TW201447335A - Synchronized pulsed LADA for the simultaneous acquisition of timing diagrams and Laser-induced upsets - Google Patents

Synchronized pulsed LADA for the simultaneous acquisition of timing diagrams and Laser-induced upsets Download PDF

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TW201447335A
TW201447335A TW103110836A TW103110836A TW201447335A TW 201447335 A TW201447335 A TW 201447335A TW 103110836 A TW103110836 A TW 103110836A TW 103110836 A TW103110836 A TW 103110836A TW 201447335 A TW201447335 A TW 201447335A
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test
laser
dut
pulse
signal
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TW103110836A
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TWI593983B (en
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Keith Serrels
Praveen Vedagarbha
Ted Lundquist
Kent Erington
Dan Bodoh
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Dcg Systems Inc
Freescale Semiconductor Inc
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    • GPHYSICS
    • G01MEASURING; TESTING
    • G01RMEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R31/00Arrangements for testing electric properties; Arrangements for locating electric faults; Arrangements for electrical testing characterised by what is being tested not provided for elsewhere
    • G01R31/28Testing of electronic circuits, e.g. by signal tracer
    • G01R31/302Contactless testing
    • G01R31/308Contactless testing using non-ionising electromagnetic radiation, e.g. optical radiation
    • G01R31/311Contactless testing using non-ionising electromagnetic radiation, e.g. optical radiation of integrated circuits

Abstract

Method to extract timing diagrams from synchronized single- or two-photon pulsed LADA by spatially positioning the incident laser beam on circuit feature of interest, temporally scanning the arrival time of the laser pulse with respect to the tester clock or the loop length trigger signal, then recording the magnitude and sign of the resulting fail rate signature per laser pulse arrival time. A Single-Photon Laser-Assisted Device Alteration apparatus applies picosecond laser pulses of wavelength having photon energy equal to or greater than the silicon band-gap. A Two-Photon Laser-Assisted Device Alteration apparatus applies femtosecond laser pulses of wavelength having photon energy equal to or greater than half the silicon band-gap at the area of interest. The laser pulses are synchronized with test vectors so that pass/fail ratios can be altered using either the single-photon or the two-photon absorption effect. A sequence of synthetic images with error data illustrates timing sensitive locations.

Description

可同時取得時序圖與雷射引發擾動,具同步化脈衝的雷射輔助裝置修改系 統與方法 Simultaneous acquisition of timing diagram and laser induced disturbance, laser assisted device modification system with synchronized pulses System and method

本案主張美國臨時專利申請案(Provisional Patent Application)61/804,696號,申請日2013年3月24日、美國臨時專利申請案61/806,803號,申請日2013年3月29日、及美國臨時專利申請案61/838,679號,申請日2013年6月24日之優先權,上開申請案的全部揭示內容併入本案作為參考。 The case claims US Provisional Patent Application No. 61/804,696, application date March 24, 2013, US Provisional Patent Application No. 61/806,803, application date March 29, 2013, and US provisional patent application Case No. 61/838,679, the priority date of the application date of June 24, 2013, the entire disclosure of the above application is incorporated herein by reference.

本發明是由美國國家情報局長辦公室(ODNI)之美國先進情報研究計劃(IARPA),基於美國空軍研究院(AFRL)合約第FA8650-11-C-7104號所資助。本案包含之方法與結論均為發明者所有,不應解為必然具有ODNI、IARPA、AFRL或美國政府明示或暗示之擔保。 The present invention is funded by the United States Advanced Intelligence Research Program (IARPA) of the Office of the Director of National Intelligence (ODNI), based on the United States Air Force Research Institute (AFRL) Contract No. FA8650-11-C-7104. The methods and conclusions contained in this case are the property of the inventor and should not be construed as necessarily a guarantee by ODNI, IARPA, AFRL or the US government express or implied.

本發明的技術領域為以雷射光在積體電路(Integrated Circuits,IC)進行缺陷定位分析的技術。更精確地說,本發明為有關使用雷射輔助裝置修改技術(Laser-Assisted Device Alteration,LADA)進行積體電路的設計除錯及/或失敗分析的技術。 The technical field of the present invention is a technique for performing defect location analysis by using laser light in integrated circuits (ICs). More specifically, the present invention relates to a technique for performing debug and/or failure analysis of integrated circuit design using Laser-Assisted Device Alteration (LADA).

所謂LADA技術的原理是利用連續波(continuous wave,CW)雷射對積體電路之背面照射,而在其內部產生局部的光電流 (photocurrents),並因而改變測試用激發信號施加在一「疑似瑕疵的」電晶體後,通過/不通過測試的結果,以定位疑似瑕疵的區域,該區域能含有設計上或製程上的缺陷。該雷射用以暫時改變裝置中之電晶體之操作特性。使用1,064nm之CW雷射時,其電流空間解析度(current spatial resolution)為240nm。 The principle of the so-called LADA technology is to use a continuous wave (CW) laser to illuminate the back side of the integrated circuit, and generate a local photocurrent inside. (photocurrents), and thus changing the test excitation signal applied to a "suspected" transistor, passing/not passing the test results to locate the suspected defect region, which can contain design or process defects. The laser is used to temporarily change the operational characteristics of the transistor in the device. When a CW laser of 1,064 nm is used, its current spatial resolution is 240 nm.

對於該LADA技術之說明可見於,例如Jeremey A.Rowlette及Travis M.Eiles著作Critical Timing Analysis in Microprocessors Using Near-IR Laser Assisted Device Alteration(LADA)乙文,刊載於International Test Conference,IEEE,IEEE Paper 10.4第267-279頁,2003年。該報告描述使用一1,064nm或1,340nm波長之CW雷射之可能性。並說明該1,340nm波長可能因產生局部加熱而造成裝置操作改變,而該1,064nm波長則可能由於光電流的產生,造成裝置的操作改變。須注意的是,該1,064nm雷射具有空間解析度上面的優勢。因此,該文作者建議使用1,064nm雷射。 A description of the LADA technique can be found, for example, in Jeremey A. Rowlette and Travis M. Eiles, Critical Timing Analysis in Microprocessors Using Near-IR Laser Assisted Device Alteration (LADA), published in International Test Conference, IEEE, IEEE Paper 10.4. Pp. 267-279, 2003. This report describes the possibility of using a CW laser with a wavelength of 1,064 nm or 1,340 nm. It is also stated that the 1,340 nm wavelength may cause a change in device operation due to local heating, and the 1,064 nm wavelength may cause a change in operation of the device due to the generation of photocurrent. It should be noted that the 1,064 nm laser has the advantage of spatial resolution. Therefore, the authors recommend using a 1,064 nm laser.

圖1顯示一種傳統的LADA系統,該系統使用一連續波雷射以將光子電子電洞對,從晶片的背面,導入到待測裝置(device under test-DUT)內。將一DUT 110耦接到一測試器115,例如為一傳統自動化測試設備(Automated Testing Equipment-ATE),該自動測試設備連接到一電腦150。該ATE是以傳統方式運作,即發出測試向量以激發該DUT,並分析該DUT對測試向量所產生的反應。該ATE可由一系統測試板取代,可選用的連接一電腦或類似裝置加以控制。因此,在本文中有時會以「測試設備」(Testing Equipment,TE)指稱一ATE或其他測試該DUT之裝置。反之,凡提及ATE時,所指涉的也包括其他測試裝置的使用。該DUT對測試向量所產 生的反應可以使用LADA作進一步的研判。例如,如果該DUT在某些測試的結果失敗,則可用LADA來檢測該DUT在特定條件下是否就可通過測試。如果是,進一步判斷其中何種裝置(亦即電晶體)是造成瑕疵的原因。反之,如果該DUT通過某些測試,則可使用LADA來檢測該DUT在何種特定條件下就不能通過這些測試。如果發現此種情形存在,還可進一步查證其內的裝置(亦即電晶體)中,何者是造成測試失敗的主因。 Figure 1 shows a conventional LADA system that uses a continuous wave laser to introduce photonic electron hole pairs from the back side of the wafer into a device under test-DUT. A DUT 110 is coupled to a tester 115, such as an Automated Testing Equipment (ATE), which is coupled to a computer 150. The ATE operates in a conventional manner by issuing a test vector to excite the DUT and analyzing the response of the DUT to the test vector. The ATE can be replaced by a system test board, optionally connected to a computer or similar device for control. Therefore, in this article, "Testing Equipment" (TE) is sometimes referred to as an ATE or other device that tests the DUT. Conversely, when referring to ATE, the reference also refers to the use of other test devices. The DUT is produced by the test vector The raw reaction can be further studied using LADA. For example, if the DUT fails in some tests, LADA can be used to detect if the DUT can pass the test under certain conditions. If so, further determine which of these devices (ie, the transistor) is the cause of the flaw. Conversely, if the DUT passes certain tests, LADA can be used to detect under which specific conditions the DUT cannot pass these tests. If such a situation is found, it can be further verified that the device (ie, the transistor) in it is the main cause of the test failure.

圖1所示的LADA系統運作方式如下:使用偏光鏡130與135以及物鏡140將由CW雷射120產生的光束集中,掃描該DUT 110。這種操作可使該雷射120在矽材質產生光載子。所產生的電子電洞對會影響鄰近電晶體的時序(timing),也就是縮短或延長電晶體的開關時間。該測試器乃是建置成對待測試裝置以定時重複測試迴路方式施加選定電壓與頻率,而將待測試裝置的操作點推到一臨界狀態。其後使用雷射激發,去改變該測試裝置測試結果的通過/不通過的狀態。該光束在各點所投射的位置即可與該測試器所產生的測試通過/不通過結果形成相關性。所以當偵測到一狀態變化之後,亦即之前測試通過的電晶體變成不通過,或者之前測試不通過的電晶體變成通過,該雷射光束在該時點所投射的座標就指示到處在「臨界點」的電晶體位置。 The LADA system shown in FIG. 1 operates in the following manner: The beams generated by the CW laser 120 are concentrated using polarizers 130 and 135 and an objective lens 140, and the DUT 110 is scanned. This operation allows the laser 120 to produce photocarriers in the crucible material. The resulting pair of electron holes affects the timing of the adjacent transistors, that is, shortens or lengthens the switching time of the transistors. The tester is constructed such that the device to be tested applies a selected voltage and frequency in a timed repeating test loop manner, and pushes the operating point of the device to be tested to a critical state. Thereafter, laser excitation is used to change the pass/fail state of the test device test results. The position at which the beam is projected at each point can be correlated with the test pass/fail results produced by the tester. Therefore, when a state change is detected, that is, the transistor that has passed the test before fails to pass, or the transistor that failed the previous test passes, the coordinates projected by the laser beam at the time point indicate that it is "critical". The position of the transistor.

在該LADA分析期間,該測試器乃是建置成將待測裝置的操作點推到一臨界狀態。其方式是使用雷射激發,去改變該測試裝置的測試結果的通過/不通過狀態。上述現有技術的雷射輔助測試技術可協助尋找瑕疵在空間上的位置,其解析度約為240nm。對於單光子LADA在解析度上的進一步改進,受限於所使用的雷射光波長。如在該Rowlette文獻所記載, 該空間解析度可藉由使用更短波長來提高。然而,如果使用小於1064nm的波長,會被矽材質吸收,成為將波長較短的雷射光從背面提供到該電晶體最大的障礙。因此,隨著近來的設計規則要求縮小裝置體積,習知的LADA系統所提供的空間解析度卻無法藉由使用較小波長雷射來改善。例如,在22nm的設計規則下,傳統的LADA設備是否有能力從4個相鄰的電晶體中解析出特定的電晶體,實在令人懷疑。 During the LADA analysis, the tester is built to push the operating point of the device under test to a critical state. The way is to use laser excitation to change the pass/fail status of the test results of the test device. The above-described prior art laser assisted testing technique can assist in finding the position of the chirp in space with a resolution of about 240 nm. Further improvements in resolution for single photon LADA are limited by the wavelength of the laser light used. As documented in the Rowlette literature, This spatial resolution can be improved by using shorter wavelengths. However, if a wavelength of less than 1064 nm is used, it will be absorbed by the germanium material, which is the biggest obstacle to providing short-wavelength laser light from the back side to the transistor. Therefore, as recent design rules require a reduction in device size, the spatial resolution provided by conventional LADA systems cannot be improved by using smaller wavelength lasers. For example, under the 22nm design rule, it is doubtful whether a traditional LADA device has the ability to resolve a particular transistor from four adjacent transistors.

光致電流(optical beam induced current-OBIC)乃是另一種測試及除錯分析技術。該技術是以雷射光束照射DUT。不過,與LADA不同的是,OBIC是一種統計型的測試方法。意即並不將激發信號提供到該DUT,而是使用雷射光束來在DUT內產生感應電流,並以低雜訊,高增益的電壓或電流放大器,量測該感應電流。OBIC過去已經使用在單光子模式,也使用在雙光子吸收模式,後者通常稱為TOBIC或2P-OBIC(two-photon optical beam induced current)。 Optical beam induced current (OBIC) is another test and debug analysis technique. This technique illuminates the DUT with a laser beam. However, unlike LADA, OBIC is a statistical test method. That is, instead of providing an excitation signal to the DUT, a laser beam is used to generate an induced current in the DUT, and the induced current is measured with a low noise, high gain voltage or current amplifier. OBIC has been used in the single photon mode in the past, and is also used in the two-photon absorption mode, which is commonly referred to as TOBIC or 2P-OBIC (two-photon optical beam induced current).

雙光子吸收(two-photo absorption-TPA)技術是同時吸收2個相同或不同頻率的光子,以將一分子從一狀態(通常是從基態)激發到一能量較高的電子狀態。使用時選擇其波長,使2個同時到達的光子的光子能量總和,等於該分子的低能量狀態與高能量狀態間的能量差值。雙光子吸收技術是一種二階程序,其強度值比線性(單光子)吸收技術的強度值小數個量級。與線性吸收的差別在於其吸收的強度與該光的強度平方成比例,因此是一種非線性的光學量測方法。 The two-photo absorption-TPA technique absorbs two photons of the same or different frequencies simultaneously to excite a molecule from a state (usually from the ground state) to an electronic state with a higher energy. The wavelength is chosen such that the sum of the photon energies of the two simultaneously arriving photons is equal to the energy difference between the low energy state and the high energy state of the molecule. The two-photon absorption technique is a second-order procedure whose intensity value is orders of magnitude smaller than the intensity value of a linear (single-photon) absorption technique. The difference from linear absorption is that the intensity of its absorption is proportional to the square of the intensity of the light, and is therefore a nonlinear optical measurement method.

以下發明簡述提供作為對本發明數種面向及技術特徵之基 本理解。發明簡述並非對本發明之廣泛介紹,也因此並非用來特別指出本發明之關鍵性或是重要元件,也非用來界定本發明之範圍。其唯一目的僅在以簡單之方式展示本發明之數種概念,並作為以下發明詳細說明之前言。 The following summary of the invention is provided as a basis for several aspects and technical features of the invention. This understanding. The invention is not intended to be exhaustive or to limit the scope of the invention. The sole purpose of the invention is to be construed in a single

本發明所揭示之各種實施例乃是藉由使用時間域的量測方法,以提高空間解析度,進而提高錯誤定位的空間解析度。本發明所揭示之實施例使用具有充足能量之脈衝雷射取代習知的連續波雷射。該脈衝雷射與該裝置之時鐘信號同步,因此可改善空間解析度。本發明多種實施例利用1,064nm波長雷射於單光子LADA,或利用更長之波長以激發非線性雙光子吸收機制,產生感應性LADA效應。本案中所使用的雷射技術可以稱之為雙光子雷射輔助裝置修改(2pLADA)技術。 The various embodiments disclosed by the present invention improve the spatial resolution by using a time domain measurement method, thereby improving the spatial resolution of error localization. Embodiments of the present invention replace pulsed continuous wave lasers with pulsed lasers of sufficient energy. The pulsed laser is synchronized with the clock signal of the device, thereby improving spatial resolution. Various embodiments of the present invention utilize a 1,064 nm wavelength laser to single photon LADA or a longer wavelength to excite a nonlinear two-photon absorption mechanism to produce an inductive LADA effect. The laser technology used in this case can be called a two-photon laser assist device modification (2pLADA) technology.

本發明所揭示的實施例使用測試向量激發一DUT,同時使用一飛秒、皮秒、甚至奈秒級的脈衝雷射掃描該DUT之一待測區域,並在掃描的同時檢驗該DUT對測試向量的回應,以對裝置內的錯誤作定位。所選用的雷射源乃是使其波長能提供在矽材質的能帶隙以下的光子能量,且能提供飛秒級的脈衝波寬。能提供最佳解析度的脈衝波寬與裝置的操作頻率相關。從該ATE取得時鐘信號,饋入至該DUT及控制該脈衝雷射的電路。該脈衝之時序可相對於該ATE時鐘平移,以探測各該裝置之通過/不通過特性。此外,藉由使用適當方法將該雷射脈衝同步至該時鐘信號,可以提高量測的空間解析度,故可在該雷射光束範圍內辨認出多數的裝置,亦即,電晶體。 The disclosed embodiment uses a test vector to excite a DUT while scanning a test area of the DUT using a femtosecond, picosecond, or even nanosecond pulsed laser, and verifying the DUT pair test while scanning. The response of the vector to locate errors within the device. The laser source chosen is one that provides its wavelength to provide photon energy below the bandgap of the germanium material and provides a femtosecond pulse width. The pulse width that provides the best resolution is related to the operating frequency of the device. A clock signal is obtained from the ATE, fed to the DUT and a circuit that controls the pulsed laser. The timing of the pulses can be translated relative to the ATE clock to detect the pass/fail characteristics of each of the devices. In addition, by synchronizing the laser pulses to the clock signal using an appropriate method, the spatial resolution of the measurement can be improved, so that a plurality of devices, that is, transistors, can be identified within the range of the laser beam.

更進一步言,根據本發明揭示的實施例,該雷射光束斷續的停駐以照明該DUT上之選定區域,並於每個位置收集LADA資料。而使雷射 脈衝到達每一個位置的時間相對於時鐘信號改變。因此可以對所有照射位置以所收集的LADA資料建構分布圖,具以研究該裝置隨時間推移之行為,亦即,該裝置的回應與該雷射脈衝之到達時間相對於該測試向量之關係。 Still further, in accordance with an embodiment of the present disclosure, the laser beam is intermittently parked to illuminate selected areas on the DUT and to collect LADA data at each location. Laser The time at which the pulse reaches each position changes with respect to the clock signal. It is thus possible to construct a profile of the collected LADA data for all illumination locations to investigate the behavior of the device over time, i.e., the response of the device to the relationship of the arrival time of the laser pulse relative to the test vector.

根據本發明進一步的面向,該LADA測試可應用於研究DUT內單一事件擾動的產生。 In accordance with a further aspect of the present invention, the LADA test can be applied to investigate the generation of a single event disturbance within a DUT.

本發明數種實施例提供可與一自動化測試設備(ATE)連結操作之雷射輔助裝置修改(LADA)系統,以檢測測試中的積體電路裝置(DUT),並包括:一時序控制電子元件,用以從該ATE接收一時鐘信號,該時序控制電子元件用以產生一同步信號,用於將雷射脈衝同步於該時鐘信號;一脈衝雷射光源,用以產生該雷射脈衝;一光學裝置,用以從該可微調脈衝雷射光源接收雷射脈衝,並導引該雷射脈衝至該待測裝置(DUT)上之所需位置;一控制器,建置以操作該時序控制電子元件,以將該雷射脈衝抵達該DUT內電晶體之時間,設定成與該時鐘時間形成同步的時間,且可併入該雷射脈衝相對於該時鐘時間之延遲或提前,藉以改變該電晶體對於該ATE施加於該DUT之測試信號的電性反應;一單像素感應器,用以偵測該雷射脈衝從該DUT的反射,並產生相應的強度信號,且其中該控制器建置成可偵測該電晶體經改變之電性反應,接收該相應的強度信號,並利用該電性反應及強度信號,以產生一圖形,表示該DUT上一選定區域中,電性反應相對於時間的關係。 Several embodiments of the present invention provide a laser assisted device modification (LADA) system that can be coupled to an automated test equipment (ATE) for detecting integrated circuit devices (DUTs) under test and including: a timing control electronic component Receiving a clock signal from the ATE, the timing control electronic component is configured to generate a synchronization signal for synchronizing the laser pulse to the clock signal; a pulsed laser light source for generating the laser pulse; An optical device for receiving a laser pulse from the fine-tunable pulsed laser source and directing the laser pulse to a desired position on the device under test (DUT); a controller configured to operate the timing control An electronic component, set a time during which the laser pulse reaches the transistor in the DUT, is synchronized with the clock time, and may incorporate a delay or advance of the laser pulse with respect to the clock time, thereby changing the An electrical response of the transistor to the test signal applied to the DUT by the ATE; a single pixel sensor for detecting the reflection of the laser pulse from the DUT and generating a corresponding intensity signal, and wherein the control Constructed to detect the altered electrical response of the transistor, receive the corresponding intensity signal, and utilize the electrical reaction and intensity signal to generate a pattern indicative of an electrical response in a selected region of the DUT Relative to time.

根據本發明的數個面向,本發明揭示從同步單光子或雙光子脈衝LADA,擷取個別時序圖及正反器擾動套圖之方法。該方法可透過空間定位(或稱「停留」)該入射雷射光束於目標電路位置,並按時間逐一檢測 該雷射脈衝之到達時間與該測試器時鐘信號或該迴路長度觸發信號之關係,然後記錄每次雷射脈衝到達時間所得之失敗率特徵之強度與表徵。該方法可能包括一雙光子誘發擾動位置之分析,以提供正反器電晶體擾動套圖及邏輯狀態分布圖形,並以CAD套合顯示電路分析及影像套位。本發明實現了非破壞性、雙光子吸收誘發擾動位置的偵測,提供一種以LADA為基礎的實施方案,替代習知的單一事件擾動激發及評估方法。 In accordance with several aspects of the present invention, the present invention discloses a method for extracting individual timing diagrams and flip-flops from a synchronous single photon or two-photon pulse LADA. The method can spatially locate (or "stay") the incident laser beam at a target circuit position and detect it one by one according to time. The arrival time of the laser pulse is related to the tester clock signal or the loop length trigger signal, and then the strength and characterization of the failure rate characteristic obtained by each laser pulse arrival time is recorded. The method may include an analysis of a pair of photon-induced disturbance locations to provide a flip-flop transistor perturbation pattern and a logic state distribution pattern, and to graphically display the circuit analysis and image set. The present invention achieves non-destructive, two-photon absorption-induced disturbance location detection, providing an LADA-based implementation that replaces conventional single event perturbation excitation and evaluation methods.

根據本發明另一面向,乃是提供一種可同時取得多數時序圖的方法,該方法包括:在按時間逐一檢測該雷射脈衝之到達時間與該測試器時鐘信號或該迴路長度觸發信號之關係的同時,從一LADA影像中的限定目標區域內之多重結構中擷取LADA活動;以及擷取電晶體的開關事件在時間軸上的變化(即時序圖)。 According to another aspect of the present invention, a method for simultaneously obtaining a plurality of timing charts is provided, the method comprising: detecting, by time, one by one, a relationship between an arrival time of the laser pulse and the tester clock signal or the loop length trigger signal At the same time, the LADA activity is extracted from the multiple structures in the defined target area in a LADA image; and the change of the switching event of the transistor on the time axis (ie, the timing diagram) is taken.

根據本發明再一面向,本發明提供一種方法,以利用一伺服器控制的CAD與電路圖管理設備,取得該DUT內一外插物理區域範圍,以同步化單光子或雙光子脈衝激發,由LADA產生的時序圖。其步驟包括:a.於一受控的目標空間區域預覽有CW LADA活動的位置;b.記錄特定之有活動位置以供CAD套圖;c.選擇相關之單元區塊或一較大的物理區域;d.建構有LADA活動位置間的邏輯路徑;e.使用同步化單光子或雙光子脈衝LADA檢驗該目標區域;f.取得所產生的時序圖;g.取得關聯網路的關聯電路圖;h.尋找既定順序中的下一LADA;及 i.重複步驟e-h,直到所有元件的檢驗全部完成為止。 According to still another aspect of the present invention, the present invention provides a method for utilizing a server controlled CAD and circuit diagram management device to obtain an extrapolated physical region range within the DUT to synchronize single photon or two photon pulse excitation by LADA The resulting timing diagram. The steps include: a. previewing the location of the CW LADA activity in a controlled target space area; b. recording the specific active location for the CAD set; c. selecting the associated unit block or a larger physical area. d. Construct a logical path between LADA active locations; e. Verify the target region using a synchronized single photon or two-photon pulse LADA; f. Obtain the generated timing diagram; g. Obtain an associated circuit diagram of the associated network; Find the next LADA in the established order; and i. Repeat steps e-h until all components have been verified.

根據本發明進一步的面向,乃是提供一種顯示一DUT中電晶體的失敗率的方法,包含以下步驟:從一測試器接收測試通過及失敗之資料;接收標示該DUT上一電荷注入器注入電荷之位置資訊;根據於該DUT上的位置配置一顯示器顯示之像素;儲存每個測試通過結果為該顯示器之第一像素顏色;儲存每個測試失敗結果為該顯示器之第二像素顏色;及重複的逐一檢視該顯示之像素,以累加/平均對該DUT中一目標區域重複該測試程序之結果,及對於該區域每個像素注入之電荷。如使用灰階顯示器,該第一顏色可為白色,該第二顏色可為黑色。 According to a further aspect of the present invention, there is provided a method of displaying a failure rate of a transistor in a DUT, comprising the steps of: receiving test pass and failure data from a tester; receiving a charge injection injected into the DUT. Location information; configuring a display display pixel according to the position on the DUT; storing each test pass result as the first pixel color of the display; storing each test failure result as the second pixel color of the display; and repeating The pixels of the display are examined one by one to accumulate/average the results of the test procedure repeated for a target region in the DUT, and the charge injected for each pixel of the region. If a gray scale display is used, the first color can be white and the second color can be black.

於本發明一實施例中,揭示一種整合測試成功及失敗結果的顯示方法,以有效呈現一時間序列的黑點與白點的灰階影像。像素停留在一特定空間位置的次數、螢光體的衰減,或在視網膜之殘像,可有效的平均化測試通過及失敗的資料,以提供於灰階範圍內的一顏色。在進行該測試程序時,於光子注入期間如果有影像從包含50%黑色及50%白色的背景灰階中顯現,即可認定已經找到一目標區域。雖然也可以攝影方式擷取觀測結果,但將所得資料儲存至非暫態性媒介物則可供進一步分析使用,以得到對應於該DUT的電路圖或布局圖的位置。使用一累加器電路儲存正值及負值,可提供一區塊內各像素的測試結果之非零值數量。之後可將該區域放大,以對一圖案連結部分或對圖案的分析提供足夠的解析度,可揭示在待測時間段中產生轉換的連結部分位置。 In an embodiment of the present invention, a display method for integrating test success and failure results is disclosed to effectively present grayscale images of black points and white points in a time series. The number of times a pixel stays in a particular spatial location, the attenuation of the phosphor, or the residual image in the retina can effectively average the pass and fail data to provide a color within the grayscale range. When the test procedure is performed, if an image appears in the background gray scale containing 50% black and 50% white during photon injection, it is determined that a target area has been found. Although the observations can also be captured photographicly, the stored data can be stored for non-transitory media for further analysis to obtain the location of the circuit diagram or layout corresponding to the DUT. Using an accumulator circuit to store positive and negative values provides a non-zero number of test results for each pixel in a block. The region can then be enlarged to provide sufficient resolution for analysis of a pattern joint or pattern, revealing the location of the joint portion that produces the transition during the time period to be tested.

本發明的其他面向及特徵可從以下詳細說明中,並參照所附圖式獲得清楚的理解。必須說明的是,該詳細說明及圖式僅提供本發明各 種實施例的各種非限制性例示。本發明的範圍應由所附的申請專利範圍來界定。 Other aspects and features of the present invention will be apparent from the description and appended claims. It must be noted that the detailed description and drawings only provide the present invention. Various non-limiting illustrations of various embodiments. The scope of the invention should be defined by the scope of the appended claims.

1‧‧‧脈衝雷射光源 1‧‧‧pulse laser source

2‧‧‧積體電路 2‧‧‧Integrated circuit

3‧‧‧中介鎖相迴路電路 3‧‧‧Intermediary phase-locked loop circuit

4‧‧‧雷射掃描顯微鏡 4‧‧‧Laser Scanning Microscope

5‧‧‧客製化應用介面 5‧‧‧Customized application interface

6‧‧‧電腦 6‧‧‧ computer

7‧‧‧DSP線路 7‧‧‧DSP line

8‧‧‧資料條件化電路 8‧‧‧Data Conditioning Circuit

9‧‧‧示波器 9‧‧‧Oscilloscope

110‧‧‧待測裝置 110‧‧‧Device under test

115‧‧‧測試器 115‧‧‧Tester

130‧‧‧偏光鏡 130‧‧‧Polar mirror

135‧‧‧偏光鏡 135‧‧‧ polarizer

140‧‧‧物鏡 140‧‧‧ objective lens

150‧‧‧電腦 150‧‧‧ computer

210‧‧‧待測裝置 210‧‧‧Device under test

215‧‧‧測試器 215‧‧‧Tester

223‧‧‧雷射脈衝序列 223‧‧‧Laser pulse sequence

224‧‧‧雷射脈衝序列 224‧‧‧Laser pulse sequence

225‧‧‧脈衝雷射光源 225‧‧‧pulse laser source

227‧‧‧雷射脈衝序列 227‧‧‧Laser pulse sequence

229‧‧‧雷射脈衝序列 229‧‧‧Laser pulse sequence

230‧‧‧偏光鏡 230‧‧‧ polarizer

235‧‧‧偏光鏡 235‧‧‧ polarizer

240‧‧‧物鏡 240‧‧‧ Objective lens

245‧‧‧信號 245‧‧‧ signal

250‧‧‧電腦 250‧‧‧ computer

255‧‧‧固定脈衝雷射光源 255‧‧‧Fixed pulsed laser source

260‧‧‧時序控制電子元件 260‧‧‧Sequence Control Electronic Components

265‧‧‧時序控制電子元件 265‧‧‧Sequence Control Electronic Components

275‧‧‧相位調整器 275‧‧‧ phase adjuster

810‧‧‧待測裝置 810‧‧‧Device under test

815‧‧‧測試器 815‧‧‧Tester

823‧‧‧脈衝 823‧‧‧pulse

825‧‧‧脈衝雷射光源 825‧‧‧pulse laser source

830‧‧‧偏光鏡 830‧‧‧ polarizer

835‧‧‧偏光鏡 835‧‧‧ polarizer

837‧‧‧半反射鏡 837‧‧‧half mirror

840‧‧‧物鏡 840‧‧‧ Objective lens

842‧‧‧聚焦透鏡 842‧‧‧focus lens

845‧‧‧信號 845‧‧‧ signal

850‧‧‧電腦 850‧‧‧ computer

860‧‧‧時序控制電子元件 860‧‧‧Sequence Control Electronic Components

870‧‧‧光學感應器 870‧‧‧ optical sensor

872‧‧‧信號 872‧‧‧ signal

900‧‧‧測試系統 900‧‧‧Test system

905‧‧‧測試器 905‧‧‧Tester

910‧‧‧微晶片 910‧‧‧microchip

920‧‧‧時鐘及脈衝控制器(排程器) 920‧‧‧clock and pulse controller (schedule)

928‧‧‧雷射脈衝 928‧‧‧Laser pulse

930‧‧‧電荷載子注入器(注入器) 930‧‧‧Electrical charge injector (injector)

940‧‧‧待測裝置 940‧‧‧Device under test

960‧‧‧位置通過/不通過資料存儲器(累加器) 960‧‧‧Location pass/fail data storage (accumulator)

附隨之圖式為本說明書所包含並構成本說明書之一部份。該等圖式例示本發明之實施例,並與發明說明共同解釋並描述本發明之原理。該等圖式之目的在於以圖表之形式描述例示實施例之主要特徵。該等圖式並非用以描述實際實施例之每一特徵或描述所示構件之相對尺寸比例,亦非按照比例描繪。 The accompanying drawings are included in this specification and form part of this specification. The drawings illustrate embodiments of the invention and together with the description The figures are intended to describe the main features of the illustrated embodiments in the form of a chart. The figures are not intended to describe each feature of the actual embodiment or the relative size of the components shown in the description, and are not to scale.

圖1為描繪一已知技術之CW LADA系統之系統圖。 1 is a system diagram depicting a known technology CW LADA system.

圖2為描繪本發明一實施例之脈衝雷射LADA系統之系統圖。 2 is a system diagram depicting a pulsed laser LADA system in accordance with an embodiment of the present invention.

圖2A為描繪本發明兩個反饋迴路之實施例示意圖。 2A is a schematic diagram depicting an embodiment of two feedback loops of the present invention.

圖2B為描繪本發明一實施例利用固定脈衝雷射光源以產生時鐘信號之示意圖。 2B is a schematic diagram depicting the use of a fixed pulsed laser source to generate a clock signal in accordance with an embodiment of the present invention.

圖3為描繪本發明達成同步機制之實施例方塊圖。 3 is a block diagram depicting an embodiment of the synchronization mechanism of the present invention.

圖4A-4C為說明本發明脈衝雷射LADA如何在位置相鄰的PMOS及NMOS電晶體中辨認及分離個別電晶體的方法示意圖。 4A-4C are schematic diagrams showing how the pulsed laser LADA of the present invention recognizes and separates individual transistors in adjacent PMOS and NMOS transistors.

圖5A-5D為說明因提供雷射脈衝的準確定位,改進空間解析度的方法示意圖。 5A-5D are schematic diagrams illustrating a method for improving spatial resolution by providing accurate positioning of laser pulses.

圖6為描繪本發明一實施例中雷射重複率鎖定機制之示意圖。 6 is a schematic diagram depicting a laser repetition rate locking mechanism in accordance with an embodiment of the present invention.

圖7A-7C為描繪根據本發明一實施例,使用LADA測量少數載子生命週期的步驟之示意圖。 7A-7C are schematic diagrams depicting the steps of measuring a minority carrier life cycle using LADA, in accordance with an embodiment of the present invention.

圖8為描繪本發明脈衝雷射LADA系統一實施例之系統圖,圖8A顯示使用圖8所示系統產生之曲線圖,圖8B則顯示影像變化過程及相對於時間之曲線圖。 8 is a system diagram depicting an embodiment of a pulsed laser LADA system of the present invention, FIG. 8A showing a graph generated using the system of FIG. 8, and FIG. 8B showing a graph of image change and time versus time.

圖9為描繪本發明一實施例脈衝雷射LADA系統之架構之方塊圖,該系統可使用於圖8所示之系統。 9 is a block diagram showing the architecture of a pulsed laser LADA system in accordance with an embodiment of the present invention, which system can be used in the system of FIG.

圖2顯示本發明一實施例。圖中的系統使用一能產生足夠能量的脈衝雷射光源,而不使用連續波雷射。此實施例的技術是使用光子吸收原理,以準確注入載子至一積體電路(IC),供使用LADA技術判斷待測裝置內的錯誤所在位置,且可用於IC的特性分析及尋找改進該IC設計之方法。該技術的主要原理是將光子送至該電晶體上的聚焦點,使所傳輸之光子能量大於產生電子電洞對所需的能量。例如,如為矽質,為大於1.1電子伏特(eV)。如為其他材質IC如砷化鎵(GaAs),矽鍺(SiGe),磷化銦(InP)等,則具有不同能帶隙能量。在此實施例中,光子激發(photon stimulation)需要以納秒(nanosecond)級至飛秒(femtosecond)級範圍的雷射脈衝激發。該訊號聚集於該雷射的焦點,在錯誤所在位置的定位上提供一立即改善。由於同步化的控制,電子電洞對產生的有效數量似乎因而減少。但本實施例乃利用精密的時序控制電子元件,以精確控制該雷射脈衝的時序,以配合測試裝置的時鐘信號(例如ATE時鐘信號)的轉換緣。此種型態的控制可達成在進行雷射輔助裝置修改(Laser-Assisted Device Alteration-LADA)時,對信號在疑似有瑕疵的電晶體中傳播時的延遲或提前,作細微的改變。 Figure 2 shows an embodiment of the invention. The system in the figure uses a pulsed laser source that produces enough energy instead of a continuous wave laser. The technique of this embodiment uses the photon absorption principle to accurately inject a carrier into an integrated circuit (IC) for judging the location of the error in the device under test using the LADA technique, and can be used for characteristic analysis of the IC and to seek improvement. The method of IC design. The main principle of this technique is to deliver photons to the focal point on the transistor such that the transmitted photon energy is greater than the energy required to generate the electron hole pair. For example, if it is enamel, it is greater than 1.1 electron volts (eV). For other materials such as gallium arsenide (GaAs), germanium (SiGe), indium phosphide (InP), etc., they have different energy band gap energies. In this embodiment, photon stimulation needs to be excited by a laser pulse in the nanosecond to femtosecond range. This signal is concentrated at the focus of the laser, providing an immediate improvement in the location of the error location. Due to the control of synchronization, the effective number of electron hole pairs appears to be reduced. However, this embodiment utilizes sophisticated timing control electronics to precisely control the timing of the laser pulses to match the transition edges of the test device's clock signal (eg, ATE clock signal). This type of control can be used to make slight changes in the delay or advancement of the signal as it propagates in a suspected transistor in the Laser-Assisted Device Alteration (LADA).

圖2顯示本發明一實施例。圖中顯示一DUT 210耦接至一 ATE 215,與先前技術相同。然而,在圖2之實施例中,納秒至飛秒級之脈衝雷射藉由脈衝雷射光源225產生,並接著透過偏光鏡230及235和物鏡240聚集至該DUT 210上。在本發明的2pLADA中,該雷射源225提供一波長長於矽的能帶隙寬之脈衝雷射光束,即波長超過1,107nm的脈衝雷射光束。在一實施例中,是使用1,550nm的波長,而在其他實施例則使用1,340nm或1,250nm的波長。另一方面,相同裝置也可適用於單光子LADA。在此情況下,該雷射源可提供的脈衝束波長例如約1,064nm。在此實施例中,該偏光鏡230及235是以一雷射掃描顯微鏡(Laser Scanning Microscope,LSM)實施。同時,在某些實施例,則使用固態浸沒透鏡(Solid Immersion Lens,SIL)做為該物鏡240配置之一部分。 Figure 2 shows an embodiment of the invention. The figure shows a DUT 210 coupled to a ATE 215, the same as the prior art. However, in the embodiment of FIG. 2, nanosecond to femtosecond pulsed lasers are generated by pulsed laser source 225 and then concentrated onto polarizer 230 and 235 and objective lens 240 onto the DUT 210. In the 2pLADA of the present invention, the laser source 225 provides a pulsed laser beam having a wavelength band longer than 矽, that is, a pulsed laser beam having a wavelength exceeding 1,107 nm. In one embodiment, a wavelength of 1,550 nm is used, while in other embodiments a wavelength of 1,340 nm or 1,250 nm is used. On the other hand, the same device can also be applied to single photon LADA. In this case, the laser source can provide a pulse beam wavelength of, for example, about 1,064 nm. In this embodiment, the polarizers 230 and 235 are implemented by a Laser Scanning Microscope (LSM). Also, in some embodiments, a Solid Immersion Lens (SIL) is used as part of the configuration of the objective lens 240.

在傳統的LADA系統中,雷射源是常開(ON)。但是在本發明的實施例中,則是使用時間極短的脈衝。因此,讓裝置能夠在該雷射脈波到達時發生轉態,極為重要。為達成此目的,本發明使用一觸發信號245,該信號從該ATE取得,輸入到時序控制電子元件260,以控制脈衝雷射225,使其雷射脈波能夠與該ATE的測試信號同步。 In a conventional LADA system, the laser source is normally open (ON). However, in the embodiment of the present invention, it is a pulse that is extremely short in use. Therefore, it is extremely important to allow the device to change state when the laser pulse arrives. To achieve this, the present invention uses a trigger signal 245 that is taken from the ATE and input to timing control electronics 260 to control pulsed laser 225 such that its laser pulse is synchronized with the test signal of the ATE.

使用第2圖所示的系統時,首先操作該測試裝置(ATE)215,以一組測試向量測定該DUT 210的臨界設定值。也就是說,隨時改變測試向量的電壓與頻率,以判斷DUT接近無法通過測試的條件,或者正達到測試失敗時的臨界點,例如,該DUT於該測試中的失敗次數達到一測試循環中的50%。此即該DUT的測試通過/不通過臨界點條件。這時的電壓與頻率的設定值其後將用來產生一重複的測試信號,以在該測試通過/不通過臨界條件下,重複的激發該DUT。 When using the system shown in Figure 2, the test equipment (ATE) 215 is first operated to determine the critical setpoint of the DUT 210 from a set of test vectors. That is to say, the voltage and frequency of the test vector are changed at any time to judge whether the DUT is close to the condition that cannot pass the test, or is reaching the critical point when the test fails. For example, the number of failures of the DUT in the test reaches a test cycle. 50%. This is the test of the DUT passing/not passing the critical point condition. The set of voltage and frequency at this time will then be used to generate a repeated test signal to repeatedly excite the DUT under the pass/fail conditions of the test.

於該DUT在其臨界條件下受到激發的同時,該測試器215送出一同步信號245到該時序控制電子元件260。該時序控制電子元件260控制該雷射源225以產生具有皮秒至飛秒級脈衝寬度,且波長大於矽能帶隙的雷射脈衝(用於2pLADA)或短於矽能帶隙的雷射脈衝(用於單光子LADA)。通常而言,該用於2pLADA之波長約在1,250nm到1,550nm之間,脈衝寬度則約為100fs。該用於單光子LADA之波長為1,064nm,且其脈衝寬度可為奈秒或飛秒之範圍。該雷射脈衝掃描該DUT 240的一待測試區域,以延長或縮短該DUT的開關時間,並將該DUT逼到超過該臨界點。其作法是,如果該測試向量的電壓/頻率是設定成使該DUT接近無法通過測試的值,則將該雷射脈衝的時序調成會使該DUT測試失敗的值。反之,如果該測試向量的電壓/頻率是設定成使該DUT正達到測試失敗的值,則將該雷射脈衝的時序調成會使該DUT測試通過的值。在該時間中,監視該DUT的輸出,以判斷該裝置中產生錯誤的位置。其作法是,在該DUT所輸出的信號顯示該裝置無法通過測試(如果該雷射光束不存在,該DUT即可通過測試)的同時,判斷該光束投射在DUT的位置何在,並以該位置作為造成錯誤的電晶體所在位置。反之,在該DUT所輸出的信號顯示裝置通過測試(如果該雷射光束不存在,該DUT即無法通過測試)的同時,判斷該光束投射在DUT的位置何在,並以該位置作為之前造成錯誤但現在則通過測試的電晶體所在位置。 While the DUT is being excited under its critical conditions, the tester 215 sends a synchronization signal 245 to the timing control electronics 260. The timing control electronics 260 controls the laser source 225 to produce a laser having a picosecond to femtosecond pulse width and a wavelength greater than the chirp bandgap (for 2pLADA) or a laser shorter than the chirp bandgap Pulse (for single photon LADA). Generally, the wavelength for 2pLADA is between about 1,250 nm and 1,550 nm, and the pulse width is about 100 fs. The single photon LADA has a wavelength of 1,064 nm and its pulse width can be in the range of nanoseconds or femtoseconds. The laser pulse scans a region to be tested of the DUT 240 to extend or shorten the switching time of the DUT and force the DUT beyond the critical point. This is done by adjusting the timing of the laser pulse to a value that would cause the DUT test to fail if the voltage/frequency of the test vector is set such that the DUT is close to a value that cannot pass the test. Conversely, if the voltage/frequency of the test vector is set such that the DUT is reaching a test failure value, the timing of the laser pulse is adjusted to a value that will pass the DUT test. During this time, the output of the DUT is monitored to determine where the error occurred in the device. The method is that the signal outputted by the DUT indicates that the device cannot pass the test (if the laser beam does not exist, the DUT can pass the test), and the position of the beam projected on the DUT is determined, and the position is As the location of the transistor that caused the error. Conversely, the signal display device outputted by the DUT passes the test (if the laser beam does not exist, the DUT cannot pass the test), and determines the position of the beam projected on the DUT, and uses the position as the previous error. But now it passes the position of the tested transistor.

必須說明的是,由於該測試裝置會產生一同步信號,故可改變該雷射脈衝的時序,以改變該光學生成(單光子或雙光子)效應對該電晶體的作用量。其方式是,改變該雷射脈衝的時序,以延長或縮短該DUT 的開關時間。這種測試功能除可以用來判斷錯誤的位置之外,尚可判斷錯誤的嚴重性。 It must be noted that since the test device generates a synchronization signal, the timing of the laser pulse can be changed to change the amount of action of the optically generated (single-photon or two-photon) effect on the transistor. The way is to change the timing of the laser pulse to extend or shorten the DUT Switching time. In addition to being used to determine the location of the error, this test function can determine the severity of the error.

本發明之實施例亦使用時序控制電子元件,以精確的控制該雷射脈衝相對於該測試裝置(例如ATE)的時鐘信號升降緣轉換時點之時序。以這種控制方式可以微調延遲或加快該信號在該目標電晶體內的傳播。在一實施例中,如圖2A所描繪,是利用兩個鎖相迴路(Phase Locked Loop,PLL)以準確地控制該脈衝雷射。在圖2A中,該ATE 215提供一時鐘信號Clk及一測試迴路信號Test Loop。該時鐘信號及該測試迴路信號皆輸入至該DUT,並同時傳送至該時序控制電子元件260,形成第一PLL。該雷射源225則包括一第二PLL。 Embodiments of the present invention also use timing control electronics to precisely control the timing of the point at which the laser pulse rises and falls relative to the clock signal of the test device (e.g., ATE). In this way, the delay can be fine-tuned or the propagation of the signal within the target transistor can be accelerated. In one embodiment, as depicted in Figure 2A, two Phase Locked Loops (PLLs) are utilized to accurately control the pulsed laser. In FIG. 2A, the ATE 215 provides a clock signal Clk and a test loop signal Test Loop. The clock signal and the test loop signal are both input to the DUT and simultaneously transmitted to the timing control electronics 260 to form a first PLL. The laser source 225 then includes a second PLL.

也就是,該雷射源225之PLL可確保該雷射脈衝之脈衝頻率穩定並準確地達到所需的頻率,例如:100MHz。相對地,該時序控制電子元件之第一PLL使該第二PLL頻率可同步於該ATE之時鐘信號。值得注意的是,在本發明中所稱的「同步」,並不一定表示該雷射脈衝與該時鐘脈衝同時發生,也可表示兩者可於一測試迴圈期間形成同步。因此可例如將該雷射脈衝之時序平移,以使該脈衝於該時鐘信號之每個時鐘脈衝中間產生,如圖中脈衝序列227所顯示。也可在每一時鐘脈衝之末端產生,如脈衝序列229所顯示。餘此類推。也就是,該雷射脈衝可能相對於該ATE之時鐘信號延遲或提早,但保持同步至該ATE之時鐘信號。 That is, the PLL of the laser source 225 ensures that the pulse frequency of the laser pulse is stable and accurately reaches a desired frequency, for example, 100 MHz. In contrast, the first PLL of the timing control electronics enables the second PLL frequency to be synchronized to the clock signal of the ATE. It should be noted that the term "synchronization" as used in the present invention does not necessarily mean that the laser pulse coincides with the clock pulse, and it can also mean that the two can form a synchronization during a test loop. Thus, for example, the timing of the laser pulses can be translated such that the pulses are generated in the middle of each clock pulse of the clock signal, as shown by pulse sequence 227 in the figure. It can also be generated at the end of each clock pulse, as shown by pulse train 229. The rest of the way. That is, the laser pulse may be delayed or earlier relative to the clock signal of the ATE, but remains synchronized to the clock signal of the ATE.

另一種做法是如下所述,將該雷射脈衝之頻率設為該ATE時鐘信號的倍數。例如,雷射脈衝序列223的脈衝數為7倍,在ATE之每個時鐘脈衝期間即產生7個雷射脈衝。利用一大於1的乘數,即可探測裝置的錯誤 是在升緣、降緣或其他時間產生。同時,因為相對於每一個時鐘脈衝已有數個雷射脈衝提供提早或延遲的顯示功能,故不需將脈衝作延遲或平移處理。反之,也可使用一小於1之乘數。例如,在脈衝序列224,其乘數為0.5倍,如此每隔一個時鐘信號才有一雷射脈衝到達。這種設計可用於驗證裝置的瑕疵確實是因為該雷射脈衝導致,因為如果原因來自於該雷射脈衝,則該裝置驗出失敗的時間會是50%。 Alternatively, the frequency of the laser pulse is set to a multiple of the ATE clock signal as described below. For example, the number of pulses of the laser pulse sequence 223 is seven times, and seven laser pulses are generated during each clock pulse of the ATE. Detecting device errors with a multiplier greater than one It is produced at rising edge, falling edge or other time. At the same time, since several laser pulses are provided with an early or delayed display function with respect to each clock pulse, it is not necessary to delay or translate the pulses. Conversely, a multiplier less than one can also be used. For example, in pulse sequence 224, the multiplier is 0.5 times, so that every other clock signal has a laser pulse arriving. This design can be used to verify that the device's defect is indeed due to the laser pulse, because if the cause is from the laser pulse, the device will fail to detect 50%.

圖3顯示本發明一實施例中,用以達成同步的機制。可經由一中介鎖相迴路(PLL)電路3將從一脈衝雷射光源1輸出,期間為納秒到飛秒的脈衝,同步至一積體電路(IC)2的時鐘週期。在此設計下,該PLL電路接受該IC之時脈週期頻率並將其鎖定於一內部石英振盪器,該石英振盪器震盪頻率與該時鐘信號相同。在本實施例中,該時脈頻率與該石英振盪器之頻率均固定於100MHz,該IC時鐘信號可藉由該ATE(未顯示)產生。此種設計能夠形成1:1的光脈衝對電晶體開關事件同步比率。在此條件下,實際來說,該頻率可設定成1kHz到10GHz之間的任何值,再根據該光子吸收率的效率逐一消去,得到所需的值。 Figure 3 shows a mechanism for achieving synchronization in an embodiment of the invention. It can be output from a pulsed laser source 1 via a medium phase locked loop (PLL) circuit 3, which is a nanosecond to femtosecond pulse, synchronized to the clock period of an integrated circuit (IC) 2. Under this design, the PLL circuit accepts the clock cycle frequency of the IC and locks it to an internal crystal oscillator having the same oscillation frequency as the clock signal. In this embodiment, the clock frequency and the frequency of the quartz oscillator are both fixed at 100 MHz, and the IC clock signal can be generated by the ATE (not shown). This design is capable of forming a 1:1 ratio of light pulse to transistor switching event synchronization. Under this condition, in practice, the frequency can be set to any value between 1 kHz and 10 GHz, and then eliminated one by one according to the efficiency of the photon absorption rate to obtain a desired value.

在此須注意,高於1GHz的光源並不適用在非線性量測,例如本發明的2pLADA方法。這是因為通常各脈衝的峰值光功率是與重複率形成反比,因此,高重複率即等於低峰值光功率,所產生的雙光子吸收效率即使存在,也不足以應用。反之,如果是使用1064nm來進行1:1同步率的單光子量測,則以數個GHz的光源較為有利,因為其光電效應是隨入射光的能量大小而縮放。此外,也應注意雙光子吸收的效率是與入射脈衝期間直接成正比。因此飛秒級的光脈衝產生的峰值光能量比皮秒級或奈秒級的光脈 衝高出許多,故可改善非線性吸收現象。因此,在非線性量測應用上,必須使用超高速(飛秒級或皮秒級)的光脈衝。反之,在單光子的量測應用上,其脈衝期間對吸收率而言,即非屬限制性的參數,因此不會影響量測效果。反而是可以提供額外的探測參數,例如可用來量測光脈衝對光電裝置激發的交互反應期間。不但如此,與以雙光子吸收微調的波長(即>1250nm)相較,矽對於單光子波長(小於1,130nm)的吸收係數較大。 It should be noted here that sources above 1 GHz are not suitable for non-linear measurements, such as the 2 pLADA method of the present invention. This is because the peak optical power of each pulse is usually inversely proportional to the repetition rate. Therefore, the high repetition rate is equal to the low peak optical power, and the resulting two-photon absorption efficiency is not sufficient even if it exists. Conversely, if a single photon measurement using 1064 nm for 1:1 synchronization is used, a light source of several GHz is advantageous because its photoelectric effect is scaled with the amount of energy of the incident light. In addition, it should also be noted that the efficiency of two-photon absorption is directly proportional to the period of the incident pulse. Therefore, the femtosecond light pulse produces a peak light energy that is more than picosecond or nanosecond. It is much higher, so it can improve the nonlinear absorption phenomenon. Therefore, in non-linear measurement applications, ultra-high speed (femtosecond or picosecond) light pulses must be used. On the other hand, in the single photon measurement application, the pulse period is not a limiting parameter for the absorption rate, so it does not affect the measurement effect. Rather, additional probing parameters can be provided, such as can be used to measure the duration of the interaction of the optical pulse to the optoelectronic device excitation. Not only that, the absorption coefficient of 矽 for single photon wavelength (less than 1,130 nm) is larger than that of two-photon absorption fine-tuning (ie, >1250 nm).

為了維持系統的效率,應用時可修正該同步化機制,以使入射光脈衝的整數倍與電晶體的開關事件(或裝置的時鐘頻率)達成匹配。為達成這項目的,需將該雷射光源設計成可產生大於1GHz的重複率,並具有一可縮放的脈衝選用模組,置於脈衝最佳化之後,以供修改其同步比例。例如,可不將各入射光脈衝形成與各電晶體的開關事件達成匹配,而將各每個第二脈衝形成與每個下一開關事件匹配,因而產生一種2:1的同步比例。在實際應用上,這種作法可以使用一200MHz重複率的雷射及一100MHz的裝置頻率加以達成,也可以一1GHz重複率的雷射及一500MHz的裝置頻率加以達成。餘此類推。另一種作法則是可將該比例調整成3:1或4:1等等,只要該比例能對應於一光電時序,使其時鐘脈衝可與測試迴路信號達成同步即可。在這種同步機制下,光子吸收的效率不會下降,但是吸收的發生比率則會,故所產生的光子信號強度會與其同步比例形成負向縮放比。須請注意,以上所述並非以雷射誘發量測積體電路技術的限制性參數。對於每個待測裝置而言,都必須執行光子縮放校正,才能判斷同步比例的最大容許值。此外,如果將一可微調光源(亦即1000-1600nm輸出波長)整合到這種系統內,則在應用時可在單光子吸收與雙光子吸收兩種機制中 互換。因為當波長大於大約1200nm時,雙光子吸收將會顯著於單光子吸收。 In order to maintain the efficiency of the system, the synchronization mechanism can be modified to match an integer multiple of the incident light pulse to the switching event of the transistor (or the clock frequency of the device). To achieve this, the laser source is designed to produce a repetition rate greater than 1 GHz, and has a scalable pulse selection module that is placed after pulse optimization to modify its synchronization ratio. For example, each of the incident light pulses may not be matched to the switching events of the respective transistors, and each of the second pulse formations may be matched to each of the next switching events, thereby producing a 2:1 synchronization ratio. In practical applications, this can be achieved using a 200MHz repetition rate laser and a 100MHz device frequency, or a 1GHz repetition rate laser and a 500MHz device frequency. The rest of the way. Alternatively, the ratio can be adjusted to 3:1 or 4:1, etc., as long as the ratio corresponds to a photo-electrical timing such that its clock pulse can be synchronized with the test loop signal. Under this synchronization mechanism, the efficiency of photon absorption does not decrease, but the ratio of absorption occurs, so that the intensity of the generated photon signal will form a negative scaling ratio with its synchronization ratio. It should be noted that the above is not a limiting parameter for laser-induced measurement of integrated circuit technology. For each device under test, photon scaling correction must be performed to determine the maximum allowable value of the synchronization ratio. In addition, if a fine-tunable light source (ie, 1000-1600 nm output wavelength) is integrated into such a system, it can be applied in both single photon absorption and two-photon absorption mechanisms. exchange. Because when the wavelength is greater than about 1200 nm, two-photon absorption will be significantly greater than single photon absorption.

一旦將上述頻率(即該時鐘頻率及該石英晶體震盪器之頻率)鎖定在一起,該PLL電路之輸出信號即經由一100Mz(或為時鐘之頻率)之電子濾波器傳送至該脈衝雷射,以作為其輸入激發信號。這種作法的優點是,該PLL線路對其輸出信號之相位具有完全控制能力。因此,可用來控制該雷射光輸出之重複率,進而控制其脈衝的抵達時間。此可藉由示波器9比較從該IC所輸出的時鐘頻率,與從該脈衝源輸出之激發輸出,加以驗證。在此實例中,該PLL線路可以電子方式達成大約600fs的相位延遲;然而,因其電路板會發生電性抖動,故而將相位延遲的最小值設定約為20ps。該系統之電性抖動與該光脈衝相對於個別驗證中電晶體開關時間所在之處的準確度,具有直接比例關係。因此,從該系統之電性抖動為20ps可知,該光學位置的準確度亦為20ps,形成一對一配對。此為一關鍵參數,因為如果該光學位置誤差大於例如該2pLADA的飛秒脈衝期間,將會抵銷上述時序控制所獲得的功效。飛秒級的光脈衝可以提高區域的能量密度,以達成有效的雙光子吸收,但當該電性抖動蠶食上述分離的載體產生時間時,該抖動將會限制下一信號的產生,以及當時的時間解資料的時間精確度。 Once the above frequency (ie, the clock frequency and the frequency of the quartz crystal oscillator) is locked together, the output signal of the PLL circuit is transmitted to the pulsed laser via an electronic filter of 100 Mz (or the frequency of the clock). Act as an excitation signal for its input. The advantage of this approach is that the PLL line has full control over the phase of its output signal. Therefore, it can be used to control the repetition rate of the laser light output, thereby controlling the arrival time of its pulse. This can be verified by the oscilloscope 9 comparing the clock frequency output from the IC with the excitation output output from the pulse source. In this example, the PLL line can electronically achieve a phase delay of approximately 600 fs; however, since the board is electrically dithered, the minimum phase delay is set to approximately 20 ps. The electrical jitter of the system is directly proportional to the accuracy of the optical pulse relative to the location of the transistor switching time in the individual verification. Therefore, from the electrical jitter of the system is 20 ps, the optical position is also accurate to 20 ps, forming a one-to-one pairing. This is a critical parameter because if the optical position error is greater than, for example, the femtosecond pulse period of the 2pLADA, the efficiency obtained by the above timing control will be offset. Femtosecond light pulses can increase the energy density of the region to achieve effective two-photon absorption, but when the electrical jitter erodes the time of generation of the isolated carrier, the jitter will limit the generation of the next signal, and at that time The time accuracy of the time solution data.

該雷射脈衝接著耦接至一雷射掃描顯微鏡(Laser Scanning Microscope,LSM)4,用以將該脈衝準確分布在該IC上一特定位置。利用一電腦6控制該LSM,該電腦提供圖形化使用者界面,以及一客製化數位訊號處理器(Digital Signal Processor,DSP)套裝。在本發明所揭示之實施例,此應用套裝經由一預設DSP線路7提供末端使用者可直接與該PLL線路交換資料之功能,而該PLL線路則提供對該雷射脈衝抵達該裝置之時間之完全控 制,例如可延遲或提早該脈衝。 The laser pulse is then coupled to a Laser Scanning Microscope (LSM) 4 for accurately distributing the pulse at a particular location on the IC. The LSM is controlled by a computer 6 that provides a graphical user interface and a custom Digital Signal Processor (DSP) package. In the disclosed embodiment, the application package provides a function for the end user to directly exchange data with the PLL line via a predetermined DSP line 7, and the PLL line provides time for the laser pulse to arrive at the device. Full control For example, the pulse can be delayed or advanced.

現說明該裝置2。該裝置2可因電性激發而產生預設條件之LADA通過/不通過的值,顯示在一客製化應用介面5。該介面板將從一計數器、栓住器及位移暫存器組合所得到的即時取得值,與預先選定一重置開關而插入的置入參考值相比較。對於該即時置入計數器值的精密控制,可藉由一類比微調遲延電位計來達成。該類比微調遲延電位計提供在該應用介面板上,用來改變該拴住器對該IC所致功能之時點。上述架構提供使用者可以條件操控,使比較器的輸出值成為通過、不通過或各半。上述通過/不通過輸出值其後提供至一資料條件化電路(在此實例為一場效可規劃閘極陣列FPGA)8。該電路經程式化,以接收一即時數位通過/不通過激發信號,以條件化方式將該失敗(不通過)值轉變成0-100%的值,並輸出一平均化(以約40us的週期)的數位輸出,也以0-100%的失敗值表示,以提高其可視性,並將所得的通過/不通過程度加以偏估後,顯示於該圖形化使用者介面。該資料條件化電路也可用來與該應用介面板連結,以在校正該應用介面板所輸出的電壓後,計算該雷射誘發的時序延遲的大小。 The device 2 will now be described. The device 2 can generate a LADA pass/fail value of a preset condition due to electrical excitation, and is displayed in a customized application interface 5. The interface panel compares the instantaneously obtained value obtained from a combination of a counter, a latcher and a displacement register with a preset reference value inserted in advance to select a reset switch. The precise control of the instant set counter value can be achieved by an analogy trimming delay potentiometer. The analog-type delay potentiometer is provided on the application panel to change the timing of the function of the clamp to the IC. The above architecture provides the user with conditional control such that the output value of the comparator becomes pass, fail or half. The pass/fail output values described above are then provided to a data conditioning circuit (in this example, a utility programmable gate array FPGA)8. The circuit is programmed to receive an immediate digit pass/fail signal to conditionally convert the failed (not passed) value to a value of 0-100% and output an average (with a period of approximately 40 us) The digital output is also represented by a 0-100% failure value to improve its visibility, and the resulting pass/fail degree is estimated and displayed on the graphical user interface. The data conditioning circuit can also be used to interface with the application panel to calculate the magnitude of the laser induced timing delay after correcting the voltage output by the application panel.

在上述之實施例中,是使用可微調之脈衝雷射光源,並調整該脈衝頻率以同步至該ATE時鐘。雖然上述實施例可行,但可微調之脈衝雷射光源通常極為昂貴並需要使用上述之PLL。圖2B顯示本發明另一實施例,其中的LADA量測是使用一簡化的固定脈衝雷射255達成。例如,可使用一模態鎖定雷射源。所謂模態鎖定是指一種光學技術,可用來產生期間極短的雷射光脈衝,該脈衝屬於皮秒或飛秒級。該雷射脈衝可充作時鐘信號,供給於時序控制電子元件265。傳統ATE具有時鐘輸入埠,故可以程式 規劃成利用該輸入時鐘信號以產生供該DUT使用的時鐘信號Clk,以及測試迴路信號。因此,在本發明一實例中,乃是將該時序控制電子元件265的時鐘信號輸入到該ATE,而該ATE則以程式規劃成可使用該輸入信號產生時鐘信號及測試迴路信號。 In the above embodiment, a finely tunable pulsed laser source is used and the pulse frequency is adjusted to synchronize to the ATE clock. While the above embodiments are feasible, the finely tuned pulsed laser source is typically extremely expensive and requires the use of the PLL described above. Figure 2B shows another embodiment of the invention in which LADA measurements are achieved using a simplified fixed pulse laser 255. For example, a modal locked laser source can be used. Modal locking refers to an optical technique that can be used to generate very short laser pulses during a period of picosecond or femtosecond. The laser pulse can be applied as a clock signal to the timing control electronics 265. Traditional ATE has a clock input port, so it can be programmed The input clock signal is programmed to generate a clock signal Clk for use by the DUT, as well as a test loop signal. Thus, in one embodiment of the invention, the clock signal of the timing control electronics 265 is input to the ATE, and the ATE is programmed to generate a clock signal and a test loop signal using the input signal.

然而,如上所述,為將該脈衝雷射LADA應用到極致,必須調整其脈衝,使其雷射脈衝在該時鐘周期的不同時間點到達該電晶體,例如使其在時鐘周期的上升緣、中間點或下降緣等時點,到達電晶體。在圖2、圖2A及圖3所示的實施例中,是將雷射脈衝提早或延遲來達成。但在圖2B的實施例中,該雷射脈衝為固定,無法改變,因此不能以延後或提早該雷射脈衝的方式來實施。為此,在本發明的一實施例中,是將該ATE以程式規劃,以延後或提早其時鐘信號,以與從該時序控制電子元件265得到的時鐘信號同步。以此方式使該雷射脈衝到達該電晶體的時間點可以微調到該ATE時鐘信號的上升緣、下降緣等時點。 However, as described above, in order to apply the pulsed laser LADA to the extreme, its pulse must be adjusted such that its laser pulse reaches the transistor at different points in the clock cycle, for example, at the rising edge of the clock cycle, The intermediate point or the falling edge is equal to the time point and reaches the transistor. In the embodiment shown in Figures 2, 2A and 3, the laser pulse is achieved either early or delayed. However, in the embodiment of Fig. 2B, the laser pulse is fixed and cannot be changed, and therefore cannot be implemented in a manner that delays or advances the laser pulse. To this end, in one embodiment of the invention, the ATE is programmed to delay or advance its clock signal to synchronize with the clock signal derived from the timing control electronics 265. In this way, the point at which the laser pulse reaches the transistor can be fine-tuned to the rising edge, the falling edge, and the like of the ATE clock signal.

另一方面,因為該ATE及該LADA測試器通常是由不同製造商製造,且實際上測試是由另一第三公司之測試工程師執行,如能簡化該測試工程師的操作,並免除該ATE延遲或提早該信號的任務,將更為有利。為達成此目的,可使用圖2B的實施例所示的相位調整器275。其方式是,使用該相位調整器275來使從該時序控制電子元件265輸出的時鐘信號,早於或晚於該雷射脈衝。所得的調整後信號之後送至該ATE,作為輸入時鐘信號。如此一來,當該ATE輸出其時鐘信號及測試迴路信號時,兩種信號都可相對於該雷射脈衝平移或延遲。 On the other hand, because the ATE and the LADA tester are usually manufactured by different manufacturers, and the test is actually performed by a test engineer of another third company, the operation of the test engineer can be simplified, and the ATE delay is eliminated. Or the task of the signal early will be more advantageous. To achieve this, the phase adjuster 275 shown in the embodiment of Figure 2B can be used. This is accomplished by using the phase adjuster 275 to cause the clock signal output from the timing control electronics 265 to be earlier or later than the laser pulse. The resulting adjusted signal is then sent to the ATE as an input clock signal. In this way, when the ATE outputs its clock signal and test loop signal, both signals can be translated or delayed relative to the laser pulse.

實施例 Example

建造一具有一脈衝光源之脈衝LADA系統,以提供評估或測量操作用裝置的新面向。傳統單光子或替代的雙光子LADA是使用一CW雷射,所使用的光輻射持續的與個別電晶體互動,使其侵入性達到可能損害的程度。反之,本發明使用的是脈衝型的LADA技術,可使個別電晶體的開關行為特性能夠在2個物理維度做出區辨。以下將討論該脈衝型LADA的延伸概念。 A pulsed LADA system with a pulsed source is constructed to provide a new orientation for evaluating or measuring the operating device. Traditional single-photon or alternative two-photon LADA uses a CW laser, and the optical radiation used continues to interact with individual transistors, making it invasive to the extent that it can be compromised. On the contrary, the present invention uses a pulse type LADA technology, which enables the switching behavior characteristics of individual transistors to be distinguished in two physical dimensions. The extended concept of this pulse type LADA will be discussed below.

在傳統CW LADA激發下,裝置的理論及實務都證實,從一p型金屬氧化物半導體(PMOS)電晶體經雷射誘發的裝置微擾(perturbations)強度,將會超過其毗鄰的n型金屬氧化物半導體(NMOS)電晶體的強度。但由於雷射光束的直徑可能覆蓋p型及其毗鄰的n型半導體,所得到的空間解析度仍不足以區別何者為有瑕疵的電晶體。反之,如果使用本發明的實施例,而以脈衝形式為之,則可以其時間解析度來得到提高的空間解析度;甚至使用波長較長的雷射,也可得到相同的結果。換言之,由於入射的脈衝已經微調到恰恰與驗證中的電晶體的開關時間間距相同,且因為各個脈衝所含的峰值能量遠大於使用CW技術的情形,故而可以從位在緊鄰位置的電晶體中,區別並分離出個別的PMOS與NMOS電晶體。這是過去使用CW激發方法所無法達成的。而本發明已經開創出一種新的實驗方法,可供半導體裝置的設計除錯與特性分析應用,並可運用在愈形小型化的設計規則中。本發明的方法已經解決了半導體裝置失敗分析產業的一大難題。該難題源於在最近的科技節點已經朝較低的奈米幾何條件縮小,使得光學誘發型電晶體辨認與操作特性分析更形重要,但卻苦無解決方法。因此,本發明的同步化脈衝LADA方法具有高於習知CW LADA方 法的價值。 Under the traditional CW LADA excitation, the theory and practice of the device have confirmed that the laser-induced device perturbations from a p-type metal oxide semiconductor (PMOS) transistor will exceed its adjacent n-type metal. The strength of an oxide semiconductor (NMOS) transistor. However, since the diameter of the laser beam may cover the p-type and its adjacent n-type semiconductor, the resulting spatial resolution is still insufficient to distinguish which is a germanium transistor. On the other hand, if the embodiment of the present invention is used in the form of a pulse, the spatial resolution can be improved by the temporal resolution; even the laser with a longer wavelength can be used to obtain the same result. In other words, since the incident pulse has been fine-tuned to be exactly the same as the switching time interval of the transistor under verification, and since the peak energy contained in each pulse is much larger than in the case of using the CW technique, it can be from the transistor in the immediately adjacent position. Differentiate and separate individual PMOS and NMOS transistors. This was not possible with the CW excitation method in the past. The present invention has devised a new experimental method for the design and debugging of semiconductor devices, and can be applied to the design rules of increasingly small and small. The method of the present invention has solved a major problem in the semiconductor device failure analysis industry. This problem stems from the fact that the recent technology nodes have been reduced to lower nanogeometry conditions, making optically induced transistor identification and operational characteristics analysis more important, but there is no solution. Therefore, the synchronized pulse LADA method of the present invention has a higher level than the conventional CW LADA side. The value of the law.

圖4A-4C顯示上述改進的一種機制範例。在連續波方法下,因為PMOS信號通常具有支配地位,故而只能得到單一信號的大致空間分布,即如圖4A所示。以這種方法極難以分離個別電晶體的實際分布位置及/或將所得的LADA顯示結果套用到電腦輔助設計(CAD)的布局圖上。理論上每個電晶體都會產生自己的LADA信號,無論其雷射誘發效應強度如何,如圖4B所示。這些信號可以用來完美的追蹤個別電晶體的實際位置,以進行快速的物理的及/或光電的辨認。這種現象也可以應用到脈衝領域,以上述實施例加以實現。其做法是,控制雷射脈衝的時序,使其與測試信號同步,而令其根據使用者的選擇,到達各個PMOS與NMOS電晶體所在位置。該脈衝可調整到與PMOS電晶體的開關動作一致,以對PMOS電晶體作測試,也可調成與NMOS的開關動作一致,以測試該NMOS電晶體,即如圖4C所示。因此可以改善對特定電晶體的開關動作進行評估,並改進LADA信號的CAD強化實體對應與辨認,不受該雷射光束的空間覆蓋範圍所拘束。 4A-4C show an example of the mechanism of the above improvement. In the continuous wave method, since the PMOS signal usually has a dominant position, only a substantially spatial distribution of a single signal can be obtained, as shown in FIG. 4A. In this way it is extremely difficult to separate the actual distribution position of the individual transistors and/or apply the resulting LADA display results to a computer aided design (CAD) layout. In theory each transistor will produce its own LADA signal, regardless of its laser-induced effect intensity, as shown in Figure 4B. These signals can be used to perfectly track the actual position of individual transistors for fast physical and/or optoelectronic identification. This phenomenon can also be applied to the pulse field and is implemented in the above embodiment. The method is to control the timing of the laser pulse to synchronize with the test signal, and to reach the position of each PMOS and NMOS transistor according to the user's choice. The pulse can be adjusted to coincide with the switching action of the PMOS transistor to test the PMOS transistor, and can also be adjusted to coincide with the switching action of the NMOS to test the NMOS transistor, as shown in FIG. 4C. Therefore, the switching action of the specific transistor can be improved, and the CAD reinforcement entity correspondence and recognition of the LADA signal can be improved, and is not restricted by the spatial coverage of the laser beam.

此外,該超高速脈衝所產生提高的峰值功率除了能更有效產生LADA信號之功能,即所得結果含較少影像平均值之外,通常可以提高或降低(視所需產生微擾的為PMOS或NMOS電晶體而定)雷射誘發臨界時序路徑微擾,因此可以改進LADA信號的收集。較強的入射光功率可以提高矽材質中光注入載子的數量,並隨之提高在待測裝置的結構中激發光電變動(optoelectronic fluctuations)的機率。以這種方式可以達成顯著的LADA信號回應,而可僅使用較低程度的侵入性即能量測得到。脈衝光源實際上關閉(OFF)的時間長於打開(ON)的時間,故可降低熱量累積與產生損害 的機率。例如,以脈衝期間為10ps的超高速雷射,在重複率為100MHz之下,雷射關閉的期間為10ns,形成一種1:1000的ON/OFF比,故可提供足夠的冷卻停機時間。不過須注意的是,產生加熱的最終原因還是其功率比。例如單一光脈衝如果含有1kJ的入射光學能量,即可滿足上述條件,但同時也含有足夠的能量而可能因其他熱學或非熱學的光電機制,對裝置產生永久性的傷害。 In addition, the increased peak power produced by the ultra-high-speed pulse can be increased or decreased in addition to the function of the LADA signal, that is, the result is less than the average value of the image (depending on the desired generation of the PMOS or PMOS) Depending on the NMOS transistor, the laser induces critical timing path perturbations, thus improving the collection of LADA signals. The stronger incident light power can increase the number of light-injected carriers in the germanium material and increase the probability of exciting optoelectronic fluctuations in the structure of the device under test. Significant LADA signal responses can be achieved in this manner, but can be measured using only a lower degree of intrusive or energy. The pulse light source is actually turned OFF for longer than the ON time, so heat accumulation and damage are reduced. The chance. For example, with an ultra-high speed laser with a pulse period of 10 ps, the laser is turned off for 10 ns at a repetition rate of 100 MHz, resulting in a 1:1000 ON/OFF ratio, thus providing sufficient cooling downtime. It should be noted, however, that the ultimate cause of heating is its power ratio. For example, if a single light pulse contains 1kJ of incident optical energy, the above conditions can be met, but at the same time, it also contains enough energy and may cause permanent damage to the device due to other thermal or non-thermal photoelectric mechanisms.

同時,由於需以非侵入性的方式對一特定電晶體注入相當程度的光功率,當然會產生使之前忽略的電晶體位置產生微擾的可能性。本來,要在一給訂的疑似瑕疵區域附近產生大規模的光載子(對於敏感度不等的電晶體作檢測時實屬常見),就會提高將LADA檢測區域的可視範圍不當擴大的可能性。所要活化的區域可以使用約為10-100uA的雷射誘發光電流來激發。但是在使用超高速雷射脈衝所驅動的峰值光功率,只要趨近10-100kW即足以對待測裝置注入10-100mA的光電流,而仍維持安全程度內的侵入性。這種能量即足以使「健康的」電晶體產生微擾。 At the same time, due to the need to inject a relatively large amount of optical power into a particular transistor in a non-invasive manner, it is of course possible to create a perturbation of the previously neglected transistor position. Originally, it was necessary to generate large-scale photocarriers in the vicinity of a suspected sputum area (which is common for detection of transistors with different sensitivities), which would increase the possibility of improperly expanding the visual range of the LADA detection area. Sex. The region to be activated can be excited using a laser induced photocurrent of about 10-100 uA. However, the peak optical power driven by the ultra-high speed laser pulse is as close as 10-100 kW, which is enough to inject a photocurrent of 10-100 mA into the device to be tested, while still maintaining intrusion in a safe degree. This energy is enough to cause perturbations in "healthy" transistors.

要在矽材質中獲得有效的雙光子吸收,可以使用高於10MW/cm2(百萬瓦/平方公分)之焦點雷射功率密度。不過,用在單光子吸收時,其值大約小106倍。這是因為其相對吸收截面不同。要達成有效且非侵入性的光載子注入,該入射光功率(或局部功率密度)的大小需降低,因為待驗證的電晶體幾何規模已然縮小。同時,雙光子吸收的發生並非依存於特定的功率密度臨界值。雙光子吸收是一種瞬間的,量子力學定義的非線性過程,隨其三級非線性極化率(third-order nonlinear susceptibility)的虛數部分變化,亦即隨強度平方變化,而非隨功率密度變化。 To achieve effective two-photon absorption in the tantalum material, a focal laser power density of more than 10 MW/cm 2 (million watts/cm 2 ) can be used. However, when used for single photon absorption, its value is approximately 106 times smaller. This is because its relative absorption cross section is different. To achieve efficient and non-invasive photon implantation, the incident light power (or local power density) needs to be reduced because the geometry of the transistor to be verified has shrunk. At the same time, the occurrence of two-photon absorption does not depend on a specific power density threshold. Two-photon absorption is an instantaneous, quantum mechanically defined nonlinear process that varies with the imaginary part of its third-order nonlinear susceptibility, that is, with the square of the intensity, rather than with the power density. .

即使1,250nm之雙光子波長可有效性地在該矽內部產生625nm的吸收(其中該吸收截面大於1,064nm),因該吸收過程依存於強度之特性也會降低其吸收的總相對比例。雙光子吸收是直接與入射光強度的平方成正比。此外,矽的摻雜程度也會影響其結果,亦即提高或降低摻雜濃度將會影響吸收的效率,其關係為波長的函數。然而這種經過單光子影響的機率卻可用來實現另一種新穎的雷射探測與裝置特性分析平台,提供對電晶體內作信號區分及轉換等級的高精密時序分析。傳統的CW LADA方法並無法提供這種形式的檢驗分析,因為受限於其侵入性特質(因其雷射為常開),以及有限的功率傳遞能力。相反的,本發明使用時間解的脈衝探測方法,則已空前的提供對無瑕疵的,設計定義的節點,並連同對其後續下游裝置的表現及互動,進行失敗分析,以檢驗其電晶體開關動作的物理學特性。為能有效實現如本發明型態的裝置特性分析,必須先對所需的入射光功率強度有所了解。使「健康的」電晶體產生微擾,需要使用高的峰值功率,但同時必須維持最小程度的侵入性。在此條件下,將入射光脈衝的期間最佳化,極有必要。如同已知,在1064nm波長下,皮秒級的脈衝期間在電晶體層次可提供相當強度的入射光功率(以及產生足夠的光載子),因為例如10ps的雷射脈衝,重複率為100MHz,且平均功率為4mW時,可產生4W的峰值功率。但是這種條件在該雷射重複率搭配到從待測裝置所得的時鐘頻率高於1GHz時,將無法達成。提高重複率的結果將導致峰值功率下降。因此,另一種較適當的替代方式是使用一飛秒級的雷射光源。該雷射重複率可以依據該裝置的工作頻率作縮放,同時提供提高等級的峰值光功率,因為其脈衝期間已經縮短1000倍,故可將其峰值功率提高相同的倍 數。在上例中即為4kW。使用飛秒級的脈衝期間另一項優點是改善其時間特性分析效果,不過所提高的效果受限於該同步化機制的電性抖動的強度,均已說明如上。最後,飛秒級的脈衝與皮秒級或奈秒級的脈衝相比,可提供較小程度的光學侵入性,從而將對裝置的雷射誘發損害發生可能性,降至最低。 Even though the two-photon wavelength of 1,250 nm is effective to produce an absorption of 625 nm inside the crucible (where the absorption cross section is greater than 1,064 nm), the absorption process depends on the strength characteristics and also reduces the total relative proportion of its absorption. Two-photon absorption is directly proportional to the square of the incident light intensity. In addition, the degree of doping of bismuth also affects the result, that is, increasing or decreasing the doping concentration will affect the efficiency of absorption, which is a function of wavelength. However, this single photon-affected probability can be used to implement another novel laser detection and device characterization platform that provides high-precision timing analysis of signal differentiation and conversion levels within the transistor. The traditional CW LADA method does not provide this form of inspection analysis because of its invasive nature (because its laser is normally open) and limited power transfer capability. In contrast, the present invention uses a time-resolved pulse detection method to provide an unprecedented analysis of the flawless, design-defined nodes and their performance and interaction with subsequent downstream devices to verify their transistor switches. The physical characteristics of the action. In order to be able to effectively implement the device characteristic analysis as in the present invention, it is necessary to first understand the required incident light power intensity. To cause perturbation of "healthy" transistors, high peak power is required, but at the same time minimal intrusion must be maintained. Under these conditions, it is extremely necessary to optimize the period of the incident light pulse. As is known, at a wavelength of 1064 nm, a picosecond pulse can provide a comparable intensity of incident light power at the transistor level (and generate enough photocarriers) because, for example, a 10 ps laser pulse, the repetition rate is 100 MHz, When the average power is 4mW, a peak power of 4W can be generated. However, this condition cannot be achieved when the laser repetition rate is matched to a clock frequency higher than 1 GHz obtained from the device under test. Increasing the repetition rate results in a drop in peak power. Therefore, another more suitable alternative is to use a femtosecond laser source. The laser repetition rate can be scaled according to the operating frequency of the device, while providing an increased level of peak optical power, since the pulse period has been shortened by 1000 times, so that the peak power can be increased by the same factor. number. In the above example, it is 4 kW. Another advantage of using a femtosecond pulse period is to improve its time characteristic analysis effect, but the improved effect is limited by the intensity of the electrical jitter of the synchronization mechanism, as explained above. Finally, femtosecond pulses provide a lesser degree of optical intrusion than picosecond or nanosecond pulses, minimizing the likelihood of laser induced damage to the device.

此外,本發明的脈衝型LADA系統已證明因其能正確的控制脈衝時序,而可提高檢測的空間解析度。再與習知CW方法比較,該CW方法是以雷射持續的激發一疑似瑕疵的特定區域,以即時的演繹出LADA資訊。所產生的結果是空間上的平均值二維LADA影像,因為在電路功能性的較高階層順序之間,即傳播信號路徑與時間之間,並無法產生區別;只能得到兩者結合後的分布資訊。其中又因受到PMOS支配,而產生偏差。與此相對,本發明的脈衝型方法則能區別出不同傳播速度的路徑,其精確度達到20ps,故可供高解析度的LADA信號顯示使用,而提供提升的側向解析度。原因在於所得結果可個別的以時間區別空間上相分離的相鄰電晶體;這些電晶體並未設定在該時間執行開關動作,而是在之後的裝置操作周期才開關。本發明可提升LADA的區別解析度以及實際上的LADA解析度。 Furthermore, the pulse type LADA system of the present invention has been shown to improve the spatial resolution of detection due to its ability to properly control pulse timing. Compared with the conventional CW method, the CW method is to stimulate the LADA information in real time by exciting a specific area of the suspected sputum by the laser. The result is a spatially average two-dimensional LADA image, because there is no difference between the higher-level order of circuit functionality, ie, the propagation signal path and time; only the combination of the two can be obtained. Distribution information. Among them, due to the PMOS dominance, there is a deviation. In contrast, the pulse type method of the present invention can distinguish paths of different propagation speeds with an accuracy of 20 ps, so that it can be used for high-resolution LADA signal display, and provides improved lateral resolution. The reason is that the results obtained can individually distinguish spatially separated adjacent transistors by time; these transistors are not set to perform switching operations at this time, but are switched on during subsequent device operation cycles. The invention can improve the difference resolution of LADA and the actual LADA resolution.

圖5A-5D顯示本發明的架構範例。在連續波模式下,因為該LADA信號的空間分布是以時間平均,所得的二維LADA分布圖只能提供大致的光電結構,且顯示結果是經個別電晶體的LADA信號強度左右(因為PMOS通常較NMOS更具主導能力),產生偏差。所得的影像即如圖5A所示,圖中顯示其空間解析度不佳,且與CAD套圖的能力有限。與此相對,在本發明的脈衝型模式下,所得的LADA影像品質較佳,且其空間解析度提高, 因在取得信號方法上的時間解特性所致。因為將個別電晶體的個別位置設為空間與時間的函數(並因能提供足夠的入射光功率以移除可能的PMOS偏差效應),相鄰電晶體的影響已經透過微擾該LADA信號取得而有效移除。得到一種測試器驅動,依存於電晶體的,控制裝置操作的事件序列。每個電晶體都設定成以一系統化,時間依存的順序做開關動作,而使入射光脈衝能夠直接以2個物理維度(即X與Y)以及以時間軸,描繪及量測各個電晶體。如此一來,所得到的LADA信號的空間解析度即獲得改善,且因此可以抽取額外的,先前技術所無法得到的裝置相關資料,即如圖5B與5C的順序所示。圖中顯示在不同時間點取得的影像,均可提供時間上與空間上的區別性。 5A-5D show an example of the architecture of the present invention. In continuous wave mode, since the spatial distribution of the LADA signal is time averaged, the resulting two-dimensional LADA profile can only provide a rough photoelectric structure, and the display result is about the LADA signal strength of the individual transistor (because PMOS is usually Deviation is more dominant than NMOS). The resulting image is shown in Figure 5A, which shows poor spatial resolution and limited ability to CAD drawings. On the other hand, in the pulse mode of the present invention, the obtained LADA image quality is better, and the spatial resolution thereof is improved. Due to the time resolution characteristics of the signal acquisition method. Since the individual locations of individual transistors are set as a function of space and time (and because sufficient incident optical power can be provided to remove possible PMOS bias effects), the effects of adjacent transistors have been obtained by perturbing the LADA signal. Effective removal. A tester drive is obtained that depends on the sequence of events of the transistor that control the operation of the device. Each transistor is set to perform a switching action in a systematic, time-dependent sequence, allowing the incident light pulse to directly depict and measure each transistor in two physical dimensions (ie, X and Y) and on the time axis. . As a result, the spatial resolution of the resulting LADA signal is improved, and thus additional device-related data not available in the prior art can be extracted, as shown in the order of Figures 5B and 5C. The images shown at different points in time show the difference in time and space.

除了可以利用本發明收集LADA相關資料之外,本發明也可用來判斷其他的光電現象。其中一例即是量測雷射誘發載子的生命週期。在現有技術下,對裝置上特定位置的載子生命週期的量化極度困難。這是因為這種量測需取得多數不同的光電參數,例如材料組成、尺寸大小、幾何條件以及電場強度與方向等等。但是如果使用本發明的脈衝型LADA技術,則可藉由偽泵探針型(pseudo pump-probe type)技術,直接量測其電子時序表(timescale)。量測時是將一特定電晶體的LADA事件的發生,連結到一雷射脈衝的到達時間。所量得的載子生命週期可能需要以該系統的電子反應時間調整(即減除),以得到更正確的量測結果。 In addition to the ability to collect LADA related data using the present invention, the present invention can also be used to determine other photoelectric phenomena. One example is to measure the life cycle of a laser-induced carrier. Under the prior art, quantification of the carrier life cycle at a particular location on the device is extremely difficult. This is because such measurements require most different optoelectronic parameters, such as material composition, size, geometry, and electric field strength and direction. However, if the pulse type LADA technique of the present invention is used, the electronic time series can be directly measured by a pseudo pump-probe type technique. The measurement is to connect the occurrence of a LADA event of a particular transistor to the arrival time of a laser pulse. The measured carrier life cycle may need to be adjusted (ie, subtracted) by the electronic reaction time of the system to obtain a more accurate measurement.

當使用單光子LADA,即1064nm波長的雷射脈衝,所量得的LADA效應的強度,與雷射誘發光電流的強度直接成正比(這是當使用線性吸收時,LADA信號會以雙光子技術二次響應)。根據一實施例,該LADA 信號可對比到一雷射脈衝到達時間的函數。進而可能擷取該載子生命週期,因為該週期將指出所得的LADA信號強度。 When using single-photon LADA, a laser pulse with a wavelength of 1064 nm, the intensity of the measured LADA effect is directly proportional to the intensity of the laser-induced photocurrent (this is when the linear absorption is used, the LADA signal is double-photon) Second response). According to an embodiment, the LADA The signal can be compared to a function of the arrival time of a laser pulse. It is then possible to capture the carrier lifetime as this period will indicate the resulting LADA signal strength.

根據本發明一實施例,實施程序如下。第一步,以一雷射光束(例如一波長1064nm的CW雷射光束)停駐照射一疑似瑕疵的電晶體,以得到一最佳化的LADA信號。如圖式7A所示。位於最佳LADA信號的雷射光束之空間座標,指出該電晶體的適當空間座標。關掉該CW雷射光源並開啟該脈衝雷射光源,將其雷射脈衝指向根據該CW雷射得到的空間座標。調整該雷射脈衝時間,以產生及測量該最佳化LADA信號。以得到與到達電晶體的測試器(例如ATE)脈衝形成適當的時間性重疊,如圖式7B所示。於此時,該電晶體上的雷射光點之空間重疊,及測試信號上雷射脈衝之時間重疊將會到達最佳值。並且,該雷射脈衝到達時間可調整至配合該載體生命週期的量測。特別是,改變雷射脈衝的時序,紀錄該LADA信號於每個時點(例如,延遲或提早的量)的強度,直到該LADA信號變為零。繪圖顯示LADA信號強度相對於時間的反應,如圖式7C所示。LADA信號從最大值轉變為最小值(或反之)所需時間,即對應至所測雷射誘發載體生命週期。執行上述程序時,需重覆施加電子測試信號至DUT。 According to an embodiment of the invention, the implementation procedure is as follows. In the first step, a laser beam (e.g., a CW laser beam having a wavelength of 1064 nm) is parked to illuminate a suspected germanium transistor to obtain an optimized LADA signal. As shown in Figure 7A. The spatial coordinates of the laser beam at the best LADA signal, indicating the appropriate spatial coordinates of the transistor. Turning off the CW laser source and turning on the pulsed laser source, directing its laser pulse to the spatial coordinates obtained from the CW laser. The laser pulse time is adjusted to generate and measure the optimized LADA signal. A suitable temporal overlap is obtained with a tester (e.g., ATE) pulse that arrives at the transistor, as shown in Figure 7B. At this time, the spatial overlap of the laser spots on the transistor and the time overlap of the laser pulses on the test signal will reach an optimum value. Moreover, the laser pulse arrival time can be adjusted to match the measurement of the life cycle of the carrier. In particular, changing the timing of the laser pulses, the intensity of the LADA signal at each point in time (eg, a delay or an early amount) is recorded until the LADA signal becomes zero. The plot shows the response of the LADA signal intensity to time, as shown in Figure 7C. The time required for the LADA signal to transition from a maximum value to a minimum value (or vice versa) corresponds to the measured laser induced carrier life cycle. When performing the above procedure, it is necessary to repeatedly apply the electronic test signal to the DUT.

雷射光源 Laser source

現有技術已能提供重複率高達數GHz的雷射光源。該雷射光源經過精密規制其共振腔長度,即:震盪腔越短,其重複率越高。對腔室長度的控制可以利用一壓電致動器設置在一腔內共振器反射鏡的相反側,加以達成並鎖定。這是目前工業標準的重複率鎖定技術,但用來實施本發明機制的電子混波器電路,在設計上及實施上可能有所不同。為能將該微 調脈衝雷射光源納入上述實施例的LADA測試器,需使用2組反饋迴路。一組用來控制該雷射脈衝的重複率,另一組用來將該脈衝的時序同步於該DUT的時鐘。第一組用來控制重複率的反饋迴路包括一個混波器,用來比較該雷射的自由運行(free-running)重複率頻率與一輸入時鐘激發信號,以產生一高電壓驅動的差動信號。該差動信號即輸入到該壓電傳導器,以調整該共振腔的長度,進而將所需的長度調整到使脈衝的重複率與輸入時鐘信號相匹配。這個處理機制的一種實例顯示在圖6。除在圖6所顯示的電路之外,另一次級穩定化機制也可包括在系統中,以持續監控並改正該分數-整數放大器的輸出電壓。以此方式確保該高電壓放大器可常時的得到正確的輸入電壓,以在較長的時段內,例如在數日中而非數十分鐘內,穩定的鎖定重複率。 The prior art has been able to provide laser sources with repetition rates up to several GHz. The laser light source is precisely regulated to the length of its resonant cavity, that is, the shorter the oscillation cavity, the higher the repetition rate. Control of the length of the chamber can be accomplished by a piezoelectric actuator disposed on the opposite side of the resonator mirror in the cavity. This is the current industry standard repetition rate locking technique, but the electronic mixer circuit used to implement the mechanism of the present invention may differ in design and implementation. To be able to The pulsed laser source is incorporated into the LADA tester of the above embodiment, and two sets of feedback loops are used. One set is used to control the repetition rate of the laser pulse, and the other is used to synchronize the timing of the pulse to the clock of the DUT. The first set of feedback loops for controlling the repetition rate includes a mixer for comparing the free-running repetition rate frequency of the laser with an input clock excitation signal to generate a high voltage driven differential signal. The differential signal is input to the piezoelectric transducer to adjust the length of the resonant cavity, thereby adjusting the desired length to match the repetition rate of the pulse to the input clock signal. An example of this processing mechanism is shown in Figure 6. In addition to the circuitry shown in Figure 6, another secondary stabilization mechanism can be included in the system to continuously monitor and correct the output voltage of the fractional-integer amplifier. In this way it is ensured that the high voltage amplifier can always get the correct input voltage for a stable lock repetition rate over a longer period of time, for example over several days instead of tens of minutes.

本發明的實施例亦提供一方法,以從同步化的單光子或雙光子脈衝LADA擷取個別的時序圖。該方法包括將該入射雷射光束空間定位(或「停駐」)於目標電路特徵。之後按時間逐一檢視該雷射脈衝之到達時間。該時間為相對於該測試時鐘信號或該迴路長度觸發信號的時間。接著記錄每一雷射脈衝到達時間所得之失敗率特性的強度及信號。該LADA量測方法可同時進一步擷取正反器擾動對應(即邏輯狀態控制)。傳統上,單一事件擾動是以直接測量該雷射誘發光電流強度之方式對應到DUT上之一特定位置。本發明所揭露實施例之方法是在執行以LADA為基礎的測試時,擷取該擾動資訊。本發明導出一種新的方法去評估這些擾動且更有效益。 Embodiments of the present invention also provide a method for extracting individual timing diagrams from synchronized single photon or two photon pulses LADA. The method includes spatially locating (or "parking" the incident laser beam to a target circuit feature. Then, the arrival time of the laser pulse is checked one by one by time. This time is the time relative to the test clock signal or the loop length trigger signal. The intensity and signal of the failure rate characteristic obtained for each laser pulse arrival time is then recorded. The LADA measurement method can further capture the flip-flop response (ie, logic state control). Traditionally, a single event disturbance corresponds to a particular location on the DUT in a manner that directly measures the intensity of the laser induced photocurrent. The method of the disclosed embodiment of the present invention captures the disturbance information when performing an LADA-based test. The present invention derives a new approach to assessing these perturbations and is more efficient.

本發明使用其他單光子吸收方法,於一實施例中是雙光子吸收方法,激發p接面及n接面半導體,以對疑似具有時間相關失敗之裝置, 提供數位的可視性。使用雙光子吸收方法時,可以對注入光電流的區域量得局部的軸空間效應值。使用10皮秒級的取樣精確度,可以使特定的測試向量邊緣,在統計方法中不會位於通過/不通過的臨界點。 The present invention uses other single photon absorption methods, in one embodiment a two-photon absorption method that excites p-junctions and n-junction semiconductors for devices suspected of having time-dependent failures, Provides digital visibility. When the two-photon absorption method is used, a local axial space effect value can be measured for the region where the photocurrent is injected. With a sampling accuracy of 10 picoseconds, a particular test vector edge can be made to be at a critical point of pass/fail in statistical methods.

LADA波形 LADA waveform

圖8描繪本發明一LADA系統之實施例。該系統可於每個特定(xi,yi)位置,取出個別的LADA波形。該波形代表失敗率與雷射脈衝到達時間的關係。該波形可幫助分析DUT中個別電晶體之行為及/或失敗機制。該系統自身結合圖2系統中之多數元件,且與圖2顯示之元件相似之元件,均標以類似的元件編號,但都以8字開頭。 Figure 8 depicts an embodiment of an LADA system of the present invention. The system can take individual LADA waveforms at each specific (xi, yi) location. This waveform represents the relationship between the failure rate and the arrival time of the laser pulse. This waveform can help analyze the behavior and/or failure mechanisms of individual transistors in the DUT. The system itself incorporates most of the components of the system of Figure 2, and components similar to those shown in Figure 2 are labeled with similar component numbers, but all begin with an 8 word.

在圖8的系統中,使用一個光學元件,例如半反射鏡837將從DUT反射的光線引導到光學感應器870上。如果需要,可將聚焦透鏡842插入在光線的路徑上,以聚集該反射光線至該光學感應器870上。舉例言之,該光學感應器可能是一光電二極體,一雪崩光電二極體(APD),或是一光電倍增管等等。於此實施例中,該光學感應器870為一單一像素感應器。當LSM將一雷射脈衝射向DUT的選定位置,從此位置反射出的光線會由光學感應器870所感應,因此感應器870傳送一相應的強度信號872到控制器850。據此可在控制器850上記錄對應到個別照射位置的強度信號。如果該LSM是用來逐一移動該雷射脈衝行經相鄰的點,使該雷射脈衝逐一照射該DUT上的給定區域,在無任何其他動作之下,由該強度信號所組成的影像應該是相當一致的灰色影像,有時即稱為胡椒鹽影像(利用灰階影像數位化技術產生)。 In the system of FIG. 8, an optical element, such as a half mirror 837, is used to direct light reflected from the DUT onto the optical sensor 870. If desired, a focusing lens 842 can be inserted into the path of the light to focus the reflected light onto the optical sensor 870. For example, the optical sensor may be a photodiode, an avalanche photodiode (APD), or a photomultiplier tube or the like. In this embodiment, the optical sensor 870 is a single pixel sensor. When the LSM directs a laser pulse to a selected location of the DUT, the light reflected from this location is induced by the optical sensor 870, so the inductor 870 transmits a corresponding intensity signal 872 to the controller 850. Accordingly, an intensity signal corresponding to the individual illumination locations can be recorded on the controller 850. If the LSM is used to move the laser pulse one by one through adjacent points, so that the laser pulse illuminates a given area on the DUT one by one, the image composed of the intensity signal should be under no other action. It is a fairly consistent gray image, sometimes called a pepper salt image (generated using grayscale image digitization techniques).

在操作時是選擇DUT上一特定區域進行驗證,並將測試器 設置成可產生使該裝置在該選定區域內呈現50%失敗率的測試向量。之後,重複執行該測試迴路,使每一個像素都照射數次,並記錄其反射光的強度。在本案中所稱之「像素」,是指一空間位置,即在該LSM將該反射鏡停留到一特定位置時,該雷射脈衝所照射的位置。該光學感應器870所產生的強度信號即視為一單一像素。不過,在該LSM移動反射鏡到該DUT上的跟隨位置,以涵蓋該選定區域全部時,從各位置的光學感應器所收集到的光,即認為對應於該位置的像素。利用這種方式即可將該選定區域在空間上劃分成影像像素,雖然該光學感應器只是單一像素感應器。反之,位在各位置上的感應器產生的影像,在顯示監視器上,可能是以多數像素表示。其間之比例取決於該感應器在對該DUT成像時,其直徑與在螢幕上顯示大小的比例。在本文中,該感應器對該DUT成像的面積,稱為一影像像素,但顯示在監視器螢幕上時,可能包括多數的螢幕像素。 In operation, select a specific area on the DUT for verification and test the tester. The test vector is set to produce a 50% failure rate for the device to exhibit within the selected area. Thereafter, the test loop is repeatedly executed so that each pixel is irradiated several times, and the intensity of the reflected light is recorded. The term "pixel" as used in this context refers to a spatial position, that is, the position at which the laser pulse is illuminated when the LSM holds the mirror to a specific position. The intensity signal produced by the optical sensor 870 is considered to be a single pixel. However, when the LSM moves the mirror to the following position on the DUT to cover all of the selected area, the light collected from the optical sensors at each location is considered to correspond to the pixel at that location. In this way, the selected area can be spatially divided into image pixels, although the optical sensor is only a single pixel sensor. Conversely, images produced by sensors located at various locations may be represented by a majority of pixels on the display monitor. The ratio between them depends on the ratio of the diameter of the sensor to the size displayed on the screen when imaging the DUT. In this paper, the area that the sensor images the DUT is called an image pixel, but when displayed on the monitor screen, it may include a large number of screen pixels.

如圖2A所示,本發明可以控制雷射脈衝的同步化,使雷射脈衝在相對於測試向量的既定延遲或提早時間到達DUT。本發明在一實施例中利用這種控制,將該時序控制電子元件設置成可使該雷射產生橫跨整個測試向量信號v的光脈衝序列p,如圖8中的虛線方框所示。每個脈衝序列中的脈衝823對應於一時間點ti,並紀錄光學感應器870在各時間點ti所收集到的反射光信號872。對每個像素重複該步驟,使得系統可以記錄各個位在該選定區域內的像素,即各個照射位置(Xi,Yi)上,於各時間點ti的強度信號。如果所有在選定區域內的電晶體都個別對測試向量及雷射脈衝回應,則所得之影像會是一個椒鹽狀類似雜訊的影像。 As shown in FIG. 2A, the present invention can control the synchronization of the laser pulses such that the laser pulses arrive at the DUT at a predetermined delay or early time relative to the test vector. In one embodiment, the present invention utilizes such control to set the timing control electronics such that the laser produces a sequence of optical pulses p across the entire test vector signal v, as indicated by the dashed box in FIG. The pulse 823 in each pulse sequence corresponds to a time point ti, and the reflected light signal 872 collected by the optical sensor 870 at each time point ti is recorded. This step is repeated for each pixel so that the system can record the individual bits in the selected area, i.e., the intensity signals at each time point ti at each illumination position (Xi, Yi). If all of the transistors in the selected area respond individually to the test vector and the laser pulse, the resulting image will be a salt and pepper-like image.

不過,如果將測試向量設定成使電晶體的失敗率維持在 50%,則該雷射脈衝將逼使部分電晶體失敗率提高,部分電晶體通過率提高。本發明人已經發現,各該電晶體的通過率與失敗率乃是取決於該雷射脈衝相對於該測試向量的時鐘信號的到達時間。據此,將圖8的系統配置成能夠擷取該資訊,並將該資訊呈現給使用者。特別是,在產生各個像素與脈衝到達時間的組合,例如:(xi,yi,ti)時,是重複測試多次,以產生一失敗率值(%)。發明人也發現,部分電晶體會因為該雷射脈衝而提高其通過率,但只需記錄其失敗率低於50%的初始設定值即可。其後對個別位置(xi,yi)產生一曲線圖,以顯示其失敗率變化與時間ti的關係,即如圖8中的實線方塊所示。圖中顯示在該DUT上選定的點(xi,yi)上,失敗率和時間之關係圖。 However, if the test vector is set to maintain the failure rate of the transistor at At 50%, the laser pulse will force the partial transistor failure rate to increase and the partial transistor pass rate to increase. The inventors have discovered that the pass rate and failure rate of each of the transistors is dependent on the arrival time of the laser signal relative to the clock signal of the test vector. Accordingly, the system of Figure 8 is configured to capture the information and present the information to the user. In particular, in generating a combination of individual pixels and pulse arrival times, for example: (xi, yi, ti), the test is repeated a plurality of times to generate a failure rate value (%). The inventors have also discovered that some of the transistors will increase their pass rate due to the laser pulse, but only the initial set value whose failure rate is less than 50% is recorded. A graph is then generated for the individual locations (xi, yi) to show the relationship between the failure rate change and the time ti, as shown by the solid squares in FIG. The figure shows the relationship between failure rate and time at the selected point (xi, yi) on the DUT.

須說明的是,雖然該曲線圖簡稱為「表示失敗率和時間的關係」,所稱之「時間」其實是指時間差,也就是測試信號與雷射脈衝間的時間差值測量結果。因此,時間t0可能是代表測試脈衝到達前10皮秒的時點,而時間t15可能是代表與測試脈衝上升緣一致的時點,而時間t50則可能是代表測試脈衝下降緣後10皮秒之時點。 It should be noted that although the graph is simply referred to as "representing the relationship between failure rate and time", the term "time" refers to the time difference, that is, the time difference measurement between the test signal and the laser pulse. Therefore, the time t0 may be the time point representing the first 10 picoseconds before the test pulse arrives, and the time t15 may represent the time point coincident with the rising edge of the test pulse, and the time t50 may be the time point representing 10 picoseconds after the falling edge of the test pulse.

描繪例如圖8的實線方框內之圖形的方法說明如下。在如上的說明中已經記錄每個位置及時間(xi,yi,ti)的強度信號,此處可稱為時空容積。根據本實施例,是使用一二維色彩空間,例如為黑白或灰階,也可使用其他顏色。然後,於每個時空容積,當測試器指出該電晶體為測試失敗時,像素值記錄為1,代表例如白色。相反地,當測試器指出該電晶體為測試通過時,強度值紀錄為0,代表例如黑色。因為該數據為計算所有目標選定區域內的像素值的累積值,如裝置有50%的失敗率,像素將呈現 平均的背景顏色,例如灰色。然而,如裝置有超過50%的失敗率,其像素將呈現淺色或白色。如果裝置有低於50%的失敗率,則像素將呈現深色。重複掃描顯示結果以累加或平均化重複測試程序的結果,顯示器的電荷注入會產生有灰色背景顏色的影像,其中白色像素代表最可能為測試失敗的裝置,而黑色像素則代表最可能測試通過的裝置。其結果顯示於圖8上方的點線方框內。 A method of depicting a graphic such as the solid line block of Fig. 8 is explained below. The intensity signal for each position and time (xi, yi, ti) has been recorded in the above description and may be referred to herein as a space-time volume. According to this embodiment, a two-dimensional color space is used, such as black and white or grayscale, and other colors may be used. Then, at each space-time volume, when the tester indicates that the transistor is a test failure, the pixel value is recorded as 1, representing, for example, white. Conversely, when the tester indicates that the transistor is a test pass, the intensity value is recorded as 0, representing, for example, black. Because the data is a cumulative value for calculating pixel values in all selected regions of the target, if the device has a 50% failure rate, the pixels will be rendered The average background color, such as gray. However, if the device has a failure rate of more than 50%, its pixels will appear light or white. If the device has a failure rate of less than 50%, the pixels will appear dark. Repeatedly scans the results to accumulate or average the results of the repeated test procedure. The charge injection of the display produces an image with a gray background color, with white pixels representing the most likely device to fail the test and black pixels representing the most likely test pass. Device. The results are shown in the dotted line box above Figure 8.

用以產生圖8上方點線方框內圖形的的資料,亦可用於產生其他圖形,用以顯示任何指定像素之失敗率和時間的關係,如圖8A和圖8B所示。特別是,使用者可以選擇任何像素(裝置),並利用先前儲存並經過修正的該選定像素強度數據產生圖形,因為這種修正是根據其通過/不通過的測試數據來更改為1或0,故而修改後的強度值與該失敗率相關。另如圖8B所示,當一個特定像素位置的電晶體的失敗率改變,該像素顏色就會改變。這種相關性可以強度信號相對時間的圖形顯示,指出失敗率和時間的關係。 The data used to generate the graphics in the dotted box above Figure 8 can also be used to generate other graphics to show the relationship between the failure rate and time for any given pixel, as shown in Figures 8A and 8B. In particular, the user can select any pixel (device) and generate the pattern using the previously stored and corrected selected pixel intensity data, since the correction is changed to 1 or 0 based on the pass/fail test data. Therefore, the modified intensity value is related to the failure rate. As also shown in Fig. 8B, when the failure rate of the transistor at a particular pixel position changes, the pixel color changes. This correlation can be a graphical representation of the intensity signal versus time, indicating the relationship between failure rate and time.

如圖示8A所示,座標圖中的白點或白色像素代表高於50%的失敗率,而暗色點則代表低於50%的失敗率。然而,圖8A的圖形不僅顯示出失敗率,也顯示雷射脈衝相對於測試時鐘信號的時序關係,對失敗率的影響。例如,圖8A1指出,當雷射脈衝的到達時間與測試脈衝的上升緣相符時,對應的電晶體通常不通過測試。而圖8A2則指出當雷射脈衝的到達時間與測試脈衝的下降緣相符時,對應的電晶體通常不通過測試。這樣的資訊可用來剖析個別電晶體的故障機制。 As shown in Figure 8A, the white or white pixels in the graph represent a failure rate above 50%, while the dark dots represent a failure rate below 50%. However, the graph of FIG. 8A not only shows the failure rate, but also shows the timing relationship of the laser pulse with respect to the test clock signal, and the effect on the failure rate. For example, Figure 8A1 indicates that when the arrival time of the laser pulse coincides with the rising edge of the test pulse, the corresponding transistor typically does not pass the test. 8A2 indicates that when the arrival time of the laser pulse coincides with the falling edge of the test pulse, the corresponding transistor usually does not pass the test. Such information can be used to profile the failure mechanism of individual transistors.

在本發明一實施例中,可以從以記錄的測試數據中抽取出函 數型時序圖,以與電晶體開關事件的系統性進展套圖。這些時序圖可以建構自每個像素停留時間的重複測試循環或每個像素停留時間的虛擬隨機測試。建構時須先得知各測試循環中的脈衝作用時間,以及每個電晶體位置上所得的LADA信號強度值,且可以使用短雷射脈衝取得。在本發明一實施例中,是以空間定位或停留該入射雷射光束於目標電路特徵,按時間逐一檢視該雷射脈衝相對於該測試時鐘信號或該迴路長度觸發信號之到達時間,並於每一雷射脈衝到達時間,記錄所得之失敗率特性的強度及信號,得到同步化的單光子或雙光子脈衝LADA資訊,而依據該資訊建立個別的時序圖。 In an embodiment of the present invention, a letter can be extracted from the recorded test data. A digital timing diagram to systematically progress with the transistor switching event. These timing diagrams can be constructed from a repeated test cycle of each pixel dwell time or a virtual random test of each pixel dwell time. The pulse action time in each test cycle, as well as the LADA signal intensity value obtained at each transistor position, must be known at construction time and can be obtained using short laser pulses. In an embodiment of the present invention, spatially locating or staying the incident laser beam on the target circuit characteristic, and checking the arrival time of the laser pulse relative to the test clock signal or the loop length trigger signal by time, and The arrival time of each laser pulse is recorded, and the intensity and signal of the obtained failure rate characteristic are recorded to obtain synchronized single-photon or two-photon pulse LADA information, and individual timing charts are established based on the information.

請參考圖9。該圖顯示一測試系統900的實施例。該系統能和傳統的測試器共同運作,例如自動化測試設備(ATE)905。該測試器能傳送激發向量信號和時鐘信號到一待測裝置(DUT),即微晶片910,並接收該微晶片910的輸出信號。所應用的電源、接地、輸入信號和結果傳送都以雙箭頭924標示。該測試器設成可重複一系列的測試程序,並將從DUT接收的結果,與預期的輸出結果做比較,並經由通道926將測試通過或失敗的數據,提供給一位置通過/不通過資料存儲器(累加器)960,該存儲器可能為任何標準的記憶體或記憶裝置。該測試器更進一步與一時鐘和脈衝控制器920耦接,時鐘和脈衝控制器920經由信號通道923控制一電荷載子注入器930。該注入器導引一定時入射的雷射脈衝928到DUT940的一小區域或空間,而與DUT相互作用。該注入器930也收集從該DUT反射的雷射脈衝。每個雷射脈衝聚集的位置可視為一單一像素,而由該位置反射的光則對應到一顯示器970上的一個或一組像素。 Please refer to Figure 9. The figure shows an embodiment of a test system 900. The system can work with traditional testers such as the Automated Test Equipment (ATE) 905. The tester can transmit the excitation vector signal and the clock signal to a device under test (DUT), i.e., microchip 910, and receive the output signal of the microchip 910. The applied power, ground, input signals, and resulting transmissions are all indicated by double arrows 924. The tester is arranged to repeat a series of test procedures and compare the results received from the DUT with the expected output and provide the pass or fail data of the test to a location pass/fail data via channel 926. A memory (accumulator) 960, which may be any standard memory or memory device. The tester is further coupled to a clock and pulse controller 920 that controls a charge carrier 930 via signal path 923. The injector directs the incident laser pulse 928 to a small area or space of the DUT 940 to interact with the DUT. The injector 930 also collects laser pulses reflected from the DUT. The position at which each of the laser pulses are concentrated can be regarded as a single pixel, and the light reflected by the position corresponds to one or a group of pixels on a display 970.

進行測試,經歷從低到高或高到低的信號轉換的電晶體,在轉換同時會因為從該雷射脈衝吸收光子而接收到所產生的電洞對之注入,該現象可能會改變該轉換的時序特性。目前已經有一些方法可用來觀測該開關轉換現象。在本發明一實施例中,是使用一信號225來控制該測試器,該測試器建置成可重複一選定的測試程序,以在無雷射脈衝入射之條件下,呈現50%通過及50%不通過測試比率。為說明方便起見,舉一簡單的例子。開始時使用一個低時鐘頻率,使該裝置於測試程序中可以通過所有的測試向量的測試。之後每次將該頻率提高一倍,並將測試向量提供給該DUT,直到大部分測試都失敗為止。然後降低該時鐘頻率,繼續測試,直到失敗率達到一半為止。其他用來產生50-50測試結果的變數包括改變電壓。以上均屬習知技術。 A transistor that undergoes a test that undergoes a signal conversion from low to high or high to low, which is injected at the same time as the resulting hole is received by absorbing photons from the laser pulse, which may change the conversion. Timing characteristics. There are already some methods for observing the switching phenomenon. In one embodiment of the invention, the tester is controlled using a signal 225 that is configured to repeat a selected test procedure to exhibit 50% pass and 50 without laser incident. % does not pass the test rate. For the sake of convenience, a simple example is given. Start with a low clock frequency so that the device can pass all test vector tests in the test program. The frequency is then doubled each time and the test vector is provided to the DUT until most of the tests fail. Then lower the clock frequency and continue testing until the failure rate reaches half. Other variables used to generate 50-50 test results include changing the voltage. All of the above are prior art techniques.

如果平衡點已知,將測試通過和失敗的值作加權,可使一個簡單的累加器960產生中和的值。在本發明一實施例中,只掃描照射DUT表面,事實上即可引發光子與由低到高轉變中的電晶體相互作用。結果即會改變測試通過與不通過的比率,且該結果可以在裝置970,例如監視器上以圖表或其他形式呈現。只要從該測試器提供一時鐘信號到該程序控制,即可使注入器與測試程序形成同步。以這種方法即可達成重複對待測區域同一點或相同多數點注入光子,其時點為與該測試程序相符、延後或提早。如圖中雙箭頭922所示。 If the balance point is known, weighting the pass and fail values, a simple accumulator 960 can produce a neutralized value. In one embodiment of the invention, scanning only the surface of the DUT can in fact cause photons to interact with the transistor in the transition from low to high. The result is a change in the ratio of test pass and no pass, and the result can be presented in a chart or other form on device 970, such as a monitor. As long as a clock signal is supplied from the tester to the program control, the injector can be synchronized with the test program. In this way, it is possible to inject photons at the same point or the same majority of the repeated areas to be tested, at the time of coincidence, delay or earlyness with the test procedure. This is shown by the double arrow 922 in the figure.

在設備操作過程中,該ATE測試器重複一測試程序,該程序包含一測試程序及架構,已設定為達成50%通過率所需的參數。測試所得的數據經過累加及平均,以產生一灰色視野的影像。在測試程序進行中的不 同時間點,當入射光通過DUT的各位置時,有些位置會偏離50%的通過率,造成較白或較黑的影像點,而不是原來的灰色霧狀。 During device operation, the ATE tester repeats a test procedure that includes a test program and architecture that has been set to achieve the 50% pass rate required. The data from the test is accumulated and averaged to produce an image of a gray field of view. Not in the test program At the same time, when the incident light passes through the various positions of the DUT, some positions will deviate from the 50% pass rate, resulting in a whiter or darker image point than the original gray mist.

進行量測時,利用分析或顯示的設備識別圖形範圍內的閃點,以及在該測試程序中的時點或位置。該位置就關連到特定狀態的電晶體。在該狀態下,測試程序正激發一信號值的轉變,當時注入器正主動的注入雷射脈衝,使單光子或雙光子吸收的能量足以產生電荷載子對。該方法另可包括一步驟,即追蹤該因電荷載子注入造成的狀態轉換行為在該電路的布局內的傳播。 When measuring, the device is analyzed or displayed to identify the flash point within the graphic range and the time point or position in the test program. This position is related to the transistor in a particular state. In this state, the test program is exciting a transition of the signal value at which the injector is actively injecting the laser pulse so that the energy absorbed by the single or two photons is sufficient to generate a charge carrier pair. The method can further include the step of tracking the propagation of the state transition behavior due to charge carrier injection within the layout of the circuit.

此外,該失敗率也可以轉換成光譜,進行追蹤或顯示。例如可使用傅立葉轉換來處理在目標區域內各位置所收集到的失敗率數據,以對各位置產生一光譜。該傅立葉轉換的峰值會與在該特定位置的失敗率產生關聯。 In addition, the failure rate can also be converted into a spectrum for tracking or display. For example, Fourier transforms can be used to process failure rate data collected at various locations within the target area to produce a spectrum for each location. The peak of the Fourier transform will be correlated with the failure rate at that particular location.

使用上述裝置紀錄及分析數據的方法會包括:建置用來執行該DUT測試程序的測試器,使其可使該DUT內的電晶體在未施用雷射脈衝時,測試不通過之比例為50%;分別將該測試程序施用到該DUT,同時以雷射脈衝照射該DUT的選定聚焦位置,該雷射脈衝建置成具有足夠的能量可以在該測試程序中的精確時間點注入電荷載子對;在每次重複測試步驟時記錄該測試器對各個焦點位置的測試結果;判斷測試結果實質上偏離50%失敗率的位置及程序點;產生一代表該失敗率偏離50%的位置的失敗率與時間進展關係的時間序列。在探測測試失敗的裝置時,本發明的方法可以利用將所得的位置與該待測裝置的設計網圖產生的電晶體布局圖,加以連結。此外,也可以產生一圖形,用以顯示因為電荷注入而改變信號傳播的 位置。在本發明一實施例中,可以使雷射脈衝的到達時間相對於該測試器時鐘信號或該迴路長度觸發信號按時間掃描,以得到LADA影像,進而取得限定的目標區域內的多重結構的LADA行為資訊,藉此可同時取得多數時序圖(即時序圖)。 The method of recording and analyzing data using the above apparatus may include: constructing a tester for executing the DUT test program such that the ratio of the test failure is 50 when the transistor in the DUT is not applied with a laser pulse. %; applying the test procedure to the DUT, respectively, while illuminating the selected focus position of the DUT with a laser pulse that is built to have sufficient energy to inject charge carriers at precise time points in the test procedure Recording the test result of the tester for each focus position each time the test step is repeated; determining the position of the test result substantially deviating from the failure rate of 50% and the program point; generating a failure indicating that the failure rate deviates from the position of 50% A time series of rates versus time progression. In detecting a device that fails the test, the method of the present invention can be coupled using a transistor layout generated from the resulting location and the design network of the device under test. In addition, a pattern can also be generated to show the change of signal propagation due to charge injection. position. In an embodiment of the invention, the arrival time of the laser pulse can be scanned with time relative to the tester clock signal or the loop length trigger signal to obtain a LADA image, thereby obtaining a multi-structure LADA in a defined target region. Behavioral information, whereby most of the timing diagrams (ie, timing diagrams) can be obtained simultaneously.

在本發明一實施例中,可利用一種整合套裝軟體,例如申請人公司的NEXS(Navigation Exchange Server)軟體,對該DUT上的外插物理區域產生以同步化的單光子或雙光子脈衝LADA為基礎的時序圖。這種工具提供使用伺服器控制的CAD以及電路圖管理工具,對LADA活動部位執行自動化的時間空間檢驗。這種應用也可同時對多數目標進行處理,其時個別的LADA活動部位或空間上已經界定的LADA活動部位正接受探測與評估。 In an embodiment of the present invention, an integrated package software, such as the NEXS (Navigation Exchange Server) software of Applicant Company, can be used to generate a synchronized single photon or two-photon pulse LADA for the extrapolated physical area on the DUT. Basic timing diagram. This tool provides automated time-space verification of LADA active parts using servo-controlled CAD and schematic management tools. This application can also process most targets at the same time, when individual LADA active sites or spatially defined LADA active sites are being tested and evaluated.

於本發明一實施例中,可利用上述技術改進電路描述,以顯示連接含在該競爭條件內的LADA部位的邏輯路線。這種電路描述可用來建置一種平面的電路圖,用以在一種通用的網圖格式(例如SPICE或Verilog)下顯示該邏輯路線。例如,可以據此標示出特定電路特徵中,相應的輸入方塊與輸出方塊。 In an embodiment of the invention, the circuit description can be improved using the techniques described above to display a logical path connecting the LADA locations contained within the race condition. This circuit description can be used to create a planar circuit diagram for displaying the logic route in a common network format (eg, SPICE or Verilog). For example, corresponding input blocks and output blocks in a particular circuit feature can be labeled accordingly.

於本發明一實施例中,可能需要取出子單元的電路圖資訊,用來引導該雷射停留在該邏輯路線中的關聯電晶體之間的位置。產生的結果有益於電晶體層級的電路除錯。 In an embodiment of the invention, it may be desirable to take out circuit diagram information for the subunits to direct the laser to stay in position between the associated transistors in the logic path. The results produced are beneficial for circuit debugging at the transistor level.

於本發明一實施例中,上述套裝軟體可應用於雙光子誘發擾動部位的分析。分析結果可分別應用於正反電晶體的分離、用於電路分析與影像對準的CAD套合。 In an embodiment of the invention, the kit software can be applied to the analysis of two-photon induced disturbance sites. The analysis results can be applied to the separation of positive and negative transistors, and the CAD assembly for circuit analysis and image alignment.

所謂的單一事件擾動(single event upset,SEU)是指一種狀態變化,因為電荷粒子例如離子、電子等,或電磁輻射打擊一微電子裝置,例如微處理器、半導體存儲器、或功率電晶體的敏感節點所產生。該狀況變化係肇因於在一邏輯元件(例如:記憶體「位元」)之重要節點內或緊鄰處的離子化,產生游離的自由電荷所致。因為該打擊的結果,使裝置的輸出或操作發生錯誤,即稱為SEU或軟性錯誤。本發明之其他面向是取得吸收誘發的擾動點。該正反器的迴授電路,比起統計組合邏輯閘極,更容易發生干擾。於一掃描型的測試中,該正反器幾乎於每個測試循環中作動。於任何測試循環中的單一雷射誘發擾動,均使該測試失敗。然而,此測試失敗與對LADA所設計的競爭條件失敗不同。於功能測試或操作中,大部份正反器並未於每個循環作動。於該測試中,擾動點有機會在每個雷射脈衝隨後產生擾動。因此,於每次測試有1000+之機會下,該初始低擾動概率都會變成幾乎達到100%的累積概率(假設為100MHz雷射重複率)。結果會觀察到劇烈但非破壞性的擾動點。此處須注意,該擾動點只要修改該測試程序即可輕易的移除。本發明揭示之方法論也提供使用一LADA為基礎的機制,測得非破壞性的雙光子吸收誘發擾動點的實施方法。此方法論對單一事件擾動的產生及評估,提供一全新方法。 The so-called single event upset (SEU) refers to a state change because charged particles such as ions, electrons, etc., or electromagnetic radiation strikes a microelectronic device, such as a microprocessor, semiconductor memory, or power transistor. Generated by the node. This change in state is due to ionization in or near an important node of a logic element (eg, a "bit" of a memory), resulting in a free free charge. As a result of this blow, an error occurs in the output or operation of the device, which is called SEU or soft error. Another aspect of the invention is to obtain an absorption induced disturbance point. The feedback circuit of the flip-flop is more prone to interference than the statistical combination logic gate. In a scan type test, the flip-flop operates in almost every test cycle. A single laser induced disturbance in any test cycle caused the test to fail. However, this test failure is not the same as the failure of the competitive conditions designed for LADA. Most functional flip-flops do not operate in every cycle during functional testing or operation. In this test, the disturbance point has the opportunity to subsequently generate a disturbance at each laser pulse. Therefore, at a chance of 1000+ per test, the initial low perturbation probability will become a cumulative probability of almost 100% (assuming a 100MHz laser repetition rate). As a result, a sharp but non-destructive disturbance point is observed. It should be noted here that the disturbance point can be easily removed by modifying the test procedure. The methodology disclosed herein also provides a method for measuring non-destructive two-photon absorption-induced disturbance points using an LADA-based mechanism. This methodology provides a completely new approach to the generation and evaluation of single event disturbances.

於此處所描述的單光子或雙光子LADA測試,該雷射脈衝設計成可平移該脈衝照射電晶體的開關時間。其方式是使該雷射脈衝相對於電晶體開關之時間延遲或提早,而導致其通過或不通過該測試。該測試通常是探測該電晶體是否於設定之時間點開關。然而,亦須注意的是,該脈衝需具有足夠之能量,才能改變或擾動個別的儲存單元的狀態。例如,如 果一正反器設定成儲存「0」,一具有足夠峰值能量的脈衝到達後,可使該正反器改變為相反狀態,即「1」,且不損壞該裝置。這個反轉可由ATE檢測得知,並報告於雷射脈衝照射的每個位置測得的結果。因此,只要使用本發明所揭示之技術,特別是使用2pLADA技術,即可輕易的偵測到可能發生單一事件擾動的記憶元件。 In the single photon or two-photon LADA test described herein, the laser pulse is designed to translate the switching time of the pulsed transistor. This is done by delaying or prematurely the laser pulse relative to the time of the transistor switch, causing it to pass or fail the test. This test is usually to detect if the transistor is switched at the set time. However, it should also be noted that the pulse needs to have sufficient energy to change or disturb the state of the individual storage unit. For example, such as If the flip-flop is set to store "0", a pulse with sufficient peak energy is reached, and the flip-flop can be changed to the opposite state, that is, "1" without damaging the device. This inversion can be detected by the ATE and reports the results measured at each location of the laser pulse illumination. Therefore, as long as the technique disclosed in the present invention is used, particularly using the 2pLADA technology, a memory element in which a single event disturbance may occur can be easily detected.

在上述的LADA測試中,一系列的雷射脈衝當中會包括一個時間點設在會使該電晶體通過或不通過該測試的脈衝。在該系列的其他脈衝對該測試則無影響。反之,在單一事件擾動的測試中,該系列中的每個脈衝都可導致該存儲單元反轉到其相反狀態。因此,使用一系列的短脈衝,使其具有高峰值功率,對於量測單一事件擾動,確屬一種有效的方法。在一測試循環中,脈衝數量越多,單元反轉狀態的機率越高。 In the LADA test described above, a series of laser pulses will include a pulse at a point in time that will cause the transistor to pass or not pass the test. Other pulses in the series have no effect on this test. Conversely, in a single event perturbation test, each pulse in the series can cause the memory cell to reverse to its opposite state. Therefore, using a series of short pulses to have high peak power is an effective method for measuring single event perturbations. In a test cycle, the greater the number of pulses, the higher the probability of a cell reversal state.

在本發明的一些實施例中,以及以上所說明的脈衝雷射光源中,是使用一MLL型態的系統。但在本發明的某些實例中,則可使用「非震盪器」型的雷射脈衝系統,只要所產生的脈衝寬度與抖動特性容許足以描繪其波形的時間解析度。不但如此,這種非震盪器型的實例可以透過直接以該測試器的觸發信號,或一個從該測試器發出,經控制的延遲觸發信號所觸發的脈衝,做同步控制。不論何者,都可使用飛秒級的雷射脈衝作為有效產生2pLADA的較佳觸發信號。雖然皮秒級的脈衝也可應用在本發明,但其缺點是會降低雙光子吸收(TPA)效率(即SNR),並提高侵入性。該2pLADA所擷取的該波長範圍應為1250nm至1550nm。其中,1250nm提供效率及解析度方面的最佳成效。相反的,納秒至飛秒級的雷射脈衝可應用於單光子LADA,但應考慮其雷射脈衝期間與時間解析度值、空間解析度 值、侵入性、及傳送的峰值功率之間的權衡。單光子LADA可選用的波長應為1064nm。 In some embodiments of the invention, and in the pulsed laser source described above, a system using an MLL type is used. However, in some embodiments of the invention, a "non-oscillator" type laser pulse system can be used as long as the resulting pulse width and jitter characteristics allow for sufficient time resolution to plot the waveform. Not only that, but an example of such a non-oscillator type can be synchronized by directly triggering the tester's trigger signal, or a pulse triggered by the controlled delay trigger signal from the tester. Either way, a femtosecond laser pulse can be used as a better trigger for effectively generating a 2pLADA. Although picosecond pulses can also be used in the present invention, they have the disadvantage of reducing the two-photon absorption (TPA) efficiency (i.e., SNR) and increasing intrusion. The wavelength range taken by the 2pLADA should be from 1250 nm to 1550 nm. Among them, 1250nm provides the best results in terms of efficiency and resolution. Conversely, nanosecond to femtosecond laser pulses can be applied to single-photon LADA, but their laser pulse period and time resolution values, spatial resolution should be considered. The trade-off between value, intrusiveness, and peak power delivered. The single-photon LADA can be used at a wavelength of 1064 nm.

必須說明的是,以上所述之方法及技術本質上並不限於任何特定之裝置,且可以任何適用之元件組合加以達成。此外,各種態樣之泛用性裝置也可適用在所述之發明中。也可以使用特製的裝置,以執行上述之發明方法步驟,而獲得更多優勢。 It must be noted that the methods and techniques described above are not limited in nature to any particular device and can be achieved in any suitable combination of components. In addition, various aspects of the universal device are also applicable to the invention described. It is also possible to use a special device to perform the above-described inventive method steps, and to obtain more advantages.

以上是對本發明例示性實施例之說明,其中顯示特定之材料與步驟。但對習於此藝之人士而言,從上述特定實例可產生或使用不同變化,而此種結構及方法均可在理解本說明書所描述及說明之操作,以及對操作之討論後,產生修改,但仍不會脫離本發明申請專利範圍所界定之範圍。 The foregoing is a description of the exemplary embodiments of the invention, However, different variations may be made or employed by those skilled in the art, and such structures and methods may be modified upon understanding the operations described and illustrated in the specification and the discussion of the operation. However, it does not depart from the scope defined by the scope of the invention.

210‧‧‧待測裝置 210‧‧‧Device under test

215‧‧‧測試器 215‧‧‧Tester

223‧‧‧雷射脈衝序列 223‧‧‧Laser pulse sequence

224‧‧‧雷射脈衝序列 224‧‧‧Laser pulse sequence

225‧‧‧脈衝雷射光源 225‧‧‧pulse laser source

227‧‧‧雷射脈衝序列 227‧‧‧Laser pulse sequence

229‧‧‧雷射脈衝序列 229‧‧‧Laser pulse sequence

230‧‧‧偏光鏡 230‧‧‧ polarizer

235‧‧‧偏光鏡 235‧‧‧ polarizer

240‧‧‧物鏡 240‧‧‧ Objective lens

245‧‧‧信號 245‧‧‧ signal

250‧‧‧電腦 250‧‧‧ computer

255‧‧‧固定脈衝雷射光源 255‧‧‧Fixed pulsed laser source

260‧‧‧時序控制電子元件 260‧‧‧Sequence Control Electronic Components

265‧‧‧時序控制電子元件 265‧‧‧Sequence Control Electronic Components

275‧‧‧相位調整器 275‧‧‧ phase adjuster

Claims (20)

一種可與一測試設備(TE)連結操作之雷射輔助裝置修改(LADA)系統,用以檢測待測的積體電路裝置(DUT),並包括:時序控制電子元件,以從該TE接收一時鐘信號,該時序控制電子元件可產生一同步信號,用於將雷射脈衝同步於該時鐘信號;一脈衝雷射光源,用以根據該同步信號產生該雷射脈衝,光學裝置,以從該脈衝雷射光源接收該雷射脈衝,並導引該雷射脈衝至該待測裝置(DUT)上之所需位置;一控制器,建置成可操作該時序控制電子元件,以將該雷射脈衝抵達該DUT內之電晶體之時間,設定成與該時鐘時間同步的時間,並可將使該雷射脈衝相對於該時鐘信號延遲或提早,以因此改變該電晶體對於該TE施加於該DUT之測試信號的電性反應;一單像素感應器,用以偵測反射自該DUT的雷射脈衝,並產生相應的強度信號;且其中該控制器建置成可偵測該經改變之電晶體電性反應,接收該相應的強度信號,並利用該電性反應及強度信號,以產生一圖形,表示於該DUT上選定的區域中,電性反應與時間的關係。 A laser assisted device modification (LADA) system operable to interface with a test equipment (TE) for detecting an integrated circuit device (DUT) to be tested, and comprising: timing control electronics for receiving a a clock signal, the timing control electronics can generate a synchronization signal for synchronizing the laser pulse to the clock signal; a pulsed laser source for generating the laser pulse according to the synchronization signal, from the optical device The pulsed laser source receives the laser pulse and directs the laser pulse to a desired position on the device under test (DUT); a controller is configured to operate the timing control electronic component to The time at which the pulse reaches the transistor in the DUT is set to a time synchronized with the clock time, and the laser pulse can be delayed or advanced relative to the clock signal to thereby change the transistor to be applied to the TE An electrical response of the test signal of the DUT; a single pixel sensor for detecting a laser pulse reflected from the DUT and generating a corresponding intensity signal; and wherein the controller is configured to detect the changed signal Electricity Electrically reaction member receiving the corresponding intensity signal, and utilizing the electrical response and the intensity signal to generate a pattern representing a selected region on the DUT, the relationship between electric and reaction time. 如申請專利範圍第1項之系統,其中該表示電性反應與時間關係的圖形,對應於該雷射脈衝對該時鐘信號間的同步關係。 A system as claimed in claim 1, wherein the graph representing the electrical response versus time corresponds to a synchronization relationship between the laser pulses and the clock signal. 如申請專利範圍第1項之系統,其中該表示電性反應與時間關係的圖形包括表示測試失敗率與該雷射脈衝相對於該TE之測試信號的到達時間的關係的圖形。 A system as claimed in claim 1, wherein the graph representing the electrical response versus time comprises a graph representing a relationship between a test failure rate and an arrival time of the laser pulse relative to the test signal of the TE. 如申請專利範圍第1項之系統,其中該雷射脈衝之脈衝率設定為該時鐘信號之倍數。 A system as claimed in claim 1, wherein the pulse rate of the laser pulse is set to a multiple of the clock signal. 如申請專利範圍第1項之系統,其中該光學裝置導引該雷射脈衝至該所需位置之方式,是以導引一序列之雷射脈衝到各所需位置,以照射該DUT的一選定區域,加以達成。 The system of claim 1, wherein the optical device directs the laser pulse to the desired position by directing a sequence of laser pulses to respective desired positions to illuminate a portion of the DUT Select the area and reach it. 如申請專利範圍第1項之系統,其中該脈衝雷射光源產生一雷射脈衝束,且其中該光學裝置藉由依序導引該雷射光束停留於每個所需位置,導引該雷射脈衝至預期的位置上。 The system of claim 1, wherein the pulsed laser source generates a laser pulse beam, and wherein the optical device guides the laser beam by sequentially guiding the laser beam to each desired position. Pulse to the desired position. 如申請專利範圍第1項之系統,其中該控制器利用該電性反應及強度信號於每個所需位置偵測一測試失敗或通過之結果,當偵測到測試失敗時,設定該強度信號為第一顏色,當偵測到測試通過時,設定該強度信號為第二顏色。 The system of claim 1, wherein the controller uses the electrical response and intensity signal to detect a test failure or a result of passing at each desired position, and when the test fails, the intensity signal is set. For the first color, when the test pass is detected, the intensity signal is set to the second color. 如申請專利範圍第7項之系統,其中該第一顏色為黑色或白色中的一種,該第二顏色為黑色或白色中的另一種。 The system of claim 7, wherein the first color is one of black or white, and the second color is the other of black or white. 如申請專利範圍第1項之系統,其中該控制器進一步提供一傅立葉變換於該電性反應與時間關係之圖形。 The system of claim 1, wherein the controller further provides a Fourier transform to the graph of the electrical response versus time. 如申請專利範圍第1項之系統,進一步包含一顯示器,且其中該控制器在該顯示器顯示一目標區域的影像,其中電晶體失敗率高於50%之位置顯示成一顏色,電晶體失敗率低於50%之位置顯示成第二顏色;該控制器進一步在該顯示器顯示每個選定位置的電性反應與時間關係之圖形,該位置由電晶體失敗率高於50%之位置與電晶體失敗率低於50%之位置中選出。 The system of claim 1, further comprising a display, wherein the controller displays an image of a target area on the display, wherein a position where the transistor failure rate is higher than 50% is displayed as a color, and the transistor failure rate is low. Displayed as a second color at 50%; the controller further displays a graph of the electrical response versus time for each selected location on the display, the location being at a location where the transistor failure rate is greater than 50% and the transistor fails The rate is selected from a position below 50%. 一種使用雷射輔助裝置修改(LADA)技術,對耦接至一測試設備(TE)的待測整合裝置(DUT)進行檢測之方法,該測試設備產生一時鐘信號及一測試信號;該方法包括:產生一雷射光束,該雷射光束包含一序列之雷射脈衝;依序定位該雷射光束於該DUT上的目標區域的每個像素位置,並對每個像素位置進行一測試循環,其中該測試循環包括按時間掃描該雷射脈衝相對於該時鐘信號的到達時間,同時該ATE提供該測試信號於至DUT,並對每個時空容積,紀錄該DUT的測試通過/不通過結果,其中該時空容積定義為一於DUT上的空間座標與一雷射脈衝的到達時間之組合;及,對多數測試結果為失敗率偏離50%的位置,產生一失敗率相對於時間的圖形。 A method for detecting a device to be tested (DUT) coupled to a test device (TE) using a laser assisted device modification (LADA) technique, the test device generating a clock signal and a test signal; the method comprising Generating a laser beam comprising a sequence of laser pulses; sequentially positioning the laser beam at each pixel location of the target region on the DUT, and performing a test cycle for each pixel location, Wherein the test cycle includes scanning the arrival time of the laser pulse with respect to the clock signal by time, and the ATE provides the test signal to the DUT, and for each space-time volume, records the test pass/fail result of the DUT, The space-time volume is defined as a combination of the space coordinates on the DUT and the arrival time of a laser pulse; and, for most test results, where the failure rate deviates by 50%, a graph of failure rate versus time is generated. 如申請專利範圍第11項之方法,其中該雷射脈衝建置成具有可在該DUT內產生雙光子吸收所需的波長與期間。 The method of claim 11, wherein the laser pulse is constructed to have a wavelength and period required to produce two-photon absorption within the DUT. 如申請專利範圍第11項之方法,其中該雷射脈衝建置成具有可在該DUT內產生單光子吸收所需的波長與期間。 The method of claim 11, wherein the laser pulse is constructed to have a wavelength and period required to produce single photon absorption within the DUT. 如申請專利範圍第11項之方法,其中記錄DUT上之通過/不通過結果之步驟,進一步包含於該DUT通過測試時,紀錄成第一顏色;當該DUT測試失敗時,記錄成第二顏色的步驟。 The method of claim 11, wherein the step of recording the pass/fail result on the DUT is further included in the first color when the DUT passes the test; and when the DUT test fails, the second color is recorded. A step of. 如申請專利範圍第14項之方法,進一步包括使用該第一及第二顏色,於顯示器產生一影像之步驟。 The method of claim 14, further comprising the step of generating an image on the display using the first and second colors. 如申請專利範圍第14項之方法,其中產生該失敗率相對於時間的圖形 的步驟,包括在該DUT上選定一空間座標,及繪製該第一及第二顏色相對於時間的圖形的步驟。 The method of claim 14, wherein the failure rate is plotted against time The step of selecting a space coordinate on the DUT and drawing a graphic of the first and second colors with respect to time. 如申請專利範圍第16項之方法,其中該第一顏色是黑色或白色中的一種,且該第二顏色是黑色或白色中的另外一種。 The method of claim 16, wherein the first color is one of black or white, and the second color is another one of black or white. 如申請專利範圍第11項之系統,其中該像素位置包括一正反器,且其中該雷射脈衝的序列建置成可於該正反器產生一單一擾動事件。 The system of claim 11, wherein the pixel location comprises a flip flop, and wherein the sequence of the laser pulses is configured to generate a single perturbation event at the flip flop. 如申請專利範圍第11項之方法,進一步包括將測試通過/不通過結果顯示為失敗率偏離50%的像素位置,關聯到一網圖之電晶體布局。 The method of claim 11, further comprising displaying the test pass/fail result as a pixel position where the failure rate deviates by 50%, associated with a transistor layout of a network map. 一種使用雷射輔助裝置修改(LADA)技術,對耦接至一測試設備(TE)的待測積體電路裝置(DUT)進行檢測之方法,該測試設備產生一時鐘信號及一測試信號;該方法包括:建置該TE以提供測試程序至該DUT,使該DUT中的電晶體於未施加雷射脈衝時,不通過測試之比例為50%;反覆提供該測試程序至該DUT,同時提供雷射脈衝至該DUT上之選定焦點位置,該雷射脈衝設定成具有足夠的能量,可在測試程序中,於精確時間點注入電荷載子對;記錄每個聚焦位置在每次重覆測試程序的測試結果;判斷測試結果實質偏離50%失敗率的位置;對失敗率實質偏離50%失敗率的位置,產生一失敗率相對於時間進程之序列。 A method for detecting an integrated circuit device (DUT) to be tested coupled to a test device (TE) using a laser assisted device modification (LADA) technique, the test device generating a clock signal and a test signal; The method includes: constructing the TE to provide a test program to the DUT, so that the ratio of the pass-through test is 50% when the transistor in the DUT is not applied with a laser pulse; and the test program is repeatedly provided to the DUT while providing a laser pulse to a selected focus position on the DUT, the laser pulse being set to have sufficient energy to inject a charge pair at a precise point in the test procedure; recording each focus position at each repeat test The test result of the program; the position where the test result deviates substantially from the failure rate of 50%; and the position where the failure rate deviates substantially from the failure rate of 50%, a sequence of failure rate with respect to the time course is generated.
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Cited By (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TWI630399B (en) * 2015-11-06 2018-07-21 Fei公司 Waveform mapping and gated laser voltage imaging
US10191111B2 (en) 2013-03-24 2019-01-29 Dcg Systems, Inc. Synchronized pulsed LADA for the simultaneous acquisition of timing diagrams and laser-induced upsets
US10209274B2 (en) 2010-09-08 2019-02-19 Fei Efa, Inc. Laser-assisted device alteration using synchronized laser pulses
US10352995B1 (en) 2018-02-28 2019-07-16 Nxp Usa, Inc. System and method of multiplexing laser triggers and optically selecting multiplexed laser pulses for laser assisted device alteration testing of semiconductor device
TWI712811B (en) * 2018-09-07 2020-12-11 新加坡商格羅方德半導體私人有限公司 Defect localization in embedded memory
CN113678330A (en) * 2019-02-04 2021-11-19 振幅公司 Laser system with pulse time overlap
TWI801243B (en) * 2021-05-21 2023-05-01 日商日立全球先端科技股份有限公司 Sample inspection device

Families Citing this family (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TWI619954B (en) * 2014-10-16 2018-04-01 Dcg系統公司 Systems and method for laser voltage imaging
US9755766B2 (en) * 2015-12-07 2017-09-05 Teradyne, Inc. Front end module for automatic test equipment
JP6820184B2 (en) 2016-10-26 2021-01-27 浜松ホトニクス株式会社 Semiconductor device inspection method and semiconductor device inspection equipment
KR102293671B1 (en) * 2017-11-29 2021-08-24 삼성전자주식회사 Apparatus for testing semiconductor device method tof testing semiconductor device
US10782343B2 (en) 2018-04-17 2020-09-22 Nxp Usa, Inc. Digital tests with radiation induced upsets
JP2024014220A (en) * 2022-07-22 2024-02-01 国立研究開発法人産業技術総合研究所 high frequency imaging device

Family Cites Families (55)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5095262A (en) 1988-09-01 1992-03-10 Photon Dynamics, Inc. Electro-optic sampling system clock and stimulus pattern generator
US5270643A (en) 1990-11-28 1993-12-14 Schlumberger Technologies Pulsed laser photoemission electron-beam probe
US5430305A (en) 1994-04-08 1995-07-04 The United States Of America As Represented By The United States Department Of Energy Light-induced voltage alteration for integrated circuit analysis
JP3352239B2 (en) 1994-08-19 2002-12-03 浜松ホトニクス株式会社 Voltage measuring device
US5854804A (en) 1996-12-13 1998-12-29 Intel Corporation Method and apparatus for synchronizing a mode locked laser with a device under test
US6316950B1 (en) 1997-05-15 2001-11-13 Lucent Technologies Inc. Method and apparatus for imaging semiconductor devices
US6078183A (en) 1998-03-03 2000-06-20 Sandia Corporation Thermally-induced voltage alteration for integrated circuit analysis
US6400165B1 (en) 2000-02-02 2002-06-04 Lucent Technologies Inc. Ultra-fast probe
JP4174167B2 (en) 2000-04-04 2008-10-29 株式会社アドバンテスト Failure analysis method and failure analysis apparatus for semiconductor integrated circuit
US20020039030A1 (en) 2000-08-03 2002-04-04 Mehyar Khazei System, method, and apparatus for product diagnostic and evaluation testing
TW479167B (en) 2000-12-05 2002-03-11 Inventec Besta Co Ltd Method for automatically resuming the file system in flash memory
GB0120577D0 (en) 2001-08-23 2001-10-17 Univ Cranfield Method for use in manufacturing an optical device
US6621275B2 (en) 2001-11-28 2003-09-16 Optonics Inc. Time resolved non-invasive diagnostics system
US6897664B1 (en) 2002-09-30 2005-05-24 Advanced Micro Devices, Inc. Laser beam induced phenomena detection
JP3776073B2 (en) 2002-10-01 2006-05-17 株式会社神戸製鋼所 Semiconductor carrier lifetime measurement method and apparatus
US6842866B2 (en) * 2002-10-25 2005-01-11 Xin Song Method and system for analyzing bitmap test data
US6882170B2 (en) 2002-12-05 2005-04-19 Intel Corporation Device speed alteration by electron-hole pair injection and device heating
US6967491B2 (en) * 2003-07-11 2005-11-22 Credence Systems Corporation Spatial and temporal selective laser assisted fault localization
US7218446B2 (en) 2003-08-27 2007-05-15 Biomedical Photometrics Inc. Imaging system having a fine focus
JP4421319B2 (en) 2004-02-13 2010-02-24 独立行政法人科学技術振興機構 Laser apparatus and laser oscillation method
US7516379B2 (en) 2004-04-06 2009-04-07 Avago Technologies General Ip (Singapore) Pte. Ltd. Circuit and method for comparing circuit performance between functional and AC scan testing in an integrated circuit (IC)
JP4683869B2 (en) 2004-07-08 2011-05-18 独立行政法人理化学研究所 Semiconductor device failure diagnosis method and apparatus
US7038474B2 (en) 2004-09-24 2006-05-02 International Business Machines Corporation Laser-induced critical parameter analysis of CMOS devices
FR2876188B1 (en) 2004-10-01 2007-01-26 Cnes Epic METHOD AND SYSTEM FOR ANALYZING AN INTEGRATED CIRCUIT
US7379652B2 (en) * 2005-01-14 2008-05-27 Montana State University Method and apparatus for detecting optical spectral properties using optical probe beams with multiple sidebands
US7450245B2 (en) * 2005-06-29 2008-11-11 Dcg Systems, Inc. Method and apparatus for measuring high-bandwidth electrical signals using modulation in an optical probing system
US7733100B2 (en) * 2005-08-26 2010-06-08 Dcg Systems, Inc. System and method for modulation mapping
US9130344B2 (en) 2006-01-23 2015-09-08 Raydiance, Inc. Automated laser tuning
US7679358B2 (en) * 2006-04-05 2010-03-16 Dcg Systems, Inc. System and method for voltage noise and jitter measurement using time-resolved emission
US8115170B2 (en) * 2007-01-09 2012-02-14 International Business Machines Corporation Method and apparatus for creating time-resolved emission images of integrated circuits using a single-point single-photon detector and a scanning system
US8072589B2 (en) 2007-01-18 2011-12-06 Dcg Systems, Inc. System and method for photoemission-based defect detection
US7777507B2 (en) * 2007-03-26 2010-08-17 Intel Corporation Integrated circuit testing with laser stimulation and emission analysis
US7852102B2 (en) 2007-04-10 2010-12-14 Panasonic Corporation Method and apparatus for inspecting semiconductor device
JP2008300486A (en) 2007-05-30 2008-12-11 Toshiba Corp Testing system, method, and apparatus of semiconductor device
FR2919402B1 (en) 2007-07-23 2009-10-30 Eads Europ Aeronautic Defence METHOD FOR TESTING A SOFTWARE APPLICATION
CN100582802C (en) 2007-08-03 2010-01-20 重庆大学 LED chip/ wafer non-contact type check-up method
JP2009115764A (en) * 2007-11-09 2009-05-28 Toshiba Corp Semiconductor inspection device and semiconductor inspection method using it
US20090147255A1 (en) 2007-12-07 2009-06-11 Erington Kent B Method for testing a semiconductor device and a semiconductor device testing system
TWI424479B (en) 2008-02-29 2014-01-21 Ind Tech Res Inst Method for patterning crystalline indium tin oxide by using femtosecond laser
US7973545B2 (en) * 2008-04-22 2011-07-05 Freescale Semiconductor, Inc. Time resolved radiation assisted device alteration
US7872489B2 (en) 2008-04-28 2011-01-18 Freescale Semiconductor, Inc. Radiation induced fault analysis
JP2009300202A (en) * 2008-06-12 2009-12-24 Toshiba Corp Method and system for inspecting semiconductor device
US20100117667A1 (en) 2008-11-07 2010-05-13 Lo William K Method and means for optical detection of internal-node signals in an integrated circuit device
US8278959B2 (en) 2008-12-18 2012-10-02 Semicaps Pte Ltd Method and system for measuring laser induced phenomena changes in a semiconductor device
JP2010181288A (en) 2009-02-05 2010-08-19 Renesas Electronics Corp Analyzer and analysis method of semiconductor integrated circuit
SG10201506637YA (en) 2009-05-01 2015-10-29 Dcg Systems Inc Systems and method for laser voltage imaging state mapping
US8170828B2 (en) 2009-06-05 2012-05-01 Apple Inc. Test method using memory programmed with tests and protocol to communicate between device under test and tester
JP2011075441A (en) 2009-09-30 2011-04-14 Hamamatsu Photonics Kk Semiconductor device failure analysis apparatus
JP2012037310A (en) 2010-08-05 2012-02-23 Renesas Electronics Corp Failure analyzer and failure analysis method of semiconductor integrated circuit
US9201096B2 (en) 2010-09-08 2015-12-01 Dcg Systems, Inc. Laser-assisted device alteration using synchronized laser pulses
EP2428807A3 (en) 2010-09-08 2014-10-29 DCG Systems, Inc. Laser assisted fault localization using two-photon absorption
JP5894745B2 (en) * 2011-05-31 2016-03-30 浜松ホトニクス株式会社 Integrated circuit inspection equipment
SG11201407582SA (en) 2012-05-16 2014-12-30 Dcg Systems Inc Laser-assisted device alteration using synchronized laser pulses
US10191111B2 (en) 2013-03-24 2019-01-29 Dcg Systems, Inc. Synchronized pulsed LADA for the simultaneous acquisition of timing diagrams and laser-induced upsets
US9823350B2 (en) * 2014-07-31 2017-11-21 Raytheon Company Linear mode computational sensing LADAR

Cited By (12)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US10209274B2 (en) 2010-09-08 2019-02-19 Fei Efa, Inc. Laser-assisted device alteration using synchronized laser pulses
US11353479B2 (en) 2010-09-08 2022-06-07 Fei Efa, Inc. Laser-assisted device alteration using synchronized laser pulses
US10191111B2 (en) 2013-03-24 2019-01-29 Dcg Systems, Inc. Synchronized pulsed LADA for the simultaneous acquisition of timing diagrams and laser-induced upsets
US11047906B2 (en) 2013-03-24 2021-06-29 Dcg Systems, Inc. Synchronized pulsed LADA for the simultaneous acquisition of timing diagrams and laser-induced upsets
TWI630399B (en) * 2015-11-06 2018-07-21 Fei公司 Waveform mapping and gated laser voltage imaging
US10209301B2 (en) 2015-11-06 2019-02-19 Fei Company Waveform mapping and gated laser voltage imaging
US10352995B1 (en) 2018-02-28 2019-07-16 Nxp Usa, Inc. System and method of multiplexing laser triggers and optically selecting multiplexed laser pulses for laser assisted device alteration testing of semiconductor device
TWI712811B (en) * 2018-09-07 2020-12-11 新加坡商格羅方德半導體私人有限公司 Defect localization in embedded memory
US10962592B2 (en) 2018-09-07 2021-03-30 Globalfoundries Singapore Pte. Ltd. Defect localization in embedded memory
US11639959B2 (en) 2018-09-07 2023-05-02 Globalfoundries Singapore Pte. Ltd. Defect localization in embedded memory
CN113678330A (en) * 2019-02-04 2021-11-19 振幅公司 Laser system with pulse time overlap
TWI801243B (en) * 2021-05-21 2023-05-01 日商日立全球先端科技股份有限公司 Sample inspection device

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