TW201442854A - Composite material and fabricating method thereof - Google Patents

Abstract

A composite material including at least one first powder particle, and at least one second powder particle is provided, wherein the first powder particle and the second powder particle are suspended in a matrix material. The matrix material has a first density. The first powder particle has a second density greater than the first density. The second powder particle has a shell-like structure. A fabricating method of the composite material is also provided.

Description

Composite material and preparation method thereof

The present disclosure relates to a composite material composed of two or more powder particles and a preparation method thereof.

The powder particles can provide various effects by controlling the particle size or changing the material. In addition, the powder particles have the characteristics of easy processing, and the application fields of the powder particles are quite extensive. For example, common materials such as paints, cosmetics, and detergents use powder particles to achieve their desired effects. In addition, in the field of electronic products, the application of powder particles is more extensive. Taking the light-emitting diode package structure as an example, the wavelength conversion material used in the light-emitting diode package structure is powder particles.

Specifically, the method for fabricating the LED package structure is generally to first arrange the LED chip on the pedestal or the wafer carrier, and then apply the glue on the pedestal to the illuminating diode chip. A wavelength conversion layer is formed thereon, wherein the wavelength conversion layer mainly uses a colloidal material as a carrier to carry the powder particle-shaped wavelength conversion material to facilitate the step of filling the glue. However, in the step of filling, the powder The sedimentation of the granular wavelength converting material in the colloidal material causes the distribution and concentration of the wavelength converting material to be inconsistent with the intended design, which results in poor control of the illuminating quality of the light emitting diode package structure. Similarly, in other applications, the sedimentation of powder particles in the matrix material often results in products that fail to meet expected specifications.

The present disclosure provides a composite material composed of two or more powder particles and a preparation method thereof.

The composite material disclosed herein includes at least one first powder particle and at least one second powder particle. The second powder particles have a shell-like structure in which the first powder particles and the second powder particles are distributed in a matrix material.

One embodiment of the preparation method of the composite material disclosed herein is as follows. Providing at least one first powder particle provides at least one second powder particle. The first powder particles and the second powder particles are mixed with a coupling agent, wherein the second powder particles have a shell-like structure. Next, a bonding agent obtained by reacting the first powder particles and the second powder particles with a coupling agent is connected to each other to form a composite particle.

The above described features and advantages of the present invention will be more apparent from the following description.

10‧‧‧ powder particles

10A, 20, 20A, 20B, 20C, 34, 58‧‧‧ composite particles

12, 32, 42, 52, 132, 232, 332‧‧‧ matrix materials

14‧‧‧Shell

22‧‧‧Coupling agent

24, 44, 54, 134, 234‧‧‧ first powder particles

26‧‧‧Connecting agent

26a‧‧‧Cladding

28, 46, 56, 136, 236‧‧‧ second powder particles

30, 40, 50, 60‧‧‧ composite materials

56A‧‧‧shell

56B‧‧‧Nuclear material

100, 200, 300‧‧‧Light emitting diode package structure

110, 210, 310‧‧‧ wafer carrier

120, 220, 320‧‧‧Light Emitter Wafer

130, 230, 330‧‧‧Encapsulation materials

230A‧‧‧Powder Concentration Department

230B‧‧‧ powder sparse

334‧‧‧ Wavelength-converting powder particles

B‧‧‧ Magnetic field

Fb‧‧ buoyancy

Fg‧‧‧Gravity

Fh‧‧‧ fluid resistance

I, II, III, IV, V, VI‧‧‧ areas

S01~S04‧‧‧Steps

X, Y‧‧‧ coordinate axis

Figure 1A is a schematic illustration of the distribution of powder particles to a matrix material.

Figure 1B is a schematic illustration of composite particles.

2 is a schematic flow chart of a method for preparing a composite material according to an embodiment of the present disclosure.

3A-3B are schematic views showing a method of preparing a composite material according to another embodiment of the present disclosure.

4A through 4C are schematic views of several composite materials.

FIG. 5 is a schematic view of a composite material according to an embodiment of the present disclosure.

FIG. 6 is a schematic view of a composite material according to another embodiment of the present disclosure.

FIG. 7 is a schematic view of a composite material according to another embodiment of the present disclosure.

FIG. 8 is a schematic view of a composite material according to still another embodiment of the present disclosure.

FIG. 9 is a schematic view of a general light emitting diode package structure.

FIG. 10 is a cross-sectional view showing a first embodiment of a light emitting diode package structure according to the present disclosure.

FIG. 11 is a schematic diagram of a second embodiment of a light emitting diode package structure according to the present disclosure.

FIG. 12 is a distribution diagram of light emitted by a plurality of sets of light-emitting diode packages in a CIE color coordinate.

FIG. 13 is a distribution diagram of light emitted by a plurality of sets of light emitting diodes in a first embodiment using the disclosed light emitting diode package structure.

14 is another embodiment of the present invention, in which the first powder particles and the second powder particles are not bonded, but the light emitted from the light-emitting diode package structure uniformly distributed on the matrix material emits light at the CIE color coordinates. The distribution map in .

Figure 1A is a schematic illustration of the distribution of powder particles to a matrix material. Please refer to the figure 1A, when the powder particles 10 are distributed on the matrix material 12, the force applied to the powder particles 10 roughly includes the gravity Fg of the powder particles 10 itself, the buoyancy Fb of the matrix material 12, and the powder particles 10 in the matrix material 12. The fluid resistance Fh generated when moving. In general, the direction of gravity Fg is opposite to the direction of buoyancy Fb and fluid resistance Fh, and the sum of these three forces will determine whether powder particles 10 sink or float in matrix material 12. The matrix material 12 can be a fluid material such as eucalyptus oil, or an uncured colloidal material such as silicone, but not limited thereto.

The gravity Fg of the powder particles 10 is greater than the total of the buoyancy Fb and the fluid resistance Fh. At the same time, the powder particles 10 are settled and cannot be suspended in the matrix material 12, which is a problem that often occurs when the powder particles 10 are used. In particular, when the density of the powder particles 10 is greater than the density of the matrix material 12, the above-mentioned sedimentation problem is often not easily overcome. Therefore, the application of the powder particles 10 against the sedimentation problem and the anti-settling powder particles 10 in one embodiment of the present disclosure will be explained below.

The following description is only illustrative of the examples, and is not intended to limit the specific details and details of the disclosure.

If a low-density casing 14 is attached to the surface of the powder particles 10, as shown in FIG. 1B, a composite particle 10A is formed, and the composite particle 10A can be adjusted by adjusting the particle size or the number of the casing 14. Equivalent density. Assuming that the density of the powder particles 10 is d1, the weight is m1, the volume is v1, and the density of the casing 14 is d2, the weight is m2, and the volume is v2, the powder particles 10 are combined with the casing 14. After the composite particles 10A are formed, the equivalent density of the composite particles 10A is d3 = (m1 + m2) / (v1 + v2). That is, the equivalent density of the composite particles 10A must be smaller than the density of the powder particles 10. In this embodiment, the density adjustment of the composite particles is performed in this manner to achieve the purpose of balancing gravity and buoyancy.

Specifically, FIG. 2 is a schematic diagram of a composite material preparation process, and one embodiment of the composite material preparation method is as follows: Step S01: uniformly mixing the first powder and the second powder; Step S02: Ethyl ruthenate (TEOS) And the alcohol solution is uniformly mixed. Since the alcohol solution contains water (H ₂ O), the water can react with TEOS, and the alcohol functions to uniformly mix the TEOS of the oil phase and the H ₂ O of the aqueous phase. In such a mixing process, the alcohol does not participate in the reaction. Therefore, the reaction formula of the above mixing process is as follows: Si(OC ₂ H ₅ ) ₄ +H ₂ O→Si(OH) ₄ +4C ₂ H ₅ OH

Step S03: The mixed powder of S01 is mixed into a mixed solution of TEOS and an alcohol solution. At this time, TEOS reacts with an alcohol to form a colloid of Si(OH) ₄ , that is, a gel in which many Si(OH) _{4 are} bonded. At this time, ammonia water may be further added to accelerate the reaction of Si(OH) ₄ into SiO ₂ , wherein the ammonia water is a catalyst and does not participate in the reaction. The above reaction formula using ammonia as a catalyst is as follows: Si(OH) ₄ +Si(OH) ₄ →NH ₄ OH→SiO ₂ +H ₂ O

Step S04: removing residual water (H ₂ O) and the formed alcohol (C ₂ H ₅ OH) by high-temperature baking to form a film-like SiO ₂ , which is used to bond the first powder and the second powder. body.

3A-3B are schematic views showing a method of preparing a composite material according to another embodiment of the present disclosure. Referring to FIG. 3A, the composite material preparation method of the present embodiment may first provide a coupling agent 22 and mix a plurality of first powder particles 24 in the coupling agent 22. Here, the material of the coupling agent 22 is ethyl orthosilicate, but sodium silicate (Na ₂ SiO ₃ .nH ₂ O) may also be used. The material of the first powder particles 24 can be determined according to the needs of practical applications, such as wavelength conversion materials, pigments, dyes or other powder materials. Specifically, the coupling agent (TEOS) 22 may be first mixed with water, butanol or ethanol, and the first powder particles 24 may be added to the water-mixed coupling agent 22. The coupling agent 22 forms a layered colloid on the surface of the first powder particles 24 as a bonding agent 26 through a hydrolysis reaction. When the material of the coupling agent 22 is ethyl orthosilicate, the bonding agent 26 is made of cerium oxide. The hydrolysis reaction of the coupling agent may be added to the catalyst ammonia water to accelerate the formation of cerium oxide.

Next, referring to FIG. 3B, the second powder particles 28 are added to the coupling agent. 22 in a mixture with the first powder particles 24. At this time, the second powder particles 28 may be bonded to the at least one first powder particles 24 through the bonding agent 26 to constitute the composite particles 20. In this embodiment, the second powder particles 28 have a shell-like structure, which may be a casing. Here, the material of the casing includes cerium oxide, aluminum oxide, titanium oxide, chromium oxide, or a combination thereof. Additionally, in other embodiments, the housing may be filled with a core material to form second powder particles 28, while the core material may be magnetic or may have electric field drivable properties.

After the composite particles 20 are formed, a drying step is performed to remove the formation. The water and alcohols are obtained to obtain dried composite particles 20. Specifically, in the mixing process of FIG. 3B, the first powder particles 24 and the second powder particles 28 may be in accordance with various The modes are joined together, and thus the composite particles 20 can have a variety of aspects, with Figures 4A through 4C being schematic illustrations of several composite particles. 4A, the composite particles 20A may be joined by a first powder particle 24 and a second powder particle 28, and the bonding agent 26 is used to connect the first powder particles 24 with the second powder particles 28. . 4B, the composite particles 20B may be formed by joining a plurality of first powder particles 24 and a second powder particles 28, and the bonding agent 26 is used to connect the first powder particles 24 with the second powder particles. 28. 4C, the composite particles 20C are joined by at least one first powder particle 24 and at least one second powder particle 28, and the bonding agent 26 simultaneously coats the first powder particles 24 and the second powder. The particles 28 constitute a coating layer 26a of the composite particles 20C. That is, the bonding agent 26 can be used to bond the first powder particles 24 and the second powder particles 28 in addition to the first powder particles 24 and the second powder particles 28. .

In the present embodiment, the second powder particles 28 have a shell-like structure. especially, The second powder particles 28 are hollow shells. At this time, by the bonding of the second powder particles 28 and the first powder particles 24, the equivalent density of the composite particles 20, 20A, 20B, and 20C may be smaller than the density of the first powder particles 24 themselves. Therefore, the composite particles 20, 20A, 20B and 20C of the present embodiment are more easily suspended in a fluid or uncured matrix relative to the first powder particles 24 themselves, and are advantageous for the composite particles 20, 20A in a powder state. , 20B and 20C applications.

For example, FIG. 5 is a schematic view of a composite material according to an embodiment of the present disclosure. Referring to FIG. 5, the composite material 30 of the present embodiment includes a plurality of composite particles 34 distributed in a matrix material 32, wherein the composite particles 34 are prepared by the foregoing embodiments. It is produced by the method and thus can be composed of at least one of the composite particles 20, 20A, 20B and 20C. Specifically, each composite particle 34 is formed by joining at least one first powder particle 24 and at least one second powder particle 28, wherein each second powder particle 28 is a hollow shell.

Generally, the matrix material 32 has a first density and the first powder particles 24 have a second density, the second density being greater than the first density. When the denser first powder particles 24 are mixed in the less dense matrix material 32, the first powder particles 24 are susceptible to gravity (as shown in Figure 1) and settle.

In the present embodiment, the second powder particles 28 are provided having a hollow shell structure. When the first powder particles 24 and the second powder particles 28 are joined into the composite particles 34, the composite particles 34 have a The third density. Here, by adjusting the particle size and the number of the second powder particles 28 such that the third density is approximately equal to the first density of the matrix material 32, the composite particles 34 can be uniformly distributed in the matrix material 32, further improving the A problem of sedimentation of a powder particle 24 in the matrix material 32. In particular, the third density of composite particles 34 is substantially related to the ratio of the number of first powder particles 24 to second powder particles 28.

In one embodiment, the composite particles 34 may have hydrophobic properties, while the matrix material 32 may be non-polar or have hydrophobic properties such that the composite particles 34 may be uniformly distributed in the matrix material 32; likewise, when the composite particles 34 are hydrophilic In the case of sex, the matrix material is non-polar or hydrophilic. Further, the composite particles 34 must have the same polarity as the matrix material 32.

In one embodiment, the matrix material 32 is a colloidal material, and the material of the first powder particles 24 comprises a wavelength converting material, wherein the matrix material 32 has a first density of from 1 g/cm ³ to 2.5 g/cm ³ . The first powder particles 24 have a second density ranging from 2.5 g/cm ³ to 6 g/cm ³ . In order to uniformly distribute all of the composite particles 34 in the matrix material 32, the density of the second powder particles 28 may range from 0.01 g/cm ³ to 2 g/cm ³ , and the second powder particles 28 may be in the first powder particles. The total density (volume) of 24 and the second powder particles 28 may be from 0.5% to 100%, and the third density of the composite particles 34 may range from 1 g/cm ³ to 1.5 g/cm ³ . Of course, the above materials and numerical values are for illustrative purposes only and are not intended to limit the disclosure. In other embodiments, the first powder particles 24 can be dyes, pigments, or other particulate materials.

FIG. 6 is a schematic view of a composite material according to another embodiment of the present disclosure. Referring to FIG. 6, the composite material 40 includes a plurality of first powder particles 44 and a plurality of second powder particles 46. The first powder particles 44 and the second powder particles 46 are mixed in a matrix material 42. 42 has a first density, first powder particles 44 have a second density, and second density is greater than the first density. The second powder particles 46 have a shell-like structure, and the second powder particles 46 are substantially hollow shells.

According to the force diagram of FIG. 1A, the second density of the first powder particles 44 of the present embodiment is greater than the first density of the matrix material 42, so that the first powder particles 44 are susceptible to gravity and settle in the matrix material 42. . The second powder particles 46 have a hollow structure, and can be uniformly distributed in the matrix material 42 by adjusting the particle size of the second powder particles 46 so that the equivalent density thereof is not larger than the matrix material 42. Therefore, when the first powder particles 44 settle in the matrix material 42, the second powder particles 46 can block the sinking of the first powder particles 44, and the first powder particles 44 can be suspended. In the matrix material 42. In the present embodiment, the materials and densities of the matrix material 42, the first powder particles 44 and the second powder particles 46 can be referred to the description of the foregoing embodiments without further elaboration.

The above embodiments are all examples in which the second powder particles have a hollow structure. Ming, but this disclosure is not limited to this. In other embodiments, the interior of the second powder particles may be filled with a core material, and the core material is, for example, a magnetic material. At this time, by the bonding of the second powder particles and the first powder particles, the composite particles can be moved by the action of a magnetic field or an electric field. For example, FIG. 7 is a schematic view of a composite material according to another embodiment of the present disclosure. Referring to FIG. 7, the composite material 50 includes a plurality of first powder particles 54 and a plurality of second powder particles 56, and the first powder particles 54 and the second powder particles 56 are mixed in the matrix material 52. The matrix material 52 has a first density, the first powder particles 54 have a second density, and the second density is greater than the first density. The second powder material 56 has a shell-like structure and includes a housing 56A and a core material 56B, wherein the core material 56B is filled in the housing 56A. In addition, at least one of the first powder particles 54 and the at least one second powder particles 56 are joined to each other to form composite particles 58, wherein at least one of the first powder particles 54 and the at least one second powder particles 56 may be as shown in FIG. 2 or The preparation methods of FIGS. 3A to 3B are joined to each other.

In the present embodiment, the core material 56B has magnetic properties. Therefore, composite particles 58 can move in the matrix material 42 as the magnetic field B is applied. As a result, regardless of whether the density of the first powder particles 54 and the second powder particles 56 is smaller than the matrix material 52 by the application of the magnetic field B, the first powder particles 54 and the second powder particles 56 can be suspended or It is evenly distributed in the matrix material 52 without sinking to the bottom.

FIG. 8 is a schematic view of a composite material according to still another embodiment of the present disclosure. Referring to FIG. 8, the composite material 60 includes a plurality of first powder particles 54 and a plurality of second powder particles 56, and the first powder particles 54 and the second powder particles 56 are distributed in the matrix material 52. The density and properties of the matrix material 52, the first powder particles 54, and the second powder particles 56 can be referred to the relevant description of FIG. 7, and details are not described herein again. However, the first powder particles 54 and the second powder particles 56 of the present embodiment are respectively distributed in the matrix material 52 without being joined together.

In the present embodiment, the core material 56B has magnetic properties. Therefore, the second powder particles 56 can move in the matrix material 52 as the magnetic field B is applied. As such, the second powder particles 56 can be suspended in the matrix material 52 by the application of the magnetic field B. At this time, the first powder particles 54 are blocked by the second powder particles 56 during sedimentation, and thus the first powder particles 54 may be suspended in the matrix material 52. In other words, regardless of whether the gravity received by the first powder particles 54 and the second powder particles 56 is greater than the sum of the buoyancy and the fluid resistance, the first powder particles 54 and the second powder particles 56 can be applied to the magnetic field B. The suspension is suspended in the matrix material 52 without sinking to the bottom.

Each of the above embodiments proposes a method of making the powder particles less likely to settle in the matrix material. In order to further illustrate the spirit of the present disclosure, the application of composite particles and composite materials will be described below by taking a light-emitting diode package structure and related components as an example. The following application modes are for illustrative purposes only, and are not intended to limit the technical field and specific conditions to which the disclosure is applied.

FIG. 9 is a schematic view of a general light emitting diode package structure. Referring to FIG. 9 , the LED package structure 300 includes a wafer carrying portion 310 and a light emitting diode crystal. Sheet 320 and an encapsulating material 330. The LED chip 320 is disposed on the wafer carrier 310, and the encapsulation material 330 is filled in the wafer carrier 310 and covers the LED substrate 320. The encapsulating material 330 includes a matrix material 332 and a plurality of wavelength converting powder particles 334, wherein the matrix material 332 can be an encapsulant. As shown, the wavelength converting powder particles 334 are concentratedly distributed at the bottom of the matrix material 332. That is to say, the wavelength-converting powder particles 334 are also subjected to gravity in the matrix material to settle in the matrix material 332, resulting in uneven distribution of light emitted by the light-emitting diode.

10 is a cross section of a first embodiment of a light emitting diode package structure according to the present disclosure schematic diagram. Referring to FIG. 10 , the LED package structure 100 includes a wafer carrier 110 , a LED chip 120 , and an encapsulation material 130 . The light emitting diode chip 120 is disposed on the wafer carrying portion 110. The encapsulation material 130 is filled on the wafer carrier 110 and covers the LED wafer 120. The encapsulating material 130 includes a matrix material 132, a plurality of first powder particles 134, and a plurality of second powder particles 136. The first powder particles 134 are distributed in the matrix material 132 and the material of the first powder particles 134 includes a wavelength converting material. The second powder particles 136 are also distributed in the matrix material 132 and the second powder particles 136 have a shell-like structure. The LED wafer 120 can be disposed on the wafer carrier 110 in a known manner, for example, by flip chip bonding or the like.

In the present embodiment, the matrix material 132 is an encapsulant material comprising epoxy resin, silicone rubber, glass, and the matrix material 132 has a density of about 1 g/cm ³ to 2.5 g/cm ³ when uncured. The material of the first powder particles 134 includes a wavelength converting material having a density of about 2.5 g/cm ³ to 6 g/cm ³ which is greater than the density of the uncured matrix material 132. If the first powder particles 134 are directly added to the uncured matrix material 132, the first powder particles 134 are liable to settle in the matrix material 132.

Therefore, the encapsulation material 130 further includes second powder particles 136, The second powder particles 136 have a shell-like structure to help prevent sedimentation of the first powder particles 134 in the matrix material 132 during the manufacturing process. The second powder particles 136 may selectively have light scattering or reflective properties, and may have high transmittance for visible light, for example, a light transmittance of more than 70%, preferably more than 80%, to facilitate light emission. The light extraction efficiency of the polar package structure 100. In the present embodiment, the second powder particles 136 have a particle diameter ranging from 0.01 μm to 100 μm, and the second powder particles 136 account for 0.5% of the total weight of the first powder particles 134 and the second powder particles 136. To 100%.

As shown in FIG. 10, in order to reduce or avoid the first powder particles 134 on the base The sedimentation occurs in the material 132, and the first powder particles 134 and the second powder particles 136 may be first prepared into composite particles by the foregoing method, and then the composite particles are mixed with the uncured matrix material 132 to form a composite material, and then The composite material is formed on the light-emitting diode wafer 120 by dispensing or dropping or coating, and finally the composite material is cured to form the packaging material 130.

In the present embodiment, the second powder particles 136 may be a hollow casing as shown in FIG. When the material of the second powder particles 136 is cerium oxide, the density thereof is, for example, 0.01 g/cm ³ to 2 g/cm ³ . Further, the composite particles in which the first powder particles 134 and the second powder particles 136 are joined have an equivalent density of about 1 g/cm ³ to 1.5 g/cm ³ which is close to that of the uncured matrix material 132. The density, therefore, the composite particles can be evenly distributed in the uncured matrix material 132. The bonding agent for providing the bonding of the first powder particles 134 and the second powder particles 136 may have a high transmittance to visible light, for example, a transmittance of more than 70%, preferably more than 80%, and a refractive index substantially equal to The refractive index of the matrix material is close to, for example, when the matrix material is an encapsulant, and the refractive index of the encapsulant ranges from 1.4 to 1.6, the refractive index of the bonding agent may range from 1.0 to 2.0.

In another embodiment, the second powder particles 136 may have a housing structure A core material, and the core material is magnetic, a magnetic field may be applied during the mixing of the composite particles with the uncured matrix material 132 to suspend the composite particles so that the composite particles are uniformly distributed in the matrix material 132. At this time, the equivalent density of the composite particles may not be limited to less than or equal to the density of the uncured matrix material 132.

In addition, in other embodiments, the first powder particles 134 and the second powder particles The particles 136 and the uncured matrix material 132 can also be prepared in the manner of Figure 6 or Figure 8.

11 is a schematic view of a second embodiment of a light emitting diode package structure according to the present disclosure Figure. Referring to FIG. 11 , the LED package structure 200 includes a wafer carrier 210 , a LED chip 220 , and an encapsulation material 230 . The LED wafer 220 is disposed on the wafer carrier 210, and the encapsulation material 230 is filled in the wafer carrier 210 and covers the LED wafer 220. The encapsulating material 230 includes a matrix material 232, a plurality of first powder particles 234, and a plurality of second powder particles 236, wherein the matrix material 232 is an encapsulant, and the first powder particles 234 are distributed in the matrix material 232. The material of the first powder particles 234 includes a wavelength converting material. The second powder particles 236 are also distributed in the matrix material 232. At the same time, the second powder particles 236 have There is a shell structure.

Specifically, the difference between this embodiment and the embodiment of FIG. 10 is that the implementation The encapsulating material 230 of the example has a powder concentration portion 230A and a powder thinning portion 230B, and the powder thinning portion 230B is located between the light emitting diode wafer 220 and the powder concentration portion 230A. That is, the distribution density of the first powder particles 234 and the second powder particles 236 in the powder concentration portion 230A is larger than the distribution density at the powder thin portion 230B. The first powder particles 234 and the second powder particles 236 can be prepared into composite particles by the manner of FIGS. 2 and 3, and the equivalent density of the composite particles is less than the density when the matrix material 232 is not cured. Therefore, the composite particles can be suspended on the surface of the uncured matrix material 232 and concentratedly distributed in the powder concentration portion 230A.

Figure 12 is a plurality of sets of light emitted by a general light-emitting diode package structure. Distribution map in the CIE color coordinates. FIG. 13 is a distribution diagram of a plurality of sets of light emitted by the first embodiment of the light emitting diode package structure in the CIE color coordinates. 14 is another embodiment of the present invention, in which the first powder particles and the second powder particles are not bonded, but the light emitted from the light-emitting diode package structure uniformly distributed on the matrix material emits light at the CIE color coordinates. The distribution map in . In Figures 12-14, X and Y respectively represent the coordinate axis, and the triangular symbol indicates the position of the light emitted by each group of light-emitting diode packages in the CIE color coordinates before the matrix material is cured, and the square symbol indicates the matrix material. After curing, the light emitted by each group of light emitting diode packages is in the CIE color coordinates.

As can be seen from FIG. 12, the light emitted by the general light emitting diode package structure is used. There is a significant drop in the distribution in the CIE color coordinates before and after curing of the matrix material. Example In contrast, the distribution in the CIE color coordinates before curing is concentrated in the region I, and the distribution in the CIE color coordinates after curing is concentrated in the region II. As can be seen from Fig. 13, the light emitted by the first embodiment of the present invention has a relatively concentrated distribution in the CIE color coordinates before and after curing of the matrix material. As shown, the distribution in the CIE color coordinates before solidification is concentrated in region III, and the distribution in the CIE color coordinates after solidification is concentrated in region IV. As can be seen from FIG. 14, the light emitted by another embodiment of the disclosed light-emitting diode package structure is relatively concentrated in the CIE color coordinates before and after the matrix material is cured. As shown, the distribution in the CIE color coordinates before solidification is concentrated in the region V, and the distribution in the CIE color coordinates after solidification is concentrated in the region VI. From the above, it can be seen that the disclosed embodiment utilizes the arrangement of the second powder particles to improve the settlement problem, and a light-emitting diode package structure having uniform light colors can be obtained.

In Fig. 12, because the first powder particles are settled, the light emitting diode package The color coordinates of the light emitted by the structure are shifted from region I to region II, causing a deviation in the color of the light. Therefore, in order to make the light emitted by the light-emitting diode package structure more concentrated in the color coordinates, the glue mixed with the composite particles can be used to compensate, so that the light color originally falling in the color coordinate area II returns to the region I.

In summary, the present disclosure proposes mixing or combining the first powder particles with the second powder particles having a shell structure to reduce or prevent the first powder particles from settling in the matrix material. . The use of the composite particle preparation method of the disclosed embodiment or the use of the composite material of the disclosed embodiment to fabricate the package material of the light emitting diode package structure contributes to improving the color consistency of the light emitting diode package structure.

24‧‧‧First powder particles

28‧‧‧Second powder particles

30‧‧‧Composite materials

32‧‧‧Material materials

34‧‧‧Composite particles

Claims (23)

A composite material comprising: at least one first powder particle; and at least one second powder particle, the at least one second powder particle having a shell structure, wherein the at least one first powder particle and the at least one The second powder particles are distributed in a matrix material. The composite material of claim 1, wherein the at least one first powder particle is bonded to the at least one second powder particle to form at least one composite particle. The composite material of claim 2, wherein the matrix material has a first density, and the at least one composite particle has a second density, the second density being no greater than the first density. The composite material according to claim 3, wherein the second density of the at least one composite particle ranges from 1 g/cm ³ to 1.5 g/cm ³ . The composite material according to claim 2, wherein the at least one first powder particle and the at least one second powder particle are joined by a bonding agent. The composite material according to claim 5, wherein the material of the bonding agent comprises cerium oxide, cerium oxide, titanium oxide, zinc oxide, cerium oxide, and aluminum oxide. The composite material according to claim 2, wherein the bonding agent coats the at least one first powder particle and the at least one second powder particle to form a coating layer of the at least one composite particle. The composite of claim 7, wherein the at least one composite particle and the matrix material have the same polarity. The composite material of claim 1, wherein the at least one second powder particle comprises a shell. The composite material according to claim 9, wherein the at least one second powder particle further comprises a core material filled in the casing. The composite material of claim 10, wherein the core material is magnetic. The composite material according to claim 9, wherein the material of the casing is cerium oxide, aluminum oxide, titanium oxide, chromium oxide, or a combination thereof. The composite material according to claim 1, wherein the at least one second powder particle has a particle size ranging from 0.01 μm to 100 μm. The composite material according to claim 1, wherein the at least one second powder particle accounts for 0.5% to 100% of the total weight of the at least one first powder particle and the at least one second powder particle. . The composite material according to claim 1, wherein the material of the at least one first powder particle comprises a wavelength converting material, a dye, a pigment or a combination thereof. The composite material according to claim 1, wherein the at least one second powder particle has a density ranging from 0.01 g/cm ³ to 2 g/cm ³ . The composite material of claim 1, wherein the matrix material is a colloidal material. A method for preparing a composite material, comprising: providing at least one first powder particle; providing at least one second powder particle; performing the at least one first powder particle and the at least one second powder particle with a coupling agent Mixing, wherein the at least one second powder particle has a shell-like structure; and a bonding agent obtained by reacting the at least one first powder particle with the at least one second powder particle by the coupling agent is connected to each other Composite particles. The method for preparing a composite material according to claim 18, wherein the material of the coupling agent comprises ethyl orthosilicate, sodium citrate or a combination thereof. The method for preparing a composite material according to claim 18, wherein the material of the bonding agent comprises cerium oxide, cerium silicate, titanium oxide, zinc oxide, cerium oxide, aluminum oxide or a combination thereof. The method for producing a composite material according to claim 18, wherein the coupling agent forms a binder by a hydrolysis reaction. The method for preparing a composite material according to claim 18, further comprising performing a drying step after forming the composite particles. The method for preparing a composite material according to claim 18, wherein the at least one second powder particle accounts for 0.5 of the total weight of the at least one first powder particle and the at least one second powder particle. % to 10%.