TW201506702A - Electronic device having touch panel and assembling method of the same - Google Patents

Abstract

The present disclosure relates to an electronic device. The electronic device includes a touch panel and a frame. The touch panel includes a protective layer, a sensing layer, and a first optical transparent adhesive layer. The first optical transparent adhesive layer includes a first surface and a second surface opposite to the first surface. The protective layer is adhered to the first surface. The second surface includes a centre area and a peripheral area. The sensing layer is adhered to the centre area. The frame is adhered to the peripheral area. The electronic device has a good dust-proofing effect, and is easy to assemble. The present disclosure also relates to an assembling method of the electronic device.

Description

Electronic device with touch screen and assembly method thereof

The invention relates to an electronic device with a touch screen and an assembly method thereof.

An electronic device having a touch screen, when the touch screen is attached to the frame of the electronic device, is generally glued on the frame, and then the touch screen is attached thereto; or the touch screen corresponds to the frame The position is attached to the double-sided tape, and the double-sided tape is used to bond the frame and the touch screen. However, there is a problem with the above-described bonding method. First of all: the above method requires additional glue or double-sided tape process, which increases the working time. Secondly, for small-sized electronic products, the area where the glue is applied or the double-sided tape is usually small, which increases the difficulty of the operation and may cause problems of inaccuracy. Finally, for the way of bonding with double-sided adhesive strips, different double-sided adhesive strips need to be attached on different sides of the touch screen, and there are often gaps between different double-sided adhesive strips, and dust will enter the electronic device from the gaps. Internal, resulting in poor dust protection.

In view of the above, it is necessary to provide an electronic device that can solve the above problems.

In view of the above, it is also necessary to provide an assembly method of an electronic device that can solve the above problems.

An electronic device includes a touch screen and a frame. The touch screen includes a protective layer, a sensing layer and a first optically transparent adhesive layer. The first optically clear adhesive layer includes a first surface and a second surface opposite each other. The protective layer is attached to the first surface. The second surface includes a central region and a peripheral region, the sensing layer is attached to the central region, and the frame is attached to the peripheral region.

A method of assembling an electronic device, comprising:

Providing a touch screen, a frame and an optical transparent adhesive layer component, the touch screen comprising a protective layer and a sensing layer, the optical transparent adhesive layer component comprising a first optical transparent adhesive layer, a light release film and a heavy release film, the first An optically transparent adhesive layer includes a first surface and a second surface opposite to each other, the light release film being attached to the first surface, the heavy release film being attached to the second surface, the second surface including the center a region and a peripheral region, the heavy-duty film including a central portion and a peripheral portion that are separable from each other, the central portion corresponding to the central region, the edge portion corresponding to the peripheral region;

Removing the light release film on the first surface and attaching the first surface to the protective layer;

Removing the central portion of the central region and attaching the sensing layer to the central region; and

The peripheral portion on the peripheral region is torn away and the frame is attached to the peripheral region.

The first optical transparent adhesive layer is divided into a central area corresponding to the sensing layer and a peripheral area of the corresponding frame, so that the frame can be adhered to the touch screen through the peripheral area, and no additional process of dispensing or double-sided tape is needed. , saving time and avoiding the risk of inaccurate stickers. Moreover, since the first optically transparent adhesive layer is a single piece, there is no gap in the middle, and dust is prevented from entering the inside of the electronic device from the gap, and the dustproof effect is better.

1 is a schematic structural view of an electronic device according to a first embodiment of the present invention.

2 is a schematic structural view of an optical transparent adhesive layer of the electronic device shown in FIG. 1 , wherein a release film is attached to the optical transparent adhesive layer.

3 is a top plan view of the optically clear adhesive layer with a release film shown in FIG. 2.

4 to 7 are schematic views showing a method of assembling an electronic device according to a second embodiment of the present invention.

Referring to FIG. 1, an electronic device 100 according to a first embodiment of the present invention is disclosed. In the embodiment, the electronic device 100 is a display device. The electronic device 100 includes a touch screen 10 , a display module 20 , and a frame 30 .

The touch screen 10 includes a protective layer 11 , a sensing layer 13 , and an optically transparent adhesive layer 15 that bonds the protective layer 11 and the sensing layer 13 . The material of the protective layer 11 is generally glass. However, in other embodiments, the protective layer 11 may also be other materials such as a transparent resin material. The size of the protective layer 11 is larger than the size of the sensing layer 13 such that when the sensing layer 13 is adhered to the protective layer 11 through the optically transparent adhesive layer 15, the region of the periphery of the protective layer 11 is not covered by the sensing layer 13.

In this embodiment, the sensing layer 13 includes a substrate and a touch sensing electrode formed on the substrate. The material of the substrate may be glass, and in other embodiments, it may be a transparent resin film. The material of the touch sensing electrode may be a conductive material such as Indium Tin Oxide (ITO) or a metal wire.

The size of the optically transparent adhesive layer 15 is larger than the size of the sensing layer 13, and is equal to or slightly smaller than the size of the protective layer 11. The optical transparent adhesive layer 15 includes a first surface 151 adhered to the protective layer 11 and a second surface 153 opposite to the first surface 151. Referring to FIG. 2 and FIG. 3 together, the second surface 153 includes a central region 155 corresponding to the sensing layer 13 and a peripheral region 157 surrounding the central region 155. When the film is attached, the sensing layer 13 is adhered to the central region 155, and the frame 30 is adhered to the peripheral region 157, thereby connecting the touch screen 10 and the frame 30 together. The material of the optical transparent adhesive layer 15 may be an organic silicone rubber, an acrylic resin, an unsaturated polyester, a polyurethane, or an epoxy resin.

Before being used for bonding, the first surface 151 of the optical transparent adhesive layer 15 is attached with a light release film 17 on which a heavy release film 19 is attached, and the optical transparent adhesive layer 15 is attached. The light release film 17 and the heavy release film 19 together form an optically transparent adhesive layer component. The light release film 17 and the release film 19 are used to protect the optically clear adhesive layer 15 from dirt or scratches. The adhesion between the release film 19 and the optically clear adhesive layer 15 is greater than the adhesion between the light release film 17 and the optically clear adhesive layer 15, so that the light release film 17 is more easily torn from the optically transparent adhesive layer 15. from. The release film 19 is cut into a central portion 191 corresponding to the central portion 155 of the second surface 153 and a peripheral portion 193 of a corresponding peripheral region 157. The central portion 191 and the peripheral portion 193 are separated from each other and can be peeled off from the optically clear adhesive layer 15 independently of each other. In the present embodiment, the light release film 17 and the heavy release film 19 are obtained by coating a release agent on a resin substrate, and the light release film 17 can be changed by changing the density of the release agent. The adhesion of the release film 19 is removed. In other embodiments, the light release film 17 and the heavy release film 19 may be obtained by plasma treatment or fluorine coating treatment on the resin substrate.

The display module 20 includes a liquid crystal panel 21 and a backlight unit 23. The display module 20 is bonded to the sensing layer 13 of the touch screen 10 via an optically transparent adhesive layer 27. The material of the optically transparent adhesive layer 27 can be the same as that of the optical transparent adhesive layer 15. Since the display module 20 is well known to those skilled in the art, its structure will not be described here.

The frame 30 is configured to receive the display module 20 and support the touch screen 10 and the display module 20. The material of the frame 30 can be plastic or metal.

Referring to FIG. 4 to FIG. 7, a method for assembling an electronic device according to a second embodiment of the present invention is disclosed, which includes the following steps.

Step S01: providing a touch screen 10, a frame 30, and an optical transparent adhesive layer element. The touch screen 10 includes a protective layer 11 and a sensing layer 13. The optical transparent adhesive layer element comprises an optical transparent adhesive layer 15 and a light release film 17 And the release film 19, the optical transparent adhesive layer 15 includes a first surface 151 and a second surface 153 opposite to each other, the light release film 17 is attached to the first surface 151, and the heavy release film 17 is attached. Attached to the second surface 153, the second surface 153 includes a central portion 155 and a peripheral portion 157, the retractable film 19 including a central portion 191 and a peripheral portion 193 that are separable from each other, the central portion 191 corresponding to the central portion 155, the peripheral portion 193 corresponds to the peripheral region 157.

Step S02: Referring to FIG. 4, the light release film 17 on the first surface 151 is peeled off, and the first surface 151 is attached to the protective layer 11.

Step S03: Referring to FIG. 5, the center portion 191 of the lift-off film 19 on the center region 155 is torn off, and the sensing layer 13 is attached to the center region 155.

Step S04: Referring to FIG. 6, the display module 20 is bonded to the sensing layer 13. In the present embodiment, the display module 20 is attached to the sensing layer 13 via the optically transparent adhesive layer 27. It can be understood that, before use, the optical transparent adhesive layer 27 is also attached with a release film (not shown). Therefore, in this step, the step of removing the release film from the optical transparent adhesive layer 27 is also included. .

Step S05: Referring to FIG. 7, the peripheral portion 193 of the heavy-release film 19 on the peripheral region 157 is peeled off, and the frame 30 is attached to the peripheral region 157. In this way, the assembly of the electronic device 100 is completed.

The present invention sets the optically clear adhesive layer 15 to be equal to or slightly smaller than the size of the protective layer 11, and divides the optically transparent adhesive layer 15 into a central region 155 corresponding to the sensing layer 13 and a peripheral region 157 of a corresponding frame 30 such that the frame 30 The touch screen 10 can be attached to the touch screen 10 through the peripheral area 157, eliminating the need for additional dispensing or double-sided tape processing, saving time and avoiding the risk of misregistration. Moreover, since the optical transparent adhesive layer 15 is a single piece, there is no gap in the middle, and dust is prevented from entering the inside of the electronic device 100 from the gap, and the dustproof effect is better.

In summary, the present invention has indeed met the requirements of the invention patent, and has filed a patent application according to law. However, the above description is only a preferred embodiment of the present invention, and it is not possible to limit the scope of the patent application of the present invention. Equivalent modifications or variations made by persons skilled in the art in light of the spirit of the invention are intended to be included within the scope of the following claims.

100‧‧‧Electronic devices

10‧‧‧ touch screen

11‧‧‧Protective layer

13‧‧‧Sense layer

15‧‧‧Optical transparent adhesive layer

151‧‧‧ first surface

153‧‧‧ second surface

155‧‧‧Central area

157‧‧‧ Peripheral area

17‧‧‧Light release film

19‧‧‧Removal film

191‧‧‧ central part

193‧‧‧ Peripheral part

20‧‧‧Display module

21‧‧‧LCD panel

23‧‧‧Backlight unit

27‧‧‧Optical transparent adhesive layer

30‧‧‧Frame

no

100‧‧‧Electronic devices

10‧‧‧ touch screen

11‧‧‧Protective layer

13‧‧‧Sense layer

15‧‧‧Optical transparent adhesive layer

151‧‧‧ first surface

153‧‧‧ second surface

20‧‧‧Display module

21‧‧‧LCD panel

23‧‧‧Backlight unit

27‧‧‧Optical transparent adhesive layer

30‧‧‧Frame

Claims (10)

An electronic device comprising a touch screen and a frame, the touch screen comprising a protective layer and a sensing layer, wherein the touch screen further comprises: a first optical transparent adhesive layer, the first optical transparent adhesive layer comprises opposite to each other The first surface and the second surface, the protective layer is attached to the first surface, the second surface includes a central area and a peripheral area, the sensing layer is attached to the central area, and the frame is attached to the peripheral area. The electronic device of claim 1, wherein the peripheral region surrounds the central region. The electronic device of claim 1, wherein the size of the protective layer is larger than the size of the sensing layer, and the size of the first optically transparent adhesive layer is equal to or smaller than the size of the protective layer, the first optically transparent adhesive layer The size is larger than the size of the sensing layer. The electronic device of claim 1, wherein the material of the first optically transparent adhesive layer is an organic silicone rubber, an acrylic resin, an unsaturated polyester, a polyurethane or an epoxy resin. The electronic device of claim 1, wherein the electronic device comprises a display module and a second optically transparent adhesive layer, and the display module is adhered to the sensing layer through the second optical transparent adhesive layer. The electronic device of claim 5, wherein the frame is for receiving and supporting the display module. A method of assembling an electronic device, comprising:
Providing a touch screen, a frame and an optical transparent adhesive layer component, the touch screen comprising a protective layer and a sensing layer, the optical transparent adhesive layer component comprising a first optical transparent adhesive layer, a light release film and a heavy release film, the first An optically transparent adhesive layer includes a first surface and a second surface opposite to each other, the light release film being attached to the first surface, the heavy release film being attached to the second surface, the second surface including the center a region and a peripheral region, the heavy-duty film including a central portion and a peripheral portion that are separable from each other, the central portion corresponding to the central region, the edge portion corresponding to the peripheral region;
Removing the light release film on the first surface and attaching the first surface to the protective layer;
The central portion on the central region is torn away and the sensing layer is attached to the central region; and the peripheral portion of the peripheral region is torn away and the frame is attached to the peripheral region. The method of assembling an electronic device according to claim 7, wherein the assembling method of the electronic device further comprises the step of: passing the display module through the second optics before the frame is attached to the peripheral region of the second surface. A transparent adhesive layer is attached to the sensing layer. The method of assembling an electronic device according to claim 7, wherein the peripheral region surrounds the central region. The method of assembling an electronic device according to claim 7, wherein an adhesion between the release film and the first optically clear adhesive layer is greater than between the light release film and the first optically transparent adhesive layer. Adhesion.