TW201441603A - Assembly and method for testing and classifying LED wafers - Google Patents

Abstract

A assembly and method for testing and classifying LED wafers is disclosed. The assembly includes a plurality of cassettes, an optical detection device, a first transferring unit and a second transferring unit. The cassettes, where the LED wafers settle in, are disposed in an untested region or a tested region. The optical detection device is disposed between the untested region and the tested region for examining the LED wafers. The first transfer unit moves the LED wafer from the untested region to the optical detection device, and the second transfer unit moves the LED wafer from the optical detection device to the tested region.

Description

Detection assembly and method for detecting and classifying LED wafers 【0001】

The invention relates to a detection assembly and a method for detecting an LED wafer, in particular to a detection assembly and a method for quickly detecting and classifying a plurality of LED wafers.

【0002】

With the rise of energy-saving and power-saving awareness, and the need for 3C products to be thinner and lighter, it is inevitable to use LEDs (light-emitting diodes) as light sources instead of traditional light bulbs to reduce power consumption and improve luminous efficiency. trend. As a result, the yield requirements for LED substrate-LED wafers have become stricter.

[0003]

In order to reduce package defects and improve overall yield before splitting the die on the LED wafer for subsequent packaging operations, yield detection is typically performed on the wafer units on the wafer, followed by subsequent packaging. operation.

[0004]

In the conventional testing operation, the wafer is loaded into the optical detecting instrument by manual operation, and the wafer unit in the wafer on the optical detecting instrument is also manually viewed. Therefore, since this method discriminates and records defects on the wafer in an artificial manner, it has a slow detection speed.

[0005]

On the other hand, considering the cost factor, in the above-mentioned testing operations, sampling detection is often used. As a result, this type of detection method will have the following disadvantages: one is manual detection and cannot effectively analyze the cause of formation of wafer defects, and in the absence of data analysis, it is beneficial to improve the process to improve the overall yield. In fact, the detection by manual means will inevitably lead to omission due to the instability of the physical and mental state of the tester; in addition, the efficiency of manual detection is relatively low, so the overall manufacturing cost will be increased.

[0006]

In addition, most of the conventional detection methods use the highest allowable defect as the measurement standard. Therefore, only the measured wafers are roughly classified into good products and defective products in terms of classification, and these products and defective products are intended to be classified. It is a non-economic practice to conduct separate tests for each further level of separation.

【0007】

In view of this, how to improve and improve the above-mentioned defects to provide a device and method for quickly detecting and classifying a plurality of LED wafers is an urgent problem to be solved in the industry.

[0008]

It is an object of the present invention to provide a LED wafer inspection assembly and method that can be used to quickly detect and classify a plurality of LED wafers.

【0009】

Another object of the present invention is to provide a LED wafer inspection assembly and method that can further screen and classify LED wafers that are classified as good and defective.

[0010]

To achieve the above objective, a detection assembly disclosed by the present invention is suitable for detecting and classifying a plurality of LED wafers. The detection assembly includes: a plurality of cassettes, an optical detecting device, a first conveying unit, and a second Conveying unit. The plurality of cassettes are respectively disposed in a test area and a measurement area for carrying the LED wafers. The optical detecting device is disposed between the area to be tested and the measuring area to detect the LED wafers. The first transport unit is adapted to move the LED wafers from the cassettes of the test area to the optical detection device, and the second transport unit is adapted to move the LED wafers from the optical detection device to the measurement area. The card is in the middle. Wherein, after the first transport unit moves the LED wafers from the card to the optical detecting device, the optical detecting device is adapted to perform a detecting operation on the LED wafers, and the second conveying unit is further configured according to the One of the detection data obtained by the inspection operation moves the LED wafers into the cassettes of the measurement area.

[0011]

The invention also includes a detection method that can be tested in conjunction with the above-described detection assembly, the steps of which are as follows. After the plurality of LED wafers to be tested are disposed in a to-be-tested area, the LED wafers are moved from the to-be-tested area to an optical detecting device. The LED wafers moved to the optical detecting device are adapted to perform a detecting operation, and the LED wafers are moved to a measurement area according to one of the measured data measured by the detecting operation. The LED wafers are placed in different cassettes in the measurement area according to different detection data, so that the screening and classification detection operations can be completed at the same time.

[0012]

The above objects, technical features and advantages will be apparent to those skilled in the art, and the following detailed description of the preferred embodiments of the invention.

10. . . Machine

100. . . Testing assembly

200. . . Card

210. . . Area to be tested

210a. . . First test area

210b. . . Second test area

220. . . Measuring zone

220a. . . First measurement zone

220b. . . Second measurement zone

222. . . Good area

224. . . Bad product area

230. . . Detection area

300. . . Optical detection device

310. . . Detection platform

312. . . Holding component

320. . . Adsorption assembly

322. . . Adsorption tank

330. . . Image projection assembly

340. . . Optical lens

350. . . Arithmetic unit

400. . . First conveying unit

410. . . First arm

500. . . Second conveying unit

510. . . Second arm

600. . . Buckle element

700. . . LED wafer

[0013]

1 is a schematic view showing the appearance of a machine for accommodating the detection assembly of the present invention;
Figure 2 is a schematic view showing the mounting assembly of the present invention mounted on a machine table;
Figure 3 is a top view of the first embodiment of the detection assembly of the present invention;
Figure 4 is a side view showing a first embodiment of the detecting assembly of the present invention;
Figure 5 is a schematic view showing an image projection assembly and a plurality of optical heads of the optical detecting device of the detecting assembly of the present invention;
Figure 6 is a schematic view of the detection platform of the detection assembly of the present invention;
Figure 7 is a schematic view showing the holding member of the detecting assembly of the present invention. Figure 8 is a schematic view showing the adsorption assembly of the detecting assembly of the present invention;
Figure 9 is a top view of a second embodiment of the detection assembly of the present invention;
Figure 10 is a top view of a third embodiment of the detection assembly of the present invention; and Figures 11 and 12 are block diagrams showing the steps of detecting and classifying a plurality of LED wafers of the present invention.

[0014]

As shown in FIG. 1, it is a schematic view for accommodating one machine 10 of one of the detecting assemblies 100 of the present invention, and FIG. 2 is a mounting assembly 100 of the present invention installed on the machine table 10. The schematic on the top.

[0015]

As shown in FIG. 1 and FIG. 2, the machine 10 is configured to accommodate the inspection assembly 100, so that the inspection assembly 100 can be isolated from the external environment during the process of detecting the plurality of LED wafers 700 to avoid external Improper intrusion of material results in damage to the inspection assembly 100 and the plurality of LED wafers 700.

[0016]

Referring to Figures 3 and 4, the test assembly 100 of the present invention is used to detect and classify a plurality of LED wafers 700. The inspection assembly 100 includes a plurality of cassettes 200, an optical detecting device 300, a first conveying unit 400, and a second conveying unit 500. The plurality of cassettes 200 are respectively disposed in a to-be-tested area 210 and a measurement area 220 for carrying a plurality of LED wafers 700. The optical detecting device 300 is disposed in a detecting area 230 between the area to be tested 210 and the measuring area 220 for detecting the plurality of LED wafers 700. Preferably, the area to be tested 210 and the measurement area 220 are centered on the optical detection device 300, and are disposed annularly on the outer side of the optical detection device 300, and the first delivery unit 400 is disposed on the area to be tested 210 and the optical detection device 300. The second transport unit 500 is disposed between the measurement area 220 and the optical detecting device 500.

[0017]

When the detecting operation of the LED wafer 700 is to be performed, the first transport unit 400 is adapted to move the LED wafer 700 from the card 200 of the test area 210 to the optical detecting device 300 of the detecting area 230, and The second transport unit 500 is adapted to move the detected LED wafer 700 from the optical detection device 300 of the detection zone 230 to the cassettes 200 of the measurement zone 220.

[0018]

Further, after the first transport unit 400 moves the LED wafer 700 from the cassette 200 of the test area 210 to the optical detection device 300 of the detection area 230, the optical detection apparatus 300 can perform one for the LED wafer 700. After the detection operation, the second transport unit 500 moves the LED wafer 700 from the optical detecting device 300 of the detecting area 230 to the appropriate position of the cassette 200 of the measuring area 220 according to one of the detection data obtained by the detecting operation. In the middle, the screening and classification of the LED wafer 700 is completed.

[0019]

In the embodiment, the optical detecting device 300 includes a detecting platform 310, an adsorption assembly 320, an image projection assembly 330, a plurality of optical lenses 340, and an operation unit 350. Please refer to the schematic diagram of the image projection assembly 330 and the complex optical head 340 of the optical detecting device 300 of the detecting assembly 100 of the present invention as shown in FIG. 5, and the total detection of the present invention as shown in FIG. A schematic diagram of the adsorption assembly 320 of 100. The detection platform 310 is configured to place the LED wafer 700 to be inspected; the adsorption assembly 320 is embedded in the detection platform 310 to adsorb and fix the LED wafer 700; and the image projection assembly 330 can sequentially project the plurality The LED wafer 700 is imaged on the detection platform 310. Finally, the plurality of optical lenses 340 are adapted to receive the images reflected by the LED wafer 700, so that the computing unit 350 can perform the images received by the optical lenses 340. Processing and analysis to complete related testing operations.

[0020]

It should be understood that the foregoing plurality of images may be visible light images or invisible light images, which are selected according to different wafer testing requirements, and the plurality of optical lenses 340 may also be selected according to the visible light image or the invisible light image.

[0021]

In detail, in the embodiment shown in FIG. 5, the plurality of optical lenses 340 are two optical lenses 340, and one of the two optical lenses 340 is disposed toward the LED wafer 700 to receive the reflection of the LED wafer 700. The other of the two optical lenses 340 are biased to the LED wafer 700 and are also used to receive the images reflected by the LED wafer 700. In this way, since the image reflected by the LED wafer 700 is simultaneously received by the optical lens 340 and the offset optical lens 340 which are disposed in the forward direction, it is helpful to improve the quality of image analysis. In this way, after the operation of the arithmetic unit 350, appropriate data data can be obtained to determine the detection result.

[0022]

In the preferred embodiment shown in FIG. 5, the offset angle of the two optical lenses 340 is about 45 degrees, but is not limited thereto. Therefore, the user can increase or decrease the number of the optical lenses 340 and the offset angle between the plurality of optical lenses 340 according to other requirements.

[0023]

As shown in FIG. 6, the adsorption assembly 320 is embedded in the detection platform 310. As shown in FIG. 7 , the detecting platform 310 can further include a plurality of holding members 312 , so that the plurality of holding members 312 are received inside the detecting platform 310 for lifting and holding on the detecting platform 310 . LED wafer 700.

[0024]

In this way, when the first transport unit 400 transports the LED wafer 700 to be tested from the to-be-tested area 210 to the detection platform 310, the plurality of holding elements 312 will be raised first, so that the first conveying unit 400 can be easily The LED wafer 700 is placed on the plurality of holding members 312 while the plurality of holding members 312 can carry the LED wafer 700; after the first conveying unit 400 removes the LED wafer 700 and homing, the plurality of holding members 312 will be lowered, so that the LED wafer 700 is placed above the detection platform 310, and is adsorbed and fixed for the adsorption assembly 320 for detection; finally, after the relevant detection operation is completed, the LED wafer 700 will be re-multipleed. The component 312 is supported upwardly for the second transport unit 500 to transport the LED wafer 700 to one of the good areas 222 or one defective area 224 of the measurement area 220 according to the detection result.

[0025]

As shown in FIG. 8, the adsorption assembly 320 is provided with a plurality of adsorption grooves 322, which can correspond to the size of different LED wafers 700 (eg, 2, 4, 6 and 8 LED wafers 700). Perform the action of adsorption fixation. Moreover, although some of the adsorption grooves 322 in the drawing have overlapping regions, and the repeated regions are formed by precise calculation, the plurality of adsorption grooves 322 can positively adsorb the LED wafers 700 of different sizes. It is fixed to the adsorption assembly 320.

[0026]

As shown in FIG. 8, in a preferred embodiment, the adsorption assembly 320 is configured to simultaneously adsorb two or two LED wafers 700 or simultaneously adsorb two or four LED wafers 700, or may be used only for adsorption. A single 6-inch LED wafer 700 or only a single 8-inch LED wafer 700 is not limited thereto.

[0027]

On the other hand, the adsorption assembly 320 can be a vacuum adsorption device to ensure that the LED wafer 700 can be securely attached to the detection platform 310, but is not limited thereto. In other words, the adsorption assembly 320 can have other aspects to assist in the adsorption operation of the LED wafer 700.

[0028]

Except for the first embodiment of the test assembly 100 shown in FIGS. 3 and 8, in the second embodiment of the test assembly 100 shown in FIG. 9, the adsorption assembly 320 can also be used for each test. It is only used to simultaneously adsorb two or two LED wafers 700 or to simultaneously adsorb two or four LED wafers 700. In the third embodiment of the detection assembly 100 shown in FIG. 10, the adsorption assembly 320 can be used to adsorb only a single 6-inch LED wafer 700 or only to adsorb a single 8 at each detection.吋 LED wafer 700.

[0029]

In the second embodiment and the third embodiment of the detecting assembly 100 shown in FIGS. 9 and 10, the difference from the first embodiment of the detecting assembly 100 shown in FIG. 8 is that the eighth embodiment The first embodiment shown in the figure can adsorb and detect four sizes of LED wafers 700 (ie, 2, 4, 6 and 8 LED wafers 700) without replacing the inspection assembly 100. The second embodiment and the third embodiment shown in FIG. 9 and FIG. 10 are respectively used to adsorb and detect two sizes of LED wafers 700 (ie, 2 吋, 4 吋 LED wafers 700, respectively). Or 6吋, 8吋 LED wafers 700), in order to reduce the cost of building the inspection assembly 100.

[0030]

On the other hand, in the embodiments disclosed in the present disclosure, the first transport unit 400 and the second transport unit 500 are both a robot arm, and each of the robot arms has two first arms 410 and two second arms. 510, to alternately transport the LED wafer 700 from the test area 210 to the detection area 230, and transport the LED wafer 700 from the detection area 230 to the measurement area 220, thereby effectively improving the detection speed of the LED wafer 700, and avoiding The idle time occurs.

[0031]

The detection assembly 100 of the present invention may further include a plurality of snap elements 600 disposed in the test area 210 and the measurement area 220 to fix the cassettes 200.

[0032]

In addition, in the embodiment shown in FIG. 2, the to-be-tested area 210 may have a first to-be-tested area 210a and a second to-be-tested area 210b, and The first test area 210a and the second test area 210b have a relationship of overlapping one another; similarly, the measurement area 220 has a first measurement area 220a and a second measurement area 220b, and the first time The measurement zone 220a and the second measurement zone 220b have a relationship of being stacked one on top of the other.

[0033]

In this way, when the plurality of LED wafers 700 disposed in the first test area 210a of the upper layer complete the detecting operation, the first transport unit 400 can immediately move to the lower layer and wait for the second time from the lower layer. In the measurement area 210b, the plurality of LED wafers 700 to be tested are continuously captured and transferred to the detection area 230. At this time, the operator can take the empty space of the LED wafer 700 of the second test area 210b of the lower layer next to the first transport unit 400, and the upper layer no longer carries the empty plural of the plurality of LED wafers 700. The cassette 200 is removed and refilled with the plurality of cassettes 200 carrying the LED wafers 700 to be tested, so that when the underlying LED wafers 700 are all detected, the first transport unit 400 can be moved back to the upper layer to continue to capture and transmit. The plurality of LED wafers 700 to be tested are replaced by an empty plurality of cassettes 200 for the operator. That is to say, through the arrangement relationship of the upper and lower layers, the first transport unit 400 can continuously and continuously capture the LED wafer 700 between the first first test area 210a and the lower second test area 210b. The optical detecting device 300 is in an idle state.

[0034]

Similarly, the second transport unit 500 will transmit the detected LED wafer 700 to the plurality of cassettes 200 of the first measurement zone 220a or the second measurement zone 220b according to different detection results.

[0035]

With the foregoing arrangement, on average, the detection assembly 100 of the present invention can complete the inspection and screening operations of 360 LED wafers 700 per hour.

[0036]

As shown in FIG. 9, the present invention also discloses a method of detecting and classifying a plurality of LED wafers 700, which includes the following steps:

[0037]

First, as shown in step 801, the plurality of LED wafers 700 are disposed in a test area 210; as shown in step 802, the plurality of LED wafers 700 are sequentially moved from the test area 210 to a detection area 230; Step 803, performing a detection operation on the plurality of LED wafers 700. Finally, as shown in step 804, the plurality of LED wafers 700 are moved to the measurement area 220 according to one of the detection data measured by the detection operation.

[0038]

Wherein, the foregoing step 803 further includes the following steps:

[0039]

As shown in step 803a, the LED wafer 700 is placed on the detection platform 310 of the detection area 230; as shown in step 803b, the LED wafer 700 is adsorbed on the detection platform 310; as shown in step 803c, the plurality of images are displayed. Projected on the LED wafer 700 in sequence; as shown in step 803d, the plurality of optical lenses 340 are used to receive the images reflected by the LED wafer 700; finally, as shown in step 803e, the processing unit 350 processes and analyzes the images. The image is used to complete the inspection of the LED wafer 700.

[0040]

In summary, with the setting of the detection assembly 100 of the present invention, the detection of the plurality of LED wafers 700 can be quickly performed, and the detection efficiency of the LED wafer 700 can be effectively improved, and the required waiting time can be shortened.

[0041]

On the other hand, the LED wafer 700 after the completion of the detection can be further divided into a good LED wafer 700 and a defective LED wafer 700 according to the user's needs and definitions, so the detection assembly 100 of the present invention After the detection of the plurality of LED wafers 700 is completed, the LED wafers 700 are screened and classified according to different requirements, and are transmitted by the second transport unit 500 to the specific good product area 222 and the defective product area 224, exempting The subsequent screening time will further improve the efficiency of detection and classification.

[0042]

The embodiments described above are only intended to illustrate the embodiments of the present invention, and to explain the technical features of the present invention, and are not intended to limit the scope of protection of the present invention. Any changes or equivalents that can be easily made by those skilled in the art are within the scope of the invention. The scope of the invention should be determined by the scope of the claims.

100. . . Testing assembly

200. . . Card

210. . . Area to be tested

220. . . Measuring zone

222. . . Good area

224. . . Bad product area

230. . . Detection area

300. . . Optical detection device

310. . . Detection platform

312. . . Holding component

320. . . Adsorption assembly

330. . . Image projection assembly

340. . . Optical lens

350. . . Arithmetic unit

400. . . First conveying unit

500. . . Second conveying unit

600. . . Buckle element

700. . . LED wafer

Claims (12)

[Item 1] A test assembly for detecting and classifying a plurality of LED wafers, comprising:
The plurality of cassettes are respectively disposed in a test area and a measurement area for carrying the LED wafers;
An optical detecting device is disposed between the area to be tested and the measuring area to detect the LED wafers;
a first transport unit adapted to move the LED wafers from the cassettes of the area to be tested to the optical detecting device; and a second transport unit adapted to move the LED crystals from the optical detecting device Rounded into the cassettes of the assay zone;
After the first transport unit moves the LED wafers from the cassettes of the to-be-measured area to the optical detecting device, the optical detecting device can perform a detecting operation on the LED wafers. The second transport unit then moves the LED wafers to the cassettes of the measurement area according to one of the detection data obtained by the detection operation. [Item 2] The detection assembly of claim 1, wherein the optical detection device comprises:
a detection platform for placing the LED wafers;
An adsorption assembly is embedded in the detection platform to adsorb the LED wafers;
An image projection assembly for sequentially projecting the plurality of images on the LED wafers on the detection platform;
The plurality of optical lenses are adapted to receive the images reflected by the LED wafers; and an arithmetic unit configured to process and analyze the images received by the optical lenses to complete the detecting operation. [Item 3] The detection assembly of claim 2, wherein the detection platform further comprises a plurality of holding elements for lifting the LED wafers up and down. [Item 4] The detection assembly of claim 1, wherein the measurement area and the measurement area are centered on the optical detection device, annularly disposed on an outer side of the optical detection device, and the first delivery unit is disposed on the The area to be tested is between the optical detecting device and the second conveying unit is disposed between the measuring area and the optical detecting device. [Item 5] The detecting assembly of claim 1, wherein the first conveying unit and the second conveying unit are both a robot arm. [Item 6] The test assembly of claim 5, wherein the robot arms each have two first arms and two second arms. [Item 7] The test assembly of claim 1, wherein the measurement area further comprises a good product area and a defective product area. [Item 8] The detection assembly of claim 1, wherein the area to be tested and the measurement area are double-layered areas stacked one on another. [Item 9] The detection assembly of claim 1 further includes a plurality of snap elements disposed in the test area and the measurement area to fix the cassettes. [Item 10] The detection assembly of claim 2, wherein the adsorption assembly is provided with a plurality of adsorption tanks for adsorbing and fixing the LED wafers. [Item 11] A method of detecting and classifying a plurality of LED wafers, comprising the steps of:
(a) placing the LED wafers in a region to be tested;
(b) moving the LED wafers from the area to be tested to a detection area;
(c) performing a detection operation on the LED wafers in the detection area; and (d) moving the LED wafers from the detection area to a measurement area according to one of the detection data measured by the detection operation. [Item 12] The method of claim 11, wherein the step (c) further comprises:
(c1) placing the LED wafers on one of the detection areas of the detection area;
(c2) adsorbing the LED wafers using the detection platform;
(c3) sequentially projecting the plurality of images onto one surface of the LED wafers;
(c4) receiving, by the plurality of optical lenses, the images reflected by the surface of the LED wafers; and (c5) processing and analyzing the images by an arithmetic unit to complete the detection of the LED wafers.