TW201438909A - Resin laminate and a forming method using the resin laminate - Google Patents
Resin laminate and a forming method using the resin laminate Download PDFInfo
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- TW201438909A TW201438909A TW103108610A TW103108610A TW201438909A TW 201438909 A TW201438909 A TW 201438909A TW 103108610 A TW103108610 A TW 103108610A TW 103108610 A TW103108610 A TW 103108610A TW 201438909 A TW201438909 A TW 201438909A
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B27/00—Layered products comprising a layer of synthetic resin
- B32B27/06—Layered products comprising a layer of synthetic resin as the main or only constituent of a layer, which is next to another layer of the same or of a different material
- B32B27/08—Layered products comprising a layer of synthetic resin as the main or only constituent of a layer, which is next to another layer of the same or of a different material of synthetic resin
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B27/00—Layered products comprising a layer of synthetic resin
- B32B27/28—Layered products comprising a layer of synthetic resin comprising synthetic resins not wholly covered by any one of the sub-groups B32B27/30 - B32B27/42
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B7/00—Layered products characterised by the relation between layers; Layered products characterised by the relative orientation of features between layers, or by the relative values of a measurable parameter between layers, i.e. products comprising layers having different physical, chemical or physicochemical properties; Layered products characterised by the interconnection of layers
- B32B7/02—Physical, chemical or physicochemical properties
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B27/00—Layered products comprising a layer of synthetic resin
- B32B27/30—Layered products comprising a layer of synthetic resin comprising vinyl (co)polymers; comprising acrylic (co)polymers
- B32B27/308—Layered products comprising a layer of synthetic resin comprising vinyl (co)polymers; comprising acrylic (co)polymers comprising acrylic (co)polymers
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B7/00—Layered products characterised by the relation between layers; Layered products characterised by the relative orientation of features between layers, or by the relative values of a measurable parameter between layers, i.e. products comprising layers having different physical, chemical or physicochemical properties; Layered products characterised by the interconnection of layers
- B32B7/04—Interconnection of layers
- B32B7/12—Interconnection of layers using interposed adhesives or interposed materials with bonding properties
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- Laminated Bodies (AREA)
- Polymerisation Methods In General (AREA)
- Injection Moulding Of Plastics Or The Like (AREA)
Abstract
Description
本發明係關於可成形之附有硬塗膜之樹脂積層體,及使用該樹脂積層體之成形方法,亦即關於,例如除了汽車、航空器、大樓、學校、各種商店的窗玻璃等,或是汽車、飛機等之燈具外罩、照明外罩之外,以個人電腦或可攜式電子機器等之框體或各種零件為首而被廣泛地應用,當中,亦適合於顯示器面板,且具有透明多層薄片的狀態之樹脂積層體,及使用該樹脂積層體之成形方法。 The present invention relates to a formable resin laminate with a hard coat film, and a method for forming the resin laminate, that is, for example, in addition to windows, automobiles, buildings, schools, window panes of various shops, etc., or In addition to the lamp cover and the lighting cover of automobiles, airplanes, etc., it is widely used as a frame or various parts such as a personal computer or a portable electronic device, and is also suitable for a display panel and has a transparent multilayer sheet. A resin laminate in a state, and a molding method using the resin laminate.
例如在數位相機或行動電話等之電子機器中,係採用由丙烯酸或聚碳酸酯、聚對苯二甲酸乙二酯等之熱塑性樹脂所製作之積層板,作為液晶顯示器等之基板、或是用以防止液晶顯示器等之表面受到損傷或污染等之保護板等。此等樹脂,由於具有光學特性優異且較玻璃不易破裂之特性,故近年來亦逐漸廣泛被使用在使用玻璃之領域中。然而,丙烯酸或聚碳酸酯、聚對苯二甲酸乙二酯等之熱塑性樹脂,與玻璃相比,表面硬度、耐磨耗性、耐擦傷性較差,存在有容易刮傷之缺點。 For example, in an electronic device such as a digital camera or a mobile phone, a laminate made of a thermoplastic resin such as acrylic or polycarbonate or polyethylene terephthalate is used as a substrate for a liquid crystal display or the like. A protective plate or the like for preventing damage or contamination of the surface of a liquid crystal display or the like. These resins have been widely used in the field of using glass because they have excellent optical characteristics and are less likely to be broken than glass. However, thermoplastic resins such as acrylic acid, polycarbonate, and polyethylene terephthalate have poor surface hardness, abrasion resistance, and scratch resistance as compared with glass, and are disadvantageous in that they are easily scratched.
為了消除該缺點,以往已逐漸進行與樹脂積層體的 表面改質相關之研究。例如,係廣泛地實施將熱硬化性樹脂、紫外線硬化型的樹脂塗佈於基材表面。此等施以塗層之樹脂積層體中,就耐磨耗性、耐擦傷性而言雖有某種程度的改善,但關於表面硬度仍有所不足,與玻璃相比,鉛筆硬度等之表面硬度低,實用上具有較大問題。 In order to eliminate this disadvantage, the laminate with the resin has been gradually carried out in the past. Research on surface modification. For example, it is widely applied to apply a thermosetting resin or an ultraviolet curable resin to the surface of a substrate. In the resin laminated body to which the coating is applied, although the abrasion resistance and the scratch resistance are somewhat improved, the surface hardness is still insufficient, and the surface of the pencil hardness or the like is compared with the glass. Low hardness and practical problems.
用以對透明塑膠材料進一步提升表面硬度之塗佈技術,例如有人嘗試將高硬度填料混入於硬塗層以提升表面硬度之作法(參考專利文獻1、專利文獻2、專利文獻3)。此外,類似的方法,係有人研究將硬塗層的膜厚設定較大,並混入用以緩和所產生的應力之無機及/或有機交聯粒子,或是將官能基導入於該粒子的表面而與硬塗層的樹脂部分地交聯之所謂有機-無機混成手法(參考專利文獻4、專利文獻5)。再者,係有人嘗試使硬塗層多層化,以增大塗層整體的厚度,進而得到更高的表面硬度之作法(參考專利文獻6)。 A coating technique for further improving the surface hardness of a transparent plastic material, for example, an attempt has been made to mix a high-hardness filler into a hard coat layer to increase the surface hardness (refer to Patent Document 1, Patent Document 2, and Patent Document 3). In addition, in a similar method, it has been studied to set a film thickness of a hard coat layer to a large extent, and to mix inorganic and/or organic crosslinked particles for mitigating the generated stress, or to introduce a functional group to the surface of the particle. The so-called organic-inorganic hybrid method in which the resin of the hard coat layer is partially crosslinked (refer to Patent Document 4 and Patent Document 5). Further, attempts have been made to multilayer the hard coat layer to increase the thickness of the entire coating layer, thereby obtaining a higher surface hardness (refer to Patent Document 6).
然而,作為此等方法的具體例所顯示者,係使用原先鉛筆硬度較聚碳酸酯更高之聚對苯二甲酸乙二酯膜或三乙酸纖維素膜作為基材而使鉛筆硬度達到4H至6H,雖可實證該效果,但由於無法僅以較薄的硬塗層來達成鉛筆硬度,所以需具有較硬之底層或無機材料的輔助功能。因此,此等底層或無機材料成為阻礙透明性之因素,而不適合作為液晶顯示器般之顯示裝置用。 However, as a specific example of such methods, a polyethylene terephthalate film or a cellulose triacetate film having a higher pencil hardness than polycarbonate is used as a substrate to achieve a pencil hardness of 4H. 6H, although this effect can be demonstrated, since it is not possible to achieve pencil hardness with only a thin hard coat layer, it is necessary to have an auxiliary function of a hard underlayer or an inorganic material. Therefore, such underlying or inorganic materials are factors that hinder transparency, and are not suitable as display devices for liquid crystal displays.
此外,有人嘗試使用鉛筆硬度較低之樹脂的聚碳酸酯樹脂,並以特定膜厚,將由含有二官能丙烯酸胺甲酸乙酯、多官能低聚物、多官能單體、單官能單體且具有特定官能基數之紫外線硬化型樹脂所構成之塗膜,形成雙層於聚碳酸酯樹脂基材上 之作法,但鉛筆硬度最大為4H,並不夠充分(參考專利文獻7)。 In addition, some people have tried to use a polycarbonate resin with a lower pencil hardness and, with a specific film thickness, will contain a difunctional urethane urethane, a polyfunctional oligomer, a polyfunctional monomer, a monofunctional monomer, and a coating film composed of a specific functional group of an ultraviolet curable resin to form a double layer on a polycarbonate resin substrate However, the pencil hardness is at most 4H, which is not sufficient (refer to Patent Document 7).
[專利文獻1]日本特開2002-107503號公報 [Patent Document 1] Japanese Patent Laid-Open Publication No. 2002-107503
[專利文獻2]日本特開2002-060526號公報 [Patent Document 2] Japanese Patent Laid-Open Publication No. 2002-060526
[專利文獻3]WO2010/035764號手冊 [Patent Document 3] WO2010/035764 manual
[專利文獻4]日本特開2000-112379號公報 [Patent Document 4] Japanese Patent Laid-Open Publication No. 2000-112379
[專利文獻5]日本特開2000-103887號公報 [Patent Document 5] Japanese Patent Laid-Open Publication No. 2000-103887
[專利文獻6]日本特開2000-052472號公報 [Patent Document 6] Japanese Patent Laid-Open Publication No. 2000-052472
[專利文獻7]日本特許第4626463號公報 [Patent Document 7] Japanese Patent No. 4246643
本發明係為了解決上述課題而創作出,該目的在於提供一種具有高表面硬度且具有高透明性之樹脂積層體,及使用該樹脂積層體之成形方法。 The present invention has been made to solve the above problems, and an object thereof is to provide a resin laminate having high surface hardness and high transparency, and a molding method using the resin laminate.
本發明人們為了得到表面硬度優異且具有高透明性之樹脂積層體而進行精心研究,結果發現到藉由形成具備有由既定的三維交聯型硬質樹脂組成物所構成之硬質樹脂層以及既定的熱塑性樹脂層之樹脂積層體,可同時達成此等特性,因而完成本發明。 The present inventors have intensively studied to obtain a resin laminate having excellent surface hardness and high transparency, and as a result, it has been found that a hard resin layer composed of a predetermined three-dimensional crosslinked type hard resin composition and a predetermined one are formed. The resin laminate of the thermoplastic resin layer can simultaneously achieve such characteristics, and thus the present invention has been completed.
亦即,本發明之樹脂積層體,其係具有:使含有具有籠型矽倍半氧烷構造之多官能(甲基)丙烯酸單體之三維交聯型 硬質樹脂組成物硬化而成之玻璃轉移溫度為200℃以上之至少1層以上的硬質樹脂層、以及於該硬質樹脂層之至少一面具有室溫的彈性率E1與150℃的彈性率E2之比(E1/E2)為1至500之具有熱塑性樹脂層之樹脂積層體,其特徵為:硬質樹脂層係單體的抗拉彈性率為2,000至4,000百萬帕,且總透光率為90%以上,此外,樹脂積層體的鉛筆硬度為6H以上,熱塑性樹脂層的合計厚度t1與硬質樹脂層的厚度t2之比(t1/t2)為0.25以上10以下。在此所謂「(甲基)丙烯酸」,係具有「甲基丙烯酸」與「丙烯酸」兩者的涵義,以下相同。 In other words, the resin laminate of the present invention has a glass transition obtained by hardening a three-dimensional crosslinked type hard resin composition containing a polyfunctional (meth)acrylic monomer having a cage type sesquisesquioxane structure. temperature of at least one layer of the hard resin layer above the 200 ℃, and in the hard resin layer of at least one surface having a room temperature elastic modulus E 1 E and elastic modulus 150 ℃ ratio 2 of (E 1 / E 2) is A resin laminate having a thermoplastic resin layer of 1 to 500, characterized in that the hard resin layer-based monomer has a tensile modulus of 2,000 to 4,000 MPa and a total light transmittance of 90% or more, and further, a resin layer a pencil hardness of 6H or more thereof, the total thickness of the thermoplastic resin layer is t 1 and the thickness t of the hard resin layer 2 ratio (t 1 / t 2) is 0.25 or more 10 or less. Here, "(meth)acrylic acid" has the meaning of both "methacrylic acid" and "acrylic acid", and the same applies hereinafter.
在此,較佳者係三維交聯型硬質樹脂組成物所含有之樹脂固體成分每100g的(甲基)丙烯酸基莫耳數可為0.6至0.9,此外,所得之硬質樹脂層的厚度可為50μm以上250μm以下。 Here, it is preferable that the resin solid content contained in the three-dimensional crosslinked type hard resin composition may be from 0.6 to 0.9 per 100 g of the (meth)acrylic mole, and the thickness of the obtained hard resin layer may be 50 μm or more and 250 μm or less.
此外,較佳者係上述硬質樹脂層與熱塑性樹脂層可介由黏著層而積層,該黏著層較佳可為黏著性黏著劑、感壓性黏著劑、光硬化性黏著劑、熱硬化性黏著劑、或熱熔黏著劑中之任一種。或者是,上述硬質樹脂層與熱塑性樹脂層可介由易黏著層而積層。 Further, preferably, the hard resin layer and the thermoplastic resin layer may be laminated via an adhesive layer, and the adhesive layer may preferably be an adhesive adhesive, a pressure sensitive adhesive, a photocurable adhesive, or a thermosetting adhesive. Any one of a agent or a hot melt adhesive. Alternatively, the hard resin layer and the thermoplastic resin layer may be laminated via an easy-adhesion layer.
再者,上述具有籠型矽倍半氧烷構造之多官能(甲基)丙烯酸單體,較佳可以下列式(1)表示,(R1SiO3/2)n(R2R3SiO2/2)m(R4R5R6SiO1/2)l (1) Further, the above polyfunctional (meth)acrylic monomer having a caged sesquisesquioxane structure is preferably represented by the following formula (1): (R 1 SiO 3/2 ) n (R 2 R 3 SiO 2 /2 ) m (R 4 R 5 R 6 SiO 1/2 ) l (1)
(式中,R1至R6為碳數1至6的烷基、苯基、(甲基)丙烯酸基、(甲基)丙烯醯氧烷基、乙烯基、具有環氧乙烷環之基,且分別可為相同之基或可含有不同之基,但於式中具有至少2個(甲基)丙烯酸基,n、m、l為平均值,n為6至14的數,m為0至4的數,l為 0至4的數,且滿足m≦1)。 (wherein R 1 to R 6 are an alkyl group having 1 to 6 carbon atoms, a phenyl group, a (meth)acrylic group, a (meth)acryloxyalkyl group, a vinyl group, a group having an oxirane ring; And respectively may be the same group or may contain different groups, but have at least 2 (meth)acrylic groups in the formula, n, m, l are average values, n is a number from 6 to 14, m is 0 A number of 4, l is a number from 0 to 4, and satisfies m≦1).
此外,本發明之樹脂積層體之成形方法,其特徵為:藉由使上述樹脂積層體熱成形而賦予既定之形狀。再者,本發明之成形方法,其特徵為:將藉此所得之既定形狀的樹脂積層體裝填於模具內,並將熱塑性樹脂射出成形而藉此使具有硬質樹脂層之樹脂積層體與熱塑性樹脂形成一體。 Moreover, the method for molding a resin laminate according to the present invention is characterized in that a predetermined shape is imparted by thermoforming the resin laminate. Further, the molding method of the present invention is characterized in that a resin laminated body having a predetermined shape obtained therein is loaded into a mold, and a thermoplastic resin is injection-molded to thereby form a resin laminated body having a hard resin layer and a thermoplastic resin. Form one.
根據本發明,由於可形成直接維持透明性且具有高表面硬度,且相對於衝擊或彎曲而具有充分的耐性之樹脂積層體,所以成形或切削、鑿穿等之加工性優異,可使用來作為顯示器面框或設計性優異之框體等。 According to the present invention, since a resin laminate having high surface hardness and high surface hardness and sufficient resistance against impact or bending can be formed, the workability such as molding, cutting, and chiseling is excellent, and it can be used as Display frame or frame with excellent design.
1‧‧‧硬質樹脂層 1‧‧‧hard resin layer
2‧‧‧黏合劑層 2‧‧‧Binder layer
3、3b‧‧‧熱塑性樹脂層 3, 3b‧‧‧ thermoplastic resin layer
4‧‧‧印刷層 4‧‧‧Printing layer
5‧‧‧感壓性黏著劑層 5‧‧‧pressure-sensitive adhesive layer
6‧‧‧保護薄片 6‧‧‧Protective sheet
第1圖係示意顯示本發明之第1樣態發明的樹脂積層體之說明圖。 Fig. 1 is an explanatory view showing a resin laminate of the first aspect of the invention.
第2圖係示意顯示本發明之第2樣態發明的樹脂積層體之說明圖。 Fig. 2 is an explanatory view showing a resin laminate of a second aspect of the invention.
第3圖係示意顯示本發明之第3樣態發明的樹脂積層體之說明圖。 Fig. 3 is an explanatory view showing a resin laminate of a third aspect of the invention.
第4圖係顯示本發明實施例所使用之射出成形機之側視圖。 Fig. 4 is a side view showing an injection molding machine used in the embodiment of the present invention.
第5圖係顯示成形後的樹脂積層體之剖面圖。 Fig. 5 is a cross-sectional view showing the formed resin laminate after molding.
以下詳細說明本發明。 The invention is described in detail below.
〈硬質樹脂層〉 <hard resin layer>
本發明之樹脂積層體的硬質樹脂層,係使含有具有籠型矽倍半氧烷構造之多官能(甲基)丙烯酸單體之三維交聯型硬質樹脂組成物硬化而成者,該玻璃轉移溫度為200℃以上。 The hard resin layer of the resin laminate of the present invention is obtained by curing a three-dimensional crosslinked type hard resin composition containing a polyfunctional (meth)acrylic monomer having a cage type sesquisesquioxane structure. The temperature is above 200 °C.
當中,上述具有籠型矽倍半氧烷構造之多官能(甲基)丙烯酸單體,較佳為以下列式(1)表示。 Among them, the above-mentioned polyfunctional (meth)acrylic monomer having a cage-type mercaptopropane structure is preferably represented by the following formula (1).
(R1SiO3/2)n(R2R3SiO2/2)m(R4R5R6SiO1/2)l (1) (R 1 SiO 3/2 ) n (R 2 R 3 SiO 2/2 ) m (R 4 R 5 R 6 SiO 1/2 ) l (1)
(式中,R1至R6為碳數1至6的烷基、苯基、(甲基)丙烯酸基、(甲基)丙烯醯氧烷基、乙烯基、具有環氧乙烷環之基,且分別可為相同之基或可含有不同之基,但於式中具有至少2個(甲基)丙烯酸基,n、m、l為平均值,n為6至14的數,m為0至4的數,l為0至4的數,且滿足m≦1) (wherein R 1 to R 6 are an alkyl group having 1 to 6 carbon atoms, a phenyl group, a (meth)acrylic group, a (meth)acryloxyalkyl group, a vinyl group, a group having an oxirane ring; And respectively may be the same group or may contain different groups, but have at least 2 (meth)acrylic groups in the formula, n, m, l are average values, n is a number from 6 to 14, m is 0 a number up to 4, l is a number from 0 to 4, and satisfies m≦1)
亦即,上述具有籠型矽倍半氧烷構造之多官能(甲基)丙烯酸單體,較佳係使構成籠之矽原子全體具有:具有(甲基)丙烯酸基之有機官能基、或由(甲基)丙烯醯氧烷基所構成之反應性官能基,且分子量分布及分子構造經過控制者,一部分官能基亦可被烷基、苯基等取代,此外,亦可為非完全封閉之多面體構造,亦可為一部分裂開之構造。為一部分裂開之構造時,於被連結之聚矽氧鏈可具有(甲基)丙烯酸基。 That is, the above-mentioned polyfunctional (meth)acrylic monomer having a cage-type mercaptopropane structure preferably has an organic functional group having a (meth)acrylic group, or a reactive functional group composed of a (meth) acryloxyalkyl group, and having a molecular weight distribution and a molecular structure controlled, a part of the functional group may be substituted by an alkyl group, a phenyl group or the like, or may be incompletely blocked. The polyhedral structure may also be a partially split structure. In the case of a partially split structure, the linked polyoxygen chain may have a (meth)acryl group.
此外,本發明所使用之硬質樹脂層1的三維交聯型硬質樹脂組成物,可併用於分子內具有2個以上的乙烯性不飽和鍵之(甲基)丙烯酸酯。上述多官能(甲基)丙烯酸酯,可列舉出二官能(甲基)丙烯酸酯及三官能以上的(甲基)丙烯酸酯。 Further, the three-dimensional crosslinked type hard resin composition of the hard resin layer 1 used in the present invention can be used in combination with a (meth) acrylate having two or more ethylenically unsaturated bonds in the molecule. The polyfunctional (meth) acrylate may, for example, be a difunctional (meth) acrylate or a trifunctional or higher (meth) acrylate.
二官能(甲基)丙烯酸酯係例如可列舉出二(甲基)丙烯酸乙二醇酯、二(甲基)丙烯酸二乙二醇酯、(甲基)丙烯酸己二醇 酯、長鏈脂肪族二(甲基)丙烯酸酯、二(甲基)丙烯酸新戊二醇酯、二(甲基)丙烯酸羥基三甲基乙酸新戊二醇酯、二(甲基)丙烯酸硬脂酸改質新戊四醇酯、二(甲基)丙烯酸丙烯酯、二(甲基)丙烯酸甘油酯、二(甲基)丙烯酸三乙二醇酯、二(甲基)丙烯酸四乙二醇酯、二(甲基)丙烯酸伸丁二醇酯、二(甲基)丙烯酸丁二醇酯、二(甲基)丙烯酸二環戊酯、二(甲基)丙烯酸聚乙二醇酯、二(甲基)丙烯酸聚丙烯酯、二(甲基)丙烯酸三甘油酯、二(甲基)丙烯酸新戊二醇改質三羥甲基丙烷酯、二(甲基)丙烯酸烯丙化環己酯、二(甲基)丙烯酸甲氧化環己酯、丙烯酸化三聚異氰酸酯、己二酸雙(丙烯氧基新戊二醇)酯、二(甲基)丙烯酸雙酚A酯、二(甲基)丙烯酸四溴雙酚A酯、二(甲基)丙烯酸雙酚S酯、二(甲基)丙烯酸丁二醇酯、二(甲基)丙烯酸鄰苯二甲酸酯、二(甲基)丙烯酸磷酸酯、二(甲基)丙烯酸鋅等。 Examples of the difunctional (meth) acrylate include ethylene glycol di(meth)acrylate, diethylene glycol di(meth)acrylate, and hexanediol (meth)acrylate. Ester, long-chain aliphatic di(meth) acrylate, neopentyl glycol di(meth)acrylate, neopentyl glycol hydroxytrimethylacetate di(meth)acrylate, hard di(meth)acrylate Fatty acid modified neopentyl glycol ester, propylene di(meth)acrylate, glyceryl di(meth)acrylate, triethylene glycol di(meth)acrylate, tetraethylene glycol di(meth)acrylate Ester, butylene glycol di(meth)acrylate, butylene glycol di(meth)acrylate, dicyclopentanyl di(meth)acrylate, polyethylene glycol di(meth)acrylate, di( Poly(meth)acrylate, triglyceride di(meth)acrylate, neopentyl glycol di(methyl)acrylate modified trimethylolpropane, dicyclohexyl (meth)acrylate, Di(hexa)cyclohexyl (meth)acrylate, acrylated isocyanate, bis(propyleneoxy neopentyl glycol) adipate, bisphenol A di(meth)acrylate, di(meth)acrylic acid Tetrabromobisphenol A ester, bis(meth)acrylic acid bisphenol S ester, di(meth)acrylic acid butylene glycol ester, di(meth)acrylic acid phthalate, di(meth)acrylic acid phosphate Two (methyl) Acid zinc.
此外,三官能以上的(甲基)丙烯酸酯係例如可列舉出三(甲基)丙烯酸三羥甲基丙烷酯、三(甲基)丙烯酸三羥甲基乙烷酯、三(甲基)丙烯酸甘油酯、二(甲基)丙烯酸新戊四醇酯、三(甲基)丙烯酸新戊四醇酯、三(甲基)丙烯酸烷基改質二新戊四醇酯、三(甲基)丙烯酸磷酸酯、三聚異氰酸三(甲基丙烯氧基乙基)酯、四(甲基)丙烯酸新戊四醇酯、四(甲基)丙烯酸二新戊四醇酯、四丙烯酸二(三羥甲基)丙烷酯、四(甲基)丙烯酸烷基改質二新戊四醇酯、五(甲基)丙烯酸二新戊四醇單羥酯、六(甲基)丙烯酸二新戊四醇酯、五(甲基)丙烯酸二新戊四醇酯、五(甲基)丙烯酸烷基改質二新戊四醇酯、五(甲基)丙烯酸羧酸改質二新戊四醇酯、三(甲基)丙烯酸胺甲酸乙酯、三(甲基)丙烯酸酯、六(甲基)丙烯酸胺甲酸乙酯、六(甲基)丙烯酸酯等。 Further, examples of the trifunctional or higher (meth) acrylate include trimethylolpropane tris(meth)acrylate, trimethylolethane tri(meth)acrylate, and tri(meth)acrylic acid. Glyceryl ester, neopentyl glycol di(meth)acrylate, neopentyl glycol tri(meth)acrylate, alkyl modified dipentaerythritol tris(meth)acrylate, tris(meth)acrylic acid Phosphate ester, tris(methacryloxyethyl) isocyanate, neopentyl tetra(meth)acrylate, dipentaerythritol tetra(meth)acrylate, di(tetramethylene) Hydroxymethyl)propane ester, tetra(meth)acrylic acid alkyl modified dipentaerythritol ester, pentaerythritol pentaerythritol monohydroxy ester, hexa(meth)acrylic acid dipivalol Ester, di-n-pentaerythritol penta(meth)acrylate, alkyl-modified pentaerythritol penta(meth)acrylate, modified pentaerythritol penta(meth)acrylate, three (meth)acrylic acid ethyl urethane, tri (meth) acrylate, hexa (meth) acrylate urethane, hexa (meth) acrylate, and the like.
具有籠型矽倍半氧烷構造之多官能(甲基)丙烯酸酯,可單獨使用該1種或組合2種以上而使用。 The polyfunctional (meth) acrylate having a cage-type sesquiterpene structure can be used singly or in combination of two or more.
本發明之由三維交聯型硬質樹脂組成物所構成之硬質樹脂層1,三維交聯型硬質樹脂組成物之固體成分每100g的(甲基)丙烯酸基莫耳數較佳為0.6至0.9的範圍,此外,該厚度較佳為50μm以上250μm以下。當每100g的(甲基)丙烯酸基莫耳數少於0.6時,無法得到充分的鉛筆硬度,多於0.9時,無柔軟性而難以成形,此外,耐衝擊性降低而難以進行切削、鑿穿等之機械加工。此外,當厚度未達50μm時,無法得到充分的鉛筆硬度,厚度超過250μm時,總透光率降低,而有無法得到顯示器所需的透明性之問題。 In the hard resin layer 1 composed of the three-dimensional crosslinked type hard resin composition of the present invention, the solid content of the three-dimensional crosslinked type hard resin composition is preferably from 0.6 to 0.9 per 100 g of the (meth)acrylic mole number. In addition, the thickness is preferably 50 μm or more and 250 μm or less. When the number of (meth)acrylic moles per 100 g is less than 0.6, sufficient pencil hardness cannot be obtained, and when it is more than 0.9, it is difficult to form without flexibility, and the impact resistance is lowered to make it difficult to cut and cut. Wait for machining. Further, when the thickness is less than 50 μm, sufficient pencil hardness cannot be obtained, and when the thickness exceeds 250 μm, the total light transmittance is lowered, and there is a problem that transparency required for the display cannot be obtained.
三維交聯型硬質樹脂組成物之固體成分每100g的(甲基)丙烯酸基莫耳數,係藉由下列式來算出。 The number of (meth)acrylic moles per 100 g of the solid content of the three-dimensional crosslinked type hard resin composition was calculated by the following formula.
(每100g的(甲基)丙烯酸基莫耳數)=(100/分子量)×1分子中的(甲基)丙烯酸基之數目 (per 100 g of (meth)acrylic mole number) = (100 / molecular weight) × 1 number of (meth)acrylic groups in the molecule
當使用複數種多官能(甲基)丙烯酸單體作為三維交聯型硬質樹脂組成物時,係使用因應調配比率所算出之平均的(甲基)丙烯酸基數,當調配有二氧化矽等之填料時,在含有該重量下,算出(甲基)丙烯酸基莫耳數的平均值。亦即,相當於存在於三維交聯型硬質樹脂組成物的固體成分中之(甲基)丙烯酸基之每單位質量的莫耳濃度(莫耳/100g)。 When a plurality of polyfunctional (meth)acrylic monomers are used as the three-dimensional crosslinked type hard resin composition, the average number of (meth)acrylic groups calculated based on the blending ratio is used, and when a filler such as cerium oxide is blended At this time, the average value of the number of (meth)acrylic moles was calculated under the weight. That is, it corresponds to the molar concentration per unit mass (mole/100 g) of the (meth)acrylic group present in the solid content of the three-dimensional crosslinked type hard resin composition.
由形成硬質樹脂層之三維交聯型硬質樹脂組成物所構成之硬質樹脂層1,在使三維交聯型硬質樹脂組成物之固體成分每100g的(甲基)丙烯酸基莫耳數不脫離0.6至0.9之範圍內,可 與單官能性(甲基)丙烯酸酯組合。惟,當調配一定量以上的單官能性(甲基)丙烯酸酯時,表面硬度有降低之傾向,即使在以黏度調整等為目的而調配時,較佳亦僅止於最低限度,相對於三維交聯型硬質樹脂組成物,較佳為30重量%以下。 The hard resin layer 1 composed of the three-dimensional crosslinked type hard resin composition forming the hard resin layer does not deviate from the (meth)acrylic mole number per 100 g of the solid content of the three-dimensional crosslinked type hard resin composition. Within the range of 0.9 Combined with a monofunctional (meth) acrylate. However, when a certain amount or more of monofunctional (meth) acrylate is blended, the surface hardness tends to decrease, and even when it is formulated for the purpose of viscosity adjustment or the like, it is preferably only at a minimum, relative to three dimensions. The crosslinked type hard resin composition is preferably 30% by weight or less.
單官能(甲基)丙烯酸酯係例如可列舉出丙烯酸甲酯、丙烯酸乙酯、丙烯酸正丁酯、丙烯酸異丁酯、丙烯酸二級丁酯、丙烯酸三級丁酯、丙烯酸戊酯、丙烯酸新戊酯、丙烯酸異戊酯、丙烯酸己酯、丙烯酸庚酯、丙烯酸辛酯、丙烯酸2-乙基己酯、丙烯酸正辛酯、丙烯酸異辛酯、丙烯酸壬酯、丙烯酸異壬酯、丙烯酸癸酯、丙烯酸異癸酯、丙烯酸十一酯、丙烯酸十二酯、丙烯酸十三酯、丙烯酸十四酯、丙烯酸十五酯、丙烯酸異十四酯、丙烯酸十六酯、丙烯酸十七酯、丙烯酸十八酯、丙烯酸十九酯、丙烯酸二十酯、丙烯酸正月桂酯、丙烯酸硬脂酯等之丙烯酸烷酯類;丙烯醯基嗎啉、丙烯酸環己酯、丙烯酸二環戊烯酯、丙烯酸二環戊烯氧乙酯、丙烯酸二環戊酯、丙烯酸苯酯、丙烯酸苄酯、丙烯酸2-羥乙酯、丙烯酸2-羥丙酯、丙烯酸2-羥丁酯、丙烯酸2-羥基-3-苯基氧基丙酯、單丙烯酸1,4-丁二醇酯、2-羥基烷基丙烯醯基磷酸酯、丙烯酸4-羥基環己酯、單丙烯酸1,6-己二醇酯、單丙烯酸新戊二醇酯、將ε-己內酯等之環狀酯化物加成於上述含羥基的丙烯酸酯系化合物者、藉由烷基縮水甘油醚、烯丙基縮水甘油醚、丙烯酸縮水甘油酯等之含縮水甘油基的化合物與丙烯酸之加成反應所得之化合物、單丙烯酸聚乙二醇酯、單丙烯酸聚丙二醇酯、丙烯酸四氫呋喃酯、丙烯酸異莰酯、丙烯酸(2-乙基-2-甲基-1,3-二氧戊環-4-基)甲酯、丙烯酸(2-異丁基-2-甲基-1,3-二氧戊環-4-基)甲 酯等。 Examples of the monofunctional (meth) acrylate include methyl acrylate, ethyl acrylate, n-butyl acrylate, isobutyl acrylate, secondary butyl acrylate, tertiary butyl acrylate, amyl acrylate, and neopentyl acrylate. Ester, isoamyl acrylate, hexyl acrylate, heptyl acrylate, octyl acrylate, 2-ethylhexyl acrylate, n-octyl acrylate, isooctyl acrylate, decyl acrylate, isodecyl acrylate, decyl acrylate, Isodecyl acrylate, eleven acrylate, dodecyl acrylate, tridecyl acrylate, tetradecyl acrylate, pentadecyl acrylate, isodecyl acrylate, hexadecyl acrylate, heptadecyl acrylate, octadecyl acrylate , alkyl acrylates, decyl acrylate, n-lauryl acrylate, stearyl acrylate, etc.; acryloyl morpholine, cyclohexyl acrylate, dicyclopentenyl acrylate, dicyclopentene acrylate Oxyethyl ester, dicyclopentyl acrylate, phenyl acrylate, benzyl acrylate, 2-hydroxyethyl acrylate, 2-hydroxypropyl acrylate, 2-hydroxybutyl acrylate, 2-hydroxy-3-phenyl acrylate Propyl ester, 1,4-butanediol monoacrylate, 2-hydroxyalkyl propylene decyl phosphate, 4-hydroxycyclohexyl acrylate, 1,6-hexanediol monoacrylate, neopentyl glycol monoacrylate The ester or a cyclic esterified product such as ε-caprolactone is added to the hydroxyl group-containing acrylate compound, and the shrinkage of the alkyl glycidyl ether, allyl glycidyl ether, glycidyl acrylate or the like is contained. a compound obtained by the addition reaction of a glyceryl compound with acrylic acid, polyethylene glycol monoacrylate, polypropylene glycol monoacrylate, tetrahydrofuran acrylate, isodecyl acrylate, acrylic acid (2-ethyl-2-methyl-1) , 3-dioxolan-4-yl)methyl ester, (2-isobutyl-2-methyl-1,3-dioxolan-4-yl)-acrylic acid Ester and the like.
若設定使用本發明之樹脂積層體作為汽車或航空器的窗玻璃用途,表面受到直射的日光變成高溫。此外,當使用來作為個人電腦或可攜式電子機器等之框體用時,於機器內部會產生熱。因此,硬質樹脂層為了防止受熱變形,必須具有耐熱性,且玻璃轉移溫度必須為200℃以上。考量到含有有機物而引起有機物的分解等,故硬質樹脂層之玻璃轉移溫度的上限為450℃。 When the resin laminate of the present invention is used as a window glass for an automobile or an aircraft, the surface is subjected to direct sunlight to become a high temperature. In addition, when used as a frame for a personal computer or a portable electronic device, heat is generated inside the machine. Therefore, in order to prevent heat deformation, the hard resin layer must have heat resistance, and the glass transition temperature must be 200 ° C or higher. When the organic matter is contained and the organic matter is decomposed or the like, the upper limit of the glass transition temperature of the hard resin layer is 450 °C.
本發明所使用之硬質樹脂層於單體的抗拉彈性率為2,000至4,000百萬帕。若抗拉彈性率未達2,000百萬帕,樹脂積層體的鉛筆硬度未達6H,若超過4,000百萬帕,會有成形或切削、鑿穿等之加工性難以進行之問題。再者,本發明所使用之硬質樹脂層,由於適合於顯示器面板等,所以其總透光率須為90%以上。 The hard resin layer used in the present invention has a tensile modulus of from 2,000 to 4,000 MPa per monomer. When the tensile modulus is less than 2,000 MPa, the pencil hardness of the resin laminate is less than 6H, and if it exceeds 4,000 MPa, the workability such as forming, cutting, and cutting is difficult to proceed. Further, since the hard resin layer used in the present invention is suitable for a display panel or the like, its total light transmittance must be 90% or more.
本發明所使用之三維交聯型硬質樹脂組成物,可藉由使該組成物進行自由基共聚合而得到(甲基)丙烯酸樹脂共聚物。為改良(甲基)丙烯酸樹脂共聚物的物性,或是促進自由基共聚合等之目的,可將各種添加劑調配於本發明之三維交聯型硬質樹脂組成物。促進反應之添加劑,可例示出熱聚合起始劑、熱聚合促進劑、光聚合起始劑、光起始助劑、增感劑等。在調配光聚合起始劑或熱聚合起始劑時,該添加量相對於三維交聯型硬質樹脂組成物的合計100重量份,可設為0.1至5重量份的範圍,更佳可設為0.1至3重量份的範圍。當該添加量未達0.1重量份時,硬化不足,使所得之硬質樹脂層的強度、剛性降低,另一方面,超過5重量份時,會有產生硬質樹脂層著色等問題之疑慮。在此所謂三維交聯型硬質樹脂組成物的合計100重量份,並不包含二 氧化矽等之填料。 The three-dimensional crosslinked type hard resin composition used in the present invention can obtain a (meth)acrylic resin copolymer by radical copolymerization of the composition. In order to improve the physical properties of the (meth)acrylic resin copolymer or to promote radical copolymerization, various additives may be formulated in the three-dimensional crosslinked type hard resin composition of the present invention. The additive for promoting the reaction may, for example, be a thermal polymerization initiator, a thermal polymerization promoter, a photopolymerization initiator, a photoinitiator, a sensitizer or the like. When the photopolymerization initiator or the thermal polymerization initiator is blended, the amount of addition may be in the range of 0.1 to 5 parts by weight, more preferably in the range of 0.1 to 5 parts by weight based on 100 parts by total of the three-dimensional crosslinked type hard resin composition. A range of 0.1 to 3 parts by weight. When the amount is less than 0.1 part by weight, the hardening is insufficient, and the strength and rigidity of the obtained hard resin layer are lowered. On the other hand, when the amount is more than 5 parts by weight, problems such as coloring of the hard resin layer may occur. Here, the total amount of the three-dimensional crosslinked type hard resin composition is 100 parts by weight, and does not include two. A filler such as ruthenium oxide.
將三維交聯型硬質樹脂組成物構成為光硬化性組成物時所使用之光聚合起始劑,可適合地使用苯乙酮系、安息香系、二苯基酮系、噻吨酮系、醯基膦氧化物系等之化合物。具體而言,可例示出2,2-二甲氧基-1,2-二苯基乙烷-1-酮、1-羥基環己基苯基酮、2-羥基-2-甲基-1-苯基丙烷-1-酮、1-[4-(2-羥乙氧基)-苯基]-2-羥基-2-甲基-1-丙烷-1-酮、2-羥基-1-[4-[4-(2-羥基-2-甲基-丙醯基)苄基]苯基]-2-甲基-1-丙烷-1-酮、苯基乙醛酸甲酯、2,4,6-三甲基苯甲醯基二苯基膦氧化物、雙(2,4,6-三甲基苯甲醯基)苯基膦氧化物、1,2-辛烷二酮、1-[4-(苯基硫)-,2-(苯甲醯肟)]、乙酮,1-[9-乙基-6-(2-甲基苯甲醯基)-9H-咔唑-3-基]-,1-(O-苯甲醯肟)]、2,4,6-三甲基苯甲醯基二苯基膦氧化物、2-甲基-1-[4-(甲基硫)苯基]-2-嗎啉丙烷-1-酮、1-羥基-環己基-苯基酮、2-苄基-2-二甲基胺基-1-(4-嗎啉苯基)-丁酮-1-酮、雙-2,6-二甲氧基苯甲醯基-2,4,4-三甲基戊基膦氧化物、二苯基酮、噻吨酮、2-氯噻吨酮、2,4-二乙基噻吨酮、異丙基噻吨酮、1-氯-4-丙氧基噻吨酮,此等可單獨使用該1種或組合2種以上使用。 When the photopolymerization initiator used in the photocurable composition is used as the photocurable composition, a acetophenone-based, benzoin-based, diphenylketone-based, thioxanthone-based or anthracene can be suitably used. A compound such as a phosphine oxide system. Specifically, 2,2-dimethoxy-1,2-diphenylethane-1-one, 1-hydroxycyclohexyl phenyl ketone, 2-hydroxy-2-methyl-1- can be exemplified Phenylpropan-1-one, 1-[4-(2-hydroxyethoxy)-phenyl]-2-hydroxy-2-methyl-1-propan-1-one, 2-hydroxy-1-[ 4-[4-(2-hydroxy-2-methyl-propenyl)benzyl]phenyl]-2-methyl-1-propan-1-one, methyl phenylglyoxylate, 2,4 ,6-trimethylbenzimidyldiphenylphosphine oxide, bis(2,4,6-trimethylbenzylidene)phenylphosphine oxide, 1,2-octanedione, 1- [4-(phenylsulfanyl)-,2-(benzonitrile)], ethyl ketone, 1-[9-ethyl-6-(2-methylbenzylidene)-9H-carbazole-3 -yl]-,1-(O-benzidine)], 2,4,6-trimethylbenzimidyldiphenylphosphine oxide, 2-methyl-1-[4-(methyl Thio)phenyl]-2-morpholinpropan-1-one, 1-hydroxy-cyclohexyl-phenyl ketone, 2-benzyl-2-dimethylamino-1-(4-morpholinylphenyl) -butanone-1-one, bis-2,6-dimethoxybenzhydryl-2,4,4-trimethylpentylphosphine oxide, diphenyl ketone, thioxanthone, 2-chloro Thioxanthone, 2,4-diethylthioxanthone, isopropylthioxanthone, 1-chloro-4-propoxythioxanthone, these may be used alone or in combination of two Used on.
本發明所使用之三維交聯型硬質樹脂組成物,可調配自由基聚合起始劑並藉由加熱或光照射使該組成物硬化,以平面或曲面等之任意形狀來製造硬質樹脂層。當藉由加熱來製造任意形狀的硬質樹脂層時,該成形溫度,可因應熱聚合起始劑與促進劑的選擇,在從室溫至200℃為止的廣泛範圍內選擇。此時,藉由在模具內或鋼帶上聚合硬化,可得到期望形狀的硬質樹脂層。 The three-dimensional crosslinked type hard resin composition used in the present invention may be formulated with a radical polymerization initiator and hardened by heating or light irradiation to produce a hard resin layer in an arbitrary shape such as a flat surface or a curved surface. When a hard resin layer of an arbitrary shape is produced by heating, the molding temperature can be selected in a wide range from room temperature to 200 ° C depending on the selection of the thermal polymerization initiator and the accelerator. At this time, a hard resin layer of a desired shape can be obtained by polymerization hardening in a mold or a steel strip.
此外,當藉由光照射來製造硬質樹脂層時,可藉由 照射波長10至400nm的紫外線或波長400至700nm的可見光線而得到。所使用之光的波長並無特別限制,但特別適合使用波長200至400nm的近紫外線。使用來作為紫外線產生源之燈,可例示出低壓汞燈(輸出:0.4至4W/cm)、高壓汞燈(40至160W/cm)、超高壓汞燈(173至435W/cm)、金屬鹵化物燈(80至160W/cm)、脈衝氙燈(80至120W/cm)、無電極放電燈(80至120W/cm)等。此等紫外線燈,分別於該分光分布具有特徵,故可因應所使用之光起始劑的種類來選定。 Further, when a hard resin layer is produced by light irradiation, It is obtained by irradiating ultraviolet rays having a wavelength of 10 to 400 nm or visible light having a wavelength of 400 to 700 nm. The wavelength of the light to be used is not particularly limited, but it is particularly suitable to use a near-ultraviolet light having a wavelength of 200 to 400 nm. A lamp used as a source of ultraviolet light generation can be exemplified by a low-pressure mercury lamp (output: 0.4 to 4 W/cm), a high-pressure mercury lamp (40 to 160 W/cm), an ultra-high pressure mercury lamp (173 to 435 W/cm), metal halide Object lamps (80 to 160 W/cm), pulsed xenon lamps (80 to 120 W/cm), electrodeless discharge lamps (80 to 120 W/cm), and the like. These ultraviolet lamps are characterized by the spectral distribution, and can be selected depending on the type of photoinitiator used.
藉由光照射來得到本發明所使用之任意形狀的硬質樹脂層之方法,例如可列舉出將三維交聯型硬質樹脂組成物注入於具有任意的模槽形狀且由石英玻璃等之透明材料所構成之模具內,並藉由上述紫外線燈照射紫外線而進行聚合硬化,然後從模具中脫模以製造期望形狀的成形體(硬質樹脂層)之方法。在未使用模具時,例如可例示出使用刮刀或輥狀塗佈機,將本發明之三維交聯型硬質樹脂組成物塗佈於移動的鋼帶上,並藉由上述紫外線燈進行聚合硬化,而製造薄片狀的成形體之方法等。 A method of obtaining a hard resin layer of any shape used in the present invention by light irradiation, for example, a three-dimensional crosslinked type hard resin composition is injected into a transparent material having a shape of an arbitrary groove and made of quartz glass or the like. In the mold which is formed, a method of performing polymerization hardening by irradiating ultraviolet rays with the ultraviolet lamp, and then releasing the mold from the mold to produce a molded body (hard resin layer) having a desired shape. When the mold is not used, for example, a three-dimensional crosslinked type hard resin composition of the present invention is applied onto a moving steel strip using a doctor blade or a roll coater, and is cured by polymerization by the above ultraviolet lamp. A method of producing a sheet-shaped formed body or the like.
如此,當藉由紫外線照射法使三維交聯型硬質樹脂組成物硬化時,紫外線硬化反應為自由基反應,故受到氧所造成之反應阻礙。因此,從抑制三維交聯型硬質樹脂組成物的硬化反應中氧所造成之反應阻礙之觀點來看,在塗佈三維交聯型硬質樹脂組成物後,較佳以由透明塑膠膜所構成之覆蓋層來覆蓋該表面。此外,如此以覆蓋層來覆蓋三維交聯型硬質樹脂組成物的表面,較佳使三維交聯型硬質樹脂組成物之表面上氧濃度成為1%以下,尤佳成為0.1%以下。如此地為了降低氧濃度,較佳採用表面 無空孔且氧穿透率小之透明塑膠膜。如此之膜的材質,例如可列舉出PET(聚對苯二甲酸乙二酯)、PEN(聚萘二甲酸乙二酯)、PBT(聚對苯二甲酸丁二酯)、PC(聚碳酸酯)、聚丙烯、聚乙烯、乙酸酯樹脂、丙烯酸系樹脂、氟乙烯系樹脂、聚醯胺、聚芳酯、賽珞凡、聚醚碸、降莰烯系樹脂等之塑膠。此等塑膠可單獨使用1種或組合2種以上使用。 As described above, when the three-dimensional crosslinked type hard resin composition is cured by the ultraviolet irradiation method, the ultraviolet curing reaction is a radical reaction, and thus the reaction by oxygen is inhibited. Therefore, from the viewpoint of suppressing the reaction inhibition by oxygen in the hardening reaction of the three-dimensional crosslinked type hard resin composition, after coating the three-dimensional crosslinked type hard resin composition, it is preferably composed of a transparent plastic film. A cover layer covers the surface. In addition, it is preferable that the surface of the three-dimensional crosslinked type hard resin composition covers the surface of the three-dimensional crosslinked type hard resin composition with an oxygen concentration of 1% or less, and more preferably 0.1% or less. In order to reduce the oxygen concentration, it is preferred to use a surface. Transparent plastic film with no holes and low oxygen permeability. Examples of the material of such a film include PET (polyethylene terephthalate), PEN (polyethylene naphthalate), PBT (polybutylene terephthalate), and PC (polycarbonate). ), plastics such as polypropylene, polyethylene, acetate resin, acrylic resin, vinyl fluoride resin, polyamide, polyarylate, celecoxib, polyether oxime, and decene-based resin. These plastics may be used alone or in combination of two or more.
上述塑膠膜,由於必須能夠剝離由三維交聯型硬質樹脂組成物所構成之硬質樹脂層以及熱塑性樹脂層,故較佳採用對塑膠膜的表面施以聚矽氧塗佈、氟塗佈等之易剝離處理者。 In the plastic film, since it is necessary to be able to peel off the hard resin layer and the thermoplastic resin layer composed of the three-dimensional crosslinked type hard resin composition, it is preferable to apply a polyfluorene coating, a fluorine coating, or the like to the surface of the plastic film. Easy to peel off the processor.
此外,上述塑膠膜亦可使用作為保護薄片6。當使用作為保護薄片6時,從耐熱性、透明性、耐候性、耐溶劑性、剛度、成本之觀點來看,較佳為使用聚對苯二甲酸乙二酯膜或聚碳酸酯膜。 Further, the above plastic film can also be used as the protective sheet 6. When used as the protective sheet 6, a polyethylene terephthalate film or a polycarbonate film is preferably used from the viewpoint of heat resistance, transparency, weather resistance, solvent resistance, rigidity, and cost.
〈熱塑性樹脂層〉 <Thermoplastic resin layer>
本發明所使用之熱塑性樹脂層3(3b),較佳為透明性優異者,可適合地使用聚對苯二甲酸乙二酯(PET)、三乙酸纖維素(TAC)、聚萘二甲酸乙二酯(PEN)、聚甲基丙烯酸甲酯(PMMA)、聚碳酸酯(PC)、聚醯亞胺(PI)、聚乙烯(PE)、聚丙烯(PP)、聚乙烯醇(PVA)、聚氯乙烯(PVC)、環烯烴共聚物(COC)、含降莰烯樹脂、聚醚碸、賽珞凡、芳香族聚醯胺等之各種樹脂膜,從耐熱性、透明性、耐候性、耐溶劑性、硬度、成形性、剛度、成本之觀點來看,較佳使用聚對苯二甲酸乙二酯、聚甲基丙烯酸甲酯或聚碳酸酯。此等膜可使用無拉伸者或是施以拉伸加工者。 The thermoplastic resin layer 3 (3b) used in the present invention is preferably one having excellent transparency, and polyethylene terephthalate (PET), cellulose triacetate (TAC), and polyethylene naphthalate B can be suitably used. Diester (PEN), polymethyl methacrylate (PMMA), polycarbonate (PC), polyimine (PI), polyethylene (PE), polypropylene (PP), polyvinyl alcohol (PVA), Various resin films of polyvinyl chloride (PVC), cycloolefin copolymer (COC), norbornene resin, polyether oxime, celecoxib, aromatic polyamine, etc., from heat resistance, transparency, weather resistance, From the viewpoints of solvent resistance, hardness, formability, rigidity, and cost, polyethylene terephthalate, polymethyl methacrylate or polycarbonate is preferably used. These films may be used without stretching or by a stretcher.
本發明所使用之熱塑性樹脂層之室溫的彈性率E1 與150℃時的彈性率E2之比(E1/E2)為1至500的範圍。150℃係假定後述成形時之模具或射出成形樹脂的標準溫度,當室溫時的彈性率較該溫度時的彈性率更高時,由於硬質樹脂層所造成的回彈,而無法維持成形時的形狀。因此,室溫的彈性率E1與150℃時的彈性率E2之比愈大,愈容易在成形溫度進行成形,且容易於室溫保持形狀。然而,當彈性率比超過500時,會產生樹脂積層體的鉛筆硬度未達6H,或是難以控制熱成形時的形狀之問題。彈性率比的測定,可從室溫至230℃為止以5℃/min的升溫速度對熱塑性樹脂層測定動態黏彈性,並求取室溫與150℃的儲存彈性率(E')之比。本發明中所謂的室溫,是指大致上為23至27℃的溫度,於彈性率測定中,以25℃為基準。 At room temperature elastic modulus of the thermoplastic resin layer used in the present invention, the ratio of E 1 and E 2 of the elastic modulus at 150 ℃ (E 1 / E 2 ) is in the range 1 to 500. The 150 ° C system assumes that the standard temperature of the mold or the injection molding resin at the time of molding described later is higher than the elastic modulus at the temperature when the modulus at room temperature is higher than that at the temperature, and the molding cannot be maintained due to the rebound caused by the hard resin layer. shape. Therefore, the elastic modulus at room temperature E 1 E and elastic modulus at 150 deg.] C of greater than 2, more easily molded at a molding temperature, and easy to maintain the shape at room temperature. However, when the modulus ratio exceeds 500, the pencil hardness of the resin laminate is less than 6H, or it is difficult to control the shape at the time of thermoforming. The elastic modulus ratio was measured by measuring the dynamic viscoelasticity of the thermoplastic resin layer at a temperature elevation rate of 5 ° C/min from room temperature to 230 ° C, and calculating the ratio of room temperature to storage elastic modulus (E') at 150 ° C. The room temperature referred to in the present invention means a temperature of approximately 23 to 27 ° C, and is based on 25 ° C in the measurement of the modulus of elasticity.
本發明所使用之熱塑性樹脂層的合計厚度的硬質樹脂層的厚度之比(熱塑性樹脂層/硬質樹脂層)為0.25以上10以下。當厚度比未達0.25時,具有難以進行成形、切削、鑿穿等之加工之問題,厚度比超過10時,會有鉛筆硬度未達6H之問題。熱塑性樹脂層的厚度(複數層時為其合計),可為30μm至1000μm。未達30μm時,會有於射出成形時硬質樹脂層產生破裂或裂痕之問題,相反的,超過1000μm時,會有鉛筆硬度未達6H或是難以加工之問題。 The ratio (thickness of the thermoplastic resin layer/hard resin layer) of the thickness of the hard resin layer of the total thickness of the thermoplastic resin layer used in the present invention is 0.25 or more and 10 or less. When the thickness ratio is less than 0.25, there is a problem that it is difficult to perform processing such as forming, cutting, and cutting. When the thickness ratio exceeds 10, there is a problem that the pencil hardness is less than 6H. The thickness of the thermoplastic resin layer (total of the plurality of layers) may be from 30 μm to 1000 μm. When it is less than 30 μm, there is a problem that cracks or cracks occur in the hard resin layer at the time of injection molding. Conversely, when it exceeds 1000 μm, there is a problem that the pencil hardness is less than 6H or it is difficult to process.
本發明之樹脂積層體的硬質樹脂層1與熱塑性樹脂層3,可藉由膜狀、薄片狀中任一種的黏合劑層2進行積層。此黏合劑層2,其厚度為0.01至30μm,較佳為0.1至10μm。未達0.01μm時難以得到充分的黏著效果,30μm以上時,無法充分得到樹脂積層體的鉛筆硬度。在此的黏合劑層2,可為下述黏著層 或易黏著層。 The hard resin layer 1 and the thermoplastic resin layer 3 of the resin laminate of the present invention can be laminated by the adhesive layer 2 of any one of a film shape and a sheet shape. The adhesive layer 2 has a thickness of 0.01 to 30 μm, preferably 0.1 to 10 μm. When it is less than 0.01 μm, it is difficult to obtain a sufficient adhesive effect, and when it is 30 μm or more, the pencil hardness of the resin laminate cannot be sufficiently obtained. The adhesive layer 2 here may be the following adhesive layer Or easy to adhere to the layer.
〈黏著層〉 <adhesive layer>
構成黏合劑層2者,可列舉出使用黏著性黏著劑、感壓性黏著劑、光硬化性黏著劑、熱硬化性黏著劑及熱熔黏著劑之黏著層。此等黏著劑可列舉出丙烯酸黏著劑、胺甲酸乙酯黏著劑、環氧黏著劑、聚酯黏著劑、聚乙烯醇黏著劑、聚烯烴黏著劑、改質聚烯烴黏著劑、聚乙烯烷醚黏著劑、橡膠黏著劑、氯乙烯-乙酸乙烯酯黏著劑、苯乙烯-丁二烯-苯乙烯共聚物(SBS共聚物)黏著劑、其氫化物(SEBS共聚物)黏著劑、乙烯-乙酸乙烯酯共聚物、乙烯-苯乙烯共聚物等之乙烯黏著劑、乙烯-甲基丙烯酸甲酯共聚物、乙烯-丙烯酸甲酯共聚物、乙烯-甲基丙烯酸乙酯共聚物、乙烯-丙烯酸乙酯共聚物等之丙烯酸酯黏著劑等,只要黏著性、透明性、加工性良好即可,並無特別限定。 Examples of the adhesive layer 2 include an adhesive layer using an adhesive adhesive, a pressure-sensitive adhesive, a photocurable adhesive, a thermosetting adhesive, and a hot-melt adhesive. Examples of such adhesives include acrylic adhesives, urethane adhesives, epoxy adhesives, polyester adhesives, polyvinyl alcohol adhesives, polyolefin adhesives, modified polyolefin adhesives, and polyvinyl alkane ethers. Adhesive, rubber adhesive, vinyl chloride-vinyl acetate adhesive, styrene-butadiene-styrene copolymer (SBS copolymer) adhesive, hydride (SEBS copolymer) adhesive, ethylene-vinyl acetate Ethylene adhesive such as ester copolymer, ethylene-styrene copolymer, ethylene-methyl methacrylate copolymer, ethylene-methyl acrylate copolymer, ethylene-ethyl methacrylate copolymer, ethylene-ethyl acrylate copolymer The acrylate adhesive such as the material is not particularly limited as long as it is excellent in adhesion, transparency, and workability.
〈易黏著層〉 <easy adhesion layer>
此外,構成黏合劑層2之其他者,可列舉出易黏著層。易黏著層係對難黏著性之樹脂層的表面施以化學易黏著能或物理易黏著能之處理後的層。所謂化學易黏著能係在基材層上形成具有官能基之樹脂的薄膜層,並與硬質樹脂層形成化學鍵而得到密著力,所謂物理易黏著能係在基材上形成具有凹凸之樹脂薄膜層或無機薄膜層,以藉由錨定效果而得到與硬質樹脂層之密著力。具有化學易黏著能之材料,可列舉出多官能(甲基)丙烯酸酯類、環氧類、含硫醇基之化合物等,具有物理易黏著能之材料,可列舉出SiO2、SiN、SiC等之蒸鍍膜等。 Moreover, the other which comprises the adhesive layer 2 is an easy adhesion layer. The easy-adhesive layer applies a layer which is treated by chemical adhesion or physical adhesion to the surface of the resin layer which is difficult to adhere. The chemical adhesion can form a film layer of a resin having a functional group on a substrate layer, and form a chemical bond with the hard resin layer to obtain a close contact force. The so-called physical adhesion can form a resin film layer having irregularities on the substrate. Or the inorganic thin film layer is obtained by the anchoring effect to obtain a close contact with the hard resin layer. Examples of the chemically-adhesive material include polyfunctional (meth)acrylates, epoxy resins, and thiol-containing compounds, and materials having physical adhesion properties include SiO 2 , SiN, and SiC. Such as vapor deposition film.
第1圖係顯示第1實施樣態作為本發明之樹脂積層 體的實施形態。該樹脂積層體,如第1圖所示,具有下列構造,亦即於熱塑性樹脂層3的雙面上,介由黏合劑層2而於上下雙面形成硬質樹脂層1,進一步於一者之硬質樹脂層1的下面具備有印刷層4之構造,於此等之表背的最表面上形成保護薄片6。其中,各黏合劑層2具有用以使硬質樹脂層1及熱塑性樹脂層3形成一體之黏著層的功能。 Fig. 1 shows a first embodiment as a resin laminate of the present invention. The embodiment of the body. As shown in Fig. 1, the resin laminate has the following structure, that is, a hard resin layer 1 is formed on both sides of the thermoplastic resin layer 3 via the adhesive layer 2, and further, one of the layers. The lower surface of the hard resin layer 1 is provided with a structure of the printed layer 4, and the protective sheet 6 is formed on the outermost surface of the front and back. Each of the adhesive layers 2 has a function of forming an adhesive layer in which the hard resin layer 1 and the thermoplastic resin layer 3 are integrally formed.
如第1圖所示,藉由在本發明之樹脂積層體的下面形成印刷層4,可構成圖樣、文字等。印刷層4的印刷圖樣,可列舉出木紋、石紋、布紋、砂紋、幾何學圖樣、文字、全面空白、金屬等之花紋,可任意地設定。 As shown in Fig. 1, by forming the printed layer 4 on the lower surface of the resin laminate of the present invention, a pattern, a character, or the like can be formed. The printed pattern of the printed layer 4 may be a pattern of wood grain, stone grain, cloth grain, sand grain, geometric pattern, text, full blank, metal, etc., and can be arbitrarily set.
於印刷層4中,較佳係調配與硬質樹脂層或熱塑性樹脂層之配合性佳之樹脂成分,例如可列舉出氯乙烯-乙酸乙烯酯共聚物等之聚乙烯基系樹脂、聚醯胺系樹脂、聚酯系樹脂、丙烯酸系樹脂、聚胺甲酸酯系樹脂、聚乙烯縮醛系樹脂、聚酯胺甲酸乙酯系樹脂、纖維素酯系樹脂、醇酸樹脂、氯化聚烯烴樹脂等。藉由調配如此之樹脂成分,可抑制印刷之剝離或脫落。此外,於印刷層4的形成時,可使用含有適當色彩的顏料或染料之著色劑。 In the printing layer 4, a resin component having a good compatibility with a hard resin layer or a thermoplastic resin layer is preferably blended, and examples thereof include a polyvinyl resin such as a vinyl chloride-vinyl acetate copolymer, and a polyamide resin. Polyester resin, acrylic resin, polyurethane resin, polyvinyl acetal resin, polyester urethane resin, cellulose ester resin, alkyd resin, chlorinated polyolefin resin, etc. . By blending such a resin component, peeling or peeling off of printing can be suppressed. Further, at the time of formation of the printed layer 4, a coloring agent containing a pigment or a dye of an appropriate color may be used.
印刷層4的形成方法,例如可列舉出平版印刷法、凹版輪旋轉印刷法、網版印刷法等之印刷法、輥塗佈法、噴霧塗佈法等之塗佈法以及柔版印刷法。此外,印刷層4的厚度,以在該積層薄片、該膜積層成形品或該積層薄片積層成形品中可得到期望的表面外觀之方式來選擇適當的厚度,一般為0.5至30μm。 Examples of the method of forming the printing layer 4 include a printing method such as a lithography method, a gravure wheel rotary printing method, or a screen printing method, a coating method such as a roll coating method or a spray coating method, and a flexographic printing method. Further, the thickness of the printed layer 4 is selected to have an appropriate thickness so as to obtain a desired surface appearance in the laminated sheet, the laminated layer molded article or the laminated laminate-formed article, and is generally 0.5 to 30 μm.
關於本發明之樹脂積層體,例如可例示出第2圖、第3圖所示之構造作為第2、第3實施樣態。 For the resin laminate of the present invention, for example, the structures shown in Figs. 2 and 3 can be exemplified as the second and third embodiments.
其中,在第2圖所示之第2實施樣態中,於熱塑性樹脂層3的上面形成印刷層4,並於該印刷層4側上部與未形成印刷層4之一側分別夾持感壓性黏著劑層5,於印刷層4側形成硬質樹脂層1,於未形成印刷層4之一側形成熱塑性樹脂層3b,並於該雙面形成保護薄片6。 In the second embodiment shown in Fig. 2, the printed layer 4 is formed on the upper surface of the thermoplastic resin layer 3, and the pressure is sandwiched between the upper portion of the printed layer 4 side and the side where the printed layer 4 is not formed. The adhesive layer 5 has a hard resin layer 1 formed on the side of the printing layer 4, a thermoplastic resin layer 3b formed on one side where the printing layer 4 is not formed, and a protective sheet 6 formed on both sides.
第2圖中,所使用之熱塑性樹脂層3,只要具有透明性即可,並無特別限定,但較佳為聚甲基丙烯酸甲酯(PMMA)。熱塑性樹脂層3為PMMA時,與PC相比,當熱塑性樹脂較厚時,即使硬質樹脂層為接近下限值之厚度,亦可形成高鉛筆硬度。 In the second embodiment, the thermoplastic resin layer 3 to be used is not particularly limited as long as it has transparency, but polymethyl methacrylate (PMMA) is preferred. When the thermoplastic resin layer 3 is PMMA, when the thermoplastic resin is thicker than PC, even if the hard resin layer has a thickness close to the lower limit, a high pencil hardness can be formed.
另一方面,在第3圖所示之第3實施樣態中,於熱塑性樹脂層3的上面夾持黏合劑層2形成硬質樹脂層1,於熱塑性樹脂層3的下面形成印刷層4,在形成有印刷層4之熱塑性樹脂層3的下面,介由黏合劑層2或感壓性黏著劑層5形成熱塑性樹脂層3b,並於該雙面形成保護薄片6。該第3實施樣態之樹脂積層體,例如適合於曲率半徑r更小之形狀的加工。 On the other hand, in the third embodiment shown in Fig. 3, the adhesive layer 2 is sandwiched between the thermoplastic resin layer 3 to form the hard resin layer 1, and the printed layer 4 is formed on the lower surface of the thermoplastic resin layer 3. On the lower surface of the thermoplastic resin layer 3 on which the printing layer 4 is formed, the thermoplastic resin layer 3b is formed via the adhesive layer 2 or the pressure-sensitive adhesive layer 5, and the protective sheet 6 is formed on both sides. The resin laminate of the third embodiment is suitable for processing such as a shape having a smaller radius of curvature r.
於第2及第3實施樣態中所使用之感壓性黏著劑層5,可使用公知的感壓性黏著劑。具體而言,例如可使用天然橡膠系樹脂、合成橡膠系樹脂、聚矽氧系樹脂、丙烯酸系樹脂、乙酸乙烯酯系樹脂、胺甲酸乙酯系樹脂等之黏著劑。此等黏著劑,只要可得到所需的光穿透性、黏著性、耐候性即可,並無特別限定。此外,因層構成的不同,為了防止色素的劣化,較佳於黏著劑中含有具有吸收紫外線效果之UV吸收劑(苯并三唑等)。 A well-known pressure-sensitive adhesive can be used for the pressure-sensitive adhesive layer 5 used in the second and third embodiments. Specifically, for example, an adhesive such as a natural rubber-based resin, a synthetic rubber-based resin, a polyoxymethylene-based resin, an acrylic resin, a vinyl acetate-based resin, or an urethane-based resin can be used. These adhesives are not particularly limited as long as they have desired light penetration, adhesion, and weather resistance. Further, in order to prevent deterioration of the dye due to the difference in layer constitution, it is preferred to contain a UV absorber (benzotriazole or the like) having an ultraviolet absorbing effect in the adhesive.
感壓性黏著劑層5係其平均厚度為0.01至30μm,較佳為0.1至10μm。未達0.01μm時,難以得到充分的黏著強度, 且吸收印刷層的凹凸以達平坦化之效果亦降低,此外,30μm以上時,無法充分得到積層體的鉛筆硬度。 The pressure-sensitive adhesive layer 5 has an average thickness of 0.01 to 30 μm, preferably 0.1 to 10 μm. When it is less than 0.01 μm, it is difficult to obtain sufficient adhesion strength. Further, the effect of absorbing the unevenness of the printed layer to achieve flatness is also lowered, and when the thickness is 30 μm or more, the pencil hardness of the laminated body cannot be sufficiently obtained.
本發明之實施樣態第2圖、第3圖中,在樹脂積層體的狀態下,可藉由熱成形來賦予三維形狀。第2圖、第3圖中的熱塑性樹脂層3及3b,可藉由熱來成形,由於硬質樹脂層1具有充分的柔軟性,所以可跟隨熱塑性樹脂層的形狀而介由黏合劑層2形成一體成形品。熱成形可列舉出真空成形、壓縮成形、模壓成形等。 In the second embodiment and the third embodiment of the present invention, in the state of the resin laminate, the three-dimensional shape can be imparted by thermoforming. The thermoplastic resin layers 3 and 3b in Figs. 2 and 3 can be formed by heat, and since the hard resin layer 1 has sufficient flexibility, it can be formed by the adhesive layer 2 following the shape of the thermoplastic resin layer. One-piece molded product. Examples of the thermoforming include vacuum forming, compression molding, and press molding.
此外,於本發明之實施樣態第2圖所示之樹脂積層體般的層構成中,可使用預先分別成形為既定形狀之A部件、B部件,並介由感壓性黏著劑層5來貼合。亦即,可介由感壓性黏著劑層5而貼合具備有保護薄片6、硬質樹脂層1、感壓性黏著劑層5、印刷層4及熱塑性樹脂層3之A部件,以及由熱塑性樹脂層3b及保護薄片6所構成之B部件。 Further, in the layer structure of the resin laminate shown in Fig. 2 of the embodiment of the present invention, the A member and the B member which have been formed into a predetermined shape in advance, and the pressure-sensitive adhesive layer 5 can be used. fit. That is, the A-part having the protective sheet 6, the hard resin layer 1, the pressure-sensitive adhesive layer 5, the printing layer 4, and the thermoplastic resin layer 3 may be bonded via the pressure-sensitive adhesive layer 5, and may be made of thermoplastic The B member composed of the resin layer 3b and the protective sheet 6.
此外,關於本發明之實施樣態第3圖所示之樹脂積層體,可在將C部件(保護薄片6、硬質樹脂層1、黏合劑層2、熱塑性樹脂層3、印刷層4及黏合劑層2(或感壓性黏著劑層5))裝填於期望形狀的模具內後,藉由射出成形來注入熱塑性樹脂層3b,然後設置保護薄片6而形成B部件(熱塑性樹脂層3b及保護薄片6)。 Further, in the resin laminated body shown in Fig. 3 of the embodiment of the present invention, the C member (protective sheet 6, hard resin layer 1, adhesive layer 2, thermoplastic resin layer 3, printed layer 4, and adhesive) can be used. After the layer 2 (or the pressure-sensitive adhesive layer 5) is filled in a mold of a desired shape, the thermoplastic resin layer 3b is injected by injection molding, and then the protective sheet 6 is provided to form a B member (the thermoplastic resin layer 3b and the protective sheet). 6).
於實施樣態第1圖至第3圖中,分別形成有印刷層4,但亦可省略印刷層4,此外,亦可配合積層體製造程序,以任意的印刷方法形成於任意的層間。 In the first to third embodiments, the printed layer 4 is formed, but the printed layer 4 may be omitted, or may be formed between arbitrary layers by any printing method in accordance with a laminate manufacturing process.
如第3圖所示,本發明中,可藉由將依需要而進行 熱成形以形成既定形狀之樹脂積層體裝填於模具內,並將熱塑性樹脂射出成形,以與熱塑性樹脂層一體化。如此地射出成形之熱塑性樹脂,較佳具有透明性,可適合地使用聚對苯二甲酸乙二酯(PET)、三乙酸纖維素(TAC)、聚萘二甲酸乙二酯(PEN)、聚甲基丙烯酸甲酯(PMMA)、聚碳酸酯(PC)、聚醯亞胺(PI)、聚乙烯(PE)、聚丙烯(PP)、聚乙烯醇(PVA)、聚氯乙烯(PVC)、環烯烴共聚物(COC)、含降莰烯樹脂、聚醚碸、賽珞凡、芳香族聚醯胺等之各種樹脂膜,從耐熱性、透明性、耐候性、耐溶劑性、剛度、成本之觀點來看,較佳使用聚對苯二甲酸乙二酯、聚甲基丙烯酸甲酯或聚碳酸酯。從耐衝擊性之觀點來看,較佳使用聚碳酸酯。 As shown in FIG. 3, in the present invention, it can be performed as needed The resin layered body which is formed into a predetermined shape by thermoforming is loaded into a mold, and the thermoplastic resin is injection-molded to be integrated with the thermoplastic resin layer. The molded thermoplastic resin is preferably transparent, and polyethylene terephthalate (PET), cellulose triacetate (TAC), polyethylene naphthalate (PEN), and poly are suitably used. Methyl methacrylate (PMMA), polycarbonate (PC), polyimine (PI), polyethylene (PE), polypropylene (PP), polyvinyl alcohol (PVA), polyvinyl chloride (PVC), Various resin films of cycloolefin copolymer (COC), decene-containing resin, polyether oxime, celecoxib, aromatic polyamine, etc., from heat resistance, transparency, weather resistance, solvent resistance, rigidity, cost From the viewpoint of the use, polyethylene terephthalate, polymethyl methacrylate or polycarbonate is preferably used. From the viewpoint of impact resistance, polycarbonate is preferably used.
[實施例] [Examples]
以下,使用實施例來更詳細說明本發明。本發明所使用之評估方法及記號如下所述。 Hereinafter, the present invention will be described in more detail by way of examples. The evaluation methods and symbols used in the present invention are as follows.
1)鉛筆硬度:依據JIS K 5600來測定。 1) Pencil hardness: Measured in accordance with JIS K 5600.
2)總透光率:依據JIS K 7361-1來測定。 2) Total light transmittance: measured in accordance with JIS K 7361-1.
3)膜厚:使用Mitutoyo股份有限公司製ID-SX來測定。 3) Film thickness: It was measured using ID-SX manufactured by Mitutoyo Co., Ltd.
4)抗拉彈性率:依據JIS K 7127來測定。 4) Tensile modulus: measured in accordance with JIS K 7127.
5)加工性:將雕刻刀(內山刃物公司製、刃徑2mm、直刃)安裝於雕刻加工機(Megaro Technica公司製),以轉數20,000rpm、傳送速度900mm/分的加工條件,對實施例中所得之樹脂積層體進行切削加工,並進行切削面的顯微鏡觀察,以於切斷面觀察到缺口(崩角)者為×,未觀察到者為○。 5) Machinability: The engraving knives (manufactured by Neiyama Blade Co., Ltd., 2 mm, straight edge) were attached to an engraving machine (manufactured by Megaro Technica Co., Ltd.), and the processing conditions were 20,000 rpm and 900 mm/min. The resin laminate obtained in the examples was subjected to a cutting process, and a microscopic observation of the cut surface was carried out so that the notch (crash angle) was observed as × on the cut surface, and ○ was not observed.
6)成形性:觀察實施下述真空壓縮成形或射出成形後所得到之成形體,以觀察到破裂、裂痕、白化中的任一項者為×,良好狀態者 為○。 6) Formability: The molded body obtained by the following vacuum compression molding or injection molding was observed to observe that any of cracking, cracking, and whitening was ×, and a good state was obtained. It is ○.
[合成例1] [Synthesis Example 1]
將作為溶劑的2-丙醇(IPA)400ml與作為鹼性觸媒的5%氫氧化四甲基銨水溶液(TMAH水溶液)裝入於具備有攪拌機、滴入漏斗、及溫度計之反應容器。將IPA150ml與3-甲基丙烯氧基丙基三甲氧矽烷(MTMS:Toray Dow Corning Silicone股份有限公司製SZ-6030)126.9g裝入於滴入漏斗,一邊攪拌反應容器,一邊於室溫中在30分鐘內滴入MTMS的IPA溶液。MTMS滴入結束後,不加熱而持續攪拌2小時。於2小時的攪拌後,於減壓下去除溶劑並以甲苯500ml進行溶解。以飽和食鹽水將反應溶液水洗至成為中性後,以無水硫酸鎂進行脫水。過濾無水硫酸鎂並進行濃縮,而得到於全部矽原子上具有甲基丙烯醯基之籠型矽倍半氧烷化合物86g。該矽倍半氧烷,為可溶於各種有機溶劑之無色的黏性液體。 400 ml of 2-propanol (IPA) as a solvent and a 5% aqueous solution of tetramethylammonium hydroxide (TMAH aqueous solution) as a basic catalyst were placed in a reaction vessel equipped with a stirrer, a dropping funnel, and a thermometer. 150 mL of IPA and 126.9 g of 3-methacryloxypropyltrimethoxy decane (MTMS: SZ-6030, manufactured by Toray Dow Corning Silicone Co., Ltd.) were placed in a dropping funnel, and the reaction vessel was stirred while being at room temperature. The IPMS solution of MTMS was added dropwise over 30 minutes. After the completion of the dropwise addition of MTMS, stirring was continued for 2 hours without heating. After stirring for 2 hours, the solvent was removed under reduced pressure and dissolved in 500 ml of toluene. The reaction solution was washed with a saturated saline solution until it became neutral, and then dehydrated with anhydrous magnesium sulfate. Anhydrous magnesium sulfate was filtered and concentrated to obtain 86 g of a cage-type mercaptosulfanyl compound having a methacryl oxime group on all of the ruthenium atoms. The sesquisesquioxane is a colorless viscous liquid which is soluble in various organic solvents.
[實施例1] [Example 1]
(硬質樹脂層的製作) (Production of hard resin layer)
將上述合成例1中所製作之於全部矽原子上具有甲基丙烯醯基之籠型矽倍半氧烷化合物:23重量份、六丙烯酸二新戊四醇酯:39重量份、二丙烯酸二環戊酯:32重量份、丙烯酸胺甲酸乙酯低聚物1:6重量份、以及作為光聚合起始劑的1-羥基環己基苯基酮:2.5重量份混合,而得到透明的三維交聯型硬質樹脂組成物。對所得之三維交聯型硬質樹脂組成物,使用先前所說明的式子來求取三維交聯型硬質樹脂組成物所含有之樹脂固體成分每100g的(甲基)丙烯酸基莫耳數,結果為0.76。第1表係顯示該三維交聯型硬質樹脂組成物的組成。 The cage-type sesquioxalic acid compound having a methacryl fluorenyl group on all the ruthenium atoms prepared in the above Synthesis Example 1 : 23 parts by weight, dipentaerythritol hexaacrylate: 39 parts by weight, diacrylic acid Cyclopentyl ester: 32 parts by weight, hexamide acrylate oligomer 1:6 parts by weight, and 1-hydroxycyclohexyl phenyl ketone as a photopolymerization initiator: 2.5 parts by weight, to obtain a transparent three-dimensional cross A joint type hard resin composition. The obtained three-dimensional crosslinked type hard resin composition was obtained by using the formula described above to obtain a (meth)acrylic mole number per 100 g of the resin solid content contained in the three-dimensional crosslinked type hard resin composition. It is 0.76. The first table shows the composition of the three-dimensional crosslinked type hard resin composition.
第1表中的略稱係如下所述。 The abbreviations in Table 1 are as follows.
A:合成例1中所得之化合物 A: Compound obtained in Synthesis Example 1
B:六丙烯酸二新戊四醇酯(日本化藥股份有限公司製KAYARAD DPHA) B: Dipentaerythritol hexaacrylate (KAYARAD DPHA, manufactured by Nippon Kayaku Co., Ltd.)
C:三甲基丙烯酸三羥甲基丙烷酯(共榮社化學股份有限公司製Light Ester TMP) C: Trimethylolpropane trimethacrylate (Light Ester TMP manufactured by Kyoeisha Chemical Co., Ltd.)
D:三丙烯酸新戊四醇酯(共榮社化學股份有限公司製Light Acrylate PE-3A) D: neopentyl glycol triacrylate (Light Acrylate PE-3A manufactured by Kyoeisha Chemical Co., Ltd.)
E:己內酯改質六丙烯酸二新戊四醇酯1(日本化藥股份有限公司製KAYARAD DPCA-20) E: Caprolactone modified dipentaerythritol hexaacrylate 1 (KAYARAD DPCA-20 manufactured by Nippon Kayaku Co., Ltd.)
F:己內酯改質六丙烯酸二新戊四醇酯2(日本化藥股份有限公司製KAYARAD DPCA-30) F: caprolactone modified dipentaerythritol hexaacrylate 2 (KAYARAD DPCA-30 manufactured by Nippon Kayaku Co., Ltd.)
G:二丙烯酸二羥甲基三環癸烷酯(二丙烯酸二環戊烯酯)(共榮社化學股份有限公司製Light Acrylate DCP-A) G: Dimethylol tricyclodecyl acrylate (dicyclopentenyl diacrylate) (Light Acrylate DCP-A manufactured by Kyoeisha Chemical Co., Ltd.)
H:二甲基丙烯酸二環戊酯(新中村化學股份有限公司製NK Ester DCP) H: Dicyclopentyl dimethacrylate (NK Ester DCP, manufactured by Shin-Nakamura Chemical Co., Ltd.)
I:聚甲基丙烯酸甲酯(PMMA)(Kuraray股份有限公司製Parapet LW:重量平均分子量約34000) I: Polymethyl methacrylate (PMMA) (Parapet LW manufactured by Kuraray Co., Ltd.: weight average molecular weight of about 34,000)
J:丙烯酸胺甲酸乙酯低聚物1(共榮社化學股份有限公司製UF-503:數量平均分子量約8800) J: urethane amide oligomer 1 (UF-503 manufactured by Kyoeisha Chemical Co., Ltd.: number average molecular weight of about 8800)
K:丙烯酸胺甲酸乙酯低聚物2(新中村化學股份有限公司製NK Oligo UA-122P:數量平均分子量約1100) K: urethane urethane oligomer 2 (NK Oligo UA-122P, manufactured by Shin-Nakamura Chemical Co., Ltd.: number average molecular weight: about 1100)
L:1-羥基環己基苯基酮(聚合起始劑、BASF Japan股份有限公司製IRGACURE 184) L: 1-hydroxycyclohexyl phenyl ketone (polymerization initiator, IRGACURE 184, manufactured by BASF Japan Co., Ltd.)
接著使用輥塗佈機,以使厚度成為0.15mm之方式將三維交聯型硬質樹脂組成物澆鑄(垂流)於經剝離處理後之PET上,在將另外經剝離處理後之PET層合於被澆鑄之三維交聯型硬質樹脂組成物後,使用30W/cm的高壓汞燈,以4000mJ/cm2的積算曝光量進行硬化,並將經剝離處理之PET全部予以剝離去除,而得到既定厚度(150μm)之薄片狀硬質樹脂層。對於所得之硬質樹脂層測定玻璃轉移溫度,至300℃為止仍未觀測到。此外,測定該硬質樹脂層的抗拉彈性率及總透光率。結果如第1表所示。 Next, a three-dimensional crosslinked type hard resin composition was cast (hang) on the peeled PET using a roll coater so as to have a thickness of 0.15 mm, and the PET which was additionally subjected to the release treatment was laminated on the PET. After the three-dimensional crosslinked type hard resin composition to be cast, a high-pressure mercury lamp of 30 W/cm is used, and hardening is performed at an accumulated exposure amount of 4000 mJ/cm 2 , and all of the peeled PET is peeled off to obtain a predetermined thickness. A sheet-like hard resin layer of (150 μm). The glass transition temperature of the obtained hard resin layer was not observed until 300 °C. Further, the tensile modulus and the total light transmittance of the hard resin layer were measured. The results are shown in Table 1.
(樹脂積層體的製作) (Production of resin laminate)
以成為5μm的厚度之方式將陽離子系光硬化性黏著劑(協立化學產業公司製)塗佈垂流於聚碳酸酯(帝人公司製PC-1151、200mm×200mm×厚0.5mm)後,將上述所得之硬質樹脂層貼合於聚碳酸酯的單面側全面,並壓接後,藉由金屬鹵化物燈以500mJ/cm2的的比率從雙面照射紫外線,而得到在硬質樹脂層上形成保護薄片之樹脂積層體(A部件)。對於在此使用來作為熱塑性樹脂層之聚碳酸酯,以從室溫(25℃)至230℃為止之5℃/min的升溫速度測定動態黏彈性(DMA),並從室溫的貯存彈性率E1與150℃的貯存彈性率E2求取彈性率比(E1/E2),結果為1.35。 A cationic photocurable adhesive (manufactured by Kyoritsu Chemical Co., Ltd.) was applied to a polycarbonate (manufactured by Teijin Co., Ltd., PC-1151, 200 mm × 200 mm × thickness: 0.5 mm) so as to have a thickness of 5 μm. The hard resin layer obtained above was bonded to the single-sided side of the polycarbonate and pressed, and then irradiated with ultraviolet rays from both sides at a ratio of 500 mJ/cm 2 by a metal halide lamp to obtain a hard resin layer. A resin laminate (Part A) that forms a protective sheet. For the polycarbonate used herein as the thermoplastic resin layer, dynamic viscoelasticity (DMA) was measured at a temperature elevation rate of 5 ° C/min from room temperature (25 ° C) to 230 ° C, and the storage modulus from room temperature was measured. The storage elastic modulus E 2 of E 1 and 150 ° C was determined as the elastic modulus ratio (E 1 /E 2 ), and as a result, it was 1.35.
(真空壓縮成形實施例) (Vacuum compression molding example)
藉由矽橡膠(厚0.8mm)從上下方夾持上述所得之樹脂積層體(A部件),在壓縮空氣5大氣壓、上下的模具溫度150℃至250℃下,將至壓縮的延遲設為10秒、壓力保持時間設為30秒,來成形樹脂積層體(A部件),將樹脂積層體(A部件)成形為於4邊具有曲面(曲率半徑a:8mm)且具有第5圖所示的剖面形狀之曲面形狀 (高度b:7mm)。對所得之樹脂積層體的成形體測定硬質樹脂層表面的鉛筆硬度,結果為8H。此外,並進行上述樹脂積層體之加工性及成形性的評估。結果彙總顯示於第2表。 The resin laminated body (A part) obtained above was sandwiched from the upper and lower sides by a ruthenium rubber (thickness: 0.8 mm), and the compression delay was set to 10 at a pressure of atmospheric pressure of 5 atmospheres and a mold temperature of 150 ° C to 250 ° C. In the second step, the pressure holding time was set to 30 seconds to form a resin laminated body (A member), and the resin laminated body (A member) was formed into a curved surface (curvature radius a: 8 mm) on four sides and had the same as shown in FIG. Curved shape of profile shape (height b: 7mm). The pencil hardness of the surface of the hard resin layer was measured for the molded body of the obtained resin laminate, and it was 8H. Further, the processability and moldability of the above-mentioned resin laminate were evaluated. The results are summarized in Table 2.
[實施例2] [Embodiment 2]
(硬質樹脂層的製作) (Production of hard resin layer)
將上述合成例得到之於全部矽原子上具有甲基丙烯醯基之籠型矽倍半氧烷化合物:23重量份、六丙烯酸二新戊四醇酯:39重量份、二丙烯酸二環戊酯:32重量份、丙烯酸胺甲酸乙酯低聚物1:6重量份、以及作為光聚合起始劑的1-羥基環己基苯基酮:2.5重量份混合,而得到具有第1表所示的組成之透明的三維交聯型硬質樹脂組成物。 The above-mentioned synthesis example obtained a cage type sesquioxalic acid compound having a methacryl fluorenyl group on all of the ruthenium atoms: 23 parts by weight, dipentaerythritol hexaacrylate: 39 parts by weight, dicyclopentanyl diacrylate 32 parts by weight, hexyl acrylate methacrylate oligomer: 6 parts by weight, and 1-hydroxycyclohexyl phenyl ketone as a photopolymerization initiator: 2.5 parts by weight, and obtained as shown in Table 1 A transparent three-dimensional crosslinked type hard resin composition composed of a transparent resin composition.
接著,使用輥塗佈機,以使厚度成為0.10mm之方式將三維交聯型硬質樹脂組成物澆鑄(垂流)於經易黏著處理之200mm×200mm×厚100μm)的PET上,將另外經剝離處理之相同大小的PET用作為保護薄片,而層合於被澆鑄之三維交聯型硬質樹脂組成物後,使用30W/cm的高壓汞燈,以4000mJ/cm2的積算曝光量進行硬化,而得到於硬質樹脂層(100μm)的表背雙面具有作為熱塑性樹脂層的PET之薄片。在所得之薄片之與經易黏著處理之熱塑性樹脂層的易黏著面相反之一面上設置印刷層、黏合劑層,而得到樹脂積層體(C部件)。該C部件之硬質樹脂層的玻璃轉移溫度,至300℃的測定中仍未觀測到,單體的抗拉彈性率及總透光率如第1表所示。此外,關於使用來作為熱塑性樹脂層的PET之彈性率比(E1/E2),亦彙總顯示於第1表。 Next, a three-dimensional crosslinked type hard resin composition was cast (collapsed) on a PET of 200 mm × 200 mm × thickness 100 μm which was easily adhered by a roll coater so as to have a thickness of 0.10 mm, and another The PET of the same size as the release film was used as a protective sheet, and after being laminated on the three-dimensional crosslinked type hard resin composition to be cast, it was hardened by using a 30 W/cm high-pressure mercury lamp at an accumulated exposure amount of 4000 mJ/cm 2 . On the both sides of the front and back sides of the hard resin layer (100 μm), there was a sheet of PET as a thermoplastic resin layer. A printed layer or a pressure-sensitive adhesive layer is provided on one surface of the obtained sheet opposite to the easy-adhesion surface of the thermoplastic resin layer which is easily adhered to obtain a resin laminate (C member). The glass transition temperature of the hard resin layer of the C member was not observed in the measurement at 300 ° C, and the tensile modulus and total light transmittance of the monomer were as shown in Table 1. Further, the elastic modulus ratio (E 1 /E 2 ) of PET used as the thermoplastic resin layer is also collectively shown in the first table.
(真空壓縮成形實施例) (Vacuum compression molding example)
以矽橡膠(厚0.8mm)從上下夾持上述所得之樹脂積層體(C部件),在壓縮空氣5大氣壓、上下的模具溫度150℃至250℃,將至壓縮的延遲設為10秒、壓力保持時間設為30秒,形成樹脂積 層體(C部件),而成形為與實施例1相同之曲面形狀。對於所得之樹脂積層體的成形體,測定硬質樹脂層表面的鉛筆硬度,結果為7H。此外,並進行上述樹脂積層體之加工性及成形性的評估。結果彙總顯示於第2表。 The resin laminated body (C member) obtained above was sandwiched from the upper and lower sides with a ruthenium rubber (thickness: 0.8 mm), and the compression time was set to 10 seconds at a pressure of atmospheric pressure of 5 atm, and a mold temperature of 150 ° C to 250 ° C. The holding time is set to 30 seconds to form a resin product. The layer body (C member) was formed into the same curved shape as in the first embodiment. The pencil hardness of the surface of the hard resin layer was measured for the molded body of the obtained resin laminate, and it was 7H. Further, the processability and moldability of the above-mentioned resin laminate were evaluated. The results are summarized in Table 2.
(射出成形實施例) (Injection molding example)
接著,將曲面成形之樹脂積層體(C部件)裝填於第4圖的第1射出成形模具內之後,將第2射出成形模具重疊於第1射出成形模具之上方,於該狀態下,將預先於120℃乾燥24小時之聚碳酸酯樹脂(Sabic公司製、商品名稱「HFD1810」),在樹脂溫度320℃、模具溫度90至120℃、模內壓力300-500kg/cm2、射出時間5秒的條件下,從射出澆道射出至模具內的模槽,藉此得到如第3圖所示之將具有硬質樹脂層之樹脂積層體(C部件)與熱塑性樹脂層(B部件)500μm形成一體化之射出成形體。 Then, the resin laminated body (C member) formed by the curved surface is placed in the first injection molding die of FIG. 4, and then the second injection molding die is superposed on the first injection molding die, and in this state, in advance. Polycarbonate resin (product name "HFD1810", manufactured by Sabic Co., Ltd.) which was dried at 120 ° C for 24 hours, at a resin temperature of 320 ° C, a mold temperature of 90 to 120 ° C, an in-mold pressure of 300-500 kg/cm 2 , and an ejection time of 5 seconds. Under the condition, the injection runner is ejected into the cavity in the mold, thereby obtaining a resin laminated body (C member) having a hard resin layer and a thermoplastic resin layer (B member) of 500 μm as shown in FIG. The molded body is injected.
[比較例1] [Comparative Example 1]
於110℃將六丙烯酸二新戊四醇酯:85重量份及PMMA:15重量份加熱混練,然後混合作為光聚合起始劑的1-羥基環己基苯基酮:2.5重量份而得到三維交聯型硬質樹脂組成物。 Dimethyl pentaerythritol hexaacrylate: 85 parts by weight and PMMA: 15 parts by weight at 110 ° C, and then kneaded by heating, and then mixed with 1-hydroxycyclohexyl phenyl ketone as a photopolymerization initiator: 2.5 parts by weight to obtain three-dimensional intersection A joint type hard resin composition.
接著,與實施例2相同地得到硬質樹脂層後,製作樹脂積層體並進行評估。結果如第2表所示。 Next, a hard resin layer was obtained in the same manner as in Example 2, and a resin laminate was produced and evaluated. The results are shown in Table 2.
[實施例3至8及比較例2至6] [Examples 3 to 8 and Comparative Examples 2 to 6]
除了將調配組成構成為第1表所示之重量比率之外,於實施例3、實施例7、比較例2及比較例4中,與實施例1相同,於實施例4、實施例5、實施例6、實施例8、比較例1、比較例3、比較例5、比較例6中,與實施例2相同地得到硬質樹脂層及樹脂 積層體。所得之成形體的評估結果一同顯示於第2表。 The third embodiment, the seventh embodiment, the second comparative example, and the comparative example 4 are the same as the first embodiment except that the blending composition is the weight ratio shown in the first table, and the fourth embodiment and the fifth embodiment are used. In Example 6, Example 8, Comparative Example 1, Comparative Example 3, Comparative Example 5, and Comparative Example 6, a hard resin layer and a resin were obtained in the same manner as in Example 2. Laminated body. The evaluation results of the obtained molded body are shown together in the second table.
[合成例2] [Synthesis Example 2]
將丙烯酸二環戊酯4.0莫耳(825g)、甲基丙烯酸2-羥乙酯3.0莫耳(390g)、二丙烯酸1,4-丁二醇酯3.0莫耳(595g)、2,4-二苯基-4-甲基-1-戊烯4.0莫耳(889g)、甲苯2400ml投入於10.0L的反應器內,於90℃添加240mmol的過氧化苯甲醯並進行6小時的反應。藉由冷卻來停止聚合反應後,於室溫將反應混合液投入於大量的己烷以析出聚合物。以己烷洗淨所得之聚合物並進行過濾、乾燥、量秤,得到共聚物A615g(產率:34%)。 Dicyclopentyl acrylate 4.0 mol (825 g), 2-hydroxyethyl methacrylate 3.0 mol (390 g), 1,4-butanediol diacrylate 3.0 mol (595 g), 2,4-di Phenyl-4-methyl-1-pentene 4.0 mol (889 g) and 2400 ml of toluene were placed in a 10.0 L reactor, and 240 mmol of benzoyl peroxide was added at 90 ° C for 6 hours. After the polymerization reaction was stopped by cooling, the reaction mixture was poured into a large amount of hexane at room temperature to precipitate a polymer. The obtained polymer was washed with hexane, filtered, dried, and weighed to obtain a copolymer A615 g (yield: 34%).
所得之共聚物A的Mw為15200,Mn為3900,Mw/Mn為3.9。共聚物A含有:來自丙烯酸二環戊酯之構造單位合計為37.8莫耳%、來自甲基丙烯酸2-羥乙酯之構造單位合計為29.3莫耳%、來自二丙烯酸1,4-丁二醇酯之構造單位合計為32.9莫耳%。此外,來自2,4-二苯基-4-甲基-1-戊烯之構造的末端基,相對於丙烯酸二環戊酯、甲基丙烯酸2-羥乙酯、二丙烯酸1,4-丁二醇酯及2,4-二苯基-4-甲基-1-戊烯之總量,存在有9.8莫耳%。再者,懸垂丙烯酸酯的比率為16.5莫耳%。Mb為0.29。共聚物A可溶於乙醇、2-丙醇、丁醇、甲苯、二甲苯、THF、二氯乙烷、二氯甲烷、三氯甲烷,未觀察到凝膠的生成。 The obtained copolymer A had a Mw of 15,200, an Mn of 3,900 and a Mw/Mn of 3.9. Copolymer A contained: a total of 37.8 mol% of structural units derived from dicyclopentyl acrylate, and a total of 29.3 mol% of structural unit derived from 2-hydroxyethyl methacrylate derived from 1,4-butanediol diacrylate The structural unit of the ester totaled 32.9 mol%. Further, the terminal group derived from the structure of 2,4-diphenyl-4-methyl-1-pentene is compared with dicyclopentanyl acrylate, 2-hydroxyethyl methacrylate, and 1,4-butyl diacrylate. The total amount of the diol ester and 2,4-diphenyl-4-methyl-1-pentene was 9.8 mol%. Further, the ratio of the pendant acrylate was 16.5 mol%. Mb is 0.29. Copolymer A was soluble in ethanol, 2-propanol, butanol, toluene, xylene, THF, dichloroethane, dichloromethane, chloroform, and no gel formation was observed.
[合成例3] [Synthesis Example 3]
將丙烯酸二環戊酯0.24莫耳(49.5g)、二丙烯酸二羥甲基三環癸烷2.6莫耳(729.4g)、二丙烯酸1,4-丁二醇酯0.96莫耳(190.1g)、丙烯酸2-羥丙酯0.96莫耳(124.9g)、2,4-二苯基-4-甲基-1-戊烯0.48莫耳(113.4g)、三級十二基硫醇3.12莫耳(631.5g)、甲苯700ml投 入於3.0L的反應器內,於90℃添加72mmol的過氧化苯甲醯並進行6小時的反應。藉由冷卻來停止聚合反應後,於室溫將反應混合液投入於大量的己烷以析出聚合物。以己烷洗淨所得之聚合物並進行過濾、乾燥、量秤,得到共聚物B696.9g(產率:63.7莫耳%)。 Dicyclopentyl acrylate 0.24 mol (49.5 g), dihydroxymethyl tricyclodecane diacrylate 2.6 mol (729.4 g), 1,4-butylene glycol diacrylate 0.96 mol (190.1 g), 2-hydroxypropyl acrylate 0.96 mol (124.9 g), 2,4-diphenyl-4-methyl-1-pentene 0.48 mol (113.4 g), tert-dodecyl mercaptan 3.12 mol ( 631.5g), toluene 700ml cast Into a 3.0 L reactor, 72 mmol of benzamidine peroxide was added at 90 ° C and reacted for 6 hours. After the polymerization reaction was stopped by cooling, the reaction mixture was poured into a large amount of hexane at room temperature to precipitate a polymer. The obtained polymer was washed with hexane, filtered, dried, and weighed to obtain a copolymer B696.9 g (yield: 63.7 mol%).
所得之共聚物B的Mw為39500,Mn為7240,Mw/Mn為5.5。藉由進行13C-NMR、1H-NMR分析及元素分析,可得知共聚物B含有:來自丙烯酸二環戊酯之構造單位4.9莫耳%、來自二丙烯酸二羥甲基三環癸烷及二丙烯酸1,4-丁二醇酯之構造單位合計為75.5莫耳%、來自丙烯酸2-羥丙酯之構造單位19.6莫耳%。此外,來自2,4-二苯基-4-甲基-1-戊烯之構造的末端基,相對於來自丙烯酸二環戊酯、二丙烯酸二羥甲基三環癸烷、丙烯酸2-羥丙酯、2,4-二苯基-4-甲基-1-戊烯及三級十二基硫醇之構造的末端基之總量(以下稱為全構成單位之總量),存在有3.7莫耳%。另一方面,來自三級十二基硫醇之構造的末端基,相對於全構成單位之總量,存在有18.6莫耳%。再者,懸垂丙烯酸酯的比率為43.5莫耳%。 The obtained copolymer B had Mw of 39,500, Mn of 7,240, and Mw/Mn of 5.5. By performing 13 C-NMR, 1 H-NMR analysis and elemental analysis, it was found that the copolymer B contained: 4.9 mol% of the structural unit derived from dicyclopentyl acrylate, derived from dimethylol tricyclodecane diacrylate. The structural unit of 1,4-butylene glycol diacrylate was 75.5 mol% in total, and the structural unit derived from 2-hydroxypropyl acrylate was 19.6 mol%. Further, the terminal group derived from the structure of 2,4-diphenyl-4-methyl-1-pentene is relative to dicyclopentanyl acrylate, dimethylol tricyclodecane diacrylate, 2-hydroxy acrylate The total amount of the terminal groups of the structures of propyl ester, 2,4-diphenyl-4-methyl-1-pentene and tertiary tridecyl mercaptan (hereinafter referred to as the total amount of the total constituent units) exists 3.7% of the mole. On the other hand, the terminal group derived from the structure of the tertiary dodecylmercaptan has 18.6 mol% with respect to the total amount of the total constituent units. Further, the ratio of the pendant acrylate was 43.5 mol%.
共聚物B可溶於甲苯、二甲苯、THF、二氯乙烷、二氯甲烷、三氯甲烷。未觀察到凝膠的生成。 Copolymer B is soluble in toluene, xylene, THF, dichloroethane, dichloromethane, and chloroform. No gel formation was observed.
[實施例9至12] [Examples 9 to 12]
除了將調配組成構成為第3表所示之重量比率之外,其他與實施例1相同地而得到硬質樹脂層及樹脂積層體。所得之成形體的評估結果一同顯示於第3表。 A hard resin layer and a resin laminate were obtained in the same manner as in Example 1 except that the blending composition was constituted by the weight ratio shown in Table 3. The evaluation results of the obtained molded body are shown together in Table 3.
第3表中除了已出現者以外之略稱係如下所述。 Abbreviations other than those already appearing in Table 3 are as follows.
M:合成例2中所得之共聚物A M: copolymer A obtained in Synthesis Example 2
N:合成例3中所得之共聚物B N: copolymer B obtained in Synthesis Example 3
B':六丙烯酸二新戊四醇酯(Daicel Cytec股份有限公司製) B': dipentaerythritol hexaacrylate (Daicel Cytec Co., Ltd.)
O:三丙烯酸三羥甲基丙烷酯(共榮社化學股份有限公司製) O: Trimethylolpropane triacrylate (manufactured by Kyoeisha Chemical Co., Ltd.)
G:二丙烯酸二羥甲基三環癸烷酯(二丙烯酸二環戊烯酯)(共榮社化學股份有限公司製Light Acrylate DCP-A) G: Dimethylol tricyclodecyl acrylate (dicyclopentenyl diacrylate) (Light Acrylate DCP-A manufactured by Kyoeisha Chemical Co., Ltd.)
P:二丙烯酸1,9-壬二醇酯(共榮社化學股份有限公司製) P: 1,9-nonanediol diacrylate (manufactured by Kyoeisha Chemical Co., Ltd.)
Q:丙烯酸二環戊烯酯(日立化成工業股份有限公司製) Q: Dicyclopentyl acrylate (manufactured by Hitachi Chemical Co., Ltd.)
R:八丙烯酸三新戊四醇酯 R: triconyl octadecyl acrylate
1‧‧‧硬質樹脂層 1‧‧‧hard resin layer
2‧‧‧黏合劑層 2‧‧‧Binder layer
3‧‧‧熱塑性樹脂層 3‧‧‧ thermoplastic resin layer
4‧‧‧印刷層 4‧‧‧Printing layer
6‧‧‧保護薄片 6‧‧‧Protective sheet
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CN111278664A (en) * | 2017-10-25 | 2020-06-12 | 株式会社普利司通 | Metal-resin composite member for tire and tire |
EP3418782B1 (en) * | 2016-12-26 | 2023-05-03 | LG Chem, Ltd. | Polarizer protection film, polarizing plate comprising the same, liquid crystal display comprising the polarizing plate, and coating composition for polarizer protecting film |
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JP6579309B2 (en) * | 2015-05-01 | 2019-09-25 | 味の素株式会社 | Curable composition |
WO2017141873A1 (en) * | 2016-02-15 | 2017-08-24 | 株式会社クラレ | Thermoplastic resin film and production method threrefor, and laminate |
CN108928075B (en) * | 2017-05-26 | 2019-12-31 | 住友化学株式会社 | Curved resin laminate |
CN111002667B (en) * | 2019-12-19 | 2022-03-08 | 宁波长阳科技股份有限公司 | Release film and preparation method thereof |
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WO2012063637A1 (en) * | 2010-11-10 | 2012-05-18 | 新日鐵化学株式会社 | Multilayered hardcoat film for injection molding, process for producing same, and process for producing injection-molded object using the multilayered hardcoat film |
KR20150119214A (en) * | 2013-02-12 | 2015-10-23 | 신닛테츠 수미킨 가가쿠 가부시키가이샤 | Resin laminate |
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EP3418782B1 (en) * | 2016-12-26 | 2023-05-03 | LG Chem, Ltd. | Polarizer protection film, polarizing plate comprising the same, liquid crystal display comprising the polarizing plate, and coating composition for polarizer protecting film |
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