TW201511320A - Reverse-side protective substrate, solar cell module, and method for producing solar cell module - Google Patents

Abstract

(Problem) To provide a method for producing a solar cell module in which, in a first step, a sealing material and a reverse-side protective substrate member (1) are laminated to produce an integrated article, and subsequently, in a second step, an obverse-side protective substrate, a sealing material, a cell, the integrated product, and a reverse-side protective substrate member (2) are layered in the stated order and compression-bonded to produce a solar cell module without the use of extrusion-coating or dry-lamination steps, whereby processability can be economically improved without any incidence of curling. (Solution) A method for producing a solar cell module, wherein the method is characterized by having a first step for laminating a sealing material and reverse-side protective substrate member (1) to produce an integrated product of the sealing material and the reverse-side protective substrate member (1), and having a subsequent second step for layering an obverse-side protective substrate, a sealing material, a cell, the integrated product, and a reverse-side protective substrate member (2) in the stated order and compression-bonding the layered article.

Description

Back protection substrate, solar cell module, and method of manufacturing solar cell module

The present invention relates to a back surface protection substrate for a solar cell module, a solar cell module using the same, and a method of manufacturing the solar cell module, and more particularly to a method for manufacturing a solar cell module, characterized in that The package material ‧ the back surface protection substrate member 1 (hereinafter, also referred to as "integral body") having a laminate of the sealing material and the back surface protective substrate member 1 is used in accordance with the surface protective substrate and the packaging material. Step 2 of superimposing and pressing the unit, the unitary body, and the member 2 for back surface protection substrate. Further, the invention of the method for producing a solar cell module according to the invention is characterized in that, in the first aspect, the laminate 1 and the back protective substrate member 1 are used to manufacture a package material and a back protective substrate member 1 And a step 2: the surface protective substrate, the encapsulant, the unit, the unitary body, and the back protective substrate member 2 are superposed and pressure-bonded in this order.

Further, a back surface protective substrate for a solar cell module, which is a laminate of a back surface protective substrate member 1 and a back surface protective substrate member 2, is characterized in that the back surface protective substrate, the back surface protective substrate The layer on the side surface connected to the back protective substrate member 2 in the member 1 is a layer mainly composed of an olefin resin (hereinafter referred to as an olefin layer 1); the olefin layer 1 has an adhesive property (hereinafter, it will have The subsequent olefin layer 1 is referred to as an adhesive layer 1); the composition and back surface of the back protective substrate member 2 The layer on the side surface to which the member for protecting the substrate 1 is bonded has an adhesive property (hereinafter, this layer is referred to as an adhesive layer 2).

Furthermore, a solar cell module is characterized in that the back surface protective substrate is provided.

In general, the solar cell module has a structure in which a surface-protective substrate of generally glass is sequentially laminated from the surface (light-receiving surface) side, and generally an ethylene-ethylene acetate copolymer is used as a main component. The surface side package material, the solar cell unit, the back side package material, and the back surface protection substrate; and the steps of laminating the respective structural members, pressure bonding and integration, such as a vacuum lamination step, to fabricate the solar cell module.

On the other hand, a back surface protective substrate which is one of the solar cell module members has been known for various structures. As an example, a back surface protective substrate for a solar cell including a substrate and a thermoplastic resin has been proposed (for example, see Patent Document 1). In Patent Document 1, a thermoplastic resin for ensuring adhesion to a substrate is a structure obtained by modifying a resin such as ethylene or acrylic. Further, in the pressure bonding step under vacuum lamination, the thermoplastic resin exhibits an effect of ensuring adhesion to the back side encapsulant.

However, in order to obtain the above-mentioned back surface protective substrate, the base material and the thermoplastic resin are integrated. In Patent Document 1, a thermoplastic resin is extrusion-coated on polyethylene terephthalate (hereinafter, it is called A "PET" film is formed on the substrate to form a back protective substrate. The extrusion coating system is expensive and becomes economically quite Lee. Moreover, after extrusion coating, it may become crimped in the back surface protection base material, and it may become a malfunction. Further, in order to ensure adhesion to the substrate, a thermoplastic resin composed of a modified resin such as ethylene or acrylic acid is used, but polyethylene terephthalate and modified resin used as a substrate are used. The next mechanism is a weak bond such as a hydrogen bond, and there is a problem of lack of adhesion in a severe environment of high temperature and high humidity.

In the vacuum lamination step in the production of the solar cell module, the surface protective substrate, the encapsulant, the solar cell, the encapsulant, and the back protective substrate member are stacked in this order and carried into the vacuum lamination device. At the time, the back surface of the substrate is curled by the heat of the vacuum lamination device, and the yield of the step is lowered.

Further, in the case where the base material is integrated with the thermoplastic resin as the back surface protective base material, as a conventional technique, the base material and the thermoplastic resin are dry-laminated by the adhesive. In this case, in the back surface protective substrate, since the substrate and the thermoplastic resin are dry-laid by the adhesive, the laminate is subsequently curled, but it is generated and extruded in the vacuum lamination step (step 2). The same shrinkage is applied in the case of coating, which may cause a decrease in the yield of this step. Further, since the back surface protective substrate is produced through the dry lamination step, it has a problem that the cost is increased.

[Previous Technical Literature] [Patent Literature]

[Patent Document 1] Japanese Patent Laid-Open Publication No. 2012-209462

In order to solve the above problems, the present invention has been made in an effort to provide a method for producing a solar cell module, which is a package material for a laminate of a package member and a back member for protecting a substrate 1 and a back surface protective substrate. It is economically advantageous to manufacture a solar cell module by superimposing and pressure-bonding one of the members 1 in the order of the surface protective substrate, the encapsulant, the unit, the integrated body, and the back protective substrate member 2 in order to manufacture the solar cell module. There is no curling or the like, and the steps can be improved.

In particular, it is particularly preferable to manufacture the integrated body in the step 1, the laminated package and the back protective substrate member 1, followed by the extrusion coating or dry lamination step, and in step 2, by surface protecting the substrate and encapsulating The material, the unit, the integrated body, and the member 2 for back surface protection substrate are laminated and pressure-bonded in this order to manufacture a solar cell module.

Further, in order to provide a back surface protective substrate, the layer on the side surface of the back surface protective base member 1 and the back surface protective base member 2 is an olefin layer 1, and the olefin layer 1 is provided. The adhesive layer having the adhesiveness; the layer on the side surface of the back protective substrate member 2 that is connected to the back protective substrate member 1 has an adhesive property, and the back surface is in a harsh environment of high temperature and high humidity. The protective substrate is also a laminate that ensures the adhesion between the back protective substrate member 1 and the back protective substrate member 2.

Further, in order to provide a solar battery module, the solar battery module has the back surface protective substrate.

The present invention for solving the above problems is the following (1) to (16).

1) A method of manufacturing a solar cell module, characterized in that the method for manufacturing a solar cell module comprises the steps of: a component for encapsulating a package and a substrate for protecting a back surface, and manufacturing a member for a package of a back surface protection substrate 1 one body (hereinafter, simply referred to as a unitary body); and then having step 2: overlapping, pressure-bonding the surface protection substrate, the package material, the unit, the unitary body, and the back surface protection substrate member 2 in this order .

2) A method of manufacturing a solar cell module, characterized in that the method of manufacturing a solar cell module has a step 2: a member for encapsulating material ‧ a back protective substrate member (hereinafter, also simply referred to as an integral body) In the order of the surface protective base material, the sealing material, the unit, the integrated body, and the back protective substrate member 2, the laminate is laminated and pressure-bonded, and the integrated package and the back protective substrate member 1 are laminated.

3) The method for producing a solar cell module according to 1), wherein the laminate of the encapsulating material and the back protective substrate member 1 in the step 1 is performed by co-extrusion.

(4) The method for producing a solar cell module according to any one of the items 1 to 3, wherein the member for back surface protective substrate 1 has a layer containing an olefin resin as a main component.

(5) The method for producing a solar cell module according to any one of the items 1 to 4, wherein the member for back surface protective substrate 1 has two layers of an olefin resin as a main component.

(6) The method for producing a solar cell module according to any one of the items 1 to 5, wherein the layer on the side surface of the member for back surface protective substrate 1 and the member for back surface protective substrate 2 is an olefin Resin as the main component The layer (hereinafter referred to as olefin layer 1); the olefin layer 1 has an adhesive property (hereinafter, the olefin layer 1 having an adhesive property is referred to as an adhesive layer 1).

(7) The method for producing a solar cell module according to any one of the items 1 to 6, wherein the layer on the side surface of the member for back surface protective substrate 2 and the member for back surface protective substrate 1 have adhesion ( Hereinafter, this layer will be referred to as an adhesive layer 2).

The method of manufacturing a solar cell module according to any one of the items 1 to 7, wherein the encapsulating material is mainly composed of an olefin resin.

9) A back protective substrate for a solar cell module, wherein the back protective substrate is characterized in that the back protective substrate member 1 and the back protective substrate member 2 are The layer of the side surface of the back surface protective base member 1 which is connected to the back surface protective base member 2 is a layer containing an olefin resin as a main component (hereinafter referred to as an olefin layer 1); the olefin layer 1 has an adhesive property (hereinafter, the olefin layer 1 having an adhesive property is referred to as an adhesive layer 1); and the layer on the side surface of the back surface protective base member 2 which is connected to the back surface protective base member 1 has an adhesive property ( Hereinafter, this layer will be referred to as an adhesive layer 2).

10) The back protective substrate for a solar cell module according to 9), wherein the adhesive layer 2 is obtained from a composition containing a urethane resin (hereinafter referred to as a composition 2).

11) The back protective substrate for the solar cell module described in 10), The composition 2 contains at least one selected from the group consisting of a melamine resin, an epoxy resin, and an olefin resin.

The back surface protective substrate for a solar cell module according to any one of the items 9 to 11, wherein the adhesive layer 1 contains an adhesive resin; the adhesive resin is selected from the group consisting of epoxy-modified olefin resins and acid-modified At least one selected from the group consisting of an olefin resin, a guanamine-modified olefin resin, and a decane-modified olefin resin.

13) The back protective substrate for a solar cell module according to 12), wherein the adhesive resin is an ethylene-glycidyl methacrylate copolymer.

The back surface protective substrate for a solar cell module according to any one of the items 9 to 13, wherein the back protective substrate member 2 has a layer mainly composed of polyethylene terephthalate ( Hereinafter, it is referred to as a polyethylene terephthalate layer, and the polyethylene terephthalate layer contains 1% by mass or more and 30% by mass or less of white particles.

(1) A laminated body for a solar cell module according to any one of the items 9) to 14), wherein the back surface protective substrate for a solar cell module according to any one of the items 9) to 14) is provided on the side of the back protective substrate member 1 .

16) A solar cell module characterized by comprising the back surface protective substrate for a solar cell module according to any one of 9) to 14).

According to the manufacturing method of the present invention, it is possible to provide a method for producing a solar cell module which comprises a laminate of a laminate and a member for backing the substrate member 1 and a member for back protective substrate 1 One piece, according to surface protection substrate, packaging material, unit, one The solar cell module is produced by laminating and pressing the body and the back protective substrate member 2 in order, which is economically advantageous and does not cause curling or the like, and the step passability can be improved.

It is particularly preferable to manufacture the integrated body in the step 1, the laminated package and the back protective substrate member 1, and then, without performing the extrusion coating or dry lamination step, in step 2, by surface protecting the substrate, the encapsulant, The unit, the integrated body, and the member 2 for back surface protection substrate are laminated and pressure-bonded in this order to manufacture a solar cell module.

Moreover, by using the back surface protective substrate of the present invention in a solar cell module, the adhesion of each layer in the back surface protective substrate can be ensured even in a severe environment of high temperature and high humidity.

1‧‧‧1st

2‧‧‧Package

3‧‧‧Back member for protective substrate 1

4‧‧‧Back member for protective substrate 2

5‧‧‧olefin layer 2

6‧‧‧Oxide layer 1 (following layer 1: olefin layer 1 has adhesion)

7‧‧‧ ensemble

8‧‧‧ Surface protection substrate

9‧‧‧Package material on the glossy side

10‧‧‧ unit

11‧‧‧Solar cell module before pressure bonding

12‧‧‧Solid cell module before pressure bonding

13‧‧‧Compressor

14‧‧‧T die

15‧‧‧Squeeze reel

16‧‧‧ casting reel

17‧‧‧ peeling reel

18‧‧‧Vacuum laminating device

19‧‧‧heating plate

20‧‧‧Upper frame

21‧‧‧ Lower frame

22‧‧‧Exhaust pipe

23‧‧‧ Space Department

24‧‧‧Supply/Exhaust Pipe

25‧‧‧Metal diaphragm

26‧‧‧ Space Department

27‧‧‧ inner wall

28‧‧‧Back protective substrate

29‧‧‧Next layer 2

30‧‧‧Solar cell module before pressure bonding

41‧‧‧Overall body of surface protection substrate/light-receiving side package/one piece/release PET/back protection substrate member 2

42‧‧‧Unplugged part of demolded PET

43‧‧‧Put the part of the demolded PET (after being pressed, it becomes part of the "peeling portion")

44‧‧‧simulation module

46‧‧‧Laminated body made of surface protection substrate/light-receiving side package/one body

47‧‧‧Back member for protective substrate 2

48‧‧‧ The longitudinal edge of the laminate sample formed by the surface protection substrate/light-receiving side package/integral in the "peeling portion" of the sample (the position fixed by the chuck on the Tensilon side) )

49‧‧‧In the back side of the "peeling portion" of the sample, the edge of the specimen for the substrate member 2 is fixed by the chuck on the other side of the Tensilon)

50‧‧‧ peeling part (in the step 2, the release PET is sandwiched between the layer 1 and the layer 2)

51, 52, 53‧‧‧ incisions

1 is a cross-sectional view showing an example of an integrated body of the sealing material of the present invention and the back protective substrate member 1 and the back protective substrate member 2 before the solar cell module is manufactured.

Fig. 2 is a cross-sectional view showing another example of the laminated body and the back protective substrate member 1 of the present invention and the back protective substrate member 2 which have been laminated before the solar cell module is manufactured.

Fig. 3 is a cross-sectional view showing still another example of the laminate of the member for sealing material and the back protective substrate of the present invention and the member for back protective substrate 2 which have been laminated before the production of the solar cell module.

Fig. 4 is a cross-sectional view showing an example (before pressure bonding) of a solar cell module obtained by the method for producing a solar cell module of the present invention.

Fig. 5 is a cross-sectional view showing another example (before pressure bonding) of the solar battery module obtained by the method for manufacturing a solar battery module of the present invention.

Fig. 6 is a cross-sectional view showing still another example (before pressure bonding) of the solar battery module obtained by the method for manufacturing a solar battery module of the present invention.

Fig. 7 is a schematic cross-sectional view showing a main part of the co-extrusion apparatus from the side of the first step of manufacturing the laminated package and the back protective substrate member 1 of the present invention.

8 is a step 2 of superimposing and pressing the surface protective substrate, the encapsulant, the unit, the integrated body, and the back protective substrate member 2 in this order according to the present invention, and manufacturing the solar cell module from the side. A schematic cross-sectional view of a vacuum laminating apparatus used at the time.

Fig. 9 is a view showing a position at which the release PET is sandwiched, and is a superposition of the surface protection substrate/B light-receiving side package/E-piece/release PET/F back-protection substrate member 2. A schematic cross-sectional view of the object.

Figure 10 is a diagram showing the position of the incision, which is a schematic cross-sectional view of the analog module.

Figure 11 is a schematic cross-sectional view of the analog module for displaying a graphic depending on the fixed position of the chuck.

[Formation of the Invention]

[Manufacturing Method of Solar Cell Module of the Present Invention]

The manufacturing method of the present invention is a manufacturing method of a solar cell module, and the manufacturing method of the solar cell module has the step 2: sealing The package material of the laminate of the member 1 for the back surface protection substrate and the member for the back surface protection substrate member 1 (hereinafter, also simply referred to as an integral body), according to the surface protection substrate and the package material (and the package material) The sealing material on the light-receiving side is superposed and pressed in the order of the member, the unit, the integrated body, and the back protective substrate member 2 (hereinafter, it is sometimes called "Second invention").

In addition, it is a method for producing a solar cell module, which has a step 1 of a laminated resin and a back protective substrate member 1 to produce a package material and a member for the back surface protective substrate member 1 (hereinafter In the second step, the surface protection substrate, the encapsulant, the unit, the integrated body, and the back protective substrate member 2 are superposed and pressed in this order (hereinafter, referred to as " First invention").

Hereinafter, a method of manufacturing the solar cell module of the present invention will be described in detail. Further, the numbers individually indicated in the brackets () below correspond to the symbols of the respective drawings.

[Solar cell module manufacturing method: Step 1]

FIG. 1 to FIG. 3 are views showing a cross section of one of the laminated member and the back protective substrate member 1 of the present invention and the back protective substrate member 2 before the solar cell module is manufactured. Figure.

Step 1 is a step of producing a package material and a member for the back surface protection substrate member 1 by laminating the package material and the back surface protection substrate member 1. In the first step, although the lamination method of the encapsulating member and the back protective substrate member 1 is not particularly limited, the lamination of the encapsulant 1 and the back protective substrate member 1 in step 1 is preferably performed by coextrusion. Go out. that is, A co-extrusion device (13) constituted by a T die (14) as shown in Fig. 7 can be used, in accordance with the member 1 for the package material and the back protective substrate, and the casting reel (15) and the casting reel (16) Coextruding, and by the method of peeling the reel (17), in step 1, the encapsulant and the back protective substrate member 1 are suitably laminated. Further, in the pinch roll, it is preferable to use a roll of coated rubber.

In the case where the laminate of the encapsulating material and the back protective substrate member 1 in the step 1 is laminated by coextrusion, a casting reel (16) in which an embossed pattern such as a checkered pattern or a pear pattern is engraved on the surface can be used. Further, the embossed pattern is transferred to the surface of the unitary body, and it is also preferable since it can prevent adhesion at the time of winding or the like.

Further, in Fig. 7, each layer (resin constituting each layer) ejected from the T die (14) is indicated by a solid line, a broken line, and a dotted line. The layer shown by the broken line means the package material, and the layer shown by the dotted line and the solid line means the member 1 for the back surface protection substrate.

In particular, when the back protective substrate member 1 has two layers, it is preferable that the layer shown by a solid line is an olefin layer 2 to be described later, and the layer shown by a dotted line is a back layer 1 which will be described later. Here, the subsequent layer 1 is preferably an olefin layer 1 having an adhesiveness, and preferably as shown in Fig. 7, the layer is ejected in contact with the casting reel (16) (i.e., preferably The layer shown by the dashed line is not the layer 1 but the layer shown by the dotted line is the layer 1). The reason for this is that the release between the casting reel (16) engraved with the embossed pattern and the adhesive layer 1 is better than that between the extrusion reel (15) covered by the rubber and the adhesive layer 1 Modularity.

On the other hand, if the adhesive layer 1 is ejected in contact with the pinch roll (15) (that is, if the layer shown by the broken line is the adhesive layer 1), The mold release property between the pinch roll (15) and the adhesive layer 1 is low, and there is a case where the appearance of the adhesive layer 1 is lowered.

In addition, the arrow in FIG. 7 shows the traveling direction (also referred to as "manufacturing direction" or "mechanical direction") of the laminated body at the time of manufacture of the laminated body of the sealing material and the back protective substrate member 1.

In the method of laminating the encapsulating material and the back protective substrate member 1 in the step 1, a method of depositing a laminate (extruded laminate) or a dry laminate is used, but by co-extrusion for the reasons described later. One-piece laminate is most suitable.

The method of the step 1 is carried out by extruding a laminate (extruded laminate): one of the members for sealing the substrate and the back protective substrate is produced by a melt extrusion or a calender or the like, and is used as a substrate. Then, the resin which is heated and melted by the T-die extruder (resin of the package material or the resin of the material of the member 1 for the back surface protection substrate) is extruded into a slit shape and flows into the base. On top of the material, a method of laminating by using a pinch roll and a casting roll is carried out. In this method, since there are many steps that must be made, there are cases where it is economically disadvantageous.

The method of the step 1 is carried out by dry lamination, and each of the encapsulating material and the back protective substrate member 1 is produced by a melt extrusion or a calender, and then a method of laminating using an adhesive in another step. This method has a situation in which it is economically disadvantageous because it has to have many steps and a material fee such as an adhesive is added.

Next, the package member 1 and the back protective substrate member 1 (3) used in the step 1 will be described.

[member 1 for back protective substrate]

The back protective substrate member 1 (3) used in the method for producing a solar cell module of the present invention is a part of a back protective substrate of a solar cell module.

The composition of the back protective substrate member 1 is not particularly limited, but it is preferably a layer having an olefin resin as a main component. Here, the layer containing the olefin resin as a main component means that the olefin resin is contained in an amount of 50% by mass or more and 100% by mass or less based on 100% by mass of all the components of the layer to be colored, and the same applies hereinafter.

The back protective substrate member 1 has a layer containing an olefin resin as a main component, and the surface protective substrate, the encapsulant, the unit, the integrated body, and the back protective substrate member 2 of glass or the like are arranged in this order. In the step 2 of superimposing and pressure-bonding, it is possible to suppress the overflow of the substrate member 1 or the reduction in thickness from the back surface of the glass due to the pressure. Moreover, it is also possible to suppress creep in a severe environment of high temperature and high humidity, and further to ensure adhesion to the packaging material.

As the olefin resin, a polypropylene resin such as a homopolypropylene or a block polypropylene, a polyethylene resin such as a low density polyethylene (LDPE) or a linear low density polyethylene (LLDPE), or ethylene-ethylene B is preferably used. An acid ester copolymer (EVA); and two or more kinds of olefin resin copolymers, for example, a copolymerized resin of propylene and ethylene (EPC: Ethylene-Propylene-Copolymer), or a copolymer of ethylene and propylene and butene, a ternary copolymer resin . An olefin resin which is suitable for use as a layer containing an olefin resin as a main component in the member 1 for a back surface protective substrate is considered to have creep resistance or heat resistance for preventing thickness reduction after the step 2, and to be followed by the packaging material. It is especially suitable for the use of polyethylene and polypropylene copolymer resin (EPC).

In the back protective substrate member 1 (3), in order to reflect light between the unit and the unit passing through the solar cell module and return to the unit, the white particles such as titanium oxide or barium sulfate may be appropriately contained. Or, in order to improve the durability, strength, and adhesion to the back surface protective member member 2, such as light resistance, it is possible to appropriately contain a crosslinking agent, a crosslinking assistant, an antioxidant, a photostabilizer, A decane coupling agent or the like.

The thickness of the back protective substrate member 1 (3) is preferably 50 μm or more as the minimum thickness for ensuring insulation, and is preferably 300 μm or less in consideration of economy.

Further, the back protective substrate member 1 (3) may be a single layer as shown in Fig. 1 or a two-layer structure as shown in Fig. 2. Further, it may be more than two layers, but since the nozzle of the co-extrusion device becomes complicated, the initial investment amount increases, and production management becomes difficult, and it is preferably a single layer or two layers.

When the back protective substrate member 1 (3) has a structure of two or more layers, the back protective substrate member 1 preferably has two layers of an olefin resin as a main component. Here, the layer having the olefin resin as a main component is as described above, and means that the olefin resin is contained in an amount of 50% by mass or more and 100% by mass or less based on 100% by mass of all the components of the layer.

In addition, the layer on the side surface of the back surface protective base member 1 which is connected to the back surface protective base member 2 is a layer mainly composed of an olefin resin (hereinafter referred to as an olefin layer 1), and the olefin layer 1 has Subsequent (hereinafter, the olefin layer 1 having the adhesion is referred to as the adhesion layer 1), and in the step 2, the adhesion to the back protective substrate member 2 (4) is followed. It is better because it rises. In particular, in the case where the back protective substrate member 1 (3) has a structure of two or more layers, it is preferable that the back protective substrate member 1 has the olefin layer 1 and the olefin layer 1 is the adhesive layer 1.

Here, the olefin layer 1 having an adhesiveness means that the olefin layer 1 contains an adhesive resin. That is, the olefin layer 1 containing an adhesive resin is referred to as an adhesive layer 1.

Here, the adhesive resin-based olefin resin further means a resin in which one side chain is partially modified by various functional groups. Therefore, the olefin resin which is a main component of the adhesive layer 1 may be used in combination with an olefin resin of a non-adhesive resin or an adhesive resin, or may be only an adhesive resin. Here, examples of the adhesive resin include an epoxy-modified olefin resin, an acid-modified olefin resin (for example, a maleic anhydride-modified olefin resin), a guanamine-modified olefin resin, a decane-modified olefin resin, and the like. The adhesive resin is particularly preferably at least one selected from the group consisting of an epoxy-modified olefin resin, an acid-modified olefin resin, a guanamine-modified olefin resin, and a decane-modified olefin resin. From the viewpoint of excellent adhesion to the adhesive layer 2 having a wide composition and adhesion to the back surface protective substrate member 2 in a severe environment, the adhesive resin contained in the adhesive layer 1 is preferably epoxy. A modified olefin resin in which an ethylene-glycidyl methacrylate copolymer is most suitably used. The ethylene-methacrylic acid glycidyl acrylate copolymer is, for example, a model Bondwe E manufactured by Sumitomo Chemical Co., Ltd.

On the other hand, the layer constituting the side surface of the member for back surface protective substrate 1 which is connected to the member for back surface protective substrate 2 is the olefin layer 1, and the olefin layer 1 is the case of the adhesive layer 1 having the adhesiveness. Preferably, the layer on the other side of the member 1 for the back protective substrate is also mainly olefin. A layer of an ingredient (hereinafter referred to as an olefin layer 2). Further, in this case, it is preferable that the back protective substrate member 1 (3) has a two-layer structure of the (olefin) layer 1 and the olefin layer 2, and the olefin layer 2 (5) suitably contains titanium oxide or barium sulfate. Wait for white particles. In this case, the thickness of the olefin layer 1 and the olefin layer 2 is preferably 50 μm or more from the viewpoint of insulating properties, and the economical efficiency is preferably 300 μm or less.

[Package]

Next, the package material (2) used in the first step of the method for manufacturing a solar cell module of the present invention will be described. In the step 2 of the present invention, the surface of the package in the unit is placed and pressed against the back surface (non-light-receiving side) of the unit (10) of the power-generating element. In the package material used in the present invention, although the composition thereof is not particularly limited, it is preferred to use an olefin resin as a main component. Here, the encapsulating material containing the olefin resin as a main component means that the olefin resin is contained in an amount of 50% by mass or more and 100% by mass or less based on 100% by mass of all the components of the encapsulating material. In the case where the olefin resin is less than 50% by mass in 100% by mass of all the components of the packaging material, the properties of the olefin resin may not be sufficiently exhibited.

By using an olefin resin as a main component, the encapsulating material can ensure the adhesion to the back surface of the unit (10) of the power generating element or the embedding property of the unit when manufacturing the solar cell module, and can also ensure the olefin The adhesion of the member 1 for the back surface protection substrate in which the resin is a main component.

Further, as the olefin resin constituting the sealing material, for example, a polyethylene resin such as low density polyethylene (LDPE) or linear low density polyethylene (LLDPE); ethylene-ethylene acetate copolymer (EVA) is suitably used. And a copolymer of two or more olefin resins, for example, polypropylene A copolymerized resin of an olefin and a polyethylene, etc., is preferably a linear low-density polyethylene (LLDPE), considering the adhesion to the back surface of the unit (10) or the embedding property of the unit. As a linear low-density polyethylene (LLDPE), the model Sumikathene-L GA401 by Sumitomo Chemical Co., Ltd. is mentioned, for example.

Further, the encapsulating material may be used to reflect light between the unit and the unit passing through the solar cell module to return to the unit, and suitably contain white particles such as titanium oxide or barium sulfate, or to improve light resistance. The durability, the strength, and the adhesion to the unit are appropriately contained, and a crosslinking agent, a crosslinking assistant, an antioxidant, a photostabilizer, a decane coupling agent, and the like are appropriately contained.

Here, the encapsulating material used in the present invention is defined as a layer having a melting point of 130 ° C or less. If the conditions are met, the encapsulating material may be a single layer or a multilayer structure composed of two or more layers. Further, the encapsulating material may contain the above-mentioned additives including white particles such as titanium oxide or barium sulfate in all or a part of the layers. Further, in the case where the encapsulating material has a multilayer structure, it is important that the melting point of all the layers is 130 ° C or less.

Further, in the present invention, it is not excluded that a layer having a melting point of 130 ° C or less is contained in the back surface protective substrate. In other words, for example, in the olefin layer 1 of the member for back surface protective substrate 1 of the present invention (the olefin layer 1 has an adhesive property, the subsequent layer 1) has a melting point of 130 ° C or less, if the package material and the olefin are used. If a layer having a melting point of more than 130 ° C exists between the layers 1, the olefin layer 1 is not referred to as a package. Therefore, in the layer of the surface of the back surface protective base member 1 which is at least in contact with the sealing material, a layer having a melting point exceeding 130 ° C is disposed.

In addition, the term "melting point" as used herein means that the main peak position (temperature) of the crystal melting obtained by using a differential scanning calorimeter (DSC) is measured in accordance with JIS K 7121 (1987), and plural numbers are observed in the layer of the eye. In the case of the melting point, the peak corresponding to the resin having the highest content is taken as the melting point.

Further, regardless of the case where the package material is a single layer structure or the case of a multilayer structure, the thickness of the package material is preferably in the range of 200 to 600 μm as a wiring attached to the back surface of the coating unit (the wiring thickness is generally about The minimum thickness necessary for about 200 μm) is preferably 200 μm or more, and the economical efficiency is preferably 600 μm or less.

[one body]

In the first aspect of the invention, the package material of the laminate of the sealing material and the back protective substrate member 1 and the one of the back surface protective substrate members 1 are mainly produced by the above-described step 1.

On the other hand, in the second invention, the method of manufacturing the integrated body is not limited. However, from the viewpoint of efficiency, it is preferred to manufacture the unitary body by the above step 1.

[Solar cell module manufacturing method: Step 2]

A method for manufacturing a solar cell module according to the present invention is a step 2 in which the surface protective substrate, the encapsulant, the unit, the integrated body, and the back protective substrate member 2 are overlapped and pressure-bonded in this order. .

4 to 6 are cross-sectional views showing an example of the solar cell module (11, 12, or 30) before the pressure bonding in the step 2 of the manufacturing method of the present invention, which is constituted from the light receiving surface ( Surface) side, surface protection The protective substrate (glass or the like) (8), the encapsulating material (9) on the light receiving surface side, the unit (10), the integrated body (1 or 7), and the back protective substrate member 2 (4) are in this order The configuration is such that the solar cell module is manufactured by the step 2 of superimposing and pressure-bonding in this order, for example, a step of laminating in a vacuum state (vacuum lamination step). Further, in the case where the vacuum lamination step is employed as the step 2 of the pressure bonding, the step 2 of press-bonding containing the heating step is suitable. Hereinafter, the step 2 of pressure-bonding including a heating step will be described. The step of pressure-bonding including the heating step includes: a method of pressure-bonding simultaneously with heating; or, after heating, the package material or the like is sufficiently softened, and The method of performing pressure bonding, and the like.

In Fig. 8, a method of using the steps of the vacuum lamination device (18) is exemplified. Using a vacuum laminating apparatus (18), a surface protective substrate (glass or the like) (8), a light receiving surface side packaging material (9), and a unit are heated on a heating plate (19) heated to 130 to 180 ° C in advance. (10) The integrated body (1 or 7) and the back protective substrate member 2 (4) are stacked in this order and left to stand (hereinafter, referred to as "the laminated body before the completion of the step 2"). Therefore, on the heating plate (19), the solar cell module (11, 12 or 30) before the pressure bonding as shown in Figs. 4 to 6 is left to stand. In Fig. 8, as an example, a solar cell module (11) before pressure bonding is used, but a solar cell module (12) before pressure bonding or a solar cell module (30) before pressure bonding may also be used. A solar cell module (30) before pressure bonding having other configurations within the scope of the present invention can also be used.

Thereafter, the upper casing (20) of the vacuum laminating device (18) is closed and sealed, and an exhaust device (not shown) is used to discharge the space from the exhaust pipe (22) installed in the lower casing (21). The air of the department (23) is also from The supply/exhaust pipe (24) provided in the upper casing (20) discharges the air of the space portion (26) formed by the rubber diaphragm (25) and the upper casing (20), thereby making the space portion (23) The space portion (26) is in a decompressed state. After keeping this state for a few minutes, air is introduced from the supply/exhaust pipe (24), and the rubber diaphragm (25) is pressed against the end by the pressure difference (atmospheric pressure) between the space portion (23) and the space portion (26). The layered body before step 2." Such a pressurized state depends on the recommended time of lamination of the encapsulating material (9) on the light-receiving surface side or the encapsulating material (2) of the integrated material (1 or 7), but is preferably maintained for 10 to 40 minutes. The solar cell module can be manufactured by performing the heating as described above and simultaneously performing the vacuum pressure bonding step 2. The temperature of the heating plate (19) of the vacuum laminating device (18) depends on the recommended temperature of the laminate (9) on the light-receiving surface side or the package (2) of the integrated material (1 or 7), but It is preferably from 130 to 180 °C.

[member for back protective substrate 2]

Next, the back protective substrate member 2 (4) used in the step 2 will be described.

The member 2 for back surface protection substrate in the present invention is not particularly limited, and a cyclic polyolefin resin, a polystyrene resin, an acrylonitrile-styrene copolymer resin, or an acrylonitrile-butadiene-benzene can be used. A layer (film) of a plurality of types of resins, such as an ethylene copolymer resin, a polyvinyl chloride resin, a fluorine resin, an acrylic resin, a polycarbonate resin, and a polyamide resin such as nylon.

In particular, the member 2 for the back surface protective substrate preferably contains a polyester having an economical surface, in particular, polyethylene terephthalate as a main component (hereinafter, simply referred to as polyethylene terephthalate). Floor). Here, the layer containing polyethylene terephthalate as a main component means The 100% by mass of all the components of the layer of the eye layer contains 50% by mass or more and 100% by mass or less of a layer of a polyethylene terephthalate resin.

Further, the member 2 for the back surface protective substrate preferably has a polyethylene terephthalate layer, and the polyethylene terephthalate layer contains 1% by mass or more and 30% by mass or less of white particles. Here, the white particles are whitened by the polyethylene terephthalate layer by containing the particles, whereby the ultraviolet absorbing energy and the light reflectivity from the white particles can be utilized, and the thin film can be reduced for a long period of time. The effect of coloring caused by deterioration. Examples of such white particles include titanium dioxide and barium sulfate.

In 100% by mass of all the components of the polyethylene terephthalate layer, if the white particles are less than 1% by mass, there is a case where the ultraviolet ray is insufficient, and if it is more than 30% by mass, there is a bonding layer 2 The situation of reduced connectivity. The content of the white particles in the polyethylene terephthalate layer is more preferably 2% by mass or more, and still more preferably 3% by mass or more. Further, the content of the white particles in the polyethylene terephthalate layer is more preferably 25% by mass or less, further preferably 20% by mass or less.

Examples of the white particles as described above include titanium dioxide and barium sulfate. Among them, rutile-type titanium dioxide is more preferably used from the viewpoint of so-called high light reflectivity and light resistance. The rutile-type titanium dioxide which is suitable as a white particle is, for example, a model R-104 (average particle diameter: 0.22 μm) manufactured by DuPont Co., Ltd. or a model SA-1 (manufactured by Daicel Chemical Industries, Ltd.) The diameter is 0.15 μm).

In addition, the polyethylene terephthalate layer of the back protective substrate member 2 can be improved in durability such as light resistance. It is suitably added with an additive such as an antioxidant, a light stabilizer, or the like.

The thickness of the polyethylene terephthalate layer of the member for back surface protective substrate 2 in the present invention is preferably 50 μm or more from the viewpoint of insulating properties, and particularly preferably 75 μm in consideration of the workability in the step 2. A thickness of 125 μm. The upper limit is preferably 300 μm or less in terms of economy.

The surface opposite to the side on which the back surface protective base member 1 is joined to the back surface protective base member 2 can be suitably subjected to ultraviolet light durability by coating with a light stabilizer or an ultraviolet absorber. Wait for improvement.

Further, it is preferable that the layer on the side surface of the back surface protective base member 2 that is connected to the back surface protective base member 1 has an adhesive property (hereinafter, this layer is referred to as an adhesive layer 2), and thus it is possible Improve the adhesion to the member 1. That is, the back protective substrate member 2 is preferably a laminated structure of a polyethylene terephthalate layer and an adhesive layer 2. Here, the layer on the side surface of the back surface protective base member 2 which is connected to the back surface protective base member 1 has an adhesive property, which means that the layer contains a urethane resin. In other words, in the case where the layer on the side surface of the back surface protective base member 2 and the back surface protective base member 1 are urethane-containing, the layer is referred to as the adhesive layer 2.

Further, since the back surface protective base member 1 and the back protective base member 2 are integrated in the solar cell module by the manufacturing method of the present invention, it is important to have the solar cell module. The characteristics necessary for the back surface protective substrate generally used, that is, insulation properties, long-term reliability, mechanical properties (breaking strength, etc.), and the like. In the manufacturing method of a general solar cell module, the back surface protection substrate is first manufactured. And use it to make solar modules. However, in the present invention, the structural member of the back surface protective substrate of the member for back surface protection substrate 1 and the member for back surface protection substrate is manufactured first, and when the solar cell module is finally manufactured through step 2, the back surface protection group is used. The material is formed as a laminate of the back protective substrate member 1 and the back protective substrate member 2, and it is important to design the back protective substrate member 1 and the back protective substrate member 2 to obtain necessary materials. characteristic. Further, in the present invention, the back surface protective substrate is not manufactured first, but the back surface protective substrate is also produced in the second step of manufacturing the solar cell module. From this point of view, it is suitable because the production step can be reduced.

Although the manufacturing method of the adhesive layer 2 is not particularly limited, the adhesive layer 2 is preferably obtained from a composition containing a urethane resin (hereinafter referred to as a composition 2). In other words, the member for back surface protective substrate 2 having the adhesive layer 2 is preferably obtained by coating the composition 2 or the like on a substrate such as a polyethylene terephthalate layer.

The adhesion between the member 2 for the back surface protective substrate (especially the polyethylene terephthalate layer) and the adhesive layer 2 can be sufficiently ensured by obtaining the adhesive layer 2 from the composition containing the urethane resin. Sex. In addition, since the urethane resin has an appropriate degree of flexibility, it can suppress the occurrence of cracks in the adhesive layer 2 when the composition 2 of the back surface protective substrate member 2 is applied. Further, by using the composition 2, the coating suitability at the time of coating is improved, and the weight of the adhesive layer 2 after coating and drying can be easily controlled to a target value.

The urethane resin suitable for the composition 2 may, for example, be a model Hydran AP-201 manufactured by DIC Corporation or DIC. Model Dicseal HS-W EXP110202. Further, as a composition 2, a coating agent obtained by diluting such a urethane resin with water can be applied to a polyethylene terephthalate layer by a conventional coating method, and the water can be dried to use a back protective substrate. A layer on the side surface of the member 2 that is connected to the back protective substrate member 1 is used as the adhesive layer 2 . The coating method of the composition 2 is, for example, bar coating, gravure coating, die coating, spray coating, etc., but it is particularly suitable to use a bar coating having a wide degree of freedom in selection of the viscosity, coating speed, and coating amount of the coating agent.

The content (the content after coating and drying) of the urethane resin in the composition 2 is preferably 0.05 to 5 g/m ² , and the economical surface such as the material cost and the coating suitability at the time of coating are the most Preferably it is 0.2 to 1.2 g/m ² .

Further, in all the components of the composition 2 (however, in addition to the solvent (for example, water)), 100% by mass, the suitable content of the urethane resin in the composition 2 is 50 to 98% by mass. An example of an optimum combination of the adhesive layer 1 and the adhesive layer 2 to be described later is an epoxy-modified olefin resin in the adhesive layer 1, preferably an ethylene-glycidyl methacrylate copolymer as an adhesive resin; Next, the layer 2 contains a form of the composition 2 of a urethane resin (AP-201 or the like) and a melamine resin (such as PM-80 described later), and more preferably a urethane resin in the composition 2. The content is 64 to 96% by mass. Further, the suitable content of the urethane resin in the composition 2 is 50 to 98% by mass as described above, but since the adhesive layer 2 is preferably obtained from the composition 2, 100% by mass of all the components of the subsequent layer 2 A suitable content of the urethane resin in the layer 2 is then from 50 to 98% by mass.

Even if it is used to form the adhesive layer 2, the coating composition is suitable. The step of the material 2 is carried out simultaneously with the step of forming (forming a film) a substrate such as a polyethylene terephthalate layer of a part of the back surface protective substrate member 2 by an extruder. Further, a step of applying the composition 2 only to a substrate such as a polyethylene terephthalate layer which has been formed into a film may be separately applied. However, in the economical aspect, it is more preferable to carry out the step of coating the composition 2 in the step of forming a film of a substrate such as a polyethylene terephthalate layer.

Further, the composition 2 preferably further contains at least one selected from the group consisting of a melamine resin, an epoxy resin, and an olefin resin. Since the composition 2 further contains at least one selected from the group consisting of a melamine resin, an epoxy resin, and an olefin resin, the subsequent layer 2 and the subsequent layer 1 which are connected by the step 2 can be attached. The improvement is improved, and even in the harsh environment of high temperature and high humidity, the adhesion between the bonding layer 1 and the bonding layer 2 can be ensured, and then the layer 2 itself becomes firm.

The melamine resin suitable for the composition 2 is, for example, a model PM-80 manufactured by DIC Corporation. The epoxy resin suitable for the composition 2 may, for example, be a model Additive EP-10 manufactured by DIC Corporation or a model Additive EXP110208. The olefin resin which is suitable for the composition 2 is a model of Dicseal HS-W EXP110202 manufactured by DIC Co., Ltd., which is a urethane resin, and contains a urethane resin and an olefin resin. Can be especially suitable for use.

The content of the urethane resin in the composition 2 and other resins (melamine resin or the like) is, for example, the following (1) to (3).

(1) urethane resin/melamine resin = 15 to 30 parts by mass / 1.5 to 8.5 parts by mass (for achieving the above-mentioned blend ratio of AP-201 to PM-80 = 94 parts by mass / 6 parts by mass) )

(2) urethane resin/epoxy resin = 15 to 30 parts by mass / 1 to 10 parts by mass (for achieving the above-mentioned blend ratio of AP-201 to EP-10 = 94 parts by mass / 6 mass Share)

(3) urethane resin / melamine resin / epoxy resin = 15 to 30 parts by mass / 3 to 7 parts by mass / 1 to 6 parts by mass (to achieve the above-mentioned AP-201 and PM-80 and EP-10 An example of blending ratio = 92 parts by mass / 6 parts by mass / 2 parts by mass).

Further, since the adhesive layer 2 is preferably obtained from the composition 2, the content relationship between the urethane resin in the above-described composition 2 and other resins (melamine resin or the like) is also established for the adhesive layer 2.

Further, the AP-201 as an example of the above-mentioned urethane resin contains a small amount of water or other resin, and PM-80 also contains water or other resin in addition to the melamine resin. On the other hand, EP-10 is almost an epoxy resin.

Further, an example of a suitable combination of the subsequent layer 1 and the subsequent layer 2 is an adhesive layer-containing olefin resin, preferably an ethylene-glycidyl methacrylate copolymer as an adhesive resin; 2 is a case where a combination of a urethane resin (AP-201 or the like) and a composition 2 of a melamine resin (PM-80 or the like) is used. In this combination, since the melamine resin is cross-linked with the epoxy-modified olefin resin, the layer 1 is subsequently The adhesion to the interface with the bonding layer 2 is improved, so that it can be suitably used.

Further, another example of the appropriate combination of the subsequent layer 1 and the subsequent layer 2 is that the adhesive layer 1 contains an epoxy-modified olefin resin, preferably an ethylene-glycidyl methacrylate copolymer as an adhesive resin; 2 is a case where a combination of a urethane resin, an olefin resin, and an epoxy resin is contained. In this combination, since the epoxy resin is cross-linked with the epoxy-modified olefin resin, the adhesion is improved, and it can be suitably used. Further, for example, Dicseal HS-W EXP110202 or the like contains both a urethane resin and an olefin resin, and the Additive EXP110208 can be suitably used as an epoxy resin.

Moreover, it is also possible to improve the appearance of the adhesive layer 2 obtained by coating the substrate 2 with a composition such as polyethylene terephthalate or the emulsifier when the resin is diluted as the composition 2 with water. The composition 2 contains a surfactant. As the surfactant, for example, a model Surfynol 440 or OLFIN EXP4051F manufactured by Nissin Chemical Co., Ltd. can be used.

The thickness of the adhesive layer 2 in the member 2 for back surface protection substrate is preferably 0.1 to 5 μm, and it is more preferably 0.2 to 1 μm in consideration of the economical surface of the material cost and the coating suitability at the time of coating.

Further, on the surface of the polyethylene terephthalate layer or the like of the underlayer of the second layer 2, the polyethylene terephthalate can be enhanced by performing various surface treatments such as corona treatment, plasma treatment, flame treatment, and the like. The adhesion of the diester layer to the subsequent layer 2. Further, the various surface treatments described above can also function as the adhesive layer 2 depending on the processing conditions.

Hereinafter, the other components used in step 2 are described. Bright.

[Surface protection substrate (8)]

In the solar cell module of the present invention, the surface protective substrate (8) which can be suitably used is used as a protective substrate on the light-receiving surface (surface) side of the solar cell module. Although the composition of the surface protective substrate is not particularly limited, glass is generally used. In the case where glass is used as the surface protective substrate, it is preferable that the light having a light transmittance of 80 to 1400 nm has a total light transmittance of 80% or more, more preferably 90% or more. As the glass used for the surface protective base material, a white glass having a small red external absorption is generally used. However, even if it is a blue glass, if the thickness is 3 mm or less, the effect on the output characteristics of the solar battery module is small. Further, in order to increase the mechanical strength of the glass, the tempered glass can be obtained by heat treatment, but a flat glass which is not heat-treated can also be used. Further, in order to suppress reflection, anti-reflection coating may be performed on the light-receiving surface side of the glass.

[Package material on the light-receiving surface (surface) side (9)]

For the package material (9) on the light-receiving side of the method for producing a solar cell module of the present invention, a conventional solar cell encapsulant sheet can be used, and for example, an ethylene-ethylene acetate copolymer (EVA) can be used. , an olefin resin, a polyvinyl butyral resin (PVB), an ionic polymer resin, a siloxane resin, etc., but from the package material of the present invention, the package material of the back surface protective substrate member 1 (2) The adhesiveness is preferably an ethylene-ethylene acetate copolymer (EVA) or an olefin resin. The ethylene-ethylene acetate copolymer (EVA) may, for example, be a model of Fastcure PV-45FR00S manufactured by Sanvic Co., Ltd. Further, regarding the thickness of the package sheet on the light-receiving surface side, the solar battery unit is protected from the outside by the outside. The function of (10) is also preferably 400 μm or more; and more preferably 450 μm to 800 μm from the viewpoint of cost.

[Solar battery unit (10)]

The solar cell unit (10) in an example of the solar cell module of the present invention covers a plurality of types such as a single crystal germanium type, a polycrystalline germanium type, an amorphous germanium type, a compound type, etc., and is preferably a solar battery module of the present invention. The manufacturing method is easy to apply, single crystal germanium type, polycrystalline germanium type.

[Back surface protective substrate for solar cell module of the present invention, laminated body for solar cell module of the present invention, solar cell module of the present invention]

Next, the back surface protective substrate for a solar cell module of the present invention, the laminate for a solar cell module of the present invention, and the solar cell module of the present invention will be described below.

The back surface protective substrate of the present invention is a back surface protective substrate for a solar cell module, and the back surface protective substrate is a laminate of the back surface protective substrate member 1 and the back surface protective substrate member 2, and the back surface protective substrate is used for the back surface protective substrate. The layer on the side surface of the member 1 which is connected to the back surface protective base member 2 is a layer mainly composed of an olefin resin (hereinafter referred to as an olefin layer 1), and the olefin layer 1 has an adhesive property (hereinafter, The olefin layer 1 having an adhesive property is referred to as an adhesive layer 1); the layer on the side surface of the back protective substrate member 2 that is connected to the back surface protective substrate member 1 has an adhesive property (hereinafter, this layer is referred to as Then layer 2). The back surface protective substrate of the present invention having such a structure can ensure the adhesion of the back surface protective substrate member 1 and the back surface protective substrate member 2 even in a severe environment of high temperature and high humidity, and is suitable for solar energy. Battery module use.

The components constituting the back surface protective substrate of the present invention, that is, the back surface protective substrate member 1, the back surface protective substrate member 2, the olefin layer 1, the adhesive layer 1, and the adhesive layer 2 are as described above. The description of the solar cell module manufacturing method is described.

Further, in the method for producing a (solar cell module) of the present invention described above, the back surface protective substrate of the present invention can be obtained by a production method according to a suitable embodiment. In the manufacturing method of the present invention, the layer on the side surface of the member for back surface protective substrate 1 and the member for back surface protective substrate 2 is an olefin layer 1, which is an adhesive layer 1 and a back surface. The solar cell module obtained by the manufacturing method of the present invention has the back surface protection of the present invention in the case where the layer on the side surface of the member for protecting the substrate 2 and the side surface of the back surface protective substrate member 1 is the back layer 2 Substrate.

Further, of course, the method for producing the back surface protective substrate of the present invention is not limited to the above-described method for producing a solar cell module of the present invention. In other words, the back surface protective base material of the present invention is obtained by laminating the back surface protective base member 1 and the back protective base member 2, and the back surface protective base member 1 is not laminated before stacking the layers. The necessity of packaging materials. In other words, the back surface protective substrate of the present invention can be obtained by laminating the back surface protecting substrate member 1 and the back surface protecting substrate member 2 before laminating the sealing material.

The laminate for a solar cell module of the present invention can be obtained by laminating a package material on the back surface of the back surface protective member of the present invention. The description of each of the elements constituting the laminate of the present invention, that is, the package material, is as in the manufacture of the above solar cell module. The invention of the law and the like are described.

Further, in the method of producing the laminate of the present invention, the side layer of the substrate member 1 can be protected by the back surface of the back surface protective substrate obtained as described above.

The solar cell module of the present invention is a solar cell module having the back protective substrate of the present invention. The description of each of the components constituting the solar battery module of the present invention is as described in the description of the manufacturing method of the present invention (the solar battery module).

In the manufacture of the solar cell module of the present invention, it is possible to manufacture a method (of a solar cell module) according to the present invention. In other words, the layer on the side surface of the back surface protective base member 1 and the back surface protective base member 2 is the olefin layer 1, and the olefin layer 1 is the adhesive layer 1, and the back protective substrate member 2 is used. In the case where the layer constituting the side surface to be bonded to the back surface protective substrate member 1 is the adhesive layer 2, the solar battery module of the present invention can be obtained by using the manufacturing method of the present invention (solar battery module).

Furthermore, the method for obtaining the solar cell module of the present invention is not limited by the manufacturing method of the present invention, and examples thereof include a surface protective substrate, a packaging material, a unit, a packaging material, and a back surface of the present invention. The protective substrate is superposed and pressure-bonded in this order, and the back protective substrate member 1 in the back protective substrate is directed toward the package side; or the surface protective substrate, the package, the unit, and the present invention The laminated body is superposed and pressed in this order, and the method of the package side in the laminated body is directed to the unit side.

[Examples]

Hereinafter, the present invention will be specifically described by examples, but the present invention is not limited by the following examples.

[Method of evaluation of characteristics]

(1) curl assessment

In the manufacture of the solar cell module of the examples and the comparative examples, it was confirmed that the crimping state of one of the objects after the step 1 and the vacuum laminating device (the heated heating plate) of the step 2 were laminated and left standing. The situation of curling.

The size is a square having a side length of 353 mm, and the curling state of one of the objects after the step 1 is statically placed on the horizontal plane to make the crimping concave, and the height of the four corners is measured by a ruler (referred to as "total"). On the other hand, the crimping condition of the step 2 is taken out after being placed in the vacuum laminating apparatus (heated heating plate) for 1 minute, and the sample is taken out (in the case of the embodiment, the integral member and the back protective substrate member 2 are respectively; On the other hand, in the case of the comparative example, the integral member of the back protective substrate member 1 and the back protective substrate member 2 was measured by the same method as in the case of the step 1. Three samples were evaluated, and the average value of the "total" of these was evaluated as "3" for 200 mm or more, "2" for 100 mm or less, and "1" for less than 100 mm.

(2) Determination of melting point

For each of the layers of the non-light-receiving surface side and the back protective substrate member 1 (olefin layers 1 and 2) used in the examples and the comparative examples, the Shimadzu Corporation Limited was used in accordance with JIS K 7121 (1987). Measured by the company model DSC-60.

[Common use materials (objects: Examples 1 to 3, Comparative Examples 1 to 2)] (The letters attached to the first of the following materials correspond to the letters in Table 1).

A. Surface protection substrate

A white heat-treated glass having a thickness of 3.2 mm and a wavelength of 350 to 1400 nm and having a transmittance of 90% or more was used.

B. Light-receiving side packaging material

An ethylene-ethylene acetate copolymer (EVA) (Model Fastcure PV-45FR00S, manufactured by Sanvic Co., Ltd., thickness: 450 μm) was used as the package sheet on the light-receiving surface side.

C. unit

As the solar battery unit, a model M-156-3 made of a 6-180 μm thick polycrystalline unit SOLARTECH ENERGY CORORATION and a stripe direction of 2 sheets × 2 columns (four sheets in total) were used. The wiring is connected in parallel by three TABs (tape automatic bonding) by a conventional automatic wiring device.

F. Member for back protective substrate 2

As the polyethylene terephthalate layer of the member 2 for the back surface protective substrate, a model of the polyethylene terephthalate film of Toshi Co., Ltd., model X10S, having a thickness of 125 μm, was used on the side connected to the E integral body. The corona treatment was such that the corona treatment coefficient determined by the following formula was 20.

Corona treatment coefficient = output (W) / processing speed (m / min) × corona electrode width (m)

In Examples 1 to 2 and Comparative Examples 1 and 2, the member for back surface protective substrate 2 was only a polyethylene terephthalate layer. On the other hand, only the third embodiment is provided with the adhesive layer 2 for the back protective substrate member 2 (only the third embodiment is used, and the back protective substrate member 2 is made of the polyethylene terephthalate layer and the adhesive layer 2). Laminated structure).

The composition 2 of the adhesive layer 2 was set to use the model AP-201 manufactured by DIC Corporation as a urethane resin, and the model PM-80 manufactured by DIC Corporation as a melamine resin, using AP-201 and The blending ratio of PM-80 was 94 parts by mass / 6 parts by mass. The water was adjusted so that the concentration of the composition 2 became an aqueous solution of 10% by mass to obtain a coating agent. The coating agent was manually applied to the polyethylene terephthalate layer using a #3 stick, and then dried at 150 ° C for 2 minutes as the adhesive layer 2, thereby (polyethylene terephthalate) The laminate of the layer and the adhesive layer 2 is a member 2 for back surface protection substrate. Further, the thickness of the adhesive layer 2 at this time is theoretically 0.6 μm.

(Example 1)

[Configuration of solar cell module]

From the light-receiving surface side, the A-surface protective substrate/B light-receiving side-side encapsulant/C unit/E-integral/F back-protecting substrate member 2

[Manufacturing method of solar cell module]

[step 1]

In the first step, a linear low-density polyethylene (LLDPE) of an olefin resin, a model Sumikathene-L GA401 (melting point: 127 ° C) manufactured by Sumitomo Chemical Co., Ltd., and a copolymerization of ethylene and propylene using an olefin resin are used. Resin (EPC: Ethylene-Propylene-Copolymer) and model Noblen FL6412 (melting point 142 ° C) manufactured by Sumitomo Chemical Co., Ltd. were used as the member 1 for the back surface protective substrate.

The package material and the back surface protective substrate member 1 are made of a material of a thickness of 250 μm by a co-extrusion device comprising a T die, and the back surface protective substrate member 1 has a thickness of 200 μm. A total of extrusion. The extrusion width was carried out at 400 mm.

[Step 2]

A surface protection substrate/B light-receiving side material/C unit/E integrated material (arranged so that the package material side faces the unit)/F back surface protective substrate member 2 (arranged to face the corona-treated surface toward the integrated object) This order was superimposed, and the solar cell module was produced by press-bonding using the vacuum lamination apparatus shown in FIG. 8 by the method described later.

As a specific manufacturing method, the A surface protective substrate (glass: thickness: 3.2 mm) and the B light receiving surface side are packaged on a hot plate which has been previously heated to 160 ° C using the vacuum lamination apparatus shown in FIG. The material, the C unit, the E-integrated material, and the F-back protective substrate member 2 are laminated and left standing in this order.

After that, the upper frame of the vacuum laminating apparatus is closed and sealed, and the exhaust unit is used to discharge the air in the space from the exhaust pipe installed in the lower casing, and the supply/discharge from the upper casing is also provided. The air pipe discharges the air in the space formed by the rubber diaphragm and the upper casing, and the space portions at the two places are in a decompressed state. After maintaining this state for 4 minutes, air was introduced from the supply/exhaust pipe, and the rubber diaphragm was pressed against the laminated body by the pressure difference (atmospheric pressure) between the two space portions. The pressurized state was maintained for 16 minutes to manufacture a solar cell module.

(Example 2)

[Configuration of solar cell module]

From the light-receiving surface side, the A-surface protective substrate/B light-receiving side-side encapsulant/C unit/E-integral/F back-protecting substrate member 2

[Manufacturing method of solar cell module]

[step 1]

In the first step, a linear low-density polyethylene (LLDPE) of an olefin resin, a model Sumikathene-L GA401 (melting point: 127 ° C) manufactured by Sumitomo Chemical Co., Ltd. is used as a packaging material, and as a member 1 for a back surface protective substrate, The olefin layer 2 is an ethylene-propylene copolymer resin (EPC) using an olefin resin, Noblen FL6412 (melting point 142 ° C) manufactured by Sumitomo Chemical Co., Ltd., and an olefin layer 1 alone using ethylene-glycidyl methacrylate. The bond type Bondfast E (melting point 103 ° C) manufactured by Sumitomo Chemical Co., Ltd. was used as the adhesive resin.

In addition, the melting point of each of the above-mentioned raw materials is the same as the method of measuring the melting point of the layer, and it is measured in accordance with JIS K 7121 (1987) using model DSC-60 manufactured by Shimadzu Corporation. The same is true below.

The package material and the back protective substrate member 1 (olefin layers 1 and 2) are formed by using a co-extrusion device comprising a T die, and the package material has a thickness of 250 μm for the back surface protective substrate. The member 1 was coextruded in a thickness of 200 μm (the olefin layer 1 was 50 μm, and the olefin layer 2 was 150 μm). The extrusion width was carried out at 400 mm.

[Step 2]

A surface protection substrate/B light-receiving side material/C unit/E integrated material (arranged so that the package material side faces C unit)/F back surface protective substrate member 2 (arranged to face the corona-treated surface toward the E-piece) In order to overlap in this order, a solar cell module was fabricated by pressure bonding in the same manner as in Example 1 by a vacuum lamination apparatus.

(Example 3)

[step 1]

In the first step, a linear low-density polyethylene (LLDPE) of an olefin resin, a model Sumikathene-L GA401 (melting point: 127 ° C) manufactured by Sumitomo Chemical Co., Ltd. is used as a packaging material, and as a member 1 for a back surface protective substrate, The olefin layer 2 is an ethylene-propylene copolymer resin (EPC) using an olefin resin, Noblen FL6412 (melting point 142 ° C) manufactured by Sumitomo Chemical Co., Ltd., and an olefin layer 1 alone using ethylene-glycidyl methacrylate. The bond type Bondfast E (melting point 103 ° C) manufactured by Sumitomo Chemical Co., Ltd. was used as the adhesive resin.

The package material and the back protective substrate member 1 (olefin layers 1 and 2) were produced by using a co-extrusion device comprising a T die, and the package material was a thickness of 250 μm, and the member for back surface protection substrate was used. 1 was coextruded in a thickness of 200 μm (olefin layer 1 was 50 μm, olefin layer 2 was 150 μm). The extrusion width was carried out at 400 mm.

[Step 2]

A surface protection base material / B light-receiving side-side packaging material / C unit / E integrated material (arrangement of the package material side toward the C unit) / F back surface protection substrate member 2 (arrangement of the adhesion layer 2 toward the E integral) In this order, the solar cell modules were fabricated by the same method as in Example 1 by means of a vacuum lamination apparatus.

(Comparative Example 1)

[Configuration of solar cell module]

From the light-receiving surface side, the A-surface protective substrate/B light-receiving side-side encapsulant/C unit/D-package/E-integrated material (arranged to make the olefin layer 2 side toward the D-package)/F back-protecting substrate member 2 (Configure the corona treatment surface toward the E-piece)

[Manufacturing method of solar cell module]

[step 1]

The E-integrated material in the comparative example is a system which does not contain a sealing material, and the step 1 in this comparative example is a step of extrusion-coating the E-integrated body on the corona-treated surface of the F back-protecting substrate member 2.

As the member 1 for the back surface protective substrate, the olefin layer 2 is a copolymer resin (EPC) of ethylene and propylene of an olefin resin, and Noblen FL6412 (melting point 142 ° C) by Sumitomo Chemical Co., Ltd., and the olefin layer 1 is separately used. Bondfast E (melting point 103 ° C) manufactured by Sumitomo Chemical Co., Ltd., which is an ethylene-glycidyl methacrylate copolymer, was used as the adhesive resin.

In the above, the back surface protective substrate member 1 is extrusion-coated on the corona-treated surface of the F back surface protective substrate member 2, and the olefin layers 1 and F of the back surface protective substrate member 1 (olefin layers 1 and 2) are used. The back protective substrate is connected by the member 2.

In addition, as the extrusion coating resin, the back surface protective substrate member 1 was extrusion coated with a thickness of 200 μm (the olefin layer 1 was 50 μm, and the olefin layer 2 was 150 μm). The extrusion coating width was carried out at 400 mm.

[Step 2]

A surface protection substrate / B light-receiving side package / C unit / D package / extrusion coating produced in step 1 (arranged to make the olefin layer 2 side toward the D package) overlap in this order, The vacuum lamination device was pressure-bonded in the same manner as in Example 1 to manufacture a solar cell module. Further, the D package was made of ethylene-vinyl acetate copolymer (EVA) (Model: Fastcure PV-45FR00S, manufactured by Sanvic Co., Ltd., thickness: 450 μm) , melting point 70 ° C).

(Comparative Example 2)

[Configuration of solar cell module]

From the light-receiving surface side, the A surface protective substrate/B light-receiving side-side packaging material/C unit/E integrated material (the olefin layer 2 side is disposed toward the D-package material)/F-back protective substrate member 2 Halo treatment surface facing E one body)

[Manufacturing method of solar cell module]

In the comparative example, the E-integrated system is a system that does not contain a packaging material, and the film for the back surface protective substrate 1 is a film in which the olefin layers 1 and 2 are co-extruded in advance.

The coextruded film (member 1 for back surface protective substrate) was co-extruded so that the thickness of the olefin layer 1 was 50 μm, and the thickness of the olefin layer 2 was 150 μm.

As the member 1 for the back surface protective substrate, the olefin layer 2 is a copolymer resin (EPC) of ethylene and propylene of an olefin resin, and Noblen FL6412 (melting point 142 ° C) by Sumitomo Chemical Co., Ltd., and the olefin layer 1 is separately used. Bondfast E (melting point 103 ° C) manufactured by Sumitomo Chemical Co., Ltd., which is an ethylene-glycidyl methacrylate copolymer, was used as the adhesive resin.

[step 1]

In the first step of the comparative example, the adhesive was applied to the corona-treated surface of the F-back protective substrate member 2, and the E-integrated film (the back protective substrate member 1) of the co-extruded film prepared in advance was dry. The step of laminating the olefin layer 1 toward the adhesive agent surface.

The adhesive applied to the corona-treated surface of the member 2 for protecting the base material of the F back is made of a main component such as polyester polyol and an isocyanate-based one. In the curing agent, the E-integrated material (the member for back surface protective substrate 1) and the F-back protective substrate member 2 are dry-laid. The dry laminate width is implemented at 400 mm.

[Step 2]

A surface protection substrate / B light-receiving side package / C unit / D package / dry laminate manufactured in step 1 (arranged to make the olefin layer 2 side toward the D package) overlap in this order, by vacuum The layering device was pressure-bonded in the same manner as in Example 1 to manufacture a solar cell module.

Further, as the D encapsulant, an ethylene-ethylene acetate copolymer (EVA) (Model Fastcure PV-45FR00S manufactured by Sanvic Co., Ltd., thickness: 450 μm, melting point: 70 ° C) was used.

[Common use materials (object: Examples 4 to 15)] (The letters attached to the first of the following materials correspond to the letters of Table 2 of his page)

A. Surface protection substrate

A white heat-treated glass having a thickness of 3.2 mm and a wavelength of 350 to 1400 nm and having a transmittance of 90% or more was used.

B. Light-receiving side packaging material

An ethylene-ethylene acetate copolymer (EVA) (Model Fastcure PV-45FR00S, manufactured by Sanvic Co., Ltd., thickness: 450 μm) was used as the package sheet on the light-receiving surface side.

other

In the examples 4 to 15, in order to set the starting point (peeling portion) at the time of evaluating the adhesion strength, a commercially available PET (release PET) provided with a release coating layer was cut into a size of 53 mm × 105 mm, and this was cut into a size of 53 mm × 105 mm. The release PET is sandwiched between the back layer 1 and the back layer 2. In this state, even if step 2 (pressurization) is carried out and the mold release PET is sandwiched, the layers 1 and 2 are not subsequently pressed (pressure-bonded). because Therefore, when the peeling test for measuring the adhesive strength is performed, the position (not attached (pressure-bonded)) can be used as the "peeling portion". Further, as the release PET, Cerapeel (registered trademark) model MF manufactured by Toray Film Processing Co., Ltd. was used.

(Example 4)

[Composition of analog solar cell modules]

From the light-receiving surface side, the A-surface protective substrate/B light-receiving side-side packaging material/E-integrated material/F-back protective substrate member 2

[Manufacturing method of analog module]

[step 1]

For the step 1, a linear low-density polyethylene (LLDPE) of an olefin resin, a model of Sumikathene-L GA401 (melting point: 127 ° C) manufactured by Sumitomo Chemical Co., Ltd., and an olefin are used as the member 1 for the back surface protective substrate. The layer 2 is a copolymerized resin (EPC) of ethylene and propylene using an olefin resin, Noblen FL6412 (melting point 142 ° C) manufactured by Sumitomo Chemical Co., Ltd., and the olefin layer 1 (layer 1) is an ethylene-methyl group alone. Bondfast E (melting point 103 ° C) manufactured by Sumitomo Chemical Co., Ltd., a polypropylene acrylate copolymer, was used as the adhesive resin.

The package material and the back surface protection substrate member 1 (olefin layers 1 and 2) are made of a T-die using a co-extrusion device, and the package material has a thickness of 250 μm, and the back surface protection substrate member is used. 1 was coextruded in a thickness of 200 μm (olefin layer 1 was 50 μm, olefin layer 2 was 150 μm). The extrusion width was carried out at 400 mm.

[Next Layer 2 Formation Step]

The polyethylene terephthalate layer of the member 2 for protecting the substrate on the back side Set layer 2 on top. The composition 2 used to form the adhesive layer 2 was model AP-201 manufactured by DIC Co., Ltd. as a urethane resin, and model PM-80 manufactured by DIC Corporation was used as a melamine resin, and AP-201 and PM were used. The blending ratio of -80 was 94 parts by mass / 6 parts by mass. The water was adjusted so that the concentration of the composition 2 became an aqueous solution of 10% by mass to obtain a coating agent. The coating agent was manually applied to the polyethylene terephthalate layer using a #3 rod, and then dried at 150 ° C for 2 minutes as the adhesive layer 2, thereby serving as the back protective substrate member 2 .

[Step 2]

A surface protection base material / B light-receiving side-side packaging material / E integrated material (arranged to face the package material side B) / F back surface protective substrate member 2 (arrangement of the adhesive layer 2 toward the E-integrated body) in this order After overlapping, a solar cell module was fabricated by the same method as in Example 1 by a vacuum laminating apparatus.

In this case, the A surface protective substrate/B light-receiving side-side packaging material/E-integrated material/F-back surface protective substrate member 2 is each a size having a side length of 105 mm square.

Further, a release PET having a size of 53 mm × 105 mm was sandwiched between the adhesive layer 1 and the adhesive layer 2, and then pressurized (pressure-bonded). At this time, as shown in Fig. 9, the release PET is sandwiched between the adhesive layer 1 and the adhesive layer 2, so that the long side of one side of the release PET is along one side of the member other than the release PET (making it Become consistent).

Using the obtained solar cell module (analog module), the bonding strength was evaluated by the following method, and the bonding strength was also evaluated by the same method for the following examples and comparative examples.

[Follow strength assessment]

In the dummy module of the embodiment, the adhesion strength of the adhesive layer 2 of the back surface protective member 1 and the back surface layer 2 of the back protective substrate member 2 was confirmed.

The dimensions are made into squares having a side length of 105 mm. Hereinafter, an additional simulation module for evaluation of the strength is used. Further, the analog module is used as a module for the subsequent strength evaluation, and is a unit that does not include a unit.

The method of measuring the strength of the next step will be described below.

First, a portion other than the glass (A surface protective substrate) of the dummy module was cut into strips having a width of 5 mm and a length of 105 mm. As will be described later, the number of evaluations is 2 times, and the edges of the simulation module, that is, the sides parallel to the short side of the release PET, are respectively cut into the slits at positions of 10 mm, 15 mm, and 20 mm (see the 10)). Thereby, two rectangular samples having a width of 5 mm and a length of 105 mm were obtained. That is, in Fig. 10, the area between the slits 51 to 52 is the first sample, and the area between the slits 52 to 53 is the second sample.

Next, the release PET is removed from the analog module.

Next, the Tensilon universal material testing machine RTG-1210 manufactured by A and D Co., Ltd. was used for measurement at a 180° peeling method and a drawing speed of 200 mm/min. In other words, as shown in Fig. 11, the "peeling portion" of the sample having a width of 5 mm and a length of 105 mm and the laminated body of the A surface protective substrate/B light-receiving side-side sealing material/E integral are formed. The edge of the specimen in the longitudinal direction is fixed to the chuck on the Tensilon side. Further, the F-back protective substrate member 2 on the edge is fixed to the chuck on the other side of the Tensilon (and the length of the F-back protective substrate member 2 is insufficient). The shape is supplemented by a transparent tape (not shown), Cellotape (registered trademark), and the like, and is fixed to the chuck on the other side of Tensilon. Then, the laminate of the F back surface protective substrate member 2 from the A surface protective substrate/B light receiving surface side sealing material/E integral is peeled off in the 180° direction by using the above-described Tensilon.

The evaluation system was performed twice in total, and the double value of the average value was set as the next strength.

Further, the above measurement was carried out before and after storage in a high-temperature and high-humidity environment (120 ° C × 100% RH × 48 hours). Further, the storage in a high-temperature and high-humidity environment was carried out using a Pressure Cooker (Highly Accelerated Life Tester Model EHS-221MD) manufactured by Espec Corporation.

The subsequent strength was evaluated based on the following criteria.

(1) If the subsequent strength before and after storage is 40N/10mm or more, it is "0".

(2) If it is not in compliance with (1) and (3), the rate of change in the strength of the joint strength before and after storage as shown below is rated as "1", and the value of more than 50% is rated as "2" .

Rate of change (%) = [(the strength before storage - the strength after storage) / the strength before storage] × 100

(3) Those who have at least one of the strengths before and after the storage are less than 10 N/10 mm are rated as "3".

Further, at the time of (1) and (3), the rate of change is not measured, and the measurement result of the rate of change is described as "ignoring".

(Example 5)

[Composition of analog solar cell modules]

From the light-receiving surface side, the A-surface protective substrate/B light-receiving side-side packaging material/E-integrated material/F-back protective substrate member 2

[Manufacturing method of analog module]

[step 1]

It was carried out in the same manner as in Example 4.

[Next Layer 2 Formation Step]

The adhesive layer 2 is provided on the polyethylene terephthalate layer of the back protective substrate member 2. The composition 2 used to form the adhesive layer 2 was model AP-201 manufactured by DIC Co., Ltd. as a urethane resin, and model EP-10 manufactured by DIC Corporation was used as an epoxy resin, and AP-201 was used. The blending ratio with EP-10 was 94 parts by mass / 6 parts by mass. The coating agent was adjusted so that the concentration of the composition 2 became an aqueous solution of 10% by mass, and then the epoxy resin was difficult to mix with water, and 0.25 parts by mass of a surfactant was added, and a model of Surfynol 440, manufactured by Nissin Chemical Co., Ltd., was added. Thereafter, the coating agent was manually applied to the polyethylene terephthalate layer using a #3 rod, and then dried at 150 ° C for 2 minutes as the adhesive layer 2, thereby serving as a member for the back surface protective substrate. 2.

[Step 2]

It was carried out in the same manner as in Example 4.

(Example 6)

[Configuration of analog solar cell module]

From the light-receiving surface side, the A-surface protective substrate/B light-receiving side-side packaging material/E-integrated material/F-back protective substrate member 2

[Manufacturing method of analog module]

[step 1]

A model Modic F535 (melting point 122 ° C) manufactured by Mitsubishi Chemical Corporation, which is an acid-modified resin obtained by graft-polymerizing maleic anhydride with an olefin resin, is used as an adhesive resin of the olefin layer 1 (layer 1). The same procedure as in Example 4 was carried out.

[Next Layer 2 Formation Step]

It was carried out in the same manner as in Example 5.

[Step 2]

It was carried out in the same manner as in Example 4.

(Example 7)

[Configuration of analog solar cell module]

From the light-receiving surface side, the A-surface protective substrate/B light-receiving side-side packaging material/E-integrated material/F-back protective substrate member 2

[Manufacturing method of analog module]

[step 1]

It was carried out in the same manner as in Example 4.

[Next Layer 2 Formation Step]

The adhesive layer 2 is provided on the polyethylene terephthalate layer of the back protective substrate member 2. The composition 2 used to form the adhesive layer 2 was model AP-201 manufactured by DIC Corporation as a urethane resin, and model PM-80 manufactured by DIC Corporation was used as a melamine resin, and DIC Corporation was used. The model EP-10 was used as an epoxy resin, and the blend ratio of AP-201 to PM-80 to EP-10 was 92 parts by mass/6 parts by mass/2 parts by mass. Adding water to adjust the concentration of the composition 2 to 10% by mass of the aqueous solution, and then, because the epoxy resin is difficult to mix with water, and adding 0.25 parts by mass of the surfactant, Nissin Chemical Co., Ltd. A coating agent was obtained from the model, Surfynol 440. Thereafter, the coating agent was manually applied to the polyethylene terephthalate layer using a #3 rod, and then dried at 150 ° C for 2 minutes as the adhesive layer 2, thereby serving as a back surface protective substrate. Member 2.

[Step 2]

It was carried out in the same manner as in Example 4.

(Example 8)

[Configuration of analog solar cell module]

From the light-receiving surface side, the A-surface protective substrate/B light-receiving side-side packaging material/E-integrated material/F-back protective substrate member 2

[Manufacturing method of analog module]

[step 1]

It was carried out in the same manner as in Example 6.

[Next Layer 2 Formation Step]

The same procedure as in Example 7 was carried out.

[Step 2]

It was carried out in the same manner as in Example 4.

(Example 9)

[Configuration of analog solar cell module]

From the light-receiving surface side, the A-surface protective substrate/B light-receiving side-side packaging material/E-integrated material/F-back protective substrate member 2

[Manufacturing method of analog module]

[step 1]

Model LC3-UV (melting point) manufactured by Arkema Co., Ltd., which uses a guanamine-modified resin which graft-polymerizes a guanamine group with an olefin resin. 130 ° C) The same procedure as in Example 4 was carried out, except that the olefin layer 1 (adjacent layer 1) was used as the adhesive resin.

[Next Layer 2 Formation Step]

The same procedure as in Example 7 was carried out.

[Step 2]

It was carried out in the same manner as in Example 4.

(Embodiment 10)

[Configuration of analog solar cell module]

From the light-receiving surface side, the A-surface protective substrate/B light-receiving side-side packaging material/E-integrated material/F-back protective substrate member 2

[Manufacturing method of analog module]

[step 1]

The decane-modified resin (melting point: 85 ° C) obtained by graft-polymerizing a sterol group with an olefin resin was used in the same manner as in Example 4 except that the olefin layer 1 (adjacent layer 1) was used.

[Next Layer 2 Formation Step]

The same procedure as in Example 7 was carried out.

[Step 2]

It was carried out in the same manner as in Example 4.

(Example 11)

[Configuration of analog solar cell module]

From the light-receiving surface side, the A-surface protective substrate/B light-receiving side-side packaging material/E-integrated material/F-back protective substrate member 2

[Manufacturing method of analog module]

[step 1]

It was carried out in the same manner as in Example 4.

[Next Layer 2 Formation Step]

The adhesive layer 2 is provided on the polyethylene terephthalate layer of the back protective substrate member 2. The composition 2 used for forming the adhesive layer 2 was a model Dicseal HS-W EXP110202 manufactured by DIC Co., Ltd. containing both a urethane resin and an olefin resin, and a model Additive EXP110208 manufactured by DIC Corporation. As the epoxy resin, the blend ratio of EXP110202 to EXP110208 was 91 parts by mass/9 parts by mass. Addition of water to adjust the concentration of the composition 2 to 10% by mass of the aqueous solution, and further, it is difficult to mix with water, and 0.25 parts by mass of a surfactant is added, manufactured by Nissin Chemical Co., Ltd., model Surfynol 440 And get the paint. Thereafter, the coating agent was manually applied to the polyethylene terephthalate layer using a #3 rod, and then dried at 150 ° C for 2 minutes as the adhesive layer 2, thereby serving as a back surface protective substrate. Member 2.

[Step 2]

It was carried out in the same manner as in Example 4.

(Embodiment 12)

[Configuration of analog solar cell module]

From the light-receiving surface side, the A-surface protective substrate/B light-receiving side-side packaging material/E-integrated material/F-back protective substrate member 2

[Manufacturing method of analog module]

[step 1]

It was carried out in the same manner as in Example 6.

[Next Layer 2 Formation Step]

The same procedure as in Example 11 was carried out.

[Step 2]

It was carried out in the same manner as in Example 4.

(Example 13)

[Configuration of analog solar cell module]

From the light-receiving surface side, the A-surface protective substrate/B light-receiving side-side packaging material/E-integrated material/F-back protective substrate member 2

[Manufacturing method of analog module]

[step 1]

The same procedure as in Example 9 was carried out.

[Next Layer 2 Formation Step]

The same procedure as in Example 11 was carried out.

[Step 2]

It was carried out in the same manner as in Example 4.

(Example 14)

[Configuration of analog solar cell module]

From the light-receiving surface side, the A-surface protective substrate/B light-receiving side-side packaging material/E-integrated material/F-back protective substrate member 2

[Manufacturing method of analog module]

[step 1]

The same procedure as in Example 10 was carried out.

[Next Layer 2 Formation Step]

The same procedure as in Example 11 was carried out.

[Step 2]

It was carried out in the same manner as in Example 4.

(Example 15)

[Configuration of analog solar cell module]

From the light-receiving surface side, the A-surface protective substrate/B light-receiving side-side packaging material/E-integrated material/F-back protective substrate member 2

[Manufacturing method of analog module]

[step 1]

It was carried out in the same manner as in Example 4.

[Next Layer 2 Formation Step]

The adhesive layer 2 is provided on the polyethylene terephthalate layer of the back protective substrate member 2. The composition 2 used for forming the adhesive layer 2 was model AP-201 manufactured by DIC Corporation as a urethane. The water was adjusted so that the concentration of the composition 2 became an aqueous solution of 10% by mass to obtain a coating agent. The coating agent was manually applied onto the polyethylene terephthalate layer using a #3 rod, and then dried at 150 ° C for 2 minutes as the adhesive layer 2, thereby using the member for the back surface protective substrate. 2.

[Step 2]

It was carried out in the same manner as in Example 4.

The diagonal lines in the table indicate that the material is not used.

(Comparison of Examples 1 to 3 and Comparative Examples 1 and 2)

Comparing the examples with the comparative examples, the examples confirmed the crimping condition after the step 1, and the crimping state when the materials of the vacuum laminating apparatus (heated heating plate) were stacked in the step 2 and were left standing. It is a grade of "1", and it can be said that it is a level that is not problematic in the process of manufacturing a solar cell module.

On the other hand, Comparative Example 1 is a roll-up of E after step 1. The article (3) in which the extrusion coating of the member (the back protective substrate member 1) and the F back surface protective member member 2 is greatly crimped on the back protective substrate member 1 (olefin layer 2) side; In the vacuum laminating apparatus (heated heating plate), when each material is laminated and left standing, it is also greatly crimped to the grade "3". This situation is a problem in the passability of the solar cell module manufacturing process, and it can be said that it is not capable of mass production.

In Comparative Example 2, the crimping after the step 1 was performed to curl the side of the back protective substrate member 1 (olefin layer 2) to the grade "2"; and the step 2 was performed in the vacuum laminating apparatus (heated hot plate). When the materials are stacked and left to stand, the dry laminate of the E-integrated material (the member for back surface protective substrate 1) and the member for the F back surface protective substrate is applied to the back protective substrate member 1 (olefin layer 2) side. The level of "3" is greatly curled up. This situation is a problem in the passability of the solar cell module manufacturing process, and it can be said that it is not capable of mass production.

The diagonal lines in the table indicate that the material is not used.

(Results of Examples 4 to 15)

The embodiment is a level of "1" or more, and can be said to be a practically sufficient performance. In particular, the layer 1 is an epoxy resin (ethylene-glycidyl methacrylate copolymer) and the layer 2 contains a urethane resin, and then the strength is grade "0", which can be said to be even at a high temperature. In high-humidity environments, it also has full performance.

1‧‧‧1st

2‧‧‧Package

3‧‧‧Back member for protective substrate 1

4‧‧‧Back member for protective substrate 2

28‧‧‧Back protective substrate

Claims (14)

A method of manufacturing a solar cell module, characterized in that the method for manufacturing a solar cell module comprises the steps of: a component 1 for a laminated layer and a back protective substrate, and a member for manufacturing a package ‧ a back protective substrate The integrated body (hereinafter, simply referred to as an integrated body); and then has the step 2: the surface protective substrate, the sealing material, the unit, the integrated body, and the back protective substrate member 2 are superposed and pressure-bonded in this order. A method of manufacturing a solar cell module, characterized in that the method for manufacturing a solar cell module has the step 2: attaching a body member (hereinafter, also simply referred to as an integral body) of the package member ‧ back protective substrate member according to the surface The protective base material, the sealing material, the unit, the integrated body, and the back protective substrate member 2 are stacked and pressure-bonded in this order, and the integrated material is laminated on the back protective substrate member 1. The method of manufacturing a solar cell module according to claim 1, wherein the lamination of the encapsulant and the back protective substrate member 1 in the step 1 is performed by co-extrusion. The method for producing a solar cell module according to any one of claims 1 to 3, wherein the member for back surface protective substrate 1 has a layer containing an olefin resin as a main component. The method for producing a solar cell module according to any one of claims 1 to 4, wherein the member for back surface protective substrate 1 has two layers of an olefin resin as a main component. The method for manufacturing a solar cell module according to any one of claims 1 to 5, wherein the composition for the back protective substrate member 1 and the back surface protective substrate The layer on the side surface connected by the member 2 is a layer mainly composed of an olefin resin (hereinafter referred to as an olefin layer 1); the olefin layer 1 has an adhesiveness (hereinafter, the olefin layer 1 having an adhesiveness is referred to as an adhesive layer 1) ). The method of manufacturing a solar cell module according to any one of claims 1 to 6, wherein the layer on the side surface of the member for back surface protective substrate 2 and the member for back surface protective substrate 1 has an adhesive property (hereinafter, This layer is called the back layer 2). The method of manufacturing a solar cell module according to any one of claims 1 to 7, wherein the encapsulating material is mainly composed of an olefin resin. A back surface protective substrate for a solar cell module, wherein the back surface protective substrate is characterized in that the back surface protective substrate is a laminate of the back surface protective substrate member 1 and the back protective substrate member 2 The layer on the side surface of the back protective substrate member 1 that is connected to the back protective substrate member 2 is a layer mainly composed of an olefin resin (hereinafter referred to as an olefin layer 1); the olefin layer 1 has The following (hereinafter, the olefin layer 1 having the adhesiveness is referred to as the adhesive layer 1); and the layer on the side surface of the back protective substrate member 2 that is connected to the back protective substrate member 1 has adhesion (hereinafter, This layer is referred to as the subsequent layer 2). The back protective substrate for a solar cell module according to claim 9, wherein the adhesive layer 2 is obtained from a composition containing a urethane resin (hereinafter referred to as a composition 2). The back surface protective substrate for a solar cell module according to claim 10, wherein the composition 2 contains at least one selected from the group consisting of a melamine resin, an epoxy resin, and an olefin resin. The back protective substrate for a solar cell module according to any one of claims 9 to 11, wherein the adhesive layer 1 contains an adhesive resin; the adhesive resin is selected from the group consisting of epoxy-modified olefin resins and acid-modified olefin resins At least one selected from the group consisting of a guanamine-modified olefin resin and a decane-modified olefin resin. The back protective substrate for a solar cell module according to claim 12, wherein the adhesive resin is an ethylene-glycidyl methacrylate copolymer. The back surface protective substrate for a solar cell module according to any one of claims 9 to 13, wherein the back protective substrate member 2 has a layer mainly composed of polyethylene terephthalate (hereinafter, referred to as In the polyethylene terephthalate layer, the polyethylene terephthalate layer contains 1% by mass or more and 30% by mass or less of white particles.