TW201443185A - Substrate-free double-sided silica gel - Google Patents

Substrate-free double-sided silica gel Download PDF

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TW201443185A
TW201443185A TW103107371A TW103107371A TW201443185A TW 201443185 A TW201443185 A TW 201443185A TW 103107371 A TW103107371 A TW 103107371A TW 103107371 A TW103107371 A TW 103107371A TW 201443185 A TW201443185 A TW 201443185A
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adhesive layer
adhesive
peeling
release sheet
parts
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TW103107371A
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TWI609939B (en
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Takeshi Ansai
Hitoshi Ohashi
Yuichi Kurata
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Lintec Corp
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Abstract

[SUBJECT] The present invention provides a substrate-free double-sided silica gel with an adhesive layer, wherein the adhesive layer can inhibit residual adhesive on one desired side during separation of parts after the lamination of two parts. [SOLUTION MEANS] The substrate-free double-sided silica gel 10 has a laminate structure sequentially configured with a first peeling sheet 2, an adhesive layer 1 formed by a silicon-based adhesive composition, and a second peeling sheet 3, wherein the two main sides 1A and 1B of the adhesive layer 1 have a difference in adhesion strength between 2 mN/25mm to 20 mN/25mm, and the main side 1B with a higher adhesion strength in the adhesive layer has an adhesion strength of less than 700 mN/25mm.

Description

無基材雙面矽膠 Non-substrate double-sided silicone

本發明係關於無基材雙面矽膠。 The present invention relates to a substrateless double sided silicone.

近年來,在顯示設備的製造領域、有關半導體部材的製造領域、電氣‧電子配件的製造領域等方面,有將2張部材(這種部材可例舉玻璃基板、矽晶圓等)加工至由黏接劑貼合併由部材/黏接劑/部材組成的積層體之一面的情況。這種加工可例舉製膜(乾、濕)加工、蝕刻加工、噴沙加工、化學蝕刻處理等。 In recent years, in the field of manufacturing of display devices, the field of manufacturing semiconductor parts, and the field of manufacturing electrical and electronic components, two parts (such as a glass substrate, a silicon wafer, etc.) can be processed to The adhesive is applied to the surface of a laminate consisting of a component/adhesive/component. Such processing may, for example, be a film forming (dry or wet) process, an etching process, a sandblasting process, a chemical etching process, or the like.

作為使用於這種用途的黏接劑,例如在專利文獻1中,揭示了利用剝離紙用的矽固化物之方案。且在專利文獻2中,揭示了矽黏接層、基材及減黏層依次積層的雙面膠。 As an adhesive used for such a use, for example, Patent Document 1 discloses a method of using a tantalum cured product for release paper. Further, in Patent Document 2, a double-sided tape in which a tantalum adhesive layer, a substrate, and a reduced-viscosity layer are sequentially laminated is disclosed.

【先前技術文獻】 [Previous Technical Literature] 【專利文獻】 [Patent Literature]

【專利文獻1】國際公開第2008/111361號 [Patent Document 1] International Publication No. 2008/111361

【專利文獻2】日本特開2012-057029號公報 [Patent Document 2] Japanese Patent Laid-Open Publication No. 2012-057029

但是,專利文獻1的剝離紙用矽的固化物不能說 是與玻璃的黏接性很充分,在作業工程中會有脫落的情況。並存在作業結束後剝離時不能選擇將上述固化物留在哪塊玻璃上的問題。此外,專利文獻2的雙面膠雖然解決了專利文獻1中的問題,但是不僅製造成本增加,且在高溫使用時減黏層的熱劣化也有問題。 However, the cured product of the release paper for the release paper of Patent Document 1 cannot be said. It is very adhesive to the glass and will fall off during work. There is a problem in that it is impossible to select which glass to leave the cured product on the glass when peeling off after the completion of the work. Further, although the double-sided tape of Patent Document 2 solves the problem in Patent Document 1, it not only increases the manufacturing cost, but also has a problem in thermal deterioration of the reduced-viscosity layer at the time of high-temperature use.

本發明鑒於這種現狀,以提供具備一種黏接劑層的無基材雙面矽膠為課題,而其特徵在於:用於2個部材的貼合之後,分離這些部材時,可以在所希望的一部材上將黏接劑無殘留地進行選擇性剝離。 The present invention has been made in view of such circumstances, and it is an object of the present invention to provide a non-substrate double-sided silicone having an adhesive layer, which is characterized in that it can be used for separating the two members after the bonding of the two members. The adhesive is selectively peeled off without residue on a part of the material.

為了達成上述目的,第一,本發明提供一種無基材雙面矽膠,其特徵在於:其結構屬於將由第1剝離片、矽系黏接劑組成物所形成的黏接劑層以及第2剝離片,按該順序配置的積層體,而上述黏接劑層的2個主面黏接力之差為2mN/25mm以上、20mN/25mm以下,同時上述黏接劑層中黏接力較高的主面黏接力為700mN/25mm以下(發明1)。 In order to achieve the above object, the present invention provides a substrateless double-sided silicone which is characterized in that the structure is an adhesive layer formed of a first release sheet and a bismuth-based adhesive composition, and a second release layer. a laminated body arranged in this order, and a difference in adhesion between the two main faces of the adhesive layer is 2 mN/25 mm or more and 20 mN/25 mm or less, and a main surface having a high adhesive force in the adhesive layer The bonding force is 700 mN/25 mm or less (Invention 1).

於上述發明(發明1)中,上述第1剝離片及上述第2剝離片中至少一個,優選為在支援體中至少一個主面上塗布氟系剝離劑而形成(發明2)。 In the above invention (Invention 1), at least one of the first release sheet and the second release sheet is preferably formed by applying a fluorine-based release agent to at least one main surface of the support (Invention 2).

於上述發明(發明1、發明2)中,上述矽系黏接劑組成物優選包含:以矽氧烷結合為主骨架並將含有烯基的附加型有機聚矽氧烷作為構成成分的矽橡膠,以及上述矽橡膠的每100質量份中含有0.01質量份以上、3質量份以下的鉑催化劑,和上述矽橡膠的每100質量份中含有15質量份以上、100 質量份以下的矽樹脂(發明3)。 In the above invention (Invention 1 and Invention 2), the ruthenium-based adhesive composition preferably contains ruthenium rubber containing a siloxane as a main component and a olefin-containing additional polyorganosiloxane. And a platinum catalyst containing 0.01 parts by mass or more and 3 parts by mass or less per 100 parts by mass of the above-mentioned ruthenium rubber, and 15 parts by mass or more and 100 parts per 100 parts by mass of the above-mentioned ruthenium rubber. Anthracene resin of the following parts by mass (Invention 3).

根據本發明具備無基材雙面矽膠的黏接劑層,既是無基材的黏接劑層,且一個主面的黏接力對於另一個主面黏接力之差被設定在一定範圍,另外,黏接力相對高的主面黏接力之上限已有規定。此外,黏接劑層是由矽系黏接劑組成而形成的。因此以這種黏接劑層貼合2個部材時,通過將黏接劑層中黏接力相對低的主面貼付在不願殘留黏接劑的部材之一面,將2個部材分離時,可優先把該部材從黏接劑層的介面上分離。 According to the present invention, the adhesive layer having the baseless double-sided silicone is not a substrate-free adhesive layer, and the difference between the adhesive force of one main surface and the adhesive force of the other main surface is set within a certain range. The upper limit of the adhesive force of the main surface having a relatively high adhesive force has been specified. In addition, the adhesive layer is formed by a lanthanide binder. Therefore, when two members are bonded together with such an adhesive layer, the main surface having a relatively low adhesive force in the adhesive layer is attached to one surface of the member which is not intended to remain the adhesive, and when the two members are separated, The material is preferentially separated from the interface of the adhesive layer.

因此,若在貼合2個部材而成的積層體一面之部材上加工,則通過將黏接劑層中黏接力相對低的主面貼付在進行該加工的部材之一面,從而在進行該加工時,該部材難以和黏接劑層產生剝離,且在加工後分離2個部材之後,在進行該加工的部材之面上不需要除掉殘留黏接劑的作業,因而可提高有關該加工的整體作業之效率。 Therefore, when the surface of the layered body in which the two parts are bonded together is processed, the main surface of the adhesive layer having a relatively low adhesive force is applied to one of the surfaces on which the processing is performed, thereby performing the processing. When the material is difficult to be peeled off from the adhesive layer, and after the two parts are separated after processing, the operation of removing the residual adhesive is not required on the surface of the processed part, thereby improving the processing. The efficiency of the overall operation.

10‧‧‧無基材雙面矽膠 10‧‧‧No substrate double-sided silicone

1‧‧‧黏接劑層 1‧‧‧Adhesive layer

1A‧‧‧面對黏接劑層1之第1剝離面2A而積層的主面(低黏接力面) 1A‧‧‧ Main surface (low adhesion surface) laminated on the first peeling surface 2A of the adhesive layer 1

1B‧‧‧面對黏接劑層1的第2剝離面3A而積層的主面(高黏接力面) 1B‧‧‧ Main surface (high adhesion surface) which is laminated on the second peeling surface 3A of the adhesive layer 1

2‧‧‧第1剝離片 2‧‧‧1st peeling piece

2A‧‧‧第1剝離面 2A‧‧‧1st peeling surface

2a‧‧‧第1剝離處理層 2a‧‧‧1st peeling treatment layer

2b‧‧‧第1支持材 2b‧‧‧1st support material

3‧‧‧第2剝離片 3‧‧‧2nd peeling piece

3A‧‧‧第2剝離面 3A‧‧‧2nd peeling surface

3a‧‧‧第2剝離處理層 3a‧‧‧2nd peeling treatment layer

3b‧‧‧第2支持材 3b‧‧‧2nd support material

【圖1】為有關本發明第一實施形態的無基材雙面矽膠之概略剖面圖。 Fig. 1 is a schematic cross-sectional view showing a substrateless double-sided silicone according to a first embodiment of the present invention.

本發明的實行形態之說明如下。 The description of the embodiment of the present invention is as follows.

1.無基材雙面矽膠 1. Non-substrate double-sided silicone

如圖1所示,根據本發明第一實施形態的上述無基材雙面 矽膠10,是在由矽系黏接劑組成物形成的黏接劑層1之各主面1A、1B上,貼合根據氟系剝離劑具有由剝離處理層2a、2b之面形成的剝離面2A、2B之剝離片(第1剝離片2、第2剝離片3)。 As shown in FIG. 1, the above-mentioned substrateless double-sided according to the first embodiment of the present invention The silicone rubber 10 is bonded to each of the main surfaces 1A and 1B of the adhesive layer 1 formed of the bismuth-based adhesive composition, and has a release surface formed by the surface of the release-treated layers 2a and 2b according to the fluorine-based release agent. Release sheets of 2A and 2B (first release sheet 2, second release sheet 3).

(1)黏接劑層 (1) adhesive layer

(1-1)組成 (1-1) Composition

黏接劑層1具備根據本實施形態之無基材雙面矽膠10,是由含有以下說明成分的矽系黏接劑組成物所形成。矽系黏接劑組成物相對於另一種的黏接劑組成物,譬如與丙烯酸系黏接劑組成物相比,具有優異的耐熱性,因此由矽系黏接劑組成物形成的黏接劑層1,在加熱時難以發生翹起、剝離、發泡等缺陷。 The adhesive layer 1 is provided with the baseless double-sided silicone 10 according to the present embodiment, and is formed of a ruthenium-based adhesive composition containing the components described below. The adhesive composition of the lanthanum adhesive has an excellent heat resistance compared to the composition of the adhesive, for example, compared with the acrylic adhesive composition, and thus the adhesive formed by the lanthanum adhesive composition The layer 1 is less likely to cause defects such as lift, peeling, and foaming upon heating.

根據本實施形態的矽系黏接劑組成物,優選為由矽氧烷結合作為主骨架,並含有以具烯基的附加型有機聚矽氧烷為構成成分的矽橡膠。通過含有上述矽橡膠,可適度降低黏接劑層1的黏接力。因此,可容易將黏接劑層1從被黏物上剝離;另外,根據黏接劑層1的內聚破壊,可讓構成黏接劑層1之材料在被黏物上的殘留變得極少。 The bismuth-based adhesive composition according to the present embodiment is preferably a ruthenium rubber having a siloxane group as a main skeleton and an ethylenically-added organopolysiloxane as a constituent component. By containing the above ruthenium rubber, the adhesion of the adhesive layer 1 can be moderately lowered. Therefore, the adhesive layer 1 can be easily peeled off from the adherend; in addition, depending on the cohesive breakage of the adhesive layer 1, the residue of the material constituting the adhesive layer 1 on the adherend can be made extremely small. .

作為上述烯基的具體例子,可列舉烯丙基、丙烯基、丁烯基、戊烯基、己烯基、丁烯基庚、辛烯基等。並且,也可含有不具附加反應性的有機基。這種有機基的具體例子,可列舉甲基、乙基、丙基等的烷基、苯基等的芳基。 Specific examples of the alkenyl group include an allyl group, a propenyl group, a butenyl group, a pentenyl group, a hexenyl group, a butenyl group, an octenyl group, and the like. Further, an organic group having no additional reactivity may also be contained. Specific examples of such an organic group include an alkyl group such as a methyl group, an ethyl group or a propyl group, or an aryl group such as a phenyl group.

屬於上述矽橡膠的有機聚氧烷的聚合度,雖沒有特別限制,但通常優選在500以上、10000以下,更優選為2000以上、8000以下。 The degree of polymerization of the organopolyoxane belonging to the above-mentioned ruthenium rubber is not particularly limited, but is usually preferably 500 or more and 10,000 or less, and more preferably 2,000 or more and 8,000 or less.

根據本實施形態的矽系黏接劑組成物,包含鉑催化劑為佳。該鉑催化劑具有使上述烯基開始產生附加反應的功能,以及促進該附加反應的功能。作為該鉑催化劑的種類,可例舉鉑黑、氯化鉑、氯鉑酸、氯化鉑和1價乙醇反應物、氯鉑酸和烯烴類的錯合物、雙(乙醯乙酸酯)合鉑等。在根據本實施形態的矽系黏接劑組成物含有上述矽橡膠和鉑催化劑時,鉑催化劑的矽系黏接劑組成物中之含量,以每矽橡膠100質量份中優選為0.01質量份以上、3質量份以下。維持在該範圍時,鉑催化劑才能穩定發揮其功能。有讓鉑催化劑的功能更加穩定發揮的觀點來看,矽系黏接劑組成物中的鉑催化劑之含量,在每矽橡膠100質量份中優選為為0.05質量份以上、2.00質量份以下;特別優選為0.10質量份以上、1.00質量份以下。 The ruthenium-based adhesive composition according to the present embodiment preferably contains a platinum catalyst. The platinum catalyst has a function of causing the above alkenyl group to start an additional reaction, and a function of promoting the additional reaction. The type of the platinum catalyst may, for example, be platinum black, platinum chloride, chloroplatinic acid, platinum chloride and a monovalent ethanol reactant, a complex of chloroplatinic acid and an olefin, or bis(acetamidine acetate). Platinum and the like. When the ruthenium-based adhesive composition according to the present embodiment contains the ruthenium rubber and the platinum catalyst, the content of the ruthenium-based adhesive composition of the platinum catalyst is preferably 0.01 parts by mass or more per 100 parts by mass of the ruthenium rubber. , 3 parts by mass or less. When maintained in this range, the platinum catalyst can stably perform its function. The content of the platinum catalyst in the ruthenium-based adhesive composition is preferably 0.05 parts by mass or more and 2.00 parts by mass or less per 100 parts by mass of the ruthenium rubber, in view of the fact that the function of the platinum catalyst is more stably exhibited; It is preferably 0.10 parts by mass or more and 1.00 parts by mass or less.

根據本實施形態的矽系黏接劑組成物,優選含有矽樹脂,即分子中具有分歧狀的有機聚矽氧烷。由於含有矽樹脂,可提高黏接劑層1對於被黏物的黏接性。由適度設定該黏接性水準的觀點來看,若根據本實施形態的矽系黏接劑組成物含有上述矽橡膠和矽樹脂時,矽樹脂在矽系黏接劑組成物的含量,在每矽橡膠100質量份中優選為10質量份以上、100質量份以下。由更加適度設定上述黏接性的觀點來看,矽系黏接劑組成物中矽樹脂的含量,在每矽橡膠100質量份中進一步優選為15質量份以上、75質量份以下;特別優選為20質量份以上、50質量份以下。 According to the bismuth-based adhesive composition of the present embodiment, it is preferable to contain an oxime resin, that is, an organic polysiloxane having a divergence in a molecule. Since the enamel resin is contained, the adhesion of the adhesive layer 1 to the adherend can be improved. When the bismuth-based adhesive composition according to the present embodiment contains the above-mentioned ruthenium rubber and enamel resin, the content of the ruthenium resin in the ruthenium-based adhesive composition is The amount of the ruthenium rubber is preferably 10 parts by mass or more and 100 parts by mass or less. The content of the oxime resin in the ruthenium-based adhesive composition is more preferably 15 parts by mass or more and 75 parts by mass or less per 100 parts by mass of the ruthenium rubber, from the viewpoint of more appropriately setting the above-mentioned adhesiveness; 20 parts by mass or more and 50 parts by mass or less.

根據本實施形態的矽系黏接劑組成物,只要黏接劑層1能發揮所目標的功能,即可包含各種成分。譬如可例 舉:具有氫化甲矽烷基的架橋劑,架橋催化劑,染料、顏料等著色材料,苯胺系、苯酚系等的抗氧化劑,二苯甲酮系、苯丙三唑系等紫外線吸收劑,滑石、二氧化鈦、二氧化矽、澱粉等填料成分,塑化劑,抗氧化劑,光穩定劑,分散劑,均染劑等。並且,若根據本實施形態的矽系黏接劑組成物含有具氫化甲矽烷基的架橋劑,其含量在每矽橡膠100質量份中優選為是1.0質量份以上、10.0質量份以下。 According to the bismuth-based adhesive composition of the present embodiment, various components can be contained as long as the adhesive layer 1 can exhibit the intended function. For example A bridging agent with a hydroformylalkyl group, a bridging catalyst, a coloring material such as a dye or a pigment, an antioxidant such as an aniline or a phenol, an ultraviolet absorber such as a benzophenone or a benzotriazole, talc or titanium dioxide. Filling components such as cerium oxide and starch, plasticizers, antioxidants, light stabilizers, dispersants, leveling agents, etc. In addition, the lanthanum-based adhesive composition of the present embodiment contains a bridging agent having a hydroformylalkyl group, and the content thereof is preferably 1.0 part by mass or more and 10.0 parts by mass or less per 100 parts by mass of the ruthenium rubber.

(1-2)黏接力 (1-2) Adhesion

具備按照本實施形態之無基材雙面矽膠10的黏接劑層1,其一主面1A的黏接力低於另一主面1B的黏接力。並且在於本發明專利說明書,黏接力的測定方法按照後述實施例中所示的測定方法進行。 In the adhesive layer 1 having the substrate-free double-sided silicone 10 according to the present embodiment, the adhesive force of one main surface 1A is lower than that of the other main surface 1B. Further, in the patent specification of the present invention, the measuring method of the adhesive force is carried out in accordance with the measuring method shown in the examples described later.

在於本發明專利說明書,具備根據本實施形態之無基材雙面矽膠的黏接劑層1,將其主面中黏接力低的主面1A稱為「低黏接力面」,將黏接力高的主面1B稱為「高黏接力面」。並且,將安排成使用時對向低黏接力面的部材稱為「第1部材」,將安排成使用時對向高黏接力面的部材稱為「第2部材」。此外,有時也將第1部材和第2部材總稱為「被黏物」。 According to the patent specification of the present invention, the adhesive layer 1 having the baseless double-sided silicone according to the present embodiment is provided, and the main surface 1A having a low adhesive force on the main surface is referred to as a "low-adhesion surface", and the adhesive force is high. The main surface 1B is called a "high adhesion surface". Further, the member which is arranged to face the low-adhesion surface at the time of use is referred to as a "first member", and the member which is arranged to face the high-adhesion surface at the time of use is referred to as a "second member". In addition, the first member and the second member may be collectively referred to as "adhered matter".

具備根據本實施形態之無基材雙面矽膠10的黏接劑層1,其高黏接力面1B的黏接力與低黏接力面1A的黏接力之差為(本發明專利說明書上亦稱「黏接力差」)2mN/25mm以上、20mN/25mm以下。由於黏接力差在上述範圍之內,將由無基材雙面矽膠10貼合的2個被黏物分離時,可穩定實現在第1部材和黏接劑層1之介面的優先分離。因此,黏接劑難以 殘留在第1部材。 The adhesive layer 1 having the substrate-free double-sided silicone 10 according to the present embodiment has a difference between the adhesive force of the high-adhesion surface 1B and the adhesive force of the low-adhesion surface 1A (also referred to as "the patent specification of the present invention" Poor adhesion") 2mN/25mm or more, 20mN/25mm or less. Since the difference in the adhesive force is within the above range, when the two adherends bonded together without the base double-sided silicone 10 are separated, the preferential separation of the interface between the first member and the adhesive layer 1 can be stably achieved. Therefore, the adhesive is difficult Remains in the first part.

若黏接力差過低於2mN/25mm,則將提高黏接劑殘留在第1部材上的可能性。此外,若黏接之差過大於20mN/25mm,則低黏接力面1A的黏接力可能變得過低,在此情況下,分離2個被黏物作業之前的階段,譬如對於第1部材的加工作業中,存在黏接劑層1在第1部材容易剝離的可能性。 If the difference in adhesion is less than 2mN/25mm, the possibility of the adhesive remaining on the first part will be increased. In addition, if the difference of the adhesion is more than 20 mN/25 mm, the adhesion force of the low adhesion surface 1A may become too low. In this case, the stage before the separation of the two adherends is performed, for example, for the first part. In the processing work, there is a possibility that the adhesive layer 1 is easily peeled off in the first member.

為了加工作業之間更加穩定降低黏接劑層1在第1部材被剝離的可能性,同時也為了在2個被黏物分離作業中,更加穩定實現第1部材和黏接劑層1之間的優先分離,黏接力差優選為2.5mN/25mm以上、18mN/25mm以下,進一步優選為3mN/25mm以上、16mN/25mm以下,特別優選為4mN/25mm以上、10mN/25mm以下。 In order to more stably reduce the possibility of the adhesive layer 1 being peeled off in the first part, and also to achieve a more stable between the first part and the adhesive layer 1 in the two adhering operations. The difference in adhesion is preferably 2.5 mN/25 mm or more and 18 mN/25 mm or less, more preferably 3 mN/25 mm or more and 16 mN/25 mm or less, and particularly preferably 4 mN/25 mm or more and 10 mN/25 mm or less.

具備根據本實施形態之無基材雙面矽膠10的黏接劑層1,其高黏接力面1B的黏接力為700mN/25mm以下。若高黏接力面1B的黏接力過高於700mN/25mm,則有時低黏接力面1A的黏接力也會變高。該情況下,由於黏接劑層1的內部產生內聚破壊的可能性較高,或可能在分離第1部材和第2部材時在第1部材產生黏接劑殘留。為了更加穩定地降低因內聚破壊而黏接劑殘留在第1部材的可能性,高黏接力面1B的黏接力優選為600mN/25mm以下,進一步優選為400mN/25mm以下,特別優選為200mN/25mm以下。 The adhesive layer 1 having the baseless double-sided silicone 10 according to the present embodiment has a high adhesion force surface 1B having an adhesive force of 700 mN/25 mm or less. If the adhesion force of the high-adhesion surface 1B is more than 700 mN/25 mm, the adhesion of the low-adhesion surface 1A may become high. In this case, there is a high possibility that cohesive breakage occurs in the inside of the adhesive layer 1, or there is a possibility that adhesive remains in the first member when the first member and the second member are separated. In order to more stably reduce the possibility that the adhesive remains in the first member due to cohesive breakage, the adhesive force of the high-adhesion surface 1B is preferably 600 mN/25 mm or less, more preferably 400 mN/25 mm or less, and particularly preferably 200 mN/ 25mm or less.

具備根據本實施形態之無基材雙面矽膠10的黏接劑層1,既是無基材的黏接劑層,且一個主面(高黏接力面)1B的黏接力對於另一個主面(低黏接力面)1A的黏接力之差(黏接 力差)被設定在一定範圍,另外,黏接力相對高的主面(高黏接力面)1B的黏接力之上限已有規定。此外,黏接劑層1是由矽系黏接劑組成而形成的。於是,以這種黏接劑層10貼合2個被黏物時,通過將黏接劑層1中黏接力相對低的主面(低黏接力面)1A貼付在不願殘留黏接劑的被黏物(第1部材),將2個被黏物分離時,可優先進行在第1部材和黏接劑層1之介面上的分離。 The adhesive layer 1 having the substrate-free double-sided silicone 10 according to the present embodiment is a substrate-free adhesive layer, and the adhesive force of one main surface (high adhesion surface) 1B is opposite to the other main surface ( Low adhesion surface) 1A difference in adhesion (bonding) The force difference is set to a certain range, and the upper limit of the bonding force of the main surface (high adhesion surface) 1B having a relatively high bonding force is defined. Further, the adhesive layer 1 is formed of a lanthanum-based adhesive. Therefore, when the two adherends are bonded to the adhesive layer 10, the main surface (low adhesion surface) 1A having a relatively low adhesive force in the adhesive layer 1 is attached to the adhesive which is unwilling to remain adhesive. When the adherend (the first member) separates the two adherends, the separation between the first member and the adhesive layer 1 can be preferentially performed.

因此,若在2個被黏物貼合形成的積層體之一個被黏物上實施加工時,以被黏物作為第1部材,可將黏接劑層1中黏接力相對較低的主面(低黏接力面)1A貼付在第1部材。實施該加工時,難以發生第1部材和黏接劑層1的剝離現像,而加工後分離2個被黏物之後,由於不需進行除去殘留在已加工之第1部材面上的黏接劑作業,因此可提高有關該加工的整體作業效率。有所需要時,讓這種2個被黏物適當維持貼合狀態的同時,也將此分離時讓在一面的被黏物上難以產生因黏接劑層1的黏接劑殘留,而發揮該作用的黏接劑層之特性在本發明專利說明書中亦稱「再剝離控制性」。具備根據本實施形態之無基材雙面矽膠10的黏接劑層1,有優異的再剝離控制性。 Therefore, when the workpiece is processed on one of the adherends formed by bonding two adherends, the adherend can be used as the first member, and the adhesive surface of the adhesive layer 1 can be relatively low. (Low adhesion surface) 1A is attached to the first part. When this processing is performed, peeling of the first member and the adhesive layer 1 is less likely to occur, and after the two adherends are separated after the processing, the adhesive remaining on the surface of the processed first member is not required to be removed. Work, thus improving the overall efficiency of the process. When necessary, the two adherends are properly maintained in the bonded state, and the separation of the adhesive on the one side of the adherend is difficult to occur due to the adhesive residue of the adhesive layer 1 The properties of the adhesive layer of this function are also referred to as "re-peeling controllability" in the patent specification of the present invention. The adhesive layer 1 having the baseless double-sided silicone 10 according to the present embodiment has excellent re-peeling controllability.

具備根據本實施形態之無基材雙面矽膠10的黏接劑層1,其高黏接力面1B的黏接力下限為由前述黏接力差到20mN/25mm。因黏接力差的優選範圍,具備根據本實施形態之無基材雙面矽膠10的黏接劑層1,其高黏接力面1B的黏接力也優選為30mN/25mm以上,進一步優選為40mN/25mm以上,特別優選為60mN/25mm以上。 In the adhesive layer 1 having the substrate-free double-sided silicone 10 according to the present embodiment, the lower limit of the adhesive force of the high-adhesion surface 1B is such that the adhesion is poor to 20 mN/25 mm. The adhesive layer 1 having the baseless double-sided silicone 10 according to the present embodiment preferably has a bonding strength of the high-adhesion surface 1B of 30 mN/25 mm or more, and more preferably 40 mN/, depending on the preferable range of the adhesive strength. 25 mm or more, particularly preferably 60 mN / 25 mm or more.

具備根據本實施形態之無基材雙面矽膠10的黏接劑層1,其低黏接力面1A的黏接力範圍,只要滿足上述黏接力差範圍及高黏接力面1B的黏接力範圍條件,則無特別限制。在加工作業等之間,為了更加穩定降低黏接劑層1在第1部材上被剝離的可能性,同時也為了在2個被黏物分離作業中,更加穩定實現第1部材和黏接劑層1之間的優先分離,優選為10mN/25mm以上、698mN/25mm以下,進一步優選為20mN/25mm以上、398mN/25mm以下,特別優選為30mN/25mm以上、198mN/25mm以下。 The adhesive layer 1 having the baseless double-sided silicone 10 according to the present embodiment has a range of adhesion force of the low-adhesion surface 1A, as long as the range of the adhesion difference and the adhesion range of the high-adhesion surface 1B are satisfied. There is no special restriction. Between the processing operations and the like, in order to more stably reduce the possibility of the adhesive layer 1 being peeled off on the first member, and also to achieve the first member and the adhesive more stably in the two adherend separation operations. The preferential separation between the layers 1 is preferably 10 mN/25 mm or more and 698 mN/25 mm or less, more preferably 20 mN/25 mm or more and 398 mN/25 mm or less, and particularly preferably 30 mN/25 mm or more and 198 mN/25 mm or less.

(1-3)厚度 (1-3) Thickness

具備根據本實施形態的無基材雙面矽膠10的黏接劑層1,其厚度並無特別限制。若黏接劑層1過薄,將會難以獲得對於被黏物(第1部材、第2部材)的所需程度之黏接性。為了易於獲得適當程度的黏接性,黏接劑層1的厚度優選為2μm以上,進一步優選為5μm以上,特別優選為10μm以上。此外,黏接劑層1厚度的上限,可按其用途做適當設定,通常為200μm以下,優選為100μm以下,進一步優選為50μm以下。 The thickness of the adhesive layer 1 having the substrate-free double-sided silicone 10 according to the present embodiment is not particularly limited. If the adhesive layer 1 is too thin, it will be difficult to obtain a desired degree of adhesion to the adherend (the first member and the second member). In order to easily obtain an appropriate degree of adhesion, the thickness of the adhesive layer 1 is preferably 2 μm or more, more preferably 5 μm or more, and particularly preferably 10 μm or more. Further, the upper limit of the thickness of the adhesive layer 1 can be appropriately set according to the use thereof, and is usually 200 μm or less, preferably 100 μm or less, and more preferably 50 μm or less.

(2)剝離片 (2) peeling sheet

如圖1所示,根據本實施形態之無基材雙面矽膠10具備2張剝離紙2、3。在本發明專利說明書,將面對低黏接力面1A積層的剝離片2稱作「第1剝離片」。並且,面對高黏接力面1B積層的剝離片3稱作「第2剝離片」。 As shown in Fig. 1, the baseless double-sided silicone 10 according to the present embodiment includes two sheets of release papers 2, 3. In the patent specification of the present invention, the release sheet 2 which is laminated on the low adhesion surface 1A is referred to as a "first release sheet". Further, the release sheet 3 which is laminated on the high adhesion surface 1B is referred to as a "second release sheet".

(2-1)第1剝離片 (2-1) 1st peeling piece

如圖1所示,具備根據本實施形態之無基材雙面矽膠10 的第1剝離片2,具有第1支持材2b和第一支持材2b的一個主面上積層的第1剝離處理層2a。第1剝離面2A是第1剝離片2的剝離面,是由第1剝離處理層2a中面對第1支持材2b主面的對面主面所形成。 As shown in FIG. 1, the substrateless double-sided silicone 10 according to the embodiment is provided. The first release sheet 2 has a first release treated layer 2a laminated on one main surface of the first support member 2b and the first support member 2b. The first peeling surface 2A is a peeling surface of the first peeling sheet 2 and is formed by the opposing main surface of the first peeling treatment layer 2a facing the main surface of the first supporting member 2b.

構成第1支持材2b的材料則無特別限制。可具體列舉:聚乙烯薄膜、聚丙烯薄膜、聚異丁烯薄膜、聚丁二烯薄膜、聚乙基薄膜、聚氯乙烯薄膜、聚氯乙烯共聚物薄膜、聚對苯二甲酸乙二酯薄膜、聚萘二甲酸薄膜、聚對苯二甲酸薄膜、聚氨酯薄膜、乙酸乙烯酯薄膜、離聚物樹脂薄膜、乙烯‧(甲基)丙烯酸共聚物薄膜、乙烯‧(甲基)丙烯酸酯共聚物薄膜、聚苯乙烯薄膜、聚碳酸酯薄膜、聚醯亞胺薄膜、聚醚亞胺薄膜、聚芳醯胺薄膜、聚醚酮薄膜、聚醚醚酮薄膜、氟樹脂薄膜等。這些架橋薄膜也是構成第1支持材2b的材料之一個實例。第1支持材2b,亦可為這些積層膜。為了尺寸的穩定性及經濟性,作為構成第1支援材2b的材料,可優選例舉聚對苯二甲酸乙二酯薄膜和聚萘二甲酸薄膜。 The material constituting the first support member 2b is not particularly limited. Specific examples include: polyethylene film, polypropylene film, polyisobutylene film, polybutadiene film, polyethyl film, polyvinyl chloride film, polyvinyl chloride copolymer film, polyethylene terephthalate film, poly Naphthalene dicarboxylic acid film, polyterephthalic acid film, polyurethane film, vinyl acetate film, ionomer resin film, ethylene ‧ (meth) acrylate copolymer film, ethylene ‧ (meth) acrylate copolymer film, poly A styrene film, a polycarbonate film, a polyimide film, a polyetherimide film, a polyarylamine film, a polyetherketone film, a polyetheretherketone film, a fluororesin film, or the like. These bridge films are also an example of the material constituting the first support member 2b. The first support member 2b may be a laminate film. The material constituting the first support member 2b is preferably a polyethylene terephthalate film or a polyethylene naphthalate film, for the purpose of dimensional stability and economy.

第1支持材2b的厚度並無特別限制。通常是5~300μm左右,為了使用上的便利和經濟性,優選為10~100μm左右。 The thickness of the first support member 2b is not particularly limited. It is usually about 5 to 300 μm, and is preferably about 10 to 100 μm in order to facilitate use and economy.

在於本實施形態,第1剝離處理層2a是在第1支持材2b的一個主面塗布氟系剝離劑而形成的。第1剝離片2具備第1剝離面2A,而第1剝離面2A是由氟系剝離劑形成的第1剝離處理層2a的面所組成,並且第1剝離片2在由矽系黏接劑組成物形成的根據本實施形態之黏接劑層1中可容易剝 離,也適合這樣做。另外,如後述由於第1剝離處理層2a是由塗布氟系剝離劑形成的,因此可降低黏接劑層1之主面1A的黏接力,而黏接劑層1之主面1A的位置面對由第1剝離處理層2a之面形成的第1剝離面2A。 In the present embodiment, the first release-treated layer 2a is formed by applying a fluorine-based release agent to one main surface of the first support member 2b. The first release sheet 2 includes the first release surface 2A, and the first release surface 2A is composed of the surface of the first release treatment layer 2a formed of a fluorine-based release agent, and the first release sheet 2 is composed of a lanthanum-based adhesive. The adhesive layer 1 according to the present embodiment formed by the composition can be easily peeled off It is also suitable for this. Further, as will be described later, since the first release-treated layer 2a is formed by applying a fluorine-based release agent, the adhesive force of the main surface 1A of the adhesive layer 1 can be lowered, and the position of the main surface 1A of the adhesive layer 1 can be lowered. The first peeling surface 2A formed by the surface of the first peeling treatment layer 2a.

氟系剝離劑的塗布量並無特別限制。通常是0.02g/m2~2.0g/m2左右,優選為0.2g/m2~1.0g/m2。剝離劑的塗布方法並無特別限制,採用所告知的塗布方法即可。塗布方法的具體例子有:凹版塗布法、邁耶棒塗布法、吻合塗布法等。 The coating amount of the fluorine-based release agent is not particularly limited. It is usually about 0.02 g/m 2 to 2.0 g/m 2 , preferably 0.2 g/m 2 to 1.0 g/m 2 . The coating method of the release agent is not particularly limited, and the coating method to be notified may be employed. Specific examples of the coating method include a gravure coating method, a Meyer bar coating method, an anastomosis coating method, and the like.

(2-2)第2剝離片 (2-2) 2nd peeling piece

如圖1顯示,具備根據本發明第一實施形態之無基材雙面矽膠10的第2剝離片3,具有在第2支援材3b和第2支持材3b的一個主面上積層的第2剝離處理層3a。第2剝離面3A是第2剝離片3的剝離面,是由第2剝離處理層3a中面對第2支持材3b的主面之對面主面所形成。 As shown in Fig. 1, the second release sheet 3 including the baseless double-sided silicone 10 according to the first embodiment of the present invention has a second layer which is laminated on one main surface of the second support member 3b and the second support member 3b. The treated layer 3a is peeled off. The second peeling surface 3A is a peeling surface of the second peeling sheet 3 and is formed by the opposing main surface of the second peeling treatment layer 3a facing the main surface of the second supporting member 3b.

構成第2支持材3b的材料並無特別限制。這種材料的具體例子及合適的例子,與構成第1支援材2b的材料相同。第2支持材3b的厚度並無特別限制。通常為5~300μm左右,從使用便利性和經濟性角度來看,優選為10~100μm左右。 The material constituting the second support member 3b is not particularly limited. Specific examples and suitable examples of such a material are the same as those constituting the first support member 2b. The thickness of the second support member 3b is not particularly limited. It is usually about 5 to 300 μm, and is preferably about 10 to 100 μm from the viewpoint of ease of use and economy.

在於本實施形態,第2剝離處理層3a是在第2支持材3b的一個主面塗布氟系剝離劑所形成的。第2剝離面3A是由第2剝離處理層3a的面所組成,且第二剝離處理層3a的面由氟系剝離劑形成,而第2剝離面3A在由矽系黏接劑組成物形成的根據本實施形態之黏接劑層1,可容易進行剝離,也適合這樣做。氟系剝離劑的塗布量並無特別限制。通常是 0.02g/m2~2.0g/m2左右,優選為0.2g/m2~1.0g/m2。剝離劑的塗布方法並無特別限制,採用所告知的塗布方法即可。塗布方法的具體例子有:凹版塗布法、吻合塗布法等。 In the present embodiment, the second release-treated layer 3a is formed by applying a fluorine-based release agent to one main surface of the second support member 3b. The second peeling surface 3A is composed of the surface of the second release treated layer 3a, and the surface of the second release treated layer 3a is formed of a fluorine-based release agent, and the second release surface 3A is formed of a ruthenium-based adhesive composition. According to the adhesive layer 1 of the present embodiment, peeling can be easily performed, and this is also suitable. The coating amount of the fluorine-based release agent is not particularly limited. It is usually about 0.02 g/m 2 to 2.0 g/m 2 , preferably 0.2 g/m 2 to 1.0 g/m 2 . The coating method of the release agent is not particularly limited, and the coating method to be notified may be employed. Specific examples of the coating method include a gravure coating method, an anastomosis coating method, and the like.

2.無基材雙面矽膠的製造方法 2. Method for manufacturing non-substrate double-sided silicone

根據本實施形態之無基材雙面矽膠10的製造方法並無特別限制。按以下說明的製造方法製造,則可容易獲得根據本實施形態的無基材雙面矽膠10,並為優選。 The method for producing the baseless double-sided silicone 10 according to the present embodiment is not particularly limited. According to the manufacturing method described below, the baseless double-sided silicone 10 according to the present embodiment can be easily obtained, and is preferable.

首先,準備根據本實施形態的矽系黏接劑組成物,或在該組成物中添加溶劑而形成的塗工液。使用溶劑時,其種類及塗工液的固形物濃度可考慮矽系黏接劑組成物的組成、塗工條件、所目標的黏接劑層1之厚度等之後適當設定。溶劑可例舉甲苯、甲基乙基酮、乙酸乙酯等,固形物濃度的例示範圍在10質量%以上、40質量%左右。 First, a coating liquid prepared by adding a solvent to the composition of the present invention is prepared. When the solvent is used, the type and the solid content of the coating liquid can be appropriately set in consideration of the composition of the lanthanum binder composition, the coating conditions, the thickness of the target adhesive layer 1, and the like. The solvent may, for example, be toluene, methyl ethyl ketone or ethyl acetate, and the concentration range of the solid content is about 10% by mass or more and about 40% by mass.

接下來,在第1剝離片2的第1剝離面2A上,塗佈上述塗工液,通過乾燥處理而形成塗布層。若需要熟成期間則確保熟成期間,若不需要熟成期間則直接讓上述塗布層成為黏接劑層1。 Next, the coating liquid is applied onto the first peeling surface 2A of the first release sheet 2, and the coating layer is formed by drying. When the ripening period is required, the ripening period is ensured, and if the ripening period is not required, the coating layer is directly made into the adhesive layer 1.

塗工液的塗布方法並無特別限制。可做通常實施的凹版塗布法、棒式塗布法、刮刀式塗布方法、刀片塗布法等。塗布後乾燥處理的詳細方法則無限制。乾燥溫度並無限制。譬如,可在90℃~150℃範圍加熱。乾燥處理時間亦無限制,可考慮乾燥溫度而適當設定。乾燥時間為5分鍾以上時,可以穩定降低為接在第一剝離片2的第1剝離面2A而形成的黏接劑層1之主面1A的黏接力,並為優選。由類似觀點來看,以乾 燥時間在8分鍾以上為特別優選。此外,雖並無乾燥時間的上限,但考慮到製造費用則在30分鐘左右。 The coating method of the coating liquid is not particularly limited. A gravure coating method, a bar coating method, a doctor blade coating method, a blade coating method, and the like which are usually carried out can be used. The detailed method of the drying treatment after coating is not limited. The drying temperature is not limited. For example, it can be heated in the range of 90 ° C ~ 150 ° C. The drying treatment time is also not limited, and can be appropriately set in consideration of the drying temperature. When the drying time is 5 minutes or longer, the adhesion force to the main surface 1A of the adhesive layer 1 formed on the first release surface 2A of the first release sheet 2 can be stably lowered, which is preferable. From a similar point of view, to dry A drying time of 8 minutes or more is particularly preferred. In addition, although there is no upper limit of the drying time, it is about 30 minutes in consideration of the manufacturing cost.

在如此獲得的第1剝離片2與黏接劑層1之積層體上由黏接劑層1形成的面上,貼付第2剝離片3的第2剝離面3A,可獲得第1剝離片2、黏接劑層1及第2剝離片3按順序積層的無基材雙面矽膠10。所獲得的無基材雙面矽膠10,可按需求進行熟成過程。熟成的條件並無限制。例如,在23℃、相對濕度50%的大氣環境下放置1週。 The second release sheet 3A of the second release sheet 3 is attached to the surface of the first release sheet 2 and the adhesive layer 1 thus obtained, which is formed of the adhesive layer 1, and the first release sheet 2 is obtained. The non-substrate double-sided silicone 10 in which the adhesive layer 1 and the second release sheet 3 are laminated in this order. The obtained substrateless double-sided silicone 10 can be subjected to a ripening process as required. There are no restrictions on the conditions of ripening. For example, it is left to stand in an atmosphere of 23 ° C and a relative humidity of 50% for one week.

積層在第1剝離片2之第1剝離面2A上的黏接劑層1,是將塗工液塗布在第1剝離面2A上而所獲得的塗布層,連接在第1剝離面2A的狀態下,經過乾燥處理等過程所形成的。對此,積層在第2剝離片3之第2剝離面3A上的黏接劑層1,是將塗布層經過乾燥處理等過程而形成的黏接劑層1之主面1B貼付在第2剝離面3A。按照這種黏接劑層1的不同積層方法,可使面對黏接劑層1之第1剝離面2A的主面1A之黏接力,低於面對第2剝離面3A的主面1B的黏接力。即,具備按上述製造方法所製造的無基材雙面矽膠10的黏接劑層1,其主面1A就是低黏接力面,而主面1B是高黏接力面。 The adhesive layer 1 which is laminated on the first peeling surface 2A of the first peeling sheet 2 is a coating layer obtained by applying a coating liquid onto the first peeling surface 2A, and is connected to the first peeling surface 2A. Under the process of drying and the like. On the other hand, the adhesive layer 1 laminated on the second release surface 3A of the second release sheet 3 is attached to the second surface of the adhesive layer 1 formed by drying the coating layer. Face 3A. According to the different lamination method of the adhesive layer 1, the adhesive force of the main surface 1A facing the first peeling surface 2A of the adhesive layer 1 can be made lower than that of the main surface 1B facing the second peeling surface 3A. Adhesion. That is, the adhesive layer 1 having the substrate-free double-sided silicone 10 manufactured by the above-described manufacturing method has a main surface 1A which is a low adhesion surface and a main surface 1B which is a high adhesion surface.

此外,根據上述製造方法,除了可使黏接劑層1之主面1A的黏接力低於主面1B的黏接力,同時亦可讓第1剝離片2之第1剝離面2A,比第2剝離片3之第2剝離面3A更難以剝離(提高剝離力)。因此,根據上述無基材雙面矽膠10的製造方法,即使作為第1剝離片2和第2剝離片3的材料,使用了同一類型的剝離片,所獲的無基材雙面矽膠10中第1 剝離片2,則成為相對不易剝離的剝離片,而第2剝離片3成為相對容易剝離的剝離片。即,根據上述無基材雙面矽膠10的製造方法,能獲得使用1種剝離片和1種矽系黏接劑組成物,且具備輕剝離型剝離片和黏接劑層以及重剝離型剝離片,再加上黏接劑層則雙方主面的黏接力互不同的無基材雙面矽膠10。 Further, according to the above manufacturing method, the adhesive force of the main surface 1A of the adhesive layer 1 can be made lower than the adhesive force of the main surface 1B, and the first peeling surface 2A of the first peeling sheet 2 can be made smaller than the second one. The second peeling surface 3A of the release sheet 3 is more difficult to peel off (improving the peeling force). Therefore, according to the method for producing the baseless double-sided silicone 10 described above, even as the material of the first release sheet 2 and the second release sheet 3, the same type of release sheet is used, and the obtained substrate-free double-sided silicone 10 is obtained. 1st When the release sheet 2 is a release sheet which is relatively difficult to peel off, the second release sheet 3 is a release sheet which is relatively easily peeled off. In other words, according to the method for producing the non-substrate double-sided silicone 10, it is possible to obtain a peeling sheet and a ruthenium-based adhesive composition, and to provide a light-peelable release sheet and an adhesive layer, and a heavy peel-off type. The film, together with the adhesive layer, has a non-substrate double-sided silicone 10 having different adhesive forces on each other.

3.無基材雙面矽膠的使用方法 3. Method of using non-substrate double-sided silicone

在使用無基材雙面矽膠10時,為了先露出低黏接力面的黏接劑層1之主面1A,可先剝離第1剝離片2,亦可為了先露出高黏接力面的黏接劑層1之主面1B,而先剝離第2剝離片3。作為具體例子,以下說明先露出黏接劑層1之主面1B的情形。 When the non-substrate double-sided silicone 10 is used, in order to expose the main surface 1A of the adhesive layer 1 having a low adhesion surface, the first release sheet 2 may be peeled off first, or the adhesion of the high adhesion surface may be exposed first. The main surface 1B of the agent layer 1 is first peeled off from the second release sheet 3. As a specific example, the case where the main surface 1B of the adhesive layer 1 is exposed first will be described below.

作為第2部材,準備製膜、蝕刻等加工時當作載置板的部材,並將從無基材雙面矽膠10除去剝離片3且露出的黏接劑層1之主面1B,貼付在第2部材的一面上。 As a second member, a member for placing a sheet during processing such as film formation or etching is prepared, and the main surface 1B of the adhesive layer 1 from which the release sheet 3 is removed from the baseless double-sided silicone 10 is attached. On the side of the second part.

接下來,對積層在積於第2部材之一面的黏接劑層1的第1剝離片2進行剝離,並露出黏接劑層1的主面1A。接著,準備作為介入第2部材和黏接劑層1而貼合的部材(實施製膜、蝕刻等加工的對像)之第1部材,並且在第1部材之一面上貼付黏接劑層1的主面1A。由此可獲得第2部材、黏接劑層1和第1部材按順序積層的積層構造體。 Next, the first release sheet 2 which is laminated on the adhesive layer 1 which is formed on one surface of the second member is peeled off, and the main surface 1A of the adhesive layer 1 is exposed. Next, a first member which is a member to be bonded to the second member and the adhesive layer 1 (an image for performing film formation or etching) is prepared, and the adhesive layer 1 is attached to one surface of the first member. The main face 1A. Thus, a laminated structure in which the second member, the adhesive layer 1 and the first member are laminated in this order can be obtained.

對於該積層構造體之第1部材的露出面,進行上述製膜、蝕刻等的加工後,若分離第1部材和第2部材,則在 第1部材和黏接劑層1之介面可優先發生剝離,因而可獲得加工後的第1部材,且在其面上不因黏接劑層1而發生黏接劑殘留。 After the film forming, etching, or the like is performed on the exposed surface of the first member of the laminated structure, when the first member and the second member are separated, The interface between the first member and the adhesive layer 1 can be preferentially peeled off, so that the processed first member can be obtained, and the adhesive does not remain on the surface of the adhesive layer 1 .

在此,即使對上述第1部材的加工,是加熱積層構造體,且結果讓黏接劑層1處於高溫環境,因為黏接劑層1如上述為由矽系黏接劑組成物所形成,故不易發生黏接劑層1的變質現像,或黏接劑層1和被黏物的積層狀態發生變化的現像。 Here, even if the first member is processed, the laminated structure is heated, and as a result, the adhesive layer 1 is in a high temperature environment, because the adhesive layer 1 is formed of a lanthanum-based adhesive composition as described above. Therefore, the deterioration of the adhesive layer 1 or the occurrence of a change in the state of the adhesive layer 1 and the adherend is less likely to occur.

有將上述黏接劑層1放置於高溫環境下之可能性的加工,其具體例子可列舉:通過蒸著及烘乾程式的銦錫氧化物(ITO)、摻雜氟的錫氧化物(FTO)、氧化鋅(ZnO),以及在酸化亞鉛形成添加鋁和鎵的氧化鋅系材料(AZO,GZO)等透明導電膜。 There is a possibility of placing the above-mentioned adhesive layer 1 in a high temperature environment, and specific examples thereof include indium tin oxide (ITO) by steaming and drying, and fluorine-doped tin oxide (FTO). ), zinc oxide (ZnO), and a transparent conductive film such as a zinc oxide-based material (AZO, GZO) in which aluminum and gallium are added to the acidified lead.

被黏物(第1部材、第2部材)的組成和構造並無特別限制。作為被黏物的一個具體例子,可舉玻璃基板。若被黏物是玻璃基板時,構成其玻璃基板之材料的具體類型並無特別限制。譬如,有化學強化玻璃、無堿玻璃、石英玻璃、蘇打酸橙玻璃、鋇鍶玻璃、氧化鋁矽酸玻璃、鑞玻璃、硼矽玻璃、鋇硼矽玻璃等。玻璃基板的厚度並無特別限制。通常為0.1mm~5mm,優選為0.2mm~2mm。並且,玻璃基板也適合使用為加工時的載置板。 The composition and structure of the adherend (the first member and the second member) are not particularly limited. As a specific example of the adherend, a glass substrate can be mentioned. When the adherend is a glass substrate, the specific type of the material constituting the glass substrate is not particularly limited. For example, there are chemically strengthened glass, flawless glass, quartz glass, soda lime glass, bismuth glass, aluminosilicate glass, bismuth glass, borosilicate glass, bismuth boron bismuth glass, and the like. The thickness of the glass substrate is not particularly limited. It is usually 0.1 mm to 5 mm, preferably 0.2 mm to 2 mm. Further, the glass substrate is also suitably used as a mounting plate during processing.

被黏物也可以由耐熱性塑膠材料組成。在被黏物由耐熱性塑膠薄膜所形成的情形下,其具體例子為:聚醯亞胺薄膜、聚醯胺薄膜、聚醯胺亞胺薄膜、聚碸薄膜、聚苯硫醚薄 膜、聚醚醚酮薄膜、聚芳酯薄膜、聚碳酸酯薄膜、液晶聚合物薄膜、聚萘二甲酸薄膜;並且可舉其中兩種以上的積層體。塑膠薄膜可為一軸延伸,亦可為二軸延伸。 The adherend can also be composed of a heat resistant plastic material. In the case where the adherend is formed of a heat-resistant plastic film, specific examples thereof are: a polyimide film, a polyamide film, a polyimide film, a polyimide film, and a polyphenylene sulfide thin film. A film, a polyetheretherketone film, a polyarylate film, a polycarbonate film, a liquid crystal polymer film, a polyethylene naphthalate film, and a laminate of two or more kinds thereof. The plastic film can be extended in one axis or in two axes.

作為被黏物更加具體的例子,可列舉:半導體晶圓、封裝等有關半導體部材;剝離蓋片、保護膜、偏光片、相位差薄膜等有關顯示設備部材;通過玻璃環氧樹脂等的回路基板、筐體等的有關電氣‧電子零部件部材等。並且,作為這種部材的支援部材而發揮功能之部材,可列舉由母玻璃、金屬系材料及陶瓷材料等形成的基板等,皆可為被黏物的具體例子。 More specific examples of the adherend include a semiconductor wafer, a semiconductor component such as a package, and a display device such as a peeling cover sheet, a protective film, a polarizing film, and a retardation film; and a circuit substrate such as a glass epoxy resin. , electrical and electronic components such as housings. In addition, as a member which functions as a support member of such a member, a substrate formed of a mother glass, a metal material, a ceramic material, or the like may be mentioned as a specific example of the adherend.

根據本實施形態之黏接劑層1的一個主面上,亦可積層複數的被黏物。此時相互近距離的被黏物,可根據本實施形態在黏接劑層1面的面內方向隔離。 According to the main surface of the adhesive layer 1 of the present embodiment, a plurality of adherends may be laminated. At this time, the adherends which are close to each other can be isolated in the in-plane direction of the surface of the adhesive layer 1 according to the present embodiment.

分離第1部材而得到的黏接劑層1和第2部材之間的積層體,在之後的處理方法並無特別限制。亦可分離黏接劑層1和第2部材,讓第2部材再得到使用。根據本實施形態的黏接劑層1,如前述是由矽系黏接劑組成物所形成,由於位於面對第2部材的黏接劑層1主面1B之黏接力在700mN/25mm以下,較易於從第2部材剝離黏接劑層1,並且源自黏接劑層1的黏接劑不易殘留在第2部材的面上。因此,通過剝離黏接劑層1而獲得的第2部材,不需做除去黏接劑的複雜作業,亦可再次使用。 The layered body between the adhesive layer 1 and the second member obtained by separating the first member material is not particularly limited in the subsequent treatment method. The adhesive layer 1 and the second member can also be separated, and the second member can be reused. The adhesive layer 1 according to the present embodiment is formed of a ruthenium-based adhesive composition as described above, and the adhesive force of the main surface 1B of the adhesive layer 1 facing the second member is 700 mN/25 mm or less. It is easier to peel the adhesive layer 1 from the second member, and the adhesive derived from the adhesive layer 1 does not easily remain on the surface of the second member. Therefore, the second member obtained by peeling off the adhesive layer 1 does not need to be complicated to remove the adhesive, and can be used again.

上述說明的實施形態,是為了容易理解本發明而所述,並非為了限定本發明。因此,上述實施形態中明示的各要素,旨在包含屬於本發明技術範圍的所有設計變更或均等 物。 The embodiments described above are intended to facilitate the understanding of the present invention and are not intended to limit the present invention. Therefore, each element explicitly expressed in the above embodiments is intended to include all design changes or equalizations falling within the technical scope of the present invention. Things.

譬如,第2剝離片3可以是第2剝離處理層3a由氟系剝離劑以外的剝離劑所形成,也可以不具備第2剝離處理層3a,而第2支持材3b面對於黏接劑層1具備剝離性而形成第2剝離面3A。作為提供第2剝離處理層3a的氟系剝離劑以外的剝離劑,可列舉醇酸系、矽系、氟系、不飽和聚酯系、聚烯烴系、蠟系剝離劑。若第2剝離面3A是由第2支持材2b面形成,作為第2支持材3b的具體例子,有氟樹脂薄膜。 For example, the second release sheet 3 may be formed of a release agent other than the fluorine release agent, or may not include the second release treatment layer 3a, and the second support member 3b may face the adhesive layer. 1 is provided with the peeling property, and the 2nd peeling surface 3A is formed. Examples of the release agent other than the fluorine-based release agent that provides the second release treatment layer 3a include an alkyd-based, an anthraquinone-based, a fluorine-based, an unsaturated polyester-based, a polyolefin-based, and a wax-based release agent. When the second peeling surface 3A is formed by the surface of the second supporting member 2b, a fluororesin film is used as a specific example of the second supporting member 3b.

再者,若是在使用無基材雙面矽膠10時先露出黏接劑層1的主面(低黏接力面)1A的情形下,可將其面貼付在第1部材的一面,得出第2剝離片3、黏接劑層1以及由第1部材形成的積層體中剝離第2剝離片3,將露出的黏接劑層1之主面(高黏接力面)1B貼付在第2部材的一面。 In the case where the base surface (low adhesion surface) 1A of the adhesive layer 1 is first exposed when the baseless double-sided silicone 10 is used, the surface of the first member can be attached to the first member. 2 The release sheet 3, the adhesive layer 1 and the laminate formed of the first member are peeled off from the second release sheet 3, and the main surface (high adhesion surface) 1B of the exposed adhesive layer 1 is attached to the second member. Side.

【實施例】 [Examples]

以下,通過實施例等對本發明進行更加具體說明,但是本發明的範圍並不受這些實施例等的限制。 Hereinafter, the present invention will be more specifically described by the examples, but the scope of the present invention is not limited by the examples and the like.

〔實施例1〕 [Example 1]

(1)矽系黏接劑組成物的塗工液之調製 (1) Modulation of the coating fluid of the lanthanum binder composition

在附加固化型矽橡膠(信越化學社製,產品名:KS-847H)100質量份添加矽樹脂(道康寧東麗社製,商品名:SD4587L)40質量份,以及鉑催化劑(道康寧東麗社製,商品名:SRX-212)0.6質量份,準備了以甲基乙基酮調整固形物濃度到25質量%的矽系黏接劑組成物之塗工液。 40 parts by mass of ruthenium resin (manufactured by Dow Corning Toray Co., Ltd., trade name: SD4587L) and platinum catalyst (manufactured by Dow Corning Toray Co., Ltd.) in an amount of 100 parts by mass of the addition-curing type ruthenium rubber (product name: KS-847H) , trade name: SRX-212) 0.6 parts by mass, and a coating liquid of a ruthenium-based adhesive composition in which the solid content was adjusted to 25% by mass with methyl ethyl ketone was prepared.

(2)黏接片之製作 (2) Production of adhesive sheets

作為剝離片,準備在聚對苯二甲酸乙二醇(PET)製薄膜(厚度:50μm)的一邊主面上由氟化矽組成的具有剝離劑層的快速剝離薄膜(琳得科社製,產品名:SP-PET50FD)2張,並各使用為第1剝離片和第2剝離片。 A release film having a release agent layer composed of barium fluoride on one side of a polyethylene terephthalate (PET) film (thickness: 50 μm) was prepared as a release sheet (Lindeco Co., Ltd., Product name: SP-PET50FD) Two sheets, each used as a first release sheet and a second release sheet.

在第1剝離片的剝離面(第1剝離面)上,將上述矽系黏接劑組成物的塗工液以刀式塗布機進行塗布,並在120℃乾燥10分鍾之後,獲得了厚度25μm的黏接劑層。在由該黏接劑層和第1剝離片所形成的積層體之黏接劑層的主面上,貼合第2剝離片的剝離面(第2剝離面),得出第1剝離片、黏接劑層以及第2剝離片按順序積層而成的無基材雙面矽膠。 On the peeling surface (first peeling surface) of the first release sheet, the coating liquid of the above-described ruthenium-based adhesive composition was applied by a knife coater, and dried at 120 ° C for 10 minutes to obtain a thickness of 25 μm. The layer of adhesive. The peeling surface (second peeling surface) of the second release sheet is bonded to the main surface of the adhesive layer of the laminated body formed of the adhesive layer and the first release sheet, and the first release sheet is obtained. The adhesive-free layer and the second release sheet are sequentially laminated to form a substrate-free double-sided silicone.

由此獲得的無基材雙面矽膠中,將剝離第1剝離片後露出的黏接劑層之主面(低黏接力面)貼付在第1玻璃基板(康寧社製,製品名:鷹XG)之一主面,得出由第1剝離片、黏接劑層以及第1玻璃基板形成的積層體。以下,將在此積層體中剝離第1剝離片而得出的積層體,稱作「第1積層體」。 In the baseless double-sided silicone obtained thereby, the main surface (low adhesion surface) of the adhesive layer exposed after peeling off the first release sheet is attached to the first glass substrate (manufactured by Corning Co., Ltd., product name: Eagle XG) One of the main surfaces is a laminate formed of the first release sheet, the adhesive layer, and the first glass substrate. Hereinafter, the laminate obtained by peeling off the first release sheet in the laminate is referred to as a "first laminate".

替代第1剝離片而使用未經剝離處理的聚對苯二甲酸乙二醇(PET)製薄膜(厚度:25μm),除了在其一主面上塗布上述塗工液外,進行了與上述同樣的操作後,獲得了PET製薄膜、黏接劑層以及第2剝離片依次積層的矽單面膠。以下,將該矽片膠稱作「第1矽單面膠」。 A film made of polyethylene terephthalate (PET) (thickness: 25 μm) which was not peeled off was used instead of the first release sheet, and the same application as described above was applied except that the coating liquid was applied to one main surface thereof. After the operation, a PET film, an adhesive layer, and a second release sheet were sequentially laminated. Hereinafter, the plaque glue is referred to as "the first 矽 single-sided glue".

〔比較例1〕 [Comparative Example 1]

對於實施例1,將調製的矽系黏接劑組成物的塗工液,通過旋轉塗布法塗布在第2玻璃基板上(康寧社製,製品名:鷹XG)之後,將所獲得的塗布層在120℃加熱10分鍾,而得到由黏接 劑層和第2玻璃基板形成的積層體。以下,將此積層體稱作「第2積層體」。 In the first embodiment, the coating liquid of the prepared ruthenium-based adhesive composition was applied onto a second glass substrate (manufactured by Corning Co., Ltd., product name: Eagle XG) by a spin coating method, and the obtained coating layer was applied. Heating at 120 ° C for 10 minutes, resulting in bonding A layered body formed of the agent layer and the second glass substrate. Hereinafter, this laminated body will be referred to as a "second laminated body".

〔試驗例1〕 [Test Example 1]

對於各個通過實施例和比較例獲得的第1積層體及第2積層體,將其黏接劑層之主面貼付在第3玻璃基板(康寧社製,製品名:鷹XG)之後,獲得了2張玻璃基板通過黏接劑層貼付而成的積層體。即,獲得了由第1玻璃基板、黏接劑層和第3玻璃基板依次積層的積層體,以及由第2玻璃基板、黏接劑層和第3玻璃基板依次積層的積層體。將這些積層體在200℃的環境下放置1小時,之後進行了冷卻至室溫(23℃)的加熱處理。對各個加熱處理後的積層體,在剝離第3玻璃基板之後,觀察了是否僅在第3玻璃基板上附著了黏接劑層。 After the main surface of the adhesive layer was attached to the third glass substrate (product name: Eagle XG, manufactured by Corning Co., Ltd.), the first laminate and the second laminate obtained in the examples and the comparative examples were obtained. A laminated body in which two glass substrates are attached by an adhesive layer. In other words, a laminate in which the first glass substrate, the adhesive layer, and the third glass substrate are laminated in this order, and a laminate in which the second glass substrate, the adhesive layer, and the third glass substrate are laminated in this order are obtained. These laminates were allowed to stand in an environment of 200 ° C for 1 hour, and then subjected to heat treatment to cool to room temperature (23 ° C). After peeling off the third glass substrate for each laminated body after the heat treatment, it was observed whether or not the adhesive layer was adhered only to the third glass substrate.

將以上實驗進行10次之後,總計了僅在第3玻璃基板上附著黏接劑層的次數。其測定結果如表1所示。 After the above experiment was carried out 10 times, the number of times the adhesive layer was adhered only to the third glass substrate was totaled. The measurement results are shown in Table 1.

〔試驗例2〕 [Test Example 2]

在於實施例1,剝離所製作出的無基材雙面矽膠之第2剝離片之後,將露出的黏接劑層之主面(高黏接力面)貼付在未經剝離處理的聚對苯二甲酸乙二酯(PET)薄膜(厚度:25μm)的一個主面上,並獲得了由PET製薄膜、黏接劑層以及第1剝離片依次積層而成的矽單面膠。以下,將此矽單面膠稱作「第2矽單面膠」。 In the first embodiment, after peeling off the second release sheet of the substrate-free double-sided silicone which was produced, the main surface (high adhesion surface) of the exposed adhesive layer was attached to the unpeeled poly(p-phenylene). On one main surface of a film of ethylene formate (PET) (thickness: 25 μm), a single-sided adhesive of a PET film, an adhesive layer, and a first release sheet was sequentially laminated. Hereinafter, this unilateral rubber is referred to as "second 矽 single-sided adhesive".

對於各個第1矽單面膠和第2矽單面膠,通過剪為長250mm、寬25mm的矩形而得出單面膠帶。在剝離各個單面膠帶的剝離片之後,將露出的黏接劑層之主面(第1矽單面 膠是高黏接力面,第2矽單面膠是低黏接力面)分別貼付在玻璃基板(康寧社製,產品名:鷹XG)的主面上,獲得了由PET製薄膜、黏接劑層和玻璃基板形成的黏接劑層,而該黏接劑層面對玻璃基板之面的黏接力相異而得出2種積層體。將各個積層體分別載置在實驗台時,將PET製薄膜朝上,並在23℃、相對濕度50%的環境下,使用2kg增壓器往返加壓後,放置24小時以當作剝離試驗用樣品。對於由此獲得的剝離實驗用樣品,基於JIS Z0237:2009用拉伸試驗機(奧立特科社製,產品名:TENSILON),在剝離速度300mm/分、剝離角度180°的條件下,將由黏接劑層和PET製薄膜形成的積層體在上述玻璃基板剝離。由此測定了黏接劑層的低黏接力面或高黏接力面對於玻璃基板的黏接力(mN/25mm)。其測定結果如表2所示。 For each of the first one-sided rubber and the second single-sided adhesive, a single-sided tape was obtained by cutting into a rectangle having a length of 250 mm and a width of 25 mm. After peeling off the release sheet of each single-sided tape, the main surface of the exposed adhesive layer (the first side of the adhesive layer) Glue is a high-adhesive surface, and the second side of the single-sided adhesive is a low-adhesive surface. They are attached to the main surface of a glass substrate (manufactured by Corning Co., Ltd., product name: Eagle XG), and a PET film and adhesive are obtained. The adhesive layer formed on the layer and the glass substrate, and the adhesive force of the adhesive layer facing the surface of the glass substrate is different to obtain two kinds of laminated bodies. When each of the laminates was placed on the test bench, the PET film was placed upside down, and it was subjected to reciprocating pressurization using a 2 kg supercharger at 23 ° C and a relative humidity of 50%, and left for 24 hours as a peeling test. Use the sample. The peeling test sample thus obtained was subjected to a tensile tester (product name: TENSILON, manufactured by Orient Co., Ltd.) according to JIS Z0237:2009, and was subjected to a peeling speed of 300 mm/min and a peeling angle of 180°. The laminate formed of the adhesive layer and the PET film is peeled off on the glass substrate. Thus, the adhesion force (mN/25 mm) of the low adhesion surface or the high adhesion surface of the adhesive layer to the glass substrate was measured. The measurement results are shown in Table 2.

如表1和表2所示,具備能滿足本發明條件的實 施例之無基材雙面矽膠的黏接劑層,其一邊主面的黏接力和另一邊主面的黏接力相異,且再剝離控制性優異。 As shown in Tables 1 and 2, there are real conditions that can satisfy the conditions of the present invention. In the adhesive layer of the non-substrate double-sided silicone of the embodiment, the adhesive force of one main surface and the adhesive force of the other main surface are different, and the peeling controllability is excellent.

【產業上的可利用性】 [Industrial availability]

由於本發明中的無基材雙面矽膠,因其黏接劑層的再剝離控制性優異,故如在玻璃基板形成ITO膜時得到優選使用。 Since the baseless double-sided silicone of the present invention is excellent in re-peeling controllability of the adhesive layer, it is preferably used when an ITO film is formed on a glass substrate.

10‧‧‧無基材雙面矽膠 10‧‧‧No substrate double-sided silicone

1‧‧‧黏接劑層 1‧‧‧Adhesive layer

1A‧‧‧面對黏接劑層1之第1剝離面2A而積層的主面(低黏接力面) 1A‧‧‧ Main surface (low adhesion surface) laminated on the first peeling surface 2A of the adhesive layer 1

1B‧‧‧面對黏接劑層1的第2剝離面3A而積層的主面(高黏接力面) 1B‧‧‧ Main surface (high adhesion surface) which is laminated on the second peeling surface 3A of the adhesive layer 1

2‧‧‧第1剝離片 2‧‧‧1st peeling piece

2A‧‧‧第1剝離面 2A‧‧‧1st peeling surface

2a‧‧‧第1剝離處理層 2a‧‧‧1st peeling treatment layer

2b‧‧‧第1支持材 2b‧‧‧1st support material

3‧‧‧第2剝離片 3‧‧‧2nd peeling piece

3A‧‧‧第2剝離面 3A‧‧‧2nd peeling surface

3a‧‧‧第2剝離處理層 3a‧‧‧2nd peeling treatment layer

3b‧‧‧第2支持材 3b‧‧‧2nd support material

Claims (3)

一種無基材雙面矽膠,其特徵在於:具備積層體之結構,而其積層體依次配置了第1剝離片、由矽系黏接劑組成物形成的黏接劑層、第2剝離片,且上述黏接劑層的2個主面黏接力之差為2mN/25mm以上、20mN/25mm以下;上述黏接劑層中黏接力較高的主面之黏接力為700mN/25mm以下。 A non-substrate double-sided silicone having a structure in which a laminate is disposed, and a first release sheet, an adhesive layer formed of a ruthenium-based adhesive composition, and a second release sheet are disposed in this order. The difference between the adhesive strengths of the two main faces of the adhesive layer is 2 mN/25 mm or more and 20 mN/25 mm or less; and the adhesive force of the main surface having a high adhesive force in the adhesive layer is 700 mN/25 mm or less. 根據申請專利範圍第1項所述的無基材雙面矽膠,其中上述第1剝離片和上述第2剝離片中至少一個,為通過在支援體的至少一個主面上塗布氟系剝離劑而形成。 The substrate-free double-sided silicone according to claim 1, wherein at least one of the first release sheet and the second release sheet is coated with a fluorine-based release agent on at least one main surface of the support. form. 根據申請專利範圍第1或2項所述的無基材雙面矽膠,其中上述矽系黏接劑組成物包含:以矽氧烷結合為主骨架並將含有烯基的附加型有機聚矽氧烷作為構成成分的矽橡膠,以及相對所述矽橡膠100質量份為0.01質量份以上、3質量份以下的鉑催化劑,和相對所述矽橡膠100質量份為15質量份以上、100質量份以下的矽樹脂。 The non-substrate double-sided silicone according to claim 1 or 2, wherein the above-mentioned lanthanum adhesive composition comprises: an additional type of organic polyoxyl which contains an alkenyl group and a base group The ruthenium rubber having a olefin as a constituent component, and a platinum catalyst in an amount of 0.01 parts by mass or more and 3 parts by mass or less based on 100 parts by mass of the ruthenium rubber, and 15 parts by mass or more and 100 parts by mass or less based on 100 parts by mass of the ruthenium rubber. Resin.
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