TW201527503A - Composition for encapsulant and encapsulant and electronic device - Google Patents

Abstract

Provided are a composition for an encapsulant, the composition includes at least one kind of a first siloxane compound having a silicon-bonded alkenyl group (Si-Vi) and a carbosilane compound having silicon-bonded hydrogen (Si-H) as a hardener, an encapsulant obtained by curing the composition for an encapsulant, and an electronic device including the encapsulant.

Description

Sealant composition and sealant and electronic component [Related application cross-reference]

The present application claims priority to and the benefit of the Korean Patent Application No. 10-2013-0152655, filed on Dec.

A sealant composition, a sealant, and an electronic component including a sealant are disclosed.

Light-emitting elements such as light emitting diodes (LEDs), organic light emitting devices (OLEDs), photoluminescent (PL) elements, and the like have been applied to household electrical components in various ways. , lighting elements, display elements, various automatic components, and the like. The illuminating elements can display the intrinsic color of the luminescent material, such as blue, red, and green in the luminescent component, or white by combining light emitters that display different colors. Such a light-emitting element can generally comprise a sealant having a package or encapsulation structure. The sealant protects the light-emitting element from external gases and moisture, and is external The portion transmits light emitted from the light-emitting elements at various wavelengths. Therefore, it is important to effectively prevent gas and moisture as well as color change.

One embodiment provides a sealant composition having improved high temperature properties, mechanical properties, and heat resistance.

Another embodiment provides a sealant obtained by curing a sealant composition.

Yet another embodiment provides an electronic component comprising a sealant.

According to one embodiment, there is provided a sealant composition comprising at least one first oxoxane compound having a silicon-bonded alkenyl group (Si-Vi), and a hardener of the following Chemical Formula 1: [Chemical Formula 1] HR ¹ R ² Si-A-SiR ³ R ⁴ H

In Chemical Formula 1, A is selected from a substituted or unsubstituted C1 to C20 alkylene group, a substituted or unsubstituted C6 to C30 cycloalkylene group, a substituted or unsubstituted C6 to C30 heterocyclic ring. Alkyl, substituted or unsubstituted C2 to C20 alkenyl, substituted or unsubstituted C2 to C20 alkynyl, substituted or unsubstituted C6 to C30 extended aryl, substituted or unsubstituted Substituted C2 to C30 heteroaryl, or a combination thereof, and R ¹ , R ² , R ³ and R ^{4 are} independently selected from hydrogen, substituted or unsubstituted C1 to C20 alkyl, substituted or unsubstituted Substituted C7 to C20 aralkyl, substituted or unsubstituted C1 to C20 heteroalkyl, substituted or unsubstituted C3 to C20 cycloalkyl, substituted or unsubstituted C2 to C20 heterocycloalkane a substituted or unsubstituted C2 to C20 alkenyl group, a substituted or unsubstituted C2 to C20 alkynyl group, a substituted or unsubstituted C6 to C20 aryl group, a substituted or unsubstituted C1 to C10 alkoxy, substituted or unsubstituted C1 to C30 alkyl, hydroxy, halogen, or a combination thereof.

A may be selected from substituted or unsubstituted C1 to C10 alkylene groups, Alken or unsubstituted C6 to C20 cycloalkyl, substituted or unsubstituted C6 to C20 extended aryl, or a combination thereof.

R ¹ , R ² , R ³ and R ⁴ may be independently selected from hydrogen, substituted or unsubstituted C1 to C10 alkyl, substituted or unsubstituted C6 to C20 cycloalkyl, substituted or unsubstituted Substituted C6 to C20 aryl, substituted or unsubstituted C2 to C10 alkenyl, substituted or unsubstituted C2 to C20 alkynyl, substituted or unsubstituted C1 to C10 alkoxy, hydroxy, Halogen, or a combination thereof.

The compound of Chemical Formula 1 may be selected from the compounds represented by the following Chemical Formulas 2 to 5:

In Chemical Formula 2, R ^a , R ^b , R ^c and R ^d are the same or different and are independently hydrogen, hydroxy, substituted or unsubstituted C1 to C5 alkyl, or substituted or unsubstituted Substituted C6 to C10 aryl, and k is an integer from 1 to 3.

In Chemical Formula 3, R ^a , R ^b , R ^c and R ^d are the same or different and are independently hydrogen, hydroxy, substituted or unsubstituted C1 to C5 alkyl, or substituted or unsubstituted Substituted C6 to C10 aryl groups, and 1 is an integer from 1 to 5.

In Chemical Formula 4, R ^a , R ^b , R ^c and R ^d are the same or different and are independently hydrogen, hydroxy, substituted or unsubstituted C1 to C5 alkyl, or substituted or unsubstituted Substituted C6 to C10 aryl, m and n are independently an integer from 0 to 5, and o and p are independently integers from 1 to 5.

In Chemical Formula 5, R ^a , R ^b , R ^c and R ^d are the same or different and are independently hydrogen, hydroxy, substituted or unsubstituted C1 to C5 alkyl, or substituted or unsubstituted Substituted C6 to C10 aryl, and q is an integer from 1 to 3.

The compound of Chemical Formula 1 may be selected from the compounds represented by Chemical Formulas 8 to 11.

[Chemical Formula 11]

The first oxane compound can be represented by Chemical Formula 6.

(R ⁵ R ⁶ R ⁷ SiO _1/2 ) _M1 (R ⁸ R ⁹ SiO _2/2 ) _D1 (R ¹⁰ SiO _3/2 ) _T1 (SiO _3/2 -Y ¹ -SiO _3/2 ) _T2 (SiO _4/2 ) _Q1

In Chemical Formula 6, R ⁵ to R ^{10 are} independently selected from hydrogen, substituted or unsubstituted C1 to C30 alkyl, substituted or unsubstituted C3 to C30 cycloalkyl, substituted or unsubstituted C6 to C30 aryl, substituted or unsubstituted C7 to C30 aralkyl, substituted or unsubstituted C1 to C30 heteroalkyl, substituted or unsubstituted C2 to C30 heterocycloalkyl, Substituted or unsubstituted C2 to C30 alkenyl, substituted or unsubstituted C2 to C30 alkynyl, substituted or unsubstituted C1 to C30 alkoxy, substituted or unsubstituted C1 to C30醯a group, a hydroxyl group, or a combination thereof, at least one of R ⁵ to R ¹⁰ comprising a substituted or unsubstituted alkenyl group, and Y ^{1 is} selected from a single bond, a substituted or unsubstituted C1 to C20 alkylene group, Substituted or unsubstituted C3 to C20 cycloalkyl, substituted or unsubstituted C2 to C20 heterocycloalkyl, substituted or unsubstituted C6 to C20 extended aryl, substituted or unsubstituted Substituted C2 to C20 heteroaryl, substituted or unsubstituted C2 to C20 alkenyl, substituted or unsubstituted C2 to C20 alkynyl, or a combination thereof, 0 < M1 < 1, 0 D1<1, 0 T1<1, 0 T2<1, 0 Q1<1, and M1+D1+T1+T2+Q1=1.

At least one of R ⁵ to R ¹⁰ may include a substituted or unsubstituted C6 to C30 aryl group.

The first oxane compound may be a decane compound having a D1 of 0 and T1 And a mixture of oxoxane compounds having a T2 of zero.

The first oxane compound may be a mixture of a compound represented by Chemical Formula 6a and a compound represented by Chemical Formula 6b.

[Chemical Formula 6a] (Me ₂ ViSiO _1/2 ) _0.322 (PhSiO _3/2 ) _0.678

[Chemical Formula 6b] (Me ₂ ViSiO _1/2 ) _0.206 (PhMeSiO _2/2 ) _0.794

The hardener of Chemical Formula 1 in the composition may be contained in an amount of less than about 50% by weight based on the total amount of the hardener and the first siloxane compound, and may be based on the total amount of the hardener and the first siloxane compound An amount greater than about 50% by weight comprises the first oxane compound.

The sealant composition may further contain a second oxane compound represented by Chemical Formula 7.

(R ¹¹ R ¹² R ¹³ SiO _1/2 ) _M2 (R ¹⁴ R ¹⁵ SiO _2/2 ) _D2 (R ¹⁶ SiO _3/2 ) _T3 (SiO _3/2 -Y ² -SiO _3/2 ) _T4 (SiO _4/2 ) _Q2

In Chemical Formula 7, R ¹¹ to R ^{16 are} independently selected from hydrogen, substituted or unsubstituted C1 to C30 alkyl, substituted or unsubstituted C3 to C30 cycloalkyl, substituted or unsubstituted C6 to C30 aryl, substituted or unsubstituted C7 to C30 aralkyl, substituted or unsubstituted C1 to C30 heteroalkyl, substituted or unsubstituted C2 to C30 heterocycloalkyl, Substituted or unsubstituted C2 to C30 alkynyl, substituted or unsubstituted C1 to C30 alkoxy, substituted or unsubstituted C1 to C30 alkyl, hydroxy, or a combination thereof, R ¹¹ to R ¹⁶ At least one of them comprises hydrogen, Y ^{2 is} selected from a single bond, a substituted or unsubstituted C1 to C20 alkylene group, a substituted or unsubstituted C3 to C20 cycloalkylene group, substituted or unsubstituted C6 to C20 extended aryl, substituted or unsubstituted C2 to C20 heteroaryl, substituted or unsubstituted C2 to C20 alkenyl, substituted or unsubstituted C2 to C20 alkynyl , or a combination thereof, 0<M2<1, 0 D3<1, 0 T2<1, 0 T3<1, 0 Q2<1, and M2+D3+T2+T3+Q2=1.

When the second oxoxane compound represented by Chemical Formula 7 is contained, the second oxoxane compound may be contained in an amount of 5 wt% to 95 wt% based on the weight of the hardener of Chemical Formula 1. Herein, the total amount of the hardener and the second oxane compound may be contained in an amount of less than 50% by weight based on the total amount of the first siloxane compound, the hardener, and the second oxane compound, and may be based on the first The total amount of the oxoxane compound, the hardener, and the second oxane compound is contained in an amount of more than 50% by weight of the first siloxane compound.

According to another embodiment, a sealant obtained by curing a sealant composition is provided.

According to still another embodiment, an electronic component including the encapsulant is provided.

The sealant composition containing the hardener of Chemical Formula 1 can improve the mechanical properties, heat resistance, and high temperature characteristics of the sealant from which it is cured.

110‧‧‧Mold

120‧‧‧Frame

140‧‧‧Light Emitting Diode Wafer

150‧‧‧ wiring

190‧‧‧ Phosphor

200‧‧‧Sealant

1 is a schematic cross section of a light emitting diode according to an embodiment Figure.

The exemplary embodiments of the present invention will be described in detail below, and can be easily performed by those of ordinary skill in the art. However, the disclosure may be embodied in many different forms and is not construed as being limited to the illustrative embodiments set forth herein.

In the specification, when a definition is not otherwise provided, "substituted" means that one of the compounds is substituted with hydrogen of a compound: a halogen atom (F, Br, Cl or I), a hydroxyl group, Alkoxy, nitro, cyano, amino group, azido, methionyl, fluorenyl, fluorenylene, carbonyl, amine carbaryl, thiol, ester, carboxyl or a salt thereof, a sulfonic acid group or a salt thereof, phosphoric acid or a salt thereof, a C1 to C20 alkyl group, a C2 to C20 alkenyl group, a C2 to C20 alkynyl group, a C6 to C30 aryl group, a C7 to C30 aralkyl group, a C1 to C30 alkoxy group, C1 to C20 heteroalkyl, C3 to C20 heteroarylalkyl, C3 to C30 cycloalkyl, C3 to C15 cycloalkenyl, C6 to C15 cycloalkynyl, C3 to C30 heterocycloalkyl, and combinations thereof.

In the specification, when no definition is provided, "hetero" means that one contains 1 to 3 hetero atoms selected from N, O, S, and P.

Hereinafter, a sealant composition according to one embodiment will be described.

According to one embodiment, there is provided a sealant composition comprising at least one first oxoxane compound having a bonded fluorenyl group (Si-Vi), and a hardener of Chemical Formula 1: [Chemical Formula 1] HR ¹ R ² Si-A-SiR ³ R ⁴ H

In Chemical Formula 1, A is selected from a substituted or unsubstituted C1 to C20 alkylene group, a substituted or unsubstituted C6 to C30 cycloalkylene group, a substituted or unsubstituted C6 to C30 heterocyclic ring. Alkyl, substituted or unsubstituted C6 to C30 extended aryl, substituted or unsubstituted C2 to C30 heteroaryl, substituted or unsubstituted C2 to C20 extended alkenyl, substituted or not Substituted C2 to C20 alkynyl, or a combination thereof, and R ¹ , R ² , R ³ and R ^{4 are} independently selected from hydrogen, substituted or unsubstituted C1 to C20 alkyl, substituted or unsubstituted Substituted C7 to C20 aralkyl, substituted or unsubstituted C1 to C20 heteroalkyl, substituted or unsubstituted C3 to C20 cycloalkyl, substituted or unsubstituted C2 to C20 heterocycloalkane a substituted or unsubstituted C2 to C20 alkenyl group, a substituted or unsubstituted C2 to C20 alkynyl group, a substituted or unsubstituted C6 to C20 aryl group, a substituted or unsubstituted C1 to C10 alkoxy, substituted or unsubstituted C1 to C30 alkyl, hydroxy, halogen, or a combination thereof.

As mentioned above, the sealant is a material that protects the LED wafer and phosphorus. The light body protects the LED wafer and the phosphor from the sulfur compound and the like, and protects the LED wafer and the phosphor from the light at various wavelengths. Material that is emitted to the outside. In general, when a metal-containing optical component is exposed to a contamination factor, most of the external contamination factor penetrates through the encapsulant, and thus the metal material is corroded and discolored, and thus the brightness and transmittance of the optical component are reduced.

The sealant should basically have a solid hardness to primarily protect the optical zero The improvement of the hardness and density of the sealant is also related to the improvement of moisture impermeability and gas impermeability, and causes improvement in reliability, which is an important property (fading resistance and chemical resistance) of the sealant.

About the conventional curable organic fluorenone sealant (curable Organosilicone encapsulant), the amount of the organic fluorenone composition having a T structure (branched type) is adjusted to improve adhesion and density, but this method increases the viscosity of the sealant, which causes problems in processability during mixing and curing.

Regarding the conventional hydrazine hydride-curable hydrazine sealant, added with a T structure The organic ruthenium composition and heat are cured to increase its hardness, and the hardness is determined by the amount of the T structure. However, when the amount of the T structure is simply increased, the coefficient of thermal expansion (CTE) is increased, and thus the sealant has a plurality of cracks via curing. However, only a small effect of reducing moisture permeability and gas permeability is obtained with respect to the improved hardness. In addition, the organic fluorenone composition having a T structure has a high viscosity, and thus has a processing problem that requires more time to mix during coating and requires high pressure.

When the hardener of Chemical Formula 1 according to the embodiment is used, there is no change In the case of the amount of the T structure in the ketone composition, the resulting material may have various hardnesses and at the same time have an improved effect of reducing moisture permeability and gas permeability. In addition, the mechanical properties of the sealant can be improved by introducing a ruthenium carbon repeating unit different from the conventional siloxane scavenger.

In terms of reliability relative to external contamination factors, based on the inclusion of phenyl The in-depth study of the fading resistance and chemical resistance of the extremely transparent curable organic fluorenone resin, and the application of the hardener of Chemical Formula 1 which has excellent surface characteristics and low permeability performance. In addition, when the fluorenone resin composition containing this hardener is used for the manufacture of the sealant, the sealant does not fade in the operation test in the case of exposure to a contamination factor, and hardly reduces the brightness of the LED package.

The sealant composition containing the hardener of Chemical Formula 1 has various Excellent physical strength of the resin substrate and compatibility with conventional sulfhydryl compositions and improved mechanical properties because the hardener introduces a fluorene repeating unit rather than a simple decane repeating unit as a main chain To the ketone sealant composition. The hardener of Chemical Formula 1 is a novel hardener, and the curable organic siloxane composition containing the hardener has excellent hardness and forms a dense structure surrounding various organic resin substrates, and thus, has a decane The hardener of Chemical Formula 1 exhibits a lower gas permeability than the conventional hardener of the structure and exhibits excellent mechanical properties. Therefore, the improvement of the gas impermeability can solve the problem of reducing the optical characteristics of the LED due to prolonged exposure to the outside. In addition, the sealant comprising the composition according to the embodiment has a structure which can be more stably substituted with a phenyl group, and can be suitably formed to be cured which maintains a high refractive index and has heat resistance as compared with a structure of a conventional hardener. product. This curable organic decane composition has a dense structure and, therefore, as demonstrated in the following examples, the curable organic decane composition has high hardness and low gas permeability. At the same time, the curable organodecane composition increases adhesion and additionally exhibits a low coefficient of thermal expansion and low modulus, and thus produces fewer cracks and bands after curing.

In an exemplary embodiment, A of Chemical Formula 1 may be selected from substituted or unsubstituted Substituted C1 to C10 alkylene, substituted or unsubstituted C6 to C20 cycloalkyl, substituted or unsubstituted C6 to C20 extended aryl, or a combination thereof.

In an exemplary embodiment, R ¹ , R ² , R ³ and R ⁴ may be independently selected from hydrogen, substituted or unsubstituted C1 to C10 alkyl, substituted or unsubstituted C6 to C20 naphthenic a substituted or unsubstituted C6 to C20 aryl group, a substituted or unsubstituted C2 to C10 alkenyl group, a substituted or unsubstituted C2 to C20 alkynyl group, a substituted or unsubstituted C1 to C10 alkoxy, hydroxy, halogen, or a combination thereof.

In an exemplary embodiment, the compound of Chemical Formula 1 may be selected from the compounds represented by Chemical Formulas 2 to 5:

In Chemical Formula 2, R ^a , R ^b , R ^c and R ^d are the same or different and are independently hydrogen, hydroxy, substituted or unsubstituted C1 to C5 alkyl, or substituted or unsubstituted Substituted C6 to C10 aryl, and k is an integer from 1 to 3.

In Chemical Formula 3, R ^a , R ^b , R ^c and R ^d are the same or different and are independently hydrogen, hydroxy, substituted or unsubstituted C1 to C5 alkyl, or substituted or unsubstituted Substituted C6 to C10 aryl, and l is an integer from 1 to 5.

In Chemical Formula 4, R ^a , R ^b , R ^c and R ^d are the same or different and are independently hydrogen, hydroxy, substituted or unsubstituted C1 to C5 alkyl, or substituted or unsubstituted Substituted C6 to C10 aryl, m and n are independently an integer from 0 to 5, and o and p are independently integers from 1 to 5.

In Chemical Formula 5, R ^a , R ^b , R ^c and R ^d are the same or different and are independently hydrogen, hydroxy, substituted or unsubstituted C1 to C5 alkyl, or substituted or unsubstituted Substituted C6 to C10 aryl, and q is an integer from 1 to 3.

The hardener of Chemical Formula 1 or Chemical Formula 2 to 5 has hydrogen (Si-H) bonded to ruthenium, and thus the hydrogen (Si-H) bonded to ruthenium may be bonded to an alkenyl group having a bond 矽 (Si-Vi) The at least one first oxane compound is bonded to the enthalpy alkenyl group.

The first oxane compound and the hardener of Chemical Formula 1 can be subjected to a hydrazine hydrogenation reaction. Therefore, when the sealant composition is cured, a dense polyoxymethane structure having a large molecular weight is formed, and the light-emitting element is protected from external moisture and gas.

At least one first oxane compound having a fluorene-bonded alkenyl group (Si-Vi) can be represented by Chemical Formula 6.

(R ⁵ R ⁶ R ⁷ SiO _1/2 ) _M1 (R ⁸ R ⁹ SiO _2/2 ) _D1 (R ¹⁰ SiO _3/2 ) _T1 (SiO _3/2 -Y ¹ -SiO _3/2 ) _T2 (SiO _4/2 ) _Q1

In Chemical Formula 6, R ⁵ to R ^{10 are} independently selected from hydrogen, substituted or unsubstituted C1 to C30 alkyl, substituted or unsubstituted C3 to C30 cycloalkyl, substituted or unsubstituted C6 to C30 aryl, substituted or unsubstituted C7 to C30 aralkyl, substituted or unsubstituted C1 to C30 heteroalkyl, substituted or unsubstituted C2 to C30 heterocycloalkyl, Substituted or unsubstituted C2 to C30 alkenyl, substituted or unsubstituted C2 to C30 alkynyl, substituted or unsubstituted C1 to C30 alkoxy, substituted or unsubstituted C1 to C30醯a group, a hydroxyl group, or a combination thereof, at least one of R ⁵ to R ¹⁰ comprising a substituted or unsubstituted alkenyl group, Y ¹ being a single bond, a substituted or unsubstituted C1 to C20 alkyl group, Substituted or unsubstituted C3 to C20 cycloalkyl, substituted or unsubstituted C2 to C20 heterocycloalkyl, substituted or unsubstituted C6 to C20 extended aryl, substituted or unsubstituted C2 to C20 heteroaryl, substituted or unsubstituted C2 to C20 alkenyl, substituted or unsubstituted C2 to C20 alkynyl, or a combination thereof, 0 < M1 < 1, 0 D1<1, 0 T1<1, 0 T2<1, 0 Q1<1, and M1+D1+T1+T2+Q1=1.

The first oxane compound is a compound having a bonded fluorenyl alkenyl group (Si-Vi) and may comprise, for example, an average of two or more than two bonded fluorenyl groups per molecule (Si-Vi) . The bonded fluorenyl alkenyl group (Si-Vi) can react with hydrogen at the end of the hardener of Chemical Formula 1.

The first oxoxane compound can be obtained by hydrolysis and condensation polymerization selected from, for example, at least one of: a monomer represented by R ⁵ R ⁶ R ⁷ SiZ ¹¹ , by R ⁸ R a monomer represented by ⁹ SiZ ¹² Z ¹³ , a monomer represented by R ¹⁰ SiZ ¹⁴ Z ¹⁵ Z ¹⁶ , a single represented by Z ¹⁷ Z ¹⁸ Z ¹⁹ Si-Y ¹ -SiZ ²⁰ Z ²¹ Z ²² The body, and the monomer represented by SiZ ²³ Z ²⁴ Z ²⁵ Z ²⁶ . Herein, R ⁵ to R ¹⁰ are the same as defined above, and Z ¹¹ to Z ^{26 are} independently a C1 to C6 alkoxy group, a hydroxyl group, a halogen group, a carboxyl group, or a combination thereof.

At least one of R ⁵ to R ¹⁰ may include a substituted or unsubstituted C6 to C30 aryl group. Therefore, the optical properties can be preserved by increasing the refractive index of the sealant of the first siloxane compound.

One or two or more than two first oxane compounds may be used.

In an exemplary embodiment, the first oxane compound may be a mixture of a decane compound having a D1 of 0 and a oxoxane compound having a T1 and a T2 of 0.

The hardener of Chemical Formula 1 in the composition may be contained in an amount of less than about 50% by weight based on the total amount of the hardener and the first siloxane compound, and may be based on the total amount of the hardener and the first siloxane compound An amount greater than about 50% by weight comprising the first oxoalkylation Compound.

The sealant composition may further contain a second oxane compound represented by Chemical Formula 7.

(R ¹¹ R ¹² R ¹³ SiO _1/2 ) _M2 (R ¹⁴ R ¹⁵ SiO _2/2 ) _D2 (R ¹⁶ SiO _3/2 ) _T3 (SiO _3/2 -Y ² -SiO _3/2 ) _T4 (SiO _4/2 ) _Q2

In Chemical Formula 7, R ¹¹ to R ^{16 are} independently selected from hydrogen, substituted or unsubstituted C1 to C30 alkyl, substituted or unsubstituted C3 to C30 cycloalkyl, substituted or unsubstituted C6 to C30 aryl, substituted or unsubstituted C7 to C30 aralkyl, substituted or unsubstituted C1 to C30 heteroalkyl, substituted or unsubstituted C2 to C30 heterocycloalkyl, Substituted or unsubstituted C2 to C30 alkynyl, substituted or unsubstituted C1 to C30 alkoxy, substituted or unsubstituted C1 to C30 alkyl, hydroxy, or a combination thereof, R ¹¹ to R ¹⁶ At least one of them comprises hydrogen, Y ^{2 is} selected from a single bond, a substituted or unsubstituted C1 to C20 alkylene group, a substituted or unsubstituted C3 to C20 cycloalkylene group, substituted or unsubstituted C6 to C20 extended aryl, substituted or unsubstituted C2 to C20 heteroaryl, substituted or unsubstituted C2 to C20 alkenyl, substituted or unsubstituted C2 to C20 alkynyl , or a combination thereof, 0<M2<1, 0 D3<1, 0 T2<1, 0 T3<1, 0 Q2<1, and M2+D3+T2+T3+Q2=1.

The second oxane compound is a compound having a bonded hydrazine hydrogen (Si-H), and may contain, for example, an average of two or more than two bonded hydrazine hydrogen (Si-H) per molecule. The bonding of hydrogen (Si-H) to the bond of the first oxane compound Alkenyl reaction.

The second oxane compound can be obtained by hydrolysis and condensation polymerization of, for example, at least one of: a monomer represented by R ¹¹ R ¹² R ¹³ SiZ ²⁷ , by R ¹⁴ R ¹⁵ SiZ ²⁸ Z ²⁹ represents a monomer, a monomer represented by R ¹⁶ SiZ ³⁰ Z ³¹ Z ³² , a single represented by Z ³³ Z ³⁴ Z ³⁵ Si-Y ¹ -SiZ ³⁶ Z ³⁷ Z ³⁸ The body, and the monomer represented by SiZ ³⁹ Z ⁴⁰ Z ⁴¹ Z ⁴² . Herein, R ¹¹ to R ¹⁶ are the same as defined above, and Z ²⁷ to Z ^{42 are} independently a C1 to C6 alkoxy group, a hydroxyl group, a halogen group, a carboxyl group, or a combination thereof.

At least one of R ¹¹ to R ¹⁶ may include a substituted or unsubstituted C6 to C30 aryl group. Therefore, the optical properties can be preserved by increasing the refractive index of the sealant containing the second siloxane compound.

When the second oxoxane compound represented by Chemical Formula 7 is contained, The second oxoxane compound is contained in an amount of 5 wt% to 95 wt% based on the weight of the hardener of Chemical Formula 1. Herein, based on the total amount of the first oxane compound, the hardener, and the second oxane compound, the total amount of the hardener and the second siloxane compound may be less than about 50% by weight, and based on the first oxirane The total amount of the compound, the hardener, and the second oxoxane compound contains the first oxoxane compound in an amount of more than 50% by weight.

The first oxane compound and the second siloxane compound each may have a weight average molecular weight of from about 100 g/mol to 30,000 g/mol.

The sealant composition may further comprise a filler.

The filler may, for example, be made of an inorganic oxide, such as ceria, alumina, titania, zinc oxide, or a combination thereof.

The sealant composition may further comprise a rhodium hydrogenation catalyst.

The ruthenium hydrogenation catalyst promotes hardening of the first oxime and the chemical formula 1 a hydrazine hydrogenation reaction of the agent, and when further comprising a second siloxane, the hydrazine hydrogenation catalyst promotes a hydrazine hydrogenation reaction of the first oxane, the hardener, and the second oxane, and the hydrazine hydrogenation catalyst can Containing, for example, platinum, rhodium, palladium, iridium, iridium or combinations thereof.

The ruthenium hydrogenation catalyst may be contained in an amount of from about 0.1 ppm to 1000 ppm based on the total amount of the sealant composition.

The sealant composition is heat treated and cured at a predetermined temperature and can be used as a sealant. A sealant can be applied to, for example, electronic components such as light emitting diodes and organic light emitting diode elements.

Hereinafter, a light-emitting diode of one example of an electronic component manufactured by applying a sealant according to an embodiment will be described with reference to FIG.

FIG. 1 is a schematic cross-sectional view showing a light emitting diode according to an embodiment.

Referring to FIG. 1, the light emitting diode includes: a mold 110; a lead frame 120 disposed inside the mold 110; a light emitting diode chip 140 mounted on the lead frame 120; and a lead frame 120 connected to the light emitting diode chip 140. a wiring 150; and an encapsulant 200 covering the LED wafer 140.

The sealant 200 is obtained by curing the sealant composition. The encapsulant 200 is formed of a composition, and thus, the light-emitting diode wafer 140 can be effectively protected and the performance of the light-emitting diode is prevented from deteriorating.

Phosphor 190 can be dispersed in encapsulant 200. Phosphor 190 contains a material that is excited by light and emits light in its intrinsic wavelength range, and contains quantum dots such as semiconductor nanocrystals on a large scale. The phosphor 190 may include, for example, a mixture of two or more selected from the group consisting of a blue phosphor, a green phosphor, or a red phosphor.

Phosphor 190 can be used as a light-emitting diode wafer as a light-emitting part The light supplied 140 displays the color in a predetermined wavelength region, and herein, the light emitting diode wafer 140 may display a color in a wavelength region shorter than the color displayed by the phosphor 190. For example, when the phosphor 190 displays red, the light emitting diode wafer 140 may exhibit blue or green having a wavelength region shorter than red.

In addition, the color emitted by the self-luminous diode chip 140 can be self-phosphorescent The color combinations emitted by the volume 190, and thus, are displayed in white. For example, when the light emitting diode chip 140 supplies blue light and the phosphor 190 includes a red phosphor and a green phosphor, the electronic components may combine blue, red, and green and display white.

Phosphor 190 can be omitted.

Hereinafter, the present disclosure will be described in more detail with reference to examples. However, these examples are illustrative, and the disclosure is not limited thereto.

[Example]

Synthesis Example: Synthesis of a siloxane compound

Synthesis Example 1: Synthesis of a first oxane compound

1 kg of a mixed solvent obtained by mixing water and toluene in a weight ratio of 5:5 was placed in a 3-necked flask, and ethylene dimethyl chlorodecane and phenyl trichloride were mixed by molar ratio of 32.2:67.8. The monomer mixture obtained from decane was added thereto in a dropwise manner over 2 hours while maintaining the flask at 23 °C. When the addition in a dropwise form was completed, the obtained mixture was heated and refluxed at 90 ° C for 3 hours to carry out a condensation polymerization reaction. Subsequently, after the resultant was cooled to room temperature, the aqueous layer was removed therefrom to prepare a polymer solution dissolved in toluene. The obtained polymer solution was washed with water to remove chlorine in the reaction by-product. Subsequently, the neutral polymer solution was distilled under reduced pressure to remove toluene, thereby obtaining a oxoxane compound represented by Chemical Formula 6a.

[Chemical Formula 6a] (Me ₂ ViSiO _1/2 ) _0.322 (PhSiO _3/2 ) _0.678

Synthesis Example 2: Synthesis of a first oxane compound

1 kg of a mixed solvent obtained by mixing water and toluene in a weight ratio of 5:5 was placed in a 3-necked flask, and ethylene dimethylchloromethane and benzyldichloromethane having a molar ratio of 20.6:79.4 were used. The monomer mixture was added to it dropwise in 2 hours while maintaining the flask at 23 °C. When the addition in the dropwise form was completed, the mixture was heated and refluxed at 90 ° C for 3 hours to carry out a condensation polymerization reaction. Subsequently, after the resultant was cooled to room temperature, the aqueous layer was removed therefrom to prepare a polymer solution dissolved in toluene. The obtained polymer solution was washed with water to remove chlorine in the reaction by-product. Subsequently, the neutral polymer solution was distilled under reduced pressure to remove toluene, thereby obtaining a oxoxane compound represented by Chemical Formula 6b.

[Chemical Formula 6b] (Me ₂ ViSiO _1/2 ) _0.206 (PhMeSiO _2/2 ) _0.794

Synthesis Example 3: Synthesis of a second oxane compound

1 kg of a mixed solvent obtained by mixing water and toluene in a weight ratio of 5:5 was placed in a 3-necked flask, and tetramethyldioxane and diphenyldichloride having a molar ratio of 66.7:33.3 were used. The monomer mixture of decane was added to it dropwise in 2 hours while maintaining the flask at 23 °C. When the addition in the dropwise form was completed, the mixture was heated and refluxed at 90 ° C for 3 hours to carry out a condensation polymerization reaction. Subsequently, after the resultant was cooled to room temperature, the aqueous layer was removed therefrom to prepare a polymer solution dissolved in toluene. The obtained polymer solution was washed with water to remove chlorine in the reaction by-product. Subsequently, the neutral polymer solution was distilled under reduced pressure to remove toluene, thereby obtaining a oxoxane compound represented by Chemical Formula 7a.

[Chemical Formula 7a] (Me ₂ HSiO _1/2 ) _0.667 (PhPeSiO _2/2 ) _0.333

Examples 1 to 5 and Comparative Example 1: Preparation of sealant composition

The decane compound according to Synthesis Examples 1 and 2 was mixed at a weight ratio as provided in the following Table 1, thereby preparing a first oxane compound containing two compounds of a fluorene-bonded alkenyl group (Si-Vi). Next, each of the mixtures (mixtures of Examples 1 to 4) was prepared by separately adding the compounds represented by Chemical Formulas 8 to 11 as a hardener to the first oxoxane compound at a content ratio as provided in Table 1 below. . In addition, the compound represented by Chemical Formula 8 and the decane compound represented by Chemical Formula 7a according to Synthesis Example 3 were added as a hardener to the first oxoxane compound by the content ratios provided in Table 1 below. A mixture (mixture of Example 5) was prepared. Further, in the case where the compound represented by Chemical Formulas 8 to 11 was not added as a hardener, a mixture (mixture of Comparative Example 1) was prepared by including a oxoxane compound in the amount provided in Table 1 below, this oxirane The compound was represented by adding Chemical Formula 7a to the first oxane compound according to Synthesis Example 3. Next, after adding a ruthenium hydrogenation catalyst Pt-CS 2.0 (Umicore) to each mixture in an amount of 5 ppm based on the total weight of each mixture, each mixture was removed by vacuum and foam, thereby preparing Each of the sealant compositions according to Examples 1 to 5 and Comparative Example 1 as provided in Table 1 below.

The viscosity and refractive index of the prepared sealant composition were measured in the following methods. Next, each composition was cured at 120 ° C for 30 minutes, and then at 170 ° C for 1 hour, and then, its hardness (Shore A and Shore D), modulus, thermal shock characteristics, moisture Permeability and gas permeability were measured in the following methods. The results are provided in Table 1 below.

- Viscosity: Viscosity was measured by reference to Brookfield (DV-II+pro) shaft No. 52 at a viscosity of 23 ° C and a torque of 90%.

- Refractive index: The refractive index of the liquid mixture before curing was measured by using an Abbe refractometer at a wavelength of D line (589 nm).

- Hardness: Hardness was measured by the following operations: The polyoxane compositions according to Examples 1 to 5 and Comparative Example 1 were respectively placed on a mold coated with Teflon (2.5 cm (width) × 7.5 cm) (length) × 1 cm (thickness)), it was heated at 150 ° C for 2 hours, it was cooled to room temperature, and a Shore A durometer was used.

- Modulus: Modulus was measured by the following operations: The polyoxane compositions according to Examples 1 to 5 and Comparative Example 1 were respectively placed on a mold coated with Teflon (35 mm (width) × 10 mm (length) × 4 mm (thickness)), it was cured at 150 ° C for 2 hours, and it was cooled to room temperature, and then, the temperature was increased from -50 ° C to 150 ° C at a speed of 2 ° C / min, The storage modulus at 125 ° C was recorded by DMA (Dynamic Mechanical Analysis).

- Thermal shock test: The packaged sample was prepared by placing the polyoxyalkylene composition according to Examples 1 to 5 and Comparative Example 1 and the YAG phosphor in LED PKG (5630PKG, Samsung Electronics), respectively. It was cured at 150 ° C for 2 hours and allowed to cool to room temperature. Subsequently, the package was exposed under the following conditions for a predetermined period of time as one cycle, the operation of the packaged samples was tested after repeating the cycle for 1000 times, and the number of non-operational packages was calculated.

(i) Conditions: The package was exposed to low temperatures and high temperatures by moving the package back and forth to the chambers while maintaining the chambers at -45 ° C and 125 ° C, respectively. -45 ° C (maintained for 30 minutes) <-> 125 ° C (maintained for 30 minutes).

(ii) Adhesion: Adhesion was measured in the following methods.

A PTFE separator (width: 10 mm, length: 20 mm, thickness: 1 mm) was inserted between two sheets of a silver sample (width: 25 mm, length: 50 mm, thickness: 1 mm), according to Examples 1 to 5 and The polyoxyalkylene composition of Comparative Example 1 was charged in an additional space remaining between the silver samples, respectively, and the silver sample was fixed with a clip. Subsequently, the silver sample was allowed to stand in an oven at 150 ° C for 2 hours to cure the composition. After the sample was cooled to room temperature, the separator and the clip were removed, and the silver sample was placed in a tensile tester (3367, Instron), and the stress at the moment the silver sample broke. It is measured by pulling it horizontally.

- Moisture permeability and gas permeability: moisture permeability and gas permeability were measured by the following operations: each sealant was fabricated into a film by a frame, and the film was cured at 130 ° C for 5 minutes, and Next, at 170 ° C for 4 hours, and then, a moisture permeability device (ASTM F-1249) / gas permeability device (ASTM D-3985) made by MOCON was used.

(Table 1)

(The content of each component is used in wt%)

As shown in Table 1, the compositions according to Examples 1 to 5 using the hardeners containing the compounds represented by Chemical Formulas 8 to 11 exhibited higher viscosities than the compositions according to Comparative Example 1. In other words, the hardener having a fluorene bond represented by Chemical Formulas 8 to 11 forms a polysiloxane having a dense structure as compared with the siloxane scavenger. Therefore, the results show that the viscosity of the sealant composition can be adjusted by changing a hardener, that is, without controlling the siloxane compound having a T structure (that is, the siloxane compound according to Synthesis Example 1). The amount of the hardener is changed in the case of the amount. The sealant compositions according to Examples 1 to 5 and Comparative Example 1 exhibited a refractive index greater than or equal to 1.5.

The composition is cured separately under the curing conditions described above, and by separate The hardness, modulus, and thermal shock characteristics of each of the sealants produced using the composition were measured. As shown in Table 1, the sealants comprising the hardeners represented by Chemical Formulas 8 to 11 according to Examples 1 to 5 exhibited higher than or equal to the hardness of the sealant according to Comparative Example 1 (Shore A and Shore D). ). Further, the modulus of the sealant containing the hardeners represented by Chemical Formulas 8 to 11 according to Examples 1 to 5 was much lower than that of the sealant of Comparative Example 1. In other words, the sealant composition containing a hardener according to an embodiment of the present invention exhibits a relatively high viscosity in a liquid state before curing, and the sealant produced by curing the composition exhibits a much higher film density and high hardness. . As described above, the sealant generally functions to protect the light-emitting element and the like, and herein, the sealant of the present invention exhibits increased mechanical properties such as hardness, and therefore, it is desirable to satisfy the first requirement of protecting the light-emitting element. On the other hand, a sealant having a high hardness but a high modulus may have cracks when the temperature is changed, and therefore, should have a lower modulus. As shown in Table 1, the sealants according to Examples 1 to 5 exhibited significantly lower modulus than the sealants according to Comparative Example 1. This corresponds to the thermal shock test results of these sealants. In other words, regarding the sealants according to Examples 1 to 5, all 100 of the 100 light-emitting elements were operated after 1000 cycles, while with respect to the sealant according to Comparative Example 1, only 65 of the 100 light-emitting elements The light-emitting elements were operated after 1000 cycles. Thus, the sealant according to Comparative Example 1 exhibited lower thermal shock characteristics greater than or equal to about 35% compared to the sealants according to Examples 1 through 5.

On the other hand, when the viscosity of the liquid sealant composition increases, the film The density can be increased, and the sealant formed of the composition has an effect of preventing moisture or gas from permeating from the outside. As shown in Table 1, compared with the sealant according to Comparative Example 1, The sealants according to Examples 1 to 5 exhibited significantly lower moisture permeability, as well as significantly reduced gas permeability. In other words, when a hardener of Chemical Formulas 8 to 11 having a ruthenium carbon bond is used, not only simple mechanical properties such as hardness and the like are obtained, but also moisture and gas permeability are remarkably reduced due to the increased density of the film. And, therefore, the sealant can be suitably used to prevent contamination factors from the outside.

As illustrated above, the composition of the sealant in accordance with one embodiment of the present invention The product exhibits excellent hardness and mechanical properties as well as the effect of reducing moisture and oxygen permeability, and thus can be used as an adhesive for electronic components, electronic parts, electronic appliances, adhesives for electric parts, and the like. Coating materials, underfills, and the like for protection. In particular, a cured product produced by using a composition has a high refractive index and a high light transmittance, and thus can be applied to a sealant, an adhesive, a binder, a coating material, an underfill, and the like. For use in optical semiconductors or other parts for optical semiconductors. For example, the composition according to an exemplary embodiment of the present invention can be applied to a sealant for an LED display and the like.

Although the present invention has been described in connection with what is presently described as the exemplary embodiments, it is understood that the invention is not to be construed as Modifications and equivalent configurations.

110‧‧‧Mold

120‧‧‧Frame

140‧‧‧Light Emitting Diode Wafer

150‧‧‧ wiring

190‧‧‧ Phosphor

200‧‧‧Sealant

Claims (14)

A sealant composition comprising: at least one first oxoxane compound having a bonded hydrazine alkenyl group (Si-Vi), and a hardener of Chemical Formula 1: [Chemical Formula 1] HR ¹ R ² Si-A-SiR ³ R ⁴ H In Chemical Formula 1, A is selected from substituted or unsubstituted C1 to C20 alkyl, substituted or unsubstituted C6 to C30 cycloalkyl, substituted or unsubstituted C6 to C30 heterocyclic alkyl, substituted or unsubstituted C6 to C30 extended aryl, substituted or unsubstituted C2 to C30 heteroaryl, substituted or unsubstituted C2 to C20 extended alkenyl, Substituted or unsubstituted C2 to C20 alkynyl or a combination thereof, and R ¹ , R ² , R ³ and R ^{4 are} independently selected from hydrogen, substituted or unsubstituted C1 to C20 alkyl, substituted Or unsubstituted C7 to C20 aralkyl, substituted or unsubstituted C1 to C20 heteroalkyl, substituted or unsubstituted C3 to C20 cycloalkyl, substituted or unsubstituted C2 to C20 Heterocycloalkyl, substituted or unsubstituted C6 to C20 aryl, substituted or unsubstituted C2 to C20 alkenyl, substituted or unsubstituted C2 to C20 alkynyl, substituted or unsubstituted of C1 to C10 alkoxy, substituted or unsubstituted C1 to C30 alkyl, hydroxy, halogen or a combination thereof. The sealant composition of claim 1, wherein A is selected from substituted or unsubstituted C1 to C10 alkylene, substituted or unsubstituted C6 to C20 cycloalkyl, substituted Or unsubstituted C6 to C20 extended aryl or a combination thereof, and R ¹ , R ² , R ³ and R ^{4 are} independently selected from hydrogen, substituted or unsubstituted C1 to C10 alkyl, substituted or not Substituted C6 to C20 cycloalkyl, substituted or unsubstituted C6 to C20 aryl, substituted or unsubstituted C2 to C10 alkenyl, substituted or unsubstituted C2 to C20 alkynyl, Substituted or unsubstituted C1 to C10 alkoxy, hydroxy, halogen or a combination thereof. The sealant composition according to claim 1, wherein the compound of Chemical Formula 1 is selected from the compounds represented by Chemical Formulas 2 to 5: In Chemical Formula 2, R ^a , R ^b , R ^c and R ^d are the same or different and are independently hydrogen, hydroxy, substituted or unsubstituted C1 to C5 alkyl, or substituted or unsubstituted Substituted C6 to C10 aryl, and k is an integer from 1 to 3; In Chemical Formula 3, R ^a , R ^b , R ^c and R ^d are the same or different and independently hydrogen, hydroxy, substituted or unsubstituted C1 to C5 alkyl, or substituted or unsubstituted C6 to C10 aryl, and l is an integer from 1 to 5; [Chemical Formula 4] In Chemical Formula 4, R ^a , R ^b , R ^c and R ^d are the same or different and are independently hydrogen, hydroxy, substituted or unsubstituted C1 to C5 alkyl, or substituted or unsubstituted Substituted C6 to C10 aryl, m and n are independently integers 0 to 5, and o and p are independently integers 1 to 5; In Chemical Formula 5, R ^a , R ^b , R ^c and R ^d are the same or different and are independently hydrogen, hydroxy, substituted or unsubstituted C1 to C5 alkyl, or substituted or unsubstituted Substituted C6 to C10 aryl, and q is an integer from 1 to 3. The sealant composition according to claim 1, wherein the compound of Chemical Formula 1 is selected from the compounds represented by Chemical Formulas 8 to 11, [Chemical Formula 10] The sealant composition according to claim 1, wherein the first oxane compound is represented by Chemical Formula 6: [Chemical Formula 6] (R ⁵ R ⁶ R ⁷ SiO _1/2 ) _M1 (R ⁸ R ⁹ SiO _2/2 ) _D1 (R ¹⁰ SiO _3/2 ) _T1 (SiO _3/2 -Y ¹ -SiO _3/2 ) _T2 (SiO _4/2 ) _Q1 In Chemical Formula 6, R ⁵ to R ^{10 are} independent Selected from hydrogen, substituted or unsubstituted C1 to C30 alkyl, substituted or unsubstituted C3 to C30 cycloalkyl, substituted or unsubstituted C6 to C30 aryl, substituted or unsubstituted Substituted C7 to C30 aralkyl, substituted or unsubstituted C1 to C30 heteroalkyl, substituted or unsubstituted C2 to C30 heterocycloalkyl, substituted or unsubstituted C2 to C30 alkenyl , substituted or unsubstituted C2 to C30 alkynyl, substituted or unsubstituted C1 to C30 alkoxy, substituted or unsubstituted C1 to C30 alkyl, hydroxy or a combination thereof, R ⁵ to R At least one of ¹⁰ comprises a substituted or unsubstituted alkenyl group, Y ¹ is a single bond, a substituted or unsubstituted C1 to C20 alkylene group, a substituted or unsubstituted C3 to C20 cycloalkane Base, substituted or unsubstituted C2 to C20 heterocycloalkylene , substituted or unsubstituted C6 to C20 extended aryl, substituted or unsubstituted C2 to C20 heteroaryl, substituted or unsubstituted C2 to C20 alkenyl, substituted or unsubstituted C2 to C20 stretching alkynyl group or a combination thereof, 0 < M1 < 1, 0 D1<1, 0 T1<1, 0 T2<1, 0 Q1<1, and M1+D1+T1+T2+Q1=1. The sealant composition of claim 5, wherein at least one of R ⁵ to R ¹⁰ includes a substituted or unsubstituted C 6 to C 30 aryl group. The sealant composition according to claim 5, wherein the first oxoxane compound is a mixture of a decane compound having a D1 of 0 and a oxoxane compound having a T1 and a T2 of 0. The sealant composition according to claim 7, wherein the first oxoxane compound is a mixture of a compound represented by Chemical Formula 6a and a compound represented by Chemical Formula 6b, [Chemical Formula 6a] ( Me ₂ ViSiO _1/2 ) _0.322 (PhSiO _3/2 ) _0.678 [Chemical Formula 6b] (Me ₂ ViSiO _1/2 ) _0.206 (PhMeSiO _2/2 ) _0.794 . The sealant composition according to claim 1, wherein the hardening represented by Chemical Formula 1 is contained in an amount of less than 50% by weight based on the total amount of the hardener and the first oxoxane compound And the first oxoxane compound 1 is contained in an amount of more than 50% by weight based on the total amount of the hardener and the first oxoxane compound. The sealant composition according to claim 1, further comprising a second oxane compound represented by Chemical Formula 7: [Chemical Formula 7] (R ¹¹ R ¹² R ¹³ SiO _1/2 ) _M2 (R ¹⁴ R ¹⁵ SiO _2/2 ) _D2 (R ¹⁶ SiO _3/2 ) _T3 (SiO _3/2 -Y ² -SiO _3/2 ) _T4 (SiO _4/2 ) _Q2 In Chemical Formula 7, R ¹¹ to R ¹⁶ Independently selected from hydrogen, substituted or unsubstituted C1 to C30 alkyl, substituted or unsubstituted C3 to C30 cycloalkyl, substituted or unsubstituted C6 to C30 aryl, substituted or not Substituted C7 to C30 aralkyl, substituted or unsubstituted C1 to C30 heteroalkyl, substituted or unsubstituted C2 to C30 heterocycloalkyl, substituted or unsubstituted C2 to C30 olefin a substituted or unsubstituted C2 to C30 alkynyl group, a substituted or unsubstituted C1 to C30 alkoxy group, a substituted or unsubstituted C1 to C30 alkyl group, a hydroxyl group or a combination thereof, R ¹¹ to At least one of R ¹⁶ includes hydrogen, Y ^{2 is} selected from a single bond, a substituted or unsubstituted C1 to C20 alkyl group, a substituted or unsubstituted C3 to C20 cycloalkyl group, substituted or not Substituted C6 to C20 extended aryl, substituted or unsubstituted Substituted C2 to C20 heteroaryl extending aryl, substituted or unsubstituted C2 to C20 alkenylene group, a substituted or unsubstituted C2 to C20 alkynyl group, or combinations thereof extending, 0 <M2 <1,0 D3<1, 0 T2<1, 0 T3<1, 0 Q2<1, and M2+D3+T2+T3+Q2=1. The sealant composition according to claim 10, wherein the second oxoxane compound is contained in an amount of 5 wt% to 95 wt% based on the weight of the hardener of Chemical Formula 1. The sealant composition according to claim 11, wherein the total amount of the first oxoxane compound, the hardener, and the second oxane compound is included in an amount of less than 50% by weight. The total amount of the hardener and the second oxoxane compound, and based on the total amount of the first oxoxane compound, the hardener, and the second oxane compound, is greater than 50% by weight The amount comprises the first oxane compound. A sealant obtained by curing the sealant composition as described in claim 1 of the patent application. An electronic component comprising the encapsulant as described in claim 13 of the patent application.