TW201507220A - Optical module and manufacturing method thereof - Google Patents

Abstract

The present invention discloses a COB (Chip On Board)-type optical module and a manufacturing method thereof. The optical module includes a lower substrate, a first PCB formed on the lower substrate, having a through hole, and including a plurality of electrodes formed on a surface thereof, and a silicon substrate accommodated within the through hole of the first PCB and having a light emitting device mounted on a surface thereof, wherein the light emitting device on the silicon substrate is electrically connected to the electrodes of the first PCB. With such a configuration, an assembly process is simplified and material cost is reduced, while obtaining the effects of improving heat dissipation characteristics, an advantage of a module using a silicon (Si) substrate, thus enhancing luminance efficiency, whereby low-priced, high performance COB-based optical module can be fabricated. Also, since a driving circuit is installed to be integrated with the optical module.

Description

Optical module and method of manufacturing same

The present invention relates to an optical module and a method of fabricating the same, and more particularly to a COB (direct wafer package) type optical module and a method of fabricating the same.

According to a general method for manufacturing a general-purpose optical module, a light-emitting device is assembled in a lead frame type package, and phosphor is applied thereon to form an individual package, and the assembled device is mounted on a PCB (printed circuit) One of the panels) is formed on the surface to form a lighting module.

However, in this way, the heat dissipation characteristics of an optical device are degraded to have low luminous efficiency, and the size limitation of the optical device limits the generation of brightness equal to the existing illumination bulb. In addition, the cost cannot be reduced.

In an effort to overcome such shortcomings, COB (Chip Direct Package) technology has been developed. A general-purpose COB type optical module is manufactured by connecting a light-emitting device to an area to be attached to the device by performing patterning using an MC-PCB (metal core printed circuit board); Assembling a light-emitting device; and subsequently applying phosphorus to the light-emitting device.

However, although this type of MC-PCB has superior thermal conductivity, its material is expensive, and it is followed by equipment investment such as installation of equipment specially designed for mass production, and in the process of manufacturing MC-PCB. It is difficult to perform microfabrication equal to or less than 50 um. Therefore, this type of technology has been evaluated to be inefficient in manufacturing an illumination optical module, and its high cost has also been pointed out to be unsuitable as a lighting module.

As a solution, Korean Patent Registration No. 10-1121151 discloses a method for manufacturing a COB type optical module using a bismuth (Si) substrate instead of the MC-PCB. The Si substrate has superior heat release capability compared to the MC-PCB, and thus has excellent heat dissipation characteristics due to its transmission characteristics for infrared light emitted from a light-emitting device. Likewise, germanium (Si) substrates can be used for mirror processing, with improved total luminous efficiency for light emitted from a light emitting device with improved overall luminous efficiency.

However, even in the foregoing method, the bismuth (Si) substrate is still subjected to the soldering operation, but the soldering operation performed on the bismuth (Si) substrate has a high level of difficulty in the process and reduces the process efficiency. Also, a high cost bismuth (Si) substrate increases the unit cost of production, and further, it is difficult to manufacture a COB module having various shapes (for example, a circular shape) in the process of processing a cerium (Si) substrate.

An object of the present invention is to provide an optical module and a method of fabricating the same that can produce a COB with high level of heat dissipation efficiency using a germanium (Si) substrate without performing a soldering process on a germanium (Si) substrate. Directly packaged) optical modules for superior operability, reducing production unit cost by reducing the area of the bismuth (Si) substrate, and forming a light source having a desired shape.

Another object of the present invention is to provide an optical film set and a method of fabricating the same that is capable of mounting a circuit for driving a light-emitting device in a substrate to achieve a single package.

Another object of the present invention is to provide an optical film set and a method of fabricating the same that is capable of attaching various circuits required for driving a light-emitting device to a substrate to achieve a single package.

Another object of the present invention is to provide an optical film set and a method of manufacturing the same that can easily process a substrate shape to form a light source having various shapes (e.g., a circular shape).

According to an embodiment of the present invention for achieving the above object, an optical module includes a non-metal matrix first PCB having a through hole and including a plurality of electrodes formed on a surface thereof; a silicon (Si) substrate housed in the through hole of the first PCB, having an insulating layer formed on one surface thereof, and including a light emitting device mounted on the surface thereof, wherein the germanium (Si) substrate is mounted thereon The light emitting device is electrically connected to the electrodes of the first PCB.

According to another embodiment, a dam for applying phosphorus may be formed on the first PCB and phosphorus may be applied to the inner side of the dam.

According to another embodiment, the light emitting device mounted on the germanium (Si) substrate may be electrically connected to the electrodes of the first PCB by a thin gold wire.

According to another embodiment, the first PCB may have a circular shape, and the through hole may have a quadrangular shape of a pair of silicon (Si) substrates.

According to another embodiment, the first PCB may have a quadrangular shape, and the through hole may have a quadrangular shape of a pair of Si (Si) substrates.

According to another embodiment, a second PCB of a non-metal matrix may be formed on top of the first PCB, and a driving circuit for driving the light emitting device mounted on the germanium (Si) substrate is formed on Among the first PCB and one or more of the second PCB.

According to another embodiment, the insulating material of the first PCB and the second PCB may be FR-1, FR-2, FR-3, FR-4, FR-5, FR-6, CEM-1, CEM. -2, CEM-3, CEM-4, CEM-5, Teflon, G-10 and G-11.

According to another embodiment, the first PCB may be formed on a lower substrate made of a metal and having an insulating layer formed on one surface thereof.

According to another embodiment, the lower substrate may be an aluminum (Al) substrate having an insulating layer formed on one surface thereof.

In accordance with another embodiment, the germanium (Si) substrate can be attached to the lower substrate by a heat transfer fluid material medium such that the germanium (Si) substrate is received within the via.

According to another embodiment of the present invention for achieving the above object, a method for fabricating an optical module includes the steps of attaching a germanium (Si) substrate to a non-metal matrix PCB to a lower substrate So that the germanium (Si) substrate is housed in the via hole of the PCB, the germanium (Si) substrate includes an insulating layer formed on one surface thereof, and has a light emitting device mounted thereon; the PCB An electrode and a through hole formed thereon; and the lower substrate is made of metal and includes an insulating layer formed on one surface thereof; and the light emitting device electrically connecting the germanium (Si) substrate and the The electrodes of the PCB.

According to another embodiment, a germanium (Si) substrate and a non-metal matrix PCB are attached to the lower substrate such that the germanium (Si) substrate is received in the via of the PCB, the lower substrate And the germanium (Si) substrate may be attached by a heat transfer fluid material medium, wherein the germanium (Si) substrate comprises an insulating layer formed on one surface thereof and has a light emitting device mounted thereon The PCB has an electrode and a through hole formed thereon; and the lower substrate is made of metal and includes an insulating layer formed on one surface thereof.

According to another embodiment, in a process of attaching a germanium (Si) substrate and a non-metal matrix PCB to a lower substrate such that the germanium (Si) substrate is received in the through hole of the PCB, A polymer is applied to one surface of the PCB to form a mask for electroplating, and the electroplating is subsequently performed, wherein the germanium (Si) substrate includes an insulating layer formed on one surface thereof and has an installation a light-emitting device thereon; the PCB has an electrode and a through hole formed thereon; and the lower substrate is made of metal and includes an insulating layer formed on one surface thereof.

According to an embodiment of the present invention, an assembly process is simplified and material cost is reduced, and at the same time, the effect of improving heat dissipation characteristics is achieved, which is an advantage of using a module of a bismuth (Si) substrate, thereby enhancing luminance efficiency, thereby being made Cheap, high performance COB based optical modules.

Similarly, when fabricated as a PCB, an area other than the light-emitting area of the module can be used to allow circuitry for driving different types of optical modules to be installed therein, solving the problem of installing the circuit during the manufacture of the lighting fixture. The space limitation problem, and since the heat generated during the operation of the circuit can be effectively dissipated, illumination light capable of extending the life of the circuit can be made.

100‧‧‧First PCB

110‧‧‧through hole

120‧‧‧electrode

130‧‧‧Electroplating

140‧‧‧Electrode wire

150‧‧‧ wire bonding

160‧‧‧ dam

170‧‧‧Phosphorus

200‧‧‧lower substrate

300‧‧‧矽(Si) substrate

400‧‧‧Lighting device

500‧‧‧second PCB

1 is a plan view showing a first PCB structure according to an embodiment of the present invention;

2 is a cross-sectional view of an optical module according to an embodiment of the present invention;

Figure 3 is a plan view of an optical module in accordance with an embodiment of the present invention;

4 is a cross-sectional view of an optical module having phosphorus coated thereon in accordance with an embodiment of the present invention;

5 is a cross-sectional view of an optical module having a second PCB attached thereto according to an embodiment of the present invention; and

Figure 6 is a plan view showing a first PCB structure formed into a circular shape in accordance with an embodiment of the present invention.

The present invention provides an optical module including a non-metal matrix first PCB having a through hole and including a plurality of electrodes formed on one surface thereof; and a Si (Si) substrate accommodating the first The through hole of the PCB has an insulating layer formed on one surface thereof and includes a light emitting device mounted on a surface thereof, wherein the light emitting device on the germanium (Si) substrate is electrically connected to the electrode of the first PCB.

Hereinafter, embodiments of the present invention will be described in detail with reference to the accompanying drawings.

1 is a plan view showing a first PCB structure according to an embodiment of the present invention. In particular, the first PCB 100 is characterized in that any substrate can be used, even if it is not a metal-based substrate (for example, a metal core printed circuit board (MC-PCB)). That is, the first PCB 100 is a non-metal matrix PCB, which can use FR-1, FR-2, FR-3, FR-4, FR-5, FR-6, CEM-1, CEM-2, CEM- 3. Any one of CEM-4, CEM-5, Teflon, G-10 and G-11 as an insulating material. In particular, a general-purpose PCB (for example, FR-4, FR-5, etc.) using glass as a reinforcing substrate can be used. The through hole 110 is formed at the center of the first PCB 100, and a plurality of electrodes 120 to be electrically connected to the light emitting device are formed at the vicinity of the through hole 110. Likewise, the plating layer 130 is formed to be close to the through hole 110. Preferably, the plating layer 130 to be wire bonded to the light emitting device is made of gold. The plating layer 130 is electrically connected to the electrode 120 through the electrode lead 140. Although not shown in FIG. 1, the lower substrate 200 is attached to the bottom of the first PCB 100 at a later time. Preferably, in order to enhance heat dissipation efficiency, the lower substrate 200 is made of metal, and in particular, the lower substrate 200 may be an aluminum (Al) substrate including an insulating layer formed thereon. Similarly, after the circuit of the electrode 120 and the electrode lead 140 is formed on the first PCB 100, various components for driving the optical module can be surface mounted on the first PCB 100 to be made for later connection. The drive circuit of the optical module.

2 is a cross-sectional view of a laterally obtained optical module in accordance with an embodiment of the present invention. The first PCB 100 is attached to the lower substrate 200 made of metal, and a bismuth (Si) substrate 300 having an insulating layer formed thereon is attached to the lower substrate 200 to be disposed on the first PCB 100. In the hole 110. A light emitting device is formed over the top of the germanium (Si) substrate 300. In this case, one or more of the light-emitting devices may be formed as an array of, for example, 4×4. In the case of forming a plurality of light-emitting devices, the individual light-emitting devices may be electrically connected in parallel, in series, or in series and parallel. This and subsequent figures only show the arrangement of the light-emitting device and the electrical connection between the devices on the germanium (Si) substrate 300. All of the light emitting devices 400 are electrically connected to the plurality of electrodes 120 of the first PCB 100, and in the present embodiment, the light emitting device 400 is electrically connected to the electrodes 120 through the wire bonds 150 having the plating layer 130 and through the electrode wires 140. According to another embodiment of the present invention, an electroplated layer may be additionally formed on the germanium (Si) substrate 300, and the light emitting device 400 may be wire bonded to the plating layer of the germanium (Si) substrate 300, and again from the germanium (Si) substrate 300. The plating layer wire is bonded to the plating layer 130 of the first PCB 100. Therefore, in one embodiment of the present invention, the electrical connection of the light-emitting device 400 on the 矽 (Si) substrate to the electrode 120 of the first PCB 100 is understood to include the following two cases: direct bonding of the light-emitting device 400 through wires The case of connecting to the plating layer of the first PCB 100, and the case where the light emitting device 400 is connected to the plating layer of the first PCB 100 through the plating layer formed on the cerium (Si) substrate 300. Here, preferably, the bismuth (Si) substrate 300 includes an insulating layer formed on an upper surface thereof, and the wire bonding 150 is a fine gold wire. The electrode 120 is connected to a driving power source for driving the light emitting device 400 later to enable the light emitting device 400 to emit light, and heat generated from the light emitting device 400 can be dissipated through the germanium (Si) substrate 300 and the lower substrate 200. Therefore, preferably, the bismuth (Si) substrate 300 and the lower substrate 200 are attached by a heat transfer fluid material medium (for example, a thermal conductive paste or the like).

That is, as can be seen from the foregoing structure, the electrode unit is configured by forming the first PCB 100 surrounding the bismuth (Si) substrate, eliminating the soldering operation for the bismuth (Si) substrate 300, simplifying the process, and Only the space for mounting the light-emitting device 400 is required on the Si) substrate 300, and the size of the germanium (Si) substrate required for each module is reduced to reduce the material cost. As a result, the COB type optical module has two advantages in its structure: the advantages of the first PCB 100 in mounting the circuit, and the advantages of the (Si) substrate 300 in heat dissipation and mirror processing. Also, according to an embodiment of the present invention, a circuit such as a DC-DC converter required for driving the light-emitting device 400 can be easily mounted in the first PCB 100, and in this case, it can be advantageously provided to include Even the integrated optical module of the drive circuit.

3 is a plan view showing the structure of an optical module according to an embodiment of the present invention. As mentioned above, the NMOS (Si) substrate 300 having the light-emitting device 400 mounted thereon is attached to the lower substrate 200 such that it is housed in the through hole 110 of the first PCB 100.

Figure 4 is a cross-sectional view of a laterally obtained optical module having phosphor applied thereto in accordance with an embodiment of the present invention. The optical module according to the present embodiment has the configuration obtained by adding the dam 160 and the phosphor 170 to the optical module structure shown in FIG. As illustrated, the dam 160 is formed to surround the bismuth (Si) substrate 300 on the first PCB 100, and the phosphor 170 is applied thereto to form an optical module. Here, the phosphorus 170 can function as an encapsulant which protects the light-emitting device 400, the plating layer 130, and the wire bonding 150 against an external material such as moisture, dust, and enhances the light-emitting characteristics of the light-emitting device 400 by the phosphorus material contained therein. .

Figure 5 is a cross-sectional view of a laterally obtained optical module in accordance with another embodiment of the present invention. An optical module according to another embodiment of the present invention has a configuration in which a second PCB 500 having a hole formed to not emit light in the upward direction without restricting the light-emitting device 400 is mounted on top of the dam 160. Here, preferably, the second PCB 500 is a non-metal matrix PCB as described above with respect to the first PCB 100. Likewise, the second PCB 500 can have any other configuration with respect to the layered manner of the first PCB 100 as long as the illumination device 400 is not limited to emit light. Also, according to an embodiment, like the first PCB 100, the second PCB 500 may have circuitry mounted therein to drive the light emitting device 400. In this case, by laminating the PCB including the driving circuit mounted therein, an optical module in which the driving circuit is integrated can be provided, and the size of the single module can be remarkably reduced.

Figure 6 illustrates an arrangement in accordance with an embodiment of the present invention in which the first PCB 100 has a circular shape. In the case of manufacturing a COB type optical module only from a bismuth (Si) substrate, it is necessary to treat the bismuth (Si) substrate to have a circular shape, which causes difficulty in the process. Therefore, as shown in FIG. 6, by using the method of arranging the PCB, the outer portion of the optical module can maintain a circular shape and can reduce the difficulty in the process, wherein the PCB is relatively easy to handle to have a circular shape. The PCB has a circular shape.

Hereinafter, a method for manufacturing the optical module shown in FIG. 4 according to an embodiment of the present invention will be described in detail with reference to FIG. Here, a method for manufacturing an optical module using an LED as a light-emitting device 400 and an aluminum oxide (Al) substrate as the lower substrate 200 will be described.

First, one surface of a cerium (Si) substrate on which an LED is to be mounted is insulated to form a substrate on which an LED is mounted. In this case, the insulating germanium (Si) substrate 300 can be manufactured by using the "LED module and its manufacturing method", which is disclosed in Korean Patent Registration No. 10-1121151 filed by the same applicant of the present invention. The upper surface of the aluminum (Al) substrate is oxidized to fabricate an aluminum (Al) substrate having an insulating upper surface. Thereafter, the first PCB 100 is shaped to have a rectangular through hole 110 at a central portion, and electrode leads 140 are formed on the first PCB 100, and respectively form electrodes 120 as anodes and cathodes. Subsequently, the first PCB 100 excluding the region in which the cerium (Si) substrate 300 is attached, the region for the electrode 120, and the region in which the plating layer 130 is to be formed is coated with a polymer, here, polymerization The material serves as a film for preventing the oxidation of the P first CB 100 and increasing the reflectance (or reflectance) of the light generated after the optical module is formed and as a mask for performing selective plating. After the selective plating operation is performed to form the plating layer 130, a dam process for applying phosphorus is performed to fabricate the dam 160, completing the first PCB 100. An insulating aluminum (Al) substrate is attached to the first PCB 100 fabricated in this manner, where an aluminum (Al) substrate may be attached by an adhesive, and an aluminum (Al) substrate may be used as the lower substrate 200. Thereafter, a winding process for forming an outer edge and a V-groove process for individual separation are performed, and a package for mounting the NMOS (Si) substrate 300 thereon is completed. A fluid material such as a thermally conductive paste for heat transfer is applied to a region of the through hole 110 of the package, and the resulting ytterbium (Si) substrate 300 is attached thereto, and the LED device is bonded by a die, followed by a wire with the plating layer 130 Engaged to complete the electrical connection of the electrode 120 and the LED device. Finally, phosphorus 170 is applied to the area surrounded by the dam 160 to complete the fabrication of the optical module.

The embodiments have been described in detail so far with reference to the accompanying drawings, so that those skilled in the art to which the invention pertains can be easily practiced. However, the invention may be embodied in a variety of forms and is not limited to the embodiments disclosed below. Also, in order to make the present invention clear and easy to understand, the parts that are not described are omitted, and the same reference numerals are used for similar parts throughout the specification.

It must be understood that when an element is referred to as "connected to" another element, it can be directly connected to the other element or the intervening element. Conversely, when a component is referred to as being "directly connected" to another component, no intervening component is present. In addition, unless explicitly stated to the contrary, the words "comprise" and variations such as "comprises" or "comprinsing" are understood to mean the inclusion of the stated elements but does not exclude any Other components.

According to an embodiment of the present invention, an optical module and a method of fabricating the same can be provided, which can manufacture a COB having a high level of heat dissipation efficiency using a cerium (Si) substrate without performing a soldering process on a germanium (Si) substrate ( The wafer directly encapsulates the type of optical module, achieving superior operability, reducing the unit cost of production by reducing the area of the bismuth (Si) substrate, and forming a light source having a desired shape.

As such, an optical module and a method of fabricating the same can be provided which are capable of mounting a circuit required for driving a light-emitting device in a substrate to achieve a single package.

As such, an optical module and a method of fabricating the same can be provided that can attach various circuits required for driving the light emitting device to the substrate to achieve a single package.

Also, an optical module and a manufacturing method thereof can be provided which can easily process a substrate shape to form a light source having various shapes (for example, a circular shape or the like).

100‧‧‧First PCB

120‧‧‧electrode

130‧‧‧Electroplating

140‧‧‧Electrode wire

150‧‧‧ wire bonding

160‧‧‧ dam

170‧‧‧Phosphorus

200‧‧‧lower substrate

300‧‧‧矽(Si) substrate

400‧‧‧Lighting device

Claims (1)

An optical module includes:
a first PCB of a non-metal matrix having a through hole and including a plurality of electrodes formed on one surface thereof; and a germanium (Si) substrate housed in the through hole of the first PCB, and Having an insulating layer formed on one surface thereof and including a light-emitting device mounted on the surface thereof,
The light emitting device on the germanium (Si) substrate is electrically connected to the electrodes of the first PCB.
2. The optical module according to claim 1, wherein a dam for applying phosphorus is formed on the first PCB, and a phosphorus system is applied to the inner side of the dam.
3. The optical module of claim 1, wherein the light emitting device mounted on the germanium (Si) substrate is electrically connected to the electrodes of the first PCB by a thin gold wire.
4. The optical module of claim 1, wherein the first PCB has a circular shape, and the through hole has a quadrangular shape of a pair of (Si) substrates.
5. The optical module of claim 1, wherein the first PCB has a quadrangular shape, and the through hole has a quadrangular shape of a pair of (Si) substrates.
6. The optical module according to any one of claims 1 to 5, wherein a second PCB of a non-metal matrix is formed on top of the first PCB, and a driver is mounted on the cymbal ( A driving circuit of the illuminating device on the Si substrate is formed in one or more of the first PCB and the second PCB.
7. The optical module according to any one of claims 1 to 5, wherein the insulating material of the first PCB and the second PCB is FR-1, FR-2, FR-3, FR-4, Any of FR-5, FR-6, CEM-1, CEM-2, CEM-3, CEM-4, CEM-5, Teflon, G-10 and G-11.
8. The optical module according to any one of claims 1 to 5, wherein the first PCB is formed on a lower substrate, the lower substrate is made of a metal, and has a surface formed on one surface thereof Insulation layer.
9. The optical module of claim 8, wherein the lower substrate is an aluminum (Al) substrate having an insulating layer formed on a surface thereof.
10. The optical module of claim 8, wherein the germanium (Si) substrate is attached to the lower substrate by a heat transfer fluid material medium such that the germanium (Si) substrate is received in the through hole Inside.
11. A method for manufacturing an optical module, the method comprising the steps of:
Attaching a germanium (Si) substrate and a non-metal matrix PCB to the lower substrate such that the germanium (Si) substrate is received in the through hole of the PCB, wherein the germanium (Si) substrate comprises one formed in one An insulating layer on the surface and having a light-emitting device mounted thereon; the PCB has an electrode and a through hole formed thereon; and the lower substrate is made of metal and includes a surface formed on one surface thereof An insulating layer; and the light emitting device electrically connected to the germanium (Si) substrate and the electrodes of the PCB.
12. The method of claim 11, wherein a germanium (Si) substrate and a non-metal matrix PCB are attached to the lower substrate such that the germanium (Si) substrate is received in the via of the PCB. In the process, the lower substrate and the bismuth (Si) substrate are attached by a heat transfer fluid material medium, wherein the bismuth (Si) substrate comprises an insulating layer formed on one surface thereof and has an installation a light-emitting device thereon; the PCB has an electrode and a through hole formed thereon; and the lower substrate is made of metal and includes an insulating layer formed on one surface thereof.
13. The method of claim 11, wherein a germanium (Si) substrate and a non-metal matrix PCB are attached to the lower substrate such that the germanium (Si) substrate is received in the via of the PCB. In the process, a polymer is applied to one surface of the PCB to form a mask for electroplating, and then electroplating is performed, wherein the germanium (Si) substrate includes an insulating layer formed on one surface thereof. And having a light-emitting device mounted thereon; the PCB has an electrode and a through hole formed thereon; and the lower substrate is made of metal and includes an insulating layer formed on one surface thereof.