TW201442066A - 圖案構造體之製造方法 - Google Patents

圖案構造體之製造方法 Download PDF

Info

Publication number
TW201442066A
TW201442066A TW103111376A TW103111376A TW201442066A TW 201442066 A TW201442066 A TW 201442066A TW 103111376 A TW103111376 A TW 103111376A TW 103111376 A TW103111376 A TW 103111376A TW 201442066 A TW201442066 A TW 201442066A
Authority
TW
Taiwan
Prior art keywords
substrate
coating
applicator
release material
resin
Prior art date
Application number
TW103111376A
Other languages
English (en)
Chinese (zh)
Inventor
Tetsuya Murakami
Takashi Miyagawa
Hiroyuki Itou
Shuji Ichikawa
Seiichi Takigawa
Original Assignee
Sumitomio Corp
Mitsubishi Pencil Co
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Sumitomio Corp, Mitsubishi Pencil Co filed Critical Sumitomio Corp
Publication of TW201442066A publication Critical patent/TW201442066A/zh

Links

Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/10—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern
    • H05K3/14—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using spraying techniques to apply the conductive material, e.g. vapour evaporation
    • H05K3/146—By vapour deposition
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/0073—Masks not provided for in groups H05K3/02 - H05K3/46, e.g. for photomechanical production of patterned surfaces
    • H05K3/0079—Masks not provided for in groups H05K3/02 - H05K3/46, e.g. for photomechanical production of patterned surfaces characterised by the method of application or removal of the mask
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/09—Shape and layout
    • H05K2201/09009—Substrate related
    • H05K2201/09045—Locally raised area or protrusion of insulating substrate
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/01—Tools for processing; Objects used during processing
    • H05K2203/0104—Tools for processing; Objects used during processing for patterning or coating
    • H05K2203/0126—Dispenser, e.g. for solder paste, for supplying conductive paste for screen printing or for filling holes

Landscapes

  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Coating Apparatus (AREA)
  • Weting (AREA)
  • Exposure Of Semiconductors, Excluding Electron Or Ion Beam Exposure (AREA)
  • Application Of Or Painting With Fluid Materials (AREA)
TW103111376A 2013-03-29 2014-03-27 圖案構造體之製造方法 TW201442066A (zh)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2013071129A JP2014195015A (ja) 2013-03-29 2013-03-29 パターン構造体の製造方法

Publications (1)

Publication Number Publication Date
TW201442066A true TW201442066A (zh) 2014-11-01

Family

ID=51624026

Family Applications (1)

Application Number Title Priority Date Filing Date
TW103111376A TW201442066A (zh) 2013-03-29 2014-03-27 圖案構造體之製造方法

Country Status (3)

Country Link
JP (1) JP2014195015A (ja)
TW (1) TW201442066A (ja)
WO (1) WO2014157051A1 (ja)

Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
GB2556331A (en) * 2016-09-14 2018-05-30 British American Tobacco Investments Ltd A container

Family Cites Families (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS6069636U (ja) * 1983-10-21 1985-05-17 アルプス電気株式会社 ペン式記録装置
JP2637398B2 (ja) * 1986-01-23 1997-08-06 鐘淵化学工業株式会社 薄膜パターン形成方法
JPH05326645A (ja) * 1992-05-19 1993-12-10 Hitachi Cable Ltd Ｔａｂ用フィルムキャリアテープの製造方法
JP2001009349A (ja) * 1999-06-29 2001-01-16 Sony Corp レジスト膜描画装置と薄膜パターンの形成方法およびそれによる光学部品
JP2004151548A (ja) * 2002-10-31 2004-05-27 Seiko Epson Corp 電気光学装置及び電子機器
KR20140030196A (ko) * 2011-05-20 2014-03-11 스미토모 쇼지 가부시키가이샤 패턴 구조체의 제조방법

Also Published As

Publication number Publication date
WO2014157051A1 (ja) 2014-10-02
JP2014195015A (ja) 2014-10-09

Similar Documents

Publication Publication Date Title
CN101541894B (zh) 碳纳米管油墨
ES2803244T3 (es) Procedimiento de impresión y tinta líquida de chorro de tinta
ATE404644T1 (de) Tintenstrahldrucktinten mit geliermittel
JP2013544917A (ja) ナノワイヤーインク組成物およびその印刷
JP2011144357A (ja) 水性マーキングインク組成物
US20110007265A1 (en) Honeycomb Coating Melanin Lens and Manufacturing Process Thereof
EP1372195A3 (en) Organic el element manufacturing process and organic el element
TW201442066A (zh) 圖案構造體之製造方法
CN101765507B (zh) 流体喷射器装置
EP3647378A1 (en) Oil-based ink composition for writing implements
US20220017760A1 (en) Oil-based ink composition for writing utensils, writing utensil using same, and airbrush unit using same
KR101712183B1 (ko) 전도성 패턴을 형성하는 광소결 시스템
JPWO2019215851A1 (ja) インクジェットヘッド及び画像形成方法
WO2017115843A1 (ja) 筆記具
JP7433063B2 (ja) 装飾用マーキングペンセット、これを有するエアブラシキット、及び装飾方法
JP2009023344A5 (ja)
KR101904292B1 (ko) 인쇄 방법
JP2007260356A (ja) ゴルフボール表面にマークを形成する方法
JP2019059103A (ja) 積層造形用粉末、三次元造形用材料セット、三次元造形装置及び三次元造形物
CN117355577A (zh) 书写工具用墨液组合物和收容书写工具用墨液组合物而成的书写工具
CN108688334A (zh) 玻璃照片的制作方法及玻璃照片
CN117157364A (zh) 书写工具用油性墨组合物
EP1826013A3 (en) Thermal head and thermal printer using the same
JP5407103B2 (ja) 機能性薄膜形成用組成物およびそれを用いた機能性薄膜形成方法
KR102057044B1 (ko) 벽지