TW201520568A - Test and maintenance system and method - Google Patents

Test and maintenance system and method Download PDF

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TW201520568A
TW201520568A TW102143809A TW102143809A TW201520568A TW 201520568 A TW201520568 A TW 201520568A TW 102143809 A TW102143809 A TW 102143809A TW 102143809 A TW102143809 A TW 102143809A TW 201520568 A TW201520568 A TW 201520568A
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card
test
data
tested
measurement
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TW102143809A
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TWI497093B (en
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Shun-Chih Huang
Ching-Yu Lu
Yen-Chen Li
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Giga Byte Tech Co Ltd
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Abstract

A test and maintenance system comprises a data measurement unit, a data transmission unit and a computer, wherein the computer comprises a storage unit for storing at least one predetermined data and at least one measuring position data. The data measurement unit is connected to at least one signal measuring position of a test card according to the measuring position data to acquire at least one measuring data. Further, the computer is able to compares the predetermined data and the measuring data to generate a detection result. A user is able to replace a unit of the test card according to the detection result so as to improve the efficiency of maintenance of the test card.

Description

測試維修系統及其方法 Test maintenance system and method thereof

本發明係關於一測試維修系統平台,特別是一種應用於待測卡維修之測試維修系統。 The invention relates to a test maintenance system platform, in particular to a test maintenance system applied to the repair of a card to be tested.

資訊產業蓬勃發展,所推出的產品日新月異,因而造成產品價格的競爭已經趨緩。也由於消費者意識抬頭,網路資訊傳遞迅速,因此售後服務之效率及水準儼然成為影響資訊品牌生存的重要依據。為提高服務水準,可以投入更多的輔助設備等。例如實施維修流程的分析與規劃,有計劃地改善維修作業,以增加維修效率及品質,並增進客戶滿意度達成企業獲利。 The information industry is booming, and the products launched are changing with each passing day, which has caused the competition for product prices to slow down. Also, due to the rise of consumer awareness and the rapid transmission of online information, the efficiency and standard of after-sales service have become an important basis for influencing the survival of information brands. In order to improve service standards, more auxiliary equipment can be invested. For example, the analysis and planning of the maintenance process is carried out, and the maintenance work is planned to improve the maintenance efficiency and quality, and the customer satisfaction is achieved to achieve corporate profit.

功能卡(如顯示卡、網路卡、磁碟陣列卡或其他特殊用途功能卡)在目前多媒體時代的使用率尤其廣泛及重要。愈高效能的功能卡,其設計結構越複雜。也由於使用環境及習慣的不同,常常產生許多使用上的問題甚至發生故障。而當功能卡發生故障,需要進行維修時,最困難的地方在於找出損壞的料件。按照傳統的維修流程,維修員需要瞭解此功能卡的線路設計,明白各料件的特性,才具備基本維修能力,且維修所需的時間與成功機率,受限於維修員的技術能力與經驗,造成維修員門檻與成本的提高。 The use of feature cards (such as display cards, network cards, disk array cards or other special purpose function cards) is particularly broad and important in the current multimedia era. The more efficient the function card, the more complicated the design structure. Due to the different environments and habits, there are often many problems in use and even failures. When the function card fails and needs to be repaired, the most difficult part is to find the damaged material. According to the traditional maintenance process, the maintenance personnel need to understand the circuit design of the function card, understand the characteristics of each material, and have the basic maintenance capability, and the time and success rate required for maintenance are limited by the technical ability and experience of the maintenance personnel. , resulting in the maintenance of the threshold and cost.

然而,實際上每張同樣功效之功能卡(如顯示卡)其維修料件與方式都是有共通之處,因此若能如上所述,實施功能卡維修流程的分析 與規劃,有計劃地改善維修作業,例如,透過一套系統將維修過的經驗進行匯整與學習,以提供日後的維修協助。如此,不僅能夠增加功能卡之維修效率及品質,亦可降低人力成本,使即使不具備維修技術的人也能透過系統完成維修。 However, in fact, each function card (such as a display card) with the same function has common features for repairing materials and methods, so if the function card maintenance process can be analyzed as described above, And planning to improve maintenance operations in a planned manner, for example, to integrate and learn the repaired experience through a system to provide future maintenance assistance. In this way, not only can the maintenance efficiency and quality of the function card be increased, but also the labor cost can be reduced, so that even those who do not have the maintenance technology can complete the repair through the system.

本發明之一目的在於提供一種測試維修系統及其方法,使用者可以根據於一電腦裝置所提供的量測位置資訊以從一待測卡找到相對應的訊號量測位置,對於待測卡之訊號量測位置進行量測以擷取出一量測資料,之後,將擷取出之量測資料與電腦裝置所儲存之一預設資料進行比對以產生一檢測結果,使用者再根據檢測結果以決定是否更換待測卡之訊號量測位置上的料件,在此,藉由電腦裝置之指示進行待測卡之檢測及維修,將可以提高待測卡檢測、維修的效率及正確性。 An object of the present invention is to provide a test maintenance system and a method thereof, wherein a user can find a corresponding signal measurement position from a card to be tested according to the measurement position information provided by a computer device, for the card to be tested. The signal measurement position is measured to take out a measurement data, and then the measured data is compared with a preset data stored in the computer device to generate a detection result, and the user further uses the detection result according to the detection result. Decide whether to replace the material on the signal measurement position of the card to be tested. Here, the detection and maintenance of the card to be tested by the instruction of the computer device can improve the efficiency and correctness of the detection and maintenance of the card to be tested.

本發明之又一目的在於提供一種測試維修系統及其方法,其電腦裝置進一步提供相關維修資訊,分析先前待測卡可能損壞的原因及料件,以令使用者可以參考先前的維修經驗進行後續其他待測卡之檢測及維修動作。 Another object of the present invention is to provide a test maintenance system and a method thereof. The computer device further provides relevant maintenance information, analyzes the cause of damage to the previously tested card and the material, so that the user can refer to the previous maintenance experience for follow-up. Detection and maintenance actions of other cards to be tested.

為了達到上述目的,本發明提供一種測試維修系統,包括:一數據量測單元,連接一待測卡之至少一訊號量測位置,並由待測卡之訊號量測位置擷取至少一量測資料;一資料傳輸單元,連接數據量測單元;及一電腦裝置,連接資料傳輸單元,並包括一儲存單元,儲存至少一預設資料及至少一量測位置資訊,其中量測位置資訊包括待測卡之訊號量測位置,而電腦裝置則透過資料傳輸單元由數據量測單元取得量測資料,並比對量測資料及相對應的預設資料,以產生一檢測結果。 In order to achieve the above object, the present invention provides a test maintenance system, comprising: a data measurement unit, which is connected to at least one signal measurement position of a card to be tested, and at least one measurement is taken from a signal measurement position of the card to be tested. a data transmission unit connected to the data measurement unit; and a computer device connected to the data transmission unit and including a storage unit for storing at least one preset data and at least one measurement position information, wherein the measurement position information includes The signal measurement position of the card is measured, and the computer device obtains the measurement data from the data measurement unit through the data transmission unit, and compares the measurement data with the corresponding preset data to generate a detection result.

本發明又提供一種測試維修方法,包括以下步驟;依據一待 測卡的型號,提供待測卡的至少一量測位置資訊;依據量測位置資訊,對待測卡的至少一訊號量測位置進行量測,並擷取至少一量測資料;及比對量測資料及至少一預設資料,並產生一檢測結果。 The invention further provides a test and maintenance method, comprising the following steps; The model of the test card provides at least one measurement position information of the card to be tested; according to the measurement position information, the measurement position of at least one signal of the test card is measured, and at least one measurement data is taken; and the comparison quantity is obtained. Measuring data and at least one preset data, and generating a test result.

10‧‧‧測試維修系統 10‧‧‧Test maintenance system

11‧‧‧電腦裝置 11‧‧‧Computer equipment

111‧‧‧儲存單元 111‧‧‧ storage unit

121‧‧‧量測位置資訊 121‧‧‧Measurement location information

123‧‧‧維修資訊 123‧‧‧Maintenance information

13‧‧‧資料傳輸單元 13‧‧‧Data Transfer Unit

14‧‧‧量測資料 14‧‧‧Measurement data

15‧‧‧數據量測單元 15‧‧‧Data Measurement Unit

17‧‧‧待測卡 17‧‧‧Test card

171‧‧‧料件 171‧‧‧Materials

172‧‧‧訊號量測位置 172‧‧‧ Signal measurement position

173‧‧‧料件 173‧‧‧Materials

174‧‧‧訊號量測位置 174‧‧‧ Signal measurement position

175‧‧‧料件 175‧‧‧Materials

176‧‧‧訊號量測位置 176‧‧‧ Signal measurement position

19‧‧‧測試訊號供給單元 19‧‧‧Test signal supply unit

第1圖為本發明第一實施例之測試維修系統的連接示意圖。 1 is a schematic view showing the connection of a test maintenance system according to a first embodiment of the present invention.

第2圖為本發明第二實施例之測試維修方法的步驟流程圖。 Figure 2 is a flow chart showing the steps of the test and maintenance method of the second embodiment of the present invention.

第3圖為本發明第三實施例之測試維修方法的步驟流程圖。 Figure 3 is a flow chart showing the steps of the test and maintenance method of the third embodiment of the present invention.

第4A圖及第4B圖為本發明第四實施例之測試維修方法的步驟流程圖。 4A and 4B are flow charts showing the steps of the test maintenance method according to the fourth embodiment of the present invention.

請參閱第1圖所示,為本發明之第一實施例之測試維修系統的連接示意圖。如圖所示,本發明第一實施例之測試維修系統10包括一電腦裝置11、一資料傳輸單元13及一數據量測單元15。其中電腦裝置11透過資料傳輸單元13連接數據量測單元15,並透過數據量測單元15及資料傳輸單元13從待測卡17擷取至少一量測資料14。資料傳輸單元13可為但不限於一通用序列匯流排線。量測資料14亦可為電壓值或波形圖。再者,待測卡17亦可為一顯示卡、一網路卡、一磁碟陣列卡或一特殊用途之功能卡。 Please refer to FIG. 1 , which is a schematic diagram of the connection of the test maintenance system of the first embodiment of the present invention. As shown, the test maintenance system 10 of the first embodiment of the present invention includes a computer device 11, a data transmission unit 13, and a data measurement unit 15. The computer device 11 is connected to the data measuring unit 15 through the data transmission unit 13, and the at least one measurement data 14 is extracted from the card under test 17 through the data measuring unit 15 and the data transmission unit 13. The data transmission unit 13 can be, but is not limited to, a universal sequence bus. The measurement data 14 can also be a voltage value or a waveform diagram. Furthermore, the card under test 17 can also be a display card, a network card, a disk array card or a special purpose function card.

一般而言,待測卡17上的電路相當的複雜,並可能包括有複數個料件171/173/175及複數個訊號量測位置172/174/176。在本發明實施例中,使用者可依據測試維修系統10的指示檢測及維修損壞的待測卡17。在本發明一實施例中,電腦裝置11包括一儲存單元111,用以儲存至少一量測位置資訊121及至少一預設資料123,例如電腦裝置11可為但不限於一個人電腦或一伺服器。 In general, the circuitry on the card under test 17 is quite complex and may include a plurality of components 171/173/175 and a plurality of signal measurement locations 172/174/176. In the embodiment of the present invention, the user can detect and repair the damaged card 17 to be tested according to the instruction of the test maintenance system 10. In one embodiment of the present invention, the computer device 11 includes a storage unit 111 for storing at least one measurement location information 121 and at least one preset data 123. For example, the computer device 11 can be, but not limited to, a personal computer or a server. .

在實際應用時使用者可將待測卡17的型號資料輸入電腦裝置10,電腦裝置10將依據輸入的型號資料由儲存單元111中找出相對應的量測位置資訊121及預設資料123。其中量測位置資訊121包括待測卡17的型號及該型號之待測卡17的訊號量測位置172/174/176,而預設資料123則包括相對應於各個訊號量測位置172/174/176之預定數值。 In the actual application, the user can input the model data of the card 17 to be tested into the computer device 10. The computer device 10 will find the corresponding measurement position information 121 and the preset data 123 from the storage unit 111 according to the input model data. The measurement location information 121 includes the model of the card 17 to be tested and the signal measurement location 172/174/176 of the card 17 to be tested, and the preset data 123 includes corresponding signal measurement locations 172/174. /176 predetermined value.

數據量測單元15可為但不限於一介面示波器。數據量測單元15透過資料傳輸單元13電性連接電腦裝置11,使用者可根據電腦裝置11所提供的量測位置資訊121,在待測卡17上找到其相對應的訊號量測位置172/174/176。將數據量測單元15連接待測卡17上的訊號量測位置172/174/176,並由該訊號量測位置172/174/176擷取出量測資料14。在本發明一實施例中,待測卡17可設置在一測試訊號供給單元19上,例如測試訊號供給單元19可為但不限於一印刷電路板,測試訊號供給單元19可提供待測卡17所需的測試訊號,例如所提供的測試訊號可為但不限於電壓或是電流,以驅動待測卡17運作。 The data measurement unit 15 can be, but is not limited to, an interface oscilloscope. The data measuring unit 15 is electrically connected to the computer device 11 through the data transmission unit 13. The user can find the corresponding signal measurement position 172/ on the card 17 to be tested according to the measured position information 121 provided by the computer device 11. 174/176. The data measuring unit 15 is connected to the signal measuring position 172/174/176 on the card 17 to be tested, and the measuring data 14 is taken out from the signal measuring position 172/174/176. In an embodiment of the present invention, the card 17 to be tested may be disposed on a test signal supply unit 19. For example, the test signal supply unit 19 may be, but not limited to, a printed circuit board, and the test signal supply unit 19 may provide the card to be tested. The required test signals, such as the test signals provided, can be, but are not limited to, voltage or current to drive the card 17 to be tested.

電腦裝置11與資料傳輸單元13電性連接,並可透過資料傳輸單元13取得數據量測單元15從待測卡17上所擷取出的量測資料14。電腦裝置11之儲存單元11所儲存的預設資料123可為待測卡17的預定數值,電腦裝置11可比對待測卡17的量測資料14與相對應的預設資料123,並產生一檢測結果,使用者可依據檢測結果而得知待測卡17上料件171/173/175是否正常,並因此得知是否需要替換待測卡17上料件171/173/175。例如可將量測資料14傳送至儲存單元111內,並比對量測資料14與預設資料123。 The computer device 11 is electrically connected to the data transmission unit 13 and can obtain the measurement data 14 taken by the data measurement unit 15 from the card to be tested 17 through the data transmission unit 13. The preset data 123 stored in the storage unit 11 of the computer device 11 can be a predetermined value of the card 17 to be tested, and the computer device 11 can compare the measurement data 14 of the card 17 to the corresponding preset data 123 and generate a detection. As a result, the user can know whether the feeding member 171/173/175 of the card to be tested 17 is normal according to the detection result, and thus know whether it is necessary to replace the feeding member 171/173/175 of the card 17 to be tested. For example, the measurement data 14 can be transmitted to the storage unit 111, and the measurement data 14 and the preset data 123 can be compared.

待測卡17包括複數個料件171/173/175及複數個訊號量測位置172/174/176,例如第一料件171、第二料件173、第三料件175、第一訊 號量測位置172、第二訊號量測位置174及第三訊號量測位置176,其中第一訊號量測位置172相對應於第一料件171,第二訊號量測位置174相對應於第二料件173,而第三訊號量測位置176則相對應於第三料件175。 The card to be tested 17 includes a plurality of materials 171/173/175 and a plurality of signal measuring positions 172/174/176, such as a first material member 171, a second material member 173, a third material member 175, and a first message. The measurement position 172, the second measurement position 174 and the third measurement position 176, wherein the first signal measurement position 172 corresponds to the first material member 171, and the second signal measurement position 174 corresponds to the first The two material members 173 and the third signal measurement position 176 correspond to the third material member 175.

在實際應用時,使用者可依據電腦裝置11所提供之量測位置資訊121的指示,將數據量測單元15連接第一訊號量測位置172,並取得待測卡17之第一訊號量測位置172的量測資料14,例如量測資料14可為第一檢測電壓。電腦裝置11可於儲存單元111中,找出與待測卡14之第一訊號量測位置172及/或第一料件171相對應之預設資料123,例如預設資料123可為第一預設電壓。電腦裝置11可進一步比對量測資料14及預設資料123,並產生檢測結果,而電腦裝置11及/或使用者可依據檢測結果決定是否更換待測卡17上的第一料件171,例如電腦裝置11可比對第一檢測電壓及第一預設電壓,當第一檢測電壓與第一預設電壓間之電壓差大於預設值,電腦裝置11便發出更換第一料件171的指示,反之,當第一檢測電壓與第一預設電壓間之電壓差小於預設值,電腦裝置11便發出不需更換第一料件171的指示。在完成第一料件171及/或第一訊號量測位置172的檢測後,可繼續進行其他料件及/或其他訊號量測位置的檢測,例如第二料件173、第三料件175、第二訊號量測位置174及/或第三訊號量測位置176的檢測,其檢測方法與第一料件171及/或第一訊號量測位置172相同,在此便不再贅述。 In the actual application, the user can connect the data measuring unit 15 to the first signal measuring position 172 according to the indication of the measured position information 121 provided by the computer device 11, and obtain the first signal measurement of the card 17 to be tested. The measurement data 14 of the location 172, such as the measurement data 14, can be the first detection voltage. The computer device 11 can find the preset data 123 corresponding to the first signal measuring position 172 and/or the first material 171 of the card 14 to be tested in the storage unit 111. For example, the preset data 123 can be the first Preset voltage. The computer device 11 can further compare the measurement data 14 and the preset data 123, and generate a detection result, and the computer device 11 and/or the user can decide whether to replace the first material 171 on the card 17 to be tested according to the detection result. For example, the computer device 11 can compare the first detection voltage and the first preset voltage. When the voltage difference between the first detection voltage and the first preset voltage is greater than a preset value, the computer device 11 issues an indication to replace the first material 171. On the contrary, when the voltage difference between the first detection voltage and the first preset voltage is less than the preset value, the computer device 11 issues an indication that the first material 171 is not required to be replaced. After the detection of the first material member 171 and/or the first signal measurement position 172 is completed, the detection of other material parts and/or other signal measurement positions may be continued, for example, the second material member 173 and the third material member 175. The detection of the second signal measurement position 174 and/or the third signal measurement position 176 is the same as the first material 171 and/or the first signal measurement position 172, and will not be described herein.

此外,在本發明另一實施例中,儲存單元111亦可儲存一維修資訊125,其中維修資訊125包括相同或相似之待測卡17的量測位置資訊、相對應的料件及預設資料,以提供使用者查詢。當儲存單元111所儲存之量測位置資訊121未能完成待測卡15的維修時,使用者可參考維修資訊125進行後續的檢測及維修動作。當然在不同實施例中,維修資訊125 亦可包含待測卡17之線路圖及料件171/173/175的預定位置,使得使用者可依據維修資訊125檢查此待測卡17是否有線路連接上之問題,或是料件171/173/175位置設置錯誤所產生之問題。 In addition, in another embodiment of the present invention, the storage unit 111 can also store a maintenance information 125, wherein the maintenance information 125 includes the measurement location information of the same or similar card 17 to be tested, the corresponding material and the preset data. To provide user queries. When the measurement location information 121 stored by the storage unit 111 fails to complete the maintenance of the card under test 15, the user can refer to the maintenance information 125 for subsequent detection and maintenance operations. Of course, in different embodiments, maintenance information 125 The circuit diagram of the card to be tested 17 and the predetermined position of the material 171/173/175 may also be included, so that the user can check whether the card to be tested 17 has a line connection according to the maintenance information 125, or the material 171/ The problem caused by the 173/175 position setting error.

此外,電腦裝置11亦可將使用者之前更換之料件171/173/175、相對應之量測位置資訊172/174/176、量測資料14及待測卡17的型號,儲存在儲存單元111內,以作為將來檢測或維修之參考。 In addition, the computer device 11 can also store the previously replaced material parts 171/173/175, the corresponding measurement position information 172/174/176, the measurement data 14 and the model number of the card to be tested 17 in the storage unit. Within 111, for future reference or repair.

上述電腦裝置11可提供特定之量測位置資訊121以及相關維修資訊125等,但在實際應用時,電腦裝置11所提供之資訊可由使用者自行增加或減少。另外,電腦裝置11針對待測卡17所提供之預設資料123及量測資料14與預設資料123的比對條件之設定,亦可由使用者自行設定。 The computer device 11 can provide specific measurement position information 121 and related maintenance information 125, etc., but in actual application, the information provided by the computer device 11 can be increased or decreased by the user. In addition, the setting of the comparison condition 123 of the preset information 123 and the measurement data 14 provided by the computer device 11 for the card 17 to be tested and the preset data 123 may also be set by the user.

請參閱第2圖所示,本發明第二實施例之測試維修方法的步驟流程圖。並請配合參閱第1圖所示,使用者可依據以下的步驟流程檢測及維修待測卡17,並有利於提高待測卡17之檢測及維修的效率及正確性。 Please refer to FIG. 2, which is a flow chart showing the steps of the test maintenance method of the second embodiment of the present invention. Please refer to Figure 1 as shown in the figure below. The user can detect and repair the card 17 to be tested according to the following steps, and it is beneficial to improve the efficiency and correctness of the detection and maintenance of the card 17 to be tested.

電腦裝置11依據待測卡17之型號,提供相對應之量測位置資訊121,如步驟21所示。此步驟中,使用者首先將待測卡17的型號登錄在電腦裝置11,隨後電腦裝置11將會依據登錄的資料,於儲存單元111中找出與此待測卡17關聯性之量測位置資訊121。接下來,可根據電腦裝置11提供的量測位置資訊121,將數據量測單元15連接量測位置資料121指示之待測卡17的訊號量測位置172/174/176,並擷取待測卡17之訊號量測位置172/174/176的量測資料14,如步驟23所示。 The computer device 11 provides the corresponding measurement position information 121 according to the model of the card 17 to be tested, as shown in step 21. In this step, the user first registers the model of the card 17 to be tested on the computer device 11, and then the computer device 11 will find the measurement position associated with the card 17 to be tested in the storage unit 111 according to the registered data. Information 121. Then, according to the measurement position information 121 provided by the computer device 11, the data measurement unit 15 is connected to the signal measurement position 172/174/176 of the card 17 to be tested indicated by the measurement position data 121, and the test is to be tested. The signal 17 of the card 17 measures the measurement data 14 of the position 172/174/176 as shown in step 23.

電腦裝置11可透過資料傳輸單元13從數據量測單元15取得待測卡17的量測資料14,並進一步比對待測卡17的量測資料14及儲存單元111所儲存之預設資料123以產生一檢測結果,如步驟25所示。而後,依據於比對結果,決定是否更換待測卡17上的料件171/173/175,如步驟27 所示。 The computer device 11 can obtain the measurement data 14 of the card 17 to be tested from the data measurement unit 15 through the data transmission unit 13 and further compare with the measurement data 14 of the test card 17 and the preset data 123 stored in the storage unit 111. A test result is generated, as shown in step 25. Then, based on the comparison result, it is decided whether to replace the material 171/173/175 on the card to be tested 17, as in step 27 Shown.

在本發明一實施例中,待測卡17包括複數個料件171/173/175及複數個訊號量測位置172/174/176,其中各個料件171/173/175分別相對應於各個訊號量測位置172/174/176,例如包括第一料件171、第二料件173、第三料件175、第一訊號量測位置172、第二訊號量測位置174及第三訊號量測位置176,其中第一訊號量測位置172相對應於第一料件171,第二訊號量測位置174相對應於第二料件173,而第三訊號量測位置176則相對應於第三料件175。因此在實際應用時,可重複上述步驟21至步驟27,以檢測待測卡17上其他尚未經過檢測的料件171/173/175及/或訊號量測位置172/174/176。 In an embodiment of the invention, the card to be tested 17 includes a plurality of materials 171/173/175 and a plurality of signal measuring positions 172/174/176, wherein each of the materials 171/173/175 corresponds to each signal. The measurement position 172/174/176 includes, for example, a first material member 171, a second material member 173, a third material member 175, a first signal measurement position 172, a second signal measurement position 174, and a third signal measurement. Position 176, wherein the first signal measurement position 172 corresponds to the first material 171, the second signal measurement position 174 corresponds to the second material 173, and the third signal measurement position 176 corresponds to the third Material 175. Therefore, in actual application, the above steps 21 to 27 may be repeated to detect other untested materials 171/173/175 and/or signal measurement positions 172/174/176 on the card 17 to be tested.

在本發明一實施例中,電腦裝置10可比對待測卡17的量測資料14及儲存單元111所儲存之預設資料123間的差值是否在一預定數值範圍之內。當量測資料14與預設資料123間的差值在預定數值範圍之外(即大於此預定數值),代表待測卡17在此訊號量測位置172/174/176上之工作參數異常,則應更換相對應於該訊號量測位置172/174/176之料件171/173/175。 In an embodiment of the invention, the difference between the measurement data 14 of the card 17 to be tested and the preset data 123 stored in the storage unit 111 is within a predetermined range of values. The difference between the equivalent test data 14 and the preset data 123 is outside the predetermined value range (ie, greater than the predetermined value), and represents that the working parameter of the card 17 to be tested is abnormal at the signal measurement position 172/174/176. The material 171/173/175 corresponding to the signal measurement position 172/174/176 should be replaced.

反之,若量測資料14與預設資料123間的差值在預定數值範圍之內(即小於或是等於此預定數值),即代表待測卡17在此訊號量測位置172/174/176上之工作參數為正常,其相對應之料件171/173/175亦不需替換。電腦裝置11及/或操作人員可進一步判斷待測卡17是否還有其他訊號量測位置172/174/176及/或料件171/173/175需要檢測。 On the other hand, if the difference between the measurement data 14 and the preset data 123 is within a predetermined value range (ie, less than or equal to the predetermined value), it means that the card 17 to be tested is at the signal measurement position 172/174/176. The working parameters are normal, and the corresponding material 171/173/175 does not need to be replaced. The computer device 11 and/or the operator can further determine whether the card 17 to be tested has other signal measurement positions 172/174/176 and/or the materials 171/173/175 need to be detected.

請參閱第3圖所示,為本發明第三實施例之測試維修方法的步驟流程圖。並請配合參閱第1圖所示,在本發明實施例中電腦裝置11依據待測卡17的型號,提供相對應之量測位置資訊121,如步驟21所示。接 下來,可根據電腦裝置11提供的量測位置資訊121,將數據量測單元15連接量測位置資料121指示之待測卡17的訊號量測位置172/174/176,並擷取待測卡17之訊號量測位置172/174/176的量測資料14,如步驟23所示。電腦裝置11可透過資料傳輸單元13從數據量測單元15取得待測卡17的量測資料14,並進一步比對待測卡17的量測資料14及儲存單元111所儲存之預設資料123以產生一檢測結果,如步驟25所示。 Please refer to FIG. 3, which is a flow chart showing the steps of the test maintenance method according to the third embodiment of the present invention. In the embodiment of the present invention, the computer device 11 provides the corresponding measurement position information 121 according to the model of the card 17 to be tested, as shown in step 21. Connect The data measuring unit 15 is connected to the signal measuring position 172/174/176 of the card 17 to be tested indicated by the measuring position data 121 according to the measured position information 121 provided by the computer device 11, and the card to be tested is captured. The signal of 17 measures the measurement data 14 of the position 172/174/176, as shown in step 23. The computer device 11 can obtain the measurement data 14 of the card 17 to be tested from the data measurement unit 15 through the data transmission unit 13 and further compare with the measurement data 14 of the test card 17 and the preset data 123 stored in the storage unit 111. A test result is generated, as shown in step 25.

電腦裝置11及或操作人員可依據檢測結果是否符合要求,如步驟31所示,判斷待測卡17之訊號量測位置172/174/176及相對應之料件171/173/175是否損壞。若檢測結果不符合要求,例如檢測結果未落在預定數值範圍之內,便表示與該訊號量測位置172/174/176相對應之料件171/173/175損壞,並需要更換與訊號量測位置172/174/176相對應之料件171/173/175,如步驟27所示。在完成料件171/173/175的更換後,可進一步測試待測卡17是否正常運作,如步驟33所示。反之,若檢測結果符合要求,例如檢測結果落在預定數值範圍之內,便表示與該訊號量測位置172/174/176相對應之料件171/173/175未損壞,並可進一步測試待測卡17是否正常運作,如步驟33所示。 The computer device 11 and/or the operator can determine whether the signal measurement position 172/174/176 of the card 17 to be tested and the corresponding material 171/173/175 are damaged according to the detection result. If the test result does not meet the requirements, for example, if the test result does not fall within the predetermined value range, it means that the material 171/173/175 corresponding to the signal measurement position 172/174/176 is damaged and needs to be replaced with the signal quantity. The corresponding position 172/174/176 is measured as 171/173/175, as shown in step 27. After the replacement of the material 171/173/175 is completed, the card 17 to be tested can be further tested for normal operation, as shown in step 33. On the other hand, if the test result meets the requirements, for example, the test result falls within the predetermined value range, it means that the material 171/173/175 corresponding to the signal measurement position 172/174/176 is not damaged, and can be further tested. Test card 17 is operating normally, as shown in step 33.

測試待測卡17是否正常運作(步驟33)的方法,可以是但不限於將待測卡17裝載於測試治具(未顯示)上,透過測試治具提供待測卡17所需之訊號及電源,以測試待測卡17是否正常運作。例如當待測卡17為一顯示卡時,可將顯示卡裝載於測試治具上,且測試治具尚連接一顯示單元,並透連接測試治具的顯示單元所顯示的畫面判斷顯示卡是否正常運作。維修完成的同時,使用者可將所替換之料件171/173/175、相對應之量測位置資訊121、相對應的量測資料14及/或相對應的檢測結果記錄於電腦裝置11之儲存單元111內,以作為將來待測卡17維修的參考。 The method of testing whether the card 17 to be tested is normally operated (step 33) may be, but not limited to, loading the card 17 to be tested on a test fixture (not shown), and providing the signal required for the card 17 to be tested through the test fixture and Power supply to test whether the card under test 17 is operating normally. For example, when the card to be tested 17 is a display card, the display card can be loaded on the test fixture, and the test fixture is still connected to a display unit, and the screen displayed by the display unit of the test fixture is connected to determine whether the display card is working normally. While the repair is completed, the user can record the replaced material 171/173/175, the corresponding measurement position information 121, the corresponding measurement data 14 and/or the corresponding detection result in the computer device 11 The storage unit 111 is used as a reference for the maintenance of the card 17 to be tested in the future.

若測試待測卡17可正常運作,便已完成待測卡17之檢測及維修的動作。反之,若待測卡17仍無法正常運作,則表示待測卡17上仍有損壞的料件171/173/175,此時將會重複步驟21至步驟33,並依據電腦裝置11的指示量測待測卡17上其它的訊號量測位置172/174/176,以找出及更換待測卡17上其他損壞的料件171/173/175,直到待測卡17可正常運作。 If the test card 17 is in normal operation, the detection and maintenance of the card 17 to be tested has been completed. On the other hand, if the card to be tested 17 still fails to operate normally, it means that there is still a damaged material 171/173/175 on the card to be tested 17, and then steps 21 to 33 will be repeated, and according to the instruction of the computer device 11, The other signal measurement positions 172/174/176 on the test card 17 are measured to find and replace other damaged materials 171/173/175 on the card 17 to be tested until the card 17 to be tested can operate normally.

請參閱第4A及4B圖所示,為本發明第四實施例之測試維修方法的步驟流程圖。本實施例包括第三實施例之測試維修步驟,如步驟21、23、25、31、27及33,上述步驟已揭露於本發明第三實施例及第3圖中,在此便不再贅述。請配合參閱第1圖,本發明實施例還包括其他的步驟,主要是透過電腦裝置11提供維修資訊125,而使用者則透過維修資訊125,找出待測卡17上可能需要測試或維修之訊號量測位置172/174/176及/或料件171/173/175。 Please refer to FIGS. 4A and 4B for a flow chart of the steps of the test and maintenance method according to the fourth embodiment of the present invention. This embodiment includes the test and maintenance steps of the third embodiment, such as steps 21, 23, 25, 31, 27, and 33. The above steps have been disclosed in the third embodiment and the third embodiment of the present invention, and will not be described herein. . With reference to FIG. 1 , the embodiment of the present invention further includes other steps, mainly through providing the maintenance information 125 through the computer device 11 , and the user uses the maintenance information 125 to find out that the test card 17 may need to be tested or repaired. Signal measurement position 172/174/176 and/or material 171/173/175.

在測試待測卡17是否正常運作時,如步驟33所示,若測試結果為待測卡17未能正常運作時,電腦裝置11可進一步判斷是否還有其他未經過量測的量測位置資訊121,如步驟41所示,若電腦裝置11判斷仍有其他未經過量測的量測位置資訊121,便提供其他未量測的量測位置資訊121,並重複步驟23至33。反之,若電腦裝置11判斷沒有其他未經過量測的量測位置資訊121,則會進一步提供維修資訊125,如步驟42所示。 When the test card 17 is tested for normal operation, as shown in step 33, if the test result is that the card to be tested 17 fails to operate normally, the computer device 11 can further determine whether there are other measured position information without over-measurement. 121. As shown in step 41, if the computer device 11 determines that there are still other measurement position information 121 that has not been over-measured, other unmeasured measurement position information 121 is provided, and steps 23 to 33 are repeated. On the other hand, if the computer device 11 determines that there is no other measurement location information 121 that has not been over-measured, the maintenance information 125 is further provided, as shown in step 42.

在本發明一實施例中,電腦裝置11可依據先前的維修記錄提供維修資訊125,其中維修記錄包含先前已量測之待測卡17的訊號量測位置172/174/176及相對應的量測資料14。維修資訊125則包括相同或相似之待測卡17的維修記錄,例如量測位置資訊及其相對應的料件。在不同實施例中,維修記錄亦可包括待測卡17之線路圖及料件171/173/175預定位置等等。 In an embodiment of the present invention, the computer device 11 can provide the maintenance information 125 according to the previous maintenance record, wherein the maintenance record includes the signal measurement position 172/174/176 of the previously measured card 17 to be tested and the corresponding amount. Test data 14. The maintenance information 125 includes maintenance records of the same or similar card 17 to be tested, such as measurement location information and its corresponding material. In various embodiments, the maintenance record may also include a circuit diagram of the card 17 to be tested and a predetermined location of the material 171/173/175, and the like.

使用者可依據電腦裝置11所提供之維修資訊125,來分析待測卡17可能的損壞原因及可能損壞之料件171/173/175,例如多數的待測卡17曾替換過A料件,而此待測卡17之前並未量測A料件相對應的訊號量測位置,則使用者可以將A料件視為一可能損壞部位,並量測相對應於A料件之訊號量測位置。另外,維修資訊可以讓使用者檢查待測卡17是否有線路連接或是料件位置擺放錯誤的問題。換言之,使用者可依據電腦裝置11所提供的維修資訊125,量測待測卡17未經過量測之訊號量測位置及/或相對應的料件,並得到該訊號量測位置及/或相對應之料件的量測資料14,如步驟43所示。 The user can analyze the possible damage reason of the card 17 to be tested and the damaged parts 171/173/175 according to the maintenance information 125 provided by the computer device 11. For example, most of the cards 17 to be tested have replaced the A material. The test card 17 does not measure the corresponding signal measurement position of the A material component, and the user can regard the A material component as a possible damage location, and measure the signal corresponding to the A component. position. In addition, the maintenance information allows the user to check whether the card 17 to be tested has a line connection or a problem in which the position of the material is placed incorrectly. In other words, the user can measure the signal measurement position of the test card 17 without over-measurement and/or the corresponding material according to the maintenance information 125 provided by the computer device 11, and obtain the signal measurement position and/or The measurement data 14 of the corresponding material is as shown in step 43.

電腦裝置11可記錄訊號量測位置172/174/176、相對應的料件171/173/175及/或量測資料14,例如將上述資料儲存在儲存單元111內,並建立新的量測位置資訊121、預設資料123及/或量測資料14。透過更新量測位置資訊121、預設資料123及/或量測資料14,將可進一步增加電腦裝置11所能提供的資料,以利於後續的使用者應用新的量測位置資訊121、預設資料123及/或量測資料14檢測待測板17,藉此以提高待測卡17的檢測效率。 The computer device 11 can record the signal measurement position 172/174/176, the corresponding material 171/173/175 and/or the measurement data 14, for example, storing the above data in the storage unit 111, and establishing a new measurement. Location information 121, preset data 123, and/or measurement data 14. By updating the measurement location information 121, the preset data 123 and/or the measurement data 14, the data that can be provided by the computer device 11 can be further increased, so that the subsequent user can apply the new measurement location information 121 and preset. The data 123 and/or the measurement data 14 detects the board 17 to be tested, thereby improving the detection efficiency of the card 17 to be tested.

綜上所述,本發明提供一待測卡17的測試維修系統及測試維修方法,使用者可透過電腦裝置11提供的量測位置資訊121,按部就班的完成簡易之待測卡17的測試及維修。此外使用者亦可藉由電腦裝置11提供之相關維修資訊125,分析先前待測卡17可能損壞的原因及料件。更可進一步將所有維修記錄儲存在電腦裝置11之儲存單元111內,例如可產生新的量測位置資訊121及/或預設資料123以提供後續維修使用。隨著量測記錄的累積,將可使得本發明所述之測試維修系統及測試維修方法更加完善,並提高本系統及方法的適用範圍將可達到每個人只要使用此系統就 可以進行維修。 In summary, the present invention provides a test maintenance system and a test maintenance method for a card 17 to be tested. The user can perform the test and maintenance of the simple test card 17 through the measurement position information 121 provided by the computer device 11. . In addition, the user can also analyze the cause of the possible damage to the card 17 to be tested and the materials by using the related maintenance information 125 provided by the computer device 11. Further, all maintenance records can be further stored in the storage unit 111 of the computer device 11, for example, new measurement location information 121 and/or preset data 123 can be generated to provide subsequent maintenance use. With the accumulation of measurement records, the test maintenance system and test maintenance method described in the present invention can be improved, and the application range of the system and method can be improved, and everyone can use the system as long as they use the system. Can be repaired.

在本發明中所述之連接指的是一個或多個物體或構件之間的直接連接或者是間接連接,例如可在一個或多個物體或構件之間存在有一個或多個中間連接物。 A connection as referred to in the present invention refers to a direct connection or an indirect connection between one or more objects or members, for example one or more intermediate connections may be present between one or more objects or members.

說明書之系統中所描述之也許、必須及變化等字眼並非本發明之限制。說明書所使用的專業術語主要用以進行特定實施例的描述,並不為本發明的限制。說明書所使用的單數量詞(如一個及該個)亦可為複數個,除非在說明書的內容有明確的說明。例如說明書所提及之一個裝置可包括有兩個或兩個以上之裝置的結合,而說明書所提之一物質則可包括有多種物質的混合。 The words "may," and "changes" described in the system of the specification are not limitations of the invention. The technical terms used in the specification are mainly for the description of specific embodiments and are not intended to be limiting. The single quantifiers (such as one and the one) used in the specification may also be plural, unless explicitly stated in the contents of the specification. For example, a device referred to in the specification may include a combination of two or more devices, and one of the materials mentioned in the specification may include a mixture of a plurality of substances.

以上所述者,僅為本發明之較佳實施例而已,並非用來限定本發明實施之範圍,即凡依本發明申請專利範圍所述之形狀、構造、特徵及精神所為之均等變化與修飾,均應包括於本發明之申請專利範圍內。 The above is only the preferred embodiment of the present invention, and is not intended to limit the scope of the present invention, that is, the variations, modifications, and modifications of the shapes, structures, features, and spirits described in the claims of the present invention. All should be included in the scope of the patent application of the present invention.

10‧‧‧測試維修系統 10‧‧‧Test maintenance system

11‧‧‧電腦裝置 11‧‧‧Computer equipment

111‧‧‧儲存單元 111‧‧‧ storage unit

121‧‧‧量測位置資訊 121‧‧‧Measurement location information

123‧‧‧維修資訊 123‧‧‧Maintenance information

13‧‧‧資料傳輸單元 13‧‧‧Data Transfer Unit

14‧‧‧量測資料 14‧‧‧Measurement data

15‧‧‧數據量測單元 15‧‧‧Data Measurement Unit

17‧‧‧待測卡 17‧‧‧Test card

171‧‧‧料件 171‧‧‧Materials

172‧‧‧訊號量測位置 172‧‧‧ Signal measurement position

173‧‧‧料件 173‧‧‧Materials

174‧‧‧訊號量測位置 174‧‧‧ Signal measurement position

175‧‧‧料件 175‧‧‧Materials

176‧‧‧訊號量測位置 176‧‧‧ Signal measurement position

19‧‧‧測試訊號供給單元 19‧‧‧Test signal supply unit

Claims (16)

一種測試維修系統,包括:一數據量測單元,連接一待測卡之至少一訊號量測位置,並由該待測卡之訊號量測位置擷取至少一量測資料;一資料傳輸單元,連接該數據量測單元;及一電腦裝置,連接該資料傳輸單元,並包括一儲存單元,儲存至少一預設資料及至少一量測位置資訊,其中該量測位置資訊包括該待測卡之該訊號量測位置,而該電腦裝置則透過該資料傳輸單元由該數據量測單元取得該量測資料,並比對該量測資料及相對應的該預設資料,以產生一檢測結果。 A test maintenance system includes: a data measurement unit that connects at least one signal measurement position of a card to be tested, and extracts at least one measurement data from a signal measurement position of the card to be tested; a data transmission unit, Connecting the data measuring unit; and a computer device connected to the data transmission unit, and including a storage unit, storing at least one preset data and at least one measurement location information, wherein the measurement location information includes the card to be tested The signal measuring position, and the computer device obtains the measurement data from the data measurement unit through the data transmission unit, and compares the measurement data with the corresponding preset data to generate a detection result. 如請求項1之測試維修系統,尚包括一測試訊號供給單元連接該待測卡,並向該待測卡提供一測試訊號。 The test maintenance system of claim 1 further includes a test signal supply unit connected to the test card and providing a test signal to the test card. 如請求項1之測試維修系統,其中該電腦裝置依據該待測卡的型號,於該儲存單元中找出相對應的該預設資料及該量測位置資訊。 The test and repair system of claim 1, wherein the computer device finds the corresponding preset data and the measured position information in the storage unit according to the model of the card to be tested. 如請求項3之測試維修系統,其中該數據量測單元依據該量測位置資訊連接該待測卡上相對應的該訊號量測位置。 The test maintenance system of claim 3, wherein the data measurement unit connects the corresponding measurement position of the signal on the card to be tested according to the measurement location information. 如請求項1之測試維修系統,其中該數據量測單元為一介面示波器。 The test maintenance system of claim 1, wherein the data measurement unit is an interface oscilloscope. 如請求項1之測試維修系統,其中該量測資料為電壓值或波形圖。 The test maintenance system of claim 1, wherein the measurement data is a voltage value or a waveform diagram. 如請求項1之測試維修系統,其中該待測卡包括複數個料件及複數個訊號量測位置,且該各個料件分別對應於該至少一訊號量測位置。 The test maintenance system of claim 1, wherein the card to be tested comprises a plurality of material parts and a plurality of signal measurement positions, and the respective material parts respectively correspond to the at least one signal measurement position. 如請求項7之測試維修系統,其中該儲存單元儲存至少一維修資訊,該維修資訊包括相同或相似之待測卡的該量測位置資訊、相對應的該料件及該預設資料。 The test maintenance system of claim 7, wherein the storage unit stores at least one maintenance information, the repair information including the measurement position information of the same or similar card to be tested, the corresponding material and the preset data. 如請求項8之測試維修系統,其中該維修資訊還包括該待測卡之線路圖及料件的位置。 The test maintenance system of claim 8, wherein the maintenance information further includes a circuit diagram of the card to be tested and a location of the material. 一種測試維修方法,包括以下步驟:依據一待測卡的型號,提供該待測卡的至少一量測位置資訊;依據該量測位置資訊,對該待測卡的至少一訊號量測位置進行量測,並擷取至少一量測資料;及比對該量測資料及至少一預設資料,並產生一檢測結果。 A test and maintenance method includes the following steps: providing at least one measurement position information of the card to be tested according to a model of the card to be tested; and performing at least one measurement position of the card to be tested according to the measurement position information Measuring, and taking at least one measurement data; and comparing the measurement data and at least one preset data, and generating a detection result. 如請求項10之測試維修方法,還包括以下步驟:依據該檢測結果,更換該待測卡的至少一料件。 The test and repair method of claim 10, further comprising the step of: replacing at least one component of the card to be tested according to the detection result. 如請求項11之測試維修方法,還包括以下步驟:測試該待測卡是否正常運作。 The test and repair method of claim 11 further includes the following steps: testing whether the card to be tested is operating normally. 如請求項12之測試維修方法,其中該待測卡包括複數個料件及複數個訊號量測位置,且該各個料件分別對應於該至少一訊號量測位置。 The test and repair method of claim 12, wherein the card to be tested comprises a plurality of materials and a plurality of signal measurement locations, and the respective components respectively correspond to the at least one signal measurement location. 如請求項13之測試維修方法,還包括以下步驟:判斷該待測卡是否存在其他未經過量測之該訊號量測位置。 The test and repair method of claim 13, further comprising the step of: determining whether the card to be tested has other signal measurement positions that are not over-measured. 如請求項14之測試維修方法,還包括以下步驟:提供該顯示卡之一維修資訊,其中該維修資訊包括相同或相似之待測卡的該量測位置資訊、相對應的該料件及該預設資料。 The test and repair method of claim 14, further comprising the steps of: providing one of the display card maintenance information, wherein the repair information includes the measured position information of the same or similar card to be tested, the corresponding material, and the Preset data. 如請求項15之測試維修方法,其中該維修資訊還包括該待測卡之線路圖及該料件的位置。 The test maintenance method of claim 15, wherein the maintenance information further includes a circuit diagram of the card to be tested and a location of the material.
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