TW201444924A - Hardened material, film, coating film, compact and resin composition - Google Patents
Hardened material, film, coating film, compact and resin composition Download PDFInfo
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- TW201444924A TW201444924A TW103102699A TW103102699A TW201444924A TW 201444924 A TW201444924 A TW 201444924A TW 103102699 A TW103102699 A TW 103102699A TW 103102699 A TW103102699 A TW 103102699A TW 201444924 A TW201444924 A TW 201444924A
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- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
- C08G59/00—Polycondensates containing more than one epoxy group per molecule; Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups
- C08G59/18—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing
- C08G59/20—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing characterised by the epoxy compounds used
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- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09D—COATING COMPOSITIONS, e.g. PAINTS, VARNISHES OR LACQUERS; FILLING PASTES; CHEMICAL PAINT OR INK REMOVERS; INKS; CORRECTING FLUIDS; WOODSTAINS; PASTES OR SOLIDS FOR COLOURING OR PRINTING; USE OF MATERIALS THEREFOR
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Abstract
Description
本發明是有關於一種作為塗佈材料、進行成形而獲得的光學材料、電絕緣材料等有用的樹脂組成物。進而,本發明是有關於一種含有包含氟系聚合物的樹脂組成物的表面經改質的成形體。 The present invention relates to a resin composition useful as an optical material, an electrical insulating material, or the like obtained as a coating material. Further, the present invention relates to a molded body having a surface modified with a resin composition containing a fluorine-based polymer.
近年來,於各種顯示板、圖像讀取用光源、交通信號、大型顯示器用單元、行動電話的背光源等中得到實用化的發光二極體(Light Emitting Diode,LED)等發光裝置通常藉由如下方式來製造:藉由將作為硬化劑的脂環式酸酐用於芳香族環氧樹脂而成者來進行樹脂密封。但是,已知該樹脂系的酸酐容易因酸而變色、或者硬化需要長時間。另外,於經硬化的密封樹脂被放置在室外的情況、或曝露於產生紫外線的光源中的情況下,存在密封樹脂發生黃變這一問題點。 In recent years, light-emitting devices such as light-emitting diodes (LEDs) that have been put into practical use in various display panels, light sources for image reading, traffic signals, large-sized display units, backlights for mobile phones, and the like have generally been borrowed. It is produced by resin sealing by using an alicyclic acid anhydride as a curing agent for an aromatic epoxy resin. However, it is known that the acid anhydride of the resin is easily discolored by an acid or hardens for a long time. Further, in the case where the cured sealing resin is left outdoors or exposed to a light source that generates ultraviolet rays, there is a problem that the sealing resin is yellowed.
為了消除此種問題點,而嘗試了使用環狀脂肪族環氧樹脂或丙烯酸樹脂,並藉由陽離子聚合起始劑來進行LED等的樹脂 密封的方法(參照專利文獻1及專利文獻2)。但是,進行了上述陽離子聚合的硬化樹脂非常脆,因此容易因冷熱循環而產生龜裂破損,另外,與現有的芳香族環氧樹脂-酸酐硬化系相比,存在硬化後的密封樹脂的著色顯著這一重大缺點。因此,該硬化樹脂不適合要求無色透明性的用途,特別是要求耐熱性與透明性的LED的密封用途。 In order to eliminate such a problem, attempts have been made to use a cyclic aliphatic epoxy resin or an acrylic resin, and to carry out a resin such as an LED by a cationic polymerization initiator. Method of sealing (refer to Patent Document 1 and Patent Document 2). However, since the hardened resin subjected to the above cationic polymerization is very brittle, cracking damage is likely to occur due to thermal cycle, and the color of the sealing resin after curing is significantly higher than that of the conventional aromatic epoxy resin-anhydride curing system. This major shortcoming. Therefore, the cured resin is not suitable for applications requiring colorless transparency, and particularly for sealing of LEDs requiring heat resistance and transparency.
因此,於專利文獻3中揭示有一種由冷熱循環所引起的 裂痕的產生得到改良,且耐光性優異的LED密封材料用樹脂組成物。此處所示的樹脂組成物是將氫化環氧樹脂或脂環式環氧樹脂作為基質成分者,但硬化後的經時變化仍然大而期望進一步的品質穩定性。 Therefore, in Patent Document 3, there is disclosed a problem caused by a thermal cycle. A resin composition for an LED sealing material which is improved in crack generation and excellent in light resistance. The resin composition shown here is a hydrogenated epoxy resin or an alicyclic epoxy resin as a matrix component, but the change with time after hardening is still large, and further quality stability is desired.
另一方面,於專利文獻4中記載有一種用以填埋配線基 板的電子零件與基板的間隙的包埋樹脂組成物(embedding resin composition),該包埋樹脂組成物使用脂肪族環狀環氧樹脂或氧雜環丁烷樹脂作為低黏度化劑。但是,該樹脂組成物含有大量的無機填料,而無法應用於需要透明性的領域。 On the other hand, Patent Document 4 describes a method for filling a wiring base. An embedding resin composition in which a gap between an electronic component of the board and the substrate is used, and the embedding resin composition uses an aliphatic cyclic epoxy resin or an oxetane resin as a low viscosity agent. However, this resin composition contains a large amount of inorganic filler, and cannot be applied to a field requiring transparency.
另外,於專利文獻5中揭示有一種將改質氧雜環丁烷樹 脂作為活性能量線硬化性樹脂的可溶於鹼性水溶液的樹脂組成物,此處所示的樹脂組成物是以作為鹼可溶性樹脂為目的,另外,改質氧雜環丁烷樹脂或多官能氧雜環丁烷樹脂因具有不飽和鍵,故無法避免由熱歷程所引起的變色。 In addition, Patent Document 5 discloses a modified oxetane tree A resin composition which is soluble in an alkaline aqueous solution of an active energy ray-curable resin, and the resin composition shown here is intended to be an alkali-soluble resin, and modified oxetane resin or polyfunctional Since the oxetane resin has an unsaturated bond, discoloration caused by the thermal history cannot be avoided.
[現有技術文獻] [Prior Art Literature]
[專利文獻] [Patent Literature]
[專利文獻1]:日本專利特開昭61-112334號公報 [Patent Document 1]: Japanese Patent Laid-Open No. 61-112334
[專利文獻2]:日本專利特開平02-289611號公報 [Patent Document 2]: Japanese Patent Laid-Open No. 02-289611
[專利文獻3]:日本專利特開2003-277473號公報 [Patent Document 3]: Japanese Patent Laid-Open Publication No. 2003-277473
[專利文獻4]:日本專利特開2004-27186號公報 [Patent Document 4]: Japanese Patent Laid-Open Publication No. 2004-27186
[專利文獻5]:國際公開第2001/072857號 [Patent Document 5]: International Publication No. 2001/072857
[專利文獻6]:日本專利特開2006-070049號公報 [Patent Document 6]: Japanese Patent Laid-Open Publication No. 2006-070049
[專利文獻7]:國際公開第2004/081084號 [Patent Document 7]: International Publication No. 2004/081084
[專利文獻8]:日本專利特開2004-331647號公報 [Patent Document 8]: Japanese Patent Laid-Open Publication No. 2004-331647
[專利文獻9]:國際公開第2003/24870號 [Patent Document 9]: International Publication No. 2003/24870
[專利文獻10]:國際公開第2004/24741號 [Patent Document 10]: International Publication No. 2004/24741
[專利文獻11]:國際公開第2008/72765號 [Patent Document 11]: International Publication No. 2008/72765
[專利文獻12]:日本專利特開2009-114409號公報 [Patent Document 12]: Japanese Patent Laid-Open Publication No. 2009-114409
[專利文獻13]:日本專利特開2012-46752號公報 [Patent Document 13]: Japanese Patent Laid-Open Publication No. 2012-46752
本發明的目的在於提供一種硬化型樹脂組成物,其可利用紫外線光或電子束對硬化被膜進行曝光,形成共聚物中的交聯基(cross-linking group)進行交聯而成的網狀聚合物(network polymer),而獲得溶劑不溶性的超薄膜,且可進行對於各種光學元件、磁頭等的保護膜,表面改質,各種材料的表面處理。 An object of the present invention is to provide a curable resin composition which can be exposed to light by ultraviolet light or electron beam to form a cross-linking group in a copolymer to form a network polymerization. A network polymer is obtained to obtain a solvent-insoluble ultra-thin film, and a protective film for various optical elements, magnetic heads, and the like, surface modification, and surface treatment of various materials can be performed.
本發明者等人進行努力研究的結果,發現藉由對如下的樹脂組成物進行表面處理,而可獲得被膜強度提昇,且於短時間 內具有超親水性表面的功能性膜,從而完成了本發明,上述樹脂組成物包含選自源自分子內具有一個加成聚合性官能基的氟倍半矽氧烷的構成單元A、及源自不含氟倍半矽氧烷且分子內具有多個聚合性官能基的倍半矽氧烷的構成單元B中的至少一種,與聚合性樹脂C。 As a result of intensive studies, the present inventors have found that by subjecting the following resin composition to surface treatment, the film strength can be improved, and in a short time. The present invention has been completed by a functional film having a superhydrophilic surface containing a constituent unit A selected from a fluorosilsesquioxane having an addition polymerizable functional group in a molecule, and a source thereof. At least one of the constituent units B of the sesquioxane having no fluorine-containing sesquioxane and having a plurality of polymerizable functional groups in the molecule, and the polymerizable resin C.
即,本發明如下所述。 That is, the present invention is as follows.
(1)一種硬化物,其具有藉由對樹脂組成物進行表面處理而獲得的功能性表面,上述樹脂組成物包含提供選自構成單元A及構成單元B中的至少一種構成單元的單體化合物、與聚合性樹脂C,上述構成單元A源自分子內具有一個加成聚合性官能基的氟倍半矽氧烷,上述構成單元B源自不含氟倍半矽氧烷且分子內具有多個聚合性官能基的倍半矽氧烷。 (1) A cured product having a functional surface obtained by subjecting a resin composition to a surface treatment, the resin composition comprising a monomer compound providing at least one constituent unit selected from the group consisting of the constituent unit A and the constituent unit B And the polymerizable resin C, the structural unit A is derived from a fluorosilsesquioxane having an addition polymerizable functional group in the molecule, and the above-mentioned constituent unit B is derived from fluorine-free sesquioxane and has a large amount in the molecule. A sesquioxane of a polymerizable functional group.
(2)如上述(1)所述的硬化物,其中上述具有一個加成聚合性官能基的氟倍半矽氧烷由下述式(1)表示。 (2) The cured product according to the above (1), wherein the above-mentioned fluorosilsesquioxane having an addition polymerizable functional group is represented by the following formula (1).
式(1)中,Rf 1~Rf 7分別獨立地表示任意的亞甲基可由 氧取代的碳數為1~20的氟烷基、至少1個氫經氟或三氟甲基取代的碳數為6~20的氟芳基、或芳基中的至少1個氫經氟或三氟甲基取代的碳數為7~20的氟芳基烷基,A1表示加成聚合性官能基。 In the formula (1), R f 1 to R f 7 each independently represent an arbitrary methylene group which may be substituted by oxygen with a fluoroalkyl group having 1 to 20 carbon atoms and at least one hydrogen substituted by fluorine or trifluoromethyl group. a fluoroaryl group having 6 to 20 carbon atoms or at least one hydrogen in the aryl group substituted with fluorine or a trifluoromethyl group having 7 to 20 carbon atoms, and A 1 representing an addition polymerization functional group base.
(3)如上述(2)所述的硬化物,其中上述式(1)中 的Rf 1~Rf 7分別獨立地表示3,3,3-三氟丙基、3,3,4,4,5,5,6,6,6-九氟己基、或十三氟-1,1,2,2-四氫辛基。 (3) The cured product according to the above (2), wherein R f 1 to R f 7 in the above formula (1) independently represent 3,3,3-trifluoropropyl, 3,3,4, 4,5,5,6,6,6-nonafluorohexyl, or tridecafluoro-1,1,2,2-tetrahydrooctyl.
(4)如上述(2)或(3)所述的硬化物,其中上述式(1)中的A1為自由基聚合性官能基。 (4) or (3) wherein said cured product (1) in the above-mentioned formula A 1 is a radical polymerizable functional group of the above (2),.
(5)如上述(4)所述的硬化物,其中上述式(1)中的A1含有(甲基)丙烯酸基或苯乙烯基。 (5) The cured product according to the above (4), wherein A 1 in the above formula (1) contains a (meth)acrylic group or a styryl group.
(6)如上述(5)所述的硬化物,其中上述式(1)中的A1由下述式(3)或式(5)表示。 (6) The cured product according to the above (5), wherein A 1 in the above formula (1) is represented by the following formula (3) or formula (5).
上述式(3)中,Y1表示碳數為2~10的伸烷基,R6為 氫、碳數為1~5的烷基、或碳數為6~10的芳基,上述式(5)中,Y2表示單鍵或碳數為1~10的伸烷基。 In the above formula (3), Y 1 represents an alkylene group having 2 to 10 carbon atoms, R 6 is hydrogen, an alkyl group having 1 to 5 carbon atoms, or an aryl group having 6 to 10 carbon atoms, and the above formula ( In 5), Y 2 represents a single bond or an alkylene group having a carbon number of 1 to 10.
(7)如上述(6)所述的硬化物,其中上述式(3)中,Y1表示碳數為2~6的伸烷基,R6表示氫或甲基,上述式(5)中,Y2表示單鍵或碳數為1或2的伸烷基。 (7) The cured product according to the above (6), wherein, in the formula (3), Y 1 represents an alkylene group having 2 to 6 carbon atoms, and R 6 represents hydrogen or a methyl group, and the above formula (5) Y 2 represents a single bond or an alkylene group having a carbon number of 1 or 2.
(8)如上述(1)所述的硬化物,其中上述源自不含氟倍半矽氧烷且分子內具有多個聚合性官能基的倍半矽氧烷的構成單元B含有由下述的結構所表示的至少1種倍半矽氧烷衍生物。 (8) The cured product according to the above (1), wherein the constituent unit B derived from the sesquioxane having no fluorine-containing sesquioxane and having a plurality of polymerizable functional groups in the molecule contains the following At least one sesquiterpene derivative represented by the structure.
[化3]
式(A-1)~式(A-3)中,R分別獨立地為氫、不鄰接 的-CH2-可由-O-或伸環烷基取代的碳數為1~45的烷基、碳數為4~8的環烷基、或者經取代或未經取代的芳基。經取代的芳基的苯環中,任意的氫可由碳數為1~10的烷基或鹵素取代。R1分別獨立地為選自碳數為1~4的烷基、環戊基、環己基及苯基中的基。 至少1個X為氫或具有聚合性的官能基的基,剩餘的X為與R1同樣地定義的基。 In the formulae (A-1) to (A-3), R is independently hydrogen, and the non-contiguous -CH 2 - may be an alkyl group having 1 to 45 carbon atoms which may be substituted by -O- or a cycloalkyl group. A cycloalkyl group having 4 to 8 carbon atoms or a substituted or unsubstituted aryl group. In the benzene ring of the substituted aryl group, any hydrogen may be substituted with an alkyl group having 1 to 10 carbon atoms or a halogen. R 1 is each independently a group selected from the group consisting of an alkyl group having 1 to 4 carbon atoms, a cyclopentyl group, a cyclohexyl group, and a phenyl group. At least one of X is hydrogen or a polymerizable functional group, and the remaining X is a group defined in the same manner as R 1 .
(9)如上述(8)所述的硬化物,其中上述式(A-1)~式(A-3)中,R為苯基或環己基。 (9) The cured product according to the above (8), wherein, in the formula (A-1) to the formula (A-3), R is a phenyl group or a cyclohexyl group.
(10)如上述(8)所述的硬化物,其中X為由式(2)、式(3)、式(4)及式(5)的任一者所表示的基。 (10) The cured product according to the above (8), wherein X is a group represented by any one of the formula (2), the formula (3), the formula (4), and the formula (5).
(11)如上述(8)所述的硬化物,其中上述源自不含氟倍半矽氧烷且分子內具有多個聚合性官能基的倍半矽氧烷的構 成單元B為由下述式(1-1)所表示的倍半矽氧烷衍生物。 (11) The cured product according to the above (8), wherein the above-mentioned sesquiterpene oxide derived from a fluorine-free sesquioxane having a plurality of polymerizable functional groups in the molecule The unit B is a sesquiterpene oxide derivative represented by the following formula (1-1).
(12)如上述(1)至上述(11)中任一項所述的硬化物,其中上述聚合性樹脂C為選自熱塑性樹脂、熱硬化性樹脂及/或活性能量線硬化性樹脂中的一種以上的樹脂。 The cured product according to any one of the above-mentioned (1), wherein the polymerizable resin C is selected from the group consisting of a thermoplastic resin, a thermosetting resin, and/or an active energy ray-curable resin. More than one resin.
(13)如上述(1)至上述(12)中任一項所述的硬化物,其中上述聚合性樹脂C為選自(甲基)丙烯酸酯樹脂、聚胺基甲酸酯樹脂、生物降解性樹脂、聚乙烯醇樹脂、丙烯酸胺基甲酸酯樹脂、聚烯烴樹脂、分子內不含矽的環氧樹脂及分子內不含矽的氧雜環丁烷樹脂中的至少一種以上的樹脂。 (13) The cured product according to any one of the above (1), wherein the polymerizable resin C is selected from the group consisting of (meth) acrylate resins, polyurethane resins, and biodegradation. At least one or more of a resin, a polyvinyl alcohol resin, an urethane urethane resin, a polyolefin resin, an epoxy resin containing no antimony in the molecule, and an oxetane resin containing no antimony in the molecule.
(14)如上述(1)所述的硬化物,其中上述表面處理為臭氧處理及/或紫外線照射處理。 (14) The cured product according to the above (1), wherein the surface treatment is ozone treatment and/or ultraviolet irradiation treatment.
(15)如上述(1)所述的硬化物,其中藉由上述表面處理所賦予的上述功能性表面為超親水性表面。 (15) The cured product according to the above (1), wherein the functional surface imparted by the surface treatment is a superhydrophilic surface.
(16)如上述(1)所述的硬化物,其中藉由上述表面處理 所賦予的上述功能性表面為阻氣層。 (16) The cured product according to (1) above, wherein the surface treatment is performed by the above The above functional surface imparted is a gas barrier layer.
(17)如上述(1)所述的硬化物,其中藉由上述表面處理所賦予的上述功能性表面為硬塗層。 (17) The cured product according to (1) above, wherein the functional surface imparted by the surface treatment is a hard coat layer.
(18)如上述(1)所述的硬化物,其中藉由上述表面處理所賦予的上述功能性表面為耐熱性表面。 (18) The cured product according to the above (1), wherein the functional surface imparted by the surface treatment is a heat resistant surface.
(19)一種膜、塗佈膜或成形體,其由樹脂組成物來製作,上述樹脂組成物包含提供選自構成單元A及構成單元B中的至少一種構成單元的單體化合物、與聚合性樹脂C,上述構成單元A源自分子內具有一個加成聚合性官能基的氟倍半矽氧烷,上述構成單元B源自不含氟倍半矽氧烷且分子內具有多個聚合性官能基的倍半矽氧烷。 (19) A film, a coating film or a molded body produced from a resin composition containing a monomer compound which provides at least one constituent unit selected from the constituent unit A and the constituent unit B, and a polymerizable property Resin C, the above-mentioned structural unit A is derived from a fluorosilsesquioxane having an addition polymerizable functional group in the molecule, and the above-mentioned constituent unit B is derived from a fluorine-free sesquioxane and has a plurality of polymerizable functionalities in the molecule. A sesquiterpene oxide.
(20)一種樹脂組成物,其特徵在於:上述樹脂組成物包括提供選自構成單元A及構成單元B中的至少一種構成單元的單體化合物、與聚合性樹脂C,上述構成單元A源自分子內具有一個加成聚合性官能基的氟倍半矽氧烷,上述構成單元B源自不含氟倍半矽氧烷且分子內具有多個聚合性官能基的倍半矽氧烷,且對上述樹脂組成物進行硬化、表面處理而成的(膜)表面的接觸角未滿10°。 (20) A resin composition comprising a monomer compound which provides at least one structural unit selected from the group consisting of the structural unit A and the structural unit B, and a polymerizable resin C, wherein the constituent unit A is derived from a fluorosilsesquioxane having an addition polymerizable functional group in the molecule, and the above-mentioned constituent unit B is derived from a sesquioxane having no fluorinated sesquioxane and having a plurality of polymerizable functional groups in the molecule, and The contact angle of the (film) surface obtained by hardening and surface-treating the above resin composition was less than 10°.
本發明的樹脂組成物包含選自構成單元A及構成單元B中的至少一種、與聚合性樹脂C,上述構成單元A源自分子內具有一個加成聚合性官能基的氟倍半矽氧烷,上述構成單元B源自 不含氟倍半矽氧烷且分子內具有多個聚合性官能基的倍半矽氧烷,該樹脂組成物藉由深紫外線或臭氧而使有機基與矽原子間的鍵結開裂,且氧原子與開裂部分鍵結,藉此可形成矽氧烷鍵,因此藉由進行表面處理,而可獲得被膜強度提昇,且於短時間內具有超親水性表面的功能性膜。藉由對本發明的樹脂組成物進行表面處理而獲得的硬化物的親水性、熱穩定性、物理強度、均勻性等優異,可適宜地用作電子材料。 The resin composition of the present invention comprises at least one selected from the group consisting of the structural unit A and the constituent unit B, and the polymerizable resin C, which is derived from a fluorosilsesquioxane having an addition polymerizable functional group in the molecule. , the above constituent unit B is derived from a sesquioxane having no fluorine sesquioxane and having a plurality of polymerizable functional groups in a molecule, the resin composition being cracked by bonding between an organic group and a ruthenium atom by deep ultraviolet rays or ozone, and oxygen Since the atom is bonded to the cleavage portion, whereby a decane bond can be formed, a surface film can be obtained by surface treatment, and a functional film having a super-hydrophilic surface in a short time can be obtained. The cured product obtained by subjecting the resin composition of the present invention to surface treatment is excellent in hydrophilicity, thermal stability, physical strength, uniformity, and the like, and can be suitably used as an electronic material.
本發明的硬化物是具有藉由對如下的樹脂組成物進行表面處理而獲得的功能性表面的硬化物,上述樹脂組成物包含選自構成單元A及構成單元B中的至少一種,與聚合性樹脂C,上述構成單元A源自具有加成聚合性官能基的氟倍半矽氧烷,上述構成單元B源自不含氟倍半矽氧烷且分子內具有多個聚合性官能基的倍半矽氧烷。 The cured product of the present invention is a cured product having a functional surface obtained by surface-treating a resin composition containing at least one selected from the group consisting of the constituent unit A and the constituent unit B, and polymerizability. In the resin C, the above-mentioned structural unit A is derived from a fluorosilsesquioxane having an addition polymerizable functional group, and the above-mentioned constituent unit B is derived from a fluorine-free sesquioxane-free compound and has a plurality of polymerizable functional groups in the molecule. Semi-oxane.
於本發明中,所謂加成聚合性官能基,是指可進行加成聚合的官能基,所謂「源自」,是指各單體構成本發明的樹脂組成物時的聚合殘基。由a來表示樹脂組成物中的構成單元A的莫耳分率(%),由b來表示樹脂組成物中的構成單元B的莫耳分率(%),由c來表示樹脂組成物中的聚合性樹脂C的莫耳分率(%),且分別滿足0<a<100、0<b<100、0<c<100、a+b+c=100。 In the present invention, the addition polymerizable functional group means a functional group capable of undergoing addition polymerization, and the term "derived from" means a polymerization residue when each monomer constitutes the resin composition of the present invention. The molar fraction (%) of the structural unit A in the resin composition is represented by a, the molar fraction (%) of the constituent unit B in the resin composition is represented by b, and the resin composition is represented by c. The molar fraction (%) of the polymerizable resin C satisfies 0 < a < 100, 0 < b < 100, 0 < c < 100, and a + b + c = 100, respectively.
於本發明中,所謂「聚合性樹脂C」,是指高分子量的 聚合性樹脂、重量平均分子量為幾百~幾千的聚合性寡聚物及聚合性單體的總稱。 In the present invention, the term "polymerizable resin C" means high molecular weight. A general term for a polymerizable resin and a polymerizable oligomer having a weight average molecular weight of several hundred to several thousands and a polymerizable monomer.
本發明的樹脂組成物例如可藉由使分子內具有一個加 成聚合性官能基的氟倍半矽氧烷、及不含具有加成聚合性官能基的氟倍半矽氧烷且分子內具有多個聚合性官能基的倍半矽氧烷、與加成聚合性單體(聚合性樹脂C)進行共聚而獲得。 The resin composition of the present invention can be made, for example, by having one addition in the molecule a fluorosilsesquioxane which is a polymerizable functional group, and a sesquioxane having no fluorosesquioxanes having an addition polymerizable functional group and having a plurality of polymerizable functional groups in the molecule, and an addition The polymerizable monomer (polymerizable resin C) is obtained by copolymerization.
首先,對分子內具有一個加成聚合性官能基的氟倍半矽氧烷進行說明。 First, a fluorosilsesquioxane having an addition polymerizable functional group in the molecule will be described.
氟倍半矽氧烷於分子結構中具有倍半矽氧烷骨架。所謂倍半矽氧烷,是指由[(R-SiO1.5)n]所表示的(R為任意的取代基)聚矽氧烷的總稱。該倍半矽氧烷的結構對應於其Si-O-Si骨架,通常被分類成無規結構、梯形結構、籠形結構。進而,籠形結構被分類成T8型、T10型、T12型等。其中,本發明中所使用的氟倍半矽氧烷的特徵在於具有至少1個加成聚合性官能基。即,倍半矽氧烷[(R-SiO1.5)n]的R中的1個為加成聚合性官能基。 The fluorosesquioxanes have a sesquiterpene skeleton in the molecular structure. The sesquioxane is a general term for a polyoxyalkylene represented by [(R-SiO 1.5 )n] (R is an arbitrary substituent). The structure of the sesquiterpene oxide corresponds to its Si-O-Si skeleton, and is generally classified into a random structure, a trapezoidal structure, and a cage structure. Further, the cage structure is classified into a T8 type, a T10 type, a T12 type, and the like. Among them, the fluorosilsesquioxane used in the present invention is characterized by having at least one addition polymerizable functional group. That is, one of R of sesquiterpene oxide [(R-SiO 1.5 )n] is an addition polymerizable functional group.
作為上述加成聚合性官能基,例如可列舉:具有末端烯烴型或內部烯烴型的自由基聚合性官能基的基;具有乙烯基醚、丙烯基醚及環氧基等陽離子聚合性官能基的基;具有乙烯基羧基及氰基丙烯醯基等陰離子聚合性官能基的基。較佳為具有環氧基等陽離子聚合性官能基的基或自由基聚合性官能基。 Examples of the addition-polymerizable functional group include a group having a terminal olefin type or an internal olefin type radical polymerizable functional group, and a cationically polymerizable functional group such as a vinyl ether, a propenyl ether or an epoxy group. a group having an anion polymerizable functional group such as a vinyl carboxyl group or a cyanoacryl fluorenyl group. A group having a cationically polymerizable functional group such as an epoxy group or a radical polymerizable functional group is preferred.
作為上述自由基聚合性官能基,只要是進行自由基聚合 的基,則並無特別限制,例如可列舉:甲基丙烯醯基、丙烯醯基、烯丙基、苯乙烯基、α-甲基苯乙烯基、乙烯基、乙烯基醚、乙烯基酯、丙烯醯胺、甲基丙烯醯胺、N-乙烯醯胺、順丁烯二酸酯、反丁烯二酸酯及N-取代順丁烯二醯亞胺。其中,較佳為含有(甲基)丙烯酸基或苯乙烯基的基。此處,所謂(甲基)丙烯酸基,是指丙烯酸基及甲基丙烯酸基的總稱,表示丙烯酸基及/或甲基丙烯酸基。以下,同樣如此。 As the above radical polymerizable functional group, as long as it is subjected to radical polymerization The base is not particularly limited, and examples thereof include a methyl methacrylate group, an acryl fluorenyl group, an allyl group, a styryl group, an α-methylstyryl group, a vinyl group, a vinyl ether, a vinyl ester, and the like. Acrylamide, methacrylamide, N-vinylamine, maleate, fumarate and N-substituted maleimide. Among them, a group containing a (meth)acrylic group or a styryl group is preferred. Here, the (meth)acrylic group means a general term of an acryl group and a methacryl group, and represents an acryl group and/or a methacryl group. The same is true below.
作為具有上述(甲基)丙烯酸基的自由基聚合性官能基,例如可列舉以下的式(3)中所示的基。 The radical polymerizable functional group having the above (meth)acrylic group may, for example, be a group represented by the following formula (3).
式(3)中,Y1表示碳數為2~10的伸烷基,較佳為表示碳數為2~6的伸烷基,更佳為表示碳數為3的伸烷基(伸丙基)。另外,R6表示氫、碳數為1~5的烷基、或碳數為6~10的芳基,較佳為表示氫或碳數為1~3的烷基,更佳為表示氫或甲基。此處,碳數為1~5的烷基可為直鏈狀或支鏈狀的任一種。另外,具有上述苯乙烯基的自由基聚合性官能基的例子包含以下的式(5)中所示的基。式(5)中,Y2表示單鍵或碳數為1~10的伸烷基,較佳為表示單鍵或碳數為1~6的伸烷基,更佳為表示單鍵或碳數為1或2的伸烷基,特佳為表示單鍵或碳數為2的伸烷基(伸乙基)。另外,乙烯基鍵結於苯環的任一個碳上,較佳為相對於Y2鍵結於對位的碳上。 In the formula (3), Y 1 represents an alkylene group having a carbon number of 2 to 10, preferably an alkylene group having a carbon number of 2 to 6, more preferably an alkylene group having a carbon number of 3 (extended polypropylene) base). Further, R 6 represents hydrogen, an alkyl group having 1 to 5 carbon atoms, or an aryl group having 6 to 10 carbon atoms, preferably hydrogen or an alkyl group having 1 to 3 carbon atoms, more preferably hydrogen or methyl. Here, the alkyl group having 1 to 5 carbon atoms may be either linear or branched. Further, examples of the radical polymerizable functional group having the above styryl group include the group represented by the following formula (5). In the formula (5), Y 2 represents a single bond or an alkylene group having a carbon number of 1 to 10, preferably a single bond or an alkylene group having a carbon number of 1 to 6, more preferably a single bond or a carbon number. The alkylene group is 1 or 2, and particularly preferably represents a single bond or an alkylene group having a carbon number of 2 (extended ethyl group). Further, the vinyl group is bonded to any carbon of the benzene ring, preferably to the carbon bonded to the opposite side with respect to Y 2 .
[化6]
上述氟倍半矽氧烷的特徵在於具有至少1個氟烷基、氟芳基烷基、或氟芳基。即,倍半矽氧烷(R-SiO1.5)n的R的1個以上,較佳為上述加成聚合性官能基以外的R均為氟烷基、氟芳基烷基及/或氟芳基。 The above fluorine silsesquioxane is characterized by having at least one fluoroalkyl group, fluoroarylalkyl group, or fluoroaryl group. In other words, one or more Rs of sesquiterpene oxide (R-SiO 1.5 )n are preferably fluoroalkyl groups, fluoroarylalkyl groups and/or fluoroaryl groups other than the above-mentioned addition polymerizable functional groups. base.
上述氟烷基可為直鏈狀或支鏈狀的任一種。該氟烷基的碳數為1~20,較佳為3~14。進而,該氟烷基的任意的亞甲基可由氧取代。此處,亞甲基包含-CH2-、-CFH-或-CF2-。即,所謂「任意的亞甲基可由氧取代」,是指-CH2-、-CFH-或-CF2-可由-O-取代。但是,於氟烷基中,2個氧未進行鍵結(-O-O-)。即,氟烷基亦可具有醚鍵。另外,於較佳的氟烷基中,鄰接於Si的亞甲基不會由氧取代,與Si為相反側的末端為CF3。進而,與-CH2-或-CFH-由氧取代相比,較佳為-CF2-由氧取代。該氟烷基的較佳的具體例包括:3,3,3-三氟丙基、3,3,4,4,4-五氟丁基、3,3,4,4,5,5,6,6,6-九氟己基、十三氟-1,1,2,2-四氫辛基、十七氟-1,1,2,2-四氫十二基、二十一氟-1,1,2,2-四氫十二基、二十五氟-1,1,2,2-四氫十四基、(3-七氟異丙氧基)丙基等。其中,可較佳地例示全氟烷基乙基,可為經由-CH2-CH2-而鍵結有氟烷基的基,亦可為經由-CH2-而鍵結有氟烷基 的基。 The fluoroalkyl group may be either linear or branched. The fluoroalkyl group has a carbon number of from 1 to 20, preferably from 3 to 14. Further, any methylene group of the fluoroalkyl group may be substituted with oxygen. Here, the methylene group contains -CH 2 -, -CFH- or -CF 2 -. That is, "arbitrary methylene group may be substituted by oxygen" means that -CH 2 -, -CFH- or -CF 2 - may be substituted by -O-. However, in the fluoroalkyl group, two oxygens are not bonded (-OO-). That is, the fluoroalkyl group may also have an ether bond. Further, in a preferred fluoroalkyl group, the methylene group adjacent to Si is not substituted by oxygen, and the terminal opposite to Si is CF 3 . Further, it is preferred that -CF 2 - is substituted with oxygen as compared with -CH 2 - or -CFH- by oxygen substitution. Preferred specific examples of the fluoroalkyl group include: 3,3,3-trifluoropropyl, 3,3,4,4,4-pentafluorobutyl, 3,3,4,4,5,5, 6,6,6-nonafluorohexyl, tridecafluoro-1,1,2,2-tetrahydrooctyl, heptadecafluoro-1,1,2,2-tetrahydrododeyl, twenty-first fluorine- 1,1,2,2-tetrahydrododecyl, twenty-fivefluoro-1,1,2,2-tetrahydrotetradecyl, (3-heptafluoroisopropoxy)propyl, and the like. Among them, a perfluoroalkylethyl group may be preferably exemplified, and a fluoroalkyl group may be bonded via -CH 2 -CH 2 -, or a fluoroalkyl group may be bonded via -CH 2 - base.
上述氟芳基烷基為包含含有氟的芳基的烷基,其碳數較 佳為7~20,更佳為7~10。較佳為所含有的氟將芳基中的任意的1個或2個以上的氫取代為氟或三氟甲基而成者。作為芳基部分,例如可列舉苯基、萘基及雜芳基。作為烷基部分,例如可列舉甲基、乙基及丙基。 The above fluoroarylalkyl group is an alkyl group containing a fluorine-containing aryl group, and its carbon number is higher. Good for 7~20, better for 7~10. It is preferred that the fluorine contained is one in which one or two or more hydrogens in the aryl group are substituted with fluorine or a trifluoromethyl group. Examples of the aryl moiety include a phenyl group, a naphthyl group, and a heteroaryl group. Examples of the alkyl moiety include a methyl group, an ethyl group, and a propyl group.
另外,上述氟芳基是芳基中的任意的1個或2個以上的氫由氟或三氟甲基取代而成者,其碳數較佳為6~20,更佳為6。作為該芳基,例如可列舉苯基、萘基及雜芳基。具體而言,例如可列舉五氟苯基等氟苯基、及三氟甲基苯基。 Further, the fluoroaryl group is one in which one or two or more hydrogens of the aryl group are substituted by fluorine or a trifluoromethyl group, and the carbon number thereof is preferably from 6 to 20, more preferably 6. Examples of the aryl group include a phenyl group, a naphthyl group, and a heteroaryl group. Specific examples thereof include a fluorophenyl group such as pentafluorophenyl group and a trifluoromethylphenyl group.
氟倍半矽氧烷中所含有的上述氟烷基、氟芳基烷基、或氟芳基之中,較佳的基為氟烷基,更佳為全氟烷基乙基,進而更佳為3,3,3-三氟丙基、3,3,4,4,5,5,6,6,6-九氟己基或十三氟-1,1,2,2-四氫辛基。 Among the above fluoroalkyl groups, fluoroarylalkyl groups or fluoroaryl groups contained in the fluorosesquioxane, a preferred group is a fluoroalkyl group, more preferably a perfluoroalkylethyl group, and thus more preferably Is 3,3,3-trifluoropropyl, 3,3,4,4,5,5,6,6,6-nonafluorohexyl or tridecafluoro-1,1,2,2-tetrahydrooctyl .
如上所述,較佳的氟倍半矽氧烷具有T8型的結構,具有1個加成聚合性官能基,且具有1個或2個以上的氟烷基、氟芳基烷基及/或氟芳基,並由以下的結構式(1)表示。 As described above, a preferred fluorosesquioxane has a T8 type structure, has one addition polymerizable functional group, and has one or more fluoroalkyl groups, fluoroarylalkyl groups and/or Fluorinyl group and represented by the following structural formula (1).
[化7]
上述式(1)中,A1為加成聚合性官能基,較佳為上述 自由基聚合性官能基,Rf 1~Rf 7較佳為分別獨立地為上述氟烷基、氟芳基烷基、或氟芳基。Rf 1~Rf 7分別可為不同的基,亦可均為相同的基。 In the above formula (1), A 1 is an addition polymerizable functional group, preferably a radical polymerizable functional group, and R f 1 to R f 7 are each independently a fluoroalkyl group or a fluoroaryl group. Alkyl, or fluoroaryl. R f 1 to R f 7 may each be a different group or may be the same group.
式(1)中的Rf 1~Rf 7較佳為分別獨立地表示3,3,3-三氟 丙基、3,3,4,4,4-五氟丁基、3,3,4,4,5,5,6,6,6-九氟己基、十三氟-1,1,2,2-四氫辛基、十七氟-1,1,2,2-四氫癸基、二十一氟-1,1,2,2-四氫十二基、二十五氟-1,1,2,2-四氫十四基、(3-七氟異丙氧基)丙基、五氟苯基丙基、五氟苯基、或α,α,α-三氟甲基苯基,Rf 1~Rf 7更佳為分別獨立地表示3,3,3-三氟丙基、3,3,4,4,5,5,6,6,6-九氟己基、或十三氟-1,1,2,2-四氫辛基。 R f 1 to R f 7 in the formula (1) preferably independently represent 3,3,3-trifluoropropyl, 3,3,4,4,4-pentafluorobutyl, 3,3, respectively. 4,4,5,5,6,6,6-nonafluorohexyl, tridecafluoro-1,1,2,2-tetrahydrooctyl, heptafluoro-1,1,2,2-tetrahydroindole Base, hexafluoro-1,1,2,2-tetrahydrododecyl, twenty-five fluoro-1,1,2,2-tetrahydrotetradecyl, (3-heptafluoroisopropoxy) Propyl, pentafluorophenylpropyl, pentafluorophenyl, or α,α,α-trifluoromethylphenyl, R f 1 to R f 7 more preferably independently represent 3,3,3-three Fluoropropyl, 3,3,4,4,5,5,6,6,6-nonafluorohexyl, or tridecafluoro-1,1,2,2-tetrahydrooctyl.
作為具體的化合物,例如可列舉國際公開第2008/072765號的[製造例1]中所記載的化合物(a-1)。 The compound (a-1) described in [Production Example 1] of International Publication No. WO 2008/072765 is exemplified as a specific compound.
[化8]
其次,對源自不含氟倍半矽氧烷且分子內具有多個聚合性官能基的倍半矽氧烷的構成單元B進行說明。 Next, the constituent unit B derived from sesquiterpene oxide having no fluorine-containing sesquioxane and having a plurality of polymerizable functional groups in the molecule will be described.
本發明的樹脂組成物的構成單元B為選自由式(A-1)~式(A-3)所表示的倍半矽氧烷衍生物中的至少1種化合物。 The structural unit B of the resin composition of the present invention is at least one compound selected from the group consisting of the sesquiterpene oxide derivatives represented by the formulae (A-1) to (A-3).
[化9]
式(A-1)~式(A-3)中,R分別獨立地為氫、不鄰接 的-CH2-可由-O-或伸環烷基取代的碳數為1~45的烷基、碳數為4~8的環烷基、或者經取代或未經取代的芳基。經取代的芳基的苯環中,任意的氫可由碳數為1~10的烷基或鹵素取代。 In the formulae (A-1) to (A-3), R is independently hydrogen, and the non-contiguous -CH 2 - may be an alkyl group having 1 to 45 carbon atoms which may be substituted by -O- or a cycloalkyl group. A cycloalkyl group having 4 to 8 carbon atoms or a substituted or unsubstituted aryl group. In the benzene ring of the substituted aryl group, any hydrogen may be substituted with an alkyl group having 1 to 10 carbon atoms or a halogen.
更佳的R為環戊基,環己基,或者任意的氫可由氯、氟、 甲基、甲氧基、或三氟甲基取代的苯基,更佳的R為環己基或苯基,而且,最佳的R為苯基。 More preferably R is cyclopentyl, cyclohexyl, or any hydrogen may be chlorine, fluorine, Methyl, methoxy or trifluoromethyl substituted phenyl, more preferably R is cyclohexyl or phenyl, and most preferably R is phenyl.
R1分別獨立地為選自碳數為1~4的烷基、環戊基、環己基及苯基中的基。碳數為1~4的烷基的例子為甲基、乙基、丙基、2-甲基乙基、丁基及第三丁基。R1的較佳例為甲基及苯基。較佳為R1為相同的基。 R 1 is each independently a group selected from the group consisting of an alkyl group having 1 to 4 carbon atoms, a cyclopentyl group, a cyclohexyl group, and a phenyl group. Examples of the alkyl group having 1 to 4 carbon atoms are a methyl group, an ethyl group, a propyl group, a 2-methylethyl group, a butyl group and a tert-butyl group. Preferred examples of R 1 are a methyl group and a phenyl group. Preferably, R 1 is the same group.
至少2個X為氫或具有聚合性的官能基的基,剩餘的X為與R1同樣地定義的基。當X為聚合性的官能基時,可列舉具有環氧乙烷基、伸環氧乙烷基、3,4-環氧環己基、氧雜環丁基、伸氧雜環丁基、乙烯基、烯丙基或苯乙烯基的任1個的取代基。於本發明中,較佳為具有環氧乙烷基、伸環氧乙烷基、3,4-環氧環己基、氧雜環丁基及伸氧雜環丁基的任1個,以下表示各取代基的殘基。 At least two of X are hydrogen or a polymerizable functional group, and the remaining X is a group defined in the same manner as R 1 . When X is a polymerizable functional group, it may, for example, be an ethylene oxide group, an ethylene oxide group, a 3,4-epoxycyclohexyl group, an oxetanyl group, an oxetanyl group, or a vinyl group. Any one of the allyl or styryl groups. In the present invention, it is preferred to have any one of an ethylene oxide group, an ethylene oxide group, a 3,4-epoxycyclohexyl group, an oxetanyl group and an oxetanyl group. Residues of each substituent.
[化10]
其次,例示屬於構成單元B的具體的化合物。 Next, a specific compound belonging to the constituent unit B is exemplified.
<化合物例1> <Compound Example 1>
化合物例1於日本專利特開2009-167390號公報的實施例中,在[合成例1]中記載為化合物(1-1),由下述式表示。 In the example of the Japanese Patent Publication No. 2009-167390, the compound (1) is represented by the following formula in [Synthesis Example 1].
[化11]
<化合物例2> <Compound Example 2>
化合物例2於日本專利特開2007-326988號公報記載的實施例中,在[合成例1]中記載為化合物(1-1),由下述式表示。 In the example described in the Japanese Patent Publication No. 2007-326988, the compound (1-1) is represented by the following formula in [Synthesis Example 1].
<化合物例3> <Compound Example 3>
化合物例3於日本專利特開2010-254814號公報的實施例1中記載為化合物(b-1-1),由下述式表示。 The compound example 3 is described as the compound (b-1-1) in the first embodiment of JP-A-2010-254814, and is represented by the following formula.
[化13]
其次,對聚合性樹脂C進行說明。 Next, the polymerizable resin C will be described.
構成單元A的氟倍半矽氧烷衍生物或構成單元B的倍半 矽氧烷衍生物可與聚合性樹脂C組合使用。於本發明中,如已述般,所謂「聚合性樹脂C」,是指高分子量的聚合性樹脂、重量平均分子量為幾百~幾千的聚合性寡聚物及聚合性單體的總稱。 a fluorosilsesquioxane derivative constituting the unit A or a half of the constituent unit B The siloxane derivative can be used in combination with the polymerizable resin C. In the present invention, the "polymerizable resin C" is a general term for a polymerizable resin having a high molecular weight, a polymerizable oligomer having a weight average molecular weight of several hundreds to several thousands, and a polymerizable monomer.
若為了藉由本發明的樹脂組成物來於基材表面形成被 膜,而於選自構成單元A的氟倍半矽氧烷衍生物及構成單元B的倍半矽氧烷衍生物中的至少一種中調配具有交聯成分的聚合性樹脂C來使用,則可改善硬化膜的耐熱性、耐光性、耐擦傷性、耐磨損性、表面.界面特性、相容性等特性。 If it is formed on the surface of the substrate by the resin composition of the present invention In the film, the polymerizable resin C having a crosslinking component is used in at least one selected from the group consisting of a fluorosilsesquioxane derivative of the structural unit A and a sesquioxane derivative of the structural unit B. Improve the heat resistance, light resistance, scratch resistance, abrasion resistance and surface of the cured film. Interface characteristics, compatibility and other characteristics.
具體而言,例如藉由將包含具有聚合性基的倍半矽氧烷 衍生物與聚合性多官能性化合物,進而視需要包含聚合起始劑(硬化反應)的溶液塗佈於基板上,並對塗膜進行乾燥及硬化,而可於基板上形成包含複合樹脂的被膜(複合膜)。 Specifically, for example, by containing a sesquiterpene oxide having a polymerizable group The derivative and the polymerizable polyfunctional compound, and optionally a solution containing a polymerization initiator (hardening reaction), are applied onto the substrate, and the coating film is dried and hardened to form a film containing the composite resin on the substrate. (composite film).
聚合性樹脂C可為熱塑性樹脂、熱硬化性樹脂的任一 種,亦可為多個種類的化合物。 The polymerizable resin C may be any of a thermoplastic resin and a thermosetting resin. It can also be a plurality of kinds of compounds.
作為聚合性樹脂C,例如包括:聚乙烯、聚丙烯、聚氯 乙烯、聚偏二氯乙烯、聚苯乙烯、丙烯腈-苯乙烯樹脂、丙烯腈-丁二烯-苯乙烯樹脂、聚(甲基)丙烯酸酯樹脂、超高分子量聚乙烯、聚-4-甲基戊烯、對排聚苯乙烯(syndiotactic polystyrene)、聚醯胺(例如尼龍6:杜邦公司的商品名、尼龍6,6:杜邦公司的商品名、尼龍6,10:杜邦公司的商品名、尼龍6,T:杜邦公司的商品名、尼龍MXD6:杜邦公司的商品名等)、聚酯(例如聚對苯二甲酸乙二酯、聚對苯二甲酸丁二酯、聚乙烯2,6-萘二羧酸酯)、聚縮醛、聚碳酸酯、聚苯醚、氟樹脂(例如聚四氟乙烯、聚偏二氟乙烯)、聚苯硫醚、聚碸、聚醚碸、聚醚醚酮、聚芳酯[例如U-polymer:尤尼吉可(Unitika)(股份)的商品名、Vectra:寶理塑膠(Polyplastics)(股份)的商品名]、聚醯亞胺[例如Kapton:東麗(股份)的商品名、AURUM:三井化學(股份)的商品名]、聚醚醯亞胺、聚醯胺醯亞胺、酚樹脂、醇酸樹脂、三聚氰胺樹脂、環氧樹脂、脲樹脂、雙馬來醯亞胺樹脂、聚酯胺基甲酸酯樹脂、聚醚胺基甲酸酯樹脂及矽酮樹脂等。該些樹脂可單獨使用,亦可將多種樹脂組合使用。 As the polymerizable resin C, for example, polyethylene, polypropylene, and polychloride are included. Ethylene, polyvinylidene chloride, polystyrene, acrylonitrile-styrene resin, acrylonitrile-butadiene-styrene resin, poly(meth)acrylate resin, ultrahigh molecular weight polyethylene, poly-4-methyl Synetactic polystyrene, polyamine (for example, nylon 6: trade name of DuPont, nylon 6,6: trade name of DuPont, nylon 6,10: trade name of DuPont), Nylon 6, T: DuPont's trade name, nylon MXD6: DuPont's trade name, etc.), polyester (such as polyethylene terephthalate, polybutylene terephthalate, polyethylene 2,6- Naphthalene dicarboxylate), polyacetal, polycarbonate, polyphenylene ether, fluororesin (eg polytetrafluoroethylene, polyvinylidene fluoride), polyphenylene sulfide, polyfluorene, polyether oxime, polyether ether Ketones, polyarylates [eg U-polymer: the trade name of Unitika (shares), Vectra: the trade name of Polyplastics (shares)], polyimine [eg Kapton: East The trade name of Li (share), AURUM: the trade name of Mitsui Chemicals Co., Ltd., polyether oximine, polyamidimide, phenol resin, alkyd resin Melamine resins, epoxy resins, urea resins, bismaleimide resins (PEI), polyester urethane resins, polyether urethane silicone resin, ketone resin and the like. These resins may be used singly or in combination of a plurality of resins.
可較佳地用於本發明的聚合性樹脂為環氧樹脂、(甲基) 丙烯酸酯樹脂、聚胺基甲酸酯樹脂、聚乳酸等生物降解性樹脂,聚乙烯醇樹脂、丙烯酸胺基甲酸酯樹脂、或者聚丙烯或聚乙烯等聚烯烴樹脂。 The polymerizable resin which can be preferably used in the present invention is an epoxy resin (meth) A biodegradable resin such as an acrylate resin, a polyurethane resin or a polylactic acid, a polyvinyl alcohol resin, an urethane acrylate resin, or a polyolefin resin such as polypropylene or polyethylene.
於本發明中,當使用環氧樹脂作為聚合性樹脂C時,例 如可列舉:雙酚A系、雙酚F系、雙酚AD系、含有溴的雙酚A系、苯酚酚醛清漆系、甲酚酚醛清漆系、多酚系、直鏈脂肪族系、丁二烯系、胺基甲酸酯系等的縮水甘油醚型環氧樹脂;六氫鄰苯二甲酸縮水甘油酯,二聚酸縮水甘油酯,芳香族系、環狀脂肪族系、脂肪族系縮水甘油酯型環氧樹脂;雙酚系、酯系、高分子量醚酯系、醚酯系、溴系、酚醛清漆系、甲基取代型環氧樹脂;雜環型環氧樹脂;三縮水甘油基異三聚氰酸酯、或四縮水甘油基二胺基二苯基甲烷等縮水甘油胺型環氧樹脂;環氧化聚丁二烯或環氧大豆油等線狀脂肪族型環氧樹脂;環狀脂肪族型環氧樹脂、萘系酚醛清漆型環氧樹脂、二縮水甘油氧基萘型環氧樹脂。該些之中,於性能及經濟性方面,特佳為雙酚A型、雙酚F型、雙酚AD型的縮水甘油醚型環氧樹脂。 In the present invention, when an epoxy resin is used as the polymerizable resin C, an example is given. Examples thereof include bisphenol A, bisphenol F, bisphenol AD, bromine-containing bisphenol A, phenol novolac, cresol novolak, polyphenol, linear aliphatic, and dibutyl A glycidyl ether type epoxy resin such as an olefin or a urethane type; a glycidyl hexahydrophthalate, a glycidyl dimerate, an aromatic system, a cyclic aliphatic system, or an aliphatic system. Glyceryl ester type epoxy resin; bisphenol type, ester type, high molecular weight ether ester type, ether ester type, bromine type, novolak type, methyl substituted type epoxy resin; heterocyclic epoxy resin; triglycidyl group a glycidylamine type epoxy resin such as isomeric cyanurate or tetraglycidyldiamine diphenylmethane; a linear aliphatic epoxy resin such as epoxidized polybutadiene or epoxidized soybean oil; An aliphatic epoxy resin, a naphthalene novolak epoxy resin, or a diglycidoxy naphthalene epoxy resin. Among these, in terms of performance and economy, a bisphenol A type, a bisphenol F type, and a bisphenol AD type glycidyl ether type epoxy resin are particularly preferable.
另外,於無損本發明的性能的範圍內,視需要亦可向環 氧樹脂中進而添加其用途領域中通常所調配的可撓化劑、偶合劑、阻燃劑、阻燃助劑、著色劑、填充劑等添加劑。 In addition, within the scope of not impairing the performance of the present invention, it may also be to the ring as needed. Additives such as a flexible agent, a coupling agent, a flame retardant, a flame retardant auxiliary, a coloring agent, and a filler which are usually formulated in the field of use are further added to the oxygen resin.
若對使本發明的樹脂組成物硬化而獲得的硬化樹脂調 配液狀環氧樹脂,則可進一步提昇半硬化狀態的樹脂流動性,另外,當製成片材狀時,片材難以破損,亦容易切開等,可提昇處理性,因此液狀環氧樹脂亦可用作稀釋劑。 When the hardened resin obtained by hardening the resin composition of the present invention is adjusted When the liquid epoxy resin is added, the fluidity of the resin in the semi-hardened state can be further improved, and when the sheet is formed into a sheet shape, the sheet is hard to be broken, and it is easy to cut, etc., and the handleability can be improved, so that the liquid epoxy resin is obtained. Can also be used as a diluent.
作為液狀環氧樹脂,只要為液狀,則並無特別限定,作 為多官能型的液狀環氧樹脂,例如可列舉:Epikote E152[商品名, 日本環氧樹脂(Japan Epoxy Resins)(股份)製造]、Epiclon N730-S[商品名,大日本油墨工業(股份)製造]等液狀苯酚酚醛清漆型環氧樹脂,Epikote E827、Epikote E828[均為商品名,日本環氧樹脂(股份)製造]等液狀雙酚A型環氧樹脂,Epikote E806、Epikote E807[均為商品名,日本環氧樹脂(股份)製造]等液狀雙酚F型環氧樹脂,Epikote E630[商品名,日本環氧樹脂(股份)製造],GOT、GAN[商品名,日本化藥(股份)製造]等液狀縮水甘油胺型環氧樹脂,EPU-73[商品名,旭電化工業(股份)]等液狀胺基甲酸酯改質雙酚A型環氧樹脂,YED122、YED111N[均為商品名,日本環氧樹脂(股份)製造]等單官能環氧樹脂等液狀環氧樹脂。 The liquid epoxy resin is not particularly limited as long as it is in a liquid form. For the polyfunctional liquid epoxy resin, for example, Epikote E152 [product name, Liquid epoxy phenol novolak type epoxy resin such as Japan Epoxy Resins (manufactured by Japan Epoxy Resins), Epiclon N730-S [trade name, manufactured by Dainippon Ink (product)], Epikote E827, Epikote E828 [both Liquid bisphenol A type epoxy resin such as product name, Japanese epoxy resin (manufactured by Japan), liquid bisphenol A, etc., Epikote E806, Epikote E807 [all trade names, manufactured by Japan Epoxy Co., Ltd.] Type epoxy resin, Epikote E630 [trade name, manufactured by Japan Epoxy Resin Co., Ltd.], liquid Glycidylamine type epoxy resin such as GOT, GAN [trade name, manufactured by Nippon Chemical Co., Ltd.], EPU-73 [product name, Asahi Chemical Industry Co., Ltd.] and other liquid urethane modified bisphenol A type epoxy resin, YED122, YED111N [all trade names, manufactured by Japan Epoxy Co., Ltd.] Liquid epoxy resin such as epoxy resin.
上述環氧樹脂的環氧值(亦稱為環氧當量)的下限值較 佳為150以上,更佳為170以上,最佳為190以上。另外,上述環氧樹脂的環氧值的上限值較佳為700以下,更佳為500以下,最佳為300以下。 The lower limit of the epoxy value (also known as epoxy equivalent) of the above epoxy resin is Preferably, it is 150 or more, more preferably 170 or more, and most preferably 190 or more. Further, the upper limit of the epoxy value of the epoxy resin is preferably 700 or less, more preferably 500 or less, and most preferably 300 or less.
若上述環氧樹脂的環氧值未滿150,則使本發明的樹脂 組成物硬化而獲得的硬化樹脂中的極性基變多,因此有時介電特性受損。即,有時硬化樹脂的介電常數或介電損耗正切變高。另一方面,若環氧值超過700,則硬化樹脂中的交聯密度下降,因此有時耐熱性受損。 If the epoxy resin of the above epoxy resin is less than 150, the resin of the present invention is used. Since the polar group in the hardened resin obtained by hardening the composition increases, dielectric properties may be impaired. That is, the dielectric constant or the dielectric loss tangent of the cured resin may become high. On the other hand, when the epoxy value exceeds 700, the crosslinking density in the cured resin is lowered, and thus heat resistance may be impaired.
進而,為了提昇硬化樹脂中的交聯密度,較佳為使用多 官能性環氧化物化合物作為聚合性樹脂C。可用於本發明的多官 能性環氧化物只要於分子中具有2個以上環氧基,則並無特別限定,可對應於用途、目的而適宜選擇。該些之中,較佳的化合物為於分子中具有2個~6個環氧基者。以下,按結構對多官能性環氧化物化合物(單體)進行分類來例示。 Further, in order to increase the crosslinking density in the cured resin, it is preferred to use more A functional epoxide compound is used as the polymerizable resin C. Multi-official that can be used in the present invention The energy epoxide is not particularly limited as long as it has two or more epoxy groups in the molecule, and can be appropriately selected depending on the use and purpose. Among these, a preferred compound is one having 2 to 6 epoxy groups in the molecule. Hereinafter, the polyfunctional epoxide compound (monomer) is classified by structure to be exemplified.
(EP-1)二元酚類的二縮水甘油醚 (EP-1) Diglycidyl ether of dihydric phenols
作為二元酚類的二縮水甘油醚,例如可列舉二元酚類(C6~C30)的二縮水甘油醚。作為二元酚類(C6~C30)的二縮水甘油醚,例如可列舉由2莫耳的雙酚F二縮水甘油醚、雙酚-A二縮水甘油醚、雙酚-B二縮水甘油醚、雙酚-AD二縮水甘油醚及雙酚-S二縮水甘油醚、鹵化雙酚A二縮水甘油醚(四氯雙酚A二縮水甘油醚等)、兒茶素二縮水甘油醚、間苯二酚二縮水甘油醚、對苯二酚二縮水甘油醚、1,5-二羥基萘二縮水甘油醚、二羥基聯苯二縮水甘油醚、八氯-4,4'-二羥基聯苯二縮水甘油醚、四甲基聯苯二縮水甘油醚、9,9'-雙(4-羥苯基)茀二縮水甘油醚、雙酚A與3莫耳的表氯醇的反應所獲得的二縮水甘油醚。 Examples of the diglycidyl ether of the dihydric phenols include diglycidyl ethers of dihydric phenols (C6 to C30). Examples of the diglycidyl ether of the dihydric phenol (C6 to C30) include 2 mol of bisphenol F diglycidyl ether, bisphenol-A diglycidyl ether, and bisphenol-B diglycidyl ether. Bisphenol-AD diglycidyl ether, bisphenol-S diglycidyl ether, halogenated bisphenol A diglycidyl ether (tetrachlorobisphenol A diglycidyl ether, etc.), catechin diglycidyl ether, isophthalic acid Phenol diglycidyl ether, hydroquinone diglycidyl ether, 1,5-dihydroxynaphthalene diglycidyl ether, dihydroxybiphenyl diglycidyl ether, octachloro-4,4'-dihydroxybiphenyl condensed water Diffused water obtained by the reaction of glyceryl ether, tetramethylbiphenyl diglycidyl ether, 9,9'-bis(4-hydroxyphenyl)indole diglycidyl ether, bisphenol A and 3 mol of epichlorohydrin Glycerol ether.
(EP-2)三元以上的多元酚類的聚縮水甘油醚 (EP-2) Polyglycidyl ether of ternary or higher polyphenols
作為三元以上的多元酚類的聚縮水甘油醚,例如可列舉:五倍子酚三縮水甘油醚,二羥基萘基甲酚三縮水甘油醚,三(羥苯基)甲烷三縮水甘油醚,二萘基三醇三縮水甘油醚,四(4-羥基苯基)乙烷四縮水甘油醚,對縮水甘油基苯基二甲基三醇雙酚A縮水甘油醚,三甲基-第三丁基-丁基羥基甲烷三縮水甘油醚,4,4'-氧基雙(1,4-苯基乙基)四甲酚縮水甘油醚,4,4'-氧基雙(1,4-苯基乙基)苯基 縮水甘油醚,雙(二羥基萘)四縮水甘油醚,苯酚酚醛清漆樹脂或甲酚酚醛清漆樹脂(Mn為400~5,000)的縮水甘油醚,檸檬烯苯酚酚醛清漆樹脂(Mn為400~5,000)的縮水甘油醚,藉由苯酚與乙二醛、戊二醛、或甲醛的縮合反應所獲得的多酚(Mn為400~5,000)的聚縮水甘油醚,及藉由間苯二酚與丙酮的縮合反應所獲得的Mn為400~5,000的多酚的聚縮水甘油醚。 Examples of the polyglycidyl ether of a trihydric or higher polyhydric phenol include gallic phenol triglycidyl ether, dihydroxynaphthyl cresol triglycidyl ether, tris(hydroxyphenyl)methane triglycidyl ether, and dinaphthyl. Triol triglycidyl ether, tetrakis(4-hydroxyphenyl)ethane tetraglycidyl ether, p-glycidyl phenyl dimethyl triol bisphenol A glycidyl ether, trimethyl-tert-butyl- Butyl hydroxymethane triglycidyl ether, 4,4'-oxybis(1,4-phenylethyl)tetramethyl phenol glycidyl ether, 4,4'-oxybis (1,4-phenylene) Phenyl Glycidyl ether, bis(dihydroxynaphthalene) tetraglycidyl ether, phenol novolac resin or cresol novolac resin (Mn 400~5,000) glycidyl ether, limonene phenol novolac resin (Mn 400~5,000) Glycidyl ether, polyglycidyl ether of polyphenol (Mn 400-5,000) obtained by condensation reaction of phenol with glyoxal, glutaraldehyde or formaldehyde, and condensation of resorcinol with acetone The polyglycidyl ether of polyphenol having a Mn of 400 to 5,000 obtained by the reaction.
(EP-3)脂肪族二元醇的二縮水甘油醚 (EP-3) diglycidyl ether of aliphatic diol
作為脂肪族二元醇的二縮水甘油醚,例如可列舉:乙二醇二縮水甘油醚、丙二醇二縮水甘油醚、四亞甲基二醇二縮水甘油醚、1,6-己二醇二縮水甘油醚、聚乙二醇(Mn為150~4,000)二縮水甘油醚、聚丙二醇(Mn為180~5,000)二縮水甘油醚、聚四亞甲基二醇(Mn為200~5,000)二縮水甘油基醚、新戊二醇二縮水甘油醚、雙酚A的環氧烷[環氧乙烷(Ethylene Oxide,EO)或環氧丙烷(Propylene Oxide,PO)(1莫耳~20莫耳)]加成物的二縮水甘油醚。 Examples of the diglycidyl ether of the aliphatic diol include ethylene glycol diglycidyl ether, propylene glycol diglycidyl ether, tetramethylene glycol diglycidyl ether, and 1,6-hexanediol condensed water. Glycerol ether, polyethylene glycol (Mn 150-4,000) diglycidyl ether, polypropylene glycol (Mn 180-5,000) diglycidyl ether, polytetramethylene glycol (Mn 200-5,000) diglycidyl Ethylene ether, neopentyl glycol diglycidyl ether, bisphenol A alkylene oxide [Ethylene Oxide (EO) or propylene oxide (Propylene Oxide, PO) (1 mol ~ 20 mol)] The diglycidyl ether of the adduct.
(EP-4)三元以上的脂肪族醇的聚縮水甘油醚 (EP-4) Polyglycidyl ether of ternary or higher aliphatic alcohol
作為三元以上的脂肪族醇的聚縮水甘油醚,例如可列舉:三羥甲基丙烷三縮水甘油醚、甘油三縮水甘油醚、季戊四醇四縮水甘油醚、山梨醇六縮水甘油醚、聚(n=2~5)甘油聚縮水甘油醚。 Examples of the polyglycidyl ether of a trivalent or higher aliphatic alcohol include trimethylolpropane triglycidyl ether, glycerol triglycidyl ether, pentaerythritol tetraglycidyl ether, sorbitol hexa glycidyl ether, and poly(n). = 2~5) Glycerol polyglycidyl ether.
(EP-5)縮水甘油酯型 (EP-5) glycidyl ester type
作為(i)芳香族聚羧酸的縮水甘油酯,例如可列舉:鄰苯二甲酸類的縮水甘油酯。作為鄰苯二甲酸類的縮水甘油酯,例如可 列舉:鄰苯二甲酸二縮水甘油酯、間苯二甲酸二縮水甘油酯、對苯二甲酸二縮水甘油酯、偏苯三甲酸三縮水甘油酯。 Examples of the glycidyl ester of the (i) aromatic polycarboxylic acid include glycidyl esters of phthalic acid. As a glycidyl ester of phthalic acid, for example Listed: diglycidyl phthalate, diglycidyl isophthalate, diglycidyl terephthalate, triglycidyl trimellitate.
作為(ii)脂肪族聚羧酸或脂環式聚羧酸的縮水甘油酯,例如可列舉:上述酚系的縮水甘油酯的芳香核加氫化物、二聚酸二縮水甘油酯、草酸二縮水甘油酯、順丁烯二酸二縮水甘油酯、丁二酸二縮水甘油酯、戊二酸二縮水甘油酯、己二酸二縮水甘油酯、庚二酸二縮水甘油酯、(甲基)丙烯酸縮水甘油酯的(共)聚合物(聚合度例如為2~10)、1,2,3-丙三甲酸三縮水甘油酯。 Examples of the glycidyl ester of the aliphatic polycarboxylic acid or the alicyclic polycarboxylic acid (ii) include an aromatic nuclear hydrogenated product of the above phenolic glycidyl ester, dimerized acid diglycidyl ester, and oxalic acid dihydrate. Glyceryl ester, diglycidyl maleate, diglycidyl succinate, diglycidyl glutarate, diglycidyl adipate, diglycidyl pimelate, (meth)acrylic acid The (co)polymer of glycidyl ester (degree of polymerization is, for example, 2 to 10), and triglycidyl 1,2,3-propane tricarboxylate.
(EP-6)縮水甘油胺型 (EP-6) glycidylamine type
作為(i)芳香族胺類的縮水甘油胺,例如可列舉:N,N-二縮水甘油基苯胺、N,N-二縮水甘油基甲苯胺、N,N,N',N'-四縮水甘油基二胺基二苯基甲烷、N,N,N',N'-四縮水甘油基二胺基二苯基碸、N,N,N',N'-四縮水甘油基二乙基二苯基甲烷、N,N,O-三縮水甘油基胺基苯酚。 Examples of the (i) aromatic amine-based glycidylamine include N,N-diglycidylaniline, N,N-diglycidyltoluidine, N,N,N',N'-tetrahydration. Glyceryldiaminodiphenylmethane, N,N,N',N'-tetraglycidyldiaminodiphenylphosphonium, N,N,N',N'-tetraglycidyldiethyl Phenylmethane, N, N, O-triglycidylaminophenol.
作為(ii)脂肪族胺類的縮水甘油胺,例如可列舉:N,N,N',N'-四縮水甘油基苯二甲胺、N,N,N',N'-四縮水甘油基六亞甲基二胺。 Examples of the glycidylamine of (ii) an aliphatic amine include N, N, N', N'-tetraglycidylbenzenediamine, N, N, N', N'-tetraglycidyl. Hexamethylenediamine.
作為(iii)脂環式胺類的縮水甘油胺,例如可列舉:N,N,N',N'-四縮水甘油基苯二甲胺的氫化化合物。 Examples of the (iii) glycidylamine-derived glycidylamine include a hydrogenated compound of N,N,N',N'-tetraglycidylbenzenediamine.
作為(iv)雜環式胺的縮水甘油胺,例如可列舉:三縮水甘油基三聚氰胺。 Examples of the glycidylamine of the (iv) heterocyclic amine include triglycidyl melamine.
(EP-7)鏈狀脂肪族環氧化物 (EP-7) chain aliphatic epoxide
作為鏈狀脂肪族環氧化物,例如可列舉:環氧當量為130~ 1,000的環氧化聚丁二烯(Mn為90~2,500)及環氧化大豆油(Mn為130~2,500)。 Examples of the chain aliphatic epoxide include an epoxy equivalent of 130~. 1,000 epoxidized polybutadiene (Mn is 90~2,500) and epoxidized soybean oil (Mn is 130~2,500).
(EP-8)脂環式環氧化物 (EP-8) alicyclic epoxide
作為脂環式環氧化物,例如可列舉:乙烯基環己烯二氧化物、檸檬烯二氧化物、二環戊二烯二氧化物、雙(2,3-環氧環戊基)醚、乙二醇雙環氧基二環戊基醚、3,4-環氧基-6-甲基環己基甲基-3',4'-環氧基-6'-甲基環己烷羧酸酯、雙(3,4-環氧基-6-甲基環己基甲基)己二酸酯、及雙(3,4-環氧基-6-甲基環己基甲基)丁胺。另外,亦包含上述酚類的環氧化合物的核加氫化物。 Examples of the alicyclic epoxide include vinylcyclohexene dioxide, limonene dioxide, dicyclopentadiene dioxide, bis(2,3-epoxycyclopentyl) ether, and B. Glycol bis(epoxy)dicyclopentyl ether, 3,4-epoxy-6-methylcyclohexylmethyl-3',4'-epoxy-6'-methylcyclohexanecarboxylate , bis(3,4-epoxy-6-methylcyclohexylmethyl)adipate, and bis(3,4-epoxy-6-methylcyclohexylmethyl)butylamine. Further, a nuclear hydrogenated product of the above phenolic epoxy compound is also included.
另外,該些聚環氧化合物可併用兩種以上。該些之中, 較佳為縮水甘油醚型、及縮水甘油酯型。 Further, these polyepoxy compounds may be used in combination of two or more kinds. Among these, Preferred are glycidyl ether type and glycidyl ester type.
作為氧雜環丁烷化合物,例如可列舉:C6~C20的脂肪 族系氧雜環丁烷化合物(例如3-乙基-3-羥甲基氧雜環丁烷)、C7~C30的芳香族系氧雜環丁烷化合物(例如苄基氧雜環丁烷及苯二甲基雙氧雜環丁烷)、C6~C30的脂肪族羧酸系氧雜環丁烷化合物(例如己二酸酯雙氧雜環丁烷)、C8~C30的芳香族羧酸系氧雜環丁烷化合物(例如對苯二甲酸酯雙氧雜環丁烷)、C8~C30的脂環式羧酸系氧雜環丁烷化合物(例如環己烷二羧酸雙氧雜環丁烷、3,3'-[亞甲基雙(氧基亞甲基)]雙(7-氧雜雙環[4.1.0]庚烷及3,3'-[亞乙基雙(氧基亞甲基)]雙(7-氧雜雙環[4.1.0]庚烷)、芳香族異氰酸酯系氧雜環丁烷化合物(例如亞甲基二苯基二異氰酸酯(Methylene Diphenyl Diisocyanate、MDI)雙氧雜環丁烷)、C2~ C20的硫系氧雜環丁烷化合物(例如環硫乙烷、2-甲基環硫乙烷、2,2-二甲基環硫乙烷、2-己基環硫乙烷及2-苯基環硫乙烷)。 Examples of the oxetane compound include C6 to C20 fat. a family of oxetane compounds (eg 3-ethyl-3-hydroxymethyl oxetane), C7-C30 aromatic oxetane compounds (eg benzyl oxetane and Benzene dimethyl dioxetane), C6-C30 aliphatic carboxylic acid oxetane compound (for example, adipate dioxetane), C8-C30 aromatic carboxylic acid system An oxetane compound (for example, terephthalate dioxetane), a C8 to C30 alicyclic carboxylic acid oxetane compound (for example, a cyclohexanedicarboxylic acid dioxyheterocycle) Butane, 3,3'-[methylenebis(oxymethylene)]bis(7-oxabicyclo[4.1.0]heptane and 3,3'-[ethylenebis(oxy) Methyl)]bis(7-oxabicyclo[4.1.0]heptane), aromatic isocyanate oxetane compound (for example, Methylene Diphenyl Diisocyanate, MDI) Cyclobutane), C2~ a sulfur-based oxetane compound of C20 (e.g., ethylene sulfide, 2-methylcycloethane, 2,2-dimethylcycloethane, 2-hexylcycloethane, and 2-phenyl) Ethylene sulfide).
另外,作為聚合性樹脂C,例如可列舉多官能性丙烯酸 系單體或寡聚物。 Further, examples of the polymerizable resin C include polyfunctional acrylic acid. A monomer or oligomer.
作為二官能性丙烯酸系單體的化合物,例如可列舉:1,3- 丁二醇二(甲基)丙烯酸酯、1,4-丁二醇二(甲基)丙烯酸酯、1,6-己二醇二(甲基)丙烯酸酯、聚乙二醇二(甲基)丙烯酸酯、二乙二醇二(甲基)丙烯酸酯、新戊二醇二(甲基)丙烯酸酯、三乙二醇二(甲基)丙烯酸酯、三丙二醇二(甲基)丙烯酸酯、羥基三甲基乙酸酯新戊二醇二(甲基)丙烯酸酯、三羥甲基丙烷二(甲基)丙烯酸酯、雙[(甲基)丙烯醯氧基乙氧基]雙酚A、雙[(甲基)丙烯醯氧基乙氧基]四溴雙酚A、雙[(甲基)丙烯醯氧基聚乙氧基]雙酚A、1,3-雙(羥乙基)5,5-二甲基乙內醯脲、3-甲基戊二醇二(甲基)丙烯酸酯、羥基三甲基乙酸酯新戊二醇化合物的二(甲基)丙烯酸酯、雙[(甲基)丙烯醯氧基丙基]四甲基二矽氧烷等二(甲基)丙烯酸酯系單體及二乙烯基苯。 Examples of the compound of the difunctional acrylic monomer include 1,3- Butanediol di(meth)acrylate, 1,4-butanediol di(meth)acrylate, 1,6-hexanediol di(meth)acrylate, polyethylene glycol di(methyl) Acrylate, diethylene glycol di(meth)acrylate, neopentyl glycol di(meth)acrylate, triethylene glycol di(meth)acrylate, tripropylene glycol di(meth)acrylate, hydroxyl Trimethyl acetate neopentyl glycol di(meth)acrylate, trimethylolpropane di(meth)acrylate, bis[(meth)acryloxyethoxyethoxy]bisphenol A, double [(Meth)acryloxyethoxyethoxy]tetrabromobisphenol A, bis[(meth)acryloxypolyethoxy]bisphenol A, 1,3-bis(hydroxyethyl)5, Bis(methyl) acrylate of 5-dimethylhydantoin, 3-methylpentanediol di(meth)acrylate, hydroxytrimethylacetate neopentyl glycol compound, double [(A) A di(meth)acrylate monomer such as acryloxypropyl]tetramethyldioxane and divinylbenzene.
另外,例如可列舉:(聚)氧乙烯(較佳為聚合度=4~ 20)二(甲基)丙烯酸酯、(聚)氧丙烯(較佳為聚合度=4~15)二(甲基)丙烯酸酯、聚四亞甲基二醇(較佳為聚合度=4~12)二(甲基)丙烯酸酯、(聚)氧乙烯(較佳為聚合度=4~8)化雙酚A.二(甲基)丙烯酸酯、(聚)氧丙烯(較佳為聚合度=4~6)化雙酚A.二(甲基)丙烯酸酯、(聚)氧乙烯(較佳為聚合度=4~8)化氫化雙酚A.二(甲基)丙烯酸酯及(聚)氧丙烯(較佳為聚合度=4~6)化氫化雙酚A. 二(甲基)丙烯酸酯。 Further, for example, (poly)oxyethylene (preferably, polymerization degree = 4~) 20) di(meth)acrylate, (poly)oxypropylene (preferably degree of polymerization = 4 to 15) di(meth)acrylate, polytetramethylene glycol (preferably degree of polymerization = 4~) 12) Di(meth)acrylate, (poly)oxyethylene (preferably degree of polymerization = 4-8) bisphenol A. Di(meth)acrylate, (poly)oxypropylene (preferably degree of polymerization = 4-6) bisphenol A. Di(meth)acrylate, (poly)oxyethylene (preferably degree of polymerization = 4-8) hydrogenated bisphenol A. Di(meth)acrylate and (poly)oxypropylene (preferably degree of polymerization = 4-6) hydrogenated bisphenol A. Di(meth)acrylate.
作為三官能性丙烯酸系單體的化合物,例如可列舉:三 羥甲基丙烷三(甲基)丙烯酸酯、季戊四醇三(甲基)丙烯酸酯、季戊四醇四(甲基)丙烯酸酯、二季戊四醇單羥基五(甲基)丙烯酸酯、三(2-羥乙基異氰酸酯)三(甲基)丙烯酸酯、三(二乙二醇)三(甲基)丙烯酸酯、3,7,14-三[(((甲基)丙烯醯氧基丙基)二甲基矽烷氧基)]-1,3,5,7,9,11,14-七乙基三環[7.3.3.15.11]七矽氧烷、3,7,14-三[(((甲基)丙烯醯氧基丙基)二甲基矽烷氧基)]-1,3,5,7,9,11,14-七異丁基三環[7.3.3.15.11]七矽氧烷、3,7,14-三[(((甲基)丙烯醯氧基丙基)二甲基矽烷氧基)]-1,3,5,7,9,11,14-七異辛基三環[7.3.3.15.11]七矽氧烷、3,7,14-三[(((甲基)丙烯醯氧基丙基)二甲基矽烷氧基)]-1,3,5,7,9,11,14-七環戊基三環[7.3.3.15.11]七矽氧烷及3,7,14-三[(((甲基)丙烯醯氧基丙基)二甲基矽烷氧基)]-1,3,5,7,9,11,14-七苯基三環[7.3.3.15.11]七矽氧烷。 Examples of the compound of the trifunctional acrylic monomer include, for example, three. Hydroxymethylpropane tri(meth)acrylate, pentaerythritol tri(meth)acrylate, pentaerythritol tetra(meth)acrylate, dipentaerythritol monohydroxypenta(meth)acrylate, tris(2-hydroxyethyl isocyanate) Tris(meth)acrylate, tris(diethylene glycol)tri(meth)acrylate, 3,7,14-tris[(((methyl)propenyloxypropyl)dimethyl decyloxy) Base]]-1,3,5,7,9,11,14-heptyltricyclo[7.3.3.15.11] heptaoxane, 3,7,14-tri[(((meth)propene)醯oxypropyl) dimethyl decyloxy)]-1,3,5,7,9,11,14-heptylbutyltricyclo[7.3.3.15.11] heptaoxane, 3,7 , 14-tris[(((methyl) propyleneoxypropyl) dimethyl decyloxy)]-1,3,5,7,9,11,14-heptyloctyltricyclo[7.3. 3.15.11] heptaoxane, 3,7,14-tri[(((methyl)propenyloxypropyl)dimethylamoxy)]-1,3,5,7,9,11 , 14-heptacyclopentyltricyclo[7.3.3.15.11] heptaoxane and 3,7,14-tri[(((methyl)propenyloxypropyl)dimethylamyloxy)]] -1,3,5,7,9,11,14-heptaphenyltricyclo[7.3.3.15.11] heptaoxane.
此外,例如可列舉:甲基丙烯酸縮水甘油酯、甲基丙烯 酸2-甲基-縮水甘油酯、甲基丙烯酸環氧化異戊烯酯、甲基丙烯酸3,4-環氧環己基甲酯、2-(羥甲基)丙烯酸乙酯、1-烯丙基-2,3-環氧基丙烷、2-丙烯醯胺-2-甲基丙磺酸、N,N'-二丙烯醯基-1,2-二羥基乙二胺、丙烯酸2-羥基乙酯、N,N'-亞甲基雙丙烯醯胺或N-丙烯醯氧基琥珀醯亞胺的單體。 Further, for example, glycidyl methacrylate or methacrylic acid may be mentioned. Acid 2-methyl-glycidyl ester, epoxidized isoamyl methacrylate, 3,4-epoxycyclohexylmethyl methacrylate, ethyl 2-(hydroxymethyl)acrylate, 1-allyl -2,3-epoxypropane, 2-propenylamine-2-methylpropanesulfonic acid, N,N'-dipropenyl-1,2-dihydroxyethylenediamine, 2-hydroxyethyl acrylate a monomer of N,N'-methylenebispropenylamine or N-propylenenonoxysuccinimide.
於本發明的樹脂組成物中可添加硬化促進劑、紫外線吸 收劑或抗氧化劑,進而亦可調配下述成分。 A hardening accelerator and ultraviolet light absorber may be added to the resin composition of the present invention. The following ingredients can also be formulated with a receiving agent or an antioxidant.
(1)粉末狀的補強劑或填充劑。例如可列舉:氧化鋯(ZrO2)、氧化鈦(TiO2)、氧化鋁(Al2O3)、奈米二氧化矽(SiO2)及氧化鋅(ZnO2)等高折射率金屬氧化物等金屬氧化物,微粉末二氧化矽、熔融二氧化矽及結晶二氧化矽等矽化合物,玻璃珠等透明填料,氫氧化鋁等金屬氫氧化物,高嶺土,雲母,石英粉末,石墨以及二硫化鉬。尤其藉由添加奈米二氧化矽,而可增加表面處理後的SiO2成分的絕對量,並變化成更加親水性的表面。於無損本發明的樹脂組成物的透明性的範圍內調配該些成分。以相對於本發明的樹脂組成物總量的質量比計,調配該些成分時的較佳的比例為0.10~1.0的範圍。 (1) A powdery reinforcing agent or filler. For example, high refractive index metal oxides such as zirconium oxide (ZrO 2 ), titanium oxide (TiO 2 ), aluminum oxide (Al 2 O 3 ), nano cerium oxide (SiO 2 ), and zinc oxide (ZnO 2 ) may be mentioned. Metal oxides, fine powders such as cerium oxide, molten cerium oxide and crystalline cerium oxide, transparent fillers such as glass beads, metal hydroxides such as aluminum hydroxide, kaolin, mica, quartz powder, graphite and disulfide molybdenum. In particular, by adding nano cerium oxide, the absolute amount of the SiO 2 component after the surface treatment can be increased and changed to a more hydrophilic surface. These components are blended in a range that does not impair the transparency of the resin composition of the present invention. A preferred ratio when the components are blended with respect to the mass ratio of the total amount of the resin composition of the present invention is in the range of 0.10 to 1.0.
(2)著色劑或顏料。例如可列舉:二氧化鈦、鉬紅、 鐵藍、群青、鎘黃、鎘紅及有機色素。 (2) A colorant or pigment. For example, titanium dioxide, molybdenum red, Iron blue, ultramarine blue, cadmium yellow, cadmium red and organic pigments.
(3)阻燃劑。例如可列舉:三氧化銻、溴化合物及磷化合物。 (3) Flame retardant. For example, antimony trioxide, a bromine compound, and a phosphorus compound are mentioned.
(4)離子吸附體。 (4) Ion absorbing body.
以相對於樹脂組成物總量的質量比計,調配該些成分時的較佳的比例為0.0001~0.30。 A preferred ratio when the components are blended in a mass ratio with respect to the total amount of the resin composition is 0.0001 to 0.30.
(5)分子內不含環氧基、氧雜環丁基的矽烷偶合劑。 (5) A decane coupling agent containing no epoxy group or oxetanyl group in the molecule.
(6)氧化鋯、二氧化鈦、氧化鋁或二氧化矽等金屬氧化物的奈米粒子分散液。 (6) A nanoparticle dispersion of a metal oxide such as zirconium oxide, titanium oxide, aluminum oxide or cerium oxide.
以相對於樹脂組成物總量的質量比計,調配上述(1)~(6)的成分時的較佳的比例為0.01~0.50。 A preferred ratio when the components of the above (1) to (6) are blended in a mass ratio with respect to the total amount of the resin composition is 0.01 to 0.50.
本發明的樹脂組成物是包含選自構成單元A及構成單 元B中的至少一種、與聚合性樹脂C,上述構成單元A源自分子內具有一個加成聚合性官能基的氟倍半矽氧烷,上述構成單元B源自不含氟倍半矽氧烷且分子內具有多個聚合性官能基的倍半矽氧烷,上述樹脂的結構可為嵌段共聚物,亦可為無規共聚物,但必須具有交聯結構。 The resin composition of the present invention comprises a component selected from the constituent unit A and a constituent sheet At least one of the element B and the polymerizable resin C, the structural unit A is derived from a fluorosilsesquioxane having an addition polymerizable functional group in the molecule, and the constituent unit B is derived from a fluorine-free sesquioxide The alkane and a sesquioxane having a plurality of polymerizable functional groups in the molecule, and the resin may have a structure of a block copolymer or a random copolymer, but must have a crosslinked structure.
本發明的樹脂組成物中的構成單元A與構成單元B及聚 合性樹脂C的質量比率較佳為處於(A):(B)=0:100~100:0、(B):(C)=5:95~99:1的範圍內。當使用多種單體化合物時,各個單體的比率只要對應於作為目標的樹脂組成物的特性而適宜決定即可。另一方面,為了使樹脂組成物變成被膜狀,並於短時間內使其表面親水化,較佳為相對於樹脂組成物整體質量,將含有倍半矽氧烷的構成單元A及/或構成單元B的質量比率維持在較佳為10份~80份,更佳為20份~80份的範圍內。 The constituent unit A and the constituent unit B in the resin composition of the present invention The mass ratio of the conjugate resin C is preferably in the range of (A): (B) = 0: 100 to 100: 0, (B): (C) = 5: 95 to 99: 1. When a plurality of monomer compounds are used, the ratio of each monomer may be appropriately determined in accordance with the characteristics of the intended resin composition. On the other hand, in order to make the resin composition into a film shape and to hydrophilize the surface in a short time, it is preferred to form a constituent unit A and/or a composition containing sesquiterpene oxide with respect to the entire mass of the resin composition. The mass ratio of the unit B is maintained in the range of preferably from 10 parts to 80 parts, more preferably from 20 parts to 80 parts.
本發明的樹脂組成物中所含有的聚合性樹脂C的質量比率並無特別限制,但為了形成表面經親水化的硬化膜,較佳為選擇多官能性環氧化物或親水性的多官能性丙烯酸化合物作為樹脂組成物的共聚合成分。 The mass ratio of the polymerizable resin C contained in the resin composition of the present invention is not particularly limited, but in order to form a cured film having a hydrophilized surface, it is preferred to select a polyfunctional epoxide or a hydrophilic polyfunctionality. The acrylic compound is used as a copolymerization component of the resin composition.
本發明的樹脂組成物可進一步含有稀釋劑。 The resin composition of the present invention may further contain a diluent.
作為稀釋劑,可使用有機溶劑或分子內不含矽原子的液狀環氧化合物、或分子內不含矽的液狀氧雜環丁烷化合物。再者,於本發明中,有時將分別於1分子中具有2個以上的官能基的化合物稱為環氧樹脂、氧雜環丁烷樹脂。 As the diluent, an organic solvent or a liquid epoxy compound containing no ruthenium atoms in the molecule or a liquid oxetane compound containing no ruthenium in the molecule can be used. Further, in the present invention, a compound having two or more functional groups in one molecule may be referred to as an epoxy resin or an oxetane resin.
若使用分子內不含矽原子的環氧樹脂、或分子內不含矽 的氧雜環丁烷樹脂作為稀釋劑,則因硬化劑而與本發明的有機矽化合物一同得到硬化,故較佳。 If an epoxy resin containing no ruthenium atoms in the molecule is used, or ruthenium is not contained in the molecule The oxetane resin is preferred as a diluent because it is hardened together with the organic hydrazine compound of the present invention by a curing agent.
作為上述分子內不含矽原子的環氧樹脂的具體例,可列 舉:雙酚-A型、雙酚-F型、雙酚-S型、經氫化的雙酚-A型等的環氧樹脂,大賽璐(Daicel)化學工業(股份)製造的Celloxide(商品名)2021P、Celloxide(商品名)3000、Celloxide(商品名)2081等脂環式環氧樹脂。 Specific examples of the epoxy resin containing no ruthenium atom in the molecule may be listed Acetone: epoxide-A type, bisphenol-F type, bisphenol-S type, hydrogenated bisphenol-A type epoxy resin, Celloxide (trade name) manufactured by Daicel Chemical Industry Co., Ltd. ) 2021P, Celloxide (trade name) 3000, Celloxide (trade name) 2081 and other alicyclic epoxy resins.
另外,作為分子內不含矽的氧雜環丁烷樹脂的具體例, 可列舉東亞合成(股份)製造的ARONE OXETANE(註冊商標)等氧雜環丁烷樹脂。另外,可列舉分子內含有環氧基或氧雜環丁基的矽烷偶合劑。作為上述矽烷偶合劑的具體例,可列舉:捷恩智(JNC)(股份)製造的SILA-ACE(商品名)S510、S520及S530等矽烷偶合劑。 Further, as a specific example of the oxetane resin containing no antimony in the molecule, An oxetane resin such as ARONE OXETANE (registered trademark) manufactured by Toagosei Co., Ltd. can be cited. Further, a decane coupling agent containing an epoxy group or an oxetanyl group in the molecule may be mentioned. Specific examples of the decane coupling agent include a decane coupling agent such as SILA-ACE (trade name) S510, S520, and S530 manufactured by JC (product).
本發明的樹脂組成物的重量平均分子量雖然根據構成 單元C的含有率等而不同,但為1000~100萬。另一方面,本發明的聚合物的分子量分佈(Mw/Mn)為1.01~2.5左右。 The weight average molecular weight of the resin composition of the present invention is based on the constitution The content rate of the unit C is different, but it is 1,000 to 1,000,000. On the other hand, the polymer of the present invention has a molecular weight distribution (Mw/Mn) of about 1.01 to 2.5.
樹脂組成物的製備方法雖然根據構成單元A~構成單元 B的種類與該些構成單元的比率、及作為目標的樹脂組成物的特性而不同,但若鑒於簡便性與通用性,則較佳為於硬化步驟的一部分中採用自由基聚合或陽離子聚合。另外,階段性地採用自由基聚合與陽離子聚合無任何問題。於本發明中,較佳為於硬化步 驟的初始階段使用陽離子聚合起始劑。 The preparation method of the resin composition is based on the constituent unit A~ constituent unit The type of B differs from the ratio of the constituent units and the characteristics of the intended resin composition. However, in view of simplicity and versatility, it is preferred to employ radical polymerization or cationic polymerization in a part of the curing step. In addition, there are no problems in the use of radical polymerization and cationic polymerization in stages. In the present invention, it is preferred to harden the step A cationic polymerization initiator is used in the initial stage of the step.
作為陽離子聚合起始劑,例如可列舉:藉由活性能量線 而產生陽離子種或路易斯酸的活性能量線陽離子聚合起始劑、及藉由熱而產生陽離子種或路易斯酸的熱陽離子聚合起始劑。 As a cationic polymerization initiator, for example, an active energy ray is exemplified An active energy ray cationic polymerization initiator which produces a cationic species or a Lewis acid, and a thermal cationic polymerization initiator which generates a cationic species or a Lewis acid by heat.
作為活性能量線陽離子聚合起始劑,例如可列舉:金屬 氟硼錯鹽及三氟化硼錯合物(美國專利第3379653號說明書)、雙(全氟烷基磺醯基)甲烷金屬鹽(美國專利第3586616號說明書)、芳基重氮化合物(美國專利第3708296號說明書)、VIa族元素的芳香族鎓鹽(美國專利第4058400號說明書)、Va族元素的芳香族鎓鹽(美國專利第4069055號說明書)、IIIa族元素~Va族元素的二羰基螯合物(美國專利第4068091號說明書)、硫代吡喃鎓鹽(美國專利第4139655號說明書)、MF6-陰離子的形態的VIb族元素(美國專利第4161478號說明書;M自磷、銻及砷中選擇)、芳基鋶錯鹽(美國專利第4231951號說明書)、芳香族錪錯鹽及芳香族鋶錯鹽(美國專利第4256828號說明書)、以及雙[4-(二苯基鋶基)苯基]硫化物-雙-六氟金屬鹽[聚合物科學,聚合物化學雜誌(Journal of Polymer Science,Polymer Chemistry),第2卷,1789項(1984年)]。 此外,例如可列舉鐵化合物的混合配位體金屬鹽及矽烷醇-鋁錯合物。 As the active energy cation polymerization initiator, for example, a metal is exemplified Fluoroboron salt and boron trifluoride complex (U.S. Patent No. 3,375,653), bis(perfluoroalkylsulfonyl)methane metal salt (US Patent No. 3,586,616), aryldiazo compound (USA) Patent No. 3,708,296), aromatic sulfonium salt of Group VIa (U.S. Patent No. 4058400), aromatic sulfonium salt of Group Va element (U.S. Patent No. 4,609,905), Group IIIa to Va a carbonyl chelate (U.S. Patent No. 4,406,091), a thiopyranium salt (U.S. Patent No. 4,139,655), a group VIb element of the form of MF6-anion (U.S. Patent No. 4,161,478; M from phosphorus, cesium) And arsenic selected), aryl sulfonium salt (US Patent No. 4231951), aromatic sulfonium salts and aromatic sulfonium salts (US Patent No. 4256828), and bis[4-(diphenyl fluorene) Phenyl]sulfide-bis-hexafluorometal salt [Journal of Polymer Science, Polymer Chemistry, Vol. 2, item 1789 (1984)]. Further, for example, a mixed ligand metal salt of an iron compound and a stanol-aluminum complex are mentioned.
較佳的活性能量線陽離子聚合起始劑的例子為芳基鋶 錯鹽,含有鹵素的錯離子的芳香族鋶鹽或芳香族錪鹽,以及II族元素、V族元素及VI族元素的芳香族鎓鹽。該些鹽的幾種可作為 商品而獲得。 An example of a preferred active energy cation polymerization initiator is aryl hydrazine. A salt, an aromatic sulfonium salt or an aromatic sulfonium salt containing a halogen ion, and an aromatic sulfonium salt of a Group II element, a Group V element, and a Group VI element. Several of these salts can be used as Obtained from the goods.
作為熱陽離子聚合起始劑,例如可使用如三氟甲磺酸(Triflic acid)鹽、三氟化硼等般的陽離子系觸媒或質子酸觸媒。作為較佳的熱陽離子聚合起始劑,例如可列舉三氟甲磺酸鹽。 As the thermal cationic polymerization initiator, for example, a cationic catalyst such as trifluoromethanesulfonic acid salt or boron trifluoride or a protonic acid catalyst can be used. As a preferable thermal cationic polymerization initiator, a trifluoromethanesulfonate is mentioned, for example.
作為三氟甲磺酸鹽,例如可列舉:三氟甲磺酸二乙基銨、三氟甲磺酸二異丙基銨、及三氟甲磺酸乙基二異丙基銨。 Examples of the trifluoromethanesulfonate include diethylammonium trifluoromethanesulfonate, diisopropylammonium trifluoromethanesulfonate, and ethyldiisopropylammonium trifluoromethanesulfonate.
另一方面,亦可用作活性能量線陽離子聚合起始劑的芳香族鎓鹽之中,有藉由熱而產生陽離子種者,該些亦可用作熱陽離子聚合起始劑。 On the other hand, among the aromatic onium salts which can also be used as an active energy ray cationic polymerization initiator, there are those which generate a cationic species by heat, and these can also be used as a thermal cationic polymerization initiator.
該些陽離子聚合起始劑之中,就處理性及潛在性與硬化性的平衡優異這一點而言,較佳為芳香族鎓鹽,其中,就處理性及潛在性的平衡優異這一點而言,較佳為重氮鹽、錪鹽、鋶鹽及鏻鹽。陽離子聚合起始劑可單獨使用、或將2種以上組合使用。 Among these cationic polymerization initiators, an aromatic sulfonium salt is preferred in terms of excellent balance between handleability and potential and curability, and in terms of excellent balance between handleability and potential Preferred are diazonium salts, phosphonium salts, phosphonium salts and phosphonium salts. The cationic polymerization initiators may be used singly or in combination of two or more.
以相對於所使用的環氧樹脂換算的合計量的質量比計,陽離子聚合起始劑的較佳的使用比例為0.0005~0.05。 The preferred ratio of use of the cationic polymerization initiator is 0.0005 to 0.05, based on the total mass ratio of the epoxy resin used.
包含構成單元A、及構成單元B的至少一者與聚合性樹脂C的本發明的樹脂組成物於由自由基聚合性的單體來製造的情況下,可使用自由基聚合起始劑來進行。 When the resin composition of the present invention containing at least one of the structural unit A and the constituent unit B and the polymerizable resin C is produced from a radical polymerizable monomer, a radical polymerization initiator can be used. .
作為自由基聚合起始劑,例如可列舉:2,2'-偶氮雙異丁腈、2,2'-偶氮雙(2,4-二甲基戊腈)、2,2'-偶氮雙(2-丁腈)、二甲基-2,2'-偶氮雙異丁酸酯、1,1'-偶氮雙(環己烷-1-碳腈)等偶氮化合物;苯甲醯基過氧化物、月桂基過氧化物、辛醯基過氧化物、乙醯基過氧 化物、二-第三丁基過氧化物、第三丁基枯基過氧化物、二枯基過氧化物、過氧化乙酸第三丁酯、過氧化苯甲酸第三丁酯、過氧化新癸酸第三丁酯等過氧化物;及四乙基秋蘭姆二硫化物等二硫代胺基甲酸酯。 Examples of the radical polymerization initiator include 2,2'-azobisisobutyronitrile, 2,2'-azobis(2,4-dimethylvaleronitrile), and 2,2'-couple. An azo compound such as nitrogen bis(2-butyronitrile), dimethyl-2,2'-azobisisobutyrate or 1,1'-azobis(cyclohexane-1-carbonitrile); benzene Formyl peroxide, lauryl peroxide, octyl peroxide, acetyl peroxy , di-tert-butyl peroxide, tert-butyl cumyl peroxide, dicumyl peroxide, tert-butyl peroxyacetate, tert-butyl peroxybenzoate, neodymium peroxide a peroxide such as a third butyl ester; and a dithiocarbamate such as tetraethylthiuram disulfide.
進而,作為聚合反應,例如可列舉:活性自由基聚合、 及活性能量線聚合。 Further, examples of the polymerization reaction include living radical polymerization, And active energy ray polymerization.
於本發明中,所謂活性能量線,是指可使產生活性種的 化合物分解而產生活性種的能量線。作為此種活性能量線,例如可列舉:可見光、紫外線、紅外線、X射線、α射線、β射線、γ射線或電子束等光能量線。 In the present invention, the term "active energy ray" means that the active species can be produced. The compound decomposes to produce an energy line of the active species. Examples of such an active energy ray include light energy rays such as visible light, ultraviolet light, infrared light, X-rays, alpha rays, beta rays, gamma rays, and electron beams.
作為活性能量線聚合起始劑的具體例,只要是藉由紫外 線或可見光線的照射而產生自由基的化合物,則並無特別限定。 作為可用作活性能量線聚合起始劑的化合物,例如可列舉:二苯基酮、米其勒酮、4,4'-雙(二乙胺基)二苯甲酮、氧雜蒽酮、硫雜蒽酮及異丙基氧雜蒽酮。 Specific examples of the active energy ray polymerization initiator are as long as they are ultraviolet The compound which generates a radical by irradiation of a line or visible light is not specifically limited. Examples of the compound usable as the active energy ray polymerization initiator include diphenyl ketone, rice ketone, 4,4′-bis(diethylamino)benzophenone, xanthone, Xanthone and isopropyl xanthone.
包含本發明的樹脂組成物的被膜、及具有被膜的成形體 可藉由如下步驟而獲得:於基板上由本發明的樹脂組成物形成膜的步驟、使該膜硬化的步驟及對膜進行表面處理的步驟。膜的形成例如可藉由塗佈來進行,膜的硬化通常可藉由乾燥、加熱、及活性能量線照射的一種或兩種以上來進行。 Film comprising the resin composition of the present invention, and a molded body having the film The step of forming a film from the resin composition of the present invention on the substrate, the step of hardening the film, and the step of surface-treating the film can be obtained by the following steps. The formation of the film can be carried out, for example, by coating, and the curing of the film can be usually carried out by one or two or more kinds of drying, heating, and active energy ray irradiation.
作為將含有本發明的樹脂組成物的溶液塗佈於基板的 方法,並無特別限制,例如可列舉:旋塗法、輥塗法、狹縫塗佈 法、浸漬法、噴塗法、凹版塗佈法、反向塗佈法、桿塗法、棒塗法、模塗法、接觸塗佈法、反向接觸塗佈法、氣刀塗佈法及簾塗法。 Applying a solution containing the resin composition of the present invention to a substrate The method is not particularly limited, and examples thereof include spin coating, roll coating, and slit coating. Method, dipping method, spray coating method, gravure coating method, reverse coating method, rod coating method, bar coating method, die coating method, contact coating method, reverse contact coating method, air knife coating method and curtain Coating method.
作為被塗佈的基板,例如可列舉:白板玻璃、青板玻璃、 塗佈有二氧化矽的青板玻璃等透明玻璃基板;聚碳酸酯、聚酯、丙烯酸樹脂、氯乙烯樹脂、芳香族聚醯胺樹脂、聚醯胺醯亞胺、聚醯亞胺、三乙酸酯、二乙酸酯等合成樹脂製片材、膜;含有降冰片烯系樹脂的環烯烴系樹脂(例如,商品名:Zeonor、Zeonex,日本瑞翁(Zeon)股份有限公司製造,商品名:Arton,JSR股份有限公司製造)、甲基丙烯酸苯乙烯、聚碸、脂環式丙烯酸樹脂或聚芳酯等用於光學用途的透明樹脂基板;鋁板、銅板、鎳板或不鏽鋼板等金屬基板;其他陶瓷板、具有光電轉換元件的半導體基板;胺基甲酸酯橡膠、苯乙烯橡膠。 Examples of the substrate to be coated include white glass and blue glass. Transparent glass substrate such as cyanide glass coated with cerium oxide; polycarbonate, polyester, acrylic resin, vinyl chloride resin, aromatic polyamide resin, polyamidimide, polyimine, triethyl A synthetic resin sheet or film such as an acid ester or a diacetate; or a cycloolefin resin containing a norbornene-based resin (for example, trade name: Zeonor, Zeonex, Japan Zeon Co., Ltd., trade name) : Arton, manufactured by JSR Co., Ltd.), transparent resin substrate for optical applications such as styrene methacrylate, polystyrene, alicyclic acrylic resin or polyarylate; metal substrate such as aluminum plate, copper plate, nickel plate or stainless steel plate Other ceramic plates, semiconductor substrates with photoelectric conversion elements; urethane rubber, styrene rubber.
該些基板亦可進行前處理,作為前處理,例如可列舉: 利用矽烷偶合劑等的化學品處理、噴砂處理、電暈放電處理、紫外線處理、電漿處理、離子鍍、濺鍍、氣相反應法及真空蒸鍍。 所塗佈的溶液的乾燥可於室溫~約200℃的環境下進行。 The substrates may also be pretreated, and as a pretreatment, for example, Chemical treatment such as decane coupling agent, sandblasting treatment, corona discharge treatment, ultraviolet treatment, plasma treatment, ion plating, sputtering, gas phase reaction, and vacuum evaporation. The drying of the applied solution can be carried out at room temperature to about 200 °C.
當使用活性能量線聚合起始劑時,於塗佈乾燥後,可藉 由活性能量線源來照射光活性能量線或電子束而使活性能量線聚合起始劑硬化。 When the active energy ray polymerization initiator is used, after the coating is dried, it can be borrowed The active energy ray energy initiator or electron beam is irradiated by an active energy ray source to harden the active energy ray polymerization initiator.
作為活性能量線源,對應於所使用的活性能量線聚合起 始劑的性質,例如可列舉:低壓水銀燈、高壓水銀燈、超高壓水 銀燈、金屬鹵化物燈、碳弧、氙弧、氣體雷射、固態雷射及電子束照射裝置。 As an active energy ray source, corresponding to the active energy ray polymerization used The properties of the initiator are, for example, low pressure mercury lamps, high pressure mercury lamps, and ultra high pressure water. Silver lamps, metal halide lamps, carbon arcs, xenon arcs, gas lasers, solid state lasers, and electron beam irradiation devices.
繼而,對經塗佈的成形體基材表面照射高能量線,藉此 對成形體進行表面處理。作為表面處理,較佳為選自臭氧處理及紫外線照射處理中的至少一種處理。作為紫外線照射處理,較佳為能量高的深紫外線(UV)的照射,光源通常使用發出185nm與254nm的光的低壓水銀燈、及發出172nm的光的氙準分子燈。 Then, the surface of the coated shaped body substrate is irradiated with a high energy line, whereby The shaped body is subjected to surface treatment. As the surface treatment, at least one selected from the group consisting of ozone treatment and ultraviolet irradiation treatment is preferred. As the ultraviolet irradiation treatment, deep ultraviolet (UV) irradiation with high energy is preferred, and a low-pressure mercury lamp that emits light at 185 nm and 254 nm and a krypton excimer lamp that emits light at 172 nm are generally used as the light source.
當所照射的UV光的能量高於有機化合物的分子鍵結能 量時,分子鍵結斷開的概率變高,但240nm以下的波長的深紫外線會使氧分解,因此172nm的射線與185nm的射線下會自氧中生成臭氧。 When the energy of the irradiated UV light is higher than the molecular bonding energy of the organic compound At the time of the measurement, the probability of the molecular bond being broken is high, but deep ultraviolet rays having a wavelength of 240 nm or less decompose the oxygen, so that 172 nm radiation and 185 nm radiation generate ozone from oxygen.
254nm的深紫外線使臭氧分解,而生成高能量的活性 氧。若C-H鍵斷開,則H原子立即被抽出。活性氧與該有機化合物進行反應,而於表面形成CO或CO(OH)等富含氧的官能基、或者使化合物的官能基分解。即,氧自由基具有極性,可增加表面能來提高親水性,從而增強依存於親水性的接著力。 254nm deep ultraviolet light decomposes ozone to generate high energy activity oxygen. If the C-H bond is broken, the H atom is immediately extracted. The active oxygen reacts with the organic compound to form an oxygen-rich functional group such as CO or CO(OH) on the surface, or to decompose the functional group of the compound. That is, the oxygen radical has a polarity, which increases the surface energy to enhance the hydrophilicity, thereby enhancing the adhesion force depending on the hydrophilicity.
本發明的含有倍半矽氧烷衍生物的樹脂組成物將倍半 矽氧烷結構的一部分設為二氧化矽,作為此處所使用的高能量線,例如可列舉:電子束、紫外線、X射線、紅外線及微波。該些之中,較佳為紫外線,通常,作為波長為200nm~350nm的波長區域的紫外線的深紫外線會產生臭氧,故更佳。 The resin composition containing the sesquiterpene oxide derivative of the present invention will be halved A part of the siloxane structure is cerium oxide. Examples of the high energy ray used herein include an electron beam, ultraviolet rays, X-rays, infrared rays, and microwaves. Among these, ultraviolet rays are preferable, and in general, deep ultraviolet rays which are ultraviolet rays having a wavelength in the wavelength range of 200 nm to 350 nm generate ozone, which is more preferable.
高能量線照射較佳為於空氣中或含有氧氣的氣體中進 行。作為氧氣以外的氣體,例如可列舉氮氣及氬氣。照射高能量線時的溫度及朝二氧化矽的轉化溫度較佳為可儘可能抑制低分子量倍半矽氧烷系樹脂的飛散的溫度,較佳為10℃~50℃的範圍內。 High-energy line irradiation is preferably carried out in air or a gas containing oxygen. Row. Examples of the gas other than oxygen include nitrogen gas and argon gas. The temperature at the time of irradiation of the high-energy ray and the conversion temperature to cerium oxide are preferably such a temperature as possible to suppress the scattering of the low molecular weight sesquiterpene-based resin, and it is preferably in the range of 10 ° C to 50 ° C.
為了獲得表面經親水化的硬化物,可如上述般選擇各種原材料,並採用各種步驟,但於本發明中,較佳為藉由以下的步驟來製作硬化物。 In order to obtain a cured product having a hydrophilized surface, various materials can be selected as described above, and various steps are employed. However, in the present invention, it is preferred to produce a cured product by the following procedure.
(1)對包含選自源自具有加成聚合性官能基的氟倍半矽氧烷的構成單元A及/或源自不含氟倍半矽氧烷、且分子內具有多個聚合性官能基的倍半矽氧烷的構成單元B中的至少一種、與聚合性樹脂C(例如多官能性單體)的樹脂組成物進行攪拌混合,進而添加陽離子聚合起始劑並較佳為於室溫~50℃下進行混合溶解。 (1) comprising a constituent unit A selected from a fluorosilsesquioxane having an addition polymerizable functional group and/or derived from a fluorine-free sesquioxane, and having a plurality of polymerizable functional groups in the molecule At least one of the constituent units B of the sesquiterpene oxide of the group is stirred and mixed with the resin composition of the polymerizable resin C (for example, a polyfunctional monomer), and further a cationic polymerization initiator is added and preferably used in the chamber. Mix and dissolve at a temperature of ~50 °C.
(2)混合溶解後,進行減壓來消泡。然後,將混合物旋塗於玻璃等基板上,然後(a)添加熱陽離子硬化劑(陽離子聚合起始劑)作為硬化劑,較佳為於80℃~100℃下,較佳為加熱5分鐘~20分鐘,最後較佳為於120℃~160℃下,較佳為加熱30分鐘~60分鐘來進行硬化;或者(b)添加光陽離子硬化劑(陽離子聚合起始劑),較佳為利用50mJ/cm2~2000mJ/cm2的紫外線(i射線)進行較佳為0.1分鐘~60分鐘的曝光,藉此進行硬化。 (2) After mixing and dissolving, decompression is carried out to defoam. Then, the mixture is spin-coated on a substrate such as glass, and then (a) a thermal cationic hardener (cationic polymerization initiator) is added as a hardener, preferably at 80 ° C to 100 ° C, preferably for 5 minutes. 20 minutes, and finally preferably at 120 ° C to 160 ° C, preferably for 30 minutes to 60 minutes for hardening; or (b) addition of photocationic hardener (cationic polymerization initiator), preferably 50 mJ Ultraviolet rays (i-rays) of /cm 2 to 2000 mJ/cm 2 are preferably exposed to light for 0.1 minute to 60 minutes.
(3)進而對所製作的硬化物照射深紫外線來實施表面處理,藉此可獲得具有親水性表面的硬化物。 (3) Further, the cured product to be produced is subjected to a surface treatment by irradiating deep ultraviolet rays, whereby a cured product having a hydrophilic surface can be obtained.
其結果,可獲得水的接觸角未滿10°的硬化物,尤其若 相對於樹脂組成物整體質量,使含有倍半矽氧烷的構成單元A及/或構成單元B的質量比率變成較佳為10份~80份,更佳為20份~80份,則實現具有接觸角為0.1°~5°的範圍的超親水面的硬化物。 As a result, it is possible to obtain a cured product having a contact angle of water of less than 10°, especially if With respect to the overall mass of the resin composition, the mass ratio of the constituent unit A and/or the constituent unit B containing sesquiterpene oxide is preferably from 10 parts to 80 parts, more preferably from 20 parts to 80 parts, and thus A cured product of a super-hydrophilic surface having a contact angle of 0.1 to 5°.
可獲得具有藉由對本發明的樹脂組成物進行上述表面 處理而獲得的功能性表面的硬化物。作為功能性表面,可列舉:超親水性表面、阻氣層、硬塗層或耐熱性表面。 It is possible to obtain the above surface by using the resin composition of the present invention A cured surface of a functional surface obtained by treatment. As the functional surface, a superhydrophilic surface, a gas barrier layer, a hard coat layer or a heat resistant surface can be cited.
所謂超親水性表面,是指水的接觸角未滿10°的表面。 所謂阻氣層,是指水蒸氣穿透率為10-2g/m2.24hr以下的層。所謂硬塗層,是指於依據JIS K 5600-5-4(1999年)進行測定的鉛筆硬度試驗中硬度為H以上的層。所謂耐熱性表面,是指作為被膜或組成物的熱特性以玻璃轉移溫度計可達成200℃以上,以線膨脹係數計可達成50ppm/K以下的表面。 The super-hydrophilic surface refers to a surface having a contact angle of water of less than 10°. The so-called gas barrier layer means that the water vapor transmission rate is 10 -2 g/m 2 . Layers below 24hr. The hard coat layer refers to a layer having a hardness of H or more in a pencil hardness test measured in accordance with JIS K 5600-5-4 (1999). The heat-resistant surface refers to a surface which can achieve a thermal property of a film or a composition by a glass transfer thermometer of 200 ° C or more and a linear expansion coefficient of 50 ppm / K or less.
如以上般的本發明的硬化物對於基材的包覆平坦化性 優異,另外,對於具有封裝構造的電子元件的基材的階差的包埋性優異,照射高能量線後變成電絕緣性優異的二氧化矽薄膜,因此作為要求該特性的用途,例如多層半導體元件的層間絕緣膜、電子材料特別有用。 Coating flattening property of the cured product of the present invention as described above In addition, it is excellent in embedding property of a step of a substrate having an electronic component having a package structure, and is a ruthenium dioxide film having excellent electrical insulating properties after being irradiated with a high-energy ray. Therefore, for example, a multilayer semiconductor is required for such characteristics. The interlayer insulating film and electronic material of the element are particularly useful.
[實施例] [Examples]
以下,根據實施例對本發明進行更詳細的說明,但發明的範圍並不限定於該些實施例。 Hereinafter, the present invention will be described in more detail based on the examples, but the scope of the invention is not limited to the examples.
(實施例1) (Example 1)
向螺口瓶(Screw Vial)中添加日本專利特開2009-167390號公報的[合成例1]中所記載的倍半矽氧烷衍生物B「記載為(1-1)」1.8g、作為聚合性樹脂C的環氧樹脂[Celloxide CEL2021P(商品名:大賽璐(股份))]7.3g及2,2-雙(4-縮水甘油氧基苯基)丙烷(東京化成)0.9g的混合物,於70℃下加熱攪拌.溶解20分鐘,繼而添加50mg的熱陽離子聚合起始劑San-Aid SI-100作為硬化劑並使其溶解。將螺口瓶設置於自轉.公轉混合機[新基(Thinky)股份有限公司製造的除泡練太郎ARE-250(商品名)]中,進行混合.消泡,而製成樹脂組成物。將樹脂組成物的組成示於表1。 The sesquioxane derivative B described in [Synthesis Example 1] of JP-A-2009-167390 is described as "(1-1)" 1.8 g as a screw bottle (Screw Vial). a mixture of 7.3 g of an epoxy resin [Celloxide CEL2021P (trade name: Daicel) (share)) and 0.9 g of 2,2-bis(4-glycidoxyphenyl)propane (Tokyo Chemicals) of the polymerizable resin C, Heat and stir at 70 ° C. After dissolving for 20 minutes, 50 mg of a thermal cationic polymerization initiator San-Aid SI-100 was added as a hardener and dissolved. Set the screw bottle to the rotation. Mixing is carried out in a revolving mixer [Decoction Rantaro ARE-250 (trade name) manufactured by Thinky Co., Ltd.]. Defoaming is carried out to form a resin composition. The composition of the resin composition is shown in Table 1.
.[San-Aid SI-100(商品名:三新化學工業公司製造)](芳香族鋶型陽離子聚合起始劑) . [San-Aid SI-100 (trade name: manufactured by Sanshin Chemical Industry Co., Ltd.)] (aromatic cation type cationic polymerization initiator)
.[Celloxide CEL2021P(商品名:大賽璐工業)](3',4'-環氧環己基甲基-3,4-環氧環己烷羧酸酯) . [Celloxide CEL2021P (trade name: Daicel Industries)] (3',4'-epoxycyclohexylmethyl-3,4-epoxycyclohexanecarboxylate)
繼而,以氣泡不進入至樹脂組成物中的方式,於玻璃基板(40mm×40mm)上藉由旋轉塗佈機(500rpm,30秒)來塗佈成150μm的厚度,於100℃下加熱20分鐘,然後於150℃下加熱30分鐘而獲得硬化物。 Then, the bubble was applied to a glass substrate (40 mm × 40 mm) by a spin coater (500 rpm, 30 seconds) to a thickness of 150 μm, and heated at 100 ° C for 20 minutes. Then, it was heated at 150 ° C for 30 minutes to obtain a cured product.
利用光表面處理機(PHOTO SURFACE PROCESSOR)[SEN特殊光源(SEN LIGHTS)(股份)公司製造的PL2003N-12],以10mm的距離,對所獲得的硬化物表面照射深紫外線(波長為185nm/254nm,照度為14.6mW/cm2)0分鐘、1分鐘、2分鐘、5分鐘、10分鐘,並測定各自的水接觸角。水接觸角是使用接觸 角測定裝置(協和界面科學公司製造,DropMaster DM500),於將1.8μL的水滴加至硬化樹脂膜表面後,改變滴加水的位置來測定5處的水接觸角並求出平均值。再者,為了抑制由表面狀態的經時變化所產生的影響,接觸角測定是於深紫外線照射日進行測定。 將結果示於表2。 The surface of the obtained cured product was irradiated with deep ultraviolet rays at a distance of 10 mm using a light surface treatment machine (PHOTO SURFACE PROCESSOR) [PL2003N-12 manufactured by SEN LIGHTS Co., Ltd.) (wavelength: 185 nm / 254 nm) The illuminance was 14.6 mW/cm 2 ) for 0 minutes, 1 minute, 2 minutes, 5 minutes, and 10 minutes, and the respective water contact angles were measured. The water contact angle was measured by using a contact angle measuring device (DropMaster DM500, manufactured by Kyowa Interface Science Co., Ltd.), and after adding 1.8 μL of water droplets to the surface of the cured resin film, the position of the water was changed to determine the water contact angle at five points. average value. Further, in order to suppress the influence caused by the temporal change of the surface state, the contact angle measurement was performed on the day of deep ultraviolet irradiation. The results are shown in Table 2.
(比較例1) (Comparative Example 1)
添加聚合性樹脂C的混合物(Celloxide CEL2021P:8.9g,2,2-雙(4-縮水甘油氧基苯基)丙烷:1.1g),並進行加熱攪拌.溶解,繼而添加50mg的熱陽離子聚合起始劑(San-Aid SI-100)作為硬化劑並使其溶解。將螺口瓶設置於自轉.公轉混合機[新基股份有限公司製造的除泡練太郎ARE-250(商品名)]中,進行混合.消泡,而製成樹脂組成物。將樹脂組成物的組成示於表1。 A mixture of polymerizable resin C (Celloxide CEL2021P: 8.9 g, 2,2-bis(4-glycidoxyphenyl)propane: 1.1 g) was added and heated and stirred. After dissolution, 50 mg of a thermal cationic polymerization initiator (San-Aid SI-100) was added as a hardener and dissolved. Set the screw bottle to the rotation. Mixing is carried out in a revolution mixer [Decoction Rantaro ARE-250 (trade name) manufactured by Shinki Co., Ltd.]. Defoaming is carried out to form a resin composition. The composition of the resin composition is shown in Table 1.
與實施例1同樣地進行加熱硬化而獲得比較例1的樣品。其後,與實施例1同樣地,以10mm的距離照射深紫外線(185nm/254nm,照度為14.6mW/cm2)1分鐘、2分鐘、5分鐘、10分鐘,並測定各自的水接觸角。為了抑制由表面狀態的經時變化所產生的影響,接觸角測定是於深紫外線照射日進行測定。將結果示於表2。 The sample of Comparative Example 1 was obtained by heat curing in the same manner as in Example 1. Thereafter, in the same manner as in Example 1, deep ultraviolet rays (185 nm/254 nm, illuminance: 14.6 mW/cm 2 ) were irradiated for 1 minute, 2 minutes, 5 minutes, and 10 minutes at a distance of 10 mm, and the respective water contact angles were measured. In order to suppress the influence by the temporal change of the surface state, the contact angle measurement was performed on the day of deep ultraviolet irradiation. The results are shown in Table 2.
根據表2所示的結果,藉由照射深紫外線,本發明中的 含有倍半矽氧烷衍生物B(1-1)的實施例1的硬化物與不含倍半矽氧烷衍生物B(1-1)的比較例1的硬化物相比,於親水性這一點上在短時間內顯示出明顯的優越性。 According to the results shown in Table 2, by irradiating deep ultraviolet rays, the present invention The cured product of Example 1 containing the sesquioxane derivative B (1-1) was hydrophilic in comparison with the cured product of Comparative Example 1 containing no sesquioxane derivative B (1-1). This point shows obvious superiority in a short time.
因此,可知當製作硬化型被膜時,藉由陽離子聚合起始 劑或自由基聚合起始劑來對樹脂組成物進行加熱而進行預硬化,繼而於更高的溫度下藉由熱或照射能量線來進行交聯硬化,最後照射深紫外線來進行表面處理,藉此可獲得被膜強度提昇、且於短時間內具有超親水性表面的功能性膜。 Therefore, it can be seen that when a hard coat film is produced, it is initiated by cationic polymerization. Or a radical polymerization initiator to pre-harden the resin composition by heating, and then cross-link harden by heat or irradiation of energy rays at a higher temperature, and finally irradiate the deep ultraviolet rays to perform surface treatment. This makes it possible to obtain a functional film having an enhanced film strength and having a super-hydrophilic surface in a short time.
雖然使用特定的形態對本發明進行了詳細說明,但對 於本領域從業人員而言明確的是,可不脫離本發明的意圖與範圍而進行各種變更及變形。再者,本申請基於2013年1月25日所申請的日本專利申請(日本專利特願2013-012113),並藉由引用 而援引其全部內容。 Although the invention has been described in detail using specific embodiments, It is apparent to those skilled in the art that various changes and modifications may be made without departing from the spirit and scope of the invention. In addition, this application is based on a Japanese patent application filed on Jan. 25, 2013 (Japanese Patent Application No. 2013-012113) And quote all of its contents.
藉由對本發明的樹脂組成物進行表面處理而獲得的硬化物的親水性、熱穩定性、物理強度、均勻性及表面特性等優異,於阻氣膜或電子材料等中的應用受到期待。 The cured product obtained by subjecting the resin composition of the present invention to surface treatment is excellent in hydrophilicity, thermal stability, physical strength, uniformity, surface characteristics, and the like, and is expected to be used in a gas barrier film or an electronic material.
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TWI706012B (en) * | 2019-09-12 | 2020-10-01 | 明基材料股份有限公司 | A high hardness flexible hard coating film |
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US10683313B2 (en) | 2016-03-17 | 2020-06-16 | Lg Chem, Ltd. | Polyhedral oligomeric silsesquioxane and preparation method thereof |
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