TW201508569A - 可撓式觸控結構及採用該可撓式觸控結構之手錶或首飾 - Google Patents

可撓式觸控結構及採用該可撓式觸控結構之手錶或首飾 Download PDF

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TW201508569A
TW201508569A TW102129616A TW102129616A TW201508569A TW 201508569 A TW201508569 A TW 201508569A TW 102129616 A TW102129616 A TW 102129616A TW 102129616 A TW102129616 A TW 102129616A TW 201508569 A TW201508569 A TW 201508569A
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layer
fpc
touch
cathode
joint
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Kuang-Yao Liao
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Hon Hai Prec Ind Co Ltd
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    • H01—ELECTRIC ELEMENTS
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    • H01M6/00—Primary cells; Manufacture thereof
    • H01M6/40—Printed batteries, e.g. thin film batteries
    • G—PHYSICS
    • G04—HOROLOGY
    • G04G—ELECTRONIC TIME-PIECES
    • G04G21/00—Input or output devices integrated in time-pieces
    • G04G21/08—Touch switches specially adapted for time-pieces
    • G—PHYSICS
    • G06—COMPUTING; CALCULATING OR COUNTING
    • G06F—ELECTRIC DIGITAL DATA PROCESSING
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    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/0277—Bendability or stretchability details
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    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
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    • H05K1/16—Printed circuits incorporating printed electric components, e.g. printed resistor, capacitor, inductor
    • G—PHYSICS
    • G06—COMPUTING; CALCULATING OR COUNTING
    • G06F—ELECTRIC DIGITAL DATA PROCESSING
    • G06F2203/00—Indexing scheme relating to G06F3/00 - G06F3/048
    • G06F2203/041—Indexing scheme relating to G06F3/041 - G06F3/045
    • G06F2203/04102—Flexible digitiser, i.e. constructional details for allowing the whole digitising part of a device to be flexed or rolled like a sheet of paper
    • G—PHYSICS
    • G06—COMPUTING; CALCULATING OR COUNTING
    • G06F—ELECTRIC DIGITAL DATA PROCESSING
    • G06F2203/00—Indexing scheme relating to G06F3/00 - G06F3/048
    • G06F2203/041—Indexing scheme relating to G06F3/041 - G06F3/045
    • G06F2203/04103—Manufacturing, i.e. details related to manufacturing processes specially suited for touch sensitive devices
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01M—PROCESSES OR MEANS, e.g. BATTERIES, FOR THE DIRECT CONVERSION OF CHEMICAL ENERGY INTO ELECTRICAL ENERGY
    • H01M2220/00—Batteries for particular applications
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    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
    • H05K2201/10007—Types of components
    • H05K2201/10037—Printed or non-printed battery
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
    • H05K2201/10007—Types of components
    • H05K2201/10053—Switch
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/11—Treatments characterised by their effect, e.g. heating, cooling, roughening
    • H05K2203/1147—Sealing or impregnating, e.g. of pores
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    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/22—Secondary treatment of printed circuits
    • H05K3/28—Applying non-metallic protective coatings
    • H05K3/284—Applying non-metallic protective coatings for encapsulating mounted components
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
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    • H05K3/46—Manufacturing multilayer circuits
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
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    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
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Abstract

一種可撓式觸控結構，其包括薄膜電池、觸控模組以及顯示模組，該薄膜電池、觸控模組及顯示模組均具有撓性，該薄膜電池包括依次電性連接之陰極接頭層、陰極層、電解質層、陽極層、FPC接頭層以及接地層，該薄膜電池還包括設置於該陰極層、電解質層、陽極層週緣之連接層，該陰極接頭層藉由該連接層與該FPC接頭層連接，該FPC接頭層上設置有電路接腳以與該陽極層及該陰極接頭層電性連接，該觸控模組包括電性連接之FPC觸控訊號層與FPC觸控層，該顯示模組設置於該FPC觸控層之一側。本發明還提供一種電子手錶及首飾。

Description

可撓式觸控結構及採用該可撓式觸控結構之手錶或首飾
本發明涉及一種可撓式觸控結構，尤其涉及一種具有薄膜電池之可撓式觸控結構及採用該可撓式觸控結構之手錶或首飾。
由於可撓式觸控屏具有較好之可操控性，故而廣泛應用於電子產品中。例如，將可撓性觸控屏裝設於具有薄膜電池之電子手錶上，現有之做法是將可撓式觸控屏及與其電性連接之電路結構從別處採購或者採用其他之生產工序製成後，再和薄膜電池一併裝設於電子手錶內。然，將可撓式觸控屏及其電路結構、薄膜電池及其電路結構分散設置於電子手錶內，使得電子手錶之錶帶厚度較厚，體積較大，且撓性不足。
鑒於上述內容，有必要提供一種體積較小、撓性較好之可撓式觸控結構及採用該可撓式觸控結構之手錶或首飾。
一種可撓式觸控結構，其包括薄膜電池、觸控模組以及顯示模組，該薄膜電池、觸控模組及顯示模組均具有撓性，該薄膜電池包括依次電性連接之陰極接頭層、陰極層、電解質層、陽極層、FPC接頭層以及接地層，該薄膜電池還包括設置於該陰極層、電解質層、陽極層週緣處之連接層，該陰極接頭層藉由該連接層與該FPC接頭層連接，該FPC接頭層上設置有電路接腳以與該陽極層及及該陰極接頭層電性連接，該觸控模組包括電性連接之FPC觸控訊號層與FPC觸控層，該FPC觸控訊號層設置於該接地層遠離該FPC接頭層之一側，該FPC觸控層處於該FPC觸控訊號層遠離該接地層之一側，該顯示模組設置於該FPC觸控層背離該FPC觸控訊號層之一側。
一種電子手錶，其包括錶盤及與錶盤連接之錶帶，該錶帶上具有裝設部，該裝設部具有撓性，該錶盤裝設收容於裝設部內，其包括可撓式觸控結構，該可撓式觸控結構包括薄膜電池、觸控模組以及顯示模組，該薄膜電池、觸控模組及顯示模組均具有撓性，該薄膜電池包括依次電性連接之陰極接頭層、陰極層、電解質層、陽極層、FPC接頭層以及接地層，該薄膜電池還包括設置於該陰極層、電解質層、陽極層週緣處之連接層，該陰極接頭層藉由該連接層與該FPC接頭層連接，該FPC接頭層上設置有電路接腳以與該陽極層及及該陰極接頭層電性連接，該觸控模組包括電性連接之FPC觸控訊號層與FPC觸控層，該FPC觸控訊號層設置於該接地層遠離該FPC接頭層之一側，該FPC觸控層處於該FPC觸控訊號層遠離該接地層之一側，該顯示模組設置於該FPC觸控層背離該FPC觸控訊號層之一側，該陰極接頭層處於該裝設部底部，該顯示模組露出於該裝設部外部。
一種具有可撓式觸控結構之首飾，該首飾具有撓性，且包括上述可撓式觸控結構。
由於薄膜電池之FPC接頭層及接地層與該觸控模組集成於一塊FPC板上，使得該可撓式觸控結構之整體厚度相對較小，體積較小且相對增加了其撓性。
100‧‧‧電子手錶
10‧‧‧錶盤
30‧‧‧錶帶
31‧‧‧裝設部
11‧‧‧可撓式觸控結構
111‧‧‧薄膜電池
1111‧‧‧封裝層
1112‧‧‧陰極接頭層
1113‧‧‧陰極層
1114‧‧‧電解質層
1115‧‧‧陽極層
1116‧‧‧FPC接頭層
11161‧‧‧電路接腳
1117‧‧‧接地層
1118‧‧‧封填層
1119‧‧‧連接層
113‧‧‧觸控模組
1131‧‧‧FPC觸控訊號層
1133‧‧‧FPC觸控層
1135‧‧‧導光層
115‧‧‧顯示模組
圖1係本發明實施方式之電子手錶立體示意圖。
圖2係圖1所示電子手錶沿II-II之剖面示意圖。
請參閱圖1，本發明實施方式之可撓式觸控結構11裝設於電子裝置100上。該電子裝置100為智慧型手錶，其包括錶盤10及與錶盤10連接之錶帶30。錶帶30上具有裝設部31，錶盤10裝設收容於裝設部31內，其包括上述可撓式觸控結構11、微處理器以及記憶體條等。於本實施方式中，裝設部31為可撓式軟質膠框，用以裝設錶盤10。可理解，可撓式觸控結構100亦可應用於首飾、醫療用含觸控屏之衣服等。
請參閱圖2，錶盤10收容於裝設部31中，其包括可撓式觸控結構11以及設置於裝設部31內之電子線路(圖未示)。可撓式觸控結構11包括處於裝設部31底部之薄膜電池111、裝設於薄膜電池111上之觸控模組113，以及露出於裝設部31外側之顯示模組115。薄膜電池111、觸控模組113以及顯示模組115均具有撓性。薄膜電池111包括依次層疊設置之封裝層1111、陰極接頭層1112、陰極層1113、電解質層1114、陽極層1115、FPC接頭層1116 (FPC，Flexible Printed Circuit)，以及接地層1117。封裝層1111設置於裝設部31之底部。陰極接頭層1112與封裝層1111面積大小相一致。陰極層1113、電解質層1114以及陽極層1115面積大小相一致且小於陰極接頭層1112。陰極層1113、電解質層1114以及陽極層1115之週緣包覆一層封填層1118。封填層1118為環狀，其上下兩側與陰極接頭層1112及FPC接頭層1116緊密貼合。封填層1118一側還設置有連接層1119，連接層1119處於遠離裝設部31側壁之一側且其兩端分別與陰極接頭層1112及FPC接頭層1116，以將陰極接頭層1112之電勢饋入FPC接頭層1116。陽極層1115與FPC接頭層1116電性連接以將電勢饋入FPC接頭層1116。FPC接頭層1116一側凸伸於連接層1119外並裝設有電路接腳11161與陽極層115及陰極接頭層116相連。FPC接頭層1116與接地層1117之週緣緊密抵持於裝設部31內壁上。接地層1117與FPC接頭層1116之間設置有絕緣薄膜以隔開。
觸控模組113週緣緊密貼合抵持於裝設部31內壁上，其包括面積與接地層1117一致之FPC觸控訊號層1131、FPC觸控層1133以及導光層1135。導光層1135之一側設有LED光源(圖未示)。FPC觸控訊號層1131藉由絕緣薄膜疊置於接地層1117上，FPC觸控層1133藉由絕緣薄膜疊置於FPC觸控訊號層1131上，導光層1135貼合覆蓋於FPC觸控層1133上。於本實施方式中，FPC接頭層1116、接地層1117、FPC觸控訊號層1131、FPC觸控層1133以及導光層1135均為於一塊多層FPC軟板板上蝕刻而成。FPC接頭層1116、接地層1117、FPC觸控訊號層1131及FPC觸控層1133互相電性連接。
顯示模組115緊密貼合設置於導光層1135上，用於顯示圖像。顯示模組115露出於裝設部31外側，其週緣緊密貼合於裝設部31之內壁上。
使用時，薄膜電池111藉由電路接腳11161向可撓式觸控結構11供電，FPC觸控訊號層1131與FPC觸控層1133電性連接以與顯示模組115上顯示日期，時間，星期等資訊。
由於將FPC觸控訊號層1131及FPC觸控層1133與薄膜電池111之FPC接頭層1116、接地層1117、導光層1135集成於一塊FPC板上且由一次製作而成，使得可撓式觸控結構11之整體厚度相對較小，進而使之其體積較小且相對增加了其撓性。
可理解，FPC觸控訊號層1131亦可圍繞封填層1118週邊設置，從而進一步減小可撓式觸控結構11之厚度。可理解，亦可使薄膜電池111之尺寸遠小於顯示模組115之尺寸。
綜上所述，本發明符合發明專利要件，爰依法提出專利申請。惟，以上該者僅為本發明之較佳實施例，舉凡熟悉本案技藝之人士，在爰依本發明精神所作之等效修飾或變化，皆應涵蓋於以下之如申請專利範圍內。
無
11‧‧‧可撓式觸控結構
111‧‧‧薄膜電池
1111‧‧‧封裝層
1112‧‧‧陰極接頭層
1113‧‧‧陰極層
1114‧‧‧電解質層
1115‧‧‧陽極層
1116‧‧‧FPC接頭層
11161‧‧‧電路接腳
1117‧‧‧接地層
1118‧‧‧封填層
1119‧‧‧連接層
113‧‧‧觸控模組
1131‧‧‧FPC觸控訊號層
1133‧‧‧FPC觸控層
1135‧‧‧導光層
115‧‧‧顯示模組

Claims (9)

  1. 一種可撓式觸控結構，其包括薄膜電池、觸控模組以及顯示模組，該薄膜電池、觸控模組及顯示模組均具有撓性，其改良在於：該薄膜電池包括依次電性連接之陰極接頭層、陰極層、電解質層、陽極層、FPC接頭層以及接地層，該薄膜電池還包括設置於該陰極層、電解質層、陽極層週緣處之連接層，該陰極接頭層藉由該連接層與該FPC接頭層連接，該FPC接頭層上設置有電路接腳以與該陽極層及及該陰極接頭層電性連接，該觸控模組包括電性連接之FPC觸控訊號層與FPC觸控層，該FPC觸控訊號層設置於該接地層遠離該FPC接頭層之一側，該FPC觸控層處於該FPC觸控訊號層遠離該接地層之一側，該顯示模組設置於該FPC觸控層背離該FPC觸控訊號層之一側。
  2. 如申請專利範圍第1項所述之可撓式觸控結構，其中該薄膜電池還包括設置於該陰極接頭層遠離該陰極層一側之封裝層，該觸控模組還包括導光層，該導光層設置於該顯示模組與該FPC觸控層之間。
  3. 如申請專利範圍第2項所述之可撓式觸控結構，其中該陰極接頭層與該封裝層面積相等，該陰極層、電解質層以及陽極層面積大小相等且小於該陰極接頭層之面積，該陰極層、該電解質層以及該陽極層週緣週邊包覆一層封填層。
  4. 如申請專利範圍第3項所述之可撓式觸控結構，其中該封填層為環狀，其上下兩側與該陰極接頭層及該FPC接頭層緊密貼合。
  5. 如申請專利範圍第4項所述之可撓式觸控結構，其中該連接層設置于該封填層之一側，且其兩端分別與該陰極接頭層及該FPC接頭層，以該陰極接頭層之電勢饋該FPC接頭層，該陽極層與該FPC接頭層電性連接以將電勢饋入該FPC接頭層。
  6. 如申請專利範圍第5項所述之可撓式觸控結構，其中該導光層貼合覆蓋於該FPC觸控層上，其該FPC接頭層、該接地層、該FPC觸控訊號層以及該FPC觸控層互相電性連接。
  7. 一種電子手錶，其包括錶盤及與錶盤連接之錶帶，該錶帶上具有裝設部，該裝設部具有撓性，該錶盤裝設收容於裝設部內，其包括可撓式觸控結構，該可撓式觸控結構包括薄膜電池、觸控模組以及顯示模組，該薄膜電池、觸控模組及顯示模組均具有撓性，其改良在於：該薄膜電池包括依次電性連接之陰極接頭層、陰極層、電解質層、陽極層、FPC接頭層以及接地層，該薄膜電池還包括設置於該陰極層、電解質層、陽極層週緣處之連接層，該陰極接頭層藉由該連接層與該FPC接頭層連接，該FPC接頭層上設置有電路接腳以與該陽極層及及該陰極接頭層電性連接，該觸控模組包括電性連接之FPC觸控訊號層與FPC觸控層，該FPC觸控訊號層設置於該接地層遠離該FPC接頭層之一側，該FPC觸控層處於該FPC觸控訊號層遠離該接地層之一側，該顯示模組設置於該FPC觸控層背離該FPC觸控訊號層之一側，該陰極接頭層處於該裝設部底部，該顯示模組露出於該裝設部外部。
  8. 如申請專利範圍第7項所述之電子手錶，其中該薄膜電池還包括設置於該陰極接頭層遠離該陰極層一側之封裝層，該封裝層貼合設置於該裝設部底部，該觸控模組還包括導光層，該導光層設置於該顯示模組與該FPC觸控層之間。
  9. 一種具有可撓式觸控結構之首飾，其改良在於：所述首飾具有撓性，且包括申請專利範圍第1項所述可撓式觸控結構。
TW102129616A 2013-08-19 2013-08-19 可撓式觸控結構及採用該可撓式觸控結構之手錶或首飾 TW201508569A (zh)

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