with the injection pressure and cutting speed of the present invention. In most of the comparative examples outside the range, the tempered glass is not feasible, or the tempered glass is damaged during cutting.Example 11 to 16 And comparative examples 8 to 16
A protective resin film was formed on one surface of the tempered glass of Preparation Example 3 (strength layer depth: 20 to 25 mm, Vickers hardness: 649 kgf/mm)2
, Young's modulus: 71.5 GPa, annealing point: 613oC
Softening point: 852oC
Evaporation point: higher than 1700o
C), and then a water knife is sprayed onto the tempered glass to facilitate cutting it. Next, a cutting plane is de-angled by contacting a cutting-edge heat source with the cutting plane of the tempered glass in a direction parallel to one of the cutting planes to the edge portion by one of the conditions shown in Table 2 below. Whether de-keratinization is feasible and the elongation is measured, and the results are shown in Table 2. The elongation is determined by an average of 50 tempered glass or more. The elongation is an index capable of evaluating the strength of the strengthened glass, and is measured in such a manner that two separate support spans are disposed below opposite sides of the center of the strengthened glass window substrate, and when The load is applied to an upper portion of a window substrate by one of the upper spans placed on the upper portion of the center of the substrate. A distance between a point at which the upper span contacts the window substrate and a point at which the window substrate is broken (crosshead displacement) is measured to facilitate calculation of the elongation according to Equation 1 below. [Equation 1] Elongation (%) = (6Tδ) / s2
(where T represents the thickness (mm) of the window substrate, δ represents a crosshead displacement (mm), and s represents a distance (mm) between the support spans).
Referring to Table 2 above, it can be seen that all of the tempered glass of Examples 11 to 15 which were carried out under the conditions of the dehorning method according to the present invention exhibited an elongation of 0.4% or more. Referring to Fig. 7, which depicts the cutting plane of embodiment 11, it can be seen that the dehorning system is uniformly implemented on the cutting plane. In the case of Embodiment 16, since the keratinization is carried out by the heat source having an annealing point or higher but lower than the softening point, a part of the cutting plane is peeled off in a strip shape, and A part thereof is peeled off in a strip shape, and a cutting plane is formed as described in Fig. 9. However, in Comparative Examples 12 to 16 which are outside the conditions of the present invention, the inclined plane was not formed on the tempered glass, and the elongation was less than 0.4%.Example 17 to twenty one
A protective resin film was formed on the surface of the tempered glass of Preparation Example 3 (strength layer depth: 20 to 25 mm, Vickers hardness: 649 kgf/mm)2
, Young's modulus: 71.5 GPa, annealing point: 613oC
Softening point: 852oC
Evaporation point: higher than 1700o
C), and then a water knife is sprayed onto the tempered glass to facilitate cutting it. Next, an inclined plane is formed by contacting a heat source of a pyramid shape to the edge portion of the cutting plane of the tempered glass under the condition shown in Table 3 below. The cutting plane is ground by a polishing wheel to strengthen it, and then the elongation is measured. The measured elongation of the tempered glass after grinding is shown in Table 3 below. Here, the elongation is determined by an average value of 50 tempered glass or more.
Referring to Table 3, it can be seen that if the cutting plane is ground using a polishing wheel formed of abrasive grains having a size of 5 μm or less, the elongation is further increased in the embodiment. However, the increase in the elongation in Examples 20 and 21 was not large, and it was outside the preferred range of the present invention as compared with the other examples.Example twenty two to 31
A protective resin film was formed on the surface of the tempered glass of Preparation Example 3 (strength layer depth: 20 to 25 mm, Vickers hardness: 649 kgf/mm)2
, Young's modulus: 71.5 GPa, annealing point: 613oC
Softening point: 852oC
Evaporation point: higher than 1700o
C), and then the tempered glass is cut by spraying a water knife under one of the conditions shown in Table 4. Next, an inclined plane is formed by contacting a cone-shaped heat source to the edge portion of the cutting plane of the tempered glass under one of the conditions shown in Table 4 below, and the cutting plane uses hydrofluoric acid ( The HF) solution is etched to strengthen it. The measured elongation of the tempered glass after etching is shown in Table 4 below. Here, the elongation is determined by an average value of 50 tempered glass or more.
Referring to Table 4, it can be seen that when the dicing plane is reinforced by etching using the etchant containing hydrofluoric acid, the elongation is further increased in the embodiment. However, the increase in the elongation in Examples 28 and 33 is not large, and the etching time and temperature of the etchant are outside the preferred range of the present invention as compared with the other embodiments. As a reference, when the etching time is 10 minutes or longer, it can be seen that over-etching is performed.