TW201522978A - High-frequency probe module - Google Patents

Abstract

A high-frequency probe module includes an electric signal conduction member, at least two probes, and a signal adapter, wherein the electric signal conduction member comprises a signal line, an insulating layer sheathing the signal line, and a ground layer sheathing the insulating layer; the electric signal conduction member has a first engaging face and a second engaging face. An included angle is formed between the first engaging face and the second engaging face or the extended surface thereof. The probes are welded on the first engaging face, and engage the second engaging face simultaneously in which one probe is connected to the signal line while another probe is connected to the ground layer. The signal adapter has a signal conduction portion and a ground conduction portion. The signal conduction portion is connected to the signal line while the ground conduction portion is connected to the ground layer.

Description

High frequency probe module

The invention relates to a probe; in particular to a high frequency probe module.

According to the method for detecting whether the electrical connection between the precision electronic components of the electronic product is true, a probe module is used as a transmission interface between the test signal and the power signal between the detecting device and the electronic device to be tested.

However, when the conventional probe module is used for high-frequency testing, the micro-inductance attached to it often causes a large increase in reactance due to high-frequency signals, which in turn causes an increase in line loss, so that the high-frequency test signal cannot pass smoothly, which leads to The signal is not easily recognized by the detecting device, and it is easy to have a test misjudgment.

Therefore, how to effectively reduce the signal loss during high-frequency signal transmission to achieve accurate high-frequency detection is actually the direction of the current industry.

In view of this, the object of the present invention is to provide a high frequency probe module, which can effectively reduce signal loss during high frequency signal transmission.

To achieve the above objective, the high-frequency probe module of the present invention is configured to transmit an electrical signal between a detecting device and a test object, and includes an electrical signal conducting member, at least two probes, and a signal connector. The electrical signal conducting member comprises a signal line made of a conductor, an insulating layer covering the signal line and made of an insulating material, and a conductor covered with the insulating layer. The grounding layer is formed; in addition, the electrical signal conducting member has a first end and a second end on the opposite side, and the electrical signal conducting member has a first contact surface and a second at the first end The contact surface is formed, and an angle is formed between the first contact surface and the second contact surface or the extended surface thereof. The two probes are made of a conductor and are connected to the object to be tested; the probes are soldered on the first contact surface and simultaneously abut the second contact surface, and wherein One probe is electrically connected to the signal line, and the other probe is electrically connected to the ground layer. The signal connector is connected to the second end of the electrical signal conducting member for electrically connecting to the detecting device; and the signal connector has a signal conducting portion and a grounding conducting portion, the signal conducting portion and the signal line The grounding conductive portion is electrically connected to the grounding layer.

Therefore, through the above design, the high-frequency probe module can effectively reduce the signal loss caused by the high-frequency signal during high-frequency signal transmission, so that the high-frequency detection can be more accurate.

10‧‧‧shell

12‧‧‧Upper shell

14‧‧‧ lower case

16‧‧‧ accommodating space

161‧‧‧ first opening

162‧‧‧ second opening

20‧‧‧Telecom transmission parts

21‧‧‧ Signal Line

22‧‧‧Insulation

23‧‧‧ Grounding layer

24‧‧‧ outer skin

25‧‧‧ first end

251‧‧‧First cutting surface

252‧‧‧Second cutting surface

253‧‧‧ first contact

254‧‧‧second contact

26‧‧‧ second end

31~33‧‧‧ probe

40‧‧‧Fixed parts

50‧‧‧Signal connector

51‧‧‧ Signal Transmitter

52‧‧‧ Grounding Conduction

53‧‧‧Insulated gasket

60‧‧‧ positioning parts

70‧‧‧Telecom transmission parts

75‧‧‧ first end

751‧‧‧ first contact

752‧‧‧second contact

753‧‧‧ Third contact

80‧‧‧Telecom transmission parts

851‧‧‧ first contact

853‧‧‧ Third contact

854‧‧‧4th meet

855‧‧‧5th contact

100‧‧‧ coaxial cable

1 is a perspective view of a probe module of a preferred embodiment; FIG. 2 is a perspective view of a probe module of a preferred embodiment; FIG. 3 is an exploded view of the probe module of the preferred embodiment; 4 reveals the connection relationship between the signal conducting member, the probe and the fixing member; FIG. 5 discloses the connection relationship between the electrical signal conducting member, the probe and the signal connector; FIG. 6 discloses that the positioning member is coated on the electrical signal conducting member; FIG. 8 is a side view of a telecommunication portion of another preferred embodiment; FIG. 9 is a perspective view of another embodiment of the telecommunication device. Stereo picture.

In order that the present invention may be more clearly described, the preferred embodiments are illustrated in the accompanying drawings. Referring to FIG. 1 to FIG. 4, a high frequency probe module according to a preferred embodiment of the present invention is used for transmitting a detection device between a detecting device (not shown) and an object to be tested (not shown). The high frequency probe module includes a housing 10, an electrical signal conducting member 20, three probes 31-33, a fixing member 40, a signal connector 50, and a positioning member 60. Wherein: the casing 10 is made of a hard metal material, and has an upper casing 12 and a lower casing 14 that can be combined, and the upper casing 12 and the lower casing 14 are combined to form an accommodation space therein. 16 and a first opening 161 and a second opening 162 communicating with the accommodating space 16 are formed on opposite sides.

Referring to FIG. 4, the signal conducting member 20 includes a signal line 21 made of a conductor, an insulating layer 22 covering the signal line 21 and made of an insulating material, and a conductive layer 22 coated with a conductor. A ground layer 23 is formed, and an outer layer 24 is formed by covering the ground layer 23 with an insulating material. In addition, referring to FIG. 5 , the electrical signal conducting member 20 has a first end 25 and a second end 26 on the opposite side, and the electrical signal conducting member 20 has a first cutting surface 251 at the first end 25 . a second cutting surface 252, and a first abutting surface 253 and a second abutting surface 254 between the first cutting surface 251 and the second cutting surface 252, the first abutting surface 253 and The first cutting surface 251 is connected, and the second abutting surface 254 is connected to the second cutting surface 252, and the first abutting surface 253 is connected to the second abutting surface 254 and forms an angle. In this embodiment, the first contact surface 253 is perpendicular to the second contact surface 254, and the distance between the first cutting surface 251 and the second cutting surface 252 is from the first end 25 to the first The two ends 26 are gradually expanded, and through the design of the cutting faces 251 and 252, the contact faces can be effectively reduced. 253, 254 processing difficulty, and thus improve the efficiency and speed of processing.

The probes 31 to 33 are made of a conductor, and one end is pointed to be connected to the to-be-side portion of the object to be tested, and the other end is welded to the first contact surface 253, and at the same time The second contact surface 254 is in contact with the second contact surface 254. One of the probes 31 is electrically connected to the signal line 21, and the other two probes 32 and 33 are electrically connected to the ground layer 23, and the probe 31 electrically connected to the signal line 21 is located at The grounding layer 23 is electrically connected between the two probes 32 and 33, and the design of the probe arrangement can increase the applicability of the probes 31-33 to detection points of different specifications, angles or pitches.

The fixing member 40 is made of an insulating rubber material, but is not limited thereto, and is disposed at a connection between the probes 31 to 33 and the electrical signal transmitting member 20 when the insulating rubber material is in a fluid state, and the like. After the insulating material is cured, the first end 25 and the portions of the probes 31 to 33 connected to the electrical signal conducting member 20 are covered, and the signal of the electrical signal transmitting member 20 at the first end 25 is shielded. The purpose of the outer layer 24 of the wire 21, the insulating layer 22, and the ground layer 23 is that the design can increase the effect of the fixing, and at the same time, the interference of the external signal during the electrical detection can be reduced.

The signal connector 50 is connected to the second end 26 of the electrical signal conducting member 20 for connecting to the coaxial cable 100 of the detecting device for electrical connection with the detecting device. In addition, the signal connector 50 has a signal conducting portion 51 and a ground conducting portion 52. The signal conducting portion 51 is electrically connected to the signal line 21, and the ground conducting portion 52 is connected to the ground layer 23. Electrical connection. In this embodiment, the signal conducting portion 51 is a metal stud. The ground conducting portion 51 is a metal collar and is disposed around the signal conducting portion 51. In addition, an insulating gasket 53 is further disposed between the signal conducting portion 51 and the ground conducting portion 52 to isolate the signals between the two, thereby preventing interference between the signal conducting portion 51 and the ground conducting portion 52. Short-circuit doubts.

Referring to FIG. 6, in the embodiment, the positioning member 60 is made of an insulating rubber material, but not limited thereto, and may be replaced by other insulating materials. The positioning member 60 covers a portion of the electrical signal conducting member 20 including the second end 26, thereby shielding the connection between the signal connector 50 and the electrical signal conducting member 20. In addition, the positioning member 60 is coupled to the accommodating space 16, and the outer surface thereof is in contact with the inner surfaces of the upper and lower shells 12, 14 to achieve a stable setting. Moreover, after the positioning member 60 is coupled to the housing 10, it can be seen from FIG. 1 and FIG. 2 that the portion of the electrical signal conducting member 20 covered by the positioning member 60 will be located in the accommodating space 16. The other uncovered ones and the probes 31-33 extend from the first opening 161 and are located outside the housing 10, and the signal connector 50 extends from the second opening 162. Outside the casing 10, the probes 31-33 can be easily connected to the object to be tested, and the signal connector 50 can be easily combined with the coaxial cable 100.

Therefore, it can be seen from the waveform of FIG. 7 that the high-frequency probe module has a reflection loss S11 of only about -11 dB when transmitting a high-frequency signal of 110 GHz, and it can be known that the electrical signal transmission member is used for the above-mentioned operation. The internal signal transmission design can effectively reduce the signal loss caused by high-frequency signals, making the high-frequency detection more accurate.

In addition, in addition to the above structure, the electrical signal conducting member of the present invention may be similar to the electrical signal conducting member 70 shown in FIG. 8 except that the first end 75 has a first abutting surface 751 and the second abutting surface. In addition to the 752, a third abutting surface 753 parallel to the first abutting surface 751 is further disposed, and when assembled, the third abutting surface 753 is coupled to the probes 31-33, thereby utilizing three sides. The design achieves a firm and fixed effect. Of course, in addition to the structure of FIG. 8, the electrical signal conducting member 80 shown in FIG. 9 may have parallel and opposite fourth abutting faces 854 and fifth abutting faces 855, and the fourth abutting faces 854 and The fifth abutting surface 855 is perpendicular to the first abutting surface 851 and the third abutting surface 853, and the fourth abutting surface 854 and the fifth abutting surface 855 are respectively the outermost side when assembled. The two probes 32, 33 (not shown) are connected, so that the five-sided design can be adopted. It greatly improves the stability of the probe assembly.

The above is only a preferred embodiment of the present invention, and equivalent changes to the scope of the present invention and the scope of the patent application are intended to be included in the scope of the present invention.

10‧‧‧shell

12‧‧‧Upper shell

14‧‧‧ lower case

16‧‧‧ accommodating space

20‧‧‧Telecom transmission parts

31~33‧‧‧ probe

40‧‧‧Fixed parts

50‧‧‧Signal connector

60‧‧‧ positioning parts

Claims (13)

A high frequency probe module for transmitting electrical signals between a detecting device and a test object, and comprising: an electrical signal conducting member, comprising a signal line made of a conductor, and a signal line covered by the signal And an insulating layer made of an insulating material, and a grounding layer covering the insulating layer and made of a conductor; in addition, the electrical signal conducting member has a first end and a second end on the opposite side, and the telecommunications The first conductive end has a first abutting surface and a second abutting surface, and the first abutting surface and the second abutting surface or an extended surface thereof form an angle; at least two The probe is made of a conductor and is for contacting the object to be tested; the probe is soldered on the first contact surface and simultaneously abuts the second contact surface, and one of the probes The probe is electrically connected to the signal line, and the other probe is electrically connected to the ground layer; and a signal connector is connected to the second end of the electrical signal conducting member for electrical connection with the detecting device Connecting; in addition, the signal connector has a signal conducting portion and a ground conducting portion, the signal The conductive portion is electrically connected to the signal line, and the ground conducting portion is connected electrically to the ground layer. The high frequency probe module of claim 1, further comprising a fixing member made of an insulating material and covering the first end and a part of the probes to shield the electrical signal transmitting member The signal line, the insulating layer and the ground plane at the first end. The high frequency probe module of claim 1, wherein the electrical signal conducting member further has a first cutting surface and a second cutting surface at the first end, and the a distance between a cutting surface and the second cutting surface is gradually expanded from the first end to the second end; in addition, the first abutting surface and the second abutting surface are located on the first cutting surface and the Between the second cutting faces, the first abutting surface is connected to the first cutting surface, and the second abutting surface is connected to the second cutting surface. The high frequency probe module of claim 3, wherein the first abutting surface is connected to the second abutting surface, and the first abutting surface is substantially perpendicular to the second abutting surface. The high-frequency probe module of claim 1, further comprising a housing, wherein the housing has an accommodating space, and a first opening and a second on the opposite sides communicating with the accommodating space An opening portion of the electrical signal conducting portion is located in the accommodating space, and the other portion protrudes from the first opening and is located outside the housing; the signal connector extends from the second opening and is located outside the housing. The high-frequency probe module of claim 5, further comprising a positioning member, which is made of an insulating material and located in the accommodating space and covering the electrical signal conducting member located in the accommodating space. The high frequency probe module of claim 6, wherein the outer surface of the positioning member is in contact with the inner surface of the housing. The high frequency probe module of claim 1, wherein the electrical signal conducting member further comprises an outer skin layer made of an insulating material and covering the ground layer. The high frequency probe module of claim 1, wherein the at least two probes are three probes, wherein one probe is electrically connected to the signal line, and the other two probes are electrically connected to the ground layer. And the probe electrically connected to the line is located between the two probes electrically connected to the ground layer. The high frequency probe module of claim 1, wherein the electrical signal conducting member further has a third abutting surface at the first end, and the third abutting surface faces the first abutting surface, and And contacting at least two probes. The high frequency probe module of claim 10, wherein the third contact surface is parallel to the first contact surface. The high frequency probe module of claim 10, wherein the electrical signal conducting member further has a fourth abutting surface and a fifth abutting surface disposed opposite each other at the first end, and the fourth connection The abutting surface and the fifth abutting surface are respectively in contact with the two probes. The high frequency probe module of claim 12, wherein the fourth abutting surface is parallel to the fifth abutting surface and perpendicular to the first abutting surface and the third abutting surface.