TW201507807A - A chemical mechanical polishing conditioner made from woven preform - Google Patents

Abstract

The present invention relates to a chemical mechanical polishing conditioner made from woven preform, comprising: a substrate; a bonding layer disposed on the substrate; and a plurality of abrasive particle placed on the bonding layer; wherein the bonding layer is formed by heat and cure a woven preform, and the plurality of abrasive particle fixed to woven preform in advance. Therefore, the present invention can provide the bonding layer with a better flexibility by the woven preform, and improve the previous problem that resin residue in powdered bonding layer, or a sheeted bonding layer causes thermal cracking or thermal deformation during the heating and curing process, and thus the polishing performance and service time of the chemical mechanical polishing conditioner.

Description

Chemical mechanical polishing dresser made of woven preform

The present invention relates to a chemical mechanical polishing dresser, and more particularly to a chemical mechanical polishing dresser made of a woven preform.

Chemical Mechanical Polishing (CMP) is a common grinding process in various industries. The surface of various articles can be ground using a chemical polishing process, including ceramic, tantalum, glass, quartz, or metal wafers. In addition, with the rapid development of integrated circuits, chemical mechanical polishing can achieve large-area planarization, so it is one of the common wafer planarization techniques in semiconductor manufacturing.

In the chemical mechanical polishing process of semiconductors, the wafers (or other semiconductor components) are contacted by a polishing pad (Pad), and the polishing liquid is used in combination with the polishing pad to remove the wafer by chemical reaction and physical mechanical advantage. Impurity or uneven structure on the surface; when the polishing pad is used for a certain period of time, the grinding effect and efficiency are reduced due to the accumulation of grinding debris generated by the grinding process on the surface of the polishing pad, so the conditioner can be used The surface of the sanding pad is ground to re-roughen the surface of the polishing pad and maintain the optimum grinding state. However, in the preparation process of the dresser, the polishing layer formed by mixing the abrasive particles and the bonding layer is required to be disposed on the surface of the substrate, and the polishing layer is fixedly bonded to the surface of the substrate by hardening such as brazing or sintering.

At present, in the manufacturing method of the chemical mechanical polishing dresser, the powder-like bonding layer (that is, using metal powder or solder alloy powder as a bonding layer) or a sheet-like bonding layer (ie, using a metal or solder powder by vacuum extrusion) is mainly used. Formed as a bonding layer sheet; only in the hardening process of the bonding layer (or the polishing layer), since the powdery bonding layer often requires an additional adhesive (for example, an organic resin), the powdery bonding layer can be formed into a semi-cured layer. a sheet-like preform, however, the adhesive often remains in the bonding layer during heat hardening, and the bonding strength between the bonding layer and the abrasive particles or the substrate is lowered, thereby deteriorating the quality and performance of the chemical mechanical polishing dresser; Since the sheet-like bonding layer is formed by vacuum extrusion treatment, the flexibility of the sheet-like bonding layer is not good, and defects of thermal cracking often occur in the heat hardening process, thereby affecting the polishing efficiency of the chemical mechanical polishing dresser. And service life.

In the known technology, for example, the Republic of China Announcement Patent No. M323370 discloses a double-sided abrasive cloth structure with chip discharge, especially for the abrasive cloth which can only be single-sidedly polished, which can quickly reduce the grinding efficiency and accelerate the deterioration of the abrasive cloth structure. An innovative structure with improved shortcomings such as service life; comprising a mesh layer woven into a mesh with longitudinal and transverse woven threads, and a diamond-coated layer on the front and rear side surfaces to form a double-sided abrasive cloth having a chipping mesh; The side surface is combined with a fixing piece of a fiber cloth layer, and the front and rear sides can be connected by a fixed piece. The double-sided abrasive cloth combined with the grinding wheel can double the service life; and the grinding debris can be smoothly removed from the chip mesh to avoid blocking the gap of the gold steel sand while maintaining better grinding sharpness and grinding efficiency; The increase in temperature causes the emery cloth to deteriorate, and the durability of the emery cloth is extended to achieve multiple advances.

In addition, another Chinese mainland publication No. 201044950 discloses a resin cutting wheel for cutting a grinding wheel, in particular, integrally formed and solidified for cutting metal materials. The utility model has a disc shape and a central opening, and is composed of abrasive grains, an organic resin, a glass fiber mesh cloth and short glass fiber filaments. The abrasive grains and the short glass fiber filaments are uniformly distributed in the organic resin, and the glass fiber mesh is parallel. The two end faces are uniformly distributed in the organic resin in the axial direction, and the abrasive grains are exposed on both end faces; the organic resin is selected from phenolic resin, and the abrasive grains are selected from brown corundum, white corundum, chrome corundum, zirconium corundum, samarium corundum, black carbonized strontium. Particles of any of green carbonized niobium, boron carbide, boron nitride, corundum, and diamond. The utility model has the characteristics of large size, high strength and hot cutting, and can be applied to high-speed cutting large-sized metal materials, and has a long service life.

However, in the gauze structure or the cutting wheel, the abrasive grains or the diamond particles are mainly fixed to the surface of the fiber cloth or the fiber web by a bonding agent (for example, an organic resin), however, the fiber cloth or the fiber web is heated. After hardening, it is still a porous network structure. Therefore, if the fiber cloth or fiber mesh is directly used as a bonding layer of the chemical mechanical polishing dresser, the overall mechanical strength of the chemical mechanical polishing dresser will be insufficient, and The grinding performance is degraded.

Therefore, there is an urgent need to develop a flexible chemical mechanical polishing dresser, which can solve the problem of residual glue or thermal cracking generated in the hardening molding process of the polishing layer of the chemical mechanical polishing dresser, thereby improving chemical mechanical polishing. The bonding strength and grinding performance of the dresser.

The main object of the present invention is to provide a chemical mechanical polishing dresser made of a woven preform, which can effectively solve the problem of residual glue or thermal crack generated during the hardening process of the chemical mechanical polishing dresser to achieve chemical mechanical The surface bonding strength of the polishing dresser; in addition, since the woven preform is heat-hardened to form a bonding layer according to the present invention, the woven preform can have more excellent flexibility while providing a chemical mechanical polishing dresser having more Excellent bonding strength and grinding performance.

In order to achieve the above object, a chemical mechanical polishing conditioner made by using a woven preform of the present invention comprises: a substrate; a bonding layer disposed on the substrate; and a plurality of abrasive particles embedded in the plurality of abrasive particles The bonding layer, and the abrasive particles are fixed on the substrate by the bonding layer; wherein the bonding layer forms a woven preform by heat hardening, and is permeable to an adhesive or a squeezing method. The abrasive particles are pre-fixed to the woven preform. Further, in the chemical mechanical polishing conditioner manufactured by the present invention using the woven preform, the melting point of the woven preform is lower than the temperature of the heat hardening, and therefore, the woven preform will be original after the heat hardening process. Multi-porous network structure The bonding layer of the dense structure has the bonding strength of the flexible and dense structure of the mesh structure.

In the CMP abrasive dresser made of the woven preform of the present invention, the woven preform may include a first direction woven substrate and a second directional woven substrate, wherein the first direction is woven in the adjacent direction A woven hole may be formed between the substrate and the second direction woven substrate. Further, in the above-described chemical mechanical polishing dresser made of the woven preform of the present invention, the maximum diameter of the woven hole may be 0.1 to 5 times the diameter of the abrasive particles, that is, the grinding in the woven hole The number of particles may be arbitrarily changed depending on the needs of the user or the conditions of the grinding process, wherein the woven holes may contain 1 to 5 of the abrasive particles. In one aspect of the invention, the woven hole may contain one abrasive particle. In another aspect of the invention, the woven hole may contain three abrasive particles.

In the CMP abrasive dresser made by the woven preform of the present invention, the abrasive particles may be located on the surface of the woven preform, or the abrasive particles may be located in the woven hole of the woven preform, that is, Said abrasive particles and the woven holes may have different or the same arrangement, or by adjusting the maximum diameter of the woven holes and the diameter of the abrasive particles to control the abrasive particles to be located on the surface of the woven preform Upper or braided holes. In addition, in the chemical mechanical polishing dresser manufactured by using the woven preform of the present invention, the arrangement of the abrasive particles may be arbitrarily changed according to user requirements or conditions of the grinding process, wherein the abrasive particles may have one Patterned or irregularly arranged.

In the chemical mechanical polishing conditioner manufactured by using the woven preform of the present invention, the woven preform may include a first direction woven substrate and a second directional woven substrate, wherein the first directional woven substrate and the woven substrate The angle between the woven substrates in the second direction is 10 to 90 degrees. In one aspect of the invention, the angle between the first direction woven substrate and the second directional woven substrate is 90 degrees. In another aspect of the invention, the angle between the first direction woven substrate and the second directional woven substrate is 60 degrees. In still another aspect of the invention, the angle between the first direction woven substrate and the second directional woven substrate is 45 degrees.

In the CMP polishing device made by the woven preform of the present invention, the woven preform includes a first direction woven substrate and a second directional woven substrate, and the woven preform further includes a first A three-direction woven substrate or a fourth direction woven substrate, wherein the woven substrates in each direction can be positioned in different directions and form an angle with each other or a woven hole formed by the woven substrate in different directions. In one aspect of the invention, the woven preform can comprise a first direction woven substrate and a second directional woven substrate. In another aspect of the invention, the woven preform can include a first direction woven substrate, a second directional woven substrate, and a third directional woven substrate. In still another aspect of the present invention, the woven preform may include a first direction woven base material, a second direction woven base material, a third direction woven base material, and a fourth direction woven base material. In addition, in the chemical mechanical polishing dresser manufactured by using the woven preform of the present invention, the number of stacked layers of the woven preform may be arbitrarily changed according to user requirements or conditions of the grinding process, wherein the woven preform may be one A single layer woven structure or a multilayer woven structure. Yu Ben In one aspect of the invention, the woven preform can be a single layer woven structure and the thickness of the woven preform can be arbitrarily adjusted depending on the size of the abrasive particles.

In the CMP abrasive dresser made of the woven preform of the present invention, the abrasive particles may be synthetic diamond, natural diamond, polycrystalline diamond, or cubic boron nitride; in a preferred aspect of the present invention, The abrasive particles can be diamonds. Further, in the chemical mechanical polishing conditioner manufactured by using the woven preform of the present invention, the abrasive particles may have a particle diameter of 30 μm to 600 μm; in a preferred aspect of the present invention, the abrasive particles are The particle size can be 200 microns.

In the chemical mechanical polishing dresser manufactured by using the woven preform of the present invention, the composition of the bonding layer or the woven preform can be arbitrarily changed according to the grinding processing demand and the grinding processing conditions, including: ceramic material, brazing material, plating material A metal material or a polymer material, but the invention is not limited thereto. In another aspect of the invention, the woven preform is formed from a ceramic material, for example, a glass fiber cloth or a carbon fiber cloth formed of a glass fiber or carbon fiber as the woven preform. In another aspect of the invention, the woven preform is formed of a brazing material, for example, a nickel-based metal solder is pressed to form a solder woven preform, wherein the brazing material is at least one A group consisting of iron, cobalt, nickel, chromium, manganese, cerium, aluminum, and combinations thereof is selected. In still another aspect of the present invention, the woven preform is formed of a polymer material, for example, a nickel-based metal solder is formed by injection molding or extrusion molding to form a polymer material. The woven preform may be an epoxy resin, a polyester resin, a polyacrylic resin, or a phenolic resin.

In the CMP polishing device made of the woven preform of the present invention, the substrate may be a stainless steel substrate to provide a chemical mechanical polishing dresser having an excellent mechanical strength and chemical resistance. In addition, in the chemical mechanical polishing dresser manufactured by using the woven preform of the present invention, the surface shape of the substrate may be arbitrarily changed according to user requirements or conditions of polishing processing, wherein the surface of the substrate may be a plane or a convex surface. A curved surface, or a concave surface. In one aspect of the invention, the surface of the substrate can be a planar shape. In another aspect of the invention, the surface of the substrate may be a convex curved surface. In still another aspect of the invention, the surface of the substrate may be a concave curved surface.

In summary, the chemical mechanical polishing dresser made by using the woven preform according to the present invention can effectively solve the problem of residual glue or thermal crack generated during the hardening molding process of the chemical mechanical polishing dresser, and by the weaving The preform has superior flexibility, while providing a chemical mechanical polishing dresser with superior bonding strength and grinding performance.

10,20,30,70,80‧‧‧substrate

11,21,31,71,81‧‧‧ bonding layer

12,22,32,42,52,62,72,82‧‧‧ abrasive particles

13,23‧‧‧ crack

310,41,51,61‧‧‧woven preforms

411,511,611‧‧‧First direction weaving substrate

412,512,612‧‧‧Second direction braided substrate

1A to 1C are flowcharts showing the fabrication of a conventional chemical mechanical polishing conditioner of Comparative Example 1.

2A to 2B are flowcharts showing the fabrication of a conventional chemical mechanical polishing conditioner of Comparative Example 2.

3A to 3C are flowcharts showing the fabrication of a chemical mechanical polishing conditioner manufactured by using a woven preform according to Embodiment 1 of the present invention.

Figure 4 is a schematic view of a woven preform of Embodiment 1 of the present invention.

Figure 5 is a schematic view of a woven preform of Embodiment 2 of the present invention.

Figure 6 is a schematic view of a woven preform according to Embodiment 3 of the present invention.

7 and 8 are schematic views of a chemical mechanical polishing conditioner made by using a woven preform according to Embodiment 4 and Embodiment 5 of the present invention.

The embodiments of the present invention are described by way of specific examples, and those skilled in the art can readily appreciate the other advantages and advantages of the present invention. The present invention may be embodied or applied in various other specific embodiments, and various modifications and changes can be made without departing from the spirit and scope of the invention.

Comparative example 1

Please refer to FIG. 1A to FIG. 1C , which is a flow chart of a conventional chemical mechanical polishing dresser having a sheet-like bonding layer. First, as shown in FIG. 1A and FIG. 1B, a plurality of abrasive particles 12 are disposed on a bonding layer 11, and the bonding layer 11 is disposed on a substrate 10, wherein the bonding layer 11 is a nickel-based metal solder via The sheet-like bonding layer formed by vacuum pressing, the substrate 10 is made of stainless steel, and the abrasive particles 12 are generally used artificial diamonds, and the abrasive particles 12 are embedded in the bonding by a conventional cloth drilling technique (for example, a template cloth drilling). Floor 11 and the spacing and arrangement of the abrasive particles 12 can be controlled by a template (not shown).

Next, as shown in FIG. 1C, a heat hardening treatment is performed to fix the abrasive particles 12 on the surface of the substrate 10 by the bonding layer 11, and a plurality of cracks 13 are formed on the bonding layer 11. Therefore, since the sheet-like bonding layer is formed by vacuum extrusion treatment, the flexibility of the sheet-like bonding layer is not good, and defects of thermal cracking often occur during heat hardening, thereby affecting the chemical mechanical polishing dresser. Grinding efficiency and service life.

Comparative example 2

Please refer to FIG. 2A to FIG. 2C , which are flow diagrams of another conventional chemical mechanical polishing dresser having a powdered bonding layer. First, as shown in FIG. 2A, a bonding layer 21 is disposed on a substrate 20, and a plurality of abrasive particles 22 are disposed on the bonding layer 21. The bonding layer 21 is a powder formed of a nickel-based metal solder. The substrate 20 is made of stainless steel, and the abrasive particles 22 are commonly used artificial diamonds, and the abrasive particles 22 are embedded on the bonding layer 21 by a conventional cloth drilling technique, and can be used by a template (not shown). The spacing and arrangement of the abrasive particles 22 are controlled.

Next, as shown in FIG. 2B, a heat hardening treatment is performed to fix the abrasive particles 22 on the surface of the substrate 20 by the bonding layer 21, and a plurality of cracks 23 are formed on the bonding layer 21. Therefore, since the powdery bonding layer often requires an additional adhesive (for example, an organic resin) to enable the powdery bonding layer to form a semi-cured sheet-like preform, the adhesive often remains in the bonding layer during heat hardening. And causing the bonding layer and the abrasive particles Or the bonding strength between the substrates is reduced, thereby deteriorating the quality and performance of the chemical mechanical polishing dresser.

Example 1

Please refer to FIG. 3A to FIG. 3C , which are flowcharts for fabricating a chemical mechanical polishing dresser made by using a woven preform according to Embodiment 1 of the present invention. First, as shown in FIG. 3A and FIG. 3B, a plurality of abrasive particles 32 are pre-fixed on a woven preform 310, and the woven preform 310 is disposed on a substrate 30, wherein the woven preform 310 is glass. The porous mesh structure formed by the fiber cloth, the substrate 30 is made of stainless steel, the abrasive particles 32 are generally used artificial diamonds, and the abrasive particles 32 are pre-fixed on the woven preform 310 by a conventional cloth drilling technique.

Next, as shown in FIG. 3C, a heat hardening treatment is performed to form a bonding layer 31 by heat curing, wherein the melting point of the woven preform 310 is lower than the temperature of the heat curing, for example. The temperature of the heat-hardening is raised to 2,000 ° C or higher, and the woven preform 310 formed of the glass fiber cloth is converted from a solid state to a molten state, and the woven preform 310 is made of the original porous network after the heat-hardening process. The structure forms a bonding layer 31 of a uniform dense structure, which simultaneously has a bonding strength of a flexible structure and a dense structure having a mesh structure. Therefore, the chemical mechanical polishing dresser made by using the woven preform of the present invention can effectively solve the problem of residual glue or thermal crack generated in the hardening molding process of the chemical mechanical polishing dresser, and the woven preform has More excellent flexibility, while providing a chemical mechanical polishing dresser with superior bonding strength and grinding performance.

Please refer to FIG. 4 together, which is a schematic view of the woven preform of Embodiment 1 of the present invention. As shown in FIG. 4, the woven preform 41 (ie, the woven preform 310 corresponding to FIG. 3A) includes a first directional woven substrate 411 and a second directional woven substrate 412, and the first woven fabric is woven adjacent to the first direction. A woven hole (not shown) is formed between the substrate 411 and the second direction woven substrate 412, wherein the abrasive particles 42 are located in the woven hole of the woven preform 41, so that the abrasive particles 32 have a The arrayed pattern is arranged, and the maximum diameter of the woven holes is approximately equal to the diameter of the abrasive particles 42 such that each woven hole contains 1 abrasive particle 42.

In addition, the first direction woven base material 411 and the second direction woven base material 412 form an angle A, and the angle of the angle A can be arbitrarily changed according to user requirements or conditions of the grinding process. In the first embodiment, The first direction woven base material 411 and the second direction woven base material 412 are arranged in a mutually perpendicular manner, that is, the angle A is 90 degrees, and the abrasive particles 42 are preliminarily fixed to the woven holes having an angle of 90 degrees. Inside.

Example 2

Please refer to FIG. 5, which is a schematic view of a woven preform according to Embodiment 2 of the present invention. The second embodiment is substantially the same as the chemical mechanical polishing dresser described in the first embodiment and the manufacturing process thereof, except that the angle between the first direction woven base material and the second direction woven base material is different. In the second embodiment, the woven preform 51 includes a first directional woven substrate 511 and a second directional woven substrate 512, and the first directional woven substrate 511 and the second directional woven substrate are adjacent to each other. 512 forms a woven hole (not shown), wherein The abrasive particles 52 are located in the woven holes of the woven preform 51 such that the abrasive particles 52 have an equally spaced patterning arrangement, and the maximum diameter of the woven holes is approximately equal to the diameter of the abrasive particles 52, such that each A woven hole contains 1 abrasive particle 52.

In addition, the first direction woven base material 511 and the second direction woven base material 512 form an angle B, and the angle of the angle B can be arbitrarily changed according to user requirements or conditions of the grinding process. In the second embodiment, The first direction woven base material 511 and the second direction woven base material 512 are arranged at a 45 degree angle, that is, the angle B is 45 degrees, so that the abrasive particles 52 are fixed in advance to the woven hole having an angle of 45 degrees. Inside.

Example 3

Please refer to FIG. 6, which is a schematic view of a woven preform according to Embodiment 3 of the present invention. Embodiment 3 is substantially the same as the chemical mechanical polishing conditioner described in the foregoing Embodiment 1, and the manufacturing process thereof, except that the abrasive particles are located at the position of the woven preform. In the embodiment 3, the woven preform 61 includes a first directional woven substrate 611 and a second directional woven substrate 612, and the first directional woven substrate 611 and the second directional woven substrate are adjacent to each other. 612 forms a woven hole (not shown), wherein, unlike Embodiment 1, the abrasive particles are located in the woven hole of the woven preform. In Embodiment 3, the abrasive particles 62 are located in the woven hole. The surface of the preform 61 is woven, and the abrasive particles 62 are pre-fixed to the first direction woven substrate 611 or the second directional woven substrate 612 of the woven preform 61 by a conventional cloth drilling technique. And the abrasive particles 62 have an arrayed patterning arrangement.

Example 4 and Example 5

Please refer to FIG. 7 and FIG. 8 , which are schematic diagrams of a chemical mechanical polishing dresser made by using a woven preform according to Embodiment 4 and Embodiment 5 of the present invention. The fourth embodiment and the fifth embodiment are substantially the same as the chemical mechanical polishing conditioner described in the first embodiment, and the manufacturing process thereof is different except that the surface shape of the substrate is different. The surface of the substrate different from the embodiment 1 is a planar shape, and the working surface of the chemical mechanical polishing conditioner (that is, the polishing surface formed by the abrasive particles) is also a planar shape, and the embodiment 4 and the implementation The working surface of the substrate of Example 5 or the chemical mechanical polishing conditioner is a non-planar outer shape.

As shown in FIG. 7 , the CMP device includes a substrate 70 , a bonding layer 71 , and a plurality of abrasive particles 72 . The polishing particles 72 are fixed on the substrate 70 by the bonding layer 71 . And the tip end of the substrate 70 and the abrasive particles 72 (ie, the working surface) is a convex curved shape, so that the center of the substrate 70 has a higher height at the center of the substrate 70 than the peripheral region of the substrate 70, or is at the center. The abrasive particles 72 have a higher height than the abrasive particles 72 in the peripheral region.

In addition, as shown in FIG. 8 , the chemical mechanical polishing dresser includes a substrate 80 , a bonding layer 81 and a plurality of abrasive particles 82 , wherein the polishing particles 82 are fixed to the substrate 80 by the bonding layer 81 . And the tip end (ie, the working surface) of the substrate 80 and the abrasive particles 82 is a concave curved shape, so that the center of the substrate 80 has a lower height than the peripheral region of the substrate 80, or The abrasive particles 82 at the center have a lower height than the abrasive particles 82 in the peripheral region.

The above-mentioned embodiments are merely examples for convenience of description, and the scope of the claims is intended to be limited to the above embodiments.

41‧‧‧woven preforms

411‧‧‧First direction braided substrate

412‧‧‧Second direction braided substrate

42‧‧‧Abrasive particles

Claims (20)

A chemical mechanical polishing dresser made by using a woven preform, comprising: a substrate; a bonding layer disposed on the substrate; and a plurality of abrasive particles embedded in the bonding layer, and The abrasive particles are fixed to the substrate by the bonding layer; wherein the bonding layer is formed by a heat curing of the woven preform, and the abrasive particles are previously fixed to the woven preform. The chemical mechanical polishing conditioner according to claim 1, wherein the woven preform has a melting point lower than a temperature at which the heat is hardened. The CMP polishing dresser of claim 1, wherein the woven preform system comprises a first direction woven substrate and a second directional woven substrate. The chemical mechanical polishing conditioner according to claim 3, wherein a woven hole is formed between the adjacent first direction woven base material and the second direction woven base material. The chemical mechanical polishing conditioner according to claim 1 or 4, wherein the maximum diameter of the woven hole is 0.1 to 5 times the diameter of the abrasive particles. The chemical mechanical polishing conditioner according to claim 1 or 4, wherein the woven hole contains 1 to 5 of the abrasive particles. The chemical mechanical polishing conditioner according to claim 1 or 4, wherein the abrasive particles are located on a surface of the woven preform, or the abrasive particles are located in the woven hole of the woven preform . The chemical mechanical polishing conditioner of claim 7, wherein the abrasive particles have a patterned arrangement or an irregular arrangement. The chemical mechanical polishing conditioner according to claim 3, wherein an angle between the first direction woven substrate and the second direction woven substrate is 10 to 90 degrees. The chemical mechanical polishing conditioner according to claim 9, wherein an angle between the first direction woven substrate and the second directional substrate is 90 degrees. The chemical mechanical polishing conditioner of claim 3, wherein the woven preform further comprises a third direction woven substrate or a fourth direction woven substrate. The CMP polishing dresser of claim 1, wherein the woven preform system is a single layer woven structure or a multilayer woven structure. The chemical mechanical polishing conditioner according to claim 1, wherein the abrasive particles are synthetic diamonds, natural diamonds, polycrystalline diamonds, or cubic boron nitride. The CMP polishing dresser of claim 1, wherein the abrasive particles have a particle size of from 30 micrometers to 600 micrometers. The chemical mechanical polishing conditioner according to claim 1, wherein the bonding layer or the composition of the woven preform is a ceramic material, a brazing material, a plating material, a metal material, or a polymer material. The chemical mechanical polishing conditioner according to claim 15, wherein the ceramic material is glass fiber or carbon fiber. The chemical mechanical polishing conditioner of claim 15, wherein the brazing material is at least one selected from the group consisting of iron, cobalt, nickel, chromium, manganese, lanthanum, aluminum, and combinations thereof. The chemical mechanical polishing conditioner according to claim 15, wherein the polymer material is an epoxy resin, a polyester resin, a polyacrylic resin, or a phenol resin. The chemical mechanical polishing conditioner according to claim 1, wherein the substrate is a stainless steel substrate. The chemical mechanical polishing conditioner according to claim 1, wherein the substrate surface is a plane, a convex curved surface, or a concave curved surface.