TWI441018B - System and method for testing a motherboard - Google Patents

Description

Motherboard test system and method

The invention relates to a test system and method, in particular to a motherboard test system and method.

With the development of electronic science and technology, motherboards have become an indispensable part of various electrical equipment (such as computers). Due to various factors such as aging of components, to ensure the reliability of the motherboard when it is used, it must be tested at the factory. In the past, the traditional detection method relied on the manual operation of the operator. Due to the wide range of detection and many functions, it is often too busy to be tested. It is not only labor intensive, but also inefficient, and prone to human error. The information is also difficult to manage.

In view of the above, it is necessary to provide a motherboard test system and method that can automatically test a motherboard.

A motherboard testing system includes a test computer and an oscilloscope. The test computer is connected to a control computer and an oscilloscope through a switch. The test computer includes a parameter setting module for setting test parameters of the motherboard, and the test parameters include: Measuring the coordinate position of the part in the motherboard, the test signal sequence of the part to be tested, the items to be tested for each test signal, the standard value of each test item, and the storage path of the test result; the parameter acquisition module is used when the test starts. When obtaining the test signal of the part to be tested The sequence and each test signal need to be tested; the probe positioning module is configured to issue a probe positioning instruction to the control computer according to the coordinate position of the part to be tested in the motherboard; the control computer controls according to the probe positioning instruction The probe gripping device of the robot arm positions the probe of the oscilloscope to the part to be tested on the motherboard; the test computer further includes: a signal test module, which is used to test each test signal of the part to be tested in succession, and obtain The oscilloscope collects the test data of each test item; the signal test module is further configured to analyze the test data according to the set standard value of each test item to determine whether the test data of each test item is set. Within the standard value range, the signal test module is further configured to collect all test data and analysis results when all the test signals are tested, and store them in the set test result storage path.

A motherboard testing method includes the following steps: setting a motherboard testing parameter in a testing computer, the testing parameters including: a coordinate position of the component to be tested in the motherboard, a test signal sequence of the component to be tested, and each test signal required Test item, standard value of each test item and storage path of test result; when the test starts, the test computer obtains the test signal sequence of the part to be tested and the item to be tested for each test signal; the test computer is based on the part to be tested The coordinate position of the board sends a probe positioning command to the control computer through the switch; the control computer controls the probe gripping device of the robot arm according to the probe positioning instruction to position the probe of the oscilloscope to the part to be tested on the motherboard; the oscilloscope The test data of each test item collected is returned to the test computer through the switch; the test computer sequentially tests each test signal of the test part, and analyzes the test data according to the set standard value of each test item to determine Whether the test data of each test item is within the set standard value range ; All test signal when the test is completed, the test computer and the aggregate of all test results, and stores it in the test results are stored in the path setting.

Compared with the prior art, the motherboard testing system and method can automatically test the motherboard, avoiding the occurrence of errors in manual operations, and improving the reliability and efficiency of the testing.

1‧‧‧Control computer

2‧‧‧Test computer

3‧‧‧Oscilloscope

4‧‧‧Switch

5‧‧‧ Robotic arm

6‧‧‧ motherboard

7‧‧‧Testing machine

20‧‧‧ motherboard test system

50‧‧‧Probe grabbing device

201‧‧‧ parameter setting module

202‧‧‧ parameter acquisition module

203‧‧‧Probe positioning module

204‧‧‧Signal Test Module

S41‧‧‧Set test parameters

S42‧‧‧Get the test signal sequence of the parts to be tested and the items to be tested for each test signal

S43‧‧‧ Position the probe of the oscilloscope to the position of the part to be tested on the motherboard

S44‧‧‧ Test each test signal in turn

S45‧‧‧Get test data and store

S46‧‧‧Analysis and storage of test data

S47‧‧‧All test signals have been tested

S48‧‧·Consolidation of all test data and storage

1 is a hardware architecture diagram of a preferred embodiment of a motherboard test system of the present invention.

2 is a functional block diagram of the motherboard test system shown in FIG. 1.

3 is a flow chart of a preferred embodiment of a motherboard testing method of the present invention.

Referring to FIG. 1, a system architecture diagram of a preferred embodiment of the motherboard test system of the present invention is shown. The system mainly includes a control computer 1, a test computer 2, an oscilloscope 3, a switch 4, a robot arm 5, and a motherboard 6 to be tested. The control computer 1, the test computer 2 and the oscilloscope 3 are connected through a switch 4, and the test board 2 is equipped with a motherboard test system 20. A probe gripping device 50 for gripping the probe of the oscilloscope 3 is mounted on the robot arm 5. The motherboard 6 is placed on the test machine 7.

When the test starts, the motherboard test system 20 issues a probe positioning command to the control computer 1, and the control computer 1 controls the probe gripping device 50 of the robot arm 5 to position the probe of the oscilloscope 3 according to the probe positioning command. The part to be tested on the motherboard 6. Then, the oscilloscope 3 returns the tested data to the test computer 2 through the switch 4. The motherboard test system 20 in the test computer 2 analyzes the test data.

Referring to FIG. 2, a functional module diagram of the motherboard test system 20 shown in FIG. The motherboard testing system 20 includes a parameter setting module 201, a parameter acquisition module 202, a probe positioning module 203, and a signal testing module 204. The module referred to in the present invention is completed A particular functional computer program segment is more suitable than a program to describe the execution of a software in a computer, and thus is described in the following description of the software in the present invention.

The parameter setting module 201 is configured to set test parameters of the motherboard 6 and store the test parameters in a storage body of the test computer 2 (such as a hard disk). The test parameters include: a coordinate position of the part to be tested in the motherboard 6, a test signal sequence of the part to be tested, an item to be tested for each test signal, a standard value of each test item, and a storage path of the test result. The test signal sequence of the component to be tested includes a voltage signal, a periodic frequency signal, and a time when the voltage is maintained at a high level. For example, voltage signal test items include Overshoot, Undershoot, Slew Rate, Rise Time, Fall Time, or Duty Cycle Distortion. . In the present embodiment, a signal sequence of one component on the test board 6 is taken as an example for description.

The parameter obtaining module 202 is configured to acquire a test signal sequence of the part to be tested and an item to be tested for each test signal from the storage body when the test starts.

The probe positioning module 203 is configured to calculate the offset of the component to be tested to the origin according to the coordinate position of the component to be tested in the motherboard 6, and issue a probe positioning instruction to the control computer 1. Wherein, the probe positioning instruction includes an offset of the part to be tested to the origin. In the present embodiment, the coordinate system is established with the center of the main board 6 as the origin, and the initial position of the probe gripping device 50 is positioned at the origin position of the coordinate system.

The control computer 1 controls the probe gripping device 50 of the robot arm 5 to position the probe of the oscilloscope 3 to the part to be tested on the motherboard 6 according to the probe positioning command. Assuming that the coordinate position of the part to be tested is (10, 12) in the main board 6, the unit is millimeter (mm), the X-axis offset of the part to be tested to the origin is 10 mm, and the offset of the Y-axis is 12 Millimeter. After the control computer 1 receives the probe positioning command sent by the probe positioning module 203, the probe grasping device 50 of the control robot 5 moves the probe of the oscilloscope 3 10 mm in the positive direction of the X axis along the Y axis. Move 12 mm in the positive direction and position the coordinates of the part to be tested in the main board 6. The Z-axis coordinate of the part to be tested in the coordinate system is zero, and the control computer 1 will control the probe of the oscilloscope 3 to move in the Z-axis direction according to the height of the probe grasping device 50 with respect to the part to be tested.

The signal test module 204 is configured to sequentially test each test signal of the component to be tested, obtain test data collected by the oscilloscope 3 for each test item, and store the test data in the set test result storage path. For example, set the test result storage path to: D:\Motherboard\Test.

The signal test module 204 is further configured to analyze the test data according to the set standard value of each test item to determine whether the test data of each test item is within a set standard value range, and store the analysis result to The set test result is stored in the path. For example, set the high-level standard value of the voltage of the part to be tested to [5, 30] in volts. If the voltage collected by the oscilloscope 3 is at a high level of 4.5 volts, the signal test module 204 determines that the test data is unqualified.

The signal test module 204 is further configured to determine whether all test signals have been tested. If there is still a test signal to be tested, the test is continued. If all the test signals have been tested, all the test data are collected and stored in the set. The test results are stored in the path.

Referring to FIG. 3, it is a flow chart of a preferred embodiment of the motherboard testing method of the present invention.

Step S41, the parameter setting module 201 sets the test parameters of the motherboard 6, and the test is performed. The test parameters are stored in the storage of the test computer 2. The test parameters include: a coordinate position of the part to be tested in the motherboard 6, a test signal sequence of the part to be tested, an item to be tested for each test signal, a standard value of each test item, and a storage path of the test result. The test signal sequence of the component to be tested includes a voltage signal, a periodic frequency signal, and a time when the voltage is maintained at a high level. In the present embodiment, a signal sequence of one component on the test board 6 is taken as an example for description.

In step S42, when the test starts, the parameter acquisition module 202 acquires the test signal sequence of the part to be tested and the item to be tested for each test signal from the storage body.

In step S43, the probe positioning module 203 calculates the offset of the component to be tested to the origin according to the coordinate position of the component to be tested in the motherboard 6, and issues a probe positioning instruction to the control computer 1. Wherein, the probe positioning instruction includes an offset of the part to be tested to the origin. In the present embodiment, the coordinate position is determined by establishing a coordinate system with the center of the motherboard 6 as an origin, and the initial position of the probe grasping device 50 is positioned at the origin position of the coordinate system.

The control computer 1 controls the probe gripping device 50 of the robot arm 5 to position the probe of the oscilloscope 3 to the part to be tested on the motherboard 6 according to the probe positioning command.

In step S44, the signal testing module 204 sequentially tests each test signal of the part to be tested.

In step S45, the signal testing module 204 acquires the test data collected by the oscilloscope 3 for each test item, and stores it in the set test result storage path. For example, set the test result storage path to: D:\Motherboard\Test.

In step S46, the signal testing module 204 is further configured to analyze the test data according to the set standard value of each test item to determine whether the test data of each test item is Within the set standard value range, the analysis results are stored in the set test balance path. For example, the standard value range for setting the voltage to maintain high time is [1, 5] in seconds. If the voltage collected by the oscilloscope 3 is maintained at a high level for 0.5 seconds, the signal test module 204 determines that the test data is unqualified.

In step S47, the signal testing module 204 determines whether all test signals have been tested. If there is still a test signal to be tested, the flow returns to step S44 to continue testing the next test signal. If all the test signals have been tested, step S48 is performed. In the present embodiment, the number of tests of the test signal is recorded by the variable i, and the initial value of the variable i is equal to 1, and the value of the variable i is incremented by one every time a test signal is tested. Assume that the number of test signals in the test signal sequence is N. If i is greater than or equal to N, the signal test module 204 determines that all test signals have been tested.

In step S48, the signal testing module 204 integrates all the test data and stores them in the set test result storage path.

This embodiment is described by taking a part to be tested as an example. If the main board 6 contains more than two parts to be tested, after testing a part to be tested, the probe positioning module 203 will be based on the next one. The coordinate position of the part in the motherboard 6 is measured, the offset of the next part to be tested to the current coordinate position is calculated, and a probe positioning command is issued to the control computer 1. Wherein, the probe positioning instruction includes an offset of the part to be tested to a current coordinate position. The control computer 1 controls the probe gripping device 50 of the robot arm 5 to position the probe of the oscilloscope 3 to the next part to be tested on the motherboard 6 according to the offset, and starts the next test flow. The description of 3 is not repeated here.

It should be noted that the above embodiments are merely illustrative of the technical solutions of the present invention and are not intended to be limiting, although the present invention is described in detail with reference to the preferred embodiments. A person skilled in the art should understand that the technical solutions of the present invention may be modified or equivalently substituted without departing from the spirit and scope of the technical solutions of the present invention.

S41‧‧‧Set test parameters

S42‧‧‧Get the test signal sequence of the parts to be tested and the items to be tested for each test signal

S43‧‧‧ Position the probe of the oscilloscope to the position of the part to be tested on the motherboard

S44‧‧‧ Test each test signal in turn

S45‧‧‧Get test data and store

S46‧‧‧Analysis and storage of test data

S47‧‧‧All test signals have been tested

S48‧‧·Consolidation of all test data and storage

Claims (6)

A motherboard test system includes a test computer and an oscilloscope, wherein the test computer is connected to a control computer and an oscilloscope through a switch, and the test computer includes: a parameter setting module, configured to set test parameters of the motherboard, wherein the test parameters include : the coordinate position of the part to be tested in the motherboard, the test signal sequence of the part to be tested, the item to be tested for each test signal, the standard value of each test item, and the storage path of the test result; the parameter acquisition module is used when At the beginning of the test, the test signal sequence of the part to be tested and the item to be tested for each test signal are obtained; the probe positioning module is configured to calculate the part to be tested to the original according to the coordinate position of the part to be tested in the motherboard The offset of the point, the coordinate position is determined by establishing a coordinate system with the center of the motherboard as an origin, and the initial position of the probe grasping device is positioned at the origin position of the coordinate system; the probe positioning module, Also used to issue a probe positioning command to the control computer through the switch, the probe positioning command including an offset of the part to be tested to the origin; The computer is used to control the probe gripping device of the robot arm according to the probe positioning instruction to position the probe of the oscilloscope to the part to be tested on the motherboard; the test computer further includes: a signal test module, which is used to treat Each test signal of the test part is tested to obtain test data of each test item collected by the oscilloscope; the signal test module is further configured to analyze the test data according to the set standard value of each test item, Determining whether the test data of each test item is within a set standard value range; and the signal test module is further configured to collect all test data and analysis results when all test signal tests are completed, and store them in The set test result is stored in the path. The motherboard test system of claim 1, wherein the test signal sequence of the component to be tested includes a voltage signal, a periodic frequency signal, and a time when the voltage is maintained at a high level. The motherboard test system of claim 1, wherein the probe positioning module is further configured to: when the motherboard includes more than two parts to be tested, if the first test is to be tested After the part, according to the coordinate position of the next part to be tested in the motherboard, calculate the offset of the next part to be tested to the current coordinate position; and issue a probe positioning instruction to the control computer, the probe positioning instruction includes Measures the offset of the part to the current coordinate position. A motherboard testing method, the method comprising the steps of: setting a motherboard test parameter in a test computer, the test parameter comprising: a coordinate position of the component to be tested in the motherboard, a test signal sequence of the component to be tested, and each test The signal needs to be tested, the standard value of each test item and the storage path of the test result; when the test starts, the test computer obtains the test signal sequence of the part to be tested and the item to be tested for each test signal; the test computer is based on the part to be tested Calculating the offset of the part to be tested to the origin at the coordinate position in the motherboard, the coordinate position is determined by establishing a coordinate system with the center of the motherboard as the origin, and the initial position of the probe grasping device Positioning at the origin position of the coordinate system; issuing a probe positioning command to the control computer through the switch, the probe positioning command includes an offset of the part to be tested to the origin; the control computer controls the probe of the robot arm according to the probe positioning instruction The grab device positions the probe of the oscilloscope to the part to be tested on the motherboard; each oscilloscope collects each test through the switch The project test data is returned to the test computer; computer test test test signals in order to treat each part of the test, each test according to the set The standard value of the test item is used to analyze the test data to determine whether the test data of each test item is within the set standard value; and when all test signals are tested, the test computer collects all test data and analysis results, and Store it in the set test result storage path. The method for testing a motherboard according to claim 4, wherein the test signal sequence of the component to be tested includes a voltage signal, a periodic frequency signal, and a time when the voltage is maintained at a high level. The method for testing a motherboard according to claim 4, further comprising the steps of: when the motherboard contains more than two parts to be tested, if the first part to be tested is tested, the test computer is Calculating the offset of the next part to be tested to the current coordinate position of the part to be tested in the coordinate position of the part to be tested; and issuing a probe positioning instruction to the control computer, the probe positioning instruction including the part to be tested to the current coordinate The offset of the position.