TW201515291A - Light emitting module and using the same - Google Patents

Abstract

A light emitting module includes a first lead frame, a carrier, a first light emitting diode, a first wire, a second wire, a first protection layer, a second protection layer, and an encapsulant. The first lead frame includes a first conductive portion and a second conductive portion apart from each other. The second conductive portion has a die-bonding area. The carrier covers a portion of the first lead frame, and forms a cavity exposing the die-bonding area. A front side of the first light emitting diode has a first electrode and a second electrode apart from each other, and the back side of the first light emitting diode is fixed on the die-bonding area. The first wire is electrically connected between the first conductive portion and the first electrode, and the second wire is electrically connected between the second conductive portion and the second electrode. The first protection layer and the second protection layer cover the first wire and the second wire, respectively. The encapsulant is filled in the cavity.

Description

Light-emitting module and its application

The invention relates to a lighting module.

Generally, in the packaging process of the LED device, the gold wire can be used to electrically connect the LED chip and the lead frame, and then the package rubber is filled into the lead frame, wherein the package is packaged. The gold wire is covered to complete the process of the light emitting diode device. However, during the manufacturing process or subsequent operation of the LED device, the encapsulant will generate internal stress during the high and low temperature change process, which may cause the gold wire in contact with it to be deformed or de-soldered due to stress pull, and even worse. A wire breakage will occur, causing the light-emitting diode device to fail. Although this problem can be improved through different wire arcing processes, the use of gold wires is increased by lengthening the gold wire, which in turn increases production costs.

One aspect of the present invention provides a light emitting module including a first lead frame, a package cup, a first light emitting diode, a first wire, a second wire, a first protective layer, a second protective layer, and an encapsulant. The first lead frame contains each other The first conductive portion and the second conductive portion are separated, and the second conductive portion has a predetermined solid crystal region thereon. The package cup covers a portion of the first lead frame and forms a recessed hole that exposes a predetermined surface of the die attach region. The first light emitting diode has a front side and a back side opposite to the front side. The front surface has a first electrode and a second electrode separated from each other, and the back surface of the first light emitting diode is fixed on the solid crystal region. The first wire is electrically connected between the first conductive portion and the first electrode. The second wire is electrically connected between the second conductive portion and the second electrode. The first and second protective layers respectively cover the first and second wires. The encapsulant is filled in the recessed hole and covers the first light emitting diode and the first and second wires covered by the first and second protective layers.

In one or more embodiments, the first and second protective layers are thermoplastic plastics.

In one or more embodiments, the thermoplastic plastic material is polycarbonate (PC), polyethylene (PE), polyethylene terephthalate (PET), polybutylene terephthalate ( PBT), one or a combination of polytetramethylene terephthalate (PCT), polypropylene (PP), nylon (Nylon).

In one or more embodiments, the thermoplastic plastic further comprises a plurality of scattering particles.

In one or more embodiments, the material of the scattering particles is one of titanium dioxide (TiO ₂ ), cerium oxide (SiO ₂ ), zinc oxide (ZnO), aluminum oxide (Al ₂ O ₃ ), or a combination thereof.

In one or more embodiments, the encapsulant and/or the thermoplastic plastic further comprises a plurality of wavelength converting particles.

Another aspect of the present invention provides a light emitting device including a substrate, The above lighting module and solder paste. The solder paste is fixed to the substrate by reflow soldering. The melting point temperature of the solder paste is higher than the melting temperature of the first and second protective layers.

According to still another aspect of the present invention, a light emitting module includes a second lead frame, a package cup, a second light emitting diode, a third wire, a third protective layer, and an encapsulant. The second lead frame includes a third conductive portion and a fourth conductive portion separated from each other, and the fourth conductive portion has a predetermined solid crystal region thereon. The package cup covers a portion of the second lead frame and forms a recessed hole that exposes a predetermined surface of the die-bonding region. The second light emitting diode has a front side and a back side opposite to the front side. The front surface has a third electrode, and the back surface has a fourth electrode, and the back surface of the second light emitting diode is fixed on the solid crystal region, and the fourth electrode is electrically connected to the fourth conductive portion. The third wire is electrically connected between the third conductive portion and the third electrode. The third protective layer covers the third wire. The encapsulant is filled in the recessed hole and covers the second LED and the third conductor covered by the third protective layer.

In one or more embodiments, the third protective layer is a thermoplastic plastic.

In one or more embodiments, the thermoplastic plastic material is polycarbonate (PC), polyethylene (PE), polyethylene terephthalate (PET), polybutylene terephthalate ( PBT), one or a combination of polytetramethylene terephthalate (PCT), polypropylene (PP), nylon (Nylon).

In one or more embodiments, the thermoplastic plastic further comprises a plurality of scattering particles.

In one or more embodiments, the material of the scattering particles is one of titanium dioxide (TiO ₂ ), cerium oxide (SiO ₂ ), zinc oxide (ZnO), aluminum oxide (Al ₂ O ₃ ), or a combination thereof.

In one or more embodiments, the encapsulant and/or the thermoplastic plastic further comprises a plurality of wavelength converting particles.

According to still another aspect of the present invention, a light emitting device includes a substrate, the above light emitting module, and a solder paste. The solder paste is fixed to the substrate by reflow soldering. The melting point temperature of the solder paste is higher than the melting point temperature of the third protective layer.

Since the protective layer covers the wire, the protective layer can help absorb the stress of the encapsulant even when the encapsulant is subjected to high and low temperature changes, thereby becoming a buffer between the encapsulant and the wire to reduce the wire. The chance of deformation, desoldering or wire breakage.

100,400‧‧‧Lighting Module

102, 402‧‧‧Glossy

110‧‧‧First lead frame

112‧‧‧First Conductive Department

114‧‧‧Second Conductive Department

120, 420‧‧‧ package cup

122, 422‧‧‧ recessed holes

130‧‧‧First LED

132‧‧‧First electrode

134‧‧‧second electrode

136, 436‧‧ positive

138, 438‧‧‧ back

140‧‧‧First wire

150‧‧‧second wire

160‧‧‧First protective layer

162, 462‧‧‧ scattering particles

170‧‧‧Second protective layer

180, 480‧‧‧Package

182, 482‧‧‧ wavelength conversion particles

200‧‧‧Substrate

300‧‧‧ solder paste

410‧‧‧Second lead frame

412‧‧‧ Third Conductive Department

414‧‧‧4th Conductive Department

430‧‧‧Second light-emitting diode

432‧‧‧ third electrode

434‧‧‧fourth electrode

440‧‧‧ Third wire

460‧‧‧ third protective layer

I‧‧‧ Gujing District

FIG. 1 is a cross-sectional view showing a light emitting module according to an embodiment of the present invention.

Fig. 2 is a cross-sectional view showing a light-emitting device according to an embodiment of the present invention.

3 is a cross-sectional view of a light emitting module according to another embodiment of the present invention.

Fig. 4 is a cross-sectional view showing a light-emitting device according to another embodiment of the present invention.

The embodiments of the present invention are disclosed in the following drawings, and for the purpose of clarity However, it should be understood that these practical details are not applied to limit this invention. That is, in some embodiments of the invention, these practical details are not necessary. In addition, some of the conventional structures and elements are shown in the drawings in a simplified schematic manner in order to simplify the drawings.

FIG. 1 is a cross-sectional view showing a light emitting module 100 according to an embodiment of the present invention. The light emitting module 100 includes a first lead frame 110 , a package cup 120 , a first light emitting diode 130 , a first conductive line 140 , a second conductive line 150 , a first protective layer 160 , a second protective layer 170 , and an encapsulant 180 . The first lead frame 110 includes a first conductive portion 112 and a second conductive portion 114 separated from each other, and the second conductive portion 114 has a predetermined solid crystal region I thereon. The package cup 120 covers a portion of the first lead frame 110 and forms a recessed hole 122 that exposes a predetermined surface of the die-bonding region I. The first light emitting diode 130 has a front surface 136 and a back surface 138 opposite to the front surface 136. The front surface 136 has a first electrode 132 and a second electrode 134 separated from each other, and the back surface 138 of the first light emitting diode 130 is fixed on the die bonding region 1. In other words, the first light emitting diode 130 is a horizontal light up diode. The first wire 140 is electrically connected between the first conductive portion 112 and the first electrode 132. The second wire 150 is electrically connected between the second conductive portion 114 and the second electrode 134. The first protective layer 160 and the second protective layer 170 respectively cover the first wire 140 and the second wire 150. The encapsulant 180 is filled in the recessed hole 122 and covers the first LED 230 and the first and second wires 140 and 150 covered by the first and second protective layers 160 and 170.

In the embodiment, the first protective layer 160 and the second protective layer 170 respectively cover the first conductive line 140 and the second conductive line 150, that is, at least a portion of the first conductive line 140 and the second conductive line 150 are not packaged. Glue 180 straight Contact. Therefore, even when the encapsulant 180 is subjected to high and low temperature changes to generate internal stress, the first protective layer 160 and the second protective layer 170 can help absorb the stress of the encapsulant 180, that is, become the encapsulant 180 and the first wire 140 and the second. The buffer between the wires 150 is used to reduce the probability of deformation, desoldering or wire breakage of the first wire 140 and the second wire 150.

In detail, both the first protective layer 160 and the second protective layer 170 may be thermoplastic plastics having a melting point temperature. When the thermoplastic plastic is higher than the melting point, it is in a liquid state, and conversely, when the thermoplastic plastic is lower than the melting point, it can be cured. If the heating temperature of the light emitting module 100 is higher than the melting temperature of the first protective layer 160 and the second protective layer 170, the first protective layer 160 is The second protective layer 170 is in a liquid state. Because the coefficient of thermal expansion (CTE) between the encapsulant 180 and the first wire 140 (or the second wire 150) generally does not match, the liquid first protective layer 160 is heated when the light emitting module 100 is heated. And the second protective layer 170 can be used as a buffer between the encapsulant 180 and the first wire 140 (or the second wire 150), respectively absorbing the internal stress of the encapsulant 180 and the first wire 140 (or the second wire 150) In order to reduce the influence of the stress of the encapsulant 180 on the first wire 140 and the second wire 150, thereby generating the probability of deformation, desoldering or wire breakage.

In one or more embodiments, the thermoplastic plastic material may be polycarbonate (PC), polyethylene (PE), polyethylene terephthalate (PET), polybutylene terephthalate. Diester (PBT), polytetramethylene terephthalate (PCT), polypropylene (PP), nylon (Nylon), or a group thereof Hehe. The thermoplastic plastic can be heated to a liquid state, for example, and then dropped onto the first wire 140 and the second wire 150 by injection to form the first protective layer 160 and the second protective layer 170, respectively. In order to increase the adhesion of the thermoplastic plastic to the first wire 140 and the second wire 150, the contact angle between the liquid thermoplastic plastic and the first wire 140 (and/or the second wire 150) may be less than 90 degrees. However, the invention is not limited thereto.

In one or more embodiments, the thermoplastic plastic further comprises a plurality of scattering particles 162. When the light beam emitted by the first light-emitting diode 130 hits the scattering particle 162, the scattering particle 162 can increase the degree of scattering of the light beam to increase the uniformity of the Coriosphere Temperature (CCT) of the overall light beam of the light-emitting module 100. . That is to say, when the light-emitting module 100 is viewed in a large angle and a small angle direction, the light colors are substantially identical.

In one or more embodiments, the material of the scattering particles 162 may be one of titanium dioxide (TiO ₂ ), cerium oxide (SiO ₂ ), zinc oxide (ZnO), aluminum oxide (Al ₂ O ₃ ), or a combination thereof. . Since the material of the scattering particles 162 usually has a high refractive index, the scattering particles 162 also have an effect of improving the reflectance. By adjusting the proportion of the scattering particles 162 in the thermoplastic plastic, the light extraction efficiency of the light emitting module 100 can be increased.

In one or more embodiments, the encapsulant 180 and/or the thermoplastic (ie, the first protective layer 160 and the second protective layer 170) further comprise a plurality of wavelength converting particles 182. For example, in the first embodiment, both the encapsulant 180 and the thermoplastic plastic include the wavelength converting particles 182. However, in other embodiments, the wavelength converting particles 182 may be distributed only in the encapsulant 180 and the thermoplastic plastic. The invention is not limited thereto. When the first light emitting diode 130 When the emitted light beam strikes the wavelength converting particles 182, the wavelength converting particles 182 can convert the wavelength of the light beam, so that the light color of the light beam can be changed. The wavelength converting particles 182 are, for example, phosphor powder or quantum dots, and the invention is not limited thereto.

It is to be noted that, in an embodiment, if the light emitting module 100 includes the scattering particles 162 and the wavelength converting particles 182 at the same time, the scattering particles 162 have the effect of scattering light, that is, the scattering particles 162 can scatter the converted color. The light beam, and thus the number of wavelength converting particles 182, can be relatively reduced to reduce the cost of the light emitting module 100.

In this embodiment, the material of the package cup 120 may be a thermoplastic plastic or a thermosetting plastic, and the material has a reflectance greater than 80% to assist in reflecting the light beam emitted by the first light emitting diode 130 to the light emitting module. The light emitting surface 102 of 100. When the material of the package cup 120 is thermoplastic, the material thereof may be polycarbonate (PC), polyethylene (PE), polyethylene terephthalate (PET), polybutylene terephthalate ( PBT), one or a combination of polytetramethylene terephthalate (PCT), polypropylene (PP), nylon (Nylon), but the melting temperature of the package cup 120 is higher than the first protection The melting temperature of the layer 160 and the second protective layer 170. When the material of the package body 120 is a thermosetting plastic, the material may be one of silicone or epoxy, Epoxy, Acrylate, Adamanda or a combination thereof. In addition, the material of the encapsulant 180 may also be a thermosetting plastic such as one of Silicone, Epoxy, Acrylate, Adamanda or a combination thereof. The material of the first wire 140 and the second wire 150 may be a conductive material such as gold, silver, copper or aluminum.

Next, please refer to FIG. 2, which is a cross-sectional view showing a light-emitting device according to an embodiment of the present invention. The light emitting device includes a substrate 200, a light emitting module 100, and a solder paste 300. The solder paste 300 is fixed to the substrate 200 by a reflow method. The melting temperature of the solder paste 300 is higher than the melting temperature of the first protective layer 160 and the second protective layer 170. On the other hand, when the package cup 120 is a thermoplastic material, the melting temperature of the package cup 120 is higher than the melting temperature of the solder paste 300. In this way, when the light-emitting module 100 is performing the reflow process, the reflow temperature can be set between the solder paste 300 and the melting temperature of the package body 120, so that the first protective layer 160 and the second protective layer 170 are The solder paste 300 is in a liquid state, and the package cup 120 is in a solid state. Therefore, the first protective layer 160 and the second protective layer 170 can respectively achieve the effects of protecting the first wire 140 and the second wire 150 to reduce the probability of deformation, desoldering or wire breakage of the first wire 140 and the second wire 150.

Referring to FIG. 3, a cross-sectional view of a light emitting module 400 according to another embodiment of the present invention is shown. The light emitting module 400 includes a second lead frame 410, a package cup 420, a second light emitting diode 430, a third wire 440, a third protective layer 460, and an encapsulant 480. The second lead frame 410 includes a third conductive portion 412 and a fourth conductive portion 414 that are separated from each other, and the fourth conductive portion 414 has a predetermined solid crystal region I thereon. The package cup 420 covers a portion of the second lead frame 410 and forms a recessed hole 422 that exposes a predetermined surface of the solid crystal region I. The second LED 430 has a front side 436 and a back side 438 opposite the front side 436. The front surface 436 has a third electrode 432, and the back surface 438 has a fourth electrode 434, and the back surface 438 of the second LED 430 is fixed on the solid crystal region I, and the fourth electrode 434 and the fourth conductive portion 414 are electrically connected. Sexual connection. In other words, the second light emitting diode 430 is a vertical light emitting diode. The third wire 440 is electrically connected between the third conductive portion 412 and the third electrode 432. The third protective layer 460 covers the third wire 440. The encapsulant 480 is filled in the recessed hole 422 and covers the second LED 430 and the third conductor 440 covered by the third protection layer 460.

In the present embodiment, the third protective layer 460 covers the third wire 440, that is, at least a portion of the third wire 440 is not in direct contact with the encapsulant 480. Therefore, even when the encapsulant 480 is subjected to high and low temperature changes to generate internal stress, the third protective layer 460 can help absorb the stress of the encapsulant 480, that is, become a buffer between the encapsulant 480 and the third lead 440, thereby reducing the third. The wire 440 is subject to deformation, desoldering, or the probability of wire breakage.

In detail, the third protective layer 460 may be a thermoplastic type plastic having a melting point temperature. In a heating condition (for example, in the thermal shock test of the light-emitting module 400), if the heating temperature of the light-emitting module 400 is higher than the melting temperature of the third protective layer 460, the third protective layer 460 becomes a liquid. The thermal expansion coefficient between the encapsulant 480 and the third lead 440 is generally mismatched. Therefore, when the illumination module 400 is heated, the liquid third protective layer 460 can be deformed between the encapsulant 480 and the third lead 440. The buffering, by absorbing the internal stress of the encapsulant 480 and the third wire 440, reduces the influence of the stress of the third wire 440 on the encapsulant 480, thereby causing deformation, desoldering or wire breakage.

In one or more embodiments, the thermoplastic plastic material may be polycarbonate (PC), polyethylene (PE), polyethylene terephthalate (PET), polybutylene terephthalate. Diester (PBT), polybutylene terephthalate 1,4 ring One or a combination of dimethanol ester (PCT), polypropylene (PP), nylon (Nylon). The thermoplastic plastic can be heated, for example, to a liquid state, and then dropped onto the third wire 440 by injection to form a third protective layer 460. In order to increase the adhesion of the thermoplastic plastic to the third wire 440, the contact angle between the liquid thermoplastic plastic and the third wire 440 may be selected to be less than 90 degrees, but the invention is not limited thereto.

In one or more embodiments, the thermoplastic plastic further comprises a plurality of scattering particles 462. When the light beam emitted by the second light-emitting diode 430 hits the scattering particles 462, the scattering particles 462 can increase the degree of scattering of the light beam to increase the thermal temperature uniformity of the overall light beam of the light-emitting module 400.

In one or more embodiments, the material of the scattering particles 462 may be one of titanium dioxide (TiO ₂ ), cerium oxide (SiO ₂ ), zinc oxide (ZnO), aluminum oxide (Al ₂ O ₃ ), or a combination thereof. . Since the material of the scattering particles 462 generally has a high refractive index, the scattering particles 462 also have an effect of improving the reflectance. By adjusting the ratio of the scattering particles 462 in the thermoplastic plastic, the light extraction efficiency of the light emitting module 400 can be increased.

In one or more embodiments, the encapsulant 480 and/or the thermoplastic (ie, the third protective layer 460) further includes a plurality of wavelength converting particles 482. For example, in the third embodiment, both the encapsulant 480 and the thermoplastic plastic include the wavelength converting particles 482. However, in other embodiments, the wavelength converting particles 482 may be distributed only in the encapsulant 480 and the thermoplastic plastic. The invention is not limited thereto. When the light beam emitted by the second light-emitting diode 430 hits the wavelength-converting particles 482, the wavelength-converting particles 482 can convert the wavelength of the light beam, so that the light color of the light beam can be changed. 482 wavelength conversion particles In the case of fluorescent powder or quantum dots, the invention is not limited thereto.

It is worth mentioning that, in an embodiment, if the light-emitting module 400 includes the scattering particles 462 and the wavelength-converting particles 482 at the same time, the scattering particles 462 have the effect of scattering light, that is, the scattering particles 462 can scatter the converted color. The light beam, and thus the number of wavelength converting particles 482, can be relatively reduced to reduce the cost of the light emitting module 400.

In this embodiment, the material of the package cup 420 may be a thermoplastic plastic or a thermosetting plastic, and the material has a reflectance greater than 80% to assist in reflecting the light beam emitted by the second LED 430 to the light emitting module. The light exit surface 402 of 400. When the material of the package cup 420 is thermoplastic, the material may be polycarbonate (PC), polyethylene (PE), polyethylene terephthalate (PET), polybutylene terephthalate ( PBT), one or a combination of polytetramethylene terephthalate (PCT), polypropylene (PP), nylon (Nylon), but the melting temperature of the package cup 420 is higher than the third protection The melting point temperature of layer 460. When the material of the package cup 420 is a thermosetting plastic, the material may be one of a silicone resin, an epoxy resin (Epoxy), an acrylate (Acrylate), an Adamanda, or a combination thereof. In addition, the material of the encapsulant 480 may also be a thermosetting plastic such as one of Silicone, Epoxy, Acrylate, Adamanda or a combination thereof. The material of the third wire 440 may be a conductive material such as gold, silver, copper or aluminum.

Next, please refer to FIG. 4, which is a cross-sectional view showing a light-emitting device according to another embodiment of the present invention. The light emitting device includes a substrate 200, a light emitting module 400, and a solder paste 300. The solder paste 300 is solidified by the reflow soldering method It is fixed on the substrate 200. The melting temperature of the solder paste 300 is higher than the melting temperature of the third protective layer 460. On the other hand, when the package cup 420 is a thermoplastic material, the melting temperature of the package cup 420 is higher than the melting temperature of the solder paste 300. In this way, when the light-emitting module 400 is performing the reflow process, the reflow temperature can be set between the solder paste 300 and the melting temperature of the package cup 420, so that the third protective layer 460 and the solder paste 300 are both in a liquid state. And the package cup 420 is in a solid state. Therefore, the third protective layer 460 can achieve the effect of protecting the third wire 440 to reduce the probability of deformation, desoldering, or wire breakage of the third wire 440.

Although the present invention has been disclosed in the above embodiments, it is not intended to limit the present invention, and the present invention can be modified and modified without departing from the spirit and scope of the present invention. The scope is subject to the definition of the scope of the patent application attached.

100‧‧‧Lighting module

102‧‧‧Glossy surface

110‧‧‧First lead frame

112‧‧‧First Conductive Department

114‧‧‧Second Conductive Department

120‧‧‧Package cup

122‧‧‧Concave holes

130‧‧‧First LED

132‧‧‧First electrode

134‧‧‧second electrode

136‧‧‧ positive

138‧‧‧ back

140‧‧‧First wire

150‧‧‧second wire

160‧‧‧First protective layer

162‧‧‧scattering particles

170‧‧‧Second protective layer

180‧‧‧Package

182‧‧‧ wavelength conversion particles

I‧‧‧ Gujing District

Claims (14)

A light-emitting module includes: a first lead frame comprising a first conductive portion and a second conductive portion separated from each other, and the second conductive portion has a predetermined solid crystal region; a package cup, package Covering a portion of the first lead frame and forming a recessed hole exposing a surface of the predetermined solid crystal region; a first light emitting diode having a front surface and a back surface opposite to the front surface, and having a front surface a first electrode and a second electrode separated from each other, and the back surface of the first LED is fixed on the die bonding region; a first wire electrically connected to the first conductive portion and the a first wire is electrically connected between the second conductive portion and the second electrode; a first and a second protective layer respectively covering the first and second wires; and a first wire The encapsulant is filled in the recessed hole and covers the first LED and the first and second wires covered by the first and second protective layers. The lighting module of claim 1, wherein the first and second protective layers are thermoplastic plastics. The lighting module of claim 2, wherein the thermoplastic plastic material Polycarbonate (PC), polyethylene (PE), polyethylene terephthalate (PET), polybutylene terephthalate (PBT), polytetramethylene terephthalate One or a combination of methanol ester (PCT), polypropylene (PP), nylon (Nylon). The illuminating module of claim 3, wherein the thermoplastic plastic body further comprises a plurality of scattering particles. The illuminating module of claim 4, wherein the scattering particles are made of one of titanium dioxide (TiO ₂ ), cerium oxide (SiO ₂ ), zinc oxide (ZnO), and aluminum oxide (Al ₂ O ₃ ). Or a combination thereof. The light emitting module of claim 5, wherein the encapsulant and/or the thermoplastic plastic further comprises a plurality of wavelength converting particles. A light-emitting device, comprising: a substrate; the light-emitting module according to any one of claims 1 to 6; and a solder paste, wherein the light-emitting module is fixed on the substrate by reflow soldering, wherein The solder paste has a melting point temperature higher than a melting point temperature of the first and second protective layers. A lighting module comprising: a second lead frame comprising a third conductive portion and a first a fourth conductive portion having a predetermined solid crystal region; a package cup covering the portion of the second lead frame and forming a recessed hole exposing the surface of the predetermined solid crystal region; a second light emitting diode having a front surface and a back surface opposite to the front surface, wherein the front surface has a third electrode, and the back surface has a fourth electrode, and the back surface of the second light emitting diode body Fixing on the solid crystal region, and the fourth electrode is electrically connected to the fourth conductive portion; a third wire electrically connected between the third conductive portion and the third electrode; a third protection a layer covering the third wire; and an encapsulant filled in the recessed hole and covering the second light emitting diode and the third wire covered by the third protective layer. The lighting module of claim 8, wherein the third protective layer is a thermoplastic plastic. The illuminating module of claim 9, wherein the thermoplastic plastic material is polycarbonate (PC), polyethylene (PE), polyethylene terephthalate (PET), polyterephthalic acid. One or a combination of butylene diester (PBT), polytetramethylene terephthalate (PCT), polypropylene (PP), nylon (Nylon). The illuminating module of claim 10, wherein the thermoplastic plastic further comprises a plurality of scattering particles. The illuminating module of claim 11, wherein the scattering particles are made of one of titanium dioxide (TiO ₂ ), cerium oxide (SiO ₂ ), zinc oxide (ZnO), and aluminum oxide (Al ₂ O ₃ ). Or a combination thereof. The lighting module of claim 12, wherein the encapsulant and/or the thermoplastic plastic further comprises a plurality of wavelength converting particles. A light-emitting device, comprising: a substrate; the light-emitting module according to any one of claims 8 to 13; and a solder paste, wherein the light-emitting module is fixed on the substrate by reflow soldering, wherein The solder paste has a melting point temperature higher than a melting point temperature of the third protective layer.