TW201510035A - Surface protective film - Google Patents

Surface protective film Download PDF

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TW201510035A
TW201510035A TW103125483A TW103125483A TW201510035A TW 201510035 A TW201510035 A TW 201510035A TW 103125483 A TW103125483 A TW 103125483A TW 103125483 A TW103125483 A TW 103125483A TW 201510035 A TW201510035 A TW 201510035A
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methyl
pentene
weight
copolymer
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TW103125483A
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TWI628220B (en
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Takayuki Uekusa
Masahiko Okamoto
Yoshisada Tamo
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Mitsui Chemicals Inc
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    • CCHEMISTRY; METALLURGY
    • C09DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09JADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J125/00Adhesives based on homopolymers or copolymers of compounds having one or more unsaturated aliphatic radicals, each having only one carbon-to-carbon double bond, and at least one being terminated by an aromatic carbocyclic ring; Adhesives based on derivatives of such polymers
    • C09J125/02Homopolymers or copolymers of hydrocarbons
    • C09J125/04Homopolymers or copolymers of styrene
    • C09J125/08Copolymers of styrene
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B32LAYERED PRODUCTS
    • B32BLAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B27/00Layered products comprising a layer of synthetic resin
    • B32B27/06Layered products comprising a layer of synthetic resin as the main or only constituent of a layer, which is next to another layer of the same or of a different material
    • B32B27/08Layered products comprising a layer of synthetic resin as the main or only constituent of a layer, which is next to another layer of the same or of a different material of synthetic resin
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B32LAYERED PRODUCTS
    • B32BLAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B27/00Layered products comprising a layer of synthetic resin
    • B32B27/30Layered products comprising a layer of synthetic resin comprising vinyl (co)polymers; comprising acrylic (co)polymers
    • B32B27/302Layered products comprising a layer of synthetic resin comprising vinyl (co)polymers; comprising acrylic (co)polymers comprising aromatic vinyl (co)polymers, e.g. styrenic (co)polymers
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B32LAYERED PRODUCTS
    • B32BLAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B27/00Layered products comprising a layer of synthetic resin
    • B32B27/32Layered products comprising a layer of synthetic resin comprising polyolefins
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B32LAYERED PRODUCTS
    • B32BLAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B7/00Layered products characterised by the relation between layers; Layered products characterised by the relative orientation of features between layers, or by the relative values of a measurable parameter between layers, i.e. products comprising layers having different physical, chemical or physicochemical properties; Layered products characterised by the interconnection of layers
    • B32B7/04Interconnection of layers
    • B32B7/12Interconnection of layers using interposed adhesives or interposed materials with bonding properties
    • CCHEMISTRY; METALLURGY
    • C09DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09JADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J123/00Adhesives based on homopolymers or copolymers of unsaturated aliphatic hydrocarbons having only one carbon-to-carbon double bond; Adhesives based on derivatives of such polymers
    • C09J123/02Adhesives based on homopolymers or copolymers of unsaturated aliphatic hydrocarbons having only one carbon-to-carbon double bond; Adhesives based on derivatives of such polymers not modified by chemical after-treatment
    • C09J123/18Homopolymers or copolymers of hydrocarbons having four or more carbon atoms
    • C09J123/20Homopolymers or copolymers of hydrocarbons having four or more carbon atoms having four to nine carbon atoms
    • CCHEMISTRY; METALLURGY
    • C09DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09JADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J7/00Adhesives in the form of films or foils
    • C09J7/20Adhesives in the form of films or foils characterised by their carriers
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B32LAYERED PRODUCTS
    • B32BLAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B2307/00Properties of the layers or laminate
    • B32B2307/40Properties of the layers or laminate having particular optical properties
    • B32B2307/42Polarizing, birefringent, filtering
    • CCHEMISTRY; METALLURGY
    • C09DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09JADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J2423/00Presence of polyolefin
    • CCHEMISTRY; METALLURGY
    • C09DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09JADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J2425/00Presence of styrenic polymer

Abstract

The purpose of the present invention is to provide a surface protective film in which, when affixed to various adherends that are flat or have concavities and convexities, self-releasing from an adherend is prevented and acceleration of adhesion in the adhesive layer can be prevented. The surface protective film of the present invention comprises a layered body having a substrate layer and at least one adhesive layer composed of a resin composition characterized in containing 2 to 50 parts by weight of a 4-methyl-1-pentene.[alpha]-olefin copolymer (A) that satisfies the conditions (a), (b), (c), and (d) below, and 50 to 98 parts by weight of a thermoplastic resin (B). The copolymer (A) satisfies the conditions of (a) comprising 65 to 90 mol% of a constituent element (i) derived from 4-methyl-1-pentene, and 35 to 10 mol% of a constituent element (ii) derived from [alpha]-olefin; (b) having an intrinsic viscosity [[eta]] in the range of 0.1 to 5.0 dL/g as measured at 135 DEG C in decalin; (c) having a molecular weight distribution (Mw/Mn) in the range of 1.0 to 3.5; and (d) having a density in the range of 870 to 830 kg/m3.

Description

表面保護薄膜 Surface protection film

本發明係關於一種包含積層體之表面保護薄膜,該積層體具有包含特定樹脂組成物之黏著劑層。 The present invention relates to a surface protective film comprising a laminate having an adhesive layer comprising a specific resin composition.

為了保護鋁板、鋼板、不鏽鋼板等金屬板及該等之塗裝板、玻璃或合成樹脂板以及包含該等構件之製品及零件,使用積層黏著層與基材層而成之表面保護薄膜。該表面保護薄膜係於素材之成形加工時或成形加工後之既定之時期被剝離。 In order to protect a metal plate such as an aluminum plate, a steel plate, or a stainless steel plate, and such a coated plate, a glass or a synthetic resin plate, and a product and a component including the same, a surface protective film in which an adhesive layer and a base material layer are laminated is used. The surface protective film is peeled off at a predetermined period of time during or after the forming of the material.

對該表面保護薄膜要求可黏著於被黏附體而容易地接著,於被黏附體之搬運時等不會容易地剝離,於加工時或加工後剝離時可容易地剝離。因此,對保護薄膜要求對被黏附體之被保護面的適度之黏著性、薄膜本身不會對被保護面造成損傷之程度的適度之柔軟性,進而應對被黏附體之加工成形時而要求延伸特性等機械特性適度、具有耐熱性等各種特性。又,根據用途而必須具有良好之外觀、透明性及色調,要求無凝膠、魚眼等薄膜缺陷。進而,此種表面薄膜係被大量消耗且快速廢棄者,因此要求可廉價地製造。 The surface protective film is required to be adhered to the adherend and easily adhered, and is not easily peeled off during conveyance of the adherend, and can be easily peeled off during processing or peeling after processing. Therefore, the protective film is required to have a moderate degree of adhesion to the protected surface of the adherend, and the film itself is not moderately soft to the extent that the protected surface is damaged, and the stretched film is required to be processed during the forming of the adhered body. Various properties such as characteristics such as moderate mechanical properties and heat resistance. Further, it is necessary to have a good appearance, transparency, and color tone depending on the use, and it is required to have no film defects such as gel or fish eyes. Further, such a surface film is consumed in a large amount and is quickly discarded, and therefore it is required to be inexpensive to manufacture.

先前,作為此種黏著薄膜,可列舉:於以低密度聚乙烯、聚丙烯等聚合體為主成分之基材薄膜之單面塗佈丙烯酸系或橡膠系之黏著劑而成者,或者將聚烯烴及苯乙烯系彈性體等以黏著劑用顆粒之形式與基材層擠出成形而成者等。 In the past, as an adhesive film, an acrylic or rubber-based adhesive is applied to one surface of a base film containing a polymer such as low-density polyethylene or polypropylene as a main component, or a poly-polymer is used. An olefin, a styrene-based elastomer, or the like is formed by extrusion molding of a base material layer in the form of particles for an adhesive.

例如於專利文獻1中記載有含有包含丙烯、碳數4~12之α-烯烴及乙烯作為共聚合體成分之丙烯系聚合體,對被黏附體之污染性較低的黏著劑及黏著片。 For example, Patent Document 1 discloses an adhesive or an adhesive sheet containing a propylene-based polymer containing propylene, an α-olefin having 4 to 12 carbon atoms, and ethylene as a copolymer component, and having low contamination to the adherend.

又,關於電子材料、光學製品,存在大量例如偏光板、相位差板、導光板、反射板、稜鏡板之類的要求特性之構件,期望亦對該等構件保持適度之黏著力之保護薄膜。此種於表面具有凹凸之被黏附體由於與接著劑層之接觸面積較小,故而對黏著劑層要求較高之黏著力。然而,因形成高黏著力而擔心塗佈等成形方法之限定、於被黏附體上之糊劑殘留等。 Further, regarding electronic materials and optical products, there are a large number of members having required characteristics such as a polarizing plate, a phase difference plate, a light guide plate, a reflecting plate, and a seesaw, and it is desirable to provide a protective film which also maintains an appropriate adhesive force for the members. Since the adhered body having irregularities on the surface has a small contact area with the adhesive layer, a high adhesive force is required for the adhesive layer. However, due to the formation of high adhesion, there is a concern about the limitation of the molding method such as coating, the residue remaining on the adherend, and the like.

自更具體之方面看上述情況,關於電子材料、光學製品,存在例如偏光板、相位差板、導光板、反射板、稜鏡薄片或擴散薄膜等般表面成為凹凸者。為了不對該凹凸造成損傷,於使用之前藉由保護薄膜保護該凹凸表面,期望亦對該等構件保持適度黏著力之表面保護薄膜。此種表面保護薄膜於貼附於被黏附體表面後,因時間及溫度等外因而存在所謂黏著亢進之問題。黏著亢進尤其是於具有表面凹凸形狀之情形時因被黏附體與黏著劑層之間之接觸面積增加而產生,其中於如擴散薄膜、反射薄膜般凹凸相對較小之被黏附體之情形時,該接觸面積之增加較顯著,因此尤其容易產生黏著亢進。其結果,自被黏附體表面剝離之作業難以進行或黏著部局部殘留於被黏附體上而產生糊劑殘留。 In view of the above, the electronic material and the optical product may have irregularities such as a polarizing plate, a phase difference plate, a light guide plate, a reflection plate, a ruthenium sheet, or a diffusion film. In order not to damage the unevenness, the uneven surface is protected by a protective film before use, and it is desirable to maintain a moderately protective surface protective film for the members. When such a surface protective film is attached to the surface of the adherend, there is a problem of so-called adhesion due to time, temperature, and the like. Adhesive adhesion, especially in the case of having a surface uneven shape, is caused by an increase in the contact area between the adherend and the adhesive layer, in the case of an adherend having a relatively small unevenness such as a diffusion film or a reflective film, The increase in the contact area is remarkable, so that adhesion is particularly likely to occur. As a result, it is difficult to carry out the work of peeling off from the surface of the adherend, or the adhesive portion partially remains on the adherend to cause paste residue.

專利文獻2、3中揭示有含有包含作為異丁烯系嵌段共聚合體之苯乙烯系彈性體與黏著賦予樹脂之黏著層的表面保護薄膜。然而,於利用上述公報之方法貼合於高凹凸之被黏附體之情形時,存在黏著力不充分之情況,黏性或黏連較差,因擠出成形不良而導致生 產性有缺陷。 Patent Documents 2 and 3 disclose a surface protective film containing an adhesive layer containing a styrene-based elastomer as an isobutylene-based block copolymer and an adhesion-imparting resin. However, in the case of adhering to the adherend of high irregularities by the method of the above publication, there is a case where the adhesive force is insufficient, the viscosity or the adhesion is poor, and the extrusion molding is poor. Productivity is defective.

又,專利文獻4、5中揭示有於黏著層使用苯乙烯系彈性體而不易產生黏著亢進之樹脂組成物及表面保護薄膜,但停留於對聚對苯二甲酸乙二酯(PET,polyethylene terephthalate)基板或丙烯酸系基板等平滑基板之黏著力評價,且黏著力較低,因此難以向有凹凸形狀之基板推廣。 Further, Patent Documents 4 and 5 disclose that a resin composition and a surface protective film which are not easily viscous in the adhesive layer using a styrene-based elastomer are present, but remain in polyethylene terephthalate (PET). The adhesion of a smooth substrate such as a substrate or an acrylic substrate is evaluated, and the adhesion is low, so that it is difficult to promote the substrate having the uneven shape.

又,專利文獻6中揭示有於黏著層藉由強黏著性之苯乙烯系彈性體與特定之脂肪醯胺之組成物而抑制黏著亢進的表面保護薄膜,但由於使用低分子量化合物,故而擔心對被黏附體之污染性等。 Further, Patent Document 6 discloses a surface protective film in which an adhesive layer suppresses adhesion by a composition of a strong adhesive styrene elastomer and a specific fatty amide, but since a low molecular weight compound is used, it is feared that Contamination of the adherend.

[先前技術文獻] [Previous Technical Literature] [專利文獻] [Patent Literature]

專利文獻1:國際公報第WO2008/099865號說明書 Patent Document 1: International Publication No. WO2008/099865

專利文獻2:日本專利特開2007-126512號公報 Patent Document 2: Japanese Patent Laid-Open Publication No. 2007-126512

專利文獻3:日本專利特開2012-255071號公報 Patent Document 3: Japanese Patent Laid-Open Publication No. 2012-255071

專利文獻4:日本專利特開2008-274213號公報 Patent Document 4: Japanese Patent Laid-Open Publication No. 2008-274213

專利文獻5:日本專利特開2011-126169號公報 Patent Document 5: Japanese Patent Laid-Open No. 2011-126169

專利文獻6:日本專利特開2013-121989號公報 Patent Document 6: Japanese Patent Laid-Open Publication No. 2013-121989

關於本發明所欲解決之課題,其目的在於提供一種於貼附於平面或具有凹凸之各種被黏附體時防止自被黏附體之自然剝離的表面保護薄膜。又,關於本發明所欲解決之另一課題,其目的在於提供一種於貼附於各種被黏附體時可抑制黏著層之黏著亢進的表面保護 薄膜。 In order to solve the problem to be solved by the present invention, it is an object of the invention to provide a surface protection film which prevents natural peeling from an adherend when attached to a flat surface or various adherends having irregularities. Further, another object of the present invention is to provide a surface protection capable of suppressing adhesion of an adhesive layer when attached to various adherends. film.

本發明者等人為了解決上述問題而進行努力研究,結果發現:具有包含於4-甲基-1-戊烯共聚合體中調配熱塑性樹脂而成之特定樹脂組成物之黏著層的表面保護薄膜表現出良好之凹凸追隨性,兼具充分之黏著強度與充分之黏著穩定性。即,與如先前般使用具有較高黏著性之材料貼附於接觸面積較小之被黏附體相比,可使用兼具充分之黏著力與良好之凹凸追隨性的材料而增大貼附於具有凹凸之各種被黏附體時之接觸面積。其結果,發現具有良好之黏著穩定性,從而完成本發明。 In order to solve the above problems, the inventors of the present invention have conducted intensive studies and found that the surface protective film having an adhesive layer containing a specific resin composition in which a thermoplastic resin is blended in a 4-methyl-1-pentene copolymer is expressed. A good bump follow-up, with sufficient adhesion strength and sufficient adhesion stability. That is, when a material having a higher adhesiveness is attached to an adherend having a small contact area as before, an adhesive having a sufficient adhesive force and good bump followability can be used to be attached to the adhesive. The contact area of various adherends having irregularities. As a result, it was found to have good adhesive stability, thereby completing the present invention.

又,本發明者等人亦發現:於4-甲基-1-戊烯共聚合體中調配熱塑性樹脂而成之特定樹脂組成物在用作黏著劑時兼具充分之黏著強度與黏著亢進抑制效果,從而完成本發明。 Further, the inventors of the present invention have found that a specific resin composition obtained by blending a thermoplastic resin in a 4-methyl-1-pentene copolymer has sufficient adhesive strength and adhesion inhibition effect when used as an adhesive. Thus, the present invention has been completed.

本發明之表面保護薄膜包含積層體,該積層體具有至少1層包含如下樹脂組成物之黏著劑層與基材層,該樹脂組成物含有:滿足下述必要條件(a)、(b)、(c)及(d)之4-甲基-1-戊烯‧α-烯烴共聚合體(A)2~50重量份、及該4-甲基-1-戊烯‧α-烯烴共聚合體(A)以外之熱塑性樹脂(B)98~50重量份(其中,上述4-甲基-1-戊烯‧α-烯烴共聚合體(A)與上述熱塑性樹脂(B)之合計為100重量份):(a)包含由4-甲基-1-戊烯衍生之構成單位(i)65~90莫耳%與由α由烯烴(其中,4-甲基-1-戊烯除外)衍生之構成單位(ii)35~10莫耳%。 The surface protection film of the present invention comprises a laminate comprising at least one adhesive layer comprising a resin composition and a substrate layer, the resin composition comprising: the following necessary conditions (a), (b), (c) and (d) 4-methyl-1-pentene ‧ α -olefin copolymer (A) 2 to 50 parts by weight, and the 4-methyl-1-pentene ‧ α - olefin copolymer ( 98 to 50 parts by weight of the thermoplastic resin (B) other than A) (wherein the total of the 4-methyl-1-pentene ‧ α - olefin copolymer (A) and the thermoplastic resin (B) is 100 parts by weight) : (a) comprises a constituent unit derived from 4-methyl-1-pentene (i) 65 to 90 mol% and a composition derived from olefin (excluding 4-methyl-1-pentene) Unit (ii) 35~10 mol%.

(b)於十氫萘中135℃下測得之極限黏度[η]為0.1~5.0 dL/g之範圍;(c)藉由凝膠滲透層析法(GPC)所測得之重量平均分子量(Mw)與數量平均分子量(Mn)之比例(分子量分佈,Mw/Mn)為1.0~3.5之範圍;(d)密度為870~830kg/m3之範圍。 (b) The ultimate viscosity [η] measured at 135 ° C in decalin is in the range of 0.1 to 5.0 dL/g; (c) the weight average molecular weight measured by gel permeation chromatography (GPC) The ratio of (Mw) to the number average molecular weight (Mn) (molecular weight distribution, Mw/Mn) is in the range of 1.0 to 3.5; and (d) the density is in the range of 870 to 830 kg/m 3 .

本發明之表面保護薄膜不僅於貼附於平板之被黏附體時可發揮充分之黏著力,於貼附於具有凹凸之各種被黏附體時亦可發揮充分之黏著力,並且藉由優異之凹凸追隨性而增大對被黏附體之接觸面積,藉此具有充分之黏著穩定性。又,本發明之表面保護薄膜不僅於貼附於平板之被黏附體時可發揮充分之黏著力,於貼附於各種被黏附體時均可發揮充分之黏著力,並且具有優異之黏著亢進抑制效果。 The surface protection film of the present invention can exert sufficient adhesion not only when attached to the adherend of the flat plate, but also exerts sufficient adhesion when attached to various adherends having irregularities, and is excellent in unevenness. Follow-up increases the contact area to the adherend, thereby providing sufficient adhesion stability. Further, the surface protective film of the present invention exhibits sufficient adhesion not only when adhered to the adherend of the flat plate, but also exhibits sufficient adhesion when attached to various adherends, and has excellent adhesion inhibition. effect.

以下進一步詳細地說明本發明之表面保護薄膜。 The surface protective film of the present invention will be described in further detail below.

本發明之表面保護薄膜包含積層體,該積層體具有至少1層包含下述樹脂組成物之黏著劑層與基材層。 The surface protection film of the present invention comprises a laminate having at least one layer of an adhesive layer and a substrate layer comprising the following resin composition.

[樹脂組成物] [Resin composition]

本發明中使用之樹脂組成物以特定比例含有具有特定物性之4-甲基-1-戊烯‧α-烯烴共聚合體(A)與該4-甲基-1-戊烯‧α-烯烴共聚合體(A)以外之熱塑性樹脂(B)。 The resin composition used in the present invention contains a 4-methyl-1-pentene‧ α -olefin copolymer (A) having a specific physical property in a specific ratio and copolymerized with the 4-methyl-1-pentene ‧ α -olefin A thermoplastic resin (B) other than the compound (A).

再者,於本說明書中,有時將4-甲基-1-戊烯‧α-烯烴共聚合體(A)簡稱為「共聚合體(A)」,且有時將4-甲基-1-戊烯‧α-烯 烴共聚合體(A)以外之熱塑性樹脂(B)簡稱為「熱塑性樹脂(B)」。 Further, in the present specification, the 4-methyl-1-pentene‧ α -olefin copolymer (A) may be simply referred to as "copolymer (A)", and sometimes 4-methyl-1- The thermoplastic resin (B) other than the pentene ‧ α -olefin copolymer (A) is simply referred to as "thermoplastic resin (B)".

<4-甲基-1-戊烯‧α-烯烴共聚合體(A)> <4-methyl-1-pentene‧ α -olefin copolymer (A)>

本發明中使用之構成樹脂組成物之4-甲基-1-戊烯‧α-烯烴共聚合體(A)滿足以下之必要條件(a)、(b)、(c)及(d)。 The 4-methyl-1-pentene‧ α -olefin copolymer (A) constituting the resin composition used in the present invention satisfies the following requirements (a), (b), (c) and (d).

必要條件(a): Necessary condition (a):

本發明中使用之4-甲基-1-戊烯‧α-烯烴共聚合體(A)包含由4-甲基-1-戊烯衍生之構成單位(i)65~90莫耳%與由α由烯烴(其中,4-甲基-1-戊烯除外)衍生之構成單位(ii)35~10莫耳%。此處,「莫耳%」為將由全部構成單體衍生之構成單位之合計設為100莫耳%時之值,例如於4-甲基-1-戊烯‧α-烯烴共聚合體(A)僅由構成單位(i)與構成單位(ii)所構成之情形時,為將構成單位(i)與構成單位(ii)之合計設為100莫耳%時之值。 The 4-methyl-1-pentene‧ α -olefin copolymer (A) used in the present invention comprises a constituent unit derived from 4-methyl-1-pentene (i) 65 to 90 mol % and α The constituent unit derived from an olefin (excluding 4-methyl-1-pentene) (ii) is 35 to 10 mol%. Here, the "mol%" is a value obtained by setting the total of the constituent units derived from all the constituent monomers to 100 mol%, for example, in the 4-methyl-1-pentene ‧ α -olefin copolymer (A) In the case where only the constituent unit (i) and the constituent unit (ii) are formed, the total value of the constituent unit (i) and the constituent unit (ii) is set to 100 mol%.

即,構成單位(i)之比例之下限值為65莫耳%,較佳為80莫耳%,更佳為81莫耳%。另一方面,構成單位(i)之比例之上限值為90莫耳%,更佳為86莫耳%。如此,於本發明中,藉由4-甲基-1-戊烯‧α-烯烴共聚合體(A)中之上述構成單位(i)之比例為上述下限值以上,所獲得之表面保護薄膜之凹凸追隨性優異,又,藉由於上限值以下,而具有適度之柔軟性。並且,進而若為80~90莫耳%,則維持所獲得之表面保護薄膜對平板或凹凸面之優異之黏著強度、黏著穩定性及不會對被黏附體造成損傷之適度之柔軟性,並且表面硬度提高,藉此薄膜之成形性及接著前之表面保護薄膜之操作變得容易而較佳,更佳為81~86莫耳%。 That is, the lower limit of the ratio of the constituent unit (i) is 65 mol%, preferably 80 mol%, more preferably 81 mol%. On the other hand, the upper limit of the ratio of the constituent unit (i) is 90 mol%, more preferably 86 mol%. In the present invention, the surface protective film obtained by the ratio of the above-mentioned constituent unit (i) in the 4-methyl-1-pentene‧ α -olefin copolymer (A) is at least the above lower limit value. It has excellent concavity and followability, and has moderate flexibility due to the upper limit or less. Further, in the case of 80 to 90 mol%, the surface protective film obtained is excellent in adhesion strength to the flat plate or the uneven surface, adhesive stability, and moderate softness which does not cause damage to the adherend, and The surface hardness is improved, whereby the formability of the film and the operation of the surface protective film before the film are easy and preferable, and more preferably 81 to 86 mol%.

又,上述構成單位(ii)之比例為35~10莫耳%,較佳為20~10莫耳%,更佳為19~14莫耳%。即,構成單位(ii)之比例之上限值為35莫耳%,較佳為20莫耳%,更佳為19莫耳%。另一方面,構成單位(ii)之比例之下限值為10莫耳%,更佳為14莫耳%。 Further, the ratio of the above constituent unit (ii) is 35 to 10 mol%, preferably 20 to 10 mol%, more preferably 19 to 14 mol%. That is, the upper limit of the ratio of the constituent unit (ii) is 35 mol%, preferably 20 mol%, more preferably 19 mol%. On the other hand, the lower limit of the ratio of the constituent unit (ii) is 10 mol%, more preferably 14 mol%.

作為衍生出上述構成單位(ii)之α-烯烴,例如可列舉:乙烯、丙烯、1-丁烯、1-戊烯、1-己烯、1-辛烯、1-癸烯、1-十一烯、1-十二烯、1-十四烯、1-十六烯、1-十八烯、1-二十烯等碳原子數2~20、較佳為碳原子數2~15、更佳為碳原子數2~10之直鏈狀α-烯烴,3-甲基-1-丁烯、3-甲基-1-戊烯、3-乙基-1-戊烯、4,4-二甲基-1-戊烯、4-甲基-1-己烯、4,4-二甲基-1-己烯、4-乙基-1-己烯、3-乙基-1-己烯等碳原子數5~20、較佳為碳原子數5~15之支鏈狀α-烯烴。該等之中,較佳為乙烯、丙烯、1-丁烯、1-戊烯、1-己烯、1-辛烯,尤佳為乙烯、丙烯。 Examples of the α-olefin from which the above structural unit (ii) is derived include ethylene, propylene, 1-butene, 1-pentene, 1-hexene, 1-octene, 1-decene, and 1-tenth. The monoene, 1-dodecene, 1-tetradecene, 1-hexadecene, 1-octadecene, 1-hexene, etc. have 2 to 20 carbon atoms, preferably 2 to 15 carbon atoms. More preferably, it is a linear α-olefin having 2 to 10 carbon atoms, 3-methyl-1-butene, 3-methyl-1-pentene, 3-ethyl-1-pentene, 4,4 - dimethyl-1-pentene, 4-methyl-1-hexene, 4,4-dimethyl-1-hexene, 4-ethyl-1-hexene, 3-ethyl-1- A branched α-olefin having 5 to 20 carbon atoms such as hexene, preferably 5 to 15 carbon atoms. Among these, ethylene, propylene, 1-butene, 1-pentene, 1-hexene, and 1-octene are preferable, and ethylene and propylene are particularly preferable.

此種衍生出上述構成單位(ii)之α-烯烴可為單獨1種,亦可為2種以上之組合。 The α-olefin from which the above-mentioned constituent unit (ii) is derived may be used alone or in combination of two or more.

此處,於本發明之一態樣中,4-甲基-1-戊烯‧α-烯烴共聚合體(A)為僅由構成單位(i)與構成單位(ii)所構成者。於該情形時,構成單位(i)與構成單位(ii)之合計為100莫耳%。 Here, in one aspect of the present invention, the 4-methyl-1-pentene‧ α -olefin copolymer (A) is composed only of the constituent unit (i) and the constituent unit (ii). In this case, the total of the constituent unit (i) and the constituent unit (ii) is 100% by mole.

然而,於4-甲基-1-戊烯‧α-烯烴共聚合體(A)中,若為無損本發明之目的之程度之少量、具體而言10莫耳%以下、較佳為5莫耳%以下、更佳為3莫耳%以下,則可除構成單位(i)及構成單位(ii)以外進而包含由並非4-甲基-1-戊烯及衍生出構成單位(ii)之α-烯烴中之任一者之其他聚合性單體衍生的構成單位。 However, in the 4-methyl-1-pentene ‧ α -olefin copolymer (A), a small amount, specifically 10 mol% or less, preferably 5 mol, which is not detrimental to the object of the present invention % or less, more preferably 3 mol% or less, may include, in addition to the constituent unit (i) and the constituent unit (ii), α which is not derived from 4-methyl-1-pentene and derived from the constituent unit (ii) a constituent unit derived from another polymerizable monomer of any of the olefins.

作為此種其他聚合性單體之較佳具體例,可列舉:苯乙 烯、乙烯基環戊烯、乙烯基環己烷、乙烯基降烷等具有環狀構造之乙烯系化合物;乙酸乙烯酯等乙烯酯類;順丁烯二酸酐等不飽和有機酸或其衍生物;丁二烯、異戊二烯、戊二烯、2,3-二甲基丁二烯等共軛二烯類;1,4-己二烯、1,6-辛二烯、2-甲基-1,5-己二烯、6-甲基-1,5-庚二烯、7-甲基-1,6-辛二烯、二環戊二烯、環己二烯、二環辛二烯、亞甲基降烯、5-乙烯基-2-降烯、5-亞乙基-2-降烯、5-亞甲基-2-降烯、5-亞異丙基-2-降烯、6-氯甲基-5-異丙烯基-2-降烯、2,3-二亞異丙基-5-降烯、2-亞乙基-3-亞異丙基-5-降烯、2-丙烯基-2,2-降二烯等非共軛多烯類等。 Preferred examples of such other polymerizable monomers include styrene, vinylcyclopentene, vinylcyclohexane, and vinyl halide. a vinyl compound having a cyclic structure such as an alkoxide; a vinyl ester such as vinyl acetate; an unsaturated organic acid such as maleic anhydride or a derivative thereof; butadiene, isoprene, pentadiene, 2, 3 a conjugated diene such as dimethylbutadiene; 1,4-hexadiene, 1,6-octadiene, 2-methyl-1,5-hexadiene, 6-methyl-1, 5-heptadiene, 7-methyl-1,6-octadiene, dicyclopentadiene, cyclohexadiene, bicyclooctadiene, methylene drop Alkene, 5-vinyl-2-nor Alkene, 5-ethylidene-2-nor Alkene, 5-methylene-2-nor Alkene, 5-isopropylidene-2-lower Alkene, 6-chloromethyl-5-isopropenyl-2-lower Alkene, 2,3-diisopropylidene-5-lower Alkene, 2-ethylene-3-isopropylidene-5-lower Alkene, 2-propenyl-2,2-nor Non-conjugated polyenes such as dienes.

換言之,本發明中使用之4-甲基-1-戊烯‧α-烯烴共聚合體(A)包含以下之構成單位:由4-甲基-1-戊烯衍生之構成單位(i)65~90莫耳%;由α-烯烴(其中,4-甲基-1-戊烯除外)衍生之構成單位(ii)35~10莫耳%;及由除4-甲基-1-戊烯及構成上述構成單位(ii)之α-烯烴以外之其他聚合性單體衍生之構成單位0~10莫耳%。 In other words, the 4-methyl-1-pentene‧ α -olefin copolymer (A) used in the present invention comprises the following constituent units: constituent units derived from 4-methyl-1-pentene (i) 65~ 90 mol %; constituent units derived from α-olefins (excluding 4-methyl-1-pentene) (ii) 35-10 mol%; and by 4-methyl-1-pentene and The constituent unit derived from the other polymerizable monomer other than the α-olefin constituting the above-mentioned structural unit (ii) is 0 to 10 mol%.

此處,於存在由其他聚合性單體衍生之構成單位之情形時,構成單位(ii)與由其他聚合性單體衍生之構成單位之合計含量滿足上述「構成單位(ii)之比例」。於該情形時,構成單位(i)與構成單位(ii)及由其他聚合性單體衍生之構成單位的合計為100莫耳%。 Here, in the case where a constituent unit derived from another polymerizable monomer is present, the total content of the constituent unit (ii) and the constituent unit derived from the other polymerizable monomer satisfies the above-mentioned "composition unit (ii) ratio". In this case, the total of the constituent units (i) and the constituent units (ii) and the constituent units derived from the other polymerizable monomers is 100 mol%.

又,上述其他聚合性單體亦可為2種以上。 Further, the other polymerizable monomers may be used in combination of two or more kinds.

再者,於本說明書中,所謂「由X衍生之構成單位」(此處,X為具有碳-碳雙鍵之化合物)時,意指以X為單體所獲得之(共)聚合體中之對應於X之構成單位,例如於記作「由4-甲基-1-戊烯衍生之構成單位」時,意指以4-甲基-1-戊烯為單體所獲得之4-甲基-1-戊烯(共)聚合體中之對應於4-甲基-1-戊烯之構成單位。 Further, in the present specification, the term "constituting unit derived from X" (here, X is a compound having a carbon-carbon double bond) means that the (co)polymer obtained by using X as a monomer is The constituent unit corresponding to X, for example, when it is referred to as "a constituent unit derived from 4-methyl-1-pentene", means 4-a 4-methyl-1-pentene as a monomer. The constituent unit corresponding to 4-methyl-1-pentene in the methyl-1-pentene (co)polymer.

必要條件(b): Necessary condition (b):

本發明中使用之4-甲基-1-戊烯‧α-烯烴共聚合體(A)於十氫萘中135℃下所測得之極限黏度[η]為0.1~5.0dL/g之範圍。再者,測定條件等詳細內容如後述實施例欄中之記載。 The 4-methyl-1-pentene ‧ α - olefin copolymer (A) used in the present invention has a limit viscosity [η] measured at 135 ° C in decalin of from 0.1 to 5.0 dL/g. In addition, the details of measurement conditions and the like are described in the column of the examples to be described later.

上述極限黏度[η]較佳為0.5~4.0dL/g,更佳為0.5~3.5dL/g。 The above ultimate viscosity [η] is preferably from 0.5 to 4.0 dL/g, more preferably from 0.5 to 3.5 dL/g.

如後所述,若於聚合中併用氫,則可控制分子量,可調整極限黏度[η]。 As will be described later, if hydrogen is used in combination in the polymerization, the molecular weight can be controlled, and the ultimate viscosity [η] can be adjusted.

若上述極限黏度[η]小於0.1dL/g而過小或大於5.0dL/g而過大,則存在於加工成表面保護薄膜時,尤其是形成構成表面保護薄膜之黏著劑層時之成形加工性受損之情況。 If the above-mentioned ultimate viscosity [η] is less than 0.1 dL/g and is too small or larger than 5.0 dL/g, it is excessively formed, and when it is processed into a surface protective film, especially when forming an adhesive layer constituting the surface protective film, the formability is affected. The situation of damage.

必要條件(c): Necessary condition (c):

本發明中使用之4-甲基-1-戊烯‧α-烯烴共聚合體(A)之藉由凝膠滲透層析法(GPC)所測得之重量平均分子量(Mw)與數量平均分子量(Mn)之比例(分子量分佈,Mw/Mn)為1.0~3.5之範圍。再者,測定條件等詳細內容如後述實施例欄中之記載。 The weight average molecular weight (Mw) and the number average molecular weight measured by gel permeation chromatography (GPC) of the 4-methyl-1-pentene‧ α -olefin copolymer (A) used in the present invention ( The ratio of Mn) (molecular weight distribution, Mw/Mn) is in the range of 1.0 to 3.5. In addition, the details of measurement conditions and the like are described in the column of the examples to be described later.

上述Mw/Mn較佳為1.2~3.0,更佳為1.5~2.8。若上述Mw/Mn大於3.5而過大,則擔心由組成分佈引起之低分子量、低立體規則性聚合物之影響,所獲得之表面保護薄膜之黏著面、即構成表面保護薄膜之黏著劑層之表面發黏,因此其觸感變差,又,易污染被黏附體。 The above Mw/Mn is preferably from 1.2 to 3.0, more preferably from 1.5 to 2.8. If the above Mw/Mn is more than 3.5 and is too large, there is concern about the influence of the low molecular weight, low stereoregular polymer caused by the composition distribution, and the adhesion surface of the obtained surface protective film, that is, the surface of the adhesive layer constituting the surface protective film. It is sticky, so its touch is deteriorated, and it is easy to contaminate the adherend.

此處,於本發明中,若使用後述觸媒,則可獲得於上述 必要條件(b)所表示之極限黏度[η]之範圍內滿足必要條件(c)之上述共聚合體(A)。再者,上述Mw/Mn及以下Mw之值係利用後述實施例中所採用之方法進行測定之情形時之值。 Here, in the present invention, if the catalyst described later is used, the above-described catalyst can be obtained. The above-mentioned copolymer (A) satisfying the necessary condition (c) within the range of the ultimate viscosity [η] represented by the necessary condition (b). In addition, the value of the above Mw/Mn and the following Mw is a value when measured by the method used in the examples described later.

又,上述4-甲基-1-戊烯‧α-烯烴共聚合體(A)之藉由凝膠滲透層析法(GPC)所測得之重量平均分子量(Mw)以聚苯乙烯換算計,較佳為500~10,000,000,更佳為1,000~5,000,000,進而較佳為1,000~2,500,000。 Further, the weight average molecular weight (Mw) of the above 4-methyl-1-pentene‧ α -olefin copolymer (A) as measured by gel permeation chromatography (GPC) is in terms of polystyrene. It is preferably from 500 to 10,000,000, more preferably from 1,000 to 5,000,000, still more preferably from 1,000 to 2,500,000.

必要條件(d): Necessary condition (d):

本發明中使用之4-甲基-1-戊烯‧α-烯烴共聚合體(A)之密度(根據ASTM D 1505進行測定)為870~830kg/m3,較佳為865~830kg/m3,更佳為855~830kg/m3。再者,測定條件等詳細內容如後述實施例欄中之記載。 The density of the 4-methyl-1-pentene‧ α -olefin copolymer (A) used in the present invention (measured according to ASTM D 1505) is 870 to 830 kg/m 3 , preferably 865 to 830 kg/m 3 More preferably, it is 855~830kg/m 3 . In addition, the details of measurement conditions and the like are described in the column of the examples to be described later.

密度可藉由4-甲基-1-戊烯‧α-烯烴共聚合體(A)之共聚單體組成比而適當變更,密度於上述範圍內之上述共聚合體(A)於製造輕量之黏著劑及黏著片上有利。 The density can be appropriately changed by the comonomer composition ratio of the 4-methyl-1-pentene ‧ α -olefin copolymer (A), and the above-mentioned copolymer (A) having a density within the above range is used for the manufacture of a lightweight adhesive. It is advantageous for the agent and the adhesive sheet.

本發明中使用之4-甲基-1-戊烯‧α-烯烴共聚合體(A)較理想的是進而於製成片材時,自探針開始接觸起15秒後之蕭氏A硬度(依據JIS K6253,於厚度3mm之壓製片材之狀態下進行測定)之值於5~90、較佳為10~85、更佳為15~80之範圍。壓製片材之製作方法如實施例所示。 The 4-methyl-1-pentene‧ α -olefin copolymer (A) used in the present invention is preferably a Shore A hardness after 15 seconds from the start of contact of the probe when the sheet is formed ( The value measured in the state of the pressed sheet having a thickness of 3 mm in accordance with JIS K6253 is in the range of 5 to 90, preferably 10 to 85, more preferably 15 to 80. The method for producing the pressed sheet is as shown in the examples.

本發明中使用之4-甲基-1-戊烯‧α-烯烴共聚合體(A)較理想的是進而於製成片材時,以下式定義之蕭氏A硬度(依據JIS K6253,於厚度3mm之壓製片材之狀態下進行測定)之值之變化△HS 於5~60、較佳為10~50、更佳為10~45之範圍。 The 4-methyl-1-pentene‧ α -olefin copolymer (A) used in the present invention is preferably a Shore A hardness defined by the following formula (in accordance with JIS K6253, in thickness) when formed into a sheet. The value ΔHS of the value measured in the state of the pressed sheet of 3 mm is in the range of 5 to 60, preferably 10 to 50, more preferably 10 to 45.

△HS=(探針剛開始接觸後之蕭氏A硬度值-自探針開始接觸起15秒後之蕭氏A硬度值) △HS=(While A hardness value immediately after the probe is contacted - Xiao A hardness value 15 seconds after the probe starts to contact)

△HS可藉由構成4-甲基-1-戊烯‧α-烯烴共聚合體(A)之共聚單體種類及共聚單體組成而任意變更,若△HS於上述範圍內,則凹凸追隨性優異。 △HS can be arbitrarily changed by constituting the comonomer type and comonomer composition of the 4-methyl-1-pentene‧ α -olefin copolymer (A), and if the ΔHS is within the above range, the unevenness followability Excellent.

再者,於難以測定蕭氏A硬度之情形時,可代替性地使用蕭氏D硬度值同樣地求出△HS'=(探針剛開始接觸後之蕭氏D硬度值-自探針開始接觸起15秒後之蕭氏D硬度值)。於該情形時,較理想的是該△HS'於5~50、較佳為5~25、更佳為6~20之範圍。該△HS'亦與上述△HS同様地可藉由構成4-甲基-1-戊烯‧α-烯烴共聚合體(A)之共聚單體種類及共聚單體組成而任意變更,若△HS'於上述範圍內,則凹凸追隨性優異。 In addition, when it is difficult to measure the Shore A hardness, the ΔHS'= can be similarly obtained by using the Shore D hardness value. (The Shore D hardness value immediately after the probe is first contacted - starting from the probe The Shore D hardness value after 15 seconds of contact). In this case, it is preferable that the ΔHS' is in the range of 5 to 50, preferably 5 to 25, more preferably 6 to 20. The ΔHS' can also be arbitrarily changed by the comonomer type and comonomer composition of the 4-methyl-1-pentene ‧ α -olefin copolymer (A), similarly to the above ΔHS, if ΔHS ' Within the above range, the bump followability is excellent.

<4-甲基-1-戊烯‧α-烯烴共聚合體(A)之製造方法> <Method for producing 4-methyl-1-pentene ‧ α -olefin copolymer (A)>

其次,對4-甲基-1-戊烯‧α-烯烴共聚合體(A)之製造方法進行說明。 Next, a method for producing the 4-methyl-1-pentene‧ α -olefin copolymer (A) will be described.

本發明中使用之4-甲基-1-戊烯‧α-烯烴共聚合體(A)之製造方法只要為可獲得滿足上述必要條件(a)、(b)、(c)及(d)之4-甲基-1-戊烯‧α-烯烴共聚合體(A)者,則並無特別限定。其中,於本發明之一般態樣中,4-甲基-1-戊烯‧α-烯烴共聚合體(A)可藉由使4-甲基-1-戊烯與上述「衍生出構成單位(ii)之α-烯烴」於適當之聚合觸媒存在下進行聚合而獲得。此處,作為本發明中可使用之聚合觸媒,較佳地使用先前公知之觸媒,例如鎂擔載型鈦觸媒、國際公開第01/53369號說明 書、國際公開第01/27124號說明書、日本專利特開平3-193796號公報或日本專利特開平02-41303號公報中記載之二茂金屬觸媒等,更佳為較佳地使用含有下述通式(1)或(2)所表示之二茂金屬化合物之烯烴聚合觸媒。 The method for producing the 4-methyl-1-pentene‧ α -olefin copolymer (A) used in the present invention is such that the above-mentioned requirements (a), (b), (c) and (d) are satisfied. The 4-methyl-1-pentene‧ α -olefin copolymer (A) is not particularly limited. Wherein, in the general aspect of the invention, the 4-methyl-1-pentene ‧ α -olefin copolymer (A) can be derived from the above-mentioned "derived constituent units" by using 4-methyl-1-pentene The ii) olefin is obtained by polymerization in the presence of a suitable polymerization catalyst. Here, as the polymerization catalyst which can be used in the present invention, a conventionally known catalyst such as a magnesium-supported titanium catalyst, International Publication No. 01/53369, International Publication No. 01/27124, is preferably used. It is more preferable to use a metallocene catalyst or the like described in Japanese Laid-Open Patent Publication No. Hei-3-193796 or Japanese Patent Application Laid-Open No. Hei 02-41303, and it is preferable to use the following formula (1) or (2). An olefin polymerization catalyst representing a metallocene compound.

(上述式(1)、(2)中,R1、R2、R3、R4、R5、R6、R7、R8、R9、R10、R11、R12、R13及R14係自氫、烴基及含矽烴基中選擇,分別可相同亦可不同,R1至R4之鄰接之取代基可相互鍵結而形成環,R5 至R12之鄰接之取代基可相互鍵結而形成環,A為可包含一部分不飽和鍵及/或芳香族環之碳原子數2~20之二價烴基,A亦可包含包括與Y一起形成之環在內之2個以上之環構造,M為選自週期表第4族之金屬,Y為碳或矽,Q為選自鹵素、烴基、及陰離子配位基或可以孤電子對配位之中性配位基中之相同者或不同者之組合,j為1~4之整數)上述通式(1)或(2)之R1、R2、R3、R4、R5、R6、R7、R8、R9、R10、R11、R12、R13及R14係自氫、烴基及含矽烴基中選擇,分別可相同亦可不同。 (In the above formulae (1) and (2), R 1 , R 2 , R 3 , R 4 , R 5 , R 6 , R 7 , R 8 , R 9 , R 10 , R 11 , R 12 and R 13 And R 14 is selected from the group consisting of hydrogen, a hydrocarbon group and a hydrazine-containing hydrocarbon group, and may be the same or different, and the adjacent substituents of R 1 to R 4 may be bonded to each other to form a ring, and the adjacent substituents of R 5 to R 12 may be bonded. The ring may be bonded to each other to form a ring, and A is a divalent hydrocarbon group having 2 to 20 carbon atoms which may contain a part of unsaturated bonds and/or an aromatic ring, and A may also include 2 rings including a ring formed together with Y. In the above ring structure, M is a metal selected from Group 4 of the periodic table, Y is carbon or ruthenium, Q is selected from a halogen, a hydrocarbon group, and an anionic ligand or may be a lone pair of electrons in a coordination neutral group. In the same or different combinations, j is an integer of 1 to 4) R 1 , R 2 , R 3 , R 4 , R 5 , R 6 , R 7 , R of the above formula (1) or (2) 8. R 9 , R 10 , R 11 , R 12 , R 13 and R 14 are selected from the group consisting of hydrogen, a hydrocarbon group and a hydrazine-containing hydrocarbon group, and may be the same or different.

烴基較佳為碳原子數1~20之烷基、碳原子數7~20之芳基烷基、碳原子數6~20之芳基、或碳原子數7~20之烷基芳基,亦可包含1個以上之環構造。又,烴基之氫之一部分或全部可經羥基、胺基、鹵基、含氟烴基等官能基取代。作為烴基之具體例,可列舉:甲基、乙基、正丙基、異丙基、2-甲基丙基、1,1-二甲基丙基、2,2-二甲基丙基、1,1-二乙基丙基、1-乙基-1-甲基丙基、1,1,2,2-四甲基丙基、第二丁基、第三丁基、1,1-二甲基丁基、1,1,3-三甲基丁基、新戊基、環己基甲基、環己基、1-甲基-1-環己基、1-金剛烷基、2-金剛烷基、2-甲基-2-金剛烷基、蓋基、降基、苄基、2-苯基乙基、1-四氫萘基、1-甲基-1-四氫萘基、苯基、聯苯基、萘基、甲苯基、氯苯基、氯聯苯基、氯萘基等。 The hydrocarbon group is preferably an alkyl group having 1 to 20 carbon atoms, an arylalkyl group having 7 to 20 carbon atoms, an aryl group having 6 to 20 carbon atoms, or an alkylaryl group having 7 to 20 carbon atoms. It may contain more than one ring structure. Further, part or all of the hydrogen of the hydrocarbon group may be substituted with a functional group such as a hydroxyl group, an amine group, a halogen group or a fluorine-containing hydrocarbon group. Specific examples of the hydrocarbon group include methyl group, ethyl group, n-propyl group, isopropyl group, 2-methylpropyl group, 1,1-dimethylpropyl group, and 2,2-dimethylpropyl group. 1,1-diethylpropyl, 1-ethyl-1-methylpropyl, 1,1,2,2-tetramethylpropyl, second butyl, tert-butyl, 1,1- Dimethylbutyl, 1,1,3-trimethylbutyl, neopentyl, cyclohexylmethyl, cyclohexyl, 1-methyl-1-cyclohexyl, 1-adamantyl, 2-adamantane Base, 2-methyl-2-adamantyl, capping, descending Base, benzyl, 2-phenylethyl, 1-tetrahydronaphthyl, 1-methyl-1-tetrahydronaphthyl, phenyl, biphenyl, naphthyl, tolyl, chlorophenyl, chloro Phenyl, chloronaphthyl and the like.

含矽烴基較佳為矽數1~4且碳原子數3~20之烷基矽烷基或芳基矽烷基,作為其具體例,可列舉:三甲基矽烷基、第三丁基二甲基矽烷基、三苯基矽烷基等。 The anthracene-containing hydrocarbon group is preferably an alkylalkylene group or an arylalkylalkyl group having 1 to 4 carbon atoms and 3 to 20 carbon atoms, and specific examples thereof include a trimethylsulfanyl group and a tert-butyldimethyl group. Alkylene, triphenylsulfanyl, and the like.

茀環上之R5至R12之鄰接之取代基可相互鍵結而形成環。作為此種經取代茀基,可列舉:苯并茀基、二苯并茀基、八氫二苯并茀基、八甲基八氫二苯并茀基等。 The adjacent substituents of R 5 to R 12 on the anthracene ring may be bonded to each other to form a ring. Examples of such a substituted fluorenyl group include a benzofluorenyl group, a dibenzofluorenyl group, an octahydrodibenzofluorenyl group, and an octamethyl octahydrodibenzofluorenyl group.

又,茀環上之R5至R12之取代基就易合成性方面而言,較佳為左右對稱,即R5=R12、R6=R11、R7=R10、且R8=R9,茀環更佳為未經取代茀、3,6-雙取代茀、2,7-雙取代茀或2,3,6,7-四取代茀。此處,茀環上之3位、6位、2位、7位分別對應於R7、R10、R6、R11Further, the substituent of R 5 to R 12 on the anthracene ring is preferably bilaterally symmetrical in terms of ease of synthesis, that is, R 5 = R 12 , R 6 = R 11 , R 7 = R 10 , and R 8 =R 9 , the anthracene ring is preferably an unsubstituted anthracene, a 3,6-disubstituted anthracene, a 2,7-disubstituted anthracene or a 2,3,6,7-tetrasubstituted anthracene. Here, the 3rd, 6th, 2nd, and 7th positions on the anthracene ring correspond to R 7 , R 10 , R 6 , and R 11 , respectively .

上述通式(1)之R13及R14係自氫及烴基中選擇,分別可相同亦可不同。作為較佳之烴基之具體例,可列舉與上述相同者。 R 13 and R 14 in the above formula (1) are selected from hydrogen and a hydrocarbon group, and may be the same or different. Specific examples of the preferred hydrocarbon group include the same as described above.

Y為碳或矽。於通式(1)之情形時,R13及R14與Y鍵結而構成作為交聯部之經取代亞甲基或經取代亞矽烷基。 Y is carbon or hydrazine. In the case of the formula (1), R 13 and R 14 are bonded to Y to form a substituted methylene group or a substituted alkylene group as a crosslinking portion.

作為較佳之具體例,可列舉:亞甲基、二甲基亞甲基、二異丙基亞甲基、甲基第三丁基亞甲基、二環己基亞甲基、甲基環己基亞甲基、甲基苯基亞甲基、氟甲基苯基亞甲基、氯甲基苯基亞甲基、二苯基亞甲基、二氯苯基亞甲基、二氟苯基亞甲基、甲基萘基亞甲基、二聯苯基亞甲基、二對甲基苯基亞甲基、甲基對甲基苯基亞甲基、乙基對甲基苯基亞甲基、二萘基亞甲基,或者二甲基亞矽烷基、二異丙基亞矽烷基、甲基第三丁基亞矽烷基、二環己基亞矽烷基、甲基環己基亞矽烷基、甲基苯基亞矽烷基、氟甲基苯基亞矽烷基、氯甲基苯基亞矽烷基、二苯基亞矽烷基、二對甲基苯基亞矽烷基、甲基對甲基苯基亞矽烷基、乙基對甲基苯基亞矽烷基、甲基萘基亞矽烷基、二萘基亞矽烷基等。 Preferred examples thereof include a methylene group, a dimethylmethylene group, a diisopropylmethylene group, a methyl tert-butylmethylene group, a dicyclohexylmethylene group, and a methylcyclohexyl group. Methyl, methylphenylmethylene, fluoromethylphenylmethylene, chloromethylphenylmethylene, diphenylmethylene, dichlorophenylmethylene, difluorophenyl methylene , methylnaphthylmethylene, diphenylmethylene, di-p-methylphenylmethylene, methyl-p-methylphenylmethylene, ethyl-p-methylphenylmethylene, Dinaphthylmethylene, or dimethylarylene, diisopropylarylene, methyl tertiary butyl sulfenyl, dicyclohexyl fluorenylene, methylcyclohexyl fluorenylene, methyl Phenylenealkylene, fluoromethylphenylarylene, chloromethylphenylarylene, diphenylalkylene, di-p-methylphenylarylene, methyl-p-methylphenylarylene A group, an ethyl p-methylphenyl fluorene alkyl group, a methylnaphthyl fluorenylene group, a dinaphthyl fluorenylene group, or the like.

於通式(2)之情形時,Y與可包含一部分不飽和鍵及/或芳香族環之碳原子數2~20之二價烴基A鍵結,構成亞環烷基或環亞甲基亞矽烷基等。作為較佳之具體例,可列舉:亞環丙基、亞環丁基、亞環戊基、亞環己基、亞環庚基、亞二環[3.3.1]壬基、亞降基、亞金剛烷基、四氫亞萘基、二氫亞茚基、環二亞甲基亞矽烷基、環三亞甲 基亞矽烷基、環四亞甲基亞矽烷基、環五亞甲基亞矽烷基、環六亞甲基亞矽烷基、環七亞甲基亞矽烷基等。 In the case of the formula (2), Y is bonded to a divalent hydrocarbon group A having 2 to 20 carbon atoms which may contain a part of the unsaturated bond and/or the aromatic ring to constitute a cycloalkylene group or a cyclomethylene group.矽 alkyl and the like. Preferred examples thereof include a cyclopropylene group, a cyclobutylene group, a cyclopentylene group, a cyclohexylene group, a cycloheptylene group, a bicyclo ring [3.3.1] fluorenyl group, and a sub-halogen. , adamantyl, tetrahydronaphthylene, dihydroindenylene, cyclodimethylene sulfenyl, cyclotrimethylene sulfenyl, cyclotetramethylene fluorenylene, cyclopentamethylene A decylene group, a cyclohexamethylene sulfenylene group, a cycloheptylene fluorene alkyl group, and the like.

通式(1)及(2)之M為選自週期表第4族之金屬,作為M,可列舉:鈦、鋯、鉿。 M of the general formulae (1) and (2) is a metal selected from Group 4 of the periodic table, and examples of M include titanium, zirconium and hafnium.

Q為選自鹵素、碳原子數1~20之烴基、及陰離子配位基或可以孤電子對配位之中性配位基中的相同者或不同者之組合。作為鹵素之具體例,可列舉:氟、氯、溴及碘,作為烴基之具體例,可列舉與上述相同者。作為陰離子配位基之具體例,可列舉:甲氧基、第三丁氧基、苯氧基等烷氧基,乙酸酯、苯甲酸酯等羧酸酯基及甲磺酸酯、甲苯磺酸酯等磺酸酯基等。作為可以孤電子對配位之中性配位基之具體例,可列舉:三甲基膦、三乙基膦、三苯基膦、二苯基甲基膦等有機磷化合物及四氫呋喃、二乙醚、二烷、1,2-二甲氧基乙烷等醚類。該等之中,Q可相同,亦可為不同者之組合,較佳為至少一者為鹵素或烷基。 Q is a combination of a halogen group, a hydrocarbon group having 1 to 20 carbon atoms, and an anionic ligand or the same or a different one of the ortho-electron pair-coordinating neutral ligands. Specific examples of the halogen include fluorine, chlorine, bromine, and iodine, and specific examples of the hydrocarbon group include the same as described above. Specific examples of the anionic ligand include an alkoxy group such as a methoxy group, a third butoxy group, and a phenoxy group; a carboxylate group such as an acetate or a benzoate; and a mesylate or toluene; a sulfonate group or the like such as a sulfonate. Specific examples of the ortho-electron pair-coordinating neutral ligand include organophosphorus compounds such as trimethylphosphine, triethylphosphine, triphenylphosphine, and diphenylmethylphosphine, and tetrahydrofuran and diethyl ether. ,two An ether such as an alkane or a 1,2-dimethoxyethane. Among these, Q may be the same or a combination of different ones, and preferably at least one of them is a halogen or an alkyl group.

又,於上述通式(1)及(2)中,j較佳為2。作為本發明中可使用之構成烯烴聚合觸媒之二茂金屬化合物,可尤佳地列舉上述通式(1)或(2)所表示之二茂金屬化合物,但並不限於此。例如作為本發明中可使用之二茂金屬化合物之其他較佳之例,亦可列舉下述通式[I]所表示之二茂金屬化合物。 Further, in the above formulae (1) and (2), j is preferably 2. The metallocene compound constituting the olefin polymerization catalyst which can be used in the present invention is preferably a metallocene compound represented by the above formula (1) or (2), but is not limited thereto. For example, as another preferable example of the metallocene compound which can be used in the present invention, a metallocene compound represented by the following formula [I] can also be mentioned.

[化3] [Chemical 3]

(式[I]中,R1、R3、R5、R6、R7、R8、R9、R10、R11、R12、R13、R14、R15及R16各自獨立為氫原子、烴基、含雜原子烴基或含矽基,R2為烴基、含雜原子烴基或含矽基,R4為氫原子,除R4以外之R1至R16之取代基中之任意2個取代基可相互鍵結而形成環,M為第4族過渡金屬,Q為鹵素原子、烴基、陰離子配位基或可以孤電子對配位之中性配位基,j為1~4之整數,於j為2以上之整數時,Q可相同或自不同者之組合中選擇)於通式[I]中,R1及R3較佳為氫原子;R2較佳為碳數1~20之烴基,較佳為鍵結於環戊二烯基環之碳為三級碳之取代基;R5及R7較佳為相互鍵結而形成環;R9、R12、R13及R16較佳為氫原子;R10、R11、R14及R15較佳為烴基,或者R10與R11相互鍵結而形成環且R14與R15相互鍵結而形成環。 (In the formula [I], R 1 , R 3 , R 5 , R 6 , R 7 , R 8 , R 9 , R 10 , R 11 , R 12 , R 13 , R 14 , R 15 and R 16 are each independently Is a hydrogen atom, a hydrocarbon group, a hetero atom-containing hydrocarbon group or a fluorenyl group, R 2 is a hydrocarbon group, a hetero atom-containing hydrocarbon group or a fluorenyl group, and R 4 is a hydrogen atom, and a substituent of R 1 to R 16 other than R 4 Any two substituents may be bonded to each other to form a ring, M is a Group 4 transition metal, Q is a halogen atom, a hydrocarbon group, an anionic ligand or a so-called l-electron pair coordination neutral ligand, j is 1~ An integer of 4, when j is an integer of 2 or more, Q may be the same or selected from a combination of different ones) In the general formula [I], R 1 and R 3 are preferably a hydrogen atom; and R 2 is preferably carbon. a hydrocarbon group of 1 to 20, preferably a carbon bonded to the cyclopentadienyl ring is a substituent of a tertiary carbon; R 5 and R 7 are preferably bonded to each other to form a ring; R 9 , R 12 , R 13 and R 16 are preferably a hydrogen atom; R 10 , R 11 , R 14 and R 15 are preferably a hydrocarbon group, or R 10 and R 11 are bonded to each other to form a ring and R 14 and R 15 are bonded to each other to form a ring. ring.

<R1至R16> <R 1 to R 16 >

於上述通式[I]中,作為可成為R1至R16(其中,R4除外)之烴基,例如可列舉:直鏈狀烴基、支鏈狀烴基、環狀飽和烴基、環狀不飽和烴基、將飽和烴基所具有之1個或2個以上之氫原子取代為環狀不飽和烴基而成之基。烴基之碳數通常為1~20,較佳為1~15,更佳為1~10。 In the above formula [I], examples of the hydrocarbon group which may be R 1 to R 16 (excluding R 4 ) include a linear hydrocarbon group, a branched hydrocarbon group, a cyclic saturated hydrocarbon group, and a cyclic unsaturated group. The hydrocarbon group is a group in which one or two or more hydrogen atoms of the saturated hydrocarbon group are substituted with a cyclic unsaturated hydrocarbon group. The carbon number of the hydrocarbon group is usually from 1 to 20, preferably from 1 to 15, more preferably from 1 to 10.

作為直鏈狀烴基,例如可列舉:甲基、乙基、正丙基、正丁基、正戊基、正己基、正庚基、正辛基、正壬基、正癸基等直鏈狀烷基;烯丙基等直鏈狀烯基。 Examples of the linear hydrocarbon group include a linear chain such as methyl, ethyl, n-propyl, n-butyl, n-pentyl, n-hexyl, n-heptyl, n-octyl, n-decyl or n-decyl. An alkyl group; a linear alkenyl group such as an allyl group.

作為支鏈狀烴基,例如可列舉:異丙基、第三丁基、第三戊基(amyl)、3-甲基戊基(pentyl)、1,1-二乙基丙基、1,1-二甲基丁基、1-甲基-1-丙基丁基、1,1-丙基丁基、1,1-二甲基-2-甲基丙基、1-甲基-1-異丙基-2-甲基丙基等支鏈狀烷基。 Examples of the branched hydrocarbon group include an isopropyl group, a tert-butyl group, a third amyl group, a 3-methylpentyl group, a 1,1-diethylpropyl group, and 1,1. - dimethylbutyl, 1-methyl-1-propylbutyl, 1,1-propylbutyl, 1,1-dimethyl-2-methylpropyl, 1-methyl-1- A branched alkyl group such as isopropyl-2-methylpropyl.

作為環狀飽和烴基,例如可列舉:環戊基、環己基、環庚基、環辛基、甲基環己基等環烷基;降基、金剛烷基、甲基金剛烷基等多環式基。 Examples of the cyclic saturated hydrocarbon group include a cycloalkyl group such as a cyclopentyl group, a cyclohexyl group, a cycloheptyl group, a cyclooctyl group, and a methylcyclohexyl group; A polycyclic group such as a benzyl group, an adamantyl group or a methyladamantyl group.

作為環狀不飽和烴基,例如可列舉:苯基、甲苯基、萘基、聯苯基、菲基、蒽基等芳基;環己烯基等環烯基;5-二環[2.2.1]七-2-烯基等多環之不飽和脂環式基。 Examples of the cyclic unsaturated hydrocarbon group include an aryl group such as a phenyl group, a tolyl group, a naphthyl group, a biphenyl group, a phenanthryl group or a fluorenyl group; a cycloalkenyl group such as a cyclohexenyl group; and a 5-bicyclo ring [2.2.1]. a polycyclic unsaturated alicyclic group such as a hepta-2-enyl group.

作為將飽和烴基所具有之1個或2個以上之氫原子取代為環狀不飽和烴基而成之基,例如可列舉將苄基、基、1,1-二苯基乙基、三苯基甲基等之烷基所具有之1個或2個以上之氫原子取代為芳基而成之基。 The group in which one or two or more hydrogen atoms of the saturated hydrocarbon group are substituted with a cyclic unsaturated hydrocarbon group is exemplified by a benzyl group. A group in which one or two or more hydrogen atoms of an alkyl group such as a 1,1-diphenylethyl group or a triphenylmethyl group are substituted with an aryl group.

作為R1至R16(其中,R4除外)中之含雜原子烴基,例如可列舉:甲氧基、乙氧基等烷氧基,苯氧基等芳氧基,呋喃基等含氧原子烴基;N-甲基胺基、N,N-二甲基胺基、N-苯基胺基等胺基,吡咯基等含氮原子烴基;噻吩基等含硫原子烴基。含雜原子烴基之碳數通常為1~20,較佳為2~18,更佳為2~15。其中,自含雜原子烴基中將含矽基排除在外。 Examples of the hetero atom-containing hydrocarbon group in R 1 to R 16 (excluding R 4 ) include an alkoxy group such as a methoxy group and an ethoxy group, an aryloxy group such as a phenoxy group, and an oxygen atom such as a furyl group. a hydrocarbon group; an amine group such as an N-methylamino group, an N,N-dimethylamino group or an N-phenylamino group; a nitrogen atom-containing hydrocarbon group such as a pyrrolyl group; and a sulfur atom-containing hydrocarbon group such as a thienyl group. The carbon number of the hetero atom-containing hydrocarbon group is usually from 1 to 20, preferably from 2 to 18, more preferably from 2 to 15. Among them, the sulfhydryl group is excluded from the hetero atom-containing hydrocarbon group.

作為R1至R16(其中,R4除外)中之含矽基,例如可列舉: 三甲基矽烷基、三乙基矽烷基、二甲基苯基矽烷基、二苯基甲基矽烷基、三苯基矽烷基等式-SiR3(式中,複數個R各自獨立為碳數1~15之烷基或苯基)所表示之基。 Examples of the mercapto group contained in R 1 to R 16 (excluding R 4 ) include, for example, trimethyldecylalkyl group, triethylsulfonylalkyl group, dimethylphenylsulfanyl group, and diphenylmethyldecanealkyl group. And a triphenyldecyl group having the formula -SiR 3 (wherein a plurality of R are each independently an alkyl group having 1 to 15 carbon atoms or a phenyl group).

除R4以外之R1至R16之取代基中之鄰接之2個取代基(例如R1與R2、R2與R3、R5與R7、R6與R8、R7與R8、R9與R10、R10與R11、R11與R12、R13與R14、R14與R15、R15與R16)可相互鍵結而形成環,R6及R7可相互鍵結而形成環,R1及R8可相互鍵結而形成環,R3及R5可相互鍵結而形成環。上述環形成於分子中可存在2處以上。 Two adjacent substituents in the substituents of R 1 to R 16 other than R 4 (for example, R 1 and R 2 , R 2 and R 3 , R 5 and R 7 , R 6 and R 8 , R 7 and R 8 , R 9 and R 10 , R 10 and R 11 , R 11 and R 12 , R 13 and R 14 , R 14 and R 15 , R 15 and R 16 ) may be bonded to each other to form a ring, R 6 and R 7 may be bonded to each other to form a ring, and R 1 and R 8 may be bonded to each other to form a ring, and R 3 and R 5 may be bonded to each other to form a ring. The above ring may be formed in the molecule in two or more places.

於本說明書中,作為2個取代基相互鍵結所形成之環(加成環),例如可列舉:脂環、芳香環、雜環。具體而言,可列舉:環己烷環,苯環,氫化苯環,環戊烯環,呋喃環、噻吩環等雜環及與此對應之氫化雜環;較佳為環己烷環、苯環及氫化苯環。又,此種環構造亦可於環上進而具有烷基等取代基。 In the present specification, examples of the ring (addition ring) formed by bonding two substituents to each other include an alicyclic ring, an aromatic ring, and a hetero ring. Specific examples thereof include a cyclohexane ring, a benzene ring, a hydrogenated benzene ring, a cyclopentene ring, a furan ring, a thiophene ring, and the like, and a hydrogenated hetero ring corresponding thereto; preferably a cyclohexane ring or a benzene; Ring and hydrogenated benzene ring. Further, such a ring structure may further have a substituent such as an alkyl group on the ring.

R1及R3就立體規則性之觀點而言,較佳為氫原子。 R 1 and R 3 are preferably a hydrogen atom from the viewpoint of stereoregularity.

選自R5、R6及R7中之至少一者較佳為烴基、含雜原子烴基或含矽基,R5更佳為烴基,R5進而較佳為直鏈狀烷基、支鏈狀烷基等碳數2以上之烷基、環烷基或環烯基,R5尤佳為碳數2以上之烷基。又,就合成上之觀點而言,亦較佳為R6及R7為氫原子。又,更佳為R5及R7相互鍵結而形成環,該環尤佳為環己烷環等6員環。 At least one selected from the group consisting of R 5 , R 6 and R 7 is preferably a hydrocarbon group, a hetero atom-containing hydrocarbon group or a mercapto group-containing group, R 5 is more preferably a hydrocarbon group, and R 5 is further preferably a linear alkyl group or a branched chain. An alkyl group having 2 or more carbon atoms, a cycloalkyl group or a cycloalkenyl group such as an alkyl group, and R 5 is preferably an alkyl group having 2 or more carbon atoms. Further, from the viewpoint of synthesis, it is also preferred that R 6 and R 7 are a hydrogen atom. Further, it is more preferred that R 5 and R 7 are bonded to each other to form a ring, and the ring is preferably a 6-membered ring such as a cyclohexane ring.

R8較佳為烴基,尤佳為烷基。 R 8 is preferably a hydrocarbon group, and particularly preferably an alkyl group.

R2就立體規則性之觀點而言,較佳為烴基,更佳為碳數1~20之烴基,進而較佳為並非芳基,尤佳為直鏈狀烴基、支鏈狀烴基或環狀飽和烴基,尤佳為具有自由價之碳(鍵結於環戊二烯基環之碳)為三級碳之取代基。 R 2 is preferably a hydrocarbon group, more preferably a hydrocarbon group having 1 to 20 carbon atoms, more preferably an aryl group, and more preferably a linear hydrocarbon group, a branched hydrocarbon group or a cyclic group. A saturated hydrocarbon group, particularly preferably a carbon having a free valence (carbon bonded to a cyclopentadienyl ring) is a substituent of a tertiary carbon.

作為R2,具體而言,可例示:甲基、乙基、異丙基、第三丁基、第三戊基(pentyl)、第三戊基(amyl)、1-甲基環己基、1-金剛烷基,更佳為第三丁基、第三戊基(pentyl)、1-甲基環己基、1-金剛烷基等具有自由價之碳為三級碳之取代基,尤佳為第三丁基、1-金剛烷基。 Specific examples of R 2 include a methyl group, an ethyl group, an isopropyl group, a tert-butyl group, a third pentyl group, a third amyl group, and a 1-methylcyclohexyl group. -adamantyl, more preferably a substituent having a free valence carbon such as a third butyl group, a third pentyl group, a 1-methylcyclohexyl group or a 1-adamantyl group, and a third-order carbon, particularly preferably Third butyl, 1-adamantyl.

於通式[I]中,茀環部分只要為由公知之茀衍生物所獲得之構造則並無特別限制,R9、R12、R13及R16就立體規則性、分子量之觀點而言,較佳為氫原子。 In the general formula [I], the anthracene ring moiety is not particularly limited as long as it is a structure obtained from a known anthracene derivative, and R 9 , R 12 , R 13 and R 16 are in terms of stereoregularity and molecular weight. It is preferably a hydrogen atom.

R10、R11、R14及R15較佳為氫原子、烴基、含氧原子烴基或含氮原子烴基,更佳為烴基,進而較佳為碳數1~20之烴基。 R 10 , R 11 , R 14 and R 15 are preferably a hydrogen atom, a hydrocarbon group, an oxygen atom-containing hydrocarbon group or a nitrogen atom-containing hydrocarbon group, more preferably a hydrocarbon group, and further preferably a hydrocarbon group having 1 to 20 carbon atoms.

R10與R11可相互鍵結而形成環,且R14與R15可相互鍵結而形成環。作為此種經取代茀基,例如可列舉:苯并茀基、二苯并茀基、八氫二苯并茀基、1,1,4,4,7,7,10,10-八甲基-2,3,4,7,8,9,10,12-八氫-1H-二苯并[b,h]茀基、1,1,3,3,6,6,8,8-八甲基-2,3,6,7,8,10-六氫-1H-二環五[b,h]茀基、1',1',3',6',8',8'-六甲基-1'H,8'H-二環五[b,h]茀基,尤佳為1,1,4,4,7,7,10,10-八甲基-2,3,4,7,8,9,10,12-八氫-1H-二苯并[b,h]茀基。 R 10 and R 11 may be bonded to each other to form a ring, and R 14 and R 15 may be bonded to each other to form a ring. Examples of such a substituted fluorenyl group include a benzofluorenyl group, a dibenzofluorenyl group, an octahydrodibenzofluorenyl group, and a 1,1,4,4,7,7,10,10-octamethyl group. -2,3,4,7,8,9,10,12-octahydro-1H-dibenzo[b,h]decyl, 1,1,3,3,6,6,8,8-eight Methyl-2,3,6,7,8,10-hexahydro-1H-bicyclopenta[b,h]decyl, 1',1',3',6',8',8'-six Methyl-1'H,8'H-bicyclopenta[b,h]fluorenyl, especially preferably 1,1,4,4,7,7,10,10-octamethyl-2,3,4 , 7,8,9,10,12-octahydro-1H-dibenzo[b,h]fluorenyl.

<M、Q、j> <M, Q, j>

於通式[I]中,M為第4族過渡金屬,較佳為Ti、Zr或Hf,更佳為Zr或Hf,尤佳為Zr。 In the general formula [I], M is a Group 4 transition metal, preferably Ti, Zr or Hf, more preferably Zr or Hf, and particularly preferably Zr.

於通式[I]中,作為可成為Q之鹵素原子,例如可列舉:氟、氯、溴、碘。 In the general formula [I], examples of the halogen atom which can be Q include fluorine, chlorine, bromine and iodine.

作為可成為Q之烴基,可列舉與R1至R16(其中,R4除外)中之烴基相同之基,較佳為直鏈狀烷基、支鏈狀烷基等烷基。 The hydrocarbon group which may be Q may be the same as the hydrocarbon group in R 1 to R 16 (excluding R 4 ), and is preferably an alkyl group such as a linear alkyl group or a branched alkyl group.

作為Q中之陰離子配位基,例如可列舉:甲氧基、第三 丁氧基等烷氧基;苯氧基等芳氧基;乙酸酯、苯甲酸酯等羧酸酯基;甲磺酸酯、甲苯磺酸酯等磺酸酯基;二甲基醯胺、二異丙基醯胺、甲基苯胺、二苯基醯胺等醯胺基。 Examples of the anionic ligand in Q include a methoxy group and a third group. Alkoxy group such as butoxy group; aryloxy group such as phenoxy group; carboxylate group such as acetate or benzoate; sulfonate group such as mesylate or tosylate; dimethyl decylamine An amidino group such as diisopropyl decylamine, methylaniline or diphenylguanamine.

作為Q中之可以孤電子對配位之中性配位基,例如可列舉:三甲基膦、三乙基膦、三苯基膦、二苯基甲基膦等有機磷化合物;四氫呋喃、二乙醚、二烷、1,2-二甲氧基乙烷等醚。 Examples of the coordinating neutral ligand in the Q group of Q may include, for example, an organophosphorus compound such as trimethylphosphine, triethylphosphine, triphenylphosphine or diphenylmethylphosphine; tetrahydrofuran, Ether, two An ether such as an alkane or a 1,2-dimethoxyethane.

Q較佳為至少一者為鹵素原子或烷基。 Preferably, at least one of Q is a halogen atom or an alkyl group.

又,於上述通式[I]中,j較佳為2。 Further, in the above formula [I], j is preferably 2.

再者,關於上述化合物[I]之命名所使用之位置編號,以[1-(1',1',4',4',7',7',10',10'-八甲基八氫二苯并[b,h]茀-12'-基)(5-第三丁基-1-甲基-3-異丙基-1,2,3,4-四氫并環戊二烯)]二氯化鋯、及[8-(1',1',4',4',7',7',10',10'-八甲基八氫二苯并[b,h]茀-12'-基)(2-第三丁基-8-甲基-3,3b,4,5,6,7,7a,8-八氫環五[a]茚)]二氯化鋯為例,將一鏡像異構物分別示於式[I-1]、式[I-2]。 Further, regarding the position number used for the naming of the above compound [I], [1-(1', 1', 4', 4', 7', 7', 10', 10'-octamethyl eight Hydrogen dibenzo[b,h]indole-12'-yl)(5-t-butyl-1-methyl-3-isopropyl-1,2,3,4-tetrahydrocyclopentadiene )] Zirconium dichloride, and [8-(1',1',4',4',7',7',10',10'-octamethyl octahydrodibenzo[b,h]茀-12'-yl)(2-tert-butyl-8-methyl-3,3b,4,5,6,7,7a,8-octahydrocyclopenta[a]indole)]zirconium dichloride For example, an image isomer is shown in the formula [I-1] and the formula [I-2], respectively.

作為本發明中之上述二茂金屬化合物之具體例,可較佳地列舉國際公開第01/27124號公報、國際公開第2006/025540號公報或國際公開第2014/050817號中所例示之化合物,但並不將本發明之範 圍特限於此。 Specific examples of the above-mentioned metallocene compound in the present invention include compounds exemplified in International Publication No. 01/27124, International Publication No. 2006/025540, and International Publication No. 2014/050817. But does not put the scope of the invention It is limited to this.

於在上述4-甲基-1-戊烯‧α-烯烴共聚合體(A)之製造中使用二茂金屬化合物之情形時,觸媒成分係由(a)二茂金屬化合物(例如上述通式(1)、(2)或[I]所表示之二茂金屬化合物),(b)選自(b-1)有機鋁氧基化合物、(b-2)與二茂金屬化合物(a)反應而形成離子對之化合物及(b-3)有機鋁化合物中之至少1種化合物,及進而視需要之(c)微粒子狀載體所構成。作為製造方法,可採用例如國際公開第01/27124號說明書中記載之方法。 In the case where a metallocene compound is used in the production of the above 4-methyl-1-pentene‧ α -olefin copolymer (A), the catalyst component is derived from (a) a metallocene compound (for example, the above formula) (1), (2) or a metallocene compound represented by [I], (b) is selected from (b-1) an organoaluminum oxy compound, (b-2) and a metallocene compound (a) Further, at least one of the compound of the ion pair and the (b-3) organoaluminum compound is formed, and further, if necessary, the (c) fine particle carrier is formed. As the production method, for example, the method described in the specification of International Publication No. 01/27124 can be employed.

又,作為有機鋁氧基化合物(b-1)(以下亦稱為「成分(b-1)」)、與二茂金屬化合物(a)(以下亦稱為「成分(a)」)反應而形成離子對之化合物(以下亦稱為「成分(b-2)」)、有機鋁化合物(b-3)(以下亦稱為「成分(b-3)」)、及微粒子狀載體(c)之具體例,可列舉作為該等化合物或載體而於烯烴聚合領域中先前公知者,例如國際公開第01/27124號說明書所記載之具體例。 Further, the organoaluminum oxy-compound (b-1) (hereinafter also referred to as "component (b-1)") and the metallocene compound (a) (hereinafter also referred to as "component (a)") are reacted. a compound forming an ion pair (hereinafter also referred to as "component (b-2)"), an organoaluminum compound (b-3) (hereinafter also referred to as "component (b-3)"), and a particulate carrier (c) Specific examples thereof include those conventionally known in the art of olefin polymerization as such compounds or carriers, and specific examples described in the specification of International Publication No. 01/27124, for example.

此處,於本發明之較佳之態樣中,4-甲基-1-戊烯‧α-烯烴共聚合體(A)可藉由使4-甲基-1-戊烯與上述「衍生出構成單位(ii)之α-烯烴」於上述聚合觸媒存在下進行聚合而獲得,結果於4-甲基-1-戊烯‧α-烯烴共聚合體(A)之製造中,聚合可藉由溶解聚合、懸浮聚合等液相聚合法或氣相聚合法中之任意者實施。 Here, in a preferred aspect of the present invention, the 4-methyl-1-pentene‧ α -olefin copolymer (A) can be formed by deriving 4-methyl-1-pentene with the above The α-olefin of the unit (ii) is obtained by polymerization in the presence of the above polymerization catalyst, and as a result, in the production of the 4-methyl-1-pentene ‧ α -olefin copolymer (A), the polymerization can be dissolved by Any of a liquid phase polymerization method such as polymerization or suspension polymerization or a gas phase polymerization method.

於液相聚合法中,可使用不活性烴溶劑作為構成液相之溶劑。作為此種不活性烴之具體例,可列舉:丙烷、丁烷、戊烷、己烷、庚烷、辛烷、癸烷、十二烷、煤油等脂肪族烴;環戊烷、環己烷、甲基環戊烷、甲基環己烷等脂環族烴;苯、甲苯、二甲苯等芳香族烴;及氯乙烯、氯苯、二氯甲烷、三氯甲烷、四氯甲烷等鹵化烴以及該等 之混合物等。 In the liquid phase polymerization method, an inactive hydrocarbon solvent can be used as a solvent constituting the liquid phase. Specific examples of such an inert hydrocarbon include aliphatic hydrocarbons such as propane, butane, pentane, hexane, heptane, octane, decane, dodecane, and kerosene; cyclopentane and cyclohexane. , an alicyclic hydrocarbon such as methylcyclopentane or methylcyclohexane; an aromatic hydrocarbon such as benzene, toluene or xylene; and a halogenated hydrocarbon such as vinyl chloride, chlorobenzene, dichloromethane, chloroform or tetrachloromethane. And these a mixture or the like.

又,亦可實施將4-甲基-1-戊烯及上述「衍生出構成單位(ii)之α-烯烴」本身作為溶劑之塊狀聚合。 Further, block polymerization of 4-methyl-1-pentene and the above-mentioned "α-olefin derived from the constituent unit (ii)" itself as a solvent can also be carried out.

又,藉由階段性地進行4-甲基-1-戊烯之均聚合和4-甲基-1-戊烯與上述「衍生出構成單位(ii)之α-烯烴」之共聚合,亦可獲得組成分佈得到控制之4-甲基-1-戊烯‧α-烯烴共聚合體(A)。 Further, by the stepwise polymerization of 4-methyl-1-pentene and the copolymerization of 4-methyl-1-pentene with the above-mentioned "α-olefin derived from the constituent unit (ii), A 4-methyl-1-pentene‧ α -olefin copolymer (A) having a controlled composition distribution can be obtained.

於進行聚合時,成分(a)係以如相對於每單位反應容積,以週期律表第4族金屬原子換算計通常成為10-8~10-2莫耳、較佳為成為10-7~10-3莫耳之量使用。成分(b-1)係以如成分(b-1)與成分(a)中之過渡金屬原子(M)之莫耳比[(b-1)/M]通常成為0.01~5000、較佳為成為0.05~2000之量使用。成分(b-2)係以如成分(b-2)與成分(a)中之過渡金屬原子(M)之莫耳比[(b-2)/M]通常成為1~10、較佳為成為1~5之量使用。成分(b-3)係以如成分(b-3)與成分(a)中之過渡金屬原子(M)之莫耳比[(b-3)/M]通常成為10~5000、較佳為成為20~2000之量使用。 When the polymerization is carried out, the component (a) is usually 10 -8 to 10 -2 mol, preferably 10 -7 °, in terms of the metal atom per unit of the cycle, per unit reaction volume. Use 10 - 3 moles. The component (b-1) is usually in the range of 0.01 to 5,000, preferably in the molar ratio [(b-1)/M] of the transition metal atom (M) in the component (b-1) and the component (a). It is used in an amount of 0.05 to 2000. The component (b-2) is usually 1 to 10, preferably 1 to 10, in terms of the molar ratio [(b-2)/M] of the transition metal atom (M) in the component (b-2) and the component (a). It is used in an amount of 1 to 5. The component (b-3) is usually 10 to 5,000, preferably 10 to 5,000, in terms of the molar ratio [(b-3)/M] of the transition metal atom (M) in the component (b-3) and the component (a). It will be used in the amount of 20~2000.

聚合溫度通常為-50~200℃之範圍,較佳為0~100℃之範圍,更佳為20~100℃之範圍。 The polymerization temperature is usually in the range of -50 to 200 ° C, preferably in the range of 0 to 100 ° C, more preferably in the range of 20 to 100 ° C.

聚合壓力通常為常壓~10MPa表壓,較佳為常壓~5MPa表壓,聚合反應可利用批次式、半連續式、連續式中之任意方法進行。進而亦可將聚合分為反應條件不同之2階段以上進行。 The polymerization pressure is usually atmospheric pressure ~ 10 MPa gauge pressure, preferably atmospheric pressure ~ 5 MPa gauge pressure, and the polymerization reaction can be carried out by any of batch, semi-continuous, and continuous methods. Further, the polymerization may be carried out in two or more stages in which the reaction conditions are different.

於聚合時,為了對生成聚合物之分子量或聚合活性進行控制,亦可添加氫,其量適宜為相對於4-甲基-1-戊烯及上述「衍生出構成單位(ii)之α-烯烴」之合計1kg而為0.001~100NL左右。 In the polymerization, in order to control the molecular weight or polymerization activity of the resulting polymer, hydrogen may be added in an amount corresponding to 4-methyl-1-pentene and the above-mentioned "derived constituent unit (ii) α- The total amount of olefins is about 0.001 to 100 NL.

<熱塑性樹脂(B)> <Thermoplastic resin (B)>

構成本發明之樹脂組成物之熱塑性樹脂(B)只要為4-甲基-1-戊烯‧α-烯烴共聚合體(A)以外之熱塑性樹脂則並無特別限制,作為較佳之熱塑性樹脂(B),例如可列舉:除上述共聚合體(A)以外之烯烴系樹脂(B1)、聚醯胺系樹脂、聚酯樹脂、及乙烯基芳香族系樹脂。於本發明中,熱塑性樹脂(B)係用於對本發明之樹脂組成物賦予良好之黏著性、成形性、觸黏性等。 The thermoplastic resin (B) constituting the resin composition of the present invention is not particularly limited as long as it is a thermoplastic resin other than the 4-methyl-1-pentene ‧ α -olefin copolymer (A), and is preferably a thermoplastic resin (B). For example, an olefin resin (B1) other than the above copolymer (A), a polyamide resin, a polyester resin, and a vinyl aromatic resin may be mentioned. In the present invention, the thermoplastic resin (B) is used to impart good adhesion, formability, and tackiness to the resin composition of the present invention.

此處,作為烯烴系樹脂(B1)之具體例,可列舉:乙烯與碳數3~20之α-烯烴之共聚合體、乙烯與碳數3~20之α-烯烴及環狀烯烴之共聚合體、以苯乙烯、乙酸乙烯酯、(甲基)丙烯酸、(甲基)丙烯酸酯等各種乙烯系化合物為共聚單體之乙烯系共聚合體、丙烯與碳數4~20之α-烯烴之共聚合體、丙烯與碳數4~20之α-烯烴及環狀烯烴之共聚合體、以苯乙烯、乙酸乙烯酯、(甲基)丙烯酸、(甲基)丙烯酸酯等各種乙烯系化合物為共聚單體之乙烯系共聚合體等。更具體而言,可列舉:低密度、中密度、高密度聚乙烯、高壓法低密度聚乙烯、同排聚丙烯、間規聚丙烯、聚1-丁烯、聚4-甲基-1-戊烯、聚3-甲基-1-丁烯、環狀烯烴共聚合體、氯化聚烯烴、及烯烴系彈性體等。 Here, specific examples of the olefin-based resin (B1) include a copolymer of ethylene and an α-olefin having 3 to 20 carbon atoms, a copolymer of ethylene and an α-olefin having 3 to 20 carbon atoms, and a cyclic olefin. a copolymer of ethylene, a copolymer of styrene, vinyl acetate, (meth)acrylic acid, or (meth)acrylate, and a copolymer of propylene and an α-olefin having 4 to 20 carbon atoms. And a copolymer of propylene and a carbon number of 4 to 20 α-olefin and a cyclic olefin, and various vinyl compounds such as styrene, vinyl acetate, (meth)acrylic acid, or (meth)acrylate are comonomers. A vinyl copolymer or the like. More specifically, low density, medium density, high density polyethylene, high pressure low density polyethylene, homogenous polypropylene, syndiotactic polypropylene, poly 1-butene, poly 4-methyl-1- Pentene, poly-3-methyl-1-butene, cyclic olefin copolymer, chlorinated polyolefin, and olefin-based elastomer.

作為烯烴系彈性體之例,亦可使用包含烯烴系嵌段共聚合體之彈性體。例如可列舉成為硬質部之形成聚丙烯等結晶性較高之聚合物之聚烯烴嵌段與成為軟質部之顯示出非晶性之單體共聚合體的嵌段共聚合體,具體而言,可例示:烯烴(結晶性)-乙烯-丁烯-烯烴嵌段共聚合體、聚丙烯-聚烯烴(非晶性)-聚丙烯嵌段共聚合體等。作為具體例,可列舉:由JSR股份有限公司以商品名DYNARON(註冊商標)市售者,由三井化學股份有限公司以商品名TAFMER(註冊商標)、NOTIO(註冊商標)市售者,由Dow Chemical股份有限公司以商品名 ENGAGETM、VERSIFYTM市售者,由ExxonMobil Chemical股份有限公司以商品名VistamaxxTM市售者。 As an example of the olefin-based elastomer, an elastomer containing an olefin-based block copolymer can also be used. For example, a block copolymer which forms a polyolefin block which is a polymer having a high crystallinity such as polypropylene and a monomer copolymer which exhibits an amorphous property which is a soft portion in a hard portion can be exemplified, and specifically, a block copolymer can be exemplified. An olefin (crystalline)-ethylene-butylene-olefin block copolymer, a polypropylene-polyolefin (amorphous)-polypropylene block copolymer, and the like. As a specific example, it is marketed by JSR Co., Ltd. under the trade name DYNARON (registered trademark), and by Mitsui Chemicals Co., Ltd. under the trade name of TAFMER (registered trademark) and NOTIO (registered trademark), by Dow. Chemicals, Inc. is marketed under the tradename ENGAGE (TM) , VERSIFY (TM) , and by ExxonMobil Chemical Co., Ltd. under the trade name Vistamaxx (TM) .

又,作為上述聚醯胺系樹脂之例,具體而言,可列舉脂肪族聚醯胺(尼龍6、尼龍11、尼龍12、尼龍66、尼龍610、尼龍612)等。 Further, specific examples of the polyamine-based resin include aliphatic polyamines (nylon 6, nylon 11, nylon 12, nylon 66, nylon 610, and nylon 612).

作為上述聚酯樹脂之例,具體而言,可列舉:聚對苯二甲酸乙二酯、聚對苯二甲酸丁二酯、聚酯系彈性體等。 Specific examples of the polyester resin include polyethylene terephthalate, polybutylene terephthalate, and polyester elastomer.

作為上述乙烯基芳香族系樹脂之例,具體而言,可列舉:聚苯乙烯、丙烯腈-丁二烯-苯乙烯(ABS,Acrylonitrile-Butadiene-Styrene)樹脂、丙烯腈-苯乙烯(AS,Acrylonitrile-Styrene)樹脂、及苯乙烯系彈性體(B2)等。 Specific examples of the vinyl aromatic resin include polystyrene, acrylonitrile-butadiene-styrene (ABS, Acrylonitrile-Butadiene-Styrene) resin, and acrylonitrile-styrene (AS, Acrylonitrile-Styrene) resin, styrene-based elastomer (B2), and the like.

作為苯乙烯系彈性體(B2),可例示:成為硬質部(結晶部)之聚苯乙烯嵌段與成為軟質部之二烯系單體嵌段的嵌段共聚合體(SBS)、氫化苯乙烯-丁二烯-苯乙烯嵌段共聚合體(HSBR)、苯乙烯-乙烯-丙烯-苯乙烯嵌段共聚合體(SEPS)、苯乙烯-乙烯-丁烯-苯乙烯嵌段共聚合體(SEBS)、苯乙烯-異戊二烯-苯乙烯嵌段共聚合體(SIS)、苯乙烯-異丁烯-苯乙烯共聚合體(SIBS)、苯乙烯-異丁烯共聚合體(SIB)等。苯乙烯系彈性體可單獨使用1種或將2種以上組合使用。 The styrene-based elastomer (B2) may, for example, be a block copolymer (SBS) or a hydrogenated styrene which is a polystyrene block of a hard portion (crystal portion) and a diene monomer block which is a soft portion. - Butadiene-styrene block copolymer (HSBR), styrene-ethylene-propylene-styrene block copolymer (SEPS), styrene-ethylene-butylene-styrene block copolymer (SEBS), Styrene-isoprene-styrene block copolymer (SIS), styrene-isobutylene-styrene copolymer (SIBS), styrene-isobutylene copolymer (SIB), and the like. The styrene-based elastomer may be used alone or in combination of two or more.

作為氫化苯乙烯-丁二烯-苯乙烯嵌段共聚合體之具體例,可列舉由JSR股份有限公司以商品名:DYNARON(註冊商標)市售者等。 Specific examples of the hydrogenated styrene-butadiene-styrene block copolymer are commercially available from JSR Co., Ltd. under the trade name of DYNARON (registered trademark).

苯乙烯-乙烯-丙烯-苯乙烯嵌段共聚合體係使苯乙烯-異戊二烯-苯乙烯嵌段共聚合體(SIS)氫化而成者。作為SIS之具體例,可列舉:由JSR股份有限公司以商品名:JSRSIS(註冊商標)市售者、由 Kuraray股份有限公司以商品名:HYBRAR(註冊商標)市售者或由Shell股份有限公司以商品名:Kraton D(註冊商標)市售者等。 The styrene-ethylene-propylene-styrene block copolymerization system is obtained by hydrogenating a styrene-isoprene-styrene block copolymer (SIS). Specific examples of the SIS include those sold by JSR Co., Ltd. under the trade name: JSRSIS (registered trademark). Kuraray Co., Ltd. is marketed under the trade name: HYBRAR (registered trademark) or by the Shell Co., Ltd. under the trade name: Kraton D (registered trademark).

又,作為SEPS之具體例,可列舉:由Kuraray股份有限公司以商品名:Septon(註冊商標)市售者或由Shell股份有限公司以商品名:Kraton(註冊商標)市售者等。 In addition, as a specific example of the SEPS, a product of the trade name: Septon (registered trademark) by Kuraray Co., Ltd., or a trade name of Kraton (registered trademark) by Shell Co., Ltd., etc., may be mentioned.

又,作為SEBS之具體例,可列舉:由旭化成股份有限公司以商品名:Tuftec(註冊商標)市售者或由Shell股份有限公司以商品名:Kraton(註冊商標)市售者等。 In addition, as a specific example of the SEBS, a product of the brand name: Tuftec (registered trademark) by Asahi Kasei Co., Ltd., or a trade name of Kraton (registered trademark) by Shell Co., Ltd., etc., may be mentioned.

又,作為SIB、SIBS之具體例,可列舉由Kaneka股份有限公司以商品名:Shibusuta(註冊商標)市售者等。 In addition, as a specific example of the SIB and the SIBS, a product of the brand name: Shibusuta (registered trademark) is available from Kaneka Co., Ltd., and the like.

又,作為特殊苯乙烯系彈性體,亦可列舉由旭化成股份有限公司以商品名:S.O.E市售者等。 Moreover, as a special styrene-type elastomer, the market name of S.O.E. by Asahi Kasei Co., Ltd. is mentioned.

進而,作為其他熱塑性樹脂(B),亦可列舉:熱塑性聚胺基甲酸乙酯;氯乙烯樹脂;偏二氯乙烯樹脂;丙烯酸系樹脂;乙烯-乙酸乙烯酯共聚合體;乙烯-甲基丙烯酸丙烯酸酯共聚合體;離子聚合物;乙烯-乙烯醇共聚合體;聚乙烯醇;氟系樹脂聚碳酸酯;聚縮醛;聚苯醚;聚苯硫醚聚醯亞胺;聚芳酯;聚碸;聚醚碸等。 Further, examples of the other thermoplastic resin (B) include thermoplastic polyurethane, vinyl chloride resin, vinylidene chloride resin, acrylic resin, ethylene-vinyl acetate copolymer, and ethylene-methacrylic acid acrylic acid. Ester copolymer; ionic polymer; ethylene-vinyl alcohol copolymer; polyvinyl alcohol; fluoro resin polycarbonate; polyacetal; polyphenylene ether; polyphenylene sulfide polyimine; polyaryl ester; Polyether oxime and the like.

於本發明中,該等熱塑性樹脂(B)之中,較佳地使用烯烴系樹脂(B1)及苯乙烯系彈性體(B2)。又,於被黏附體為凹凸面之情形時,尤佳為苯乙烯系彈性體(B2),其原因在於所獲得之表面保護薄膜之黏著力較高。此處,於使用苯乙烯系彈性體(B2)作為熱塑性樹脂(B)之情形時,更佳為例如熱塑性樹脂(B)僅由苯乙烯系彈性體(B2)構成。 In the present invention, among the thermoplastic resins (B), an olefin resin (B1) and a styrene elastomer (B2) are preferably used. Further, in the case where the adherend is an uneven surface, the styrene elastomer (B2) is particularly preferable because the adhesion of the obtained surface protective film is high. Here, when the styrene-based elastomer (B2) is used as the thermoplastic resin (B), it is more preferable that the thermoplastic resin (B) is composed only of the styrene-based elastomer (B2).

該等熱塑性樹脂可單獨使用1種,亦可將2種以上組合使用。 These thermoplastic resins may be used alone or in combination of two or more.

本發明之樹脂組成物除含有上述共聚合體(A)以外亦含有此種熱塑性樹脂(B)。此處,於本發明中,若將共聚合體(A)與熱塑性樹脂(B)之合計量設為100重量份,則就黏著力、對被黏附體之凹凸追隨性之觀點而言,上述組成物中之共聚合體(A)含量之上限值為50重量份,較佳為45重量份,尤佳為40重量份,且下限值為2重量份,較佳為5重量份,尤佳為10重量份。 The resin composition of the present invention contains such a thermoplastic resin (B) in addition to the above-mentioned copolymer (A). In the present invention, when the total amount of the copolymer (A) and the thermoplastic resin (B) is 100 parts by weight, the above composition is obtained from the viewpoint of adhesion and adhesion followability to the adherend. The upper limit of the content of the copolymer (A) in the compound is 50 parts by weight, preferably 45 parts by weight, particularly preferably 40 parts by weight, and the lower limit is 2 parts by weight, preferably 5 parts by weight, particularly preferably It is 10 parts by weight.

換言之,熱塑性樹脂(B)含量之下限值為50重量份,更佳為55重量份,尤佳為60重量份,且上限值為98重量份,更佳為95重量份,尤佳為90重量份。 In other words, the lower limit of the content of the thermoplastic resin (B) is 50 parts by weight, more preferably 55 parts by weight, still more preferably 60 parts by weight, and the upper limit is 98 parts by weight, more preferably 95 parts by weight, particularly preferably 90 parts by weight.

<其他成分> <Other ingredients>

本發明之樹脂組成物可為僅由上述共聚合體(A)與上述熱塑性樹脂(B)所構成者,但亦可除包含上述共聚合體(A)及上述熱塑性樹脂(B)以外,視需要亦進而包含黏著賦予劑等適當之添加劑作為其他成分。 The resin composition of the present invention may be composed only of the above-mentioned copolymer (A) and the above thermoplastic resin (B), but may contain, in addition to the above-mentioned copolymer (A) and the above thermoplastic resin (B), Further, an appropriate additive such as an adhesion-imparting agent is contained as another component.

此處,本發明之樹脂組成物主要可用作黏著劑,為了調整對被黏附體之黏著力,視需要亦可進而包含黏著賦予劑作為添加劑。 Here, the resin composition of the present invention is mainly used as an adhesive, and in order to adjust the adhesion to the adherend, an adhesion-imparting agent may be further contained as an additive as needed.

此處,作為本發明中可使用之黏著賦予劑之例,可列舉一般作為黏著賦予劑而製造、出售之樹脂狀物質,具體而言,可例示:色滿-茚樹脂等色滿樹脂;苯酚-甲醛樹脂及二甲苯-甲醛樹脂等酚系樹脂;萜酚樹脂、萜烯樹脂(α,β-蒎烯樹脂)、芳香族改質萜烯樹脂、氫化萜烯樹脂等萜烯樹脂;合成聚萜烯樹脂、芳香族烴樹脂、脂肪族系烴樹脂、脂肪族系環狀烴樹脂、氫化烴樹脂及烴系黏著化樹脂等石油系烴樹脂;松香季戊四醇、松香季戊四醇酯,松香甘油、松香甘油酯,氫化松香,氫化松香、氫化松香酯,特殊松香、特殊松香酯及松香系 黏著賦予劑等松香衍生物等。 Here, as an example of the adhesive agent which can be used in the present invention, a resinous substance which is generally produced and sold as an adhesion-imparting agent, and specifically, a color-filled resin such as a color-filled resin; - phenolic resin such as formaldehyde resin and xylene-formaldehyde resin; terpene resin such as indophenol resin, terpene resin (α, β-pinene resin), aromatic modified terpene resin, hydrogenated terpene resin; Petroleum hydrocarbon resins such as terpene resin, aromatic hydrocarbon resin, aliphatic hydrocarbon resin, aliphatic cyclic hydrocarbon resin, hydrogenated hydrocarbon resin, and hydrocarbon-based adhesive resin; rosin pentaerythritol, rosin pentaerythritol ester, rosin glycerin, rosin glycerin Ester, hydrogenated rosin, hydrogenated rosin, hydrogenated rosin ester, special rosin, special rosin ester and rosin A rosin derivative such as an adhesion-imparting agent.

該等成分之中,可例示:軟化點於70℃以上、較佳為70~130℃之範圍之氫化烴樹脂、氫化脂肪族系環狀烴樹脂、氫化脂肪族/脂環族系石油樹脂、氫化萜烯樹脂、氫化合成聚萜烯樹脂等氫化樹脂;松香季戊四醇、松香季戊四醇酯,松香甘油、松香甘油酯,氫化松香,氫化松香、氫化松香酯,特殊松香、特殊松香酯及松香系黏著賦予劑等松香衍生物等。 Among these components, a hydrogenated hydrocarbon resin, a hydrogenated aliphatic cyclic hydrocarbon resin, a hydrogenated aliphatic/alicyclic petroleum resin having a softening point of 70 ° C or higher, preferably 70 to 130 ° C, may be exemplified. Hydrogenated resin such as hydrogenated terpene resin, hydrogenated synthetic polydecene resin; rosin pentaerythritol, rosin pentaerythritol ester, rosin glycerin, rosin glyceride, hydrogenated rosin, hydrogenated rosin, hydrogenated rosin ester, special rosin, special rosin ester and rosin-based adhesion Rosin derivatives such as agents.

藉由添加黏著賦予劑,可調整本發明之黏著劑對被黏附體之黏著力。 The adhesion of the adhesive of the present invention to the adherend can be adjusted by adding an adhesion-imparting agent.

此處,於本發明之樹脂組成物包含上述黏著賦予劑之情形時,該黏著賦予劑之使用量係將上述共聚合體(A)與上述熱塑性樹脂(B)之合計設為100重量份而為5~100重量份。 In the case where the resin composition of the present invention contains the above-mentioned adhesion-imparting agent, the amount of the adhesion-imparting agent used is 100 parts by weight in total of the copolymer (A) and the thermoplastic resin (B). 5 to 100 parts by weight.

又,本發明之樹脂組成物亦可於無損本發明之目的之範圍內根據目的包含作為上述黏著賦予劑以外之添加劑的耐候性穩定劑、耐熱穩定劑、抗靜電劑、防滑劑、抗黏連劑、防霧劑、滑劑、顏料、染料、塑化劑、抗老化劑、鹽酸吸收劑、抗氧化劑、結晶成核劑、防黴劑、抗菌劑、難燃劑、填充劑(無機填充劑、有機填充劑)、軟化劑等添加劑。 Further, the resin composition of the present invention may contain a weathering stabilizer, a heat stabilizer, an antistatic agent, an anti-slip agent, and an anti-blocking agent as additives other than the above-mentioned adhesion-imparting agent, depending on the purpose, without departing from the object of the present invention. Agent, anti-fogging agent, slip agent, pigment, dye, plasticizer, anti-aging agent, hydrochloric acid absorbent, antioxidant, crystal nucleating agent, anti-fungal agent, antibacterial agent, flame retardant, filler (inorganic filler) , organic fillers, softeners and other additives.

作為上述軟化劑,可使用先前公知之軟化劑。作為其例,具體而言,可列舉:加工處理油、潤滑油、石蠟、液態石蠟、聚乙烯蠟、聚丙烯蠟、石油瀝青及凡士林等石油系物質;煤焦油及煤焦油瀝青等煤焦油類;蓖麻油、亞麻仁油、菜籽油、大豆油及椰子油等脂肪油;妥爾油、蜂蠟、巴西棕櫚蠟及羊毛脂等蠟類;蓖麻油酸、棕櫚酸、硬脂酸、12-氫氧化硬脂酸、褐煤酸、油酸及芥子酸等脂肪酸或 其金屬鹽;石油樹脂、熏草咔-茚樹脂及雜排聚丙烯等合成高分子;鄰苯二甲酸二辛酯、己二酸二辛酯及癸二酸二辛酯等酯系塑化劑;其他微晶蠟、及液狀聚丁二烯或其改質物或氫化物;液狀多硫橡膠等。 As the above softener, a previously known softener can be used. Specific examples thereof include processing oils, lubricating oils, paraffin waxes, liquid paraffin waxes, polyethylene waxes, polypropylene waxes, petroleum pitches, and petroleum materials such as petroleum jelly; coal tars such as coal tar and coal tar pitch. Fat oils such as castor oil, linseed oil, rapeseed oil, soybean oil and coconut oil; waxes such as tall oil, beeswax, carnauba wax and lanolin; ricinoleic acid, palmitic acid, stearic acid, 12- Fatty acids such as stearic acid, montanic acid, oleic acid and sinapic acid or Its metal salt; synthetic resin such as petroleum resin, smoked alfalfa-茚 resin and miscellaneous polypropylene; ester plasticizer such as dioctyl phthalate, dioctyl adipate and dioctyl sebacate Other microcrystalline waxes, and liquid polybutadiene or its modified or hydride; liquid polysulfide rubber.

作為上述填充劑之例,可列舉:雲母、碳黑、二氧化矽、碳酸鈣、滑石、石墨、不鏽鋼、鋁等粉末填充劑;玻璃纖維或金屬纖維等纖維狀填充劑等。又,亦可列舉親水性之層狀黏土礦物及/或特定形狀(層狀除外)之親水性無機化合物。 Examples of the filler include a powder filler such as mica, carbon black, cerium oxide, calcium carbonate, talc, graphite, stainless steel, and aluminum; and a fibrous filler such as glass fiber or metal fiber. Further, a hydrophilic layered clay mineral and/or a hydrophilic inorganic compound having a specific shape (excluding a layer) may be mentioned.

作為親水性之層狀黏土礦物,例如可列舉積層有複數層平面地擴展之層的頁矽酸鹽礦物,例如可列舉膨潤石。膨潤石為蒙脫石群礦物,例如可列舉:蒙脫石(Montmorillonite)、鎂質蒙脫石(magnesian montmorillonite)、鐵質蒙脫石(iron montmorillonite)、鐵鎂蒙脫石(iron magnesian montmorillonite)、貝得石、鋁貝得石(aluminian beidellite)、囊脫石、鋁囊脫石(aluminian nontronite)、皂石(saponite)、鋁皂石(aluminian saponite)、鋰膨潤石、鋅膨潤石、矽鎂石、膨潤土等。 Examples of the hydrophilic layered clay mineral include a sheet silicate mineral having a layer in which a plurality of layers are expanded in a planar manner, and examples thereof include bentonite. The bentonite is a mineral of the smectite group, and examples thereof include Montmorillonite, magnesian montmorillonite, iron montmorillonite, and iron magnesian montmorillonite. , beide stone, aluminian beidellite, smectite, aluminian nontronite, saponite, aluminian saponite, lithium bentonite, zinc bentonite, strontium Magnesia, bentonite, etc.

又,作為親水性之層狀黏土礦物,例如亦可列舉:蛭石(vermiculite)、多水高嶺土、膨潤性雲母、石墨等。 Further, examples of the hydrophilic layered clay mineral include vermiculite, halloysite, swellable mica, and graphite.

該等親水性之層狀黏土礦物可單獨使用1種或併用2種以上。此種親水性之層狀黏土礦物可使用一般之市售品,例如更具體而言,作為天然品,例如可列舉:Kunipia系列(蒙脫石,KUNIMINE INDUSTRIES公司製造)、Bengel系列(膨潤土,Ho Jun公司製造)、Somasif ME系列(膨潤性雲母,CO-OP.CHEMICAL公司製造)等,作為合成品,例如可列舉:Sumecton(皂石,KUNIMINE INDUSTRIES公司製造)、Lucentite SWN系列(鋰膨潤石,CO-OP.CHEMICAL公司製造)、合成鋰皂石(鋰膨潤石,Rockwood Holdings公司製造)。一般而言,合 成品之最大長度小於天然品,因此可獲得較小之油滴,就此觀點而言較佳為合成品。 These hydrophilic layered clay minerals may be used alone or in combination of two or more. As such a hydrophilic layered clay mineral, a general commercial product can be used. For example, more specifically, as a natural product, for example, Kunipia series (montmorillonite, manufactured by KUNIMINE INDUSTRIES), Bengel series (bentonite, Ho) (manufactured by Jun), Somasif ME series (swellable mica, manufactured by CO-OP. CHEMICAL Co., Ltd.), and the like, for example, Sumecton (saponite, manufactured by KUNIMINE INDUSTRIES), and Lucentite SWN series (lithium bentonite, Co., Ltd., manufactured by CO-OP.CHEMICAL, and laponite (lithium bentonite, manufactured by Rockwood Holdings). In general, The maximum length of the finished product is smaller than that of the natural product, so that smaller oil droplets can be obtained, and from this point of view, it is preferably a synthetic product.

作為上述難燃劑之例,可例示:銻系難燃劑、氫氧化鋁、氫氧化鎂、硼酸鋅、胍系難燃劑、鋯系難燃劑等無機化合物,聚磷酸銨、伸乙基雙三(2-氰乙基)氯化鏻、磷酸三(三溴苯基)酯、磷酸三(三溴苯基)酯、三(3-羥基丙基)氧化膦等磷酸酯及其他磷化合物,氯化石蠟、氯化聚烯烴、全氯環十五烷等氯系難燃劑,六溴苯、伸乙基雙二溴降烷二羧醯亞胺、伸乙基雙四溴鄰苯二甲醯亞胺、四溴雙酚A衍生物、四溴雙酚S、四溴二季戊四醇等溴系難燃劑及該等之混合物。 Examples of the flame retardant include inorganic compounds such as a lanthanum-based flame retardant, aluminum hydroxide, magnesium hydroxide, zinc borate, a lanthanum-based flame retardant, and a zirconium-based flame retardant, and ammonium polyphosphate and ethylene. Phosphate esters such as bis(2-cyanoethyl)phosphonium chloride, tris(tribromophenyl)phosphate, tris(tribromophenyl)phosphate, tris(3-hydroxypropyl)phosphine oxide, and other phosphorus compounds Chloride-based flame retardants such as chlorinated paraffin, chlorinated polyolefin, perchlorocyclopentadecane, hexabromobenzene, and ethylidene dibromide a bromine-based flame retardant such as alkanedicarboxylimine, exoethyl bis-tetrabromophthalimide, tetrabromobisphenol A derivative, tetrabromobisphenol S, tetrabromodipentaerythritol, and the like .

該等軟化劑、填充劑、難燃化劑等黏著賦予劑以外之添加劑之使用量之合計係將上述共聚合體(A)與上述熱塑性樹脂(B)之合計設為100重量份而為0.001~50重量份。 The total amount of the additives other than the adhesion-imparting agent such as the softener, the filler, and the flame retardant is set to 100 parts by weight in total of the copolymer (A) and the thermoplastic resin (B). 50 parts by weight.

<本發明之樹脂組成物之製造方法> <Method for Producing Resin Composition of the Present Invention>

本發明之樹脂組成物可於如上所述之範圍內調配上述共聚合體(A)、上述熱塑性樹脂(B)及視需要之上述「其他成分」項中所列舉之各種添加物,採用各種公知之方法進行製造,例如多段聚合法,利用Plastomill、亨舍爾混合機、V型混合器、帶式混合機、滾動攪拌機、捏煉機等進行混合之方法,或者於混合後利用單軸擠出機、雙軸擠出機、捏合機、班布里混合機等熔融混練後進行造粒或粉碎之方法。 The resin composition of the present invention may be blended with the above-mentioned copolymer (A), the above thermoplastic resin (B), and optionally the above-mentioned "other components" in the above-mentioned range, and various known additives are used. Method for manufacturing, for example, a multi-stage polymerization method, using a Plastomill, a Henschel mixer, a V-type mixer, a belt mixer, a rolling mixer, a kneader, etc., or using a single-axis extruder after mixing A method of granulation or pulverization after melt-kneading, such as a twin-screw extruder, a kneader, or a Banbury mixer.

<接枝改質> <Grafting modification>

於本發明中,可不使上述4-甲基-1-戊烯‧α-烯烴共聚合體(A)及上述熱塑性樹脂(B)改質而直接用於製造本發明之樹脂組成物,亦可於 無損本發明之目的之範圍內使上述4-甲基-1-戊烯‧α-烯烴共聚合體(A)之一部分或全部接枝改質,亦可使上述熱塑性樹脂(B)之一部分或全部接枝改質。作為接枝改質所使用之極性化合物、接枝改質之方法,可列舉先前公知之化合物、方法,例如可採用日本專利特開2008-127440號公報所記載之化合物、方法。 In the present invention, the 4-methyl-1-pentene‧ α -olefin copolymer (A) and the thermoplastic resin (B) may be used in the production of the resin composition of the present invention without modification. Part or all of the above 4-methyl-1-pentene‧ α -olefin copolymer (A) may be graft-modified in a range not degrading the object of the present invention, or a part or all of the thermoplastic resin (B) may be partially Graft modification. Examples of the polar compound to be used for the graft modification and the graft modification include conventionally known compounds and methods. For example, the compounds and methods described in JP-A-2008-127440 can be used.

接枝改質體之接枝量通常為0.1~40重量%,較佳為0.2~30重量%,更佳為0.2~20重量%。 The graft amount of the graft modified body is usually from 0.1 to 40% by weight, preferably from 0.2 to 30% by weight, more preferably from 0.2 to 20% by weight.

若使上述4-甲基-1-戊烯‧α-烯烴共聚合體(A)或上述熱塑性樹脂(B)接枝改質,則於組成物中之各成分之相溶性或製成積層薄膜時薄膜間不易產生層間剝離的方面較佳。 When the 4-methyl-1-pentene‧ α -olefin copolymer (A) or the thermoplastic resin (B) is graft-modified, the compatibility of the components in the composition or the formation of a laminated film is obtained. The aspect in which interlayer peeling is less likely to occur between the films is preferable.

[積層體、尤其是表面保護薄膜] [Laminar, especially surface protection film]

於本發明中,亦提供使用上述樹脂組成物而成之積層體、即含有包含上述樹脂組成物之至少1層黏著劑層(L1)的積層體。 In the present invention, a laminate comprising the above resin composition, that is, a laminate comprising at least one adhesive layer (L1) containing the above resin composition is also provided.

於本發明之積層體中,藉由於黏著劑層中使用上述樹脂組成物,而於貼附於具有凹凸之各種被黏附體時黏著劑層追隨凹凸形狀,藉此黏著面積增加,可發揮充分之黏著力,並且因黏著面積增加而亦可使黏著力保持穩定。 In the laminate of the present invention, when the resin composition is used in the adhesive layer, the adhesive layer follows the uneven shape when attached to various adherends having irregularities, whereby the adhesive area is increased and sufficient Adhesion, and the adhesion can be stabilized due to the increased adhesion area.

此處,作為本發明之積層體,可列舉含有基材層(L2)與包含上述本發明之樹脂組成物之至少1層黏著劑層(L1)的積層體,具體而言,可列舉使包含上述本發明之樹脂組成物之黏著劑層(L1)積層於單層或多層構成之基材層(L2)之單面或兩面而成的多層薄膜。換言之,作為本發明之積層體之基本態樣,可列舉:使基材層(L2)/黏著劑層(L1)依序積層而成之2層薄膜、或使黏著劑層(L1)/基材層(L2)/黏著劑層(L1) 積層而成之3層薄膜。 Here, the laminate of the present invention includes a substrate layer (L2) and a laminate including at least one adhesive layer (L1) of the resin composition of the present invention, and specifically includes The pressure-sensitive adhesive layer (L1) of the resin composition of the present invention is laminated on a single-sided or double-sided film of a single-layer or multi-layer base material layer (L2). In other words, as a basic aspect of the laminated body of the present invention, a two-layer film in which a base material layer (L2)/adhesive layer (L1) is sequentially laminated or an adhesive layer (L1)/base is used. Material layer (L2) / adhesive layer (L1) A three-layer film laminated.

此處,構成本發明之積層體的基材層(L2)之材料並無特別限制,較佳為聚烯烴系樹脂等熱塑性樹脂,作為其具體例,可例示:聚丙烯系樹脂(丙烯之均聚合體、及丙烯與少量之α-烯烴的無規或嵌段共聚合體)、聚乙烯系樹脂(低密度聚乙烯、中密度聚乙烯、高密度聚乙烯及線狀低密度聚乙烯)、公知之乙烯系聚合體(乙烯‧α-烯烴共聚合體、乙烯-丙烯酸乙酯共聚合體;乙烯-乙酸乙烯酯共聚合體、乙烯-甲基丙烯酸甲酯共聚合體、乙烯-丙烯酸正丁酯共聚合體)、公知之丙烯系共聚合體(丙烯‧α-烯烴共聚合體)、聚-4-甲基-1-戊烯、以及該等之組合。 Here, the material of the base material layer (L2) constituting the laminate of the present invention is not particularly limited, and is preferably a thermoplastic resin such as a polyolefin resin. Specific examples thereof include a polypropylene resin (acrylic resin) a polymer, a random or block copolymer of propylene and a small amount of α-olefin, a polyethylene resin (low density polyethylene, medium density polyethylene, high density polyethylene, and linear low density polyethylene), known The ethylene-based polymer (ethylene ‧ α -olefin copolymer, ethylene-ethyl acrylate copolymer; ethylene-vinyl acetate copolymer, ethylene-methyl methacrylate copolymer, ethylene-n-butyl acrylate copolymer), A propylene-based copolymer (propylene ‧ α -olefin copolymer), poly-4-methyl-1-pentene, and combinations thereof are known.

又,於本發明之積層體中,例如亦可於基材層(L2)之與黏著劑層(L1)側相反側之面進而設置表面層(L3)。即,本發明之積層體亦可具有包含使表面層(L3)/基材層(L2)/黏著劑層(L1)依序積層而成之至少3層的構造。此處,表面層(L3)有時係為了例如於將積層體製成輥之情形時易捲出積層體而設置。於該情形時,作為基材層(L2)及表面層(L3)之材料,可使用種類相互相同之樹脂,或者亦可使用種類互不相同之樹脂。 Further, in the laminate of the present invention, for example, a surface layer (L3) may be further provided on the surface of the base material layer (L2) opposite to the side of the adhesive layer (L1). In other words, the laminate of the present invention may have a structure including at least three layers in which the surface layer (L3)/base material layer (L2)/adhesive layer (L1) are sequentially laminated. Here, the surface layer (L3) is sometimes provided in order to easily roll up the laminated body when the laminated body is made into a roll. In this case, as the material of the base material layer (L2) and the surface layer (L3), resins of the same type may be used, or resins of different types may be used.

可對基材層(L2)之表面利用如電暈放電處理、電漿處理、火焰處理、電子束照射處理及紫外線照射處理之表面處理法進行處理,基材層(L2)可為無色透明之層,亦可為進行過著色或進行過印刷之層。 The surface of the substrate layer (L2) can be treated by a surface treatment such as corona discharge treatment, plasma treatment, flame treatment, electron beam irradiation treatment, and ultraviolet irradiation treatment, and the substrate layer (L2) can be colorless and transparent. The layer may also be a layer that has been colored or printed.

作為基材層(L2),亦可使用沿單軸或雙軸方向經延伸者。 As the base material layer (L2), it is also possible to use an extension in a uniaxial or biaxial direction.

作為本發明之積層體之製造方法,例如可列舉公知之多層薄膜之成形方法,作為較佳之方法,可例示:使用T字模薄膜成形 法或吹脹薄膜成形法將包含本發明之樹脂組成物之黏著劑層(L1)與基材層(L2)共擠出的方法,或者於預先成形之基材層(L2)上擠出塗覆包含本發明之樹脂組成物之黏著劑層(L1)的方法等。又,亦可列舉將本發明之樹脂組成物溶於溶劑而塗佈於基材層(L2)上從而於該基材層(L2)上形成黏著劑層(L1)的方法。該等之中,較佳為藉由共擠出成形法之薄膜化。 As a method for producing the laminated body of the present invention, for example, a known method for forming a multilayer film can be mentioned, and as a preferred method, a T-shaped film can be used for forming. A method of coextruding an adhesive layer (L1) comprising the resin composition of the present invention with a substrate layer (L2) or extrusion coating on a preformed substrate layer (L2) by a method or an inflation film forming method A method of coating the adhesive layer (L1) containing the resin composition of the present invention. Further, a method in which the resin composition of the present invention is dissolved in a solvent and applied to the base material layer (L2) to form an adhesive layer (L1) on the base material layer (L2) may be mentioned. Among these, it is preferable to form a film by a co-extrusion molding method.

本發明之多層薄膜亦可沿單軸方向或雙軸方向進行延伸。作為單軸延伸之較佳之方法,可例示通常使用之輥延伸法。作為雙軸延伸之方法,可例示:於單軸延伸後進行雙軸延伸之逐次延伸法、或如管式延伸法之同時雙軸延伸法。 The multilayer film of the present invention may also extend in a uniaxial direction or a biaxial direction. As a preferred method of uniaxial stretching, a roll stretching method which is generally used can be exemplified. As a method of biaxial stretching, a sequential stretching method of performing biaxial stretching after uniaxial stretching or a simultaneous biaxial stretching method such as tubular extension method can be exemplified.

藉由使用如上所述之製造方法,可以多層薄膜之形態獲得本發明之積層體,作為該多層薄膜之較佳之用途,可列舉表面保護薄膜。使用本發明之樹脂組成物之表面保護薄膜(多層薄膜)之厚度並無特別限定,較佳為5~5000μm左右,更佳為10~1000μm左右。表面層(黏著層)之厚度並無特別限制,可根據被黏附體之種類或所要求之物性(例如黏著強度)進行選擇,通常為1~500μm,較佳為3~300μm。又,積層體只要至少具有黏著劑層與基材層2層即可,例如亦可於黏著劑層(L1)與基材層(L2)之間設置中間層(L4)。此處,作為中間層(L4)所使用之材質,可使用先前公知者。 The laminate of the present invention can be obtained in the form of a multilayer film by using the above-described production method. As a preferred use of the multilayer film, a surface protection film can be cited. The thickness of the surface protective film (multilayer film) using the resin composition of the present invention is not particularly limited, but is preferably about 5 to 5,000 μm, more preferably about 10 to 1,000 μm. The thickness of the surface layer (adhesive layer) is not particularly limited and may be selected depending on the type of the adherend or the desired physical properties (for example, adhesive strength), and is usually 1 to 500 μm, preferably 3 to 300 μm. Further, the laminate may have at least two layers of the adhesive layer and the base layer. For example, an intermediate layer (L4) may be provided between the adhesive layer (L1) and the base layer (L2). Here, as a material used for the intermediate layer (L4), a conventionally known one can be used.

於將使用本發明之樹脂組成物之多層薄膜用作表面保護薄膜之情形時,為了防止多層薄膜彼此之黏連(黏附),可於多層薄膜間插入剝離紙或剝離薄膜,或者於基材層(L2)之露出面塗佈剝離劑。 In the case where a multilayer film using the resin composition of the present invention is used as a surface protective film, in order to prevent adhesion (adhesion) of the multilayer films to each other, a release paper or a release film may be interposed between the multilayer films, or on the substrate layer. The exposed surface of (L2) was coated with a release agent.

又,於本發明中,關於基材層(L2),為了視需要對表面賦予如滑動性之功能,亦可包含脫模劑等添加劑。 Further, in the present invention, the base material layer (L2) may contain an additive such as a release agent in order to impart a function as a slidability to the surface as needed.

<表面保護薄膜之製造方法> <Method for Producing Surface Protective Film>

積層基材層(L2)與黏著劑層(L1)及視需要設置之表面層(L3)之方法並無特別限制,可列舉:藉由擠出層壓、擠出塗覆等公知之積層法於預先藉由T字模成形或吹脹成形所獲得之表面層(L3)薄膜上積層基材層(L2)及黏著劑層(L1)的方法,或者將基材層(L2)及黏著劑層(L1)獨立地製成薄膜後藉由乾式層壓積層各薄膜之方法等,就生產性之方面而言,較佳為將表面層(L3)、基材層(L2)、黏著劑層(L1)之各成分供於多層之擠出機而成形之共擠出成形。該情況亦同樣地適合於製造包含除具有基材層(L2)、黏著劑層(L1)及視需要設置之表面層(L3)以外亦具有上述中間層(L4)之積層體的表面保護薄膜之情形。基於該等情況,於本發明中之較佳之態樣中,構成表面保護薄膜之積層體例如為藉由T字模薄膜成形法所獲得之多層薄膜。 The method of laminating the base material layer (L2) and the adhesive layer (L1) and optionally the surface layer (L3) is not particularly limited, and examples thereof include a known lamination method by extrusion lamination, extrusion coating, or the like. a method of laminating a substrate layer (L2) and an adhesive layer (L1) on a surface layer (L3) film obtained by T-die molding or inflation molding, or a substrate layer (L2) and an adhesive layer (L1) A method of laminating each film by dry lamination after independently forming a film, etc., in terms of productivity, a surface layer (L3), a substrate layer (L2), and an adhesive layer (preferably) Each component of L1) is supplied to a multi-layer extruder to form a co-extrusion molding. This case is also suitable for the production of a surface protective film comprising a laminate having the above-mentioned intermediate layer (L4) in addition to the substrate layer (L2), the adhesive layer (L1), and optionally the surface layer (L3). The situation. Based on such a case, in the preferred aspect of the invention, the laminate constituting the surface protective film is, for example, a multilayer film obtained by a T-die film forming method.

藉由使用上述較佳之形態之基材層(L2)、黏著劑層(L1)及視需要設置之表面層(L3),脫模性優異之聚烯烴系多層薄膜尤其可較佳地用作表面保護薄膜、脫模薄膜。 The polyolefin-based multilayer film excellent in mold release property is particularly preferably used as a surface by using the substrate layer (L2), the adhesive layer (L1) and the surface layer (L3) which are optionally provided in the above preferred embodiment. Protective film, release film.

<用途> <Use>

作為本發明之樹脂組成物及包含樹脂組成物而成之積層體之用途,可列舉:黏著劑片材、表面保護薄膜等。於將本發明之樹脂組成物用作多層薄膜之黏著劑層之情形時,該多層薄膜可較佳地用作用以保護鋁板、鋼板、不鏽鋼板等金屬板及該等之塗裝板、或玻璃板、合成樹脂板等加工用構件、進而使用該等構件之家電製品或汽車零件、電子零件的表面保護薄膜。因此,本發明之樹脂組成物可較佳地用於 例如黏著薄膜、保護薄膜黏著層等之黏著劑、半導體用步驟保護薄膜、透鏡保護薄膜、半導體晶圓用背面研磨膠帶、切割保護膠帶、印刷基板用保護膠帶之類的電子領域之薄膜或膠帶、窗玻璃保護用薄膜、燒附塗裝用薄膜等。尤其是本發明之樹脂組成物具有凹凸追隨性,因此較佳地用於用以保護表面凹凸構造較多之稜鏡薄片或反射片材、附有褶皺之表面的片材等。此處,作為應用於印刷基板用保護膠帶之例,可列舉軟性、印刷基板之鍍敷處理時所使用之鍍敷掩膜用保護薄膜。 Examples of the use of the resin composition of the present invention and a laminate comprising the resin composition include an adhesive sheet, a surface protective film, and the like. When the resin composition of the present invention is used as an adhesive layer of a multilayer film, the multilayer film can be preferably used as a metal plate for protecting an aluminum plate, a steel plate, a stainless steel plate, and the like, or a coated plate or glass. A processing member such as a plate or a synthetic resin sheet, and a surface protective film for an electric appliance or an automobile part or an electronic component using the member. Therefore, the resin composition of the present invention can be preferably used for For example, an adhesive such as an adhesive film or a protective film adhesive layer, a semiconductor protective film, a lens protective film, a back grinding tape for a semiconductor wafer, a cut protective tape, a protective film for a printed circuit board, or an electronic film or tape, A film for window glass protection, a film for baking and coating, and the like. In particular, since the resin composition of the present invention has concavo-convex followability, it is preferably used for a sheet or a reflective sheet for protecting a surface having a large uneven structure, a sheet having a wrinkled surface, and the like. In the case of the protective tape for a printed circuit board, a protective film for a plating mask used for the plating treatment of a printed circuit board is exemplified.

本發明之表面保護薄膜可貼附於作為保護之對象物的被黏附體而使用。根據被黏附體之貼附面之物性、例如表面之凹凸(表面粗度)等而調整成分。一般而言,於被黏附體之貼附面之表面粗度較粗之情形時採用強黏著型之材質。 The surface protection film of the present invention can be used by being attached to an adherend which is an object to be protected. The composition is adjusted depending on the physical properties of the attached surface of the adherend, for example, the surface roughness (surface roughness). In general, a strongly adhesive type material is used when the surface of the adherend of the adherend is thick.

對於表面凹凸較大之被黏附面,較佳為使用苯乙烯系彈性體(B2)作為熱塑性樹脂(B)。於該情形時,被黏附面之表面凹凸高度較佳為於0.1~300μm之範圍,更佳為於0.1~100μm之範圍,進而較佳為於1~50μm之範圍,尤佳為於1~30μm之範圍。 It is preferable to use a styrene-based elastomer (B2) as the thermoplastic resin (B) for the adhered surface having a large surface unevenness. In this case, the surface unevenness height of the adhered surface is preferably in the range of 0.1 to 300 μm, more preferably in the range of 0.1 to 100 μm, further preferably in the range of 1 to 50 μm, and particularly preferably in the range of 1 to 30 μm. The scope.

換言之,可謂於本發明中亦提供一種使用本發明之保護薄膜保護作為保護之對象物的被黏附體之方法,此種方法係藉由對作為保護之對象物的被黏附體中之應保護之面貼附本發明之表面保護薄膜而進行。尤其是於使用苯乙烯系彈性體(B2)作為熱塑性樹脂(B)之情形時,關於作為保護之對象物的被黏附體之較佳之例,可列舉表面凹凸高度為0.1~300μm、更佳為0.1~100μm、進而較佳為1~50μm、尤佳為1~30μm之面,作為更具體之例可列舉稜鏡薄片。 In other words, it is also possible to provide a method of protecting an adherend as an object to be protected by using the protective film of the present invention, which is to be protected by an adherend as an object to be protected. It is carried out by attaching the surface protective film of the present invention. In particular, when the styrene-based elastomer (B2) is used as the thermoplastic resin (B), a preferred example of the adherend as the object to be protected is a surface unevenness height of 0.1 to 300 μm, more preferably The surface of 0.1 to 100 μm, more preferably 1 to 50 μm, and particularly preferably 1 to 30 μm, as a more specific example, may be a tantalum sheet.

[實施例] [Examples]

以下藉由實施例說明本發明,但本發明並不受該等實施 例之任何限定。 The invention is illustrated by the following examples, but the invention is not subject to such implementation Any definition of the example.

[測定條件等] [Measurement conditions, etc.]

實施例中之物性之測定條件等如下所述。 The measurement conditions and the like of the physical properties in the examples are as follows.

[組成] [composition]

聚合物中之4-甲基-1-戊烯及α-烯烴含量係藉由13C-NMR,利用以下之裝置於以下之條件下進行測定。使用日本電子股份有限公司製造之ECP500型核磁共振裝置,作為溶劑為鄰二氯苯/氘苯(80/20體積%)混合溶劑,試樣濃度55mg/0.6mL,測定溫度120℃,觀測核為13C(125MHz),序列為單脈衝質子去耦,脈衝寬度為4.7μs(45°脈衝),重複時間為5.5秒,累計次數為1萬次以上,將27.50ppm設為化學位移之基準值而進行測定。 The content of 4-methyl-1-pentene and α-olefin in the polymer was measured by 13 C-NMR using the following apparatus under the following conditions. An ECP500 type nuclear magnetic resonance apparatus manufactured by JEOL Ltd. was used as a mixed solvent of o-dichlorobenzene/nonylbenzene (80/20% by volume) as a solvent, and the sample concentration was 55 mg/0.6 mL. The measurement temperature was 120 ° C, and the observation nuclei were 13 C (125MHz), the sequence is single pulse proton decoupling, the pulse width is 4.7μs (45° pulse), the repetition time is 5.5 seconds, the cumulative number is more than 10,000 times, and 27.50ppm is set as the reference value of chemical shift. The measurement was carried out.

[密度] [density]

聚合物之密度係根據ASTM D 1505(水中置換法),使用ALFA MIRAGE公司之電子比重計MD-300S,由在水中與空氣中所測得之各試樣之重量而算出。 The density of the polymer was calculated from the weight of each sample measured in water and air according to ASTM D 1505 (aqueous substitution method) using an electronic hydrometer MD-300S of ALFA MIRAGE.

[熔點(Tm)] [melting point (Tm)]

聚合物之熔點(Tm)係利用Seiko Instruments公司製造之DSC220C裝置藉由示差掃描熱量計(DSC)進行測定。將由聚合所獲得之試樣7~12mg密封於鋁鍋中,自室溫以10℃/min加熱至200℃。為了使該試樣完全熔解而於200℃下保持5分鐘,繼而以10℃/min冷卻至-50℃。 於-50℃下放置5分鐘置後,將該試樣以10℃/min再次加熱至200℃。採用該再次之(第二次之)加熱中之波峰溫度作為熔點(Tm)。 The melting point (Tm) of the polymer was measured by a differential scanning calorimeter (DSC) using a DSC220C apparatus manufactured by Seiko Instruments. 7 to 12 mg of the sample obtained by the polymerization was sealed in an aluminum pan and heated from room temperature to 200 ° C at 10 ° C / min. In order to completely melt the sample, it was kept at 200 ° C for 5 minutes, and then cooled to -50 ° C at 10 ° C / min. After standing at -50 ° C for 5 minutes, the sample was again heated to 200 ° C at 10 ° C / min. The peak temperature in this (second time) heating was used as the melting point (Tm).

[極限黏度] [limit viscosity]

極限黏度[η](dL/g)係使用十氫萘溶劑於135℃下進行測定。 The ultimate viscosity [η] (dL/g) was measured using a decalin solvent at 135 °C.

即,將樣品約20mg溶解於十氫萘15ml,於135℃之油浴中測定比黏度ηsp。於該十氫萘溶液中追加十氫萘溶劑5ml而稀釋後,以相同之方式測定比黏度ηsp。進而重複進行該稀釋操作2次,將如下述式所示般將濃度(C)外推至0時之ηsp/C值設為極限黏度[η](單位:dL/g)。 That is, about 20 mg of the sample was dissolved in 15 ml of decalin, and the specific viscosity η sp was measured in an oil bath at 135 °C. After adding 5 ml of decalin solvent to the decalin solution and diluting, the specific viscosity η sp was measured in the same manner. Further, this dilution operation was repeated twice, and the η sp /C value when the concentration (C) was extrapolated to 0 as shown in the following formula was defined as the ultimate viscosity [η] (unit: dL/g).

[η]=lim(ηsp/C)(C→0) [η]=lim(η sp /C)(C→0)

[分子量(Mw、Mn)、分子量分佈(Mw/Mn)] [Molecular weight (Mw, Mn), molecular weight distribution (Mw/Mn)]

共聚合體(A)之分子量係使用液相層析儀:Waters製造之ALC/GPC 150-C plus型(示差折射計檢測器一體型),作為管柱係將Tosoh股份有限公司製造之GMH6-HT×2根及GMH6-HTL×2根串列連接,作為移動相介質係使用鄰二氯苯,以流速1.0ml/min於140℃下進行測定。 The molecular weight of the copolymer (A) is a liquid chromatograph: ALC/GPC 150-C plus (differential refractometer detector integrated type) manufactured by Waters, and GMH6-HT manufactured by Tosoh Co., Ltd. as a column system. ×2 and GMH6-HTL×2 were connected in series, and o-dichlorobenzene was used as a mobile phase medium, and the measurement was carried out at 140 ° C at a flow rate of 1.0 ml/min.

藉由公知之方法,採用使用標準聚苯乙烯樣品之校準曲線對所獲得之層析圖進行解析,藉此算出Mw/Mn值及Mz/Mw值。對每個樣品之測定時間為60分鐘。 The obtained chromatogram was analyzed by a known method using a calibration curve of a standard polystyrene sample, thereby calculating Mw/Mn value and Mz/Mw value. The measurement time for each sample was 60 minutes.

[各種測定用壓製片材之製作法] [Manufacturing method of various pressed sheets for measurement]

使用設定於190℃之神藤金屬工業公司製造之油壓式熱壓機,於10MPa之壓力下將實施例及比較例之各黏著劑(即,用於黏著劑層(L1)之黏著劑樹脂組成物)板材成形。於厚度1~3mm之片材(隔片形狀; 於240×240×厚度2mm之板取4個80×80×0.5~3mm)之情形時,保持餘熱5~7分鐘左右,於10MPa下加壓1~2分鐘後,使用設定於20℃之另一神藤金屬工業公司製造之油壓式熱壓機,於10MPa下進行壓縮,冷卻5分鐘左右,製成測定用試樣。使用厚度5mm之黃銅板作為熱板。將藉由上述方法所製作之樣品供作各種物性評價試樣。 The adhesives of the examples and the comparative examples (i.e., the adhesive resin for the adhesive layer (L1) were used under a pressure of 10 MPa using a hydraulic hot press manufactured by Shinto Metal Industry Co., Ltd. set at 190 °C. Material) sheet forming. a sheet having a thickness of 1 to 3 mm (slice shape; When taking four 80×80×0.5~3mm) on a plate of 240×240×2mm thickness, keep the residual heat for about 5~7 minutes, pressurize at 10MPa for 1-2 minutes, then use another one set at 20°C. A hydraulic hot press manufactured by Shinto Metal Industries Co., Ltd. was compressed at 10 MPa and cooled for about 5 minutes to prepare a sample for measurement. A brass plate having a thickness of 5 mm was used as the hot plate. The samples prepared by the above methods were used for various physical property evaluation samples.

[蕭氏硬度測定] [Dang's hardness measurement]

於蕭氏硬度(依據JIS K6253)之測定中,使用厚度3mm之壓製片材作為測定試樣,讀取蕭氏A硬度計或蕭氏D硬度計之探針剛開始接觸後與自探針開始接觸起15秒後之刻度。 In the measurement of Xiao's hardness (according to JIS K6253), a pressed sheet having a thickness of 3 mm was used as a measurement sample, and the probe of the Xiao's A hardness tester or the Xiao's D hardness tester was just started after contact with the self-probe. The scale after 15 seconds of contact.

繼而,求出以下式定義之蕭氏硬度之值之變化△HS。 Then, the change ΔHS of the value of the Shore hardness defined by the following formula was obtained.

△HS=(探針剛開始接觸後之蕭氏硬度值-自探針開始接觸起15秒後之蕭氏硬度值) △HS=(Which hardness value after the probe has just started contact - Xiao hardness value after 15 seconds from the start of contact of the probe)

此處,蕭氏硬度之測定於原則上係使用蕭氏A硬度計進行,但對於難以進行蕭氏A硬度之測定之測定試樣,代替地使用蕭氏D硬度計進行。 Here, the measurement of the Shore hardness is carried out in principle using a Shore A hardness tester, but a measurement sample which is difficult to measure the Shore A hardness is used instead of the Shore D hardness tester.

此處,於使用相同種類之硬度計時,可謂△HS越大則凹凸追隨性越高。 Here, when the same type of hardness is used, it can be said that the larger the ΔHS, the higher the tracking followability.

[積層體成形] [Layered body formation]

使用兼備30mmΦ單軸擠出機之模具寬度300mm之3種3層T字模成形機,自分別與表面層(L3)、基材層(L2)、黏著劑層(L1)連結之樹脂供給料斗投入樹脂顆粒,通過單軸擠出機內之料缸而使樹脂顆粒熔解後,藉由T字模進行擠出成形,獲得成為黏著片之積層體。此時, 於表面層(L3)及基材層(L2)使用Prime Polymer股份有限公司製造之聚丙烯F107,於黏著劑層(L1)利用各實施例及比較例所示之黏著劑樹脂組成物。 Three kinds of three-layer T-die forming machines with a die width of 300 mm and a 30 mm Φ single-axis extruder were used, and the resin supply hoppers connected to the surface layer (L3), the base material layer (L2), and the adhesive layer (L1) were respectively put into the hopper. The resin pellets are melted by a cylinder in a uniaxial extruder, and then extruded by a T-die to obtain a laminate which is an adhesive sheet. at this time, Polypropylene F107 manufactured by Prime Polymer Co., Ltd. was used for the surface layer (L3) and the base material layer (L2), and the adhesive resin composition shown in each of the examples and the comparative examples was used for the adhesive layer (L1).

此處,將關於各實施例及比較例之表面層(L3)厚度、基材層(L2)厚度、黏著劑層(L1)厚度及合計厚度分別示於表2~5。 Here, the thickness of the surface layer (L3), the thickness of the base material layer (L2), the thickness of the adhesive layer (L1), and the total thickness of each of the examples and the comparative examples are shown in Tables 2 to 5, respectively.

[黏著力評價(丙烯酸系板)] [Adhesion evaluation (acrylic board)]

依據JIS Z0237-2000,測定各實施例及比較例中所獲得之積層體之黏著力。此處,於作為黏著片樣品之各積層體之並非測定黏著力之對象之面貼附100μm之聚對苯二甲酸乙二酯之片材,製成黏著薄膜。另一方面,使用寬度50mm×長度100mm×厚度2mm之黑色丙烯酸系板(Mitsubishi Rayon股份有限公司製造,商品名Acrylite REX,形狀50×100mm角板)作為試驗板。將該試驗板與該黏著薄膜於溫度23℃、相對濕度50%之環境下放置1小時後,將黏著薄膜配置試驗板上後,利用約2kg之橡膠輥一面施加壓力一面使之通過2個來回,而將黏著薄膜貼附於試驗板。貼附後,於溫度23℃、相對濕度50%之固定環境下放置1天後,於溫度23℃相對濕度50%之環境下,測定沿180°方向以速度300mm/min自作為試驗板之黑色丙烯酸系板剝離時之黏著力,定為23℃下之黏著力。 The adhesion of the laminate obtained in each of the examples and the comparative examples was measured in accordance with JIS Z0237-2000. Here, a sheet of polyethylene terephthalate having a thickness of 100 μm was attached to the surface of the laminated body which is a sample of the adhesive sheet, and the adhesive film was formed. On the other hand, a black acrylic plate (manufactured by Mitsubishi Rayon Co., Ltd., trade name Acrylite REX, shape 50 × 100 mm gusset) having a width of 50 mm × a length of 100 mm × a thickness of 2 mm was used as a test plate. After the test plate and the adhesive film were allowed to stand in an environment of a temperature of 23 ° C and a relative humidity of 50% for 1 hour, the adhesive film was placed on the test plate, and then a pressure of about 2 kg was applied to the rubber roller to pass it back and forth. And attach the adhesive film to the test plate. After attaching, it was allowed to stand for 1 day in a fixed environment with a temperature of 23 ° C and a relative humidity of 50%, and then measured at a temperature of 23 ° C and a relative humidity of 50% to measure the blackness of the test plate at a speed of 300 mm/min in the direction of 180°. The adhesion of the acrylic plate when peeled off was set at 23 ° C.

將關於各實施例及比較例之黏著力示於表2~5之「黏著強度(丙烯酸系板)@23℃」欄。 The adhesion of each of the examples and the comparative examples is shown in the column of "adhesive strength (acrylic plate) @23 °C" in Tables 2 to 5.

[黏著亢進率] [Adhesion rate]

根據上述「黏著力評價(丙烯酸系板)」中記載之方法及條件,代替 將貼附有黏著薄膜(即,由各實施例及比較例中獲得之積層體所獲得的黏著薄膜)之試驗板於溫度23℃、相對濕度50%之固定環境下放置1天,而將上述試驗板於烘箱中60℃之環境下放置1天後,於溫度23℃相對濕度50%之環境下,測定沿180°方向以速度300mm/min自黑色丙烯酸系板剝離時之黏著亢進後之黏著力。將此時之黏著力定為60℃下之黏著力。將關於各實施例及比較例之60℃下之黏著力示於表2~5之「黏著強度(丙烯酸系板)@60℃」欄。 According to the method and conditions described in the above "Adhesion evaluation (acrylic board)" The test plate to which the adhesive film (that is, the adhesive film obtained from the laminate obtained in each of the examples and the comparative examples) was attached was allowed to stand in a fixed environment at a temperature of 23 ° C and a relative humidity of 50% for 1 day. The test plate was placed in an oven at 60 ° C for 1 day, and after adhesion at a temperature of 23 ° C and a relative humidity of 50%, the adhesion after peeling from the black acrylic plate at a speed of 300 mm/min in the direction of 180° was measured. force. The adhesion at this time was set to the adhesion at 60 °C. The adhesive strength at 60 ° C of each of the examples and the comparative examples is shown in the column of "adhesive strength (acrylic plate) @60 ° C" in Tables 2 to 5.

對於各實施例及比較例,根據表2~5之「黏著強度(丙烯酸系板)@23℃」欄所示之23℃下之黏著力及「黏著強度(丙烯酸系板)@60℃」欄所示之60℃下之黏著力,算出黏著亢進率。此處,關於「黏著亢進率」,具體而言係以{(60℃下之黏著力)-(23℃下之黏著力)}/(23℃下之黏著力)×100之形式算出。 For each of the examples and comparative examples, the adhesion at 23 ° C and the "adhesive strength (acrylic plate) @60 ° C" column shown in the column of "Adhesive strength (acrylic plate) @23 ° C" in Tables 2 to 5 are shown. The adhesion at 60 ° C is shown to calculate the adhesion rate. Here, the "adhesion rate" is specifically calculated as {(adhesion at 60 ° C) - (adhesion at 23 ° C)} / (adhesion at 23 ° C) × 100.

將關於各實施例及比較例之黏著亢進率示於表2~5之「黏著亢進率」欄。 The adhesion rate of each of the examples and the comparative examples is shown in the "adhesion rate" column of Tables 2 to 5.

[黏著力評價(SUS凹凸板)] [Adhesion evaluation (SUS embossing plate)]

依據WO2011/002083號公報,以下述方式測定各實施例及比較例中所獲得之積層體對SUS凹凸板之黏著力。此處,使用各實施例及比較例中所獲得之積層體作為保護薄膜。 According to WO2011/002083, the adhesion of the laminate obtained in each of the examples and the comparative examples to the SUS embossed plate was measured in the following manner. Here, the laminate obtained in each of the examples and the comparative examples was used as a protective film.

於寬度50mm之不鏽鋼板(SUS304,180號拋光)貼附保護薄膜,於溫度23℃、相對濕度50%之固定環境下放置1天後,於溫度23℃相對濕度50%之環境下,沿180°方向以速度300mm/min剝離,測定黏著力。即,使用上述不鏽鋼板代替上述黑色丙烯酸系板,將「黏著薄膜」替換為「保護薄膜」,除此以外,以與上述「黏著力評價(丙 烯酸系板)」相同之方式進行保護薄膜之貼附及測定。 A protective film is attached to a stainless steel plate (SUS304, polished No. 180) having a width of 50 mm, and placed in a fixed environment at a temperature of 23 ° C and a relative humidity of 50% for one day, and then at a temperature of 23 ° C and a relative humidity of 50%, along the 180. The direction of the peel was peeled at a speed of 300 mm/min, and the adhesion was measured. That is, the above-mentioned stainless steel plate was used instead of the above-mentioned black acrylic plate, and the "adhesive film" was replaced with the "protective film", and in addition to the above, "adhesion evaluation" (C) The protective film was attached and measured in the same manner as the olefinic plate.

將關於各實施例及比較例之黏著力示於表2~5之「黏著強度(SUS凹凸板)」欄。 The adhesive force of each of the examples and the comparative examples is shown in the "adhesive strength (SUS embossing plate)" column of Tables 2 to 5.

[黏著穩定性(SUS凹凸板)] [Adhesive stability (SUS embossing plate)]

以下述方式評價各實施例及比較例中所獲得之積層體對SUS凹凸板之黏著穩定性。此處,使用各實施例及比較例中所獲得之積層體作為保護薄膜。 The adhesion stability of the laminate obtained in each of the examples and the comparative examples to the SUS embossed plate was evaluated in the following manner. Here, the laminate obtained in each of the examples and the comparative examples was used as a protective film.

於不鏽鋼板(SUS304,180號拋光)貼附保護薄膜,於溫度23℃、相對濕度50%之固定環境下,將貼附面朝下保管1天。確認保管後之保護薄膜之剝離片數,以下述方式評價。 A protective film was attached to a stainless steel plate (SUS304, polished No. 180), and the attached surface was stored for one day in a fixed environment at a temperature of 23 ° C and a relative humidity of 50%. The number of peeling sheets of the protective film after storage was confirmed and evaluated in the following manner.

×:全部剝離或未黏著於基材 ×: all peeled off or not adhered to the substrate

△:一部分薄膜剝離 △: Part of the film peeling

○:全部保持黏著狀態 ○: All remain stuck

將關於各實施例及比較例之評價示於表2~5之「黏著穩定性(SUS凹凸板)」欄。 The evaluations of the respective examples and comparative examples are shown in the column of "adhesion stability (SUS embossing plate)" in Tables 2 to 5.

[黏著力評價(稜鏡板)] [Adhesion evaluation (seesaw)]

以下述方式測定各實施例及比較例中所獲得之積層體對稜鏡板之黏著力。 The adhesion of the laminate obtained in each of the examples and the comparative examples to the raft was measured in the following manner.

以厚度110μm、稜鏡之節距為50μm、高度為35μm之包含丙烯酸系樹脂之稜鏡薄片為稜鏡板,使用各實施例及比較例中所獲得之積層體作為保護薄膜。此處,將該保護薄膜之寬度設為50mm。 使用2kg橡膠輥以20mm/min將上述保護薄膜壓合於該稜鏡板,於溫度23℃、相對濕度50%之固定環境下放置30分鐘後,沿180°方向以速度300mm/min剝離,測定黏著力。 A tantalum sheet containing an acrylic resin having a thickness of 110 μm, a pitch of 50 μm, and a height of 35 μm was used as a backing plate, and a laminate obtained in each of Examples and Comparative Examples was used as a protective film. Here, the width of the protective film was set to 50 mm. The protective film was press-bonded to the slab at 20 mm/min using a 2 kg rubber roller, and left at a temperature of 23 ° C and a relative humidity of 50% for 30 minutes, and then peeled at a speed of 300 mm/min in a 180° direction to measure adhesion. force.

將關於各實施例及比較例之黏著力示於表2~5之「黏著強度(稜鏡板)」欄。 The adhesive strengths of the respective examples and comparative examples are shown in the "adhesive strength (seesaw)" column of Tables 2 to 5.

[黏著穩定性(稜鏡板)] [Adhesive stability (seesaw)]

以下述方式測定各實施例及比較例中所獲得之積層體對稜鏡板之黏著穩定性。 The adhesion stability of the laminate obtained in each of the examples and the comparative examples to the raft was measured in the following manner.

使用各實施例及比較例中所獲得之積層體作為保護薄膜。並且使用與上述「黏著力評價(稜鏡板)」中所使用者相同之稜鏡薄片代替上述不鏽鋼板,於其上貼附保護薄膜,除此以外,以與上述「黏著穩定性(SUS凹凸板)」相同之方式進行評價。 The laminate obtained in each of the examples and the comparative examples was used as a protective film. Further, the same stainless steel sheet as the user of the above-mentioned "adhesion evaluation (slab)" is used in place of the above-mentioned stainless steel sheet, and a protective film is attached thereto, in addition to the above-mentioned "adhesion stability (SUS embossing sheet) )" Evaluation in the same way.

將關於各實施例及比較例之評價示於表2~5之「黏著穩定性(稜鏡板)」欄。 The evaluations of the respective examples and comparative examples are shown in the "adhesion stability (seesaw)" column of Tables 2 to 5.

[合成例1] [Synthesis Example 1]

於充分進行過氮氣置換之容量1.5升之附攪拌翼之SUS製高壓釜中於23℃下裝入4-甲基-1-戊烯750ml。於該高壓釜中裝入三異丁基鋁(TIBAL)之1.0mmol/ml甲苯溶液0.75ml,使攪拌機運轉。 750 ml of 4-methyl-1-pentene was charged at 23 ° C in a SUS autoclave having a stirring capacity of 1.5 liters which was sufficiently purged with nitrogen. To the autoclave, 0.75 ml of a 1.0 mmol/ml toluene solution of triisobutylaluminum (TIBAL) was placed, and the mixer was operated.

其次,將高壓釜加熱至內溫60℃,以使全壓成為0.13MPa(表壓)之方式利用丙烯進行加壓。繼而,利用氮氣將預先製備之甲基鋁氧烷以Al換算計1mmol、包含二苯基亞甲基(1-乙基-3-第三丁基-環戊二烯基)(2,7-二-第三丁基-茀基)二氯化鋯0.01mmol之甲苯溶液0.34ml壓入高壓釜,開始聚合。於聚合反應中以高壓釜內溫成為60 ℃之方式進行溫度調整。聚合開始60分鐘後,利用氮氣將甲醇5ml壓入高壓釜而停止聚合,將高壓釜釋壓至大氣壓。一面於反應溶液中注入丙酮一面進行攪拌。 Next, the autoclave was heated to an internal temperature of 60 ° C, and pressurized with propylene so that the total pressure became 0.13 MPa (gauge pressure). Then, the previously prepared methylaluminoxane was 1 mmol in terms of Al using nitrogen gas, and contained diphenylmethylene (1-ethyl-3-t-butyl-cyclopentadienyl) (2,7- A solution of 0.34 ml of a di-t-butyl-indenyl)zirconium dichloride 0.01 mmol toluene solution was introduced into the autoclave to start polymerization. In the polymerization reaction, the internal temperature of the autoclave becomes 60. Temperature adjustment in °C mode. After 60 minutes from the start of the polymerization, 5 ml of methanol was pressed into the autoclave with nitrogen gas to stop the polymerization, and the autoclave was released to atmospheric pressure. The mixture was stirred while injecting acetone into the reaction solution.

將所獲得之包含溶劑之粉末狀聚合體於100℃、減壓下乾燥12小時。所獲得之聚合物為36.9g,聚合物中之4-甲基-1-戊烯含量為72.5mol%,丙烯含量為27.5mol%。 The obtained powdery polymer containing a solvent was dried at 100 ° C for 12 hours under reduced pressure. The polymer obtained was 36.9 g, the content of 4-methyl-1-pentene in the polymer was 72.5 mol%, and the propylene content was 27.5 mol%.

[合成例2] [Synthesis Example 2]

於充分進行過氮氣置換之容量1.5升之附攪拌翼之SUS製高壓釜中於23℃下裝入正己烷300ml(於乾燥氮氣環境中於活性氧化鋁上乾燥者)、4-甲基-1-戊烯450ml。於該高壓釜中裝入三異丁基鋁(TIBAL)之1.0mmol/ml甲苯溶液0.75ml,使攪拌機運轉。 It was charged with 300 ml of n-hexane (drying on activated alumina in a dry nitrogen atmosphere) at a temperature of 23 ° C in a SUS autoclave with a capacity of 1.5 liters, which was sufficiently purged with nitrogen, 4-methyl-1. -pentene 450 ml. To the autoclave, 0.75 ml of a 1.0 mmol/ml toluene solution of triisobutylaluminum (TIBAL) was placed, and the mixer was operated.

其次,將高壓釜加熱至內溫60℃,以使全壓成為0.19MPa(表壓)之方式利用丙烯進行加壓。繼而,利用氮氣將預先製備之甲基鋁氧烷以Al換算計1mmol、包含二苯基亞甲基(1-乙基-3-第三丁基-環戊二烯基)(2,7-二-第三丁基-茀基)二氯化鋯0.01mmol之甲苯溶液0.34ml壓入高壓釜,開始聚合。於聚合反應中以高壓釜內溫成為60℃之方式進行溫度調整。聚合開始60分鐘後,利用氮氣將甲醇5ml壓入高壓釜而停止聚合,將高壓釜釋壓至大氣壓。一面於反應溶液中注入丙酮一面進行攪拌。 Next, the autoclave was heated to an internal temperature of 60 ° C, and pressurized with propylene so that the total pressure became 0.19 MPa (gauge pressure). Then, the previously prepared methylaluminoxane was 1 mmol in terms of Al using nitrogen gas, and contained diphenylmethylene (1-ethyl-3-t-butyl-cyclopentadienyl) (2,7- A solution of 0.34 ml of a di-t-butyl-indenyl)zirconium dichloride 0.01 mmol toluene solution was introduced into the autoclave to start polymerization. The temperature adjustment was carried out in the polymerization reaction so that the internal temperature of the autoclave became 60 °C. After 60 minutes from the start of the polymerization, 5 ml of methanol was pressed into the autoclave with nitrogen gas to stop the polymerization, and the autoclave was released to atmospheric pressure. The mixture was stirred while injecting acetone into the reaction solution.

將所獲得之包含溶劑之粉末狀聚合體於100℃、減壓下乾燥12小時。所獲得之聚合物為44.0g,聚合物中之4-甲基-1-戊烯含量為84.1mol%,丙烯含量為15.9mol%。 The obtained powdery polymer containing a solvent was dried at 100 ° C for 12 hours under reduced pressure. The polymer obtained was 44.0 g, the content of 4-methyl-1-pentene in the polymer was 84.1 mol%, and the propylene content was 15.9 mol%.

[合成例3] [Synthesis Example 3]

於充分進行過氮氣置換之容量1.5升之附攪拌翼之SUS製高壓釜中於23℃下裝入4-甲基-1-戊烯50ml。於該高壓釜中裝入三異丁基鋁(TIBAL)之1.0mmol/ml甲苯溶液0.75ml,使攪拌機運轉。其次,將高壓釜加熱至內溫30℃,以使全壓成為0.74MPa之方式利用丙烯進行加壓,添加氫12Nml。繼而,利用氮氣將預先製備之甲基鋁氧烷以Al換算計1mmol、包含二苯基亞甲基(1-甲基-3-第三丁基-環戊二烯基)(2,7-二-第三丁基-茀基)二氯化鋯0.005mmol之甲苯溶液0.34ml壓入高壓釜,開始聚合。其後60分鐘以高壓釜內溫成為60℃之方式進行溫度調整。聚合開始60分鐘後,利用氮氣將甲醇5ml壓入高壓釜而停止聚合,將高壓釜釋壓至大氣壓。一面於反應溶液中注入丙酮一面進行攪拌。將所獲得之包含溶劑之橡膠狀聚合體於130℃、減壓下乾燥12小時。所獲得之聚合物為78.1g,聚合物中之4-甲基-1-戊烯含量為8.9mol%,丙烯含量為91.1mol%。 To a SUS autoclave equipped with a stirring blade having a capacity of 1.5 liters sufficiently purged with nitrogen, 50 ml of 4-methyl-1-pentene was charged at 23 °C. To the autoclave, 0.75 ml of a 1.0 mmol/ml toluene solution of triisobutylaluminum (TIBAL) was placed, and the mixer was operated. Next, the autoclave was heated to an internal temperature of 30 ° C, and pressurized with propylene so that the total pressure became 0.74 MPa, and 12 N ml of hydrogen was added. Then, the previously prepared methylaluminoxane was 1 mmol in terms of Al using nitrogen gas, and contained diphenylmethylene (1-methyl-3-t-butyl-cyclopentadienyl) (2,7- A solution of 0.34 ml of a toluene solution of di-t-butyl-indenyl)zirconium dichloride (0.005 mmol) was pressed into an autoclave to start polymerization. Thereafter, the temperature was adjusted 60 minutes after the internal temperature of the autoclave became 60 °C. After 60 minutes from the start of the polymerization, 5 ml of methanol was pressed into the autoclave with nitrogen gas to stop the polymerization, and the autoclave was released to atmospheric pressure. The mixture was stirred while injecting acetone into the reaction solution. The obtained rubbery polymer containing a solvent was dried at 130 ° C for 12 hours under reduced pressure. The polymer obtained was 78.1 g, the content of 4-methyl-1-pentene in the polymer was 8.9 mol%, and the propylene content was 91.1 mol%.

[合成例4] [Synthesis Example 4]

於充分進行過氮氣置換之容量1.5升之附攪拌翼之SUS製高壓釜中於23℃下裝入4-甲基-1-戊烯750ml。於該高壓釜中裝入三異丁基鋁(TIBAL)之1.0mmol/ml甲苯溶液0.75ml,使攪拌機運轉。其次,將高壓釜加熱至內溫30℃,以使全壓成為0.74MPa之方式利用丙烯進行加壓,添加氫12Nml。繼而,利用氮氣將預先製備之甲基鋁氧烷以Al換算計1mmol、包含二苯基亞甲基(1-甲基-3-第三丁基-環戊二烯基)(2,7-二-第三丁基-茀基)二氯化鋯0.005mmol之甲苯溶液0.34ml壓入高壓釜,開始聚合。其後60分鐘以高壓釜內溫成為60℃之方式進行 溫度調整。聚合開始60分鐘後,利用氮氣將甲醇5ml壓入高壓釜而停止聚合,將高壓釜釋壓至大氣壓。一面於反應溶液中注入丙酮一面進行攪拌。將所獲得之包含溶劑之橡膠狀聚合體於130℃、減壓下乾燥12小時。所獲得之聚合物為56.3g,聚合物中之4-甲基-1-戊烯含量為24.7mol%,丙烯含量為75.3mol%。 750 ml of 4-methyl-1-pentene was charged at 23 ° C in a SUS autoclave having a stirring capacity of 1.5 liters which was sufficiently purged with nitrogen. To the autoclave, 0.75 ml of a 1.0 mmol/ml toluene solution of triisobutylaluminum (TIBAL) was placed, and the mixer was operated. Next, the autoclave was heated to an internal temperature of 30 ° C, and pressurized with propylene so that the total pressure became 0.74 MPa, and 12 N ml of hydrogen was added. Then, the previously prepared methylaluminoxane was 1 mmol in terms of Al using nitrogen gas, and contained diphenylmethylene (1-methyl-3-t-butyl-cyclopentadienyl) (2,7- A solution of 0.34 ml of a toluene solution of di-t-butyl-indenyl)zirconium dichloride (0.005 mmol) was pressed into an autoclave to start polymerization. In the next 60 minutes, the internal temperature of the autoclave became 60 ° C. Temperature adjustment. After 60 minutes from the start of the polymerization, 5 ml of methanol was pressed into the autoclave with nitrogen gas to stop the polymerization, and the autoclave was released to atmospheric pressure. The mixture was stirred while injecting acetone into the reaction solution. The obtained rubbery polymer containing a solvent was dried at 130 ° C for 12 hours under reduced pressure. The obtained polymer was 56.3 g, the content of 4-methyl-1-pentene in the polymer was 24.7 mol%, and the propylene content was 75.3 mol%.

[合成例5] [Synthesis Example 5]

於充分進行過氮氣置換之容量1.5升之附攪拌翼之SUS製高壓釜中於23℃下裝入4-甲基-1-戊烯750ml。於該高壓釜中裝入三異丁基鋁(TIBAL)之1.0mmol/ml甲苯溶液0.75ml,開始攪拌。 750 ml of 4-methyl-1-pentene was charged at 23 ° C in a SUS autoclave having a stirring capacity of 1.5 liters which was sufficiently purged with nitrogen. Into the autoclave, 0.75 ml of a 1.0 mmol/ml toluene solution of triisobutylaluminum (TIBAL) was placed, and stirring was started.

其次,將高壓釜加熱至內溫60℃,以使全壓成為0.17MPa之方式利用丙烯進行加壓。繼而,利用氮氣將預先製備之甲基鋁氧烷以Al換算計1mmol、包含二苯基亞甲基(1-乙基-3-第三丁基-環戊二烯基)(2,7-二-第三丁基-茀基)二氯化鋯0.005mmol之甲苯溶液0.34ml壓入高壓釜,開始聚合。於聚合反應中以高壓釜內溫成為60℃之方式進行溫度調整。聚合開始60分鐘後,利用氮氣將甲醇5ml壓入高壓釜而停止聚合,將高壓釜釋壓至大氣壓。一面於反應溶液中注入丙酮一面進行攪拌。 Next, the autoclave was heated to an internal temperature of 60 ° C, and pressurized with propylene so that the total pressure became 0.17 MPa. Then, the previously prepared methylaluminoxane was 1 mmol in terms of Al using nitrogen gas, and contained diphenylmethylene (1-ethyl-3-t-butyl-cyclopentadienyl) (2,7- A solution of 0.34 ml of a toluene solution of di-t-butyl-indenyl)zirconium dichloride (0.005 mmol) was pressed into an autoclave to start polymerization. The temperature adjustment was carried out in the polymerization reaction so that the internal temperature of the autoclave became 60 °C. After 60 minutes from the start of the polymerization, 5 ml of methanol was pressed into the autoclave with nitrogen gas to stop the polymerization, and the autoclave was released to atmospheric pressure. The mixture was stirred while injecting acetone into the reaction solution.

將所獲得之包含溶劑之粉末狀聚合體於130℃、減壓下乾燥12小時。所獲得之共聚合體之重量為32.0g,共聚合體中之4-甲基-1-戊烯含量為92.3mol%,丙烯含量為7.7mol%。 The obtained powdery polymer containing a solvent was dried at 130 ° C for 12 hours under reduced pressure. The weight of the obtained copolymer was 32.0 g, the content of 4-methyl-1-pentene in the copolymer was 92.3 mol%, and the propylene content was 7.7 mol%.

將上述合成例中所獲得之共聚合體之物性分別示於表1。 The physical properties of the copolymer obtained in the above synthesis examples are shown in Table 1, respectively.

[實施例1] [Example 1]

調配合成例1中所獲得之4-甲基-1-戊烯‧α-烯烴共聚合體20重量份、JSR股份有限公司製造之DYNARON(註冊商標)1320P(氫化苯乙烯-丁二烯-苯乙烯共聚合體(HSBR))80重量份、及作為耐熱穩定劑之正十八烷基-3-(4'-羥基-3',5'-二第三丁基苯基)丙酸酯0.2重量份。將所獲得之混合物作為黏著劑樹脂組成物,利用三種三層薄膜成形機進行成形,以多層薄膜之形態獲得積層體(表面保護薄膜),測定該積層體之物性。此處,獲得積層體時所採用之具體之成形條件如上述「積層體成形」項中所記載。將各種物性示於表2。 20 parts by weight of 4-methyl-1-pentene ‧ α -olefin copolymer obtained in Synthesis Example 1 and DYNARON (registered trademark) 1320P (hydrogenated styrene-butadiene-styrene) manufactured by JSR Co., Ltd. Copolymer (HSBR)) 80 parts by weight, and 0.2 parts by weight of n-octadecyl-3-(4'-hydroxy-3',5'-di-t-butylphenyl)propionate as a heat-resistant stabilizer . The obtained mixture was used as an adhesive resin composition, and was molded by three three-layer film forming machines to obtain a laminate (surface protective film) in the form of a multilayer film, and the physical properties of the laminate were measured. Here, the specific molding conditions to be used in obtaining the laminated body are as described in the above-mentioned "Laminated body forming". Various physical properties are shown in Table 2.

[實施例2] [Embodiment 2]

調配合成例1中所獲得之4-甲基-1-戊烯‧α-烯烴共聚合體30重量份、JSR股份有限公司製造之DYNARON(註冊商標)1320P(氫化苯乙烯-丁二烯-苯乙烯共聚合體(HSBR))70重量份、及作為耐熱穩定劑之正十八烷基-3-(4'-羥基-3',5'-二-第三丁基苯基)丙酸酯0.2重量份。將所獲得之混合物作為黏著劑樹脂組成物,其後利用三種三層薄膜成形機進行成形而獲得積層體(表面保護薄膜),測定該積層體之物性。此處,獲得積層體時所採用之具體之成形條件如上述「積層體成形」項中記載所述。將各種物性示於表2。 30 parts by weight of 4-methyl-1-pentene‧ α -olefin copolymer obtained in Synthesis Example 1 and DYNARON (registered trademark) 1320P (hydrogenated styrene-butadiene-styrene) manufactured by JSR Co., Ltd. Copolymer (HSBR)) 70 parts by weight, and n-octadecyl-3-(4'-hydroxy-3',5'-di-t-butylphenyl)propionate as a heat resistant stabilizer 0.2 weight Share. The obtained mixture was used as an adhesive resin composition, and then molded by three three-layer film forming machines to obtain a laminate (surface protective film), and the physical properties of the laminate were measured. Here, the specific molding conditions to be used in obtaining the laminated body are as described in the above-mentioned "Laminated body forming". Various physical properties are shown in Table 2.

[實施例3] [Example 3]

於黏著劑層中,代替使用合成例1中所獲得之4-甲基-1-戊烯‧α-烯烴共聚合體30重量份及JSR股份有限公司製造之DYNARON(註冊 商標)1320P(氫化苯乙烯-丁二烯-苯乙烯共聚合體(HSBR))70重量份,而變更為合成例1中所獲得之4-甲基-1-戊烯‧α-烯烴共聚合體50重量份與JSR股份有限公司製造之DYNARON(註冊商標)1320P(氫化苯乙烯-丁二烯-苯乙烯共聚合體(HSBR))50重量份,除此以外,進行與實施例2相同之操作,進行黏著劑樹脂組成物試樣之製備及成形,測定所獲得之積層體之物性。將各種物性示於表2。 In the adhesive layer, 30 parts by weight of the 4-methyl-1-pentene‧ α -olefin copolymer obtained in Synthesis Example 1 and DYNARON (registered trademark) 1320P (hydrogenated styrene) manufactured by JSR Co., Ltd. were used instead. 70 parts by weight of butadiene-styrene copolymer (HSBR), and changed to 50 parts by weight of 4-methyl-1-pentene ‧ α -olefin copolymer obtained in Synthesis Example 1 and JSR Co., Ltd. An adhesive resin composition sample was prepared in the same manner as in Example 2 except that 50 parts by weight of DYNARON (registered trademark) 1320P (hydrogenated styrene-butadiene-styrene copolymer (HSBR)) was produced. Preparation and molding, and measuring the physical properties of the obtained laminate. Various physical properties are shown in Table 2.

[比較例1] [Comparative Example 1]

於黏著劑層中,代替使用合成例1中所獲得之4-甲基-1-戊烯‧α-烯烴共聚合體20重量份及JSR股份有限公司製造之DYNARON(註冊商標)1320P(氫化苯乙烯-丁二烯-苯乙烯共聚合體(HSBR))80重量份,而使用JSR股份有限公司製造之DYNARON(註冊商標)1320P(氫化苯乙烯-丁二烯-苯乙烯共聚合體(HSBR))100重量份,除此以外,進行與實施例1相同之操作,進行黏著劑樹脂組成物試樣之製備及成形,測定所獲得之積層體之物性。將各種物性示於表3。 In the adhesive layer, 20 parts by weight of the 4-methyl-1-pentene‧ α -olefin copolymer obtained in Synthesis Example 1 and DYNARON (registered trademark) 1320P (hydrogenated styrene) manufactured by JSR Co., Ltd. were used instead. - Butadiene-styrene copolymer (HSBR)) 80 parts by weight, and DYNARON (registered trademark) 1320P (hydrogenated styrene-butadiene-styrene copolymer (HSBR)) manufactured by JSR Co., Ltd. 100 weight In the same manner as in Example 1, the same procedure as in Example 1 was carried out, and preparation and molding of a sample of the adhesive resin composition were carried out, and the physical properties of the obtained laminate were measured. Various physical properties are shown in Table 3.

[比較例2] [Comparative Example 2]

於黏著劑層中,代替使用合成例1中所獲得之4-甲基-1-戊烯‧α-烯烴共聚合體30重量份及JSR股份有限公司製造之DYNARON(註冊商標)1320P(氫化苯乙烯-丁二烯-苯乙烯共聚合體(HSBR))70重量份,而使用JSR股份有限公司製造之DYNARON(註冊商標)1320P(氫化苯乙烯-丁二烯-苯乙烯共聚合體(HSBR))100重量份,除此以外,進行與實施例2相同之操作,進行黏著劑樹脂組成物試樣之製備及成形,測定所獲得之積層體之物性。將各種物性示於表3。 In the adhesive layer, 30 parts by weight of the 4-methyl-1-pentene‧ α -olefin copolymer obtained in Synthesis Example 1 and DYNARON (registered trademark) 1320P (hydrogenated styrene) manufactured by JSR Co., Ltd. were used instead. - Butadiene-styrene copolymer (HSBR)) 70 parts by weight, and using DYNARON (registered trademark) 1320P (hydrogenated styrene-butadiene-styrene copolymer (HSBR)) manufactured by JSR Co., Ltd. 100 weight In the same manner as in Example 2, the preparation and molding of the sample of the adhesive resin composition were carried out, and the physical properties of the obtained laminate were measured. Various physical properties are shown in Table 3.

[比較例3] [Comparative Example 3]

於黏著劑層中,代替使用合成例1中所獲得之4-甲基-1-戊烯‧α-烯烴共聚合體30重量份及JSR股份有限公司製造之DYNARON(註冊商標)1320P(氫化苯乙烯-丁二烯-苯乙烯共聚合體(HSBR))70重量份,而使用合成例1中所獲得之4-甲基-1-戊烯‧α-烯烴共聚合體100重量份,除此以外,進行與實施例2相同之操作,進行黏著劑樹脂組成物試樣之製備及成形,測定所獲得之積層體之物性。將各種物性示於表3。 In the adhesive layer, 30 parts by weight of the 4-methyl-1-pentene‧ α -olefin copolymer obtained in Synthesis Example 1 and DYNARON (registered trademark) 1320P (hydrogenated styrene) manufactured by JSR Co., Ltd. were used instead. 70 parts by weight of butadiene-styrene copolymer (HSBR), and 100 parts by weight of 4-methyl-1-pentene ‧ α -olefin copolymer obtained in Synthesis Example 1 was used, and In the same manner as in Example 2, preparation and molding of a sample of the adhesive resin composition were carried out, and the physical properties of the obtained laminate were measured. Various physical properties are shown in Table 3.

[比較例4] [Comparative Example 4]

於黏著劑層中,代替使用合成例1中所獲得之4-甲基-1-戊烯‧α-烯烴共聚合體30重量份及JSR股份有限公司製造之DYNARON(註冊商標)1320P(氫化苯乙烯-丁二烯-苯乙烯共聚合體(HSBR))70重量份,而使用合成例2中所獲得之4-甲基-1-戊烯‧α-烯烴共聚合體100重量份,除此以外,進行與實施例2相同之操作,進行黏著劑樹脂組成物試樣之製備及成形,測定所獲得之積層體之物性。將各種物性示於表3。 In the adhesive layer, 30 parts by weight of the 4-methyl-1-pentene‧ α -olefin copolymer obtained in Synthesis Example 1 and DYNARON (registered trademark) 1320P (hydrogenated styrene) manufactured by JSR Co., Ltd. were used instead. 70 parts by weight of a butadiene-styrene copolymer (HSBR), and 100 parts by weight of a 4-methyl-1-pentene ‧ α -olefin copolymer obtained in Synthesis Example 2 was used. In the same manner as in Example 2, preparation and molding of a sample of the adhesive resin composition were carried out, and the physical properties of the obtained laminate were measured. Various physical properties are shown in Table 3.

[實施例4] [Example 4]

於黏著劑層中,代替使用合成例1中所獲得之4-甲基-1-戊烯‧α-烯烴共聚合體20重量份及JSR股份有限公司製造之DYNARON(註冊商標)1320P(氫化苯乙烯-丁二烯-苯乙烯共聚合體(HSBR))80重量份,而使用合成例2中所獲得之4-甲基-1-戊烯‧α-烯烴共聚合體5重量份及JSR股份有限公司製造之DYNARON(註冊商標)1320P(氫化苯乙烯-丁二烯-苯乙烯共聚合體(HSBR))95重量份,除此以外,進行與實施例1 相同之操作,進行黏著劑樹脂組成物試樣之製備及成形,測定所獲得之積層體之物性。將各種物性示於表2。 In the adhesive layer, 20 parts by weight of the 4-methyl-1-pentene‧ α -olefin copolymer obtained in Synthesis Example 1 and DYNARON (registered trademark) 1320P (hydrogenated styrene) manufactured by JSR Co., Ltd. were used instead. 80 parts by weight of butadiene-styrene copolymer (HSBR), and 5 parts by weight of 4-methyl-1-pentene ‧ α -olefin copolymer obtained in Synthesis Example 2, and manufactured by JSR Co., Ltd. An adhesive resin composition sample was prepared in the same manner as in Example 1 except that 95 parts by weight of DYNARON (registered trademark) 1320P (hydrogenated styrene-butadiene-styrene copolymer (HSBR)) was used. Preparation and molding, and measuring the physical properties of the obtained laminate. Various physical properties are shown in Table 2.

[實施例5] [Example 5]

將合成例1中所獲得之4-甲基-1-戊烯‧α-烯烴共聚合體20重量份變更為合成例2中所獲得之4-甲基-1-戊烯‧α-烯烴共聚合體20重量份,除此以外,進行與實施例1相同之操作,進行黏著劑樹脂組成物試樣之製備及成形,測定所獲得之積層體之物性。將各種物性示於表2。 The obtained in Synthesis Example 1 of 4-methyl-1-pentene ‧ α - olefin copolymer 20 parts by weight of the laminate was changed to 2 obtained in Synthesis Example of 4-methyl-1-pentene ‧ α - olefin copolymer assembly The preparation and molding of the sample of the adhesive resin composition were carried out in the same manner as in Example 1 except that 20 parts by weight, and the physical properties of the obtained laminate were measured. Various physical properties are shown in Table 2.

[實施例6] [Embodiment 6]

於黏著劑層中,代替使用合成例1中所獲得之4-甲基-1-戊烯‧α-烯烴共聚合體30重量份及JSR股份有限公司製造之DYNARON(註冊商標)1320P(氫化苯乙烯-丁二烯-苯乙烯共聚合體(HSBR))70重量份,而使用合成例1中所獲得之4-甲基-1-戊烯‧α-烯烴共聚合體30重量份與Kaneka股份有限公司製造之SIBSTAR(註冊商標)062M(苯乙烯-異丁烯-苯乙烯共聚合體(SIBS))70重量份,除此以外,進行與實施例2相同之操作,進行黏著劑樹脂組成物試樣之製備及成形,測定所獲得之積層體之物性。將各種物性示於表2。 In the adhesive layer, 30 parts by weight of the 4-methyl-1-pentene‧ α -olefin copolymer obtained in Synthesis Example 1 and DYNARON (registered trademark) 1320P (hydrogenated styrene) manufactured by JSR Co., Ltd. were used instead. 70 parts by weight of butadiene-styrene copolymer (HSBR), and 30 parts by weight of 4-methyl-1-pentene ‧ α -olefin copolymer obtained in Synthesis Example 1 was produced by Kaneka Co., Ltd. Preparation and formation of a sample of the adhesive resin composition were carried out in the same manner as in Example 2 except that 70 parts by weight of SIBSTAR (registered trademark) 062M (styrene-isobutylene-styrene copolymer (SIBS)) was used. The physical properties of the obtained laminate were measured. Various physical properties are shown in Table 2.

[實施例7] [Embodiment 7]

將JSR股份有限公司製造之DYNARON(註冊商標)1320P(氫化苯乙烯-丁二烯-苯乙烯共聚合體(HSBR))80重量份變更為Prime Polymer股份有限公司製造之EVOLUE(註冊商標)SP0540(乙烯-辛烯共聚合體(LLDPE))80重量份,除此以外,進行與實施例1相同之操作,進行黏著劑樹脂組成物試樣之製備及成形,測定所獲得之積層體之物性。將各種物性示於表4。 80 parts by weight of DYNARON (registered trademark) 1320P (hydrogenated styrene-butadiene-styrene copolymer (HSBR)) manufactured by JSR Co., Ltd. was changed to EVOLUE (registered trademark) SP0540 (ethylene) manufactured by Prime Polymer Co., Ltd. In the same manner as in Example 1, except that 80 parts by weight of the octene copolymer (LLDPE) was used, the preparation and molding of the sample of the adhesive resin composition were carried out, and the physical properties of the obtained laminate were measured. Various physical properties are shown in Table 4.

[實施例8] [Embodiment 8]

將JSR股份有限公司製造之DYNARON(註冊商標)1320P(氫化苯乙烯-丁二烯-苯乙烯共聚合體(HSBR))80重量份變更為三井化學股份有限公司製造之TAFMER(註冊商標)PN-2060(丙烯系彈性體(TPO)80重量份,除此以外,進行與實施例1相同之操作,進行黏著劑樹脂組成物試樣之製備及成形,測定所獲得之積層體之物性。將各種物性示於表4。 80 parts by weight of DYNARON (registered trademark) 1320P (hydrogenated styrene-butadiene-styrene copolymer (HSBR)) manufactured by JSR Co., Ltd. was changed to TAFMER (registered trademark) PN-2060 manufactured by Mitsui Chemicals Co., Ltd. In the same manner as in Example 1, except that 80 parts by weight of the propylene-based elastomer (TPO) was used, the preparation and molding of the sample of the adhesive resin composition were carried out, and the physical properties of the obtained laminate were measured. Shown in Table 4.

[實施例9] [Embodiment 9]

將JSR股份有限公司製造之DYNARON(註冊商標)1320P(氫化苯乙烯-丁二烯-苯乙烯共聚合體(HSBR))80重量份變更為Prime Polymer股份有限公司製造之Prime Polypro(註冊商標)MF257(PP))80重量份,除此以外,進行與實施例1相同之操作,進行黏著劑樹脂組成物試樣之製備及成形,測定所獲得之積層體之物性。將各種物性示於表4。 80 parts by weight of DYNARON (registered trademark) 1320P (hydrogenated styrene-butadiene-styrene copolymer (HSBR)) manufactured by JSR Co., Ltd. was changed to Prime Polypro (registered trademark) MF257 (produced by Prime Polymer Co., Ltd.) The same procedure as in Example 1 was carried out, except that the same procedure as in Example 1 was carried out, and the physical properties of the obtained laminate were measured. Various physical properties are shown in Table 4.

[實施例10] [Embodiment 10]

使用合成例2中所獲得之4-甲基-1-戊烯‧α-烯烴共聚合體20重量份代替合成例1中所獲得之4-甲基-1-戊烯‧α-烯烴共聚合體20重量份,除此以外,進行與實施例8相同之操作,進行黏著劑樹脂組成物試樣之製備及成形,測定所獲得之積層體之物性。將各種物性示於表4。 Synthesis Example 2 to obtain the 4-methyl-1-pentene ‧ α - olefin copolymer 20 parts by weight in place of assembly 1 obtained in Synthesis Example of 4-methyl-1-pentene ‧ α - olefin copolymer assembly 20 The same procedure as in Example 8 was carried out, and the preparation and molding of the sample of the adhesive resin composition were carried out, and the physical properties of the obtained laminate were measured. Various physical properties are shown in Table 4.

[比較例5] [Comparative Example 5]

於黏著劑層中,代替使用合成例1中所獲得之4-甲基-1-戊烯‧α-烯烴共聚合體20重量份及JSR股份有限公司製造之DYNARON(註冊商標)1320P(氫化苯乙烯-丁二烯-苯乙烯共聚合體(HSBR))80重量份,而使用JSR股份有限公司製造之DYNARON(註冊商標)1320P(氫化苯乙烯-丁二烯-苯乙烯共聚合體(HSBR))80重量份及三井化學股份有限公司性TAFMER(註冊商標)PN-2060 20重量份,除此以外,進行與實施例1相同之操作,進行黏著劑樹脂組成物試樣之製備及成形,測定所獲得之積層體之物性。將各種物性示於表5。 In the adhesive layer, 20 parts by weight of the 4-methyl-1-pentene‧ α -olefin copolymer obtained in Synthesis Example 1 and DYNARON (registered trademark) 1320P (hydrogenated styrene) manufactured by JSR Co., Ltd. were used instead. - Butadiene-styrene copolymer (HSBR)) 80 parts by weight, and using DYNARON (registered trademark) 1320P (hydrogenated styrene-butadiene-styrene copolymer (HSBR)) manufactured by JSR Co., Ltd. 80 weight In the same manner as in Example 1, except that 20 parts by weight of TAFMER (registered trademark) PN-2060 of Mitsui Chemicals Co., Ltd., the preparation and molding of the sample of the adhesive resin composition were carried out, and the obtained sample was obtained. The physical properties of the laminate. Various physical properties are shown in Table 5.

[比較例6] [Comparative Example 6]

於黏著劑層中,代替使用合成例1中所獲得之4-甲基-1-戊烯‧α-烯烴共聚合體20重量份及JSR股份有限公司製造之DYNARON(註冊商標)1320P(氫化苯乙烯-丁二烯-苯乙烯共聚合體(HSBR))80重量份,而使用Prime Polymer股份有限公司製造之EVOLUE(註冊商標)SP0540 80重量份及三井化學股份有限公司製造之TAFMER(註冊商標)PN-2060 20重量份,除此以外,進行與實施例1相同之操作,進行黏著劑樹脂組成物試樣之製備及成形,測定所獲得之積層體之物性。 將各種物性示於表5。 In the adhesive layer, 20 parts by weight of the 4-methyl-1-pentene‧ α -olefin copolymer obtained in Synthesis Example 1 and DYNARON (registered trademark) 1320P (hydrogenated styrene) manufactured by JSR Co., Ltd. were used instead. - 80 parts by weight of butadiene-styrene copolymer (HSBR), and EVOLUE (registered trademark) SP0540 80 parts by weight of Prime Polymer Co., Ltd. and TAFMER (registered trademark) PN manufactured by Mitsui Chemicals, Inc. In the same manner as in Example 1, except that 2060 parts by weight of 2060 parts by weight, the preparation and molding of the sample of the adhesive resin composition were carried out, and the physical properties of the obtained laminate were measured. Various physical properties are shown in Table 5.

[比較例7] [Comparative Example 7]

於黏著劑層中,代替使用合成例1中所獲得之4-甲基-1-戊烯‧α-烯烴共聚合體20重量份及JSR股份有限公司製造之DYNARON(註冊商標)1320P(氫化苯乙烯-丁二烯-苯乙烯共聚合體(HSBR))80重量份,而使用三井化學股份有限公司製造之TAFMER(註冊商標)PN-2060 100重量份,除此以外,進行與實施例1相同之操作,進行黏著劑樹脂組成物試樣之製備及成形,測定所獲得之積層體之物性。將各種物性示於表5。 In the adhesive layer, 20 parts by weight of the 4-methyl-1-pentene‧ α -olefin copolymer obtained in Synthesis Example 1 and DYNARON (registered trademark) 1320P (hydrogenated styrene) manufactured by JSR Co., Ltd. were used instead. - The same operation as in Example 1 except that 80 parts by weight of butadiene-styrene copolymer (HSBR) was used, and TAFMER (registered trademark) PN-2060 100 parts by weight manufactured by Mitsui Chemicals, Inc. was used. The preparation and molding of the sample of the adhesive resin composition were carried out, and the physical properties of the obtained laminate were measured. Various physical properties are shown in Table 5.

[比較例8] [Comparative Example 8]

於黏著劑層中,代替使用合成例1中所獲得之4-甲基-1-戊烯‧α-烯烴共聚合體20重量份及JSR股份有限公司製造之DYNARON(註冊商標)1320P(氫化苯乙烯-丁二烯-苯乙烯共聚合體(HSBR))80重量份,而使用三井化學股份有限公司製造之TAFMER(註冊商標)PN-2060 80重量份與JSR股份有限公司製造之DYNARON(註冊商標)1320P(氫化苯乙烯-丁二烯-苯乙烯共聚合體(HSBR))20重量份,除此以外,進行與實施例1相同之操作,進行黏著劑樹脂組成物試樣之製備及成形,測定所獲得之積層體之物性。將各種物性示於表5。 In the adhesive layer, 20 parts by weight of the 4-methyl-1-pentene‧ α -olefin copolymer obtained in Synthesis Example 1 and DYNARON (registered trademark) 1320P (hydrogenated styrene) manufactured by JSR Co., Ltd. were used instead. 80 parts by weight of a butadiene-styrene copolymer (HSBR), and TAFMER (registered trademark) PN-2060 80 parts by weight of Mitsui Chemicals Co., Ltd. and DYNARON (registered trademark) 1320P manufactured by JSR Co., Ltd. The same procedure as in Example 1 was carried out, except that 20 parts by weight of (hydrogenated styrene-butadiene-styrene copolymer (HSBR)) was used, and preparation and molding of a sample of the adhesive resin composition were carried out, and the measurement was obtained. The physical properties of the laminate. Various physical properties are shown in Table 5.

Claims (6)

一種表面保護薄膜,其包含積層體,該積層體具有:包含如下樹脂組成物之至少1層黏著劑層、及基材層;該樹脂組成物含有:滿足下述必要條件(a)、(b)、(c)及(d)之4-甲基-1-戊烯‧α-烯烴共聚合體(A)2~50重量份、及該4-甲基-1-戊烯‧α-烯烴共聚合體(A)以外之熱塑性樹脂(B)98~50重量份(其中,上述4-甲基-1-戊烯‧α-烯烴共聚合體(A)與上述熱塑性樹脂(B)之合計為100重量份):(a)包含由4-甲基-1-戊烯衍生之構成單位(i)65~90莫耳%與由α-烯烴(其中,4-甲基-1-戊烯除外)衍生之構成單位(ii)35~10莫耳%;(b)於十氫萘中135℃下測得之極限黏度[η]為0.1~5.0dL/g之範圍;(c)藉由凝膠滲透層析法(GPC)所測得之重量平均分子量(Mw)與數量平均分子量(Mn)之比例(分子量分佈,Mw/Mn)為1.0~3.5之範圍;(d)密度為870~830kg/m3之範圍。 A surface protective film comprising a laminate comprising at least one adhesive layer comprising a resin composition and a substrate layer; the resin composition comprising: satisfying the following requirements (a), (b) , (c) and (d) 4-methyl-1-pentene ‧ α - olefin copolymer (A) 2 to 50 parts by weight, and the copolymerization of the 4-methyl-1-pentene ‧ α - olefin 98 to 50 parts by weight of the thermoplastic resin (B) other than the combined (A) (wherein the total of the above 4-methyl-1-pentene ‧ α - olefin copolymer (A) and the above thermoplastic resin (B) is 100% by weight (a) comprising a constituent unit derived from 4-methyl-1-pentene (i) 65 to 90 mol% and derived from an α-olefin (excluding 4-methyl-1-pentene) The constituent unit (ii) is 35 to 10 mol%; (b) the ultimate viscosity [η] measured at 135 ° C in decalin is in the range of 0.1 to 5.0 dL/g; (c) by gel permeation. The ratio of the weight average molecular weight (Mw) to the number average molecular weight (Mn) measured by chromatography (GPC) (molecular weight distribution, Mw/Mn) is in the range of 1.0 to 3.5; (d) the density is 870 to 830 kg/m. The scope of 3 . 如申請專利範圍第1項之表面保護薄膜,其中,於上述必要條件(a)中,上述構成單位(i)之比例為80~90莫耳%,上述構成單位(ii)之比例為20~10莫耳%。 The surface protection film of claim 1, wherein in the above-mentioned requirement (a), the ratio of the constituent unit (i) is 80 to 90 mol%, and the ratio of the constituent unit (ii) is 20 10 moles %. 如申請專利範圍第1或2項之表面保護薄膜,其中,上述熱塑性樹脂(B)為苯乙烯系彈性體(B2)。 The surface protective film according to claim 1 or 2, wherein the thermoplastic resin (B) is a styrene-based elastomer (B2). 如申請專利範圍第1至3項中任一項之表面保護薄膜,其中,上述積層體係藉由T字模薄膜成形法所獲得之多層薄膜。 The surface protective film according to any one of claims 1 to 3, wherein the laminated system is a multilayer film obtained by a T-die film forming method. 一種表面之保護方法,其係使用申請專利範圍第3項之表面保護薄膜保護表面凹凸高度為0.1~300μm之面。 A method for protecting a surface, which uses a surface protection film of the third application of the patent application to protect a surface having a surface unevenness of 0.1 to 300 μm. 一種稜鏡薄片之保護方法,其係使用申請專利範圍第3項之表面保護薄膜保護稜鏡薄片。 A method for protecting a ruthenium sheet, which uses the surface protection film of the third application of the patent scope to protect the ruthenium sheet.
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