TW201507588A - Hybrid heat sink assembly - Google Patents

Abstract

A hybrid heat sink assembly is installed at an electronic device, and the electronic device has a case, a circuit board and an interface card which is electrically set on the circuit board. The hybrid heat sink assembly includes a first heat-dissipation device and a second heat-dissipation device, wherein the first heat-dissipation device is installed on an outer side surface of the case. The second heat-dissipation device is installed on the interface card. When the electronic device is operating, the first heat-dissipation device and the second heat-dissipation device are used to dissipate heat from the electronic device by water cooling manner.

Description

Composite heat sink

The present invention relates to a heat dissipating device, and more particularly to a composite heat dissipating assembly composed of a plurality of heat dissipating devices.

With the rapid development of high-tech industries in recent years, the volume of electronic components in electronic products has become more and more small, and the density per unit area has become higher and higher, and the overall performance has been continuously enhanced. There is also a need for a heat sink capable of ensuring sufficient cooling capacity in a narrow area to keep the operating temperature of each electronic component in the electronic device within a reasonable range to promote heat exchange with the environment, thereby protecting the electronic zero. Components, to avoid damage to electronic components or computer system failure due to overheating.

The conventional heat dissipation method can be roughly divided into air-cooled and water-cooled. The air-cooled heat dissipation method usually uses a heat sink to dissipate components of the electronic device. The conventional heat sink includes a body having a plurality of heat dissipation fins. In order to improve heat dissipation efficiency, a fan is usually added, which is fixed on the heat dissipation fins. When the conventional heat sink is used, the bottom surface of the main body is attached to the heat generating component, for example, a central processing unit (CPU) or a graphic processing unit (GPU) generates a large amount of waste heat. On the heating element, the heat source is transmitted to the heat dissipation fin through the body through the heat conduction, and the heat source is dissipated by the air flow generated by the fan, thereby generating the effect of cooling and cooling the heat generating element.

In addition, the conventional water-cooling heat sink is mainly composed of a water-cooled row and a water-cooled pump, wherein the water-cooled row is filled with a cooling liquid and directly disposed on the corresponding heat-generating electronic component to directly absorb the heat-generating electronic components. The heat is generated, and the water-cooled discharge is connected to the water-cooled pump through the conduit, so that the coolant can be flowed through the water-cooled discharge by the operation of the water-cooled pump, thereby performing the heat exchange cycle.

However, the existing water-cooled heat sinks are designed for the size and position of the electronic components of various types of electronic devices. Therefore, the arrangement relationship and the number of uses of the water-cooled and water-cooled pumps are forced to be fixed and cannot be changed. In this way, if it is necessary to dissipate heat for electronic components with different heat generation, the conventional water-cooling heat sink cannot perform the most efficient configuration according to the actual heat generation of the electronic components.

That is to say, if it is for electronic components with large heat generation, the water pressure of the fixed configuration water-cooling heat sink will not be enough to dissipate the electronic components in time; if it is for electronic components with low heat generation, Although the water-cooled heat sink can dissipate heat in time, the operation of excessive water pressure will generate unnecessary noise.

In view of the above problems, the present invention provides a composite heat dissipating assembly for solving the problem of poor fit of a water-cooled heat sink.

The composite heat dissipating component of the present invention is suitable for an electronic device, and the electronic device has a casing, a circuit board disposed in the casing, and an interface card electrically inserted on the circuit board, and one side of the casing Has an opening. The composite heat dissipating assembly includes a first heat dissipating device and a second heat dissipating device, wherein the first heat dissipating device is disposed on an outer side surface of the casing, and corresponding to the opening, the first heat dissipating device has a body, a first fan, and a first heat dissipating device a first heat sink and at least one pump member. The first fan is mounted on the body and faces the opening, the first heat dissipation plate is mounted on a side of the body, and the first heat dissipation plate has at least one groove, and the pump member is received in the concave of the first heat dissipation plate. The pump member has a first water inlet and a first water outlet, and is exposed outside the first heat dissipation plate.

The second heat dissipating device is disposed on the interface card, and has a cooling plate, a second heat dissipating plate and a first cover body, and the first surface of the cooling plate is provided with a space A plurality of fins are erected to form a plurality of flow paths. The cooling plate has a second water inlet and a second water outlet, respectively connected to the flow channel, wherein the second water inlet and the second water outlet pass through the casing to be exposed outside the casing. The second heat dissipation plate is attached to the second surface of the cooling plate with one side thereof, and is attached to the interface card with the opposite other side. The first cover is disposed on a side of the second heat dissipation plate, and the cover covers the cooling plate to constitute a closed chamber.

The invention further provides a composite heat dissipation component, which is suitable for electricity The electronic device has a casing, a circuit board disposed in the casing, and an interface card electrically inserted on the circuit board, and one side of the casing has an opening. The composite heat dissipating assembly includes a first heat dissipating device and a second heat dissipating device, wherein the first heat dissipating device is disposed on an outer side surface of the casing, and corresponding to the opening, the first heat dissipating device has a body, a first fan, and a first heat dissipating device a first heat sink and at least one pump member. The first fan is mounted on the body and faces the opening, the first heat dissipation plate is mounted on a side of the body, and the first heat dissipation plate has at least one groove, and the pump member is received in the concave of the first heat dissipation plate. The pump member has a first water inlet and a first water outlet, and is exposed outside the first heat dissipation plate.

The second heat sink is disposed on the interface card and has a cooling a plate, a second heat sink, and a plurality of flow channels on the first surface of the cooling plate. The cooling plate has a second water inlet and a second water outlet, respectively connected to the flow channel, wherein the second water inlet and the second water outlet pass through the casing to be exposed outside the casing. The second heat dissipation plate is attached to the first surface of the cooling plate with one side thereof to form a sealed chamber, and the other side opposite to the second heat dissipation plate is attached to the interface card.

The effect of the invention is that the composite heat dissipating component is not only utilized The water-cooled pump and the water-cooled row are modularized to achieve good heat dissipation, and the required heat dissipation power can be adjusted according to the actual heat generation of the electronic components to meet the needs of different users and more economical. At the same time, the water channel connection between the water-cooled pump and the water-cooled row is designed outside the casing, so that there is no problem of water leakage inside the casing, and the electronic components in the casing are prevented from being damaged due to water leakage, so as to achieve the protection effect.

The features, implementations, and utilities of the present invention are described in detail below with reference to the drawings.

100‧‧‧First heat sink

110‧‧‧ body

120‧‧‧First fan

130‧‧‧First heat sink

131‧‧‧ Groove

140‧‧‧ pump parts

141‧‧‧ first water inlet

142‧‧‧ first outlet

200‧‧‧second heat sink

210‧‧‧Cooling plate

211‧‧‧ first side

212‧‧‧ second side

213‧‧‧Fins

214‧‧‧ flow path

215‧‧‧Second water inlet

216‧‧‧Second outlet

220‧‧‧second heat sink

230‧‧‧ first cover

300‧‧‧Second heat sink

310‧‧‧Cooling plate

311‧‧‧ first side

312‧‧‧ second side

313‧‧‧ runner

314‧‧‧Second water inlet

315‧‧‧Second outlet

320‧‧‧second heat sink

330‧‧‧Fixing fin set

340‧‧‧second fan

350‧‧‧Second cover

400‧‧‧Electronic devices

410‧‧‧Chassis

411‧‧‧ openings

420‧‧‧ boards

430‧‧‧Interface card

500‧‧‧Water-cooled radiator

510‧‧‧ third water inlet

520‧‧‧ third outlet

530‧‧‧pipe

1 is an exploded perspective view of a composite heat sink assembly and an electronic device according to a first embodiment of the present invention.

2 is a schematic view showing the combination of the composite heat dissipating component and the electronic device according to the first embodiment of the present invention.

FIG. 3 is a schematic view showing the combination of the first heat dissipating device of the composite heat dissipating component according to the first embodiment of the present invention.

4A is an exploded perspective view showing a second heat dissipating device of the composite heat dissipating assembly according to the first embodiment of the present invention.

FIG. 4B is a schematic diagram showing the combination of the second heat dissipation device and the interface card of the composite heat dissipation assembly according to the first embodiment of the present invention.

4C is a schematic view showing a path of a water-cooled flow path in a second heat dissipating device of the composite heat dissipating assembly according to the first embodiment of the present invention.

FIG. 5A is an exploded perspective view showing a second heat dissipating device of the composite heat dissipating assembly according to the second embodiment of the present invention.

FIG. 5B is a schematic diagram showing the combination of the second heat dissipating device and the interface card of the composite heat dissipating component according to the second embodiment of the present invention.

FIG. 5C is a schematic diagram of a water-cooling flow path of a second heat dissipating device of the composite heat dissipating assembly according to the second embodiment of the present invention.

FIG. 6 is an exploded perspective view showing the second heat dissipation and heat dissipation fin set, the second fan, and the second cover of the composite heat dissipation assembly according to the second embodiment of the present invention.

FIG. 7 is a schematic diagram showing a combination of a heat dissipating fin set, a second fan, and a second cover in a second heat dissipating device of the composite heat dissipating assembly according to the second embodiment of the present invention.

FIG. 8 is a schematic view showing the combination of the composite heat dissipating component and the electronic device according to the second embodiment of the present invention.

Please refer to FIG. 1 to FIG. 2 for an exploded schematic view and a combined schematic view of the composite heat dissipating component and the electronic device disclosed in the first embodiment of the present invention. The composite heat dissipating component of the embodiment is applicable to an electronic device 400. The electronic device 400 has a casing 410, a circuit board 420 disposed in the casing 410, and electrically inserted on the circuit board 420. An interface card 430 is provided, and one side of the casing 410 has an opening 411. The electronic device 400 may be a computer system host or a server chassis, and the circuit board 420 is similar to the electronic components configured in the conventional computer, and can also perform preset functions and applications of the computer. Etc., the applicant does not elaborate here, and only the electronic components involved in the present embodiment will be described in detail.

Please refer to FIG. 3, which is a schematic diagram of the combination of the first heat dissipating device of the composite heat dissipating assembly disclosed in the first embodiment of the present invention. The composite heat dissipating assembly of the present embodiment includes a first heat dissipating device 100 and a second heat dissipating device 200, wherein the first heat dissipating device 100 is disposed on an outer side surface of the casing 410 and corresponds to the position of the opening 411, first The heat sink 100 has a body 110, a first fan 120, a first heat sink 130, and at least one pump member 140. The first fan 120 is mounted on the body 110, and the axial direction of the first fan 120 is located at the position of the opening 411 of the casing 410, so that the first fan 120 passes through the opening 411 to extract the hot air in the casing 410 or It is blown toward the inside of the casing 410, so that the air in the casing 410 and the outside air are mutually circulated, thereby achieving the effect of rapid heat dissipation.

The first heat dissipation plate 130 is disposed on one side of the body 110 and is located at the bottom of the first fan 120. The first heat dissipation plate 130 has at least one groove 131 disposed opposite to the first fan 120. On the other side, the pump member 140 is disposed in the recess 131 at the bottom of the first heat dissipation plate 130, and the bottom of the pump member 140 has a first water inlet 141 and a first water outlet 142, and the first water inlet 141 and the first water outlet 142 are exposed on the first heat dissipation plate 130 In addition, in order to connect a pipeline (not shown), the first water inlet 141 can input a cryogenic liquid (such as pure water, distilled water or coolant) into the pump member 140, and the first water outlet 142 can be discharged. The high temperature liquid of thermal energy forms a cooling cycle to reduce the temperature of the electronic device 400 and achieve the heat dissipation effect. The material of the first heat dissipation plate 130 of the present embodiment may be a material with good thermal conductivity, such as a copper alloy, an aluminum alloy or an iron alloy, and the like.

It should be noted that the pump member 140 disclosed in the present invention is a water-cooled pump, which is used in three numbers, and the number of corresponding grooves 131 is also three, and each pump member 140 can be connected in series with each other. The cooling power is increased, and the number of the pump members 140 of the present invention is not limited to the number contained in the embodiment, and those skilled in the art can correspondingly change the number of configurations of the pump member 140 of the present invention according to actual needs.

Referring to FIG. 4A to FIG. 4B, an exploded schematic view and a combined schematic view of a second heat dissipating device and an interface card of the composite heat dissipating assembly disclosed in the first embodiment of the present invention. The second heat sink 200 of the embodiment is disposed on the interface card 430, and the second heat sink 200 has a cooling plate 210, a second heat sink 220, and a first cover 230. The cooling plate 210 has a first surface 211 and a second surface 212 opposite to each other, and the first surface 211 is provided with a plurality of fins 213 spaced apart to form a plurality of flow channels 214. The cooling plate 210 has a second water inlet 215 and a second water outlet 216. It is worth noting that the flow channel 214 is divided into two parts, left and right, and communicates with each other at the bottom end. The second water inlet 215 is connected to a part of the flow channel 214, and the second water outlet 216 is connected to the other part. Flow path 214.

The second heat dissipation plate 220 is attached to the first surface 211 of the cooling plate 210 by one side thereof, and is coupled to the interface card 430 by the opposite other side. The second heat dissipation plate 220 and the cooling plate 210 can be soldered. The manner of attaching to each other, such as diffusion soldering, solder paste soldering, spot soldering, etc., is not limited thereto.

Please refer to FIG. 4C at the same time, which is disclosed in the first embodiment of the present invention. Schematic diagram of the water-cooled flow path in the second heat sink of the composite heat sink assembly. It is further explained that the first cover 230 of the embodiment is disposed on the side of the second heat dissipation plate 220, and the first cover 230 and the cooling plate 210 are engaged with each other, so that the first cover 230 covers the cooling plate 210. The top surface is surrounded by four to form a closed chamber. When the interface card 430 is electrically inserted on the circuit board 420, the second water inlet 215 and the second water outlet 216 are passed through the casing 410 and exposed outside the casing 410 to connect the pipeline (not shown). The second water inlet 215 can input the low temperature liquid into the closed chamber formed by the first cover 230 and the cooling plate 210, respectively pass through the left and right flow passages 214, and then the second water outlet 216 discharges the heat source. The high temperature liquid forms a water-cooled row with heat exchange, so that the temperature on the second heat sink 220 is rapidly lowered, thereby enabling the interface card 430 to achieve heat dissipation.

In addition, in order to have a more excellent heat dissipation effect, the embodiment The composite heat dissipating component can be selectively installed with a water-cooled heat sink 500 attached to an electronic component (such as a CPU) of the circuit board 420, wherein the water-cooled heat sink 500 is a water-cooled pump and is water-cooled. The heat sink 500 has a third water inlet 510 and a third water outlet 520. The two pipes pass through the casing 410 and are respectively connected to the third water inlet 510 and the third water outlet 520, and the water-cooled heat sink 500 The operation of the pump member 140 is the same as that of the above, so that the electronic components on the circuit board 420 can be cooled to achieve the purpose of heat dissipation, and the applicant will not repeat them here.

Composite heat dissipating component disclosed in the second embodiment of the present invention The overall structure is similar to that of the heat dissipation module of the first embodiment described above, and therefore the following is only for the details of the difference between the two.

Please refer to both Figure 5A and Figure 5B. Second invention of the present invention The difference between the composite heat dissipating component disclosed in the embodiment and the composite heat dissipating component disclosed in the first embodiment is that the second heat dissipating device 300 of the second embodiment is disposed on the interface card 430 and the second heat dissipating The device 300 has a cooling plate 310 and a second heat dissipation plate 320. Wherein the cooling plate 310 has an opposite one The first surface 311 and the second surface 312 have a plurality of flow paths 313 formed on the first surface 311. The cooling plate 310 has a second water inlet 314 and a second water outlet 315. It is worth noting that the flow path 313 is divided into two parts, left and right, and communicates with each other at the bottom end. The second water inlet 314 is connected to a part of the flow path 313, and the second water outlet 315 is connected to the other part. Flow path 313.

The second heat sink 320 is attached to the cold side by one side The first surface 311 of the board 310 is configured to form a closed chamber, and the other side of the second heat sink 320 is coupled to the interface card 430. The second heat sink 320 and the cooling plate 310 can be soldered to each other. Attachment, such as diffusion soldering, solder paste soldering, spot soldering, etc., is not limited thereto.

Please also refer to Figure 5C. Wherein, when the interface card 430 is electrically When being inserted into the circuit board 420, the second water inlet 314 and the second water outlet 315 are passed through the casing 410 and exposed outside the casing 410 to connect the pipeline (not shown) to the second water inlet. 314 can input the cryogenic liquid into the closed chamber formed by the second heat sink 320 and the cooling plate 310, respectively pass through the left and right flow passages 313, and then discharge the high temperature liquid adsorbing thermal energy from the second water outlet 315 to form a heat exchange. The function of the water-cooled row causes the temperature on the second heat sink 320 to rapidly drop, thereby enabling the interface card 430 to achieve heat dissipation.

Please also refer to Figures 6 to 7. In addition, in order to have more The second heat dissipating device 300 of the present embodiment can be provided with a heat dissipating fin set 330, a second fan 340 and a second cover 350. The heat dissipating fin set 330 is attached to the cooling plate 310. The second side 312 is bonded to each other by soldering or soldering, so that the heat dissipation fin group 330 and the cooling plate 310 are more thermally conductive. The second fan 340 is mounted in the second cover 350 and corresponds to the heat dissipation fin set 330. The second cover 350 covers the cooling plate 310, the second heat dissipation plate 320, the heat dissipation fin set 330 and the second The fan 340, when the second fan 340 generates an airflow, the heat dissipation fin set 330 and the second fan 340 can assist the second heat sink 300 to dissipate the interface card 430 more quickly, thereby facilitating heat exchange with the outside air. Role to achieve better heat dissipation Rate and heat dissipation.

Please also refer to Figure 8. In addition, in order to have a better dispersion The heat-dissipating component of the embodiment of the present invention is optionally further provided with a water-cooled heat sink 500 attached to an electronic component (such as a CPU) of the circuit board 420, wherein the water-cooled heat sink 500 is a water-cooled pump, and the water-cooled radiator 500 has a third water inlet 510 and a third water outlet 520. The two pipelines pass through the casing 410 and are respectively connected to the third water inlet 510 and the third water outlet. 520, and the water-cooled heat sink 500 and the pumping unit 140 operate in the same manner, so that the electronic components on the circuit board 420 can be cooled to achieve the purpose of heat dissipation, so the applicant will not repeat them here.

Illustrative of the embodiments disclosed above, It is clear that the composite heat dissipating component of the present invention can solve the problem of poor adaptability of the water-cooled heat dissipating device by modularizing the water-cooling pump and the water-cooling row.

Compared with the prior art, the composite heat dissipating component of the invention The system not only utilizes the modular design of the water-cooled pump and the water-cooled row to achieve good heat dissipation, but also allocates the required heat dissipation power according to the actual heat generation of the electronic components to meet the needs of different users, and is more in line with Economic benefits. At the same time, the water channel connection between the water-cooled pump and the water-cooled row is designed outside the casing, so that there is no problem of water leakage inside the casing, and the electronic components in the casing are prevented from being damaged due to water leakage, so as to achieve the protection effect.

Although the embodiments of the present invention are disclosed above, it is not intended to limit the present invention, and those skilled in the art, regardless of the spirit and scope of the present invention, the shapes, structures, and features described in the scope of the present application. And the number of modifications may be made, and the scope of patent protection of the present invention shall be determined by the scope of the patent application attached to the specification.

100‧‧‧First heat sink

200‧‧‧second heat sink

215‧‧‧Second water inlet

216‧‧‧Second outlet

400‧‧‧Electronic devices

410‧‧‧Chassis

420‧‧‧ boards

430‧‧‧Interface card

500‧‧‧Water-cooled radiator

530‧‧‧pipe

Claims (9)

A composite heat dissipating component is suitable for an electronic device, the electronic device has a casing, a circuit board disposed in the casing, and an interface card electrically inserted on the circuit board, wherein the casing is One side has an opening, the composite heat dissipating assembly includes: a first heat dissipating device disposed on the side of the casing and corresponding to the opening, the first heat dissipating device having: a body; a first fan, The first heat dissipation plate is disposed on a side of the body, and the first heat dissipation plate has at least one groove; and at least one pump member is disposed in the first heat dissipation In the groove of the plate, the pump member has a first water inlet and a first water outlet exposed outside the first heat dissipation plate; and a second heat dissipation device disposed on the interface card, the second The heat dissipating device has a cooling plate having a first surface and a second surface, and a first surface having a plurality of fins standing up to each other to form a plurality of flow channels, the cooling plate having a second inlet The nozzle and the second outlet are connected separately The flow channel, wherein the second water inlet and the second water outlet are exposed outside the casing through the casing; and a second heat dissipation plate is attached to the cooling plate by one side thereof Two sides, the second heat sink is attached to the interface card on the opposite side; and A first cover is disposed on the side of the second heat dissipation plate, and covers the cooling plate to form a closed chamber. The composite heat dissipating component of claim 1, further comprising a water-cooled heat sink attached to an electronic component of the circuit board, the water-cooled heat sink having a third water inlet and a third water outlet a nozzle, two pipelines passing through the casing and respectively connected to the third water inlet and the third water outlet. The composite heat dissipating component of claim 1, wherein the second heat dissipating plate and the cooling plate are made of a copper alloy. The composite heat dissipating assembly of claim 1, wherein the second heat dissipating plate and the cooling plate are welded to each other. A composite heat dissipating component is suitable for an electronic device, the electronic device has a casing, a circuit board disposed in the casing, and an interface card electrically inserted on the circuit board, wherein the casing is One side has an opening, the composite heat dissipating assembly includes: a first heat dissipating device disposed on the side of the casing and corresponding to the opening, the first heat dissipating device having: a body; a first fan, The first heat dissipation plate is disposed on a side of the body, and the first heat dissipation plate has at least one groove; and at least one pump member is disposed in the first heat dissipation In the groove of the plate, the pump member has a first water inlet and a first water outlet exposed outside the first heat dissipation plate; and a second heat dissipation device disposed on the interface card, the second Cooling device The utility model has a cooling plate having a first surface and a second surface, wherein the first surface has a plurality of flow channels, the cooling plate has a second water inlet and a second water outlet, respectively connected to The flow channel, wherein the second water inlet and the second water outlet are exposed outside the casing through the casing; and a second heat dissipation plate covering the first side of the cooling plate with one side thereof One side is configured to form a closed chamber, and the second heat sink is attached to the interface card on the opposite side. The composite heat dissipating component of claim 5, further comprising a water-cooled heat sink attached to an electronic component of the circuit board, the water-cooled heat sink having a third water inlet and a third water outlet a nozzle, two pipelines passing through the casing and respectively connected to the third water inlet and the third water outlet. The composite heat dissipating component of claim 5, wherein the second heat dissipating device further comprises a heat dissipating fin set, a second fan and a second cover, the heat dissipating fin set is attached to the cooling plate The second fan is disposed on the heat dissipating fin set, and the second cover covers the cooling plate, the second heat dissipating plate, the heat dissipating fin set and the second fan. The composite heat dissipating component of claim 5, wherein the second heat dissipating plate and the cooling plate are made of a copper alloy. The composite heat dissipating assembly of claim 5, wherein the second heat dissipating plate and the cooling plate are welded to each other.