TW201524607A - Process of manufacturing powder with arc process - Google Patents

Abstract

The present invention discloses a process of manufacturing powder with an arc process, which mainly utilizes an arc electrical shock insulated substrate. The surface of the insulated substrate comprises a plurality of geometric bumps. The thin film layers of the plurality of geometric bumps are fractured and the thin film layers are dissociated to become byssoid, schistose spherical powder by electrical shock.

Description

Process for manufacturing powder by arc method

The present invention relates to a process for producing a powder, and more particularly to a process for producing a powder by an arc method.

At present, the related processes for preparing powders are mostly introduced into the plasma by metal or metal alloy, gasified, and then oxidized with oxygen gas. After the formation of the nano-sized oxide particles, they are cooled to control them. Produced by the growth rate. However, such a process requires a lot of time, so how to obtain a powder system by arc more quickly is the object that the inventor intends to achieve.

In view of the problems of the prior art, the present inventors have proposed a process for manufacturing a powder by an arc method based on years of research and development and many practical experiences, as an implementation method and basis for improving the above disadvantages.

In view of the above, an object of the present invention is to provide a process for producing a powder by an arc method to improve the convenience of producing a powder.

According to the object of the present invention, a process for manufacturing a powder by an arc method is proposed, which mainly uses an electric arc to strike an insulating substrate, and a plurality of geometric bumps on the surface of the insulating substrate rupture the film layer on the surface of the plurality of geometric bumps, and The film layer material is subjected to an electric shock and is thermally dissociated into a filamentous powder, a flake powder, and a spherical powder.

Preferably, the material of the insulating substrate is, for example, a high molecular polymer, aluminum oxide or zirconium oxide.

Preferably, the arc is produced by 5,000 to 120,000 volts (V) of high voltage.

Preferably, the material of the film layer can be, for example, metal, ceramic or a combination thereof.

Preferably, the film layer is subjected to electric shock and dissociated into a filamentous powder, a flake powder, a spherical powder or a combination thereof.

Preferably, the plurality of geometric bumps have a size of 0.4 to 100 microns.

Preferably, the plurality of geometric bumps are spaced apart by a distance of 1 to 200 microns.

Preferably, the appearance shape of the plurality of geometric bumps may be, for example, a rectangular body, a strip shape or an angular body.

As described above, the process for manufacturing a powder by the arc method according to the present invention has the following advantages:

(1) This process can be electrically shocked by an electric arc, thereby improving the convenience of making powder.

(2) This process can be controlled by arc parameters to obtain powders of various shapes, such as filaments, flakes, and spherical powders.

(3) This process uses an insulating substrate to reduce the risk of electric shock leakage.

(4) The process design geometric bump is on the surface of the insulating substrate, so that the arc advances along the position of the bump, and the arc is guided to quickly cut the film layer. In theory, the speed is close to the speed of light, causing the destruction effect along the plane of the insulating substrate, forming the required Powder, the distribution of the control geometric bumps is the preset arc advancement route, which indirectly controls the size of the powder, rather than simply clicking through the film layer.

(5) The film layer may have a multilayer structure such that the obtained powder is a layered composite.

For a better understanding and understanding of the technical features and the efficacies of the present invention, the preferred embodiments and the detailed description are as follows.

S11～S13‧‧‧Step procedure

Fig. 1 is a schematic view showing the process of manufacturing a powder by an arc method of the present invention.

Figure 2 is a schematic diagram of an arc single click through film layer.

Fig. 3 is a schematic view of an electron microscope in which the film layer of the present invention is subjected to electric shock and dissociated into a spherical ceramic powder.

Fig. 4 is a schematic view showing an electron microscope in which the film layer of the present invention is subjected to electric shock and dissociated into a spherical spherical metal powder.

Fig. 5 is a schematic view showing an electron microscope in which the film layer of the present invention is subjected to electric shock and dissociated into a filament-like powder, a sheet-like powder, and a spherical powder.

Figure 6 is an electron micrograph showing the geometrical bumps of the rectangular body of the present invention.

Figure 7 is a schematic view of an electron microscope of a microscopic image of a long strip of geometric bumps of the present invention.

Figure 8 is a schematic view of an electron microscope of the sheet-like powder of the present invention, having a size of about 40 μm.

Fig. 9 is a schematic view of an electron microscope having a multilayer structure of the film layer of the present invention.

Hereinafter, the process of manufacturing the powder by the arc method according to the preferred embodiment of the present invention will be described with reference to the accompanying drawings. For the sake of understanding, the same elements in the following embodiments are denoted by the same reference numerals.

Please refer to FIG. 1 , which is a schematic diagram of a process for manufacturing a powder by an arc method according to the present invention. In the figure, the steps of the process of manufacturing the powder by the arc method are as follows:

S11: providing an insulating substrate and a film layer. The insulating substrate comprises at least an insulating substrate body and a plurality of geometric bumps on the surface of the substrate body, and the film layer is located on a surface of the geometric bump of the insulating substrate. The thickness of the insulating substrate is about 10 mm. The geometric bumps have a size of about 0.4 to 100 micrometers, and a preferred spacing distribution distance of about 1 to 200 micrometers, and the appearance shape thereof may be, for example, a rectangular body, a strip shape, or an angular body. For example, the surface of the substrate body is, for example, arranged with a plurality of geometric bumps (as shown in FIG. 6) of an approximate matrix and about 1 micrometer wide and about 2-15 micrometers long. The material of the insulating body can be, for example, In the case of a high molecular polymer, alumina or zirconia, the shape of the geometric bump is, for example, elongated (as shown in Fig. 7). In addition, the film layer is located on the surface of the geometric bump, and the film layer may have a multi-layer structure (as shown in FIG. 9), and the material thereof may be, for example, a metal, a ceramic or a combination thereof, wherein the metal may be, for example, silver. ;

S12: using an HV of 5,000 to 120,000 volts (V) to electrically strike an insulating substrate placed at an anode position to rupture a film layer on a surface of the plurality of geometric bumps;

S13: using the high-voltage arc to dissociate the film layer into a powder, for example, a filament-like powder, a sheet-like powder (as shown in FIG. 8), a spherical powder (such as FIG. 3 and Figure 4) or a combination thereof (as shown in Figure 5), the number of which is the largest in sheet form, accounting for more than 60%, and the spherical powder is second, accounting for about 20%. Among them, the aforementioned powder may be, for example, a layered composite.

As described above, the process design of the present invention advances the arc along the surface of the bump by geometric bumps on the surface of the insulating substrate, and guides the arc to rapidly cut the film layer. Theoretically, the speed is close to the speed of light, resulting in a plane along the insulating substrate. Destruction effect, forming the desired powder, rather than simply clicking through the film layer (as shown in Figure 2). Moreover, the process uses an insulating substrate to reduce the risk of electric shock leakage, and can obtain various shapes of powders, such as filaments, flakes, and spherical powders, by arc parameter control. Further, the film layer may have a multilayer structure such that the obtained powder is a layered composite.

The above is intended to be illustrative only and not limiting. Any equivalent modifications or alterations to the spirit and scope of the invention are intended to be included in the scope of the appended claims.

no

S11~S13‧‧‧Step process

Claims (10)

[Item 1] A process for manufacturing a powder by an arc method, the main steps of which are as follows:
Providing an insulating substrate and a film layer, the surface of the insulating substrate has a plurality of geometric bumps, and the film layer is located on the surface of the geometric bumps of the insulating substrate;
Breaking the film layer on the surface of the plurality of geometric bumps with an arc shock; [Item 2] The process for producing a powder by an arc method as described in claim 1, wherein the insulating substrate is made of a polymer, alumina or zirconia. [Item 3] The process for producing a powder by an arc method as described in claim 1, wherein the arc is produced by a high voltage of 5,000 to 120,000 volts (V). [Item 4] The process for producing a powder by an arc method as described in claim 1, wherein the material of the film layer is metal, ceramic or a combination thereof. [Item 5] The process for producing a powder by an arc method as described in claim 1, wherein the film layer is subjected to electric shock and dissociated into a filamentous powder, a flake powder, a spherical powder or a combination thereof. [Item 6] The process for manufacturing a powder by an arc method as described in claim 1, wherein the geometric bumps have a size of 0.4 to 100 μm. [Item 7] The process for manufacturing a powder by an arc method as described in claim 1, wherein the geometric bumps are spaced apart by a distance of 1 to 200 μm. [Item 8] The process for manufacturing a powder by an arc method as described in claim 1, wherein the geometric bumps have a rectangular shape, a strip shape or an angular body. [Item 9] The process for producing a powder by an arc method as described in claim 1, wherein the film layer has a multi-layer structure, and the material of each of the multi-layer structures is metal, ceramic or a combination thereof. [Item 10] The process for producing a powder by an arc method as described in claim 1, wherein the powder is a layered composite.