TW201523817A - Heat sink, power module and manufacturing method for heat sink - Google Patents

Abstract

This invention provides a heat sink, a power module, and a manufacturing method for heat sink which can suppress an amount of warping under heat cycle. A heat sink (10) in this invention includes: a first member (1), which is plane-shaped and formed of metal or alloy, with a groove (3) formed in the central part of principle surface, the side surfaces of the groove (3) have an angle of inclination from 10 DEG to 45 DEG with respect to the principle surface; and a second member (2), which is such laminated that a metal or alloy having thermal conductivity larger than the material forming the first member (1) is laminated inside the groove (3), or laminated from the inside of the groove (3) toward the thickness direction of the first member (1); wherein, the second member (2) is laminated in such a manner that a powder material of the metal or alloy forming the second member (2) is accelerated together with a gas heated to a temperature lower than the melting point of the powder material, and is sprayed and stacked inside the groove (3) of the first member (1), or sprayed to stack from the inside of the groove (3) toward the thickness direction of the second member (2), in solid-phase state.

Description

Heat sink, power module and heat sink manufacturing method

The invention relates to a method for manufacturing a heat sink, a power module and a heat sink.

Power modules are known in the prior art for energy-saving key components used in various fields such as power control for industrial use and automobiles, and motor control. Power module is a device in which a semiconductor wafer (transistor) is mounted on a circuit pattern formed by a brazed metal plate on one side of an insulating substrate (for example, a ceramic substrate) as a substrate, and is separated on the other side. A heat-dissipating plate is provided for the brazed metal plate. In such a power module, the semiconductor wafer is bonded to the circuit pattern by soldering, and the heat dissipation plate is bonded to the metal plate by soldering or brazing (see, for example, Patent Document 1 below). .

In the power module of Patent Document 1, etc., in order to efficiently diffuse heat from the power module, the material of the heat sink is made of copper having excellent thermal conductivity, and the heat sink is attached to the insulating substrate. The opposite side of the surface is locked with a cooler made of an aluminum alloy by a fixing screw, or joined by soldering or brazing.

(previous technical literature) (Patent Literature)

Patent Document 1: Japanese Patent Laid-Open Publication No. 2013-58535

The power module is subjected to thermal cycling during use. Therefore, as shown in Patent Document 1, if a different material is used on the material of the heat sink (copper) and the cooler (aluminum alloy), the coefficient of thermal expansion is The thermal stress is inferior, and the heat dissipation efficiency is lowered by the gap generated between the heat sink and the cooler, and the joint portion is peeled off due to thermal stress.

The present invention has been made in view of the above circumstances, and an object of the invention is to provide a heat dissipation plate, a power module, and a heat dissipation plate manufacturing method which are capable of suppressing the amount of warpage under thermal cycling and having excellent adhesion to other members.

In order to achieve the above object, the heat dissipation plate of the present invention includes a first member formed of a metal or an alloy and formed into a plate shape, and having a groove portion at a central portion of the main surface, the side surface of the groove portion being opposite to the main surface The second member is formed by laminating a metal or an alloy having a thermal conductivity higher than a material constituting the first member in the groove portion, or from the inside of the groove portion to the first portion a layer in which a thickness direction of the member is laminated; wherein a powder material of a metal or an alloy constituting the second member is accelerated together with a gas heated to a temperature lower than a melting point of the powder material, and in a solid phase state Next, spray it to the foregoing The first member is deposited in the groove portion of the first member, or is sprayed so as to extend from the inside of the groove portion in the thickness direction of the second member, so that the second member is laminated.

Further, the heat dissipation plate of the present invention includes: a second member made of a metal or an alloy and formed into a plate-like body whose side surface is inclined at an angle of 10 to 45 with respect to the main surface; and the first member is composed of A metal or an alloy having a thermal conductivity lower than that of the material constituting the second member is laminated on the outer peripheral portion of the side surface of the second member; wherein the powder material of the metal or alloy constituting the first member is heated to The gas having a temperature lower than the melting point of the powder material is accelerated together, and in a solid phase state, it is sprayed onto the outer peripheral portion of the side surface of the second member to be deposited, so that the first member is laminated.

Further, in the heat dissipation plate according to the invention described above, the metal or alloy constituting the second member has a thermal expansion coefficient smaller than that of the metal or alloy constituting the first member.

Further, in the heat dissipation plate according to the invention described above, the first member is aluminum or an aluminum alloy, and the second member is copper or a copper alloy.

Further, in the heat dissipation plate according to the invention described above, the groove portion is formed to traverse from one end portion of the first member main surface to the other end portion.

Further, in the heat dissipation plate according to the invention described above, the groove portion is formed to penetrate the first member.

Further, in the heat dissipation plate according to the invention, the second member is formed in the groove portion, and a top surface of the first member is The top surface of the second member is formed into a flat surface.

Further, in the heat dissipation plate according to the invention, the top surface of the second member is formed to protrude from a top surface of the first member, and a portion of the first member that is in contact with the second member is the largest. The ratio of the thickness to the maximum thickness of the portion of the second member that is in contact with the first member is in the range of 1:1 to 1:3.

Further, in the heat dissipation plate according to the invention, the maximum thickness of the portion of the first member that is in contact with the second member and the maximum thickness of the portion of the second member that is in contact with the first member are In the range of 1:1 to 20:1.

Further, in the heat dissipation plate according to the invention described above, the first member is formed with a flow path through which a cooling medium flows, on a surface opposite to a surface on which the groove portion is formed.

Further, the power module of the present invention includes: the heat dissipation plate described in any one of the above; the ceramic substrate is connected to the second member of the heat dissipation plate; and the heat dissipation member is made of aluminum or aluminum alloy and is connected to The surface of the heat sink opposite to the surface in contact with the first ceramic substrate.

Further, the power module of the present invention includes the heat dissipation plate described in the above aspect of the invention, and the ceramic substrate is connected to the second member side of the heat dissipation plate.

Further, the method for manufacturing a heat dissipation plate according to the present invention includes the step of forming a second member formed by a groove formed in a central portion of a main surface of the first member, wherein the first member is made of a metal or an alloy, and is formed. In the shape of a plate, the side of the groove has a range of 10° to 45° with respect to the main surface a tilting angle, and a powder material having a thermal conductivity higher than a material constituting the material of the first member, together with a gas heated to a temperature lower than a melting point of the powder material, to be accelerated in the groove portion Embedding and depositing in a solid phase state to form the second member, or a cutting step, at least for the step of laminating by means of the laminating step, or extending from the inside of the groove portion toward the thickness direction of the second member The formed second member is subjected to cutting.

Further, the method for producing a heat dissipation plate according to the present invention includes the step of laminating a powder of a metal or an alloy having a thermal conductivity lower than a material constituting the second member from a side surface of the second member and an outer peripheral portion of the side surface. The material is accelerated together with a gas heated to a temperature lower than a melting point of the powder material, and in a solid phase state, sprayed and deposited to form a first member, wherein the second member is A metal or an alloy is formed in a plate shape in which a side surface is inclined at an angle of 10 to 45 with respect to the main surface; and a cutting step is performed by cutting at least the first member formed by the laminating step.

Further, in the method of manufacturing a heat dissipation plate according to the invention described above, the metal or alloy constituting the second member has a thermal expansion coefficient smaller than that of the metal or alloy constituting the first member.

The heat dissipating plate of the present invention can achieve the effect of reducing the amount of warpage even when subjected to thermal cycling even when two kinds of metals or alloys are used, and also suppressing the use in combination with a ceramic substrate, a cooler, or the like. Peeling of the joint portion, and the like.

1‧‧‧1st component

1A‧‧‧1st component

1B‧‧‧1st component

1D‧‧‧1st component

1E‧‧‧1st component

1F‧‧‧1st component

1G‧‧‧1st component

1H‧‧‧1st component

1J‧‧‧1st building block

1K‧‧‧1st component

1M‧‧‧1st component

1a‧‧‧1st base material part (1st member)

1b‧‧‧1st component

1c‧‧‧1st film

2‧‧‧2nd member

2A‧‧‧2nd member

2B‧‧‧2nd component

2D‧‧‧2nd component

2E‧‧‧2nd component

2F‧‧‧2nd component

2G‧‧‧2nd component

2H‧‧‧2nd member

2J‧‧‧2nd member

2K‧‧‧2nd component

2M‧‧‧ second component

2a‧‧‧2nd membrane department

2c‧‧‧2nd base material

2e‧‧‧2nd membrane department

3‧‧‧Ditch

3A‧‧‧Ditch Department

3B‧‧‧Ditch Department

3D‧‧‧Ditch Department

3E‧‧‧Ditch Department

3F‧‧‧Ditch Department

3G‧‧‧Ditch Department

3H‧‧‧Ditch Department

3J‧‧‧Ditch Department

3K‧‧‧Ditch Department

3M‧‧‧Ditch Department

4‧‧‧hard solder

5‧‧‧hard solder

10‧‧‧heating plate

10A‧‧‧heat plate

10B‧‧‧heat plate

10D‧‧‧heat plate

10E‧‧‧heat plate

10F‧‧‧heat plate

10G‧‧‧heat plate

10H‧‧‧heat plate

10J‧‧‧heat plate

10K‧‧‧heat plate

10M‧‧‧heat plate

20‧‧‧cooler

21‧‧‧Flow

30‧‧‧Power Module Substrate

31‧‧‧Semiconductor components

32‧‧‧ circuit layer

33‧‧‧Ceramic substrate

34‧‧‧metal layer

35‧‧‧Soft solder

50‧‧‧cold spray device

51‧‧‧ gas heater

52‧‧‧ spray gun

53‧‧‧Powder supply device

54‧‧‧ gas nozzle

55‧‧‧Valves

56‧‧‧ valve

100‧‧‧Power Module

H1‧‧‧ thickness

H2‧‧‧ thickness

H3‧‧‧ thickness

r ₁ to r ₆ ‧‧‧ distance

θ‧‧‧Tilt angle

Fig. 1 (a) and (b) are schematic views showing the configuration of a heat dissipation plate according to Embodiment 1 of the present invention.

Fig. 2 is a schematic view showing an outline of a cold spray apparatus used for manufacturing a heat dissipation plate according to Embodiment 1 of the present invention.

Fig. 3 (a) to (c) are schematic views showing the steps of manufacturing the heat dissipation plate according to the first embodiment of the present invention.

Fig. 4 (a) to (c) are schematic views for explaining another manufacturing procedure of the heat dissipation plate according to the first embodiment of the present invention.

Fig. 5 is a schematic view showing the configuration of a power module according to the first embodiment of the present invention.

Fig. 6 is a schematic view showing the configuration of a heat dissipation plate according to a first modification of the first embodiment of the present invention.

Fig. 7 is a schematic view showing the configuration of a heat dissipation plate according to a second modification of the first embodiment of the present invention.

(a) to (c) are schematic views for explaining a manufacturing procedure of a heat dissipation plate according to a second modification of the first embodiment of the present invention.

Fig. 9 is a schematic view showing the configuration of a heat dissipation plate according to a third modification of the first embodiment of the present invention.

Fig. 10 (a) and (b) are schematic views showing the configuration of a heat dissipation plate according to a fourth modification of the first embodiment of the present invention.

Fig. 11 (a) and (b) are schematic views showing the configuration of a heat dissipation plate according to a second embodiment of the present invention.

Fig. 12 (a) to (c) are flowcharts showing the steps of manufacturing the heat dissipation plate according to the second embodiment of the present invention.

Fig. 13 (a) and (b) are schematic views showing the configuration of a heat dissipation plate according to a first modification of the second embodiment of the present invention.

Fig. 14 is a schematic view showing the configuration of a heat dissipation plate according to a second modification of the second embodiment of the present invention.

Fig. 15 is a flow chart showing the steps of manufacturing the heat dissipation plate according to the second modification of the second embodiment of the present invention.

Fig. 16 (a) and (b) are schematic views showing the configuration of a heat dissipation plate according to a third modification of the second embodiment of the present invention.

(a) and (b) are schematic views showing a configuration of a heat dissipation plate according to a fourth modification of the second embodiment of the present invention.

(a) and (b) are schematic views showing the configuration of a heat dissipation plate according to a fifth modification of the second embodiment of the present invention.

Hereinafter, embodiments of the present invention will be described in detail with reference to the drawings. Further, the present invention is not limited to the following embodiments. Further, in each of the drawings referred to in the following description, the shapes, sizes, and positional relationships are simply expressed in such a manner that the contents of the present invention can be understood. That is, the present invention is not limited by the shape, size, and positional relationship illustrated in the drawings.

(Embodiment 1)

First, the heat dissipation plate according to the first embodiment of the present invention will be described in detail with reference to the drawings. Fig. 1 is a schematic view showing the configuration of a heat dissipation plate according to Embodiment 1 of the present invention. Figure 1 (a) shows a top view of the heat sink, Figure 1 (b) A cross-sectional view taken along line AA of Fig. 1(a) is shown.

The heat radiating plate 10 is composed of a first member 1 made of a metal or an alloy, and a second member 2 made of a metal or alloy having a thermal conductivity higher than that of the first member 1. . A preferred combination of the first member 1 and the second member 2 can be exemplified by aluminum and copper, iron and aluminum, iron and copper.

The first member 1 has a groove portion 3 at a central portion of the main surface, wherein the side surface of the groove portion 3 has an inclination angle (θ) of 10° to 45° with respect to the main surface. In the first embodiment, the groove portion 3 is formed so as to traverse from one end portion of the main surface of the first member 1 to the other end portion, and is formed to penetrate from the top surface of the main surface of the first member 1 to the main surface. . In addition, in the present specification, the "side has an inclination angle (θ) of 10 to 45 with respect to the main surface", except that the single surface (or ridge line) forming the side surface has 10 to 45 degrees with respect to the main surface. In addition to the case of the inclination angle (θ), when the side surface contains the circular arc portion, among the tangent lines of the circular arc portion, the inclination angle (θ) of the wiring having the largest inclination angle with the main surface is 10° to 45° case.

The maximum thickness of the contact portion 2 of the first member and the second member 1 of h _1, and the second member and the scope of the ratio of the maximum thickness of the first portion of the contact member h _2, preferably 1: 1 to 1: 3. By forming in this range, it is possible to reduce the warpage of the heat dissipation plate under thermal cycling without increasing the thickness of the heat dissipation plate 10. The maximum thickness of the contact portion 2 of the first member and the second member 1 of h _1, and the second member and the scope of the ratio of the maximum thickness of the first portion of the contact member h _2, preferably 1: 1.5 to 1: 2.5.

The formation of the second member 2 is as follows: the second member will be constructed The powder material of 2 is accelerated together with a gas heated to a temperature lower than the melting point of the powder material, and is sprayed in a solid phase state so as to extend from the inside of the groove portion 3 in the thickness direction of the first member 1. It piles up.

Next, a method of manufacturing the heat dissipation plate 10 of the first embodiment will be described. Fig. 2 is a schematic view showing an outline of a cold spray apparatus used for manufacturing a heat dissipation plate according to Embodiment 1 of the present invention. Fig. 3 is a schematic view showing a manufacturing procedure of a heat dissipation plate according to Embodiment 1 of the present invention. Fig. 4 is a schematic view showing another manufacturing procedure of the heat dissipation plate according to the first embodiment of the present invention.

The cold spray device 50 includes a gas heater 51 that heats the compressed gas, and a powder supply device 52 that stores the powder material to be sprayed onto the substrate and supplies it to the spray gun 54; and the gas nozzle 53 is to be The heated compressed gas and the material powder mixed by the spray gun 54 are sprayed to the first base material portion 1a of the first member 1 after the cutting process.

As the compressed gas, helium gas, nitrogen gas, air or the like can be used. The supplied compressed gas system is supplied to the gas heater 51 and the powder supply device 52 by the valves 55 and 56, respectively. The compressed gas system supplied to the gas heater 51 is heated to, for example, 50 ° C or higher and a temperature equal to or lower than the melting point of the material powder of the second member 2, and then supplied to the spray gun 54. The heating temperature of the compressed gas is preferably from 300 ° C to 900 ° C.

The compressed gas system supplied to the powder supply device 52 supplies the material powder having a particle diameter of, for example, 10 μm to 100 μm in the powder supply device 52 to the spray gun 54 so as to be a predetermined discharge amount. The heated compressed gas system is formed by a gas nozzle formed into a shape of a front fine 53 forms a supersonic flow (about 340 m/s or more). Further, the gas pressure of the compressed gas is preferably from about 1 MPa to about 5 MPa. By setting the pressure of the compressed gas to about 1 MPa to 5 MPa, the adhesion strength between the first member 1 and the second member 2 can be improved. It is preferred to carry out the treatment at a pressure of about 2 MPa to 4 MPa. The powder material supplied to the spray gun 54 is accelerated by being supplied to the supersonic flow of the compressed gas, and the substrate is formed at a high speed in a solid phase state to form a film. In addition, the apparatus for forming the second coating unit 2a by causing the material powder to collide with the groove portion 3 formed in the first base portion 1a in a solid phase state is not limited to the cold spraying device 50 of Fig. 2 .

The heat dissipation plate 10 of the first embodiment can be manufactured by the following steps: First, as shown in Fig. 3(a), a first substrate having a groove portion 3 having a side surface having an inclination angle of 10 to 45 with respect to the main surface is prepared. In the portion 1a, the powder material constituting the second member 2 is sprayed in the groove portion 3 in a solid phase state to form a second film portion by the cold spray device 50 as shown in Fig. 3(b). 2a. After the second film portion 2a is laminated, as shown in FIG. 3(c), the top surface of the second film portion 2a and the surface of the first member 1a opposite to the surface on which the groove portion 3 is formed are formed as Cutting in a flat manner.

Alternatively, the heat dissipation plate 10 of the first embodiment can be manufactured by the procedure shown in Fig. 4 . In the method of Fig. 4, the first member 1b composed of two parts is aligned by a positioning member (not shown) so that the groove portion 3 is formed into a predetermined shape (refer to Fig. 4 (a). )). Then, as shown in Fig. 4(b), the powder material constituting the second member 2 is sprayed in a solid phase state by the cold spray device 50 to form a second film portion 2a, and as shown in Fig. 4 (c), for the top surface of the second membrane portion 2a, The cutting process is performed in a planar manner. In addition, the surface of the heat dissipation plate 10 on the side opposite to the side of the second film portion 2a (the first member 1b and the second film portion 2a) can be cut.

The material powder is accelerated together with the gas by the cold spray device 50, and is sprayed to the groove portion 3 having a side angle of 10 to 45 with respect to the main surface in a solid phase state to be deposited to form the second member 2a. Thereby, the adhesion strength between the first member 1 and the second member 2 can be improved. Further, the heat dissipation plate 10 of the first embodiment is not limited to being manufactured by a cold spray method, and can also be produced by using a coating material obtained by joining different metals and FSW (Friction Stir Welding).

Further, in the heat dissipation plate 10 of the first embodiment, since the groove portion 3 is formed so as to penetrate from the top surface of the main surface of the first member 1 to the main surface, the contact area between the first member 1 and the second member 2 is small, and the thickness can be greatly increased. Reduce the amount of warpage caused by the difference in thermal expansion.

The heat dissipation plate 10 of the first embodiment can be favorably used for the heat dissipation plate as the power module shown in Fig. 5. Fig. 5 is a schematic view showing the configuration of a power module according to the first embodiment of the present invention.

The power module 100 includes a power module substrate 30 on which a semiconductor element 31 is mounted, a heat dissipation plate 10 that conducts heat generated by the semiconductor element 31, and a cooler 20 that releases heat from the heat dissipation plate 10.

The power module substrate 30 has a ceramic substrate 33, and a circuit layer 32 is formed on one surface of the ceramic substrate 33, and a metal layer 34 is formed on the other surface.

The ceramic substrate 33 is a substantially plate made of an insulating material. Shaped component. As the material of the ceramic substrate 33, for example, a nitride-based ceramic such as aluminum nitride or tantalum nitride, or aluminum oxide, magnesium oxide, zirconium oxide, talc, magnesium silicate, mullite, titanium oxide, or the like is used. An oxide-based ceramic such as cerium oxide or lanthanum aluminum oxynitride.

The circuit layer 32 is made of, for example, a metal having good conductivity such as aluminum, copper, or silver, or an alloy containing the metal. A circuit pattern for transmitting an electrical signal to the semiconductor element 31 or the like is formed in the circuit layer 32.

The semiconductor element 31 is realized by a semiconductor element such as a diode, a transistor, or an IGBT (Insulated Gate Bipolar Transistor). The semiconductor element 31 is connected to the circuit layer 32 by a soft solder 35. Further, the semiconductor element 31 is preferably a power element that can be used at a high voltage, and particularly preferably a silicon carbide wafer excellent in heat resistance, and a plurality of ceramic substrates 33 may be provided for the purpose of use.

The metal layer 34 is formed of the same material as that of the circuit layer 32, and the circuit layer 32 and the metal layer 34 are bonded to the ceramic substrate 33 by hard solder.

Further, the power module 100 of the first embodiment may be a direct copper-clad substrate in which the circuit layer 32 and the metal layer 34 made of a copper plate are directly bonded to the ceramic substrate 33 ("Direct Bonded Copper substrate", hereinafter referred to as a DBC substrate). ).

The cooler 20 is formed of a metal or an alloy having good thermal conductivity, such as aluminum or an aluminum alloy. A flow path 21 through which a cooling medium such as air or water flows is formed on the surface opposite to the side of the cooler 20 that is in contact with the heat dissipation plate 10.

The heat sink 10 is attached to the metal layer 34 of the power module substrate 30 by the hard solder 5 on the protruding surface of the second member 2. Further, the heat dissipation plate 10 is placed on the opposite side of the surface in contact with the metal layer 34, and is joined to the cooler 20 by the hard solder 4.

In the power module 100 of the first embodiment, the coefficient of thermal expansion of the metal or alloy constituting the second member 2 of the heat dissipation plate 10 is preferably smaller than the coefficient of thermal expansion of the metal or alloy constituting the first member 1. The coefficient of thermal expansion of the metal or alloy constituting the second member 2 is smaller than the coefficient of thermal expansion of the metal or alloy constituting the first member 1, so that it can be buffered under thermal cycling, possibly between the ceramic substrate 33 and the cooler 20. Thermal stress.

When the heat sink 10 is used in the power module 100, the first member 1 is preferably formed of aluminum or an aluminum alloy, and the second member 2 is preferably formed of copper or a copper alloy. Aluminum or aluminum alloy is used as the first member 1 and copper or copper alloy is used as the second member 2, whereby not only the amount of warpage under thermal cycling can be reduced, but also thermal diffusibility is excellent, and the ceramic substrate 33 can be suppressed. The peeling of the joint portion when the cooler 20 or the like is joined.

Further, in the first modification of the heat dissipation plate 10 of the first embodiment, the heat dissipation plate shown in Fig. 6 can be exemplified. The difference between the heat radiating plate 10A of the first modification shown in FIG. 6 and the heat radiating plate 10 of the first embodiment is that the second member 2A is laminated only in the groove portion 3A of the first member 1A, and the second member 2A and the first member are The member 1A is formed in a plane.

The heat dissipation plate 10A of the first modification can be manufactured by the method of manufacturing the heat dissipation plate 10 of the first embodiment shown in FIG. 3 or FIG. For example, preparing the formation shown in Fig. 3(a) with the side opposite to the main mask The first base material portion 1a of the groove portion 3 having an inclination angle of 10° to 45° is formed by the cold spray device 50 as shown in Fig. 3(b), and the powder material constituting the second member 2 is solid phase. The state is sprayed into the groove portion 3 to be deposited to form the second film portion 2a, and the surface of the first member 1a opposite to the surface on which the groove portion 3 is formed is cut and the top surface of the second film portion 2a is cut. The top surface of the first member 1a may be cut so that the second member 2A and the first member 1A are formed into a flat surface. Alternatively, the first member 1b composed of two parts shown in Fig. 4(a) is prepared, and the powder material constituting the second member 2 is formed by the cold spray device 50 as shown in Fig. 4(b). The second film portion 2a is formed by being sprayed in the groove portion 3 in a solid phase state, and the top surface of the second film portion 2a and the top surface of the first member 1a are further provided so that the second member 2A and the first member are formed. It is sufficient that 1A is formed into a flat surface.

Further, the heat dissipation plate may have a shape as shown in Fig. 7. Fig. 7 is a schematic view showing the configuration of a heat dissipation plate according to a second modification of the first embodiment of the present invention. Fig. 8 is a schematic view showing a manufacturing procedure of a heat dissipation plate according to a second modification of the first embodiment of the present invention.

The heat radiating plate 10B of the second modification 2 of the first embodiment is similar to the heat radiating plate 10 of the first embodiment in that the second member 2B is formed to protrude from the first member 1B. However, the groove portion 3B is formed in a convex shape and the first embodiment The heat sink 10 is different. In the heat dissipation plate 10B of the second modification, the inclination angle (θ) of the side surface of the groove portion 3B on the side where the second member 2B protrudes is set to 10° to 45° with respect to the main surface. In the heat dissipation plate 10B of Modification 2, since the second member 2B is convex, heat diffusion is made easier.

In addition, the heat dissipation plate 10B of the second modification is shown in FIG. The steps shown can be made. First, as shown in Fig. 8(a), the second base material portion 2c having a side surface having an inclination angle of 10 to 45 with respect to the main surface is prepared by the cold spray device 50 as shown in Fig. 8(b). As shown in the figure, the powder material constituting the first member 1B is sprayed to the outer peripheral portion of the side surface of the second base material portion 2c in a solid phase state to be deposited, thereby forming the first film 1c. After the first layer 1c is laminated, as shown in FIG. 8(c), the top surface of the first film 1c is cut so as to form a flat surface, and the corner portion of the second base member 2c is cut. Processing, whereby the heat sink 10B can be manufactured.

Further, the heat dissipation plate may have a shape as shown in Fig. 9. Figure 9 is a cross-sectional view showing a heat dissipation plate according to a third modification of the first embodiment of the present invention. The heat dissipation plate 10K of the modification 3 is formed into a shape in which the heat dissipation plate 10A of the modification 1 is turned upside down. The heat sink 10K is formed such that the area of the bottom surface side of the cooler is larger than the area of the top surface side connected to the ceramic substrate, in which the second member 2K is exposed on the main surface. Therefore, the heat dissipation plate 10K of the modification 3 has excellent diffusibility for heat emitted from the semiconductor element on the ceramic substrate. The heat sink 10K of the third modification may be used by being turned over after the heat dissipation plate 10A of the first modification is manufactured.

Further, the heat dissipation plate may have a shape as shown in Fig. 10. Fig. 10(a) is a plan view of a heat dissipation plate according to a fourth modification of the first embodiment of the present invention, and Fig. 10(b) is a cross-sectional view taken along line BB of Fig. 10(a). The heat dissipation plate 10D of the fourth modification is formed such that the groove portion 3D penetrates the central portion of the main surface.

(Embodiment 2)

Difference between the heat sink 10E of the second embodiment and the first embodiment The groove portion 3E formed in the first member 1E is not a through hole. Hereinafter, the heat sink 10E of the second embodiment will be described with reference to the drawings.

Fig. 11(a) is a plan view of a heat dissipation plate 10E according to a second embodiment of the present invention, and Fig. 11(b) is a cross-sectional view taken along line CC of Fig. 11(a). The heat sink 10E differs from the heat sink 10 of the first embodiment in that the groove portion 3E does not penetrate the first member 1E.

The first member 1E has a groove portion 3E at a central portion of the main surface, and the side surface of the groove portion 3E has an inclination angle (θ) of 10° to 45° with respect to the main surface. The groove portion 3E is formed to traverse from one end portion of the main surface of the first member 1 to the other end portion.

The heat sink 10E of the second embodiment can be manufactured by the procedure shown in Fig. 12. First, as shown in Fig. 12(a), a first member 1E having a groove portion 3E having a side surface having an inclination angle of 10 to 45 with respect to the main surface is prepared, and the cold spray device 50 is as shown in Fig. 12 (b), the powder material constituting the second member 2E is sprayed into the groove portion 3E in a solid phase state to be deposited, and the second film portion 2e is formed. After the second film portion 2e is laminated, as shown in Fig. 12(c), the top surface of the second film portion 2e is cut into a flat surface, whereby the heat dissipation plate 10E can be manufactured.

Further, the heat dissipation plate may have a shape as shown in Fig. 13. Fig. 13(a) is a plan view of a heat dissipation plate according to a first modification of the second embodiment of the present invention, and Fig. 13(b) is a cross-sectional view taken along line DD of Fig. 13(a). In the heat dissipation plate 10F of the first modification of the second embodiment, the groove portion 3F is formed only at the central portion of the main surface.

Further, the heat dissipation plate 10E of the second embodiment can also be in the The 1 member 1E forms a flow path and has a cooling function. Fig. 14 is a schematic view showing the configuration of a heat dissipation plate according to a second modification of the second embodiment of the present invention.

In the heat dissipation plate 10G according to the second modification of the second embodiment, the first member 1G is provided, and the first member 1G is formed on the surface opposite to the surface on which the groove portion 3G is formed, and a flow path 21 through which the cooling medium flows is formed. The heat sink 10G can release heat conducted through the second member 2G via the flow path 21 of the first member 1G.

The heat dissipation plate 10G of the second modification of the second embodiment can be manufactured as shown in Fig. 15, and the flow path 21 and the groove portion 3G are formed in a bulk material of a metal or an alloy belonging to the material of the first member 1G. The first member 1G is produced (step S1), and the powder material constituting the second member 2 is sprayed into the groove portion 3G in a solid phase state by the cold spray device 50 to form a second film portion. S2). After the second coating layer is laminated, the cutting process of forming the top surface of the second coating portion into a flat surface is performed (step S3). Alternatively, only the groove portion 3G may be formed in the block of the metal or alloy belonging to the material of the first member 1G, and the second film portion is to be formed by the cold spray device 50, and the second member is formed by cutting, and then formed. Flow path 21.

Further, the heat dissipation plate may have a shape as shown in Fig. 16. Fig. 16(a) is a plan view of a heat dissipation plate according to a third modification of the second embodiment of the present invention, and Fig. 16(b) is a cross-sectional view taken along line EE of Fig. 16(a). In the heat dissipation plate 10M of the third modification of the second embodiment, the second member 2M is formed in the groove portion 3 of the first member 1M, and the top surface of the second member 2M and the top surface of the first member 1M are formed into a flat surface.

Further, the heat dissipation plate may have a shape as shown in Fig. 17. Fig. 17 (a) is a plan view of a heat dissipation plate according to a fourth modification of the second embodiment of the present invention, and Fig. 17 (b) is a cross-sectional view taken along line FF of Fig. 17 (a). In the heat dissipation plate 10H of the fourth modification of the second embodiment, three groove portions 3H that traverse from one end portion of the main surface to the other end portion are formed in parallel on the first member 1H. The second member 2H is formed in the groove portion 3H of the first member 1H, and the top surface of the second member 2H and the top surface of the first member 1H are formed into a flat surface.

Further, the heat sink may have the shape shown in Fig. 18. Fig. 18(a) is a plan view of a heat dissipation plate according to a fifth modification of the second embodiment of the present invention, and Fig. 18(b) is a cross-sectional view taken along line GG of Fig. 18(a). In the heat dissipation plate 10J of the fifth modification of the second embodiment, a plurality of groove portions 3J are formed in a lattice shape at equal intervals on the first member 1J. The second member 2J is formed in the groove portion 3J of the first member 1J, and the top surface of the second member 2J and the top surface of the first member 1J are formed into a flat surface.

In the heat dissipating plates in which the top surface of the first member and the second member of the first embodiment and the second member of the first embodiment and the third and fifth embodiments of the second embodiment are formed as a flat surface, the first member and the first member the maximum thickness of the member contact portion 2 h _1, and the maximum thickness portion of the first member and the second member contact ratio in the range ₂ h of, preferably 1: 1 to 20: 1. By forming in this range, it is possible to reduce the warpage of the heat dissipation plate under thermal cycling without increasing the thickness of the heat dissipation plate. The range of the ratio of the maximum thickness h _{1 of the} portion where the first member is in contact with the second member and the maximum thickness h ₂ of the portion of the second member that is in contact with the first member is preferably 1:1 to 10:1.

[Examples]

(Example 1)

The heat dissipation plate 10 having the shape of Fig. 1 was produced. The first member 1 was made of aluminum (A6063-T5), and the second member 2 was made of copper (phosphorus deoxidized copper). In the first member 1, an aluminum plate (r ₁ : 50 mm, r ₃ : 50 mm) having a thickness (h ₁ ) of 3.0 mm forms an angle (θ) of the side surface with respect to the main surface: 30°, r ₂ : 30 mm, r ₃ : 50mm groove portion 3. The second member 2 is formed by laminating the copper particles (particle diameter: 30 μm) to the groove portion 3 by a cold spray device 50 using a compressed gas: nitrogen gas, compressed gas temperature: 600 ° C, gas pressure: 3 MPa. The thickness h ₂ of the second member ₂ is 5.0 mm.

(Examples 2 and 3)

In the heat dissipation plate 10E having the shape of Fig. 11, the first member 1E is made of aluminum (A6063-T5), and the second member 2E is made of copper (phosphorus deoxidized copper). In the first member 1E, an aluminum plate (r ₁ : 50 mm, r ₃ : 50 mm) having a thickness (h ₁ ) of 3.0 mm forms an angle (θ) of the side surface with respect to the main surface: 30°, a base thickness h ₃ : 2.0 mm or The groove portion 3E of 1.0 mm, r ₂ : 30 mm, and r ₃ : 50 mm. The second member 2E is formed by laminating the copper particles (particle diameter: 30 μm) to the groove portion 3E by a cold spray device 50 with a compressed gas: nitrogen gas, compressed gas temperature: 600 ° C, gas pressure: 3 MPa. The thickness h ₂ of the second member 2E is 3.0 mm or 4.0 mm.

(Reference example 1)

In the heat dissipation plate 10 having the shape of Fig. 1, the second member 2 is laminated on the first member 1 having no groove portion 3. The first member is an aluminum plate (A6063-T5, r ₁ : 50 mm, r ₃ : 50 mm) having a thickness (h ₁ ) of 3 mm, and the second member 2 is compressed by a cold spray device 50 to compress a gas: nitrogen gas, compressed gas Temperature: 600 ° C, gas pressure: 3 MPa, and sprayed copper particles (phosphorus deoxidized copper, particle size 30 μm) were laminated. The size of the second member is r ₂ : 30 mm, r ₃ : 50 mm, and h ₂ : 2 mm. The thicknesses of the first member and the second member of Reference Example 1 are shown in Table 1.

(Example 4)

In the heat dissipation plate 10D having the shape shown in Fig. 10, aluminum (A6063-T5) was used for the first member 1D, and copper (phosphorus deoxidized copper) was used for the second member 2D. In the first member 1D, the aluminum plate (r ₁ : 50 mm, r ₃ : 50 mm) having a thickness (h ₁ ) of 3 mm forms an angle (θ) of the side surface with respect to the main surface: 30°, r ₂ : 30 mm, r ₄ : 30 mm. Ditch 3D. The second member 2D is formed by laminating the copper particles (particle diameter: 30 μm) to the groove portion 3D by a cold spray device 50 with a compressed gas: nitrogen gas, compressed gas temperature: 600 ° C, gas pressure: 3 MPa. The thickness h ₂ of the second member 2D is 5.0 mm.

(Examples 5 and 6)

In the heat dissipation plate 10F having the shape of Fig. 13, the first member 1F is made of aluminum (A6063-T5), and the second member 2F is made of copper (phosphorus deoxidized copper). In the first member 1F, an aluminum plate (r ₁ : 50 mm, r ₃ : 50 mm) having a thickness (h ₁ ) of 3.0 mm forms an angle (θ) of a side surface with respect to the main surface: 30°, a base thickness h ₃ : 2.0 mm or The groove portion 3F of 1.0 mm, r ₂ : 30 mm, and r ₄ : 30 mm. The second member 2F is formed by laminating the copper particles (particle diameter: 30 μm) to the groove portion 3F by a cold spray device 50 with a compressed gas: nitrogen gas, compressed gas temperature: 600 ° C, gas pressure: 3 MPa. The thickness h ₂ of the second member 2F is 3.0 mm or 4.0 mm.

(Reference example 2)

In the heat dissipation plate 10D having the shape of Fig. 10, the second member is laminated on the first member having no groove portion. The first member is an aluminum plate having a thickness (h ₁ ) of 3 mm (A6063-T5, r ₁ : 50 mm, r ₃ : 50 mm), and the second member is cooled by a cold spray device 50 to compress gas: nitrogen gas, compressed gas temperature : 600 ° C, gas pressure: 3 MPa, and sprayed copper particles (phosphorus deoxidized copper, particle size 30 μm) were laminated. The size of the second member is r ₂ : 30 mm, r ₄ : 30 mm, and h ₂ : 2 mm. The thicknesses of the first member and the second member of Reference Example 2 are shown in Table 2.

(Example 7)

In the heat dissipation plate 10M having the shape of Fig. 16, the first member 1M is made of aluminum (A6063-T5), and the second member 2M is made of copper (phosphorus deoxidized copper). In the first member 1M, an aluminum plate (r ₁ : 50 mm, r ₃ : 50 mm) having a thickness (h ₁ ) of 5.0 mm forms an angle (θ) of the side surface with respect to the main surface: 30°, and a base thickness h ₃ : 4.0 mm. r ₂ : 30 mm, r ₃ : 50 mm groove portion 3M. The second member 2M is formed by laminating the copper particles (particle diameter: 30 μm) to the groove portion 3M by the cold spraying device 50 with compressed gas: nitrogen gas, compressed gas temperature: 600 ° C, gas pressure: 3 MPa, so that the second member 2M is formed. The top surface of the 1 member 1M and the top surface of the second member 2M are cut to form a flat surface. The thicknesses of the first member 1M and the second member 2M of the seventh embodiment are shown in Table 3.

(Example 8)

In the heat dissipation plate 10H having the shape of Fig. 17, the first member 1H is made of aluminum (A6063-T5), and the second member 2H is made of copper (phosphorus deoxidized copper). In the first member 1H, an aluminum plate (r ₁ : 50 mm, r ₃ : 50 mm) having a thickness (h ₁ ) of 5.0 mm was formed at an angle of r4: 1.5 mm to form an angle (θ) of three side faces with respect to the main surface: 30°. The groove portion 3H having a base thickness h ₃ : 4.0 mm, r ₂ : 9 mm, and r ₃ : 50 mm. The second member 2H is formed by laminating the copper particles (particle diameter: 30 μm) to the groove portion 3H by a cold gas spraying device 50 with a compressed gas: nitrogen gas, a compressed gas temperature: 600 ° C, and a gas pressure: 3 MPa. The top surface of the 1 member 1H and the top surface of the second member 2H are cut to form a flat surface. The thicknesses of the first member 1H and the second member 2H of the eighth embodiment are shown in Table 3.

(Example 9)

In the heat dissipation plate 10J having the shape shown in Fig. 18, aluminum (A6063-T5) is used for the first member 1J, and copper (phosphorus deoxidized copper) is used for the second member 2J. In the first member 1J, the aluminum plate (r ₁ : 50 mm, r ₃ : 50 mm) having a thickness (h ₁ ) of 5.0 mm is formed in a lattice shape at intervals of r ₄ : 1.5 mm and r ₆ : 1.5 mm with respect to the main surface. The angle (θ) of the surface: 30°, the base thickness h ₃ : 4.0 mm, r ₂ : 9 mm, r ₅ : 9 mm, the groove portion 3J (9 complete grooves). The second member 2J is formed by a cold spray device 50, a compressed gas: nitrogen gas, a compressed gas temperature: 600 ° C, a gas pressure: 3 MPa, and copper particles (particle diameter: 30 μm) are sprayed onto the groove portion 3J to form a layer. The top surface of the member 1J and the top surface of the second member 2J are cut to form a flat surface. The thicknesses of the first member 1J and the second member 2J of the ninth embodiment are shown in Table 3.

(Reference Example 3)

In the heat dissipation plate 10 having the shape of Fig. 1, the second member 2 is laminated on the first member 1 having no groove portion 3. The first member is an aluminum plate (A6063-T5, r ₁ : 50 mm, r ₃ : 50 mm) having a thickness (h ₁ ) of 4.0 mm, and the second member 2 is compressed by a cold spray device 50 with a compressed gas: nitrogen, compression. Gas temperature: 600 ° C, gas pressure: 3 MPa, and sprayed copper particles (phosphorus deoxidized copper, particle size 30 μm) were laminated. The size of the second member is r ₂ : 30 mm, r ₃ : 50 mm, and h ₂ : 1.0 mm. The thicknesses of the first member and the second member of Reference Example 3 are shown in Table 3.

The warpage of each of the test pieces produced in the above Examples and Reference Examples when heated to 125 ° C and cooled to -40 ° C was visually evaluated (◎ to ×). Here, the warpage refers to the warpage of the end portion of the copper plate as the second member from the state of no heat load. Tests made in the examples and reference examples The thickness and warpage of the test piece are summarized in Tables 1 to 3 below.

As shown in Table 1, Examples 1 to 3 were able to reduce the amount of warpage as compared with Reference Example 1. Further, as shown in Table 2, Examples 4 to 6 were able to reduce the amount of warpage as compared with Reference Example 2. In addition, as shown in Table 3, compared In Reference Example 3, Examples 7 to 9 were capable of reducing the amount of warpage.

1‧‧‧1st component

2‧‧‧2nd member

3‧‧‧Ditch

10‧‧‧heating plate

H1‧‧‧ thickness

H2‧‧‧ thickness

R1 to r3‧‧‧ distance

θ‧‧‧Tilt angle

Claims (15)

A heat dissipation plate comprising: a first member made of a metal or an alloy, and formed in a plate shape, and having a groove portion at a central portion of the main surface, the side surface of the groove portion having an inclination of 10° to 45° with respect to the main surface And the second member is formed by laminating a metal or an alloy having a thermal conductivity higher than a material constituting the first member in the groove portion, or laminating from the inside of the groove portion in the thickness direction of the first member. In which a powder material of a metal or an alloy constituting the second member is accelerated together with a gas heated to a temperature lower than a melting point of the powder material, and is sprayed to the foregoing in a solid phase state. The member is deposited in the groove portion of the member, or is sprayed so as to extend from the inside of the groove portion in the thickness direction of the second member, so that the second member is laminated. A heat dissipation plate comprising: a second member formed of a metal or an alloy and formed into a plate-like body whose side surface is inclined at an angle of 10° to 45° with respect to the main surface; and the first member is thermally conductive a metal or an alloy smaller than a material constituting the second member is laminated on the outer peripheral portion of the side surface of the second member; wherein the powder material of the metal or alloy constituting the first member is heated to be higher than The gas having a low melting point of the powder material is accelerated together, and in a solid phase state, it is sprayed onto the outer peripheral portion of the side surface of the second member to be stacked, so that the first Component layering. The heat dissipation plate according to claim 1 or 2, wherein a metal or an alloy constituting the second member has a thermal expansion coefficient smaller than a metal or an alloy constituting the first member. The heat dissipation plate according to any one of claims 1 to 3, wherein the first member is aluminum or an aluminum alloy, and the second member is copper or a copper alloy. The heat dissipation plate according to any one of claims 1 to 4, wherein the groove portion is formed to traverse from one end portion of the first member main surface to the other end portion. The heat dissipation plate according to any one of claims 1 to 5, wherein the groove portion is formed to penetrate the first member. The heat dissipation plate according to any one of claims 1 to 6, wherein the second member is formed in the groove portion, and a top surface of the first member and a top surface of the second member are formed in a flat surface. The heat dissipation plate according to any one of the first to sixth aspect, wherein the top surface of the second member is formed to protrude from a top surface of the first member; The ratio of the maximum thickness of the portion where the second member is in contact with the maximum thickness of the portion of the second member that is in contact with the first member is in the range of 1:1 to 1:3. The heat dissipation plate according to claim 7, wherein a maximum thickness of a portion of the first member that is in contact with the second member is the largest portion of a portion of the second member that is in contact with the first member. thickness The ratio is in the range of 1:1 to 20:1. The heat dissipation plate according to any one of claims 1 to 3, wherein the first member is formed with a flow path through which a cooling medium flows, on a surface opposite to a surface on which the groove portion is formed. A power module, comprising: the heat dissipation plate according to any one of claims 1 to 9; the ceramic substrate connected to the second member of the heat dissipation plate; and the heat dissipation member is made of aluminum or aluminum alloy The structure is connected to the surface on the opposite side of the surface of the heat sink that is in contact with the ceramic substrate. A power module comprising: a heat dissipation plate according to claim 10; and a ceramic substrate connected to the second member side of the heat dissipation plate. A method of manufacturing a heat dissipation plate includes the step of forming a second member formed in a groove formed in a central portion of a main surface of a first member, wherein the first member is made of a metal or an alloy and is formed into a plate. a side surface of the groove portion having an inclination angle of 10 to 45 with respect to the main surface, and a powder material having a thermal conductivity higher than a material constituting the material of the first member, which is heated to be higher than The gas having a low melting point of the powder material is accelerated together, and is sprayed into the groove portion to be deposited in a solid phase state, or is sprayed from the inside of the groove portion toward the thickness direction of the first member. Depositing to form the second member; and cutting the at least the second member formed by the step of laminating. A method for producing a heat dissipation plate includes a step of laminating a material of a metal or an alloy having a thermal conductivity lower than a material constituting the second member from a side surface of the second member and an outer peripheral portion of the side surface. Accelerating together with a gas heated to a temperature lower than the melting point of the powder material, and in a solid phase state, being sprayed and deposited to form a first member, wherein the second member is made of metal or The plate is formed of an alloy and formed into a plate-like body whose side surface is inclined at an angle of 10 to 45 with respect to the main surface, and a cutting step of cutting at least the first member formed by the laminating step. The method for producing a heat dissipation plate according to claim 13 or claim 14, wherein the metal or alloy constituting the second member has a thermal expansion coefficient smaller than a metal or an alloy constituting the first member.