TW201500468A - Molding resin composition for insertion member, metal resin composite molding body using same, and its manufacturing method - Google Patents

Molding resin composition for insertion member, metal resin composite molding body using same, and its manufacturing method Download PDF

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TW201500468A
TW201500468A TW103105431A TW103105431A TW201500468A TW 201500468 A TW201500468 A TW 201500468A TW 103105431 A TW103105431 A TW 103105431A TW 103105431 A TW103105431 A TW 103105431A TW 201500468 A TW201500468 A TW 201500468A
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resin
epoxy group
resin composition
metal member
insert
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TW103105431A
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TWI634159B (en
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Katsuhei Onishi
Michiaki Ogura
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Polyplastics Co
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    • CCHEMISTRY; METALLURGY
    • C08ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08LCOMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L81/00Compositions of macromolecular compounds obtained by reactions forming in the main chain of the macromolecule a linkage containing sulfur with or without nitrogen, oxygen or carbon only; Compositions of polysulfones; Compositions of derivatives of such polymers
    • C08L81/02Polythioethers; Polythioether-ethers
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B29WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29CSHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C45/00Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould; Apparatus therefor
    • B29C45/14Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould; Apparatus therefor incorporating preformed parts or layers, e.g. injection moulding around inserts or for coating articles
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B32LAYERED PRODUCTS
    • B32BLAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B15/00Layered products comprising a layer of metal
    • B32B15/04Layered products comprising a layer of metal comprising metal as the main or only constituent of a layer, which is next to another layer of the same or of a different material
    • B32B15/08Layered products comprising a layer of metal comprising metal as the main or only constituent of a layer, which is next to another layer of the same or of a different material of synthetic resin
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B32LAYERED PRODUCTS
    • B32BLAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B3/00Layered products comprising a layer with external or internal discontinuities or unevennesses, or a layer of non-planar form; Layered products having particular features of form
    • B32B3/02Layered products comprising a layer with external or internal discontinuities or unevennesses, or a layer of non-planar form; Layered products having particular features of form characterised by features of form at particular places, e.g. in edge regions
    • B32B3/08Layered products comprising a layer with external or internal discontinuities or unevennesses, or a layer of non-planar form; Layered products having particular features of form characterised by features of form at particular places, e.g. in edge regions characterised by added members at particular parts
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B32LAYERED PRODUCTS
    • B32BLAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B7/00Layered products characterised by the relation between layers; Layered products characterised by the relative orientation of features between layers, or by the relative values of a measurable parameter between layers, i.e. products comprising layers having different physical, chemical or physicochemical properties; Layered products characterised by the interconnection of layers
    • B32B7/04Interconnection of layers
    • CCHEMISTRY; METALLURGY
    • C08ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08GMACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G75/00Macromolecular compounds obtained by reactions forming a linkage containing sulfur with or without nitrogen, oxygen, or carbon in the main chain of the macromolecule
    • C08G75/02Polythioethers
    • C08G75/0204Polyarylenethioethers
    • C08G75/0209Polyarylenethioethers derived from monomers containing one aromatic ring
    • CCHEMISTRY; METALLURGY
    • C08ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08JWORKING-UP; GENERAL PROCESSES OF COMPOUNDING; AFTER-TREATMENT NOT COVERED BY SUBCLASSES C08B, C08C, C08F, C08G or C08H
    • C08J5/00Manufacture of articles or shaped materials containing macromolecular substances
    • C08J5/12Bonding of a preformed macromolecular material to the same or other solid material such as metal, glass, leather, e.g. using adhesives
    • CCHEMISTRY; METALLURGY
    • C08ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08LCOMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L33/00Compositions of homopolymers or copolymers of compounds having one or more unsaturated aliphatic radicals, each having only one carbon-to-carbon double bond, and only one being terminated by only one carboxyl radical, or of salts, anhydrides, esters, amides, imides or nitriles thereof; Compositions of derivatives of such polymers
    • C08L33/04Homopolymers or copolymers of esters
    • C08L33/06Homopolymers or copolymers of esters of esters containing only carbon, hydrogen and oxygen, which oxygen atoms are present only as part of the carboxyl radical
    • C08L33/062Copolymers with monomers not covered by C08L33/06
    • C08L33/068Copolymers with monomers not covered by C08L33/06 containing glycidyl groups
    • CCHEMISTRY; METALLURGY
    • C08ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08LCOMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L63/00Compositions of epoxy resins; Compositions of derivatives of epoxy resins

Abstract

To provide a molding resin composition for insertion member having a strong bonding strength between a metal member and a resin member, and able to impart an excellent peeling resistance to a metal resin composite molding body, a metal resin composite molding body using same, and its manufacturing method. A resin composition, which is the molding resin composition for the insertion member on the metal member of the insertion member subjected to a physical treatment and/or a chemical treatment. The aforementioned resin composition comprises (A) a polyarylene thioether, (B) a compound containing the epoxy group, and (C) an alkene copolymer containing the epoxy group. The epoxy group content in the aforementioned (B) compound containing the epoxy group is 0.01 to 0.25 mass% in the entire composition, and the epoxy group content of the aforementioned (C) the epoxy-group content in the epoxy-containing alkene-based copolymer is 0.01 to 0.3 mass% in the entire composition, wherein the abovementioned epoxy group content in the entire composition is 0.02 to 0.4 mass% in total.

Description

插入件成形用樹脂組合物、使用該組合物之金屬樹脂複合成形體以及其製造方法 Resin composition for insert molding, metal resin composite molded body using the same, and a method for producing the same

本發明係關於插入件成形用樹脂組成物,包括樹脂構件之金屬樹脂複合成形體,該樹脂構件包含於施以物理性處理及/或化學性處理的插入件金屬構件上經成形插入件之上述樹脂組成物,以及上述金屬樹脂復合成形體的製造方法。 The present invention relates to a resin composition for insert molding, comprising a metal resin composite molded body of a resin member which is contained in a molded insert member which is subjected to physical treatment and/or chemical treatment. A resin composition and a method for producing the above-described metal resin composite molded body.

由金屬或合金等所構成之插入件金屬構件,與由熱可塑性樹脂組成物所構成之樹脂構件,一體化為金屬樹脂複合成形體,自以往,使用於儀表盤週圍的扶手置物盒(console box)等汽車的內裝構件或引擎周圍的零件,或者內裝零件、數位相機或行動電話等電子機器的介面連接部,電源端部等與外界接觸的零件。 The insert metal member composed of a metal or an alloy and the resin member composed of the thermoplastic resin composition are integrated into a metal resin composite molded body, and conventionally used as a console box around the instrument panel (console box) ) A component such as a built-in member of an automobile or a part around an engine, or an interface of an electronic device such as a built-in component, a digital camera, or a mobile phone, or a component such as a power supply end that comes into contact with the outside.

作為插入件金屬構件與樹脂構件一體化的方法,係於插入件金屬構件側的接合面使以物理性處理及/或化學性處理,提升插入件金屬構件與樹脂構件的密著性的方法,使用接著劑或雙面膠帶的方法,於插入件金屬構件及/或樹脂構件設置反折片或抓爪等固定構件,使用該固定構件使二者固定的方法,使用螺絲等接合的方法等。其等之中,於插入件金屬構件的接合面失以物理性處理及/或化學性處理的方法以及使用 接著劑的方法,就設計金屬樹脂附合成形體時的自由度的方面而言為有效的。 The method of integrating the insert metal member and the resin member is a method of physically and chemically treating the joint surface on the insert metal member side to improve the adhesion between the insert metal member and the resin member. A method of using an adhesive or a double-sided tape is to provide a fixing member such as a reverse flap or a gripper to the insert metal member and/or the resin member, and a method of fixing the both by using the fixing member, a method of joining using a screw or the like. Among them, the method of using physical treatment and/or chemical treatment on the joint surface of the insert metal member and the use thereof The method of the subsequent agent is effective in terms of designing the degree of freedom in the case where the metal resin is attached to the composite body.

特別地,插入件金屬構件側的接合面施以物理性處理及/或化學性處理的方法,就不使用高價的接著劑的方面而言為有利的。作為於插入件金屬構件側的接合面施以物理性處理及/或化學性處理的方法,例如,可列舉專利文獻1所揭示的方法。該方法係於插入件金屬構件的表面於所期望的範圍利用雷射形成粗面的方法。 In particular, the method of applying physical treatment and/or chemical treatment to the joint surface on the side of the insert metal member is advantageous in terms of not using an expensive adhesive. As a method of applying physical treatment and/or chemical treatment to the joint surface on the side of the insert metal member, for example, the method disclosed in Patent Document 1 can be cited. The method is a method of forming a rough surface using a laser in a desired range on the surface of the insert metal member.

【先前技術文獻】 [Previous Technical Literature] 【專利文獻】 [Patent Literature]

【專利文獻1】日本特開2010-167475號公報 [Patent Document 1] Japanese Patent Laid-Open Publication No. 2010-167475

金屬樹脂複合成形體中,插入件金屬構件與樹脂構件的充分一體化為實用上必要者。因此,金屬樹脂附合成形體中,插入件金屬構件與樹脂構件的接合強度不僅要強,也冀求插入件金屬構件與樹脂構件之間難以產生剝離。 In the metal-resin composite molded body, it is practically necessary to sufficiently integrate the insert metal member and the resin member. Therefore, in the metal resin-attached composite body, the joint strength between the insert metal member and the resin member is not only strong, but also it is difficult to cause peeling between the insert metal member and the resin member.

本發明之目的係提供於插入件金屬構件與樹脂構件之間,接合強度強,且賦予耐剝離性優異的金屬樹脂複合成形體的插入件用樹脂組成物,使用該組成物之金屬樹脂複合成形體,以及其製造方法。 An object of the present invention is to provide a resin composition for an insert of a metal-resin composite molded article having excellent joint strength between the insert metal member and the resin member, and to form a metal resin composite using the composition. Body, and its method of manufacture.

本發明者們,為了解決上述課題而重複地致力研究。其結果發現,藉由併用含有環氧基的化合物與含有環氧基 的烯烴系共聚物,將各成分中的環氧基含量調整為規定的範圍的樹脂組成物,解決上述課題,完成本發明。更具體而言,本發明係提供以下者。 The inventors of the present invention have repeatedly made efforts to solve the above problems. As a result, it was found that by using a compound containing an epoxy group in combination with an epoxy group The olefin-based copolymer is a resin composition in which the epoxy group content in each component is adjusted to a predetermined range, and the above problems are solved, and the present invention has been completed. More specifically, the present invention provides the following.

(1)於施以物理性處理及/或化學性處理的插入件金屬構件上用於插入件成形之樹脂組成物,前述樹脂組成物包含(A)聚伸芳基硫醚樹脂、(B)含有環氧基的化合物、(C)含有環氧基的烯烴系共聚物,前述(B)含有環氧基的化合物中的環氧基含量於全組成物中為0.01至0.25質量%,前述(C)含有環氧基的烯烴系共聚物中的環氧基含量於全組成物中為0.01至0.3質量%,上述(B)含有環氧基的化合物中的環氧基含量與(C)含有環氧基的烯烴系共聚物中的環氧基含量的合計於全組成物中為0.02至0.40質量%之樹脂組成物。 (1) A resin composition for insert molding on an insert metal member to which physical treatment and/or chemical treatment is applied, the resin composition comprising (A) a poly(arylene sulfide) resin, (B) The epoxy group-containing compound, (C) the epoxy group-containing olefin-based copolymer, and the epoxy group-containing compound (B) have an epoxy group content of 0.01 to 0.25 mass% in the total composition, as described above ( C) The epoxy group content in the epoxy group-containing olefin-based copolymer is 0.01 to 0.3% by mass in the total composition, and the epoxy group content (C) in the above (B) epoxy group-containing compound is contained. The epoxy group content in the epoxy group-containing olefin-based copolymer is 0.02 to 0.40% by mass in the total composition.

(2)前述(B)含有環氧基的化合物為環氧樹脂之(1)所記載的樹脂組成物。 (2) The epoxy group-containing compound (B) is the resin composition described in (1) of the epoxy resin.

(3)前述(B)含有環氧基的化合物為雙酚型環氧樹脂之(1)或(2)所記載的樹脂組成物。 (3) The epoxy group-containing compound (B) is a resin composition according to (1) or (2) of the bisphenol type epoxy resin.

(4)前述(C)含有環氧基的烯烴系共聚物為包含源自α-烯烴的構成單位與源自α,β-不飽和酸的縮水甘油酯的構成單位的烯烴系共聚物之(1)至(3)之任一者所記載的樹脂組成物。 (4) The (C) epoxy group-containing olefin-based copolymer is an olefin-based copolymer comprising a constituent unit derived from an α-olefin and a constituent unit derived from a glycidyl ester derived from an α,β-unsaturated acid ( The resin composition described in any one of (1).

(5)前述(C)含有環氧基的烯烴系共聚物為,進一步包含源自(甲基)丙烯酸酯的構成單位的烯烴系共聚物之(1)至(4)之任一者所記載的樹脂組成物。 (5) The (C) epoxy group-containing olefin-based copolymer further contains any one of (1) to (4) of the olefin-based copolymer derived from the (meth) acrylate. Resin composition.

(6)進一步地,相對於更(A)聚伸芳基硫醚樹脂100 質量份包含1至300質量份之(D)無機填充材之(1)至(5)之任一者所記載的樹脂組成物。 (6) Further, with respect to the more (A) poly(arylene sulfide) resin 100 The resin composition as described in any one of (1) to (5) of (D) inorganic filler is contained in the mass part.

(7)包括插入件金屬構件,以及包含(1)至(6)之任一者所記載的樹脂組成物且於前述插入件金屬構件上插入件已成形之樹脂構件,前述插入件金屬構件與前述樹脂構件相接的表面的至少一部分,施以物理性處理及/或化學性處理之金屬樹脂複合成形體。 (7) comprising an insert metal member, and a resin member comprising the resin composition according to any one of (1) to (6), wherein the insert member has been molded on the insert metal member, the insert metal member and At least a part of the surface where the resin member is in contact with each other is subjected to a physical treatment and/or chemical treatment of the metal resin composite molded body.

(8)具有將表面的至少一部分經施以物理性處理及/或化學性處理之插入件金屬構件,設置於射出成形用鑄模內,將(1)至(6)之任一者所記載的樹脂組成物以溶融狀態射出於前述射出成型用鑄模內,將前述插入件金屬構件與樹脂構件一體化之一體化步驟之金屬樹脂複合成形體的製造方法。 (8) An insert metal member having at least a part of the surface subjected to physical treatment and/or chemical treatment, and is provided in the injection molding mold, and is described in any one of (1) to (6). A method of producing a metal-resin composite molded body in which the resin composition is injected in the injection molding mold in a molten state and integrated with the insert metal member and the resin member.

根據本發明,可提供於插入件金屬構件與樹脂構件之間,接合強度強,且復與耐剝離性優異的金屬樹脂複合成形體之插入件成形用樹脂組成物以及使用該組成物之金屬樹脂複合成形體。 According to the present invention, it is possible to provide a resin composition for insert molding of a metal-resin composite molded article having a high joint strength between the insert metal member and the resin member and having excellent peeling resistance, and a metal resin using the composition. Composite formed body.

【圖1】圖1為顯示實施例及比較例中所使用之金屬樹脂複合成形體之模式圖,(a)為分解斜視圖,(b)為斜視圖,(c)為僅顯示金屬部的圖。 Fig. 1 is a schematic view showing a metal-resin composite molded body used in Examples and Comparative Examples, (a) is an exploded perspective view, (b) is a perspective view, and (c) is a metal only portion. Figure.

【圖2】圖2為顯示於實施例進行之樹脂部與金屬部之間的接合強度的測定方法的模式圖。 Fig. 2 is a schematic view showing a method of measuring the joint strength between the resin portion and the metal portion performed in the embodiment.

以下,說明本發明之實施態樣。又,本發明不限定為以下的實施態樣。 Hereinafter, embodiments of the present invention will be described. Further, the present invention is not limited to the following embodiments.

<樹脂組成物> <Resin composition>

本發明之樹脂組成物係於施以物理性處理及/或化學性處理的插入件金屬構件上用於插入件成形者,其係包含(A)聚伸芳基硫醚樹脂、(B)含有環氧基的化合物以及(C)含有環氧基的烯烴系共聚物。以下,說明該樹脂組成物中所包含之各成分。 The resin composition of the present invention is used for insert molding of a metal member to be subjected to physical treatment and/or chemical treatment, which comprises (A) a poly(arylene sulfide) resin and (B) An epoxy group-containing compound and (C) an epoxy group-containing olefin-based copolymer. Hereinafter, each component contained in the resin composition will be described.

[(A)聚伸芳基硫醚樹脂] [(A) Poly(aryl thioether resin)]

作為(A)聚伸芳基硫醚樹脂,並無特別限定,可使用以往習知的聚伸芳基硫醚樹脂。作為(A)聚伸芳基硫醚樹脂,較佳使用聚伸苯基硫醚(PPS)樹脂。(A)聚伸芳基硫醚樹脂可1種單獨或組合2種以上使用。 The (A) poly(arylene sulfide) resin is not particularly limited, and a conventionally known poly(arylene sulfide) resin can be used. As the (A) poly(arylene sulfide) resin, a polyphenylene sulfide (PPS) resin is preferably used. (A) The poly(aryl) sulfide resin may be used alone or in combination of two or more.

(A)聚伸芳基硫醚樹脂,為了獲得插入件金屬構件與樹脂構件之更佳的密著性,於310℃測定之切斷速度1216/秒時之溶融黏度較佳為8至300Pa‧s,特佳為10至200Pa‧s。 (A) Poly(arylene sulfide) resin, in order to obtain better adhesion between the insert metal member and the resin member, the melt viscosity at a cutting speed of 1216 / sec measured at 310 ° C is preferably 8 to 300 Pa‧ s, especially good for 10 to 200Pa‧s.

[(B)含有環氧基的化合物] [(B) Compound containing an epoxy group]

(B)含有環氧基的化合物只要為後述(C)含有環氧基的烯烴系共聚物以外的含有環氧基的化合物即可,並無特別限定。(B)含有環氧基的化合物可1種單獨或組合2種以上使用。 (B) The epoxy group-containing compound is not particularly limited as long as it is an epoxy group-containing compound other than the (C) epoxy group-containing olefin copolymer described later. (B) The epoxy group-containing compound may be used alone or in combination of two or more.

(B)含有環氧基的化合物可為1分子內含有1個環氧基的化合物,亦可為1分子內含有2個以上環氧基的化合物。作為(B)含有環氧基的化合物,可大至分類為環氧樹脂,以及其以外的含有環氧基的化合物,例如,可列舉雙酚A與環 氧氯丙烷(epichlorohydrin)反應所得之雙酚型環氧樹脂、酚醛樹脂與環氧氯丙烷反應所得之酚醛型環氧樹脂、聚羧酸與環氧氯丙烷反應所得之聚縮水甘油酯類、由脂環化合物獲得之脂環化合物型環氧樹脂、具有醇性羥基之脂肪族化合物與環氧氯丙烷反應所得之縮水甘油醚類、環氧化丁二烯、以及具有雙鍵之化合物與果氧化物反應所得之環氧化合物。作為具體例,可列舉雙酚A型環氧樹脂、甲基縮水甘油醚、苯基縮水甘油醚、各種脂肪酸的縮水甘油酯、二乙二醇二縮水甘油醚、酞酸二縮水甘油酯、六氫肽酸二縮水甘油酯、環氧化聚丁二烯、環氧化SBS等。其中,由品質安定性(與聚伸芳基硫醚樹脂的反應安定性)、優良的操作性、環境衛生(無致突變性)等觀點,較佳為環氧樹脂,特別地,較佳為變雙酚A型環氧樹脂等雙酚型環氧樹脂。 (B) The epoxy group-containing compound may be a compound containing one epoxy group in one molecule, or a compound containing two or more epoxy groups in one molecule. The (B) epoxy group-containing compound can be classified into an epoxy resin and other epoxy group-containing compounds, and examples thereof include bisphenol A and a ring. a bisphenol epoxy resin obtained by an epichlorohydrin reaction, a phenolic epoxy resin obtained by reacting a phenol resin with epichlorohydrin, a polyglycidyl ester obtained by reacting a polycarboxylic acid with epichlorohydrin, An alicyclic compound-type epoxy resin obtained from an alicyclic compound, a glycidyl ether obtained by reacting an aliphatic compound having an alcoholic hydroxyl group with epichlorohydrin, an epoxidized butadiene, and a compound having a double bond and a fruit oxide The resulting epoxy compound is reacted. Specific examples include bisphenol A epoxy resin, methyl glycidyl ether, phenyl glycidyl ether, glycidyl esters of various fatty acids, diethylene glycol diglycidyl ether, diglycidyl citrate, and the like. Hydroxypeptide diglycidyl ester, epoxidized polybutadiene, epoxidized SBS, and the like. Among them, an epoxy resin is preferable from the viewpoints of quality stability (reaction stability with a poly(arylene sulfide) resin), excellent handleability, environmental sanitation (no mutagenicity), and the like, and particularly preferably Bisphenol type epoxy resin such as bisphenol A type epoxy resin.

(B)含有環氧基的化合物的含量,以(B)含有環氧基的化合物中的環氧基含量於全組成物中,通常為0.01至0.25質量%,較佳為0.01至0.20質量%的量。上述環氧基含量於全組成物中未達0.01質量%時,插入件金屬構件與樹脂構件之間的耐剝離性容易降低。特別地,插入件成形時,為溶融狀態之樹脂組成物的流動末端容易發生界面剝離。另一方面,上述環氧含量超過全組成物中0.25質量%時,由於插入件成形時的脫模性容易變差,難以獲得目的之成形品,或生產性容易降低的方面而言為不佳。 (B) The content of the epoxy group-containing compound, wherein the epoxy group content in the (B) epoxy group-containing compound is usually from 0.01 to 0.25% by mass, preferably from 0.01 to 0.20% by mass in the total composition. The amount. When the epoxy group content is less than 0.01% by mass in the total composition, the peeling resistance between the insert metal member and the resin member is liable to lower. In particular, when the insert is molded, interfacial peeling is likely to occur at the flow end of the resin composition in a molten state. On the other hand, when the epoxy content is more than 0.25 mass% of the total composition, the mold release property at the time of molding the insert is likely to be deteriorated, and it is difficult to obtain the intended molded article, or the productivity is liable to be lowered. .

[(C)含有環氧基的烯烴系共聚物] [(C) Olefin-containing olefin-based copolymer]

(C)含有環氧基的烯烴系共聚物,並無特別限定。(C)含有 環氧基的烯烴系共聚物可1種單獨或組合2種以上使用。 (C) The epoxy group-containing olefin-based copolymer is not particularly limited. (C) contains The olefin-based copolymer of the epoxy group may be used alone or in combination of two or more.

作為(C)含有環氧基的烯烴系共聚物,例如,可列舉包含源自α-烯烴的構成單位與源自α,β-不飽和酸的縮水甘油酯的構成單位的烯烴系共聚物,其中,由於可獲得優異的金屬樹脂複合成形體,較佳為進一步包含源自(甲基)丙烯酸酯的構成單位的烯烴系共聚物。又,以下,亦有將(甲基)丙烯酸酯稱為(甲基)丙烯酸之酯的情況。例如,(甲基)丙烯酸縮水甘油酯亦稱為縮水甘油基(甲基)丙烯酸酯。再者,本說明書中,「(甲基)丙烯酸」意指丙基酸與甲基丙烯酸二者,「(甲基)丙烯酸酯」意指丙烯酸酯與甲基丙烯酸酯二者。 Examples of the (C) epoxy group-containing olefin-based copolymer include an olefin-based copolymer comprising a constituent unit derived from an α-olefin and a constituent unit derived from a glycidyl ester derived from an α,β-unsaturated acid. In particular, it is preferable to further contain an olefin-based copolymer derived from a constituent unit of (meth) acrylate, since an excellent metal-resin composite molded body can be obtained. Further, in the following, the (meth) acrylate may be referred to as an ester of (meth) acrylate. For example, glycidyl (meth)acrylate is also known as glycidyl (meth) acrylate. In the present specification, "(meth)acrylic acid" means both propyl acid and methacrylic acid, and "(meth)acrylate" means both acrylate and methacrylate.

作為α-烯烴,並無特別限定,例如,可列舉乙烯、丙烯、丁烯等,特別較佳為乙烯。α-烯烴可1種單獨使用,亦可2種以上併用。(C)含有環氧基的烯烴系共聚物包含源α-烯烴的構成單位,容易賦予樹脂構件可撓性,藉由可撓性的賦予使樹脂構件變軟,有助於插入件金屬構件與樹脂構件之間的接合強度的改良。 The α-olefin is not particularly limited, and examples thereof include ethylene, propylene, butylene, and the like, and ethylene is particularly preferable. The α-olefin may be used alone or in combination of two or more. (C) The epoxy group-containing olefin-based copolymer contains a constituent unit of a source α-olefin, and it is easy to impart flexibility to the resin member, and the resin member is softened by flexibility, thereby contributing to the insert metal member and Improvement in joint strength between resin members.

作為α,β-不飽和酸之縮水甘油酯,並無特別限定,例如,可列舉丙烯酸縮水甘油酯、甲基丙烯酸縮水甘油酯、乙基丙烯酸縮水甘油酯等,特別較佳為甲基丙烯酸縮水甘油酯。α,β-不飽和酸的縮水甘油酯可1種單獨使用,亦可2種以上併用。由於(C)含有環氧基的烯烴系共聚物包含α,β-不飽和酸的縮水甘油酯,容易獲得插入件金屬構件與樹脂構件之間的結合強度提升的效果。 The glycidyl ester of the α,β-unsaturated acid is not particularly limited, and examples thereof include glycidyl acrylate, glycidyl methacrylate, and glycidyl ethacrylate, and particularly preferably methacrylic acid shrinkage. Glyceride. The glycidyl ester of the α,β-unsaturated acid may be used alone or in combination of two or more. Since the (C) epoxy group-containing olefin-based copolymer contains a glycidyl ester of an α,β-unsaturated acid, the effect of improving the bonding strength between the insert metal member and the resin member can be easily obtained.

作為(甲基)丙烯酸酯,並無特別限定,例如,可列 舉丙烯酸甲酯、丙烯酸乙酯、丙烯酸正丙酯、丙烯酸異丙酯、丙烯酸正丁酯、丙烯酸正己酯、丙烯酸正辛酯等丙烯酸酯;甲基丙烯酸甲酯、甲基丙烯酸乙酯、甲基丙烯酸正丙酯、甲基丙烯酸異丙酯、甲基丙烯酸正丁酯、甲基丙烯酸異丁酯、甲基丙烯酸正戊酯、甲基丙烯酸正辛酯等甲基丙烯酸酯。其中,特別較佳為丙烯酸甲酯。(甲基)丙烯酸酯可1種單獨使用,亦可2種以上併用。源自(甲基)丙烯酸酯的構成單位有助於插入件金屬構件與樹脂構件之間的接合強度的提升。 The (meth) acrylate is not particularly limited, and for example, it can be listed. Examples of acrylates such as methyl acrylate, ethyl acrylate, n-propyl acrylate, isopropyl acrylate, n-butyl acrylate, n-hexyl acrylate, n-octyl acrylate; methyl methacrylate, ethyl methacrylate, methyl A methacrylate such as n-propyl acrylate, isopropyl methacrylate, n-butyl methacrylate, isobutyl methacrylate, n-amyl methacrylate or n-octyl methacrylate. Among them, methyl acrylate is particularly preferred. The (meth) acrylate may be used alone or in combination of two or more. The constituent unit derived from (meth) acrylate contributes to an improvement in the joint strength between the insert metal member and the resin member.

包含源自α-烯烴的構成單位與源自α,β-不飽和酸的縮水甘油酯的構成單位的烯烴系共聚物,以及進一步地包含源自(甲基)丙烯酸酯的構成單位的烯烴系共聚物,可藉由以往習知的方法共聚合而製造。例如,藉由進行通常已知的自由基聚合反應,可獲得上述共聚物。共聚物的種類,並無特別限定,例如,可為無規共聚物,亦可為嵌段共聚物。再者,上述烯烴系共聚物,例如,聚甲基丙烯酸甲酯、聚甲基丙烯酸乙酯、聚丙烯酸甲酯、聚丙烯酸乙酯、聚丙烯酸丁酯、聚丙烯酸2-乙基己酯、聚苯乙烯、聚丙烯腈、丙烯腈‧苯乙烯共聚物、丙烯酸丁酯‧苯乙烯共聚物等,亦可為分支狀或交聯構造之經化學鍵結的烯烴系無規共聚物。 An olefin-based copolymer comprising a constituent unit derived from an α-olefin and a constituent unit derived from a glycidyl ester of an α,β-unsaturated acid, and an olefin-based copolymer further comprising a constituent unit derived from (meth) acrylate The copolymer can be produced by copolymerization by a conventional method. For example, the above copolymer can be obtained by carrying out a generally known radical polymerization reaction. The type of the copolymer is not particularly limited, and may be, for example, a random copolymer or a block copolymer. Further, the above olefin-based copolymer, for example, polymethyl methacrylate, polyethyl methacrylate, polymethyl acrylate, polyethyl acrylate, polybutyl acrylate, polyethyl acrylate 2-ethylhexyl ester, poly A styrene, a polyacrylonitrile, an acrylonitrile ‧ styrene copolymer, a butyl acrylate styrene copolymer, or the like may be a chemically bonded olefin-based random copolymer having a branched or crosslinked structure.

本發明所使用之烯烴系共聚物,於不損害本發明效果的範圍,可含有源自其他共聚合成分之構成單位。 The olefin-based copolymer used in the present invention may contain a constituent unit derived from another copolymerization component insofar as the effects of the present invention are not impaired.

更具體而言,作為(C)含有環氧基的烯烴系共聚物,例如,可列舉縮水甘油基甲基丙烯酸酯改質乙烯系共聚物、縮水甘油醚改質乙烯系共聚物等,其中,較佳為縮水甘油 基甲基丙烯酸酯改質乙烯系共聚物。 More specifically, examples of the (C) epoxy group-containing olefin-based copolymer include a glycidyl methacrylate-modified vinyl copolymer and a glycidyl ether-modified vinyl copolymer. Preferred for glycidol A methacrylate modified ethylene copolymer.

作為縮水甘油基甲基丙烯酸酯改質乙烯系共聚物,可列舉縮水乾由基甲基丙烯酸酯接枝改質乙烯聚合物、乙烯-縮水甘油基甲基丙烯酸酯共聚物、乙烯-縮水甘油基甲基丙烯酸酯-丙烯酸甲酯共聚物。其中,特別地因為可獲得優異的金屬樹脂複合成形體,較佳為乙烯-縮水甘油基甲基丙烯酸酯共聚物及乙烯-縮水甘油基甲基丙烯酸酯-丙烯酸甲酯共聚,特佳為乙烯-縮水甘油基甲基丙烯酸酯-丙烯酸甲酯共聚物。作為乙烯-縮水甘油基甲基丙烯酸酯共聚物及乙烯-縮水甘油基甲基丙烯酸酯-丙烯酸甲酯共聚物的具體例,可列舉「BONDFAST」(住友化學公司製)等。 Examples of the glycidyl methacrylate-modified vinyl copolymer include a shrink-drying-based methacrylic acid graft-modified ethylene polymer, an ethylene-glycidyl methacrylate copolymer, and an ethylene-glycidyl group. Methacrylate-methyl acrylate copolymer. Among them, in particular, since an excellent metal resin composite molded body can be obtained, an ethylene-glycidyl methacrylate copolymer and an ethylene-glycidyl methacrylate-methyl acrylate copolymer are preferable, and particularly preferably ethylene- Glycidyl methacrylate-methyl acrylate copolymer. Specific examples of the ethylene-glycidyl methacrylate copolymer and the ethylene-glycidyl methacrylate-methyl acrylate copolymer include "BONDFAST" (manufactured by Sumitomo Chemical Co., Ltd.).

作為縮水甘油醚改質乙烯系共聚物,例如,可列舉縮水甘油醚接枝改質乙烯共聚物、縮水甘油醚-乙烯共聚物。 Examples of the glycidyl ether-modified ethylene-based copolymer include a glycidyl ether graft-modified ethylene copolymer and a glycidyl ether-ethylene copolymer.

(C)含有環氧基的烯烴系共聚物的含量,(C)含有環氧基的烯烴系共聚物中的環氧基含量於全組成物中,通常為0.01至0.30質量%,較佳為0.03至0.25質量%的量。上述環氧基含量於全組成物中未達0.01質量%時,插入件金屬構件與樹脂構件之間的結合強度容易降低。插入件金屬構件與樹脂構件之密著性,為該等構件間的線膨脹差異所影響。實現(C)含有環氧基的烯烴系共聚物應力緩和,變形小,咸信為上述接合強度改善。應力緩和為韌性有效果,而韌性可以拉伸予以評估。作為彈性體功能之(C)含有環氧基的烯烴系共聚物的含量少時,拉伸小,咸信無法獲得充分的應力緩和效果。另一方面,上述環氧基含量於全組成物中超過0.3質量%時,就插入件成 形時的脫模性容易變差,或有產生氣體變多的傾向而鑄模保養的頻率容易變高而言不佳。 (C) The content of the epoxy group-containing olefin-based copolymer, and (C) the epoxy group-containing olefin-based copolymer has an epoxy group content of usually 0.01 to 0.30% by mass in the total composition, preferably An amount of 0.03 to 0.25 mass%. When the epoxy group content is less than 0.01% by mass in the total composition, the bonding strength between the insert metal member and the resin member is liable to lower. The adhesion of the insert metal member to the resin member is affected by the difference in linear expansion between the members. The (C) epoxy group-containing olefin-based copolymer is stress-relieved and has small deformation, and the bonding strength is improved. Stress relaxation is effective for toughness, while toughness can be evaluated by stretching. When the content of the (C) epoxy group-containing olefin-based copolymer as the elastomer function is small, the stretching is small, and a sufficient stress relieving effect cannot be obtained. On the other hand, when the above epoxy group content exceeds 0.3% by mass in the total composition, the insert is formed into The mold release property at the time of molding tends to be deteriorated, or there is a tendency that gas generation tends to increase, and the frequency of mold maintenance tends to be high, which is not preferable.

再者,(B)含有環氧基的化合物中的環氧基含量與(C)含有環氧基的烯烴系共聚物中的環氧基含量的合計,於全組成物中,通常為0.02至0.40質量%,較佳為0.03至0.30質量%,更佳為0.035至0.25。上述合計超過0.40質量%時,就所得乘形體的脫模性容易惡化的點而言不佳。又,上述合計的下限為(B)含有環氧基的化合物中的環氧基含量的下限與(C)含有環氧基的烯烴系共聚物中的環氧基含量的下限的加總。 Further, the total content of the epoxy group in the (B) epoxy group-containing compound and the (C) epoxy group-containing olefin-based copolymer in the total composition are usually 0.02 to 0.40% by mass, preferably 0.03 to 0.30% by mass, more preferably 0.035 to 0.25. When the total amount is more than 0.40% by mass, the release property of the obtained multiplying body is likely to be deteriorated. In addition, the lower limit of the total is the sum of the lower limit of the epoxy group content in the (B) epoxy group-containing compound and the lower limit of the epoxy group content in the (C) epoxy group-containing olefin copolymer.

[(D)無機填充材] [(D) Inorganic filler]

本發明之樹脂組成物,亦可包含(D)無機填充材。本發明之樹脂組成物中添加(D)無機填充材,所得樹脂組成物的機械強度容易提升。(D)無機填充材並無特別限定,可列舉以往習知者。(D)無機填充材的形狀,並無特別限定,可為纖維狀,亦可為球狀、粉粒狀、板狀、鱗片狀、不定形狀等非纖維狀,較佳為纖維狀。作為(D)無機填充材,例如,可列舉玻璃纖維、球狀氧化矽、玻璃珠粒等。其中,較佳為玻璃纖維。(D)無機填充材可1種單獨或組合2種以上使用。 The resin composition of the present invention may further comprise (D) an inorganic filler. The (D) inorganic filler is added to the resin composition of the present invention, and the mechanical strength of the obtained resin composition is easily improved. (D) The inorganic filler is not particularly limited, and those conventionally known can be mentioned. (D) The shape of the inorganic filler is not particularly limited, and may be fibrous, or may be a non-fibrous shape such as a spherical shape, a granular shape, a plate shape, a scaly shape, or an indefinite shape, and is preferably a fibrous shape. Examples of the (D) inorganic filler include glass fibers, spherical cerium oxide, glass beads, and the like. Among them, glass fibers are preferred. (D) The inorganic filler may be used alone or in combination of two or more.

(D)無機填充材的含量,相對於(A)聚伸芳基硫醚樹脂100質量份,通常為1至300質量份,較佳為25至250質量份。上述含未達1質量份時,本發明之樹脂組成物藉由添加(D)無機填充材的效果無法呈現。上述含量超過300質量份時,就插入件金屬構件與樹脂構件之間的接合強度容易降低,或插入件成形時的流動性容易降低的點而言不佳。 The content of the inorganic filler (D) is usually from 1 to 300 parts by mass, preferably from 25 to 250 parts by mass, per 100 parts by mass of the (A) poly(arylene sulfide) resin. When the above content is less than 1 part by mass, the resin composition of the present invention cannot be exhibited by the effect of adding (D) an inorganic filler. When the content is more than 300 parts by mass, the joint strength between the insert metal member and the resin member is liable to be lowered, or the fluidity at the time of molding of the insert is liable to be lowered.

[其他成分] [Other ingredients]

本發明之樹脂組成物,除了上述成分以外,只要於不損害本發明效果的範圍,為了賦予所期望的物性,亦可為含有有機填充材、難燃劑、紫外線吸收劑、熱安定劑、光安定劑、著色劑、碳黑、脫模劑、可塑劑等添加劑者。 The resin composition of the present invention may contain an organic filler, a flame retardant, an ultraviolet absorber, a heat stabilizer, or light in order to impart desired physical properties, in addition to the above-described components, without impairing the effects of the present invention. Additives such as stabilizers, colorants, carbon black, mold release agents, and plasticizers.

[樹脂組成物的製造方法] [Method for Producing Resin Composition]

本發明之樹脂組成物的製造方法,只要可將該樹脂組成物中的成分均一地混合者即可,並無特別限定,可由以往已知的樹脂組成物的製造方法適宜選擇。例如,可列舉使用單軸或雙軸擠押基等溶融混練裝置,將各成分溶融混練而押出後,將所得樹脂組成物加工為粉末、小片、小粒等所期望的形態的方法。 The method for producing the resin composition of the present invention is not particularly limited as long as the components in the resin composition can be uniformly mixed, and can be suitably selected from a conventional method for producing a resin composition. For example, a method in which a melt-kneading device such as a uniaxial or biaxial extruding base is used, and each component is melted and kneaded and then extruded, and the obtained resin composition is processed into a desired form such as a powder, a small piece, or a small particle.

<金屬樹脂複合成形體> <Metal resin composite molded body>

本發明之金屬樹脂複合成形體係包括插入件金屬構件,以及包含本發明之樹脂組成物且於上述插入件金屬構件上插入成形之樹脂構件。上述插入件金屬構件與上述樹脂構件相接的表面之至少一部分,係施以物理性處理及/或化學性處理。本發明之金屬樹脂複合成形體,由於為併用(B)含有環氧基的化合物與(C)含有環氧基的烯烴系共聚物,使用將該等各成分中的環氧基含量經調整為規定範圍的樹脂組成物者,插入件金屬構件與樹脂構件之間,接合強度強,且耐剝離性優異。 The metal resin composite molding system of the present invention comprises an insert metal member, and a resin member comprising the resin composition of the present invention and inserted into the insert metal member. At least a part of the surface of the insert metal member that is in contact with the resin member is subjected to physical treatment and/or chemical treatment. In the metal-resin composite molded article of the present invention, the (b) epoxy group-containing compound and (C) epoxy group-containing olefin copolymer are used in combination, and the epoxy group content in each of the components is adjusted to In the resin composition of a predetermined range, the joint metal member and the resin member have strong joint strength and excellent peeling resistance.

由於具有上述特性,本發明之金屬樹脂複合成形體,可適合使用於要求接合強度及耐剝離性二者,插入件金屬構件與樹脂構件的密著性優異的用途。例如,本發明之金屬樹脂複合成形體,適合作為經由濕度或水分而容易受到不良影響 的電、電子零件等於內部包括之金屬樹脂複合成形體。特別地,推定於要求高程度防水的領域,例如,河川、泳池、滑雪場、澡堂等中使用,適合作為與水分或濕氣的入侵而故障相關的電或電子機器用的零件。再者,本發明之金屬樹脂複合成形體,例如,亦有用於作為於內部包括樹脂製的軸套或保持構件等,電‧電子機器用框體。本文中,作為電‧電子機器用框體,除了行動電話之外,可列舉相機、攝影一體形相機、數位相機等攜帶用映像電子機器的框體,筆記型電腦、口袋型電腦、計算機、電子記事本、PDC、PHS、行動電話等攜帶用資訊或通信中端機的框體,MD、卡匣立體隨身聽、收音機等攜帶用音響電子機器的框體,液晶TV、液晶螢幕、電話、傳真機、手持掃描器等家庭用電話機器的框體等。 By the above-mentioned characteristics, the metal-resin composite molded article of the present invention can be suitably used for applications in which both the joint strength and the peeling resistance are required, and the adhesion between the insert metal member and the resin member is excellent. For example, the metal resin composite molded body of the present invention is suitable as a susceptible to being adversely affected by humidity or moisture. The electrical and electronic parts are equal to the metal resin composite formed body included therein. In particular, it is presumed to be used in fields requiring high degree of waterproofing, for example, in rivers, swimming pools, ski resorts, bathhouses, etc., and is suitable as a component for electric or electronic equipment related to failure of moisture or moisture intrusion. In addition, the metal-resin composite molded body of the present invention is also used as a casing for electric and electronic equipment, for example, as a bushing or a holding member made of resin. In this case, as a housing for electric and electronic equipment, in addition to a mobile phone, a casing for a portable imaging electronic device such as a camera, a photographic camera, or a digital camera, a notebook computer, a pocket computer, a computer, and an electronic device can be cited. Notepad, PDC, PHS, mobile phone, etc. The frame for carrying information or communication intermediate machine, MD, cassette stereo Walkman, radio, etc. The frame of portable audio electronic equipment, LCD TV, LCD screen, telephone, fax A casing of a home telephone device such as a machine or a handheld scanner.

[插入件金屬構件] [insert metal member]

本發明所使用之插入件金屬構件,與樹脂構件相接的表面的至少一部份,較佳為全部,施以物理性處理及/或化學性處理。 The insert metal member used in the present invention, preferably at least a part of the surface in contact with the resin member, is subjected to physical treatment and/or chemical treatment.

構成插入件金屬構件的金屬材料並無特別限定,作為其例,可列舉由銅、銅合金、鋁、鋁合金及鎂合金所成群組選出之至少一種。 The metal material constituting the insert metal member is not particularly limited, and examples thereof include at least one selected from the group consisting of copper, a copper alloy, aluminum, an aluminum alloy, and a magnesium alloy.

本發明中,根據用途使用成形為所期望形狀的插入件金屬構件。例如,將經溶融的金屬等流入所期望形狀的模,可獲得所期望形狀的插入件金屬構件。再者,為了將插入件金屬構件成形為所期望的形狀,亦可使用藉由工作機械等切削加工。 In the present invention, an insert metal member formed into a desired shape is used depending on the application. For example, by inserting a molten metal or the like into a mold of a desired shape, an insert metal member of a desired shape can be obtained. Further, in order to shape the insert metal member into a desired shape, cutting by a working machine or the like may be used.

如上述方式所得之插入件金屬構件的表面,施以物理性處理及/或化學性處理。師以物理性處理及/或化學性處理的位置,或處理範圍的大小,考慮樹脂構件形成的位置等而決定。 The surface of the insert metal member obtained in the above manner is subjected to physical treatment and/or chemical treatment. The position of the physical treatment and/or chemical treatment, or the size of the treatment range, is determined in consideration of the position at which the resin member is formed.

物理性處理及化學性處理,並無特別限定,可使用習知的物理性處理及化學性處理。藉由物理性處理,使插入件金屬構件的表面粗面化,於粗面化區域形成孔,發生構成樹脂構件的樹脂組成物併入的錨定效果,插入件金屬構件與樹脂構件的界面容易提升密著性。另一方面,藉由化學性處理,於插入件金屬構件與插入成形之樹脂構件之間,由於賦予共價鍵、氫鍵或分子間力等化學的接著效果,插入件金屬構件與樹脂構件的界面容易提升密著性。化學性處理,亦可為伴隨插入件金屬構件的表面的粗面化者,於該情況中,發生與物理性處理同樣的錨定效果,插入件金屬構件與樹脂構件之界面更為容易提升密著性。 The physical treatment and the chemical treatment are not particularly limited, and conventional physical treatment and chemical treatment can be used. By physical treatment, the surface of the insert metal member is roughened, pores are formed in the roughened region, and the anchoring effect of the resin composition constituting the resin member is formed, and the interface between the insert metal member and the resin member is easy. Improve adhesion. On the other hand, by chemical treatment, between the insert metal member and the insert-molded resin member, the metal member and the resin member are interposed by a chemical bonding effect such as a covalent bond, a hydrogen bond, or an intermolecular force. The interface is easy to improve the adhesion. The chemical treatment may be a roughening of the surface of the metal member of the insert, in which case the same anchoring effect as the physical treatment occurs, and the interface between the metal member of the insert and the resin member is more easily lifted. Sexuality.

作為物理性處理,例如,可列舉雷射處理、噴砂(sandblasting)(日本專利特開2001-225346號公報)等。亦可組合施以複數的物理性處理。 Examples of the physical treatment include laser treatment, sandblasting (Japanese Patent Laid-Open Publication No. 2001-225346), and the like. A plurality of physical treatments may also be combined.

作為化學性處理,例如,可列舉電暈放電等乾式處理,三嗪處理(參照日本專利特開2000-218935號公報)、化學蝕刻(參照日本專利特開2001-225352號公報)、陽極氧化處理(日本特開2010-64496)、聯胺處理等。再者,構成插入件金屬構件的金屬材料為鋁的情況時,亦可列舉溫水處理(日本專利特開平8-142110號公報)。作為溫水處理,可列舉於100℃的水之浸漬 3至5分鐘。亦可組合施以複數的化學處理。 For the chemical treatment, for example, dry treatment such as corona discharge, triazine treatment (refer to Japanese Laid-Open Patent Publication No. 2000-218935), chemical etching (refer to Japanese Patent Laid-Open Publication No. 2001-225352), and anodizing treatment (Japanese special open 2010-64496), hydrazine treatment, and the like. In the case where the metal material constituting the insert metal member is aluminum, a warm water treatment (Japanese Patent Laid-Open No. Hei 8-142110) is also known. As warm water treatment, it can be exemplified by water impregnation at 100 ° C. 3 to 5 minutes. A plurality of chemical treatments may also be applied in combination.

[樹脂構件] [Resin member]

本發明中使用之樹脂構件係由聚伸芳基硫醚樹脂組成物所構成,於插入件金屬構件上使插入件成形。 The resin member used in the present invention is composed of a poly(arylene sulfide) resin composition, and the insert is molded on the insert metal member.

[金屬樹脂複合成形體的製造方法] [Method of Manufacturing Metal Resin Composite Molded Body]

金屬樹脂複合成形體的製造方法的具體的步驟並無特別限定,只要上述插入件金屬構件之經施以物理性處理及/或化學性處理的表面至少一部分,經由使插入件金屬構件與樹脂構件密著,使插入件金屬構件與樹脂構件一體化者即可。 The specific steps of the method for producing the metal-resin composite molded body are not particularly limited as long as at least a part of the surface of the insert metal member subjected to physical treatment and/or chemical treatment is passed through the insert metal member and the resin member. Adhesively, the insert metal member and the resin member may be integrated.

例如,可列舉將表面的至少一部分經施以物理性處理及/或化學性處理的插入件金屬構件配置於射出成型用鑄模內,本發明之樹脂組成物以溶融狀態射出至上述射出成型用鑄模內,製造插入件金屬構件與樹脂構件一體化之金屬樹脂複合成形體的方法。射出成形的條件並無特別限定,可根據聚伸芳基硫醚樹脂的物性等,設定適宜的較佳條件。再者,使用轉移成形、壓縮成形等方法,亦為形成插入件金屬構件與樹脂構件一體化之金屬樹脂複合成形體的有效方法。該等方法中,上述插入件金屬構件與上述樹脂構件相接的表面的至少一部分,較佳為全部,施以物理性及/或化學性處理。 For example, an insert metal member in which at least a part of the surface is subjected to physical treatment and/or chemical treatment is disposed in a mold for injection molding, and the resin composition of the present invention is emitted in a molten state to the mold for injection molding. In the inside, a method of manufacturing a metal resin composite molded body in which an insert metal member and a resin member are integrated is manufactured. The conditions for the injection molding are not particularly limited, and appropriate preferable conditions can be set depending on the physical properties of the poly(arylene sulfide) resin and the like. Further, a method such as transfer molding or compression molding is also an effective method for forming a metal resin composite molded body in which an insert metal member and a resin member are integrated. In these methods, at least a part of the surface of the insert metal member that is in contact with the resin member is preferably all physically and/or chemically treated.

作為其他例,可列舉以預先射出成形法等一般的成形方法製造樹脂構件,將施以物理性處理及/或化學性處理插入件金屬構件與上述樹脂構件,於所期望的接合位置相接,於相接面施予熱,使樹脂構件的相接面附近溶融,製造插入件金屬構件與樹脂構件經一體化之金屬樹脂複合成形體的方 法。該方法中,上述插入件金屬構件與上述樹脂構件相接的表面的至少一部分,較佳為全部,施以物理性處理及/或化學性處理。 As another example, a resin member is produced by a general molding method such as a pre-extrusion molding method, and a physical member and/or a chemically treated insert metal member and the resin member are brought into contact with each other at a desired joint position. Heat is applied to the contact surface to melt the vicinity of the contact surface of the resin member, and the metal resin composite molded body in which the insert metal member and the resin member are integrated is produced. law. In this method, at least a part of the surface of the insert metal member that is in contact with the resin member is preferably all subjected to physical treatment and/or chemical treatment.

【實施例】 [Examples]

以下,雖出示實施例及比較例,具體地說明本發明,但本發明不限定為該等實施例者。 Hereinafter, the present invention will be specifically described by showing the examples and comparative examples, but the present invention is not limited to the examples.

實施例及比較例中所使用之金屬樹脂複合成形體的模式圖示於圖1。(a)為分解斜視圖,(b)為斜視圖,(c)為僅顯示金屬部的圖。該金屬樹脂複合成形體係以下述的方法製作。又,途中的尺寸單位為mm。 A schematic diagram of the metal-resin composite molded body used in the examples and the comparative examples is shown in Fig. 1 . (a) is an exploded perspective view, (b) is an oblique view, and (c) is a view showing only a metal portion. This metal resin composite molding system was produced by the following method. Also, the unit of size on the way is mm.

<樹脂組成物的調製> <Modulation of Resin Composition>

將下述的原料成分乾式摻混後,投入至筒溫度320℃的雙軸擠押機,溶融混練,獲得小粒化之熱可塑性樹脂組成物。各成分的調配量(質量份)係如表1至表4所示。 The raw material components described below were dry-blended, and then placed in a biaxial extruder of a cylinder temperature of 320 ° C, and kneaded and kneaded to obtain a pelletized thermoplastic resin composition. The blending amount (parts by mass) of each component is shown in Tables 1 to 4.

‧聚伸苯硫醚樹脂 ‧Polyphenylene sulfide resin

A-1:FORTRON KPS W214A(製品名),溶融粘度:130Pa‧s(剪斷速度:1216/秒,溫度:310℃),KUREHA公司製 A-1: FORTRON KPS W214A (product name), melt viscosity: 130Pa‧s (cutting speed: 1216 / sec, temperature: 310 ° C), manufactured by KUREHA

‧含有環氧基的化合物 ‧Epoxy-containing compounds

B-1:雙酚A型環氧樹脂,jER(舊名「Epicoat」,任一皆為註冊商標)1004K(製品名),環氧基含量:4.6質量%,環氧基當量925,分子量:1650,三菱化學公司製 B-1: bisphenol A type epoxy resin, jER (former name "Epicoat", any of which is a registered trademark) 1004K (product name), epoxy group content: 4.6% by mass, epoxy equivalent 925, molecular weight: 1650, manufactured by Mitsubishi Chemical Corporation

‧含有環氧基的烯烴系共聚物 ‧Olefin-containing olefin copolymer

C-1:乙烯-甲基丙烯酸縮水甘油酯-丙烯酸甲酯共聚物,BOMDFAST 7L(製品名),環氧基含量:3質量%,住友化學公 司製 C-1: ethylene-glycidyl methacrylate-methyl acrylate copolymer, BOMDFAST 7L (product name), epoxy group content: 3% by mass, Sumitomo Chemical Corporation System

C-2:乙烯-甲基丙烯酸縮水甘油酯-丙烯酸甲酯共聚物,BONDFAST 7M(製品名),環氧基含量:6質量%,住友化學公司製 C-2: ethylene-glycidyl methacrylate-methyl acrylate copolymer, BONDFAST 7M (product name), epoxy group content: 6 mass%, manufactured by Sumitomo Chemical Co., Ltd.

C-3:乙烯-甲基丙烯酸縮水甘油酯共聚物,BONDFAST E(製品名),環氧基含量:12質量%,住友化學公司製 C-3: ethylene-glycidyl methacrylate copolymer, BONDFAST E (product name), epoxy group content: 12% by mass, manufactured by Sumitomo Chemical Co., Ltd.

‧非含有環氧基的聚合物重合体 ‧Polymer-free polymer recombination

C’-1:乙烯辛烯共聚物,Engage 8440(製品名),DOW CHEMICAL日本公司製 C'-1: ethylene octene copolymer, Engage 8440 (product name), manufactured by DOW CHEMICAL Japan

C’-2:乙烯丙烯酸乙酯共聚物,NUC-6570(製品名),日本UNICAR公司製 C'-2: ethylene ethyl acrylate copolymer, NUC-6570 (product name), manufactured by Japan UNICAR Co., Ltd.

C’-3:Silicone elastomer,DY33-315(製品名),TORAY‧DOW CORNING公司製 C'-3: Silicone elastomer, DY33-315 (product name), manufactured by TORAY‧DOW CORNING

‧無機填充材 ‧Inorganic filler

D-1:玻璃纖維,ECS 03T747(製品名)、Nippon Electric Glass Co.,Ltd.公司製 D-1: Glass fiber, ECS 03T747 (product name), manufactured by Nippon Electric Glass Co., Ltd.

又,溶融黏度的測定方法係如下所述。 Further, the method for measuring the melt viscosity is as follows.

[溶融粘度] [melting viscosity]

使用東洋精機(株)公司製的毛細管流變儀(capillograph),作為毛細管,使用1mm ×20mmL/平模(flat fie),測定胴溫度310℃,剪斷速度1216/秒的溶融黏度。 A capillary rheometer manufactured by Toyo Seiki Co., Ltd. was used as a capillary tube, and 1 mm was used. ×20 mmL/flat fie, the melt viscosity of the crucible temperature of 310 ° C and the shear rate of 1216 / sec was measured.

<插入件金屬構件的物理性處理或化學性處理> <Physical treatment or chemical treatment of the insert metal member>

作為插入件金屬構件,使用由銅(C-1100P,厚度2mm)或鋁(A5052、厚度2mm)所構成,經施以如下所述之物理性處理 活化學性處理的板狀物。該等板狀的插入件金屬構件,具有圖1(a)的斜線所示之部份接合面。又,表1至表4中,「物理」、「化學1」及「化學2」,分別指稱下述的物性處理、化學性處理1及化學性處理2。 As the insert metal member, it is composed of copper (C-1100P, thickness 2 mm) or aluminum (A5052, thickness 2 mm), and is subjected to physical treatment as described below. A chemically treated plate. The plate-shaped insert metal members have a part of the joint faces shown by oblique lines in Fig. 1(a). In addition, in Tables 1 to 4, "physical", "chemical 1", and "chemical 2" refer to the following physical properties, chemical treatment 1 and chemical treatment 2, respectively.

[物理性處理] [Physical processing]

於鋁置的插入件金屬構件,使用市售的液體搪光機(liquid honing machine),將粒度為# 1000(中心粒徑:14.5至18μm)的氧化鋁研磨劑以濃度20%、錶壓0.4MPa的條件噴塗,進行粗化處理。 For the insert metal member placed on the aluminum, a alumina honing machine having a particle size of #1000 (central particle diameter: 14.5 to 18 μm) was used at a concentration of 20% and a gauge pressure of 0.4 using a commercially available liquid honing machine. The condition of MPa is sprayed and roughened.

[化學性處理1] [Chemical treatment 1]

銅製的插入件金屬構件的表面,於下述組成的蝕刻液A(水溶液)浸漬1分鐘進行防鏽膜去除,其次於下述組成的蝕刻液B(水溶液)浸漬5分鐘蝕刻金屬零件表面。 The surface of the copper insert member metal member was immersed in the etching liquid A (aqueous solution) having the following composition for 1 minute to remove the rust preventive film, and then etched with the etching liquid B (aqueous solution) having the following composition for 5 minutes to etch the surface of the metal member.

‧蝕刻液A(溫度20℃) ‧etching solution A (temperature 20 ° C)

‧蝕刻液B(溫度25℃) ‧ etching solution B (temperature 25 ° C)

[化學性處理2] [Chemical treatment 2]

將鋁製的插入件金屬構件的表面,於下述組成的鹼脫脂液(水溶液)浸漬5分鐘進行脫脂處理,其次於下述組成的蝕刻液 C(水溶液)浸漬3分鐘蝕刻金屬零件表面。 The surface of the aluminum insert metal member was immersed in an alkali degreasing liquid (aqueous solution) having the following composition for 5 minutes to carry out degreasing treatment, followed by an etching liquid having the following composition C (aqueous solution) was immersed for 3 minutes to etch the surface of the metal part.

‧鹼脫脂液(溫度40℃) ‧ Alkaline degreasing solution (temperature 40 ° C)

AS-165F(荏原UDYLITE公司製)50ml/L AS-165F (made by UD UDYLITE Co., Ltd.) 50ml/L

‧蝕刻液C(溫度40℃) ‧ etching solution C (temperature 40 ° C)

<金屬樹脂複合成形體的製作> <Production of Metal Resin Composite Molded Body>

經施以物理性處理及/或化學性處理的插入件金屬構件配置於鑄模,將該插入件金屬構件與包含實施例1至10及比較例1至12之任一者所調製的樹脂組成物的樹脂構件,進行一體化的一體化步驟。成形條件如以下所述。金屬樹脂複合成形體形狀如圖1所示。 The insert metal member subjected to physical treatment and/or chemical treatment is disposed in a mold, and the insert metal member and the resin composition prepared by any of Examples 1 to 10 and Comparative Examples 1 to 12 are used. The resin member is subjected to an integrated integration step. The molding conditions are as follows. The shape of the metal resin composite molded body is as shown in FIG.

[成形條件] [forming conditions]

成形機:SODICK TR-40VR(縱型射出成形機) Forming machine: SODICK TR-40VR (longitudinal injection molding machine)

筒溫度:320℃ Barrel temperature: 320 ° C

鑄模溫度:150℃ Mold temperature: 150 ° C

射出速度:70mm/s Injection speed: 70mm/s

保壓力:80MPa×5秒 Pressure: 80MPa × 5 seconds

<金屬樹脂複合成形體的評估> <Evaluation of Metal Resin Composite Shaped Body>

上述方法所製作之金屬樹脂複合成形體,評估接合部分的接合強度、剝離後的破壞形態以及耐剝離性。具體的評估方法如下所述。 The metal-resin composite molded article produced by the above method was evaluated for the joint strength of the joined portion, the fracture form after peeling, and the peeling resistance. The specific evaluation method is as follows.

[接合強度] [joint strength]

具有圖1所示形狀的金屬樹脂複合成形體,如圖2所示方 式,配置於台座(模具)上,以1mm/分鐘的速度於箭頭方向由插入件金屬構件押入剝離樹脂構件的方式移動模具。測定由插入件金屬構件剝離樹脂構件時的強度作為接合強度。又,作為測定機器,使用TENSILON UTA-50kN((株)ORIENTEC公司製)。測定結果示於表1至表4(值為3次試驗之平均值)。 A metal-resin composite molded body having the shape shown in Fig. 1, as shown in Fig. 2 The mold was placed on a pedestal (mold), and the mold was moved in such a manner that the insert metal member was pushed into the peeling resin member at a speed of 1 mm/min in the direction of the arrow. The strength at the time of peeling off the resin member from the insert metal member was measured as the joint strength. Further, as a measuring device, TENSILON UTA-50kN (manufactured by ORIENTEC Co., Ltd.) was used. The results of the measurements are shown in Tables 1 to 4 (the values are the average of 3 tests).

[破壞形態] [destructive form]

接合強度測定後,接合部份之區域以目視觀察,評估僅有插入件金屬構件與樹脂構件之界面產生破壞(界面剝離,以×表示),是否至少於樹脂構件中產生(凝集破壞,以◎表示)。結果示於表1至表4。 After the joint strength was measured, the area of the joint portion was visually observed, and it was evaluated that only the interface between the insert metal member and the resin member was broken (interfacial peeling, indicated by ×), and it was generated at least in the resin member (aggregation failure, ◎ Express). The results are shown in Tables 1 to 4.

[耐剝離性] [Release resistance]

接合強度測定後,接合部份之區域的插入件金屬構件側以目視觀察,求出插入件金屬構件上附著的樹脂構件所占面積與接合部份之區域全體的面積的比例,以下述的基準評估。結果示於表1至表4。 After the measurement of the joint strength, the side of the insert metal member in the region of the joint portion was visually observed, and the ratio of the area occupied by the resin member adhered to the insert metal member to the area of the entire joint portion was determined by the following criteria. Evaluation. The results are shown in Tables 1 to 4.

○:上述的比例為50%以上,耐剝離性良好。 ○: The above ratio was 50% or more, and the peeling resistance was good.

×:上述的比例為20%以上且未達50%,耐剝離性不佳。 X: The above ratio is 20% or more and less than 50%, and the peeling resistance is not good.

××:上述的比例未達20%,耐剝離性極為不佳。 ××: The above ratio is less than 20%, and the peeling resistance is extremely poor.

<其他的評估> <Other evaluation> [離型性] [release]

上述金屬樹脂複合成形體的製作時,由鑄模的脫模性以下述的基準評估。結果示於表1至表4。 In the production of the above-mentioned metal-resin composite molded article, the mold release property of the mold was evaluated on the basis of the following criteria. The results are shown in Tables 1 to 4.

○:可無問題地由鑄模脫模,脫模性良好。 ○: The mold can be released without any problem, and the mold release property is good.

×:難以由鑄模脫模,脫模性不佳。無法進行接合部分的 強度、剝離後的破壞形態以及耐剝離性的評估。 ×: It is difficult to release the mold from the mold, and the mold release property is not good. Unable to engage the joint Evaluation of strength, fracture morphology after peeling, and peeling resistance.

[拉伸破壞變形] [Stretching Deformation]

實施例1至10及比較例1至12之任一者所調製的樹脂組成物,根據ISO 527-1,2為基準,測定拉伸破壞變形。結果示於表1至表4。 The resin composition prepared in any of Examples 1 to 10 and Comparative Examples 1 to 12 was measured for tensile fracture deformation based on ISO 527-1,2. The results are shown in Tables 1 to 4.

如表1及表2所示,併用(B)含有環氧基的化合物與(C)含有環氧基的烯烴系共聚物,該等各成分中的環氧基含量經調整為規定範圍的實施例1至10的金屬樹脂複合成形體中,插入件金屬構件與樹脂構件之間,接合強度強,且耐剝離性優異。 As shown in Table 1 and Table 2, (B) an epoxy group-containing compound and (C) an epoxy group-containing olefin-based copolymer were used in combination, and the epoxy group content in each of the components was adjusted to a predetermined range. In the metal-resin composite molded articles of Examples 1 to 10, the joint metal member and the resin member have strong joint strength and excellent peeling resistance.

如表3所示,使用(B)含有環氧基的化合物而不使用(C)含有環氧基的烯烴系共聚物之比較例2的金屬樹脂複合成形體,與實施例1至10相比,接合強度及耐剝離性差。 As shown in Table 3, the metal-resin composite molded article of Comparative Example 2 in which (B) the epoxy group-containing compound was used instead of (C) the epoxy group-containing olefin-based copolymer was compared with Examples 1 to 10. The joint strength and peeling resistance are poor.

如表3及表4所示,使用(C)含有環氧基的烯烴系共聚物而不使用(B)含有環氧基的化合物之比較例1、3、6及7的金屬樹脂複合成形體,與實施例1至10相比,接合強度及耐剝離性差。 As shown in Tables 3 and 4, the metal-resin composite molded articles of Comparative Examples 1, 3, 6 and 7 in which (C) an epoxy group-containing olefin-based copolymer was used without using (B) an epoxy group-containing compound Compared with Examples 1 to 10, the joint strength and the peeling resistance were inferior.

如表3及表4所示,使用(B)含有環氧基的化合物,而不使用(C)含有環氧基的烯烴系共聚物之比較例4、5、及8至11的金屬樹脂複合成形體,與實施例1至10相比,接合強度及耐剝離性差。 As shown in Tables 3 and 4, the (B) epoxy group-containing compound was used instead of (C) the epoxy group-containing olefin copolymer, and the metal resin composites of Comparative Examples 4, 5, and 8 to 11 were used. The molded body was inferior in bonding strength and peeling resistance as compared with Examples 1 to 10.

又,如表4所示,即使併用(B)含有環氧基的化合物與(C)含有環氧基的烯烴系共聚物,該等各成分中的環氧基含量的合計於全組成物中超過0.4質量%之比較例12的金屬樹脂複合成形體,脫模性差。 Further, as shown in Table 4, even if (B) the epoxy group-containing compound and (C) the epoxy group-containing olefin copolymer are used in combination, the total epoxy group content in each of the components is in the total composition. The metal-resin composite molded article of Comparative Example 12, which was more than 0.4% by mass, was inferior in mold release property.

Claims (8)

一種樹脂組成物,其係於施以物理性處理及/或化學性處理的插入件金屬構件上用於插入件成形的樹脂組成物,其中,前述樹脂組成物包含(A)聚伸芳基硫醚樹脂、(B)含有環氧基的化合物以及(C)含有環氧基的烯烴系共聚物,前述(B)含有環氧基的化合物中的環氧基含量於全組成物中為0.01至0.25質量%,前述(C)含有環氧基的烯烴系共聚物中的環氧基含量於全組成物中為0.01至0.30質量%,前述(B)含有環氧基的化合物中的環氧基含量與前述(C)含有環氧基的烯烴系共聚物中的環氧基含量的合計於全組成物中為0.02至0.40質量%。 A resin composition for a resin composition for insert molding on an insert metal member to which physical treatment and/or chemical treatment is applied, wherein the resin composition contains (A) polyarylene sulfide An ether resin, (B) an epoxy group-containing compound, and (C) an epoxy group-containing olefin-based copolymer, wherein the epoxy group-containing compound (B) has an epoxy group content of 0.01 to 0.1% in the total composition. 0.25 mass%, the epoxy group content of the (C) epoxy group-containing olefin-based copolymer is from 0.01 to 0.30% by mass in the total composition, and the epoxy group in the above (B) epoxy group-containing compound The content of the epoxy group in the epoxy group-containing olefin-based copolymer of the above (C) is 0.02 to 0.40% by mass in the total composition. 根據申請專利範圍第1項之樹脂組成物,其中前述(B)含有環氧基的化合物為環氧樹脂。 The resin composition according to the first aspect of the invention, wherein the (B) epoxy group-containing compound is an epoxy resin. 根據申請專利範圍第1項之樹脂組成物,其中前述(B)含有環氧基的化合物為雙酚型環氧樹脂。 The resin composition according to the first aspect of the invention, wherein the (B) epoxy group-containing compound is a bisphenol type epoxy resin. 根據申請專利範圍第1項之樹脂組成物,其中前述(C)含有環氧基的烯烴系共聚物為包含源自α-烯烴的構成單位與源自α,β-不飽和酸縮水甘油酯的構成單位的烯烴系共聚物。 The resin composition according to the first aspect of the invention, wherein the (C) epoxy group-containing olefin-based copolymer comprises a constituent unit derived from an α-olefin and a glycidyl ester derived from α,β-unsaturated acid. An olefin-based copolymer constituting a unit. 根據申請專利範圍第1項之樹脂組成物,其中前述(C)含有環氧基的烯烴系共聚物為進一步包含源自(甲基)丙烯酸酯的構成單位的烯烴系共聚物。 According to the resin composition of the first aspect of the invention, the (C) epoxy group-containing olefin-based copolymer is an olefin-based copolymer further comprising a constituent unit derived from (meth) acrylate. 根據申請專利範圍第1項之樹脂組成物,其中進一步包含對於(A)聚伸芳基硫醚樹脂100質量份為1至300質量份之 (D)無機填充材。 The resin composition according to the first aspect of the invention, which further comprises 1 to 300 parts by mass of 100 parts by mass of the (A) poly(arylene sulfide) resin. (D) Inorganic filler. 一種金屬樹脂複合成形體,其係包括插入件金屬構件,包含申請專利範圍第1至6項中任一項之樹脂組成物且經插入成形於前述插入件金屬構件上的樹脂構件,前述插入件金屬構件的與前述樹脂構件相接的表面的至少一部份,施以物理性處理及/或化學性處理。 A metal resin composite molded body comprising an insert metal member, comprising the resin composition of any one of claims 1 to 6 and inserted into a resin member formed on the insert metal member, the insert At least a portion of the surface of the metal member that is in contact with the resin member is subjected to physical treatment and/or chemical treatment. 一種金屬樹脂複合成形體的製造方法,其係具有降表面的至少一部分經施以物理性處理及/或化學性處理的插入件金屬構件配製於設出成形用鑄模內,將申請專利範圍第1至6項中任一項之樹脂組成物以溶融狀態射出於前述射出成形用鑄模內,使前述插入件金屬構件與樹脂構件一體化之一體化步驟。 A method for producing a metal resin composite molded body, wherein an insert metal member having at least a part of a reduced surface subjected to physical treatment and/or chemical treatment is prepared in a mold for forming and forming, and the patent application scope is first The resin composition according to any one of the above-mentioned items, wherein the resin composition is injected into the injection molding mold in a molten state, and the insert metal member and the resin member are integrated.
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Publication number Priority date Publication date Assignee Title
JP6132669B2 (en) * 2013-06-11 2017-05-24 ポリプラスチックス株式会社 Metal resin composite molded body and method for producing the same
JP6543965B2 (en) * 2015-03-04 2019-07-17 東ソー株式会社 Polyarylene sulfide resin composition and composite comprising the same
US11383491B2 (en) 2016-03-24 2022-07-12 Ticona Llc Composite structure
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Family Cites Families (13)

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JP4207436B2 (en) * 2002-02-19 2009-01-14 東レ株式会社 Polyamide resin composition
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JP2005306926A (en) * 2004-04-19 2005-11-04 Toray Ind Inc Polyphenylene sulfide resin composition and molded article
WO2009011398A1 (en) * 2007-07-17 2009-01-22 Taisei Plas Co., Ltd. Composite of metal with resin and process for producing the same
JP2010167475A (en) 2009-01-26 2010-08-05 Yamase Denki Kk Metallic material joined with different kind of material and having airtightness in boundary therebetween, and method of manufacturing the same
JP2011016942A (en) * 2009-07-09 2011-01-27 Tosoh Corp Polyarylene sulfide resin composition
JP4527196B2 (en) * 2009-12-24 2010-08-18 東ソー株式会社 Composite and production method thereof
JP2012056980A (en) * 2010-09-06 2012-03-22 Toray Ind Inc Epoxy resin composition for tow prepreg and tow prepreg
JP2012135884A (en) * 2010-12-24 2012-07-19 Toray Ind Inc Method of manufacturing composite molding
JP5803403B2 (en) * 2011-08-09 2015-11-04 東ソー株式会社 Polyarylene sulfide resin composition and composite comprising the same
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