TW201511359A - Light fixture - Google Patents

Abstract

A light fixture is provided which can efficiently emit illumination light from a semiconductor light-emitting element in a direction that is orthogonal to the direction in which the semiconductor light-emitting element and an optical element face each other, without the surface shape of a light-distribution lens being very complicated. A light fixture includes a base member 30, 45, 54; a semiconductor light-emitting element 62 fixed to the base member; and an optical element 70 facing the semiconductor light-emitting element. The optical element is provided with a projecting portion 74 that projects toward the semiconductor light-emitting element, and an inclined reflective surface 73b and 74a, formed on an outer surface of the projecting portion, which is inclined with respect to a straight reference line AL that extends in the direction in which the semiconductor light-emitting element and an optical element face each other, wherein a distance in an orthogonal direction from the reference line to the inclined reflective surface gradually shortens from the optical element toward the semiconductor light-emitting element.

Description

Lighting fixture

The present invention relates to a lighting fixture using a semiconductor light emitting element (LED).

As a conventional example of a lighting fixture using a semiconductor light emitting element (LED), for example, a lighting fixture disclosed in Patent Document 1 is known.

The lighting fixture includes a base member, an LED (semiconductor light-emitting element) fixed to the base member, and a light distribution lens (optical element) fixed to the base member.

Since the light generated by the LED is high in straightness, when the shape of the light distribution lens is not considered, the illumination light of the LED that has passed through the light distribution lens hardly spreads, and proceeds toward a specific direction (and its peripheral portion). However, when the light distribution lens exhibits such light distribution characteristics, the practicality of the lighting fixture is lowered.

Therefore, in Patent Document 1, the illumination light is diffused by studying the shape of the light distribution lens. The light distribution lens of Patent Document 1 is a rotationally symmetric body centering on an axis orthogonal to the light emitting surface of the LED, and a rotation centering on the axis is formed on a surface of the light distribution lens that faces the LED (and the base member). A symmetrical shaped recess.

Further, the light distribution lens is fixed to the base member in a state of covering the LED. Further, the LED is placed in a space formed between the recess and the base member.

When the power generated by the power source is supplied to the LED, the LED emits light.

Then, the illumination light generated by the LED is from the surface of the above-mentioned concave portion (the light distribution lens The inner peripheral surface is incident on the inside of the light distribution lens. Further, the illumination light passes through the inside of the light distribution lens, and is emitted from the outer circumference of the light distribution lens toward the outside of the light distribution lens. Specifically, a part of the illumination light is emitted from the light distribution lens in the axial direction and the peripheral direction thereof, and the remaining (part of) the illumination light is emitted in the direction orthogonal to the axis and the peripheral direction thereof. Therefore, the illumination light is diffused in various directions through the light distribution lens.

Prior art literature

Patent literature

Patent Document 1: Japanese Laid-Open Patent Publication No. 2006-114863

Patent Document 2: Japanese Laid-Open Patent Publication No. 2009-44016

Patent Document 3: Japanese Laid-Open Patent Publication No. 2012-4078

Patent Document 4: Patent No. 4357508

Patent Document 5: Patent No. 4568194

The light distribution lens of Patent Document 1 does not have a high ability to emit illumination light of an LED in an orthogonal direction (and its peripheral direction) with respect to the above-described axis. Therefore, the peripheral portion on the side in the orthogonal direction (and its peripheral direction) of the light distribution lens is likely to be dark.

Further, in the light distribution lens of Patent Document 1, the shape of the outer circumferential surface or the inner circumferential surface (the surface of the concave portion) is complicated in order to emit the illumination light in the orthogonal direction (and its peripheral direction). Therefore, the manufacturing cost of the light distribution lens is apt to increase.

An object of the present invention is to provide a lighting fixture capable of making the surface shape of a light distribution lens less complex, and illuminating the semiconductor light emitting element relative to the semiconductor light emitting element. It is emitted with high efficiency in the orthogonal direction of the opposing direction of the optical element.

A lighting fixture according to the present invention includes: a base member; a semiconductor light emitting element fixed to the base member; and an optical element facing the semiconductor light emitting element, wherein the optical element includes a protruding portion The semiconductor light emitting element side protrudes; an inclined reflecting surface formed on an outer surface of the protruding portion, inclined with respect to a reference line of a straight line extending in a direction opposite to a direction of the semiconductor light emitting element and the optical element, and The distance from the side of the semiconductor light-emitting element from the side of the optical element to the direction perpendicular to the reference line is gradually shortened.

The lighting fixture of the present invention may be as follows: the protruding portion is a cone centering on the reference line and gradually decreasing the orthogonal direction distance as approaching the semiconductor light emitting element, outside the cone The surface constitutes the annular inclined reflecting surface located around the reference line.

In the lighting fixture of the present invention, the optical element may include a supported portion that is supported by the base member in a fixed state.

The lighting fixture of the present invention may be characterized in that the optical element includes: a first optical element having the protruding portion; and a second optical element having a support portion formed by a through hole or a recess, or the through hole or The recess is adapted to be fitted in the first optical element in a fixed state.

The illuminating device of the present invention may be configured such that a coating layer having a reflectance of light higher than a light reflectance of the inclined reflecting surface is applied to the inclined reflecting surface.

The optical element of the lighting fixture of the present invention has a side facing the semiconductor light emitting element A protruding protrusion is formed with an inclined reflecting surface on an outer surface of the protruding portion. The oblique reflecting surface is configured as an inclined surface, that is, as a reference line that is parallel to a direction (linear direction) of the semiconductor light-emitting element and the optical element, and is spaced from the optical element side toward the semiconductor light-emitting element side. The line is formed by an inclined surface whose distance in the orthogonal direction is gradually shortened.

Therefore, a part of the illumination light emitted from the semiconductor light-emitting element toward the protruding portion side is reflected by the oblique reflection surface to be highly efficiently reflected in the orthogonal direction with respect to the linear direction. Therefore, the peripheral portion on the orthogonal direction side of the light distribution lens can be made bright.

Further, since the shape of the inclined reflecting surface formed on the protruding portion is relatively simple, the manufacturing cost of the light distribution lens does not become high.

10‧‧‧LED module (semiconductor light-emitting element module)

15‧‧‧LED holder (semiconductor for semiconductor light-emitting components)

17‧‧‧Connecting board

18A, 18B‧‧‧ Carrying Department

18C‧‧‧Transporting hole

19‧‧‧ Bearer connection

20‧‧‧First conductive parts

20A‧‧‧Wire connection

20B‧‧‧ Cable connection

20C‧‧‧ snap hole

21‧‧‧Second conductive parts

21A‧‧‧Wire connection

21B‧‧‧ Cable connection

21C‧‧‧Snap hole

22‧‧‧First cut-off bridge

23‧‧‧Second cut bridge

24‧‧‧ Third cut bridge

30‧‧‧Primary resin molding (base member) (resin molding)

31‧‧‧ Main body

32‧‧‧Circular inner wall

33‧‧‧Inside protrusion

35‧‧‧Bridges exposed holes

36‧‧‧Snap hole

37‧‧‧Connector connection

38‧‧‧Connector connection slot

39‧‧‧Clamping recess

40A, 40B, 40C, 40D‧‧‧ lower surface side protrusion

41‧‧‧ peripheral wall

42‧‧‧Card claws

43‧‧‧Connecting arm

45‧‧‧heatsink (base part) (heat transfer parts)

46‧‧‧The Department of Storage

47‧‧‧Card recess

48‧‧‧Abutment

49‧‧‧LED support

49a‧‧‧Installation surface

50‧‧‧Circular recess

51‧‧‧Non-circular recess

54‧‧‧Secondary resin molded part (base part) (resin molded part)

55‧‧‧ annular wall

56‧‧‧Rings

57‧‧‧Overhead

58‧‧‧Reflective film

59‧‧‧LED fixing part (semiconductor light-emitting element fixing part)

62, 62A, 62B, 62C, 62D‧‧‧ LED (semiconductor light-emitting element)

64‧‧‧welding line

66‧‧‧Lighting appliances

68‧‧‧Chassis (heat sink)

70‧‧‧Lighting lens (optical component)

71‧‧‧First light distribution lens (first optical element)

71a‧‧‧ Main body

71b‧‧‧Support

71c‧‧‧Fixed foot (supported part)

71d‧‧‧Diffusion coating

72‧‧‧Second optical lens (second optical element)

73‧‧‧Mate

73a‧‧‧Diffusion coating

73b‧‧‧Sloping reflective surface

74‧‧‧Protruding

74a, 74a'‧‧‧ oblique reflecting surface

74b‧‧‧Conical coating

75, 75'‧‧‧Connector cable

77‧‧‧ Cable

78‧‧‧Wire

79‧‧‧ Covered tube

80‧‧‧Connector

81‧‧‧Insulator

82‧‧‧ carding protrusion

83‧‧‧Protection prevention

84‧‧‧Long slot

85‧‧‧First contact

86‧‧‧First contact piece

87‧‧‧second contact

88‧‧‧Second contact piece

90‧‧‧welding line

92‧‧‧Short-circuit connector

AL‧‧‧Axis of the lens (reference line)

S‧‧‧ annular gap

Fig. 1 is a perspective view of a part of a conduction plate according to an embodiment of the present invention as seen from above.

2 is a perspective view of the primary integrated body in which the primary resin molded portion is integrally formed on the conductive plate as viewed from above.

Fig. 3 is a perspective view of the primary body viewed from below.

Figure 4 is a plan view of the primary unit.

Fig. 5 is a plan view of a primary unit in which one cut is performed.

Fig. 6 is a perspective view showing a state in which the integrated body and the heat sink are separated from each other as seen from above.

Fig. 7 is a perspective view showing a state in which the integrated body and the heat sink are separated from each other as seen from below.

Fig. 8 is a perspective view of the combined body of the primary body and the heat sink viewed from above.

Fig. 9 is a perspective view of a combination of the primary body and the heat sink as seen from below.

Fig. 10 is a view showing the secondary resin molded portion integrally formed in the primary unit and the heat sink as viewed from above. A perspective view of the quadratic body of the combined body.

Fig. 11 is a perspective view of the secondary unit viewed from below.

Fig. 12 is a plan view of a secondary body in which a reflective film is formed on a mounting surface.

Fig. 13 is a perspective view of the LED holder and the LED which are completed by performing secondary cutting as seen from above.

Figure 14 is a cross-sectional view taken along the line XIV-XIV of Figure 13 .

Figure 15 is a plan view of the LED module.

Fig. 16 is a perspective view showing a separated state of the LED module and the light distribution lens as seen from above.

Fig. 17 is a perspective view showing a separated state of the LED module and the light distribution lens as seen from below.

18 is a perspective view of a separated state of the first light distribution lens and the second light distribution lens as viewed from above.

19 is a perspective view of a separated state of the first light distribution lens and the second light distribution lens as viewed from below.

Fig. 20 is a perspective view of a combination of an LED module and a light distribution lens as seen from above.

21 is a perspective view of a combination of an LED module and a light distribution lens as seen from below.

Fig. 22 is a plan view showing a combination of an LED module and a light distribution lens.

Figure 23 is a cross-sectional view taken along the line XXIII-XXIII of Figure 22 .

Fig. 24 is a perspective view of the one end portion of the cable with the connector and its vicinity as seen from above.

Fig. 25 is a perspective view of an end portion of a cable with a connector and a portion in the vicinity thereof as seen from below.

Fig. 26 is a plan view showing a lighting fixture in which a lower surface of a heat sink of one LED module is fixed to an upper surface of a heat dissipating member and a connector of a cable with a connector is connected, and a light distribution lens is omitted.

Fig. 27 is a schematic plan view of the lighting fixture of Fig. 24 in which the translucent cover and the chassis are omitted.

Fig. 28 is a plan view similar to Fig. 27 of a lighting fixture different from that of Figs. 26 and 27, which is constructed using one LED module.

Fig. 29 is a plan view similar to Fig. 27 of a lighting fixture different from that of Figs. 26 to 28, which is constructed using one LED module.

Fig. 30 is a plan view similar to Fig. 27 of a lighting fixture different from that of Figs. 26 to 29, which is constructed using one LED module.

Fig. 31 is a plan view similar to Fig. 27 of a lighting fixture in which a plurality of LED modules are connected in a chain.

Fig. 32 is a plan view similar to Fig. 27 of a lighting fixture of a different mode from Fig. 31, in which a plurality of LED modules are connected in a chain.

Fig. 33 is a cross-sectional view corresponding to Fig. 23 of a modification.

FIG. 34 is a view showing a protruding portion of a second light distribution lens according to another modification.

Fig. 35 is a cross-sectional view corresponding to Fig. 23 of still another modification.

FIG. 36 is a perspective view of a protruding portion of a second light distribution lens according to a modification different from the above-described respective modifications.

37 is an enlarged perspective view of a mounting surface, a reflection film, and an LED of a modification different from the above-described respective modifications.

Hereinafter, an embodiment of the present invention will be described with reference to the drawings. In addition, The front, back, left and right, and up and down directions in the following description are based on the direction of the arrow in the figure.

In the present embodiment, the LED module 10 is used as a light source of the lighting fixture 66 (see FIGS. 26 to 30).

The LED module 10 (semiconductor light-emitting element module) is provided with an LED 62, a bonding wire 64, and a sealant on the LED holder 15 (a holder for a semiconductor light-emitting element) (and, in some cases, a bonding wire 90 to be described later). ) and formed by integration. First, the detailed structure and manufacturing method of the LED holder 15 will be described.

FIG. 1 shows a conduction plate 17 as a base material of the socket 15 for LED. The conductive plate 17 is formed by press-molding a metal flat plate having excellent electrical conductivity, thermal conductivity, and rigidity, such as brass, beryllium copper, or copper alloy. The overall shape of the conduction plate 17 is a flat shape extending in the front-rear direction (only a part of the conduction plate 17 is illustrated in FIG. 1). The left and right side portions of the conduction plate 17 are constituted by the load-bearing portions 18A and 18B extending in the front-rear direction, and the load-bearing connection portions 19 provided at equal intervals in the front-rear direction connect the plurality of portions of the load-bearing portion 18A and the load-bearing portion 18B to each other. A transfer hole 18C is bored in the carrier portion 18A and the carrier portion 18B at equal intervals. Two first conductive members 20 and second conductive members 21 are formed on each of the portions surrounded by the carrying portions 18A and 18B and the adjacent two load connecting portions 19. In addition, the two first conductive members 20 are integrated with the carrying portions 18A, 18B and the load-bearing connecting portion 19 through the two first cutting bridges 22, respectively, and the two second conductive members 21 are all connected by a second cutting bridge. The device 23 is integrated with the load-bearing connection portion 19. Further, the adjacent first conductive member 20 and second conductive member 21 are connected to each other by a third cut bridge 24. An arc-shaped wire connecting portion 20A is formed on the inner peripheral edge portion of the first conductive member 20. In a portion of the first conductive member 20 different from the wire connecting portion 20A, a cable connecting portion 20B extending linearly in a direction parallel to the carrying portions 18A, 18B is protruded, and a non-circular shape is formed in other portions. The engaging hole 20C. On the other hand, a wire connecting portion 21A having an arc shape (the same shape as the wire connecting portion 20A) is formed on the inner peripheral edge portion of the second conductive member 21. Further, in a portion of the second conductive member 21 that is different from the wire connecting portion 21A, a cable connecting portion 21B that linearly extends in a direction parallel to the cable connecting portion 20B is protruded, and a non-woven portion is provided in another portion. A circular shaped engagement hole 21C.

In the conduction plate 17 of such a structure, the sprocket of the conveying device (not shown) is engaged with each of the conveying holes 18C of the conduction plate 17, and the sprocket is rotated to be conveyed forward. Further, when transported to a predetermined position, a primary molding die (not shown) composed of a pair of molds located above and below the conduction plate 17 is closed, and the conduction plate 17 is housed in the primary molding die. When being conveyed to the predetermined position, the plurality of support pins (not shown) provided in the primary molding die are fitted to the positioning holes (not shown) formed in the conduction plate 17, and the conduction plate 17 is fixed once. Formed in the mold. Further, injection molding (primary molding, insert molding) using a resin material (for example, a liquid crystal polymer or the like) having high insulating properties and heat resistance is performed in the primary molding die. Further, when the respective molds of the primary molding die are separated from the conduction plate 17 after the resin material is cured, a plurality of integrated bodies in which the plurality of primary resin molded portions 30 are integrally formed on the surface of the conductive plate 17 are present (hereinafter, It is called a one-piece (only one is shown in Figure 2 to Figure 4).

As shown in the figure, the primary resin molded portion 30 (base member) includes a main body portion 31 having a substantially square shape in plan view, and the first conductive member 20, the second conductive member 21, the first cutting bridge 22, and the second cut are provided. The break bridge 23 and the third cut bridge 24 are integrated and form a circular through hole at the center; two connecting arms 43 extend from two portions of the main body portion 31 and are integrated with the front and rear load bearing portions 19. . The main body portion 31 includes an annular inner wall portion 32 that is circular (conical) in plan view, and constitutes an outer shape of the through hole, and four inner protruding portions 33 that are adjacent to the inner periphery of the annular inner wall portion 32. The four portions of the portion are connected and fill the space between the ends of the adjacent first conductive member 20 and second conductive member 21. Further, on the upper surface of the main body portion 31, two bridge exposure holes 35 for exposing the respective third cutting bridges 24 are formed, and engaging holes are formed in four places on the upper and lower surfaces of the main body portion 31. The engaging hole 33 is exposed in the 20C and the engaging hole 21C. Further, a connector connecting protrusion 37 is formed at each of the two portions of the main body portion 31, and the upper surface of the front end portion of the cable connecting portion 20B and the cable connecting portion 21B is exposed, and the cable connecting portion is formed. 20B and the cable connecting portion 21B are integrated; a connector connecting groove 38 is formed around each connector connecting protrusion 37; and two engaging recesses 39 are respectively recessed in each of the connector connecting grooves 38. Side (right side and left side). Further, on the lower surface of the primary resin molded portion 30, eight lower surface side protrusions 40A, 40B, 40C, and 40D projecting downward from the conduction plate 17 are protruded. In addition, the primary resin molded portion 30 includes two outer peripheral walls 41 having a substantially L-shaped cross section that protrudes to a position lower than the lower surface side protruding portions 40A, 40B, 40C, and 40D, and are formed on the inner faces of the outer peripheral walls 41. There is one engaging claw 42 (only one is shown in Figs. 3 and 7).

Then, each of the primary integrated materials (the conductive plate 17 and the primary resin molded portion 30) is transported to a predetermined position in the front by the transfer device, and the conduction plate 17 is turned on by a primary cutting device (not shown) disposed at the predetermined position. The first cutting bridge 22, the second cutting bridge 23, and the third cutting bridge 24 are cut (one cut). Specifically, each of the first cutting bridge 22 and the second cutting bridge 23 is cut in a direction parallel to the outer peripheral surface of the main body portion 31 of each primary resin molded portion 30, and the bridge exposure hole 35 is used. The central portion of each of the third cutting bridges 24 is cut (see Fig. 5).

Then, the primary unit is transported to a predetermined position in the front by the transport device.

A plurality of heat dissipation (the same amount as the primary one) is disposed at the predetermined position The unit 45 (base member) (heat transfer member) is placed directly below the primary unit when the primary unit is transported to the predetermined position (Fig. 6 and Fig. 7).

The heat sink 45 is an integrally molded product made of a metal such as aluminum, and has a higher thermal conductivity than the primary resin molded portion 30 (and the secondary resin molded portion 54 to be described later). The outer shape of the heat sink 45 is substantially the same as that of the main body portion 31. The upper half of the heat sink 45 is constituted by the accommodated portion 46 having a shape slightly larger than the lower half in plan view, and the locking recess 47 is formed at two locations on the lower surface of the outer peripheral edge portion of the accommodated portion 46 (in FIG. 7). And only one of them is shown in FIG. The lower surface of the heat sink 45 is constituted by an abutting surface 48 formed of a flat surface. A low-cylindrical LED support portion 49 is protruded from a central portion of the upper surface of the heat sink 45. The upper surface of the LED support portion 49 is constituted by a mounting surface 49a composed of a horizontal plane. Further, two circular recesses 50 and two non-circular recesses 51 are recessed in the upper surface of the heat sink 45.

When each of the primary integrated bodies (the conductive plate 17 and the primary resin molded portion 30) is located directly above the respective heat sinks 45, the transfer device raises the respective heat sinks 45 toward the respective primary bodies (see FIGS. 8 and 9). As a result, the accommodated portion 46 of each of the heat sinks 45 is housed in a space surrounded by the two outer peripheral walls 41 of the corresponding primary integrated body, and a part (two portions) of the outer peripheral surface of the storage portion 46 is The inner peripheral surfaces of the two outer peripheral walls 41 face each other while forming minute voids, and the upper surface of the accommodating portion 46 is in surface contact with the lower surfaces of the lower surface side protrusions 40A, 40B, 40C, and 40D. At this time, four ridges (downward ridges located around the four engagement hole exposure holes 36) formed on the lower surface of the primary body (the main body portion 31) are respectively fitted to the two circular shapes. The recess 50 and the two non-circular recesses 51. Further, since the two engaging claws 42 are engaged with respect to the two locking recesses 47 from below, the heat sink 45 is temporarily fixed with respect to the main body portion 31 (the main body portion 31 and the heat sink 45 are integrated). Further, the LED support portion 49 is slidably fitted to a circular hole in the center of the main body portion 31. LED branch with respect to the inner peripheral surface of the wire connecting portion 20A and the wire connecting portion 21A and each inner protruding portion 33 The outer circumference of the receiving portion 49 faces away from the inner peripheral side, and an annular space S is formed therebetween (see FIG. 8).

The integrated body of the primary body (the conductive plate 17 and the primary resin molded portion 30) and the heat sink 45 is further conveyed to a predetermined position in the front by the transfer device.

Then, the secondary molding die (not shown) which is formed by the pair of upper and lower molds of the integrated object is closed, and this integrated object is accommodated in the secondary molding die. At this time, a plurality of support pins (not shown) provided in the secondary molding die are fitted into the positioning holes, and the integrated body is fixed in the secondary molding die. Then, a resin material (for example, a liquid crystal polymer or the like) having high insulating properties and heat resistance is injection molded (embedded molding. Secondary molding) in the secondary molding die. Then, when the secondary molding die is separated up and down after the resin material is cured, secondary resin molding is formed on the surface of the integral body of the primary body (the conduction plate 17 and the primary resin molding portion 30) and the heat sink 45. The integral (secondary integrated body) of the portion 54 (base member) (see Figs. 10 and 11). As shown in the figure, the secondary resin molded portion 54 is formed by sandwiching the primary resin molded portion 30 and the heat sink 45 (the covering claw 42 and the locking concave portion 47 are covered), and thus is cured by the secondary resin molding portion 54 once. The resin molded portion 30 and the heat sink 45 are completely fixed. The secondary resin molded portion 54 has an annular wall 55 that is formed by a conical surface that covers the surface of the annular inner wall portion 32 and has a circular shape in plan view and that is continuous with the upper surface of each of the inner protruding portions 33. Further, the annular portion 56 constituting a part of the secondary resin molded portion 54 is filled between the inner peripheral surface of the wire connecting portion 20A and the wire connecting portion 21A and the outer peripheral surface of each of the inner protruding portions 33 and the LED supporting portion 49. The annular space S (see FIG. 10), the upper surface of the annular portion 56 is flush with the mounting surface 49a of the LED support portion 49 and the upper surface of each of the inner protruding portions 33 (with the mounting surface of the LED support portion 49) 49a and the upper surface of each inner protrusion 33 are continuous). In addition, the secondary resin molded portion 54 fills a gap formed between the lower surface of the primary resin molded portion 30 and the upper surface of the accommodated portion 46 (eight lower surface side projections 40A of the primary resin molded portion 30, The gap formed between 40B, 40C, 40D). In addition, the covering protrusions 57 which are formed (expanded) on the outer peripheral surface of the secondary resin molded portion 54 are covered by the first cutting bridge 22 and the second cutting bridge 23 which are exposed before the secondary molding. The end.

Then, each of the secondary integrated bodies (the conductive plate 17, the primary resin molded portion 30, the heat sink 45, and the secondary resin molded portion 54) is transported to a predetermined position in the front side by the transfer device.

A pad printer (not shown) is disposed at the predetermined position, and when the secondary integrated object is transported to the predetermined position, each of the secondary integrated objects is placed in the pad printing machine. Further, the upper surface of the four inner protrusions 33, the mounting surface 49a of the LED support portion 49, the surface of the annular wall 55, and the upper surface of the annular portion 56 are continuously (integrally printed) from the pad printer. The reflection film 58 was formed into a film having a thickness of 30 μm (see FIGS. 12 and 13). The reflective film 58 is obtained by mixing titanium oxide (TiO ₂ ) or the like as a colorant in a urethane resin as a main component, and has insulating properties as a whole. Since the reflective film 58 contains a coloring agent, it is white, and the color (hue) is different from the heat sink 45 made of aluminum, and the (light) visible light reflectance is higher than that of the primary resin molded portion 30, the heat sink 45, and the secondary resin molded portion. 54 is high (specifically, the visible light reflectance is 90% or more, preferably 95% or more). Further, the reflection film 58 formed on the LED support portion 49 is formed to avoid a part of the attachment surface 49a. That is, as shown in the figure, the mounting surface 49a is formed so as to avoid a plurality of (36 in total) rectangular regions in plan view. Each of the rectangular regions in plan view constitutes an LED fixing portion 59 (semiconductor light-emitting element fixing portion), and a film thickness corresponding to the thickness of the reflecting film 58 is generated between the upper surface of the reflecting film 58 and the LED fixing portion 59 (mounting surface 49a). The height difference.

Then, the secondary integrated object is transported to a predetermined position in the front by the transport device, and each of the connecting arms 43 is cut (secondary cutting) by a secondary cutting device (not shown) disposed at the predetermined position. Specifically, each end surface of the covering protrusion 57 corresponding to each of the connecting arms 43 is The connecting arm 43 is linearly cut, and the secondary integrated body is cut out from the load-bearing connecting portion 19 (and the carrying portions 18A and 18B) (see FIG. 13). As a result, a completed product of the plurality of LED holders 15 that are not exposed to the connection portions (fracture surfaces, unnecessary metal portions) of the carrier portions 18A and 18B and the load-bearing connection portion 19 is obtained.

Next, a method of manufacturing the LED module 10 by the LED holder 15 will be described.

The LED 62 (semiconductor light-emitting element) having a substantially rectangular parallelepiped shape is fixed to each of the LED support portions 49 of the LED holder 15 . As shown in the figure, the planar shape of each of the LEDs 62 is substantially the same as that of the LED fixing portion 59 (slightly smaller than the LED fixing portion 59). When the LED 62 is fixed to the LED fixing portion 59, an adhesive (not shown) is first applied to each of the LED fixing portions 59 (mounting surface 49a), and then the LED carrying device (not shown) mounts the LED 62 on each of the LEDs. The fixing portion 59 (see Fig. 15). As described above, since a height difference corresponding to the film thickness of the reflective film 58 is generated between the upper surface of the reflective film 58 and the LED fixing portion 59 (the LED fixing portion 59 is a concave portion surrounded by the reflective film 58), it can be simple and The LEDs 62 are reliably mounted (fitted) to the respective LED fixing portions 59. Further, since a height difference corresponding to the film thickness of the reflection film 58 occurs between the upper surface of the reflection film 58 and the LED fixing portion 59, it is possible to suppress the flow of the adhesive applied to the LED fixing portion 59 (mounting surface 49a) to The periphery of the LED fixing portion 59 (on the side of the reflection film 58). Further, the LED transport device includes a sensor that recognizes a color difference, and the LED transport device mounts the LED 62 while recognizing a hue difference (boundary line) between the reflective film 58 and the LED fixing portion 59 (mounting surface 49a). The LED fixing portion 59. Therefore, the LED 62 can be reliably placed on the LED fixing portion 59.

Next, as shown in FIG. 15, the terminals exposed by the upper surfaces of the adjacent LEDs 62 fixed to the respective LED fixing portions 59 are connected to each other by the bonding wires 64 (thick lines shown in FIG. 15), and the bonding wires 64 are used. The terminal of the LED 62 located at a position facing the wire connecting portion 20A is connected to the wire connecting portion 20A, and at the same time, the wire 64 is positioned at a position facing the wire connecting portion 21A. The terminal of the LED 62 is connected to the wire connecting portion 21A (further, if necessary, the bonding wire 90 to be described later).

Finally, the upper surface of the secondary resin molded portion 54 (a circular hole formed on the inner peripheral side of the upper edge portion of the annular wall 55) is coated with a thermosetting resin material or an ultraviolet curable resin having light transmissivity and insulating properties. A sealant composed of a material or the like (not shown). Then, the wire connecting portion 20A, the wire connecting portion 21A, the inner protruding portion 33, the reflecting film 58, the LED 62, and the bonding wire 64 (90) are completed by the LED module 10 covered with the sealant.

The LED module 10 configured as described above can be utilized as a constituent article of the lighting fixture 66 shown in FIGS. 26 to 32.

The lighting fixture 66 is provided with a chassis 68 (heat dissipation member) made of a metal plate. The LED module 10 is fixed to the chassis 68 in a state where the abutting surface 48 of the heat sink 45 is in contact with the upper surface of the chassis 68.

Further, the lighting fixture 66 includes a light distribution lens 70 (optical element) detachably attached to the LED module 10 and a cable 75 with a connector.

The light distribution lens 70 includes a first light distribution lens 71 (first optical element) and a second light distribution lens 72 (second optical element) each composed of a light transmissive material (for example, a resin such as glass or acrylic).

The first light distribution lens 71 includes a main body portion that is an annular rotational symmetry body centering on an axis AL (see FIGS. 16 to 19 and 23 ) extending in the vertical direction (the direction in which the LEDs 62 and the light distribution lens 70 face each other). 71a and a total of four fixing legs 71c (supported portions) projecting from the lower surface of the main body portion 71a. A support portion 71b having a circular cross section is formed in the center portion of the main body portion 71a as a through hole.

The second light distribution lens 72 integrally has a fitting portion 73 constituting an upper portion thereof and a protruding portion 74 constituting a lower portion thereof. The fitting portion 73 is a cylindrical body centered on the axis line AL (reference line), and has an outer diameter substantially the same as the inner diameter of the support portion 71b. The protruding portion 74 is a cone centered on the axis AL of the first light distribution lens 71. In other words, the inclined reflecting surface 74a which is the outer peripheral surface of the protruding portion 74 is a conical surface which is gradually reduced in the orthogonal direction distance (radial distance) with respect to the axis AL as it is close to the lower side from the upper side. Further, a conical surface coating 74b having a higher visible light reflectance than the inclined reflecting surface 74a (second light distribution lens 72) (for example, a thin film coating of silver or the like formed by vapor deposition or sputtering) is applied to the entire inclined reflecting surface 74a. A material such as titanium oxide (TiO ₂ ) is mixed with the urethane resin.

The light distribution lens 70 is fitted (pressed) to the support portion 71b of the first light distribution lens 71 in a fixed state by the fitting portion 73 of the second light distribution lens 72, and the first light distribution lens 71 and the second light distribution lens 71 are provided. The upper surface of the optical lens 72 is formed on the same surface (continuous). Further, the fixed state may be maintained by providing a mechanical locking device (not shown) that holds the fixing portion 73 and the support portion 71b in a fixed state, or by bonding. The upper surface of the first light distribution lens 71 and the second light distribution lens 72 is coated with a light diffusion function (a function of diffusing the upward illumination light) over the first light distribution lens 71 and the second light distribution lens 72. The surface has a high diffusion coating 71d, 73a.

The light distribution lens 70 configured as described above is attached to the corresponding engagement hole 20C and the engagement hole 21C by fitting (pressing) the four fixing legs 71c, and is attached to the LED module 10 in a fixed state (however, it is detachable) . When the light distribution lens 70 is attached to the LED module 10, the lower surface (inclined reflection surface 74a) of the main body portion 71a and the second light distribution lens 72 form a gap with the LED module 10 and face each other in the direction of the axis AL (refer to FIG. 23). . Further, the axis AL is orthogonal to the mounting surface 49a of the LED support portion 49 (and the planar light-emitting surface formed on the upper surface of each LED 62).

Cable 75 with connector, by integrating two cables 77 and connector 80 Made. The flexible cable 77 includes a wire 78 that bundles a plurality of metal wires, and a covered pipe 79 made of an insulating material on the surface of the covered wire 78. Both ends of each cable 77 are removed by the covered pipe 79. The wire 78 is exposed. The connector 80 has an insulator 81 made of an insulating material and first and second contacts 85 and 87. A locking protrusion 82 extending in the front-rear direction is formed on both side portions of the insulator 81 as a hollow member, and a retaining projection 83 is protruded from the front end portion of the right and left locking protrusions 82. Further, the lower surface of the front end portion (rear half portion) of the insulator 81 is formed in a thin wall shape, and two long grooves 84 communicating with the internal space of the insulator 81 are formed on the lower surface. Each of the first contact 85 and the second contact 87 is made of a conductive material (metal or the like), and is inserted into the internal space of the insulator 81 in a fixed state. At one end (front end) of the first contact 85 and the second contact 87, the electric wires 78, the first contact 85 and the second contact of the one end portion (rear end portion) of the two cables 77 are crimped (connected), respectively. The other end portion (rear end portion) of the point 87 is constituted by the elastically deformable first contact piece 86 and the second contact piece 88 which protrude through the corresponding long groove 84 and below the insulator 81.

As shown in FIG. 26, the cable 75 with a connector is detachable with respect to the connector connection protrusion 37 and the connector connection groove 38 (the cable connection part 20B and the cable connection part 21B) of the LED module 10. That is, the connector 80 is inserted into the connector connecting groove 38, and the right and left locking protrusions 82 are fitted to the right and left side portions of the connector connecting groove 38. Then, since the right and left retaining projections 83 are engaged with the right and left engaging recesses 39, the connector connecting projections 37 and the connector connecting grooves 38 and the connector 80 can be held without unintentionally pulling out the connector 80. Connection status. Moreover, when the connector 80 is connected to the connector connecting projection 37 and the connector connecting groove 38, the first contact piece 86 of the first contact 85 and the second contact piece 88 of the second contact 87 are elastically deformed. At the same time, it is in contact with the cable connecting portion 20B and the cable connecting portion 21B, respectively.

The lighting fixture 66 (LED module 10) of the present embodiment can be various Way to implement.

26 to 30 are diagrams in which the lighting fixture 66 is constituted by one LED module 10.

The lead wire connecting portion 20A and the wire connecting portion 21A on the front side of the LED module 10 (the socket 15 for LEDs) shown in FIG. 26 and FIG. 27, and any one of the wire connecting portion 20A and the wire connecting portion 21A on the rear side pass through The bonding wires 90 are connected. In addition, the connector 80 of the cable 75 with the connector is connected to one of the connector connecting protrusions 37 of the LED module 10 and the connector connecting groove 38, and the two cables of the cable 75 with the connector 77 is connected to the anode and cathode of the power source, respectively.

When the switch omitted from the illustration is switched from off to on, the current generated by the power source flows through the cable 77 to the parallel circuit composed of the wire connecting portion 20A, the wire connecting portion 21A, the LED 62, the bonding wire 64, and the bonding wire 90. Therefore, in each of the LEDs 62 (in FIG. 27, all of the LEDs on the left side of the center portion of the LED module 10 are collectively shown as LEDs 62A, and all of the LEDs 62 on the right side of the center portion are collectively shown as LEDs 62B) emit light.

On the other hand, when the switch is switched from on to off, the supply of current to the LED 62 is cut off, and the LEDs 62 are turned off.

The wire connecting portion 20A and the wire connecting portion 21A on the right side of the LED module 10 (the socket 15 for LEDs) constituting the lighting fixture 66 shown in FIG. 28 are connected by a bonding wire 90. In addition, the connector 80 of the cable 75 with the connector is connected to one of the connector connecting protrusions 37 of the LED module 10 and the connector connecting groove 38, and the two cables of the cable 75 with the connector 77 is connected to the anode and cathode of the power source, respectively. Further, the manner in which the LEDs 62 are connected to the wire connecting portion 20A and the wire connecting portion 21A via the bonding wire 64 is changed from the above-described manner. That is, all of the LEDs 62 located on the front side of the center portion of the LED module 10 (collectively referred to as LEDs 62C in FIG. 28) are connected to the front side wire connecting portion 20A and the wire connecting portion 21A by the bonding wires 64, and are located at the LED module 10 All of the LEDs 62 on the rear side of the center portion (collectively referred to as LEDs 62D in FIG. 28) are connected to the wire connecting portion 20A on the rear side and the wire connecting portion 21A by the bonding wires 64. The lighting fixture 66 has a series circuit including a wire connecting portion 20A, a wire connecting portion 21A, an LED 62, a bonding wire 64, and a bonding wire 90.

Further, in the lighting fixture 66 shown in FIG. 28, instead of connecting the wire connecting portion 20A on the right side of the LED module 10 (the socket for the LED 15) and the wire connecting portion 21A by the bonding wire 90, it may be configured to be short-circuited. The connector 92 is connected to the other connector connecting projection 37 and the connector connecting groove 38. The short-circuit connector 92 includes an insulator corresponding to the insulator 81 and two contacts corresponding to the first contact 85 and the second contact 87, and the two contacts are short-circuited to each other inside the insulator.

In the lighting fixture 66 shown in FIG. 29, the connectors 80 of the two cables 75 with connectors are respectively connected to the two connector connecting projections provided on the LED module 10 (the LED holder 15). 37 and the connector connecting groove 38, the ends of the connector 80 on the opposite side of the connector 75 are connected to the anode and cathode of the other power source, respectively.

The lighting fixture 66 shown in Fig. 30 is different from the wiring of the LED 62 via the bonding wire 64 to the wire connecting portion 20A and the wire connecting portion 21A in the same manner as in Fig. 29 (the same as Fig. 28 except that the bonding wire 90 is not provided). Other than the point, it is the same as the configuration of FIG.

In the lighting fixture 66 shown in FIGS. 31 and 32, a plurality of (three or four or more LED modules 10 are illustrated in FIGS. 31 and 32) LED modules 10 are interlocked. It is formed by a connection.

The lighting fixture 66 shown in FIG. 31 includes a plurality of LED modules 10 having the configuration shown in FIGS. 26 and 27, and the adjacent LED modules 10 are connected to each other with a connector 80 at both ends. The cable 75' of the connector is connected.

The lighting fixture 66 shown in FIG. 32 includes one LED module 10 (the LED module 10 located at the rear in FIG. 32) having the configuration shown in FIG. 28 and a method of removing the bonding wire 90 from the LED module 10 shown in FIG. The plurality of LED modules 10, the adjacent LED modules 10 are connected to each other by a cable 75' with a connector. In the case where the lighting fixture 66 is configured as shown in FIG. 32, the wire connecting portion 20A and the wire connecting portion 21A on the right side of the LED module 10 (the holder 15 for LEDs) located at one end portion instead of the bonding wire 90 are used. The short-circuit connector 92 may be connected to the connector connecting projection 37 and the connector connecting groove 38 of the LED module 10 for connection.

Further, when the lighting fixture 66 is configured as shown in FIG. 31 or FIG. 32, each of the above-described chassis 68 may be fixed to each of the LED modules 10, or all of the LED modules 10 may be fixed to the front and rear direction. A chassis (heat sink. The illustration is omitted).

When the luminaire 66 is implemented as described in any of FIGS. 26 to 32, the (upward) straightness of the illumination light emitted from each of the LEDs 62 (the light-emitting surface formed on the upper surface of the LED 62) is high. As shown in FIG. 23, most of the illumination light of each LED 62 also travels upward. Further, most of the illumination light directly faces the light distribution lens 70 side, and the remaining portion of the illumination light is reflected by the reflection film 58 toward the light distribution lens 70 side.

A part of the illumination light (including the light reflected by the reflection film 58) toward the light distribution lens 70 faces the first light distribution lens 71 (the main body portion 71a), passes through the inside of the main body portion 71a, and passes through the upper surface of the main body portion 71a. (Diffusion coating 71d) is diffused to the upper side of the main body portion 71a (diffusion coating 71d) and simultaneously emitted (see an arrow in Fig. 23). Further, a part of the illumination light that has passed through the inside of the main body portion 71a and reaches the diffusion coating layer 71d is diffused downward by the lower surface of the diffusion coating layer 71d and simultaneously reflected.

On the other hand, the other portion of the illumination light (including the light reflected by the reflection film 58) that faces the light distribution lens 70 (the portion on the inner circumferential side of the illumination light that faces the main body portion 71a) faces the second light distribution lens 72. Projection portion 74 (inclined reflection surface 74a). Most of the illumination light is highly efficiently reflected by the conical surface coating 74b in the orthogonal direction (left-right direction) with respect to the axis AL (and the peripheral direction in the orthogonal direction), and is transmitted through the main body portion 71a to the main body portion. The outer peripheral side (left and right sides of FIG. 23) of 71a is emitted (refer to the arrow of FIG. 23). Further, a part of the remaining illumination light toward the protruding portion 74 (inclined reflecting surface 74a) passes through the inclined reflecting surface 74a and enters the inside of the second light distribution lens 72, and passes through the upper surface of the fitting portion 73 (diffusion coating) The layer 73a) is diffused toward the upper side of the fitting portion 73 (diffusion coating layer 73a) and simultaneously emitted (the remaining portion of the remaining illumination light toward the protruding portion 74 (inclined reflecting surface 74a) faces downward through the lower surface of the diffusion coating layer 73a. Diffusion and simultaneous reflection).

The above lighting fixture 66 can be used not only as an illumination device that illuminates indoors or the like, but also for various other uses (for example, a backlight for a liquid crystal display device).

In the present embodiment described above, the reflection film 58 having a higher visible light reflectance than the primary resin molded portion 30, the LED support portion 49, and the secondary resin molded portion 54 is formed in the LED module 10 (the LED holder 15). A resin portion having a low visible light reflectance in a circular recess of the upper surface (a portion on the inner peripheral side of the upper edge portion of the annular wall 55) (the upper surface of the four inner protrusions 33, the annular wall 55) The surface and the upper surface of the annular portion 56 and the mounting surface 49a (the resin portion and the mounting surface 49a are not exposed). Therefore, it is possible to reflect the light of the LEDs 62 attached to the respective LED fixing portions 59 (mounting surfaces 49a) without losing their strength as much as possible.

In addition, the LED holder 15 does not pass through the respective constituent elements (the conduction plate 17, the primary resin molding portion 30, the heat sink 45, and the secondary resin) that constitute the bracket 15 for the LED. After the molded parts 54 are formed separately, the respective constituent elements are assembled to each other and fixed by screws or the like, and the primary resin molded portion 30 and the secondary resin molded portion 54 are injection molded (inserted and formed), which is easy to manufacture. Manufacturing.

Further, the upper surface of each of the inner protrusions 33, the mounting surface 49a of the LED support portion 49, and the upper surface of the annular portion 56 are located on the same plane (continuous), and the mounting surface 49a and the annular wall 55 of the LED support portion 49 are provided. Since the upper surface of the annular portion 56 and the upper surface of each of the inner protrusions 33 are continuous, the reflection film 58 can be easily and smoothly formed on the upper surface of the inner protrusion 33, the mounting surface 49a of the LED support portion 49, and the ring. The surface of the wall 55 and the upper surface of the annular portion 56. Therefore, the reflection efficiency of the illumination light emitted from the LED 62 can be reliably improved by the reflection film 58.

Further, the heat generated by each of the LEDs 62 is conducted to the heat sink 45 via the reflective film 58 made of a thin film, and is radiated from the lower half (exposed portion) of the heat sink 45, and simultaneously from the heat sink 45 (abutment surface 48). After being conducted to the chassis 68 and radiated from the chassis 68, the heat of the LEDs 62 can be efficiently dissipated to the outside. Therefore, it is possible to prevent a decrease in the luminous efficiency of the LED 62 caused by the high temperature. In addition, since a large LED element having a large amount of heat can be used as the LED 62, the amount of light can be increased.

Further, since the LED module 10 includes the annular wall 55 located at a position close to the LED 62 (light distribution lens 70) (the portion of the reflection film 58 formed on the annular wall 55), it is possible to control the directivity of the illumination light generated by the LED 62 or Radiation angle. Further, since the reflection film 58 or the LED fixing portion 59 can be formed in the LED holder 15 in various ways (due to the degree of freedom in the arrangement of the LEDs 62 on the mounting surface 49a), the freedom of optical design can be obtained. The LED module 10 is large in that it suppresses uneven brightness of the LED 62, or dimming (adjustment of brightness) and color adjustment (warning of warm/cold colors, etc.).

Further, the light distribution lens 70 can diffuse the illumination light emitted from each of the LEDs 62 while using the oblique reflection surface 74a (conical surface coating 74b) and the diffusion coating layers 71d and 73a, so that it is possible to The entire periphery of the light distribution lens 70 (the upper side of the light distribution lens 70 and the outer circumferential direction of the first light distribution lens 71) is brightly illuminated.

Further, since the shape of the inclined reflecting surface 74a formed on the protruding portion 74 of the second light distribution lens 72 is relatively simple, the second light distribution lens 72 (and the light distribution lens 70) can illuminate the illumination light with respect to the axis AL. The orthogonal direction (left-right direction) (and the peripheral direction of the orthogonal direction) is efficiently reflected, but the manufacturing cost thereof does not become high.

Further, since the important configuration of the second light distribution lens 72 is the inclined reflection surface 74a (the surface is coated with the conical surface coating 74b), and the thickness and shape of the other portions are designed to be high, the second light distribution lens 72 can be made. It is a low height (reducing the upper and lower dimensions of the second light distribution lens 72).

Further, the mode (size, shape, and the like) of the second light distribution lens 72 can be made to correspond to the mode (size, shape, and the like) of the various first light distribution lenses 71 corresponding to the required specifications of the illumination device or the like. For example, as shown in FIG. 33, the upper surface of the first light distribution lens 71 and the upper surface of the second light distribution lens 72 may be formed by a curved surface (for example, a curved surface forming a part of a spherical surface), so that the entire second light distribution lens 72 is provided. It is lower in height than the above embodiment.

In addition, when the light distribution characteristics of the light distribution lens 70 are to be changed, one of the first light distribution lens 71 and the second light distribution lens 72 constituting the light distribution lens 70 may be replaced with another shape (for example, The second light distribution lens 72 is converted into a configuration in which the inclination angle with respect to the axis AL of the inclined reflection surface 74a is different from the angle shown, or the first light distribution lens 71 is changed to a predetermined state without changing the second light distribution lens 72. Structure), can make parts common. Therefore, the light distribution characteristics of the light distribution lens 70 can be easily changed at low cost, or the outer shape can be changed.

Although the present invention has been described above based on the above embodiments, the present invention is not limited to the above-described embodiments, and various modifications can be made.

The protruding portion 74 (inclined reflecting surface 74a) of the second light distribution lens 72 does not have to be a completely conical shape. For example, as shown in FIG. 34(a) as a side view, the front end (lower end) of the protruding portion 74 may be cut in a plane orthogonal to the axis AL. Further, as shown by the imaginary line in FIG. 34(a), the tip end of the protruding portion 74 may be configured to be hemispherical (or substantially hemispherical). Further, as shown by the imaginary line in FIG. 34(b) as a side view, it is also possible to use the inclined reflecting surface 74a' which is formed by a curved surface slightly bulging toward the outer peripheral side of the completely conical surface (inclined reflecting surface 74a) (with the axis) The AL-centered rotational symmetry plane constitutes the outer peripheral surface of the protruding portion 74. Further, as shown in a perspective view of FIG. 34(c) viewed from below, a polygonal conical surface (centered on the axis AL) may be used (the protruding portion 74 of FIG. 34(c) is a quadrangular pyramid, but it may be The inclined reflecting surface 74a'' formed by the polygonal pyramid other than the quadrangular pyramid constitutes the outer peripheral surface of the protruding portion 74. The outer peripheral surface (inclined reflecting surface) of the protruding portion 74 of each of the modifications is included in the "cone" of the present invention.

Further, as shown in FIG. 35, instead of the inclined reflecting surface 74a, the left and right distances from the axis AL may be inclined with respect to the axis AL and close to the lower side (the LED module 10 side) from above (relative to the axis AL). The inclined reflecting surface 73b formed by the plane which is gradually shortened in the orthogonal direction distance is configured as the second light distribution lens 72 (light distribution lens 70).

Further, as shown in FIG. 36, a protruding portion 74 including a pair of inclined reflecting surfaces 73b that are symmetrical with respect to the axis AL may be provided in the second light distribution lens 72.

Further, the curved surface such as a part of the conical surface and the plane such as the inclined reflecting surface 73b may be combined to form the outer peripheral surface of the protruding portion 74.

Further, the light distribution lens 70 may have a shape different from that of the illustrated shape.

Further, the entire light distribution lens 70 may be constituted by one member (the light distribution lens 70 may be integrally molded).

Further, the support portion 71b may be formed as a through hole without being formed as a through hole.

The material (function) and formation position of the coating applied to the light distribution lens 70 are not limited to the above embodiments. Further, the light distribution lens 70 may not be coated (for example, the diffusion coating layers 71d and 73a and the conical surface coating layer 74b). Further, instead of applying a coating to the light distribution lens 70, a rough surface (a surface rougher than other portions of the surface) may be formed on the surface of the light distribution lens 70, and the illumination light may be diffused by the rough surface.

Further, the light distribution lens 70 may be fixed to a member different from the LED module 10. For example, when the lighting fixture 66 is used as a backlight for a liquid crystal display device, the light distribution lens 70 may be fixed to the casing of the liquid crystal display device.

The portion corresponding to the primary resin molded portion 30 and the secondary resin molded portion 54 may be integrated with the first conductive member 20 and the second conductive member 21 in advance, and then the heat sink 45 may be fixed to the integrated body to be manufactured. LED holder 15. In this case, the portion corresponding to the primary resin molded portion 30 and the secondary resin molded portion 54 may be integrated with the first conductive member 20 and the second conductive member 21 by injection molding (embedded molding). After molding the portion corresponding to the primary resin molded portion 30 and the secondary resin molded portion 54, the molded article is assembled to the first conductive member 20 and the second conductive member 21.

The heat sink 45 may be formed of a material different from aluminum (a material having a higher thermal conductivity than the primary resin molded portion 30 and the secondary resin molded portion 54).

In addition, heat conduction between the abutting surface 48 of the heat sink 45 and the chassis 68 may also be provided. Sexual sheet or thermally conductive adhesive.

Further, the formation of the inner protrusion 33 or the annular portion 56 by the reflection film 58 may be omitted.

Further, as shown in FIG. 37, after the reflective film 58 is formed, the reflective film 95 which is thinner than the reflective film 58 (which may be the same composition as the reflective film 58) may be used as long as the visible light reflectance is lower than that of the primary resin molded portion 30. The device 45 and the secondary resin molding portion 54 are high, and the composition may be different from the reflection film 58) in each of the LED fixing portions 59 (mounting surface 49a), and then the LEDs 62 are fixed to the respective LED fixing portions 59 (on the reflective film 95). surface).

10‧‧‧LED module (semiconductor light-emitting element module)

45‧‧‧heatsink (base part) (heat transfer parts)

55‧‧‧ annular wall

59‧‧‧LED fixing part (semiconductor light-emitting element fixing part)

70‧‧‧Lighting lens (optical component)

71‧‧‧First light distribution lens (first optical element)

71a‧‧‧ Main body

71b‧‧‧Support

71c‧‧‧Fixed foot (supported part)

71d‧‧‧Diffusion coating

72‧‧‧Second optical lens (second optical element)

73‧‧‧Mate

73a‧‧‧Diffusion coating

74‧‧‧Protruding

74a‧‧‧Sloping reflective surface

74b‧‧‧Conical coating

Claims (5)

A lighting fixture comprising: a base member; a semiconductor light emitting element fixed to the base member; and an optical element facing the semiconductor light emitting element, wherein the optical element includes a protruding portion a semiconductor light emitting element side protruding; an inclined reflecting surface formed on an outer surface of the protruding portion, inclined with respect to a reference line of a straight line extending in a direction opposite to a direction of the semiconductor light emitting element and the optical element, and The optical element side is close to the semiconductor light emitting element side and the distance from the reference line in the orthogonal direction is gradually shortened. The lighting fixture according to claim 1, wherein the protruding portion is a cone centering on the reference line and gradually decreasing the orthogonal direction distance as approaching the semiconductor light emitting element, The outer surface of the cone constitutes an annular inclined reflecting surface located around the reference line. The lighting fixture according to claim 1 or 2, wherein the optical element includes a supported portion that is supported by the base member in a fixed state. The lighting fixture according to any one of claims 1 to 3, wherein the optical element includes: a first optical element having the protruding portion; and a second optical element having a through hole Or a support portion formed by a recess, the through hole or The recess is adapted to be fitted in the first optical element in a fixed state. The lighting fixture according to any one of claims 1 to 4, wherein the inclined reflecting surface is coated with a light reflectance higher than a light reflectance of the inclined reflecting surface.