TW201439923A - Chip card assembly structure and method thereof - Google Patents
Chip card assembly structure and method thereof Download PDFInfo
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- TW201439923A TW201439923A TW102113133A TW102113133A TW201439923A TW 201439923 A TW201439923 A TW 201439923A TW 102113133 A TW102113133 A TW 102113133A TW 102113133 A TW102113133 A TW 102113133A TW 201439923 A TW201439923 A TW 201439923A
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- film
- substrate
- fixing
- wafer
- fixing groove
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- 238000000034 method Methods 0.000 title claims abstract description 11
- 239000000758 substrate Substances 0.000 claims abstract description 36
- 239000002313 adhesive film Substances 0.000 claims abstract description 31
- 239000010408 film Substances 0.000 claims description 28
- 239000000853 adhesive Substances 0.000 claims description 7
- 230000001070 adhesive effect Effects 0.000 claims description 7
- 239000010409 thin film Substances 0.000 claims description 7
- 125000006850 spacer group Chemical group 0.000 claims description 4
- 238000004519 manufacturing process Methods 0.000 abstract description 11
- 238000010586 diagram Methods 0.000 description 16
- 238000000926 separation method Methods 0.000 description 3
- 230000007812 deficiency Effects 0.000 description 2
- 238000002955 isolation Methods 0.000 description 2
- 238000012986 modification Methods 0.000 description 2
- 230000004048 modification Effects 0.000 description 2
- 241001122315 Polites Species 0.000 description 1
- 238000012550 audit Methods 0.000 description 1
- 238000013461 design Methods 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 238000011156 evaluation Methods 0.000 description 1
- 230000000873 masking effect Effects 0.000 description 1
- 239000000463 material Substances 0.000 description 1
- 238000012552 review Methods 0.000 description 1
Landscapes
- Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
Abstract
Description
本發明為提供一種晶片卡，特別是一種應用自由且節省生產成本的晶片卡組合結構及其方法。 The present invention is to provide a wafer card, and more particularly to a wafer card assembly structure and method thereof which are free to apply and save production cost.
按，習用傳統晶片卡係包含有分別製作之一承載片體及一晶片模組，且於其製作過程中係需先在承載片體一側處製作一凹槽，然後將晶片模組嵌入凹槽才得以完成，因此製作係相當麻煩、耗時；而目前於市面上流通的晶片卡主要分為一般SIM卡、micro SIM卡及nano SIM卡三種，其尺寸、大小係不相同，故習用傳統晶片卡進行製作時，係僅能分別一次生產一種尺寸的承載片體及晶片模組然後再逐一組裝、嵌入，係使生產成本居高不下，且習用傳統晶片卡應用上係受到尺寸、大小的限制，同時導致屯貨成本上升。 According to the conventional wafer card system, a carrier sheet and a wafer module are separately fabricated, and a groove is formed on one side of the carrier sheet during the manufacturing process, and then the wafer module is embedded in the concave portion. The slot is completed, so the production system is quite cumbersome and time consuming. Currently, the wafer cards circulating in the market are mainly divided into three types: general SIM card, micro SIM card and nano SIM card. The size and size are different, so the tradition is different. When the wafer card is manufactured, it is only possible to produce the carrier sheet and the chip module of one size at a time and then assemble and embed one by one, which makes the production cost high, and the conventional wafer card application is subject to size and size. Restrictions also lead to an increase in the cost of stockpiling.
是以，要如何解決上述習用之問題與缺失，即為本發明之發明人與從事此行業之相關廠商所亟欲研究改善之方向所在者。 Therefore, how to solve the above problems and deficiencies in the above-mentioned applications, that is, the inventors of the present invention and those involved in the industry are eager to study the direction of improvement.
故，本發明之發明人有鑑於上述缺失，乃蒐集相關資料，經由多方評估及考量，並以從事於此行業累積之多年經驗，經由不斷試作及修改，始設計出此種應用自由且節省生產成本的晶片卡組合結構及其方法的發明專利者。 Therefore, the inventors of the present invention have collected the relevant materials in view of the above-mentioned deficiencies, and through multi-party evaluation and consideration, and through years of experience accumulated in the industry, through continuous trial and modification, the design freedom and production are saved. The patented manufacturer of the cost of the wafer card assembly structure and method thereof.
本發明之主要目的在於：得與不同尺寸、規格配合使用。 The main purpose of the present invention is to use it in combination with different sizes and specifications.
本發明之再一主要目的在於：減少生產所需的成本。 Still another primary object of the present invention is to reduce the cost of production.
為達上述目的，本發明係包括至少一基板及至少一固定元件，而固定元件至少一側處係形成有至少一與基板相對應之固定槽，且固定元件一側處係設置有至少一供遮蔽固定槽之黏貼膜，並固定槽內係設置有至少一與黏貼膜黏合之薄膜晶片；而當欲使用本發明時，係掀起黏貼膜以帶動掀起薄膜晶片，且於固定槽中放入基板使基板固定，並貼回黏貼膜來帶動薄膜晶片往固定槽移動，使薄膜晶片與基板得以結合，再次掀起黏貼膜取出經結合之薄膜晶片與基板，使薄膜晶片之設置位置得以正確，藉由上述技術，可針對習用貼膜晶片卡所存在之應用受到限制及生產成本較高的問題點加以突破，達到應用自由且節省生產成本之實用進步性。 In order to achieve the above object, the present invention includes at least one substrate and at least one fixing component, and at least one side of the fixing component is formed with at least one fixing groove corresponding to the substrate, and at least one side of the fixing component is provided Masking the adhesive film of the fixing groove, and fixing at least one film wafer bonded to the adhesive film in the fixing groove; and when the invention is to be used, picking up the adhesive film to drive up the film wafer, and placing the substrate in the fixing groove Fixing the substrate and attaching it back to the adhesive film to drive the film wafer to move to the fixing groove, so that the film wafer and the substrate can be combined, and then picking up the adhesive film to take out the bonded film wafer and the substrate, so that the position of the film wafer is correctly obtained. The above technology can solve the problem that the application of the conventional film wafer card is limited and the production cost is high, achieving the practical progress of application freedom and saving production cost.
1‧‧‧基板 1‧‧‧Substrate
2‧‧‧薄膜晶片 2‧‧‧film wafer
21‧‧‧接觸介面組 21‧‧‧Contact interface group
22‧‧‧貼合部 22‧‧‧Fitting Department
221‧‧‧隔離片 221‧‧‧Isolation film
23‧‧‧分割部 23‧‧‧ Division
3‧‧‧固定元件 3‧‧‧Fixed components
31‧‧‧固定槽 31‧‧‧ fixing slot
311‧‧‧第一固定槽 311‧‧‧First fixed slot
312‧‧‧第二固定槽 312‧‧‧Second fixing slot
313‧‧‧第三固定槽 313‧‧‧3rd fixing slot
4‧‧‧黏貼膜 4‧‧‧Adhesive film
41‧‧‧黏性部 41‧‧‧ Viscous Department
第一圖 係為本發明較佳實施例之實施示意圖。 The first figure is a schematic diagram of the implementation of the preferred embodiment of the invention.
第二圖 係為本發明較佳實施例之分離示意圖。 The second drawing is a schematic view of the separation of the preferred embodiment of the invention.
第三圖 係為本發明較佳實施例之薄膜晶片示意圖。 The third drawing is a schematic view of a thin film wafer in accordance with a preferred embodiment of the present invention.
第四圖 係為本發明較佳實施例之固定元件示意圖。 The fourth figure is a schematic view of a fixing member of a preferred embodiment of the present invention.
第五圖 係為本發明較佳實施例之結合示意圖(一)。 The fifth drawing is a combination diagram (1) of a preferred embodiment of the present invention.
第六圖 係為本發明較佳實施例之結合示意圖(二)。 Figure 6 is a schematic diagram (2) of a preferred embodiment of the present invention.
第七圖 係為本發明較佳實施例之結合示意圖(三)。 Figure 7 is a schematic diagram (3) of a preferred embodiment of the present invention.
第八圖 係為本發明較佳實施例之拆除示意圖。 The eighth figure is a schematic view of the removal of the preferred embodiment of the present invention.
為達成上述目的及功效，本發明所採用之技術手段及構造，茲繪圖就本發明較佳實施例詳加說明其特徵與功能如下，俾利完全了解。 In order to achieve the above objects and effects, the technical means and the structure of the present invention will be described in detail with reference to the preferred embodiments of the present invention.
請參閱第一圖至第四圖所示，係為本發明較佳實施例之實施示意圖、分離示意圖、薄膜晶片示意圖及固定元件示意圖，由圖中可清楚看出本發明係包括至少一基板1、至少一固定元件3、至少一黏貼膜4及至少一薄膜晶片2，於本實施例中係以一般SIM卡、micro SIM卡及nano SIM卡三種尺寸大小為解說，而固定元件3至少一側處係形成有至少一與基板1相對應之固定槽31，且固定槽31係進一步分為第一固定槽311(尺寸等同於一般SIM卡大小)、第二固定槽312(尺寸等同於micro SIM大小)及第三固定槽313(尺寸等同於nano SIM卡大小)，並第一固定槽311、第二固定槽312及第三固定槽313之槽底與基板1側壁的距離係不相同，而黏貼膜4係設置於固定元件3一側處以供遮蔽固定槽31，且黏貼膜4鄰近固定元件3之側處係具有至少一黏性部41，並黏性部41係得以重覆黏貼，而薄膜晶片2係設置於固定槽31內且與黏貼膜4黏合，且薄膜晶片2鄰近黏貼膜4之側處係設置有一接觸介面組21，另一側係具有至少一供與基板1結合之貼合部22，並貼合部22上係設置有至少一隔離片221，而薄膜晶片2係具有至少一與基板1相對應且得以拆除之分割部23，且分割部23之外緣尺寸係等同於micro SIM大小，並分割部23之內緣尺寸係等同於nano SIM卡大小，另，上述僅為本發明其中之一實施態樣，其態樣不設限於此。 Please refer to the first to fourth embodiments, which are schematic diagrams of the implementation of the preferred embodiment of the present invention, a schematic diagram of the separation, a schematic diagram of the thin film wafer and a schematic diagram of the fixing component. It is clear from the drawing that the present invention includes at least one substrate 1 At least one fixing component 3, at least one adhesive film 4, and at least one thin film wafer 2, in the embodiment, the three sizes of a general SIM card, a micro SIM card and a nano SIM card, and at least one side of the fixing component 3 At least one fixing groove 31 corresponding to the substrate 1 is formed, and the fixing groove 31 is further divided into a first fixing groove 311 (equivalent to a general SIM card size) and a second fixing groove 312 (the size is equivalent to the micro SIM) And the third fixing slot 313 (the size is equivalent to the size of the nano SIM card), and the distance between the bottom of the first fixing slot 311, the second fixing slot 312 and the third fixing slot 313 is different from the sidewall of the substrate 1, and The adhesive film 4 is disposed at one side of the fixing member 3 for shielding the fixing groove 31, and the adhesive film 4 has at least one adhesive portion 41 adjacent to the side of the fixing member 3, and the adhesive portion 41 is repeatedly pasted. Thin film wafer 2 is fixed in fixed 31 is bonded to the adhesive film 4, and a contact interface group 21 is disposed on the side of the film wafer 2 adjacent to the adhesive film 4, and the other side has at least one bonding portion 22 for bonding with the substrate 1, and the bonding portion 22 is provided with at least one spacer 221, and the thin film wafer 2 has at least one divided portion 23 corresponding to the substrate 1 and removed, and the outer edge size of the divided portion 23 is equal to the size of the micro SIM, and the dividing portion The inner edge size of 23 is equivalent to the size of the nano SIM card. In addition, the above is only one embodiment of the present invention, and the aspect thereof is not limited thereto.
請同時配合參閱第一圖至第八圖所示，係為本發明較佳實施例之實施示意圖、分離示意圖、薄膜晶片示意圖、固定元件示意圖、結合示意圖(一)、結合示意圖(二)、結合示意圖(三)、及拆除示意圖，由圖中可清楚看出當欲使用本發明時，係先將黏貼膜4局部撕起令固定槽31得以外露，且黏貼膜4係藉由黏性部41同時掀起薄膜晶片2帶動薄膜晶片2脫離固定槽31，並將隔離片221撕下使貼合部22得以外露，然後將基板1依其尺寸放置、固定於第一固定槽311、第二固定槽312或第三固定槽313，且貼回黏貼膜4使薄膜晶片2之貼合部22得以與基板1結合，並再一次局部撕起黏貼膜4取出 結合之薄膜晶片2和基板1，而當基板1尺寸為一般SIM卡大小或micro SIM卡大小時即完成本案所述之晶片卡；另，當基板1尺寸為nano SIM卡大小時，係拆除薄膜晶片2之分割部23即完成本案所述之晶片卡(如第八圖所示)；是以，本發明之晶片卡組合結構及其方法為可改善習用之技術關鍵在於： Please refer to the first embodiment to the eighth embodiment at the same time, which is a schematic diagram of the implementation of the preferred embodiment of the present invention, a schematic diagram of the separation, a schematic diagram of the thin film wafer, a schematic diagram of the fixed component, a combined schematic diagram (1), a combined schematic diagram (2), and a combination The schematic diagram (3), and the dismantling diagram, it can be clearly seen from the figure that when the invention is to be used, the adhesive film 4 is partially torn off so that the fixing groove 31 is exposed, and the adhesive film 4 is adhered by the adhesive portion 41. At the same time, the film wafer 2 is lifted to drive the film wafer 2 out of the fixing groove 31, and the spacer 221 is torn off to expose the bonding portion 22, and then the substrate 1 is placed and fixed to the first fixing groove 311 and the second fixing groove according to the size thereof. 312 or the third fixing groove 313, and pasting the adhesive film 4, the bonding portion 22 of the film wafer 2 is bonded to the substrate 1, and the adhesive film 4 is partially peeled off again. Combining the film wafer 2 and the substrate 1, and when the size of the substrate 1 is a general SIM card size or a micro SIM card size, the wafer card described in the present invention is completed; and when the size of the substrate 1 is a nano SIM card size, the film is removed. The dividing portion 23 of the wafer 2 completes the wafer card described in the present invention (as shown in the eighth figure); therefore, the key to the technology for improving the conventional use of the wafer card assembly structure and method of the present invention is:
一、藉由基板1及黏貼膜4與薄膜晶片2及基板1相配合以獲得配合應用於不同尺寸、規格和單一生產之目的，令本發明達到應用自由且節省生產成本之實用進步性。 1. The substrate 1 and the adhesive film 4 are matched with the film wafer 2 and the substrate 1 to obtain a combination for different sizes, specifications, and single production purposes, so that the present invention achieves practical application and free practical cost.
二、藉由薄膜晶片2得以拆除之分割部23以獲得配合應用於不同尺寸、規格和單一生產之目的，令本發明達到應用自由且節省生產成本之實用進步性。 2. The segment 23 of the film wafer 2 can be removed for the purpose of adapting to different sizes, specifications and single production, so that the invention can achieve practical application and save practical cost.
惟，以上所述僅為本發明之較佳實施例而已，非因此即拘限本發明之專利範圍，故舉凡運用本發明說明書及圖式內容所為之簡易修飾及等效結構變化，均應同理包含於本發明之專利範圍內，合予陳明。 However, the above description is only for the preferred embodiment of the present invention, and thus the scope of the present invention is not limited thereto, so that the simple modification and equivalent structural changes that are made by using the specification and the contents of the present invention should be the same. It is included in the scope of the patent of the present invention and is combined with Chen Ming.
綜上所述，本發明之晶片卡組合結構及其方法於使用時，為確實能達到其功效及目的，故本發明誠為一實用性優異之發明，為符合發明專利之申請要件，爰依法提出申請，盼 審委早日賜准本發明，以保障發明人之辛苦發明，倘若 鈞局審委有任何稽疑，請不吝來函指示，發明人定當竭力配合，實感公便。 In summary, the wafer card assembly structure and method of the present invention can achieve its efficacy and purpose when used, so the invention is an invention with excellent practicability, and is an application for conforming to the invention patent, To file an application, I hope that the review committee will grant the invention as soon as possible to protect the inventor's hard work. If there is any doubt in the audit committee, please do not hesitate to give instructions, the inventor will try his best to cooperate and feel polite.
1‧‧‧基板 1‧‧‧Substrate
2‧‧‧薄膜晶片 2‧‧‧film wafer
21‧‧‧接觸介面組 21‧‧‧Contact interface group
22‧‧‧貼合部 22‧‧‧Fitting Department
221‧‧‧隔離片 221‧‧‧Isolation film
23‧‧‧分割部 23‧‧‧ Division
3‧‧‧固定元件 3‧‧‧Fixed components
31‧‧‧固定槽 31‧‧‧ fixing slot
311‧‧‧第一固定槽 311‧‧‧First fixed slot
312‧‧‧第二固定槽 312‧‧‧Second fixing slot
313‧‧‧第三固定槽 313‧‧‧3rd fixing slot
4‧‧‧黏貼膜 4‧‧‧Adhesive film
41‧‧‧黏性部 41‧‧‧ Viscous Department
Claims (10)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| TW102113133A TWI494861B (en) | 2013-04-12 | 2013-04-12 | Chip card combination structure and method thereof |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| TW102113133A TWI494861B (en) | 2013-04-12 | 2013-04-12 | Chip card combination structure and method thereof |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| TW201439923A true TW201439923A (en) | 2014-10-16 |
| TWI494861B TWI494861B (en) | 2015-08-01 |
Family
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Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| TW102113133A TWI494861B (en) | 2013-04-12 | 2013-04-12 | Chip card combination structure and method thereof |
Country Status (1)
| Country | Link |
|---|---|
| TW (1) | TWI494861B (en) |
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| TWI582703B (en) * | 2015-12-31 | 2017-05-11 | 太思科技股份有限公司 | Auxiliary mounting structure for mounting advanced smart card |
| CN106971220A (en) * | 2016-01-14 | 2017-07-21 | 太思科技股份有限公司 | Auxiliary mounting structure |
| TWI728461B (en) * | 2019-09-09 | 2021-05-21 | 品瓚國際有限公司 | A subscriber identity module and its processing method |
Family Cites Families (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US5581065A (en) * | 1993-08-02 | 1996-12-03 | Dai Nippon Printing Co., Ltd. | Sheet-framed IC carrier, method for producing the same, and IC carrier case |
| CN101464961B (en) * | 2008-12-11 | 2011-08-31 | 东莞锐发智能卡科技有限公司 | Method and equipment for producing SIM card |
| EP2636001A4 (en) * | 2010-11-02 | 2014-09-03 | Linxens Holding | Sim card and manufacturing method |
| CN102004940B (en) * | 2010-11-30 | 2013-01-09 | 天水华天科技股份有限公司 | High-density SIM (Subscriber Identity Module) card packaging element and production method thereof |
| TWM418391U (en) * | 2011-01-28 | 2011-12-11 | Phytrex Technology Corp | Chip on film device |
-
2013
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Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| TWI582703B (en) * | 2015-12-31 | 2017-05-11 | 太思科技股份有限公司 | Auxiliary mounting structure for mounting advanced smart card |
| CN106971220A (en) * | 2016-01-14 | 2017-07-21 | 太思科技股份有限公司 | Auxiliary mounting structure |
| TWI728461B (en) * | 2019-09-09 | 2021-05-21 | 品瓚國際有限公司 | A subscriber identity module and its processing method |
Also Published As
| Publication number | Publication date |
|---|---|
| TWI494861B (en) | 2015-08-01 |
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