TW201508846A - Apparatus for mounting semiconductor dies - Google Patents

Abstract

An apparatus for mounting semiconductor dies is a package mechanism capable of performing die bonding or multi-die stacking. The apparatus comprises a first feeding mechanism, a second feeding mechanism, a pre-bonding module and a main bonding module. The first feeding mechanism and the second feeding mechanism respectively send substrates to where the pre-bonding module performs pre-bonding, and respectively send or hold the substrates at where the main bonding module performs main bonding. The pre-bonding module presses at least one die onto the substrate or another die on the substrate for pre-bonding. Afterward, the bonding heads included in the main bonding module simultaneously press pre-bonded dies and perform main bonding to affix the dies to a substrate or the dies on the substrate.

Description

Device for bonding semiconductor wafers

BACKGROUND OF THE INVENTION 1. Field of the Invention This invention relates to a device for attaching a semiconductor wafer, and more particularly to a package device for fabricating a semiconductor electronic component in a die bonding process.

In the entire semiconductor packaging process, the process immediately after the wafer dicing is a die-bonding (or solid crystal, top film or adhesive film) process, which is a separate wafer on the wafer after being cut by the scribe line ( Or the die; the die is sequentially placed on the lead frame or the substrate, and the lead frame and the wafer are firmly bonded to each other by an adhesive (for example, silver glue) or tape.

FIG. 1A is a schematic diagram of a main mechanism of a conventional die bonder. The substrate 5 is loaded by the left feed end of the transport rail 19, and the plurality of substrates 5 sequentially loaded are transported by the feed jaws 17 to the discharge end of the transport rail 19. The substrate 5 passes under the adhesive cylindrical container 8 and the dispensing head 9, and the adhesive in the container 8 is discharged through the dispensing head 9 to the units on the substrate 5. In addition, the pick-and-place mechanism 11 sequentially takes the wafer 10 on the wafer 15, and the wafer 15 is fixed on a film, and the film 10 is stretched by the expansion mechanism 12 to pull the wafers 10 away from each other. The wafer 10 picked up by the pick-and-place mechanism 11 is moved to the end of the transport rail 19 and moved downward until the wafer 10 is fixed to the glue on the substrate 5.

Since it takes a lot of time for the wafer 10 to be fixed on the substrate 5, especially for the wafer 10 of a larger area, it takes more time for the glue to be properly extruded around. If the adhesive material is replaced with a tape made of polyimide material, each wafer 10 requires more time, and it takes about 2 to 3 seconds to bond the wafer 10 and the substrate 5 effectively, so that the wafer 10 is obviously pressed. The process will become the bottleneck action of the conventional die bonder, that is, the unit per hour (UPH) will be affected and reduced. Compared to the use of adhesives, when tape is used to bond the wafer to the substrate 5, the throughput per hour is greatly reduced.

Due to the increased demand for thin package and multi-chip stacking packages, the thickness of the wafer needs to be reduced to 3 mils (about 76.2 μm). 1B is a schematic diagram of a multi-wafer stack package in which a plurality of wafers 10 are stacked on a substrate 5, and the sizes of the wafers may also be different. Since the overflow of the ultra-thin wafer is more difficult to control, the adhesive can no longer be used as a glue for the ultra-thin wafer. That is to say, the use of tape is a better choice for ultra-thin wafers. However, the above-mentioned adverse effects on the throughput per hour require a better solution or a design that can both meet the dual needs of mass production and quality.

In particular, the pick-and-place mechanism needs to be equipped with a special ejection mechanism when picking up the ultra-thin wafer, and a slower operation mode can ensure that the wafer does not break, which causes a large bottleneck of productivity, that is, an output per hour. It will be lower.

In addition to the poor production per unit time, the conventional die-clamping machine 17 is subjected to the severe test of the warpage of the substrate 5. Especially when working in a multi-chip module (MCM) package, the thin substrate 5 is warped by the baking temperature after the first die is adhered. The feeding jaws 17 are alternately transmitted to the discharge end by a relay. The warping of the substrate 5 often causes the feeding jaws 17 to be properly clamped and positioned when the hand is replaced, thereby causing collision between the substrate 5 and the conveying guide 19. And the card, Even the wafer 10 on the substrate 5 needs to be scrapped due to scratching or crystal collapse.

In summary, there is a need in the semiconductor packaging equipment market for a device that can significantly increase the yield per unit time and process quality of the bonded semiconductor wafer, and also reduce the downtime and scrap rate that should not be in the die bonding process.

The object of the present invention is to provide a device for bonding a semiconductor wafer, which is capable of simultaneously (or nearly simultaneously) performing a stepwise press-bonding of a die bond between a plurality of tracks by multi-track feeding and transporting a lead frame or a substrate. Significantly increase the unit time production of the unit.

Another object of the present invention is to provide a die bonding device with a pre-pressed and a main pressure segmented wafer-bonding function. The main pressing module for performing the main pressure further comprises a plurality of pressing heads, so that the pressing can be simultaneously performed. The wafers are fully integrated with the substrate and can be matched with the pre-compression time required to perform the pre-compression pre-compression module, thereby effectively increasing the unit time yield of the device.

Another object of the present invention is to provide a die bonding device for split-and-drop wafers, in which two multi-head mechanisms are respectively used as pre-pressing and crystal-splitting modules, and the wafers are successively taken from the wafer system to the lead frame or the substrate. Pressing and taking wafers can be processed simultaneously or almost simultaneously, thus effectively increasing the unit time yield of the device.

In order to achieve the above object, the present invention provides an apparatus for bonding a semiconductor wafer for attaching a wafer or a multi-wafer to a package carrier, comprising: a pre-press module that applies pressure to at least one wafer and a package carrier Or pre-compression of another wafer on a package carrier; a main compression module, comprising a plurality of compression heads, simultaneously pressing a plurality of pre-compressed wafers, and making the plurality of wafers and a package a plurality of wafers on the carrier or a package carrier for primary pressing; a first feed conveying mechanism; a second feeding conveying mechanism, the first feeding conveying mechanism and the second feeding conveying The mechanism respectively transmits the package carrier to the pre-pressing module to perform predetermined pressing, and respectively transmits or stops the pre-compressed package carrier to perform main pressing at the main pressing module; wherein the predetermined pressure The combination and the main pressing position can be respectively moved and located on the first feeding conveying mechanism and the second feeding conveying mechanism.

The invention further provides a device for bonding a semiconductor wafer, which is used for bonding a wafer or a multi-wafer on a package carrier, comprising: a pre-pressing module, applying pressure to at least one wafer and a package carrier or a package carrier The other wafer is pre-compressed; a main press-fit module, including a plurality of press-bonding heads, simultaneously presses a plurality of pre-compressed wafers, and the plurality of wafers and a package carrier or a package The plurality of wafers on the carrier are mainly pressed; and the plurality of feeding and conveying mechanisms can transport the package carrier in a carrier manner, and respectively transfer the package carrier to the pre-pressing module to perform predetermined pressing, and respectively transmit Or stopping the pre-compression of the package carrier to perform the main pressing of the main compression module, and directly and continuously reciprocally transfer the package carrier to press the pre-press module and the main pressure module to complete The multilayer wafer stack is laminated and saves time for repositioning the package carrier. Wherein the predetermined compression and the main compression are respectively located on the plurality of feed conveying mechanisms.

5‧‧‧Substrate

8‧‧‧Injection cylindrical container

9‧‧‧ dispensing head

10‧‧‧ wafer

11‧‧‧ pick-and-place mechanism

12‧‧‧Expansion agencies

15‧‧‧ wafer

17‧‧‧Feed jaws

19‧‧‧Conveyor rails

20‧‧‧Devices for attaching semiconductor wafers

21‧‧‧Material Transfer Module

22‧‧‧Preloading module

23‧‧‧Main compression module

24‧‧‧ Wafer Carrying Module

25‧‧‧ wafer pick and place module

26‧‧‧ Positioning station mechanism

29‧‧‧Output transfer mechanism

80~83‧‧‧Package carrier

27a‧‧‧Package carrier feeding mechanism

27b‧‧‧Package carrier discharge mechanism

211‧‧‧First feed conveyor

212‧‧‧Second feed conveying mechanism

221‧‧‧Remove the head

231‧‧‧ Pressing head

251‧‧‧Remove the head

291‧‧‧First Visual Identification Unit

292‧‧‧Second Visual Identity Unit

293‧‧‧ Third Visual Identification Unit

In order to facilitate further description of the embodiments, the following drawings are provided, wherein: FIG. 1A is a schematic diagram of a main mechanism of a conventional die bonder; FIG. 1B is a schematic structural view of a conventional wafer stack; FIG. 2A is a structure of the present invention. FIG. 2B is a schematic view of the third visual recognition unit of the present invention for taking an image on a package carrier; FIG. 3A is a schematic diagram of loading, pre-compression, and main pressing of the package carrier of the device of the present invention; 3B is a schematic diagram of loading, pre-compression, main pressing and unloading of a package carrier by the apparatus of the present invention; and FIG. 3C is a schematic diagram of loading, pre-compression, main pressing and unloading of the package carrier by the apparatus of the present invention.

The simplifications and clarity of the present invention are shown in the drawings, and the description and details of the features and techniques may be omitted to avoid unnecessarily obscuring the present invention. In addition, the elements in the drawings are not necessarily drawn to size. For example, the size of some of the elements in the figures may be exaggerated relative to other elements to help improve the understanding of the embodiments of the invention. The same reference numbers are used in the different drawings in the drawings.

The terms "first", "second", "third", "fourth", etc. (if any) in the specification and claims are used to distinguish between similar elements and do not have to be Sequence or chronological description. It is to be understood that the terms so used are interchangeable, where appropriate, such that the embodiments described herein can operate, for example, in a different order than those described or otherwise described herein. In addition, the terms "comprising," "comprising," and "having,", and,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,, Rather, it may include other elements that are not explicitly listed or such programs, methods, systems, projects, devices, or devices.

The terms "left", "right", "front", "back", "top", "bottom", "upper", "lower", etc. (if any) in the specification and claims are used to describe The purpose, without having to be considered a certain relative position. It is to be understood that the use of such terms is interchangeable, where appropriate, so that the embodiments described herein can operate in other or different orientations.

2A is a perspective view of the apparatus for adhering a semiconductor wafer of the present invention. The device 20 for bonding a semiconductor chip mainly comprises a material transfer module 21, a pre-press module 22 and a main press-fit module 23, and further comprises a wafer carrier module 24, a wafer pick-and-place module 25, and a fixed The stage mechanism 26, the package carrier feeding mechanism 27a, the package carrier discharging mechanism 27b, and the discharge conveying mechanism 28.

The wafer pick-and-place module 25 is used to pick up the wafer 10 of the wafer 15 on the wafer carrier module 24 and place the picked wafer 10 on the positioning stage mechanism 26. By capturing the image of the wafer 15 by the first visual recognition unit 291 above the wafer carrier module 24, the position and rotation angle of the wafer carrier module 24 can be identified and adjusted, and the wafer marks or incomplete wafers can be identified. The wafer pick-and-place module 25 is optimally picked up (or picked up) by the wafer. In the present embodiment, the wafer pick-and-place module 25 has two pick-and-place heads 251, so that the two wafers 10 can be picked up simultaneously or sequentially, which is advantageous for the unit time production of the lifting device. The number of the pick-and-place heads 251 is not limited by the embodiment, and may be one or three or more. When the wafer carrier module 24 (the wafer pick-and-place module 25) is picked up, the wafer 10 is placed on the positioning mechanism 26, and the positioning mechanism 26 can align the position and angle of the wafer 10 by the second visual recognition unit 292. The preload module 22 optimally picks up the wafer 15 from the positioning stage mechanism 26.

The pre-press module 22 moves the picked wafer 10 to the package carrier 80 on the material transfer module 21, and simultaneously applies a pressure to the wafer 10 and the package carrier 80 to temporarily bond the wafer 10 to the package carrier 80. The material transfer module 21 includes a first feed transport mechanism 211 and a second feed transport mechanism 212, on which the package carrier 80 is supplied from the package carrier feed mechanism 27a. In the present embodiment, the pre-press module 22 has two pick-and-place heads 221, so that the two wafers 10 can be picked up simultaneously or sequentially, which is advantageous for the unit time production of the lifting device. However, the number of the pick-and-place heads 221 is not limited by the embodiment, and may be one or three or more. The package carrier 80 described above is a substrate (such as a printed circuit board) or a lead frame.

First feed conveying mechanism 211 and second feeding conveying mechanism 212 (this hair It is not limited to two transport mechanisms, and the plurality of transport mechanisms are also claimed in the present invention) that the package carrier 80 is separately transferred to the pre-press module 22 to perform predetermined pressing, and the predetermined press-fit is respectively transmitted or stopped. The package carrier 80 performs the main compression at the main compression module 23. The pre-compression and the main compression are located at the positions set by the first feeding conveying mechanism 211 and the second feeding conveying mechanism 212, and can be designed according to the design of the pre-pressing module 22 and the main pressing module 23. For details, please refer to Figures 3A~3B and the corresponding description paragraphs. Moreover, the two feed conveying mechanisms can adjust the track width according to the size of the package carrier 80.

When one of the first feed transport mechanism 211 and the second feed transport mechanism 212 sends the package carrier 80 to the pre-compression, the package carrier 80 or the wafer thereon is placed with the pre-press module 22 The preliminary bonding between the wafers is performed, that is, the pre-pressing module 22 presses the wafer by the pick-and-place head 221 to perform pre-compression. By taking the image on the package carrier 80 by the third visual recognition unit 293, the initial fixing or stacking position of the wafer can be precisely controlled. When the pre-pressing module 22 sequentially bonds a plurality of wafers onto the package carrier 80, the other feeding mechanism sends or otherwise stops the pre-compressed package carrier 80 to the main pressing place. The plurality of press heads 231 of the press-fit module 23 apply a plurality of pre-compressed wafer surfaces together to fully bond the wafers to the package carrier 80 or wafer thereon. Thus, by performing the pre-pressing and the main-pressure bonding step between the multi-track conveying lines, the waiting time between the individual modules or the mechanisms can be effectively saved, thereby increasing the unit time production of the device 20. In addition, the wafers 10 fixed by the package carrier 80 on the first feed conveying mechanism 211 and the second feeding conveying mechanism 212 may be of different grades or classifications, for example, the first carrier conveying mechanism 211 is fixed by the package carrier 80. The wafer 10 is of the A grade or classification bin 1, and the wafer 10 fixed by the package carrier 80 on the second feed transport mechanism 212 may be of the B grade or the classification bin 2.

In the embodiment shown in FIG. 2B, the third visual recognition unit 293 takes an image on the package carrier 80 before the package carrier 80 or the wafer thereon and the wafer placed on the pre-press module 22 are initially bonded and fixed. At this time, the pick-and-place head 221 for adsorbing a wafer 10 is located at a predetermined fixed position on the package carrier 80. The third visual recognition unit 293 can respectively capture the images of the wafer 10 and the package carrier 80, and simultaneously capture the common image of the wafer 10 and the package carrier 80, by analyzing the relative positions of the wafer 10 and the package carrier 80 in the image. Precise control of the initial fixing or stacking position of the wafer.

In this embodiment, the main pressing module 23 has four pressing heads 231, but it is not limited by this embodiment, and may be one or plural. In addition, the plurality of pick and place heads 221 of the pre-press module 22 and the plurality of press heads 231 of the main press-fit module 23 can individually control the force (or pressure) applied to the surface of the wafer. That is, different strength adjustments can be made for different wafers 10 to optimize the combination of wafer 10 and package carrier 80.

The first feeding conveying mechanism 211 and the second feeding conveying mechanism 212 can select the moving carrier (as shown) to transfer the package carrier 80 to the pre-compression point and the main pressing place, so there is no similar jaw transfer transmission. The risk of jamming or interference caused by the action is particularly applicable to the package carrier 80 having a small thickness or a large amount of warpage. The package carrier feeding mechanism 27a can be repeatedly moved at the feeding ends of the first feeding conveying mechanism 211 and the second feeding conveying mechanism 212, and the package carrier 80 that needs to perform pre-compression is respectively loaded into the first feeding conveying mechanism. 211 and a second feed conveying mechanism 212. The discharge conveying mechanism 28 also repeatedly moves at the discharge ends of the first feeding conveying mechanism 211 and the second feeding conveying mechanism 212, accepts the package carrier 80 that has completed the main pressing step, and unloads it to the package carrier discharging mechanism. Within 27b. The package carrier discharge mechanism 27b can be selectively moved in the same manner as the discharge conveyor mechanism 28, so that the package carrier 80 is unloaded into the magazine on the package carrier discharge mechanism 27b.

3A and 3C are schematic diagrams showing the loading, pre-compression, and main pressing of the package carrier of the apparatus of the present invention, and FIG. 3B is a schematic diagram of loading, pre-compression, main pressing and unloading of the package carrier by the apparatus of the present invention. . In the present embodiment, the predetermined pressing points are respectively located at half of the first feeding conveying mechanism 211 and the second feeding conveying mechanism 212 away from the feeding section (the left side packaging carrier feeding mechanism 27a, not shown). The side, and the main compression, is located on the half of the second feed conveying mechanism 212 and the first feeding conveying mechanism 211 near the feeding section. However, the pre-compression and the main compression are not limited by this embodiment, and may depend on the range of motion and assembly position of the main compression module 23 and the pre-pressure module 22.

Referring to FIG. 3A, the package carrier 81 that needs to perform the pre-compression step is pre-compressed from the package carrier feeding mechanism 27a to the right first feeding mechanism 211, and the package carrier 81 or the wafer thereon is pre-compressed. A preliminary bond is fixed between the wafers placed by the module 22. While waiting for the pre-press module 22 to sequentially bond the plurality of wafers onto the package carrier 81, the second feed transport mechanism 212 stops the previously completed pre-pressed package carrier 82 at the main press-fit, the main pressure The module 23 will fully bond the wafers to the package carrier 82 or wafer thereon. The package carrier 82, which is primarily crimped, is transferred to the right to the discharge conveyor 28 as shown in Figure 3B. Or return to the pre-nip zone for pre-compression of the previous wafer, as shown in Figure 3C.

Referring to FIG. 3B, the first feeding and conveying mechanism 211 sends the pre-pressed package carrier 81 to the left to the main pressing position, and the main pressing module 23 is displaced from the second feeding mechanism 212. Above the feed conveying mechanism 211, a main pressing step of the package carrier 81 is performed. At the same time, the second feeding mechanism 212 can self-package the carrier feeding mechanism 27a, and the package carrier 83 that needs to perform the pre-compression step is sent to the right to the pre-compression point, and the pre-pressing module 22 can be self-positioning mechanism. 26 picking up the wafer 10 and crossing the first feed Above the transport mechanism 211, the wafers are initially bonded to the package carrier 83 or wafer thereon. The package carrier 81 that has completed the primary press will be transferred to the right to the discharge conveyor 28, and the discharge conveyor 28 will of course also be displaced downwardly to the right of the first feed conveyor 211 (not shown). The pre-compressed package carrier 83 can be moved to the left, waiting for the main compression module 23 to perform the main pressing step (the position of the package carrier 82 as shown in FIG. 3A). Since the feeding and conveying mechanism is a carrier, the feeding and conveying mechanisms 211 and 212 transfer the package carrier to and from the pre-compression and the main pressing, and the third visual positioning module 293 only needs to visually position the package carrier. The stacking of the multilayer wafers can be completed, thereby increasing the efficiency of production.

As described above, in the case of ultra-thin wafers, when it is bonded, it is necessary to use a film to adhere the ultra-thin wafer to the package carrier or the wafer thereon. The bonding of the film glue must be combined with the temperature and the pressing time to make the material nearly completely cured, usually taking 1 second to 2 seconds. Therefore, if the wafer is pick-and-placed and pressed by a conventional mechanism, the cycle time will be long (about 1.5 sec to 2.5 sec), which may result in inefficient production. If the pre-pressing and main pressing step is carried out, since the pre-compression operation requires about 0.1 sec, the cycle time of the entire pre-compression step can be 0.6 sec. In the embodiment of the present invention, the main pressing module has four pressing heads, and the pressing action takes about 2 sec, but the main pressing of the four wafers is completed at one time. Therefore, the cycle time of the main pressing step is about 0.6 sec. However, the pre-compression and primary compression stepping steps are performed in a sub-track and are performed almost simultaneously, so the cycle time of the entire pressing step is still about 0.6 sec, which is about 4 sec. of 2.5 sec required by the conventional mechanism. Therefore, the previous embodiment has an increase in production efficiency of about 4 times.

The front opening first feeding conveying mechanism 211, the two feeding conveying mechanism 212 and the discharging conveying mechanism 28 may comprise a conveying platform, a vacuum adsorption device or a clamping device to facilitate the conveying of the package carrier, and the first two may further have a heating device Can improve the curing of film glue.

The technical and technical features of the present invention have been disclosed as above, and those skilled in the art can still make various substitutions and modifications without departing from the spirit and scope of the invention. Therefore, the scope of the present invention should be construed as being limited by the scope of the appended claims

10‧‧‧ wafer

15‧‧‧ wafer

20‧‧‧Devices for attaching semiconductor wafers

21‧‧‧Material Transfer Module

22‧‧‧Preloading module

23‧‧‧Main compression module

24‧‧‧ Wafer Carrying Module

25‧‧‧ wafer pick and place module

26‧‧‧ Positioning station mechanism

28‧‧‧Output transfer mechanism

80‧‧‧Package carrier

27a‧‧‧Package carrier feeding mechanism

27b‧‧‧Package carrier discharge mechanism

211‧‧‧First feed conveyor

212‧‧‧Second feed conveying mechanism

221‧‧‧Remove the head

231‧‧‧ Pressing head

251‧‧‧Remove the head

291‧‧‧First Visual Identification Unit

292‧‧‧Second Visual Identity Unit

293‧‧‧ Third Visual Identification Unit

Claims (12)

A device for attaching a semiconductor wafer for bonding a wafer or a multi-wafer to a package carrier, comprising: a pre-press module that picks up and applies pressure to at least one wafer and a package carrier or a package carrier The other wafer is pre-compressed; a main press-fit module comprising a plurality of press-bonding heads simultaneously presses a plurality of pre-compressed wafers, and the plurality of wafers and a package carrier or a package carrier The plurality of wafers are subjected to main pressing; a first feeding conveying mechanism; and a second feeding conveying mechanism, the first feeding conveying mechanism and the second feeding conveying mechanism respectively conveying the package carrier to the pre-feed The pressing module performs a predetermined pressing, and respectively transfers or stops the pre-compressed package carrier to perform main pressing at the main pressing module; wherein the predetermined pressing portion and the main pressing portion Each of the locations is located on the first feed conveying mechanism and the second feeding conveying mechanism. The device for attaching a semiconductor wafer according to claim 1, further comprising: a wafer carrying module, carrying a wafer, the wafer comprising a plurality of wafers; and a wafer pick-and-place module comprising at least one Receiving a pick-up head, picking up at least one wafer from the wafer on the wafer carrying module; and a positioning stage mechanism for the wafer pick-and-place module to place the wafer and adjusting the position or angle of the wafer; The pre-press module includes at least one pick-and-place head from which at least one wafer is picked up and placed on a package carrier. The device for attaching a semiconductor wafer according to claim 1, further comprising a discharge conveying mechanism, wherein the discharge conveying mechanism receives the completion from the first feeding conveying mechanism and the second feeding conveying mechanism The main packaged package carrier. The device for attaching a semiconductor wafer according to claim 2, wherein the wafer pick-and-place module simultaneously or sequentially picks up two or more wafers having a thickness of 3 mil or less. The device for attaching a semiconductor wafer according to claim 1, wherein the first feeding conveying mechanism and the second feeding conveying mechanism respectively transfer the package carrier by a single stage, and the stage reciprocates And loading the package carrier between the predetermined pressing of the pre-pressing module and the main pressing of the main pressing module. The device for attaching a semiconductor wafer according to claim 2, wherein the pre-press module comprises at least two pick-and-place heads, and the main press-fit module comprises at least two press-fit heads, and the wafer pick-and-place module Includes at least two pick and place heads. The device for attaching a semiconductor wafer according to claim 2, further comprising: a first visual identification unit disposed on the wafer carrier module for capturing an image of the wafer; A second visual recognition unit is disposed on the positioning mechanism to capture an image of the wafer on the positioning mechanism. The device for attaching a semiconductor wafer according to claim 1, further comprising a third visual identification unit, wherein the third visual recognition unit is located at the first feeding conveying mechanism and the second feeding The package carrier on the transport mechanism, wherein the pre-press module captures the image of the package carrier by the third visual recognition unit, and controls the position of the wafer to be fixed to the package carrier. The device for bonding a semiconductor wafer according to claim 1, wherein the pre-pressing module is pre-compressed on one of the first feeding conveying mechanism and the second feeding conveying mechanism, and After the main pressing and closing module performs the main pressing on the other of the other, and after the pre-compression and the main pressing are completed, the first feeding conveying mechanism and the second feeding conveying mechanism are respectively exchanged for pre-compression. Combined with the main press. The device for attaching a semiconductor wafer according to claim 1, wherein the first feeding mechanism and the chip feeding mechanism of the second feeding mechanism are different grades or classifications. The device for attaching a semiconductor wafer according to claim 8, wherein the third visual recognition unit respectively captures an image of the wafer and the package carrier, or simultaneously captures a common image of the wafer and the package carrier. The device for bonding a semiconductor wafer according to claim 6, wherein at least two pick and place heads of the pre-pressing module individually control the force applied to the wafer, and at least two of the main pressing modules The press head individually controls the force applied to the wafer.