TW201507799A - Apparatus for supporting substrate and apparatus for processing substrate including the same - Google Patents
Apparatus for supporting substrate and apparatus for processing substrate including the same Download PDFInfo
- Publication number
- TW201507799A TW201507799A TW103118680A TW103118680A TW201507799A TW 201507799 A TW201507799 A TW 201507799A TW 103118680 A TW103118680 A TW 103118680A TW 103118680 A TW103118680 A TW 103118680A TW 201507799 A TW201507799 A TW 201507799A
- Authority
- TW
- Taiwan
- Prior art keywords
- sleeve
- substrate
- hole
- pin
- substrate supporting
- Prior art date
Links
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
- H01L21/687—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches
- H01L21/68714—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a susceptor, stage or support
- H01L21/68742—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a susceptor, stage or support characterised by a lifting arrangement, e.g. lift pins
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F16—ENGINEERING ELEMENTS AND UNITS; GENERAL MEASURES FOR PRODUCING AND MAINTAINING EFFECTIVE FUNCTIONING OF MACHINES OR INSTALLATIONS; THERMAL INSULATION IN GENERAL
- F16C—SHAFTS; FLEXIBLE SHAFTS; ELEMENTS OR CRANKSHAFT MECHANISMS; ROTARY BODIES OTHER THAN GEARING ELEMENTS; BEARINGS
- F16C29/00—Bearings for parts moving only linearly
- F16C29/02—Sliding-contact bearings
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
Abstract
Description
本發明係關於一種發明基板處理設備，並且更特別地，關於一種基板支撐設備，能夠防止用於支撐基板的複數個升降銷損壞，以及包含該基本支撐設備的基本處理設備。 The present invention relates to an inventive substrate processing apparatus, and more particularly, to a substrate supporting apparatus capable of preventing damage of a plurality of lifting pins for supporting a substrate, and a basic processing apparatus including the basic supporting apparatus.
通常，為了製造一太陽能電池、一半導體裝置以及一平板顯示裝置，需要在一基板的一表面上形成一預定的電路圖案或一光學圖案。為此，可執行基板處理的各種過程，舉例而言，在一基板上沉積一預定材料之薄膜的一薄膜沉積過程，透過使用感光材料選擇性曝光此薄膜的一感光過程，以及透過選擇性地去除薄膜的一暴露部分形成一圖案的一蝕刻過程。這些用於基板處理的各種過程可在一處理室內部執行，其中處理室可提供有一基板支撐設備，此基板支撐設備支撐一基板，例如玻璃基板或半導體晶片。 Generally, in order to manufacture a solar cell, a semiconductor device, and a flat panel display device, it is necessary to form a predetermined circuit pattern or an optical pattern on a surface of a substrate. To this end, various processes of substrate processing can be performed, for example, a thin film deposition process of depositing a film of a predetermined material on a substrate, a photosensitive process for selectively exposing the film by using a photosensitive material, and selectively transmitting An etch process that removes an exposed portion of the film to form a pattern. These various processes for substrate processing can be performed inside a processing chamber, wherein the processing chamber can be provided with a substrate supporting device that supports a substrate, such as a glass substrate or a semiconductor wafer.
基板支撐設備包含用於支撐基板的一基座，以及複數個升降銷，這些升降銷垂直地插入到穿透基座的一銷插入孔中以便將基板放置於基座上或將基座上放置的基板提升到一裝載/卸載位置。 The substrate supporting apparatus includes a base for supporting the substrate, and a plurality of lifting pins vertically inserted into a pin insertion hole of the penetrating base to place the substrate on the base or to place the base The substrate is lifted to a loading/unloading position.
第1圖為使用根據習知技術的一基板支撐設備的一基板處 理設備之示意圖。 Figure 1 is a substrate using a substrate supporting apparatus according to the prior art. Schematic diagram of the device.
將參照第1圖描述使用根據習知技術的基板支撐設備的基板處理。 The substrate processing using the substrate supporting apparatus according to the prior art will be described with reference to FIG.
首先，如第1圖(a)所示，降低一基座20，以使得每一升降銷40的一頂表面提供於相距基座20的一頂表面的一預定的間隔。在此情況下，一基板(S)裝載至一處理室中，並且然後放置到複數個升降銷40上。 First, as shown in Fig. 1(a), a base 20 is lowered such that a top surface of each lift pin 40 is provided at a predetermined interval from a top surface of the base 20. In this case, a substrate (S) is loaded into a processing chamber and then placed on a plurality of lift pins 40.
然後，如第1圖(b)所示，升高基座20，以使得由這些個升降銷40支撐的基板(S)放置在基座20的頂表面上。在此情況下，每一升降銷40插入至在基座20的頂表面中形成的銷插入孔中。 Then, as shown in FIG. 1(b), the susceptor 20 is raised so that the substrate (S) supported by the lift pins 40 is placed on the top surface of the susceptor 20. In this case, each of the lift pins 40 is inserted into a pin insertion hole formed in the top surface of the base 20.
如第1圖(c)所示，基座20上放置的基板(S)使用一種基板處理，例如薄膜沉積過程或蝕刻過程進行處理。 As shown in Fig. 1(c), the substrate (S) placed on the susceptor 20 is processed using a substrate treatment such as a thin film deposition process or an etching process.
在完成基板處理之後，放置在基座20上的基板(S)透過降低基座20放置在這些個升降銷40上，並且然後放置到這些升降銷上的基板(S)40從處理室卸載至外部。 After the substrate processing is completed, the substrate (S) placed on the susceptor 20 is placed on the lift pins 40 through the lowering base 20, and then the substrate (S) 40 placed on the lift pins is unloaded from the process chamber to external.
在根據習知技術的基板支撐設備中，提升銷40可在基座20的重複降低或升高的過程中收到破壞或損傷。也就是說，如果升降銷40由於基板(S)的重量與/或下垂不保持在垂直狀態下，則升降銷40在插入到基座20的銷插入孔中的同時在一對角方向上傾斜。在這種情況下，如果基座20上升，則透過銷插入孔的內壁和升降銷40之間的一摩擦力瞬間產生一剪切力，從而破壞或損壞升降銷40。當升降銷40受到損壞時，需要停止設備的作業，這樣導致生產率降低，並且還對由升降銷40支撐的基板(S) 造成損傷。 In the substrate supporting apparatus according to the prior art, the lift pin 40 can be damaged or damaged during repeated lowering or raising of the susceptor 20. That is, if the lift pins 40 are not held in the vertical state due to the weight and/or sagging of the substrate (S), the lift pins 40 are inclined in a pair of angular directions while being inserted into the pin insertion holes of the base 20 . In this case, if the base 20 is raised, a frictional force is instantaneously generated by a frictional force between the inner wall of the pin insertion hole and the lift pin 40, thereby damaging or damaging the lift pin 40. When the lift pin 40 is damaged, it is necessary to stop the operation of the apparatus, which leads to a decrease in productivity, and also to the substrate (S) supported by the lift pins 40. Cause damage.
因此，本發明的實施例在於提供一種基板支撐設備，以及具有此種基板支撐設備的一基板處理設備，藉以克服由於習知技術的限制及缺點所產生的一個或多個問題。 Accordingly, embodiments of the present invention are directed to a substrate support apparatus, and a substrate processing apparatus having such a substrate support apparatus, thereby overcoming one or more problems due to limitations and disadvantages of the prior art.
本發明之實施例的一方面在於提供一種基板支撐設備，能夠防止用於支撐基板的複數個升降銷受到損傷，以及包含此種基板支撐設備的一基板處理設備。 An aspect of an embodiment of the present invention is to provide a substrate supporting apparatus capable of preventing damage of a plurality of lifting pins for supporting a substrate, and a substrate processing apparatus including such a substrate supporting apparatus.
本發明其他的優點、目的和特徵將在如下的說明書中部分地加以闡述，並且本發明其他的優點、目的和特徵對於本領域的普通技術人員來說，可以透過本發明如下的說明得以部分地理解或者可以從本發明的實踐中得出。本發明的目的和其他優點可以透過本發明所記載的說明書和申請專利範圍中特別指明的結構並結合圖式部份，得以實現和獲得。 Other advantages, objects, and features of the invention will be set forth in part in the description which follows, It is understood or can be derived from the practice of the invention. The objectives and other advantages of the invention will be realized and attained by the <RTI
為了獲得本發明的這些目的和其他特徵，現對本發明作具體化和概括性的描述，本發明的一種基板支撐設備包含一基座，基座上放置一基板，一升降銷，用於支撐基板，升降銷垂直地穿透基座，以及一套筒，提供於基座中，其中升降銷插入至套筒中，其中套筒由一自潤滑材料形成用於防止升降銷受到損傷。 In order to obtain these and other features of the present invention, the present invention is embodied and described in detail. A substrate supporting apparatus of the present invention includes a base on which a substrate is placed, and a lift pin for supporting the substrate. The lift pin vertically penetrates the base and a sleeve is provided in the base, wherein the lift pin is inserted into the sleeve, wherein the sleeve is formed of a self-lubricating material for preventing the lift pin from being damaged.
在本發明的一實施例的另一方面中，提供的一種基板處理設備可包含一處理室，用於提供一處理空間；一基板支撐裝置，用於支撐一基板，基板支撐裝置提供於處理室中；以及一氣體分佈裝置，用於將處理氣體分佈於基板上，其中氣體分佈裝置與處理室中提供的基座相面對， 其中基板支撐裝置包含上述的基板支撐設備。 In another aspect of an embodiment of the present invention, a substrate processing apparatus can include a processing chamber for providing a processing space, a substrate supporting device for supporting a substrate, and a substrate supporting device provided in the processing chamber And a gas distribution device for distributing the processing gas on the substrate, wherein the gas distribution device faces the susceptor provided in the processing chamber, The substrate supporting device includes the above substrate supporting device.
可以理解的是，如上所述的本發明之概括說明和隨後所述的本發明之詳細說明均是具有代表性和解釋性的說明，並且是為了進一步揭示本發明之申請專利範圍。 It is to be understood that the foregoing general description of the invention and the claims
20‧‧‧基座 20‧‧‧ Pedestal
40‧‧‧升降銷 40‧‧‧lifting pin
100‧‧‧基板支撐設備 100‧‧‧Substrate support equipment
120‧‧‧基座 120‧‧‧Base
121‧‧‧垂直孔 121‧‧‧Vertical holes
121a‧‧‧套筒安裝孔 121a‧‧‧Sleeve mounting hole
121b‧‧‧銷放置孔 121b‧‧‧ pin placement hole
121c‧‧‧階梯環部 121c‧‧‧ step ring
140‧‧‧升降銷 140‧‧‧lifting pin
142‧‧‧銷支撐件 142‧‧‧ pin support
144‧‧‧銷頭 144‧‧ ‧ pin head
160‧‧‧套筒 160‧‧‧ sleeve
180‧‧‧銷保持托架 180‧‧‧ pin retention bracket
182‧‧‧套筒插入孔 182‧‧‧Sleeve insertion hole
184‧‧‧套筒固定槽 184‧‧‧Sleeve fixing groove
210‧‧‧主套筒 210‧‧‧ main sleeve
211‧‧‧主套筒孔 211‧‧‧ main sleeve hole
213‧‧‧頂部主體 213‧‧‧ top subject
213a‧‧‧頂部外螺紋 213a‧‧‧Top external thread
215‧‧‧底部主體 215‧‧‧ bottom body
215a‧‧‧底部外螺紋 215a‧‧‧Bottom external thread
217‧‧‧套筒固定部 217‧‧‧Sleeve fixing
219‧‧‧第一密封件安裝槽 219‧‧‧First seal mounting groove
220‧‧‧頂部導向套筒 220‧‧‧Top guide sleeve
221‧‧‧頂部通孔 221‧‧‧Top through hole
223‧‧‧頂部導向孔 223‧‧‧Top guide hole
225‧‧‧頂部內螺紋 225‧‧‧Top internal thread
227‧‧‧第二密封件安裝槽 227‧‧‧Second seal mounting groove
230‧‧‧底部導向套筒 230‧‧‧Bottom guide sleeve
231‧‧‧底部通孔 231‧‧‧ bottom through hole
233‧‧‧底部導向孔 233‧‧‧ bottom guide hole
235‧‧‧底部內螺紋 235‧‧‧ bottom internal thread
240‧‧‧第一密封件 240‧‧‧First seal
250‧‧‧第二密封件 250‧‧‧Second seal
360‧‧‧套筒 360‧‧‧Sleeve
410‧‧‧主套筒 410‧‧‧Main sleeve
411‧‧‧主套筒孔 411‧‧‧Main sleeve hole
413‧‧‧頂部主體 413‧‧‧Top subject
415‧‧‧底部主體 415‧‧‧ bottom body
417‧‧‧套筒固定部 417‧‧‧Sleeve fixing
420‧‧‧頂部導向套筒 420‧‧‧Top guide sleeve
422‧‧‧套筒支撐件 422‧‧‧Sleeve support
424‧‧‧套筒頭 424‧‧‧Sleeve head
426‧‧‧銷插入孔 426‧‧‧ pin insertion hole
510‧‧‧處理室 510‧‧‧Processing room
512‧‧‧底腔室 512‧‧‧ bottom chamber
514‧‧‧頂腔室 514‧‧‧ top chamber
520‧‧‧基板支撐裝置 520‧‧‧Substrate support device
522‧‧‧升降軸 522‧‧‧ lifting shaft
524‧‧‧波紋管 524‧‧‧ Bellows
530‧‧‧氣體分佈裝置 530‧‧‧ gas distribution device
532‧‧‧氣體供給管 532‧‧‧ gas supply pipe
S‧‧‧基板 S‧‧‧Substrate
第1圖為使用根據習知技術的一基板支撐設備的一基板處理設備之示意圖；第2圖為根據本發明一個實施例的一基板支撐設備之橫截面圖；第3圖為第2圖所示的一套筒；第4圖為根據本發明另一實施例的基板支撐設備的橫截面圖；第5圖為第4圖中所示的一套筒；以及第6圖為根據本發明的本實施例的一用於處理基板的設備之示意圖。 1 is a schematic view of a substrate processing apparatus using a substrate supporting apparatus according to the prior art; FIG. 2 is a cross-sectional view of a substrate supporting apparatus according to an embodiment of the present invention; and FIG. 3 is a second drawing. Figure 4 is a cross-sectional view of a substrate supporting apparatus according to another embodiment of the present invention; Figure 5 is a sleeve shown in Figure 4; and Figure 6 is a sleeve according to the present invention. A schematic diagram of an apparatus for processing a substrate of this embodiment.
以下，將參照附圖詳細描述本發明的實施例。 Hereinafter, embodiments of the present invention will be described in detail with reference to the accompanying drawings.
為了說明本發明的實施例，應理解關於術語的以下細節。 In order to illustrate embodiments of the invention, the following details regarding terms should be understood.
如果在上下文中沒有具體的定義，則單數表達的術語應理解為包含一多數表達以及單數表達。如果使用例如「第一」或「第二」的術語，則可以是從其他元件分離的任何一個元件。因此，專利申請範圍的保護範圍不受這些術語的限制。 If there is no specific definition in the context, the singular terms should be understood to include a plurality of expressions as well as singular expressions. If a term such as "first" or "second" is used, it may be any element that is separated from other elements. Therefore, the scope of protection of the scope of patent application is not limited by these terms.
此外，應當理解的是，術語例如「包含」或「具有」並不排除存在一個或多個特徵、數字、步驟、操作、元件、部件或它們的組合 的可能性。 In addition, it should be understood that the term "comprises" or "comprising" does not exclude the presence of one or more features, numbers, steps, operations, components, components or combinations thereof The possibility.
應當理解的是，術語「至少一個」包含與任何一個項目相關的所有組合。舉例而言，「第一元件、第二元件以及第三元件中的至少一個」可包含從第一元件、第二元件以及第三元件中選擇的兩個或更多元件，以及從第一元件、第二元件以及第三元件中選擇的每一元件的所有組合。 It should be understood that the term "at least one of" encompasses all combinations that are associated with any one item. For example, "at least one of the first element, the second element, and the third element" may include two or more elements selected from the first element, the second element, and the third element, and from the first element All combinations of each of the second element and the third element selected.
此外，如果提及一第一元件位於一第二結構「之上或上方」，則應當理解的是，第一元件和第二元件可彼此相接觸，或一第三元件可介入於第一元件和第二元件之間。然而，如果使用「正上或正上方」，則應當理解的是，第一元件和第二元件彼此相接觸。 In addition, if it is mentioned that a first component is located "above or above" a second structure, it is to be understood that the first component and the second component can be in contact with each other, or a third component can be involved in the first component. Between the second component and the second component. However, if "up or up" is used, it should be understood that the first element and the second element are in contact with each other.
在下文中，將參照附圖描述根據本發明之實施例的一基板支撐設備。 Hereinafter, a substrate supporting apparatus according to an embodiment of the present invention will be described with reference to the accompanying drawings.
第2圖為根據本發明一個實施例的一基板支撐設備之橫截面圖。第3圖為第2圖所示的一套筒。 2 is a cross-sectional view of a substrate supporting apparatus in accordance with one embodiment of the present invention. Figure 3 is a sleeve shown in Figure 2.
請參照第2圖及第3圖，根據本發明一個實施例的用於支撐基板的設備(在下文中，稱為「基板支撐設備」)100可包含一基座120、複數個升降銷140、複數個套筒160以及複數個銷保持托架180。 Referring to FIGS. 2 and 3, an apparatus for supporting a substrate (hereinafter, referred to as "substrate support apparatus") 100 according to an embodiment of the present invention may include a base 120, a plurality of lift pins 140, and a plurality of A sleeve 160 and a plurality of pin retaining brackets 180.
可移動地設置在用於執行基板處理的處理室(圖未示)的一內底表面上的基座120支撐一基板(S)。基座120可由一金屬材料形成，例如由鋁(Al)材料形成。如果需要的話，用於加熱基板(S)的一加熱器(圖未示)可提供於基座120的內部。 A susceptor 120 movably disposed on an inner bottom surface of a processing chamber (not shown) for performing substrate processing supports a substrate (S). The susceptor 120 may be formed of a metal material, such as an aluminum (Al) material. A heater (not shown) for heating the substrate (S) may be provided inside the susceptor 120, if necessary.
基座120提供有複數個垂直孔121。垂直地插入於基座120中提供的垂直孔121中的每一升降銷140穿過每一垂直孔121。 The base 120 is provided with a plurality of vertical holes 121. Each of the vertical pins 121 vertically inserted into the vertical holes 121 provided in the base 120 passes through each of the vertical holes 121.
每一垂直孔121可包含一套筒安裝孔121a、一銷放置孔121b、以及一階梯環部121c。 Each of the vertical holes 121 may include a sleeve mounting hole 121a, a pin placing hole 121b, and a step ring portion 121c.
套筒安裝孔121a形成為具有一中空形狀，此中空形狀具有相距基座120之一底表面的第一高度和直徑。 The sleeve mounting hole 121a is formed to have a hollow shape having a first height and a diameter apart from a bottom surface of the base 120.
銷放置孔121b形成為具有一中空形狀，此中空形狀具有相距基座120之一頂表面的第二高度和直徑，第二高度可相比較於第一高度相對較小。 The pin placement hole 121b is formed to have a hollow shape having a second height and a diameter apart from a top surface of the susceptor 120, and the second height may be relatively small compared to the first height.
階梯環部121c設置為形成套筒安裝孔121a的一頂表面以及銷放置孔121b的一底表面。階梯環部121c具有套筒安裝孔121a和銷放置孔121b之間的一第三高度。升降銷140插入到階梯環部121c中，並且然後穿過階梯環部121c。 The step ring portion 121c is provided to form a top surface of the sleeve mounting hole 121a and a bottom surface of the pin placement hole 121b. The stepped ring portion 121c has a third height between the sleeve mounting hole 121a and the pin placement hole 121b. The lift pin 140 is inserted into the step ring portion 121c and then passes through the step ring portion 121c.
基座120的一厚度可對應於透過將第一高度、第二高度以及第三高度相加在一起而得到的結果值。 A thickness of the susceptor 120 may correspond to a resulting value obtained by adding together the first height, the second height, and the third height.
每一升降銷140垂直地穿過基座120，並且支撐裝載於基座120的基板(S)。 Each lift pin 140 passes vertically through the base 120 and supports a substrate (S) loaded on the base 120.
根據本發明一個實施例的每一升降銷140可包含一銷支撐件142以及一銷頭144。 Each lift pin 140 in accordance with one embodiment of the present invention can include a pin support 142 and a pin head 144.
形成為「|」形狀的銷支撐件142相比較於基座120的厚度相對更長，並且垂直地插入到基座120的垂直孔121中。而且，銷支撐件142的一底表面可固定到處理室的內底表面，或者固定至放置在處理室的內底表面上的具有預定重量的一配重件(或重量)上。銷支撐件142可由一陶瓷材料，例如氧化鋁(Al2O3)形成，但不限於這種材料。例如，銷支撐 件142可由與基座120相同的材料形成。 The pin support 142 formed in a "|" shape is relatively longer than the thickness of the susceptor 120, and is vertically inserted into the vertical hole 121 of the susceptor 120. Moreover, a bottom surface of the pin support 142 may be fixed to the inner bottom surface of the processing chamber or to a weight (or weight) having a predetermined weight placed on the inner bottom surface of the processing chamber. The pin support 142 may be formed of a ceramic material such as alumina (Al 2 O 3 ), but is not limited to this material. For example, the pin support 142 can be formed from the same material as the base 120.
與銷支撐件142的一頂表面相連接的銷頭144支持基板(S)。銷頭144可形成為具有一預定厚度的一圓形面板或多邊形面板。銷頭144可由與銷支撐件142相同的材料形成，或可由熱導率相比較於銷支撐件142的熱導率更高的材料形成。當基座120降低時，銷頭144從基座120的頂表面的一預定高度突出，並且當基座120上升時銷頭144插入至基座120的銷放置孔121b中，然後放置到階梯環部121c上。 A pin head 144 coupled to a top surface of the pin support 142 supports the substrate (S). The pin head 144 can be formed as a circular panel or a polygonal panel having a predetermined thickness. The pin head 144 may be formed of the same material as the pin support 142 or may be formed of a material having a higher thermal conductivity than the pin support 142. When the base 120 is lowered, the pin head 144 protrudes from a predetermined height of the top surface of the base 120, and when the base 120 is raised, the pin head 144 is inserted into the pin placement hole 121b of the base 120, and then placed to the step ring On the portion 121c.
銷支撐件142和銷頭144可由相同的材料製成，並且可形成為具有「T」形的一個整體。 The pin support 142 and the pin head 144 may be made of the same material and may be formed in one piece having a "T" shape.
根據本發明的另一實施例，每一升降銷140不包含前述的銷頭144，而是僅包含銷支撐件142。 According to another embodiment of the invention, each lift pin 140 does not include the aforementioned pin head 144, but only the pin support 142.
每一套筒160提供於基座120的垂直孔121中，其中升降銷140穿過垂直孔121。每一套筒160由一自潤滑性材料形成，以使得每一套筒160導向基座120的重複性的向上和向下運動。也就是說，每一套筒160在真空室內部的真空及高溫環境下最小化移動的基座120與固定的升降銷140之間的摩擦，用以從而防止或最小化升降銷140的損傷。舉例而言，每一套筒160可部分或全部地由連續使用溫度(CUT)為170℃至310℃的一自潤滑材料形成，或者可部分或全部地由連續使用溫度(CUT)為170℃至310℃且摩擦係數為0.05至0.5的一自潤滑材料形成。 Each sleeve 160 is provided in a vertical bore 121 of the base 120 with the lift pins 140 passing through the vertical bores 121. Each sleeve 160 is formed from a self-lubricating material such that each sleeve 160 guides the repetitive upward and downward movement of the base 120. That is, each sleeve 160 minimizes friction between the moving base 120 and the fixed lift pins 140 in a vacuum and high temperature environment inside the vacuum chamber to thereby prevent or minimize damage to the lift pins 140. For example, each sleeve 160 may be formed, in part or in whole, from a self-lubricating material having a continuous use temperature (CUT) of 170 ° C to 310 ° C, or may be partially or fully 170 ° C from a continuous use temperature (CUT). A self-lubricating material is formed to 310 ° C and a coefficient of friction of 0.05 to 0.5.
本發明一個實施例的每一套筒160可包含一主套筒210、一頂部導向套筒220以及一底部導向套筒230。這種情況下，升降銷140，也就是說，銷支撐件142可插入且然後穿過主套筒210穿透主套筒210、頂部 導向套筒220以及底部導向套筒230。 Each sleeve 160 of one embodiment of the present invention can include a main sleeve 210, a top guide sleeve 220, and a bottom guide sleeve 230. In this case, the lift pin 140, that is, the pin support 142 can be inserted and then penetrates the main sleeve 210 through the main sleeve 210, the top The guide sleeve 220 and the bottom guide sleeve 230.
主套筒210可由例如鋁(Al)的金屬材料或例如氧化鋁(Al2O3)的陶瓷材料形成為一管型。根據本發明一個實施例的主套筒210可形成為具有主套筒孔211的一管型，此管型包含一頂部主體213、一底部主體215以及一套筒固定部217。在此種情況下，主套筒孔211的一直徑相比較於升降銷140的一直徑，即銷支撐件142的直徑更大，從而使得主套筒孔211不與升降銷140相接觸。 The main sleeve 210 may be formed in a tubular shape from a metal material such as aluminum (Al) or a ceramic material such as alumina (Al 2 O 3 ). The main sleeve 210 according to an embodiment of the present invention may be formed in a tubular shape having a main sleeve hole 211 including a top body 213, a bottom body 215, and a sleeve fixing portion 217. In this case, a diameter of the main sleeve hole 211 is larger than a diameter of the lift pin 140, that is, the diameter of the pin support 142 is larger, so that the main sleeve hole 211 is not in contact with the lift pin 140.
對應於主套筒210之一頂部區域的頂部主體213與頂部導向套筒220相連接。在與頂部導向套筒220相連接的同時，頂部主體213插入到在基座120的底表面中提供的套筒安裝孔121a中。並且，直徑相比較於頂部主體213更小的一頂部外螺紋213a形成於頂部主體213的一頂部區域中。 A top body 213 corresponding to a top region of one of the main sleeves 210 is coupled to the top guide sleeve 220. The top body 213 is inserted into the sleeve mounting hole 121a provided in the bottom surface of the base 120 while being connected to the top guide sleeve 220. Also, a top external thread 213a having a smaller diameter than the top body 213 is formed in a top region of the top body 213.
對應於主套筒210之一底部區域的底部主體215與底部導向套筒230相連接。當與底部導向套筒230相連接時，在底部主體215從基座120的一底表面突出。並且其直徑相比較於底部主體215的直徑更小的一底部外螺紋215a形成於底部主體215的一底部區域中。 A bottom body 215 corresponding to a bottom region of one of the main sleeves 210 is coupled to the bottom guide sleeve 230. When connected to the bottom guide sleeve 230, the bottom body 215 protrudes from a bottom surface of the base 120. And a bottom external thread 215a having a diameter smaller than the diameter of the bottom body 215 is formed in a bottom portion of the bottom body 215.
其直徑相比較於頂部主體213和底部主體215中每一個的直徑更大的套筒固定部217提供於頂部主體213與底部主體215之間，其中套筒固定部217以一預定的厚度突出。在這種情況下，套筒固定部217的一頂表面與基座120的底表面相接觸或相連接，以使得套筒固定部217能夠限制插入至套筒安裝孔121a中的頂部主體213的一插入長度，或者能夠防止插入到套筒安裝孔121a中的主套筒210從套筒安裝孔121a分離。 A sleeve fixing portion 217 having a diameter larger than that of each of the top body 213 and the bottom body 215 is provided between the top body 213 and the bottom body 215, wherein the sleeve fixing portion 217 protrudes with a predetermined thickness. In this case, a top surface of the sleeve fixing portion 217 is in contact with or connected to the bottom surface of the base 120, so that the sleeve fixing portion 217 can restrict the insertion of the top body 213 into the sleeve mounting hole 121a. An insertion length or a main sleeve 210 inserted into the sleeve mounting hole 121a can be prevented from being separated from the sleeve mounting hole 121a.
主套筒210插入至套筒安裝孔121a中。例如O形環的一第一密封件240可提供於主套筒210的外圓周表面與套筒安裝孔121a之間。這種情況下，提供於第一密封件240中的一第一密封件安裝槽219形成於主套筒210的外圓周表面中。 The main sleeve 210 is inserted into the sleeve mounting hole 121a. A first seal 240 such as an O-ring may be provided between the outer circumferential surface of the main sleeve 210 and the sleeve mounting hole 121a. In this case, a first seal mounting groove 219 provided in the first seal 240 is formed in the outer circumferential surface of the main sleeve 210.
頂部導向套筒220形成為一管型，其材料與主套筒210的材料不相同。頂部導向套筒220與主套筒210的頂部區域，也就是說，頂部主體213的頂部區域相連接。當與主套筒210相連接時，頂部導向套筒220插入到在基座120的底表面中形成的套筒安裝孔121a中。因此，頂部導向套筒220保持升降銷140在垂直狀態，並且引導基座120的向上和向下運動。詳細而言，頂部導向套筒220由一自潤滑性材料形成，透過在真空室內部的真空及高溫環境下最小化移動的基座120與固定的升降銷140之間的摩擦力瞬時產生的一剪切力，並且還維持升降銷140於垂直狀態，能夠平滑地導向基座120的上下運動。特別地，頂部導向套筒220可由連續使用溫度(CUT)為170℃至310℃的一自潤滑材料形成，或者可由連續使用溫度(CUT)為170℃至310℃且摩擦係數為0.05至0.5的一自潤滑材料形成，舉例而言，工程塑料材料中的自潤滑材料，也就是說，PTFE(聚四氟乙烯)、PI(聚酰亞胺)、PEI(聚醚酰亞胺)、PBI(聚苯並咪唑)、PAI(聚酰胺酰亞胺)以及PEEK(聚醚醚酮)。 The top guide sleeve 220 is formed in a tubular shape, the material of which is different from the material of the main sleeve 210. The top guide sleeve 220 is coupled to the top region of the main sleeve 210, that is, the top region of the top body 213. When connected to the main sleeve 210, the top guide sleeve 220 is inserted into the sleeve mounting hole 121a formed in the bottom surface of the base 120. Therefore, the top guide sleeve 220 holds the lift pins 140 in a vertical state and guides the upward and downward movement of the base 120. In detail, the top guide sleeve 220 is formed of a self-lubricating material, and is instantaneously generated by friction between the base 120 and the fixed lift pin 140 that minimizes movement in a vacuum and high temperature environment inside the vacuum chamber. The shearing force, and also maintaining the lift pin 140 in a vertical state, can smoothly guide the up and down movement of the base 120. In particular, the top guide sleeve 220 may be formed of a self-lubricating material having a continuous use temperature (CUT) of 170 ° C to 310 ° C, or may have a continuous use temperature (CUT) of 170 ° C to 310 ° C and a coefficient of friction of 0.05 to 0.5. A self-lubricating material is formed, for example, as a self-lubricating material in engineering plastic materials, that is, PTFE (polytetrafluoroethylene), PI (polyimide), PEI (polyetherimide), PBI ( Polybenzimidazole), PAI (polyamideimide) and PEEK (polyetheretherketone).
頂部導向套筒220可設置有一頂部通孔221、一頂部導向孔223以及一頂部內螺紋225。 The top guide sleeve 220 may be provided with a top through hole 221, a top guide hole 223, and a top internal thread 225.
頂部通孔221垂直地穿過頂部導向套筒220，其中頂部通孔221的一直徑相比較於升降銷140的銷支撐件142的直徑相對較大。 The top through hole 221 passes vertically through the top guide sleeve 220, wherein a diameter of the top through hole 221 is relatively larger than a diameter of the pin support 142 of the lift pin 140.
頂部導向孔223從頂部通孔221之一內側壁朝向頂部通孔221的中心突出，以使得頂部導向孔223的直徑與升降銷140的銷支撐件142的直徑相對於頂部通孔221的中心相同。此種情況下，頂部導向孔223的一內側壁可形成為一線或平面形狀。因此，頂部導向孔223的內側壁與升降銷140的一外圓周表面形成線或面接觸，以使得頂部導向孔223保持升降銷140於垂直狀態，並引導基座120的向上及向下運動。 The top guide hole 223 protrudes from the inner side wall of one of the top through holes 221 toward the center of the top through hole 221 such that the diameter of the top guide hole 223 is the same as the diameter of the pin support 142 of the lift pin 140 with respect to the center of the top through hole 221. . In this case, an inner side wall of the top guide hole 223 may be formed in a line or planar shape. Therefore, the inner side wall of the top guide hole 223 is in line or surface contact with an outer circumferential surface of the lift pin 140 such that the top guide hole 223 holds the lift pin 140 in a vertical state and guides the upward and downward movement of the base 120.
頂部內螺紋225形成於頂部導向套筒220的一底部內表面中，並且由此與頂部外螺紋213a的螺絲相連接。 The top internal thread 225 is formed in a bottom inner surface of the top guide sleeve 220 and is thereby coupled to the screw of the top external thread 213a.
頂部導向套筒220插入到套筒安裝孔121a中。例如O形環的一第二密封件250可提供於頂部導向套筒220的外圓周表面和套筒安裝孔121a之間。這種情況下，待提供於第二密封件250中的一第二密封件安裝槽227形成於頂部導向套筒220的外圓周表面中。 The top guide sleeve 220 is inserted into the sleeve mounting hole 121a. A second seal 250 such as an O-ring may be provided between the outer circumferential surface of the top guide sleeve 220 and the sleeve mounting hole 121a. In this case, a second seal mounting groove 227 to be provided in the second seal 250 is formed in the outer circumferential surface of the top guide sleeve 220.
底部導向套筒230形成為一管型，其材料不同於主套筒210的材料。底部導向套筒230與主套筒210的底部區域，也就是說，底部主體215的底部區域相連接。與主套筒210相連接，底部導向套筒230與主套筒210的底部主體215一起從基座120的底表面突出。 The bottom guide sleeve 230 is formed in a tubular shape having a material different from that of the main sleeve 210. The bottom guide sleeve 230 is connected to the bottom region of the main sleeve 210, that is, the bottom region of the bottom body 215. Connected to the main sleeve 210, the bottom guide sleeve 230 protrudes from the bottom surface of the base 120 together with the bottom body 215 of the main sleeve 210.
底部導向套筒230可由連續使用溫度(CUT)為170℃至310℃的一自潤滑材料形成，或者可由連續使用溫度(CUT)為170℃至310℃且摩擦係數為0.05至0.5的一自潤滑材料形成，舉例而言，工程塑料材料中的自潤滑材料，也就是說，PTFE(聚四氟乙烯)、PI(聚酰亞胺)、PEI(聚醚酰亞胺)、PBI(聚苯並咪唑)、PAI(聚酰胺酰亞胺)或PEEK(聚醚醚酮)。此外，底部導向套筒230可由在上述自潤滑材料的工程塑料中與頂部導向 套筒220相同的材料形成，或與頂部導向套筒220不同的材料形成。如果頂部導向套筒220和底部導向套筒230由不同的材料形成，較佳地，頂部導向套筒220由相比較於底部導向套筒230的材料摩擦係數相對較低且連續使用溫度(CUT)相對較高的材料形成。也就是說，如果升降銷140未保持在垂直狀態，而是相對於一垂直方向(Z)在一對角方向上傾斜，則較佳地，頂部導向套筒220由相比較於底部導向套筒230的材料具有摩擦係數相對較低且連續使用溫度(CUT)相對較高的材料形成，以便減少傾斜的升降銷140相比較於底部導向套筒230與頂部導向套筒220之間的高摩擦強度。 The bottom guide sleeve 230 may be formed of a self-lubricating material having a continuous use temperature (CUT) of 170 ° C to 310 ° C, or may be self-lubricating from a continuous use temperature (CUT) of 170 ° C to 310 ° C and a friction coefficient of 0.05 to 0.5. Material formation, for example, self-lubricating materials in engineering plastic materials, that is, PTFE (polytetrafluoroethylene), PI (polyimide), PEI (polyetherimide), PBI (polyphenylene) Imidazole), PAI (polyamideimide) or PEEK (polyetheretherketone). In addition, the bottom guiding sleeve 230 can be guided by the top in the engineering plastic of the above self-lubricating material. The sleeve 220 is formed of the same material or a different material than the top guide sleeve 220. If the top guide sleeve 220 and the bottom guide sleeve 230 are formed of different materials, preferably, the top guide sleeve 220 has a relatively low coefficient of friction and continuous use temperature (CUT) compared to the bottom guide sleeve 230. A relatively high material is formed. That is, if the lift pins 140 are not held in a vertical state, but are inclined in a pair of angular directions with respect to a vertical direction (Z), preferably, the top guide sleeve 220 is compared with the bottom guide sleeve. The material of 230 has a relatively low coefficient of friction and a relatively high continuous use temperature (CUT) material to reduce the high frictional strength of the inclined lift pin 140 compared to the bottom guide sleeve 230 and the top guide sleeve 220. .
底部導向套筒230可提供有一底部通孔231、一底部導向孔233以及一底部內螺紋235。 The bottom guide sleeve 230 can be provided with a bottom through hole 231, a bottom guide hole 233, and a bottom internal thread 235.
底部通孔231垂直地穿過底部導向套筒230，其中底部通孔231的一直徑相比較於升降銷140之銷支撐件142的直徑相對較大。 The bottom through hole 231 passes vertically through the bottom guide sleeve 230, wherein a diameter of the bottom through hole 231 is relatively larger than a diameter of the pin support 142 of the lift pin 140.
底部導向孔233從底部通孔231之一內側壁朝向底部通孔231的中心突出，以使得底部導向孔233的直徑與升降銷140的銷支撐件142的直徑相對於底部通孔231的中心相同。此種情況下，底部導向孔233的一內側壁可形成為一線或平面形狀。因此，底部導向孔233與插入至底部通孔231中的升降銷140的一外圓周表面形成線或面接觸，以使得底部導向孔233保持升降銷140於垂直狀態，並引導基座120的向上及向下運動。 The bottom guide hole 233 protrudes from the inner side wall of one of the bottom through holes 231 toward the center of the bottom through hole 231 such that the diameter of the bottom guide hole 233 is the same as the diameter of the pin support 142 of the lift pin 140 with respect to the center of the bottom through hole 231 . In this case, an inner side wall of the bottom guide hole 233 may be formed in a line or planar shape. Therefore, the bottom guide hole 233 is in line or surface contact with an outer circumferential surface of the lift pin 140 inserted into the bottom through hole 231, so that the bottom guide hole 233 holds the lift pin 140 in a vertical state and guides the upward direction of the base 120. And move down.
底部內螺紋235形成於底部導向套筒230的一頂部內表面中，並且由此與底部外螺紋215a的螺絲相連接。 A bottom internal thread 235 is formed in a top inner surface of the bottom guide sleeve 230 and is thereby coupled to the screw of the bottom external thread 215a.
為了覆蓋插入至基座120的套筒安裝孔121a中之套筒160的側表面，每一銷保持托架180與基座120的底表面相連接以便固定套筒 160的位置，由此穿過套筒160從基座120的底表面突出的升降銷140保持在垂直狀態。這種情況下，每一銷保持托架180可通過使用複數個螺釘或螺栓與基座120的底表面相連接。 In order to cover the side surface of the sleeve 160 inserted into the sleeve mounting hole 121a of the base 120, each pin holding bracket 180 is coupled to the bottom surface of the base 120 to fix the sleeve. The position of 160, whereby the lift pins 140 protruding from the bottom surface of the base 120 through the sleeve 160 are maintained in a vertical state. In this case, each pin holding bracket 180 can be coupled to the bottom surface of the base 120 by using a plurality of screws or bolts.
每一銷保持托架180可包含一套筒插入孔182以及一套筒固定槽184。 Each of the pin holding brackets 180 may include a sleeve insertion hole 182 and a sleeve fixing groove 184.
套筒插入孔182垂直地穿過銷保持器托架180，以使得主套筒210的底部主體215與底部導向套筒230插入至套筒插入孔182中。 The sleeve insertion hole 182 vertically passes through the pin holder bracket 180 such that the bottom body 215 of the main sleeve 210 and the bottom guide sleeve 230 are inserted into the sleeve insertion hole 182.
套筒固定槽184形成在相距銷保持托架180的頂表面的一預定深度，其中套筒固定槽184的一直徑對應於在主套筒210中形成的套筒固定部217的一直徑。插入至套筒插入孔182中的主套筒210的套筒固定部217插入並放置在套筒固定槽184中。 The sleeve fixing groove 184 is formed at a predetermined depth from the top surface of the pin holding bracket 180, wherein a diameter of the sleeve fixing groove 184 corresponds to a diameter of the sleeve fixing portion 217 formed in the main sleeve 210. The sleeve fixing portion 217 of the main sleeve 210 inserted into the sleeve insertion hole 182 is inserted and placed in the sleeve fixing groove 184.
因此，根據本發明的本實施例的上述基板支撐設備100提供有套筒160，其中套筒160不與升降銷140相接觸的區域由例如鋁(Al)的材料形成；並且套筒160與升降銷140相接觸的區域由自潤滑材料形成，以使得可能將升降銷140維持在垂直狀態，並且還可能平滑導向基座120的向上及向下移動，從而防止或者最小化升降銷140透過基座120的重複運動產生的損傷。 Therefore, the above-described substrate supporting apparatus 100 according to the present embodiment of the present invention is provided with the sleeve 160 in which a region where the sleeve 160 does not contact the lift pin 140 is formed of a material such as aluminum (Al); and the sleeve 160 and the lift The area where the pins 140 are in contact is formed of a self-lubricating material to make it possible to maintain the lift pins 140 in a vertical state, and it is also possible to smoothly move the upward and downward movement of the guide base 120, thereby preventing or minimizing the lifting pins 140 from passing through the base. Damage caused by repeated movements of 120.
第4圖為根據本發明另一實施例的基板支撐設備的橫截面圖。第5圖為第4圖中所示的一套筒。其表示了具有結構上變化的套筒。因此，在下文中，將僅詳細描述此套筒。 Figure 4 is a cross-sectional view of a substrate supporting apparatus in accordance with another embodiment of the present invention. Figure 5 is a sleeve shown in Figure 4. It represents a sleeve with a structural change. Therefore, in the following, only this sleeve will be described in detail.
套筒360可包含一主套筒410以及一頂部導向套筒420。 The sleeve 360 can include a main sleeve 410 and a top guide sleeve 420.
主套筒410可由例如鋁(Al)的金屬材料或例如氧化鋁 (Al2O3)的陶瓷材料形成為一管型。根據本發明一個實施例的主套筒410可形成為具有一主套筒孔411的一管型，此管型包含一頂部主體413、一底部主體415以及一套筒固定部417。此種情況下，主套筒孔411的一直徑相比較於升降銷140的一直徑，即銷支撐件142的直徑更大。除了一外螺紋未形成於頂部主體413的一頂部區域及底部主體415的一底部區域中之外，第4圖中所示的主套筒410在結構上與第3圖中所示的主套筒210的結構相同。由此將省去相同部分的重複的解釋。 The main sleeve 410 may be formed in a tubular shape from a metal material such as aluminum (Al) or a ceramic material such as alumina (Al 2 O 3 ). The main sleeve 410 according to an embodiment of the present invention may be formed in a tubular shape having a main sleeve hole 411. The tube type includes a top body 413, a bottom body 415, and a sleeve fixing portion 417. In this case, a diameter of the main sleeve hole 411 is larger than a diameter of the lift pin 140, that is, the diameter of the pin support 142. The main sleeve 410 shown in FIG. 4 is structurally identical to the main sleeve shown in FIG. 3 except that an external thread is not formed in a top region of the top body 413 and a bottom portion of the bottom body 415. The barrel 210 has the same structure. This will eliminate the need for repeated explanations of the same parts.
頂部導向套筒420插入到主套筒410的主套筒孔411中。當插入到主套筒410中時，頂部導向套筒420插入至在基座120的底表面上中形成的套筒安裝孔121a中。因此，頂部導向套筒420將升降銷140保持在垂直狀態，並且還導向基座120的運動。更詳細而言，頂部導向套筒420由與結合第2圖及第3圖解釋的上述頂部導向套筒220相同的材料形成。 The top guide sleeve 420 is inserted into the main sleeve hole 411 of the main sleeve 410. When inserted into the main sleeve 410, the top guide sleeve 420 is inserted into the sleeve mounting hole 121a formed in the bottom surface of the base 120. Thus, the top guide sleeve 420 maintains the lift pins 140 in a vertical position and also guides the movement of the base 120. In more detail, the top guide sleeve 420 is formed of the same material as the above-described top guide sleeve 220 explained in connection with FIGS. 2 and 3.
頂部導向套筒420可包含一套筒支撐件422、一套筒頭424以及一銷插入孔426。頂部導向套筒420形成為其中銷插入孔426垂直地形成的一「T」形管型。 The top guide sleeve 420 can include a sleeve support 422, a sleeve head 424, and a pin insertion hole 426. The top guide sleeve 420 is formed in a "T" shape in which the pin insertion holes 426 are vertically formed.
套筒支撐件422形成為一圓筒形，此圓筒形具有能夠插入到主套筒410的主套筒孔411中的一直徑。 The sleeve support 422 is formed in a cylindrical shape having a diameter that can be inserted into the main sleeve hole 411 of the main sleeve 410.
套筒頭424與套筒支撐件422的一頂表面相連接，然後放置到主套筒410的頂表面上。 The sleeve head 424 is coupled to a top surface of the sleeve support 422 and then placed onto the top surface of the main sleeve 410.
銷插入孔426垂直地穿過套筒支撐件422和套筒頭424的中心，其中銷插入孔426的一直徑與上述升降銷140的銷支撐件142的直徑相同。 The pin insertion hole 426 vertically passes through the center of the sleeve support 422 and the sleeve head 424, wherein a diameter of the pin insertion hole 426 is the same as the diameter of the pin support 142 of the lift pin 140 described above.
頂部導向套筒420設置在升降銷140的銷支撐件142和主套筒410的主套筒孔411之間，以使得頂部導向套筒420將升降銷140維持在垂直狀態，並且還導向基座120的運動，從而防止升降銷140透過基座120的移動產生的損傷。 The top guide sleeve 420 is disposed between the pin support 142 of the lift pin 140 and the main sleeve hole 411 of the main sleeve 410 such that the top guide sleeve 420 maintains the lift pin 140 in a vertical state and also guides the base The movement of 120 prevents damage of the lift pin 140 through the movement of the base 120.
如上所述，根據本發明另一實施例的基板支撐設備100能夠透過使用不同種類的材料形成的套筒360將升降銷140維持於垂直狀態，並且導向基座120的運動，從而防止或最小化透過基座120的重複運動產生的升降銷140的損傷。 As described above, the substrate supporting apparatus 100 according to another embodiment of the present invention can maintain the lift pin 140 in a vertical state through the sleeve 360 formed using different kinds of materials, and guide the movement of the base 120, thereby preventing or minimizing Damage to the lift pin 140 generated by repeated movement of the base 120.
在根據本發明的實施例的基板支撐設備100中，套筒160及360可由上述的自潤滑性材料形成，並且也可以形成為各種形狀。 In the substrate supporting apparatus 100 according to the embodiment of the present invention, the sleeves 160 and 360 may be formed of the self-lubricating material described above, and may also be formed in various shapes.
根據本發明的一個修改實施例，套筒可包含如第3圖所示的主套筒210、頂部導向套筒220以及底部導向套筒230。其中，主套筒210、頂部導向套筒220以及底部導向套筒230可由自潤滑材料形成，此外也可以形成為一體。 In accordance with a modified embodiment of the present invention, the sleeve can include a main sleeve 210, a top guide sleeve 220, and a bottom guide sleeve 230 as shown in FIG. Wherein, the main sleeve 210, the top guiding sleeve 220 and the bottom guiding sleeve 230 may be formed of a self-lubricating material, or may be formed integrally.
根據本發明的另一修改的實施例，套筒可僅包含如第3圖所示的主套筒210及頂部導向套筒220。這種情況下，上述主套筒210和頂部導向套筒220可由自潤滑材料形成，此外也可形成為一體。 According to another modified embodiment of the present invention, the sleeve may include only the main sleeve 210 and the top guide sleeve 220 as shown in FIG. In this case, the main sleeve 210 and the top guide sleeve 220 may be formed of a self-lubricating material, or may be formed integrally.
根據本發明的再一修改的實施例，套筒可僅包含第4圖中所示的主套筒410，以及塗覆於主套筒410之主套筒孔411的一內表面上的自潤滑性材料的一塗覆層(圖未示)。在這種情況下，主套筒410可由基於鋁(Al)的材料形成。 According to still another modified embodiment of the present invention, the sleeve may include only the main sleeve 410 shown in FIG. 4, and self-lubricating applied to an inner surface of the main sleeve hole 411 of the main sleeve 410. A coating of a material (not shown). In this case, the main sleeve 410 may be formed of an aluminum (Al)-based material.
第6圖為根據本發明的本實施例的一用於處理基板的設備 之示意圖。 Figure 6 is a diagram of an apparatus for processing a substrate according to the embodiment of the present invention. Schematic diagram.
請參考第6圖，本發明的本實施例的用於處理基板的設備(在下文中，稱為「基板處理設備」)可包含一處理室510、一基板支撐裝置520以及一氣體分佈裝置530。 Referring to FIG. 6, the apparatus for processing a substrate (hereinafter, referred to as "substrate processing apparatus") of the present embodiment of the present invention may include a processing chamber 510, a substrate supporting device 520, and a gas distributing device 530.
處理室510提供了用於執行化學氣相沉積(CVD)製程的一處理空間，其中處理室510包含一底腔室512以及一頂腔室514。 The processing chamber 510 provides a processing space for performing a chemical vapor deposition (CVD) process, wherein the processing chamber 510 includes a bottom chamber 512 and a top chamber 514.
底腔室512中形成頂部打開的「U」形。一基板入口(圖未示)形成於底腔室512的一側上，基板通過此基板入口進來和出去，並且用於從處理空間排放氣體的一排氣管形成於底腔室512的一底表面上一側上。 A top open "U" shape is formed in the bottom chamber 512. A substrate inlet (not shown) is formed on one side of the bottom chamber 512 through which the substrate enters and exits, and an exhaust pipe for discharging gas from the processing space is formed at a bottom of the bottom chamber 512. On one side of the surface.
在頂腔室514形成於底腔室512之上，用以由此覆蓋底腔室512的頂部。這種情況下，例如O形環的一絕緣件設置於底腔室512與頂腔室514之間，以便將底腔室512與頂腔室514彼此電絕緣。 A top chamber 514 is formed over the bottom chamber 512 to thereby cover the top of the bottom chamber 512. In this case, an insulating member such as an O-ring is disposed between the bottom chamber 512 and the top chamber 514 to electrically insulate the bottom chamber 512 from the top chamber 514 from each other.
基板支撐裝置520可移動地提供於處理室510的底腔室512中，由此支撐利用基板傳輸設備(圖未示)裝載到處理空間中的基板(S)。基板支撐裝置520對應於根據本發明實施例的第2圖至第5圖中所示的基板支撐設備100，其中基板支撐裝置520包含基座120、複數個升降銷140、複數個套筒160及360以及複數個銷保持托架180。將省去基板支撐裝置520中包含的上述元件的說明。 The substrate supporting device 520 is movably provided in the bottom chamber 512 of the processing chamber 510, thereby supporting the substrate (S) loaded into the processing space by a substrate transfer device (not shown). The substrate supporting device 520 corresponds to the substrate supporting device 100 shown in FIGS. 2 to 5 according to an embodiment of the present invention, wherein the substrate supporting device 520 includes a base 120, a plurality of lifting pins 140, a plurality of sleeves 160, and 360 and a plurality of pin holding brackets 180. Description of the above elements included in the substrate supporting device 520 will be omitted.
基板支撐裝置520的基座120按照基座120由穿過底腔室512之底表面的一升降軸522可移動地支撐的方式提供。升降軸522透過一個波紋管524密封，並且利用升降設備(圖未示)上下移動。 The base 120 of the substrate support device 520 is provided in such a manner that the base 120 is movably supported by a lifting shaft 522 that passes through the bottom surface of the bottom chamber 512. The lifting shaft 522 is sealed by a bellows 524 and moved up and down by means of a lifting device (not shown).
氣體分佈裝置530設置在處理室510的頂腔室514中，同時連通穿過頂腔室514的一氣體供給管532。為了在基板(S)上形成一預定的薄膜，氣體分佈裝置530均勻地分佈藉由氣體供給管532供給到基板(S)上的處理氣體。這種情況下，氣體分佈裝置530可根據使用處理氣體的薄膜沉積過程提供有直流電源、交流電源或高頻電源。 The gas distribution device 530 is disposed in the top chamber 514 of the processing chamber 510 while communicating with a gas supply tube 532 that passes through the top chamber 514. In order to form a predetermined film on the substrate (S), the gas distributing means 530 uniformly distributes the processing gas supplied to the substrate (S) by the gas supply pipe 532. In this case, the gas distribution device 530 may be provided with a DC power source, an AC power source, or a high frequency power source according to a thin film deposition process using a process gas.
以下將描述利用根據本發明實施例的基板處理設備的薄膜沉積方法。 A thin film deposition method using a substrate processing apparatus according to an embodiment of the present invention will be described below.
首先，降低升降軸522，以使得處理室510中提供的基座120下降到起始位置。因此，分別插入到基座120中提供的複數個套筒160及360中且與底腔室512垂直相連接的複數個升降銷140，在相距基座120的頂表面的一預定高度突出。 First, the lift shaft 522 is lowered to lower the base 120 provided in the process chamber 510 to the home position. Accordingly, a plurality of lift pins 140 respectively inserted into the plurality of sleeves 160 and 360 provided in the base 120 and vertically connected to the bottom chamber 512 protrude at a predetermined height from the top surface of the base 120.
然後，基板(S)裝載於處理室510的處理空間中，並且然後放置於每一升降銷140的銷頭144上。 The substrate (S) is then loaded into the processing space of the processing chamber 510 and then placed on the pin head 144 of each lift pin 140.
在此之後，使得升降軸522上升，以使得基座120上升到處理位置。因此，基座120與升高的升降軸522一起上升，以使得支撐由每一升降銷140之銷頭144所支撐的基板(S)的基座120上升至處理位置。這種情況下，升降銷140的每一銷頭144插入到基座120的銷放置孔121b中。 After that, the lifting shaft 522 is raised to raise the base 120 to the processing position. Thus, the base 120 rises with the raised lift shaft 522 such that the base 120 supporting the substrate (S) supported by the pin head 144 of each lift pin 140 is raised to the processing position. In this case, each of the pin heads 144 of the lift pins 140 is inserted into the pin placement holes 121b of the base 120.
在處理室510的內部形成真空環境之後，利用氣體分佈裝置530將用於化學氣相沉積(CVD)處理的處理氣體分佈到基板(S)上，用以由此在基板(S)上沉積薄膜。 After the vacuum environment is formed inside the processing chamber 510, the processing gas for chemical vapor deposition (CVD) processing is distributed onto the substrate (S) by the gas distributing device 530 to thereby deposit a thin film on the substrate (S). .
在根據本發明的實施例的基板處理設備以及使用上述設備的薄膜沉積方法中，每一升降銷140的底表面可與配重件(圖未示)而非 底腔室512相連接。這種情況下，每一升降銷140根據基座120的降低透過在底腔室512之底表面上支撐的配重件，維持在垂直狀態，並且每一升降銷140根據基座120的上升透過配重件從基座120懸掛下來。 In the substrate processing apparatus according to the embodiment of the present invention and the thin film deposition method using the above apparatus, the bottom surface of each lift pin 140 may be associated with a weight member (not shown) instead of The bottom chambers 512 are connected. In this case, each of the lift pins 140 is maintained in a vertical state by the weight member supported on the bottom surface of the bottom chamber 512 according to the lowering of the base 120, and each lift pin 140 is transmitted through the rise of the base 120. The weight member is suspended from the base 120.
根據本發明的基板支撐設備以及具有該設備的基板處理設備，升降銷140維持在垂直狀態，並且基座120的移動透過基座120中提供的自潤滑材料的套筒導向，從而防止或最小化由基座120的重複運動產生的升降銷140的損傷。 According to the substrate supporting apparatus of the present invention and the substrate processing apparatus having the same, the lift pins 140 are maintained in a vertical state, and the movement of the susceptor 120 is guided through the sleeve of the self-lubricating material provided in the susceptor 120, thereby preventing or minimizing Damage to the lift pin 140 resulting from repeated movement of the base 120.
此外，透過防止或最小化升降銷140的損傷可能延長升降銷140與套筒的更換時間，從而實現生產率的提高。 Further, by preventing or minimizing the damage of the lift pins 140, it is possible to extend the replacement time of the lift pins 140 and the sleeve, thereby achieving an improvement in productivity.
對於本領域技術人員顯而易見的是在不脫離本發明的精神或範圍下可進行各種修改和變化。因此，在所附之專利申請範圍及其等同範圍之內，本發明覆蓋的不同的變型和改變。 It will be apparent to those skilled in the art that various modifications and changes can be made without departing from the spirit and scope of the invention. Accordingly, the present invention covers various modifications and changes within the scope of the appended claims.
100‧‧‧基板支撐設備 100‧‧‧Substrate support equipment
120‧‧‧基座 120‧‧‧Base
121‧‧‧垂直孔 121‧‧‧Vertical holes
121a‧‧‧套筒安裝孔 121a‧‧‧Sleeve mounting hole
121b‧‧‧銷放置孔 121b‧‧‧ pin placement hole
121c‧‧‧階梯環部 121c‧‧‧ step ring
140‧‧‧升降銷 140‧‧‧lifting pin
142‧‧‧銷支撐件 142‧‧‧ pin support
144‧‧‧銷頭 144‧‧ ‧ pin head
160‧‧‧套筒 160‧‧‧ sleeve
180‧‧‧銷保持托架 180‧‧‧ pin retention bracket
182‧‧‧套筒插入孔 182‧‧‧Sleeve insertion hole
184‧‧‧套筒固定槽 184‧‧‧Sleeve fixing groove
210‧‧‧主套筒 210‧‧‧ main sleeve
220‧‧‧頂部導向套筒 220‧‧‧Top guide sleeve
230‧‧‧底部導向套筒 230‧‧‧Bottom guide sleeve
240‧‧‧第一密封件 240‧‧‧First seal
250‧‧‧第二密封件 250‧‧‧Second seal
S‧‧‧基板 S‧‧‧Substrate
Claims (12)
Applications Claiming Priority (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| KR1020130060676A KR102197189B1 (en) | 2013-05-28 | 2013-05-28 | Apparatus for supporting substrate |
| ??10-2013-0060676 | 2013-05-28 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| TW201507799A true TW201507799A (en) | 2015-03-01 |
| TWI639482B TWI639482B (en) | 2018-11-01 |
Family
ID=51989098
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| TW103118680A TWI639482B (en) | 2013-05-28 | 2014-05-28 | Apparatus for supporting substrate and apparatus for processing substrate including the same |
Country Status (3)
| Country | Link |
|---|---|
| KR (1) | KR102197189B1 (en) |
| TW (1) | TWI639482B (en) |
| WO (1) | WO2014193138A1 (en) |
Families Citing this family (9)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US20160348233A1 (en) * | 2015-05-29 | 2016-12-01 | Applied Materials, Inc. | Grounding of conductive mask for deposition processes |
| US11387135B2 (en) * | 2016-01-28 | 2022-07-12 | Applied Materials, Inc. | Conductive wafer lift pin o-ring gripper with resistor |
| DE102016212780A1 (en) | 2016-07-13 | 2018-01-18 | Siltronic Ag | Device for handling a semiconductor wafer in an epitaxial reactor and method for producing a semiconductor wafer with an epitaxial layer |
| KR101996051B1 (en) * | 2017-07-05 | 2019-07-03 | 심경식 | Roller bushing supporting substrate |
| KR102659428B1 (en) * | 2018-11-29 | 2024-04-23 | 삼성디스플레이 주식회사 | Bushing portion and substrate processing apparatus including the same |
| KR20210054112A (en) * | 2019-11-04 | 2021-05-13 | 삼성디스플레이 주식회사 | Deposition apparatus and method of processing substrate using the same |
| KR20210076345A (en) | 2019-12-16 | 2021-06-24 | 삼성전자주식회사 | Lift pin module |
| CN111739837A (en) * | 2020-07-27 | 2020-10-02 | 盛吉盛(宁波)半导体科技有限公司 | Ceramic lifting pin of aluminum heater cover plate of semiconductor equipment and preparation method thereof |
| KR20230082405A (en) * | 2021-12-01 | 2023-06-08 | 주식회사 유진테크 | Lift pin protection assembly and substrate processing apparatus |
Family Cites Families (13)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US5848670A (en) * | 1996-12-04 | 1998-12-15 | Applied Materials, Inc. | Lift pin guidance apparatus |
| KR100459788B1 (en) * | 2002-01-14 | 2004-12-04 | 주성엔지니어링(주) | 2 stage wafer lift pin |
| TW200526384A (en) * | 2003-09-24 | 2005-08-16 | Mitsuboshi Diamond Ind Co Ltd | Substrate dicing system, substrate manufacturing apparatus, and substrate dicing method |
| KR20060076941A (en) * | 2004-12-29 | 2006-07-05 | 주식회사 평강산업 | A hinge device |
| KR101240391B1 (en) * | 2005-05-24 | 2013-03-08 | 주성엔지니어링(주) | Lift pin assembly |
| KR101207771B1 (en) * | 2006-02-09 | 2012-12-05 | 주성엔지니어링(주) | Lift pin holder reducing friction force |
| TWI363212B (en) * | 2006-05-26 | 2012-05-01 | Advanced Display Proc Eng Co | Adhesive chuck, and apparatus and method for assembling substrates using the same |
| KR100840971B1 (en) | 2007-02-28 | 2008-06-24 | 세메스 주식회사 | Substrate support and apparatus for coating substrate having the same |
| JP5352329B2 (en) * | 2009-04-13 | 2013-11-27 | 株式会社日立ハイテクノロジーズ | Mounting processing work apparatus, mounting processing work method, and display substrate module assembly line |
| WO2011009007A2 (en) * | 2009-07-15 | 2011-01-20 | Applied Materials, Inc. | Improved lift pin guides |
| US20110164955A1 (en) * | 2009-07-15 | 2011-07-07 | Applied Materials,Inc. | Processing chamber with translating wear plate for lift pin |
| KR101053564B1 (en) * | 2010-10-29 | 2011-08-03 | (주) 에스디시 | Lift pin guide |
| JP6180510B2 (en) | 2012-04-26 | 2017-08-16 | アプライド マテリアルズ インコーポレイテッドＡｐｐｌｉｅｄ Ｍａｔｅｒｉａｌｓ，Ｉｎｃｏｒｐｏｒａｔｅｄ | Method and apparatus for preventing erosion of ESC adhesives |
-
2013
- 2013-05-28 KR KR1020130060676A patent/KR102197189B1/en active IP Right Grant
-
2014
- 2014-05-27 WO PCT/KR2014/004707 patent/WO2014193138A1/en active Application Filing
- 2014-05-28 TW TW103118680A patent/TWI639482B/en active
Also Published As
| Publication number | Publication date |
|---|---|
| KR20140139935A (en) | 2014-12-08 |
| TWI639482B (en) | 2018-11-01 |
| WO2014193138A1 (en) | 2014-12-04 |
| KR102197189B1 (en) | 2020-12-31 |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| TWI639482B (en) | Apparatus for supporting substrate and apparatus for processing substrate including the same | |
| KR101374442B1 (en) | Placing table apparatus, processing apparatus, temperature control method and storage medium storing program | |
| KR102026727B1 (en) | Substrate support with heater | |
| CN105280518B (en) | Heat treatment device for semiconductor substrate | |
| TW201812082A (en) | Wafer centering in pocket to improve azimuthal thickness uniformity at wafer edge | |
| TWI748437B (en) | Process kit and apparatus for processing substrate and lifting solution for substrate edge ring of the apparatus | |
| US20180100235A1 (en) | Susceptor and epitaxial growth device | |
| KR20140027100A (en) | Susceptor and method for producing epitaxial wafer using same | |
| KR20130105875A (en) | Substrate processing apparatus, substrate supporting tool, and semiconductor device manufacturing method | |
| JPWO2012066752A1 (en) | Susceptor and epitaxial wafer manufacturing method | |
| JP2017117850A (en) | Wafer support mechanism, chemical vapor deposition device, and manufacturing method of epitaxial wafer | |
| JP2010123810A (en) | Substrate supporting device and substrate temperature control method | |
| KR101267397B1 (en) | Deposition apparatus for thin film and deposition method for thin film using the same | |
| US9120114B2 (en) | Deposition apparatus | |
| US20070042118A1 (en) | Encapsulated thermal processing | |
| TW201528415A (en) | Lift pin assembly and substrate processing apparatus having the same | |
| KR102166491B1 (en) | Batch type apparatus for processing substrate | |
| KR20120103060A (en) | Chuck structure assembly and device for processing semiconductor substrate using the same | |
| KR101247160B1 (en) | Thin film deposition apparatus | |
| CN111834281A (en) | Substrate processing apparatus | |
| KR101612503B1 (en) | Thin film deposition apparatus | |
| CN104934345A (en) | Plasma device | |
| JP2015076457A (en) | Substrate processing apparatus | |
| KR102581343B1 (en) | Film forming apparatus | |
| KR101651882B1 (en) | Substrate processing apparatus |