TW201446365A - Drilling apparatus with a decoupled force frame and metrology frame for enhanced positioning - Google Patents

Abstract

A printed circuit board (PCB) drilling apparatus that greatly increases the speed, accuracy and depth of the drilling process as well as increasing the life of the drill bits by decoupling the reactionary forces encountered in the positioning and drilling functions of the apparatus in the x, y and z axes from the components that accomplish the positioning, measuring and drilling of the stacked printed circuit boards. The part of the apparatus that moves and drills as well as the feedback position sensors are mounted to a set of vibration isolation pads that absorb the vibrations that would disturb the feedback sensors. Additionally, the force frame of the apparatus that experiences the reactionary force movements are decoupled from the metrology frame of the apparatus that house the feedback sensors, also increasing the throughput and accuracy.

Description

Drilling device with decoupling force frame and metrology frame for enhanced positioning

The present invention relates to a novel design for a printed circuit board (PCB) substrate drilling machine that greatly increases the speed, accuracy and depth of the drilling process and increases the life of the drill bit.

A huge industry has been developed around the following requirements: drilling multiple spaced holes (through or non-through) in substrates such as electronic wafers, thin film electronics, organic packaging substrates, glass, silicon wafers, sapphire or the like hole). Such pores or patterned drilled holes can be used for electron attachment, filtration, cytology, bioassays, chemotaxis or particle monitoring, and have diameters typically in the micrometer range. The holes must not only be identical in diameter to each other, but must also be placed at precise locations relative to the substrate or adjacent holes and have the correct geometry.

In general, these drilling machines move simultaneously on all three axes. The substrate is moved in position on the horizontal x-axis below the drill, and after the drill has been moved in position on the Y horizontal axis on top of the substrate by the overhead unit, the drill is inserted into the z vertical axis. The drilling begins once the substrate is in place as indicated by a set of metrology locating sensors on the machine and at least one of the pressure feet has secured the PCB substrate on the x-axis table to the z-axis drill unit. This positioning before drilling is extremely fast by computer control, running at thousands of times per minute. According to Newton's third law of motion, each of these three positioning or drilling movements produces a reaction force in the structure of the PCB substrate drilling machine. Because the metrology location sensor is coupled to the machine, the effect of the reaction force slows down the settling time or lag (lag) of positioning the PCB substrate within the acceptable range of the feedback sensor, thus reducing Slow positioning process and slightly increase the inaccuracy of the positioning and final placement of the holes in the PCB.

Prior art PCB substrate drilling systems rely on the use of thick heavy machine bases to minimize such reaction forces coupled with light moving masses, however, such reaction forces still inherently reside in the machine and are sufficient to limit the speed at which the machine can operate and Accuracy. When drilling micropores or vias with a diameter of 100 microns or less at a rate of more than 15 weeks per second, the positioning acceleration increases to meet the point-to-point positioning command, and the interference introduced into the heavy machine base causes each positioning to end The settling time is longer, thus offsetting any movement time reduction obtained by the improved acceleration of the lighter moving mass. In addition, the sensor operates on a x-axis and a y-axis with a medium sized settling window (in the 0.1 micron range). These prior art solutions that increase the quality of the machine base (reaction quality) and make the moving mass lighter do not completely solve the root cause of the problem, that is, a single base design supports both the metrology system and the drilling system.

Since then, PCB substrate drills with improved accuracy and speed, faster and deeper drilling depth (increased PCB substrate stack height), longer bit life, less bit breakage, and higher machine productivity The hole machine will meet the long-standing needs of the substrate drilling and surface patterning industry. This new invention utilizes and combines known techniques and new techniques in a unique and novel configuration to overcome the aforementioned problems and achieve this.

The invention, which will be described in more detail later, relates to a PCB substrate drill A hole device adapted to provide both speed and accuracy to the user, resulting in higher productivity. More particularly, the present invention relates to a PCB substrate drilling apparatus that decouples any reaction force from the x-axis and y-axis positioning with a measurement component and a positioning component, and balances the z-axis drilling of the device Force to allow for more efficient operation of drilling a larger stack of PCB substrates. The present invention has many advantages and many novel features that are mentioned above, and such novel features are not to be construed as a singular, singular, or suggestive.

In accordance with the present invention, it is an object of the present invention to provide an improved PCB substrate drilling apparatus having a decoupling force frame and a metrology frame to allow for enhanced positioning and drilling.

Another object of the present invention is to provide an improved PCB substrate drilling apparatus that is capable of exceeding the current number of stacked PCB substrates that can be simultaneously drilled and held within operational tolerances.

Another object of the present invention is to provide a PCB substrate drilling apparatus that maximizes the life of the drill bit and increases the accuracy of the position of the drill hole.

It is yet another object of the present invention to provide a PCB substrate drilling apparatus that minimizes or eliminates all reaction forces from the positioning function and the drilling function, the effects being generated by the moving components of the apparatus.

The subject matter of the present invention is particularly pointed out and clearly claimed in the <RTIgt; The same reference numerals are used to refer to the same elements in the drawings. Other objects, features, and aspects of the invention are discussed in more detail below.

Thus, the more important features of the present invention are set forth in the <Desc/Clms Page number> Contribution. Of course, there are additional features of the present invention which will be described hereinafter and will form the subject matter of the appended claims.

1 is a front view of a prior art PCB substrate drilling apparatus, illustrating an operating force and a reaction force; FIG. 2 is a front view of the PCB substrate drilling apparatus of the present invention, illustrating a separation of an operating force and a reaction force; 3 is a perspective view of the PCB substrate drilling device; FIG. 4 is a front view of the PCB substrate drilling device; FIG. 5 is a side view of the PCB substrate drilling device; FIG. 6 is a rear view of the PCB substrate drilling device; A top view of the hole device; Fig. 8 is a perspective view of the z-axis drill unit; Figure 9 is a front view of the z-axis drill unit; and Figure 10 is a side view of the z-axis drill unit.

All geometrical discussions involved in describing the present invention are made with reference to a three-dimensional Cartesian coordinate system in which the z-axis is vertical and points upward (forward), so that the x-axis and the y-axis are on a horizontal plane, where The x-axis system on the horizontal plane is shown pointing forward toward the "outside the page" toward the viewer, and the y-axis is shown as being positive on the right side of the z-axis.

In general, PCB substrate drilling machines perform the following four functions: they are movable Displaying (positioning) the PCB substrate to be drilled in the correct x-axis position on the moving table; positioning the drill unit in the correct y-axis position above the PCB substrate stack on the movable table; Feedback sensor measurement and verification is performed relative to the position of the drill unit; and the drill bit is inserted into the stacked PCB substrate on the z-axis. In prior art devices, the metrology function (metrics) is accomplished by position feedback sensors positioned on the same frame that the device is positioned and drilled. The frame has a large mass base, which is usually a flat granite or cement slab, and the reaction function of the positioning function and the drilling function is transmitted to the base. The mass of the base minimizes any reaction force movement experienced by the plate, and a very small portion of these reaction forces are transmitted to the actual positioning assembly, the measurement assembly, and the drilling assembly. This has several benefits. First, it minimizes the settling time of the positioning feedback sensor (i.e., the time after the positioning of the movable station is completed until the sensor does not move further or back and the signal used to begin drilling can be initiated). Second, it prevents any additional unwanted movement of the x-axis moveable table, the y-axis moveable trolly, and the z-axis drill unit, which will reduce the accuracy of the PCB stack position. Third, and lastly, it helps to ensure that the drill bit enters the PCB stack accurately at 90 degrees and thus does not deviate too far from the desired mark on the bottom PCB substrate.

Although this solution can be used to minimize these reaction forces, these reaction forces are not negligible. While large-scale drilling has been available to acceptably minimize such unwanted movements, this is not the case for PCB substrate holes in the range of 10 microns to 100 microns. In this large mass base or frame, the reaction force is converted to a low acceleration when absorbed, and one must expect that the frequency at which the position feedback sensor is disturbed will not result in loss of system accuracy. The main reason why this heavy-duty base design is so prominent is due to the outstanding use of the ball screw drive. However, with the emergence of cost-competitive linear motors, it is now possible Create a machine tool architecture that utilizes a decoupling framework/metrics framework.

Complete elimination of these reaction forces will greatly improve the operation of such devices. The apparatus of the present invention involves removing such reaction force movements on all axes in two ways that create a new device architecture. First, the apparatus of the present invention separates or decouples the apparatus into two frames, namely a force frame for accepting x-axis and y-axis reaction forces and a metrology frame that is used to position the holes to be drilled A feedback sensor for the PCB substrate stack. The importance of preventing reaction force movement from interfering with position feedback is critical because the feedback sensor unit is only consistent with the environment in which it is located. If the frame on which the feedback sensor encoder is positioned has a wide range of vibrations, the frame will lose its correct measurement device, the x-axis position of the assembly, the y-axis position, and the z-axis position (as indicated by the code strip). ability. (Although location feedback is typically accomplished by a feedback sensor unit having an encoder strip and an optical encoder that senses the strip, it is known that the present invention may utilize other position feedback sensor units.) Second, The apparatus of the present invention utilizes a balanced reaction force drill unit that does not transfer the reaction forces from the downward and upward strokes of the drill mandrel to the metrology frame. The combination of these solutions eliminates all movement caused by reaction forces on all three axes, resulting in shorter cycle times (due to faster positioning sensor settling times), less bit wear and breakage (due to precise 90 degree drilling geometry), higher stacking of multiple PCB substrates (due to less bit offset).

Briefly, the output of the present invention far exceeds the output of the prior art and provides more accurately positioned holes on the PCB substrate. 1 illustrates the operational concept of the prior art, and FIG. 2 illustrates the operational concept of the decoupling force frame/metric framework design of the present invention that produces enhanced machine stability.

It should be noted that the position feedback sensor is not illustrated for the purpose of clarity. Drilling and driving computers, pressure feet, and drill drive equipment, as those are well known in the industry and are included in the drawings, will only obscure the clarity of the general representation and the understanding of the present invention. In a preferred embodiment, a zero impact pressure foot will be utilized as disclosed in EP 0 266 397 A4, EP 0 461 733 B1, and EP 0 461 733 A2.

Referring to Figures 3 through 7, the general arrangement of all of the components of the PCB substrate drilling apparatus (device) 2 is best seen. The reaction frame base mass 4 made of a dense material such as granite, stainless steel or concrete rests directly on the ground and is used to support the rest of the assembly. The weight of the reaction frame base mass is typically in the range of at least a few tons. The actual weight varies with the size of the device to which it is coupled. The reaction frame base mass is separated from the metrology frame support base 20 by a set of vibration isolation dampers 8. These dampers provide two functions. The dampers prevent any reaction force motion or other vibrations from the base mass frame 4 from being transmitted to the metrology frame support base 20 and the table assembly 6, and the dampers absorbing the interference in the metrology frame support base 20 that would interfere with the feedback Any vibration of the sensor. These vibration isolation dampers 8 have an elastomeric polymer, although they may be replaced by metal springs or other compressible isolators well known in the industry. The vibration isolation damper 8 can be mounted to the top and bottom of a set of panels 10, which in turn are attached to the base mass frame 4 and the metrology frame support base 20. Although the isolation dampers are described as being in a group and located at the four corners of the assembly 2, the actual placement and number of isolation dampers may vary depending on the size and configuration of the assembly. Although not shown in the drawings, in an alternative embodiment, the isolation damper is placed at the horizontal center of the gravity plane of the metrology frame support base. The design illustrated in Figure 3 will be modified such that the uppermost (top) panel of a pair of sheet metal members 10 will fit into the stop aperture in the metrology frame support base such that its vertical position and the metrology frame support base The horizontal center of the gravity plane is vertically aligned. The top of this stop orifice It will be used as the upper contact point between the metrology frame support base 20 and the isolation damper 8. Modifications of this type will be well known in the art. This helps further eliminate any parasitic reaction interference.

The x-axis mobile station assembly 6 has an x-axis mobile station 12 coupled to the travel arm 14 of the x-axis linear drive unit. The x-axis linear drive unit drives the travel arm 14 along the fixed track 16 based on signals generated by the main control computer. The code strips are located on the mobile station 12, and the code strips allow an optical encoder mounted on the metrology frame support base 20 to determine the position of the mobile station and relay the position to the computing device for use with the x-axis linear drive unit An x-axis drive signal is generated to move the travel arm 14 and the PCB substrate stack to be drilled, the PCB substrate stack being mounted on the travel stage 12. The x-axis travel arm 14 is coupled to a fixed drive track 16 of the x-axis linear drive unit for linear movement on the x-axis by means of a low friction bearing arrangement. The additional low friction bearing 18 acts as a support between the bottom surface of the x-axis moving table 12 and the top surface of the metrology frame support base 20. The fixed drive rail 16 is not coupled or connected to the metrology frame support base 20. Instead, the fixed drive rail 16 of the x-axis drive unit is directly coupled to the base mass frame 4 by the x-axis reaction force shifting device 22. The x-axis reaction force moving transfer device is a strut made of a pair of rigid arms connected by a beam 23 made of steel, metal, polymer or a composite structure thereof, and the x-axis fixed drive track The 16 series is attached to the beam 23. The x-axis reaction force moving transfer device is an extension of the base mass force frame 4. (Although it is known that the x-axis reaction force shifting device 22 can have a different physical configuration, the x-axis fixed drive rail 16 will remain connected to the base mass force frame 4 and the x-axis travel arm 14 must be supported by the metrology frame. The base 20 is isolated. Since the base mass frame 4 is directly coupled to the ground, the x-axis reaction force shifting device 22 is directly connected to the ground instead of being connected to the base mass force frame. The frame is considered equivalent to connecting the x-axis reaction force transfer device 22 to the base mass force frame 4. This alternative design method will be an alternative embodiment of the invention. )

When the x-axis moving table 12 and the traveling support arm 14 of the linear drive unit move on the x-axis, the reaction force experienced on the x-axis fixed drive rail 16 of the linear drive unit is transmitted to the x-axis reaction force shifting device 22 to The base mass forces the frame 4, which in turn is transferred to the ground. It is known that in other embodiments, the x-axis reaction force shifting device 22 can have a single rigid arm and can be attached differently to a fixed drive.

The y-axis moving lift assembly has a y-axis moving carriage 24 coupled to the y-axis travel arm 26 of the y-axis linear drive unit. The y-axis drive unit drives the y-axis moving carriage 24 along a y-axis fixed (typically magnetic) drive track 28 based on signals generated by the main control computer. This y-axis travel arm 26 is coupled to the y-axis fixed drive track 28 for the y-axis linear drive unit and is adapted for linear motion on the y-axis by means of the low friction bearing arrangement 30. The additional low friction y-axis bearing 30 acts as a support between the back of the y-axis moving sling 24 and the front side of the y-axis support block 32 of the metrology frame support base. The y-axis support block is an extension of the metrology frame support base 20. (Although the y-axis support block is shown as a U-shaped block that vertically protrudes from the section of the metrology frame support base 20 that supports the travel stage 12, it is known that any configuration capable of supporting the y-axis moving lift 24 can be used. Instead, as long as the configuration is isolated from the base mass frame 4.

The y-axis fixed drive rail 28 is coupled directly to the base mass frame 4 by the y-axis reaction force shifting device 34 and the y-axis support block 32 of the metrology frame support base (and the remainder of the metrology frame support base 20) Decoupling. The y-axis reaction force shifting device is a rigid strut made up of a pair of rigid arms with a planar member extending between the pair of rigid arms. The planar member may be made of steel, metal, polymer or a composite structure thereof and connected to y The shaft secures the drive track 36 and supports the latter. When the y-axis moving bracket 24 and the traveling arm 26 of the y-axis linear driving unit move on the y-axis, the reaction force experienced on the y-axis fixed driving rail 28 of the y-axis linear driving unit moves the transfer device via the y-axis reaction force 34 is transferred to the base mass frame 4, which in turn is transferred to the ground. It is known that in other embodiments the transfer device 34 can be moved using a y-axis reaction force. (Although the y-axis reaction force shifting device 34 is known to have a different physical configuration, the y-axis fixed drive track 28 and the base mass force frame 4 will remain connected and the y-axis fixed drive 36 and the metrology frame force must be The base 20 is isolated. Since the base mass frame 4 is directly coupled to the ground, direct connection of the y-axis reaction force transfer device 22 to the ground rather than to the base mass frame 4 is considered equivalent to y-axis reaction. The mobile transfer device 32 is coupled to the base mass force frame 4. This alternative design method will be an alternate embodiment of the present invention.)

Referring to Figures 8 through 10, the general arrangement of the z-axis balancing reaction force drill unit 36 is best seen. As previously mentioned, for the purpose of clarity, the mandrel rotary drive assembly (drill drive device) and the zero impact pressure foot assembly that secures the PCB substrate prior to drilling are not illustrated. Each of these components is the subject of prior patents and is well known in the art and does not impart significant vibrational movements that are critical to the accuracy of PCB substrate positioning.

The drill unit 36 is mounted and oriented on the y-axis moving carriage 24 such that the linear and z-axis drilling strokes of the drill unit are in line with the horizontal plane of the x-axis moving table 12 and the horizontal plane of the y-axis moving carriage. 90 degrees. The drill unit 36 has a bottom plate 38 to which the upper guide sleeve 40 and the lower guide sleeve 42 are attached, each of the sleeves housing a low friction guide bushing assembly, such sleeves A perforated or porous carbon air sleeve such as 5 microns to 25 microns. The drill unit 36 has a mandrel 44 that resides in a low friction guide bushing that is received in the lower guide sleeve 42. Into the inside. The lower guide sleeve also houses the spindle motor. The mandrel 44 holds a drill bit and rotates at a high speed. The spindle 44 is driven downwardly or downwardly on the z-axis by a z-axis spindle drive unit that applies an electrical pulse provided to the voice coil 46, the voice coil having a cup-shaped design, which is assembled In the matching recess in the bottom of the voice coil magnet assembly 48. The voice coil magnet assembly 48 is made of a voice coil magnet coupled to the reaction mass and is partially housed within a low friction guide bushing assembly that is received in the upper guide sleeve 40 Inside. There is an elongated linear member curved portion 50 that connects the mandrel 44 to the voice coil 46. This curved portion 50 is slightly deflected to minimize any angular deformation and deviation from the z-axis travel of the mandrel 44.

The combined mass of the voice coil magnet and the reaction mass (voice coil magnet assembly) 48 is several times larger than the combined mass of the voice coil 46, the curved portion 50, and the mandrel 44. In this manner, when the electrical pulse wave is emitted to the voice coil 46 partially residing in the recess in the bottom of the voice coil magnet, the magnetic field generated in the voice coil 46 pushes the magnetic field of the voice coil magnet and the reaction mass 48, and Because the combination of the voice coil 46, the curved portion 50, and the mandrel 44 is much smaller than the mass of the voice coil magnet and the reaction mass 48, the combination of the voice coil 46, the curved portion 50, and the mandrel 44 is driven down on the z-axis. At the same time, the magnet and reaction mass 48 are driven upward on the z-axis. The ratio of the length of the up-stroke of the voice coil magnet and reaction mass 48 to the length of the downward stroke of the voice coil 46, the curved portion 50, and the mandrel 44 is proportional to its mass. If the mass of the voice coil magnet and the reaction mass 48 is 10 times the combined mass of the voice coil 46, the curved portion 50, and the mandrel 44, there will be a magnet and a reaction mass for each of the mandrel movements on the negative z-axis. The reaction on the positive z-axis moves 0.1 , and vice versa. Because the reaction force generated when the mandrel 44 has its drill bit inserted down into the PCB substrate is processed by the upward (balanced) movement of the magnet and the reaction mass 48 upwards, there is no transfer to the drill unit 36 and the metrology frame. Unresolved force or movement of the base 20. Thus, there are no unresolved reaction forces that would interfere with the drilling geometry of the position feedback sensor or mandrel 44.

In addition, to help minimize reaction forces and ensure that the mandrel and magnet are always returned or "settled" to the same position, the multi-axis pivotable interphase link set 52 is coupled to the voice coil 46 and the voice coil magnet assembly 48. between. This interphase link set is made up of a series of linear members that are sequentially connected. In FIG. 9, first member 56, which is a linear arm, has a distal pivot connection 53 to voice coil 46 and a proximal pivot connection to a first end of intermediate connection member 55. A fixed pivot 54 is attached to the bottom of the upper guide sleeve 40 and aligned on the linear axis of the mandrel 44. The first member 56 is horizontally passed through the pivot 54 such that the ratio of the distance from the pivot 54 to the distal pivot connection 53 to the distance from the pivot 54 to the proximal pivot connection 56 is proportional to the voice coil magnet and The mass of the reaction mass 48 is the same as the ratio of the combined mass of the voice coil 46, the curved portion 50, and the mandrel 44. The second end of the intermediate connecting member 55 is connected to the last connecting member 57, which is attached to the voice coil 46.

It should be noted that the voice coil 46 and the voice coil magnet coupled to the reaction mass 48 each move in the opposite direction along the z-axis. Because the quality of the voice coil 46, the mandrel 44, and the curved portion 50 is less than the mass of the voice coil magnet coupled to the reaction mass 48, the voice coil 46, the mandrel 44, and the curved portion 50 move linearly. The quantity is proportional to its mass. For example, if the combined mass of the voice coil 46, the mandrel 44, and the curved portion 50 is 100 grams, and the combined mass of the voice coil magnet coupled to the reaction mass 48 is 1000 grams, the voice coil 46 and the mandrel 44 And the curved portion 50 will move in the opposite z-axis direction by a distance 10 times the distance that the voice coil magnet coupled to the reaction mass 48 will move.

The decoupling frame/metrics frame design along with the balanced reaction force drill unit attempts to make all the net reaction forces derived from the positioning and drilling functions of the device within the metrology framework Zero to allow for more efficient operation of the feedback sensor. This in turn increases equipment productivity by allowing shorter sensor settling times, higher drilling cycle times, more accurate drilling geometry, fewer broken drill bits, and longer bit life.

The above description will allow those skilled in the art to make and use the invention. The above description also sets forth the best mode for carrying out the invention. Since the general principles of the invention have been disclosed, there are many variations and modifications that will remain apparent to those skilled in the art. Thus, those skilled in the art will appreciate that the conception of the present disclosure may be readily utilized as a basis for the design of other structures, methods, and systems for performing several aspects of the present invention. Therefore, it is important that the scope of the invention is to be construed as including such equivalents, and the scope of the invention is not limited to the spirit and scope of the invention.

Claims (19)

A PCB substrate drilling device comprising: a base mass force frame; a metrology frame support base; at least one isolation damper; an x-axis linear drive unit having an x-axis fixed drive track and a drivable x-axis a y-axis linear drive unit having a y-axis fixed drive track and a drivable y-axis travel arm; a positionable x-axis mobile stage assembly coupled to the x-axis travel arm, and Wherein the mobile station assembly is movably supported on the metrology frame support base; a positionable y-axis mobile station bracket coupled to the y-axis travel arm, wherein the y-axis mobile bracket is movable Supported on one of the extension members of the metrology frame support base; at least one z-axis drill unit coupled to the y-axis moving bracket; an x-axis reaction force moving transfer device supporting the x-axis fixed drive rail And an extension member of the base mass force frame; and a y-axis reaction force movement transfer device supporting the y-axis fixed drive rail and being an extension of the base mass force frame; wherein the metrology frame support base and the Block-based mass force by such spacer frame damper of at least one of a separated. The PCB substrate drilling apparatus of claim 1, further comprising at least one vibration isolation damping positioned between the base mass force frame and the metrology frame support base Device. The PCB substrate drilling apparatus of claim 1, wherein the z-axis drill unit is a balanced reaction force drill unit, and the balance reaction force drill unit comprises: a drill unit bottom plate connected to the mobile support a z-axis movable drill spindle rotatably received in a first guide bushing assembly mounted to a bottom plate of the drill unit a lower guide sleeve; a z-axis movable spindle drive unit movably received in a second guide bushing assembly, the second guide bushing assembly being attached to an attachment To the upper guide sleeve of the drill unit base plate; a curved connector attached between the spindle and the z-axis spindle drive unit. The PCB substrate drilling apparatus of claim 3, wherein the z-axis spindle driving unit comprises a voice coil movably received in a part of the movable voice coil magnet coupled to a reaction mass Inside. The PCB substrate drilling apparatus of claim 4, wherein the mandrel and the curved portion are combined to have a first mass, and the voice coil magnet and the coupled reaction mass have a second mass. And wherein the first mass is less than the second mass. The PCB substrate drilling apparatus of claim 5, wherein the z-axis drill unit has a series of sequentially joined connecting members, the connecting members forming a pivotable interphase link group, wherein the first connection A component system is pivotally attached to the voice coil magnet and a final connecting member is attached to the voice coil, and wherein the first connecting member is also attached to the upper guiding sleeve by a pivot support a bottom portion of the pivot support extending from the upper guide sleeve and along the mandrel Linear axis alignment, wherein the first connecting member passes horizontally through the pivot, and a distance from the pivot to a distal end of the first connecting member and a proximal end from the pivot to the first connecting member The ratio of the distances is close to the ratio of the combined mass of the magnet and the reaction mass to the combined mass of the voice coil, the curved portion, and the mandrel. The PCB substrate drilling apparatus of claim 2, wherein the at least one vibration isolation damper has an upper contact point on the metrology frame support base and a lower contact point on the base mass force frame, and Wherein the upper contact point is positioned along a center of the gravity plane of the metrology frame support base. The PCB substrate drilling apparatus of claim 7, wherein the metrology frame support base has a stop vertical aperture defined therein, the stop vertical aperture having an upper surface parallel to the gravity plane The center contacts the upper contact point of the at least one vibration isolation damper. The PCB substrate of claim 6, further comprising an intermediate connecting member connected between the first connecting member and the third connecting member. A PCB substrate drilling device comprising: a support base; an x-axis linear drive unit resident on the support base and having an x-axis fixed drive track and an x-axis travel arm; a y-axis linear drive unit, Residing on the support base and having a y-axis fixed drive track and a y-axis travel arm; a positionable x-axis mobile stage assembly coupled to the x-axis travel arm; a positionable y-axis movement a bracket coupled to the y-axis travel arm; a z-axis balance reaction force drill unit coupled to the y-axis moving bracket; wherein the z-axis reaction force drill unit comprises: a drill unit bottom plate connected to the moving bracket; a z-axis Moving the spindle of the drill, rotatably received in a first guide bushing assembly, the first guide bushing assembly being mounted to a guide sleeve attached to the lower portion of the drill unit floor a z-axis spindle drive unit movably received in a second guide bushing assembly mounted to an upper portion of the drill unit base plate a guiding sleeve; and a curved connector attached between the spindle and the z-axis spindle drive unit. The PCB substrate drilling apparatus of claim 10, wherein the z-axis spindle driving unit comprises a voice coil and a voice coil magnet coupled to a reaction mass, wherein the voice coil system is partially accommodated in the voice coil One of the magnets is inside the recess. The PCB substrate drilling apparatus of claim 11, wherein the voice coil and the voice coil magnet coupled to the reaction mass are simultaneously movable in opposite directions along the z-axis. The PCB substrate drilling apparatus of claim 11, wherein the voice coil, the mandrel, and one of the curved portions have a mass smaller than a mass of the voice coil magnet coupled to the reaction mass. The PCB substrate drilling apparatus of claim 12, wherein the z-axis drill unit has a series of sequentially connected connecting members, the connecting members forming a pivotable interphase link group, wherein the first connection A component system is pivotally attached to the voice coil magnet and a final connecting member is attached to the voice coil, and wherein the first connecting member is also attached to the upper guiding sleeve by a pivot support a bottom portion of the pivot support extending from the upper guide sleeve and linearly aligned along one of the mandrels, wherein the first connecting member passes horizontally through the pivot and from the pivot to the first connection a distance from a distal end of the member to a distance from the pivot to a proximal end of the first connecting member The ratio of the comparison is close to the ratio of the combined mass of the magnet and the reaction mass to the combined mass of the voice coil, the curved portion, and the mandrel. The PCB substrate drilling apparatus of claim 14, wherein the support base is composed of: a metrology frame support base; a base mass force frame; and at least one compression isolation damper; wherein the metrology frame support The base resides on top of the base mass frame, but is separated from the base mass frame by at least one of the compression isolation dampers. The PCB substrate drilling apparatus of claim 14, wherein the x-axis fixed drive rail and the y-axis fixed drive rail are attached to the base mass force frame, and the x-axis travel arm is coupled to the movable body The mobile station assembly supported on the metrology frame support base, and the y-axis travel arm is coupled to the moving bracket movably supported on the metrology frame support base. The PCB substrate drilling apparatus of claim 15, wherein the x-axis fixed drive rail is attached to the base mass force frame by an x-axis reaction force movement transfer device, and the y-axis fixed drive rail system Attached to the base mass force frame by a y-axis reaction force moving transfer device. The PCB substrate drilling apparatus of claim 16, wherein the at least one vibration isolation damper has an upper contact point on the metrology frame support base and a lower contact point on the base mass force frame, and Wherein the upper contact point is positioned along a center of one of the gravity planes of the metrology frame support base. The PCB substrate drilling apparatus of claim 18, wherein the metrology frame support base has a stop vertical aperture defined therein, the stop vertical aperture having an upper surface that resides parallel to gravity The center of the plane contacts the upper contact point of the at least one vibration isolation damper.