TW201518713A - Cooling testing system in server - Google Patents

Abstract

A cooling testing system includes a PC, a MCU (Micro Control Unit), a temperature sensing module, a plurality of cooling fans, a switch module, and a heating module. The PC defines a inputting window for inputting pre-set parameters. The heating module includes a plurality of heating resistors arranged in matrix. The switch module includes a plurality of switches controlling the plurality of heating resistors. The MCU turns on some of the plurality of switches corresponding to the heating resistors corresponding to pre-set positions of heating components according to the pre-set parameters, so that the heating resistors operate to generate heats to simulate the heating components. The MCU controls fans to operate in a pre-set speed according to the pre-set parameters. The temperature sensing module senses temperatures of positions of the heating components to the MCU. The MCU compares the temperatures to a pre-set of the pre-set parameters and displays the comparing result on a screen.

Description

Server heat dissipation detection system

The invention relates to a detection system, in particular to a server heat dissipation detection system.

In the development process of PC and server systems, the reasonable estimation and design of the system heating and cooling modules in advance is a key factor for the successful completion of new product development and saving research and development costs. The method of estimating the knowledge requires engineers to spend a lot of time and money to develop multiple systems, do various experiments to determine the selection, installation and speed of the system fan, and estimate the heat dissipation of the system through numerous test data. . However, this method greatly increases the complexity of the design and increases the design development cycle and design cost. Since each design must develop a system, this greatly reduces the integrity of the verification.

In view of the above, it is necessary to provide a server heat dissipation detection system that is applicable to multiple server systems.

A server heat dissipation detecting system includes a user terminal, an MCU, a temperature sensing module, and a plurality of fans for dissipating heat, the user terminal is provided with a user interface, and the user interface is configured to input preset parameters, the MCU Connecting the user terminal, the fan, and the temperature sensing module, the server heat dissipation detecting system further includes a switch module and a heat generating module, wherein the heat generating module includes a plurality of heating resistors arranged in a matrix The switch module includes a plurality of switches for controlling the on/off of the heating resistor, the switch is connected to the MCU, and the MCU opens a heat corresponding to a preset position of the heating element according to the preset parameter. a corresponding switch of the resistor, so that the heating element corresponding to the preset position works to simulate heat generated by the heating element, and the MCU controls the fan to operate at a preset speed according to the preset parameter to the heating resistor Performing heat dissipation, the temperature sensing module is configured to sense a temperature at the heating resistor and transmit the temperature to the MCU, and the MCU receives the temperature and the preset parameter One of the preset temperature is compared, and the comparison of the results displayed on a display screen, the default speed of the simulated position of the heating element of the heating resistor and is used to determine the cooling fan of whether the requirements of.

Compared with the prior art, in the above-mentioned server heat dissipation detecting system, the plurality of heating resistors are distributed in a matrix on a motherboard. Therefore, the plurality of heating resistors can substantially cover all positions of the motherboard. For different server systems, the number and position of the required heating resistors can be adjusted according to the preset positions of different heating elements, and the detection results of the estimated heat dissipation system are obtained by the control of the MCU.

10‧‧‧MCU

11‧‧‧I2C module

13‧‧‧PWM module

15‧‧‧Control Module

20‧‧‧Switch Module

21‧‧‧ switch

211‧‧‧Control terminal

212‧‧‧First connection

213‧‧‧second connection

30‧‧‧heating module

50‧‧‧Temperature Sensing Module

51‧‧‧temperature sensor

513‧‧‧ probe

70‧‧‧Fan module

71~78‧‧‧fan

90‧‧‧ imaging module

91‧‧‧Infrared sensor

93‧‧‧ Thermal imaging unit

100‧‧‧User terminal

101‧‧‧User interface

103‧‧‧Input device

200‧‧‧ display screen

1 and 2 are schematic diagrams showing circuit connections of a preferred embodiment of the server heat dissipation detecting system of the present invention.

3 is a block diagram showing a connection of a preferred embodiment of the server heat dissipation detecting system of the present invention.

Figure 4 is a schematic illustration of the switch of Figure 1.

Referring to FIG. 1-3, in a preferred embodiment of the present invention, a server heat dissipation detecting system includes an MCU (Micro Control Unit) 10. The MCU 10 is externally connected with a switch module 20, a heat generating module 30, a temperature sensing module 50, a fan module 70, an imaging module 90, and a user terminal 100.

Referring to FIG. 4 at the same time, the switch module 20 includes 16 switches 21 . The heating module 30 includes 16 heating resistors R1 R R16. Each switch 21 controls an open/close state of the heat generating resistors R1 to R16. The switch 21 and the heating resistors R1 R R16 are mounted on one of the servo boards (not shown). Each switch 21 includes a control terminal 211, a first connection terminal 212, and a second connection terminal 213. When the control terminal 211 receives the high level signal, the switch 21 connects the first connection end 212 and the second connection end 213. When the control terminal 211 receives the low level signal, the switch 21 disconnects the first connection end 212 and the second connection end 213; the second connection end 213 of each switch 21 is connected to a heat generating resistor R1 R R16 The first connection end 212 is connected to the output of a power supply. The heating resistors R1 R R16 are arranged in a matrix of four rows and four columns to uniformly cover the position of the motherboard. The first row of the first row is the heating resistor R1, the second row of the first row is the heating resistor R2, the third row of the first row is the heating resistor R4, the fourth row of the fourth row is the heating resistor R4, the first row of the second row For the heating resistor R5, the second row and the second column are the heating resistors R6, the second row and the third column are the heating resistors R7, the second row and the fourth column are the heating resistors R8, and the third row and the first column are the heating resistors R9, The third row and the second column are the heating resistors R10, the third row and the third column are the heating resistors R11, the third row and the fourth column are the heating resistors R12, the fourth row and the first column are the heating resistors R13, and the fourth row and the second column are The heating resistor R14, the fourth row and the third column are the heating resistors R15, and the fourth row and the fourth column are the heating resistors R16. The heating resistors R1 R R16 are used to simulate heating elements on the motherboard, such as a CPU, a north bridge, and a south bridge. At the time of design, if the position of the CPU is between the second row and the second row and the third column as needed, the heating resistors R6 and R7 can simulate the CPU as a heating element to simulate the heat dissipation. The sum of the powers of the heating resistors R6 and R7 is substantially equal to the power of the CPU. At this time, the MCU 10 can control the pin 6 and the pin 7 to output a high level to turn on the corresponding switch 21, and the heating resistors R6 and R7 operate to generate heat.

The temperature sensing module 50 includes eight temperature sensors 51. Each temperature sensor 51 includes two probes 513. Each of the probes 513 corresponds to one of the heating resistors R1 R R16 for sensing the temperature of the heating resistors R1 R R16 .

The MCU 10 includes an I2C (a serial communication bus) module 11 , a PWM (Pulse Width Modulation) module 13 , and a control module 15 . The fan module 70 includes eight fans 71-78. The fans 71 to 78 are arranged in a row in the longitudinal direction. The PWM module 13 includes eight PWM outputs. Each output terminal is connected to one of the fans 71-78 to output a PWM signal to control the rotation speed of the corresponding fan 71-78. The serial clock line SCL and the serial data line SDA of the I2C module 11 are connected to the temperature sensing module 50 to read the temperature sensing module 50 sensed at a preset frequency. Temperature information. In the preferred embodiment of the present invention, the fans 71-78 and the temperature sensing module 50 are all mounted in a server chassis. The control module 15 is configured to control the opening and closing of the switches K1 - K16 and the duty ratio of the PWM signals output by the PWM output.

The imaging module 90 includes an infrared sensor 91 and a thermal imaging unit 93. The infrared sensor 91 is configured to sense an infrared signal generated by the heat generated around the heat generating module 30 and transmitted to the thermal imaging unit 93. The thermal imaging unit 93 receives the infrared signal transmitted by the infrared sensor 91 and draws the image into a display screen 200. The image drawn by the thermal imaging unit 93 is the flow of the wind flow in the server.

The user terminal 100 includes a user interface 101 and an input device 103. The input device 103 is configured to input preset parameters in the user interface 101. The preset parameters include a switch number to be opened, a fan number to be connected, an initial duty ratio of a PWM signal outputted by the PWM output, and a preset temperature in the server.

In an embodiment, when estimating the heat dissipation of the server, preset the positions of the heating elements, such as the CPU, the north bridge, and the south bridge, and input the user interface 101 according to the preset position. Open the switch, such as the switch K2~K9, open the corresponding fan, such as the fan 72~75, preset the initial duty cycle of the PWM signal corresponding to the fan 72~75 is 25%, and preset the server The heat dissipation temperature is 60 degrees. The control module 15 reads the preset parameter, and controls the corresponding switches K2~K9 and the fans 72-75 to open, and sets the initial duty ratio of the corresponding PWM signal to 25%. At this time, the corresponding heating resistors R2 to R9 start to operate to simulate the heat generated by the heating element. At the same time, the fans 72 to 75 heat the system, and the probe 513 corresponding to the heating resistors R2 R R9 in the temperature sensing module 50 senses the temperature of the corresponding heating resistors R2 R R9 and processes the temperature. After being transmitted to the temperature signal that the I2C module 11 can recognize, the infrared sensor 91 senses the infrared signal generated by the heat generated around the heat generating module 30 and transmits the infrared signal to the thermal imaging unit 93. The thermal imaging unit 93 receives the infrared signal transmitted by the infrared sensor 91 and plots the image into a display screen 200 to display the wind flow condition in the server system. The I2C module 13 transmits the temperature signal to the control module 15 and displays the temperature signal through the display screen 200. The control module 15 compares whether the temperature signal is lower than a preset temperature. If yes, it indicates that the position of the preset heating element, the position and number of the fan, and the duty ratio of the preset PWM signal are feasible. If not, the control module 15 controls the duty cycle of the corresponding PWM signal to a certain amplitude, such as 6.25% (1/16), until the temperature of the server system is as low as the preset temperature. If the duty cycle of the PWM signal is incremented to 100% and the temperature of the servo system is still higher than the preset temperature, it means that the previous preset parameter is a failure and the preset parameters need to be reset, such as increasing the number of fans, or The preset position of the heating element is adjusted to be re-detected until the detected temperature of the servo system is as low as the preset temperature.

The matrix of the heating resistors R1 R R16 is distributed on the motherboard, and the fans 71 to 78 are longitudinally arranged on one side of the motherboard. Therefore, the heating resistors R1 to R16 can substantially cover all positions of the motherboard. For different server systems, the number and position of the required heating resistors can be adjusted according to the preset positions of different heating elements, and the detection result of the estimated heat dissipation system is obtained by the server heat dissipation detection system.

In summary, the present invention has indeed met the requirements of the invention patent, and has filed a patent application according to law. However, the above description is only a preferred embodiment of the present invention, and it is not possible to limit the scope of the patent application of the present invention. Equivalent modifications or variations made by persons skilled in the art in light of the spirit of the invention are intended to be included within the scope of the following claims.

no

10‧‧‧MCU

11‧‧‧I2C module

13‧‧‧PWM module

15‧‧‧Control Module

20‧‧‧Switch Module

30‧‧‧heating module

50‧‧‧Temperature Sensing Module

70‧‧‧Fan module

90‧‧‧ imaging module

100‧‧‧User terminal

200‧‧‧ display screen

Claims (10)

A server heat dissipation detecting system includes a user terminal, an MCU, a temperature sensing module, and a plurality of fans for dissipating heat, the user terminal is provided with a user interface, and the user interface is configured to input preset parameters, the MCU Connecting the user terminal, the fan, and the temperature sensing module, the server heat dissipation detecting system further includes a switch module and a heat generating module, wherein the heat generating module includes a plurality of heating resistors arranged in a matrix The switch module includes a plurality of switches for controlling the on/off of the heating resistor, the switch is connected to the MCU, and the MCU opens corresponding to a preset position of the heating element according to the preset parameter. Corresponding switch of the heating resistor, so that the heating element corresponding to the preset position works to simulate the heating element to generate heat, and the MCU controls the fan to operate at a preset speed according to the preset parameter to The heat generating resistor is configured to dissipate heat, and the temperature sensing module is configured to sense a temperature of the heat generating resistor and transmit the temperature to the MCU, and the temperature received by the MCU and the One of the parameters of the preset temperature is compared, and the comparison of the results displayed on a display screen, for determining a position analogous to the rotational speed of the heat generating resistor of the heating element and the fan of whether the requirements. The server heat dissipation detecting system of claim 1, wherein the heat generating module comprises 16 heat generating resistors, and the 16 heat generating resistors are arranged in a matrix of four rows and four columns on a motherboard. Corresponding to the position of the heating element preset on the motherboard. The server heat dissipation detecting system of claim 2, wherein the switch module comprises 16 switches, wherein the 16 switches are arranged in a matrix of four rows and four columns, and each switch controls one of the corresponding positions. Heating resistor. The server heat dissipation detecting system of claim 2, wherein the temperature sensing module comprises 16 probes, each probe detecting a temperature of the heat generating resistor. The server heat dissipation detecting system according to claim 4, wherein the MCU includes an I2C module, and the I2C module is configured to receive a temperature sent by the temperature sensing module, and display the temperature. On the display screen. The server heat dissipation detecting system according to claim 1, wherein a sum of powers of the plurality of working heating resistors is substantially equal to a sum of powers of the predetermined heating elements. The server heat dissipation detecting system of claim 1, wherein the MCU further includes a control module, wherein the control module controls the location when the temperature received by the MCU is higher than the preset temperature The speed of the fan is increased by an amplitude. The server heat dissipation detecting system of claim 7, wherein the control module is configured to increase a speed of the fan to a limit value and the temperature received by the MCU is higher than the preset temperature. A prompt to change the preset parameters is issued on the display screen. The server heat dissipation detecting system of claim 1, wherein the server heat dissipation detecting system further comprises an imaging module, wherein the imaging module detects the infrared signal emitted by the heating element and changes the infrared signal The situation is drawn as an image displayed on the display screen. The server heat dissipation detecting system of claim 9, wherein the imaging module comprises an infrared sensor and a thermal imaging unit, wherein the infrared sensor is configured to detect an infrared signal emitted by the heating element. And transmitting the infrared signal to the thermal imaging unit, and the thermal imaging unit draws the received infrared signal into an image and displays the image on the display screen.