TW201526027A - Conductive composition and method for manufacturing the same, solar cell - Google Patents
Conductive composition and method for manufacturing the same, solar cell Download PDFInfo
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- TW201526027A TW201526027A TW103139980A TW103139980A TW201526027A TW 201526027 A TW201526027 A TW 201526027A TW 103139980 A TW103139980 A TW 103139980A TW 103139980 A TW103139980 A TW 103139980A TW 201526027 A TW201526027 A TW 201526027A
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- 238000003466 welding Methods 0.000 description 1
- 239000008096 xylene Substances 0.000 description 1
- 229910052727 yttrium Inorganic materials 0.000 description 1
- VWQVUPCCIRVNHF-UHFFFAOYSA-N yttrium atom Chemical compound [Y] VWQVUPCCIRVNHF-UHFFFAOYSA-N 0.000 description 1
Classifications
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01B—CABLES; CONDUCTORS; INSULATORS; SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING OR DIELECTRIC PROPERTIES
- H01B1/00—Conductors or conductive bodies characterised by the conductive materials; Selection of materials as conductors
- H01B1/14—Conductive material dispersed in non-conductive inorganic material
- H01B1/16—Conductive material dispersed in non-conductive inorganic material the conductive material comprising metals or alloys
-
- C—CHEMISTRY; METALLURGY
- C03—GLASS; MINERAL OR SLAG WOOL
- C03C—CHEMICAL COMPOSITION OF GLASSES, GLAZES OR VITREOUS ENAMELS; SURFACE TREATMENT OF GLASS; SURFACE TREATMENT OF FIBRES OR FILAMENTS MADE FROM GLASS, MINERALS OR SLAGS; JOINING GLASS TO GLASS OR OTHER MATERIALS
- C03C3/00—Glass compositions
- C03C3/04—Glass compositions containing silica
- C03C3/062—Glass compositions containing silica with less than 40% silica by weight
- C03C3/064—Glass compositions containing silica with less than 40% silica by weight containing boron
- C03C3/066—Glass compositions containing silica with less than 40% silica by weight containing boron containing zinc
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- C—CHEMISTRY; METALLURGY
- C03—GLASS; MINERAL OR SLAG WOOL
- C03C—CHEMICAL COMPOSITION OF GLASSES, GLAZES OR VITREOUS ENAMELS; SURFACE TREATMENT OF GLASS; SURFACE TREATMENT OF FIBRES OR FILAMENTS MADE FROM GLASS, MINERALS OR SLAGS; JOINING GLASS TO GLASS OR OTHER MATERIALS
- C03C3/00—Glass compositions
- C03C3/04—Glass compositions containing silica
- C03C3/062—Glass compositions containing silica with less than 40% silica by weight
- C03C3/07—Glass compositions containing silica with less than 40% silica by weight containing lead
- C03C3/072—Glass compositions containing silica with less than 40% silica by weight containing lead containing boron
-
- C—CHEMISTRY; METALLURGY
- C03—GLASS; MINERAL OR SLAG WOOL
- C03C—CHEMICAL COMPOSITION OF GLASSES, GLAZES OR VITREOUS ENAMELS; SURFACE TREATMENT OF GLASS; SURFACE TREATMENT OF FIBRES OR FILAMENTS MADE FROM GLASS, MINERALS OR SLAGS; JOINING GLASS TO GLASS OR OTHER MATERIALS
- C03C8/00—Enamels; Glazes; Fusion seal compositions being frit compositions having non-frit additions
- C03C8/02—Frit compositions, i.e. in a powdered or comminuted form
- C03C8/04—Frit compositions, i.e. in a powdered or comminuted form containing zinc
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- C—CHEMISTRY; METALLURGY
- C03—GLASS; MINERAL OR SLAG WOOL
- C03C—CHEMICAL COMPOSITION OF GLASSES, GLAZES OR VITREOUS ENAMELS; SURFACE TREATMENT OF GLASS; SURFACE TREATMENT OF FIBRES OR FILAMENTS MADE FROM GLASS, MINERALS OR SLAGS; JOINING GLASS TO GLASS OR OTHER MATERIALS
- C03C8/00—Enamels; Glazes; Fusion seal compositions being frit compositions having non-frit additions
- C03C8/02—Frit compositions, i.e. in a powdered or comminuted form
- C03C8/10—Frit compositions, i.e. in a powdered or comminuted form containing lead
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- C—CHEMISTRY; METALLURGY
- C03—GLASS; MINERAL OR SLAG WOOL
- C03C—CHEMICAL COMPOSITION OF GLASSES, GLAZES OR VITREOUS ENAMELS; SURFACE TREATMENT OF GLASS; SURFACE TREATMENT OF FIBRES OR FILAMENTS MADE FROM GLASS, MINERALS OR SLAGS; JOINING GLASS TO GLASS OR OTHER MATERIALS
- C03C8/00—Enamels; Glazes; Fusion seal compositions being frit compositions having non-frit additions
- C03C8/14—Glass frit mixtures having non-frit additions, e.g. opacifiers, colorants, mill-additions
- C03C8/16—Glass frit mixtures having non-frit additions, e.g. opacifiers, colorants, mill-additions with vehicle or suspending agents, e.g. slip
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01B—CABLES; CONDUCTORS; INSULATORS; SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING OR DIELECTRIC PROPERTIES
- H01B1/00—Conductors or conductive bodies characterised by the conductive materials; Selection of materials as conductors
- H01B1/20—Conductive material dispersed in non-conductive organic material
- H01B1/22—Conductive material dispersed in non-conductive organic material the conductive material comprising metals or alloys
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L31/00—Semiconductor devices sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L31/02—Details
- H01L31/0224—Electrodes
- H01L31/022408—Electrodes for devices characterised by at least one potential jump barrier or surface barrier
- H01L31/022425—Electrodes for devices characterised by at least one potential jump barrier or surface barrier for solar cells
- H01L31/022441—Electrode arrangements specially adapted for back-contact solar cells
- H01L31/02245—Electrode arrangements specially adapted for back-contact solar cells for metallisation wrap-through [MWT] type solar cells
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- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
- Y02E—REDUCTION OF GREENHOUSE GAS [GHG] EMISSIONS, RELATED TO ENERGY GENERATION, TRANSMISSION OR DISTRIBUTION
- Y02E10/00—Energy generation through renewable energy sources
- Y02E10/50—Photovoltaic [PV] energy
Abstract
Description
本發明是關於一種用以形成太陽電池的電極的導電性組成物的製造方法、藉由該製造方法所獲得的導電性組成物及太陽電池。 The present invention relates to a method for producing a conductive composition for forming an electrode of a solar cell, a conductive composition obtained by the method, and a solar cell.
本申請案主張基於2013年11月20日提出申請的日本專利申請案2013-240014號的優先權,該申請案的全部內容作為參照而併入本說明書中。 The present application claims priority to Japanese Patent Application No. 2013-240014, filed on Nov. 20, 2013, the entire disclosure of which is hereby incorporated by reference.
作為將太陽的光能轉換為電力的太陽電池的典型例,已知有將結晶性矽(單晶或多晶)作為半導體基板而利用的太陽電池、所謂結晶矽系太陽電池。作為該結晶矽系太陽電池,已知有例如圖2所示的單面受光型太陽電池(單體電池(single cell))110。 As a typical example of a solar cell that converts light energy of the sun into electric power, a solar cell using a crystalline germanium (single crystal or polycrystal) as a semiconductor substrate, a so-called crystalline germanium-based solar cell, is known. As the crystal lanthanide solar cell, for example, a single-sided light-receiving type solar cell (single cell) 110 shown in Fig. 2 is known.
該太陽電池110於p型矽基板(Si晶圓:含有p型結晶矽的p-Si層)111的受光面(圖2中為上表面)側具備藉由pn接合形成所形成的n-Si層116,於n-Si層116上具備含有氧化鈦、或二氧化矽、氮化矽的抗反射膜114,及含有銀(Ag)的表面電極(受 光面電極)112。另一方面,於p型矽基板(p-Si層)111的背面(圖2中為下表面)側具備與受光面電極112同樣含有銀(Ag)的背面側外部連接用電極122、發揮所謂的背面電場(BSF,Back Surface Field)效應的鋁電極120、及藉由鋁擴散至p-Si層111所形成的p+層(BSF層)124。此處,作為與用以形成受光面電極112的導電性組成物相關的現有技術,例如可列舉專利文獻1~專利文獻7等。 The solar cell 110 has n-Si formed by pn junction on the light-receiving surface (upper surface in FIG. 2) side of a p-type germanium substrate (Si wafer: p-Si layer containing p-type crystalline germanium) 111. The layer 116 includes an anti-reflection film 114 containing titanium oxide, ceria or hafnium nitride, and a surface electrode (light-receiving surface electrode) 112 containing silver (Ag) on the n-Si layer 116. On the other hand, the back surface side external connection electrode 122 containing silver (Ag) similar to the light-receiving surface electrode 112 is provided on the back surface (the lower surface in FIG. 2) side of the p-type germanium substrate (p-Si layer) 111. The aluminum electrode 120 of the back surface field (BSF) effect and the p + layer (BSF layer) 124 formed by diffusion of aluminum to the p-Si layer 111. Here, as a related art related to the conductive composition for forming the light-receiving surface electrode 112, for example, Patent Document 1 to Patent Document 7 and the like can be cited.
[專利文獻1]日本專利申請案公開2001-303400號公報 [Patent Document 1] Japanese Patent Application Publication No. 2001-303400
[專利文獻2]日本專利申請案公開2006-302890號公報 [Patent Document 2] Japanese Patent Application Publication No. 2006-302890
[專利文獻3]日本專利申請案公開2011-96747號公報 [Patent Document 3] Japanese Patent Application Publication No. 2011-96747
[專利文獻4]日本專利第4754655號 [Patent Document 4] Japanese Patent No. 4754655
[專利文獻5]國際公開第2012/020694號 [Patent Document 5] International Publication No. 2012/020694
[專利文獻6]國際公開第2012/141187號 [Patent Document 6] International Publication No. 2012/141187
[專利文獻7]國際公開第2012/144335號 [Patent Document 7] International Publication No. 2012/144335
此外,典型而言,所述的矽系太陽電池的受光面電極包含線狀的匯流條電極(連接用電極)、及與該匯流條連接的多根細線狀的柵格電極(集電用電極)。由於該些受光面電極形成於太陽電池的受光面,故而會產生遮光損失(shadow loss)。因此,為了 擴大電池單元(cell)每單位面積的受光面積,提高電池單元每單位面積的輸出效率、即光電轉換效率,要求實現受光面電極、尤其是根數多的柵格電極的細線化(fine-line)。例如,要求使現有的太陽電池中為130μm程度的柵格電極的寬度成為110μm以下。然而,例如若使柵格電極的寬度變細,則由於受光面電極與n層的歐姆接觸惡化,接觸電阻變高,導致電流密度降低,因此存在無法單純地提高轉換效率的問題。 Further, typically, the light-receiving surface electrode of the lanthanide solar cell includes a linear bus bar electrode (connection electrode) and a plurality of thin-line grid electrodes (collecting electrodes) connected to the bus bar ). Since the light-receiving surface electrodes are formed on the light-receiving surface of the solar cell, a shadow loss occurs. Therefore, in order to The light-receiving area per unit area of the battery cell is enlarged, and the output efficiency per unit area of the battery cell, that is, the photoelectric conversion efficiency is improved, and it is required to realize thinning of the light-receiving surface electrode, especially the grid electrode having a large number of wires (fine-line) ). For example, it is required that the width of the grid electrode of about 130 μm in the conventional solar cell be 110 μm or less. However, for example, when the width of the grid electrode is made thinner, the ohmic contact between the light-receiving surface electrode and the n-layer is deteriorated, the contact resistance is increased, and the current density is lowered. Therefore, there is a problem that the conversion efficiency cannot be simply improved.
本發明是以如上所述的情況為背景而完成者,其目的在 於提供一種於形成太陽電池的電極時可實現良好的電接合的導電性組成物的製造方法。又,本發明的另一目的在於提供一種使用該導電性組成物所形成的導電性組成物、及具備藉由該導電性組成物所形成的電極的具有優異的電特性(例如,開路電壓、填充因子或能量轉換效率)的太陽電池。 The present invention has been completed in the context of the above-described situation, and its purpose is A method of producing a conductive composition capable of achieving good electrical bonding when forming an electrode of a solar cell is provided. Moreover, another object of the present invention is to provide a conductive composition formed using the conductive composition and an electrode having the conductive composition to have excellent electrical characteristics (for example, an open circuit voltage, Filling factor or energy conversion efficiency) of the solar cell.
關於用以形成太陽電池的電極的導電性組成物,例如如所述專利文獻3~專利文獻7所揭示般,已知藉由將碲以氧化物等化合物的形態、或作為玻璃構成成分而含有於導電性組成物中,可改善歐姆接觸等。然而,由於太陽電池根據其商品形態,例如基板本身的構成會不同,或所要求的特性等會有些許不同,因此,實際情況是缺乏用以決定所述導電性組成物中各構成材料的詳細配方的指導。 For example, as disclosed in Patent Document 3 to Patent Document 7, the conductive composition for forming an electrode of a solar cell is known to contain ruthenium in the form of a compound such as an oxide or as a glass constituent component. In the conductive composition, ohmic contact or the like can be improved. However, since the solar cell differs depending on its commercial form, for example, the composition of the substrate itself, or the required characteristics, etc., the actual situation is lack of detail for determining the constituent materials in the conductive composition. Guidance for the formula.
在此種情況下,本發明者反覆銳意研究,結果發現,關於含 有碲的導電性組成物,於即便使用同一形態的碲源(例如,含碲玻璃組成物、氧化碲等)製作導電性組成物的情形時,亦可改變形成後的電極中碲的價數(即Te原子的電子狀態)。並且瞭解到,不論碲源的形態如何,該碲的價數均會影響到太陽電池特性、尤其是基板與電極的歐姆接觸,從而完成本申請案發明。 Under such circumstances, the inventors repeatedly studied with enthusiasm and found that The conductive composition having a ruthenium can change the valence of ruthenium in the formed electrode even when a conductive composition is produced using the same type of ruthenium source (for example, a ruthenium-containing glass composition or ruthenium oxide). (ie the electronic state of the Te atom). It is also known that regardless of the shape of the source, the valence of the ruthenium affects the characteristics of the solar cell, especially the ohmic contact between the substrate and the electrode, thereby completing the invention of the present application.
即,藉由本發明,提供一種用以形成太陽電池的電極的導電性組成物的製造方法。該製造方法的特徵在於包含以下的步驟(1)、步驟(2)。 That is, according to the present invention, a method of producing a conductive composition for forming an electrode of a solar cell is provided. This manufacturing method is characterized by comprising the following steps (1) and (2).
(1)準備銀粉末、含碲組成物、及碲價數調整材料。 (1) Preparation of silver powder, bismuth-containing composition, and valence price adjustment material.
(2)以將該導電性組成物塗佈於所述太陽電池的基板並進行了煅燒時的該基板與所述導電性組成物的界面所含的碲(Te)的平均價數成為4.3以上且5.1以下的方式,調整所述銀粉末、所述含碲組成物及所述碲價數調整材料的配方而製備導電性組成物。 (2) The average valence of cerium (Te) contained in the interface between the substrate and the conductive composition when the conductive composition is applied to the substrate of the solar cell and fired is 4.3 or more Further, in a mode of 5.1 or less, the composition of the silver powder, the ruthenium-containing composition, and the valence number adjusting material is adjusted to prepare a conductive composition.
根據本發明的製造方法,可以使導電性組成物所含的碲在形成後的電極中以最佳的電子狀態(電子配置)存在的方式調整構成導電性組成物的各構成材料的配方。例如,於在通常的煅燒條件將導電性組成物煅燒所獲得的電極中,碲被氧化成接近6價的狀態(典型而言,5.2~5.5的範圍)。然而,於本發明中,藉由調整各構成材料的配方,而以將於所使用的基板等上煅燒後的電極中碲的價數維持為如上所述般被進一步還原的狀態的方式進行控制。具體而言,主要對導電性組成物中的含碲組成物與碲價數調整材料的配方進行製備,而滿足作為導電性組成物整體的電 荷中性條件,並且實現碲(Te)的平均價數成為所述範圍的配方。 雖然詳細機制尚不明確,但藉由該電子狀態的碲存在於基板與電極的界面附近,可較佳地改善電極與基板的電接合狀態。藉此,不論導電性組成物中的碲的形態及調配量如何,該些碲原子於電極中均可以可有效地有助於實現低電阻的歐姆接觸的電子狀態而存在。 According to the production method of the present invention, the composition of each constituent material constituting the conductive composition can be adjusted so that the ruthenium contained in the conductive composition exists in an optimum electronic state (electron arrangement) in the formed electrode. For example, in an electrode obtained by calcining a conductive composition under normal calcination conditions, ruthenium is oxidized to a state close to hexavalent (typically, a range of 5.2 to 5.5). However, in the present invention, by adjusting the formulation of each constituent material, the valence of ruthenium in the electrode calcined on the substrate to be used or the like is maintained in a state of being further reduced as described above. . Specifically, the formulation of the ruthenium-containing composition and the valence number adjustment material in the conductive composition is mainly prepared, and the electricity as the entire conductive composition is satisfied. Neutral conditions are imposed, and the average valence of cerium (Te) is achieved as a formulation of the stated range. Although the detailed mechanism is not clear, the electrical state of the electrode and the substrate can be preferably improved by the presence of germanium in the electronic state in the vicinity of the interface between the substrate and the electrode. Thereby, regardless of the form and amount of ruthenium in the conductive composition, the ruthenium atoms can be effectively present in the electrode to contribute to the electronic state of the low-resistance ohmic contact.
再者,於本說明書中,碲的價數的測定方法並無特別限 制。例如,作為碲的價數的較佳的測定手法,可列舉藉由X射線吸收精細結構(X-ray absorption fine structure,XAFS)解析法或X射線光電子分光分析法(X-ray Photoelectron Spectroscopy,XPS)而實施。 Furthermore, in the present specification, there is no particular limitation on the method of measuring the valence of hydrazine. system. For example, as a preferred measurement method for the valence of ruthenium, X-ray absorption fine structure (XAFS) analysis method or X-ray photoelectron spectroscopy (XPS) can be cited. ) and implemented.
關於XAFS,更具體而言,藉由X射線吸收近限結構(X-ray Absorption Near Edge Structure,XANES)解析法,可根據基於碲原子的內殼電子向非佔有能階及準連續能階激發時的能量的X射線吸收光譜,掌握碲原子的化學狀態(電子狀態)。於本說明書中,碲的價數如後文所述,採用平均價數,該平均價數是根據使用SPring-8的射束線(beam line)BL14B2中的XAFS分析裝置並藉由透過法所測定的、XANES光譜在4350eV附近的峰值位移量而計算出。再者,用於計算平均價數的吸收能並不限定於4350eV附近者,例如亦可利用Te-K端、L端等吸收能。 Regarding XAFS, more specifically, the X-ray Absorption Near Edge Structure (XANES) analytical method can be used to excite non-occupied energy levels and quasi-continuous energy levels according to the inner shell electrons based on germanium atoms. The X-ray absorption spectrum of the energy at the time grasps the chemical state (electronic state) of the ruthenium atom. In the present specification, the valence of 碲 is as described later, and the average valence is based on the XAFS analysis device in the beam line BL14B2 using SPring-8 and by the transmission method. The measured XANES spectrum was calculated from the peak displacement amount around 4350 eV. Further, the absorption energy for calculating the average valence is not limited to the vicinity of 4,350 eV, and for example, the absorption energy such as the Te-K terminal or the L terminal may be used.
又,關於XPS,藉由觀測對超高真空下的試樣表面照射X射線所釋放的光電子的動能,可獲得與該表面的元素組成或化 學狀態相關的資訊。具體而言,藉由對光電子的能譜進行解析,於對存在於物質表面的碲原子進行鑑定的同時,可根據基於細部掃描(narrow scan)分析的碲峰值的化學位移獲得與價數或結合狀態相關的資訊。碲的價數可使用如下結果,該結果是使用XPS分析裝置(愛發科(ULVAC-PHI)股份有限公司製造,PHI5000),於使用例如Al-Kα射線(hv=1486.6eV激發)作為射線源所獲得的XPS光譜中,例如以結合能為576eV附近的Te-3d5/2的峰值作為指標,根據碲的價數與結合能位移量的關係,計算出碲的平均價數而獲得。再者,用於計算平均價數的峰值並不限定於Te-3d5/2,例如,亦可設為Te-3d3/2(586eV)等其他峰值。 Further, regarding XPS, information on the elemental composition or chemical state of the surface can be obtained by observing the kinetic energy of the photoelectrons released by irradiating the surface of the sample under ultra-high vacuum with X-rays. Specifically, by analyzing the energy spectrum of the photoelectron, the ruthenium atom present on the surface of the substance can be identified, and the valence or combination can be obtained according to the chemical shift of the 碲 peak based on the narrow scan analysis. Status related information. The valence of 碲 can use the following result, which is obtained by using an XPS analyzer (manufactured by ULVAC-PHI Co., Ltd., PHI5000) using, for example, Al-Kα ray (hv=1486.6eV excitation) as a ray source. In the obtained XPS spectrum, for example, the peak value of Te-3d 5/2 in the vicinity of 576 eV is used as an index, and the average valence of 碲 is obtained from the relationship between the valence of ruthenium and the amount of binding energy displacement. Further, the peak value for calculating the average valence is not limited to Te-3d 5/2 , and may be other peaks such as Te-3d 3/2 (586 eV).
於此處所揭示的導電性組成物的製造方法的較佳一實施方式中,所述含碲組成物的特徵在於:其是含有碲(Te)作為構成元素的碲化合物粉末。 In a preferred embodiment of the method for producing a conductive composition disclosed herein, the cerium-containing composition is characterized in that it is a cerium compound powder containing cerium (Te) as a constituent element.
藉由該構成,碲的調配方法、或調配比例的調整變得容易,因此較佳。 According to this configuration, it is preferable to adjust the blending method or the blending ratio of the crucible.
於此處所揭示的導電性組成物的製造方法的較佳一實施方式中,所述含碲組成物的特徵在於:其是含有碲(Te)作為構成元素的玻璃組成物。 In a preferred embodiment of the method for producing a conductive composition disclosed herein, the ruthenium-containing composition is characterized in that it is a glass composition containing cerium (Te) as a constituent element.
藉由該構成,於燒穿(fire through)時碲與玻璃成分一併良好地到達基板,可有效地有助於實現低電阻的歐姆接觸。又,藉由使用包含含有碲的玻璃組成物的導電性組成物,亦可形成接著強度高的電極。 According to this configuration, the ruthenium and the glass component can reach the substrate well together during the fire through, which can effectively contribute to the realization of the low-resistance ohmic contact. Further, by using a conductive composition containing a glass composition containing ruthenium, an electrode having a high bonding strength can be formed.
於此處所揭示的導電性組成物的製造方法的較佳一實施方式中,所述玻璃組成物的特徵在於:其是不含碲的基本玻璃成分、與含有碲的含碲玻璃成分的混合物。 In a preferred embodiment of the method for producing a conductive composition disclosed herein, the glass composition is characterized in that it is a mixture of a basic glass component containing no antimony and a hafnium containing glass component containing antimony.
藉由該構成,可更容易地控制煅燒後的碲的價數,可更簡便地製造歐姆接觸的改善效果高的導電性組成物。 According to this configuration, the valence of the ruthenium after calcination can be more easily controlled, and the conductive composition having a high ohmic contact improving effect can be more easily produced.
於此處所揭示的導電性組成物的製造方法的較佳一實施方式中,所述碲價數調整材料的特徵在於:其是包含選自由Ti、V、Mn、Fe、Co、Ni、Cu及Zn所組成的群組中的至少一種金屬元素的金屬或金屬化合物。 In a preferred embodiment of the method for producing a conductive composition disclosed herein, the valence number adjusting material is characterized in that it comprises a material selected from the group consisting of Ti, V, Mn, Fe, Co, Ni, Cu, and a metal or metal compound of at least one metal element in the group consisting of Zn.
於煅燒後的電極中,所述金屬元素具有電子狀態容易根據環境而發生變動的特性。藉由該構成,可更佳地控制含碲組成物中所含的碲的價數。又,藉由含有該些金屬或金屬化合物,亦可謀求所形成的電極的接著強度的提高、及接觸電阻的降低。 In the electrode after calcination, the metal element has a property that the electronic state is easily changed depending on the environment. With this configuration, the valence of ruthenium contained in the ruthenium-containing composition can be more preferably controlled. Further, by containing these metals or metal compounds, it is possible to improve the adhesion strength of the formed electrode and the reduction in contact resistance.
於另一方面,本發明提供藉由所述的任一種製造方法所製造的導電性組成物。藉此,所調配的碲成分在煅燒後的電極中可以可充分有助於形成良好的(低電阻的)歐姆接觸的狀態而存在,再者,本發明亦提供可形成接著性優異的電極的導電性組成物。由於該導電性組成物是以碲能夠對應所使用的基板而以最佳的電子狀態(電子配置)存在的方式調整配方,因此於用以形成太陽電池的電極的情形時,可實現開路電壓、填充因子及能量轉換效率等電特性優異的太陽電池。根據該方面,本發明亦藉由具備使用該導電性組成物所形成的電極而提供電特性及可靠性優異 的太陽電池。 In another aspect, the present invention provides a conductive composition produced by any of the above-described production methods. Thereby, the prepared antimony component can be sufficiently contributed to the formation of a good (low-resistance) ohmic contact in the electrode after calcination. Further, the present invention also provides an electrode which can form an excellent adhesion. Conductive composition. Since the conductive composition adjusts the formulation in such a manner that it can exist in an optimum electronic state (electronic configuration) in accordance with the substrate to be used, an open circuit voltage can be realized in the case of forming an electrode of a solar cell. A solar cell having excellent filling characteristics and energy conversion efficiency and electric characteristics. According to this aspect, the present invention also provides electrical characteristics and reliability by providing an electrode formed using the conductive composition. Solar battery.
10‧‧‧太陽電池 10‧‧‧Solar battery
11‧‧‧基板 11‧‧‧Substrate
12‧‧‧受光面電極(Ag電極) 12‧‧‧Photometric surface electrode (Ag electrode)
14‧‧‧抗反射膜 14‧‧‧Anti-reflective film
16‧‧‧n-Si層(n+層) 16‧‧‧n-Si layer (n + layer)
20‧‧‧背面電極(鋁電極) 20‧‧‧Back electrode (aluminum electrode)
22‧‧‧背面側外部連接用電極 22‧‧‧Electrode for external connection on the back side
24‧‧‧p+層(BSF層) 24‧‧‧p + layer (BSF layer)
110‧‧‧太陽電池 110‧‧‧Solar battery
111‧‧‧p型矽基板(p-Si層) 111‧‧‧p-type germanium substrate (p-Si layer)
112‧‧‧表面電極(受光面電極) 112‧‧‧ Surface electrode (light receiving surface electrode)
114‧‧‧抗反射膜 114‧‧‧Anti-reflective film
116‧‧‧n-Si層 116‧‧‧n-Si layer
120‧‧‧鋁電極 120‧‧‧Aluminum electrode
122‧‧‧背面側外部連接用電極 122‧‧‧Electrode for external connection on the back side
124‧‧‧p+層(BSF層) 124‧‧‧p + layer (BSF layer)
圖1是示意性表示使用本發明的導電性組成物所構成的太陽電池的結構的一例的截面圖。 FIG. 1 is a cross-sectional view schematically showing an example of a configuration of a solar cell using the conductive composition of the present invention.
圖2是示意性表示使用現有的導電性組成物所構成的太陽電池的結構的一例的截面圖。 2 is a cross-sectional view schematically showing an example of a configuration of a solar cell using a conventional conductive composition.
以下對本發明的較佳的實施形態進行說明。再者,於本說明書中,除了特別提及的事項以外的事項且為本發明的實施所必需的事項(例如導電性組成物於基板上的賦予方法或煅燒方法、太陽電池的構成等)可作為本領域技術人員基於該領域現有技術的設計事項而掌握。本發明可基於本說明書所揭示的內容及該領域的技術常識而實施。 Preferred embodiments of the present invention will be described below. In addition, in the present specification, matters other than those specifically mentioned and matters necessary for the implementation of the present invention (for example, a method of imparting a conductive composition on a substrate, a method of firing, a configuration of a solar cell, etc.) may be used. It is known to those skilled in the art based on design matters of the prior art in the field. The present invention can be implemented based on the contents disclosed in the present specification and the technical common sense in the field.
此處所揭示的導電性組成物的製造方法以用於形成太陽電池中的銀(Ag)電極的用途的Ag電極形成用導電性組成物的製造為對象。該製造方法如上所述,包含如下步驟:(1)準備作為導電性組成物的構成材料的銀粉末、含碲組成物、及碲價數調整材料;(2)以將該導電性組成物塗佈於所述太陽電池的基板並進行了煅燒時的該基板與所述導電性組成物的界面所含的碲(Te)的平均價數成為4.3以上且5.1以下的方式,調整所述銀粉末、所述含碲組成物及所述碲價數調整材料的配方而製備導電性 組成物。 The method for producing a conductive composition disclosed herein is for the production of a conductive composition for forming an Ag electrode for use in forming a silver (Ag) electrode in a solar cell. As described above, the production method includes the steps of: (1) preparing a silver powder, a ruthenium-containing composition, and a ruthenium number adjustment material as a constituent material of the conductive composition; (2) coating the conductive composition The silver powder is adjusted so that the average valence of cerium (Te) contained in the interface between the substrate and the conductive composition when the substrate of the solar cell is baked is 4.3 or more and 5.1 or less Conductivity is prepared by formulating the cerium-containing composition and the valence number adjusting material Composition.
此處所揭示的導電性組成物中作為主要的固體成分而含有的銀粉末是以銀(Ag)為主體的粒子的集合體,典型而言,是包含Ag單質的粒子的集合體。然而,若整體而言為Ag主體的粒子的集合體,則該銀粉末為微量含有Ag以外的雜質或Ag主體的合金者亦可包含於此處所謂的「銀粉末」中。再者,該銀粉末可為藉由現有公知的製造方法所製造者,並不要求特別的製造方法。 The silver powder contained as a main solid component in the conductive composition disclosed herein is an aggregate of particles mainly composed of silver (Ag), and is typically an aggregate of particles containing a simple substance of Ag. However, if the aggregate of the particles of the Ag main body is a whole, the silver powder may be contained in a so-called "silver powder" as an alloy containing a small amount of impurities other than Ag or an Ag main body. Further, the silver powder may be produced by a conventionally known production method, and a special production method is not required.
構成該銀粉末的粒子的形狀並無特別限定。典型而言為球狀,但並不限於所謂的正球形狀者。除球狀以外,例如可列舉鱗片(flake)形狀或不規則形狀者。該銀粉末亦可包含此種各種形狀的粒子。於該銀粉末包含平均粒徑小的(典型而言數μm尺寸)粒子的情形時,較佳為該粒子(一次粒子)的70質量%以上具有球狀或與其類似的形狀。例如,較佳為構成該銀粉末的粒子的70質量%以上為如縱橫比(即,粒子的長徑相對於短徑的比)為1~1.5的銀粉末。 The shape of the particles constituting the silver powder is not particularly limited. It is typically spherical, but is not limited to the so-called true spherical shape. In addition to the spherical shape, for example, a flake shape or an irregular shape may be mentioned. The silver powder may also contain particles of such various shapes. In the case where the silver powder contains particles having a small average particle diameter (typically several μm in size), it is preferred that 70% by mass or more of the particles (primary particles) have a spherical shape or a shape similar thereto. For example, it is preferable that 70% by mass or more of the particles constituting the silver powder is a silver powder having an aspect ratio (that is, a ratio of a long diameter of the particles to a short diameter) of 1 to 1.5.
再者,於在構成太陽電池的基板(例如Si基板)的一面(典型而言為受光面,但亦可為背面)形成Ag電極的情形時,可以可實現所需尺寸(線寬、膜厚等)及形狀的方式考慮導電性組成物的塗佈量及塗佈形態等。此處,作為對形成該太陽電池的受光面電極而言較佳的銀粉末,並無特別限制,較合適為構成該粉末的粒子的平均粒徑為20μm以下者,較佳為0.01μm以上且 10μm以下,更佳為0.3μm以上且5μm以下,例如為2μm±1μm。再者,此處所謂的平均粒徑是指藉由雷射繞射/散射法所測量的粒度分佈中的累積體積50%時的粒徑、即D50(中徑)。 Further, when an Ag electrode is formed on one surface (typically, a light receiving surface but also a back surface) of a substrate (for example, a Si substrate) constituting a solar cell, a desired size (line width, film thickness) can be achieved. The coating amount and coating form of the conductive composition are considered in the form of the shape and the like. Here, the silver powder which is preferable for forming the light-receiving surface electrode of the solar cell is not particularly limited, and it is preferable that the average particle diameter of the particles constituting the powder is 20 μm or less, preferably 0.01 μm or more. 10 μm or less, more preferably 0.3 μm or more and 5 μm or less, for example, 2 μm ± 1 μm. Here, the average particle diameter referred herein means a particle diameter at a cumulative volume of 50% in the particle size distribution measured by the laser diffraction/scattering method, that is, D50 (medium diameter).
例如,亦可使用將平均粒徑的差互不相同的多種銀粉末(典型而言為兩種)彼此混合,混合粉末的平均粒徑處於所述範圍內的銀(混合)粉末。藉由使用如上所述的平均粒徑的銀粉末,可形成作為受光面電極較佳的緻密的Ag電極。 For example, a silver (mixed) powder in which a plurality of silver powders (typically two kinds) having different average particle diameters are different from each other may be used, and the average particle diameter of the mixed powder is within the above range. By using the silver powder having the average particle diameter as described above, a dense Ag electrode which is preferably a light-receiving surface electrode can be formed.
作為此處所揭示的導電性組成物中的所述銀粉末的含量,並無特別限制,於將該導電性組成物(固體成分)整體設為100質量%時,較佳為以其50質量%以上且99質量%以下、更佳為65質量%以上且98質量%以下、例如75質量%以上且95質量%以下為銀粉末的方式調整含有率。於所製造的導電性組成物中的銀粉末含有率處於所述範圍內的情形時,可形成導電性高、緻密性進一步提高的Ag電極(膜)。 The content of the silver powder in the conductive composition disclosed herein is not particularly limited, and when the conductive composition (solid content) is 100% by mass as a whole, it is preferably 50% by mass. The content ratio is adjusted so that the amount is 99% by mass or less, more preferably 65% by mass or more and 98% by mass or less, and for example, 75% by mass or more and 95% by mass or less is silver powder. When the content of the silver powder in the conductive composition to be produced is in the above range, an Ag electrode (film) having high conductivity and further improved denseness can be formed.
作為含碲組成物,只要為含有碲(Te)作為構成元素的粉末狀材料,則可無特別限制地使用。例如,具體而言,可為碲(Te)的單質或含有碲作為構成元素的有機化合物、無機化合物等化合物粉末、粉末狀的玻璃組成物等。該些亦可為以下所例示的任意兩種以上的混合物或複合化合物。 The ruthenium-containing composition can be used without any particular limitation as long as it is a powdery material containing cerium (Te) as a constituent element. Specifically, for example, it may be a simple substance of cerium (Te) or an organic compound containing cerium as a constituent element, a compound powder such as an inorganic compound, a powdery glass composition or the like. These may also be any two or more kinds of mixtures or composite compounds exemplified below.
作為有機化合物,可例示各種碲醇、碲化物、碲氧化物、碲 酮(tellurone)及其衍生物等。作為含碲無機化合物,可例示碲與其他金屬的化合物、氧化物、含氧酸、氫氧化物、鹵化物、硫酸鹽、磷酸鹽、硝酸鹽、碳酸鹽、乙酸鹽、金屬錯合物(配位化合物)等。作為該些無機或有機的含碲組成物,代表性而言,可例示:四碲富瓦烯(Tetratellurafulvalene,TTeF);TeO2、Te2O3、Te2O5、TeO3等碲氧化物;以Te(OH)6表示的碲酸;甲基碲酸(meta-telluronic acid)鉀、甲基碲酸鈉等碲酸鹽;碲化鋅、碲化鋁、碲化鈷、碲化錫、碲化鎢、碲化鈦、碲化銅、碲化鉛、碲化鉍、碲化錳、碲化鉬等碲化金屬化合物。於該些含碲組成物中,碲可取例如0價、3價、4價、5價及6價等值。作為此處所使用的含碲組成物,較佳為碲以5價或6價存在的化合物,例如可例示Te2O5、TeO3、Te(OH)6等。 Examples of the organic compound include various decyl alcohols, tellurides, cerium oxides, tellurones and derivatives thereof. Examples of the ruthenium-containing inorganic compound include compounds of ruthenium and other metals, oxides, oxyacids, hydroxides, halides, sulfates, phosphates, nitrates, carbonates, acetates, and metal complexes. Bit compound). Typical examples of the inorganic or organic cerium-containing composition include tetragonal valence (Tetratellurafulvalene, TTeF); cerium oxide such as TeO 2 , Te 2 O 3 , Te 2 O 5 , and TeO 3 ; ; tannic acid represented by Te(OH) 6 ; potassium salt of meta-telluronic acid, sodium citrate, etc.; zinc telluride, aluminum telluride, cobalt telluride, antimony telluride, Deuterated tungsten, antimony telluride, antimony telluride, antimony telluride, antimony telluride, antimony telluride, antimony molybdenum and other deuterated metal compounds. Among the ruthenium-containing compositions, ruthenium may have values such as zero-valent, trivalent, tetravalent, pentavalent, and hexavalent. The ruthenium-containing composition used herein is preferably a compound in which ruthenium is present at a valence of 5 or 6 valent, and examples thereof include Te 2 O 5 , TeO 3 , Te(OH) 6 and the like.
又,作為含碲玻璃成分,可考慮含有碲作為玻璃構成成分的各種玻璃組成物、或於實質上不含碲的玻璃組成物的表面擔載碲化合物的形態的碲化合物擔載玻璃組成物等。即,於含碲玻璃成分中,碲成分並非自玻璃組成物背離而存在的成分,而是構成玻璃組成物本身的成分,或並不自玻璃組成物中游離,而是一體存在。該含碲玻璃成分可成為有效地作用於藉由燒穿法自抗反射膜上方形成作為太陽電池的受光面電極的Ag電極的成分。又,亦可為提高對所形成的電極的基板的接著強度的無機添加材料。 In addition, as the bismuth-containing glass component, various glass compositions containing ruthenium as a glass constituent component or a ruthenium compound-supporting glass composition in which a ruthenium compound is supported on the surface of a glass composition containing substantially no ruthenium may be considered. . That is, in the bismuth-containing glass component, the bismuth component is not a component which is deviated from the glass composition, but is a component constituting the glass composition itself, or is not free from the glass composition, but is present integrally. The bismuth-containing glass component can effectively act on a component which forms an Ag electrode as a light-receiving surface electrode of a solar cell from above the anti-reflection film by a burn-through method. Further, it may be an inorganic additive material that improves the adhesion strength to the substrate of the formed electrode.
藉由使用含有碲作為玻璃構成成分的玻璃組成物,可降 低玻璃組成物的軟化溫度,而可實現密接性更高的導電性組成物。作為含有碲作為玻璃構成成分的玻璃組成物,組成並無特別限定,例如,可較佳地使用如下所示的組成(氧化物換算組成;將玻璃介質(glass frit)整體設為100mol%)的玻璃組成物。 By using a glass composition containing ruthenium as a constituent of glass, it can be lowered The softening temperature of the low glass composition can achieve a conductive composition having higher adhesion. The composition of the glass composition containing ruthenium as a glass component is not particularly limited, and for example, the composition shown below (the oxide conversion composition; the glass frit as a whole is 100 mol%) can be preferably used. Glass composition.
以下對該含碲玻璃組成物的構成(氧化物換算組成)進行詳細說明。 Hereinafter, the composition (oxide conversion composition) of the cerium-containing glass composition will be described in detail.
TeO2可與其他元素一併成為構成玻璃骨架的成分(玻璃網狀形成劑(network former)),具有降低玻璃的軟化點的功能。又,藉由含有於太陽電池的電極形成用導電性組成物中,可發揮抑制燒穿時的基板的過度侵蝕的效果。例如,該TeO2可以70mol%以下程度的比例含有於玻璃組成物中(再者,於後述的不含碲的玻璃組成物中,可為0mol%)。由於TeO2相對而言較為昂貴,因此於調配量過多的情形時成本變高,故而欠佳。較佳為TeO2為5mol%~65mol%程度的比例,更佳為10mol%~50mol%較為理想。 TeO 2 functions as a component constituting a glass skeleton (network former) together with other elements, and has a function of lowering the softening point of the glass. In addition, the conductive composition for forming an electrode included in the solar cell can exhibit an effect of suppressing excessive erosion of the substrate during the burn-through. For example, the TeO 2 may be contained in the glass composition in a proportion of about 70 mol% or less (further, 0 mol% in a glass composition containing no antimony described later). Since TeO 2 is relatively expensive, it is costly when the amount of the compound is too large, and thus it is not preferable. It is preferable that the ratio of TeO 2 is from 5 mol% to 65 mol%, more preferably from 10 mol% to 50 mol%.
SiO2是構成玻璃骨架的成分(玻璃網狀形成劑(network former)),例如,可以0mol%~70mol%程度的比例含有於玻璃組成物中。隨著SiO2的調配量增大,玻璃的溶解性降低,同時軟化點上升。若SiO2超過例如70mol%,則燒穿特性降低,故而欠佳。於在玻璃組成物中含有代替SiO2的玻璃網狀形成劑的情形時,SiO2的含量亦可為0mol%(即,實質上不含SiO2)。於含有SiO2的情形時,就玻璃結構的化學穩定性、耐久性或操作性等觀點而言,較佳為SiO2為5mol%~65mol%程度的比例,更佳為10mol% ~50mol%較為理想。 SiO 2 is a component constituting a glass skeleton (network former), and can be contained in the glass composition in a ratio of, for example, 0 mol% to 70 mol%. As the amount of SiO 2 is increased, the solubility of the glass is lowered and the softening point is increased. When SiO 2 exceeds, for example, 70 mol%, the burn-through characteristics are lowered, which is not preferable. In the case where the glass composition contains a glass network forming agent instead of SiO 2 , the content of SiO 2 may be 0 mol% (that is, substantially free of SiO 2 ). In the case of containing SiO 2 , the ratio of SiO 2 is from 5 mol% to 65 mol%, more preferably from 10 mol% to 50 mol%, from the viewpoints of chemical stability, durability, workability, and the like of the glass structure. ideal.
B2O3顯示抑制玻璃組成物的熱膨脹且降低黏度及熔融 溫度的功能,可以0mol%~40mol%程度的比例含有於玻璃組成物中。若B2O3過多,則於調整玻璃組成物時的溶解及冷卻中容易引起結晶析出,故而欠佳。由於B2O3可成為引起長期耐久性(尤其是長期高溫耐久性)降低的因素,因此B2O3的含量亦可為0mol%(即,實質上不含B2O3)。較佳為B2O3為1mol%~30mol%程度的比例,更佳為5mol%~25mol%程度。 B 2 O 3 exhibits a function of suppressing thermal expansion of the glass composition and lowering the viscosity and the melting temperature, and may be contained in the glass composition in a proportion of from 0 mol% to 40 mol%. When the amount of B 2 O 3 is too large, crystals are easily precipitated during dissolution and cooling in the adjustment of the glass composition, which is not preferable. Since B 2 O 3 may be a factor causing a decrease in long-term durability (especially long-term high-temperature durability), the content of B 2 O 3 may also be 0 mol% (that is, substantially free of B 2 O 3 ). It is preferably a ratio of B 2 O 3 of from 1 mol% to 30 mol%, more preferably from 5 mol% to 25 mol%.
Bi2O3是任意的添加成分,且為調整熱膨脹係數的成 分。又,藉由玻璃接合材料包含多成分系統,亦可提高物理穩定性。玻璃組成物中的Bi2O3的比例例如較佳為1mol%~30mol%程度的比例,更佳為5mol%~25mol%程度。 Bi 2 O 3 is an optional component and is a component that adjusts the coefficient of thermal expansion. Moreover, physical stability can also be improved by including a multi-component system for the glass bonding material. The ratio of Bi 2 O 3 in the glass composition is, for example, preferably in a proportion of about 1 mol% to 30 mol%, more preferably about 5 mol% to 25 mol%.
PbO是任意的添加成分,以降低玻璃的軟化點為目的, 例如可以0mol%~65mol%程度的比例而含有。考慮到人體健康及對環境的影響,PbO的含量可為0mol%(即,實質上不含B2O3)。 於含有PbO的配方中,PbO的比例例如較佳為10mol%~50mol%程度的比例,更佳為30mol%~40mol%程度。 PbO is an optional component to reduce the softening point of the glass, and may be contained, for example, in a ratio of from 0 mol% to 65 mol%. The PbO content may be 0 mol% (i.e., substantially free of B 2 O 3 ) in consideration of human health and environmental impact. In the formulation containing PbO, the proportion of PbO is, for example, preferably from 10 mol% to 50 mol%, more preferably from 30 mol% to 40 mol%.
關於鹼土金屬成分(MO:具體而言,MgO、CaO、ZnO、 SrO及BaO中的至少一種),雖然未必是必需成分,但是作為網狀修飾氧化物(網狀修飾劑(network modifier))而為有助於控制玻璃組成物的熱穩定性的成分。於含有該些的情形時,例如可以合計為1mol%~25mol%程度的比例含有任一種以上,更佳為合計 為1mol%~10mol%程度的比例。 About alkaline earth metal components (MO: specifically, MgO, CaO, ZnO, At least one of SrO and BaO is not necessarily an essential component, but is a component of a network modified oxide (network modifier) which is useful for controlling the thermal stability of the glass composition. In the case of containing the above, for example, the ratio may be from 1 mol% to 25 mol% in total, or more preferably in total. It is a ratio of about 1 mol% to 10 mol%.
關於鹼金屬成分(RO:具體而言,Li2O、Na2O及K2O 中的至少一種),雖然亦未必是必需成分,但作為增大玻璃組成物的熔融性的成分,可含有任一種以上。該些成分例如可以合計為1mol%~15mol%程度的比例而含有,更佳為例如1mol%~7mol%程度。 The alkali metal component (RO: specifically, at least one of Li 2 O, Na 2 O, and K 2 O) is not necessarily an essential component, but may be contained as a component that increases the meltability of the glass composition. Any one or more. These components may be contained, for example, in a proportion of about 1 mol% to 15 mol%, more preferably, for example, 1 mol% to 7 mol%.
作為此處所揭示的導電性組成物中所含的玻璃組成 物,可僅由如上所述典型的玻璃構成成分所構成,或者只要並不明顯地損及本發明的效果,亦可為含有所述以外的任意成分者。 作為此種添加成分,於氧化物的形態下,例如可列舉Al2O3、TiO2、ZrO2、WO3、V2O5、Nb2O5、FeO、CuO、SnO2、P2O5、La2O3、CeO2等。又,亦可視需要而含有現有的通常用於此種玻璃接合材料的添加劑(公知的澄清劑、著色劑等)。該些附加性構成成分或各種添加劑的比例較佳為低於玻璃組成物整體的大致5mol%(典型而言為低於4mol%,例如低於1mol%)。除此以外,當然容許混入所述組成所示以外的成分,且為來自原料或製造步驟的不可避免的雜質。 The glass composition contained in the conductive composition disclosed herein may be composed only of the typical glass constituent components as described above, or may be contained as long as the effects of the present invention are not significantly impaired. Any component other than that. Examples of such an additive component include, in the form of an oxide, Al 2 O 3 , TiO 2 , ZrO 2 , WO 3 , V 2 O 5 , Nb 2 O 5 , FeO, CuO, SnO 2 , and P 2 O. 5 , La 2 O 3 , CeO 2, etc. Further, an additive (a known clarifying agent, a coloring agent, or the like) which is conventionally used for such a glass bonding material may be contained as needed. The proportion of these additional constituent components or various additives is preferably less than about 5 mol% (typically less than 4 mol%, for example less than 1 mol%) of the entire glass composition. In addition to this, it is of course allowed to mix components other than those shown in the above composition, and it is an unavoidable impurity derived from a raw material or a manufacturing process.
另一方面,並非必須限定於此,於較佳的一實施方式中,可設為除所述鉛(Pb)成分以外,實質上亦不含砷(As)成分的配方。由於砷成分或鉛成分會對人體或環境造成不良影響,因此就環境性或作業性、安全性的觀點而言欠佳。 On the other hand, it is not necessarily limited to this. In a preferred embodiment, a formulation containing substantially no arsenic (As) component other than the lead (Pb) component may be used. Since the arsenic component or the lead component adversely affects the human body or the environment, it is not preferable from the viewpoint of environmental performance, workability, and safety.
作為如以上所述的含碲玻璃組成物,更具體而言,例如 可例示下述的玻璃L、玻璃M及玻璃N作為較佳的例。 As the bismuth-containing glass composition as described above, more specifically, for example The following glass L, glass M, and glass N are mentioned as a preferable example.
[玻璃L] [Glass L]
SiO2:9mol%以上且53mol%以下 SiO 2 : 9 mol% or more and 53 mol% or less
B2O3:1mol%以上且7mol%以下 B 2 O 3 : 1 mol% or more and 7 mol% or less
PbO:10mol%以上且57mol%以下 PbO: 10 mol% or more and 57 mol% or less
TeO2:10mol%以上且70mol%以下 TeO 2 : 10 mol% or more and 70 mol% or less
[玻璃M] [Glass M]
SiO2:9mol%以上且65mol%以下 SiO 2 : 9 mol% or more and 65 mol% or less
B2O3:1mol%以上且18mol%以下 B 2 O 3 : 1 mol% or more and 18 mol% or less
PbO:9mol%以上且65mol%以下 PbO: 9 mol% or more and 65 mol% or less
Li2O:0.6mol%以上且18mol%以下 Li 2 O: 0.6 mol% or more and 18 mol% or less
TeO2:10mol%以上且70mol%以下 TeO 2 : 10 mol% or more and 70 mol% or less
[玻璃N] [Glass N]
Bi2O3:10mol%以上且29mol%以下 Bi 2 O 3 : 10 mol% or more and 29 mol% or less
B2O3:10mol%以上且33mol%以下 B 2 O 3 : 10 mol% or more and 33 mol% or less
SiO2:0mol%以上且20mol%以下 SiO 2 : 0 mol% or more and 20 mol% or less
ZnO:10mol%以上且30mol%以下 ZnO: 10 mol% or more and 30 mol% or less
TeO2:10mol%以上且60mol%以下 TeO 2 : 10 mol% or more and 60 mol% or less
Li2O、Na2O及K2O的合計:8mol%以上且21mol%以下 Total of Li 2 O, Na 2 O, and K 2 O: 8 mol% or more and 21 mol% or less
於本發明的導電性組成物使用所述的玻璃L、玻璃M及玻璃N中任一者時,可尤佳地提高太陽電池的電特性。即,作為表現燒穿效果的玻璃組成物,例如使用作為含鉛玻璃的玻璃L及玻璃 M、或作為無鉛玻璃的玻璃N中任一者均可較佳地進行太陽電池的受光面電極的形成。 When any of the glass L, the glass M, and the glass N described above is used for the conductive composition of the present invention, the electrical characteristics of the solar cell can be particularly improved. That is, as a glass composition which exhibits a burn-through effect, for example, glass L and glass which are lead-containing glass are used. The formation of the light-receiving surface electrode of the solar cell can be preferably performed by either M or the glass N as the lead-free glass.
另一方面,於碲化合物擔載玻璃組成物中,碲化合物是 與作為載體的玻璃組成物不可分地一體結合的狀態,且是主要作為結晶相而非作為構成玻璃的成分而含有。例如,具體而言,相對於一個鱗片狀或粉末狀的玻璃介質,可為一個或多個碲化合物粒子結合而擔載於玻璃介質上的狀態。擔載碲化合物粒子的玻璃介質亦可進一步結合多個等。此處,關於玻璃介質與碲化合物粒子的相對大小,並無特別限制,任一者均可為大,又,亦可為相同程度的大小。只要保持兩者的相對位置關係即可。 On the other hand, in the ruthenium compound-supporting glass composition, the ruthenium compound is The glass composition as a carrier is inseparably integrated with each other, and is mainly contained as a crystal phase rather than as a component constituting the glass. For example, specifically, it is a state in which one or a plurality of cerium compound particles are bonded to each other and supported on a glass medium with respect to one scaly or powdery glass medium. The glass medium carrying the ruthenium compound particles may be further combined with a plurality of or the like. Here, the relative size of the glass medium and the cerium compound particles is not particularly limited, and either of them may be large or may be the same size. Just keep the relative positional relationship between the two.
若著眼於該碲化合物擔載玻璃組成物的結構,則碲化合 物擔載玻璃組成物具有將玻璃組成物(玻璃相)、與晶質碲化合物相(結晶相)介隔界面而一體化而成的結構。此處,玻璃相以實質上不含碲(Te)的玻璃作為主成分。即,玻璃相可含有Te,但並非作為主要的形成玻璃骨架的成分,而是可作為次要成分而含有。又,碲化合物相是以碲化合物作為主成分(例如,意欲使碲化合物佔50質量%以上)的晶質,具有結晶結構,於此方面可明顯區別於玻璃相。玻璃相可包含一種玻璃相,亦可存在多種玻璃相。又,碲化合物相可包含一種碲化合物相,亦可存在多種碲化合物相。例如,於一個玻璃相中,可將組成不同的多種碲化合物相一體化,亦可將組成不同的多種玻璃相與組成不同的多種碲化合物相一體化。 If attention is paid to the structure of the ruthenium compound supporting the glass composition, The material-supporting glass composition has a structure in which a glass composition (glass phase) and a crystalline cerium compound phase (crystalline phase) are interfacially interfacial and integrated. Here, the glass phase has a glass containing substantially no cerium (Te) as a main component. That is, the glass phase may contain Te, but it is not contained as a main component for forming a glass skeleton, but may be contained as a secondary component. Further, the ruthenium compound phase is a crystal having a ruthenium compound as a main component (for example, a ruthenium compound is intended to be 50% by mass or more), and has a crystal structure, and in this respect, it can be clearly distinguished from the glass phase. The glass phase can comprise a glass phase, and a plurality of glass phases can also be present. Further, the ruthenium compound phase may contain one ruthenium compound phase, and a plurality of ruthenium compound phases may also exist. For example, in a glass phase, a plurality of ruthenium compounds having different compositions may be integrated, and a plurality of glass phases having different compositions may be integrated with a plurality of ruthenium compounds having different compositions.
由於該些玻璃相與碲化合物相亦存在接合界面互相的成分會擴散的情況,因此,例如於界面附近亦可含有互相的成分。即,可為於界面附近互相的成分不均的形態。典型而言,例如,玻璃相可在與碲化合物相的界面附近含有Te。但可為於玻璃相的中心附近不含Te的形態。再者,根據玻璃相的大小,亦可考慮中心附近含有Te的形態,但於該情形時,亦可理解為Te並非作為主要的玻璃網狀形成劑(即玻璃骨架)而存在。又,碲化合物相可在與玻璃相的界面附近含有玻璃相的構成成分。於該情形時,是將玻璃相的構成成分作為碲化合物的一構成成分而局部含有。 Since the glass phase and the ruthenium compound phase also have a component in which the components at the joint interface are diffused, for example, the components may be contained in the vicinity of the interface. That is, it may be a form in which the components in the vicinity of the interface are not uniform. Typically, for example, the glass phase may contain Te in the vicinity of the interface with the ruthenium compound phase. However, it may be in the form of no Te near the center of the glass phase. Further, depending on the size of the glass phase, a form in which Te is contained in the vicinity of the center may be considered. However, in this case, it is also understood that Te does not exist as a main glass network forming agent (ie, a glass skeleton). Further, the ruthenium compound phase may contain a constituent component of the glass phase in the vicinity of the interface with the glass phase. In this case, the constituent component of the glass phase is partially contained as a constituent component of the cerium compound.
即,於碲擔載玻璃介質中,玻璃相與碲化合物相介隔界面而接合,雖然於界面附近互相的成分可擴散,但不存在一相被完全併入另一相中的情況,本質上是作為獨立的不同的相而存在。 That is, in the ruthenium-supporting glass medium, the glass phase and the ruthenium compound are joined at the interface, and although the components in the vicinity of the interface are diffusible, there is no case where one phase is completely incorporated into the other phase, essentially It exists as a separate and distinct phase.
於該碲擔載玻璃組成物中,擔載碲化合物的玻璃組成物(可為玻璃相。以下相同)的形狀並無特別限制,典型而言,可為將玻璃粉碎等所獲得的鱗片狀或粉末狀的玻璃。又,組成亦無特別限制,可設為與自先前起用於此種導電性組成物的玻璃介質等相同者。 The shape of the glass composition carrying the ruthenium compound (which may be a glass phase, the same applies hereinafter) in the ruthenium-supporting glass composition is not particularly limited, and may be, for example, a scaly shape obtained by pulverizing glass or the like. Powdered glass. Further, the composition is not particularly limited, and may be the same as a glass medium or the like used for such a conductive composition from the prior art.
作為此種玻璃介質,例如,可例示:鉛系玻璃、鋅系玻璃、硼矽酸系玻璃、鹼系玻璃;及含有氧化鋇或氧化鉍等的玻璃;或包含該些兩種以上的組合等的玻璃。該玻璃介質的組成可按照所述的含碲玻璃組成物的構成(TeO2以外)進行考慮。更具體而言,例如,可列舉具有如以下所示的代表組成(氧化物換算組成;將 玻璃介質整體設為100mol%)的玻璃組成物作為較佳的例。 Examples of such a glass medium include lead-based glass, zinc-based glass, borosilicate glass, and alkali-based glass; and glass containing cerium oxide or cerium oxide; or a combination of two or more thereof. Glass. The composition of the glass medium can be considered in accordance with the composition of the bismuth-containing glass composition (other than TeO 2 ). More specifically, for example, a glass composition having a representative composition (the oxide-converted composition; the entire glass medium is 100 mol%) as shown below is preferable.
[玻璃L'] [Glass L']
SiO2:9mol%以上且53mol%以下 SiO 2 : 9 mol% or more and 53 mol% or less
B2O3:1mol%以上且7mol%以下 B 2 O 3 : 1 mol% or more and 7 mol% or less
PbO:46mol%以上且57mol%以下 PbO: 46 mol% or more and 57 mol% or less
[玻璃M'] [Glass M']
SiO2:20mol%以上且65mol%以下 SiO 2 : 20 mol% or more and 65 mol% or less
B2O3:1mol%以上且18mol%以下 B 2 O 3 : 1 mol% or more and 18 mol% or less
PbO:20mol%以上且65mol%以下 PbO: 20 mol% or more and 65 mol% or less
Li2O:0.6mol%以上且18mol%以下 Li 2 O: 0.6 mol% or more and 18 mol% or less
[玻璃N'] [Glass N']
Bi2O3:10mol%以上且29mol%以下 Bi 2 O 3 : 10 mol% or more and 29 mol% or less
B2O3:20mol%以上且33mol%以下 B 2 O 3 : 20 mol% or more and 33 mol% or less
SiO2:0mol%以上且20mol%以下 SiO 2 : 0 mol% or more and 20 mol% or less
ZnO:15mol%以上且30mol%以下 ZnO: 15 mol% or more and 30 mol% or less
Li2O、Na2O及K2O的合計:8mol%以上且21mol%以下 Total of Li 2 O, Na 2 O, and K 2 O: 8 mol% or more and 21 mol% or less
再者,所述的組成為代表性者,就獲得與基板的良好的附著性、或電極膜的形成性、對抗反應反射膜的侵蝕性、良好的歐姆接觸的目的等而言,當然可對各種成分進行調整,或者亦可進一步添加玻璃修飾成分(鹼金屬元素、鹼土金屬元素或其他各種玻璃形成成分)。 In addition, the representative composition is representative, and good adhesion to a substrate, formation of an electrode film, corrosion resistance against a reaction reflection film, good ohmic contact, and the like are obtained. Various components may be adjusted, or a glass modifying component (an alkali metal element, an alkaline earth metal element, or various other glass forming components) may be further added.
又,擔載於所述玻璃組成物的碲化合物亦無特別限制, 例如可考慮所述例示的各種碲化合物。擔載於玻璃介質的碲化合物的比例亦無特別限制,例如,作為大致基準,所述碲化合物相對於玻璃介質100質量份,較佳為以換算為氧化碲(TeO2)時的質量計以20質量份~60質量份的比例擔載,更佳為30質量份~50質量份程度。 Further, the ruthenium compound supported on the glass composition is not particularly limited, and for example, various ruthenium compounds exemplified above can be considered. The ratio of the ruthenium compound supported on the glass medium is not particularly limited. For example, the ruthenium compound is preferably used in terms of mass per 100 parts by mass of the glass medium in terms of cerium oxide (TeO 2 ). The ratio of 20 parts by mass to 60 parts by mass is more preferably 30 parts by mass to 50 parts by mass.
藉由以上構成的碲擔載玻璃組成物,認為於導電性組成 物中,碲化合物與玻璃組成物以較佳的狀態存在,不存在過度均勻或過度不均的情況,亦不存在過度靠近或過度遠離的情況。自製備導電性組成物時起,該導電性組成物的塗佈、乾燥期間自不必說,直至玻璃成分因煅燒而熔融為止,該較佳的位置關係得以持續維持。藉由含有此種碲擔載玻璃組成物的導電性組成物,與含有碲化合物作為單一的膏構成成分的銀膏相比,可形成低電阻且可實現高能量轉換效率的電極。又,藉由含有該碲擔載玻璃組成物的導電性組成物,與含有將碲作為網狀形成劑而含有的玻璃介質的導電性組成物相比,可形成接著強度高的電極。即,可形成具有高接著強度(例如,焊接強度)、且接觸電阻低的電極。 The conductive composition is considered by the above-mentioned ruthenium-supporting glass composition In the case where the ruthenium compound and the glass composition are present in a preferred state, there is no excessive uniformity or excessive unevenness, and there is no excessively close or excessively distant. From the time of preparation of the conductive composition, the application and drying of the conductive composition need not be continued until the glass component is melted by firing, and the preferable positional relationship is maintained. By the conductive composition containing such a ruthenium-supporting glass composition, an electrode having low resistance and high energy conversion efficiency can be formed as compared with a silver paste containing a ruthenium compound as a single paste constituent component. In addition, the conductive composition containing the ruthenium-supporting glass composition can form an electrode having a higher bonding strength than a conductive composition containing a glass medium containing ruthenium as a network-forming agent. That is, an electrode having high adhesion strength (for example, welding strength) and low contact resistance can be formed.
再者,此處所揭示的含碲玻璃未必需要全部為如上所述的含有碲作為玻璃構成成分的各種玻璃組成物及/或碲擔載玻璃組成物。例如,亦可將含有碲作為玻璃構成成分的各種玻璃組成物及/或碲擔載玻璃組成物與自先前起用於此種導電性組成物的不含碲成分的基本玻璃成分(非含碲玻璃)混合使用。該基本玻璃成分 的組成並無特別限制,例如,可按照所述的含碲玻璃組成物的構成(TeO2以外)進行考慮。更具體而言,可列舉具有所述玻璃L'、玻璃M'及玻璃N'中任一組成的玻璃作為較佳的例。該情形時的含碲玻璃與基本玻璃成分的比例可參考佔導電性組成物的玻璃成分的總量、及含碲玻璃所含的碲量而適當決定。 Further, the bismuth-containing glass disclosed herein does not necessarily need to be all of the glass compositions and/or ruthenium-supporting glass compositions containing ruthenium as a glass constituent component as described above. For example, various glass compositions and/or ruthenium-supporting glass compositions containing ruthenium as a glass constituent component and basic bismuth-free glass components (non-ruthenium-containing glass) used for such a conductive composition from the prior art may be used. )Mixed use. The composition of the basic glass component is not particularly limited, and for example, it can be considered in accordance with the composition of the above-described bismuth-containing glass composition (other than TeO 2 ). More specifically, a glass having any one of the above-described glass L', glass M', and glass N' is exemplified as a preferred example. The ratio of the bismuth-containing glass to the basic glass component in this case can be appropriately determined by referring to the total amount of the glass component of the conductive composition and the amount of ruthenium contained in the bismuth-containing glass.
玻璃成分整體佔該導電性組成物(固體成分)的較佳的比例並不限定於此,但大致為0.5質量%以上且5質量%以下,較佳為0.5質量%以上且3質量%以下,更佳為1質量%以上且3質量%以下較為合適。 The preferred ratio of the glass component to the conductive composition (solid content) is not limited thereto, but is preferably 0.5% by mass or more and 5% by mass or less, preferably 0.5% by mass or more and 3% by mass or less. More preferably, it is 1% by mass or more and 3% by mass or less.
又,由於含碲組成物的含量亦取決於所使用的含碲組成 物的形態,因此無法一概而論,但可以將導電性組成物塗佈於太陽電池的基板並進行了煅燒時的基板與導電性組成物的界面所含的碲(Te)的平均價數成為4.3以上且5.1以下的方式,且以與銀粉末及碲價數調整材料的調配比例而決定。例如,於使用後述的實施例中記載的含碲玻璃作為含碲組成物的情形時,作為大致基準,於將導電性組成物(固體成分)整體設為100質量%時,含碲組成物所佔的比例較佳為於0.5質量%以上且50質量%以下、更佳為1質量%以上且35質量%以下、例如5質量%以上且25質量%以下的範圍進行適當調整。 Also, since the content of the cerium-containing composition also depends on the cerium-containing composition used. Although the form of the object cannot be generalized, the average valence of cerium (Te) contained in the interface between the substrate and the conductive composition when the conductive composition is applied to the substrate of the solar cell and calcined is 4.3 or more. And 5.1 or less, and it is determined by adjusting the ratio of the silver powder and the valence number adjustment material. For example, when the cerium-containing composition described in the examples described later is used as the cerium-containing composition, the cerium-containing composition is used when the total amount of the conductive composition (solid content) is 100% by mass. The ratio is preferably 0.5% by mass or more and 50% by mass or less, more preferably 1% by mass or more and 35% by mass or less, and for example, 5% by mass or more and 25% by mass or less.
作為碲價數調整材料,可較佳地使用包含含有氧化數相對而言較易變化的元素的化合物的粉末。例如,可考慮可成為+3價以 上的離子的過渡金屬、典型金屬及含有稀土元素的金屬或其化合物。更佳為可為屬於自週期表的第3A族至第3B族的元素的金屬或其化合物,典型而言可考慮屬於自週期表的第3A族至第2B族的過渡金屬元素,尤佳為可考慮包含作為第一過渡元素(3d過渡元素)的鈧(Sc)、鈦(Ti)、釩(V)、鉻(Cr)、錳(Mn)、鐵(Fe)、鈷(Co)、鎳(Ni)、銅(Cu)及鋅(Zn)的金屬或其化合物的粉末。更佳為包含Fe、Co、Ni、Ti的金屬或其氧化物的粉末,進而可限定為Ni或NiO。該些粉末可單獨含有任一種,亦可含有兩種以上。 As the valence number adjusting material, a powder containing a compound containing an element which is relatively easily changed in oxidation number can be preferably used. For example, consider a price of +3 A transition metal of an ion, a typical metal, and a metal containing a rare earth element or a compound thereof. More preferably, it is a metal or a compound thereof which is an element belonging to Groups 3A to 3B of the periodic table, and a transition metal element belonging to Group 3A to Group 2B of the periodic table is typically considered, and particularly preferably It is conceivable to contain ruthenium (Sc), titanium (Ti), vanadium (V), chromium (Cr), manganese (Mn), iron (Fe), cobalt (Co), nickel as the first transition element (3d transition element). A powder of a metal of (Ni), copper (Cu), and zinc (Zn) or a compound thereof. More preferably, it is a powder containing a metal of Fe, Co, Ni, Ti or an oxide thereof, and further may be limited to Ni or NiO. These powders may be contained alone or in combination of two or more.
作為構成該些粉末的粒子的平均粒徑,適宜為1nm以上且200nm以下,較佳為5nm以上且200nm以下,更佳為15nm以上且200nm以下。 The average particle diameter of the particles constituting the powders is preferably 1 nm or more and 200 nm or less, preferably 5 nm or more and 200 nm or less, more preferably 15 nm or more and 200 nm or less.
碲價數調整材料的含量可以將導電性組成物塗佈於太 陽電池的基板並進行了煅燒時的基板與導電性組成物的界面所含的碲(Te)的平均價數成為4.3以上且5.1以下的方式,且以與銀粉末及含碲組成物的調配比例而決定。藉由調整碲價數調整材料的含量,可有效地控制碲的平均化數。碲價數調整材料的含量並無嚴格限制,作為大致基準,於將導電性組成物(固體成分)整體設為100質量%時,可以碲價數調整材料所佔的比例大致為0.5質量%以下程度為基準。較佳為0.001質量%以上且0.3質量%以下,更佳為0.001質量%以上且0.2質量%以下。 The amount of valence adjustment material can be applied to the conductive composition too The average valence of cerium (Te) contained in the interface between the substrate and the conductive composition when the substrate of the positive electrode is baked is 4.3 or more and 5.1 or less, and is blended with the silver powder and the cerium-containing composition. The ratio is determined. By adjusting the amount of the valence to adjust the content of the material, the average number of enthalpies can be effectively controlled. The content of the valence number adjustment material is not critical, and when the total amount of the conductive composition (solid content) is 100% by mass, the ratio of the valence number adjustment material is approximately 0.5% by mass or less. The degree is the benchmark. It is preferably 0.001% by mass or more and 0.3% by mass or less, more preferably 0.001% by mass or more and 0.2% by mass or less.
按以上方式調配的導電性組成物可以包含銀粉末、含碲組成物及碲價數調整材料的固體粉末狀(典型而言為混合物的狀態)而提供,但例如亦可以分散於有機介質中的狀態而提供。即,導電性組成物可含有有機介質作為所述固體成分以外的成分。作為該有機介質,只要為可使所述固體成分、尤其是銀粉末良好地分散者即可,可無特別限制地使用現有的用於此種膏的有機介質。典型而言,可考慮使有機黏合劑分散於溶劑中而成的有機媒液(vehicle)。例如,作為構成有機介質的溶劑,可使用一種或組合使用多種乙二醇及二乙二醇衍生物(二醇醚系溶劑)、甲苯、二甲苯、丁基卡必醇(Butyl carbitol,BC)、萜品醇等高沸點有機溶劑。又,作為有機黏合劑,可含有各種樹脂成分。該樹脂成分只要為可對導電性組成物賦予良好的黏性及塗膜形成能力(對基板的附著性)者即可,可無特別限制地使用現有的用於此種膏的樹脂成分。例如,可列舉以丙烯酸樹脂、環氧樹脂、酚樹脂、醇酸樹脂、纖維素系高分子、聚乙烯醇、松香樹脂等為主體者。其中,尤佳為乙基纖維素等纖維素系高分子。 The conductive composition formulated in the above manner may be provided by a silver powder, a cerium-containing composition, and a solid powder form of a valence valence adjusting material (typically in a state of a mixture), but may be dispersed, for example, in an organic medium. Provided by status. That is, the conductive composition may contain an organic medium as a component other than the solid component. The organic medium can be used as long as the solid component, particularly the silver powder, can be well dispersed, and the conventional organic medium for such a paste can be used without particular limitation. Typically, an organic vehicle in which an organic binder is dispersed in a solvent can be considered. For example, as the solvent constituting the organic medium, one type or a combination of a plurality of ethylene glycol and a diethylene glycol derivative (glycol ether type solvent), toluene, xylene, and butyl carbitol (BC) may be used. A high boiling organic solvent such as terpineol. Further, as the organic binder, various resin components may be contained. The resin component is not particularly limited as long as it can impart good adhesion to the conductive composition and coating film forming ability (adhesion to the substrate), and a conventional resin component for such a paste can be used without particular limitation. For example, an acrylic resin, an epoxy resin, a phenol resin, an alkyd resin, a cellulose polymer, a polyvinyl alcohol, a rosin resin, etc. are mentioned. Among them, a cellulose-based polymer such as ethyl cellulose is particularly preferred.
該有機介質佔導電性組成物整體(固體成分+有機介質)的比例適宜為5質量%以上且60質量%以下,較佳為7質量%以上且50質量%以下,更佳為10質量%以上且40質量%以下。又,媒液中所含的有機黏合劑可以導電性組成物整體的1質量%以上且10質量%以下程度、更佳為1質量%以上且7質量%以下程度的比例而含有。藉由設為該構成,易於在基板上作為電極(膜) 而形成(塗佈)均勻厚度的塗膜,操作容易,且煅燒電極膜前的乾燥無需長時間而可較佳地乾燥,故而較佳。 The ratio of the organic medium to the entire conductive composition (solid content + organic medium) is preferably 5% by mass or more and 60% by mass or less, preferably 7% by mass or more and 50% by mass or less, and more preferably 10% by mass or more. And 40% by mass or less. In addition, the organic binder contained in the vehicle may be contained in an amount of about 1% by mass or more and 10% by mass or less, more preferably 1% by mass or more and 7% by mass or less, based on the total amount of the conductive composition. By adopting this configuration, it is easy to use as an electrode (film) on the substrate. On the other hand, it is preferable to form (coat) a coating film having a uniform thickness, which is easy to handle, and drying before calcining the electrode film is preferably carried out without drying for a long period of time.
再者,將固體成分分散於有機介質中的形態(可為所謂 的膏、油墨等狀態)的導電性組成物例如可藉由以下手法而較佳地調整。 Furthermore, a form in which a solid component is dispersed in an organic medium (may be called The conductive composition of the paste, ink, or the like can be preferably adjusted by, for example, the following method.
即,將所述所準備的銀粉末、含碲組成物、及碲價數調整材料分散於有機介質中。典型而言,該固體成分於有機介質中的分散例如可使用三輥磨機或其他混煉機等,將特定調配比的銀粉末、含碲組成物及碲價數調整材料與媒液一併混合、攪拌。再者,於混合以上材料時,可將全部材料同時混合,亦可分2次以上投入。例如,亦可預先將銀粉末及含碲組成物(碲擔載玻璃除外)混合,其後添加碲擔載玻璃或碲價數調整材料。進而,亦可以預先將一部分材料分散於例如水系溶劑或醇類等介質中而成的分散液的形態進行混合等。藉此,可較佳地製備將固體成分分散於有機介質中的形態的導電性組成物。 That is, the prepared silver powder, the cerium-containing composition, and the valence number adjusting material are dispersed in an organic medium. Typically, the dispersion of the solid component in an organic medium can be carried out, for example, using a three-roll mill or another kneader, and the silver powder, the ruthenium-containing composition, and the valence number adjusting material of the specific blending ratio are mixed with the vehicle liquid. Mix and stir. Furthermore, when mixing the above materials, all the materials may be mixed at the same time, or may be added in two or more times. For example, the silver powder and the ruthenium-containing composition (excluding the ruthenium-supporting glass) may be mixed in advance, and then the ruthenium-supporting glass or the ruthenium number adjustment material may be added. Further, a part of the material may be mixed and dispersed in a form of a dispersion liquid such as an aqueous solvent or an alcohol. Thereby, a conductive composition in a form in which a solid component is dispersed in an organic medium can be preferably prepared.
再者,含碲組成物中,碲擔載玻璃可藉由例如將特定的玻璃粉末與碲化合物混合並對該混合物進行煅燒而準備。煅燒較佳為於將玻璃粉末的熔點設為Tm℃時,典型而言於在氧化氣體環境(例如,大氣環境)中成為(Tm-35)℃~(Tm+20)℃的溫度範圍下實施。若煅燒溫度超過(Tm+20)℃,則進行玻璃粉末的熔融,碲化合物被併入(溶解)於玻璃相中,故而欠佳。煅燒溫度 更佳為(Tm+15)℃以下,進而較佳為Tm℃以下(即,玻璃粉末的熔點以下)。又,若煅燒溫度低於(Tm-35)℃,則無法確實地擔載碲化合物的可能性增大,故而欠佳。煅燒溫度較佳為(Tm-30)℃以上,更佳為(Tm-20)℃以上。藉此,可準備此處所揭示的碲擔載玻璃。 Further, in the ruthenium-containing composition, the ruthenium-supporting glass can be prepared, for example, by mixing a specific glass powder with a ruthenium compound and calcining the mixture. The calcination is preferably carried out at a temperature range of (Tm-35) ° C to (Tm + 20) ° C in an oxidizing gas atmosphere (for example, an atmospheric environment) when the melting point of the glass powder is Tm ° C. . If the calcination temperature exceeds (Tm + 20) ° C, the glass powder is melted, and the ruthenium compound is incorporated (dissolved) in the glass phase, which is not preferable. Calcination temperature More preferably, it is (Tm+15) ° C or less, and further preferably Tm ° C or less (that is, the melting point of the glass powder or less). Further, when the calcination temperature is lower than (Tm - 35) ° C, the possibility that the antimony compound cannot be reliably supported is increased, which is not preferable. The calcination temperature is preferably (Tm - 30) ° C or more, more preferably (Tm - 20) ° C or more. Thereby, the crucible-supporting glass disclosed herein can be prepared.
再者,作為煅燒後所獲得的煅燒物的碲擔載玻璃亦可存 在整體燒結而形成大的凝聚體的情形。於此種情形時,亦可藉由將該凝聚體粉碎,並視需要而篩選,使用適於導電性組成物的製備的粒度(例如,0.01μm~10μm程度)者。藉由燒結,玻璃粉末與碲化合物形成頸口(neck)而結合。雖然該結合比藉由吸附等形成的附著牢固,但並未將玻璃粉末與碲化合物壓緊,而是直接以混合狀態燒結,因此該凝聚體可不使用球磨機或粉碎機等特別裝置,而是藉由程度輕的粉碎(例如,利用手工作業的壓碎、或使用研缽及研缽棒等的輕型混合)而容易地細粒化為所需粒度。 Furthermore, the crucible-supporting glass which is a calcined product obtained after calcination can also be stored. A case where a large aggregate is formed by sintering as a whole. In such a case, the aggregate may be pulverized and sieved as necessary, and a particle size (for example, about 0.01 μm to 10 μm) suitable for preparation of the conductive composition may be used. By sintering, the glass powder is combined with the bismuth compound to form a neck. Although the bonding is stronger than the adhesion formed by adsorption or the like, the glass powder is not pressed against the bismuth compound, but is directly sintered in a mixed state. Therefore, the aggregate can be borrowed without using a special device such as a ball mill or a pulverizer. The granulation is easily granulated to a desired particle size by a light pulverization (for example, by manual crushing or by light mixing using a mortar and pestle).
按以上方式所獲得的導電性組成物例如可與自先前起一直用於在基板上形成作為受光面電極即Ag電極的銀膏等同樣地進行操作。即,此處所揭示的利用導電性組成物進行的電極的形成可無特別限制地採用現有公知的方法。 The conductive composition obtained in the above manner can be operated in the same manner as the silver paste or the like which is used to form an Ag electrode as a light-receiving surface electrode on the substrate, for example. That is, the formation of the electrode by the conductive composition disclosed herein can be carried out by a conventionally known method without particular limitation.
作為形成該受光面電極12的手法,例如可利用所謂的燒穿法,即於矽基板11的表面的大致整個面上形成抗反射膜14,於該抗反射膜14上方的受光面電極12的形成部分直接塗佈銀膏 並進行了煅燒,藉此使銀膏下方的抗反射膜14熔融而形成銀膏與矽基板11的電接觸。 As a method of forming the light-receiving surface electrode 12, for example, a so-called burn-through method in which the anti-reflection film 14 is formed on substantially the entire surface of the surface of the ruthenium substrate 11 and the light-receiving surface electrode 12 above the anti-reflection film 14 can be used. Forming a part directly coated with silver paste Calcination is performed to melt the anti-reflection film 14 under the silver paste to form electrical contact between the silver paste and the ruthenium substrate 11.
例如,於藉由燒穿法形成如圖1所示的太陽電池10中的銀電極(受光面電極12)的情形時,以與現有同樣的方式於基板的受光面形成n+層16或抗反射膜14後,以成為所需膜厚(例如20μm程度)或所需塗膜圖案的方式將本發明的導電性組成物供給(塗佈)於抗反射膜14上。典型而言,導電性組成物的供給可藉由網版印刷法、分配器塗佈法、浸漬塗佈法等進行。再者,作為基板,較佳為矽(Si)製基板11,典型而言為Si晶圓。該基板11的厚度可考慮所需的太陽電池的尺寸、或於該基板11上形成的Ag電極12,背面電極20,抗反射膜14等的膜厚、該基板11的強度(例如破壞強度)等而進行設定。基板11的厚度例如通常設為100μm以上且300μm以下,較佳為150μm以上且250μm以下,例如可為160μm以上且200μm。又,本導電性組成物亦可用於具有n+層16薄且摻雜劑濃度低的淺結發射極(shallow emitter)結構的基板11。 For example, when a silver electrode (light-receiving surface electrode 12) in the solar cell 10 shown in FIG. 1 is formed by a burn-through method, an n + layer 16 or an anti-reflection is formed on the light-receiving surface of the substrate in the same manner as in the prior art. After the reflection film 14, the conductive composition of the present invention is supplied (coated) on the anti-reflection film 14 so as to have a desired film thickness (for example, about 20 μm) or a desired coating film pattern. Typically, the supply of the conductive composition can be carried out by a screen printing method, a dispenser coating method, a dip coating method, or the like. Further, as the substrate, a substrate 11 made of bismuth (Si) is preferable, and is typically a Si wafer. The thickness of the substrate 11 can take into consideration the size of the solar cell required, or the thickness of the Ag electrode 12, the back surface electrode 20, the anti-reflection film 14 and the like formed on the substrate 11, and the strength (for example, the breaking strength) of the substrate 11. Set it up. The thickness of the substrate 11 is, for example, usually 100 μm or more and 300 μm or less, preferably 150 μm or more and 250 μm or less, and for example, 160 μm or more and 200 μm. Further, the present conductive composition can also be applied to the substrate 11 having a shallow emitter structure having a thin n + layer 16 and a low dopant concentration.
此處所揭示的導電性組成物例如可為主要將銀粉末、與 作為含碲組成物的玻璃成分分散於有機介質中所構成者。此種導電性組成物藉由組成物中的玻璃成分在煅燒過程中破壞抗反射膜14,而實現組成物中的銀成分與n-Si層16的歐姆接觸。藉由該手法,與伴隨抗反射膜14的部分去除的電極形成手法相比,可減少步驟數,且不必擔心抗反射膜14的去除部分與受光面電極12的 形成位置產生偏離。因此,受光面電極12的形成可較佳地採用該燒穿法。 The conductive composition disclosed herein may be, for example, mainly silver powder, and The glass component containing the ruthenium-containing composition is dispersed in an organic medium. Such a conductive composition causes the ohmic contact of the silver component in the composition with the n-Si layer 16 by destroying the anti-reflection film 14 during the calcination by the glass component in the composition. By this method, the number of steps can be reduced as compared with the electrode forming method accompanying partial removal of the anti-reflection film 14, and there is no need to worry about the removed portion of the anti-reflection film 14 and the light-receiving surface electrode 12. The formation position is deviated. Therefore, the formation of the light-receiving electrode 12 can preferably employ the burn-through method.
再者,於不採用燒穿法的情形時,例如可採用以下手法。即,首先,在矽基板11表面的大致整個面,藉由化學氣相沈積(Chemical Vapor Deposition,CVD)等於受光面形成n+層16或抗反射膜14。其後,使用氫氟酸(氟化氫(hydrogen fluorite,HF))等按所需的電極圖案將該抗反射膜14中的受光面電極12的形成部分剝離(去除)。然後,可列舉以所需的膜厚對該剝離部分供給導電性組成物。 Further, in the case where the burn-through method is not employed, for example, the following method can be employed. That is, first, the n + layer 16 or the anti-reflection film 14 is formed by chemical vapor deposition (CVD) equal to the light receiving surface on substantially the entire surface of the surface of the ruthenium substrate 11. Thereafter, the formation portion of the light-receiving surface electrode 12 in the anti-reflection film 14 is peeled off (removed) using hydrofluoric acid (hydrogen fluorite (HF)) or the like in accordance with a desired electrode pattern. Then, a conductive composition is supplied to the peeled portion at a desired film thickness.
繼而,於適當的溫度(例如為室溫以上,典型而言為100℃程度)下將供給至基板11的導電性組成物的塗佈物(塗膜)乾燥。乾燥後,藉由在適當的煅燒爐(例如高速煅燒爐)中,於合適的加熱條件(例如600℃以上且900℃以下,較佳為700℃以上且800℃以下)下加熱特定時間而進行乾燥塗膜的煅燒。藉此,將所述塗佈物燒接於基板11上,形成如圖2所示的銀電極12。 Then, the coating material (coating film) of the conductive composition supplied to the substrate 11 is dried at an appropriate temperature (for example, at room temperature or higher, typically about 100 ° C). After drying, it is heated in a suitable calcination furnace (for example, a high-speed calciner) under suitable heating conditions (for example, 600 ° C or more and 900 ° C or less, preferably 700 ° C or more and 800 ° C or less) for a specific time. Calcination of the dried coating film. Thereby, the coating material is baked on the substrate 11 to form the silver electrode 12 as shown in FIG.
再者,除了使用藉由本發明的製造方法所製造的導電性組成物形成電極(典型而言,受光面電極)以外的用於太陽電池製造的材料或製程可與現有相同。此外,可無需特別處理等而製造具備藉由該導電性組成物所形成的電極的太陽電池(典型而言為結晶矽系太陽電池)。作為該結晶矽系太陽電池的構成的一典型例,可列舉如上述的圖1所示的構成。 Further, a material or a process for manufacturing a solar cell other than the conductive composition forming electrode (typically, a light-receiving surface electrode) manufactured by the manufacturing method of the present invention may be the same as the prior art. Further, a solar cell (typically a crystalline lanthanide solar cell) having an electrode formed of the conductive composition can be produced without special treatment or the like. A typical example of the configuration of the crystalline lanthanide solar cell is the configuration shown in Fig. 1 described above.
作為受光面電極形成以外的製程,可列舉作為背面電極20的鋁電極20的形成。該鋁電極20的形成順序如以下所述。例如,首先,如所述般於受光面印刷用以形成受光面電極12的導電性組成物,於背面亦在所需區域印刷背面側外部連接用電極22形成用導電性組成物(可為藉由此處所揭示的製造方法所調整的導電性組成物)並將其乾燥。其後,以重疊於背面側外部連接用電極用導電性組成物的印刷區域的一部分的方式印刷鋁電極膏材料並將其乾燥,進行全部塗膜的煅燒。通常於煅燒鋁電極20的同時亦形成P+層(BSF層)24。即,於藉由煅燒在p型矽基板11上形成成為背面電極20的鋁電極20的同時,藉由鋁原子擴散於該基板11中而形成含有鋁作為雜質的p+層24。由此可製作太陽電池(電池單元)10。 As a process other than the formation of the light-receiving surface electrode, the formation of the aluminum electrode 20 as the back surface electrode 20 is mentioned. The order in which the aluminum electrodes 20 are formed is as follows. For example, first, as described above, the conductive composition for forming the light-receiving surface electrode 12 is printed on the light-receiving surface, and the conductive composition for forming the back-side external connection electrode 22 is printed on the back surface in the desired region. The conductive composition adjusted by the manufacturing method disclosed herein is dried and dried. Then, the aluminum electrode paste material is printed so as to be superimposed on a part of the printing region of the conductive composition for the back side external connection electrode, and dried, and the entire coating film is fired. A P + layer (BSF layer) 24 is also formed at the same time as the aluminum electrode 20 is calcined. In other words, the aluminum electrode 20 serving as the back surface electrode 20 is formed on the p-type germanium substrate 11 by firing, and the p + layer 24 containing aluminum as an impurity is formed by diffusing aluminum atoms in the substrate 11. Thereby, a solar cell (battery unit) 10 can be produced.
此處所揭示的導電性組成物是如上所述般以煅燒後的基板與電極的界面所含的碲的平均價數成為4.3以上且5.1以下的方式而進行控制。藉由該電子狀態的碲存在於基板與電極的界面,基板與電極之間的接觸變得良好,而可將太陽電池10的基板11內產生的電力經由電極以低損失的狀態擷取至外部。藉此,可製作能量轉換效率高的太陽電池。又,由於該導電性組成物本質上含有碲成分,故而接著強度高,可製作耐久性及可靠性高的太陽電池。因此,藉由該導電性組成物,可提供具有優異的太陽電池特性(例如,FF為0.78以上,發電效率為16.5%以上)的太陽電池。 The conductive composition disclosed herein is controlled such that the average valence of ruthenium contained in the interface between the substrate and the electrode after firing is 4.3 or more and 5.1 or less. Since the germanium in the electronic state exists at the interface between the substrate and the electrode, the contact between the substrate and the electrode becomes good, and the electric power generated in the substrate 11 of the solar cell 10 can be extracted to the outside through the electrode with a low loss state. . Thereby, a solar cell having high energy conversion efficiency can be produced. Further, since the conductive composition contains an antimony component in nature, the strength is high, and a solar cell having high durability and reliability can be produced. Therefore, the solar cell having excellent solar cell characteristics (for example, FF of 0.78 or more and power generation efficiency of 16.5% or more) can be provided by the conductive composition.
再者,藉由燒穿法所形成的太陽電池10的能量轉換效 率等性能較大程度上取決於以所述方式所形成的歐姆接觸的品質。即,藉由降低所形成的受光面電極12與矽基板11的接觸電阻,可達成高能量轉換效率。此處所揭示的導電性組成物如上所述,可改善歐姆接觸,進而可較佳地有助於實現填充因子(FF)或能量轉換效率得以提高的太陽電池10。 Furthermore, the energy conversion effect of the solar cell 10 formed by the burn-through method The rate and the like are largely dependent on the quality of the ohmic contact formed in the manner described. That is, by reducing the contact resistance between the formed light-receiving surface electrode 12 and the ruthenium substrate 11, high energy conversion efficiency can be achieved. The conductive composition disclosed herein can improve ohmic contact as described above, and thus can preferably contribute to the solar cell 10 in which the fill factor (FF) or energy conversion efficiency is improved.
又,於現有的太陽電池的通常的構成中,由於波長短的 光透過性低,因此不存在達到pn接合並有助於發電的情況,而是被n-Si層吸收而變為熱(熱損失)。於此處所揭示的太陽電池10的較佳一實施方式中,就儘量將波長更短的光以高強度送達pn接合部分而提高光電轉換效率的目的而言,亦可減小n-Si層16的厚度(深度)而減少熱損失。n-Si層16的厚度例如亦可與現有同樣地設為300nm~500nm程度。然而,例如亦可設為300nm以下、更佳為250nm以下程度而進行薄層化。 Moreover, in the conventional configuration of the conventional solar cell, the wavelength is short. Since light transmittance is low, there is no case where pn bonding is achieved and power generation is facilitated, but it is absorbed by the n-Si layer to become heat (heat loss). In a preferred embodiment of the solar cell 10 disclosed herein, the n-Si layer 16 can also be reduced for the purpose of delivering light of a shorter wavelength to the pn junction portion with high intensity to improve photoelectric conversion efficiency. The thickness (depth) reduces heat loss. The thickness of the n-Si layer 16 can be, for example, about 300 nm to 500 nm as in the related art. However, for example, it may be made thinner than 300 nm or less, more preferably 250 nm or less.
通常,若n-Si層的厚度變得如此薄,則由於n-Si層本 身高電阻化而片電阻增大,且為了抑制表面再結合而需降低摻雜劑濃度等,因此有產生受光面電極與n-Si層之間難以獲得良好的歐姆接觸、接觸電阻增大的問題之虞。又,若受光面電極的形成應用所述的燒穿法,則產生電極膏不僅到達n-Si層、而且亦超過n-Si層而侵蝕至pn接合界面附近的可能性,要求煅燒條件的嚴格化,又,有反之對太陽電池的填充因子(FF)或能量轉換效率造成不良影響之虞。然而,藉由使用此處所揭示的導電性組成物形成受 光面電極,可如所述般確實地改善歐姆接觸。因此,即便於例如使n-Si層16的厚度薄至250nm以下,或以不侵蝕pn接合的方式調整煅燒條件的情形時,亦可抑制接觸電阻的增大而實現良好的接合。 Generally, if the thickness of the n-Si layer becomes so thin, since the n-Si layer is The electric resistance is increased and the sheet resistance is increased, and the dopant concentration or the like is required to suppress the recombination of the surface, so that it is difficult to obtain a good ohmic contact between the light-receiving surface electrode and the n-Si layer, and the contact resistance is increased. After that. Further, when the above-described burn-through method is applied to the formation of the light-receiving electrode, the possibility that the electrode paste not only reaches the n-Si layer but also exceeds the n-Si layer and erodes to the vicinity of the pn junction interface is required, and the calcination conditions are required to be strict. And, in turn, there is a negative impact on the solar cell's fill factor (FF) or energy conversion efficiency. However, by using the conductive composition disclosed herein, formation The smooth electrode can positively improve the ohmic contact as described. Therefore, even when the thickness of the n-Si layer 16 is made thinner than 250 nm or less, or the baking condition is adjusted so as not to etch the pn junction, it is possible to suppress an increase in contact resistance and achieve good bonding.
以下對與本發明相關的實施例進行說明,但並無意將本發明限定於如以下實施例所示者。 The embodiments related to the present invention are described below, but the present invention is not intended to be limited to the following examples.
製備包含銀粉末(平均粒徑1.6μm)、Ni粉末(平均粒徑0.15μm)及如下述所示的玻璃組成物的導電性組成物1~導電性組成物10。將該些導電性組成物分散於包含黏合劑(乙基纖維素)與有機溶劑(萜品醇)的有機媒液中並加入有機溶劑,藉此調整為黏度為160Pa.s~180Pa.s(20rpm,25℃)的膏狀。膏的製備使用三輥磨機。由此獲得的膏狀導電性組成物的配方如下:銀粉末:77質量%~88質量%;Ni粉末:0.01質量%~0.2質量%;玻璃組成物:1質量%~10質量%;有機媒液(organic vehicle):4質量%~14質量%;有機溶劑:2質量%~8質量%。 A conductive composition 1 to a conductive composition 10 containing a silver powder (average particle diameter: 1.6 μm), Ni powder (average particle diameter: 0.15 μm), and a glass composition shown below were prepared. The conductive composition is dispersed in an organic vehicle containing a binder (ethylcellulose) and an organic solvent (terpineol) and added to the organic solvent, thereby adjusting the viscosity to 160 Pa. s~180Pa. Paste in s (20 rpm, 25 ° C). The paste was prepared using a three roll mill. The formulation of the paste-like conductive composition thus obtained is as follows: silver powder: 77% by mass to 88% by mass; Ni powder: 0.01% by mass to 0.2% by mass; glass composition: 1% by mass to 10% by mass; organic medium Organic vehicle: 4% by mass to 14% by mass; organic solvent: 2% by mass to 8% by mass.
再者,作為所述玻璃組成物,以佔導電性組成物的碲量成為如下述表1的「Te添加量」所示的值的方式,將不含碲的基本玻璃介質與含有碲的含碲玻璃介質混合而使用。作為基本玻璃介質,使用平均粒徑為1.1μm,且具有下述組成A或組成B的玻璃。又,作為含碲玻璃介質,使用具有下述組成的玻璃。 In addition, as the glass composition, the amount of the conductive composition is such that the amount of the conductive composition is a value shown by the "Te addition amount" in Table 1 below, and the basic glass medium containing no antimony and the antimony containing The glass medium is mixed and used. As the basic glass medium, a glass having an average particle diameter of 1.1 μm and having the following composition A or composition B was used. Further, as the cerium-containing glass medium, glass having the following composition was used.
Bi2O3:20mol%,B2O3:29mol%,SiO2:4mol%,ZnO:30 mol%,Li2O:17mol% Bi 2 O 3 : 20 mol%, B 2 O 3 : 29 mol%, SiO 2 : 4 mol%, ZnO: 30 mol%, Li 2 O: 17 mol%
PbO:29mol%,B2O3:12mol%,SiO2:47mol%,Li2O:12mol% PbO: 29 mol%, B 2 O 3 : 12 mol%, SiO 2 : 47 mol%, Li 2 O: 12 mol%
Te2O:30mol%,PbO:29mol%,B2O3:5mol%,SiO2:36mol% Te 2 O: 30 mol%, PbO: 29 mol%, B 2 O 3 : 5 mol%, SiO 2 : 36 mol%
將所述所獲得的膏狀導電性組成物1~導電性組成物10用作受光面電極形成用膏,按以下的順序製作評價用太陽電池單元。 The paste-like conductive composition 1 to the conductive composition 10 obtained above were used as a paste for forming a light-receiving surface electrode, and solar cells for evaluation were produced in the following order.
即,首先,準備市售的156mm見方大小的太陽電池用p型單晶矽基板(板厚180μm),使用將氫氟酸與硝酸混合而成的混酸對其表面進行酸蝕刻處理。繼而,於藉由所述蝕刻處理而形成有微細的凹凸結構的矽基板的受光面塗佈含磷溶液,並進行熱處理,藉此於該矽基板的受光面形成厚度約為0.5μm的n-Si層(n+層)(參照圖1)。藉由電漿CVD(電漿輔助化學氣相沈積(Plasma-Enhanced Chemical Vapor Deposition,PECVD))法於該n-Si層上形成厚度為80nm程度的抗反射膜(氮化矽膜)。 Specifically, first, a commercially available 156 mm square solar cell p-type single crystal germanium substrate (plate thickness: 180 μm) was prepared, and the surface thereof was subjected to an acid etching treatment using a mixed acid obtained by mixing hydrofluoric acid and nitric acid. Then, a phosphorus-containing solution is applied to the light-receiving surface of the ruthenium substrate having the fine uneven structure formed by the etching treatment, and heat treatment is performed to form n-thickness having a thickness of about 0.5 μm on the light-receiving surface of the ruthenium substrate. Si layer (n + layer) (refer to Fig. 1). An antireflection film (tantalum nitride film) having a thickness of about 80 nm was formed on the n-Si layer by a plasma CVD (Plasma-Enhanced Chemical Vapor Deposition (PECVD)) method.
其後,使用所準備的導電性組成物,藉由網版印刷法於抗反射膜上形成成為受光面電極(Ag電極)的塗膜(厚度為10μm以上且30μm以下)。又,以同樣的方式,以圖案狀形成成為背面電極(Ag電極)的塗膜。於85℃下將該些塗膜乾燥而供於下一步驟。 Then, using the prepared conductive composition, a coating film (having a thickness of 10 μm or more and 30 μm or less) which is a light-receiving surface electrode (Ag electrode) is formed on the anti-reflection film by a screen printing method. Further, in the same manner, a coating film to be a back surface electrode (Ag electrode) was formed in a pattern. The coating films were dried at 85 ° C for the next step.
繼而,藉由網版印刷(SUS製網眼,#325,線徑23μm, 乳劑厚20μm,以下相同),以重疊於矽基板的背面側的Ag電極圖案的一部分的方式印刷(塗佈)特定的背面電極用鋁膏。印刷條件是以柵線的煅燒寬度成為100μm的方式進行設定。繼而,使用近紅外線高速煅燒爐,在大氣環境中,於大致700℃以上且800℃以下的溫度下對該矽基板進行煅燒。藉此,獲得具備Ag電極(受光面電極)的評價用太陽電池單元。以下將使用導電性組成物1~導電性組成物10所製作的太陽電池分別對應稱為樣品1~樣品10。 Then, by screen printing (SUS mesh, #325, wire diameter 23μm, The emulsion is 20 μm thick, and the same applies hereinafter, and a specific aluminum paste for a back surface electrode is printed (coated) so as to overlap a part of the Ag electrode pattern on the back side of the ruthenium substrate. The printing conditions were set so that the baking width of the gate line became 100 μm. Then, the tantalum substrate is fired in a near-infrared high-speed calciner at a temperature of approximately 700 ° C or more and 800 ° C or less in an atmospheric environment. Thereby, an evaluation solar cell including an Ag electrode (light-receiving surface electrode) was obtained. Hereinafter, the solar cells produced using the conductive composition 1 to the conductive composition 10 are referred to as samples 1 to 10, respectively.
使用太陽模擬器(伯格(Beger)公司製造,PSS10),對樣品1~樣品10的太陽電池的I-V特性進行測定,根據所獲得的I-V曲線,求出開路電壓(Voc)、填充因子(fill factor,FF)及發電效率(η)。Voc、FF及發電效率是基於JIS C-8913所規定的「結晶系太陽電池單元輸出功率測定方法」而算出,將其結果示於表1。再者,該算出值是藉由太陽模擬器所獲得的100個資料的平均值。 The solar characteristics of the solar cells of samples 1 to 10 were measured using a solar simulator (manufactured by Berger Co., Ltd., PSS10), and the open circuit voltage (Voc) and the filling factor (fill) were determined based on the obtained IV curve. Factor, FF) and power generation efficiency (η). The Voc, FF, and power generation efficiency were calculated based on the "method of measuring the output power of the crystalline solar cell unit" defined in JIS C-8913, and the results are shown in Table 1. Furthermore, the calculated value is the average of 100 data obtained by the solar simulator.
對於測定I-V特性後的樣品1~樣品10的太陽電池,將矽基板的表面的電極剝離,對露出的電極與基板的界面(基板表面)進行XAFS分析,研究該界面中的碲的價數。分析條件如以下所述。 For the solar cells of Samples 1 to 10 after the I-V characteristics were measured, the electrodes on the surface of the ruthenium substrate were peeled off, and the interface between the exposed electrodes and the substrate (the surface of the substrate) was subjected to XAFS analysis, and the valence of ruthenium in the interface was examined. The analysis conditions are as follows.
分析裝置:SPring-8的產業利用II,BL14B2 Analytical device: SPRING-8 industrial utilization II, BL14B2
單色器:SPring-8標準二結晶分光器 Monochromator: SPring-8 standard two crystal splitter
分光晶體:Si(111) Spectroscopic crystal: Si(111)
測定能量區域:4320eV~4400eV Measuring energy area: 4320eV~4400eV
測定法:透過法 Determination method: transmission method
於XANES光譜中,碲的原子價數越大,吸收端越向高能量側移位。於碲的價數的解析中,分別以TeO2及TeO3作為4價及6價的碲的標準試樣,根據該標準試樣的XANES光譜中4350eV附近的吸收能的位移量計算出測定樣品所含的碲的平均價數。將碲的平均價數的測定結果示於表1。 In the XANES spectrum, the larger the valence of ruthenium, the more the absorption end shifts toward the high energy side. In the analysis of the valence of yttrium, TeO 2 and TeO 3 were used as standard samples of tetravalent and hexavalent ruthenium, respectively, and the measurement sample was calculated based on the displacement amount of the absorption energy around 4350 eV in the XANES spectrum of the standard sample. The average price of the cesium contained. The measurement results of the average valence of hydrazine are shown in Table 1.
將樣品1~樣品10的導電性組成物煅燒所獲得的電極-基板界面中的碲的價數大部分與根據經驗所預想的值大致一致。如表1所示,導電性組成物所含的碲的比例與煅燒後的電極-基板界面中 的碲的價數之間大致可觀察到若Te添加量增加則碲的價數降低的傾向。然而,根據樣品1、樣品2及樣品5等可知,此種關係未必一定成立,根據玻璃組成物的配方、或碲價數調整材料的配方等,碲的價數會有所變化。 The valence of ruthenium in the electrode-substrate interface obtained by calcining the conductive composition of Samples 1 to 10 largely coincides with the value expected from experience. As shown in Table 1, the ratio of ruthenium contained in the conductive composition to the electrode-substrate interface after calcination It is observed that the valence of ruthenium tends to decrease as the amount of addition of Te increases. However, according to Sample 1, Sample 2, and Sample 5, such a relationship is not necessarily established, and the valence of hydrazine may vary depending on the formulation of the glass composition or the formulation of the valence number.
此外,於碲的價數為4.3以上且5.1以下的情形時,顯示Voc、FF及發電效率均取得良好平衡且顯示良好的值。填充因子(FF)基本上是成為太陽電池品質的基準的指標,代表性的FF值處於0.7以上且0.8以下的範圍。於該FF值高於0.7的後半區域,藉由FF值即便增大0.01%,亦可大幅提高作為太陽電池的性能。根據表1的結果可確認,根據導電性組成物中的碲的價數,所獲得的FF值具有較大差別。即,於碲的價數為4.3以上且5.1以下的情形時,FF值均高於0.78,可獲得與其他情形相比極高的值。 In addition, when the valence of 碲 is 4.3 or more and 5.1 or less, it is shown that Voc, FF, and power generation efficiency are all in good balance, and it shows the favorable value. The fill factor (FF) is basically an index that serves as a benchmark for solar cell quality, and a representative FF value is in a range of 0.7 or more and 0.8 or less. In the latter half of the FF value higher than 0.7, even if the FF value is increased by 0.01%, the performance as a solar cell can be greatly improved. From the results of Table 1, it was confirmed that the obtained FF value has a large difference depending on the valence of ruthenium in the conductive composition. In other words, when the valence of 碲 is 4.3 or more and 5.1 or less, the FF value is higher than 0.78, and an extremely high value can be obtained as compared with other cases.
又,Voc及發電效率亦可見同樣的傾向,於碲的價數為4.3以上且5.1以下的情形時,可認為特性均取得良好平衡,並且顯著提高。 Further, the same tendency tends to be observed for Voc and power generation efficiency. When the valence of ruthenium is 4.3 or more and 5.1 or less, it is considered that the characteristics are well balanced and remarkably improved.
以上已對本發明的具體例進行詳細說明,但該些僅為例示,並不對申請專利範圍進行限定。申請專利範圍所記載的技術中包括將以上所例示的具體例進行各種變形、變更而成者。 The specific examples of the present invention have been described in detail above, but these are merely illustrative and are not intended to limit the scope of the application. The technology described in the patent application scope includes various modifications and changes to the specific examples described above.
10‧‧‧太陽電池 10‧‧‧Solar battery
11‧‧‧基板 11‧‧‧Substrate
12‧‧‧受光面電極(Ag電極) 12‧‧‧Photometric surface electrode (Ag electrode)
14‧‧‧抗反射膜 14‧‧‧Anti-reflective film
16‧‧‧n-Si層(n+層) 16‧‧‧n-Si layer (n + layer)
20‧‧‧背面電極(鋁電極) 20‧‧‧Back electrode (aluminum electrode)
22‧‧‧背面側外部連接用電極 22‧‧‧Electrode for external connection on the back side
24‧‧‧p+層(BSF層) 24‧‧‧p + layer (BSF layer)
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US10923608B2 (en) | 2017-04-28 | 2021-02-16 | Giga Solar Materials Corp. | Conductive paste for solar cell, solar cell and manufacturing method thereof, and solar cell module |
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