TW201504293A - Resin sheet with separator, electronic component device manufacturing method and electronic component device - Google Patents

Abstract

This resin sheet with separator is capable of reducing warping. This invention relates to a resin sheet with separator which comprises a resin sheet and a separator, and characterized in that the resin sheet has grooves or slits, and the resin sheet is divided by the grooves or slits.

Description

Resin sheet with separator, method of manufacturing electronic component device, and electronic component device Field of invention

The present invention relates to a resin sheet with a separator, a method of manufacturing the electronic component device, and an electronic component device.

Background of the invention

In the manufacture of an electronic component device, an electronic component may be sealed with a sealing resin after the electronic component is mounted on the substrate. In the above electronic component device, generally, the shrinkage ratio of the sealing resin is larger than the shrinkage ratio of the substrate or the like, so that the sealing resin tensions the substrate. As a result, warpage sometimes occurs.

On the other hand, a sheet is proposed as the sealing resin. For example, Patent Document 1 discloses that after kneading a specific epoxy resin, a curing agent, and an inorganic filler, the kneaded material is plastically processed to form a resin sheet, whereby the blending ratio of the inorganic filler can be increased. Further, Patent Document 2 discloses a method of producing a sheet from a kneaded material such as a resin. However, these literatures do not adequately review the suppression of warpage.

Prior technical literature Patent literature

Patent Document 1: Japanese Patent Laid-Open Publication No. 2013-7028

Patent Document 2: Japanese Patent Laid-Open Publication No. 2013-6406

Summary of invention

An object of the present invention is to solve the above problems, and to provide a resin sheet with a separator which can suppress warpage, a method for manufacturing an electronic component device, and an electronic component device.

The present invention relates to a resin sheet with a separator, which is provided with a resin sheet and a separator, wherein the resin sheet has a groove or a slit, and the resin sheet is passed through the groove or the aforementioned The slit is separated. The resin sheet of the present invention is formed with a plurality of blocks. In the resin sheet of the present invention, each of the blocks shrinks, so that the force of the resin sheet to tension the substrate can be reduced, and warpage can be suppressed. Further, since the resin sheet of the present invention has a sheet shape, it has good handleability.

Moreover, the present invention relates to a method of manufacturing an electronic component device, comprising a sealing step of laminating the resin sheet with the separator on the substrate to cover the electronic component on the substrate to seal the electronic component.

The sealing step preferably includes the step of, after laminating the resin sheet with the separator attached to the substrate, and heating under reduced pressure to harden the resin sheet with the separator.

Further, the present invention relates to an electronic component device manufactured by the aforementioned manufacturing method.

1‧‧‧Resin sheet with separator

2‧‧‧Resin sheet

3‧‧‧ trench

4‧‧‧ Block

5, 6‧‧‧ partitions

7‧‧‧Slit

11‧‧‧Substrate

12‧‧‧Electronic parts

21‧‧‧ Sealing body (electronic parts device)

1(a) is a front view of a resin sheet with a separator according to Embodiment 1, (b) is a front view of the resin sheet of Embodiment 1, and (c) is a resin sheet of Embodiment 1. A schematic view of the material.

2(a) to 2(c) are schematic front views showing a modification of the resin sheet of the first embodiment.

3(a) to 3(c) are schematic front views showing a modification of the resin sheet with a separator according to the first embodiment.

4(a) and 4(b) are schematic plan views showing a modified example of the resin sheet of the first embodiment.

In Fig. 5, (a) is a schematic plan view of a substrate on which electronic components are arranged, and (b) is a front view.

Fig. 6 is a schematic view showing a manufacturing step of one of the electronic component devices.

In Fig. 7, (a) is a perspective view of a sealing body; (b) is a schematic plan view thereof; and (c) is a schematic cross-sectional view when the sealing body is cut by the line A-A' of (b). A schematic view of the resin sheet.

Form for implementing the invention

The invention is described in detail below with reference to the embodiments, but the invention is not limited by the embodiments.

[Embodiment 1]

Fig. 1(a) is a front elevational view showing a resin sheet 1 with a separator attached to the first embodiment. In Fig. 1(a), the resin sheet 1 with a separator is provided with separators 5 and 6 on both surfaces of the resin sheet 2.

Fig. 1 (b) is a front view of the resin sheet 2 of the first embodiment Figure. Fig. 1 (c) is a schematic plan view of the resin sheet 2 of the first embodiment. In FIGS. 1(a) to (c), the resin sheet 2 has the grooves 3 and is formed with a plurality of blocks 4. In the resin sheet 2, the respective blocks 4 are shrunk, so that the force of the resin sheet 2 to tighten the substrate can be reduced, and warpage can be suppressed.

The number of blocks is not particularly limited, and more and more can suppress warpage. The number of blocks is ideally above 2 blocks, and more preferably above 9 blocks. Also, the upper limit of the number of blocks is, for example, below 100,000 blocks. Also, the shape of the block 4 can be appropriately designed.

The depth of the groove 3 is not particularly limited, and is preferably 1/2 or more, more preferably 2/3 or more, with respect to the thickness of the resin sheet 2. If it is 1/2 times or more, the warpage can be well suppressed.

In the first embodiment, the cross-sectional shape of the groove 3 (the cross-sectional shape when the resin sheet 2 is cut in the thickness direction) is rectangular, but the cross-sectional shape of the groove 3 is not particularly limited, and may be, for example, a V shape. Trapezoidal, U-shaped, etc. (Fig. 2(a)~(c)).

In the first embodiment, the groove 3 is formed in the resin sheet 2, and as shown in FIG. 3, the slit 7 (a hole penetrating the thickness direction of the resin sheet 2) may be used. If it is the slit 7, the independence of the block 4 can be improved, and the effect of suppressing the warpage is large.

In the first embodiment, the linear groove 3 is formed in a plan view. However, the shape of the groove 3 and the slit 7 is not limited thereto, and may be, for example, a curved shape or a wavy shape. Further, in the first embodiment, the grooves 3 are formed in a lattice shape in plan view, but the grooves 3 and the slits 7 are not formed in a lattice shape.

In the first embodiment, the groove 3 is formed to be continuous in plan view, but the shape of the groove 3 and the slit 7 is not limited thereto, for example, 4(a) to 4(b), the grooves 3 and the slits 7 are formed intermittently. It is preferable to form the groove 3 and the slit 7 continuously from the reason that the force of the resin sheet 2 to be tightly pressed against the substrate can be effectively reduced and the effect of suppressing the warpage is large.

The width of the groove 3 and the slit 7 is not particularly limited, but is preferably 2 to 4 mm. If it is 2 mm or more, warpage can be favorably suppressed. Moreover, when it is 4 mm or less, the manufacturing efficiency of an electronic component apparatus does not fall.

In the first embodiment, the cross-sectional shape of each of the grooves 3 is the same, but it may be different. The width of each of the grooves 3 can be different. Moreover, the shape of each of the grooves 3 can be different.

The thickness of the resin sheet 2 is not particularly limited, but is preferably 100 μm or more, and more preferably 150 μm or more. Further, the thickness of the resin sheet 2 is preferably 2000 μm or less, and more preferably 1000 μm or less. If it is within the above range, the electronic component can be sealed well.

In the first embodiment, the resin sheet 2 has a single-layer structure, but may have a multilayer structure in which two or more resin sheets 2 are laminated. Further, it is preferable to use a single layer structure for the reason that the interlayer is not peeled off and the uniformity of the thickness of the sheet is high.

The thickness of the separators 5, 6 is not particularly limited and is, for example, 3 to 300 μm.

In the first embodiment, the separators 5 and 6 are provided on both surfaces of the resin sheet 2, but the resin sheet 1 with the separator may be provided with only one of the separators 5 and 6.

In the first embodiment, the separator 5 is laminated on the resin sheet 2 so as to conceal the groove 3, but the laminated state is not limited thereto. As shown in FIGS. 3(b) to (c), a spacer 5 penetrating the portion corresponding to the groove 3 and the slit 7 may be laminated. On the other hand, from the viewpoint that the separator 5 can be peeled off at one time and the manufacturing efficiency is good, it is preferable that the separator 5 is laminated on the resin sheet 2 so as to conceal the groove 3 and the slit 7.

The resin sheet 1 with a separator can be produced, for example, by a method of laminating the separators 5 and 6 on the resin sheet 2 after the resin sheet 2 is produced.

The resin sheet 2 can be produced by a general method, and is preferably a method in which a kneaded product obtained by kneading an epoxy resin, a phenol resin, a thermoplastic resin, a filler, and a hardening accelerator is plastically processed into a sheet shape to form a groove. 3 or the method of slit 7. Thereby, the filler can be highly filled and the warpage can be suppressed.

Specifically, the epoxy resin, the phenol resin, the thermoplastic resin, the filler, and the hardening accelerator are melt-kneaded by a known kneader such as a mixing roll, a pressure kneader, or an extruder. As the kneading conditions, the upper limit of the temperature is preferably 140 ° C or lower, and preferably 130 ° C or lower. The lower limit of the temperature is preferably at least the softening point of each of the above components, and is, for example, 30 ° C or higher, preferably 50 ° C or higher. The kneading time is ideally 1 to 30 minutes. Further, the kneading is preferably carried out under reduced pressure (under a reduced pressure atmosphere), and the pressure under reduced pressure is, for example, 1 × 10 ^-4 to 0.1 kg/cm ² .

The epoxy resin is not particularly limited. For example, a triphenylmethane type epoxy resin, a cresol novolac type epoxy resin, a biphenyl type epoxy resin, a modified bisphenol A type epoxy resin, a bisphenol A type epoxy resin, a bisphenol F type ring can be used. Various epoxy resins such as an oxygen resin, a modified bisphenol F-type epoxy resin, a dicyclopentadiene type epoxy resin, a phenol novolak type epoxy resin, and a phenoxy resin. These epoxy resins may be used alone or in combination of two or more.

From the viewpoint of ensuring the toughness after curing of the epoxy resin and the reactivity of the epoxy resin, it is preferred that the epoxy group has an epoxy equivalent of 150 to 250, a softening point or a melting point of 50 to 130 ° C, and is solid at room temperature, wherein From the viewpoint of reliability, a triphenylmethane type epoxy resin, a cresol novolac type epoxy resin, and a biphenyl type epoxy resin are preferable.

The phenol resin is not particularly limited as long as it can initiate a hardening reaction with the epoxy resin. For example, a phenol novolak resin, a phenol aralkyl resin, a biphenyl aralkyl resin, a dicyclopentadiene type phenol resin, a cresol novolak resin, a resol resin, or the like can be used. These phenol resins may be used alone or in combination of two or more.

As the phenol resin, from the viewpoint of reactivity with an epoxy resin, it is preferred to use a hydroxyl group equivalent of 70 to 250 and a softening point of 50 to 110 ° C, and it is suitable from the viewpoint of high hardening reactivity. Phenolic phenolic resin. Further, from the viewpoint of reliability, it is also suitable to use a low hygroscopic property such as a phenol aralkyl resin and a biphenyl aralkyl resin.

Examples of the thermoplastic resin (elastic) include natural rubber, butyl rubber, isoprene rubber, chloroprene rubber, ethylene-vinyl acetate copolymer, ethylene-acrylic acid copolymer, and ethylene-acrylate copolymerization. , polybutadiene resin, polycarbonate resin, thermoplastic polyimide resin, 6-nylon and 6,6-nylon and other polyamide resin, phenoxy resin, acrylic resin, PET and PBT An ester resin, a polyamidoximine resin, a fluororesin, a styrene-isobutylene-styrene block copolymer, a methyl methacrylate-butadiene-styrene copolymer (MBS resin), or the like. These thermoplastic resins may be used singly or in combination of two or more. Among them, from low stress and low water absorption From the viewpoint, a styrene-isobutylene-styrene block copolymer is preferred.

The filler is not particularly limited, and an inorganic filler is preferred. Examples of the inorganic filler include quartz glass, talc, cerium oxide (such as molten cerium oxide and crystalline cerium oxide), aluminum oxide, aluminum nitride, tantalum nitride, and boron nitride. Among them, from the viewpoint of satisfactorily reducing the coefficient of linear expansion, cerium oxide and aluminum oxide are preferred, and cerium oxide is preferred. As the cerium oxide, from the viewpoint of good fluidity, molten cerium oxide is preferred, and spherical oxidized cerium oxide is preferred.

The average particle diameter of the filler is desirably 1 μm or more, and more desirably 5 μm or more. When it is 1 μm or more, the flexibility and flexibility of the resin sheet 2 can be easily obtained. The average particle diameter of the filler is desirably 40 μm or less, and desirably 30 μm or less. If it is 40 μm or less, it is easy to increase the filling rate of the filler.

Further, the average particle diameter can be derived, for example, by using a sample which is arbitrarily extracted from the parent group and measured by a laser diffraction scattering type particle size distribution measuring apparatus.

The curing accelerator is not particularly limited as long as it can cure the epoxy resin and the phenol resin, and examples thereof include organic phosphorus compounds such as triphenylphosphine and tetraphenylphosphonium tetraphenylborate; and 2-phenyl-4. An imidazole compound such as 5-dihydroxyimidazole or 2-phenyl-4-methyl-5-hydroxymethylimidazole. Among them, 2-phenyl-4,5-dihydroxymimidazole is preferred because the resin sheet 2 can be produced satisfactorily without progressing from the temperature rise during the kneading.

The epoxy resin, the phenol resin, the thermoplastic resin, the filler, and the hardening accelerator are preferably kneaded together with a flame retardant component, a pigment, a decane coupling agent, or the like.

The kneaded product after melt-kneading is preferably directly subjected to plastic working at a high temperature without cooling. There is no particular limitation on the plastic working method, and For example, flat pressing method, T-die extrusion method, thread die extrusion method, rolling method, roll kneading method, inflation extrusion method, co-extrusion method, polishing forming method, and the like. The plastic working temperature is preferably at least the softening point of each of the above components. When considering the thermosetting property and moldability of the epoxy resin, for example, it is preferably 40 to 150 ° C, preferably 50 to 140 ° C, more preferably 70 to 120 ° C. .

Next, the composition of the resin sheet 2 will be described.

The total content of the epoxy resin and the phenol resin in the resin sheet 2 is preferably 2.0% by weight or more, and more preferably 3.0% by weight or more. When it is 2.0% by weight or more, the adhesion to an electronic component, a substrate, or the like can be favorably obtained. The total content of the epoxy resin and the phenol resin in the resin sheet 2 is preferably 20% by weight or less, more preferably 10% by weight or less. If it is 20% by weight or less, the hygroscopicity can be lowered.

From the viewpoint of hardening reactivity, the blending ratio of the epoxy resin to the phenol resin is blended in an amount of 0.7 to 1.5 equivalents based on 1 equivalent of the epoxy group in the epoxy resin and a total of hydroxyl groups in the phenol resin. Preferably, it is preferably 0.9 to 1.2 equivalents.

The content of the thermoplastic resin is preferably 10 to 50% by weight based on 100% by weight of the organic component (the total component other than the filler). When it is in the above range, flexibility, flexibility, adhesion, and the like can be favorably obtained.

The content of the filler in the resin sheet 2 is desirably 70% by volume or more, and more desirably 74% by volume or more. If it is 70% by volume or more, the coefficient of linear expansion can be designed to be low. On the other hand, the filler content is desirably 90% by volume or less, preferably 85% by volume or less. When it is 90% by volume or less, flexibility, fluidity, and adhesion can be favorably obtained.

The filler content can also be described in terms of "% by weight". In the representative, the content of cerium oxide is described in terms of "% by weight".

The cerium oxide is usually in a specific gravity of 2.2 g/cm ³ , and thus the appropriate range of the cerium oxide content (% by weight) is as follows.

That is, the content of cerium oxide in the resin sheet 2 is preferably 81% by weight or more, and more preferably 84% by weight or more. The content of cerium oxide in the resin sheet 2 is preferably 94% by weight or less, more preferably 91% by weight or less.

The alumina generally has a specific gravity of 3.9 g/cm ³ , and thus an appropriate range of the alumina content (% by weight) is as follows.

That is, the alumina content in the resin sheet 2 is preferably 88% by weight or more, and more preferably 90% by weight or more. The content of alumina in the resin sheet 2 is preferably 97% by weight or less, more preferably 95% by weight or less.

The content of the hardening accelerator is preferably 0.1 to 5 parts by weight based on 100 parts by weight of the total of the epoxy resin and the phenol resin.

The content of the flame retardant component is preferably 10 to 30% by weight based on 100% by weight of the organic component (the total component other than the filler). The content of the decane coupling agent is preferably 0.01 to 3 parts by weight based on 100 parts by weight of the filler.

The method of forming the grooves 3 and the slits 7 in the resin sheet 2 is not particularly limited, and can be formed, for example, by Thomson processing or the like. The resin sheet 2 after processing is laminated with the separators 5, 6, whereby the resin sheet 1 with the separator can be obtained.

As the separators 5 and 6, for example, a plastic base material such as a plastic sheet; a rubber base material such as a rubber sheet; a foam base material such as a foam sheet; and a metal base material such as a metal foil or a metal plate; A fiber-based substrate such as cloth, non-woven fabric, felt, or mesh; a paper-based substrate such as paper; and a laminate of the above-mentioned substrate. Among them, it is preferable to appropriately use a plastic substrate. Examples of the material of the plastic material include olefin-based resins such as polyethylene (PE), polypropylene (PP), and ethylene-propylene copolymer; ethylene-vinyl acetate copolymer (EVA), ionic polymer resin, and ethylene. - (meth)acrylic acid copolymer, ethylene-(meth)acrylate (random, interlaced) copolymer, copolymer of ethylene as a monomer component; polyethylene terephthalate (PET), polynaphthalene Polyethylene glycol (PEN), polybutylene terephthalate (PBT) and other polyesters; acrylic resin; polyvinyl chloride (PVC); polyurethane; polycarbonate; polyphenylene sulfide (PPS) An amine resin such as polyamine (nylon) or a wholly aromatic polyamine (polyarylamine); polyetheretherketone (PEEK); polyimine; polyetherimine; polydivinylidene; ABS (acrylonitrile-butadiene-styrene copolymer); cellulose resin; oxime resin; and fluororesin.

The separators 5 and 6 are preferably subjected to a peeling treatment on the surface of the laminated thermosetting sealing sheet 16. The release agent used for the release treatment may, for example, be a fluorine-based release agent, a long-chain alkyl acrylate release agent, or a oxime-based release agent. Among them, a deuterium-based stripper is preferred.

The resin sheet 1 with a separator can be used for a SAW (Surface Acoustic Wave) filter; a MEMS (Micro Electro Mechanical Systems) such as a pressure sensor or a vibration sensor; an IC such as an LSI (integrated circuit) Semiconductors such as transistors; capacitors; and electronic components such as resistors.

The sealing method is not particularly limited, and a method in which the resin sheet 1 with the separator is laminated on the substrate on the substrate to cover the electronic component to seal the electronic component is exemplified.

The substrate is not particularly limited, and examples thereof include a printed wiring board, a ceramic substrate, a tantalum substrate, and a metal substrate.

The shape of the substrate is not particularly limited, and a slightly polygonal shape or a slightly round shape can be used. However, the shape of the substrate is slightly polygonal and slightly circular.

The slightly polygonal shape includes not only a polygon but also a polygonal similar shape. Specifically, the slightly polygonal shape includes, in addition to the polygonal shape, at least a part of the polygonal shape of the angular arc with a similar shape and at least a part of the side or a side of the side of which is a polygonal shape similar to a curve. As a slightly polygonal shape, it is preferably a rectangular shape or a slightly square shape.

It is preferable that the substrate having the slightly polygonal shape has a length of at least one side of 300 mm or more. Thereby, the electronic component device can be efficiently manufactured. The upper limit of the length of one side is not particularly limited, and is, for example, 700 mm or less.

A slightly circular shape contains not only a circle but also a circular similar shape. Specifically, the substantially circular shape includes a circular shape, a circular shape in which at least a part of the circumference is formed with a concave-convex portion, and a circular shape in which at least a part of the circumference forms a linear portion (linear portion). At least a part of the shape and the circumference are formed with a circular similar shape or the like of the wavy portion.

As the above-mentioned slightly circular substrate, it is preferable that the diameter or the short diameter is 300 mm or more. Thereby, the electronic component device can be efficiently manufactured. The upper limit of the diameter or the short diameter is not particularly limited, and is, for example, 16 Å or less.

The area of the substrate (the area when the substrate is viewed in a plan view) is preferably 70,000 to 500,000 mm ^{2 from} the viewpoint of efficiently manufacturing the electronic component device. Even if a large substrate of 70,000 mm ² or more which is prone to warpage is used, warpage can be suppressed.

Hereinafter, a method of manufacturing an electronic component device using the resin sheet 1 with a separator will be described.

(preparation step)

First, the resin sheet 1 with the separator and the substrate 11 on which the electronic component 12 is placed are prepared.

Fig. 5(a) is a schematic plan view of the substrate 11 on which the electronic component 12 is disposed. Figure 5 (b) is a schematic front view. In FIGS. 5(a) and 5(b), a plurality of electronic components 12 are mounted on the substrate 11.

The number of the electronic components 12 disposed on the substrate 11 is not particularly limited. The number of the electronic components 12 is, for example, one or more, and preferably two or more, and more preferably 100 or more. Further, the upper limit is not particularly limited and is, for example, 10,000 or less. The layout of the electronic component 12 is not particularly limited.

5(a) and 5(b), the electronic component 12 is disposed on one surface of the substrate 11, and may be disposed on both sides.

(Peeling step 1)

The resin sheet 1 attached to the separator peels off the separator 6.

(sealing step)

In the sealing step, as shown in FIG. 6, the resin sheet 1 with the separator is laminated on the substrate 11 in a state in which the resin sheet 2 of the resin sheet 1 with the separator is opposed to the electronic component 12, The electronic component 12 is sealed. Further, the resin sheet 2 functions as a sealing resin for externally protecting the electronic component 12 and an attached element.

The lamination method is not particularly limited, and it can be carried out by a known method such as hot pressing or lamination. As a hot pressing condition, the temperature is, for example, 40 to 100 ° C and is ideally The temperature is, for example, 0.1 to 10 MPa and preferably 0.5 to 8 MPa at 50 to 90 ° C, and the time is, for example, 0.3 to 10 minutes and preferably 0.5 to 5 minutes. Moreover, in consideration of the adhesion and followability of the resin sheet 2 to the electronic component 12 and the substrate 11, it is preferable to carry out pressing under reduced pressure conditions (for example, 0.1 to 5 kPa).

After the resin is sealed, the resin sheet 2 is thermally cured according to the demand. As a condition of the heat hardening treatment, the heating temperature is preferably 100 to 200 °C. The heating time is preferably divided into 10 to 300. Further, it is also possible to pressurize according to the demand, and it is preferably 0.1 to 10 MPa.

(peeling step 2)

The separator 5 is peeled off from the sealing body 21 formed by the sealing step in response to the demand.

Fig. 7(a) is a perspective view of the sealing body 21. (b) is a schematic view of the top view. (c) A schematic cross-sectional view of the sealing body 21 when the A-A' line of (b) is cut. As shown in FIGS. 7(a) to 7(c), a plurality of blocks 4 are formed in the sealing body 21. In the sealing body 21, each of the blocks 4 is contracted, so that the force of the resin sheet 2 to tighten the substrate 11 can be reduced, and warpage can be suppressed.

(cutting step)

The sealing body 21 can be directly used as a semiconductor device, and it is also possible to re-wire or form a bump in the sealing body 21 as needed. Further, the sealing body 21 can be cut and waferized according to the demand. On the other hand, when cutting, the groove 3 of the sealing body 21 or the like can be aligned as a reference. Thereby, the alignment can be easily performed.

In the first embodiment, the separator 6 is peeled off from the resin sheet 1 to which the separator is attached in the peeling step 1, and the separator 5 may be peeled off.

Further, in the first embodiment, the resin sheet with the separator attached is shown. The surface of the material 1 on which the groove 3 is not formed is opposed to the electronic component 12, and the surface of the resin sheet 1 with the separator formed with the groove 3 may be opposed to the electronic component 12. On the other hand, the reason why the warp can be satisfactorily suppressed is that the surface of the resin sheet 1 with the separator which is not formed with the groove 3 is preferably opposed to the electronic component 12.

Further, in the first embodiment, the case where one block 4 is allocated for each electronic component 12 is shown, but the allocation of the block 4 is not limited thereto, and can be appropriately designed.

Example

Hereinafter, a detailed description will be given by way of an appropriate embodiment of the present invention. However, the materials, blending amounts, and the like described in the examples are not intended to limit the scope of the invention only by the above, unless otherwise specified.

The components used in the examples will be described.

Epoxy resin: YSLV-80XY (double phenol F type epoxy resin, epoxy equivalent 200g/eq., softening point 80 °C)

Phenol resin: MEH-7851-SS manufactured by Minghe Chemical Co., Ltd. (phenol resin having a biphenyl aralkyl skeleton, hydroxyl equivalent: 203 g/eq., softening point: 67 ° C)

Filler: FB-9454FC manufactured by Electrochemical Industry Co., Ltd. (melted spherical cerium oxide powder, average particle size 15 μm, maximum particle diameter 128 μm)

矽Case coupling agent: KBM-403 (3-glycidoxypropyltrimethoxy decane) manufactured by Shin-Etsu Chemical Co., Ltd.

Flame retardant: FP-100 (phenoxycyclophosphazene oligomer) manufactured by Fushimi Pharmaceutical Co., Ltd.

Carbon black: #20 (particle size 50nm) made by Mitsubishi Chemical Corporation

Hardening accelerator: 2PHZ-PW (2-phenyl) manufactured by Shikoku Chemical Industry Co., Ltd. -4,5-dimethylimidazole)

Thermoplastic resin: SIBSTAR 072T (polystyrene-polyisobutylene-polystyrene copolymer) manufactured by KANEKA

[Comparative Examples 1 to 3]

Each component was blended according to the blending ratio described below, and kneaded by a roll kneader at 60 to 120 ° C for 10 minutes under reduced pressure (0.01 kg/cm ² ) to prepare a kneaded product. Then, the obtained kneaded product was formed into a sheet shape by a flat pressing method, and a resin sheet (having a size of 100 mm × 100 mm) having a thickness shown in Table 1 was produced. The separator is adhered to the obtained resin sheet.

Blending ratio

(1) The blending is carried out so that the epoxy group has 1 equivalent of the epoxy group, and the hydroxyl group in the phenol resin is 1 equivalent (the total blending component is 100% by weight, and the total amount of the epoxy resin and the phenol resin: 6.85 wt% ).

(2) The blending hardening accelerator was added in an amount of 1.71 parts by weight based on 100 parts by weight of the total of the epoxy resin and the phenol resin.

(3) The organic component (the total component other than the filler) was blended with 30% by weight of the thermoplastic resin in 100% by weight.

(4) The organic component (the total component other than the filler) was blended with 15% by weight of the flame retardant in 100% by weight.

(5) In 100% by weight of the total blending component, 88% by weight of the filler was blended (79.5% by volume in the resin sheet).

(6) 0.1 part by weight of a decane coupling agent is blended with respect to 100 parts by weight of the filler.

The following evaluation was carried out using the obtained resin sheet. The results show In Table 1~3.

(warpage amount)

A resin sheet was placed on a glass epoxy substrate (120 mm × 120 mm × thickness 200 μm). The substrate on which the resin sheet was placed was placed on a press plate of a transient vacuum laminating apparatus (VS008-1515 manufactured by MIKADO TECHNOS Co., Ltd.), and vacuum-pressed (pressing conditions: vacuum holding time 30 seconds, pressurizing time 60 seconds, pressure 203.9) g/cm ² , pressing temperature 90 ° C). After the vacuum was released, the molded product was taken out and hardened in an oven at 150 ° C for 1 hour. The finished product which was then cooled at room temperature for 1 hour was used as a sample.

The sample is placed on a water platform to measure the distance between the table and the angle (angle) of the sample. The distance was measured for the four corners (corner 隅), and the average value was obtained. Let the average value obtained be the amount of warpage and show it in Table 1.

Example 1~2

A resin sheet was produced in the same manner as in the comparative example. The obtained resin sheet was cut into a 4-block or a 9-block according to the formulation shown in Table 1 (the separator was not divided into only the resin sheets).

The above evaluation was carried out using the obtained resin sheet. The results are shown in Table 1.

Example 3~4

A resin sheet was produced in the same manner as in the comparative example. The obtained resin sheet was formed into a slit as shown in Fig. 4 (b) (a slit which was intermittently formed in a plan view), and the resin sheet was partitioned into 4 blocks or 9 blocks.

The above evaluation was carried out using the obtained resin sheet. The results are shown in Table 2.

Example 5~6

A resin sheet was produced in the same manner as in the comparative example. The obtained resin sheet was formed into a groove as shown in Fig. 4 (a) (a groove which was intermittently formed in a plan view), and the resin sheet was partitioned into 4 blocks or 9 blocks.

The above evaluation was carried out using the obtained resin sheet. The results are shown in Table 3.

1‧‧‧Resin sheet with separator

2‧‧‧Resin sheet

3‧‧‧ trench

4‧‧‧ Block

5, 6‧‧‧ partitions

Claims (4)

A resin sheet with a separator, comprising a resin sheet and a separator; wherein the resin sheet has a groove or a slit, and the resin sheet is partitioned by the groove or the slit. A method of manufacturing an electronic component device, comprising a sealing step of laminating a resin sheet attached to a substrate as claimed in claim 1 to an electronic component on a substrate to seal the electronic component. The method of manufacturing the electronic component device of claim 2, wherein the sealing step comprises the steps of: laminating the resin sheet with the separator on the substrate, and heating under reduced pressure to cause the resin of the separator The sheet is hardened. An electronic component device produced by the method of claim 2 or 3.