TW201443439A - Chip inspection fixing structure - Google Patents

Abstract

This invention relates to a chip inspection fixing structure for enhancing the efficiency of large scale final test of chip products. A plurality of receiving spaces is formed in a testing disc and an assembly of a positioning push member and a spring is used to stably place the chips in the receiving spaces such that probes can correctly contact metal electrodes of the chips during inspection of the chips by the probes. In addition, the testing disc can be applied to existing wafer inspection machines such that the inspection machine may be commonly applicable to wafer inspection or the inspection disc of this invention.

Description

Wafer inspection fixed structure

The present invention relates to a wafer inspection fixed structure, and more particularly to a fixed structure applied when performing a wafer finish test on a packaged wafer finished product.

The wafer test of an integrated circuit (IC) is an important part of its manufacturing process. It can generally be divided into two stages. The test before cutting and packaging is the IC wafer test (Wafer Test). In the electrical function test for the wafer, the IC can filter out the electrically defective wafer before entering the package, and does not package the defective wafers to reduce the manufacturing cost. The test after the package molding is the use of various instruments (Instruments) in the ATE (Automatic Test Equipment) test for the finished wafer, the purpose of which is to confirm the function, electrical properties, tolerance, power consumption, heat dissipation, etc. of the finished wafer. Whether the parameters are normal to ensure the quality of the wafer before shipment. Therefore, for wafer manufacturers, the final wafer finished product test is an indispensable key process.

The professional wafer testing service factory mainly uses sophisticated high-tech machinery and equipment to simulate various possible use environments and methods of the chip, such as high temperature, low temperature, unstable voltage and high or low voltage environment. Under normal conditions of use, the tested wafers are placed in such simulated environments to test whether their working conditions are within specifications to ensure the quality of the wafer.

In the conventional wafer finished product testing technology, since the early detection of a single wafer is too much waste, it is also limited by the fact that the packaged wafer is not easy to detect, so the strip test is used. The method is carried out, that is, when a plurality of crystal grains (Die) are still connected by a bottom plate during wafer preparation, the test is performed in units of strips, and then cut and separated after the test. However, such a cutting action may cause a slight crack, which affects some ICs like analog IC chips, so it is still necessary to return to the single wafer inspection after cutting. The prior art can only test up to 8 wafers, and the efficiency is not good.

In addition, if a large-scale wafer product inspection is to be performed, the volume of the finished wafer is limited to be small, and the specification of 2 mm × 2 mm is easily exposed to vibration and shaking, so that the probe for detection is used. The inability to align the metal electrodes on the wafer causes misalignment and inability to meet the basic needs of the industry. Therefore, how to ensure the position of the wafer under test is an urgent problem to be overcome in this technical field.

SUMMARY OF THE INVENTION A primary object of the present invention is to provide a wafer inspection and fixing structure which, after opening a plurality of fixing structures on a test disc, uses a combination of a positioning pusher and a spring to stably fix the wafer in the fixed structure.

A secondary object of the present invention is to provide a wafer inspection and fixing structure, which is characterized in that a large number of packaged wafers are placed on a test disk for detection, and a large-scale one-time detection is performed through a probe array on the probe card. High detection efficiency.

Another object of the present invention is to provide a wafer inspection and fixing structure, which is to apply a test disc to an existing wafer inspection machine, so that the inspection machine can be commonly used for detecting a wafer or placing the same. The test disk of the invention is invented to detect the finished wafer on which it is placed.

In order to achieve the above object, the present invention discloses a wafer inspection and fixing structure, which is a test disk having a plurality of accommodating spaces, and any of the accommodating spaces includes: a wafer accommodating groove and a positioning. The pushing member accommodates the groove, and the positioning pusher receiving groove communicates with the wafer receiving groove, and a positioning pusher and a spring are disposed in the positioning pusher receiving groove, and the positioning pusher is disposed close to the wafer capacity. One end of the slot is provided, and the other end is connected to one end of the spring, and the other end of the spring is connected to the positioning pusher receiving groove. Under the test disk architecture that provides such a fixed chip, it can be applied to a large number of wafer finished product inspection systems, which can greatly improve the efficiency of detection and thus reduce the cost.

1. . . Test disk

2. . . Housing space

3. . . Wafer

10. . . Wafer receiving slot

110. . . Carrier block

20. . . Positioning pusher receiving slot

210. . . Push block

220. . . Push cover block

30. . . Positioning pusher

310. . . Positioning bump

320. . . Positioning groove

330. . . Groove push surface

40. . . spring

50. . . Blocker

60. . . Testing machine base

610. . . Pedestal

620. . . Probe card

First: it is a top view of the test disc of the present invention;
Second: it is a perspective view of the wafer inspection fixed structure of the present invention;
Third figure: it is a perspective view of the accommodation space of the present invention;
Figure 4 is a cross-sectional view showing the wafer inspection fixing structure of the present invention;
Fig. 5 is a schematic view showing the use of the wafer detecting and fixing structure of the present invention; and a sixth drawing showing the use of the wafer detecting base of the present invention.

In order to provide a better understanding and understanding of the features and the efficacies of the present invention, the preferred embodiment and the detailed description are as follows:

In the conventional wafer finished product testing technology, since it is too time-consuming to detect independently for a single wafer in the early stage, it is difficult to detect, and if large-scale wafer finished product inspection is performed, it is limited by the relatively small volume of the finished wafer product, which is easy. The shock caused by vibration and shaking causes the detection to be inaccurate and cannot meet the demand of mass production in the industry. Therefore, the present invention is improved for a large number of wafer inspections, and the improvement of a fixed structure with a wafer detection is novel and advanced. Creation of sex.

First, please refer to the first figure, which is a top view of the wafer detecting and fixing structure of the present invention, which comprises a test disc 1 and a plurality of accommodating spaces 2, which are widely opened in a checkerboard manner. Test one side of the disc 1. Taking the test disc 1 of the gossip as an example, if the size of the wafer for detecting is 2 mm × 2 mm, it is easy to open more than two hundred accommodation spaces 2 on the test disc 1, so that it can be detected simultaneously on a large scale. The ability of the finished wafer.

The key technical feature of the present invention is the structure of the fixed wafer. Please refer to the second figure, which is an enlarged view of the accommodating space 2, which can be divided into a ㄧ wafer receiving groove 10 and a positioning pusher accommodating groove 20, The accommodating accommodating groove 10 is connected to the positioning urging receiving groove 20, and a positioning pushing member 30 and a spring 40 are disposed in the positioning pushing member receiving groove 20, and one side of the positioning pushing member 30 is adjacent to the wafer. The other side of the slot 10 is connected to one end of the spring 40, and the other end of the spring 40 is connected to the pusher receiving slot 20.

The wafer receiving groove 10 in the accommodating space 2 is a block on which the wafer is placed, and the wafer is placed in the block and will be fixed for inspection. Since the test disc 1 is placed and fixed on the base of the detecting machine at the time of detection, and in the vertical direction with respect to this position, a probe card composed of a plurality of probes is provided.

When the detecting machine is in operation, the probe card is moved vertically downwards, so that the plurality of probes have contact with the metal electrodes of the wafer to confirm whether the electrical function is normal, and the yield is maintained. The quantity and quality of the goods.

Since the size of the wafer to be detected in the present invention is about several centimeters square, the metal electrode area is smaller, and can be 50 micrometers or less, and the contact width of the probe used can be no more than 30 micrometers. Therefore, the foregoing fixing of the wafer in the wafer receiving groove 10 is a necessary technical means to avoid the test failure of the wafer due to the offset.

Referring to the third figure, the side of the wafer receiving groove 10 has at least one blocking member 50. When the wafer is fixed, it will contact the blocking member 50 and abut the blocking member 50, so that it does not move arbitrarily. The force of the wafer against the blocking member 50 is derived from the positioning pusher 30.

In addition, one side of the positioning pusher 30 is provided with the pusher blocking block 210 to maintain the position of the positioning pusher 30 in the horizontal direction, and the pusher cover block 220 is disposed on the positioning pusher 30 to block the positioning pusher 30 from the spring 40 in the vertical direction. In the accommodation space 2.

Please refer to the fourth figure, which is a structural diagram of the positioning pusher in the present invention; as shown in the figure, one of the positioning pushers 30 has a positioning protrusion 310, which is used to abut the wafer. 3 one side. Since the outer shape of the wafer 3 is generally a rectangular parallelepiped structure, in this embodiment, the positioning bumps 310 are provided with two bumps evenly distributed and disposed in parallel to the side of the wafer 3, which can have a more stable interference effect, but is not limited thereto. Its structure and number of positioning bumps 310.

Then, the other side of the positioning pusher 30 has a positioning groove 320. The positioning groove 320 is a semi-cylindrical groove. The spring 40 is disposed on the positioning groove 320. The inner surface of the positioning groove 320 is As a groove pushing surface 330, the groove pushing surface 330 is used to push the spring 40.

Referring to FIG. 2 and FIG. 5 together, in order to fix the wafer 3, the wafer 3 is placed on the wafer receiving groove 10, and the positioning bump 310 on the positioning pusher 30 is used to push the wafer 3 against the blocking member. 50 and make sure it doesn't get loose. The working mechanism of the positioning pusher 30 is that the spring 40 is disposed in the positioning groove 320 of the rear end thereof, so that the spring 40 and the positioning pusher 30 are combined into a set of fixing mechanism, and the user can push the groove of the positioning pusher 30. The surface 330 acts as a force application point and pulls in the opposite direction of the wafer receiving groove 10, and the pushing spring 40 is compressed; at this time, the positioning protrusion 310 of the positioning pusher 30 is retracted, and the space is removed to allow the wafer 3 to be confirmed. The ground is placed into the wafer receiving groove 20.

Then, the user releases the groove pushing surface 330 of the positioning pusher 30 so that the spring 40 is no longer compressed, so that the spring 40 can push the groove pushing surface 330 to move toward the wafer receiving groove 10, thereby pushing the positioning. The positioning protrusion 310 at the front end of the member 30 can be in contact with one side of the wafer 3, and then continuously push the wafer 3 toward the blocking member 50, thereby fixing the position of the wafer 3, so that the wafer 3 does not arbitrarily move, shake or It is a shock that causes a deviation.

In addition, since the performance of the wafer at different temperatures needs to be checked during the testing of the wafer 3, and the present invention also considers this requirement, the pedestal of the testing machine is planned as a temperature regulating plate with adjustable temperature, and the setting is set. The test disc 1 thereon is made of a metal having good heat conduction and uniformity, and a preferred material is aluminum alloy. In order to ensure that the wafer 3 can be uniformly heated, at least one of the carrier blocks 110 is heated under the wafer 3, and in the second embodiment of the embodiment, the test disc 1 has two protrusions in the wafer receiving groove 21. The type of carrier block 110 is located above the carrier block 110 in a fixed position of the wafer 3. Under such a structure, when the detecting machine detects the wafer 3, the detecting machine can heat the carrying block 110 to a test temperature to test the performance of the wafer 3 at three levels of low temperature, medium temperature and high temperature, but the present case does not The shape and number of the carrier block 110 are defined.

In the technique of inserting the wafer 3 on the test disc 1, the wafer extraction can be moved into the wafer receiving groove 10 of the accommodating space 2 through an array of a plurality of tips, but the method is not limited thereto. .

Finally, referring to the sixth figure, the test disc 1 disclosed in the present invention is disposed on the base 610 of the aforementioned detection machine 60, and the inspection machine 60 is an existing wafer inspection machine. In the present invention, the test disc 1 is prepared as a wafer outer shape, so that the test machine 60 can be commonly used for detecting the wafer or the test disc 1. At the time of detection, the probe card 620 composed of a plurality of probes of the detecting machine 60 detects the wafers 3 at the same time and simultaneously, and when the detecting machine 60 detects the wafers, the test disk 1 faces upwards. The probe card 620 is tested down.

In addition, since the performance of the wafer at different temperatures needs to be checked during the test of the wafer 3, and the present invention also considers this requirement, the pedestal 610 of the inspection machine 60 is planned as a temperature-regulating plate with adjustable temperature. The test disc 1 disposed thereon is made of a metal having good heat conduction and uniformity, and a preferred material is aluminum alloy.

The wafer detecting and fixing structure of the invention can stably fix a large number of wafers on the test disc, and directly apply the test disc to the existing wafer inspection machine, thereby realizing the detection of the large-scale wafer finished product; whether in the detection Efficiency or cost reduction, etc., are more than ten times more outstanding than the prior art, and it is undoubtedly a fixed structure for wafers with economical and practical value.

The above is only the preferred embodiment of the present invention, and is not intended to limit the scope of the present invention, and the variations, modifications, and modifications of the shapes, structures, features, and spirits described in the claims of the present invention. All should be included in the scope of the patent application of the present invention.

The invention is a novelty, progressive and available for industrial use, and should meet the requirements of the patent application stipulated in the Patent Law of China, and the invention patent application is filed according to law, and the prayer bureau will grant the patent as soon as possible. prayer.

2. . . Housing space

10. . . Wafer receiving slot

110. . . Carrier block

20. . . Positioning pusher receiving slot

30. . . Positioning pusher

40. . . spring

Claims (10)

A wafer inspection fixing structure includes a test disc having a plurality of accommodating spaces, and any one of the accommodating spaces includes:
a wafer receiving groove; and a positioning pusher receiving groove communicating with the wafer receiving groove, comprising:
a positioning pusher is disposed in the positioning pusher receiving groove; and a spring, one end of which is connected to the positioning pusher, and the other end is connected to the positioning pusher receiving groove. The wafer detecting and fixing structure of claim 1, wherein the wafer receiving groove is provided with a wafer, the positioning pusher is in contact with the wafer, and the spring pushes the positioning pusher to fix the wafer; The wafer is a finished wafer product. The wafer inspection fixing structure according to claim 2, wherein the test disc has at least one carrier block protruding from the wafer receiving groove, and the wafer is disposed on the carrier block. The wafer detecting and fixing structure according to claim 2, wherein one side of the positioning pusher has at least one positioning protrusion, and the positioning protrusion abuts on one side of the wafer. The wafer detecting and fixing structure according to claim 1, wherein the positioning pusher further has a positioning groove, and the spring is disposed in the positioning groove. The wafer inspection fixing structure according to claim 5, wherein the positioning groove of the positioning pusher has a groove pushing surface for pushing the spring. The wafer inspection fixing structure according to claim 1, wherein the test tray is further disposed on a base of a detecting machine, wherein the detecting machine is commonly used for detecting a wafer and the test tray. One of the groups formed. The wafer detecting and fixing structure according to claim 7, wherein the plurality of probes of the detecting machine respectively and simultaneously detect the wafers, and when the detecting machine detects the wafers, the testing tray is upward Tested down by these probes. The wafer inspection fixing structure according to claim 1, wherein the positioning pusher further covers a pusher cover block to maintain a position in a vertical direction of the positioning pusher. The wafer detecting and fixing structure according to claim 1, wherein one of the positioning pushers is further provided with a pusher blocking block to maintain the position of the positioning pusher in the horizontal direction.